TW202324574A - Holding mechanism and adhesion apparatus capable of suppressing deviation of a workpiece without using an electrostatic chuck - Google Patents

Abstract

An object of the present invention is to suppress deviation of a workpiece without using an electrostatic chuck. A holding mechanism 2 is a mechanism for holding a workpiece, and includes: a suction table 10 having a holding surface 141 for holding the workpiece by suction; a vacuum chamber 40 that accommodates the suction table 10 and is capable of reducing a pressure in the interior; and a deviation prevention means 70 for preventing deviation of the workpiece when the pressure inside the vacuum chamber 40 is reduced while the workpiece is sucked and held by the suction table 10 . At least part of the holding surface 141 of the suction table 10 is formed of a tack layer 14 having adhesion, and the suction table 10 also serves as the deviation prevention means 70.

Description

Holding mechanism and pasting device

The invention relates to a holding mechanism and a pasting device for holding workpieces.

For example, in the manufacturing process of a semiconductor element, the adhesive film sticking apparatus which sticks various adhesive films to a semiconductor wafer (for example, refer patent document 1 and patent document 2) is widely used.

On the other hand, an adhesive film attaching device called a vacuum attacher that attaches an adhesive film to a wafer in a reduced pressure environment (for example, refer to Patent Document 3) is also widely used. This kind of adhesive film sticking device sticks the adhesive film to the wafer in a decompressed environment, and uses the differential pressure from the atmosphere to make the adhesive film and the wafer tightly bonded, preventing the formation of air bubbles between the wafer and the adhesive film. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2020-047899 [Patent Document 2] Japanese Patent Laid-Open No. 2020-047699 [Patent Document 3] Japanese Patent Laid-Open No. 2021-034605

[Problems to be Solved by the Invention] Generally, an electrostatic chuck table is used to hold wafers in a vacuum chamber (decompression chamber). However, the electrostatic chuck table is expensive, and a suction table that uses suction to hold a workpiece has been desired. However, if the chamber is depressurized, there is a problem that the suction table cannot continuously absorb the workpiece on the surface of the suction table, and when the suction force disappears, the workpiece will move and deviate from the position held by suction.

In particular, when the workpiece is thinned and warped, if the suction force disappears from the state of suction and holding by the suction table, the workpiece will move greatly, which is a problem.

An object of the present invention is to provide a holding mechanism and an adhering device which can suppress positional deviation of workpieces without using an electrostatic chuck.

[Technical means to solve the problem] In order to solve the above-mentioned problems and achieve the purpose, the holding mechanism of the present invention is a holding mechanism for holding a workpiece, which is characterized in that it includes: a suction table, which has a holding surface for attracting and holding the workpiece; a vacuum chamber, which houses the suction table and has an internal capacity decompression; and means for preventing deviation of the workpiece when decompression is performed in the vacuum chamber in a state where the workpiece is sucked and held by the suction table.

In the holding mechanism, at least a part of the holding surface of the suction table may be constituted by a member having an adhesive force, and the suction table may also serve as the displacement preventing means.

In the holding mechanism, the displacement preventing means may have a plurality of workpiece fixing members configured to move from the outer side of the outer periphery of the workpiece held by the suction table toward the center of the holding surface. freely.

In the holding mechanism, the displacement preventing means may have a pressing member that presses an upper surface side of the workpiece on the suction table.

The sticking device of the present invention is a sticking device for sticking an adhesive film to a workpiece, and is characterized in that it has: a suction table, which has a holding surface for attracting and holding the workpiece; an adhesive film holding unit, which makes the adhesive film face the suction table. The adhesive film is held in the state of the workpiece; the adhesive roller, which sticks the adhesive film held by the adhesive film holding unit to the workpiece on the suction table; the vacuum chamber, which accommodates the suction table and the adhesive roller and can reduce the pressure inside and an offset preventing means for preventing the offset of the workpiece when the vacuum chamber is depressurized in a state where the workpiece is sucked and held by the suction table.

[Efficacy of the invention] The present invention exerts the effect of suppressing positional deviation of workpieces without using an electrostatic chuck.

Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the components described below include those that can be easily conceived by a person having ordinary knowledge in the technical field to which the present invention pertains, and those that are substantially the same. In addition, the structure described below can be combined suitably. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

[Embodiment 1] The bonding apparatus according to Embodiment 1 of the present invention will be described based on the drawings. Fig. 1 is a cross-sectional view schematically showing a configuration example of an adhering device according to Embodiment 1. Fig. 2 is a perspective view schematically showing a workpiece pasted on an adhesive film by the pasting device shown in Fig. 1 .

The sticking device 1 shown in FIG. 1 of Embodiment 1 is a device for sticking an adhesive film 210 on the back surface 205 of the workpiece 200 shown in FIG. 2 . The workpiece 200 pasted with the adhesive film 210 by the pasting device 1 of Embodiment 1 uses silicon (Si), sapphire (Al ₂ O ₃ ), gallium arsenide (GaAs), or silicon carbide (SiC) as the substrate 201 Disc-shaped semiconductor wafers, optical element wafers and other wafers.

