TW202326161A - Sensor chip calibration device and sensor chip calibration method - Google Patents

Abstract

A calibrating a sensor chip calibration method includes arranging a first reference temperature sensor on a load board. The first reference temperature sensor is used to measure a load board temperature. A to-be test object is set on the load board, and the to-be test object calibrates a to-be test object temperature through a second reference temperature sensor. And, the temperature of the to-be test object temperature is compared with the temperature of the load board temperature through a processor. When the temperature of the to-be test object temperature and the temperature of the load board temperature are the same, then the to-be test is tested.

Description

Sensing wafer calibration device and sensing wafer calibration method

The present invention relates to a calibration device and a calibration method, in particular to a sensing wafer calibration device and a sensing wafer calibration method.

The mass production of temperature sensing chips will be affected by three main aspects, packaging form, test environment, and reference temperature. The test environment includes test machines, classifiers, tools, and test processes. During the test, the material of the test head that the object to be tested is in contact with will have a significant impact on temperature sensing. Different materials (such as: steel and copper pillars) will have an impact on the temperature, and then affect the Test the accuracy of the temperature sensing die.

Therefore, it has become one of the problems to be solved in this field how to avoid the material of the test head which is in contact with the object to be tested from significantly affecting the temperature sensing.

In order to solve the above problems, an aspect of the present disclosure provides a sensing wafer calibration device including: a test load board and an object under test. The test carrier board is used to place a first reference thermometer; the first reference thermometer is used to measure the temperature of a carrier board. The object to be tested is set on the test carrier board, and the object to be tested passes through a second reference temperature device to calibrate the temperature of the object to be tested. Wherein, a processor is used to compare the temperature of the object to be tested with the temperature of the carrier, and when the temperature of the object to be tested and the temperature of the carrier are consistent, the object to be tested is then tested.

In order to solve the above-mentioned problems, another aspect of the present disclosure provides a method for calibrating a sensor chip, including: disposing a first reference temperature device on a test load board; the first reference temperature device is used for Measuring the temperature of a carrier board; setting an object to be tested on the test carrier board, and the object to be tested passes through a second reference temperature device to calibrate the temperature of the object to be tested; Comparing with the temperature of the carrier board, when the temperature of the object to be tested is consistent with the temperature of the carrier board, then the object to be tested is tested.

It can be seen from the above that, with the sensor chip calibration device and the sensor chip calibration method of this case, the object to be measured passes through the reference temperature device to calibrate the temperature of the object to be measured, and the temperature of the object to be tested is compared with the temperature of the substrate , when the temperature of the object to be tested is the same as that of the carrier board, the object to be tested is tested, thereby reducing the temperature influence in the test environment. In addition, by adjusting the position of the reference thermometer on the test carrier so that the object under test is located on the same plane as a socket, the reference thermometer on the test carrier and the reference thermometer on the test carrier are both in the same plane. Parallel on the horizontal plane can reduce the influence of the temperature of the test sorter on the temperature of the object to be tested. In addition, placing the pressure block of the same material on the reference thermometer on the test carrier and the object to be tested respectively can make both of them subject to the same test contact area. Through the above method, the test for measuring the temperature sensing chip can be greatly optimized, and the function of measuring the temperature sensing chip can be achieved more accurately, so as to effectively evaluate whether the quality of a batch of temperature sensing chips can be mass-produced.

The following description is a preferred implementation of the invention, and its purpose is to describe the basic spirit of the invention, but not to limit the invention. For the actual content of the invention, reference must be made to the scope of the claims that follow.

It must be understood that words such as "comprising" and "comprising" used in this specification are used to indicate the existence of specific technical features, values, method steps, operations, components and/or components, but do not exclude possible Add more technical characteristics, values, method steps, operation processes, components, components, or any combination of the above.

Words such as "first", "second", and "third" used in the claims are used to modify the elements in the claims, and are not used to indicate that there is an order of priority, an antecedent relationship, or an element An element preceding another element, or a chronological order in performing method steps, is only used to distinguish elements with the same name.

Generally speaking, during the test process, the material of the test head that the object under test is in contact with will have a significant impact on temperature sensing. Different materials (such as: steel and copper pillars) will have an impact on temperature. About 0.75 degrees Celsius to 1 degree Celsius is enough to affect the accuracy of testing the temperature sensing chip, so it needs to be optimized for the temperature sensing chip testing and mass production process.

