WO2023112464A1 - Cutting device, and method for manufacturing cut product - Google Patents

Cutting device, and method for manufacturing cut product Download PDF

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Publication number
WO2023112464A1
WO2023112464A1 PCT/JP2022/038572 JP2022038572W WO2023112464A1 WO 2023112464 A1 WO2023112464 A1 WO 2023112464A1 JP 2022038572 W JP2022038572 W JP 2022038572W WO 2023112464 A1 WO2023112464 A1 WO 2023112464A1
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WO
WIPO (PCT)
Prior art keywords
tank
water
cutting
state
discharge mechanism
Prior art date
Application number
PCT/JP2022/038572
Other languages
French (fr)
Japanese (ja)
Inventor
晴貴 井口
隆也 細見
凛 坂本
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN202280066015.0A priority Critical patent/CN118043168A/en
Priority to KR1020247009500A priority patent/KR20240045335A/en
Publication of WO2023112464A1 publication Critical patent/WO2023112464A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B23Q3/088—Work-clamping means other than mechanically-actuated using vacuum means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
    • B23Q3/06—Work-clamping means
    • B23Q3/08—Work-clamping means other than mechanically-actuated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to a cutting device and a method for manufacturing a cut product.
  • Patent Document 1 discloses a cutting device for cutting a workpiece.
  • This cutting apparatus is provided with a suction unit that suctions and holds the workpiece.
  • the suction unit has a chuck table, and the workpiece is suction-held by the chuck table.
  • a suction pump is connected to the suction unit.
  • a water-sealed vacuum pump is used as a suction pump, in which the suction force does not decrease even when water is sucked (see Patent Document 1).
  • Patent Document 1 does not disclose means for solving such problems.
  • the present invention has been made to solve such problems, and an object of the present invention is to provide a cutting apparatus using a dry vacuum pump and a method for manufacturing a cut product, in which an object to be cut is kept adsorbed. Another object is to suppress the intrusion of water into the vacuum pump.
  • a cutting device includes a table, a cutting mechanism, a holding mechanism, and a water separation and discharge mechanism.
  • the table holds the cutting object by sucking the cutting object.
  • the cutting mechanism separates the cutting object by cutting the cutting object on the table.
  • the holding mechanism holds the cut object by sucking the singulated cut object.
  • the table or holding mechanism is connected to a dry vacuum pump through a suction path.
  • a water separation and discharge mechanism is located on the suction path and discharges water through the drainage path.
  • the water separation and discharge mechanism includes a first tank and a second tank. The second tank is located downstream of the first tank in the drainage path.
  • the first tank includes a partition plate that separates a region where the connection port to the vacuum pump is located and a region where the connection port to the table or the holding mechanism is located. A gap is formed above the partition plate in the first tank.
  • the water separation and discharge mechanism further includes a valve mechanism. The valve mechanism has a first state in which water flowing from the first tank to the second tank is stored in the second tank, and a second state in which water is stored in the first tank and the water stored in the second tank is discharged. change the state.
  • a method for manufacturing a cut product according to another aspect of the present invention uses the above cutting device.
  • This cut product manufacturing method includes the step of individualizing the cut object by cutting the cut object on the table with a cutting mechanism.
  • the present invention in a cutting apparatus using a dry-type vacuum pump and a method for manufacturing a cut product, it is possible to prevent water from entering the vacuum pump while maintaining adsorption of the object to be cut.
  • FIG. 4 is a diagram schematically showing the first water separation/discharge mechanism in the first state
  • FIG. 5 is a diagram schematically showing the first water separation/discharge mechanism in a second state
  • FIG. 5 is a figure which shows typically the plane of a 1st tank.
  • FIG. 5 is a diagram schematically showing a VV cross section of FIG. 4
  • FIG. 5 is a diagram schematically showing a VI-VI cross section of FIG. 4
  • FIG. 4 is a flow chart showing an example of a water discharge procedure in the first water separation and discharge mechanism
  • 6 is a flow chart showing an example of a water discharge procedure in the second water separation and discharge mechanism
  • 4 is a flow chart showing an example of an operation procedure in the first water separation/discharge mechanism when drainage failure occurs.
  • FIG. 4 is a diagram schematically showing another example of the first water separation/discharge mechanism in the first state
  • FIG. 10 is a diagram schematically showing another example of the first water separation/discharge mechanism in the second state;
  • this embodiment an embodiment according to one aspect of the present invention (hereinafter also referred to as “this embodiment”) will be described in detail with reference to the drawings.
  • the same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated.
  • each drawing is schematically drawn by appropriately omitting or exaggerating objects for easy understanding.
  • FIG. 1 is a plan view schematically showing a cutting device 1 according to this embodiment.
  • the cutting apparatus 1 cuts an object to be cut (a package substrate in this embodiment) to cut the object into a plurality of cut products (electronic components (package components) when the object to be cut is a package substrate). It is configured to singulate into .
  • a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed.
  • An example of an object to be cut is a substrate, which includes substrates that are not resin-sealed (including wafers) and substrates that have been resin-sealed (package substrates).
  • package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-lead ) package substrates.
  • a package substrate P1 is used as an object to be cut, and the cutting device 1 separates the package substrate P1 into a plurality of electronic components S1 (not shown).
  • the resin-sealed surface is referred to as a mold surface
  • the surface opposite to the mold surface is referred to as a ball/lead surface.
  • the ball/lead surface in this embodiment corresponds to the surface facing upward during cutting (cut surface), and the mold surface in this embodiment is It corresponds to the opposite side of the cutting plane.
  • the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components.
  • the cutting module A1 is configured to manufacture a plurality of electronic components S1 (cut products) by cutting the package substrate P1.
  • the inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.
  • the cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a transport section 7.
  • the cutting module A1 also includes a second water separation/discharge mechanism 42, a third water separation/discharge mechanism 43, part of the first water separation/discharge mechanism 41, vacuum pumps D2 and D3, and part of the vacuum pump D1. and
  • the substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the magazine M1 that stores the plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball/lead surface facing upward.
  • the positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 on the rail portions 4a. After that, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5 .
  • the cutting table 5 holds the package substrate P to be cut.
  • a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is shown.
  • a vacuum pump D2 is connected to one cutting table 5 through a suction path VR2, and a vacuum pump D3 is connected to the other cutting table 5 through a suction path VR3.
  • Each of the vacuum pumps D2 and D3 is a dry vacuum pump.
  • Each cutting table 5 sucks the package substrate P1 by suction of the vacuum pump D2 or the vacuum pump D3.
  • a second water separation/discharge mechanism 42 is provided in the suction route VR2, and a third water separation/discharge mechanism 43 is provided in the suction route VR3.
  • Each of the second water separation/discharge mechanism 42 and the third water separation/discharge mechanism 43 will be described later in detail.
  • Each cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c.
  • the holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below.
  • the rotating mechanism 5b can rotate the holding member 5a in the ⁇ 1 direction in the drawing.
  • the moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.
  • the spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1.
  • a twin-spindle cutting device 1 having two spindles 6 is shown.
  • the spindle part 6 is movable along the X-axis and Z-axis of the drawing. Note that the cutting device 1 may have a single spindle configuration having one spindle portion 6 .
  • the spindle section 6 includes a blade 6a and a rotating shaft 6c.
  • the blade 6a rotates at a high speed to cut the package substrate P1 and singulate the package substrate P1 into a plurality of electronic components S1.
  • the blade 6a is attached to the rotating shaft 6c while being sandwiched between first and second flanges (not shown).
  • the first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown) such as nuts.
  • the first flange is also called the inner flange and the second flange is also called the outer flange.
  • the spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, a washing water nozzle (none of which is shown), and the like.
  • the cutting water nozzle jets cutting water toward the blade 6a rotating at high speed.
  • the cooling water nozzle jets cooling water.
  • the cutting table 5 sucks the package substrate P1.
  • the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed.
  • Confirmation using the first position confirmation camera 5d is also referred to as alignment.
  • the position of a mark provided on the package substrate P1 is confirmed.
  • the mark indicates, for example, the cutting position of the package substrate P1.
  • the cutting table 5 moves toward the spindle section 6 along the Y-axis in the figure.
  • the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle section 6.
  • FIG. In this case, since the ball/lead surface of the package substrate P1 faces upward, the ball/lead surface becomes the cut surface.
  • the package substrate P1 is imaged by the second position confirmation camera 6b as necessary, and the position and the like of the package substrate P1 are confirmed. In the confirmation using the second position confirmation camera 6b, for example, the cutting position and cutting width of the package substrate P1 are confirmed.
  • the cutting table 5 moves away from the spindle section 6 along the Y-axis in the drawing while sucking the plurality of individualized electronic components S1.
  • the first cleaner 5e cleans and dries the upper surface (ball/lead surface) of the electronic component S1. Washing water is used for washing the electronic component S1.
  • the transport unit 7 sucks the electronic component S1 held on the cutting table 5 from above.
  • a vacuum pump D1 is connected to the transfer section 7 through a suction path VR1.
  • the vacuum pump D1 is a dry vacuum pump.
  • the conveying unit 7 sucks the electronic component S1 by suction of the vacuum pump D1.
  • a first water separation and discharge mechanism 41 is provided in the suction path VR1. The first water separation/discharge mechanism 41 will be described later in detail.
  • the transport unit 7 sucks the electronic component S1 and transports the electronic component S1 to the inspection table 11 of the inspection/storage module B1. During this transfer process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1.
  • the conveying unit 7 that has picked up the electronic component S1 is lowered in the Z-axis direction in the drawing, and the electronic component S1 is cleaned and dried in a state in which the electronic component S1 approaches the second cleaner 7a.
  • the conveying section 7 that has picked up the electronic component S1 is lifted in the Z-axis direction in the figure. Washing water is used for washing the electronic component S1.
  • the inspection/storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement section 14, and an extraction section 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1.
  • the inspection/storage module B1 also includes a portion of the first water separation/discharge mechanism 41 and a portion of the vacuum pump D1. The first water separation/discharge mechanism 41 and the vacuum pump D1 are present across both the cutting module A1 and the inspection/storage module B1.
  • the inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1.
  • the inspection table 11 is movable along the X-axis of the figure. Also, the inspection table 11 can be turned upside down.
  • the inspection table 11 is provided with a holding member that holds the electronic component S1 by sucking the electronic component S1.
  • a vacuum pump D1 is connected to the inspection table 11 through a suction path VR1. The inspection table 11 sucks the electronic component S1 onto the holding member by suction of the vacuum pump D1.
  • the first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball/lead surface and mold surface) of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the electronic component S1 are performed. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 so as to capture an upper image.
  • the first optical inspection camera 12 images the mold surface of the electronic component S1 transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the electronic component S ⁇ b>1 on the holding member of the inspection table 11 . After the holding member sucks the electronic component S1, the inspection table 11 is turned upside down. After the inspection table 11 moves above the second optical inspection camera 13 , the ball/lead surface of the electronic component S 1 is imaged by the second optical inspection camera 13 .
  • An inspected electronic component S1 is placed in the placement section 14.
  • a vacuum pump D1 is connected to the arrangement portion 14 through a suction path VR1.
  • the placement unit 14 sucks the inspected electronic component S1 by suction of the vacuum pump D1.
  • the placement unit 14 is movable along the Y-axis of the figure.
  • the inspection table 11 arranges the inspected electronic component S ⁇ b>1 in the arrangement section 14 .
  • the extraction unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray.
  • the electronic parts S1 are sorted into “non-defective products” or “defective products” based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13 .
  • the extraction unit 15 transfers each electronic component S1 to the non-defective product tray 15a or the defective product tray 15b based on the sorting result. Namely, non-defective products are stored in the non-defective product tray 15a, and defective products are stored in the defective product tray 15b. When each of the non-defective product tray 15a and the defective product tray 15b is filled with electronic components S1, it is replaced with a new tray.
  • the cutting device 1 further includes a computer 50, a monitor 20, and a sound output section 25.
  • Monitor 20 is configured to display an image.
  • the monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.
  • the sound output unit 25 is configured to output sound.
  • the sound output unit 25 is composed of, for example, a sound output device such as a speaker, buzzer, or bell.
  • the computer 50 controls each part of the cutting module A1 and the inspection/storage module B1.
  • the computer 50 includes, for example, the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction It controls the unit 15 , the first water separation/discharge mechanism 41 , the second water separation/discharge mechanism 42 , the third water separation/discharge mechanism 43 , the vacuum pumps D 1 , D 2 , D 3 , the monitor 20 and the sound output unit 25 .
  • each cutting table 5 is connected to the vacuum pump D2 or the vacuum pump D3, and the transfer section 7, the inspection table 11 and the placement section 14 are each connected to the vacuum pump D1.
  • Each cutting table 5 is exposed to, for example, cutting water, cooling water, and cleaning water jetted when cutting the package substrate P1, and cleaning water used when cleaning the electronic component S1 by the first cleaner 5e. Due to the suction of the vacuum pumps D2 and D3, for example, these waters enter the suction paths VR2 and VR3, respectively.
  • the conveying unit 7 is exposed to, for example, cleaning water used when cleaning the electronic component S1 with the second cleaner 7a. This water, for example, enters the suction path VR1 due to the suction of the vacuum pump D1.
  • each of the vacuum pumps D1, D2, and D3 is a water-sealed vacuum pump, no problem will occur even if water enters each vacuum pump.
  • a water ring type vacuum pump when used, fresh water must be continuously supplied into the vacuum pump in order to suppress the temperature rise of the sealing water. That is, when a water ring vacuum pump is used, a large amount of water is consumed.
  • dry vacuum pumps are employed for each of the vacuum pumps D1, D2 and D3.
  • a first water separation and discharge mechanism 41, a second water separation and discharge mechanism 42 and a second water separation and discharge mechanism 42 are provided on the suction paths VR1, VR2 and VR3.
  • 3 water separation and discharge mechanisms 43 are arranged respectively.
  • Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 separates water that has entered the suction path, and separates water separated through the discharge path from the cutting device 1.
  • each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 configured to discharge to Drainage is performed by each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43, thereby suppressing water from entering each of the vacuum pumps D1, D2, and D3. .
  • the first water separation/discharge mechanism 41 is positioned on the suction path VR1 between each of the conveying section 7, the inspection table 11, and the placement section 14 and the vacuum pump D1.
  • the second water separating/discharging mechanism 42 is located on the suction path VR2 between the one cutting table 5 and the vacuum pump D2.
  • the third water separating/discharging mechanism 43 is located on the suction path VR3 between the other cutting table 5 and the vacuum pump D3.
  • the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 are arranged in different places, but have substantially the same configuration.
  • Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 can be changed between a first state and a second state.
  • the first state and the second state will be explained later.
  • the 1st water separation discharge mechanism 41 is demonstrated representatively.
  • FIG. 2 is a diagram schematically showing the first water separation/discharge mechanism 41 in the first state.
  • FIG. 3 is a diagram schematically showing the first water separation/discharge mechanism 41 in the second state.
  • the first water separation and discharge mechanism 41 includes a first tank 410, a second tank 420, a liquid level sensor 430, and valves V1, V2, V3. .
  • the first tank 410 is located on the suction route VR1.
  • the first tank 410 is connected to each of the conveying section 7, the inspection table 11, and the placement section 14 located upstream in the suction route VR1 through pipes.
  • the first tank 410 is configured to store water that has flowed through the suction path VR1. Further, the first tank 410 is connected through a pipe to a vacuum pump D1 located downstream in the suction path VR1. In addition, the first tank 410 is connected through a pipe to a second tank 420 positioned downstream in the drainage route DR1. The first tank 410 is configured to discharge the stored water to the second tank 420 .
