TW202324518A - Cutting device, and method for manufacturing cut product - Google Patents

Abstract

This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/discharge mechanism is positioned on the suction path and discharges water through a water discharge path. The water isolation/discharge mechanism includes a first tank, a second tank, and a valve mechanism. The first tank includes a partition plate for partitioning the tank into a region where a connection opening leading to the vacuum pump is positioned and a region where a connection opening leading to the table or the holding mechanism is positioned. A space is formed in the first tank above the partition plate. The valve mechanism changes between a first state, in which water flowing from the first tank into the second tank is reserved in the second tank, and a second state, in which water is reserved in the first tank and the water reserved in the second tank is discharged.

Description

Cutting device, and method of manufacturing cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Application Publication No. 2019-202353 (Patent Document 1) discloses a cutting device for cutting a workpiece. In this cutting device, a suction unit is provided to suck and hold the workpiece. The adsorption unit has a chuck table, and the workpiece is sucked and held by the chuck table. In the adsorption unit, a suction pump is connected. In this cutting device, a water-sealed vacuum pump is used as a suction pump, and the water-sealed vacuum pump does not lower the suction force even if it sucks water (see Patent Document 1).

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Laid-Open No. 2019-202353

[Problem to be solved by the invention] When a water-sealed vacuum pump is used to adsorb the object to be cut (for example, a substrate), it is necessary to continuously supply new water into the vacuum pump in order to suppress the temperature rise of the sealed water. That is, if a water-sealed vacuum pump is used, a large amount of water will be consumed. In order to solve this problem, it is considered to use a dry vacuum pump instead of a water-sealed vacuum pump. In this case, it is necessary to prevent water from entering the vacuum pump during, for example, the step of spraying the object to be cut. In addition, it is necessary to continuously perform suction of the object to be cut. However, the above-mentioned Patent Document 1 does not disclose a technical means for solving this problem.

The present invention was made to solve such a problem, and an object of the present invention is to suppress water intrusion into the vacuum pump while maintaining adsorption of objects to be cut in a cutting device using a dry vacuum pump and a method of manufacturing a cut product.

[Technical means to solve the problem] A cutting device according to one aspect of the present invention includes a table, a cutting mechanism, a holding mechanism, and a water separation and discharge mechanism. The stage holds the object to be cut by suctioning the object to be cut. The cutting mechanism separates the object to be cut into pieces by cutting the object to be cut on the table. The holding mechanism holds the object to be cut by sucking the object to be cut into pieces. The table or holding mechanism is connected to the dry vacuum pump through the suction channel. The water separation and discharge mechanism is located on the suction passage and discharges water through the drainage passage. The water separation and discharge mechanism includes a first tank and a second tank. The second groove is located further downstream than the first groove in the drain passage. The first tank includes a partition plate to separate the area where the connection port with the vacuum pump is located and the area where the connection port with the stage or the holding mechanism is located. In the first groove, a gap is formed above the partition plate. The water separation and discharge mechanism further includes a valve mechanism. The valve mechanism can be changed into a first state and a second state. The first state will store the water flowing from the first tank into the second tank in the second tank. The second state will store the water in the first tank and the water stored in the second tank. The water in the second tank is drained.

A method of manufacturing a cut product according to another aspect of the present invention uses the cutting device described above. This method of manufacturing a cut product includes a step of cutting the object to be cut on the table by a cutting mechanism, thereby dividing the object to be cut into individual pieces.

[Effect of the invention] According to the present invention, in a cutting device using a dry vacuum pump and a method of manufacturing a cut product, it is possible to suppress water intrusion into the vacuum pump while maintaining adsorption of the object to be cut.

Hereinafter, an embodiment (hereinafter also referred to as "the present embodiment") related to one aspect of the present invention will be described in detail using the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated. In addition, for easy understanding, appropriate objects are omitted or exaggerated and schematically drawn in each drawing.

[1. Composition] <1-1. Overall configuration of cutting device> Fig. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut the object to be cut (in this embodiment, a package substrate) so that the object to be cut is individually cut into a plurality of cut products (when the object to be cut is a package substrate). In the case of a substrate, it is an electronic part (package part)). In the package substrate, a substrate on which a semiconductor chip is mounted or a lead frame is sealed with resin.

An example of an object to be cut includes a substrate, including a substrate (including a wafer) that has not been resin-sealed and a substrate that has been resin-sealed (package substrate). As an example of the package substrate, there are BGA (Ball Grid Array, Ball Grid Array) package substrate, LGA (Line Grid Array, Land Grid Array) package substrate, CSP (Chip Size Package) package substrate, LED (Light-Emitting Package) package substrate, etc. Diode, Light Emitting Diode) package substrate, and QFN (Quad Flat No-leaded) package substrate.

In this example, the package substrate P1 is used as the object to be cut, and the package substrate P1 is sliced into a plurality of electronic components S1 (not shown) by the cutting device 1 . Hereinafter, the resin-sealed side of the package substrate P1 is referred to as the sealing surface, and the side opposite to the sealing surface is referred to as the solder ball/wire surface. In addition, when the object to be cut is a substrate that is not sealed with resin, the solder ball/wire surface of this embodiment corresponds to the side (cut surface) facing upward during cutting; the sealing surface of this embodiment corresponds to On the side opposite to the cut surface.

As shown in FIG. 1 , the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as constituent elements. The cutting module A1 is configured to manufacture a plurality of electronic components S1 (cut products) by cutting the package substrate P1. The inspection and storage module B1 is configured to inspect each of a plurality of manufactured electronic components S1, and then store the electronic components S1 in a tray. In the cutting device 1, each component can be attached to and detached from another component and exchanged.