As shown in FIG. 2 , the workpiece 200 is formed with elements 204 in each region of the front 203 divided by a plurality of intersecting dividing lines 202 . The element 204 is, for example, an integrated circuit such as IC (Integrated Circuit) or LSI (Large Scale Integration, large scale integrated circuit), CCD (Charge Coupled Device, charge coupled device) or CMOS (Complementary Metal Oxide Semiconductor, complementary metal Oxide semiconductor) and other image sensors, MEMS (Micro Electro Mechanical Systems, micro-electromechanical systems) or memory (semiconductor memory device), etc. In the workpiece 200, the front surface 203 and the back surface 205 on the back side of the front surface 203 cover the entire circumference to form a chamfered portion 206 convexly curved toward the outer peripheral direction.

In Embodiment 1, the workpiece 200 is pasted with a disc-shaped adhesive film 210 on the back side 205, and is supported in the inner opening of the ring frame 211, and the diameter of the disc-shaped adhesive film 210 is larger than that of the workpiece 200. And the ring frame 211 is pasted on the outer edge. The workpiece 200 is divided into individual elements 204 along planned dividing lines 202 . In Embodiment 1, the adhesive film 210 includes: a base material layer, which is flexible and made of a non-adhesive resin; and an adhesive layer, which is laminated on the base layer and has flexibility and Made of adhesive resin.

The pasting device 1 of Embodiment 1 is a device for sticking a disc-shaped adhesive film 210 to the back surface 205 of a workpiece 200. The disc-shaped adhesive film 210 is larger in diameter than the workpiece 200 and has a ring-shaped frame 211 attached to its outer edge. . As shown in FIG. 1 , the bonding device 1 includes a holding mechanism 2 and a control unit 100 .

The holding mechanism 2 is a mechanism for holding the workpiece 200 . The holding mechanism 2 includes: a suction table 10 , an adhesive roller 20 , a roller moving unit 30 , a vacuum chamber 40 , and a lifting unit 60 for raising and lowering the suction table 10 .

The suction table 10 is provided with: the frame holding part 11 which has the frame holding surface 111 which suction-holds the annular frame 211, and the workpiece|work holding part 12 which has the holding surface 141 which suction-holds the workpiece|work 200. As shown in FIG. The frame holding part 11 is integrally provided with: a disk-shaped disk part 112 whose outer diameter is larger than that of the workpiece 200; The inner and outer diameters of the frame 211 are equal. The upper surface of the ring portion 113 is the frame holding surface 111 for attracting and holding the ring frame 211 . The frame holding surface 111 is formed flat along the horizontal direction. The frame suction hole 114 opens on the frame holding surface 111 .

The workpiece holding portion 12 is formed in a disk shape with an outer diameter slightly smaller than that of the workpiece 200 , and is arranged coaxially with the frame holding portion 11 on the disk portion 112 of the frame holding portion 11 . The upper surface 121 of the workpiece holding portion 12 is formed flat along the horizontal direction. The adhesive layer 14 (corresponding to an adhesive member) made of silicon-based resin, silicon-based rubber, or fluorine-based rubber is laminated on the upper surface 121 . The adhesive layer 14 can be comprised by "flex carrier (trademark)" manufactured by UMI Co., Ltd., "GEL BASE (trademark)" manufactured by EXSEAL Co., Ltd., etc., for example.

If the adhesive layer 14 is placed on the front side 203 of the workpiece 200 , it will adhere to and fix the front side 203 of the workpiece 200 by the adhesive force. In addition, the so-called viscous force refers to weak or strong cohesive force. The so-called weak cohesive force means that spherical beads are placed on the viscous layer 14 as articles, and the viscous layer 14 is continuously inclined and spherical. The adhesive force when the angle of the viscous layer 14 relative to the horizontal direction when the beads start to roll is 3.5 degrees, the so-called strong adhesive force refers to the angle of the viscous layer 14 relative to the horizontal direction when the spherical beads start to roll Even if it is 10 degrees, it will not roll on the adhesive layer 14 and maintain the adhesive force when the spherical beads are maintained.

In Embodiment 1, the surface of the adhesive layer 14 is the holding surface 141 for attracting and holding the workpiece 200 . In Embodiment 1, although the entire holding surface 141 is constituted by the surface of the adhesive layer 14, that is, the adhesive layer 14, the present invention is not limited thereto as long as at least a part of the holding surface 141 is formed by It only needs to be composed of the adhesive layer 14 . Furthermore, in Embodiment 1, the holding surface 141 is arranged at a position lower than the frame holding surface 111 .

A plurality of suction holes 142 are opened on the holding surface 141 , and the suction holes 142 pass through the adhesive layer 14 and open on the upper surface 121 of the workpiece holding portion 12 . The frame suction hole 114 and the suction hole 142 are connected to the suction path 15 provided in the frame holding portion 11 and the workpiece holding portion 12 . The suction path 15 is connected to a suction source 16 . An on-off valve 17 is provided between the frame holding portion 11 of the suction path 15 and the suction source 16 .