  • a liquid level sensor 430 is attached to the first tank 410 .
  • the liquid level sensor 430 is configured to detect the height of the liquid level (water surface) in the first tank 410 .
  • various known sensors such as a water gauge can be used.
  • FIGS. 4 is a diagram schematically showing the plane of the first tank 410.
  • FIG. FIG. 5 is a diagram schematically showing a VV cross section of FIG.
  • FIG. 6 is a diagram schematically showing a VI-VI section of FIG.
  • the first tank 410 includes a first tank body 411, connection ports 412, 413, 414, and a partition plate 415. As shown in FIGS. 4, 5 and 6, the first tank 410 includes a first tank body 411, connection ports 412, 413, 414, and a partition plate 415. As shown in FIGS.
  • the first tank body 411 is, for example, made of metal and has a cylindrical shape.
  • a connection port 412 penetrates through the upper surface of the first tank body 411 .
  • Pipes connected to each of the transport unit 7 , the inspection table 11 and the placement unit 14 are connected to the connection port 412 .
  • This pipe constitutes a part of the suction route VR1.
  • the connection port 412 does not necessarily have to be provided on the upper surface of the first tank body 411, and may be provided on the side surface of the first tank body 411, for example.
  • a pipe connected to the cutting table 5 is connected to the connection port 412 .
  • a connection port 413 penetrates the side surface of the first tank main body 411 .
  • a pipe connected to the vacuum pump D1 is connected to the connection port 413 .
  • This pipe constitutes a part of the suction route VR1.
  • the connection port 413 does not necessarily have to be provided on the side surface of the first tank main body 411, and may be provided on the upper surface of the first tank main body 411, for example.
  • a pipe connected to the vacuum pump D2 and a pipe connected to the vacuum pump D3 are connected to connection ports 413, respectively.
  • connection port 414 penetrates through the bottom surface of the first tank body 411 .
  • a pipe connected to the second tank 420 is connected to the connection port 414 .
  • This pipe constitutes a part of the drainage route DR1.
  • First tank 410 drains to second tank 420 through connection port 414 .
  • the partition plate 415 is, for example, made of metal and has a rectangular shape.
  • the partition plate 415 is erected at a position passing through the center of the first tank body 411 in plan view, and extends upward from the bottom surface of the first tank body 411 .
  • the partition plate 415 is joined to each of the inner side surface and the inner bottom surface of the first tank body 411 via a plurality of welded portions W1.
  • the partition plate 415 partitions the area where the connection port 413 is located and the area where the connection port 412 is located in the first tank 410 . That is, the connection port 413 is located in one region partitioned by the partition plate 415 , and the connection port 412 is located in the other region partitioned by the partition plate 415 . Since a gap is formed between the two welded portions W1 adjacent to each other, the water that enters from the connection port 412 and falls downward is stored in both of the two regions partitioned by the partition plate 415. be done.
  • a gap is formed above the partition plate 415 in the first tank 410 .
  • the gap length is X1.
  • the lower end of the connection port 412 is positioned lower than the upper end of the partition plate 415 .
  • the lower end of the connection port 412 (the upper end portion of the tip of the connection port 412 when the connection port 412 is provided on the side surface) is located at a position lower than the upper end of the partition plate 415 by the length X2. there is This makes it difficult for water entering from the connection port 412 to be sucked into the connection port 413 .
  • the second tank 420 is located downstream of the first tank 410 in the drainage route DR1.
  • the second tank 420 is arranged at a position lower than the first tank 410 in the height direction (Z-axis direction (FIG. 1)). Therefore, the water that has flowed into the suction path VR1 flows from the first tank 410 to the second tank 420 according to gravity.
  • the second tank 420 is configured to store water flowing from the first tank 410 .
  • a valve V1 is provided between the first tank 410 and the second tank 420 in the drainage path DR1.
  • the valve V1 can be opened and closed.
  • the water stored in the first tank 410 flows into the second tank 420 when the valve V1 is open.
  • the valve V1 is closed, water is stored in the first tank 410 and the inflow of water from the first tank 410 to the second tank 420 is stopped.
  • the drainage path DR1 branches between the valve V1 and the second tank 420.
  • the branch destination is connected to the atmosphere via a valve V2.
  • the valve V2 can be opened and closed. When the valve V2 is open, the pressure in the drainage path DR1 becomes the atmospheric pressure.
  • a valve V3 is provided downstream of the second tank 420 in the drainage path DR1.
  • the valve V3 is a drain valve and is composed of a check valve.
  • the valve V1 when the valve V1 is open and the valve V2 is closed, the range Z1 including the drainage path DR1, the second tank 420 and the valve V3 is in a vacuum state, so the valve V3 is automatically closed. closed.
  • the water that has flowed into the suction path VR1 passes through the first tank 410 and is stored in the second tank 420 .
  • the first state described above refers to this state, in which the valve V1 is open and the valves V2 and V3 are closed (see FIG. 2).
  • the valve V1 when the valve V1 is in the closed state and the valve V2 is in the open state, the range Z2 which does not include the drainage path DR1, the second tank 420 and the valve V3 is in a vacuum state. automatically open.
  • the water flowing into the suction path VR1 is stored in the first tank 410, and the water stored in the second tank 420 is discharged to the outside of the cutting device 1 through the water discharge port.
  • the above-mentioned second state refers to this state, in which the valve V1 is closed and the valves V2 and V3 are open (see FIG. 3).
  • the first water separation and discharge mechanism 41 can change between the first state and the second state.
  • each valve to change between the first state and the second state at an appropriate timing, it is possible to properly drain water while maintaining the suction of the electronic component S1 by the vacuum pump D1.
  • the timing of changing between the first state and the second state will be described later.
  • FIG. 7 is a diagram schematically showing the hardware configuration of the computer 50.
  • the computer 50 includes a control unit 70, an input/output I/F (interface) 90, a reception unit 95, and a storage unit 80. Each component is electrically connected via a bus. It is connected to the.
  • the control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like.
  • the control unit 70 is configured to control each component in the computer 50 and each component in the cutting apparatus 1 according to information processing.
  • the input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via signal lines.
  • the input/output I/F 90 is used for transmitting data from the computer 50 to each component within the cutting device 1 and for receiving data transmitted from each component within the cutting device 1 to the computer 50 .
  • the receiving unit 95 is configured to receive instructions from the user.
  • the reception unit 95 is composed of, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.
  • the storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or solid state drive.
  • the storage unit 80 is configured to store a control program 81, for example.
  • Various operations in the cutting apparatus 1 are realized by the control program 81 being executed by the control unit 70 .
  • the control program 81 is developed in the RAM 74 .
  • the control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 developed in the RAM 74 .
  • FIG. 8 is a flow chart showing an example of a drainage procedure in the first water separation and drainage mechanism 41. As shown in FIG. The processing shown in this flowchart is executed by the control section 70 of the computer 50 when the first water separation/discharge mechanism 41 is in the second state (FIG. 3). The processing shown in this flow chart is performed each time the processing of one package substrate P1 is completed.
  • control unit 70 determines whether or not the ball/lead surface of electronic component S1 attracted to cutting table 5 has been completely cleaned (washed) by first cleaner 5e (step S100). . If it is determined that the cleaning of the ball/lead surface is not completed (NO in step S100), control unit 70 waits until the cleaning of the ball/lead surface is completed.
  • step S100 when it is determined that the cleaning of the ball/lead surface has been completed (YES in step S100), the control unit 70 closes the valve V1 so that the first water separation/discharge mechanism 41 changes from the second state to the first state. , V2 (step S110). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state. As a result, the valve V3 is closed, and before water enters the suction path VR1 from the conveying unit 7 due to cleaning by the second cleaner 7a, the first water is supplied while the electronic component S1 is being sucked by the vacuum pump D1. The amount of water that can be stored in the separation and discharge mechanism 41 can be increased. The switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
  • control unit 70 completes the cleaning of the mold surface (surface opposite to the cutting surface) of the electronic component S1 sucked by the conveying unit 7 by the second cleaner 7a, and moves the conveying unit 7 in the Z-axis (FIG. 1) direction. is completed (step S120).
  • the control section 70 causes the cleaning by the second cleaner 7a and the lifting of the conveying section 7 to be completed. wait until is completed.
  • the second tank 420 in the first water separation/discharge mechanism 41 is filled with the most water, and the first tank 410 is filled with water. It is a difficult timing.
  • the control unit 70 causes the first water separating/discharging mechanism 41 to move from the first state to the second state.
  • Each of the valves V1 and V2 is controlled to change to the state (step S130). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state.
  • the valve V3 is opened, and the water stored in the second tank 420 is discharged from the vacuum pump D1 after the electronic component S1 has been subjected to the final treatment using the water adsorbed by the conveying unit 7. It is possible to discharge the electronic component S1 to the outside of the cutting device 1 while maintaining the suction of the electronic component S1.
  • the switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
  • FIG. 9 is a flow chart showing an example of the drainage procedure in the second water separation and drainage mechanism 42.
  • the processing shown in this flowchart is executed by the control section 70 of the computer 50 when the second water separation/discharge mechanism 42 is in the second state.
  • the processing shown in this flow chart is performed each time the processing of one package substrate P1 is completed.
  • control unit 70 determines whether or not the package substrate P1 is placed on the cutting table 5 (step S200). If it is determined that package substrate P1 is not placed on cutting table 5 (NO in step S200), control unit 70 waits until package substrate P1 is placed on cutting table 5.
  • the control unit 70 causes the second water separation/discharge mechanism 42 to change from the second state to the first state.
  • the valves V1 and V2 are respectively controlled (step S210). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state.
  • the valve V3 is closed, and before the cutting water, cooling water, and cleaning water enter the suction path VR2 from the cutting table 5, the vacuum pump D2 continues to suck the electronic component S1, and the second water
  • the amount of water that can be stored in the separation and discharge mechanism 42 can be increased.
  • the switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
  • control unit 70 determines whether or not the ball/lead surface of the electronic component S1 attracted to the cutting table 5 has been cleaned (washed) by the first cleaner 5e (step S220). If it is determined that the cleaning of the ball/lead surface is not completed (NO in step S220), control unit 70 waits until the cleaning of the ball/lead surface is completed. At the timing when the cleaning of the ball/lead surface of the electronic component S1 by the first cleaner 5e is completed, in the second water separation/discharge mechanism 42, the second tank 420 is filled with the most water, and the first tank 410 is filled with water. It's the timing when it's hard to collect.
  • control unit 70 closes valve V1 so that second water separation/discharge mechanism 42 changes from the first state to the second state. , V2 (step S230). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state.
  • the valve V3 is opened, and after the electronic component S1 is subjected to the final treatment using the water adsorbed on the cutting table 5, the water stored in the second tank 420 is discharged by the vacuum pump D2. It is possible to discharge the electronic component S1 to the outside of the cutting device 1 while maintaining the suction of the electronic component S1.
  • the switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
  • Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 performs a common operation when drainage failure occurs.
  • the operation of the first water separation/discharge mechanism 41 at the time of poor drainage will be described as a representative example.
  • FIG. 10 is a flow chart showing an example of the operation procedure when the first water separation/discharge mechanism 41 has poor drainage. The processing shown in this flowchart is executed by the control section 70 of the computer 50 when the cutting device 1 is in operation.
  • control unit 70 refers to the output of liquid level sensor 430 to determine whether the height of the liquid level (water surface) in first tank 410 is equal to or higher than a predetermined height. (step S300). When it is determined that the liquid level in first tank 410 is less than the predetermined height (NO in step S300), control unit 70 continues the determination in step S300.
  • control unit 70 controls sound output unit 25 to output a warning sound. (Step S310). By hearing the warning sound, the operator can recognize that the first water separation/discharge mechanism 41 has a drainage failure.
  • each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 is connected from the first tank 410 to the second tank.
  • a first state in which the water that has flowed into 420 is stored in the second tank 420, and a second state in which the water stored in the first tank 410 and the water stored in the second tank 420 is discharged to the outside of the cutting device 1. can vary between Therefore, according to this cutting apparatus 1, by appropriately changing the state of each water separation and discharge mechanism, it is possible to suppress the entry of water into each vacuum pump while maintaining the adsorption of the substrate such as the electronic component S1. can be done.
  • a region where the connection port 413 connected to the vacuum pump D1, D2 or D3 is located and a region where the connection port 412 where the path for sucking the electronic component S1 or the package substrate P1 is located are partitioned. It is separated by a plate 415 and water can be stored in both areas of the partition plate 415 . A gap is formed above the partition plate 415 . According to the cutting device 1 according to the present embodiment, water can be separated from intake air with such a simple configuration.
  • the first water separation/discharge mechanism 41 by performing waste water treatment in each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 each time the treatment of one package substrate P1 is completed, the first The volumes of the tank 410 and the second tank 420 can be made as small as possible.
  • Each of the package substrate P1 and the electronic component S1 is an example of the "cutting object" in the present invention.
  • the cutting table 5 is an example of a “table” in the present invention.
  • the spindle section 6 is an example of a “cutting mechanism” in the present invention.
  • the conveying section 7 is an example of a "holding mechanism” in the present invention.
  • Each of the suction paths VR1, VR2, VR3 is an example of the "suction path” in the present invention.
  • Each of the vacuum pumps D1, D2, D3 is an example of the "vacuum pump” in the present invention.
  • Drainage route DR1 is an example of a "drainage route” in the present invention.
  • Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 is an example of the "water separation/discharge mechanism" in the present invention.
  • the first tank 410 is an example of the "first tank” in the present invention
  • the second tank 420 is an example of the "second tank” in the present invention.
  • the partition plate 415 is an example of the "partition plate” in the present invention.
  • a configuration including valves V1, V2, and V3 is an example of a "valve mechanism” in the present invention.
  • the controller 70 of the computer 50 is an example of the "controller” in the present invention.
  • the valve V3 is an example of a "drainage valve” in the present invention.
  • first water separation/discharge mechanism 41, second water separation/discharge mechanism 42, and third water separation/discharge mechanism 43 each include valves V1 and V2.
  • each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 does not necessarily include the valves V1 and V2.
  • Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 stores, for example, the water flowing from the first tank 410 to the second tank 420 in the second tank 420.
  • Such a valve mechanism includes, for example, a three-way valve.
  • Other examples of the first water separation/discharge mechanism 41 will be described below.
  • FIG. 11 is a diagram schematically showing the first water separation/discharge mechanism 41A in the first state.
  • FIG. 12 is a diagram schematically showing the first water separation/discharge mechanism 41A in the second state.
  • a three-way valve VA is provided between the first tank 410 and the second tank 420 in the first water separation/discharge mechanism 41A.
  • the three-way valve VA can change between a state in which the first tank 410 and the second tank 420 penetrate (FIG. 11) and a state in which the second tank 420 and the atmosphere penetrate (FIG. 12). That is, the three-way valve VA discharges water from the first tank 410 to the second tank 420 and stores water in the second tank 420 in a first state (FIG.
  • the second state (FIG. 12) in which the water stored in the tank 420 is discharged can be changed.
  • a three-way valve VA may be used instead of the valves V1 and V2. Note that the range Z3 is in a vacuum state in the first state, and the range Z4 is in a vacuum state in the second state.
  • the suction paths VR1, VR2, VR3 are provided with the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43, respectively.
  • each suction path does not necessarily have to be provided with a water separation and discharge mechanism.
  • a water seal type vacuum pump may be used as the vacuum pumps D2 and D3, and the suction paths VR2 and VR3 may not be provided with water separation and discharge mechanisms.
