TW202322436A - Led顯示裝置 - Google Patents
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- TW202322436A TW202322436A TW110143143A TW110143143A TW202322436A TW 202322436 A TW202322436 A TW 202322436A TW 110143143 A TW110143143 A TW 110143143A TW 110143143 A TW110143143 A TW 110143143A TW 202322436 A TW202322436 A TW 202322436A
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Abstract
一顯示裝置,包含第一發光模組與第二發光模組。每一個發光模組具有一基板、複數個LED晶粒設置於基板上、反射層位於基板上、以及一透光層。透光層覆蓋基板、複數個LED晶粒、以及反射層。第一模組的透光層與第二模組的透光層皆具有粗糙的最上表面。第一模組的複數個LED晶粒以及第二模組的複數個 LED晶粒發出相同的色光。於第一發光模組上方可測得第一反射率,於第二發光模組上方可測得第二反射率,第一反射率以及第二反射率的標準差不大於0.5。
Description
本發明係關於一種LED顯示裝置的設計,尤關於一種具有粗化表面的LED顯示裝置。
發光二極體(Light-emitting diode;LED)具有耗能低、壽命長、體積小、反應速度快以及光學輸出穩定等特性,逐漸取代傳統之照明光源而被應用於各式照明裝置中。
LED顯示裝置具有高對比、高亮度的優點,因此市場上對於LED顯示裝置的需求越來越大。隨著市場需求演進,LED顯示裝置的尺寸越來越大,因此,逐漸發展出多個LED模組拼接成一LED顯示裝置。於此架構下的LED顯示裝置,則無尺寸上限的限制。然而,模組拼接會面臨模組間色彩不一致,拼接條紋等視覺的缺陷。因此,本發明提出一LED顯示裝置的結構,可以降低人眼視覺對於前述缺陷的感受度。
一顯示裝置,包含第一發光模組與第二發光模組。每一個發光模組具有一基板、複數個LED晶粒設置於基板上、反射層位於基板上、以及一透光層。透光層覆蓋基板、複數個LED晶粒、以及反射層。第一模組的透光層與第二模組的透光層皆具有粗糙的最上表面。第一模組的複數個LED晶粒以及第二模組的複數個 LED晶粒發出相同的色光。於第一發光模組上方可測得第一反射率,於第二發光模組上方可測得第二反射率,第一反射率以及第二反射率的標準差不大於0.5。
以下實施例將伴隨著圖式說明本發明之概念,在圖式或說明中,相似或相同之部分係使用相同之標號,並且在圖式中,元件之形狀、厚度或高度在合理範圍內可擴大或縮小。本發明所列舉之各實施例僅用以說明本發明,並非用以限制本發明之範圍。對本發明所作之任何顯而易知之修飾或變更皆不脫離本發明之精神與範圍。
第1圖顯示本發明一實施例的一顯示裝置1000之局部上視圖。顯示裝置1000為一可用於液晶顯示器之背光光源,其包含複數個發光模組100以陣列排列的方式組合成顯示裝置1000。相鄰發光模組100之間具有一個拼接處5。發光模組100包含一基板1、一反射層3、一透光層(未顯示)、以及複數個LED晶粒10以陣列方式排列於基板1上。反射層3位於基板1上,並具有複數個開孔31。開孔31具有一寬度大於LED晶粒10的寬度。複數個LED晶粒10位於反射層3的複數個開孔31中,與基板1中的電路(未顯示)電性連接,以被內部及/或外部的驅動電路(未顯示)控制點亮。一實施例中,顯示裝置1000中的複數個LED晶粒10發出相同的色光,並包含二或更多種類的獨立波長轉換層(未顯示)分別位於二或更多顆 LED晶粒10的上方,使顯示裝置1000可以發出紅、藍、綠等顏色。在一實施例中,波長轉換層為QD膜片。例如,LED晶粒10發出藍光,其中,一部份的LED晶粒10上方被放置可被激發出綠光的波長轉換層,另一部分的LED晶粒10上方被放置可被激發出紅光的波長轉換層,其餘的LED晶粒10未被覆蓋任何波長轉換層。又例如,LED晶粒10發出紫外光,其中,一部份的LED晶粒10上方被放置可被激發出藍光的波長轉換層,一部份的LED晶粒10上方被放置可被激發出綠光的波長轉換層,另一部分的LED晶粒10上方被放置可被激發出紅光的波長轉換層。
