TW202330830A - Thermosetting adhesive composition, multilayer film, bonded body and method for producing same - Google Patents

Abstract

The present invention provides a thermosetting adhesive composition which is used for the purpose of bonding circuit members to each other, and which has a storage elastic modulus of 700 MPa or less at 35 DEG C after being heated at 130 DEG C for one hour. The present invention also provides a multilayer film which comprises a base material film and an adhesive layer that is arranged on the surface of the base material film, wherein the adhesive layer is configured from the above-described thermosetting adhesive composition.

Description

Thermosetting adhesive composition, laminated film, connector and manufacturing method thereof

The disclosure relates to a thermosetting adhesive composition, a laminated film, a connecting body and a manufacturing method thereof.

Conventionally, semiconductor devices are manufactured through the following steps. First, the semiconductor wafer is singulated into semiconductor chips by implementing a dicing step in a state where the semiconductor wafer is attached to the adhesive sheet for dicing. Thereafter, a pick-up step, a die bonding step, a wire bonding step, a molding step, and the like are performed. Patent Document 1 discloses an adhesive sheet (die bonding dicing sheet) that has both the function of fixing the semiconductor wafer in the dicing step and the function of bonding the semiconductor wafer to the substrate in the die bonding step.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2007-288170

However, in recent years, with the development of semiconductor modules for small devices represented by smart phones, the manufacturing process of semiconductor modules has also undergone significant changes compared with previous manufacturing processes. For example, processes that do not perform a dicing step and a die bonding step are coming into practical use. In contrast, the adhesive composition used in the manufacturing process of the semiconductor module is also required to have different performance than before. In addition to this situation, the inventors of the present invention have been developing an adhesive composition capable of achieving sufficient adhesiveness with a small bonding area in order to cope with the high functionality and thinning of devices on which semiconductor chips are mounted.

One aspect of the present disclosure provides a thermosetting adhesive composition having excellent adhesion between circuit members such as a semiconductor chip, a printed circuit board, and a flexible printed circuit board. One aspect of the present disclosure provides a laminated film having an adhesive layer composed of the thermosetting adhesive composition, a connected body, and a manufacturing method thereof.

The thermosetting adhesive composition according to one aspect of the present disclosure is used for bonding circuit members. After heating the thermosetting adhesive composition at 130° C. for 1 hour (hereinafter, sometimes simply referred to as “after heating”), The storage modulus at 35°C is 700 MPa or less.

The storage modulus of the heated thermosetting adhesive composition at 35°C is 700 MPa or less, which means that the heated thermosetting adhesive composition is relatively soft at 35°C. The adhesive layer composed of the heated thermosetting adhesive composition is relatively soft, so that excellent adhesion can be achieved even at the front end of the flexible printed circuit board (hereinafter referred to as "FPC board"). This is presumably because even if a force in the direction of peeling from the adhesive layer is applied to the front end of the FPC board after bonding, the adhesive layer can deform to some extent, and the peeling energy is consumed in the deformation of the adhesive layer.

After the above thermosetting adhesive composition is heated at 130° C. for 1 hour, the storage modulus at 130° C. may be above 4 MPa. The thermosetting adhesive composition after heating has a storage modulus of 4 MPa or more at 130° C., which means that the thermosetting adhesive composition after heating is relatively hard at 130° C. The thermosetting adhesive composition after heating is relatively hard at 130°C, so it can be applied to, for example, the front end of the FPC board, the circuit member (semiconductor chip or printed circuit board) to be bonded, and the adhesive layer arranged between them. The structure is preferably wire bonded. [Invention effect]

According to one aspect of the present disclosure, there is provided a thermosetting adhesive composition excellent in adhesion between circuit members such as a semiconductor chip, a printed circuit board, and a flexible printed circuit board. According to one aspect of the present disclosure, a laminated film having an adhesive layer composed of the thermosetting adhesive composition, a connecting body and a manufacturing method thereof are provided.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including steps and the like) are not essential unless otherwise specified. In the following description, the same symbols are attached to the same or corresponding parts, and repeated descriptions are omitted. In addition, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings unless otherwise specified. The sizes of the components in the drawings are shown conceptually, and the dimensional ratios in the drawings are not limited to the ratios shown in the drawings.

Numerical values and their ranges in this specification are not limited to the present disclosure. In this specification, the numerical range represented by "-" means the range which includes the numerical value described before and after "-" as a minimum value and a maximum value, respectively. In the numerical ranges described step by step in this specification, the upper limit or lower limit described in one numerical range may be replaced by the upper limit or lower limit of the numerical range described in other steps. The description of "(meth)acrylic acid" in this specification means "acrylic acid" and the corresponding "methacrylic acid".

＜Laminated Film＞ Fig. 1 is a cross-sectional view schematically showing a laminated film according to this embodiment. The laminated film 10 shown in this figure is equipped with the base film 1, the adhesive agent layer 3, and the cover film 5 in this order. The laminated film 10 has a width of, for example, 300 mm to 500 mm and a total length of 10 m to 400 m, and is produced by, for example, being wound up in a roll shape. Hereinafter, the configuration of the laminated film 10 will be described.

[Substrate film] The base film 1 is not particularly limited as long as it can sufficiently withstand the tension applied during the manufacturing process of the adhesive layer 3 and the manufacturing process of the semiconductor module. It is preferable that the base film 1 is transparent from the viewpoint of the visibility of the adhesive layer 3 arrange|positioned thereon. As the base film 1, polyester films such as polyethylene terephthalate films, polytetrafluoroethylene films, polyethylene films, polypropylene films, polymethylpentene films, polyvinyl acetate films, poly - 4-methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, etc. alone or copolymers or mixtures thereof, such as polyolefin-based films, polyvinyl chloride films, polyamide films, etc. Plastic films such as amine films, etc. The base film 1 may have a single-layer structure or a multi-layer structure.

The thickness of the base film 1 should just be selected suitably within the range which does not impair workability, For example, it is 10-200 micrometers, 20-100 micrometers, or 25-80 micrometers may be sufficient. The range of these thicknesses is not a problem in practical use, and is also an economically effective range.

In order to improve the adhesion of the adhesive layer 3 to the base film 1, chemical or physical treatments such as corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, and ionizing radiation treatment can be carried out on the surface of the base film 1. surface treatment. As the base film 1 , a thin film made of a fluororesin and having a low surface energy can also be used. Examples of such films include TOYOBO CO., LTD. A-63 (release treatment agent: modified silicone system) and TOYOBO CO., LTD. A-31 (release treatment agent: Pt-based Silicone system), etc.

In order to prevent the adhesion of the adhesive layer 3 to the base film 1 from becoming too high, a silicone-based release agent, a fluorine-based release agent, a long-chain alkyl acrylate release agent, etc. can be formed on the surface of the base film 1. A release layer composed of a release agent.