The cutting module A1 mainly includes a substrate supply unit 3 , a positioning unit 4 , a cutting table 5 , a mandrel unit 6 , and a transfer unit 7 . Furthermore, the cutting module A1 includes a second water separation and discharge mechanism 42, a third water separation and discharge mechanism 43, a part of the first water separation and discharge mechanism 41, vacuum pumps D2 and D3, and a part of the vacuum pump D1.

The substrate supply unit 3 pushes out the package substrates P1 one at a time from the cassette M1 accommodating a plurality of package substrates P1 , thereby supplying the package substrates P1 one at a time to the positioning unit 4 . At this time, the package substrate P1 is arranged such that the solder ball/lead surface faces upward.

The positioning section 4 arranges the package substrate P1 pushed out from the substrate supply section 3 on the rail section 4a, thereby positioning the package substrate P1. Thereafter, the positioning unit 4 transports the positioned package substrate P1 to the cutting table 5 .

The cutting table 5 holds the package substrate P1 to be cut. In this example, the cutting apparatus 1 which has the twin (twin) cutting stage structure which has two cutting stages 5 is illustrated. A vacuum pump D2 is connected to one cutting table 5 through a suction passage VR2, and a vacuum pump D3 is connected to the other cutting table 5 through a suction passage VR3. Each vacuum pump D2, D3 is a dry vacuum pump. Each cutting table 5 absorbs the package substrate P1 by suction of the vacuum pump D2 or the vacuum pump D3. The second water separation and discharge mechanism 42 is provided in the suction passage VR2, and the third water separation and discharge mechanism 43 is provided in the suction passage VR3. The details of each of the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 will be described later.

Each cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5 a sucks the package substrate P1 conveyed by the positioning unit 4 from below, and holds the package substrate P1 . The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the figure. The moving mechanism 5c can move the holding member 5a along the Y-axis in the drawing.

The mandrel part 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. In this example, a double-spindle cutting device 1 having two core shaft parts 6 is exemplified. The core shaft portion 6 is movable along the X-axis and Z-axis in the figure. In addition, the cutting device 1 may have a single (single) mandrel configuration having one mandrel part 6 .

The core portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a cuts the packaging substrate P1 by rotating at a high speed, so that the packaging substrate P1 is sliced into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c in a state of being pinched by a first flange and a second flange not shown. The first flange and the second flange are fixed to the rotation shaft 6c by fastening members, such as nuts, which are not shown in the figure. The first flange is also called the inner flange and the second flange is also called the outer flange.

The spindle portion 6 is provided with nozzles for cutting water, nozzles for cooling water, nozzles for washing water (none of which are shown), and the like. The cutting water nozzle sprays cutting water toward the high-speed rotating blade 6a. Cooling water nozzles spray cooling water. The nozzle for washing water sprays washing water that can wash away cut chips, etc.

Referring again to FIG. 1 , when the package substrate P1 is placed on the cutting table 5 , the cutting table 5 absorbs the package substrate P1 . Thereafter, the package substrate P1 is photographed by the first position confirmation camera 5d to confirm the position of the package substrate P1. Confirmation using the first position confirmation camera 5d is also referred to as alignment. In the confirmation using the first position confirmation camera 5d, for example, the position of a mark provided on the package substrate P1 is confirmed. This mark indicates, for example, the cutting position of the package substrate P1.

Thereafter, the cutting table 5 moves toward the mandrel 6 along the Y-axis in the figure. After the cutting table 5 moves below the mandrel part 6 , the package substrate P1 is cut by relatively moving the cutting table 5 and the mandrel part 6 . At this time, since the solder ball/wire surface of the package substrate P1 faces upward, the solder ball/wire surface becomes a cut surface. Thereafter, the package substrate P1 is photographed by the second position confirmation camera 6 b according to the need, so as to confirm the position of the package substrate P1 and the like. In the confirmation using the second position confirmation camera 6b, for example, the cutting position and the cutting width of the package substrate P1 are confirmed.

The cutting table 5 moves in a direction away from the core shaft portion 6 along the Y-axis of the figure in a state where the plurality of electronic components S1 formed by suction are absorbed after the cutting of the package substrate P1 is completed. move. During this moving process, the upper surface (solder ball/wire surface) of the electronic component S1 is cleaned (cleaning) and dried by the first cleaner 5e. In addition, washing water is used for washing the electronic component S1.

The transfer unit 7 sucks the electronic component S1 held on the cutting table 5 from above. A vacuum pump D1 is connected to the conveyance unit 7 through a suction passage VR1. The vacuum pump D1 is a dry vacuum pump. The conveyance part 7 adsorb|sucks the electronic component S1 by suction of the vacuum pump D1. A first water separation and discharge mechanism 41 is provided in the suction passage VR1. The first water separation and discharge mechanism 41 will be described in detail later. The transport unit 7 absorbs the electronic component S1 and transports it to the inspection table 11 of the inspection and storage module B1. During this transfer process, the lower surface (sealant surface) of the electronic component S1 is cleaned and dried by the second washer 7a. The electronic component S1 is washed and dried in a state where the conveying unit 7 holding the electronic component S1 descends in the Z-axis direction in the drawing and the electronic component S1 approaches the second washer 7a. When the washing and drying of the electronic component S1 are completed, the conveyance part 7 to which the electronic component S1 was adsorbed will rise in the Z-axis direction. In addition, washing water is used for washing the electronic component S1.

