TW202321330A - Resin composition and method for producing same, and composite material - Google Patents

Resin composition and method for producing same, and composite material Download PDF

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TW202321330A
TW202321330A TW111130440A TW111130440A TW202321330A TW 202321330 A TW202321330 A TW 202321330A TW 111130440 A TW111130440 A TW 111130440A TW 111130440 A TW111130440 A TW 111130440A TW 202321330 A TW202321330 A TW 202321330A
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resin composition
vinyl ester
resin
mass
ester resin
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TW111130440A
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小林健一
岡田尚人
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日商昭和電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1466Acrylic or methacrylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/222Magnesia, i.e. magnesium oxide

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Emergency Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A resin composition comprising (A) a vinyl ester resin, (B) a monomer containing an ethylenically unsaturated group, (C) at least one compound selected from an alkaline earth metal oxide and an alkaline earth metal hydroxide, and (D) at least one compound selected from water and a compound containing a hydroxy group, in which the vinyl ester resin (A) comprises a vinyl ester resin (A1), and the vinyl ester resin (A1) has a weight average molecular weight (Mw) of 1,500 or more and a molecular weight distribution (Mw/Mn) of 2.0 or more.

Description

樹脂組成物、其製造方法及複合材料Resin composition, its production method and composite material

本發明係關於含有乙烯基酯樹脂的樹脂組成物及其製造方法,以及複合材料。The present invention relates to a resin composition containing a vinyl ester resin, a method for producing the same, and a composite material.

近年來上水管、下水管或電力管等埋設在地中的現有管道之老朽化變得深刻化,已有提出修補此等的種種方法。 例如專利文獻1中揭示含有使埋設在地中的現有管道之內壁面上密著管狀襯材,藉由於前述襯材內部供給壓縮空氣且於前述襯材內部導入的移動式光照射裝置,對前述襯材內面照射光而使前述襯材硬化的硬化步驟之現有管道的修補方法。又,作為襯材之材料,可使用由纖維等所成的含浸基材中含浸光硬化性樹脂組成物者,或作為前述光硬化性樹脂組成物,可使用將不飽和聚酯樹脂或乙烯基酯樹脂等聚合性樹脂溶解於苯乙烯等溶劑者。 [先前技術文獻] [專利文獻] In recent years, the aging of existing pipelines buried in the ground such as water supply pipes, sewage pipes, and power pipes has become more serious, and various methods of repairing these have been proposed. For example, Patent Document 1 discloses that the inner wall surface of the existing pipeline buried in the ground is closely adhered to the tubular lining material, and the mobile light irradiation device is supplied with compressed air inside the lining material and introduced into the lining material. A method of repairing existing pipes in a hardening step in which the lining material is irradiated with light to harden the lining material. In addition, as the material of the lining material, a photocurable resin composition impregnated into an impregnated base material made of fibers or the like can be used, or as the aforementioned photocurable resin composition, an unsaturated polyester resin or vinyl resin can be used. Polymer resins such as ester resins are dissolved in solvents such as styrene. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2020-82408號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2020-82408

[發明所解決的問題][Problem solved by the invention]

作為使用於現有管道之修補用的襯材材料之樹脂組成物,於含浸基材含浸樹脂組成物時可使其容易含浸樹脂組成物之低黏度者為佳。另一方面,亦期待具有使樹脂組成物不會分佈不均,且可維持於含浸基材中保持均勻分布的狀態之程度的黏度者。即,即使於含浸基材含浸樹脂組成物時為低黏度,隨著時間經過而增黏,在修補現有管道時,可維持保持樹脂組成物之狀態的程度下成為高黏度的樹脂組成物為佳。然而,對於過去樹脂組成物,具有增黏性低且難控制增黏速度等問題。 本發明為欲解決如上述課題者,以提供製造後的黏度(以下亦稱為初期黏度)立即低,隨著時間經過會增黏,且容易控制增黏速度之樹脂組成物為目的。又,以提供含有前述樹脂組成物的複合材料及前述樹脂組成物之製造方法為目的。 [解決課題的手段] As a resin composition used as a lining material for repairing existing pipelines, it is preferable to have a low viscosity that can be easily impregnated with the resin composition when the impregnation base is impregnated with the resin composition. On the other hand, it is also desirable to have a viscosity such that the resin composition is not unevenly distributed and can maintain a uniformly distributed state in the impregnated base material. That is, even if the impregnation base material is impregnated with a resin composition, it has a low viscosity, and the viscosity increases over time. When repairing an existing pipeline, it is preferable to become a high-viscosity resin composition to the extent that the state of the resin composition can be maintained. . However, conventional resin compositions have problems such as low viscosity and difficulty in controlling the speed of viscosity increase. In order to solve the above problems, the present invention aims to provide a resin composition whose viscosity (hereinafter also referred to as initial viscosity) is low immediately after manufacture, increases with time, and is easy to control the rate of viscosity increase. Moreover, it aims at providing the composite material containing the said resin composition, and the manufacturing method of the said resin composition. [means to solve the problem]

即,本發明為提供以下手段者。 [1] 一種樹脂組成物,其中含有烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C),與選自水及含有羥基的化合物的至少1種化合物(D),前述乙烯基酯樹脂(A)含有乙烯基酯樹脂(A1),前述乙烯基酯樹脂(A1)的重量平均分子量(Mw)為1,500以上,重量平均分子量Mw與數平均分子量Mn的比(Mw/Mn)為2.0以上。 [2] 如上述[1]所記載的樹脂組成物,其中前述乙烯基酯樹脂(A1)的重量平均分子量(Mw)為35,000以下。 [3] 如上述[1]或[2]所記載的樹脂組成物,其中前述乙烯基酯樹脂(A1)的分子量分布(Mw/Mn)為18以下。 [4] 如上述[1]~[3]中任一項所記載的樹脂組成物,其中前述乙烯基酯樹脂(A1)的酸價為5KOHmg/g以上。 [5] 如上述[1]~[4]中任一項所記載的樹脂組成物,其中前述乙烯基酯樹脂(A1)的酸價為100KOHmg/g以下。 [6] 如上述[1]所記載的樹脂組成物,其中前述乙烯基酯樹脂(A1)為樹脂前驅物(P1)與多元酸酐(a1-4)之加成反應生成物,前述樹脂前驅物(P1)為,相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,將於1分子中具有2個環氧基之環氧化合物(a1-1)、不飽和一元酸(a1-2),及多元酸酐(a1-3)進行反應至來自前述多元酸酐(a1-3)的酸基之總量成為5~25莫耳而得的反應生成物。 [7] 前述環氧化合物(a1-1)為雙酚型環氧樹脂之上述[6]所記載的樹脂組成物。 [8] 前述不飽和一元酸(a1-2)為選自(甲基)丙烯酸及巴豆酸的至少1種之上述[6]或[7]所記載的樹脂組成物。 [9] 前述多元酸酐(a1-3)為二元酸酐之上述[6]~[8]中任一項所記載的樹脂組成物。 [10] 前述多元酸酐(a1-4)為二元酸酐之上述[6]~[9]中任一項所記載的樹脂組成物。 [11] 前述乙烯基酯樹脂(A)為進一步含有乙烯基酯樹脂(A2),前述乙烯基酯樹脂(A2)為於1分子中具有2個以上環氧基的環氧化合物(a2-1)及不飽和一元酸(a2-2)的反應生成物之上述[6]~[10]中任一項所記載的樹脂組成物。 [12] 相對於前述乙烯基酯樹脂(A1)與前述乙烯基酯樹脂(A2)的合計100質量份,前述乙烯基酯樹脂(A1)為35~90質量份,前述乙烯基酯樹脂(A2)為10~65質量份之上述[11]所記載的樹脂組成物。 [13] 前述化合物(C)為氧化鎂之上述[1]~[12]中任一項所記載的樹脂組成物。 [14] 進一步含有聚合起始劑(E)的上述[1]~[13]中任一項所記載的樹脂組成物。 [15] 聚合起始劑(E)為光聚合起始劑之上述[1]~[14]中任一項所記載的樹脂組成物。 [16] 相對於前述乙烯基酯樹脂(A)與前述含有乙烯性不飽和基的單體(B)的合計100質量份而言,含有前述乙烯基酯樹脂(A)20~80質量份,含有前述含有乙烯性不飽和基的單體(B)20~80質量份,含有前述化合物(C)0.01~6質量份,含有前述化合物(D)0.01~3質量份之上述[1]~[15]中任一項所記載的樹脂組成物。 [17] 一種樹脂組成物之製造方法,其中含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C),與選自水及含有羥基的化合物的至少1種化合物(D),前述乙烯基酯樹脂(A)含有乙烯基酯樹脂(A1),其係含有下述步驟1~3的樹脂組成物之製造方法; 步驟1:將於1分子中具有2個環氧基的環氧化合物(a1-1)、不飽和一元酸(a1-2),及多元酸酐(a1-3)進行反應至,相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,前述來自多元酸酐(a1-3)的酸基之總量成為5~25莫耳而得到樹脂前驅物(P1)之步驟, 步驟2:使前述樹脂前驅物(P1)及多元酸酐(a1-4)進行加成反應後得到前述乙烯基酯樹脂(A1)之步驟, 步驟3:混合前述乙烯基酯樹脂(A)、前述含有乙烯性不飽和基的單體(B)、前述化合物(C)與前述化合物(D)而得到樹脂組成物之步驟。 [18] 含有如上述[1]~[16]中任一項所記載的樹脂組成物與纖維基材片材(F)之複合材料。 [19] 使用於管材修補之如上述[18]所記載的複合材料。 [發明之效果] That is, the present invention provides the following means. [1] A resin composition comprising an alkenyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), and at least 1 element selected from oxides and hydroxides of metals belonging to Group 2 elements. A compound (C), and at least one compound (D) selected from water and hydroxyl-containing compounds, the aforementioned vinyl ester resin (A) contains a vinyl ester resin (A1), and the aforementioned vinyl ester resin (A1) The weight average molecular weight (Mw) is 1,500 or more, and the ratio (Mw/Mn) of the weight average molecular weight Mw to the number average molecular weight Mn is 2.0 or more. [2] The resin composition according to the above [1], wherein the vinyl ester resin (A1) has a weight average molecular weight (Mw) of 35,000 or less. [3] The resin composition according to the above [1] or [2], wherein the vinyl ester resin (A1) has a molecular weight distribution (Mw/Mn) of 18 or less. [4] The resin composition according to any one of the above [1] to [3], wherein the vinyl ester resin (A1) has an acid value of 5 KOHmg/g or more. [5] The resin composition according to any one of the above [1] to [4], wherein the vinyl ester resin (A1) has an acid value of 100 KOHmg/g or less. [6] The resin composition as described in [1] above, wherein the vinyl ester resin (A1) is an addition reaction product of a resin precursor (P1) and a polybasic acid anhydride (a1-4), and the resin precursor (P1) is an epoxy compound (a1-1) having two epoxy groups in one molecule, A reaction product obtained by reacting unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) until the total amount of acid groups derived from the polybasic acid anhydride (a1-3) becomes 5 to 25 moles. [7] The epoxy compound (a1-1) is the resin composition described in the above [6] of the bisphenol-type epoxy resin. [8] The unsaturated monobasic acid (a1-2) is the resin composition described in the above [6] or [7] that is at least one selected from (meth)acrylic acid and crotonic acid. [9] The polybasic acid anhydride (a1-3) is the resin composition described in any one of the above [6] to [8] of the dibasic acid anhydride. [10] The polybasic acid anhydride (a1-4) is the resin composition described in any one of the above [6] to [9] of the dibasic acid anhydride. [11] The vinyl ester resin (A) further contains a vinyl ester resin (A2), and the vinyl ester resin (A2) is an epoxy compound having two or more epoxy groups in one molecule (a2-1 ) and the resin composition described in any one of [6] to [10] above, which is a reaction product of an unsaturated monobasic acid (a2-2). [12] With respect to a total of 100 parts by mass of the vinyl ester resin (A1) and the vinyl ester resin (A2), the vinyl ester resin (A1) is 35 to 90 parts by mass, and the vinyl ester resin (A2 ) is 10 to 65 parts by mass of the resin composition described in [11] above. [13] The aforementioned compound (C) is the resin composition described in any one of the aforementioned [1] to [12] of magnesium oxide. [14] The resin composition described in any one of the above [1] to [13] that further contains a polymerization initiator (E). [15] The polymerization initiator (E) is the resin composition described in any one of the above [1] to [14] of the photopolymerization initiator. [16] Containing 20 to 80 parts by mass of the vinyl ester resin (A) relative to the total of 100 parts by mass of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B), The aforementioned [1]~[ 15] the resin composition described in any one. [17] A method for producing a resin composition comprising a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), and oxides and hydroxides of metals belonging to Group 2 elements At least one compound (C), and at least one compound (D) selected from water and hydroxyl-containing compounds, the aforementioned vinyl ester resin (A) contains vinyl ester resin (A1), which contains the following steps The manufacturing method of the resin composition of 1~3; Step 1: react epoxy compound (a1-1), unsaturated monobasic acid (a1-2), and polybasic acid anhydride (a1-3) with 2 epoxy groups in one molecule until, relative to the aforementioned ring For 100 moles of the total amount of epoxy groups in the oxygen compound (a1-1), the total amount of the acid groups from the aforementioned polybasic acid anhydride (a1-3) becomes 5 to 25 moles to obtain the resin precursor (P1). step, Step 2: the step of obtaining the aforementioned vinyl ester resin (A1) after the addition reaction of the aforementioned resin precursor (P1) and the polybasic acid anhydride (a1-4), Step 3: a step of mixing the aforementioned vinyl ester resin (A), the aforementioned ethylenically unsaturated group-containing monomer (B), the aforementioned compound (C) and the aforementioned compound (D) to obtain a resin composition. [18] A composite material comprising the resin composition described in any one of the above [1] to [16] and a fibrous base sheet (F). [19] The composite material described in [18] above for pipe repair. [Effect of Invention]

依據本發明可提供初期黏度為低,隨著時間經過會增黏,且容易控制增黏速度的樹脂組成物及其製造方法。又,亦可提供含有前述樹脂組成物之複合材料。According to the present invention, it is possible to provide a resin composition having a low initial viscosity, which increases in viscosity over time, and whose rate of viscosity increase is easy to control, and a method for producing the same. Moreover, a composite material containing the aforementioned resin composition can also be provided.

[實施發明的型態][Types of implementing the invention]

首先,對於本說明書中之用語及表記的定義及意義如以下所示。 所謂「(甲基)丙烯酸」為丙烯酸及甲基丙烯酸之總稱。同樣地,所謂「(甲基)丙烯酸酯」為丙烯酸酯及甲基丙烯酸酯之總稱,所謂「(甲基)丙烯醯基」為丙烯醯基及甲基丙烯醯基之總稱。 「重量平均分子量Mw」(以下亦可僅記載為「Mw」。)及「數平均分子量Mn」(以下亦可僅記載為「Mn」。)為藉由凝膠滲透層析法(GPC)測定而求得之標準聚苯乙烯換算分子量。具體為藉由後述實施例所記載的方法所測定。 所謂乙烯基酯樹脂的「酸價」表示,依據JIS K6901:2008,作為指示劑使用溴麝香草酚藍與酚紅之混合溶液而測定所得值,其為中和乙烯基酯樹脂1g時必要的氫氧化鉀之mg數。具體為藉由後述實施例所記載的方法所測定。 所謂乙烯基酯樹脂之「黏度」表示對於乙烯基酯樹脂65質量%與苯氧基乙基甲基丙烯酸酯35質量%之混合物的黏度者。使用E型黏度計在溫度25℃下進行測定的值。具體為藉由後述實施例所記載的方法所測定。 所謂樹脂組成物的「黏度」為使用B型黏度計,在溫度23℃下進行測定的值。具體為藉由後述實施例所記載的方法所測定。所謂「初期黏度」表示製造樹脂組成物後1小時以內立即測定的黏度。 所謂「來自多元酸酐的酸基」,在無特別說明的情況下,表示自多元酸酐所產生的游離酸基。 First, the definitions and meanings of the terms and symbols used in this specification are as follows. The term "(meth)acrylic acid" is a general term for acrylic acid and methacrylic acid. Similarly, "(meth)acrylate" is a general term for acrylate and methacrylate, and "(meth)acryl" is a general term for acryl and methacryl. "Weight average molecular weight Mw" (hereinafter may be simply referred to as "Mw") and "number average molecular weight Mn" (hereinafter may also be simply referred to as "Mn") are measured by gel permeation chromatography (GPC) And obtain the standard polystyrene conversion molecular weight. Specifically, it was measured by the method described in the Examples described later. The so-called "acid value" of vinyl ester resin indicates the value measured according to JIS K6901:2008 using a mixed solution of bromothymol blue and phenol red as an indicator, which is necessary to neutralize 1 g of vinyl ester resin The mg of potassium hydroxide. Specifically, it was measured by the method described in the Examples described later. The "viscosity" of the vinyl ester resin means the viscosity of a mixture of 65% by mass of vinyl ester resin and 35% by mass of phenoxyethyl methacrylate. The value measured at a temperature of 25° C. using an E-type viscometer. Specifically, it was measured by the method described in the Examples described later. The "viscosity" of the resin composition is a value measured at a temperature of 23° C. using a B-type viscometer. Specifically, it was measured by the method described in the Examples described later. The "initial viscosity" means the viscosity measured within one hour immediately after the production of the resin composition. "An acid group derived from a polybasic acid anhydride" means a free acid group generated from a polybasic acid anhydride unless otherwise specified.