Please refer to FIGS. 1-2. FIG. 1 is a schematic diagram of a sensor chip calibration device 100 according to an embodiment of the present invention. FIG. 2 is a schematic diagram illustrating a sensor chip calibration method 200 according to an embodiment of the present invention. In one embodiment, the sensing chip described in this application may be a temperature sensing chip, or other chips used to detect temperature-related issues.

As shown in FIG. 1 , the sensing wafer calibration device 100 includes a test load board LB and an object under test FA.

In one embodiment, the sensing wafer calibration device 100 further includes a test carrier LB, a first reference temperature device (not shown, as long as it is placed at a place where the temperature of the test carrier LB can be measured), a waiting The test object FA and a second reference thermometer TMP, wherein the first reference thermometer, the test object FA and the second reference thermometer TMP are arranged on a socket SOK, and the socket is on the test carrier board LB.

In one embodiment, the socket and the object under test FA are located on the test carrier board LB, and the object under test FA is, for example, a temperature sensing chip.

In one embodiment, the process of mass production testing is as follows: the socket base (socket base) is locked on the socket SOK of the test carrier board LB, the test head (test head) is installed on the classification machine, and the test head is through the copper When the column is in contact with the object FA to be tested, it will draw the object FA from the work tray (tray) to the top of the socket SOK and then press it down for testing. The classifier can heat the test head, and the mass production test process The temperature of the test head can be controlled through the sensing wafer calibration method 200 . Please refer to Figure 2 next.

In step 210, a first reference thermometer is arranged on the test carrier board LB, and the first reference thermometer is used to measure the temperature of a carrier board.

In step 220 , an analyte FA is set on the test carrier, and the analyte FA passes through a second reference temperature device TMP to calibrate a temperature of the analyte.

In step 230, a processor (not shown, electrically coupled to the test carrier board LB) compares the temperature of the object under test with the temperature of the carrier board, and when the temperature of the object under test and the temperature of the carrier board are the same , and then test the analyte FA.

In one embodiment, the processor can be composed of a bulk circuit such as a micro controller, a microprocessor, a digital signal processor, an application specific integrated circuit (ASIC) ) or a logic circuit, the processor can receive or send signals to the test carrier board LB.

In one embodiment, please refer to Figures 3A~3B. Figures 3A~3B illustrate a method for adding a briquette BK1 to the object FA and adding a briquette BK2 to a second reference thermometer according to an embodiment of the present invention. Schematic diagram on TMP. In one embodiment, as shown in FIG. 3A , only the pressing block BK1 is used to prepare to apply pressure to the object under test. In one embodiment, as shown in FIG. 3B , the pressing block BK2 is applied to the second reference temperature device TMP, and the pressing block BK1 is applied to the object to be tested FA.

In one embodiment, the pressing block BK1 and the pressing block BK2 are made of the same material.

In one embodiment, the size of the pressing block BK2 is greater than or equal to the second reference temperature sensor TMP, and the size of the pressing block BK1 is greater than or equal to the test object FA.

Thereby, in the test process, the analyte FA and the second reference temperature device TMP can receive the same contact area.

Please refer to FIGS. 4A-4B . FIGS. 4A-4B are diagrams showing a modified position of the second reference temperature device TMP to be parallel to the object FA according to an embodiment of the present invention.

In Figures 4A~4B, the oblique part is the part of the test carrier board LB that can be seen. Therefore, it can be seen from Figure 4A that the placement position of the second reference temperature sensor TMP is located on the test carrier board LB. It can be seen from Figure 4B , the placement position of the second reference temperature device TMP is located on the test carrier board LB.

In one embodiment, please refer to FIG. 4A, the placement position of the second reference temperature device TMP is located on the test carrier board LB, the object under test FA is located on the socket SOK, the second reference temperature device TMP and the object under test FA are not Located on the same level, for example, when the thickness of the second reference temperature device TMP is the same as that of the test object FA, in Figure 4A, the second reference temperature device TMP may be lower than the test object FA, and the two are not in on the same level.

In one embodiment, please refer to FIG. 4B , by modifying the placement position of the second reference temperature device TMP so that it is parallel to the object under test FA. The placement position of the second reference temperature sensor TMP on the test carrier board LB is on the same plane as the object under test FA on the socket SOK. In other words, the placement position of the second reference thermometer TMP is on the same horizontal plane as the object FA, and the placement position of the second reference thermometer TMP is parallel to the horizontal plane of the object FA. In Fig. 4B, the second reference temperature device TMP and the analyte FA are at the same level.

Thereby, the influence of the handle temperature on the second reference temperature device TMP can be reduced.