在單一個發光模組100中,兩相鄰的LED晶粒之間的橫向距離為D1。在兩相鄰發光模組100中,分屬不同發光模組100之兩相鄰LED晶粒之間的橫向距離為D2。在單一發光模組100中,兩相鄰的LED晶粒之間的縱向距離為L1。在兩相鄰發光模組100中,分屬不同發光模組100之兩相鄰的LED晶粒之間的縱向距離為L2。在一實施例中,為使相鄰模組的拼接處不要有在人類視覺上產生不連續感, D1以等於D2尤佳,L1以等於L2尤佳。換句話說,顯示裝置1000中的複數個LED晶粒10係以等間距的方式,排列於基板1上。
第2圖為顯示裝置1000 A-A′線段的剖面示意圖。A-A′線段橫跨拼接處5。在第2圖中,為求說明方便,拼接處5左側為發光模組100,拼接處5右側為發光模組100′。以發光模組100為說明例,發光模組100具有基板1、導電線路2、反射層3、複數個LED晶粒10、以及透光層4。發光模組100整體最大厚度<600 μm,較佳地<500 μm。導電線路2位於基板1上方與複數個LED晶粒10做電性連接。複數個LED晶粒彼此等距相隔D1,使得發光模組100的出光均勻。反射層3位於導電線路2上方,具有複數個開孔31。開孔31露出導電線路2的一部份。並用以容置至少一顆LED晶粒10使其與露出的導電線路2電性連接。反射層3可以將LED晶粒射向基板1的光線往基板1上方反射,用以提高發光模組100的亮度。為了不阻擋LED晶粒10的側向光,反射層3的最上表面31以低於LED晶粒10的最上表面101尤佳。值得注意的是,反射層3與LED晶粒10在橫向彼此分開並間隔一段距離,可以避免因為製造公差,使得反射層3覆蓋過多的導電線路2,導致LED晶粒10與導電線路2完全無法或僅能部分連接。此外,反射層3未與LED晶粒10的側面直接接觸,也可以幫助LED晶粒從側面出光,以利提高提高發光模組100的亮度。
參考第2圖,透光層4位於基板1的上方,並覆蓋複數個LED晶粒10、反射層3、以及導電線路2,用以保護LED晶粒10以及導電線路2。透光層4的最上表面41為具有複數個突出部與複數個凹陷部的粗糙表面。透光層4的最上表面41的粗糙度較反射層3的最上表面粗糙度大。透光層4的粗糙的最上表面41可以降低LED晶粒10射出的光線於最上表面41產生全內反射,使光線反射回基板1造成光損失。換言之,透光層4的粗糙的最上表面41有助於LED晶粒10射出的光線於最上表面產生折射,而離開發光模組100,進而增加發光模組100的亮度。此外,透光層4的粗糙的最上表面41可以分散環境光射入發光模組100後被反射層3反射所產生的反射光,因而降低人眼對此反射光的不適感。
發光模組100中的LED晶粒10與發光模組100ˊ的晶粒10ˊ具有相近的發光波長及/或發光強度,例如:發光模組100中的一個LED晶粒與發光模組100ˊ中的一個LED晶粒兩者的發光主波長/峰波長的最大差值小於或等於1.5 nm,發光強度的最大變異量小於或等於3.5 %。其中,發光強度的變異量為兩個LED晶粒的發光強度差/較低的LED晶粒發光強度。發光模組100中的反射層3與發光模組100ˊ的反射層3ˊ因製程公差通常存在反射率的差異。此反射率的差異造成LED晶粒10射出的光線自反射層3反射的光強度與LED晶粒10ˊ射出的光線自反射層3ˊ反射的光強度不同。透光層4的粗糙的最上表面41可對來自反射層3、3ˊ的光線產生折射、散射,而降低不同發光模組間,因為反射層3、3ˊ反射率差異造成的光強度差異,進而降低人眼察覺到相鄰發光模組(拼接處)間因色彩不一致造成的拼接條紋。
基板1可以包含有機材質、無機材質或其組合。基板1可以被彎折(當除去應力後可回復原狀)或不可彎折。有機材質可以包含酚醛樹酯、玻璃纖維、環氧樹脂、聚酰亞胺或雙馬來醯亞胺-三氮雜苯樹脂(Bismaleimide Triazine;BT)、或是ABF(Ajinomoto Build-up Film)。無機材質可以包含鋁、陶瓷材料、或玻璃(glass)。可被彎折的材質可以包含PET、PI(聚酰亞胺)、HPVDF(聚偏二氟乙烯)、或ETFE(乙烯 - 四氟乙烯)。