[樹脂組成物] 本實施形態的樹脂組成物含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C)與選自水及含有羥基的化合物的至少1種之化合物(D)。 然後,前述乙烯基酯樹脂(A)含有重量平均分子量Mw為1,500以上,重量平均分子量Mw與數平均分子量Mn的比(Mw/Mn)為2.0以上的乙烯基酯樹脂(A1)。 藉由具有如此構成,樹脂組成物的初期黏度為低,隨著時間經過會增黏,且成為容易控制增黏速度者。 [Resin composition] The resin composition of this embodiment contains a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), and at least one compound selected from oxides and hydroxides of metals belonging to Group 2 elements (C) and at least one compound (D) selected from water and hydroxyl-containing compounds. Then, the vinyl ester resin (A) contains a vinyl ester resin (A1) having a weight average molecular weight Mw of 1,500 or more and a ratio (Mw/Mn) of the weight average molecular weight Mw to the number average molecular weight Mn of 2.0 or more. With such a constitution, the initial viscosity of the resin composition is low, the viscosity increases with time, and it becomes easy to control the rate of viscosity increase.

本實施形態的樹脂組成物含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、化合物(C)及化合物(D),除此以外亦可含有後述其他成分,但由可良好地得到本發明之效果的觀點來看,樹脂組成物中之乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、化合物(C)及化合物(D)的合計含有量以80~100質量%為佳,較佳為90~100質量%,更佳為95~100質量%。The resin composition of this embodiment contains a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), a compound (C) and a compound (D), and may also contain other components described below, but From the viewpoint of obtaining the effect of the present invention well, the vinyl ester resin (A), ethylenically unsaturated group-containing monomer (B), compound (C) and compound (D) in the resin composition The total content is preferably 80 to 100% by mass, more preferably 90 to 100% by mass, more preferably 95 to 100% by mass.

<乙烯基酯樹脂(A)> 本實施形態之乙烯基酯樹脂(A)含有乙烯基酯樹脂(A1)。乙烯基酯樹脂(A1)可單獨使用1種,亦可併用2種以上。 又,乙烯基酯樹脂(A)中視必要亦可含有後述乙烯基酯樹脂(A2)。 <Vinyl ester resin (A)> The vinyl ester resin (A) of this embodiment contains a vinyl ester resin (A1). Vinyl ester resin (A1) may be used individually by 1 type, and may use 2 or more types together. Moreover, the vinyl ester resin (A2) mentioned later may be contained in vinyl ester resin (A) as needed.

[乙烯基酯樹脂(A1)] 本實施形態之乙烯基酯樹脂(A1)的重量平均分子量(Mw)為1,500以上,重量平均分子量(Mw)與數平均分子量(Mn)之比(Mw/Mn)為2.0以上。 藉由將乙烯基酯樹脂(A1)的重量平均分子量(Mw)為1,500以上時,可使樹脂組成物更有效率地增黏。乙烯基酯樹脂(A1)的重量平均分子量(Mw)由可更有效率地增黏之觀點來看,以2,000以上為佳,較佳為4,000以上,更佳為6,000以上,由可使樹脂組成物的初期黏度減低至適宜範圍且控制增黏速度的觀點來看,以35,000以下為佳,較佳為25,000以下,更佳為15,000以下。 [vinyl ester resin (A1)] The weight average molecular weight (Mw) of the vinyl ester resin (A1) of this embodiment is 1,500 or more, and the ratio (Mw/Mn) of the weight average molecular weight (Mw) to the number average molecular weight (Mn) is 2.0 or more. When the weight average molecular weight (Mw) of the vinyl ester resin (A1) is 1,500 or more, the resin composition can be thickened more efficiently. The weight-average molecular weight (Mw) of the vinyl ester resin (A1) is preferably 2,000 or more, more preferably 4,000 or more, and more preferably 6,000 or more from the viewpoint of more efficient thickening. From the viewpoint of reducing the initial viscosity of the product to an appropriate range and controlling the viscosity increase rate, it is preferably 35,000 or less, more preferably 25,000 or less, more preferably 15,000 or less.

Mw/Mn的分子量分布之指標為1時表示單分散聚合物,該比越大表示分子量分布越廣的意思。 乙烯基酯樹脂(A1)的Mw/Mn為較廣的2.0以上,可使乙烯基酯樹脂(A1)合成時之各種製造條件的最適化變得容易。乙烯基酯樹脂(A1)的Mw/Mn由可更容易使各種製造條件最適化的觀點來看,以2.5以上為佳,較佳為3.0以上,更佳為4.0以上,由抑制樹脂組成物的物性分散,將初期黏度減低至適宜範圍,控制增黏速度的觀點來看,以18以下為佳,較佳為12以下,更佳為10以下。 When the molecular weight distribution index of Mw/Mn is 1, it means a monodisperse polymer, and a larger ratio means a wider molecular weight distribution. Mw/Mn of the vinyl ester resin (A1) is a wide range of 2.0 or more, and the optimization of various production conditions at the time of synthesis of the vinyl ester resin (A1) can be facilitated. The Mw/Mn of the vinyl ester resin (A1) is preferably 2.5 or more, more preferably 3.0 or more, and more preferably 4.0 or more from the viewpoint of making it easier to optimize various production conditions. From the standpoint of dispersion of physical properties, reduction of initial viscosity to an appropriate range, and control of viscosity increase rate, 18 or less is preferable, more preferably 12 or less, more preferably 10 or less.

乙烯基酯樹脂(A1)的數平均分子量(Mn)由可有效率地使樹脂組成物更增黏的觀點來看,以500以上為佳,較佳為700以上,更佳為900以上,由樹脂組成物之初期黏度減低至適宜範圍且控制增黏速度的觀點來看,以2,500以下為佳,較佳為1,800以下,更佳為1,600以下。The number average molecular weight (Mn) of the vinyl ester resin (A1) is preferably 500 or more, more preferably 700 or more, and more preferably 900 or more from the viewpoint of efficiently making the resin composition more viscous. From the viewpoint of reducing the initial viscosity of the resin composition to an appropriate range and controlling the viscosity increase rate, it is preferably 2,500 or less, more preferably 1,800 or less, more preferably 1,600 or less.

乙烯基酯樹脂(A1)的酸價由使樹脂組成物之增黏速度提高的觀點來看,以5KOHmg/g以上為佳,較佳為10KOHmg/g以上,更佳為15KOHmg/g以上,較更佳為25KOHmg/g以上,由控制樹脂組成物的增黏速度之觀點來看,以100KOHmg/g以下為佳,較佳為90KOHmg/g以下,更佳為80KOHmg/g以下,較更佳為70KOHmg/g以下。The acid value of the vinyl ester resin (A1) is preferably 5KOHmg/g or more, more preferably 10KOHmg/g or more, more preferably 15KOHmg/g or more, from the viewpoint of increasing the viscosity-increasing rate of the resin composition. More preferably above 25KOHmg/g, from the point of view of controlling the viscosity increase rate of the resin composition, preferably below 100KOHmg/g, preferably below 90KOHmg/g, more preferably below 80KOHmg/g, more preferably below 80KOHmg/g Below 70KOHmg/g.

乙烯基酯樹脂(A1)由樹脂組成物的初期黏度之適度控制或混合容易性等觀點來看,使用溶劑或反應性稀釋劑等,調整黏度而使用者為佳。調整黏度以1~400Pa・s為佳,較佳為10~300Pa・s,更佳為20~150Pa・s。Vinyl ester resin (A1) is preferably used to adjust the viscosity by using a solvent or a reactive diluent from the viewpoint of moderate control of the initial viscosity of the resin composition and ease of mixing. The viscosity is preferably adjusted to 1~400Pa·s, more preferably 10~300Pa·s, more preferably 20~150Pa·s.

乙烯基酯樹脂(A1)以於1分子中具有2個環氧基之環氧化合物(a1-1)、不飽和一元酸(a1-2),及多元酸酐(a1-3)之反應生成物的樹脂前驅物(P1)與多元酸酐(a1-4)的加成反應生成物者為佳。藉由使用如此乙烯基酯樹脂(A1)時,可將樹脂組成物的初期黏度減低至更適宜的範圍,又藉由化合物(C)的作用,隨著時間經過可使樹脂組成物更有效率地增黏。Vinyl ester resin (A1) is a reaction product of epoxy compound (a1-1) having two epoxy groups in one molecule, unsaturated monobasic acid (a1-2), and polybasic acid anhydride (a1-3) The addition reaction product of the resin precursor (P1) and polybasic acid anhydride (a1-4) is preferable. By using such a vinyl ester resin (A1), the initial viscosity of the resin composition can be reduced to a more suitable range, and the effect of the compound (C) can make the resin composition more efficient over time to thicken.

(樹脂前驅物(P1)) 樹脂前驅物(P1)為於1分子中具有2個環氧基之環氧化合物(a1-1)、不飽和一元酸(a1-2),及多元酸酐(a1-3)的反應生成物。 樹脂前驅物(P1)由可穩定地製造乙烯基酯樹脂(A)的觀點,及由適度地拓廣乙烯基酯樹脂(A1)的Mw/Mn,加速樹脂組成物之增黏速度的觀點來看,相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,反應前述環氧化合物(a1-1)、前述不飽和一元酸(a1-2),及前述多元酸酐(a1-3)至來自前述多元酸酐(a1-3)的酸基之總量成為5~25莫耳而得的反應生成物者為佳,較佳為7~23莫耳,更佳為9~21莫耳。 例如當前述多元酸酐(a1-3)為二元酸酐之情況時,首先藉由環氧化合物(a1-1)的環氧基與不飽和一元酸(a1-2)的羧基之反應,環氧化合物(a1-1)的環氧基經開環產生羥基,對於該羥基作為多元酸酐(a1-3)的二元酸酐為開環加成。其次,藉由該二元酸酐之開環加成所產生的羧基與環氧化合物(a1-1)的未反應之環氧基進一步反應。因此,前述多元酸酐(a1-3)為二元酸酐之情況時,可與二元酸酐1分子單位所含有的環氧基進行反應,來自二元酸酐的酸基之數目為1個。 (Resin Precursor (P1)) The resin precursor (P1) is a reaction product of an epoxy compound (a1-1) having two epoxy groups in one molecule, an unsaturated monobasic acid (a1-2), and a polybasic acid anhydride (a1-3). Resin precursor (P1) from the point of view of stably producing vinyl ester resin (A), and from the point of view of expanding the Mw/Mn of vinyl ester resin (A1) moderately and accelerating the viscosity increase rate of the resin composition See, relative to the total amount of 100 moles of epoxy groups of the aforementioned epoxy compound (a1-1), the reaction of the aforementioned epoxy compound (a1-1), the aforementioned unsaturated monobasic acid (a1-2), and the aforementioned The polybasic acid anhydride (a1-3) to the total amount of the acid groups from the aforementioned polybasic acid anhydride (a1-3) is preferably a reaction product obtained by 5 to 25 moles, preferably 7 to 23 moles, more preferably 9~21 moles. For example, when the aforementioned polybasic acid anhydride (a1-3) is a dibasic acid anhydride, at first by the reaction of the epoxy group of the epoxy compound (a1-1) and the carboxyl group of the unsaturated monobasic acid (a1-2), the epoxy The epoxy group of the compound (a1-1) generates a hydroxyl group through ring opening, and the dibasic acid anhydride of the polybasic acid anhydride (a1-3) is ring-opening addition to the hydroxyl group. Next, the carboxyl group generated by the ring-opening addition of the dibasic acid anhydride further reacts with the unreacted epoxy group of the epoxy compound (a1-1). Therefore, when the said polybasic acid anhydride (a1-3) is a dibasic acid anhydride, it can react with the epoxy group contained in 1 molecular unit of a dibasic acid anhydride, and the number of the acid group originating in a dibasic acid anhydride is 1.

(環氧化合物(a1-1)) 環氧化合物(a1-1)為於1分子中具有2個環氧基的化合物,可使用所有單體、寡聚物、聚合物,該分子量及分子結構並無特別限定。環氧化合物(a1-1)可單獨使用1種,亦可併用2種以上。 作為環氧化合物(a1-1),例如可舉出雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂,及雙酚AF型環氧樹脂等雙酚型環氧樹脂;tert-丁基鄰苯二酚型環氧樹脂、萘型環氧樹脂、萘酚型環氧樹脂、蒽型環氧樹脂、縮水甘油基酯型環氧樹脂、聯苯基型環氧樹脂、線狀脂肪族環氧樹脂、具有丁二烯結構的環氧樹脂、脂環式環氧樹脂、雜環式環氧樹脂、含有螺環的環氧樹脂、環己烷二甲醇型環氧樹脂、亞萘基醚型環氧樹脂等。其中亦由抑制樹脂組成物的初期黏度之上升,控制增黏速度之觀點來看,以雙酚型環氧樹脂為佳,以選自雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、雙酚AF型環氧樹脂的一種以上為較佳,以雙酚A型環氧樹脂為更佳。 (epoxy compound (a1-1)) The epoxy compound (a1-1) is a compound having two epoxy groups in one molecule, and any monomer, oligomer, or polymer can be used, and the molecular weight and molecular structure are not particularly limited. An epoxy compound (a1-1) may be used individually by 1 type, and may use 2 or more types together. Examples of the epoxy compound (a1-1) include bisphenol type epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, and bisphenol AF type epoxy resins. Epoxy resin; tert-butyl catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidyl ester type epoxy resin, biphenyl type ring Oxygen resin, linear aliphatic epoxy resin, epoxy resin with butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy resin containing spiro ring, cyclohexanedimethanol ring Oxygen resin, naphthylene ether type epoxy resin, etc. Among them, from the viewpoint of suppressing the initial viscosity increase of the resin composition and controlling the viscosity increasing speed, bisphenol epoxy resins are preferred, and bisphenol A epoxy resins and bisphenol F epoxy resins are preferred. , bisphenol S type epoxy resin, and bisphenol AF type epoxy resin are preferred, and bisphenol A type epoxy resin is more preferred.

環氧化合物(a1-1)的環氧當量可在乙烯基酯樹脂(A1)未凝膠化下得到,又由抑制樹脂組成物的初期黏度之上升,可適度地控制增黏速度之觀點來看,以170~ 1000為佳,較佳為170~500,更佳為170~400,較更佳為170~300。The epoxy equivalent of the epoxy compound (a1-1) can be obtained when the vinyl ester resin (A1) is not gelled, and from the viewpoint of suppressing the increase of the initial viscosity of the resin composition and moderately controlling the viscosity increase rate Look, 170~1000 is better, more preferably 170~500, more preferably 170~400, and more preferably 170~300.

由合成乙烯基酯樹脂(A)時的效率性及容易性之觀點來看,使用的環氧化合物(a1-1)在25℃條件下為液狀,環氧當量為300以下者為較佳。From the viewpoint of the efficiency and ease of synthesizing vinyl ester resin (A), the epoxy compound (a1-1) to be used is liquid at 25°C and has an epoxy equivalent of 300 or less. .

(不飽和一元酸(a1-2)) 不飽和一元酸(a1-2)為具有乙烯性不飽和基的單羧酸為佳,可單獨使用1種,亦可併用2種以上。 作為不飽和一元酸,例如可舉出(甲基)丙烯酸、巴豆酸、桂皮酸等。其中亦由可得到具有泛用性或乙烯基酯樹脂(A)之合成時的反應性,及良好硬化性之樹脂組成物的觀點來看,選自(甲基)丙烯酸、巴豆酸的至少1種為佳,以(甲基)丙烯酸為較佳,由耐藥品性之觀點來看,以甲基丙烯酸為更佳。 (unsaturated monobasic acid (a1-2)) The unsaturated monobasic acid (a1-2) is preferably a monocarboxylic acid having an ethylenically unsaturated group, and may be used alone or in combination of two or more. As unsaturated monobasic acid, (meth)acrylic acid, crotonic acid, cinnamic acid, etc. are mentioned, for example. Among them, at least 1 selected from (meth)acrylic acid and crotonic acid can be obtained from the viewpoint of obtaining a resin composition having general versatility, reactivity during synthesis of vinyl ester resin (A), and good curability. Among them, (meth)acrylic acid is preferred, and methacrylic acid is more preferred from the viewpoint of chemical resistance.