In one embodiment, the socket SOK and a cover are collectively referred to as a hand tester. The hand tester includes a hand tester test head. The test head of a test sorter (test handler) for objects is made of copper, and the temperature difference between the multiple samples calibrated by the hand tester and the calibrated object is about plus 0.25 degrees Celsius to minus 0.25 degrees Celsius between degrees.

In one embodiment, the upper cover is used to cover the test carrier board LB.

In one embodiment, when the temperature of the object under test and the temperature of the carrier board are the same, the processor performs testing through a plurality of sockets SOK corresponding to a plurality of samples to obtain a plurality of data correspondingly, and each data is related to the temperature of the carrier board The difference shall not be greater than 1. When the difference between one of these data and the temperature of the carrier plate is greater than 1, the test is ended. This situation means that these samples are too different and inconsistent to be used in subsequent steps. For example, there are 4 sockets S1~S4 in total, and 4 samples can be tested (or verified) at a time to obtain data D1~D4 respectively. Data D1 is for example 1255, data D2 is for example 1256, data D3 is for example 1257, The data D4 is, for example, 1255. If the difference between the data D3 and the data D1 and D4 is greater than 1, it means that the difference between these samples is too large, so the test is ended. In some examples, the processor may select 10 samples for verification at a time, however, the present invention is not limited thereto, and this is only an example.

In one embodiment, the processor uses a calibration program to capture these samples, and the plurality of user identifiers (UIDs) corresponding to these samples are the same fixed identifier, such as “Corr.”. For example, if there is a batch of 40 sample chips, the user identification symbols of this batch of sample chips will be “Corr.”. In this way, non-sample wafers are prevented from being mixed into the batch of samples, and production line operation errors (such as caused by mixing materials) are avoided. When one of the samples fails, mass production cannot be performed.

In one embodiment, assuming that the user ID of chip A is not “Corr.”, it may pause at this time to find the chip A mixed with the sample for debugging.

In one embodiment, the processor uses a calibration program to perform a mass production sorter test, and accesses an offset code diff, which is used to represent the difference between the FA of the test object and an ambient temperature . In one embodiment, the ambient temperature refers to the temperature of the testing environment. For example, the temperature on the production line may vary slightly due to the weather.

In one embodiment, according to the offset difference code, the processor dynamically selects a test program code corresponding to the offset difference code and writes it into the object under test FA. For example, when the offset difference code is 2, the processor writes the program code corresponding to the offset difference code of 2 into the object under test FA, and mass-produces the object under test A after calibration.

Thereby, the temperature measurement error of the calibrated analyte FA at room temperature can be within a certain range, for example, between plus 0.25°C and minus 0.25°C.

Please refer to FIG. 5 . FIG. 5 is a flowchart illustrating a method 500 for establishing a test process according to an embodiment of the present invention. In Fig. 5, the test process method 500 is used to build the production line. During the test process, the difference between the mass production (such as 40 sample chips) and the manual test is captured to achieve the expected temperature. Control, for example: the average temperature code (temp code) of 20 samples is 2958, the average temperature code captured by the Handler test head is 2961, and the displacement code is equal to the average temperature code value 2961 minus The average value of the temperature code is 2958 (that is, one code is 3), and this displacement code is applied in the mass production process, so that the factory sample temperature error can be between plus 0.25 degrees Celsius and minus 0.25 degrees Celsius. The room temperature of the test factory is expected to be between 20 degrees Celsius and 25 degrees Celsius. The method 500 for establishing the test process can stop the test immediately when the temperature exceeds the expectation, so as to ensure the accuracy of the test.

In step 510, the processor uses the test program to verify the multiple samples according to the calibration test specification of the production line (for example, more than 20 samples need to be obtained).

In step 520, the processor determines whether it is a final test and verifies whether the respective fixed identifiers of these samples are correct.

In one embodiment, when the processor determines that at least one of the fixed identifiers is not “Corr.”, it means that the samples are mixed with non-samples, and then returns to step 510 . In some examples, the fixed identification symbol is not necessarily "Corr.", but may be other identification symbols, so the present invention is not limited thereto, and this is only an example.

In one embodiment, when the processor determines that the respective fixed identification symbols of these samples are all “Corr.”, it means that these samples are correct, and then enters step 530 .

In one embodiment, the processor receives an input signal from a user interface to know whether the respective fixed identifiers of the samples are correct.