  • a water-sealed vacuum pump may be used as the vacuum pump D1, and the suction path VR1 may not be provided with a water separation and discharge mechanism.
  • valve V3 is used as the valve V3 included in each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43.
  • valve V3 need not necessarily be a check valve.
  • the valve V3 may be composed of an on-off valve (so-called stop valve). In this case, for example, when water is stored in the second tank 420, the valve V3 is controlled to be closed, and when water is discharged from the second tank 420, the valve V3 is controlled to be open.
  • valve V2 leading to the atmosphere is provided in a path branched from the drainage path DR1 between the valve V1 and the second tank 420 .
  • the valve V2 may be provided at a location in the drainage path DR1 where the pressure downstream of the valve V1 (more specifically, inside the second tank 420) can be brought to the atmospheric pressure. It does not have to be branched.
  • a pipe may be connected to the upper surface of the second tank 420 and the valve V2 may be provided in this pipe.
  • a warning sound is emitted when the height of the water surface in first tank 410 reaches or exceeds a predetermined height.
  • the warning sound does not necessarily have to be emitted.
  • the cutting device 1 may be forcibly stopped when the height of the water surface in the first tank 410 reaches or exceeds a predetermined height. As a result, it is possible to prevent the first tank 410 from overflowing with water.
  • step S100 of FIG. 8 it is determined in step S100 of FIG. 8 whether or not the cleaning (washing) by the first cleaner 5e has been completed. However, in step S100 of FIG. 8, it may be determined whether the drying by the first cleaner 5e is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the second state to the first state. Further, in step S120 of FIG. 8, it may be determined whether drying by the second cleaner 7a is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the first state to the second state. Further, in step S220 of FIG.
  • step S220 of FIG. 9 it is determined whether or not the cleaning (washing) of the ball/lead surfaces of the electronic component S1 by the first cleaner 5e has been completed. However, in step S220 of FIG. 9, it may be determined whether the drying by the first cleaner 5e is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the first state to the second state.
  • the states of the valves V1 and V2 are switched at the same time.
  • the states of valves V1 and V2 do not necessarily have to be switched at the same time.
  • the valve V1 is switched from the open state to the closed state, and then the valve V2 is switched from the closed state to the open state.
  • the valve V2 is switched from the open state to the closed state, and then the valve V1 is switched from the closed state to the open state.

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Abstract

This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/discharge mechanism is positioned on the suction path and discharges water through a water discharge path. The water isolation/discharge mechanism includes a first tank, a second tank, and a valve mechanism. The first tank includes a partition plate for partitioning the tank into a region where a connection opening leading to the vacuum pump is positioned and a region where a connection opening leading to the table or the holding mechanism is positioned. A space is formed in the first tank above the partition plate. The valve mechanism changes between a first state, in which water flowing from the first tank into the second tank is reserved in the second tank, and a second state, in which water is reserved in the first tank and the water reserved in the second tank is discharged.

Description

切断装置、及び切断品の製造方法CUTTING DEVICE AND METHOD FOR MANUFACTURING CUTTING GOODS
　本発明は、切断装置、及び切断品の製造方法に関する。 The present invention relates to a cutting device and a method for manufacturing a cut product.
　特開２０１９－２０２３５３号公報（特許文献１）は、被加工物を切削する切削装置を開示する。この切削装置においては、被加工物を吸引保持する吸着ユニットが設けられている。吸着ユニットはチャックテーブルを備え、被加工物がチャックテーブルによって吸引保持される。吸着ユニットには、吸引ポンプが接続されている。この切削装置においては、吸引ポンプとして、水を吸引しても吸引力が下がらない水封式真空ポンプが用いられている（特許文献１参照）。 Japanese Patent Laying-Open No. 2019-202353 (Patent Document 1) discloses a cutting device for cutting a workpiece. This cutting apparatus is provided with a suction unit that suctions and holds the workpiece. The suction unit has a chuck table, and the workpiece is suction-held by the chuck table. A suction pump is connected to the suction unit. In this cutting apparatus, a water-sealed vacuum pump is used as a suction pump, in which the suction force does not decrease even when water is sucked (see Patent Document 1).
特開２０１９－２０２３５３号公報JP 2019-202353 A
　切断対象物（例えば、基板）の吸着のために水封式真空ポンプが用いられる場合には、封水の温度上昇を抑制するために、真空ポンプ内への新しい水の供給が継続的に行なわれる。すなわち、水封式真空ポンプが用いられると、大量の水が消費される。このような問題を解決するために、水封式真空ポンプの代わりにドライ式真空ポンプを用いることが考えられる。この場合には、例えば、切断対象物に水を噴射する工程等における真空ポンプ内への水の浸入を抑制する必要がある。また、切断対象物の吸着は継続的に行なわれる必要がある。しかしながら、このような課題を解決するための手段は上記特許文献１に開示されていない。 When a water-sealed vacuum pump is used to adsorb a cutting object (eg, a substrate), new water is continuously supplied to the vacuum pump in order to suppress the temperature rise of the sealing water. be That is, a large amount of water is consumed when a water ring vacuum pump is used. In order to solve such problems, it is conceivable to use a dry vacuum pump instead of a water ring vacuum pump. In this case, for example, it is necessary to prevent water from entering the vacuum pump during the step of spraying water onto the object to be cut. Also, the suction of the object to be cut needs to be performed continuously. However, Patent Document 1 does not disclose means for solving such problems.
　本発明は、このような問題を解決するためになされたものであって、その目的は、ドライ式の真空ポンプを用いる切断装置、及び切断品の製造方法において、切断対象物の吸着を維持しつつ真空ポンプ内への水の浸入を抑制することである。 The present invention has been made to solve such problems, and an object of the present invention is to provide a cutting apparatus using a dry vacuum pump and a method for manufacturing a cut product, in which an object to be cut is kept adsorbed. Another object is to suppress the intrusion of water into the vacuum pump.
　本発明のある局面に従う切断装置は、テーブルと、切断機構と、保持機構と、水分離排出機構とを備える。テーブルは、切断対象物を吸着することによって切断対象物を保持する。切断機構は、テーブル上の切断対象物を切断することによって切断対象物を個片化する。保持機構は、個片化された切断対象物を吸着することによって切断対象物を保持する。テーブル又は保持機構は、吸引経路を通じてドライ式の真空ポンプに接続されている。水分離排出機構は、吸引経路上に位置し、排水経路を通じて水を排出する。水分離排出機構は、第１タンクと、第２タンクとを含む。第２タンクは、排水経路において第１タンクよりも下流に位置する。第１タンクは、真空ポンプとの接続口が位置する領域と、テーブル又は保持機構との接続口が位置する領域とを仕切る仕切り板を含む。第１タンクにおいて、仕切り板の上方には隙間が形成されている。水分離排出機構は、弁機構をさらに含む。弁機構は、第１タンクから第２タンクへ流入した水が第２タンクに貯留される第１状態と、第１タンクに水が貯留され第２タンクに貯留された水が排出される第２状態とを変更する。 A cutting device according to one aspect of the present invention includes a table, a cutting mechanism, a holding mechanism, and a water separation and discharge mechanism. The table holds the cutting object by sucking the cutting object. The cutting mechanism separates the cutting object by cutting the cutting object on the table. The holding mechanism holds the cut object by sucking the singulated cut object. The table or holding mechanism is connected to a dry vacuum pump through a suction path. A water separation and discharge mechanism is located on the suction path and discharges water through the drainage path. The water separation and discharge mechanism includes a first tank and a second tank. The second tank is located downstream of the first tank in the drainage path. The first tank includes a partition plate that separates a region where the connection port to the vacuum pump is located and a region where the connection port to the table or the holding mechanism is located. A gap is formed above the partition plate in the first tank. The water separation and discharge mechanism further includes a valve mechanism. The valve mechanism has a first state in which water flowing from the first tank to the second tank is stored in the second tank, and a second state in which water is stored in the first tank and the water stored in the second tank is discharged. change the state.
　本発明の他の局面に従う切断品の製造方法は、上記切断装置を用いる。この切断品の製造方法は、切断機構によってテーブル上の切断対象物を切断することにより切断対象物を個片化するステップを含む。 A method for manufacturing a cut product according to another aspect of the present invention uses the above cutting device. This cut product manufacturing method includes the step of individualizing the cut object by cutting the cut object on the table with a cutting mechanism.
　本発明によれば、ドライ式の真空ポンプを用いる切断装置、及び切断品の製造方法において、切断対象物の吸着を維持しつつ真空ポンプ内への水の浸入を抑制することができる。 According to the present invention, in a cutting apparatus using a dry-type vacuum pump and a method for manufacturing a cut product, it is possible to prevent water from entering the vacuum pump while maintaining adsorption of the object to be cut.
切断装置を模式的に示す平面図である。It is a top view which shows a cutting device typically. 第１状態における第１水分離排出機構を模式的に示す図である。FIG. 4 is a diagram schematically showing the first water separation/discharge mechanism in the first state; 第２状態における第１水分離排出機構を模式的に示す図である。FIG. 5 is a diagram schematically showing the first water separation/discharge mechanism in a second state; 第１タンクの平面を模式的に示す図である。It is a figure which shows typically the plane of a 1st tank. 図４のＶ－Ｖ断面を模式的に示す図である。FIG. 5 is a diagram schematically showing a VV cross section of FIG. 4; 図４のＶＩ－ＶＩ断面を模式的に示す図である。FIG. 5 is a diagram schematically showing a VI-VI cross section of FIG. 4; コンピュータのハードウェア構成を模式的に示す図である。It is a figure which shows the hardware constitutions of a computer typically. 第１水分離排出機構における排水手順の一例を示すフローチャートである。4 is a flow chart showing an example of a water discharge procedure in the first water separation and discharge mechanism; 第２水分離排出機構における排水手順の一例を示すフローチャートである。6 is a flow chart showing an example of a water discharge procedure in the second water separation and discharge mechanism; 第１水分離排出機構における排水不良時の動作手順の一例を示すフローチャートである。4 is a flow chart showing an example of an operation procedure in the first water separation/discharge mechanism when drainage failure occurs. 第１状態における第１水分離排出機構の他の例を模式的に示す図である。FIG. 4 is a diagram schematically showing another example of the first water separation/discharge mechanism in the first state; 第２状態における第１水分離排出機構の他の例を模式的に示す図である。FIG. 10 is a diagram schematically showing another example of the first water separation/discharge mechanism in the second state;
　以下、本発明の一側面に係る実施の形態（以下、「本実施の形態」とも称する。）について、図面を用いて詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。また、各図面は、理解の容易のために、適宜対象を省略又は誇張して模式的に描かれている。 Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and the description thereof will not be repeated. In addition, each drawing is schematically drawn by appropriately omitting or exaggerating objects for easy understanding.
　［１．構成］
　＜１－１．切断装置の全体構成＞
　図１は、本実施の形態に従う切断装置１を模式的に示す平面図である。切断装置１は、切断対象物（本実施の形態では、パッケージ基板）を切断することによって、該切断対象物を複数の切断品（切断対象物がパッケージ基板の場合、電子部品（パッケージ部品））に個片化するように構成されている。パッケージ基板においては、半導体チップが装着された基板又はリードフレームが樹脂封止されている。 [1. composition]
<1-1. Overall Configuration of Cutting Device>
FIG. 1 is a plan view schematically showing a cutting device 1 according to this embodiment. The cutting apparatus 1 cuts an object to be cut (a package substrate in this embodiment) to cut the object into a plurality of cut products (electronic components (package components) when the object to be cut is a package substrate). It is configured to singulate into . In a package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed.
　切断対象物の一例としては基板が挙げられ、基板には樹脂封止されていない基板（ウエハを含む）及び樹脂封止された後の基板（パッケージ基板）が含まれる。パッケージ基板の一例としては、ＢＧＡ（Ball Grid Array）パッケージ基板、ＬＧＡ（Land Grid Array）パッケージ基板、ＣＳＰ（Chip Size Package）パッケージ基板、ＬＥＤ（Light Emitting Diode）パッケージ基板及びＱＦＮ（Quad Flat No-leaded）パッケージ基板が挙げられる。 An example of an object to be cut is a substrate, which includes substrates that are not resin-sealed (including wafers) and substrates that have been resin-sealed (package substrates). Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-lead ) package substrates.
　この例においては、切断対象物としてパッケージ基板Ｐ１が用いられ、切断装置１によってパッケージ基板Ｐ１が複数の電子部品Ｓ１（不図示）に個片化される。以下では、パッケージ基板Ｐ１の両面のうち、樹脂封止された面をモールド面と称し、モールド面と反対の面をボール／リード面と称する。なお、切断対象物が樹脂封止されていない基板の場合、本実施の形態のボール／リード面は切断時に上を向いている面（切断面）に相当し、本実施の形態のモールド面は切断面の反対面に相当する。 In this example, a package substrate P1 is used as an object to be cut, and the cutting device 1 separates the package substrate P1 into a plurality of electronic components S1 (not shown). Hereinafter, of both surfaces of the package substrate P1, the resin-sealed surface is referred to as a mold surface, and the surface opposite to the mold surface is referred to as a ball/lead surface. When the object to be cut is a substrate that is not resin-sealed, the ball/lead surface in this embodiment corresponds to the surface facing upward during cutting (cut surface), and the mold surface in this embodiment is It corresponds to the opposite side of the cutting plane.
　図１に示されるように、切断装置１は、構成要素として、切断モジュールＡ１と、検査・収納モジュールＢ１とを含んでいる。切断モジュールＡ１は、パッケージ基板Ｐ１を切断することによって複数の電子部品Ｓ１（切断品）を製造するように構成されている。検査・収納モジュールＢ１は、製造された複数の電子部品Ｓ１の各々を検査し、その後、電子部品Ｓ１をトレイに収納するように構成されている。切断装置１において、各構成要素は、他の構成要素に対して着脱可能かつ交換可能である。 As shown in FIG. 1, the cutting device 1 includes a cutting module A1 and an inspection/storage module B1 as components. The cutting module A1 is configured to manufacture a plurality of electronic components S1 (cut products) by cutting the package substrate P1. The inspection/storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is detachable and replaceable with respect to other components.
　切断モジュールＡ１は、主として、基板供給部３と、位置決め部４と、切断テーブル５と、スピンドル部６と、搬送部７とを含んでいる。また、切断モジュールＡ１は、第２水分離排出機構４２と、第３水分離排出機構４３と、第１水分離排出機構４１の一部と、真空ポンプＤ２，Ｄ３と、真空ポンプＤ１の一部とを含んでいる。 The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a transport section 7. The cutting module A1 also includes a second water separation/discharge mechanism 42, a third water separation/discharge mechanism 43, part of the first water separation/discharge mechanism 41, vacuum pumps D2 and D3, and part of the vacuum pump D1. and
　基板供給部３は、複数のパッケージ基板Ｐ１を収容するマガジンＭ１からパッケージ基板Ｐ１を１つずつ押し出すことによって、パッケージ基板Ｐ１を１つずつ位置決め部４へ供給する。このとき、パッケージ基板Ｐ１は、ボール／リード面を上に向けて配置されている。 The substrate supply unit 3 supplies the package substrates P1 one by one to the positioning unit 4 by pushing out the package substrates P1 one by one from the magazine M1 that stores the plurality of package substrates P1. At this time, the package substrate P1 is arranged with the ball/lead surface facing upward.
　位置決め部４は、基板供給部３から押し出されたパッケージ基板Ｐ１をレール部４ａ上に配置することによって、パッケージ基板Ｐ１の位置決めを行う。その後、位置決め部４は、位置決めされたパッケージ基板Ｐ１を切断テーブル５へ搬送する。 The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 on the rail portions 4a. After that, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5 .