不飽和一元酸(a1-2)的量相對於環氧化合物(a1-1)之環氧基總量100莫耳而言,反應至不飽和一元酸(a1-2)之酸基總量成為75~95莫耳者為佳,較佳為77~93莫耳,更佳為79~91莫耳。 不飽和一元酸(a1-2)的酸基之總量若相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言為75莫耳以上時,乙烯基酯樹脂(A1)中因導入充分量的乙烯性不飽和基,故樹脂組成物容易表現良好硬化性。又,若將不飽和一元酸(a1-2)的酸基之總量相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言為95莫耳以下時,環氧化合物(a1-1)與不飽和一元酸(a1-2)的反應生成物與多元酸酐(a1-3)可充分地進行交聯而可容易得到具有良好增黏性的樹脂組成物。 The amount of unsaturated monobasic acid (a1-2) is relative to the epoxy group total amount 100 mole of epoxy compound (a1-1), reacts to the acid group total amount of unsaturated monobasic acid (a1-2) becomes 75-95 moles is preferred, more preferably 77-93 moles, more preferably 79-91 moles. When the total amount of acid groups of the unsaturated monobasic acid (a1-2) is 75 moles or more relative to 100 moles of the total amount of epoxy groups of the aforementioned epoxy compound (a1-1), the vinyl ester resin In (A1), since a sufficient amount of ethylenically unsaturated groups is introduced, the resin composition tends to exhibit good curability. Also, when the total amount of the acid groups of the unsaturated monobasic acid (a1-2) is 95 moles or less with respect to the total amount of 100 moles of the epoxy groups of the aforementioned epoxy compound (a1-1), the ring The reaction product of the oxygen compound (a1-1) and the unsaturated monobasic acid (a1-2) and the polybasic acid anhydride (a1-3) can be sufficiently cross-linked to easily obtain a resin composition with good thickening properties.

(多元酸酐(a1-3)) 多元酸酐(a1-3)為1分子內具有複數個羧基的化合物中至少2個羧基經脫水縮合而形成酸酐。此等中亦由乙烯基酯樹脂(A1)合成時的容易性、分子量或酸價之控制容易性,及可使樹脂組成物之黏度控制在適切範圍等觀點來看,以二元酸酐為佳。多元酸酐(a1-3)可單獨使用1種,亦可併用2種以上。 作為多元酸酐(a1-3),例如可舉出馬來酸酐、鄰苯二甲酸酐、琥珀酸酐、端亞甲基四氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐、3-甲基-1,2,3,6-四氫鄰苯二甲酸酐、4-甲基-1,2,3,6-四氫鄰苯二甲酸酐、3-甲基-六氫鄰苯二甲酸酐、4-甲基-六氫鄰苯二甲酸酐、甲基-3,6-端亞甲基-1,2,3,6-四氫鄰苯二甲酸酐、偏苯三酸酐等。此等可單獨使用,亦可使用2種以上。其中亦由獲得容易性或乙烯基酯樹脂(A1)合成時的反應性、合成時的處理容易性等觀點來看,以馬來酸酐,及鄰苯二甲酸酐為佳,以馬來酸酐為較佳。 (polyanhydride (a1-3)) The polybasic acid anhydride (a1-3) is an acid anhydride formed by dehydration condensation of at least two carboxyl groups in a compound having a plurality of carboxyl groups in one molecule. Among these, dibasic acid anhydrides are preferred from the viewpoints of ease of synthesis of vinyl ester resin (A1), ease of control of molecular weight or acid value, and ability to control the viscosity of the resin composition within an appropriate range. . The polybasic acid anhydride (a1-3) may be used individually by 1 type, and may use 2 or more types together. Examples of the polybasic acid anhydride (a1-3) include maleic anhydride, phthalic anhydride, succinic anhydride, terminal methylenetetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 3-methanoic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, 4-methyl-1,2,3,6-tetrahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride Acid anhydride, 4-methyl-hexahydrophthalic anhydride, methyl-3,6-end methylene-1,2,3,6-tetrahydrophthalic anhydride, trimellitic anhydride, etc. These may be used individually, and may use 2 or more types. Among them, maleic anhydride and phthalic anhydride are preferred, and maleic anhydride is preferred from the viewpoints of availability, reactivity during synthesis of vinyl ester resin (A1), and ease of handling during synthesis. better.

多元酸酐(a1-3)具有使環氧化合物(a1-1)與羥基的反應生成物進行交聯而使乙烯基酯樹脂(A1)高分子化的角色。乙烯基酯樹脂(A1)進行高分子化之機構推測如以下所示。 藉由環氧化合物(a1-1)的環氧基與不飽和一元酸(a1-2)的羧基之反應,環氧化合物(a1-1)的環氧基經開環而產生羥基,對於該羥基開環加成多元酸酐(a1-3)。然後,藉由多元酸酐(a1-3)的開環加成而產生的羧基與環氧化合物(a1-1)的未反應之環氧基進一步反應而交聯並高分子化。 藉由將如此乙烯基酯樹脂(A1)進行高分子化,因分子量分布往高分子側移動故可增大樹脂組成物之增黏速度。 The polybasic acid anhydride (a1-3) has the role of crosslinking the reaction product of an epoxy compound (a1-1) and a hydroxyl group, and polymerizing a vinyl ester resin (A1). The mechanism of polymerization of the vinyl ester resin (A1) is estimated as follows. By the reaction of the epoxy group of the epoxy compound (a1-1) and the carboxyl group of the unsaturated monobasic acid (a1-2), the epoxy group of the epoxy compound (a1-1) generates a hydroxyl group through ring opening, for this Hydroxyl ring-opening addition of polybasic acid anhydride (a1-3). Then, the carboxyl group generated by the ring-opening addition of the polybasic acid anhydride (a1-3) further reacts with the unreacted epoxy group of the epoxy compound (a1-1) to crosslink and polymerize. By polymerizing the vinyl ester resin (A1) in this way, the viscosity increase rate of the resin composition can be increased because the molecular weight distribution shifts to the polymer side.

多元酸酐(a1-3)的量相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,反應至來自多元酸酐(a1-3)的酸基之總量成為5~25莫耳者為佳,較佳為7~23莫耳,更佳為9~21莫耳。 藉由反應至來自多元酸酐(a1-3)的酸基之總量相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言成為5莫耳以上,經環氧化合物(a1-1)與多元酸酐(a1-3)之交聯,乙烯基酯樹脂(A1)的分子量增加,可使樹脂組成物有效率地增黏。又,藉由反應至來自多元酸酐(a1-3)的酸基之總量相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言成為25莫耳以下,控制前述環氧化合物(a1-1)的交聯量變得容易,乙烯基酯樹脂(A1)合成時之凝膠化受到抑制,樹脂組成物之增黏速度變得容易控制。 The amount of polybasic acid anhydride (a1-3) is relative to the total amount of 100 moles of epoxy groups of the aforementioned epoxy compound (a1-1), and the total amount of the acid group that is reacted to come from polybasic acid anhydride (a1-3) becomes 5-25 moles is preferred, more preferably 7-23 moles, more preferably 9-21 moles. By reacting until the total amount of acid groups derived from polybasic acid anhydride (a1-3) becomes 5 moles or more relative to the total amount of epoxy groups of the aforementioned epoxy compound (a1-1) 100 moles, the epoxy The crosslinking of the compound (a1-1) and the polybasic anhydride (a1-3) increases the molecular weight of the vinyl ester resin (A1), which can effectively increase the viscosity of the resin composition. Also, by reacting until the total amount of the acid groups from the polybasic acid anhydride (a1-3) becomes 25 moles or less with respect to the total amount of 100 moles of the epoxy groups of the aforementioned epoxy compound (a1-1), the control The amount of crosslinking of the aforementioned epoxy compound (a1-1) becomes easier, the gelation during synthesis of the vinyl ester resin (A1) is suppressed, and the rate of thickening of the resin composition becomes easier to control.

對於本實施形態,反應至相對於環氧化合物(a1-1)之環氧基總量100莫耳而言,來自不飽和一元酸(a1-2)及多元酸酐(a1-3)的酸基(其中所謂「酸基」表示多元酸酐(a1-3)經水解而產生的酸基。例如多元酸酐(a1-3)為二元酸酐之情況時,自1分子所產生的酸基之數為2。)的總量成為105~125莫耳者為佳,較佳為107~123莫耳,更佳為109~121莫耳。 藉由反應至來自不飽和一元酸(a1-2)及多元酸酐(a1-3)的酸基之總量相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言成為105莫耳以上,來自前述環氧化合物(a1-1)的未反應之環氧基量受到抑制,樹脂組成物之增黏速度的控制變得容易。又,藉由反應至來自不飽和一元酸(a1-2)及多元酸酐(a1-3)的酸基之總量相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言成為125莫耳以下,可控制無凝膠化而反應且乙烯基酯樹脂(A1)中之未反應的不飽和一元酸(a1-2)及多元酸酐(a1-3)的殘存可受到抑制,且可抑制對樹脂組成物之增黏速度的影響。 For this embodiment, the acid group from unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) is reacted to 100 moles of the total amount of epoxy groups relative to epoxy compound (a1-1). (The so-called "acid group" refers to the acid group produced by hydrolysis of the polybasic acid anhydride (a1-3). For example, when the polybasic acid anhydride (a1-3) is a binary acid anhydride, the number of acid groups generated from one molecule is 2.) The total amount is preferably 105~125 moles, more preferably 107~123 moles, more preferably 109~121 moles. By reacting to the total amount of acid groups from unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) relative to the total amount of epoxy groups of the aforementioned epoxy compound (a1-1) 100 moles When it becomes 105 mol or more, the amount of unreacted epoxy group derived from the said epoxy compound (a1-1) is suppressed, and the control of the thickening rate of a resin composition becomes easy. Also, by reacting until the total amount of acid groups from unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) relative to the total amount of epoxy groups of the aforementioned epoxy compound (a1-1) is 100 mo If it is less than 125 moles, the reaction without gelation can be controlled, and the remaining unreacted unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) in the vinyl ester resin (A1) can be reduced. It is suppressed, and can suppress the influence on the viscosity increasing speed of the resin composition.

(多元酸酐(a1-4)) 作為多元酸酐(a1-4)若為於1分子內具有複數個羧基的化合物,至少2個羧基經脫水縮合而可形成酸酐者即可並無特別限定。例如可舉出與多元酸酐(a1-3)之相同者,其中亦由乙烯基酯樹脂(A1)的分子量及酸價之控制容易性、合成時之處理容易性以及樹脂組成物的良好黏度特性等觀點來看以二元酸酐為佳。多元酸酐(a1-4)可單獨使用1種,亦可併用2種以上。 作為多元酸酐(a1-4)的具體例子,可舉出與多元酸酐(a1-3)之相同者,以馬來酸酐為較佳。 多元酸酐(a1-3)與多元酸酐(a1-4)可使用相同者,亦可使用相異者。 (polyanhydride (a1-4)) The polybasic acid anhydride (a1-4) is not particularly limited as long as it is a compound having a plurality of carboxyl groups in one molecule, and at least two carboxyl groups can be dehydrated and condensed to form an acid anhydride. For example, the same ones as polybasic acid anhydrides (a1-3) can be mentioned, among them, the ease of controlling the molecular weight and acid value of the vinyl ester resin (A1), the ease of handling during synthesis, and the good viscosity characteristics of the resin composition From other viewpoints, dibasic acid anhydrides are preferred. The polybasic acid anhydride (a1-4) may be used individually by 1 type, and may use 2 or more types together. Specific examples of the polybasic acid anhydride (a1-4) include the same ones as the polybasic acid anhydride (a1-3), and maleic anhydride is preferred. The polybasic acid anhydride (a1-3) and the polybasic acid anhydride (a1-4) may use the same thing, and may use a different thing.

多元酸酐(a1-4)扮演著藉由與逐次反應前述環氧化合物(a1-1)、前述不飽和一元酸(a1-2)與多元酸酐(a1-3)而得的作為反應生成物之樹脂前驅物(P1)進行反應,繼續對前述多元酸酐(a1-3)以同樣反應機制與環氧化合物(a1-1)進行交聯,或對樹脂前驅物(P1)導入羧基等角色。即,多元酸酐(a1-4)加成於來自環氧化合物(a1-1)的環氧基經開環所產生的羥基之同時產生羧基。然後,所產生的羧基與來自環氧化合物(a1-1)的未反應之環氧基進行反應並進行交聯,所有環氧基經反應後,來自多元酸酐(a1-4)的羧基除此以上並無進行交聯而直接殘留,於乙烯基酯樹脂(A1)導入羧基。The polybasic acid anhydride (a1-4) acts as one of the reaction products obtained by successively reacting the aforementioned epoxy compound (a1-1), the aforementioned unsaturated monobasic acid (a1-2) and the polybasic acid anhydride (a1-3). The resin precursor (P1) reacts to continue to cross-link the aforementioned polybasic acid anhydride (a1-3) with the epoxy compound (a1-1) through the same reaction mechanism, or to introduce carboxyl groups into the resin precursor (P1). That is, the polybasic acid anhydride (a1-4) is added to the hydroxyl group derived from the ring-opening of the epoxy group of the epoxy compound (a1-1), and a carboxyl group is generated. Then, the generated carboxyl group reacts with the unreacted epoxy group from the epoxy compound (a1-1) and cross-links. After all the epoxy groups are reacted, the carboxyl group from the polybasic anhydride (a1-4) is removed The above remains without being cross-linked, and carboxyl groups are introduced into the vinyl ester resin (A1).

反應至多元酸酐(a1-4)相對於環氧化合物(a1-1)之環氧基總量100莫耳而言,多元酸酐(a1-4)成為3~60莫耳者為佳,較佳為5~50莫耳,更佳為7~45莫耳。藉由反應多元酸酐(a1-4)至相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言成為3莫耳以上,藉由抑制於乙烯基酯樹脂(A1)之未反應環氧基的殘存,樹脂組成物的初期黏度之上升可受到抑制,又藉由羧基之導入,欲提高樹脂組成物之增黏速度而必要的充分量之羧基導入於乙烯基酯樹脂(A1),又來自環氧化合物(a1-1)的環氧基經開環所產生的羥基藉由以多元酸酐(a1-4)的加成而被消費,可減低樹脂組成物之初期黏度。又,藉由使多元酸酐(a1-4)進行反應至相對於前述環氧化合物(a1-1)的環氧基之總量100莫耳而言成為60莫耳以下,樹脂組成物之增黏速度變得容易控制。Reaction until polybasic acid anhydride (a1-4) relative to epoxy compound (a1-1) epoxy group total amount 100 moles, polybasic acid anhydride (a1-4) becomes 3~60 moles preferably, preferably 5-50 moles, more preferably 7-45 moles. By reacting polybasic acid anhydride (a1-4) to 3 moles or more with respect to the total amount of epoxy groups of the aforementioned epoxy compound (a1-1) 100 moles, by inhibiting vinyl ester resin (A1 ) of the unreacted epoxy group remains, the initial viscosity increase of the resin composition can be suppressed, and by the introduction of the carboxyl group, a sufficient amount of carboxyl group necessary to increase the viscosity of the resin composition is introduced into the vinyl ester Resin (A1), and the hydroxyl group generated by the ring-opening of the epoxy group from the epoxy compound (a1-1) is consumed by the addition of polybasic anhydride (a1-4), which can reduce the initial stage of the resin composition. viscosity. In addition, by reacting the polybasic acid anhydride (a1-4) to 60 moles or less with respect to the total amount of epoxy groups of the epoxy compound (a1-1) of 100 moles, the viscosity of the resin composition can be increased. Speed becomes easy to control.

[乙烯基酯樹脂(A2)] 前述乙烯基酯樹脂(A2)為於1分子中具有2個以上環氧基的環氧化合物(a2-1)及不飽和一元酸(a2-2)的反應生成物。 樹脂組成物藉由含有乙烯基酯樹脂(A2),可變得更容易控制樹脂組成物之增黏速度。又,亦可調整樹脂組成物之初期黏度及硬化物之物性。 [vinyl ester resin (A2)] Said vinyl ester resin (A2) is the reaction product of the epoxy compound (a2-1) which has 2 or more epoxy groups in 1 molecule, and an unsaturated monobasic acid (a2-2). When the resin composition contains the vinyl ester resin (A2), it becomes easier to control the viscosity increase rate of the resin composition. In addition, the initial viscosity of the resin composition and the physical properties of the cured product can also be adjusted.