The suction table 10 is placed on the holding surface 141 on the front side 203 of the workpiece 200 and on the frame holding surface 111 is placed the ring-shaped frame 211 pasted with the outer edge of the adhesive film 210, and the on-off valve 17 is opened to activate the suction holes 114 and 142. The suction source 16 sucks, whereby the workpiece 200 is sucked and held on the holding surface 141 and the annular frame 211 is sucked and held on the frame holding surface 111 . Thus, in Embodiment 1, the frame holding portion 11 is an adhesive film holding unit, and the adhesive film holding unit is formed by placing the workpiece 200 on the holding surface 141 of the workpiece holding portion 12 so that the adhesive film 210 faces the suction table 10 . In this state, the ring frame 211 is sucked and held to hold the adhesive film 210 .

The sticking roller 20 sticks the adhesive film 210 stuck to the annular frame 211 held by the frame holding unit 11 to the workpiece 200 on the holding surface 141 of the suction table 10 . The sticking roller 20 faces the workpiece 200 sucked and held on the suction table 10 along the vertical direction through the adhesive film 210 stuck to the annular frame 211 sucked and held on the suction table 10 . The bonding roller 20 is provided to be movable along the back surface 205 of the workpiece 200 and in a direction parallel to the horizontal direction by the roller moving unit 30 .

The pasting roller 20 is rotatably supported around an axis parallel to the horizontal direction by the supporting member 21, and is disposed above the workpiece 200 held on the suction table 10, and is held on the suction table by being sucked through the adhesive. The adhesive film 210 of the annular frame 211 of 10 faces the workpiece 200 held on the suction table 10 along the vertical direction. The axis of the pasting roller 20 is parallel to the horizontal direction and perpendicular to the moving direction caused by the roller moving unit 30 .

The supporting member 21 is moved in the horizontal direction by the roller moving unit 30 , whereby the bonding roller 20 moves along the back surface 205 of the workpiece 200 . If the suction table 10 is raised by the lifting unit 60, the adhesive roller 20 will push the adhesive film 210 attached to the annular frame 211 held on the suction table 10 toward the workpiece 200, pushing the adhesive film 210 toward the workpiece 200. And the workpiece 200 is pressed against the suction table 10 .

In this way, the sticking roller 20 is arranged at the following position: when the suction table 10 is raised by the lifting unit 60 , the adhesive film 210 is pushed against the workpiece 200 and the workpiece 200 is pressed against the suction table 10 . And, if the sticking roller 20 moves along the back surface 205 of the workpiece 200 by the roller moving unit 30 in the state where the suction table 10 is raised by the lifting unit 60, the adhesive film 210 is pushed against the workpiece 200 and the workpiece 200 is moved. Press on the suction table 10 and rotate on the adhesive film 210 to stick the adhesive film 210 on the back surface 205 of the workpiece 200 .

The roller moving unit 30 moves the pasting roller 20 in the horizontal direction. The roller moving unit 30 moves the support member 21 which supports the bonding roller 21 so as to be rotatable around the axis, in the horizontal direction.

The elevating unit 60 elevates the suction table 10 in the vertical direction. The lifting unit 60 vertically lifts the frame holder 11 of the suction table 10 .

The vacuum chamber 40 is a container for accommodating the suction table 10, the bonding roller 20, the roller moving unit 30, and the lifting unit 60, and the inside thereof can be decompressed. The vacuum chamber 40 is equipped with: an upper frame body 41 and a lower frame body 42, which can move between a state where their outer edges are in contact with each other and a state where their outer edges are separated from each other; a vacuum source 47, which passes through an exhaust path 45, a switch The valve 46 is connected to the lower housing 42 , and the air supply source 50 is connected to the upper housing 41 through the supply path 48 and the switching valve 49 .

The frames 41 and 42 integrally include a disk portion 43 whose outer diameter is larger than that of the annular frame 211 , and a cylindrical portion 44 erected from the outer edge of the disk portion 43 . The outer diameters of the disk portions 43 of the frames 41 and 42 are equal. The frames 41 and 42 are arranged such that the inner opening of the cylindrical portion 44 faces along the Z-axis direction. The upper frame body 41 and the lower frame body 42 are relatively moved up and down by a lifting unit not shown. In the upper housing 41 , the roller moving unit 30 is attached to the disc portion 43 . In the lower housing 42 , the elevating unit 60 is attached to the disc portion 43 .

In the vacuum chamber 40, the upper frame body 41 and the lower frame body 42 are raised and lowered toward each other by the lifting unit, whereby the outer edges of the cylindrical parts 44 of the frames 41, 42 are in airtight contact with each other. , and the interior is isolated from the exterior, and the interior is hermetically sealed. In the vacuum chamber 40, the upper frame body 41 and the lower frame body 42 are lifted up and down in a direction separated from each other by the lifting unit, whereby the outer edges of the cylindrical parts 44 of the frames 41, 42 are separated from each other, and the workpiece can be moved 200 and the ring frame 211 are carried in and out.