　切断テーブル５は、切断されるパッケージ基板Ｐを保持する。この例においては、２個の切断テーブル５を有するツインカットテーブル構成の切断装置１が示されている。一方の切断テーブル５には吸引経路ＶＲ２を通じて真空ポンプＤ２が接続されており、他方の切断テーブル５には吸引経路ＶＲ３を通じて真空ポンプＤ３が接続されている。真空ポンプＤ２，Ｄ３の各々は、ドライ式の真空ポンプである。各切断テーブル５は、真空ポンプＤ２又は真空ポンプＤ３の吸引によりパッケージ基板Ｐ１を吸着する。吸引経路ＶＲ２には第２水分離排出機構４２が設けられており、吸引経路ＶＲ３には第３水分離排出機構４３が設けられている。第２水分離排出機構４２及び第３水分離排出機構４３の各々については、後程詳しく説明する。 The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 with a twin-cut table configuration having two cutting tables 5 is shown. A vacuum pump D2 is connected to one cutting table 5 through a suction path VR2, and a vacuum pump D3 is connected to the other cutting table 5 through a suction path VR3. Each of the vacuum pumps D2 and D3 is a dry vacuum pump. Each cutting table 5 sucks the package substrate P1 by suction of the vacuum pump D2 or the vacuum pump D3. A second water separation/discharge mechanism 42 is provided in the suction route VR2, and a third water separation/discharge mechanism 43 is provided in the suction route VR3. Each of the second water separation/discharge mechanism 42 and the third water separation/discharge mechanism 43 will be described later in detail.
　各切断テーブル５は、保持部材５ａと、回転機構５ｂと、移動機構５ｃとを含んでいる。保持部材５ａは、位置決め部４によって搬送されたパッケージ基板Ｐ１を下方から吸着することによって、パッケージ基板Ｐ１を保持する。回転機構５ｂは、保持部材５ａを図のθ１方向に回転させることが可能である。移動機構５ｃは、保持部材５ａを図のＹ軸に沿って移動させることが可能である。 Each cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning unit 4 from below. The rotating mechanism 5b can rotate the holding member 5a in the θ1 direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.
　スピンドル部６は、パッケージ基板Ｐ１を切断することによって、パッケージ基板Ｐ１を複数の電子部品Ｓ１に個片化する。この例においては、２個のスピンドル部６を有するツインスピンドル構成の切断装置１が示されている。スピンドル部６は、図のＸ軸及びＺ軸に沿って移動可能である。なお、切断装置１は、一個のスピンドル部６を有するシングルスピンドル構成としてもよい。 The spindle unit 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. In this example, a twin-spindle cutting device 1 having two spindles 6 is shown. The spindle part 6 is movable along the X-axis and Z-axis of the drawing. Note that the cutting device 1 may have a single spindle configuration having one spindle portion 6 .
　スピンドル部６は、ブレード６ａと、回転軸６ｃとを含んでいる。ブレード６ａは、高速回転することによって、パッケージ基板Ｐ１を切断し、パッケージ基板Ｐ１を複数の電子部品Ｓ１に個片化する。ブレード６ａは、不図示の第１及び第２フランジにより挟持された状態で、回転軸６ｃに装着される。第１及び第２フランジは、ナット等の不図示の締結部材によって回転軸６ｃに固定される。第１フランジは奥フランジとも称され、第２フランジは外フランジとも称される。 The spindle section 6 includes a blade 6a and a rotating shaft 6c. The blade 6a rotates at a high speed to cut the package substrate P1 and singulate the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotating shaft 6c while being sandwiched between first and second flanges (not shown). The first and second flanges are fixed to the rotating shaft 6c by fastening members (not shown) such as nuts. The first flange is also called the inner flange and the second flange is also called the outer flange.
　スピンドル部６には、切削水用ノズル、冷却水用ノズル及び洗浄水用ノズル（いずれも不図示）等が設けられる。切削水用ノズルは、高速回転するブレード６ａに向かって切削水を噴射する。冷却水用ノズルは、冷却水を噴射する。洗浄水用ノズルは、切断屑等を洗浄する洗浄水を噴射する。 The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, a washing water nozzle (none of which is shown), and the like. The cutting water nozzle jets cutting water toward the blade 6a rotating at high speed. The cooling water nozzle jets cooling water. The washing water nozzle jets washing water for washing cutting waste and the like.
　再び図１を参照して、切断テーブル５上にパッケージ基板Ｐ１が載置されると、切断テーブル５はパッケージ基板Ｐ１を吸着する。その後、第１位置確認カメラ５ｄによってパッケージ基板Ｐ１が撮像され、パッケージ基板Ｐ１の位置が確認される。第１位置確認カメラ５ｄを用いた確認は、アラインメントとも称される。第１位置確認カメラ５ｄを用いた確認においては、例えば、パッケージ基板Ｐ１上に設けられたマークの位置が確認される。該マークは、例えば、パッケージ基板Ｐ１の切断位置を示す。 Referring to FIG. 1 again, when the package substrate P1 is placed on the cutting table 5, the cutting table 5 sucks the package substrate P1. After that, the package substrate P1 is imaged by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. Confirmation using the first position confirmation camera 5d is also referred to as alignment. In confirmation using the first position confirmation camera 5d, for example, the position of a mark provided on the package substrate P1 is confirmed. The mark indicates, for example, the cutting position of the package substrate P1.
　その後、切断テーブル５は、図のＹ軸に沿いスピンドル部６に向かって移動する。切断テーブル５がスピンドル部６の下方に移動した後、切断テーブル５とスピンドル部６とを相対的に移動させることによって、パッケージ基板Ｐ１が切断される。この場合には、パッケージ基板Ｐ１のボール／リード面が上を向いているため、ボール／リード面が切断面となる。その後、必要に応じて第２位置確認カメラ６ｂによってパッケージ基板Ｐ１が撮像され、パッケージ基板Ｐ１の位置等が確認される。第２位置確認カメラ６ｂを用いた確認においては、例えば、パッケージ基板Ｐ１の切断位置及び切断幅が確認される。 After that, the cutting table 5 moves toward the spindle section 6 along the Y-axis in the figure. After the cutting table 5 moves below the spindle section 6, the package substrate P1 is cut by relatively moving the cutting table 5 and the spindle section 6. FIG. In this case, since the ball/lead surface of the package substrate P1 faces upward, the ball/lead surface becomes the cut surface. After that, the package substrate P1 is imaged by the second position confirmation camera 6b as necessary, and the position and the like of the package substrate P1 are confirmed. In the confirmation using the second position confirmation camera 6b, for example, the cutting position and cutting width of the package substrate P1 are confirmed.
　切断テーブル５は、パッケージ基板Ｐ１の切断が完了した後、個片化された複数の電子部品Ｓ１を吸着した状態で、図のＹ軸に沿ってスピンドル部６から離れる方向に移動する。この移動過程において、第１クリーナ５ｅによって、電子部品Ｓ１の上面（ボール／リード面）の洗浄（クリーニング）及び乾燥が行なわれる。なお、電子部品Ｓ１の洗浄においては、洗浄水が用いられる。 After the cutting of the package substrate P1 is completed, the cutting table 5 moves away from the spindle section 6 along the Y-axis in the drawing while sucking the plurality of individualized electronic components S1. In this moving process, the first cleaner 5e cleans and dries the upper surface (ball/lead surface) of the electronic component S1. Washing water is used for washing the electronic component S1.
　搬送部７は、切断テーブル５に保持された電子部品Ｓ１を上方から吸着する。搬送部７には、吸引経路ＶＲ１を通じて真空ポンプＤ１が接続されている。真空ポンプＤ１は、ドライ式の真空ポンプである。搬送部７は、真空ポンプＤ１の吸引により電子部品Ｓ１を吸着する。吸引経路ＶＲ１には第１水分離排出機構４１が設けられている。第１水分離排出機構４１については、後程詳しく説明する。搬送部７は、電子部品Ｓ１を吸着し、電子部品Ｓ１を検査・収納モジュールＢ１の検査テーブル１１へ搬送する。この搬送過程においては、第２クリーナ７ａによって、電子部品Ｓ１の下面（モールド面）の洗浄及び乾燥が行なわれる。電子部品Ｓ１を吸着した搬送部７が図のＺ軸方向において下降し、電子部品Ｓ１が第２クリーナ７ａに近付いた状態で、電子部品Ｓ１の洗浄及び乾燥が行なわれる。電子部品Ｓ１の洗浄及び乾燥が終了すると、電子部品Ｓ１を吸着した搬送部７は図のＺ軸方向において上昇する。なお、電子部品Ｓ１の洗浄においては、洗浄水が用いられる。 The transport unit 7 sucks the electronic component S1 held on the cutting table 5 from above. A vacuum pump D1 is connected to the transfer section 7 through a suction path VR1. The vacuum pump D1 is a dry vacuum pump. The conveying unit 7 sucks the electronic component S1 by suction of the vacuum pump D1. A first water separation and discharge mechanism 41 is provided in the suction path VR1. The first water separation/discharge mechanism 41 will be described later in detail. The transport unit 7 sucks the electronic component S1 and transports the electronic component S1 to the inspection table 11 of the inspection/storage module B1. During this transfer process, the second cleaner 7a cleans and dries the lower surface (mold surface) of the electronic component S1. The conveying unit 7 that has picked up the electronic component S1 is lowered in the Z-axis direction in the drawing, and the electronic component S1 is cleaned and dried in a state in which the electronic component S1 approaches the second cleaner 7a. When the cleaning and drying of the electronic component S1 are completed, the conveying section 7 that has picked up the electronic component S1 is lifted in the Z-axis direction in the figure. Washing water is used for washing the electronic component S1.
　検査・収納モジュールＢ１は、主として、検査テーブル１１と、第１光学検査カメラ１２と、第２光学検査カメラ１３と、配置部１４と、抽出部１５とを含んでいる。なお、第１光学検査カメラ１２は、切断モジュールＡ１に設けられていてもよい。また、検査・収納モジュールＢ１は、第１水分離排出機構４１の一部と、真空ポンプＤ１の一部とを含んでいる。第１水分離排出機構４１及び真空ポンプＤ１は、切断モジュールＡ１及び検査・収納モジュールＢ１の両方に跨って存在している。 The inspection/storage module B1 mainly includes an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, an arrangement section 14, and an extraction section 15. Note that the first optical inspection camera 12 may be provided in the cutting module A1. The inspection/storage module B1 also includes a portion of the first water separation/discharge mechanism 41 and a portion of the vacuum pump D1. The first water separation/discharge mechanism 41 and the vacuum pump D1 are present across both the cutting module A1 and the inspection/storage module B1.
　検査テーブル１１は、電子部品Ｓ１の光学的な検査のために、電子部品Ｓ１を保持する。検査テーブル１１は、図のＸ軸に沿って移動可能である。また、検査テーブル１１は、上下反転することができる。検査テーブル１１には、電子部品Ｓ１を吸着することによって電子部品Ｓ１を保持する保持部材が設けられている。検査テーブル１１には、吸引経路ＶＲ１を通じて真空ポンプＤ１が接続されている。検査テーブル１１は、真空ポンプＤ１の吸引により電子部品Ｓ１を保持部材上に吸着する。 The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis of the figure. Also, the inspection table 11 can be turned upside down. The inspection table 11 is provided with a holding member that holds the electronic component S1 by sucking the electronic component S1. A vacuum pump D1 is connected to the inspection table 11 through a suction path VR1. The inspection table 11 sucks the electronic component S1 onto the holding member by suction of the vacuum pump D1.
　第１光学検査カメラ１２及び第２光学検査カメラ１３は、電子部品Ｓ１の両面（ボール／リード面及びモールド面）を撮像する。第１光学検査カメラ１２及び第２光学検査カメラ１３によって生成された画像データに基づいて、電子部品Ｓ１の各種検査が行なわれる。第１光学検査カメラ１２及び第２光学検査カメラ１３の各々は、検査テーブル１１の近傍において、上方を撮像するように配置されている。 The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both surfaces (ball/lead surface and mold surface) of the electronic component S1. Based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13, various inspections of the electronic component S1 are performed. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is arranged in the vicinity of the inspection table 11 so as to capture an upper image.
　第１光学検査カメラ１２は、搬送部７によって検査テーブル１１へ搬送される電子部品Ｓ１のモールド面を撮像する。その後、搬送部７は、検査テーブル１１の保持部材上に電子部品Ｓ１を載置する。保持部材が電子部品Ｓ１を吸着した後、検査テーブル１１は上下反転する。検査テーブル１１が第２光学検査カメラ１３の上方へ移動した後に、電子部品Ｓ１のボール／リード面が第２光学検査カメラ１３によって撮像される。 The first optical inspection camera 12 images the mold surface of the electronic component S1 transported to the inspection table 11 by the transport unit 7. After that, the transport unit 7 places the electronic component S<b>1 on the holding member of the inspection table 11 . After the holding member sucks the electronic component S1, the inspection table 11 is turned upside down. After the inspection table 11 moves above the second optical inspection camera 13 , the ball/lead surface of the electronic component S 1 is imaged by the second optical inspection camera 13 .
　配置部１４には、検査済みの電子部品Ｓ１が配置される。配置部１４には、吸引経路ＶＲ１を通じて真空ポンプＤ１が接続されている。配置部１４は、真空ポンプＤ１の吸引により検査済みの電子部品Ｓ１を吸着する。配置部１４は、図のＹ軸に沿って移動可能である。検査テーブル１１は、検査済みの電子部品Ｓ１を配置部１４に配置する。 An inspected electronic component S1 is placed in the placement section 14. A vacuum pump D1 is connected to the arrangement portion 14 through a suction path VR1. The placement unit 14 sucks the inspected electronic component S1 by suction of the vacuum pump D1. The placement unit 14 is movable along the Y-axis of the figure. The inspection table 11 arranges the inspected electronic component S<b>1 in the arrangement section 14 .
　抽出部１５は、配置部１４に配置された電子部品Ｓ１をトレイに移送する。電子部品Ｓ１は、第１光学検査カメラ１２及び第２光学検査カメラ１３を用いた検査の結果に基づいて、「良品」又は「不良品」に分別される。抽出部１５は、分別の結果に基づいて、各電子部品Ｓ１を良品用トレイ１５ａ又は不良品用トレイ１５ｂに移送する。すなわち、良品は良品用トレイ１５ａに収納され、不良品は不良品用トレイ１５ｂに収納される。良品用トレイ１５ａ及び不良品用トレイ１５ｂの各々は、電子部品Ｓ１で満たされると、新たなトレイに取り換えられる。 The extraction unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray. The electronic parts S1 are sorted into “non-defective products” or “defective products” based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13 . The extraction unit 15 transfers each electronic component S1 to the non-defective product tray 15a or the defective product tray 15b based on the sorting result. Namely, non-defective products are stored in the non-defective product tray 15a, and defective products are stored in the defective product tray 15b. When each of the non-defective product tray 15a and the defective product tray 15b is filled with electronic components S1, it is replaced with a new tray.
　切断装置１は、さらにコンピュータ５０と、モニタ２０と、音出力部２５とを含んでいる。モニタ２０は、画像を表示するように構成されている。モニタ２０は、例えば、液晶モニタ又は有機ＥＬ（Electro Luminescence）モニタ等の表示デバイスで構成される。音出力部２５は、音を出力するように構成されている。音出力部２５は、例えば、スピーカ、ブザー又はベル等の音出力デバイスで構成される。 The cutting device 1 further includes a computer 50, a monitor 20, and a sound output section 25. Monitor 20 is configured to display an image. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is composed of, for example, a sound output device such as a speaker, buzzer, or bell.