The inspection and storage module B1 mainly includes an inspection table 11 , a first optical inspection camera 12 , a second optical inspection camera 13 , an arrangement unit 14 , and an extraction unit 15 . In addition, the first optical inspection camera 12 may also be installed in the cutting module A1. In addition, the inspection and storage module B1 includes a part of the first water separation and discharge mechanism 41 and a part of the vacuum pump D1. The first water separation and discharge mechanism 41 and the vacuum pump D1 exist across both the cutting module A1 and the inspection and storage module B1.

The inspection stand 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis in the figure. Also, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member for holding the electronic component S1 by suctioning the electronic component S1. A vacuum pump D1 is connected to the inspection table 11 through a suction channel VR1. The inspection table 11 attracts the electronic component S1 to the holding member by suction of the vacuum pump D1.

The first optical inspection camera 12 and the second optical inspection camera 13 take images of both surfaces of the electronic component S1 (solder ball/wire surface, and sealing surface). Various inspections of the electronic component S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13 . Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged near the inspection table 11 and takes an image of the upper side.

The first optical inspection camera 12 takes an image of the sealing surface of the electronic component S1 conveyed to the inspection table 11 by the conveying unit 7 . Thereafter, the transport unit 7 places the electronic component S1 on the holding member of the inspection table 11 . After the electronic component S1 is adsorbed by the holding member, the inspection table 11 is turned upside down. After the inspection table 11 moves above the second optical inspection camera 13 , the second optical inspection camera 13 takes an image of the solder ball/wire surface of the electronic component S1 .

The inspected electronic component S1 is arranged in the arrangement unit 14 . A vacuum pump D1 is connected to the arrangement part 14 through the suction passage VR1. The placement unit 14 sucks the inspected electronic component S1 by suction of the vacuum pump D1. The placement unit 14 is movable along the Y-axis in the figure. The inspection table 11 arranges the inspected electronic component S1 on the arrangement unit 14 .

The extraction part 15 transfers the electronic component S1 already arranged in the arrangement|positioning part 14 to a tray. The electronic component S1 is classified as "good product" or "defective product" based on inspection results using the first optical inspection camera 12 and the second optical inspection camera 13 . The extraction part 15 transfers each electronic component S1 to the tray 15a for good products or the tray 15b for defective products based on the discrimination result. That is, good products are accommodated in the tray 15a for good products, and defective products are accommodated in the tray 15b for defective products. When the trays 15a for good products and the trays 15b for defective products are filled with electronic components S1, they are replaced with new ones.

The cutting device 1 further includes a computer 50 , a monitor 20 , and an audio output unit 25 . The monitor 20 is configured to display images. The monitor 20 is constituted by, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is configured as a sound output device such as a speaker, a buzzer, or a bell, for example.

The computer 50 controls the operation of each part of the cutting module A1 and the inspection and storage module B1, for example. The computer 50, for example, controls the substrate supply unit 3, the positioning unit 4, the cutting table 5, the mandrel unit 6, the conveying unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, Extraction unit 15 , first water separation and discharge mechanism 41 , second water separation and discharge mechanism 42 , third water separation and discharge mechanism 43 , vacuum pumps D1 , D2 , D3 , monitor 20 , and sound output unit 25 .

<1-2. Configuration of each water separation and discharge mechanism> As described above, the vacuum pump D2 or the vacuum pump D3 is connected to each cutting table 5 , and the vacuum pump D1 is connected to each of the conveyance unit 7 , inspection table 11 and arrangement unit 14 . Each cutting table 5 is exposed to sprayed cutting water, cooling water, and washing water when, for example, cutting the package substrate P1, and when cleaning the electronic component S1 by the first washer 5e. When exposed to the washing water used. By the suction of the vacuum pumps D2, D3, for example, the water is individually immersed into the suction channels VR2, VR3. Moreover, the conveyance part 7 is exposed to the wash water used when washing|cleaning the electronic component S1 with the 2nd washer 7a. By the suction of the vacuum pump D1, for example, this water is immersed into the suction channel VR1.

Assuming that each of the vacuum pumps D1, D2, and D3 is a water-sealed vacuum pump, no problem will arise even if water soaks into each of the vacuum pumps. However, when using a water-sealed vacuum pump, it is necessary to continuously supply new water into the vacuum pump in order to suppress the temperature rise of the sealed water. That is, if a water-sealed vacuum pump is used, a large amount of water will be consumed. In order to solve such a problem, in the cutting device 1 according to the present embodiment, a dry vacuum pump is used for each of the vacuum pumps D1, D2, and D3.

In order to prevent water from entering the dry vacuum pumps D1, D2, and D3, the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism are individually arranged on the suction channels VR1, VR2, and VR3. 43. Each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 are configured to separate the water immersed in the suction channel, and to send the separated water to the cutting device through the drainage channel. 1's external discharge. Drainage is performed by each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 , thereby preventing water from entering the respective vacuum pumps D1 , D2 , and D3 .

As described above, the first water separation and discharge mechanism 41 is located on the suction passage VR1 between the respective conveyance parts 7 , the inspection table 11 , and the arrangement part 14 and the vacuum pump D1 . The second water separation and discharge mechanism 42 is located on the suction passage VR2 between the one cutting table 5 and the vacuum pump D2. The third water separation and discharge mechanism 43 is located on the suction passage VR3 between the other cutting table 5 and the vacuum pump D3. Each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 has substantially the same configuration although they are arranged in different locations. Each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 can be changed between the first state and the second state. The first state and the second state will be described later. Hereinafter, the first water separation and discharge mechanism 41 will be described as a representative.

Fig. 2 is a diagram schematically showing the first water separation and discharge mechanism 41 in the first state. Fig. 3 is a diagram schematically showing the first water separation and discharge mechanism 41 in the second state. As shown in Figure 2 and Figure 3, the first water separation and discharge mechanism 41 includes a first tank 410, a second tank 420, a liquid level sensor 430, and valves V1, V2, V3.