乙烯基酯樹脂(A2)的重量平均分子量(Mw)以500~6,000為佳,較佳為500~5,000,更佳為500~4,500。 重量平均分子量(Mw)若為500以上,可容易提高樹脂組成物的硬化物之機械性強度。又,重量平均分子量(Mw)若為6,000以下,作為樹脂組成物時,可容易溶解含於樹脂組成物的其他成分,變得更容易處理。乙烯基酯樹脂(A2)的重量平均分子量(Mw)可藉由與乙烯基酯樹脂(A1)之同樣方法進行測定。 The weight average molecular weight (Mw) of the vinyl ester resin (A2) is preferably 500-6,000, more preferably 500-5,000, more preferably 500-4,500. When the weight average molecular weight (Mw) is 500 or more, the mechanical strength of the cured product of the resin composition can be easily improved. In addition, if the weight average molecular weight (Mw) is 6,000 or less, other components contained in the resin composition can be easily dissolved when used as a resin composition, and handling becomes easier. The weight average molecular weight (Mw) of vinyl ester resin (A2) can be measured by the method similar to vinyl ester resin (A1).

乙烯基酯樹脂(A2)的數平均分子量Mn由可有效率地使樹脂組成物更增黏的觀點來看,以400以上為佳,較佳為500以上,更佳為600以上,由控制樹脂組成物的增黏速度之觀點來看,以1,500以下為佳,較佳為1,200以下,更佳為1,000以下。The number average molecular weight Mn of the vinyl ester resin (A2) is preferably 400 or more, more preferably 500 or more, and more preferably 600 or more from the viewpoint of efficiently making the resin composition more viscous. From the viewpoint of the viscosity increasing rate of the composition, it is preferably 1,500 or less, more preferably 1,200 or less, more preferably 1,000 or less.

乙烯基酯樹脂(A2)的Mw/Mn由合成條件的控制容易度的觀點來看,以1.05以上為佳,較佳為1.1以上,由抑制樹脂組成物的物性分散,且控制增黏速度的觀點來看,以2.0以下為佳,較佳為1.7以下,更佳為1.5以下。 且,Mw/Mn表示分子量分布之指標,其為1時表示單分散聚合物,該比越大表示分子量分布越廣的意思。 The Mw/Mn of the vinyl ester resin (A2) is preferably 1.05 or more, more preferably 1.1 or more from the viewpoint of the ease of control of the synthesis conditions, because it suppresses the dispersion of the physical properties of the resin composition and controls the viscosity increasing rate. From a viewpoint, it is preferably 2.0 or less, more preferably 1.7 or less, more preferably 1.5 or less. In addition, Mw/Mn represents an index of molecular weight distribution, and when it is 1, it represents a monodisperse polymer, and the larger the ratio, the wider the molecular weight distribution.

(環氧化合物(a2-1)) 作為前述環氧化合物(a2-1),可使用於1分子中具有2個以上環氧基的化合物,可使用單體、寡聚物、聚合物全部,該分子量及分子結構並無特別限定。前述環氧化合物(a2-1)為於1分子中所具有的環氧基可為2個亦可為3個以上。環氧化合物(a2-1)可單獨使用1種,亦可併用2種以上。 作為前述環氧化合物(a2-1),例如與使用於上述乙烯基酯樹脂(A1)的環氧化合物(a1-1)同樣者以外,可舉出芪型環氧樹脂;酚醛清漆型環氧樹脂;多官能環氧樹脂;酚芳烷基型環氧樹脂;含有三嗪核的環氧樹脂;有橋環狀烴化合物變性酚型環氧樹脂;縮水甘油基酯型環氧樹脂;含有噁唑烷酮環的環氧樹脂等。 (epoxy compound (a2-1)) As the epoxy compound (a2-1), a compound having two or more epoxy groups in one molecule can be used, and all monomers, oligomers, and polymers can be used, and the molecular weight and molecular structure are not particularly limited. The said epoxy compound (a2-1) may have 2 or 3 or more epoxy groups in 1 molecule. An epoxy compound (a2-1) may be used individually by 1 type, and may use 2 or more types together. Examples of the aforementioned epoxy compound (a2-1) include the same ones as the epoxy compound (a1-1) used in the aforementioned vinyl ester resin (A1), stilbene-type epoxy resins; novolac-type epoxy resins; Resin; Multifunctional epoxy resin; Phenol aralkyl type epoxy resin; Epoxy resin containing triazine nucleus; Denatured phenolic epoxy resin with bridged cyclic hydrocarbon compound; Glycidyl ester type epoxy resin; Epoxy resins with oxazolidone rings, etc.

(不飽和一元酸(a2-2)) 不飽和一元酸(a2-2)為具有乙烯性不飽和基的單羧酸為佳,可單獨使用1種,亦可併用2種以上。 作為前述不飽和一元酸(a2-2),可使用公知者。例如可使用與使用於上述乙烯基酯樹脂(A1)的(a1-1)之同樣者,可舉出(甲基)丙烯酸、巴豆酸、桂皮酸等。此等中亦以(甲基)丙烯酸為佳。 (unsaturated monobasic acid (a2-2)) The unsaturated monobasic acid (a2-2) is preferably a monocarboxylic acid having an ethylenically unsaturated group, and may be used alone or in combination of two or more. Known ones can be used as the unsaturated monobasic acid (a2-2). For example, the same thing as (a1-1) used for the said vinyl ester resin (A1) can be used, and (meth)acrylic acid, crotonic acid, cinnamic acid, etc. are mentioned. Among these, (meth)acrylic acid is also preferable.

反應不飽和一元酸(a2-2)至相對於環氧化合物(a2-1)的環氧基之總量100莫耳而言不飽和一元酸(a2-2)的酸基之總量成為80~100莫耳者為佳,較佳為90~100莫耳,更佳為99~100莫耳。 藉由將不飽和一元酸(a2-2)的酸基之總量反應至相對於前述環氧化合物(a2-1)的環氧基之總量100莫耳而言成為80莫耳以上,於乙烯基酯樹脂(A2)所含的未反應之環氧基與含於乙烯基酯樹脂(A1)的羧基進行反應,可容易抑制樹脂組成物之增黏速度變得過大。又,由控制增黏速度,以及調製樹脂組成物後2天及/或5天之黏度的觀點,及由製造穩定性之觀點來看,於乙烯基酯樹脂(A2)未殘存未反應的環氧基者為佳,相對於環氧化合物(a2-1)的環氧基之總量100莫耳而言,不飽和一元酸(a2-2)的酸基之總量以100莫耳者為佳。 Reaction of unsaturated monobasic acid (a2-2) until the total amount of acid groups of unsaturated monobasic acid (a2-2) becomes 80 moles relative to the total amount of epoxy groups of epoxy compound (a2-1) 100 moles ~100 moles is preferred, more preferably 90~100 moles, more preferably 99~100 moles. By reacting the total amount of the acid groups of the unsaturated monobasic acid (a2-2) to become 80 moles or more with respect to the total amount of 100 moles of the epoxy groups of the aforementioned epoxy compound (a2-1), in The reaction between the unreacted epoxy group contained in the vinyl ester resin (A2) and the carboxyl group contained in the vinyl ester resin (A1) can easily prevent the viscosity increase rate of the resin composition from becoming too high. Also, from the viewpoint of controlling the viscosity increasing rate and the viscosity of the resin composition 2 days and/or 5 days after preparation, and from the viewpoint of production stability, no unreacted rings remain in the vinyl ester resin (A2). Oxygen group is preferably, relative to the total amount of 100 moles of the epoxy group of epoxy compound (a2-1), the total amount of the acid group of unsaturated monobasic acid (a2-2) is with 100 moles. good.

樹脂組成物含有乙烯基酯樹脂(A2)之情況時,乙烯基酯樹脂(A1)的含有量相對於乙烯基酯樹脂(A1)與乙烯基酯樹脂(A2)的合計100質量份而言,乙烯基酯樹脂(A1)設定在35~90質量份為佳,較佳為40~85質量份,更佳為45~80質量份。乙烯基酯樹脂(A2)的含有量相對於乙烯基酯樹脂(A1)與乙烯基酯樹脂(A2)的合計100質量份而言,以設定在10~65質量份者為佳,較佳為15~60質量份,更佳為20~55質量份。樹脂組成物中含有上述範圍的乙烯基酯樹脂(A1)與乙烯基酯樹脂(A2)時,進一步控制樹脂組成物之增黏速度變得容易。When the resin composition contains a vinyl ester resin (A2), the content of the vinyl ester resin (A1) is 100 parts by mass of the total of the vinyl ester resin (A1) and the vinyl ester resin (A2), The vinyl ester resin (A1) is preferably 35-90 parts by mass, more preferably 40-85 parts by mass, more preferably 45-80 parts by mass. The content of the vinyl ester resin (A2) is preferably set at 10 to 65 parts by mass with respect to the total of 100 parts by mass of the vinyl ester resin (A1) and the vinyl ester resin (A2), preferably 10 to 65 parts by mass, more preferably 15-60 parts by mass, more preferably 20-55 parts by mass. When the vinyl ester resin (A1) and vinyl ester resin (A2) in the above-mentioned range are contained in the resin composition, it becomes easy to further control the thickening speed of the resin composition.

乙烯基酯樹脂(A)的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)與後述含有乙烯性不飽和基的單體(B)的合計100質量份而言,以20~80質量份者為佳,較佳為30~70質量份,更佳為40~60質量份。將乙烯基酯樹脂(A)設定在20質量份以上時,藉由乙烯基酯樹脂(A1)可容易使樹脂組成物的增黏速度良好地加速。若乙烯基酯樹脂(A)為80質量份以下時,藉由含有乙烯性不飽和基的單體(B),容易使樹脂組成物之初期黏度減低。The content of the vinyl ester resin (A) in the resin composition is 20 to 80 parts by mass relative to the total of 100 parts by mass of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B) described later. Parts by mass are preferred, preferably 30 to 70 parts by mass, more preferably 40 to 60 parts by mass. When the vinyl ester resin (A) is 20 parts by mass or more, the thickening rate of the resin composition can be easily accelerated by the vinyl ester resin (A1). When the vinyl ester resin (A) is 80 parts by mass or less, the initial viscosity of the resin composition is easily reduced by the ethylenically unsaturated group-containing monomer (B).

乙烯基酯樹脂(A)的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以20~75質量份者為佳,較佳為30~65質量份,更佳為40~60質量份。乙烯基酯樹脂(A)若為20質量份以上時,藉由乙烯基酯樹脂(A1)可容易良好地加速樹脂組成物之增黏速度。乙烯基酯樹脂(A)若為75質量份以下時,藉由含有乙烯性不飽和基的單體(B)可容易減低樹脂組成物之初期黏度。The content of the vinyl ester resin (A) in the resin composition is preferably 20 to 75 parts by mass, more preferably 30 to 65 parts by mass, more preferably 30 to 65 parts by mass, relative to 100 parts by mass of the total amount of the resin composition 40 to 60 parts by mass. When the vinyl ester resin (A) is at least 20 parts by mass, the vinyl ester resin (A1) can easily and favorably accelerate the rate of thickening of the resin composition. When the vinyl ester resin (A) is 75 parts by mass or less, the initial viscosity of the resin composition can be easily reduced by the ethylenically unsaturated group-containing monomer (B).

<含有乙烯性不飽和基的單體(B)> 前述含有乙烯性不飽和基的單體(B)若具有乙烯性不飽和基即可並無特別限制,以具有(甲基)丙烯醯基或乙烯基者為佳。 含有乙烯性不飽和基的單體(B)中含有量越多,樹脂組成物之初期黏度上升越受到抑制,對控制增黏速度或增黏後的到達黏度之方向產生作用。又,可提高含有後述樹脂組成物之複合材料等硬度、強度、耐藥品性、耐水性等。 <Ethylenically unsaturated group-containing monomer (B)> The aforementioned ethylenically unsaturated group-containing monomer (B) is not particularly limited as long as it has an ethylenically unsaturated group, but preferably has a (meth)acryl group or a vinyl group. The more the ethylenically unsaturated group-containing monomer (B) contains, the more the initial viscosity increase of the resin composition is suppressed, which has an effect on controlling the viscosity increasing speed or the direction of the viscosity after increasing the viscosity. In addition, hardness, strength, chemical resistance, water resistance, etc. of composite materials containing the resin composition described later can be improved.

含有乙烯性不飽和基的單體(B)之中,作為具有(甲基)丙烯醯基者,例如可舉出(甲基)丙烯酸、(甲基)丙烯酸酯等。(甲基)丙烯酸酯可為單官能亦可為多官能。Among the ethylenically unsaturated group-containing monomers (B), those having a (meth)acryl group include, for example, (meth)acrylic acid, (meth)acrylate, and the like. (Meth)acrylate may be monofunctional or polyfunctional.

作為單官能性(甲基)丙烯酸酯,例如可舉出甲基(甲基)丙烯酸酯、乙基(甲基)丙烯酸酯、n-丁基(甲基)丙烯酸酯、i-丁基(甲基)丙烯酸酯、t-丁基(甲基)丙烯酸酯、2-乙基己基、月桂基(甲基)丙烯酸酯、環己基(甲基)丙烯酸酯、苯甲基(甲基)丙烯酸酯、硬脂基(甲基)丙烯酸酯、十三烷基(甲基)丙烯酸酯、苯氧基乙基(甲基)丙烯酸酯、二環戊烯基氧基乙基(甲基)丙烯酸酯、乙二醇單甲基醚(甲基)丙烯酸酯、乙二醇單乙基醚(甲基)丙烯酸酯、乙二醇單丁基醚(甲基)丙烯酸酯、乙二醇單己基醚(甲基)丙烯酸酯、乙二醇單2-乙基己基醚(甲基)丙烯酸酯、二乙二醇單甲基醚(甲基)丙烯酸酯、二乙二醇單乙基醚(甲基)丙烯酸酯、二乙二醇單丁基醚(甲基)丙烯酸酯、二乙二醇單己基醚(甲基)丙烯酸酯、二乙二醇單2-乙基己基醚(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、二環戊烯基氧基乙基(甲基)丙烯酸酯、三環癸基(甲基)丙烯酸酯、二甲基胺基乙基(甲基)丙烯酸酯、二乙基胺基乙基(甲基)丙烯酸酯、己內酯變性羥基烷基(甲基)丙烯酸酯、烯丙基(甲基)丙烯酸酯等。Examples of monofunctional (meth)acrylates include meth (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, base) acrylate, t-butyl (meth)acrylate, 2-ethylhexyl, lauryl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, Stearyl (meth)acrylate, tridecyl (meth)acrylate, phenoxyethyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, ethyl Glycol monomethyl ether (meth)acrylate, ethylene glycol monoethyl ether (meth)acrylate, ethylene glycol monobutyl ether (meth)acrylate, ethylene glycol monohexyl ether (methyl) ) acrylate, ethylene glycol mono-2-ethylhexyl ether (meth)acrylate, diethylene glycol monomethyl ether (meth)acrylate, diethylene glycol monoethyl ether (meth)acrylate , Diethylene glycol monobutyl ether (meth) acrylate, diethylene glycol monohexyl ether (meth) acrylate, diethylene glycol mono 2-ethylhexyl ether (meth) acrylate, bicyclic Pentenyl (meth)acrylate, Dicyclopentenyloxyethyl (meth)acrylate, Tricyclodecanyl (meth)acrylate, Dimethylaminoethyl (meth)acrylate , Diethylaminoethyl (meth)acrylate, caprolactone-modified hydroxyalkyl (meth)acrylate, allyl (meth)acrylate, etc.

作為多官能性(甲基)丙烯酸酯,例如可舉出乙二醇二(甲基)丙烯酸酯、1,2-丙二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯及1,6-己二醇二(甲基)丙烯酸酯等烷烴二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯及聚四甲二醇二(甲基)丙烯酸酯等聚氧化烯甘醇二(甲基)丙烯酸酯,又可舉出三羥甲基丙烷二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、季戊四醇二丙烯酸酯單硬脂酸酯、1,3-雙((甲基)丙烯醯氧基)-2-羥基丙烷、乙氧基化雙酚A二(甲基)丙烯酸酯、參-(2-(甲基)丙烯醯氧基乙基)異氰脲酸酯等。Examples of polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, 1,2-propanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, ) acrylate, 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate and 1,6-hexanediol di(meth)acrylate etc. (meth)acrylate, diethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate Polyoxyalkylene glycol di(meth)acrylate such as acrylate, polyethylene glycol di(meth)acrylate and polytetramethylene glycol di(meth)acrylate, and trimethylolpropane Di(meth)acrylate, glycerin di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate (meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, pentaerythritol diacrylate monostearate, 1,3-bis((meth)acryloxy )-2-hydroxypropane, ethoxylated bisphenol A di(meth)acrylate, ginseng-(2-(meth)acryloxyethyl)isocyanurate, etc.