The adhesive force between the base film 1 and the adhesive layer 3 is, for example, 0.5 N/m or more. When this adhesive force is 0.5 N/m or more, it becomes easy to prevent that the adhesive agent layer 3 peels off unexpectedly from the base film 1 in the process of manufacturing the laminated film 10. In addition, the adhesion of the adhesive layer 3 to the base film 1 represents the 90° peel strength. Specifically, it represents a sample with a width of 20 mm in which the adhesive layer 3 is formed on the base film 1. Peel strength measured when the adhesive layer is peeled from the base film at a peel speed of 50 mm/min.

[adhesive layer] The adhesive layer 3 is used for connecting circuit components, especially preferably for connecting the front end of the printed circuit board and the FPC board, or connecting the front end of the semiconductor wafer and the FPC board. A module 50A (connected body) shown in FIG. 2 includes a semiconductor chip C, a printed circuit board 12 (first circuit member), an adhesive sheet 3c, and an FPC board 15 (second circuit member). The adhesive tablet 3 c is bonded to the printed circuit board 12 and the front end portion 15 a of the FPC board 15 . The adhesive tablet 3 c is composed of a cured product of the adhesive tablet 3 p (see FIG. 4 ). The adhesive tablet 3p is processed into a predetermined shape by drawing the adhesive layer 3 shown in FIG. 1 . Furthermore, the adhesive layer 16 connects the printed circuit board 12 and the semiconductor chip C. As shown in FIG. The adhesive layer 16 may have the same composition as that of the adhesive sheet 3c, or may have a different composition.

The module 50B shown in FIG. 3 is obtained by performing wire bonding on the module 50A shown in FIG. 2 . The wire W1 electrically connects the semiconductor chip C and the printed circuit board 12 , and the wire W2 electrically connects the printed circuit board 12 and the FPC board 15 . The semiconductor wafer C is, for example, a sensor wafer. The printed circuit board 12 is used to process signals from the semiconductor chip C. As shown in FIG. Signals from the printed circuit board 12 are transmitted to the front end portion 15 a of the FPC board 15 .

The adhesive sheet 3p (adhesive layer) is composed of a thermosetting adhesive composition satisfying the following condition 1. ·Condition 1 After heating at 130° C. for 1 hour, the storage modulus at 35° C. is 700 MPa or less.

By using the thermosetting adhesive composition satisfying condition 1, the front end portion 15a of the FPC board 15 can be bonded to the circuit member (printed circuit board 12 in this embodiment) to be bonded with high strength. The storage modulus of condition 1 is 700MPa or less, may be 30-700MPa, or may be 30-500MPa or 30-200MPa.

The thermosetting adhesive composition that satisfies condition 1 shows that it is relatively soft at 35°C after heating at 130°C for 1 hour. Therefore, even if the front end 15a of the FPC board 15 is attached to the adhesive sheet 3p (adhesive sheet 3c) that has passed through a thermal history close to it (see FIG. 2 ), the front end 15a is peeled off from the adhesive sheet 3c. The force of the direction, then tablet 3c also can be deformed to a certain extent. Detachment of the tip portion 15a from the adhesive sheet 3c can be suppressed by the deformation of the adhesive sheet 3p due to the energy consumption of the peeling.

In order to obtain a thermosetting adhesive composition satisfying condition 1, for example, the following method is considered. · Method 1: The amount of the thermoplastic resin (for example, acrylic rubber) contained in the thermosetting adhesive composition is increased. · Method 2: Use a thermoplastic resin with a low glass transition temperature (Tg). ·Method 3: Use a thermosetting resin with a soft skeleton. According to the research of the present inventors, methods 1 and 2 are more effective than method 3. Regarding method 1, when the thermosetting adhesive composition contains a thermoplastic resin, a thermosetting resin, and a filler, when the total mass of the thermosetting adhesive composition is 100 parts by mass, the content of the thermoplastic resin is, for example, 20 to 40 parts by mass . Regarding method 2, Tg of the thermoplastic resin is, for example, -50°C to 20°C.

The thermosetting adhesive composition constituting the adhesive sheet 3p may further satisfy the following condition 2. ·Condition 2 After heating at 130° C. for 1 hour, the storage modulus at 130° C. is 4 MPa or more.

By using the thermosetting adhesive composition satisfying condition 2, the vibration of the adhesive sheet 3c in the wire bonding step can be reduced, and the connection by wire bonding becomes easy. As mentioned above, the storage modulus of condition 2 is 4 MPa or more, and may be 10 MPa or more or 20 MPa or more. The upper limit of the storage modulus of condition 2 is, for example, 10000 MPa. The higher the storage modulus of condition 2 is, the easier it is to perform wire bonding connection.

In addition, considering only the above-mentioned condition 1, for example, when the amount of thermoplastic resin contained in the thermosetting adhesive composition is increased so that the storage modulus of condition 1 becomes 700 MPa or less, the storage modulus of condition 2 There is also a tendency to decrease, and there is a tendency not to satisfy condition 2. In order to obtain a thermosetting adhesive composition that satisfies condition 1 and also satisfies condition 2, it is considered that in the thermosetting adhesive composition that satisfies condition 1, for example, a thermosetting resin with more cross-linking points is used, thereby increasing the thermal conductivity after heating. Crosslink density.

The thermosetting adhesive composition is preferably cured to a certain extent by heat treatment at 130° C. for 1 hour. The extent to which the reaction proceeds can be quantified by differential scanning calorimetry. That is, the reaction rate calculated from the calorific value C1 and the calorific value C2 by the following formula is, for example, 40% or more, and may be 50% or more or 60% or more. The calorific value obtained from the DSC curve obtained from the differential scanning calorimetry/minute differential scanning calorimetry. Reaction rate (%) = (C1-C2)/C1×100 The calorific value C1 is the calorific value of the thermosetting adhesive composition (first measurement object). The calorific value C2 is the calorific value of the resin composition (second measurement object) after heating the thermosetting adhesive composition at 130° C. for 1 hour. Moreover, the temperature range at the time of differential scanning calorimetry measurement is 30 degreeC - 300 degreeC, for example. The temperature range of calorific values C1 and C2 obtained from the DSC curve obtained by measurement is 100°C to 270°C. When the reaction rate is 40% or more, deterioration over time after the production steps can be suppressed, and the reliability is excellent.

The melt viscosity of the thermosetting adhesive composition at 120° C. is, for example, 3500˜12000 Pa·s, may be 3500˜10000 Pa·s or 3500˜8000 Pa·s. Since the melt viscosity at 120°C is within the above range, even if the front end 15a of the FPC board 15 has unevenness, it is possible to arrange a thermosetting adhesive without a gap between the front end 15a and the member (printed circuit board 12) to be bonded. agent composition. Thereby, the front-end|tip part 15a and the printed circuit board 12 can be bonded with high strength.