　コンピュータ５０は、例えば、切断モジュールＡ１及び検査・収納モジュールＢ１の各部を制御する。コンピュータ５０は、例えば、基板供給部３、位置決め部４、切断テーブル５、スピンドル部６、搬送部７、検査テーブル１１、第１光学検査カメラ１２、第２光学検査カメラ１３、配置部１４、抽出部１５、第１水分離排出機構４１、第２水分離排出機構４２、第３水分離排出機構４３、真空ポンプＤ１，Ｄ２，Ｄ３、モニタ２０及び音出力部２５を制御する。 The computer 50, for example, controls each part of the cutting module A1 and the inspection/storage module B1. The computer 50 includes, for example, the substrate supply unit 3, the positioning unit 4, the cutting table 5, the spindle unit 6, the transport unit 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction It controls the unit 15 , the first water separation/discharge mechanism 41 , the second water separation/discharge mechanism 42 , the third water separation/discharge mechanism 43 , the vacuum pumps D 1 , D 2 , D 3 , the monitor 20 and the sound output unit 25 .
　＜１－２．各水分離排出機構の構成＞
　上述のように、各切断テーブル５には真空ポンプＤ２又は真空ポンプＤ３が接続されており、搬送部７、検査テーブル１１及び配置部１４の各々には真空ポンプＤ１が接続されている。各切断テーブル５は、例えば、パッケージ基板Ｐ１の切断時に噴射される切削水、冷却水及び洗浄水、並びに、第１クリーナ５ｅによる電子部品Ｓ１の洗浄時に用いられる洗浄水に曝される。真空ポンプＤ２，Ｄ３の吸引により、例えば、これらの水が吸引経路ＶＲ２，ＶＲ３にそれぞれ浸入する。また、搬送部７は、例えば、第２クリーナ７ａによる電子部品Ｓ１の洗浄時に用いられる洗浄水に曝される。真空ポンプＤ１の吸引により、例えば、この水が吸引経路ＶＲ１に浸入する。 <1-2. Configuration of Each Water Separation and Discharge Mechanism>
As described above, each cutting table 5 is connected to the vacuum pump D2 or the vacuum pump D3, and the transfer section 7, the inspection table 11 and the placement section 14 are each connected to the vacuum pump D1. Each cutting table 5 is exposed to, for example, cutting water, cooling water, and cleaning water jetted when cutting the package substrate P1, and cleaning water used when cleaning the electronic component S1 by the first cleaner 5e. Due to the suction of the vacuum pumps D2 and D3, for example, these waters enter the suction paths VR2 and VR3, respectively. Further, the conveying unit 7 is exposed to, for example, cleaning water used when cleaning the electronic component S1 with the second cleaner 7a. This water, for example, enters the suction path VR1 due to the suction of the vacuum pump D1.
　仮に真空ポンプＤ１，Ｄ２，Ｄ３の各々が水封式の真空ポンプである場合には、各真空ポンプに水が浸入しても問題が生じない。しかしながら、水封式の真空ポンプが用いられる場合には、封水の温度上昇を抑制するために、真空ポンプ内へ新しい水が継続的に供給される必要がある。すなわち、水封式の真空ポンプが用いられると、大量の水が消費される。このような問題を解決するために、本実施の形態に従う切断装置１においては、真空ポンプＤ１，Ｄ２，Ｄ３の各々に、ドライ式の真空ポンプが採用されている。 If each of the vacuum pumps D1, D2, and D3 is a water-sealed vacuum pump, no problem will occur even if water enters each vacuum pump. However, when a water ring type vacuum pump is used, fresh water must be continuously supplied into the vacuum pump in order to suppress the temperature rise of the sealing water. That is, when a water ring vacuum pump is used, a large amount of water is consumed. In order to solve such a problem, in the cutting device 1 according to the present embodiment, dry vacuum pumps are employed for each of the vacuum pumps D1, D2 and D3.
　ドライ式の真空ポンプＤ１，Ｄ２，Ｄ３の各々に水が浸入しないようにするために、吸引経路ＶＲ１，ＶＲ２，ＶＲ３上には第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３がそれぞれ配置されている。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、吸引経路に浸入した水を分離し、排水経路を通じて分離された水を切断装置１の外部へ排出するように構成されている。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々によって排水を行なうことにより、真空ポンプＤ１，Ｄ２，Ｄ３の各々への水の浸入が抑制される。 In order to prevent water from entering each of the dry vacuum pumps D1, D2 and D3, a first water separation and discharge mechanism 41, a second water separation and discharge mechanism 42 and a second water separation and discharge mechanism 42 are provided on the suction paths VR1, VR2 and VR3. 3 water separation and discharge mechanisms 43 are arranged respectively. Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 separates water that has entered the suction path, and separates water separated through the discharge path from the cutting device 1. configured to discharge to Drainage is performed by each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43, thereby suppressing water from entering each of the vacuum pumps D1, D2, and D3. .
　上述のように、第１水分離排出機構４１は、搬送部７、検査テーブル１１及び配置部１４の各々と真空ポンプＤ１との間の吸引経路ＶＲ１上に位置している。第２水分離排出機構４２は、一方の切断テーブル５と真空ポンプＤ２との間の吸引経路ＶＲ２上に位置している。第３水分離排出機構４３は、他方の切断テーブル５と真空ポンプＤ３との間の吸引経路ＶＲ３上に位置している。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、配置されている場所が互いに異なるが、実質的に同一の構成を有している。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、第１状態及び第２状態間で変化可能である。第１状態及び第２状態については後程説明する。以下では、代表的に、第１水分離排出機構４１について説明する。 As described above, the first water separation/discharge mechanism 41 is positioned on the suction path VR1 between each of the conveying section 7, the inspection table 11, and the placement section 14 and the vacuum pump D1. The second water separating/discharging mechanism 42 is located on the suction path VR2 between the one cutting table 5 and the vacuum pump D2. The third water separating/discharging mechanism 43 is located on the suction path VR3 between the other cutting table 5 and the vacuum pump D3. The first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 are arranged in different places, but have substantially the same configuration. Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 can be changed between a first state and a second state. The first state and the second state will be explained later. Below, the 1st water separation discharge mechanism 41 is demonstrated representatively.
　図２は、第１状態における第１水分離排出機構４１を模式的に示す図である。図３は、第２状態における第１水分離排出機構４１を模式的に示す図である。図２及び図３に示されるように、第１水分離排出機構４１は、第１タンク４１０と、第２タンク４２０と、液面レベルセンサ４３０と、バルブＶ１，Ｖ２，Ｖ３とを含んでいる。 FIG. 2 is a diagram schematically showing the first water separation/discharge mechanism 41 in the first state. FIG. 3 is a diagram schematically showing the first water separation/discharge mechanism 41 in the second state. As shown in FIGS. 2 and 3, the first water separation and discharge mechanism 41 includes a first tank 410, a second tank 420, a liquid level sensor 430, and valves V1, V2, V3. .
　第１タンク４１０は、吸引経路ＶＲ１上に位置している。第１タンク４１０は、吸引経路ＶＲ１における上流に位置する搬送部７、検査テーブル１１及び配置部１４の各々と配管を通じて接続されている。第１タンク４１０は、吸引経路ＶＲ１を通じて流入した水を貯留するように構成されている。また、第１タンク４１０は、吸引経路ＶＲ１における下流に位置する真空ポンプＤ１と配管を通じて接続されている。また、第１タンク４１０は、排水経路ＤＲ１における下流に位置する第２タンク４２０と配管を通じて接続されている。第１タンク４１０は、貯留された水を第２タンク４２０へ排出するように構成されている。 The first tank 410 is located on the suction route VR1. The first tank 410 is connected to each of the conveying section 7, the inspection table 11, and the placement section 14 located upstream in the suction route VR1 through pipes. The first tank 410 is configured to store water that has flowed through the suction path VR1. Further, the first tank 410 is connected through a pipe to a vacuum pump D1 located downstream in the suction path VR1. In addition, the first tank 410 is connected through a pipe to a second tank 420 positioned downstream in the drainage route DR1. The first tank 410 is configured to discharge the stored water to the second tank 420 .
　第１タンク４１０には、液面レベルセンサ４３０が取り付けられている。液面レベルセンサ４３０は、第１タンク４１０における液面（水面）の高さを検出するように構成されている。液面レベルセンサ４３０としては、水位計等の公知の種々のセンサを用いることができる。 A liquid level sensor 430 is attached to the first tank 410 . The liquid level sensor 430 is configured to detect the height of the liquid level (water surface) in the first tank 410 . As the liquid level sensor 430, various known sensors such as a water gauge can be used.
　図４は、第１タンク４１０の平面を模式的に示す図である。図５は、図４のＶ－Ｖ断面を模式的に示す図である。図６は、図４のＶＩ－ＶＩ断面を模式的に示す図である。図４、図５及び図６に示されるように、第１タンク４１０は、第１タンク本体４１１と、接続口４１２，４１３，４１４と、仕切り板４１５とを含んでいる。 4 is a diagram schematically showing the plane of the first tank 410. FIG. FIG. 5 is a diagram schematically showing a VV cross section of FIG. FIG. 6 is a diagram schematically showing a VI-VI section of FIG. As shown in FIGS. 4, 5 and 6, the first tank 410 includes a first tank body 411, connection ports 412, 413, 414, and a partition plate 415. As shown in FIGS.
　第１タンク本体４１１は、例えば、金属製であり、円柱形状を有している。第１タンク本体４１１の上面には、接続口４１２が貫通している。接続口４１２には、搬送部７、検査テーブル１１及び配置部１４の各々に接続された配管が接続される。この配管は、吸引経路ＶＲ１の一部を構成する。なお、接続口４１２は、必ずしも第１タンク本体４１１の上面に設けられる必要はなく、例えば、第１タンク本体４１１の側面に設けられてもよい。また、第２水分離排出機構４２及び第３水分離排出機構４３の各々においては、切断テーブル５に接続された配管が接続口４１２に接続される。 The first tank body 411 is, for example, made of metal and has a cylindrical shape. A connection port 412 penetrates through the upper surface of the first tank body 411 . Pipes connected to each of the transport unit 7 , the inspection table 11 and the placement unit 14 are connected to the connection port 412 . This pipe constitutes a part of the suction route VR1. The connection port 412 does not necessarily have to be provided on the upper surface of the first tank body 411, and may be provided on the side surface of the first tank body 411, for example. Also, in each of the second water separation/discharge mechanism 42 and the third water separation/discharge mechanism 43 , a pipe connected to the cutting table 5 is connected to the connection port 412 .
　第１タンク本体４１１の側面には、接続口４１３が貫通している。接続口４１３には、真空ポンプＤ１に接続された配管が接続される。この配管は、吸引経路ＶＲ１の一部を構成する。なお、接続口４１３は、必ずしも第１タンク本体４１１の側面に設けられる必要はなく、例えば、第１タンク本体４１１の上面に設けられてもよい。また、第２水分離排出機構４２及び第３水分離排出機構４３においては、真空ポンプＤ２に接続された配管及び真空ポンプＤ３に接続された配管がそれぞれ接続口４１３に接続される。 A connection port 413 penetrates the side surface of the first tank main body 411 . A pipe connected to the vacuum pump D1 is connected to the connection port 413 . This pipe constitutes a part of the suction route VR1. The connection port 413 does not necessarily have to be provided on the side surface of the first tank main body 411, and may be provided on the upper surface of the first tank main body 411, for example. Further, in the second water separation/discharge mechanism 42 and the third water separation/discharge mechanism 43, a pipe connected to the vacuum pump D2 and a pipe connected to the vacuum pump D3 are connected to connection ports 413, respectively.
　第１タンク本体４１１の底面には、接続口４１４が貫通している。接続口４１４には、第２タンク４２０に接続された配管が接続される。この配管は、排水経路ＤＲ１の一部を構成する。第１タンク４１０は、接続口４１４を通じて第２タンク４２０へ排水する。 A connection port 414 penetrates through the bottom surface of the first tank body 411 . A pipe connected to the second tank 420 is connected to the connection port 414 . This pipe constitutes a part of the drainage route DR1. First tank 410 drains to second tank 420 through connection port 414 .
　仕切り板４１５は、例えば、金属製であり、矩形形状を有している。仕切り板４１５は、平面視における第１タンク本体４１１の中心を通る位置に立てられており、第１タンク本体４１１の底面から上方に向かって延びている。仕切り板４１５は、第１タンク本体４１１の内側側面及び内側底面の各々に複数の溶接部Ｗ１を介して接合されている。仕切り板４１５は、第１タンク４１０内において、接続口４１３が位置する領域と、接続口４１２が位置する領域とを仕切っている。すなわち、仕切り板４１５によって仕切られた一方の領域に接続口４１３が位置し、仕切り板４１５によって仕切られた他方の領域に接続口４１２が位置している。なお、互いに隣接する２つの溶接部Ｗ１の間には隙間が形成されているため、接続口４１２から浸入して下方に落下した水は、仕切り板４１５によって仕切られた２つの領域の両方に貯留される。 The partition plate 415 is, for example, made of metal and has a rectangular shape. The partition plate 415 is erected at a position passing through the center of the first tank body 411 in plan view, and extends upward from the bottom surface of the first tank body 411 . The partition plate 415 is joined to each of the inner side surface and the inner bottom surface of the first tank body 411 via a plurality of welded portions W1. The partition plate 415 partitions the area where the connection port 413 is located and the area where the connection port 412 is located in the first tank 410 . That is, the connection port 413 is located in one region partitioned by the partition plate 415 , and the connection port 412 is located in the other region partitioned by the partition plate 415 . Since a gap is formed between the two welded portions W1 adjacent to each other, the water that enters from the connection port 412 and falls downward is stored in both of the two regions partitioned by the partition plate 415. be done.
　第１タンク４１０において、仕切り板４１５の上方には隙間が形成されている。この例において、隙間の長さはＸ１である。仕切り板４１５の上方に隙間を形成することによって、真空ポンプＤ１の吸引によって生じる気流の経路が確保されている。また、接続口４１２の下端は、仕切り板４１５の上端よりも低い位置に存在している。この例において、接続口４１２の下端（側面に接続口４１２が設けられているときは、接続口４１２の先端の上端部分）は、仕切り板４１５の上端よりも長さＸ２低い位置に存在している。これにより、接続口４１２から浸入した水が接続口４１３に吸引されにくくなっている。 A gap is formed above the partition plate 415 in the first tank 410 . In this example, the gap length is X1. By forming a gap above the partition plate 415, a path for the airflow generated by the suction of the vacuum pump D1 is secured. Also, the lower end of the connection port 412 is positioned lower than the upper end of the partition plate 415 . In this example, the lower end of the connection port 412 (the upper end portion of the tip of the connection port 412 when the connection port 412 is provided on the side surface) is located at a position lower than the upper end of the partition plate 415 by the length X2. there is This makes it difficult for water entering from the connection port 412 to be sucked into the connection port 413 .
　再び図２及び図３を参照して、第２タンク４２０は、排水経路ＤＲ１において第１タンク４１０の下流に位置している。第２タンク４２０は、高さ方向（Ｚ軸方向（図１））において第１タンク４１０よりも低い位置に配置されている。したがって、吸引経路ＶＲ１に流入した水は、第１タンク４１０から第２タンク４２０へ重力に従って流入する。第２タンク４２０は、第１タンク４１０から流入する水を貯留するように構成されている。 With reference to FIGS. 2 and 3 again, the second tank 420 is located downstream of the first tank 410 in the drainage route DR1. The second tank 420 is arranged at a position lower than the first tank 410 in the height direction (Z-axis direction (FIG. 1)). Therefore, the water that has flowed into the suction path VR1 flows from the first tank 410 to the second tank 420 according to gravity. The second tank 420 is configured to store water flowing from the first tank 410 .