含有乙烯性不飽和基的單體(B)之中,除(甲基)丙烯酸酯以外,作為具有(甲基)丙烯醯基者,例如可舉出丙烯醯嗎啉、2-羥基乙基(甲基)丙烯醯胺、2-羥基乙基-N-甲基(甲基)丙烯醯胺、3-羥基丙基(甲基)丙烯醯胺等。除具有(甲基)丙烯醯基者以外,作為具有乙烯基者,例如可舉出苯乙烯、p-氯苯乙烯、乙烯基甲苯、α-甲基苯乙烯、二氯苯乙烯、二乙烯基苯、t-丁基苯乙烯、乙酸乙烯基、二烯丙基富馬酸酯、三烯丙基異氰脲酸酯,又可舉出乙烯基苯甲基丁基醚、乙烯基苯甲基己基醚、乙烯基苯甲基辛基醚、二乙烯基苯甲基醚等乙烯基苯甲基化合物等。Among the ethylenically unsaturated group-containing monomers (B), those having (meth)acryl groups other than (meth)acrylates include, for example, acryloylmorpholine, 2-hydroxyethyl ( Meth)acrylamide, 2-hydroxyethyl-N-methyl(meth)acrylamide, 3-hydroxypropyl(meth)acrylamide, and the like. In addition to those having a (meth)acryl group, examples of those having a vinyl group include styrene, p-chlorostyrene, vinyltoluene, α-methylstyrene, dichlorostyrene, divinyl Benzene, t-butylstyrene, vinyl acetate, diallyl fumarate, triallyl isocyanurate, vinyl benzyl butyl ether, vinyl benzyl Vinyl benzyl compounds such as hexyl ether, vinyl benzyl octyl ether, and divinyl benzyl ether.

此等中,亦由樹脂組成物之增黏速度的控制、硬化性、乾燥性等觀點來看,又由含有樹脂組成物之複合材料的強度、靭性、耐熱性、耐藥品性等觀點,以及成本之觀點來看,以選自苯乙烯、甲基(甲基)丙烯酸酯、苯氧基乙基(甲基)丙烯酸酯、苯甲基(甲基)丙烯酸酯、二環戊烯基(甲基)丙烯酸酯、二環戊烯基氧基乙基(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯,及新戊二醇(甲基)丙烯酸酯的至少1種為較佳,由臭氣抑制之觀點來看,以選自苯氧基乙基(甲基)丙烯酸酯、苯甲基(甲基)丙烯酸酯,及二乙二醇二(甲基)丙烯酸酯、新戊二醇(甲基)丙烯酸酯的至少1種為較佳,由樹脂組成物的硬化物之耐藥品性之觀點來看,以選自苯氧基乙基甲基丙烯酸酯、苯甲基(甲基)丙烯酸酯,及二乙二醇二甲基丙烯酸酯、新戊二醇(甲基)丙烯酸酯的至少1種為更佳。Among these, it is also from the viewpoints of the control of the viscosity increase rate of the resin composition, curability, drying, etc., and from the viewpoints of the strength, toughness, heat resistance, chemical resistance, etc. of the composite material containing the resin composition, and From the point of view of cost, it is selected from styrene, methyl (meth)acrylate, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, dicyclopentenyl (meth)acrylate base) acrylate, dicyclopentenyloxyethyl (meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate At least one of (meth)acrylate and neopentyl glycol (meth)acrylate is preferred. From the viewpoint of odor suppression, it is selected from phenoxyethyl (meth)acrylate, Benzyl (meth)acrylate, and at least one of diethylene glycol di(meth)acrylate and neopentyl glycol (meth)acrylate are preferred, and the resistance of the cured product of the resin composition is From the point of view of drug properties, selected from phenoxyethyl methacrylate, benzyl (meth)acrylate, diethylene glycol dimethacrylate, neopentyl glycol (meth)acrylic acid At least one kind of ester is more preferable.

含有乙烯性不飽和基的單體(B)的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)與含有乙烯性不飽和基的單體(B)的合計100質量份,以20~80質量份者為佳,較佳為30~70質量份,更佳為40~60質量份。 含有乙烯性不飽和基的單體(B)若為20質量份以上時,可容易減低樹脂組成物之初期黏度,使作業性變得良好。含有乙烯性不飽和基的單體(B)若為80質量份以下時,可成為增黏性更良好的樹脂組成物。 The content of the ethylenically unsaturated group-containing monomer (B) in the resin composition is based on 20 parts by mass of the total of vinyl ester resin (A) and ethylenically unsaturated group-containing monomer (B). Preferably ~80 parts by mass, more preferably 30~70 parts by mass, more preferably 40~60 parts by mass. When the ethylenically unsaturated group-containing monomer (B) is 20 parts by mass or more, the initial viscosity of the resin composition can be easily reduced, and workability can be improved. When the ethylenically unsaturated group-containing monomer (B) is 80 parts by mass or less, it becomes a resin composition with better thickening properties.

含有乙烯性不飽和基的單體(B)的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以20~75質量份者為佳,較佳為30~65質量份,更佳為40~60質量份。 含有乙烯性不飽和基的單體(B)若為20質量份以上時,容易減低樹脂組成物之初期黏度,作業性變得良好。含有乙烯性不飽和基的單體(B)若為75質量份以下時,可成為增黏性變得更良好的樹脂組成物。 The content of the ethylenically unsaturated group-containing monomer (B) in the resin composition is preferably 20 to 75 parts by mass, more preferably 30 to 65 parts by mass relative to 100 parts by mass of the total amount of the resin composition. parts by mass, more preferably 40 to 60 parts by mass. When the ethylenically unsaturated group-containing monomer (B) is 20 parts by mass or more, the initial viscosity of the resin composition tends to decrease, and workability becomes favorable. When the ethylenically unsaturated group-containing monomer (B) is 75 parts by mass or less, it becomes a resin composition with better thickening properties.

<化合物(C)> 化合物(C)可為選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種,可單獨1種亦可併用2種以上。化合物(C)為與乙烯基酯樹脂(A)所具有羧基及羥基,作為其他助劑具有羧基及羥基之化合物進行相互作用,具有使樹脂組成物經時性增黏的效果。 <Compound (C)> The compound (C) may be at least one kind selected from oxides and hydroxides of metals belonging to Group 2 elements, and may be used alone or in combination of two or more kinds. The compound (C) interacts with the carboxyl group and hydroxyl group of the vinyl ester resin (A) and the compound having the carboxyl group and hydroxyl group as other additives, and has the effect of increasing the viscosity of the resin composition over time.

作為屬於第2族元素的金屬之氧化物,例如可舉出氧化鎂、氧化鈣、氧化鋇等。 作為屬於第2族元素的金屬之氫氧化物,例如可舉出鎂、鈣、鋇等氫氧化物等。 其中亦由增黏效果、泛用性,及成本等觀點來看,以氧化鎂為佳。 Examples of oxides of metals belonging to Group 2 elements include magnesium oxide, calcium oxide, barium oxide, and the like. Examples of hydroxides of metals belonging to Group 2 elements include hydroxides of magnesium, calcium, barium, and the like. Among them, magnesium oxide is preferable from the viewpoints of thickening effect, versatility, and cost.

化合物(C)的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)及含有乙烯性不飽和基的單體(B)的合計100質量份而言,以0.01~6質量份為佳,較佳為0.05~5質量份,更佳為0.1~4質量份。若將化合物(C)設定在0.01質量份以上時,可使樹脂組成物之增黏性變得更良好。藉由將化合物(C)設定在6質量份以下時,樹脂組成物的過剩增黏變得容易抑制,又經時性增黏速度變得容易控制,可更充分確保時間。The content of the compound (C) in the resin composition is preferably 0.01 to 6 parts by mass relative to the total of 100 parts by mass of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B). , preferably 0.05 to 5 parts by mass, more preferably 0.1 to 4 parts by mass. When the compound (C) is at least 0.01 parts by mass, the thickening property of the resin composition can be further improved. By setting the compound (C) at 6 parts by mass or less, excessive thickening of the resin composition can be easily suppressed, and the rate of thickening over time can be easily controlled, allowing more sufficient time to be secured.

化合物(C)的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以0.01~6質量份為佳,較佳為0.05~5質量份,更佳為0.1~4質量份。化合物(C)若為0.01質量份以上時,樹脂組成物的增黏性變得更良好。化合物(C)若為6質量份以下時,樹脂組成物的過剩增黏變得容易抑制,又,經時性增黏速度變得容易控制,可更充分確保時間。The content of the compound (C) in the resin composition is preferably 0.01 to 6 parts by mass, more preferably 0.05 to 5 parts by mass, more preferably 0.1 to 4 parts by mass relative to 100 parts by mass of the total amount of the resin composition. parts by mass. When the compound (C) is 0.01 mass part or more, the thickening property of a resin composition will become more favorable. When the compound (C) is 6 parts by mass or less, excessive thickening of the resin composition can be easily suppressed, and the rate of thickening over time can be easily controlled, allowing more sufficient time to be secured.

<化合物(D)> 化合物(D)為選自水及含有羥基的化合物的至少1種以上。化合物(D),對於隨著時間經過的增黏速度之變化,以控制增黏速度作為目的而使用。含有羥基的化合物,例如可舉出苯甲基醇、硬脂基醇、異硬脂基醇等沸點50℃以上之醇。又,其他可舉出乳酸等羥基羧酸、甘油、多元醇、含有羥基的(甲基)丙烯酸酯等。此等可單獨使用1種,亦可併用2種以上。此等中亦由獲得性、成本等觀點來看,以水及醇為佳,較佳為水。 <Compound (D)> The compound (D) is at least one or more selected from water and hydroxyl-containing compounds. The compound (D) is used for the purpose of controlling the thickening speed with respect to the change in the thickening speed with the lapse of time. Examples of the hydroxyl group-containing compound include alcohols having a boiling point of 50° C. or higher such as benzyl alcohol, stearyl alcohol, and isostearyl alcohol. Moreover, others include hydroxycarboxylic acids such as lactic acid, glycerin, polyhydric alcohols, hydroxyl group-containing (meth)acrylates, and the like. These may be used individually by 1 type, and may use 2 or more types together. Among these, water and alcohol are preferable from the viewpoints of availability and cost, and water is more preferable.

化合物(D)的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)及含有乙烯性不飽和基的單體(B)的合計100質量份,以0.01~3質量份為佳,較佳為0.05~2質量份,更佳為0.1~1質量份。化合物(D)若為0.01質量份以上時,樹脂組成物的增黏速度變得容易控制,過剩增黏變得容易抑制。化合物(D)若為3質量份以下時,含有樹脂組成物的複合材料之強度、靭性、耐熱性,及耐藥品性等物性變得更良好者。The content of the compound (D) in the resin composition is preferably 0.01 to 3 parts by mass relative to the total of 100 parts by mass of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B). Preferably, it is 0.05-2 mass parts, More preferably, it is 0.1-1 mass parts. When the compound (D) is 0.01 parts by mass or more, the thickening rate of the resin composition becomes easy to control, and excessive thickening becomes easy to suppress. When the compound (D) is 3 parts by mass or less, the composite material containing the resin composition will have better physical properties such as strength, toughness, heat resistance, and chemical resistance.

化合物(D)的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以0.01~3質量份為佳,較佳為0.05~2質量份,更佳為0.1~1質量份。化合物(D)若為0.01質量份以上時,樹脂組成物的增黏速度變得容易控制,過剩增黏變得容易抑制。化合物(D)若為3質量份以下時,含有樹脂組成物的複合材料之強度、靭性、耐熱性,及耐藥品性等物性變得更良好者。The content of the compound (D) in the resin composition is preferably 0.01 to 3 parts by mass, more preferably 0.05 to 2 parts by mass, more preferably 0.1 to 1 parts by mass. When the compound (D) is 0.01 parts by mass or more, the thickening rate of the resin composition becomes easy to control, and excessive thickening becomes easy to suppress. When the compound (D) is 3 parts by mass or less, the composite material containing the resin composition will have better physical properties such as strength, toughness, heat resistance, and chemical resistance.

<聚合起始劑(E)> 樹脂組成物亦可進一步含有聚合起始劑(E)。聚合起始劑(E)中,光聚合起始劑及熱聚合起始劑中任一者亦可使用。由確保控制增黏速度,增黏至所定黏度的時間之觀點來看,樹脂組成物以含有光聚合起始劑者為佳。 <Polymerization initiator (E)> The resin composition may further contain a polymerization initiator (E). In the polymerization initiator (E), any one of a photopolymerization initiator and a thermal polymerization initiator can also be used. From the viewpoint of ensuring the control of the viscosity increasing speed and the time for increasing the viscosity to a predetermined viscosity, it is preferable that the resin composition contains a photopolymerization initiator.

作為聚合起始劑(E)而使用光聚合起始劑之情況時,光聚合起始劑的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)及含有乙烯性不飽和基的單體(B)的合計100質量份而言,以0.01~10質量份為佳,較佳為0.05~5質量份,更佳為0.1~3質量份。光聚合起始劑的含有量若為0.01質量份以上時,可得到硬化性更良好的樹脂組成物。光聚合起始劑的含有量若為10質量份以下時,樹脂組成物在硬化時不容易產生急激硬化反應及發熱,變得容易抑制裂紋,又,所得的複合材料成為強度、靭性、耐熱性,及耐藥品性等物性之平衡更優異者。When a photopolymerization initiator is used as the polymerization initiator (E), the content of the photopolymerization initiator in the resin composition is relative to the vinyl ester resin (A) and the monoethylenically unsaturated group-containing 0.01-10 mass parts is preferable with respect to a total of 100 mass parts of body (B), More preferably, it is 0.05-5 mass parts, More preferably, it is 0.1-3 mass parts. When the content of the photopolymerization initiator is 0.01 parts by mass or more, a resin composition with better curability can be obtained. When the content of the photopolymerization initiator is 10 parts by mass or less, the resin composition is less likely to undergo rapid curing reaction and heat generation during curing, and it becomes easier to suppress cracks, and the resulting composite material becomes stronger in strength, toughness, and heat resistance. , and the balance of physical properties such as chemical resistance is better.

作為聚合起始劑(E)而使用光聚合起始劑之情況時,光聚合起始劑的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以0.01~10質量份為佳,較佳為0.05~5質量份,更佳為0.1~3質量份。光聚合起始劑的含有量若為0.01質量份以上時,可得到硬化性更良好的樹脂組成物。光聚合起始劑的含有量若為10質量份以下時,樹脂組成物在硬化時不容易產生急激硬化反應及發熱,變得容易抑制裂紋,又,所得的複合材料成為強度、靭性、耐熱性,及耐藥品性等物性之平衡更優異者。When a photopolymerization initiator is used as the polymerization initiator (E), the content of the photopolymerization initiator in the resin composition is 0.01 to 10 parts by mass relative to 100 parts by mass of the total amount of the resin composition. Parts by mass are preferred, preferably 0.05 to 5 parts by mass, more preferably 0.1 to 3 parts by mass. When the content of the photopolymerization initiator is 0.01 parts by mass or more, a resin composition with better curability can be obtained. When the content of the photopolymerization initiator is 10 parts by mass or less, the resin composition is less likely to undergo rapid curing reaction and heat generation during curing, and it becomes easier to suppress cracks, and the resulting composite material becomes stronger in strength, toughness, and heat resistance. , and the balance of physical properties such as chemical resistance is better.

作為聚合起始劑(E)使用熱聚合起始劑的情況時,熱聚合起始劑的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)及含有乙烯性不飽和基的單體(B)的合計100質量份而言,以0.05~10質量份為佳,較佳為0.1~8質量份,更佳為0.5~5質量份。熱聚合起始劑的含有量若為0.05質量份以上時,可得到硬化性更良好的樹脂組成物。熱聚合起始劑的含有量若為10質量份以下時,含有樹脂組成物的複合材料成為強度、靭性、耐熱性,及耐藥品性等物性之平衡更優異者。When a thermal polymerization initiator is used as the polymerization initiator (E), the content of the thermal polymerization initiator in the resin composition is relative to the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer The total of 100 parts by mass of (B) is preferably 0.05 to 10 parts by mass, more preferably 0.1 to 8 parts by mass, more preferably 0.5 to 5 parts by mass. When the content of the thermal polymerization initiator is 0.05 parts by mass or more, a resin composition with better curability can be obtained. When the content of the thermal polymerization initiator is 10 parts by mass or less, the composite material containing the resin composition has a better balance of physical properties such as strength, toughness, heat resistance, and chemical resistance.

作為聚合起始劑(E)使用熱聚合起始劑的情況時,熱聚合起始劑的樹脂組成物中之含有量相對於樹脂組成物之總量100質量份而言,以0.05~10質量份為佳,較佳為0.1~8質量份,更佳為0.5~5質量份。熱聚合起始劑的含有量若為0.05質量份以上時,可得到硬化性更良好的樹脂組成物。熱聚合起始劑的含有量若為10質量份以下時,含有樹脂組成物的複合材料成為強度、靭性、耐熱性,及耐藥品性等物性之平衡更優異者。When a thermal polymerization initiator is used as the polymerization initiator (E), the content of the thermal polymerization initiator in the resin composition is 0.05 to 10 parts by mass relative to 100 parts by mass of the total amount of the resin composition. Parts are preferred, preferably 0.1 to 8 parts by mass, more preferably 0.5 to 5 parts by mass. When the content of the thermal polymerization initiator is 0.05 parts by mass or more, a resin composition with better curability can be obtained. When the content of the thermal polymerization initiator is 10 parts by mass or less, the composite material containing the resin composition has a better balance of physical properties such as strength, toughness, heat resistance, and chemical resistance.