The control unit 100 controls each component constituting the pasting device 1 to make the pasting device 1 perform a pasting action, and the pasting action is to stick the adhesive film 210 to the back surface 205 of the workpiece 200 . The control unit 100 is a computer capable of executing computer programs, and has: an arithmetic processing device, which has a microprocessor such as a CPU (Central Processing Unit, central processing unit); a memory device, which has a ROM (Read Only Memory, only Read memory) or RAM (Random Access Memory, random access memory) memory; and input and output interface devices.

The arithmetic processing device of the control unit 100 executes the computer program stored in the ROM on the RAM, and generates a control signal for controlling the pasting device 1 . The arithmetic processing device of the control unit 100 outputs the generated control signal to each constituent element of the pasting device 1 through the input-output interface device.

In addition, the control unit 100 is connected to a display unit which is constituted by a liquid crystal display device or the like for displaying the state of processing operations or images, etc., and an input unit which registers processing conditions, etc. occasional use. The input unit is constituted by at least one of a touch panel, a keyboard and the like arranged on the display unit.

Next, the sticking operation of sticking the adhesive film 210 to the back surface 205 of the workpiece 200 by the sticking apparatus 1 having the above-mentioned configuration will be described based on the drawings. Fig. 3 is a cross-sectional view schematically showing a state in which a workpiece and a ring frame are sucked and held on the suction table of the bonding apparatus shown in Fig. 1 . Fig. 4 is a cross-sectional view schematically showing the state of the workpiece being sucked and held by the adhesive film pressed against the suction table of the pasting device shown in Fig. 3 .

In the pasting device 1, the control unit 100 receives and stores the processing conditions input from the input unit, etc., and starts the pasting operation upon receiving an instruction to start the pasting operation input from the input unit or the like. In the pasting operation, the control unit 100 of the pasting device 1 controls the lifting unit (not shown) to separate the frames 41 and 42 from each other. In the pasting operation, if the front side 203 of the workpiece 200 is placed on the holding surface 141 in the pasting device 1, and the ring-shaped frame 211 pasted by the outer edge of the adhesive film 210 is placed on the frame holding surface 111, the control The elevating unit brings the frames 41 and 42 close to each other and makes the outer edges of the cylindrical parts 44 of the frames 41 and 42 contact each other in an airtight state, thereby sealing the inside of the vacuum chamber 40 .

In the pasting operation, as shown in FIG. 3 , the control unit 100 in the pasting device 1 opens the switch valve 17, and the suction hole 114, 142 is sucked by the suction source 16 through the suction path 15, so that the front side 203 of the workpiece 200 is sucked and held on the holding surface 141 , and attract and hold the ring-shaped frame 211 on the frame holding surface 111 . At this time, the viscous layer 14 fixes the workpiece 200 to the holding surface 141 by viscous force. In the sticking action, the control unit 100 in the sticking device 1 opens the switch valve 46, and the air in the vacuum chamber 40 is exhausted to the outside of the vacuum chamber 40 by the vacuum source 47 through the exhaust path 45, and the vacuum chamber 40 is exhausted. Internal decompression. At this time, the pressure is also reduced between the workpiece 200 sucked and held on the holding surface 141 and the adhesive film 210 .

In the pasting action, before the air pressure in the vacuum chamber 40 is lower than the predetermined air pressure (absolute air pressure), the pasting device 1 controls the roller moving unit 30 to position the pasting roller 20 across the adhesive film 210 as shown in FIG. Above the workpiece 200, the suction table 10 is raised by the lifting unit 60, the adhesive film 210 is pushed against the workpiece 200 by the adhesive roller 20, and the workpiece 200 is pushed against the holding surface 141 through the adhesive film 210, thereby restraining the workpiece 200. position offset. In addition, the so-called predetermined air pressure refers to the air pressure in the vacuum chamber 40 under the following conditions: if the suction force for sucking and holding the workpiece 200 on the holding surface 141 decreases, and the workpiece 200 is not pressed against the holding surface 141 with a certain force, then The workpiece 200 is displaced relative to the holding surface 141 .

In this way, in Embodiment 1, the adhesive layer 14 of the pasting device 1 and the pasting roller 20 constitute the displacement preventing means 70, and the displacement preventing means 70 draws the vacuum chamber in the state where the workpiece 200 is sucked and held by the suction table 10. When the chamber 40 is depressurized, the workpiece 200 is prevented from shifting. In this manner, the holding mechanism 2 of the bonding apparatus 1 is provided with the displacement preventing means 70 . Furthermore, in Embodiment 1, since the holding surface 141 is the surface of the adhesive layer 14 , the suction table 10 also constitutes the displacement preventing means 70 , that is, the suction table 10 also serves as the displacement preventing means 70 . In Embodiment 1, in order to suppress the formation of air bubbles between the adhesive film 210 and the workpiece 200 in the compressed area, the adhesive device 1 preferably uses the adhesive roller 20 to compress the adhesive film immediately before reaching the predetermined air pressure. 210. Moreover, in the present invention, the sticking device 1 presses the adhesive film 210 with the sticking roller 20 immediately before reaching the predetermined air pressure, or it may be after the workpiece 200 is held by the holding surface 141 and before the decompression starts. Moreover, in the present invention, the pasting device 1 may not use the pasting roller 20 to press the adhesive film, but only use the viscous force of the viscous layer 14 to restrain the positional deviation of the workpiece 200 .