In one embodiment, the processor receives an input signal from a user interface or grabs a value of a counter to know whether it is a final test. The counter can be used to record the number of tests, for example, each sample needs to be tested 30 times, and the 30th test is the final test.

In one embodiment, when the processor determines in step 520 to be negative, it first confirms whether the fixed identification symbol is “Corr.”, and then returns the confirmation result to step 510 .

In step 530, the processor determines whether the function of each sample and the output value of the sample are normal. When the processor judges that the function of each sample is normal and the output value of the sample is normal, it goes to step 540 . When the processor determines that one of the function of each sample and the output value of the sample is not normal, the process returns to step 510 .

In one embodiment, the processor tests whether the function of the sample is normal, such as wafer testing of voltage, current, resistance, etc.

In one embodiment, the processor receives the sample temperature value transmitted from the second reference temperature sensor TMP.

In one embodiment, when the processor judges that one of the function of each sample and the output value of the sample is abnormal, it can be confirmed by software or manpower that the test machine, ambient temperature or other factors cause the problem.

When the processor determines that the temperature of the sample is within a temperature threshold and the function of the sample is normal, step 540 is executed.

In step 540, the processor records an offset code difference value in a storage device.

In one embodiment, the storage device is, for example, a ROM, a flash memory, a floppy disk, a hard disk, an optical disk, a flash drive, a magnetic tape, a database that can be accessed from the network, or those familiar with the art can easily think of it Storage media with the same function.

In one embodiment, the offset code difference is used to represent the difference between the analyte FA and an ambient temperature.

In one embodiment, the content of the offset code difference includes test time, sample number, reference chip value, reference temperature, information of the object under test FA, sample quantity, offset value, number of the test carrier LB, etc. .

In this way, the process of building a test is completed.

Please refer to FIG. 6 , which is a flow chart of a mass production testing method 600 according to an embodiment of the present invention.

In step 610, the processor starts to test a plurality of DUTs FA through a mass production test program.

In step 620 , the mass production test program obtains the offset code difference from the storage device and determines whether the quantity of the plurality of DUTs FA is greater than a threshold value of the DUT quantity.

In one embodiment, the sample number threshold is, for example, 20, but this is only an example, and the present case is not limited thereto.

When the mass production test program successfully obtains the offset to-be-coded difference and determines that the quantity of the DUT is greater than the threshold value of the quantity of the DUT, it proceeds to step 630 .

When the mass production test program fails to obtain the offset to be coded difference, or it is determined that the number of DUTs is not greater than the threshold value of the number of DUTs, then go back to step 610 .

In one embodiment, when the mass production test program fails to obtain the offset to be coded difference, or it is determined that the number of DUTs is not greater than the threshold value of the number of DUTs, the sample test failure message is set through software or manually, and re-confirmed Whether there is a sample test, because it is already on the production line at this time, there should be no samples, so it is necessary to use software or manual to check whether there are samples or other factors, so that step 620 cannot pass.

In step 630, the mass production test program judges whether the user ID is null. When the mass production test program determines that the user ID is not null, it returns to step 610 , which means that there may be sample chips mixed into the FA chip under test for mass production testing. When the mass production test program determines that the user ID is null, the process goes to step 640 .

In one embodiment, when the mass production test program judges that the user identification symbol is not null, it is confirmed whether the sample is mixed through software or manually for testing. Since it is already on the production line at this time, there should be no sample. Therefore, it is necessary to check whether there are samples or other factors by software or manually, so that step 630 cannot pass.

In step 640, the mass production test program judges whether the function of each DUT FA meets various pre-defined standards. When the mass production test program judges that the function of each DUT FA meets various pre-defined standards, the process goes to step 650 . When the mass production test program judges that the functions of each DUT FA do not meet the pre-defined standards, the process goes to step 645 .

In one embodiment, in one embodiment, the mass production test program will test whether the function of each DUT FA is normal, such as chip testing of voltage, current, resistance, etc.

In step 645, the mass production test program determines that the test object FA fails the test.

In step 650, the mass production test program judges that the test object FA has passed the test. Therefore, it can be mass-produced for the analyte FA.