In addition to conditions 1 and 2, the thermosetting adhesive composition has, for example, the property of not being stretched excessively. Specifically, the thermosetting adhesive composition includes a thermoplastic resin, a thermosetting resin, a curing accelerator, and an inorganic filler, and may include a photoreactive monomer, a photopolymerization initiator, and the like as required. The composition of the thermosetting adhesive composition will be described later.

The laminated film 10 is produced, for example, as follows. First, a coating solution obtained by dissolving the raw material resin composition of the adhesive layer 3 in a solvent such as an organic solvent and varnish is prepared. The adhesive layer 3 is formed by removing the solvent after applying this coating liquid on the base film 1 . Examples of the coating method include blade coating, roll coating, spray coating, gravure coating, bar coating, and curtain coating. Next, the cover film 5 is bonded to the surface of the adhesive layer 3 under conditions of normal temperature to 60°C. Thereby, the laminated film 10 can be obtained. In addition, after forming the adhesive layer 3 on the base film having a wide width, the cover film 5 can be laminated so as to cover it to produce a laminated film, and the laminated film can be obtained by cutting (slitting) it into a predetermined width. 10.

＜Punched Products＞ FIG. 4 is a perspective view schematically showing a punched product manufactured from the laminated film 10 . Fig. 5 is a sectional view taken along line V-V shown in Fig. 4 . The punched product 20 shown in these figures has a strip-shaped base film 1 with a width of 100 mm or less, and is arranged on the base film 1 along its longitudinal direction (the direction of the arrow X shown in FIG. 4 ). A plurality of adhesive sheets 3p and a cover film 5p covering the upper surface 3f of the adhesive sheet 3p and having the same shape as the adhesive sheet 3p.

The bonding tablet 3p is preferably suitable for bonding a circuit member (semiconductor wafer or printed circuit board) to the front end of an FPC board. The area of the adhesive sheet 3p in plan view is, for example, 1 to 100 mm ² , and may be 3 to 50 mm ² or 5 to 40 mm ² . According to the punched product 20, a plurality of adhesive sheets 3p arranged along the base film 1 (refer to FIG. 6) are sequentially picked up, and then each adhesive sheet 3p can be arranged in a predetermined area of the circuit member Therefore, bonding of the circuit member and the FPC member can be effectively carried out.

The punched product 20 can be obtained by the following procedure, for example. (A) Step of preparing the laminated film 10 . (B) A step of obtaining a plurality of adhesive sheets 3p arranged on the base film 1 in the longitudinal direction of the base film 1 by pulling out the adhesive layer 3 and the cover film 5 in the laminated film 10 .

＜Thermosetting resin composition＞ The thermosetting adhesive composition constituting the adhesive layer 3 and the adhesive sheet 3p will be described. The thermosetting adhesive composition includes, for example, a thermoplastic resin, a thermosetting resin, a curing accelerator, and an inorganic filler.

(thermoplastic resin) As the thermoplastic resin, a resin having thermoplasticity, or a resin having thermoplasticity in at least an uncured state and forming a crosslinked structure after heating can be used. As thermoplastic resins, reactive group-containing (meth)acrylic copolymers (hereinafter sometimes referred to as "reactive group-containing (meth)acrylic copolymers) are ”) is preferred.

When a reactive group-containing (meth)acrylic copolymer is included as a thermoplastic resin, the thermosetting adhesive composition may not include a thermosetting resin. That is, it may be an aspect containing a reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler. A thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.

Examples of the (meth)acrylic copolymer include (meth)acrylate copolymers such as acrylic glass and acrylic rubber, among which acrylic rubber is preferred. The acrylic rubber is preferably formed by copolymerizing a monomer selected from (meth)acrylate and acrylonitrile, mainly composed of acrylate.

Examples of (meth)acrylates include methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, hexyl acrylate, cyclohexyl acrylate, 2-ethyl acrylate, Hexyl methacrylate, lauryl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate, butyl methacrylate, isobutyl methacrylate, hexyl methacrylate ester, cyclohexyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, etc. As the (meth)acrylate copolymer, a copolymer containing butyl acrylate and acrylonitrile as a copolymerization component, and a copolymer containing ethyl acrylate and acrylonitrile as a copolymerization component are preferable.

The reactive group-containing (meth)acrylic copolymer is preferably a reactive group-containing (meth)acrylic copolymer containing a reactive group-containing (meth)acrylic monomer as a copolymerization component. Such a reactive group-containing (meth)acrylic copolymer can be obtained by copolymerizing a reactive group-containing (meth)acrylic monomer with a monomer composition containing the aforementioned monomer.

As the reactive group, from the viewpoint of improving heat resistance, epoxy group, carboxyl group, acryl group, methacryl group, hydroxyl group, and cyclic sulfide group are preferred, and among them, from the viewpoint of crosslinkability, ring An oxy group and a carboxyl group are more preferable.

In this embodiment, the reactive group-containing (meth)acrylic copolymer is an epoxy group-containing (meth)acrylic copolymer containing an epoxy group-containing (meth)acrylic monomer as a copolymerization component. is better. In this case, examples of (meth)acrylic monomers having an epoxy group include glycidyl acrylate, 4-hydroxybutyl acrylate glycidyl ether, methyl 3,4-epoxycyclohexyl acrylate , Epoxypropyl methacrylate, 4-hydroxybutyl methacrylate glycidyl ether, 3,4-epoxycyclohexyl methyl methacrylate, etc. From the viewpoint of heat resistance, the (meth)acrylic monomer having a reactive group is preferably glycidyl acrylate or glycidyl methacrylate.

The Tg of the thermoplastic resin is, for example, -50°C to 20°C, may be -40°C to 10°C, or -40°C to 0°C. When Tg of a thermoplastic resin is -50 degreeC or more, it becomes easy to suppress that the adhesive layer 3 becomes soft too much, and it becomes possible to realize excellent handleability and adhesiveness. On the other hand, when Tg of a thermoplastic resin is 0 degreeC or less, it becomes easy to ensure the flexibility of the adhesive bond layer 3, and it becomes possible to realize excellent adhesive strength. In addition, even if there are irregularities on the surface of the adhesive, the adhesive layer 3 can easily follow the irregularities and can exhibit excellent adhesiveness.

The Tg of a thermoplastic resin is the intermediate glass transition temperature value obtained by differential scanning calorimetry (DSC). Specifically, the Tg of a thermoplastic resin is the midpoint glass transition temperature calculated by measuring the heat change under the conditions of a temperature increase rate of 10°C/min and a measurement temperature of -80 to 80°C, and calculated according to JIS K7121:1987. In addition, when a thermoplastic resin is a commercial item, the value described in a catalog etc. can be employ|adopted.

It is preferable that the weight average molecular weight of a thermoplastic resin is 100,000 or more and 2 million or less. When the weight average molecular weight is 100,000 or more, it is easy to secure heat resistance. On the other hand, when the weight average molecular weight is 2 million or less, it is easy to suppress the fall of flow rate and the fall of adhesiveness. The thermoplastic resin may have a weight average molecular weight of 400,000 to 2 million or 500,000 to 2 million. In addition, the weight average molecular weight is the polystyrene conversion value based on the calibration curve of standard polystyrene by gel permeation chromatography (GPC).