　排水経路ＤＲ１において、第１タンク４１０と第２タンク４２０との間にはバルブＶ１が設けられている。バルブＶ１は、開閉が可能である。バルブＶ１が開状態である場合には、第１タンク４１０に貯留された水が第２タンク４２０へ流入する。バルブＶ１が閉状態である場合には、第１タンク４１０に水が貯留され、第１タンク４１０から第２タンク４２０への水の流入が停止する。 A valve V1 is provided between the first tank 410 and the second tank 420 in the drainage path DR1. The valve V1 can be opened and closed. The water stored in the first tank 410 flows into the second tank 420 when the valve V1 is open. When the valve V1 is closed, water is stored in the first tank 410 and the inflow of water from the first tank 410 to the second tank 420 is stopped.
　バルブＶ１と第２タンク４２０との間において、排水経路ＤＲ１は分岐している。分岐先は、バルブＶ２を介して大気につながっている。バルブＶ２は、開閉が可能である。バルブＶ２が開状態である場合には、排水経路ＤＲ１内の圧力が大気圧となる。排水経路ＤＲ１において、第２タンク４２０の下流には、バルブＶ３が設けられている。バルブＶ３は、排水用弁であり、逆止弁で構成される。 The drainage path DR1 branches between the valve V1 and the second tank 420. The branch destination is connected to the atmosphere via a valve V2. The valve V2 can be opened and closed. When the valve V2 is open, the pressure in the drainage path DR1 becomes the atmospheric pressure. A valve V3 is provided downstream of the second tank 420 in the drainage path DR1. The valve V3 is a drain valve and is composed of a check valve.
　例えば、バルブＶ１が開状態であり、かつ、バルブＶ２が閉状態である場合には、排水経路ＤＲ１、第２タンク４２０及びバルブＶ３を含む範囲Ｚ１が真空状態となるため、バルブＶ３は自動的に閉状態になる。この場合には、吸引経路ＶＲ１に流入した水は、第１タンク４１０を通過して第２タンク４２０に貯留される。上述の第１状態とは、この状態のことをいい、バルブＶ１が開状態であり、かつ、バルブＶ２及びバルブＶ３が閉状態である状態のことをいう（図２参照）。 For example, when the valve V1 is open and the valve V2 is closed, the range Z1 including the drainage path DR1, the second tank 420 and the valve V3 is in a vacuum state, so the valve V3 is automatically closed. closed. In this case, the water that has flowed into the suction path VR1 passes through the first tank 410 and is stored in the second tank 420 . The first state described above refers to this state, in which the valve V1 is open and the valves V2 and V3 are closed (see FIG. 2).
　一方、バルブＶ１が閉状態であり、かつ、バルブＶ２が開状態である場合には、排水経路ＤＲ１、第２タンク４２０及びバルブＶ３を含まない範囲Ｚ２が真空状態となるため、バルブＶ３は自動的に開状態になる。この場合には、吸引経路ＶＲ１に流入した水は第１タンク４１０に貯留され、第２タンク４２０に貯留されていた水は水排出口を通じて切断装置１の外部に排出される。上述の第２状態とは、この状態のことをいい、バルブＶ１が閉状態であり、かつ、バルブＶ２及びバルブＶ３が開状態である状態のことをいう（図３参照）。 On the other hand, when the valve V1 is in the closed state and the valve V2 is in the open state, the range Z2 which does not include the drainage path DR1, the second tank 420 and the valve V3 is in a vacuum state. automatically open. In this case, the water flowing into the suction path VR1 is stored in the first tank 410, and the water stored in the second tank 420 is discharged to the outside of the cutting device 1 through the water discharge port. The above-mentioned second state refers to this state, in which the valve V1 is closed and the valves V2 and V3 are open (see FIG. 3).
　上述のように、第１水分離排出機構４１は、第１状態及び第２状態間で変化可能である。各バルブを制御することによる第１状態及び第２状態間の変更を適切なタイミングで行なうことによって、真空ポンプＤ１による電子部品Ｓ１の吸引を維持した状態で、排水を適切に行なうことができる。第１状態及び第２状態間の変更のタイミングについては後程説明する。 As described above, the first water separation and discharge mechanism 41 can change between the first state and the second state. By controlling each valve to change between the first state and the second state at an appropriate timing, it is possible to properly drain water while maintaining the suction of the electronic component S1 by the vacuum pump D1. The timing of changing between the first state and the second state will be described later.
　＜１－３．コンピュータのハードウェア構成＞
　図７は、コンピュータ５０のハードウェア構成を模式的に示す図である。図７に示されるように、コンピュータ５０は、制御部７０と、入出力Ｉ／Ｆ（interface）９０と、受付部９５と、記憶部８０とを含み、各構成は、バスを介して電気的に接続されている。 <1-3. Computer hardware configuration>
FIG. 7 is a diagram schematically showing the hardware configuration of the computer 50. As shown in FIG. As shown in FIG. 7, the computer 50 includes a control unit 70, an input/output I/F (interface) 90, a reception unit 95, and a storage unit 80. Each component is electrically connected via a bus. It is connected to the.
　制御部７０は、ＣＰＵ（Central Processing Unit）７２、ＲＡＭ（Random Access Memory）７４及びＲＯＭ（Read Only Memory）７６等を含んでいる。制御部７０は、情報処理に応じて、コンピュータ５０内の各構成要素及び切断装置１内の各構成要素を制御するように構成されている。 The control unit 70 includes a CPU (Central Processing Unit) 72, a RAM (Random Access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting apparatus 1 according to information processing.
　入出力Ｉ／Ｆ９０は、信号線を介して、切断装置１に含まれる各構成要素と通信するように構成されている。入出力Ｉ／Ｆ９０は、コンピュータ５０から切断装置１内の各構成要素へのデータの送信、切断装置１内の各構成要素からコンピュータ５０へ送信されるデータの受信に用いられる。受付部９５は、ユーザからの指示を受け付けるように構成されている。受付部９５は、例えば、タッチパネル、キーボード、マウス及びマイクの一部又は全部で構成される。 The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The input/output I/F 90 is used for transmitting data from the computer 50 to each component within the cutting device 1 and for receiving data transmitted from each component within the cutting device 1 to the computer 50 . The receiving unit 95 is configured to receive instructions from the user. The reception unit 95 is composed of, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.
　記憶部８０は、例えば、ハードディスクドライブ、ソリッドステートドライブ等の補助記憶装置である。記憶部８０は、例えば、制御プログラム８１を記憶するように構成されている。制御プログラム８１が制御部７０によって実行されることにより、切断装置１における各種動作が実現される。制御部７０が制御プログラム８１を実行する場合に、制御プログラム８１は、ＲＡＭ７４に展開される。そして、制御部７０は、ＲＡＭ７４に展開された制御プログラム８１をＣＰＵ７２によって解釈及び実行することにより各構成要素を制御する。 The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or solid state drive. The storage unit 80 is configured to store a control program 81, for example. Various operations in the cutting apparatus 1 are realized by the control program 81 being executed by the control unit 70 . When the control unit 70 executes the control program 81 , the control program 81 is developed in the RAM 74 . The control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 developed in the RAM 74 .
　［２．動作］
　＜２－１．第１水分離排出機構における排水動作＞
　図８は、第１水分離排出機構４１における排水手順の一例を示すフローチャートである。このフローチャートに示される処理は、第１水分離排出機構４１が第２状態（図３）である場合にコンピュータ５０の制御部７０によって実行される。なお、このフローチャートに示される処理は、１枚のパッケージ基板Ｐ１の処理が完了する毎に行なわれる。 [2. motion]
<2-1. Drainage operation in the first water separation and discharge mechanism>
FIG. 8 is a flow chart showing an example of a drainage procedure in the first water separation and drainage mechanism 41. As shown in FIG. The processing shown in this flowchart is executed by the control section 70 of the computer 50 when the first water separation/discharge mechanism 41 is in the second state (FIG. 3). The processing shown in this flow chart is performed each time the processing of one package substrate P1 is completed.
　図８を参照して、制御部７０は、切断テーブル５に吸着された電子部品Ｓ１のボール／リード面の第１クリーナ５ｅによるクリーニング（洗浄）が完了したか否かを判定する（ステップＳ１００）。ボール／リード面のクリーニングが完了していないと判定されると（ステップＳ１００においてＮＯ）、制御部７０は、ボール／リード面のクリーニングが完了するまで待機する。 Referring to FIG. 8, control unit 70 determines whether or not the ball/lead surface of electronic component S1 attracted to cutting table 5 has been completely cleaned (washed) by first cleaner 5e (step S100). . If it is determined that the cleaning of the ball/lead surface is not completed (NO in step S100), control unit 70 waits until the cleaning of the ball/lead surface is completed.
　一方、ボール／リード面のクリーニングが完了したと判定されると（ステップＳ１００においてＹＥＳ）、制御部７０は、第１水分離排出機構４１が第２状態から第１状態へ変化するようにバルブＶ１，Ｖ２の各々を制御する（ステップＳ１１０）。すなわち、制御部７０は、閉状態から開状態へ切り替わるようにバルブＶ１を制御すると共に、開状態から閉状態へ切り替わるようにバルブＶ２を制御する。これにより、バルブＶ３は閉状態となり、第２クリーナ７ａによるクリーニングによって搬送部７から吸引経路ＶＲ１に水が浸入する前に、真空ポンプＤ１による電子部品Ｓ１の吸引を維持した状態で、第１水分離排出機構４１において貯留可能な水の量を増やすことができる。なお、バルブＶ１における状態の切替えとバルブＶ２における状態の切替えとは同時に行なわれる。 On the other hand, when it is determined that the cleaning of the ball/lead surface has been completed (YES in step S100), the control unit 70 closes the valve V1 so that the first water separation/discharge mechanism 41 changes from the second state to the first state. , V2 (step S110). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state. As a result, the valve V3 is closed, and before water enters the suction path VR1 from the conveying unit 7 due to cleaning by the second cleaner 7a, the first water is supplied while the electronic component S1 is being sucked by the vacuum pump D1. The amount of water that can be stored in the separation and discharge mechanism 41 can be increased. The switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
　その後、制御部７０は、搬送部７に吸着された電子部品Ｓ１のモールド面（切断面と反対の面）の第２クリーナ７ａによるクリーニングが完了し、搬送部７のＺ軸（図１）方向における上昇が完了したか否かを判定する（ステップＳ１２０）。第２クリーナ７ａによるクリーニング、及び、搬送部７の上昇が完了していないと判定されると（ステップＳ１２０においてＮＯ）、制御部７０は、第２クリーナ７ａによるクリーニング、及び、搬送部７の上昇が完了するまで待機する。第２クリーナ７ａによるクリーニング、及び、搬送部７の上昇が完了したタイミングは、第１水分離排出機構４１において、第２タンク４２０に最も水が溜まっており、かつ、第１タンク４１０に水が溜まりにくいタイミングである。 After that, the control unit 70 completes the cleaning of the mold surface (surface opposite to the cutting surface) of the electronic component S1 sucked by the conveying unit 7 by the second cleaner 7a, and moves the conveying unit 7 in the Z-axis (FIG. 1) direction. is completed (step S120). When it is determined that the cleaning by the second cleaner 7a and the lifting of the conveying section 7 are not completed (NO in step S120), the control section 70 causes the cleaning by the second cleaner 7a and the lifting of the conveying section 7 to be completed. wait until is completed. At the timing when the cleaning by the second cleaner 7a and the lifting of the conveying unit 7 are completed, the second tank 420 in the first water separation/discharge mechanism 41 is filled with the most water, and the first tank 410 is filled with water. It is a difficult timing.
　一方、第２クリーナ７ａによるクリーニング、及び、搬送部７の上昇が完了したと判定されると（ステップＳ１２０においてＹＥＳ）、制御部７０は、第１水分離排出機構４１が第１状態から第２状態へ変化するようにバルブＶ１，Ｖ２の各々を制御する（ステップＳ１３０）。すなわち、制御部７０は、開状態から閉状態へ切り替わるようにバルブＶ１を制御すると共に、閉状態から開状態へ切り替わるようにバルブＶ２を制御する。これにより、バルブＶ３は開状態となり、搬送部７に吸着された状態における水を用いた最後の処理が電子部品Ｓ１に施された後に、第２タンク４２０に貯留された水を、真空ポンプＤ１による電子部品Ｓ１の吸引を維持した状態で、切断装置１の外部に排出することができる。なお、バルブＶ１における状態の切替えとバルブＶ２における状態の切替えとは同時に行なわれる。 On the other hand, when it is determined that the cleaning by the second cleaner 7a and the lifting of the conveying unit 7 are completed (YES in step S120), the control unit 70 causes the first water separating/discharging mechanism 41 to move from the first state to the second state. Each of the valves V1 and V2 is controlled to change to the state (step S130). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state. As a result, the valve V3 is opened, and the water stored in the second tank 420 is discharged from the vacuum pump D1 after the electronic component S1 has been subjected to the final treatment using the water adsorbed by the conveying unit 7. It is possible to discharge the electronic component S1 to the outside of the cutting device 1 while maintaining the suction of the electronic component S1. The switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
　＜２－２．第２及び第３水分離排出機構における排水動作＞
　第２水分離排出機構４２及び第３水分離排出機構４３の排水手順は実質的に同一である。以下では、代表的に、第２水分離排出機構４２における排水手順について説明する。 <2-2. Drainage operation in the second and third water separation and discharge mechanisms>
The drainage procedures of the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 are substantially the same. Below, the drainage procedure in the second water separation/discharge mechanism 42 will be described as a representative example.
　図９は、第２水分離排出機構４２における排水手順の一例を示すフローチャートである。このフローチャートに示される処理は、第２水分離排出機構４２が第２状態である場合にコンピュータ５０の制御部７０によって実行される。なお、このフローチャートに示される処理は、１枚のパッケージ基板Ｐ１の処理が完了する毎に行なわれる。 FIG. 9 is a flow chart showing an example of the drainage procedure in the second water separation and drainage mechanism 42. FIG. The processing shown in this flowchart is executed by the control section 70 of the computer 50 when the second water separation/discharge mechanism 42 is in the second state. The processing shown in this flow chart is performed each time the processing of one package substrate P1 is completed.
　図９を参照して、制御部７０は、切断テーブル５上にパッケージ基板Ｐ１が載置されたか否かを判定する（ステップＳ２００）。切断テーブル５上にパッケージ基板Ｐ１が載置されていないと判定されると（ステップＳ２００においてＮＯ）、制御部７０は、切断テーブル５上にパッケージ基板Ｐ１が載置されるまで待機する。 9, the control unit 70 determines whether or not the package substrate P1 is placed on the cutting table 5 (step S200). If it is determined that package substrate P1 is not placed on cutting table 5 (NO in step S200), control unit 70 waits until package substrate P1 is placed on cutting table 5. FIG.