It can be seen from the above that, with the sensor chip calibration device and the sensor chip calibration method of this case, the object to be measured passes through the reference temperature device to calibrate the temperature of the object to be measured, and the temperature of the object to be tested is compared with the temperature of the substrate , when the temperature of the object to be tested is the same as that of the carrier board, the object to be tested is tested, thereby reducing the temperature influence in the test environment. In addition, by adjusting the position of the reference thermometer on the test carrier so that the object under test is located on the same plane as a socket, the reference thermometer on the test carrier and the reference thermometer on the test carrier are both in the same plane. Parallel on the horizontal plane can reduce the influence of the temperature of the test sorter on the temperature of the object to be tested. In addition, placing the pressure block of the same material on the reference thermometer on the test carrier and the object to be tested respectively can make both of them subject to the same test contact area. Through the above method, the test for measuring the temperature sensing chip can be greatly optimized, and the function of measuring the temperature sensing chip can be achieved more accurately, so as to effectively evaluate whether the quality of a batch of temperature sensing chips can be mass-produced.

100: Sensing wafer calibration device TMP: second reference temperature device SOK: socket FA: analyte 200: Sensing wafer calibration method 210~230,510~540,610~650: steps BK1, BK2: Briquetting block LB: Test carrier board 500: Build a test process method 600: Mass Production Test Methods

FIG. 1 is a schematic diagram of a sensing chip calibration device according to an embodiment of the present invention. FIG. 2 is a schematic diagram illustrating a sensor chip calibration method according to an embodiment of the present invention. FIGS. 3A-3B are schematic diagrams illustrating adding a compact to the object to be tested and adding the compact to the second reference thermometer according to an embodiment of the present invention. FIGS. 4A-4B are diagrams illustrating a modification of the placement position of the second reference thermometer so that it is parallel to the object to be tested according to an embodiment of the present invention. FIG. 5 is a flow chart illustrating a method for building a testing process according to an embodiment of the present invention. FIG. 6 is a flowchart illustrating a mass production testing method according to an embodiment of the present invention.

200: Sensing wafer calibration method

210~230: Steps

Claims (10)

A sensing wafer calibration device, comprising: a test load board (load board) for placing a first reference thermometer; the first reference thermometer is used for measuring the temperature of a load board; and An object to be tested is set on the test support plate, and the object to be tested passes through a second reference temperature device to calibrate the temperature of the object to be tested; Wherein, the temperature of the object under test is compared with the temperature of the carrier board through a processor, and the object under test is tested when the temperature of the object under test and the temperature of the carrier board are consistent. According to the sensor chip calibration device according to claim 1, a socket and the object under test are located on the test carrier board. The sensing chip calibration device according to claim 1, wherein the second reference thermometer on the test carrier is placed on the same plane as the object under test on a socket. The sensor chip calibration device as claimed in claim 1, wherein a first pressing block is applied to the second reference temperature device, and a second pressing block is applied to the object under test, wherein the first pressing block and the second pressing block are applied The compacts are of the same material. The sensing wafer calibration device according to claim 4, wherein the size of the first pressing block is greater than or equal to the second reference thermometer, and the size of the second pressing block is greater than or equal to the object under test. Such as the sensing chip calibration device of claim 1, wherein a socket and a cover (cover) are collectively referred to as a hand tester, and the hand tester includes a hand tester test head (test head), and the hand tester test head is a Steel material, a test head of a test sorter (test handler) for testing the object to be tested is made of copper, a plurality of samples calibrated by the hand tester and the calibrated test handler The object temperature difference is between plus 0.25 degrees Celsius and minus 0.25 degrees Celsius. A sensing wafer calibration method, comprising: disposing a first reference temperature device on a test carrier board (load board); the first reference temperature device is used to measure the temperature of a carrier board; An object to be tested is set on the test carrier, and the object to be tested passes through a second reference temperature device to calibrate the temperature of an object to be tested; and The temperature of the object under test is compared with the temperature of the carrier board through a processor, and when the temperature of the object under test is consistent with the temperature of the carrier board, the object under test is tested again. The sensing chip calibration method according to claim 7, wherein when the temperature of the object to be measured is the same as the temperature of the carrier board, the processor performs testing through a plurality of sockets corresponding to a plurality of samples, so as to obtain a plurality of data correspondingly , the difference between each of these materials and the temperature of the carrier board shall not be greater than 1, and when there is a situation that the difference between one of the data and the temperature of the carrier board is greater than 1, the test is ended. Such as the sensor chip calibration method of claim 8, further comprising: The processor uses a calibration program to capture the samples, and the plurality of user identifiers (UIDs) corresponding to the samples are the same fixed identifier. Such as the sensor chip calibration method of claim 9, wherein the processor uses the calibration program to perform a mass production sorter test, and accesses an offset code difference (offset code diff), and the offset code difference is used to represent the The temperature difference between the analyte and an ambient temperature.

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