透光層4可被LED晶粒10發出的全部或部分光線穿透,透光層4的材料可以包含矽膠(Silicone)、環氧樹脂(Epoxy)、聚亞醯胺(PI)、苯并環丁烯(BCB)、過氟環丁烷(PFCB)、SU8、丙烯酸樹脂(Acrylic Resin)、聚甲基丙烯酸甲酯(PMMA)、聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、聚醚醯亞胺(Polyetherimide)、氟碳聚合物(Fluorocarbon Polymer)、氧化鋁(Al
2O
3)、SINR、旋塗玻璃(SOG)。在一實施例中,透光層4的原材是一張膜片,可以被貼在基板1上(以下簡稱為「貼膜(lamination)」),具有厚度均勻與較薄的優點。在實施例中,透光層4的厚度<200 μm,較佳厚度<150 μm。在另一實施例中,透光層4利用點膠、噴塗等方式形成在發光模組上,不同發光模組100間的厚度會有些微的差異。然而,利用貼膜的方式,可以減少模組間厚度的差異,例如,數個發光模組100的厚度的標準差(Standard Deviation)不大於0.01。在另一實施例中,透光層4可包含碳黑粒子,可以吸收外界環境的光線,用以吸收外界光線穿透透光層4被反射層2反射的光線並提高顯示裝置1000/發光模組100的對比度。
反射層3可以包含一基質及高反射率物質之混和物。基質可為矽膠基質(silicone-based)或環氧基質(epoxy-based)。高反射率物質可包含二氧化鈦、二氧化矽、氧化鋁、K2TiO
3、ZrO
2、ZnS、ZnO、或 MgO。
LED晶粒10為半導體發光元件,其包含第一半導體層、以及第二半導體層、以及位於第一半導體層與第二半導體之間的活性層。第一半導體層及第二半導體層,可分別提供電子、電洞,使電子、電洞於活性層中復合(Recombination)以發出光線。第一半導體層、活性層、及第二半導體層可包含Ⅲ-Ⅴ族半導體材料,例如Al
xIn
yGa
( 1-x-y )N或Al
xIn
yGa
( 1-x-y )P,其中0≦x、 y≦1;(x+y)≦1。依據活性層之材料,LED晶粒10可發出一峰值介於610 nm及650 nm之間的紅光、峰值介於530 nm及570 nm之間的綠光、峰值介於450 nm及490 nm之間的藍光、峰值介於400 nm及450 nm之間的紫光、或是峰值介於280 nm及400 nm之間的紫外光。在另一實施例中,LED晶粒可以替換為雷射二極體(Laser Diode)。
於一實施例中,LED晶粒10可以為覆晶式晶片(Flip Chip),每一個LED晶粒10可以藉由導電材料(未顯示),例如,焊料、異方性導電膠,固定於導電線路2上。在另一實施例中,複數個LED晶粒10為垂直型晶片或是水平式晶片時,每一個LED晶粒10可以藉由適當之黏著材料(未顯示)固定於導電線路2或基板1上。例如,LED晶粒為垂直型晶片時,黏著材料為焊料、異方性導電膠等。LED晶粒10為水平式晶片時,黏著材料為銀膠、環氧樹脂、矽膠等。
另一實施例中,發光模組100可應用於照明、或是顯示器(直接作為畫素)。根據需要,LED晶粒可以為紅色LED晶粒、綠色LED晶粒、藍色LED晶粒及/或青綠色LED晶粒。例如,應用於照明及/或背光源時LED晶粒可為藍色LED晶粒(藍色發光二極體搭配適當之螢光粉可發出白光)、應用於顯示器時LED晶粒包含紅、綠、藍三色之LED晶粒,或包含紅、綠、藍、青綠四色之LED晶粒。
顯示裝置1000包含複數個發光模組100,透光層4具有粗糙的上表面41,可以降低不同發光模組間的亮度不均、色彩不一致、拼接條紋等問題。每一個發光模組100的上方可以測得一個反射率。此反射率所代表的數值是發光模組100中透光層4的反射率以及透光層4下方的反射層3的反射率的加總。數個發光模組100的反射率之間具有一個標準差(Standard Deviation),標準差不大於0.5。亦即,數個發光模組100的反射率離散度不高,人眼較不會感受到不同發光模組間亮度的差異,因此可以獲得較佳顯示效果的顯示裝置1000。