作為光聚合起始劑,若為藉由光照射而可產生自由基者即可並無特別限定,例如可舉出安息香、安息香甲基醚、安息香乙基醚等安息香與其烷基醚類;苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1,1-二氯苯乙酮、4-(1-t-丁基二氧基-1-甲基乙基)苯乙酮等苯乙酮類;1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮等α-羥基烷基苯酮類;2-甲基蒽醌、2-戊基蒽醌、2-t-丁基蒽醌、1-氯蒽醌等蒽醌類;2,4-二甲基硫基呫噸酮、2,4-二異丙基硫基呫噸酮、2-氯噻噸酮等噻噸酮類;苯乙酮二甲基縮酮、苯甲基二甲基縮酮等縮酮類;二苯甲酮、4-(1-t-丁基二氧基-1-甲基乙基)二苯甲酮、3,3’,4,4’-肆(t-丁基二氧羰基)二苯甲酮等二苯甲酮類;2-甲基-1-[4-(甲基硫基)苯基]-2-嗎啉代-丙烷-1-酮、2-苯甲基-2-二甲基胺基-1-(4-嗎啉代苯基)丁酮-1-酮、2-苯甲基-2-二甲基胺基-1-(4-嗎啉代苯基)-丁烷-1-酮等嗎啉類;苯基雙(2,4,6-三甲基苯甲醯基)膦氧化物等醯基膦氧化物類;及呫噸酮類 等。此等可單獨使用1種或併用2種以上。The photopolymerization initiator is not particularly limited as long as it can generate free radicals by light irradiation, for example, benzoin, benzoin methyl ether, benzoin ethyl ether and other benzoin and its alkyl ethers; benzene Ethanone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 4-(1-t-butyldioxy-1-methylethyl) Acetophenones such as acetophenone; α-hydroxyalkylphenones such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methyl-1-phenyl-propan-1-one; Anthraquinones such as base anthraquinone, 2-pentyl anthraquinone, 2-t-butyl anthraquinone, 1-chloroanthraquinone; 2,4-dimethylthioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone and other thioxanthones; acetophenone dimethyl ketal, benzyl dimethyl ketal and other ketals; benzophenone, 4-(1 -t-butyldioxy-1-methylethyl)benzophenone, 3,3',4,4'-tetra(t-butyldioxycarbonyl)benzophenone and other benzophenones Class; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc. Phylines; Acylphosphine oxides such as phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; Xanthones, etc. These can be used individually by 1 type or in combination of 2 or more types.

光聚合起始劑由反應性之觀點來看,使用不需要氫提供者之分子內開裂型光聚合起始劑者為佳。又,由吸收波長315~460nm之光而產生活性種之觀點來看,在前述波長範圍可更有效率地產生活性種的2,2-二甲氧基-2-苯基苯乙酮、苯基雙(2,4,6-三甲基苯甲醯基)膦氧化物,及1-羥基環己基苯基酮、1-羥基環己基苯基酮為佳。As the photopolymerization initiator, it is preferable to use an intramolecular cleavage type photopolymerization initiator that does not require a hydrogen donor from the viewpoint of reactivity. Also, from the viewpoint of generating active species by absorbing light with a wavelength of 315 to 460 nm, 2,2-dimethoxy-2-phenylacetophenone and benzene can more efficiently generate active species in the aforementioned wavelength range. Bis(2,4,6-trimethylbenzoyl)phosphine oxide, 1-hydroxycyclohexyl phenyl ketone and 1-hydroxy cyclohexyl phenyl ketone are preferred.

熱聚合起始劑並無特別限定,可使用公知的自由基聚合起始劑。作為熱聚合起始劑,例如可舉出有機過氧化物、偶氮化合物、過硫酸鹽、氧化還原系化合物等。此等中亦以有機化過氧化物為佳。 作為有機過氧化物,例如可舉出酮過氧化物、過苯甲酸酯、過氧化氫、二醯基過氧化物、過氧縮酮、過氧化氫、二烯丙基過氧化物、過氧酯及過氧二碳酸酯等。更具體可舉出甲基乙基酮過氧化物、異丙苯過氧化氫、t-丁基過苯甲酸酯、2-乙基己烷過氧酸1,1,3,3-四甲基丁基、二苯甲醯基過氧化物(亦稱為苯甲醯基過氧化物)、苯甲醯基m-甲基苯甲醯基過氧化物、m-過氧化甲苯醯、二異丙苯過氧化物、二異丙基過氧化物、二-t-丁基過氧化物、t-丁基過氧苯甲酸酯、1,1-雙(t-丁基過氧)-3,3,5-三甲基環己烷、2,5-二甲基-2,5-雙(t-丁基過氧)己炔-3、3-異丙基過氫氧化物、t-丁基過氫氧化物、二異丙苯過氫氧化物、乙醯過氧化物、雙(4-t-丁基環己基)過氧二碳酸酯、二異丙基過氧二碳酸酯、異丁基過氧化物、3,3,5-三甲基己醯基過氧化物、月桂基過氧化物等。此等可單獨使用1種或併用2種以上。 The thermal polymerization initiator is not particularly limited, and known radical polymerization initiators can be used. Examples of the thermal polymerization initiator include organic peroxides, azo compounds, persulfates, redox compounds, and the like. Among these, organic peroxides are also preferred. Examples of organic peroxides include ketone peroxide, perbenzoate, hydrogen peroxide, diacyl peroxide, peroxyketal, hydrogen peroxide, diallyl peroxide, peroxide Oxygen esters and peroxydicarbonates, etc. More specifically, methyl ethyl ketone peroxide, cumene hydroperoxide, t-butyl perbenzoate, 2-ethylhexane peroxy acid 1,1,3,3-tetramethyl butyl, dibenzoyl peroxide (also known as benzoyl peroxide), benzoyl m-methylbenzoyl peroxide, m-toluyl peroxide, diiso Propylbenzene peroxide, diisopropyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, 1,1-bis(t-butyl peroxy)-3 ,3,5-trimethylcyclohexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3,3-isopropyl perhydroxide, t- Butyl perhydroxide, dicumyl perhydroxide, acetyl peroxide, bis(4-t-butylcyclohexyl) peroxydicarbonate, diisopropylperoxydicarbonate, isopropylperoxydicarbonate Butyl peroxide, 3,3,5-trimethylhexyl peroxide, lauryl peroxide, etc. These can be used individually by 1 type or in combination of 2 or more types.

此等中亦由硬化控制之容易性、獲得性或處理容易性等觀點來看,雙(4-t-丁基環己基)過氧二碳酸酯、2-乙基己烷過氧酸1,1,3,3-四甲基丁基、二苯甲醯基過氧化物、苯甲醯基m-甲基苯甲醯基過氧化物、m-過氧化甲苯醯、甲基乙基酮過氧化物,及t-丁基過氧苯甲酸酯為佳。Among them, from the viewpoint of ease of hardening control, availability, or ease of handling, bis(4-t-butylcyclohexyl)peroxydicarbonate, 2-ethylhexane peroxyacid 1, 1,3,3-tetramethylbutyl, dibenzoyl peroxide, benzoyl m-methylbenzoyl peroxide, m-toluyl peroxide, methyl ethyl ketone peroxide Oxide, and t-butyl peroxybenzoate are preferred.

<其他成分> 本實施形態的樹脂組成物中作為其他成分,例如可含有其他樹脂、觸媒、增黏助劑、聚合禁止劑、觸變劑、硬化促進劑、硬化遲延劑、界面活性劑、界面調整劑、濕潤分散劑、消泡劑、塗平劑、偶合劑、光穩定劑、蠟、難燃劑、可塑劑、填充劑、內部脫模劑、低收縮劑、調色劑、減黏劑、分離防止劑、相溶化劑等添加劑。前述添加劑之含有量在不妨礙本發明之效果的範圍即可,並無特別限定。 <Other ingredients> The resin composition of this embodiment may contain, as other components, other resins, catalysts, thickening aids, polymerization inhibitors, thixotropic agents, hardening accelerators, hardening retarders, surfactants, interface modifiers, Wetting and dispersing agent, defoaming agent, leveling agent, coupling agent, light stabilizer, wax, flame retardant, plasticizer, filler, internal release agent, low shrinkage agent, toner, viscosity reducer, separation prevention Additives such as agents and compatibilizers. The content of the aforementioned additives is not particularly limited as long as it does not interfere with the effects of the present invention.

(其他樹脂) 本實施形態中之樹脂組成物,由進一步控制增黏速度之觀點來看,於1分子中具有自由基聚合性不飽和基,亦可含有與前述乙烯基酯樹脂(A)相異的其他樹脂。 作為其他樹脂,例如可舉出胺基甲酸酯(甲基)丙烯酸酯樹脂、聚酯(甲基)丙烯酸酯樹脂、(甲基)丙烯酸酯樹脂,及不飽和聚酯樹脂等。此等其他樹脂可單獨使用1種或併用2種以上。 (other resins) The resin composition in this embodiment has a radically polymerizable unsaturated group in one molecule from the viewpoint of further controlling the thickening rate, and may contain other resins different from the aforementioned vinyl ester resin (A) . Examples of other resins include urethane (meth)acrylate resins, polyester (meth)acrylate resins, (meth)acrylate resins, and unsaturated polyester resins. These other resins may be used alone or in combination of two or more.

所謂前述胺基甲酸酯(甲基)丙烯酸酯樹脂表示具有(甲基)丙烯醯基氧基的聚胺基甲酸酯。具體而言可舉出聚異氰酸酯與聚羥基化合物或多元醇類進行反應後,將未反應的異氰酸酯基進一步與含有羥基的(甲基)丙烯酸化合物及視必要含有羥基的烯丙基醚化合物進行反應而得的含有自由基聚合性不飽和基的寡聚物。The said urethane (meth)acrylate resin means the polyurethane which has a (meth)acryloxy group. Specifically, after reacting polyisocyanate with polyhydroxy compounds or polyols, reacting unreacted isocyanate groups with hydroxyl-containing (meth)acrylic compounds and optionally hydroxyl-containing allyl ether compounds The obtained oligomer containing a radically polymerizable unsaturated group.

所謂前述聚酯(甲基)丙烯酸酯樹脂為具有(甲基)丙烯醯基氧基之聚酯。聚酯(甲基)丙烯酸酯樹脂例如可藉由以下所示(1)或(2)的方法而得。 (1)將末端為羧基的聚酯與含有環氧基的(甲基)丙烯酸酯或含有羥基的(甲基)丙烯酸酯進行反應之方法 (2)將末端為羥基的聚酯與(甲基)丙烯酸或含有異氰酸酯基的(甲基)丙烯酸酯進行反應的方法 作為上述(1)的方法中之原料使用的末端為羧基的聚酯,可舉出由過剩量之飽和多元酸及/或不飽和多元酸與多元醇所得者。 作為上述(2)的方法中之原料使用的末端為羥基的聚酯,可舉出由飽和多元酸及/或不飽和多元酸與過剩量多元醇所得者。 The aforementioned polyester (meth)acrylate resin is a polyester having a (meth)acryloxy group. Polyester (meth)acrylate resin can be obtained by the method of (1) or (2) shown below, for example. (1) A method of reacting a carboxyl-terminated polyester with an epoxy-containing (meth)acrylate or a hydroxyl-containing (meth)acrylate (2) Method of reacting hydroxyl-terminated polyester with (meth)acrylic acid or isocyanate group-containing (meth)acrylate The carboxyl-terminated polyester used as a raw material in the method (1) above includes one obtained from an excess amount of saturated polybasic acid and/or unsaturated polybasic acid and polyhydric alcohol. The hydroxyl-terminated polyester used as a raw material in the method (2) above includes one obtained from a saturated polybasic acid and/or an unsaturated polybasic acid and an excess amount of polyhydric alcohol.

前述不飽和聚酯樹脂為不飽和二元酸,及視必要含有飽和二元酸之二元酸成分與多元醇經酯化反應而得者。The aforementioned unsaturated polyester resin is an unsaturated dibasic acid, and a dibasic acid component optionally containing a saturated dibasic acid is obtained by esterification with a polyhydric alcohol.

作為其他樹脂,以進一步控制增黏速度之觀點來看,胺基甲酸酯(甲基)丙烯酸酯樹脂、聚酯(甲基)丙烯酸酯樹脂,及(甲基)丙烯酸酯樹脂為佳。 本實施形態的樹脂組成物含有其他樹脂之情況時,其他樹脂的樹脂組成物中之含有量相對於乙烯基酯樹脂(A)及含有乙烯性不飽和基的單體(B)的合計100質量份而言,以1~45質量份為佳,較佳為5~40質量份,更佳為10~35質量份。 As other resins, urethane (meth)acrylate resins, polyester (meth)acrylate resins, and (meth)acrylate resins are preferable from the viewpoint of further controlling the thickening rate. When the resin composition of this embodiment contains other resins, the content of the other resins in the resin composition is based on 100 mass of the total of vinyl ester resin (A) and ethylenically unsaturated group-containing monomer (B). In terms of parts, preferably 1 to 45 parts by mass, more preferably 5 to 40 parts by mass, more preferably 10 to 35 parts by mass.

(聚合禁止劑) 聚合禁止劑可使用於在抑制樹脂組成物的聚合反應之進行。 作為聚合禁止劑,可使用公知者,例如可舉出氫醌、甲基氫醌、吩噻嗪、鄰苯二酚、4-t-丁基鄰苯二酚等。此等可單獨使用1種,亦可併用2種以上。 本實施形態的樹脂組成物含有聚合禁止劑之情況時,樹脂組成物中之聚合禁止劑的含有量相對於環氧化合物(a1-1)、不飽和一元酸(a1-2)及多元酸酐(a1-3)之合計100質量份而言,以0.01~5質量份為佳,較佳為0.02~4質量份,更佳為0.03~3質量份。 (polymerization inhibitor) A polymerization inhibitor can be used to inhibit the polymerization reaction of the resin composition. Known ones can be used as the polymerization inhibitor, and examples thereof include hydroquinone, methylhydroquinone, phenothiazine, catechol, 4-t-butylcatechol, and the like. These may be used individually by 1 type, and may use 2 or more types together. When the resin composition of this embodiment contains a polymerization inhibitor, the content of the polymerization inhibitor in the resin composition is relative to the epoxy compound (a1-1), unsaturated monobasic acid (a1-2) and polybasic acid anhydride ( The total of 100 parts by mass of a1-3) is preferably 0.01 to 5 parts by mass, more preferably 0.02 to 4 parts by mass, more preferably 0.03 to 3 parts by mass.

(觸變劑) 本實施形態中之樹脂組成物中視必要可含有觸變劑。觸變劑使用於調製樹脂組成物之混合性或流動性。作為觸變劑,可舉出有機系觸變劑及無機系觸變劑。此等可單獨使用1種或併用2種以上。 本實施形態的樹脂組成物含有觸變劑之情況時,該含有量相對於乙烯基酯樹脂(A)與含有乙烯性不飽和基的單體(B)的合計100質量份而言,以0.01~10質量份為佳,較佳為0.1~5質量份。 (thixotropic agent) The resin composition in this embodiment may contain a thixotropic agent as necessary. Thixotropic agents are used to adjust the mixing or fluidity of resin compositions. Examples of the thixotropic agent include organic thixotropic agents and inorganic thixotropic agents. These can be used individually by 1 type or in combination of 2 or more types. When the resin composition of the present embodiment contains a thixotropic agent, the content is 0.01 parts by mass relative to the total of 100 parts by mass of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B). ~10 parts by mass is better, more preferably 0.1~5 parts by mass.

作為有機系觸變劑,例如可舉出氫化蓖麻油、醯胺系、酸化聚乙烯系、植物油聚合油系、界面活性劑系,及併用此等複合系等。具體可舉出「Flonon(註冊商標)SP-1000AF」(共榮社化學股份有限公司製)、「Disparon(註冊商標)6900-20X」(楠本化成股份有限公司)等。 作為無機系觸變劑,例如可舉出經疏水性處理或親水性處理的二氧化矽及膨潤土等。作為疏水性之無機系觸變劑,具體可舉出「Leoroseal(註冊商標)PM-20L」(Tokuyama股份有限公司製)、「AEROSIL(註冊商標)R-106」(Nippon Aerosil股份有限公司)、「CAB-O-SIL(註冊商標)」(Cabot Corporation製)等。作為親水性之無機系觸變劑,具體可舉出「AEROSIL(註冊商標)-200」(Nippon Aerosil股份有限公司製)等。且使用親水性之燒成二氧化矽之情況時,觸變性改質劑「BYK(註冊商標)-R605」、「BYK(註冊商標)-R606」(皆為BYK公司製)之併用可有效地適度控制增黏速度。 Examples of organic thixotropic agents include hydrogenated castor oil, amide-based, acidified polyethylene-based, vegetable oil polymerized oil-based, surfactant-based, and composite systems using these in combination. Specific examples thereof include "Flonon (registered trademark) SP-1000AF" (manufactured by Kyoeisha Chemical Co., Ltd.), "Disparon (registered trademark) 6900-20X" (Kusumoto Chemical Co., Ltd.), and the like. As an inorganic type thixotropic agent, the silica and bentonite etc. which were hydrophobically treated or hydrophilically treated are mentioned, for example. Specific examples of the hydrophobic inorganic thixotropic agent include "Leoroseal (registered trademark) PM-20L" (manufactured by Tokuyama Co., Ltd.), "AEROSIL (registered trademark) R-106" (Nippon Aerosil Co., Ltd.), "CAB-O-SIL (registered trademark)" (manufactured by Cabot Corporation) and the like. Specific examples of the hydrophilic inorganic thixotropic agent include "AEROSIL (registered trademark)-200" (manufactured by Nippon Aerosil Co., Ltd.). And when using hydrophilic fired silica, the combined use of thixotropic modifiers "BYK (registered trademark)-R605" and "BYK (registered trademark)-R606" (both manufactured by BYK Corporation) can effectively Moderately control the speed of viscosity increase.