　一方、切断テーブル５上にパッケージ基板Ｐ１が載置されたと判定されると（ステップＳ２００においてＹＥＳ）、制御部７０は、第２水分離排出機構４２が第２状態から第１状態へ変化するようにバルブＶ１，Ｖ２の各々を制御する（ステップＳ２１０）。すなわち、制御部７０は、閉状態から開状態へ切り替わるようにバルブＶ１を制御すると共に、開状態から閉状態へ切り替わるようにバルブＶ２を制御する。これにより、バルブＶ３は閉状態となり、切削水、冷却水及び洗浄水が切断テーブル５から吸引経路ＶＲ２へ浸入する前に、真空ポンプＤ２による電子部品Ｓ１の吸引を維持した状態で、第２水分離排出機構４２において貯留可能な水の量を増やすことができる。なお、バルブＶ１における状態の切替えとバルブＶ２における状態の切替えとは同時に行なわれる。 On the other hand, when it is determined that the package substrate P1 is placed on the cutting table 5 (YES in step S200), the control unit 70 causes the second water separation/discharge mechanism 42 to change from the second state to the first state. , the valves V1 and V2 are respectively controlled (step S210). That is, the control unit 70 controls the valve V1 to switch from the closed state to the open state, and controls the valve V2 to switch from the open state to the closed state. As a result, the valve V3 is closed, and before the cutting water, cooling water, and cleaning water enter the suction path VR2 from the cutting table 5, the vacuum pump D2 continues to suck the electronic component S1, and the second water The amount of water that can be stored in the separation and discharge mechanism 42 can be increased. The switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
　その後、制御部７０は、切断テーブル５に吸着された電子部品Ｓ１のボール／リード面の第１クリーナ５ｅによるクリーニング（洗浄）が完了したか否かを判定する（ステップＳ２２０）。ボール／リード面のクリーニングが完了していないと判定されると（ステップＳ２２０においてＮＯ）、制御部７０は、ボール／リード面のクリーニングが完了するまで待機する。電子部品Ｓ１のボール／リード面の第１クリーナ５ｅによるクリーニングが完了したタイミングは、第２水分離排出機構４２において、第２タンク４２０に最も水が溜まっており、かつ、第１タンク４１０に水が溜まりにくいタイミングである。 After that, the control unit 70 determines whether or not the ball/lead surface of the electronic component S1 attracted to the cutting table 5 has been cleaned (washed) by the first cleaner 5e (step S220). If it is determined that the cleaning of the ball/lead surface is not completed (NO in step S220), control unit 70 waits until the cleaning of the ball/lead surface is completed. At the timing when the cleaning of the ball/lead surface of the electronic component S1 by the first cleaner 5e is completed, in the second water separation/discharge mechanism 42, the second tank 420 is filled with the most water, and the first tank 410 is filled with water. It's the timing when it's hard to collect.
　一方、ボール／リード面のクリーニングが完了したと判定されると（ステップＳ２２０においてＹＥＳ）、制御部７０は、第２水分離排出機構４２が第１状態から第２状態へ変化するようにバルブＶ１，Ｖ２の各々を制御する（ステップＳ２３０）。すなわち、制御部７０は、開状態から閉状態へ切り替わるようにバルブＶ１を制御すると共に、閉状態から開状態へ切り替わるようにバルブＶ２を制御する。これにより、バルブＶ３は開状態となり、切断テーブル５に吸着された状態における水を用いた最後の処理が電子部品Ｓ１に施された後に、第２タンク４２０に貯留された水を、真空ポンプＤ２による電子部品Ｓ１の吸引を維持した状態で、切断装置１の外部に排出することができる。なお、バルブＶ１における状態の切替えとバルブＶ２における状態の切替えとは同時に行なわれる。 On the other hand, if it is determined that the cleaning of the ball/lead surface has been completed (YES in step S220), control unit 70 closes valve V1 so that second water separation/discharge mechanism 42 changes from the first state to the second state. , V2 (step S230). That is, the control unit 70 controls the valve V1 to switch from the open state to the closed state, and controls the valve V2 to switch from the closed state to the open state. As a result, the valve V3 is opened, and after the electronic component S1 is subjected to the final treatment using the water adsorbed on the cutting table 5, the water stored in the second tank 420 is discharged by the vacuum pump D2. It is possible to discharge the electronic component S1 to the outside of the cutting device 1 while maintaining the suction of the electronic component S1. The switching of the state of the valve V1 and the switching of the state of the valve V2 are performed at the same time.
　＜２－３．排水不良時における動作＞
　第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、排水不良が生じた場合に共通の動作を行なう。以下では、代表的に、第１水分離排出機構４１における排水不良時の動作について説明する。 <2-3. Operation at the time of poor drainage>
Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 performs a common operation when drainage failure occurs. Below, the operation of the first water separation/discharge mechanism 41 at the time of poor drainage will be described as a representative example.
　図１０は、第１水分離排出機構４１における排水不良時の動作手順の一例を示すフローチャートである。このフローチャートに示される処理は、切断装置１の動作時にコンピュータ５０の制御部７０によって実行される。 FIG. 10 is a flow chart showing an example of the operation procedure when the first water separation/discharge mechanism 41 has poor drainage. The processing shown in this flowchart is executed by the control section 70 of the computer 50 when the cutting device 1 is in operation.
　図１０を参照して、制御部７０は、液面レベルセンサ４３０の出力を参照することによって、第１タンク４１０における液面（水面）の高さが所定高さ以上であるか否かを判定する（ステップＳ３００）。第１タンク４１０における液面の高さが所定高さ未満であると判定されると（ステップＳ３００においてＮＯ）、制御部７０は、ステップＳ３００における判定を継続する。 Referring to FIG. 10, control unit 70 refers to the output of liquid level sensor 430 to determine whether the height of the liquid level (water surface) in first tank 410 is equal to or higher than a predetermined height. (step S300). When it is determined that the liquid level in first tank 410 is less than the predetermined height (NO in step S300), control unit 70 continues the determination in step S300.
　一方、第１タンク４１０における液面の高さが所定高さ以上であると判定されると（ステップＳ３００においてＹＥＳ）、制御部７０は、警告音を出力するように音出力部２５を制御する（ステップＳ３１０）。警告音を聞くことによって、作業者は、第１水分離排出機構４１において排水不良が生じていることを認識することができる。 On the other hand, when it is determined that the liquid level in first tank 410 is equal to or higher than the predetermined height (YES in step S300), control unit 70 controls sound output unit 25 to output a warning sound. (Step S310). By hearing the warning sound, the operator can recognize that the first water separation/discharge mechanism 41 has a drainage failure.
　［３．特徴］
　以上のように、本実施の形態に従う切断装置１において、第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、第１タンク４１０から第２タンク４２０へ流入した水が第２タンク４２０に貯留される第１状態と、第１タンク４１０に水が貯留され第２タンク４２０に貯留された水が切断装置１の外部へ排出される第２状態との間で変化可能である。したがって、この切断装置１によれば、各水分離排出機構の状態を適切に変更することによって、電子部品Ｓ１等の基板の吸着を維持しつつ、各真空ポンプへの水の浸入を抑制することができる。 [3. feature]
As described above, in the cutting device 1 according to the present embodiment, each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 is connected from the first tank 410 to the second tank. A first state in which the water that has flowed into 420 is stored in the second tank 420, and a second state in which the water stored in the first tank 410 and the water stored in the second tank 420 is discharged to the outside of the cutting device 1. can vary between Therefore, according to this cutting apparatus 1, by appropriately changing the state of each water separation and discharge mechanism, it is possible to suppress the entry of water into each vacuum pump while maintaining the adsorption of the substrate such as the electronic component S1. can be done.
　また、第１タンク４１０においては、真空ポンプＤ１，Ｄ２又はＤ３につながる接続口４１３が位置する領域と、電子部品Ｓ１又はパッケージ基板Ｐ１を吸着する経路がつながる接続口４１２が位置する領域とが仕切り板４１５で区切られており、仕切り板４１５の両領域において貯水が可能である。そして、仕切り板４１５の上方には隙間が形成されている。本実施の形態に従う切断装置１によれば、このような簡単な構成により、吸気から水を分離することができる。さらに、１枚のパッケージ基板Ｐ１の処理が完了する毎に第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々における排水処理を行なうことによって、第１タンク４１０及び第２タンク４２０の容量をできるだけ小さくすることができる。 In the first tank 410, a region where the connection port 413 connected to the vacuum pump D1, D2 or D3 is located and a region where the connection port 412 where the path for sucking the electronic component S1 or the package substrate P1 is located are partitioned. It is separated by a plate 415 and water can be stored in both areas of the partition plate 415 . A gap is formed above the partition plate 415 . According to the cutting device 1 according to the present embodiment, water can be separated from intake air with such a simple configuration. Further, by performing waste water treatment in each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 each time the treatment of one package substrate P1 is completed, the first The volumes of the tank 410 and the second tank 420 can be made as small as possible.
　なお、パッケージ基板Ｐ１及び電子部品Ｓ１の各々は、本発明における「切断対象物」の一例である。切断テーブル５は、本発明における「テーブル」の一例である。スピンドル部６は、本発明における「切断機構」の一例である。搬送部７は、本発明における「保持機構」の一例である。吸引経路ＶＲ１，ＶＲ２，ＶＲ３の各々は、本発明における「吸引経路」の一例である。真空ポンプＤ１，Ｄ２，Ｄ３の各々は、本発明における「真空ポンプ」の一例である。排水経路ＤＲ１は、本発明における「排水経路」の一例である。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、本発明における「水分離排出機構」の一例である。第１タンク４１０は本発明における「第１タンク」の一例であり、第２タンク４２０は本発明における「第２タンク」の一例である。仕切り板４１５は、本発明における「仕切り板」の一例である。バルブＶ１，Ｖ２，Ｖ３を含む構成は、本発明における「弁機構」の一例である。コンピュータ５０の制御部７０は、本発明における「制御部」の一例である。バルブＶ３は、本発明における「排水用弁」の一例である。 Each of the package substrate P1 and the electronic component S1 is an example of the "cutting object" in the present invention. The cutting table 5 is an example of a "table" in the present invention. The spindle section 6 is an example of a "cutting mechanism" in the present invention. The conveying section 7 is an example of a "holding mechanism" in the present invention. Each of the suction paths VR1, VR2, VR3 is an example of the "suction path" in the present invention. Each of the vacuum pumps D1, D2, D3 is an example of the "vacuum pump" in the present invention. Drainage route DR1 is an example of a "drainage route" in the present invention. Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 is an example of the "water separation/discharge mechanism" in the present invention. The first tank 410 is an example of the "first tank" in the present invention, and the second tank 420 is an example of the "second tank" in the present invention. The partition plate 415 is an example of the "partition plate" in the present invention. A configuration including valves V1, V2, and V3 is an example of a "valve mechanism" in the present invention. The controller 70 of the computer 50 is an example of the "controller" in the present invention. The valve V3 is an example of a "drainage valve" in the present invention.
　［４．他の実施の形態］
　上記実施の形態の思想は、以上で説明された実施の形態に限定されない。以下、上記実施の形態の思想を適用できる他の実施の形態の一例について説明する。 [4. Other embodiments]
The idea of the above embodiments is not limited to the embodiments described above. An example of another embodiment to which the concept of the above embodiment can be applied will be described below.
　＜４－１＞
　上記実施の形態に従う切断装置１において、第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、バルブＶ１，Ｖ２を含んでいた。しかしながら、第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、必ずしもバルブＶ１，Ｖ２を含んでいなくてもよい。第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々は、例えば、第１タンク４１０から第２タンク４２０へ流入した水が第２タンク４２０に貯留される第１状態と、第１タンク４１０に水が貯留され第２タンク４２０に貯留された水が排出される第２状態とを変更する弁機構を含んでいればよい。このような弁機構としては、例えば、三方弁が挙げられる。以下では、第１水分離排出機構４１の他の例について説明する。 <4-1>
In cutting device 1 according to the above embodiment, first water separation/discharge mechanism 41, second water separation/discharge mechanism 42, and third water separation/discharge mechanism 43 each include valves V1 and V2. However, each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 does not necessarily include the valves V1 and V2. Each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43 stores, for example, the water flowing from the first tank 410 to the second tank 420 in the second tank 420. and a second state in which water is stored in the first tank 410 and water stored in the second tank 420 is discharged. Such a valve mechanism includes, for example, a three-way valve. Other examples of the first water separation/discharge mechanism 41 will be described below.
　図１１は、第１状態における第１水分離排出機構４１Ａを模式的に示す図である。図１２は、第２状態における第１水分離排出機構４１Ａを模式的に示す図である。図１１及び図１２に示されるように、第１水分離排出機構４１Ａにおいては、第１タンク４１０と第２タンク４２０との間に三方弁ＶＡが設けられている。三方弁ＶＡは、第１タンク４１０と第２タンク４２０とが貫通した状態（図１１）と、第２タンク４２０と大気とが貫通した状態（図１２）とを変更することができる。すなわち、三方弁ＶＡは、第１タンク４１０から第２タンク４２０へ水を排出し第２タンク４２０において水を貯留する第１状態（図１１）と、第１タンク４１０に水を貯留し第２タンク４２０に貯留された水を排出する第２状態（図１２）とを変更することができる。上記実施の形態に従う切断装置１において、バルブＶ１，Ｖ２の代わりに三方弁ＶＡが用いられてもよい。なお、第１状態においては範囲Ｚ３が真空状態となっており、第２状態において範囲Ｚ４が真空状態となっている。 FIG. 11 is a diagram schematically showing the first water separation/discharge mechanism 41A in the first state. FIG. 12 is a diagram schematically showing the first water separation/discharge mechanism 41A in the second state. As shown in FIGS. 11 and 12, a three-way valve VA is provided between the first tank 410 and the second tank 420 in the first water separation/discharge mechanism 41A. The three-way valve VA can change between a state in which the first tank 410 and the second tank 420 penetrate (FIG. 11) and a state in which the second tank 420 and the atmosphere penetrate (FIG. 12). That is, the three-way valve VA discharges water from the first tank 410 to the second tank 420 and stores water in the second tank 420 in a first state (FIG. 11), and stores water in the first tank 410 in a second state. The second state (FIG. 12) in which the water stored in the tank 420 is discharged can be changed. In the cutting device 1 according to the above embodiment, a three-way valve VA may be used instead of the valves V1 and V2. Note that the range Z3 is in a vacuum state in the first state, and the range Z4 is in a vacuum state in the second state.
　＜４－２＞
　また、上記実施の形態に従う切断装置１においては、吸引経路ＶＲ１，ＶＲ２，ＶＲ３に第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３がそれぞれ設けられた。しかしながら、必ずしも各吸引経路に水分離排出機構が設けられなくてもよい。例えば、真空ポンプＤ２，Ｄ３としては水封式の真空ポンプが用いられ、吸引経路ＶＲ２，ＶＲ３の各々には水分離排出機構が設けられなくてもよい。また、例えば、真空ポンプＤ１としては水封式の真空ポンプが用いられ、吸引経路ＶＲ１には水分離排出機構が設けられなくてもよい。 <4-2>
Further, in the cutting device 1 according to the above embodiment, the suction paths VR1, VR2, VR3 are provided with the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43, respectively. However, each suction path does not necessarily have to be provided with a water separation and discharge mechanism. For example, a water seal type vacuum pump may be used as the vacuum pumps D2 and D3, and the suction paths VR2 and VR3 may not be provided with water separation and discharge mechanisms. Further, for example, a water-sealed vacuum pump may be used as the vacuum pump D1, and the suction path VR1 may not be provided with a water separation and discharge mechanism.