When the (meth)acrylic copolymer having a reactive group contains glycidyl acrylate or glycidyl methacrylate as a copolymerization component, when the mass of the entire adhesive film is 100 parts by mass, The content of the thermoplastic resin is preferably 20 to 40 parts by mass. When the content is within the above range, the flexibility and adhesiveness of the adhesive layer 3 will be easily achieved at a higher level. As the (meth)acrylic copolymer having the above-mentioned reactive groups, those obtained by polymerization methods such as bead polymerization and solution polymerization can be used. Alternatively, commercially available items such as SG-P3 (product name, manufactured by Nagase Chemtex Corporation) can be used.

(thermosetting resin) The thermosetting resin can be used without particular limitation as long as it is a resin cured by heat. Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenol resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. These can be used individually by 1 type or in combination of 2 or more types.

The epoxy resin is not particularly limited as long as it has a heat-resistant effect by curing. As the epoxy resin, difunctional epoxy resins such as bisphenol A epoxy resins, novolak epoxy resins such as phenol novolac epoxy resins, and cresol novolac epoxy resins can be used. Epoxy resin and polyfunctional epoxy resin can use a glycidylamine type epoxy resin, a heterocycle-containing epoxy resin, an alicyclic epoxy resin, etc., and what is conventionally known.

Examples of bisphenol A epoxy resins include Epikote 807, Epikote 815, Epikote 825, Epikote 827, Epikote 828, Epikote 834, Epikote 1001, Epikote 1004, Epikote 1007, Epikote 1009 (all manufactured by Mitsubishi Chemical Corporation), DER-330, DER-3 01. DER- 361 (both manufactured by Dow Chemical Company), YD8125, YDF8170 (both manufactured by Tohto Kasei Co., Ltd.), etc. Examples of the phenol novolac epoxy resin include Epikote 152, Epikote 154 (all manufactured by Mitsubishi Chemical Corporation), EPPN-201 (manufactured by Nippon Kayaku Co., Ltd.), DEN-438 (manufactured by Dow Chemical Company), and the like. As o-cresol novolak type epoxy resins, YDCN-700-10 (manufactured by NIPPON STEEL Chemical & Material Co., Ltd.), EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 (all manufactured by Nippon Kayaku Co., Ltd.), YDCN701, YDCN702, YDCN703, YDCN704 (all manufactured by Tohto Kasei Co., Ltd.), N-500P-10 (manufactured by DIC CORPORATION), etc. Examples of polyfunctional epoxy resins include Epon 1031S, 1032H60 (all manufactured by Mitsubishi Chemical Corporation), Araldite 0163 (manufactured by BASF Japan Ltd.), DENACOL EX-611, EX-614, EX-614B, EX-622, EX -512, EX-521, EX-421, EX-411, EX-321 (all manufactured by Nagase Chemtex Corporation), etc. Examples of amine-type epoxy resins include Epikote 604 (manufactured by Mitsubishi Chemical Corporation), YH-434 (manufactured by Tohto Kasei Co., Ltd.), TETRAD-X, and TETRAD-C (all manufactured by MITSUBISHI GAS CHEMICAL COMPANY, INC. ), ELM-120 (manufactured by Sumitomo Chemical Co., Ltd.), etc. Examples of heterocycle-containing epoxy resins include AralditePT810 (manufactured by BASF Japan Ltd.), ERL4234, ERL4299, ERL4221, and ERL4206 (all are manufactured by Union Carbide Corporation). These epoxy resins can be used individually by 1 type or in combination of 2 or more types.

As the epoxy resin, it is preferable to use a polyfunctional epoxy resin with a small functional group equivalent. By applying an epoxy resin to increase the storage modulus of the adhesive film at 130° C. after heat treatment, the wire bonding property is excellent. Specifically, HP-4710 (manufactured by DIC Corporation), Epon 1031S, and 1032H60 (all are manufactured by Mitsubishi Chemical Corporation) are mentioned.

As the epoxy resin curing agent which is a part of the thermosetting resin component, commonly used known resins can be used. Specifically, amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, phenols such as bisphenol A, bisphenol F, and bisphenol S having two or more in one molecule can be mentioned. Phenolic resins such as bisphenols with a neutral hydroxyl group, phenol novolac resins, bisphenol A novolac resins, and cresol novolac resins. As the epoxy resin curing agent, phenolic resins such as phenol novolac resins, bisphenol A novolac resins, and cresol novolac resins are particularly preferred from the viewpoint of excellent electrolytic corrosion resistance during moisture absorption. In addition, the epoxy curing agent can be used in combination with the epoxy resin, or can be used alone.

Among the above phenol resin curing agents, Phenolite LF2882, Phenolite LF2822, Phenolite TD-2090, Phenolite TD-2149, Phenolite VH-4150, Phenolite VH4170 (all manufactured by DIC CORPORATION, product name), H-1 (Meiwa Plastic Industries , Ltd., product name), Epicure MP402FPY, Epicure YL6065, Epicure YLH129B65, MillexXL, MillexXLC, MillexXLC-LL, MillexRN, MillexRS, MillexVR (all manufactured by Mitsubishi Chemical Corporation, product name) are preferred.

Content of the thermosetting resin in a thermosetting adhesive composition is 20-60 mass parts, for example, 20-50 mass parts with respect to 100 mass parts of thermosetting adhesive compositions. When the content of the thermosetting resin is within the above range, shrinkage accompanying thermosetting of the adhesive layer 3 can be suppressed, and excellent adhesiveness after thermosetting can be easily realized.

(curing accelerator) Examples of curing accelerators include imidazoles, dicyandiamine derivatives, dicarboxylic acid dihydrazine, triphenylphosphine, tetraphenylphosphine tetraphenyl borate, 2-ethyl-4-methyl Imidazole-tetraphenyl borate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenyl borate, etc. These can be used individually by 1 type or in combination of 2 or more types.

When the thermosetting adhesive composition contains a (meth)acrylic copolymer having an epoxy group, it is preferable to contain a curing accelerator that accelerates the curing of the epoxy group contained in the (meth)acrylic copolymer. Examples of curing accelerators that accelerate the curing of epoxy groups include phenol-based curing agents, acid anhydride-based curing agents, amine-based curing agents, imidazole-based curing agents, imidazoline-based curing agents, trioxane-based curing agents, and phosphino-based curing agents. Hardener. Among them, an imidazole-based curing agent that can be expected to shorten the process time and improve workability is preferable from the viewpoint of rapid curing, heat resistance, and peelability. These compounds can be used individually by 1 type or in combination of 2 or more types.

The content of the curing accelerator in the thermosetting adhesive composition is, for example, 0.01 to 1.0 parts by mass, 0.02 to 0.8 parts by mass, or 0.03 to 0.5 parts by mass relative to 100 parts by mass of the thermosetting adhesive composition. When content of a hardening accelerator exists in the said range, it exists in the tendency which can fully suppress the fall of storage stability while being able to improve the curability of the adhesive bond layer 3.