(硬化促進劑) 硬化促進劑可使用於調整硬化速度。 硬化促進劑並無特別限定,例如可使用公知的有機金屬鹽等有機金屬化合物、胺系化合物、β-二酮類等,此等可單獨使用1種,亦可併用2種以上。 本實施形態中之樹脂組成物含有硬化促進劑之情況時,該含有量相對於乙烯基酯樹脂(A)與含有乙烯性不飽和基的單體(B)之合計100質量份而言,以0.01~5質量份為佳,較佳為0.05~4質量份,更佳為0.1~3質量份。含有量若為上述範圍內時可使硬化性之調整變得容易。 (hardening accelerator) Hardening accelerators can be used to adjust the hardening speed. The hardening accelerator is not particularly limited. For example, known organometallic compounds such as organometallic salts, amine compounds, β-diketones, and the like can be used. These may be used alone or in combination of two or more. When the resin composition in this embodiment contains a hardening accelerator, the content is 100 parts by mass of the total of the vinyl ester resin (A) and the ethylenically unsaturated group-containing monomer (B). It is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, more preferably 0.1 to 3 parts by mass. When the content is within the above range, the adjustment of curability can be facilitated.

作為有機金屬化合物,可舉出環烷烴酸銅等銅化合物;辛基酸鈷、環烷烴酸鈷及氫氧化鈷等鈷化合物;己酸鹽鋅等鋅化合物;辛基酸錳等錳化合物。 作為胺系化合物,可舉出苯胺類、甲苯胺類、苯甲醛類、三乙醇胺、二伸乙基三胺、吡啶、苯嗎啉、哌啶、2,4,6-參(二甲基胺基甲基)酚、N,N-二甲基苯甲基胺等。 作為β-二酮類,可舉出乙醯丙酮、乙醯乙酸乙酯、α-乙醯-γ-丁內酯、N-吡嗪並乙醯乙醯胺、N,N-二甲基乙醯乙醯胺等。 Examples of the organometallic compound include copper compounds such as copper naphthenate; cobalt compounds such as cobalt octylate, cobalt naphthenate, and cobalt hydroxide; zinc compounds such as zinc hexanoate; and manganese compounds such as manganese octylate. Examples of amine compounds include anilines, toluidines, benzaldehydes, triethanolamine, diethylenetriamine, pyridine, phenmorpholine, piperidine, 2,4,6-paraffin (dimethylamine methyl)phenol, N,N-dimethylbenzylamine, etc. Examples of β-diketones include acetylacetone, ethyl acetylacetate, α-acetyl-γ-butyrolactone, N-pyrazinoacetylacetamide, N,N-dimethylacetate Acetamide, etc.

本實施形態中之樹脂組成物相對於乙烯基酯樹脂(A)與含有乙烯性不飽和基的單體(B)的合計100質量份而言,含有乙烯基酯樹脂(A)20~80質量份,包含含有乙烯性不飽和基的單體(B)20~80質量份,含有化合物(C)0.01~6質量份,含有選自水及含有羥基的化合物的至少1種之化合物(D)0.01~3質量份者為佳。The resin composition in this embodiment contains 20 to 80 mass parts of vinyl ester resin (A) with respect to the total of 100 mass parts of vinyl ester resin (A) and ethylenically unsaturated group-containing monomer (B). Parts, including 20-80 parts by mass of monomer (B) containing ethylenically unsaturated groups, containing 0.01-6 parts by mass of compound (C), containing at least one compound (D) selected from water and compounds containing hydroxyl groups 0.01 to 3 parts by mass is preferred.

樹脂組成物的初期黏度以0.1~3.0Pa・s為佳,較佳為0.2~2.5Pa・s,更佳為0.5~2.0Pa・s。初期黏度若為上述範圍時,可得到將樹脂組成物有效率且充分地含浸於後述纖維基材片材(G),且無未含有樹脂之部分(無脫拔樹脂的部分)的複合材料。The initial viscosity of the resin composition is preferably 0.1-3.0 Pa·s, more preferably 0.2-2.5 Pa·s, more preferably 0.5-2.0 Pa·s. When the initial viscosity is within the above range, a composite material in which the resin composition is efficiently and sufficiently impregnated into the fibrous base sheet (G) described later and has no resin-free parts (no resin-extracted parts) can be obtained.

自樹脂組成物的製造至2天後,較佳在5天後的時間點之(增黏後)黏度,以100~2,200Pa・s為佳,較佳為200~2,000Pa・s,更佳為400~1,800Pa・s,較更佳為500~1,500Pa・s。增黏後的黏度若為上述範圍時,作為複合材料而施工時,樹脂組成物變得難以流動。即,可較佳得到樹脂組成物與纖維基材片材(G)不會分離,又樹脂組成物在纖維基材片材(G)中不會有分佈不均產生,樹脂組成物與纖維基材片材(G)的密著性優異的複合材料。From the manufacture of the resin composition to 2 days later, preferably 5 days later, the viscosity (after increasing the viscosity) is preferably 100~2,200Pa·s, preferably 200~2,000Pa·s, more preferably 400~1,800Pa·s, more preferably 500~1,500Pa·s. When the viscosity after thickening is within the above range, the resin composition becomes difficult to flow when applied as a composite material. That is, it is preferable to obtain that the resin composition and the fiber base sheet (G) will not be separated, and the resin composition will not be unevenly distributed in the fiber base sheet (G), and the resin composition and the fiber base A composite material excellent in the adhesiveness of the material sheet (G).

[樹脂組成物之製造方法] 所謂本實施形態中之樹脂組成物之製造方法表示,含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C)與選自水及含有羥基的化合物的至少1種之化合物(D)的樹脂組成物之製造方法,含有步驟1~3。然後,前述乙烯基酯樹脂(A)至少含有乙烯基酯樹脂(A1)。 [Manufacturing method of resin composition] The so-called method for producing the resin composition in this embodiment means that a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), an oxide of a metal selected from the group 2 elements, and hydrogen A method for producing a resin composition of at least one compound (C) of an oxide and at least one compound (D) selected from water and a compound containing a hydroxyl group, comprising steps 1-3. And said vinyl ester resin (A) contains vinyl ester resin (A1) at least.

<步驟1> 所謂本實施形態中之步驟1表示,反應於1分子中具有2個環氧基之環氧化合物(a1-1)、不飽和一元酸(a1-2),及多元酸酐(a1-3)至相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,成為來自前述多元酸酐(a1-3)的酸基之總量為5~25莫耳,得到樹脂前驅物(P1)之步驟。 作為步驟1,例如可舉出對於可加熱攪拌之反應容器內,在酯化觸媒之存在下,環氧化合物(a1-1)、不飽和一元酸(a1-2),及環氧化合物(a1-1)的環氧基100莫耳,將來自多元酸酐(a1-3)的酸基之總量成為5~25莫耳之量的多元酸酐(a1-3)視必要地溶解於溶劑或反應性稀釋劑,在70~150℃,較佳在80~140℃,更佳在90~130℃下,進行1~8小時的反應而得到樹脂前驅物(P1)之方法。 <Step 1> The so-called step 1 in this embodiment means that the epoxy compound (a1-1), unsaturated monobasic acid (a1-2), and polybasic acid anhydride (a1-3) having 2 epoxy groups in 1 molecule are reacted to With respect to the total amount of 100 moles of the epoxy groups of the aforementioned epoxy compound (a1-1), the total amount of the acid groups from the aforementioned polybasic acid anhydride (a1-3) is 5 to 25 moles, and the resin precursor The step of object (P1). As step 1, for example, in a reaction vessel that can be heated and stirred, in the presence of an esterification catalyst, epoxy compound (a1-1), unsaturated monobasic acid (a1-2), and epoxy compound ( The epoxy group of a1-1) is 100 moles, and the polybasic acid anhydride (a1-3) is dissolved in a solvent or The reactive diluent is reacted at 70-150°C, preferably at 80-140°C, more preferably at 90-130°C for 1-8 hours to obtain the resin precursor (P1).

(觸媒) 作為酯化觸媒,例如可舉出三乙基胺、三乙二胺、N,N-二甲基苯甲基胺、N,N-二甲基苯胺、2,4,6-參(二甲基胺基甲基)酚,及二氮雜聯環辛烷等三級胺、三苯基膦,及苯甲基三苯基鏻氯化物等磷化合物或二乙基胺鹽酸鹽、三甲基苯甲基銨氯化物、氯化鋰等。此等可單獨使用1種或可併用2種以上。此等中,亦由緩和反應速度而防止樹脂的凝膠化,又可容易控制分子量分布之觀點來看,以磷系、銨鹽系等觸媒為佳,以銨鹽為較佳。 (catalyst) Examples of esterification catalysts include triethylamine, triethylenediamine, N,N-dimethylbenzylamine, N,N-dimethylaniline, 2,4,6-paraffin (di Methylaminomethyl)phenol, and tertiary amines such as diazabicyclooctane, triphenylphosphine, and phosphorus compounds such as benzyltriphenylphosphonium chloride or diethylamine hydrochloride, triphenylphosphonium chloride, etc. Tolyl benzyl ammonium chloride, lithium chloride, etc. These may be used individually by 1 type, or may use 2 or more types together. Among these, phosphorus-based and ammonium-based catalysts are preferred, and ammonium-based catalysts are preferred, from the standpoint of slowing down the reaction rate to prevent gelation of the resin and enabling easy control of the molecular weight distribution.

觸媒的使用量由促進反應且抑制樹脂前驅物(P1)的增黏之觀點來看,環氧化合物(a1-1)相對於不飽和一元酸(a1-2)及多元酸酐(a1-3)之合計100質量份而言,以0.01~5質量份為佳,較佳為0.05~4質量份,更佳為0.1~3質量份。The amount of catalyst used is from the point of view of promoting the reaction and inhibiting the viscosity of the resin precursor (P1), the epoxy compound (a1-1) is relatively ) to a total of 100 parts by mass, preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, more preferably 0.1 to 3 parts by mass.

由可容易均勻地混合環氧化合物(a1-1)、不飽和一元酸(a1-2)、多元酸酐(a1-3),及多元酸酐(a1-4)之觀點來看,視必要亦可藉由溶劑及/或反應性稀釋劑進行稀釋。 作為溶劑,若為在環氧化合物(a1-1)、不飽和一元酸(a1-2)、多元酸酐(a1-3),及多元酸酐(a1-4)為惰性之溶劑者即可並無特別限制,例如可將甲基異丁基酮(MIBK)等在1氣壓中之沸點為70~150℃的公知之溶劑單獨使用1種或併用2種以上。 From the viewpoint of being able to mix epoxy compound (a1-1), unsaturated monobasic acid (a1-2), polybasic acid anhydride (a1-3), and polybasic acid anhydride (a1-4) easily and uniformly, if necessary Dilution with solvents and/or reactive diluents. As a solvent, as long as it is inert to the epoxy compound (a1-1), unsaturated monobasic acid (a1-2), polybasic acid anhydride (a1-3), and polybasic acid anhydride (a1-4) is inert. None Particularly limited, for example, known solvents such as methyl isobutyl ketone (MIBK) having a boiling point of 70 to 150° C. at 1 atmosphere can be used alone or in combination of two or more.

作為反應性稀釋劑,以於環氧化合物(a1-1)、不飽和一元酸(a1-2)、多元酸酐(a1-3),及多元酸酐(a1-4)為惰性的含有乙烯性不飽和基的單體(B)為佳。 混合方法雖為特別限定,可藉由公知方法進行。 As a reactive diluent, an ethylenic non The monomer (B) of a saturated group is preferable. Although the mixing method is particularly limited, it can be performed by a known method.

在步驟1中,由抑制樹脂前驅物(P1)的聚合反應之進行的觀點來看,可添加聚合禁止劑。聚合禁止劑亦可適用在上述<其他成分>之項目所說明者。添加聚合禁止劑之情況時的添加量,例如相對於環氧化合物(a1-1)、不飽和一元酸(a1-2)及多元酸酐(a1-3)的合計100質量份而言可為0.0001~10質量份,較佳為0.001~1質量份。In Step 1, a polymerization inhibitor may be added from the viewpoint of inhibiting the progress of the polymerization reaction of the resin precursor (P1). Polymerization inhibitors can also be applied to those described in the item of the above <Other Components>. When adding a polymerization inhibitor, the addition amount may be 0.0001, for example, with respect to a total of 100 parts by mass of the epoxy compound (a1-1), the unsaturated monobasic acid (a1-2) and the polybasic acid anhydride (a1-3). ~10 parts by mass, preferably 0.001~1 part by mass.

<步驟2> 所謂本實施形態中之步驟2表示,使樹脂前驅物(P1),及多元酸酐(a1-4)進行加成反應而得到乙烯基酯樹脂(A1)之步驟。 作為步驟2,例如可舉出於合成樹脂前驅物(P1)之反應容器內,於觸媒之存在下,添加多元酸酐(a1-4),在70~150℃,較佳在80~140℃,更佳在90~130℃下,進行30分鐘~4小時反應而得到乙烯基酯樹脂(A1)之方法。 <Step 2> The so-called step 2 in this embodiment means the step of making the resin precursor (P1) and the polybasic acid anhydride (a1-4) undergo an addition reaction to obtain the vinyl ester resin (A1). As step 2, for example, in the reaction vessel of the synthetic resin precursor (P1), in the presence of a catalyst, add polybasic acid anhydride (a1-4), at 70~150°C, preferably at 80~140°C , more preferably at 90-130° C. for 30 minutes to 4 hours to react to obtain the vinyl ester resin (A1).

作為觸媒,可適用在上述<步驟1>(觸媒)的項中所說明者,亦可繼續使用在步驟1之樹脂前驅物(P1)的合成所使用的觸媒,於添加多元酸酐(a1-4)時,亦可從新追加在步驟1所添加的相同者或相異者。 在步驟2亦與步驟1同樣地,視必要亦可添加溶劑及/或反應性稀釋劑、聚合禁止劑。混合方法亦與步驟1同樣地藉由公知方法進行。 As the catalyst, it can be applicable to those described in the item of the above-mentioned <step 1> (catalyst), and can also continue to use the catalyst used in the synthesis of the resin precursor (P1) in step 1, and add polybasic acid anhydride ( In the case of a1-4), it is also possible to newly add the same thing or the different thing added in step 1. Also in step 2, similarly to step 1, a solvent and/or a reactive diluent, and a polymerization inhibitor may be added as necessary. The mixing method is also performed by a known method in the same manner as step 1.

在後面步驟3中,由可均勻地容易混合乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)及金屬化合物(C)而調整黏度之觀點來看,亦可藉由乙烯基酯樹脂(A1)溶劑及/或反應性稀釋劑進行稀釋。 乙烯基酯樹脂(A1)的黏度(藉由溶劑及/或反應性稀釋劑之調整黏度)以1~400Pa・s為佳,較佳為10~300Pa・s,更佳為20~150Pa・s。 In the following step 3, from the viewpoint of easily mixing the vinyl ester resin (A), the ethylenically unsaturated group-containing monomer (B) and the metal compound (C) uniformly to adjust the viscosity, it is also possible to adjust the viscosity by Dilute with vinyl ester resin (A1) solvent and/or reactive diluent. The viscosity of vinyl ester resin (A1) (adjusted by solvent and/or reactive diluent) is preferably 1~400Pa·s, more preferably 10~300Pa·s, more preferably 20~150Pa·s .