In the pasting operation, in the pasting device 1, after the air pressure in the vacuum chamber 40 is lower than the predetermined air pressure and is decompressed to a vacuum state, the control unit 100 controls the roller moving unit 30 to move the pasting roller 20 in the horizontal direction, And stick the adhesive film 210 on the back surface 205 of the workpiece 200 . In the sticking operation, the sticking device 1 closes the on-off valve 46 after sticking the adhesive film 210 on the back surface 205 of the workpiece 200, and opens the on-off valve 49 to supply air from the air supply source 50 to the vacuum chamber 40 through the supply path 48. Inside, the air pressure in the vacuum chamber 40 is raised to the atmospheric pressure, and the adhesive film 210 is brought into close contact with the back surface 205 of the workpiece 200 . In this way, the sticking device 1 sticks the adhesive film 210 to the back surface 205 of the workpiece 200 during the sticking action. Furthermore, in the present invention, in addition to the suction source 16, in the pasting device 1, an air supply source (not shown) is connected to the holding surface 141 through the switch valve 17, and the air supply source and the suction source 16 are selected through the switch valve 17. If it is freely connected to the holding surface 141, when peeling the workpiece 200 from the holding surface 141, the air from the air supply source can also be blown from the holding surface 141, so that the workpiece 200 can be peeled off from the adhesive layer 14 with viscous force. made easy.

The holding mechanism 2 and the sticking mechanism 1 of Embodiment 1 described above are equipped with the displacement preventing means 70, and the displacement preventing means 70 is made of the adhesive layer 14 constituting the holding surface 141 and pushes the workpiece 200 against the adhesive layer 14. Therefore, even if the vacuum chamber 40 is depressurized and the suction force of the suction table 10 decreases, the workpiece 200 can be held on the holding surface 141 without positional displacement.

As a result, the holding mechanism 2 and the bonding apparatus 1 according to Embodiment 1 exhibit an effect of suppressing positional displacement of the workpiece 200 without using an electrostatic chuck.

[modified example] A sticking device according to a modified example of Embodiment 1 of the present invention will be described based on the drawings. Fig. 5 is a cross-sectional view schematically showing a configuration example of a sticking device according to a modified example of the first embodiment. In addition, in FIG. 5, the same code|symbol is attached|subjected to the same part as Embodiment 1, and description is abbreviate|omitted.

As shown in FIG. 5 , in the pasting device 1-1 according to the modified example of Embodiment 1, the convex portion 122 protruding upward is provided on the outer edge portion of the workpiece holding portion 12 covering the entire circumference, and the adhesive layer 14 is laminated. It is the same as that of the first embodiment except that the holding surface 141 , which is the surface of the adhesive layer 14 through which the suction hole 142 penetrates, is formed in a ring shape on the convex portion 122 . In addition, the ring-shaped holding surface 141 of the sticking device 1-1 of the modified example corresponds to the remaining area of the outer periphery of the workpiece 200 where the element 204 is not formed, and is set to support the remaining area of the outer periphery without supporting the element area where the element 204 is formed. size. The pasting device 1-1 of the modified example does not form the adhesive layer 14 in the area corresponding to the area where the element 204 is formed, and the element 204 does not contact the adhesive layer 14 and reduces the risk of contamination of the element 204 , it becomes easy to peel off the workpiece 200 from the holding surface 141 .

The holding mechanism 2-1 and the sticking device 1-1 of the modified example are equipped with the displacement preventing means 70 similarly to the first embodiment. Composed of the adhesive roller 20 that pushes against the adhesive layer 14, even if the vacuum chamber 40 is depressurized and the suction force of the suction table 10 decreases, the workpiece 200 can be held on the holding surface without positional deviation. 141, and the effect of suppressing the positional deviation of the workpiece 200 can be suppressed without using the electrostatic chuck.

[Embodiment 2] A sticking device according to Embodiment 2 of the present invention will be described based on the drawings. Fig. 6 is a cross-sectional view schematically showing a configuration example of a sticking device according to Embodiment 2. Fig. 7 is a cross-sectional view schematically showing a state in which the workpiece is sucked and held by the suction table of the bonding apparatus according to the second embodiment by the workpiece fixing member. In addition, in FIG. 6 and FIG. 7, the same code|symbol is attached|subjected to the same part as Embodiment 1, and description is abbreviate|omitted.