The first groove 410 is located on the suction channel VR1. The first tank 410 is connected to each of the transport unit 7 , the inspection table 11 , and the arrangement unit 14 located upstream of the suction passage VR1 through piping. The first tank 410 is configured to store water that has flowed in through the suction passage VR1. In addition, the first tank 410 is connected to the vacuum pump D1 located downstream of the suction passage VR1 through piping. Also, the first tank 410 is connected to the second tank 420 located downstream of the drain passage DR1 through piping. The first tank 410 is configured to discharge the stored water to the second tank 420 .

In the first tank 410, a liquid level sensor 430 is installed. The liquid level sensor 430 is configured to detect the height of the liquid surface (water surface) in the first tank 410 . Various well-known sensors such as a water level gauge can be used as the liquid level sensor 430 .

FIG. 4 is a diagram schematically showing the plane of the first groove 410 . Fig. 5 is a diagram schematically showing a V-V cross section in Fig. 4 . Fig. 6 is a diagram schematically showing a section along VI-VI in Fig. 4 . As shown in FIG. 4 , FIG. 5 and FIG. 6 , the first tank 410 includes a first tank body 411 , connecting ports 412 , 413 , 414 , and a partition plate 415 .

The first tank body 411 is, for example, made of metal and has a cylindrical shape. A connecting port 412 penetrates through the top surface of the first tank body 411 . To the connection port 412 , piping connected to each of the conveyance unit 7 , the inspection table 11 , and the arrangement unit 14 is connected. This piping constitutes a part of the suction channel VR1. In addition, the connection port 412 is not necessarily provided on the top surface of the first tank body 411 , for example, it may also be provided on the side of the first tank body 411 . In addition, in each of the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 , the pipe connected to the cutting table 5 is connected to the connection port 412 .

On the side of the first tank body 411 , a connecting port 413 is penetrated. A pipe connected to the vacuum pump D1 is connected to the connection port 413 . This piping constitutes a part of the suction channel VR1. In addition, the connection port 413 does not have to be provided on the side of the first tank body 411 , for example, it can also be provided on the top surface of the first tank body 411 . In addition, in the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 , the pipes connected to the vacuum pump D2 and the pipes connected to the vacuum pump D3 are respectively connected to the connection port 413 .

A connecting port 414 penetrates through the bottom surface of the first tank body 411 . A pipe connected to the second tank 420 is connected to the connection port 414 . This piping constitutes a part of the drain passage DR1. The first tank 410 drains water to the second tank 420 through the connection port 414 .

The partition plate 415 is, for example, made of metal and has a rectangular shape. The partition plate 415 is erected at a position passing through the center of the first tank body 411 in plan view, and extends upward from the bottom surface of the first tank body 411 . The partition plate 415 is joined to each inner side surface and inner bottom surface of the first tank body 411 via a plurality of welded portions W1. The partition plate 415 separates the area where the connection port 413 is located and the area where the connection port 412 is located in the first groove 410 . That is, the connection port 413 is located in one area partitioned by the partition plate 415 , and the connection port 412 is located in the other area partitioned by the partition plate 415 . In addition, since a gap is formed between two adjacent welded portions W15 , the water that enters from the connection port 412 and falls downward is stored in both of the two regions partitioned by the partition plate 415 .

In the first groove 410 , a gap is formed above the partition plate 415 . In this example, the length of the gap is X1. A gap is formed above the partition plate 415 , whereby the passage of the airflow generated by the suction of the vacuum pump D1 is ensured. Also, the lower end of the connection port 412 exists at a lower position than the upper end of the partition plate 415 . In this example, the lower end of the connection port 412 (when the connection port 412 is provided on the side, the upper end portion of the front end of the connection port 412 ) exists at a position lower than the upper end of the partition plate 415 by a length X2. Thereby, the water that has entered from the connection port 412 is less likely to be sucked to the connection port 413 .

Referring to FIGS. 2 and 3 again, the second groove 420 is located downstream of the first groove 410 in the drainage channel DR1. The second groove 420 is arranged at a lower position than the first groove 410 in the height direction (Z-axis direction (FIG. 1)). Therefore, the water flowing into the suction channel VR1 flows from the first groove 410 to the second groove 420 by gravity. The second tank 420 is configured to store water flowing in from the first tank 410 .

In the drain passage DR1 , a valve V1 is provided between the first tank 410 and the second tank 420 . Valve V1 can be opened and closed. When the valve V1 is in an open state, the water stored in the first tank 410 flows into the second tank 420 . When the valve V1 is in the closed state, the water is stored in the first tank 410 and the flow of water from the first tank 410 to the second tank 420 is stopped.

Between the valve V1 and the second tank 420, the drain passage DR1 is branched. The divergent place is connected to the atmosphere through the valve V2. Valve V2 can be opened and closed. When the valve V2 is in an open state, the pressure in the drain passage DR1 becomes atmospheric pressure. In the drain passage DR1, downstream of the second tank 420, a valve V3 is provided. The valve V3 is a valve for drainage and is configured as a check valve.

For example, when the valve V1 is open and the valve V2 is closed, the area Z1 including the drainage channel DR1, the second tank 420 and the valve V3 is in a vacuum state, so the valve V3 is automatically closed. At this time, the water flowing into the suction channel VR1 passes through the first tank 410 and is stored in the second tank 420 . The above-mentioned first state refers to this state, that is, the state in which the valve V1 is in the open state and the valves V2 and V3 are in the closed state (see FIG. 2 ).