(inorganic filler) The thermosetting adhesive composition may contain an inorganic filler. Examples of the inorganic filler include metallic fillers such as silver powder, gold powder, and copper powder, and non-metallic inorganic fillers such as silica, alumina, boron nitride, titanium dioxide, glass, iron oxide, and ceramics. Inorganic fillers can be selected according to desired functions.

The above-mentioned inorganic filler may have an organic group on the surface. By modifying the surface of the inorganic filler with an organic group, it is possible to improve the dispersibility in an organic solvent when preparing the varnish for forming the adhesive layer 3 . In addition, shrinkage accompanying thermal curing of the adhesive layer 3 can be suppressed, and it is easy to achieve both high elastic modulus and excellent peelability of the adhesive layer 3 . The inorganic filler having an organic group on the surface can be obtained, for example, by mixing a silane coupling agent represented by the following formula (B-1) and an inorganic filler, and stirring at a temperature of 30° C. or higher. It can be confirmed by UV measurement, IR measurement, XPS measurement, etc. that the surface of the inorganic filler is modified with an organic group.

[chemical 1] In formula (B-1), X represents a group consisting of phenyl, glycidyloxy, acryl, methacryl, mercapto, amine, vinyl, isocyanate and methacryloxy In the organic group in the group, s represents 0 or an integer of 1 to 10, and R11, R12 and R13 each independently represent an alkyl group having 1 to 10 carbons. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, isopropyl, isobutyl, etc. . From the viewpoint of easy availability, the alkyl group having 1 to 10 carbon atoms is preferably methyl, ethyl or pentyl. From the viewpoint of heat resistance, X is preferably an amine group, a glycidoxy group, a mercapto group and an isocyanate group, more preferably a glycidoxy group and a mercapto group. From the viewpoint of suppressing film fluidity at high temperature and improving heat resistance, s in formula (B-1) is preferably 0-5, more preferably 0-4.

Examples of silane coupling agents include trimethoxyphenylsilane, dimethyldimethoxyphenylsilane, triethoxyphenylsilane, dimethoxymethylphenylsilane, and vinyltrimethoxysilane , Vinyltriethoxysilane, Vinyltris(2-methoxyethoxy)silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N -(2-Aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-glycidyl ether propyltrimethyl Oxysilane, 3-glycidyl ether propylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-isocyanatopropyltriethoxy Silane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-ureapropyltriethoxysilane, N-(1,3-dimethylbutylene base)-3-(triethoxysilyl)-1-propylamine, N,N'-bis(3-(trimethoxysilyl)propyl)ethylenediamine, polyoxyethylene propyltrioxane Oxysilane, polyethoxydimethylsiloxane, etc. Among them, 3-aminopropyltriethoxysilane, 3-glycidyl etherpropyltrimethoxysilane, 3-isocyanatopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane Silane is preferred, and trimethoxyphenylsilane, 3-glycidyl ether propyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane are more preferred. A silane coupling agent can be used individually by 1 type or in combination of 2 or more types.

From the viewpoint of achieving a balance between heat resistance and storage stability, the content of the coupling agent is, for example, 0 to 10 parts by mass, or 0.1 to 5 parts by mass, relative to 100 parts by mass of the thermosetting adhesive composition. From the standpoint of , the upper limit may be 3 parts by mass.

The content of the inorganic filler is, for example, 30 to 50 parts by mass with respect to 100 parts by mass of the thermosetting adhesive composition, and may be 35 to 45 parts by mass. Content of the inorganic filler in a thermosetting adhesive composition is 450 mass parts or less with respect to 100 mass parts of thermoplastic resins, for example, and may be 400 mass parts or less or 350 mass parts or less. The lower limit of the content of the inorganic filler is not particularly limited, and may be, for example, 10 parts by mass or more, and may be 50 parts by mass or more with respect to 100 parts by mass of the thermoplastic resin. By setting the content of the inorganic filler within the above range, shrinkage accompanying thermal curing can be suppressed, and it is easy to achieve both high melt viscosity and excellent peelability of the adhesive layer 3 .

(organic filler) The thermosetting adhesive composition may contain an organic filler. Examples of the organic filler include carbon, rubber-based fillers, silicone-based fine particles, polyamide fine particles, polyimide fine particles, and the like. The content of the organic filler is, for example, 450 parts by mass or less with respect to 100 parts by mass of the thermoplastic resin, and may be 400 parts by mass or less or 350 parts by mass or less. Although the lower limit of content of an organic filler is not specifically limited, For example, it is 10 mass parts or more with respect to 100 mass parts of thermoplastic resins.

(Organic solvents) The thermosetting adhesive composition can be diluted with an organic solvent as needed. The organic solvent is not particularly limited, and its volatility during film formation can be determined in consideration of its boiling point. Specifically, methanol, ethanol, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, methyl ethyl ketone, acetone, methyl isobutyl Solvents with lower boiling points such as ketones, toluene, and xylene are preferred. In addition, for the purpose of improving film forming property, etc., it is preferable to use a solvent with a relatively high boiling point such as dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and cyclohexanone. These solvents can be used individually by 1 type or in combination of 2 or more types.

The thickness of the adhesive layer 3 may be appropriately selected within a range that does not impair the workability, and is, for example, 1 to 200 μm, 5 to 150 μm, or 10 to 150 μm. When the thickness of the adhesive layer 3 is 1 μm or more, it is easy to ensure sufficient adhesiveness. On the other hand, when the thickness is 200 μm or less, it is easy to suppress the thermosetting adhesive composition constituting the adhesive layer 3 from the substrate film 1 or covering. Film 5 overflows.

[cover film] The cover film 5 may be easily peeled off from the adhesive layer 3 . As the cover film 5, polyester films such as polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polymethylpentene film, polyvinyl acetate film, poly- 4-Methylpentene-1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, etc. alone or copolymers or mixtures thereof, such as polyolefin-based films, polyvinyl chloride films, polyimides Films and other plastic films, etc. The cover film 5 can be a single-layer structure or a multi-layer structure. In the case of a multilayer structure, an adhesive film may be used, and specifically, an adhesive film for dicing (manufactured by Maxell, Ltd.) is preferable. The adhesive film may have an adhesive layer and a base material layer. In this case, the adhesive layer may be configured to be in contact with the adhesive layer 3 . As the adhesive layer, a photocurable adhesive layer or a pressure-sensitive adhesive layer can be used, and the aforementioned plastic film or the like can be used as the substrate layer.