第3圖為不同發光模組之反射率比較表。反射率的量測是以手持式分光色差儀(portable sphere spectrophotometer),例如:X-Rite公司出廠的 Ci6X,置於第1圖中一發光模組100之上,並朝向發光模組100射出一450 nm的光源,測得發光模組100的反射光所計算出的值。如第3圖顯示,實施例中的發光模組100的透光層4具有粗糙的最上表面。8個發光模組100,編號1、2、3、4、5、6、7、8,分別測到8個不同的反射率。此反射率會因為透光層4的粗糙面具有不同的粗糙度、以及反射層3具有不同的反射率而有所差異,大都介於84 %~86 %之間。實施例中,具有粗糙上表面的不同發光模組間的反射率標準差為0.447。對照例中的發光模組的透光層具有平滑上表面,分別為編號1、2、3、4、5、6、7、8,分別可以測到8個不同的反射率,介於82 %~84 %之間,標準差為0.542。如表格所示,實施例中的發光模組的反射率的標準差較低(離散度較低),對照例中發光模組的標準差較高(離散度較高)。因此,使用實施例的發光模組組合出的顯示裝置,發光模組之間的亮度與色彩均勻度都會較使用對照例組合的顯示裝置佳。
以上所述之實施例僅係為說明本發明之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施,當不能以之限定本發明之專利範圍,即舉凡依本發明所揭示之精神所作之均等變化或修飾,仍應涵蓋在本發明之專利範圍內。
1:基板
2:導電線路
3、3ˊ:反射層
4:透光層
5:拼接處
10、10ˊ:LED晶粒
31:開孔
41、101:最上表面
100、100ˊ:發光模組
1000:顯示裝置
L1、L2、D1、D2:距離
第1圖為依據本發明一實施例的顯示裝置之局部示意圖。
第2圖為依據本發明一實施例的顯示裝置之局部剖面圖。
第3圖為依據本發明一實施例與對照例的不同發光模組之反射率比較表。
1:基板
2:導電線路
3、3':反射層
4:透光層
5:拼接處
10、10':LED晶粒
31:開孔
41、101:最上表面
100、100':發光模組
1000:顯示裝置
D1、D2:距離
Claims (10)
- 一顯示裝置,包含: 一第一發光模組,具有一第一基板、複數個第一LED晶粒設置於該第一基板上、一第一反射層位於該第一基板、以及一第一透光層覆蓋該第一基板、該複數個第一LED晶粒、以及該第一反射層;以及 一第二發光模組,具有一第二基板、複數個第二LED晶粒設置於該第二基板上、一第二反射層位於該第二基板上、以及一第二透光層覆蓋該第二基板、該複數個第二LED晶粒、以及該第二反射層, 其中,該第一透光層與該第二透光層皆具有一粗糙最上表面, 其中,該複數個第一LED晶粒以及該複數個第二 LED晶粒發出相同的色光, 其中,於該第一發光模組上方可測得一第一反射率,於該第二發光模組上方可測得一第二反射率,該第一反射率以及該第二反射率的標準差不大於0.5。
- 如請求項1的顯示裝置,其中,該第一發光模組具有一第一厚度,該第二發光模組具有一第二厚度,該第一厚度以及該第二厚度的標準差不大於0.01 。
- 如請求項1的顯示裝置,其中,其中,該複數個第一LED晶粒以等間距排列。
- 如請求項1的顯示裝置,其中,該第一反射層未接觸LED晶粒。
- 如請求項1的顯示裝置,其中,該第一發光模組還包括一第一導電線路位於該第一反射層與該第一基板之間,並與該複數個第一LED晶粒電性連接。
- 如請求項1的顯示裝置,其中,該反射層具有一最上表面低於該第一LED晶粒的一最上表面。
- 如請求項1的顯示裝置,其中,該第一透光層的該最上表面的粗糙度大於該反射層之最上表面的粗糙度。
- 如請求項1的顯示裝置,其中,該反射層具有一開孔供容置該第一LED晶粒,該開孔的寬度大於該第一LED晶粒。
- 如請求項1的顯示裝置,其中,該第一透光層具有一厚度小於150μm。
- 如請求項1的顯示裝置,其中,該第一發光模組的最大厚度小於600μm。
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