On the other hand, when the valve V1 is closed and the valve V2 is opened, the vacuum range Z2 does not include the drain passage DR1, the second groove 420 and the valve V3, so the valve V3 is automatically opened. At this time, the water flowing into the suction channel VR1, that is, the water stored in the first tank 410 and the second tank 420, is discharged to the outside of the cutting device 1 through the water discharge port. The above-mentioned second state refers to this state, that is, the state in which the valve V1 is in the closed state and the valves V2 and V3 are in the open state (see FIG. 3 ).

As mentioned above, the first water separation and discharge mechanism 41 can be changed between the first state and the second state. The change between the first state and the second state is performed at an appropriate timing by the control of each valve, whereby drainage can be appropriately performed while maintaining the suction state of the electronic component S1 by the vacuum pump D1. The timing of the change between the first state and the second state will be described later.

＜1-3. Computer hardware configuration＞ FIG. 7 is a diagram schematically showing the hardware configuration of the computer 50 . As shown in FIG. 7, the computer 50 includes a control unit 70, an input/output I/F (interface, interface) 90, a receiving unit 95, and a memory unit 80, and each component is electrically connected via a bus bar.

The control unit 70 includes a CPU (Central Processing Unit, Central Processing Unit) 72, a RAM (Random Access Memory, Random Access Memory) 74, a ROM (Read Only Memory, Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50 . The accepting unit 95 is configured to accept instructions from the user. The receiving unit 95 is constituted by, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. The control program 81 is executed by the control unit 70 to realize various operations in the cutting device 1 . When the control program 81 is executed by the control unit 70 , the control program 81 is expanded in the RAM 74 . Furthermore, the control unit 70 interprets and executes the control program 81 developed in the RAM 74 via the CPU 72 to control each component.

[2. Action] <2-1. Drain operation in the first water separation and discharge mechanism> FIG. 8 is a flowchart showing an example of a drainage routine in the first water separation and discharge mechanism 41 . The processing shown in this flowchart is executed by the control unit 70 of the computer 50 when the first water separation and discharge mechanism 41 is in the second state (FIG. 3). Note that the processing shown in this flowchart is executed every time the processing of one package substrate P1 is completed.

Referring to FIG. 8 , the control unit 70 determines whether cleaning (cleaning) of the solder ball/lead surface of the electronic component S1 attracted to the cutting table 5 by the first cleaner 5 e is completed (step S100 ). If it is determined that the cleaning of the solder ball/lead surface has not been completed (NO in step S100 ), the control unit 70 waits until the cleaning of the solder ball/lead surface is completed.

On the other hand, if it is determined that the cleaning of the solder ball/lead surface has been completed (Yes in step S100), the control unit 70 controls each valve V1, V2 so that the first water separation and discharge mechanism 41 changes from the second state to the first state. A state (step S110). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state. Thereby, the valve V3 is closed, and before the second washer 7a cleans and water enters the suction passage VR1 from the conveying part 7, the vacuum pump D1 maintains the suction state of the electronic component S1. The amount of water that can be stored in the first water separation and discharge mechanism 41 . In addition, the state switching of the valve V1 and the state switching of the valve V2 are implemented simultaneously.

Thereafter, the control unit 70 judges the cleaning of the sealing surface (the side opposite to the cut surface) of the electronic component S1 adsorbed by the conveying unit 7 by the second cleaner 7 a and the cleaning of the conveying unit 7 on the Z-axis (the second side). 1) whether the ascent in the direction has been completed (step S120). If it is determined that the cleaning by the second washer 7a and the lifting of the conveying unit 7 have not been completed (NO in step S120), the control unit 70 waits until the cleaning by the second washer 7a and the lifting of the conveying unit 7 are completed. The ascent is complete. In the sequence after the cleaning by the second washer 7a and the lifting of the transfer unit 7 are completed, in the first water separation and discharge mechanism 41, the second tank 420 accumulates the most water and the first tank 410 is difficult to accumulate. water timing.

On the other hand, if it is judged that the cleaning by the second washer 7a and the lifting of the transfer unit 7 are completed (Yes in step S120), the control unit 70 controls the valves V1, V2 to separate the first water The discharge mechanism 41 changes from the first state to the second state (step S130). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state. Thereby, the valve V3 is opened, and the electronic component S1 can be stored in the vacuum pump D1 while the electronic component S1 is kept suctioned by the vacuum pump D1 after finishing the electronic component S1 with water in the state of being adsorbed by the conveyance unit 7. The water in the second tank 420 is discharged to the outside of the cutting device 1 . In addition, the state switching of the valve V1 and the state switching of the valve V2 are implemented simultaneously.

<2-2. Drain operation in the second and third water separation and discharge mechanisms> The drainage procedures of the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 are substantially the same. Hereinafter, the drainage operation in the second water separation and discharge mechanism 42 will be representatively described.

FIG. 9 is a flowchart showing an example of a drainage routine in the second water separation and discharge mechanism 42 . The processing shown in this flowchart is executed by the control unit 70 when the second water separation and discharge mechanism 42 is in the second state. In addition, the processing shown in this flowchart is executed every time the processing of one package substrate P1 is completed.

Referring to FIG. 9 , the control unit 70 determines whether the package substrate P1 is placed on the cutting table 5 (step S200 ). If it is determined that the package substrate P1 has not been placed on the cutting table 5 (NO in step S200 ), the control unit 70 waits until the package substrate P1 is placed on the cutting table 5 .