The adhesive force between the adhesive layer 3 and the cover film 5 is, for example, 70 N/m or less, may be 50 N/m or less, or may be 20 N/m or less. In particular, when the adhesive layer 3 is composed of a thermosetting resin composition, after heat treatment at 90° C. for 1 second, the adhesive force of the cover film 5 to the adhesive layer 3 is preferably within the above range. When the adhesion force is 70 N/m or less, after the adhesive layer 3 covered with the cover film 5 is temporarily pressure-bonded to the adhesive body (for example, a substrate) at 90° C. for 0.5 seconds, it is possible to The cover film 5 is easily peeled off from the semi-cured adhesive layer 3 with an adhesive tape or the like. In addition, the adhesion force of the cover film 5 to the adhesive layer 3 represents the 90° peel strength, and specifically means that a cover film of the same width is prepared to be placed on an adhesive layer having the same composition as the adhesive layer 3 and having a width of 20 mm. The peel strength measured when peeling the cover film from the adhesive layer at an angle of 90° and a peeling speed of 50 mm/min. When the cover film 5 is an adhesive film having a photocurable adhesive layer, the adhesive force may be a value after light irradiation.

The thickness of the cover film 5 may be appropriately selected within a range that does not impair workability, and is, for example, 10 to 200 μm, 10 to 180 μm, or 15 to 140 μm. The range of these thicknesses is not a problem in practical use, and is also an economically effective range.

＜Manufacturing method of semiconductor module＞ A method for producing the die set 50B (connected body) shown in FIG. 3 using the punched product 20 will be described. 6 is a cross-sectional view schematically showing a state in which an adhesive sheet 3p and a cover film 5p covering the adhesive sheet 3p are picked up from the base film 1 . In the state where a certain tension is applied to the punched product 20, the surface of the punched product 20 on the base film 1 side is brought into contact with the wedge-shaped member 60, and the punched product 20 is moved in the direction of the arrow shown in FIG. move. Thereby, as shown in the drawing, the fronts of the adhesive tablet 3p and the cover film 5p are in a state of floating from the base film 1 . In this state, for example, the adhesive sheet 3p and the cover film 5p are picked up by the pick-up device 65 having attraction force.

Next, the adhesive sheet 3p in the state covered with the cover film 5p is arrange|positioned on the surface 12a of the printed circuit board 12 (refer FIG. 7). In this state, temporary pressure bonding of the adhesive sheet 3p to the printed circuit board 12 is performed. What is necessary is just to carry out temporary crimping, for example, under conditions of temperature 60-100 degreeC, and pressing force 0.1-2 Mpa, for 0.1-10 second. The adhesive tablet 3p is semi-hardened by temporary pressure bonding, and the adhesive force to the surface 12a is improved. Thereafter, the cover film 5p is peeled from the adhesive sheet 3p using an adhesive tape or the like. Thereby, the surface F1 of the adhesive sheet 3p is exposed.

Bonding the front end 15a of the FPC board 15 to the printed circuit board 12 includes a step of pressing the front end 15a to the adhesive sheet 3p and a step of curing the adhesive sheet 3p by heating thereafter. That is, first, after the front end portion 15a of the FPC board 15 is disposed on the upper surface 3f of the adhesive sheet 3p, the front end portion 15a is pressure-bonded to the adhesive sheet 3p. Thereby, the laminated body containing the printed circuit board 12, the FPC board 15, and the adhesive sheet 3p was obtained. The crimping may be performed, for example, under conditions of a temperature of 90 to 150° C. and a pressing force of 0.1 to 3 MPa for 0.1 to 10 seconds. Next, curing treatment of the adhesive sheet 3p is implemented. What is necessary is just to perform hardening processing for 30 to 240 minutes at the temperature of 100-175 degreeC, for example. Thereby, the module 50A shown in FIG. 2 is obtained. Since the adhesive sheet 3p satisfies the above-mentioned condition 1, even if a force is applied to the front end portion 15a after the curing process in the direction in which the front end portion 15a is peeled off from the adhesive sheet 3c, the adhesive sheet 3c can be deformed to a certain extent to suppress The front end portion 15a is peeled off from the adhesive sheet 3c. In addition, in consideration of the heat resistance of the members constituting the module 50A, the temperature conditions for the crimping and curing treatment may be set at about 120 to 140° C., and the treatment time may be set at about 30 to 90 minutes. From such a viewpoint, the heating conditions of the above-mentioned conditions 1 and 2 were set to 130° C. for 1 hour. By setting the temperature of the heating module 50A lower, there is an advantage of expanding the selection range of materials.

The module 50B shown in FIG. 3 is obtained by performing wire bonding on the module 50A. When the adhesive sheet 3p satisfies the above-mentioned condition 2, the shaking of the adhesive sheet 3c in the wire bonding step can be reduced, and connection by wire bonding becomes easy. Thereafter, the semiconductor module is completed by processing to protect the wires W1 and W2 of the module 50B with a resin material, heat treatment for performing a curing reaction of the adhesive sheet 3c, and the like.

As mentioned above, although the embodiment of this indication was demonstrated in detail, this indication is not limited to the said embodiment. For example, in the above-mentioned embodiment, although the case where the adhesive sheet 3p composed of the adhesive composition is prepared in advance by drawing out is exemplified, it can be applied by preparing a coating liquid containing the adhesive composition. It is applied on the surface of the printed circuit board 12 to form an adhesive layer. [Example]

Hereinafter, this indication is demonstrated based on an Example. The present disclosure is not limited to the following examples.

In order to prepare the adhesive varnishes of Examples and Comparative Examples, the following materials were prepared. ＜Epoxy resin (thermosetting resin)＞ ・YDF-8170C (product name, manufactured by NIPPON STEEL Chemical & Material Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent: 160) ・EXA-830CRP product name), manufactured by DIC CORPORATION, bisphenol F type epoxy resin, epoxy equivalent: 160) ・N-500P-10 (product name, manufactured by DIC CORPORATION, cresol novolak type epoxy resin, epoxy equivalent 204) ・Epiclon HP-4710 (product name, manufactured by DIC CORPORATION, naphthalene-type 4-functional epoxy resin, epoxy equivalent: 170) ＜Phenolic resin (thermosetting resin)＞ ・PSM-4326 (product name, manufactured by Gun Ei Chemical Industry Co., Ltd., phenolic resin, functional group equivalent weight 105) ・MEH-7800M (product name, manufactured by MEIWA KAGAKU KOUGYOU CO.,LTD, phenol novolac type phenolic resin, hydroxyl equivalent: 167-180g/eq) ＜Thermoplastic resin＞ ・SG-P3 (product name, manufactured by Nagase Chemtex Corporation, glycidyl-containing acrylic rubber, molecular weight: 800,000, Tg: 12°C) ・SG-708-6 (product name, manufactured by Nagase Chemtex Corporation, carboxyl group-containing acrylic rubber, molecular weight: 700,000, Tg: 4°C) ・SG280 TEA (product name, manufactured by Nagase Chemtex Corporation, carboxyl group-containing acrylic rubber, molecular weight: 900,000, Tg: -29°C) ・WS023 (product name, manufactured by Nagase Chemtex Corporation, hydroxyl-containing acrylic rubber, molecular weight: 500,000, Tg: -10°C) ＜Filling＞ ・SC-2050-HLG (product name, manufactured by Admatechs Co., Ltd., surface treatment filler) ・R972 (product name, manufactured by Nippon Aerosil Co., Ltd., silica particles) ＜Coupling agent＞ ・A-189 (product name, manufactured by Momentive Performance Materials Japan LLC, γ-mercaptopropyltrimethoxysilane, silane coupling agent) ・Z-6119 (product name, manufactured by Dow Toray Co., Ltd., 3-ureapropyltriethoxysilane, silane coupling agent) ＜Curing Accelerator＞ ・Curesol2PZ-CN (product name, manufactured by SHIKOKU CHEMICALS CORPORATION, 1-ethyl-2-phenylimidazole) (Product name, manufactured by SHIKOKU CHEMICALS CORPORATION, imidazole compound) ・Curesol2PZ (product name, manufactured by SHIKOKU CHEMICALS CORPORATION, 2-phenylimidazole) <Solvent> · Cyclohexanone