As shown in FIG. 6, in the holding mechanism 2-2 of the sticking device 1-2 of Embodiment 2, the displacement prevention means 70-2 has a plurality of workpiece fixing members 71 instead of the adhesive layer 14, and in the workpiece holding part 12 The disc-shaped porous material 13 such as porous ceramics is attached to the center of the upper surface 121 , and the surface of the porous material 13 is a holding surface 131 for attracting and holding the workpiece 200 . The workpiece fixing member 71 is configured to be movable from the outside of the outer peripheral edge of the workpiece 200 held by the suction table 10 toward the center of the holding surface 131 .

The workpiece fixing member 71 is disposed on the disc portion 112 of the frame holding portion 11 of the suction table 10 and outside the workpiece holding portion 12 , that is, the holding surface 131 . The workpiece fixing member 71 is provided so as to be able to move freely along the radial direction of the workpiece holding portion 12 , that is, the holding surface 131 , by the moving means 72 . The workpiece fixing member 71 includes: a column portion 73 standing upright from the disc portion 112 of the frame holding portion 11; The chamfer 206 of the workpiece 200 at 131 faces. In Embodiment 2, the fixing portion 74 is formed in a cross-sectional arc along the chamfered portion 206 of the workpiece 200 sucked and held on the holding surface 131 so that the center in the thickness direction is located most on the outer peripheral side of the holding surface 131 shape. In Embodiment 2, the upper end of the fixing portion 74 is disposed below the back surface 205 of the workpiece 200 sucked and held by the holding surface 131 of the workpiece holding portion 12 .

In the pasting device 1-2 of Embodiment 2, after the workpiece 200 is placed on the holding surface 131 and the annular frame 211 is placed on the frame holding surface 111, the control unit 100 controls the moving means 72 so that the workpiece fixing member 71 moves along the It moves toward the workpiece 200 along the radial direction of the holding surface 131 . The pasting device 1-2 of Embodiment 2 clamps the chamfered portion 206 of the workpiece 200 on the holding surface 131 with the fixing portions 74 of the plurality of workpiece fixing members 71 to fix the workpiece 200 on the holding surface 131 .

Afterwards, in the pasting device 1-2 of Embodiment 2, after the control unit 100 controls the elevating unit to seal the inside of the vacuum chamber 40, as shown in FIG. It is held on the holding surface 131 , and the ring-shaped frame 211 is sucked and held on the frame holding surface 111 , and the adhesive film 210 is stuck to the back surface 205 of the workpiece 200 in the same manner as in the first embodiment.

The holding mechanism 2-2 and the sticking device 1-2 of Embodiment 2 are provided with the displacement prevention means 70-2 having a plurality of workpiece fixing members 71, so even if the inside of the vacuum chamber 40 is depressurized and the suction force of the stage 10 is sucked The lowering also functions to hold the workpiece 200 on the holding surface 131 without positional displacement as in the first embodiment, and to suppress the positional displacement of the workpiece 200 without using an electrostatic chuck.

[Embodiment 3] A sticking device according to Embodiment 3 of the present invention will be described based on the drawings. Fig. 8 is a cross-sectional view schematically showing a state in which the adhesive film is pressed against the suction table of the sticking device of the third embodiment and the workpiece is sucked and held. Fig. 9 is a cross-sectional view schematically showing the state where the adhesive roller of the pasting device shown in Fig. 8 sticks the adhesive film to the back of the workpiece. In addition, in FIG.8 and FIG.9, the same code|symbol is attached|subjected to the same part as Embodiment 1, and description is abbreviate|omitted.

As shown in FIG. 8 , in the holding mechanism 2-3 of the sticking device 1-3 of Embodiment 3, the offset prevention means 70-3 has an adhesive film pushing member 75 instead of the adhesive layer 14, and the workpiece holding part 12 The disc-shaped porous material 13 such as porous ceramics is attached to the center of the upper surface 121 , and the surface of the porous material 13 is a holding surface 131 for attracting and holding the workpiece 200 . The adhesive film pressing member 75 is disposed at a position facing the center of the holding surface 131 of the disc portion 43 of the upper housing 41 of the vacuum chamber 40 . The adhesive film pressing member 75 is configured to be freely raised and lowered by a lifting unit 76 .

In the pasting device 1-3 of the third embodiment, the control unit 100 controls the lifting unit to seal the inside of the vacuum chamber 40, and then opens the on-off valve 17 to attract and hold the workpiece 200 and the ring frame 211 on the holding surfaces 131, 111. , and open the on-off valve 46 to decompress the inside of the vacuum chamber 40 . In the sticking device 1-3 of Embodiment 3, before the air pressure in the vacuum chamber 40 is lower than the predetermined air pressure (absolute air pressure), as shown in FIG. 75 is lowered, the adhesive film 210 is pushed against the workpiece 200 by the adhesive film pushing member 75 , and the workpiece 200 is pushed against the holding surface 131 through the adhesive film 210 to suppress the positional deviation of the workpiece 200 . In addition, in the present invention, the sticking device 1-3 preferably lowers the adhesive film pressing member 75 immediately before the air pressure in the vacuum chamber 40 falls below a predetermined air pressure. Moreover, in the present invention, the pasting device 1-3 can also lower the adhesive film pressing member 75 after sucking and holding the workpiece 200 and before starting to depressurize, so that the adhesive film pressing member 75 penetrates the adhesive film 210 to move the workpiece 200 to the other side. The retaining surface 131 is pushed against.