On the other hand, if it is determined that the package substrate P1 has been placed on the cutting table 5 (Yes in step S200), the control unit 70 controls the valves V1, V2 so that the second water separation and discharge mechanism 42 changes from the second state to the second state. It is the first state (step S210). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state. With this, the valve V3 is closed, and before the cutting water, cooling water, and washing water enter the suction passage VR2 from the cutting table 5, the vacuum pump D2 maintains the suction state of the electronic component S1, increasing the storage capacity. The amount of water in the second water separation and discharge mechanism 42 . In addition, the state switching of the valve V1 and the state switching of the valve V2 are implemented simultaneously.

Thereafter, the control unit 70 determines whether cleaning (cleaning) of the solder ball/lead surface of the electronic component S1 adsorbed on the cutting table 5 by the first cleaner 5e is completed (step S220). If it is determined that the cleaning of the solder ball/wire surface has not been completed (NO in step S220 ), the control unit 70 waits until the cleaning of the solder ball/wire surface is completed. After the cleaning of the solder ball/wire surface by the first cleaner 5e is completed, in the second water separation and discharge mechanism 42, the second tank 420 accumulates the most water and the first tank 410 is not easy to accumulate water timing.

On the other hand, if it is determined that the cleaning of the solder ball/wire surface is completed (Yes in step S220), the control unit 70 controls the respective valves V1, V2 so that the second water separation and discharge mechanism 42 is changed from the first state to the second state. state (step S230). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state. Thereby, the valve V3 is opened, and after the final treatment of the electronic component S1 with water in the state of being adsorbed on the cutting table 5, the electronic component S1 can be kept in the state of being sucked by the vacuum pump D2, and the stored The water in the second tank 420 is discharged to the outside of the cutting device 1 . In addition, the state switching of the valve V1 and the state switching of the valve V2 are implemented simultaneously.

＜2-3. Operation in case of poor drainage＞ Each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 performs a common operation when drainage failure occurs. Hereinafter, the operation when the drainage in the first water separation and discharge mechanism 41 fails is representatively described.

FIG. 10 is a flowchart showing an example of an operation program in the case of a drainage failure in the first water separation and discharge mechanism 41 . The processing shown in this flowchart is executed by the control unit 70 of the computer 50 when the cutting device 1 is operated.

Referring to FIG. 10, the control unit 70 refers to the output of the liquid level sensor 430 to determine whether the liquid level (water level) in the first tank 410 is above a predetermined height (step S300). If it is determined that the height of the liquid surface in the first tank 410 is less than the predetermined height (No in step S310), the control unit 70 continues the determination in step S300.

On the other hand, when it is determined that the height of the liquid surface in the first tank 410 is equal to or higher than the predetermined height (Yes in step S310 ), the control unit 70 controls the sound output unit 25 to output a warning sound. By hearing the warning sound, the operator can perceive that drainage failure has occurred in the first water separation and discharge mechanism 41 .

[3. Features] As above, in the cutting device 1 according to the present embodiment, each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 can be set between the first state and the second state. Change, the first state will store the water flowing into the second tank 420 from the first tank 410 in the second tank 420, and the second state will discharge the water stored in the first tank 410 and the second tank 420 to the outside of the cutting device 1. Therefore, according to this cutting device 1 , it is possible to appropriately change the state of each water separation and discharge mechanism, thereby suppressing water from entering each vacuum pump while maintaining the adsorption of the substrate such as the electronic component S1 .

Also, in the first tank 410, the partition plate 415 is used to separate the area where the connection port 413 is located and the area where the connection port 412 is located, and water can be stored in the two areas of the partition plate 415. The connection port 413 Connected to the vacuum pump D1 , D2 or D3 , the connection port 412 is connected to the channel for absorbing the package substrate P1 or the package substrate P1 . Furthermore, a gap is formed above the partition plate 415 . According to the cutting device 1 of the present embodiment, water can be separated from the suction air with such a simple structure. Further, every time the processing of one package substrate P1 is completed, the water discharge treatment is performed in each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43, thereby reducing the size of the first water separation and discharge mechanism as much as possible. The capacity of the first tank 410 and the second tank 420.

In addition, each of the package substrate P1 and the electronic component S1 is an example of the "object to be cut" in the present invention. The cutting stage 5 is an example of the "stage" in the present invention. The core shaft portion 6 is an example of the "cutting mechanism" in the present invention. The transport unit 7 is an example of the "holding mechanism" in the present invention. Each of the suction channels VR1, VR2, and VR3 is an example of the "suction channel" in the present invention. Each of the vacuum pumps D1, D2, and D3 is an example of a "vacuum pump" in the present invention. The drainage channel DR1 is an example of the "drainage channel" in the present invention. Each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 is an example of the "water separation and discharge mechanism" in the present invention. The first groove 410 is an example of the "first groove" in the present invention; the second groove 420 is an example of the "second groove" in the present invention. The partition plate 415 is an example of the "partition plate" in the present invention. The configuration including the respective valves V1, V2, and V3 is an example of the "valve mechanism" in the present invention. The control unit 70 of the computer 50 is an example of the "control unit" in the present invention. The valve V3 is an example of the "valve for drainage" in the present invention.

[4. Other Embodiments] The idea of the above-mentioned embodiment is not limited to the above-described embodiment. Hereinafter, other embodiments to which the ideas of the above-mentioned embodiments can be applied will be described.

<4-1> In the cutting device 1 according to the above-mentioned embodiment, each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 includes valves V1 and V2 . However, each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 does not necessarily include the valves V1 and V2 . For example, each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43, as long as it includes a valve mechanism, the valve mechanism can be changed into the first state and the second state. The first state stores the water flowing from the first tank 410 into the second tank 420 in the second tank 420 , and the second state discharges the water stored in the first tank 410 and the second tank 420 . As such a valve mechanism, a tripartite valve is exemplified. Another example of the first water separation and discharge mechanism 41 will be described below.