(Example 1) Adhesive varnishes were obtained by mixing the materials shown in Example 1 of Table 1 with a solvent and performing vacuum degassing. This adhesive varnish was coated on a 38 μm-thick surface release-treated PET film (base film). A film-like adhesive (adhesive layer) having a thickness of 25 μm was formed on one surface of the PET film through the drying step. A laminated film was obtained by attaching an adhesive film for dicing (manufactured by Maxell, Ltd.,) to the surface of the film-like adhesive.

(Examples 2 to 13 and Comparative Example 1) Except having used the adhesive varnish of the composition shown in Examples 2-13 and the comparative example 1 of Tables 1-3, it carried out similarly to Example 1, and each laminated film was produced.

The film adhesives of Examples and Comparative Examples were evaluated for the following items. (Determination of storage modulus) (1) Storage modulus after heating at 130°C for 1 hour After the film adhesive was heated at 130° C. for 1 hour, the storage modulus of the film adhesive was measured by the following method. That is, by laminating a plurality of film-like adhesives with a thickness of 25 μm to a thickness of about 300 μm, setting it to a size of 4 mm in width x 33 mm, and performing a curing treatment at 130° C. for 1 hour. Samples for measurement. The sample was installed in a dynamic viscoelastic device (product name: Rheogel E-4000, manufactured by Universal Building Materials Co., Ltd.) with a distance between chucks of 20 mm, and a tensile load was applied at a frequency of 10 Hz and a heating rate of 3 °C/ Minutes were measured, and the storage modulus at 35°C and 130°C was measured. The results are shown in Tables 1-3. (2) Storage modulus before heating at 130°C for 1 hour The storage modulus of the film adhesive before being heated at 130° C. for 1 hour was also measured in the same manner as above. The storage modulus in 130 degreeC is shown in Tables 1-3.

(Measurement of Melt Viscosity) The melt viscosity at 120° C. of the film adhesive (before heating at 130° C. for 1 hour) was measured by the following method. A measurement sample was obtained by laminating a plurality of film adhesives with a thickness of 25 μm to a thickness of about 300 μm, and punching this into a size of 10 mm×10 mm. A circular aluminum plate jig with a diameter of 8 mm was installed in the dynamic viscoelasticity apparatus ARES (manufactured by TA Instruments), and the above-mentioned sample was further mounted on it. Thereafter, a 5% strain was applied at 35° C., and the temperature was increased to 150° C. at a temperature increase rate of 5° C./min, and the measurement was performed. The frequency was set to be constant at 1 Hz, the initial load was kept at 200 g, and the axial force was kept at 100 g. The value of the melt viscosity in 120 degreeC is described in Tables 1-3.

(measurement of calorific value) The reaction rate of the film adhesive was measured by the following method. That is, 10 mg of the film-like adhesive was weighed on an aluminum pan (manufactured by Epolead Service Co., Ltd.), the aluminum cap was put on, and the evaluation sample was sealed in the sample pan using a crimp. DSC was measured using a differential scanning calorimeter (Thermo plus DSC8235E, manufactured by Rigaku Corporation) under a nitrogen atmosphere at a temperature increase rate of 10°C/min and in a measurement temperature range of 30 to 300°C. As the analysis mechanism of the calorific value, the analysis method of the local area is used. The total calorific value (unit: J/g) was calculated by specifying the baseline within the analysis temperature range and integrating the peak surface area based on the analysis indication in the temperature range of 100°C to 270°C in the DSC curve. Let it be the initial calorific value C1.

The film adhesives (initial samples, first measurement objects) obtained in Examples and Comparative Examples were placed in an oven set at 130° C., and heat-treated for 1 hour. The calorific value (unit: J/g) at 100° C. to 270° C. was calculated using the heat-treated sample (second measurement object) in the same procedure as before the heat treatment. Let this be the calorific value C2 after heat treatment.

Using the obtained values of the two calorific values C1 and C2, the reaction rate was calculated by the following formula. The results are shown in Tables 1-3. Reaction rate (%) = (C1-C2)/C1×100

(Determination of peel strength) The peel strength of the film adhesive was measured by the following method. First, the laminated film was punched into a size of 3.2mm×3.2mm. After the base film was peeled off from the laminated film, the film-like adhesive was attached to the organic substrate, and temporarily pressure-bonded with a pressure of 1.0 N on a table at 90° C. for 0.5 seconds. Next, the cover film was peeled off from the film-like adhesive, and a polyimide film (Upilex 50S (product name), manufactured by UBE Corporation) with a size of 5 mm×100 mm was attached to the film-like adhesive. The force of 15N was officially crimped for 1 second. Then, the film adhesive was hardened by heating at 130 degreeC for 1 hour, and the measurement sample was obtained. The peel strength was measured with a 90-degree peel tester (manufactured by TESTER SANGYO CO,. LTD.) at a test speed of 50 mm/min. The results are shown in Tables 1-3.

[Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Resin component [parts by mass] epoxy resin YDF-8170C 65 65 65 65 65 EXA-830CRP - - - - - N-500P-10 20 20 20 20 20 HP-4710 - - - - - Phenolic resin PSM-4326 55 55 55 55 55 MEH-7800M - - - - - thermoplastic resin SG-P3 100 140 - - - SG-708-6 - - 100 - - SG280 EK23 - - - 100 WS023 EK30 - - - - 100 Filler [parts by mass] SC2050HLG 160 160 160 160 160 R972 - - - - - Coupler [parts by mass] A-189 0.5 0.5 0.5 0.5 0.5 Z-6119 1 1 1 1 1 Curing accelerator [parts by mass] 2PZ-CN 0.2 0.2 0.2 0.2 0.2 2PZ - - - - - Modulus of elasticity after curing at 35°C [MPa] 600 200 300 40 40 Modulus of elasticity after curing at 130°C [MPa] 10 5 4 5 2 Modulus of elasticity after curing at 130°C [MPa] 0.3 0.4 0.3 0.4 0.3 Response rate[%] 60 50 - 50 - Melt viscosity at 120℃[Pa·s] 8000 12500 9500 5500 5500 Peel strength of polyimide film [N/m] 300 500 300 500 550

[Table 2] Example 6 Example 7 Example 8 Example 9 Example 10 Resin component [parts by mass] epoxy resin YDF-8170C 65 60 50 70 70 EXA-830CRP - - - - - N-500P-10 20 20 20 10 HP-4710 - - - 20 10 Phenolic resin PSM-4326 55 60 70 50 50 MEH-7800M - - - - - thermoplastic resin SG-P3 - - - - - SG-708-6 - - - - - SG280 EK23 100 100 100 100 100 WS023 EK30 - - - - - Filler [parts by mass] SC2050HLG 160 160 160 160 160 R972 - - - - - Coupler [parts by mass] A-189 0.5 0.5 0.5 0.5 0.5 Z-6119 1 1 1 1 1 Curing accelerator [parts by mass] 2PZ-CN - 0.2 0.3 0.2 0.2 2PZ 0.2 - - - - Modulus of elasticity after curing at 35°C [MPa] 90 90 130 120 70 Modulus of elasticity after curing at 130°C [MPa] 8 7 8 twenty two 7 Modulus of elasticity after curing at 130°C [MPa] 0.5 0.5 0.5 0.4 0.5 Response rate[%] 50 50 60 80 50 Melt viscosity at 120℃[Pa·s] 7000 7000 7500 6500 6500 Peel strength of polyimide film [N/m] 400 350 400 300 350

[table 3] Example 11 Example 12 Example 13 Comparative example 1 Resin component [parts by mass] epoxy resin YDF-8170C 55 70 - 65 EXA-830CRP - - 40 - N-500P-10 20 - 70 20 HP-4710 - 20 - - Phenolic resin PSM-4326 45 50 - 55 MEH-7800M - - 90 - thermoplastic resin SG-P3 - 100 180 60 SG-708-6 - - - - SG280 EK23 100 - - - WS023 EK30 - - - - Filler [parts by mass] SC2050HLG 160 160 - 200 R972 - - 20 - Coupler [parts by mass] A-189 0.5 0.5 0.4 0.5 Z-6119 1 1 0.7 1 Curing accelerator [parts by mass] 2PZ-CN 0.2 0.2 0.4 0.2 2PZ - - - - Modulus of elasticity after curing at 35°C [MPa] 140 600 430 2700 Modulus of elasticity after curing at 130°C [MPa] 8 32 7 - Modulus of elasticity after curing at 130°C [MPa] 0.7 0.3 0.4 0.02 Response rate [%] 50 80 80 70 Melt viscosity at 120℃[Pa·s] 8500 9000 7500 4000 Peel strength of polyimide film [N/m] 400 300 1100 100

1: Substrate film 3: Adhesive layer 3c, 3p: adhesive tablets 5,5p: cover film 10:Laminated film 12: Printed circuit substrate 15: Flexible printed circuit board 15a: front end 20: Punching processed products 50A, 50B: module (connector) C: semiconductor wafer W1, W2: wire

FIG. 1 is a cross-sectional view schematically showing one embodiment of the laminated film of the present disclosure. FIG. 2 is a cross-sectional view schematically showing the state of the manufacturing process of the semiconductor module. FIG. 3 is a cross-sectional view schematically showing the state of the manufacturing process of the semiconductor module. Fig. 4 is a perspective view schematically showing an example of a punched product of the present disclosure. Fig. 5 is a sectional view taken along line V-V shown in Fig. 4 . 6 is a cross-sectional view schematically showing a state in which an adhesive sheet and a cover film covering the adhesive sheet are picked up from a base film. FIG. 7 is a cross-sectional view schematically showing the state of the manufacturing process of the semiconductor module.

1: Substrate film

3: Adhesive layer

5: Cover film

10:Laminated film

Claims (10)

A thermosetting adhesive composition used for bonding circuit components to each other, wherein After the thermosetting adhesive composition is heated at 130° C. for 1 hour, the storage modulus at 35° C. is 700 MPa or less. The thermosetting adhesive composition as described in Claim 1, wherein After the thermosetting adhesive composition is heated at 130° C. for 1 hour, the storage modulus at 130° C. is 4 MPa or more. The thermosetting adhesive composition as described in Claim 1 or Claim 2, wherein The reaction rate calculated from the calorific value C2 of the second measuring object relative to the calorific value C1 of the first measuring object by the following formula is 40% or more. The calorific value in the range of 100°C to 270°C obtained from the DSC curve obtained by the differential scanning calorimetry, Reaction rate (%) = (C1-C2)/C1×100 The aforementioned first measurement object is the thermosetting adhesive composition, The aforementioned second measurement object is the resin composition after heating the thermosetting adhesive composition at 130° C. for 1 hour. The thermosetting adhesive composition according to any one of claim 1 to claim 3 has a melt viscosity at 120° C. of 3500-12000 Pa·s. The thermosetting adhesive composition according to any one of claim 1 to claim 4, which comprises thermoplastic resin, thermosetting resin and inorganic filler, wherein When the total mass of this thermosetting adhesive composition is 100 mass parts, content of the said thermoplastic resin is 20-40 mass parts. The thermosetting adhesive composition according to any one of claim 1 to claim 5, which comprises thermoplastic resin, thermosetting resin and inorganic filler, wherein When the total mass of this thermosetting adhesive composition is 100 mass parts, content of the said inorganic filler is 30-50 mass parts. The thermosetting adhesive composition as described in Claim 5 or Claim 6, wherein The aforementioned thermoplastic resin has a glass transition temperature in the range of -50°C to 20°C. A laminated film having: base film; and The adhesive layer is arranged on the surface of the aforementioned base film, The aforementioned adhesive layer is composed of the thermosetting adhesive composition described in any one of claim 1 to claim 7. A method for manufacturing a linker, comprising sequentially: A step of preparing a laminate comprising a first circuit member, a second circuit member, and an adhesive layer disposed between the first and second circuit members; A step of heating the aforementioned laminate at 100-175°C for 30-240 minutes; and a step of wire-bonding the first circuit member and the second circuit member, The aforementioned first circuit member is one selected from the group consisting of printed circuit boards and semiconductor chips, The aforementioned second circuit member is a flexible printed circuit board, The aforementioned adhesive layer is composed of the thermosetting adhesive composition described in any one of claim 1 to claim 7. A linker comprising: the first circuit member; the second circuit member; and The adhesive layer disposed between the aforementioned first and second circuit members, The aforementioned first circuit member is one selected from the group consisting of printed circuit boards and semiconductor chips, The aforementioned second circuit member is a flexible printed circuit board, The aforementioned adhesive layer is composed of a cured product of the thermosetting adhesive composition described in any one of claim 1 to claim 7.

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