In the gluing device 1-3 of Embodiment 3, the control unit 100 controls the lifting unit 60 to raise the suction table 10, and controls the roller moving unit 30 to move the gluing roller 20 in the horizontal direction, and the same as Embodiment 1. The film 210 is attached to the back surface 205 of the workpiece 200 , and the on-off valve 46 is closed and the on-off valve 49 is opened to supply air from the air supply source 50 through the supply path 48 into the vacuum chamber 40 . In addition, in the sticking device 1-3 of Embodiment 3, if the sticking roller 20 starts sticking the adhesive film 210 to the outer edge of the back surface 205 of the workpiece 200 as shown in FIG. The glue film pressing member 75 rises and withdraws from the glue film 210 .

The holding mechanism 2-3 and the sticking device 1-3 of Embodiment 3 are provided with the offset prevention means 70-3 having the adhesive film pressing member 75, so even if the inside of the vacuum chamber 40 is decompressed and the suction force of the table 10 is sucked The lowering also functions to hold the workpiece 200 on the holding surface 131 without positional displacement as in the first embodiment, and to suppress the positional displacement of the workpiece 200 without using an electrostatic chuck.

[Embodiment 4] A sticking device according to Embodiment 4 of the present invention will be described based on the drawings. 10 is a cross-sectional view schematically showing a state in which a workpiece sucked and held by the suction table of the bonding apparatus according to Embodiment 4 is pressed against the holding surface. In addition, in FIG. 10, the same code|symbol is attached|subjected to the same part as Embodiment 1, and description is abbreviate|omitted.

As shown in FIG. 10 , in the holding mechanism 2-4 of the pasting device 1-4 of Embodiment 4, the displacement prevention means 70-4 has a pushing member 77 instead of the adhesive layer 14, and is placed on the upper surface of the workpiece holding part 12. The disc-shaped porous material 13 such as porous ceramics is attached to the center of 121 , and the surface of the porous material 13 is a holding surface 131 for attracting and holding the workpiece 200 . The pressing member 77 is a member that presses the back surface 205 that is the upper surface of the workpiece 200 on the holding surface 131 of the suction table 10 .

The pressing member 77 of the pasting device 1-4 of Embodiment 4 is formed in a plate shape capable of intruding between the back surface 205 of the workpiece 200 and the adhesive film 210 on the holding surface 131 before the adhesive film 210 is pasted, and is arranged so as to It can move freely in the horizontal direction by the moving means 78 . In Embodiment 4, the moving direction of the pressing member 77 intersects (orthogonally) with respect to the moving direction of the bonding roller 20 . Preferably, if the pushing member 77 is located on the holding surface 131 , at least a part thereof is located on the center of the holding surface 131 . However, in the present invention, the position of the pressing member 77 is not limited thereto, and any position on the workpiece 200 may be pressed.

In the pasting device 1-4 of the fourth embodiment, the control unit 100 controls the lifting unit to seal the inside of the vacuum chamber 40, and then opens the on-off valve 17 to attract and hold the workpiece 200 and the ring frame 211 on the holding surfaces 131, 111. , and open the on-off valve 46 to depressurize the inside of the vacuum chamber 40 . In the sticking device 1-4 of Embodiment 4, the control unit 100 controls the moving means 78 to cause the pressing member 77 to penetrate as shown in FIG. Between the back surface 205 of the workpiece 200 on the holding surface 131 and the adhesive film 210 , the workpiece 200 is pushed against the holding surface 131 by the pushing member 77 , thereby suppressing the positional deviation of the workpiece 200 . Furthermore, in the present invention, the sticking device 1 - 4 may push the workpiece 200 against the holding surface 131 with the pushing member 77 after the workpiece 200 is sucked and held by the suction table 10 and before the vacuum chamber 40 is depressurized.

In the pasting device 1-4 of the fourth embodiment, the control unit 100 controls the lifting unit 60 to raise the suction table 10, and controls the roller moving unit 30 to move the pasting roller 20 in the horizontal direction, and the same as the first embodiment. The adhesive film 210 is pasted on the back surface 205 of the workpiece 200 . After sticking the adhesive film 210 to the back surface 205 of the workpiece 200 in the same manner as in Embodiment 1, the sticking device 1-4 closes the on-off valve 46 and opens the on-off valve 49 to supply air from the air supply source 50 through the supply path 48 to the Inside the vacuum chamber 40. In addition, in the pasting device 1-4 of Embodiment 4, when the pasting roller 20 starts pasting the adhesive film 210 on the outer edge of the back surface 205 of the workpiece 200, the control unit 100 controls the moving means 78 so that the pressing member 77 is positioned horizontally. direction, so that the pushing member 77 is withdrawn from between the back surface 205 of the workpiece 200 and the adhesive film 210 .