Fig. 11 is a diagram schematically showing the water separation and discharge mechanism 41A in the first state. Fig. 12 is a diagram schematically showing the water separation and discharge mechanism 41A in the second state. As shown in FIGS. 11 and 12 , in the water separation and discharge mechanism 41A, a three-way valve VA is provided between the first tank 410 and the second tank 420 . The three-way valve VA can be changed to a state passing through the first groove 410 and the second groove 420 ( FIG. 11 ), and a state passing through the second groove 420 and the atmosphere ( FIG. 12 ). That is, the three-way valve VA can be changed into a first state (FIG. 11) and a second state (FIG. 12). The first state will store the water discharged from the first tank 410 to the second tank 420 in the second state. The second tank 420 , the second state will discharge the water stored in the first tank 410 and the second tank 420 . In the cutting device 1 according to the above-mentioned embodiment, a three-way valve VA may be used instead of the valves V1 and V2. In addition, the range Z3 in the first state is in a vacuum state, and the range Z4 in the second state is in a vacuum state.

<4-2> In addition, in the cutting device 1 according to the above-mentioned embodiment, the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 are individually provided in the suction channels VR1, VR2, and VR3. However, it is not necessary to provide a water separation and discharge mechanism in each suction channel. For example, a water-sealed vacuum pump may be used as the vacuum pumps D2 and D3, and the water separation and discharge mechanism may not be provided in the respective suction channels VR2 and VR3. In addition, for example, a water-sealed vacuum pump may be used as the vacuum pump D1, and a water separation and discharge mechanism may not be provided in the suction passage VR1.

<4-3> Also, in the shutoff device 1 according to the above-mentioned embodiment, a check valve is used as the valve V3 included in each of the first water separation and discharge mechanism 41 , the second water separation and discharge mechanism 42 , and the third water separation and discharge mechanism 43 . However, valve V3 does not have to be a check valve. The valve V3 can also be designed as a two-position valve (so-called stop valve). At this time, for example, when water is to be stored in the second tank 420 , the control valve V3 is in a closed state; when water is to be discharged from the second tank 420 , the control valve V3 is in an open state.

<4-4> Also, the valve V2 that communicates with the atmosphere is provided on a passage branched from the drain passage DR1 between the valve V1 and the second tank 420 . However, the valve V2 does not have to be provided to branch off from the drain passage DR1, and may be provided in a place in the drain passage DR1 where the downstream of the valve V1 (more specifically, inside the second tank 420 ) becomes atmospheric pressure. For example, a pipe may be connected to the top surface of the second tank 420, and the valve V2 may be provided in this pipe.

<4-5> In addition, in the cutting device 1 according to the above-mentioned embodiment, when the height of the water surface in the first tank 410 becomes higher than or equal to a predetermined height, a warning sound is emitted. However, when the height of the water surface in the first tank 410 becomes higher than or equal to a predetermined height, it is not necessary to generate a warning sound. For example, the cutting device 1 may be forcibly stopped when the height of the water surface in the first tank 410 becomes higher than or equal to a predetermined height. Thereby, it is possible to suppress the occurrence of a situation where the water in the first tank 410 overflows.

<4-6> In addition, in the above-mentioned embodiment, in step S100 of FIG. 8, it is determined whether or not the cleaning (washing) by the first washer 5e is completed. However, in step S100 of FIG. 8, it may be determined whether or not the drying by the first washer 5e is completed. Next, when it is determined that the drying is completed, the first water separation and discharge mechanism 41 is changed from the second state to the first state. In addition, in step S120 of FIG. 8, it may be determined whether or not the drying by the second washer 7a is completed. Next, when it is determined that the drying is completed, the first water separation and discharge mechanism 41 is changed from the first state to the second state. In addition, in step S220 of FIG. 9, it is determined whether the cleaning (cleaning) of the solder ball/lead surface of the electronic component S1 by the first cleaner 5e is completed. However, in step S220 of FIG. 9, it may be determined whether or not the drying by the first washer 5e is completed. Next, when it is determined that the drying is completed, the first water separation and discharge mechanism 41 may be changed from the first state to the second state.

<4-7> Furthermore, in the shutoff device 1 according to the above-mentioned embodiment, when the state of the valves V1 and V2 included in each water separation and discharge mechanism is to be switched, the states of the valves V1 and V2 are simultaneously switched. However, the states of the valves V1 and V2 may not necessarily be switched simultaneously. For example, when the state of each water separation and discharge mechanism is switched from the first state to the second state, the valve V1 can also be switched from the open state to the closed state, and then the valve V2 can be switched from the closed state to the open state. Also, for example, when the state of each water separation and discharge mechanism is switched from the second state to the first state, the valve V2 may be switched from the open state to the closed state, and then the valve V1 may be switched from the closed state to the open state.

As mentioned above, the embodiment of this invention was illustrated and described. That is, the detailed description and the attached drawings are disclosed for the purpose of illustration. Therefore, among the constituent elements described in the detailed description and the attached drawings, constituent elements not necessary for solving the problem may be included. Therefore, although these unnecessary constituent elements are described in the constituent elements of the detailed description and attached drawings, these unnecessary constituent elements should not be directly regarded as essential.

In addition, the above-mentioned embodiments are merely illustrations of the present invention from various viewpoints. Various improvements and changes can be made to the above-described embodiments within the scope of the present invention. For implementation of the present invention, specific configurations can be appropriately adopted in accordance with the embodiments.