　＜４－３＞
　また、上記実施の形態に従う切断装置１においては、第１水分離排出機構４１、第２水分離排出機構４２及び第３水分離排出機構４３の各々が含むバルブＶ３として逆止弁が用いられた。しかしながら、バルブＶ３は、必ずしも逆止弁である必要はない。バルブＶ３は、開閉弁（いわゆるストップ弁）で構成されてもよい。この場合には、例えば、第２タンク４２０に水を貯留するときにバルブＶ３が閉状態に制御され、第２タンク４２０から水を排出するときにバルブＶ３が開状態に制御される。 <4-3>
Further, in the cutting device 1 according to the above embodiment, a check valve is used as the valve V3 included in each of the first water separation/discharge mechanism 41, the second water separation/discharge mechanism 42, and the third water separation/discharge mechanism 43. . However, valve V3 need not necessarily be a check valve. The valve V3 may be composed of an on-off valve (so-called stop valve). In this case, for example, when water is stored in the second tank 420, the valve V3 is controlled to be closed, and when water is discharged from the second tank 420, the valve V3 is controlled to be open.
　＜４－４＞
　また、大気につながるバルブＶ２は、バルブＶ１と第２タンク４２０との間において排水経路ＤＲ１を分岐させた経路に設けられていた。しかしながら、バルブＶ２は、排水経路ＤＲ１において、バルブＶ１の下流（より具体的には、第２タンク４２０内）を大気圧とすることができる箇所に設けられていればよく、必ずしも排水経路ＤＲ１を分岐させて設けなくてもよい。例えば、第２タンク４２０の上面に配管を接続し、この配管にバルブＶ２を備えてもよい。 <4-4>
Also, the valve V2 leading to the atmosphere is provided in a path branched from the drainage path DR1 between the valve V1 and the second tank 420 . However, the valve V2 may be provided at a location in the drainage path DR1 where the pressure downstream of the valve V1 (more specifically, inside the second tank 420) can be brought to the atmospheric pressure. It does not have to be branched. For example, a pipe may be connected to the upper surface of the second tank 420 and the valve V2 may be provided in this pipe.
　＜４－５＞
　また、上記実施の形態に従う切断装置１においては、第１タンク４１０における水面の高さが所定高さ以上となった場合に警告音が発せられた。しかしながら、第１タンク４１０における水面の高さが所定高さ以上となった場合に必ずしも警告音が発せられなくてもよい。例えば、第１タンク４１０における水面の高さが所定高さ以上となった場合に、切断装置１が強制的に停止されてもよい。これにより、第１タンク４１０において水が溢れる事態の発生を抑制することができる。 <4-5>
Further, in cutting device 1 according to the above-described embodiment, a warning sound is emitted when the height of the water surface in first tank 410 reaches or exceeds a predetermined height. However, when the height of the water surface in the first tank 410 reaches or exceeds a predetermined height, the warning sound does not necessarily have to be emitted. For example, the cutting device 1 may be forcibly stopped when the height of the water surface in the first tank 410 reaches or exceeds a predetermined height. As a result, it is possible to prevent the first tank 410 from overflowing with water.
　＜４－６＞
　また、上記実施の形態においては、図８のステップＳ１００において、第１クリーナ５ｅによるクリーニング（洗浄）が完了したか否かが判定された。しかしながら、図８のステップＳ１００においては、第１クリーナ５ｅによる乾燥が完了したか否かが判定されてもよい。そして、乾燥が完了したと判定された場合に、第１水分離排出機構４１が第２状態から第１状態へ変更されてもよい。また、図８のステップＳ１２０においては、第２クリーナ７ａによる乾燥が完了したか否かが判定されてもよい。そして、乾燥が完了したと判定された場合に、第１水分離排出機構４１が第１状態から第２状態へ変更されてもよい。また、図９のステップＳ２２０においては、電子部品Ｓ１のボール／リード面の第１クリーナ５ｅによるクリーニング（洗浄）が完了したか否か判定された。しかしながら、図９のステップＳ２２０においては、第１クリーナ５ｅによる乾燥が完了したか否かが判定されてもよい。そして、乾燥が完了したと判定された場合に、第１水分離排出機構４１が第１状態から第２状態へ変更されてもよい。 <4-6>
Further, in the above embodiment, it is determined in step S100 of FIG. 8 whether or not the cleaning (washing) by the first cleaner 5e has been completed. However, in step S100 of FIG. 8, it may be determined whether the drying by the first cleaner 5e is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the second state to the first state. Further, in step S120 of FIG. 8, it may be determined whether drying by the second cleaner 7a is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the first state to the second state. Further, in step S220 of FIG. 9, it is determined whether or not the cleaning (washing) of the ball/lead surfaces of the electronic component S1 by the first cleaner 5e has been completed. However, in step S220 of FIG. 9, it may be determined whether the drying by the first cleaner 5e is completed. Then, when it is determined that the drying is completed, the first water separation/discharge mechanism 41 may be changed from the first state to the second state.
　＜４－７＞
　また、上記実施の形態に従う切断装置１においては、各水分離排出機構に含まれるバルブＶ１，Ｖ２の状態を切り替える場合に、バルブＶ１，Ｖ２の状態が同時に切り替えられた。しかしながら、バルブＶ１，Ｖ２の状態は、必ずしも同時に切り替えられなくてもよい。例えば、各水分離排出機構の状態を第１状態から第２状態へ切り替える場合には、バルブＶ１が開状態から閉状態へ切り替えられ、その後、バルブＶ２が閉状態から開状態へ切り替えられてもよい。また、例えば、各水分離排出機構の状態を第２状態から第１状態へ切り替える場合には、バルブＶ２が開状態から閉状態へ切り替えられ、その後、バルブＶ１が閉状態から開状態へ切り替えられてもよい。 <4-7>
Further, in the cutting device 1 according to the above-described embodiment, when switching the states of the valves V1 and V2 included in each water separation and discharge mechanism, the states of the valves V1 and V2 are switched at the same time. However, the states of valves V1 and V2 do not necessarily have to be switched at the same time. For example, when switching the state of each water separation and discharge mechanism from the first state to the second state, the valve V1 is switched from the open state to the closed state, and then the valve V2 is switched from the closed state to the open state. good. Further, for example, when switching the state of each water separation and discharge mechanism from the second state to the first state, the valve V2 is switched from the open state to the closed state, and then the valve V1 is switched from the closed state to the open state. may
　以上、本発明の実施の形態について例示的に説明した。すなわち、例示的な説明のために、詳細な説明及び添付の図面が開示された。よって、詳細な説明及び添付の図面に記載された構成要素の中には、課題解決のために必須でない構成要素が含まれることがある。したがって、それらの必須でない構成要素が詳細な説明及び添付の図面に記載されているからといって、それらの必須でない構成要素が必須であると直ちに認定されるべきではない。 The embodiment of the present invention has been exemplified above. Accordingly, the detailed description and accompanying drawings have been disclosed for the purpose of illustrative description. Therefore, the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, the inclusion of such non-essential elements in the detailed description and accompanying drawings should not be construed as immediately identifying them as essential.
　また、上記実施の形態は、あらゆる点において本発明の例示にすぎない。上記実施の形態は、本発明の範囲内において、種々の改良や変更が可能である。すなわち、本発明の実施にあたっては、実施の形態に応じて具体的構成を適宜採用することができる。 Also, the above-described embodiment is merely an example of the present invention in all respects. Various improvements and modifications can be made to the above embodiment within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.
　１　切断装置、３　基板供給部、４　位置決め部、４ａ　レール部、５　切断テーブル、５ａ　保持部材、５ｂ　回転機構、５ｃ　移動機構、５ｄ　第１位置確認カメラ、５ｅ　第１クリーナ、６　スピンドル部、６ａ　ブレード、６ｂ　第２位置確認カメラ、６ｃ　回転軸、７　搬送部、７ａ　第２クリーナ、１１　検査テーブル、１２　第１光学検査カメラ、１３　第２光学検査カメラ、１４　配置部、１５　抽出部、１５ａ　良品用トレイ、１５ｂ　不良品用トレイ、２０　モニタ、２５　音出力部、４１，４１Ａ　第１水分離排出機構、４２　第２水分離排出機構、４３　第３水分離排出機構、５０　コンピュータ、７０　制御部、７２　ＣＰＵ、７４　ＲＡＭ、７６　ＲＯＭ、８０　記憶部、８１　制御プログラム、９０　入出力Ｉ／Ｆ、４１０　第１タンク、４１１　第１タンク本体、４１２，４１３，４１４　接続口、４１５　仕切り板、４２０　第２タンク、４３０　液面レベルセンサ、Ａ１　切断モジュール、Ｂ１　検査・収納モジュール、Ｄ１，Ｄ２，Ｄ３　真空ポンプ、ＤＲ１　排水経路、Ｍ１　マガジン、Ｐ１　パッケージ基板、Ｓ１　電子部品、Ｖ１，Ｖ２，Ｖ３　バルブ、ＶＡ　三方弁、ＶＲ１，ＶＲ２，ＶＲ３　吸引経路、Ｗ１　溶接部、Ｚ１，Ｚ２，Ｚ３，Ｚ４　範囲。

  Reference Signs List 1 cutting device 3 substrate supply unit 4 positioning unit 4a rail unit 5 cutting table 5a holding member 5b rotating mechanism 5c moving mechanism 5d first position confirmation camera 5e first cleaner 6 spindle unit 6a Blade 6b Second position confirmation camera 6c Rotating shaft 7 Conveying unit 7a Second cleaner 11 Inspection table 12 First optical inspection camera 13 Second optical inspection camera 14 Placement unit 15 Extraction unit 15a Non-defective product tray, 15b tray for defective products, 20 monitor, 25 sound output unit, 41, 41A first water separation and discharge mechanism, 42 second water separation and discharge mechanism, 43 third water separation and discharge mechanism, 50 computer, 70 control unit, 72 CPU, 74 RAM, 76 ROM, 80 storage unit, 81 control program, 90 input/output I/F, 410 first tank, 411 first tank body, 412, 413, 414 connection port, 415 partition plate, 420 second second Tank, 430 liquid level sensor, A1 cutting module, B1 inspection/storage module, D1, D2, D3 vacuum pump, DR1 drainage path, M1 magazine, P1 package substrate, S1 electronic component, V1, V2, V3 valve, VA three-way valve, VR1, VR2, VR3 suction path, W1 weld, Z1, Z2, Z3, Z4 range.

Claims (6)

  1. 　切断対象物を吸着することによって前記切断対象物を保持するテーブルと、
    　前記テーブル上の前記切断対象物を切断することによって前記切断対象物を個片化する切断機構と、
    　個片化された前記切断対象物を吸着することによって前記切断対象物を保持する保持機構とを備え、
    　前記テーブル又は前記保持機構は、吸引経路を通じてドライ式の真空ポンプに接続されており、
    　前記吸引経路上に位置し、排水経路を通じて水を排出する水分離排出機構をさらに備え、
    　前記水分離排出機構は、
    　第１タンクと、
    　前記排水経路において前記第１タンクよりも下流に位置する第２タンクとを含み、
    　前記第１タンクは、前記真空ポンプとの接続口が位置する領域と、前記テーブル又は前記保持機構との接続口が位置する領域とを仕切る仕切り板を含み、
    　前記第１タンクにおいて、前記仕切り板の上方には隙間が形成されており、
    　前記水分離排出機構は、前記第１タンクから前記第２タンクへ流入した水が前記第２タンクに貯留される第１状態と、前記第１タンクに水が貯留され前記第２タンクに貯留された水が排出される第２状態とを変更する弁機構をさらに含む、切断装置。     a table that holds the cutting object by sucking the cutting object;
    a cutting mechanism that separates the cutting object by cutting the cutting object on the table;
    a holding mechanism that holds the cut object by sucking the singulated cut object,
    The table or the holding mechanism is connected to a dry vacuum pump through a suction path,
    Further comprising a water separation and discharge mechanism located on the suction path and discharging water through the drainage path,
    The water separation and discharge mechanism is
    a first tank;
    and a second tank located downstream of the first tank in the drainage path,
    The first tank includes a partition plate that separates a region where a connection port with the vacuum pump is located and a region where a connection port with the table or the holding mechanism is located,
    In the first tank, a gap is formed above the partition plate,
    The water separation and discharge mechanism has two states: a first state in which water flowing from the first tank to the second tank is stored in the second tank, and a state in which water is stored in the first tank and stored in the second tank. and a valve mechanism for changing between a second state in which the water is expelled.
  2. 　１枚の前記切断対象物の処理毎に前記第１状態から前記第２状態へ変更するように前記弁機構を制御する制御部をさらに備え、
    　前記制御部は、前記テーブル又は前記保持機構に前記切断対象物が吸着された状態における水を用いた最後の処理が前記切断対象物に施された後に前記第１状態から前記第２状態へ変更するように前記弁機構を制御する、請求項１に記載の切断装置。     further comprising a control unit that controls the valve mechanism so as to change from the first state to the second state each time one sheet of the cutting object is processed;
    The control unit changes from the first state to the second state after the last treatment using water is applied to the cutting object while the cutting object is adsorbed to the table or the holding mechanism. 2. The cutting device of claim 1, wherein the valve mechanism is controlled to .
  3. 　前記吸引経路は、前記保持機構と前記真空ポンプとを接続し、
    　前記制御部は、前記保持機構に前記切断対象物が保持された状態で、前記切断対象物の切断面と反対の面における水を用いたクリーニングが終了した後に、前記第１状態から前記第２状態へ変更するように前記弁機構を制御する、請求項２に記載の切断装置。     the suction path connects the holding mechanism and the vacuum pump,
    After cleaning the surface opposite to the cut surface of the object to be cut with water while the object to be cut is held by the holding mechanism, the control unit changes the state from the first state to the second state. 3. The cutting device of claim 2, which controls the valve mechanism to change state.
  4. 　前記吸引経路は、前記テーブルと前記真空ポンプとを接続し、
    　前記制御部は、前記テーブルに前記切断対象物が保持された状態で、前記切断対象物の切断面における水を用いたクリーニングが終了した後に、前記第１状態から前記第２状態へ変更するように前記弁機構を制御する、請求項２に記載の切断装置。     the suction path connects the table and the vacuum pump;
    The control unit changes the state from the first state to the second state after the cutting surface of the cutting target is cleaned with water while the cutting target is held on the table. 3. The cutting device of claim 2, wherein the valve mechanism is controlled by
  5. 　前記弁機構は、前記排水経路において前記第２タンクよりも下流に位置する排水用弁を含み、
    　前記排水用弁は、逆止弁である、請求項１から請求項４のいずれか１項に記載の切断装置。     The valve mechanism includes a drain valve located downstream of the second tank in the drain path,
    The cutting device according to any one of claims 1 to 4, wherein the drain valve is a check valve.
  6. 　請求項１から請求項５のいずれか１項に記載の切断装置を用いた、切断品の製造方法であって、
    　前記切断機構によって前記テーブル上の前記切断対象物を切断することにより前記切断対象物を個片化して前記切断品を製造するステップを含む、切断品の製造方法。

          A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 5,
    A method for manufacturing a cut product, comprising the step of manufacturing the cut product by cutting the cutting target on the table by the cutting mechanism to separate the cutting target into individual pieces.
PCT/JP2022/038572 2021-12-14 2022-10-17 Cutting device, and method for manufacturing cut product WO2023112464A1 (en)

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JP2021072396A (en) * 2019-10-31 2021-05-06 Ｔｏｗａ株式会社 Transport module, cutting device, and manufacturing method of cut product

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US6241226B1 (en) * 1999-09-03 2001-06-05 Speedfam-Ipec Corporation Vacuum system coupled to a wafer chuck for holding wet wafers
JP2009028881A (en) * 2007-07-30 2009-02-12 Olympus Corp Workpiece adsorption device
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