The holding mechanism 2-4 and the sticking device 1-4 of Embodiment 4 are equipped with the displacement prevention means 70-4 having the pressing member 77, so even if the vacuum chamber 40 is decompressed and the suction force of the suction table 10 is reduced, Also like the first embodiment, the workpiece 200 can be held on the holding surface 131 without positional displacement, and the positional displacement of the workpiece 200 can be suppressed without using an electrostatic chuck.

In addition, the present invention is not limited to the above-mentioned embodiments. That is, various modifications and implementations are possible without departing from the gist of the present invention.

1,1-1,1-2,1-3,1-4: pasting device 2,2-1,2-2,2-3,2-4: holding mechanism 10: Attraction Desk 11:Frame holding part (film holding unit) 14: Viscous layer (components with viscous force) 20: pasting roller 40: Vacuum chamber 70,70-2,70-3,70-4: prevention of shifting means 71: Workpiece fixing member 77: push components 131,141: keep the surface 200: workpiece 205: back (upper surface) 210: film

Fig. 1 is a cross-sectional view schematically showing a configuration example of an adhering device according to Embodiment 1. Fig. 2 is a perspective view schematically showing a workpiece pasted on an adhesive film by the pasting device shown in Fig. 1 . Fig. 3 is a cross-sectional view schematically showing a state in which a workpiece and a ring frame are sucked and held on the suction table of the bonding apparatus shown in Fig. 1 . Fig. 4 is a cross-sectional view schematically showing the state of the workpiece being sucked and held by the adhesive film pressed against the suction table of the pasting device shown in Fig. 3 . Fig. 5 is a cross-sectional view schematically showing a configuration example of a sticking device according to a modified example of the first embodiment. Fig. 6 is a cross-sectional view schematically showing a configuration example of a sticking device according to Embodiment 2. Fig. 7 is a cross-sectional view schematically showing a state in which the workpiece is sucked and held by the suction table of the bonding apparatus according to the second embodiment by the workpiece fixing member. Fig. 8 is a cross-sectional view schematically showing a state in which the adhesive film is pressed against the suction table of the sticking device of the third embodiment and the workpiece is sucked and held. Fig. 9 is a cross-sectional view schematically showing the state where the adhesive roller of the pasting device shown in Fig. 8 sticks the adhesive film to the back of the workpiece. 10 is a cross-sectional view schematically showing a state in which a workpiece sucked and held by the suction table of the bonding apparatus according to Embodiment 4 is pressed against the holding surface.

1: pasting device

2: Keep the body

10: Attraction Desk

11: Frame holding part (film holding unit)

111: Frame holding surface

112: Disc Department

113: ring part

114: Attraction hole for frame

12: Workpiece holding part

121: upper surface

14: Viscous layer (component with viscous force)

141: keep surface

142: suction hole

15: Attraction path

16: Source of Attraction

17: switch valve

20: pasting roller

21: Support member

30: Roller moving unit

40: Vacuum chamber

41: Upper frame

42: Lower frame

43: Circular plate part

44: Cylindrical part

45: exhaust path

46: switch valve

47: Vacuum source

48: Supply path

49: switch valve

50: Air supply source

60: Lifting unit

70: Offset prevention means

100: control unit

Claims (5)

A holding mechanism that holds a workpiece and has: a suction table having a holding surface for attracting and holding the workpiece; a vacuum chamber that accommodates the suction table and can depressurize inside; and The offset preventing means prevents the offset of the workpiece when the pressure in the vacuum chamber is reduced while the workpiece is sucked and held by the suction table. The maintenance organization as claimed in item 1, wherein, At least a part of the holding surface of the suction table is constituted by a member having an adhesive force, and the suction table is also used as the displacement preventing means. The maintenance organization as claimed in item 1, wherein, The displacement preventing means has a plurality of workpiece fixing members configured to be movable from the outside of the outer peripheral edge of the workpiece held by the suction table toward the center of the holding surface. The maintenance organization as claimed in item 1, wherein, The displacement preventing means has a pressing member that presses the upper surface side of the workpiece on the suction table. A sticking device, which sticks an adhesive film to a workpiece, and has: a suction table having a holding surface for attracting and holding the workpiece; an adhesive film holding unit that holds the adhesive film in a state where the adhesive film faces the workpiece on the suction table; a pasting roller, which sticks the adhesive film held by the adhesive film holding unit to the workpiece on the suction table; a vacuum chamber, which accommodates the suction table and the bonding roller and can be decompressed inside; and The offset preventing means prevents the offset of the workpiece when the pressure in the vacuum chamber is reduced while the workpiece is sucked and held by the suction table.

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