1: cutting device 3: Substrate supply part 4: Positioning Department 4a: track part 5: Cutting table 5a: Holding member 5b: Rotary mechanism 5c: Mobile Mechanism 5d: First position confirmation camera 5e: First Scrubber 6: mandrel part 6a: blade 6b:Second position confirmation camera 6c: axis of rotation 7:Transportation department 7a: Second scrubber 11: Examination table 12: The first optical inspection camera 13: Second optical inspection camera 14:Configuration Department 15: selection part 15a: Trays for good products 15b: Tray for defective products 20: Monitor 25: Sound output unit 41, 41A: the first water separation and discharge mechanism 42: The second water separation and discharge mechanism 43: The third water separation and discharge mechanism 50: computer 70: Control Department 72:CPU 74: RAM 76:ROM 80: memory department 81: Control program 90: Input and output I/F 95: Reception Department 410: first slot 411: The first slot body 412, 413, 414: connection ports 415: Partition board 420: second slot 430: liquid level sensor A1: cut off module B1: Inspection and storage module D1, D2, D3: vacuum pump DR1: drainage channel M1: Cassette P1: Package substrate S1: Electronic parts V1, V2, V3: valves VA: three-way valve VR1, VR3, VR3: attraction channel W1: welding part Z1,Z2,Z3,Z4: range

Fig. 1 is a plan view schematically showing a cutting device. Fig. 2 is a diagram schematically showing the first water separation and discharge mechanism in the first state. Fig. 3 is a diagram schematically showing the first water separation and discharge mechanism in the second state. Fig. 4 is a diagram schematically showing the plane of the first groove. Fig. 5 is a diagram schematically showing a V-V cross section in Fig. 4 . Fig. 6 is a diagram schematically showing a section along VI-VI in Fig. 4 . Fig. 7 is a diagram schematically showing the hardware configuration of a computer. Fig. 8 is a flowchart showing an example of a drainage routine in the first water separation and discharge mechanism. Fig. 9 is a flowchart showing an example of a drainage routine in the second water separation and discharge mechanism. Fig. 10 is a flowchart showing an example of an operation program when drainage is not smooth in the first water separation and discharge mechanism. Fig. 11 is a diagram schematically showing another example of the first water separation and discharge mechanism in the first state. Fig. 12 is a diagram schematically showing another example of the first water separation and discharge mechanism in the second state.

Domestic deposit information (please note in order of depositor, date, and number) none

Overseas storage information (please note in order of storage country, organization, date, and number) none

1: cutting device

3: Substrate supply part

4: Positioning Department

4a: track part

5: Cutting table

5a: Holding member

5b: Rotary mechanism

5c: Mobile Mechanism

5d: First position confirmation camera

5e: First Scrubber

6: mandrel part

6a: blade

6b:Second position confirmation camera

6c: axis of rotation

7:Transportation department

7a: Second scrubber

11: Examination table

12: The first optical inspection camera

13: Second optical inspection camera

14:Configuration department

15: selection part

15a: Trays for good products

15b: Tray for defective products

20: Monitor

25: Sound output unit

41: The first water separation and discharge mechanism

42: The second water separation and discharge mechanism

43: The third water separation and discharge mechanism

50: computer

A1: cut off module

B1: Inspection and storage module

D1, D2, D3: vacuum pump

M1: Cassette

VR1, VR3, VR3: attraction channel

Claims (6)

A cutting device comprising: a table for holding the cutting target object by absorbing the cutting target object; a cutting mechanism that separates the object to be cut into pieces by cutting the object to be cut on the table; and a holding mechanism for holding the object to be cut by absorbing the object to be cut into pieces; The aforementioned table or the aforementioned holding mechanism is connected to a dry vacuum pump through a suction channel; The cutting device is further equipped with a water separation and discharge mechanism, which is located on the aforementioned suction channel and discharges water through the drainage channel; The water separation and discharge mechanism includes a first tank and a second tank located downstream of the first tank in the drainage channel; The aforementioned first tank includes a partition plate to separate the area where the connection port with the aforementioned vacuum pump is located and the area where the connection port with the aforementioned platform or the aforementioned holding mechanism is located; In the first groove, a gap is formed above the partition plate; The water separation and discharge mechanism further includes a valve mechanism that can be changed into a first state and a second state. The first state stores the water that has flowed from the first tank into the second tank in the second tank. , the second state will discharge the water stored in the first tank and the second tank. The cutting device according to claim 1, further comprising a control unit, the control unit controls the valve mechanism to change from the first state to the second state every time the processing of one piece of the object to be cut is completed; The control unit controls the valve mechanism to change from the first state to the second state after the object to be cut is subjected to final treatment with water in a state in which the object to be cut is adsorbed on the table or the holding mechanism. . The cutting device according to claim 2, wherein the suction channel is connected to the holding mechanism and the vacuum pump; The control unit controls the valve mechanism from the first to the first position after cleaning the object to be cut with water on the surface opposite to the cut surface while the object to be cut is held by the holding mechanism. The state changes to the aforementioned second state. The cutting device according to claim 2, wherein the suction channel is connected to the table and the vacuum pump; The control unit controls the valve mechanism to change from the first state to the second state after cleaning the cut surface of the object to be cut with water while the object to be cut is held on the table. Two states. The shutoff device according to any one of claims 1 to 4, wherein the valve mechanism includes a valve for draining in the drain passage located downstream of the second tank; The aforementioned drain valve is a check valve. A method of manufacturing a cut product, using the cutting device described in any one of Claims 1 to 5; This manufacturing method includes the step of cutting the object to be cut on the table by the cutting mechanism, whereby the object to be cut is divided into pieces to manufacture the cut product.

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