(乙烯基酯樹脂(A2)的製造) 乙烯基酯樹脂(A)含有乙烯基酯樹脂(A2)之情況時,作為乙烯基酯樹脂(A2)之製造方法,例如可舉出對於可加熱攪拌之反應容器內,在酯化觸媒之存在下,環氧化合物(a2-1)及不飽和一元酸(a2-2)可視必要溶解於溶劑或反應性稀釋劑,在70~150℃,較佳在80~140℃,更佳在90~130℃下,進行1~8小時之反應的方法。 觸媒可使用與步驟1之相同者,又與步驟1同樣地,視必要亦可添加溶劑及/或反應性稀釋劑、聚合禁止劑。混合方法亦與步驟1同樣地,可藉由公知方法進行。 (Manufacture of vinyl ester resin (A2)) When the vinyl ester resin (A) contains the vinyl ester resin (A2), as the production method of the vinyl ester resin (A2), for example, in a reaction vessel that can be heated and stirred, in the esterification catalyst In the presence of epoxy compound (a2-1) and unsaturated monobasic acid (a2-2) may be dissolved in solvent or reactive diluent if necessary, at 70~150°C, preferably at 80~140°C, more preferably at 90°C The method of carrying out the reaction at ~130°C for 1~8 hours. As the catalyst, the same one as in step 1 can be used, and similarly to step 1, a solvent and/or a reactive diluent and a polymerization inhibitor may be added as necessary. The mixing method can also be performed by a known method in the same manner as in step 1.

<步驟3> 所謂本實施形態中之步驟3表示,混合含有乙烯基酯樹脂(A1)的乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C),與選自水及含有羥基的化合物的至少1種之化合物(D)而得到樹脂組成物之步驟。步驟3中,亦可將乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、化合物(C)與化合物(D)以外,亦可混合聚合起始劑(E)、觸媒,及前述其他成分等任意成分。 步驟3中,對於混合順序並限定,例如可舉出作為反應性稀釋劑使用含有乙烯性不飽和基的單體(B)而製造乙烯基酯樹脂(A),其次視必要加入追加的含有乙烯性不飽和基的單體(B)、化合物(C)、化合物(D)及前述任意成分並混合的方法。由使黏度控制變得容易之觀點來看,化合物(C)在最後添加者為佳。 作為混合方法並無特別限制,例如可使用分散劑、行星式混合機、捏合機等進行。混練溫度以10~40℃為佳,較佳為15~30℃,由混合容易性等觀點來看,更佳為20~30℃。 <Step 3> The so-called step 3 in this embodiment means that the vinyl ester resin (A) containing the vinyl ester resin (A1), the monomer (B) containing an ethylenically unsaturated group, and the metal selected from the group 2 elements are mixed. A step of obtaining a resin composition with at least one compound (C) of oxides and hydroxides, and at least one compound (D) selected from water and hydroxyl-containing compounds. In Step 3, in addition to vinyl ester resin (A), ethylenically unsaturated group-containing monomer (B), compound (C) and compound (D), polymerization initiator (E), Catalyst, and any other ingredients mentioned above. In Step 3, the order of mixing is not limited. For example, vinyl ester resin (A) is produced by using ethylenically unsaturated group-containing monomer (B) as a reactive diluent, and then additional ethylene-containing A method in which the monomer (B), the compound (C), the compound (D) of a sexually unsaturated group, and the aforementioned optional components are mixed together. From the viewpoint of easy viscosity control, it is preferable to add the compound (C) last. The mixing method is not particularly limited, and it can be performed using, for example, a dispersant, a planetary mixer, a kneader, or the like. The kneading temperature is preferably 10 to 40°C, more preferably 15 to 30°C, and more preferably 20 to 30°C from the viewpoint of ease of mixing.

[複合材料] 本實施形態中之複合材料含有前述樹脂組成物與纖維基材片材(F)。 作為複合材料,例如將樹脂組成物含浸於纖維基材,經一定期間保管(養護)而增黏者為佳。如此複合材料可得到形態保持性良好且具有優異機械性強度之硬化物(成形品)。 [composite material] The composite material in this embodiment contains the said resin composition and a fibrous base material sheet (F). As a composite material, for example, it is preferable to impregnate a fiber base material with a resin composition and store (cure) it for a certain period of time to increase its viscosity. Such a composite material can obtain a hardened product (molded product) having good shape retention and excellent mechanical strength.

含有樹脂組成物與纖維基材片材(F)之複合材料可作為預成型體、預浸料、現有管道之補強或修補等管材修補用途之襯材等材料而使用於對結構物的施工。此等中亦以作為襯材等材料使用者為佳。即,複合材料作為管材修補用者為佳。 作為襯材使用複合材料之情況時,可適用公知的各種方法。具體為,將圓筒形狀之光硬化性的複合材料作為襯材,直接拉進去,且將襯材自先端側使其反轉下,藉由推進於現有管道,拉進於現有管道內,以空氣壓等對現有管道內面進行密著襯材後,藉由導入於襯材內部的移動式光照射裝置,對襯材內面照射紫外線或可見光線等而使襯材硬化,進而可對現有管道進行補強並修補。 The composite material containing the resin composition and the fibrous base sheet (F) can be used in the construction of structures as materials such as preforms, prepregs, and lining materials for pipe repairs such as reinforcement or repair of existing pipes. Among these, it is also preferred to be used as lining materials and other materials. That is, the composite material is preferable for repairing pipes. When a composite material is used as a backing material, various known methods can be applied. Specifically, a cylindrical light-hardening composite material is directly pulled in as a lining material, and the lining material is reversed from the tip side, and pushed into the existing pipeline by pushing it into the existing pipeline, so that After the inner surface of the existing pipeline is adhered to the lining material by air pressure, etc., the inner surface of the lining material is irradiated with ultraviolet light or visible light by the mobile light irradiation device introduced into the lining material to harden the lining material, and then the existing pipeline can be repaired. Piping is reinforced and repaired.

樹脂組成物之複合材料中的含有量相對於複合材料100質量%而言,以20~95質量%為佳,較佳為25~85質量%,更佳為25~75質量%。樹脂組成物的含有量若為20質量%以上時,可使複合材料之施工性變得更良好。樹脂組成物的含有量若為95質量%以下時,可充分確保纖維基材片材(F)的含有量,容易得到作為複合材料之硬化物的充分強度。The content of the resin composition in the composite material is preferably 20 to 95% by mass, more preferably 25 to 85% by mass, more preferably 25 to 75% by mass, relative to 100% by mass of the composite material. When the content of the resin composition is 20% by mass or more, the workability of the composite material can be improved. When the content of the resin composition is 95% by mass or less, the content of the fibrous base sheet (F) can be sufficiently secured, and sufficient strength as a cured product of the composite material can be easily obtained.

纖維基材片材(F)的複合材料中的含有量相對於複合材料100質量%而言,以5~80質量%為佳,較佳為15~75質量%,更佳為25~75質量%。纖維基材片材(F)的含有量若為5質量%以上時,容易得到作為複合材料之硬化物的充分強度。纖維基材片材(F)的含有量若為80質量%以下時,可充分確保樹脂組成物的含有量,複合材料之施工性變得更良好。The content of the fiber base sheet (F) in the composite material is preferably 5 to 80% by mass, more preferably 15 to 75% by mass, more preferably 25 to 75% by mass relative to 100% by mass of the composite material %. When the content of the fibrous base material sheet (F) is 5% by mass or more, it is easy to obtain sufficient strength as a cured product of the composite material. When the content of the fibrous base material sheet (F) is 80% by mass or less, the content of the resin composition can be sufficiently ensured, and the workability of the composite material becomes better.

<纖維基材片材(F)> 作為纖維基材片材(F),由機械性強度等觀點,例如可舉出醯胺、丙胺酸(Alanide)、維尼綸(Vinylon)、聚酯、酚等有機纖維、碳纖維、玻璃纖維、金屬纖維、陶瓷纖維等所謂強化纖維,又此等複合纖維。此等中亦以芳醯基纖維、碳纖維,及玻璃纖維為佳,由強度、獲得容易性、價格等觀點來看以玻璃纖維為較佳。特別在將含浸於纖維基材的樹脂組成物進行光硬化之情況時,以具有光透過性之玻璃纖維或聚酯纖維為佳。 纖維基材片材(F)可單獨使用1種或併用2種以上。 例如,在玻璃纖維之情況時,使用於一般的紗絲徑以1~15μm為佳,較佳為3~10μm。 <Fibrous Base Sheet (F)> Examples of the fibrous base sheet (F) include organic fibers such as amide, alanide, vinylon, polyester, and phenol, carbon fibers, glass fibers, and metals from the viewpoint of mechanical strength. So-called reinforcing fibers such as fibers and ceramic fibers, and such composite fibers. Among these, aramid fibers, carbon fibers, and glass fibers are also preferable, and glass fibers are more preferable from the viewpoints of strength, availability, and price. Especially in the case of photocuring the resin composition impregnated into the fiber substrate, glass fibers or polyester fibers having light transmission properties are preferable. The fibrous base sheet (F) may be used alone or in combination of two or more. For example, in the case of glass fibers, the diameter of the yarn used in general is preferably 1 to 15 μm, more preferably 3 to 10 μm.

作為纖維基材之形態,例如可舉出片材、切碎縷、剁碎、研磨纖維等。作為片材,例如可舉出將複數強化纖維往一方向排列而成者、平紋編織或斜紋編織等二方向織物、多軸向織物、非捲曲織物、不織布、墊子、針織、編織、強化纖維等經造紙的紙等。纖維基材可單獨使用1種,亦可併用2種以上,又可為單層亦可為複數層經層合者。 纖維基材片材(F)的厚度由樹脂組成物之含浸性的觀點來看,在單層之情況時,以0.01~5mm為佳,又進行複數層層合之情況時,合計厚度以1~20mm為佳,較佳為1~15mm。此等纖維基材片材(F)亦可含有公知含有量的公知尺寸劑。 As a form of a fibrous base material, a sheet, chopped strand, chopped, ground fiber, etc. are mentioned, for example. Examples of the sheet include those in which a plurality of reinforcing fibers are arranged in one direction, bidirectional fabrics such as plain weave or twill weave, multiaxial fabrics, non-crimped fabrics, nonwoven fabrics, mats, knits, weaves, reinforcing fibers, etc. Paper made from paper, etc. One type of fiber base material may be used alone, or two or more types may be used in combination, and it may be a single layer or may be laminated in plural layers. The thickness of the fibrous base sheet (F) is preferably 0.01 to 5mm in the case of a single layer from the viewpoint of the impregnation property of the resin composition, and in the case of laminating multiple layers, the total thickness is 1 ~20mm is preferred, more preferably 1~15mm. These fibrous base sheets (F) may contain a known size agent in a known content.

對複合材料之硬化物(纖維強化塑質:FRP)所要求的機械性強度雖配合使用的用途目的而有各式各樣,例如對於使用玻璃纖維基材之複合材料,一般而言,作為FRP之彎曲強度,以100~1000MPa為佳,較佳為150~ 800MPa。又,作為FRP之彎曲彈性率,以5~40GPa為佳,較佳為7~35GPa,更佳為8~30GPa。 且前述彎曲強度及彎曲彈性率之值為依據JIS K7171:2016的測定值。 The mechanical strength required for hardened composite materials (fiber-reinforced plastic: FRP) varies depending on the purpose of use. For example, composite materials using glass fiber substrates are generally used as FRP The bending strength is preferably 100~1000MPa, more preferably 150~800MPa. Also, the flexural modulus of FRP is preferably 5 to 40 GPa, more preferably 7 to 35 GPa, more preferably 8 to 30 GPa. In addition, the values of the aforementioned flexural strength and flexural modulus are measured values based on JIS K7171:2016.

[複合材料之製造方法] 作為複合材料之製造方法,可舉出將纖維基材片材(F)含浸於樹脂組成物,含浸有樹脂組成物的纖維基材片材(F)之雙面上貼合薄膜,在一定溫度下進行養護並使樹脂組成物增黏至樹脂組成物達成目標黏度之可施工的材料為止的方法。如保管溫度或目標黏度如樹脂組成物之項目所記載。作為保管方法,可舉出將薄片狀複合材料經蛇腹折或捲取而保管的方法。 [實施例] [Manufacturing method of composite material] As a method for producing a composite material, impregnating the fibrous base material sheet (F) with a resin composition, laminating a film on both sides of the fibrous base material sheet (F) impregnated with the resin composition, It is a method of curing and making the resin composition viscous until the resin composition reaches the target viscosity and is a constructable material. Such as storage temperature or target viscosity as recorded in the item of resin composition. As a storage method, a method of storing the sheet-shaped composite material by accordion folding or coiling is mentioned. [Example]

以下藉由實施例及比較例更具體說明本發明,但本發明並非限定為以下實施例者。Hereinafter, the present invention will be described in more detail by examples and comparative examples, but the present invention is not limited to the following examples.

[乙烯基酯樹脂之合成] 首先,將欲調製樹脂組成物的乙烯基酯樹脂藉由下述合成例及比較合成例進行合成。 [Synthesis of vinyl ester resin] First, the vinyl ester resin to prepare the resin composition was synthesized by the following synthesis example and comparative synthesis example.

對於下述合成例及比較合成例使用於乙烯基酯樹脂之合成的環氧化合物之詳細內容如以下所示。 ・環氧化合物(1):雙酚A型環氧樹脂;「Epomic(註冊商標)R140P」,三井化學股份有限公司製之環氧當量188 ・環氧化合物(2):雙酚A型環氧樹脂;「jER(註冊商標)834」,三菱化學股份有限公司製之環氧當量245 ・環氧化合物(3):酚酚醛清漆型環氧樹脂;「EPICLON(註冊商標)N-740」,DIC股份有限公司製之環氧當量172 且,環氧當量為依據JIS K7236:2001而測定的值。 The details of the epoxy compound used in the synthesis of the vinyl ester resin in the following synthesis examples and comparative synthesis examples are as follows. ・Epoxy compound (1): bisphenol A type epoxy resin; "Epomic (registered trademark) R140P", epoxy equivalent 188 manufactured by Mitsui Chemicals Co., Ltd. ・Epoxy compound (2): bisphenol A epoxy resin; "jER (registered trademark) 834", epoxy equivalent 245 manufactured by Mitsubishi Chemical Corporation ・Epoxy compound (3): Phenol novolac type epoxy resin; "EPICLON (registered trademark) N-740", epoxy equivalent 172 manufactured by DIC Co., Ltd. In addition, epoxy equivalent is the value measured based on JISK7236:2001.

[合成例1] 具備攪拌機、迴流冷卻管、氣體導入管及溫度計之5L的4口可分離燒瓶中,放入環氧化合物(1)1260g、作為聚合禁止劑的甲基氫醌0.74g(相對於環氧化合物(1)、後述甲基丙烯酸,及作為後述多元酸酐(a1-3)使用的馬來酸酐之合計100質量份而言為0.04質量份)、作為酯化觸媒的十四烷基二甲基苯甲基-銨氯化物(「Nissan陽離子(註冊商標)M 2-100R」(日油股份有限公司製),純度超過90質量%)5.6g(相對於環氧化合物(1)、後述甲基丙烯酸,及作為後述多元酸酐(a1-3)使用的馬來酸酐之合計100質量份而言為0.3質量份),加熱至110℃,將作為不飽和一元酸(a1-2)的甲基丙烯酸519g(相對於環氧化合物(1)的環氧基之總量100莫耳而言,甲基丙烯酸之酸基為90莫耳),及作為多元酸酐(a1-3)的馬來酸酐66g(相對於環氧化合物(1)之環氧基總量100莫耳而言,來自馬來酸酐的酸基之總量為10莫耳)經約30分鐘而滴下後,進行約4小時反應而合成樹脂前驅物(P1-1)。其次,添加作為多元酸酐(a1-4)之馬來酸酐263g(相對於環氧化合物(a1-1)之環氧基總量100莫耳而言,馬來酸酐為40莫耳),進行約2小時反應後得到乙烯基酯樹脂(A1-1)。 表2表示各成分之配合量。 [Synthesis Example 1] In a 5 L separable flask with a stirrer, a reflux cooling pipe, a gas introduction pipe and a thermometer, 1260 g of epoxy compound (1) and 0.74 g of methylhydroquinone as a polymerization inhibitor (relatively 0.04 parts by mass based on a total of 100 parts by mass of epoxy compound (1), methacrylic acid described later, and maleic anhydride used as polybasic acid anhydride (a1-3) described later), tetradecane as an esterification catalyst Dimethylbenzyl-ammonium chloride (“Nissan Cationic (registered trademark) M 2 -100R” (manufactured by NOF Corporation), purity exceeding 90% by mass) 5.6 g (relative to epoxy compound (1) , the methacrylic acid described later, and the total of 100 parts by mass of maleic anhydride used as the polybasic acid anhydride (a1-3) described below is 0.3 parts by mass), heated to 110°C, and the unsaturated monobasic acid (a1-2) 519g of methacrylic acid (relative to the total amount of 100 moles of epoxy groups in the epoxy compound (1), the acid group of methacrylic acid is 90 moles), and as the polybasic acid anhydride (a1-3) Maleic anhydride 66g (relative to the epoxy group total amount 100 moles of epoxy compound (1), the total amount of acid groups from maleic anhydride is 10 moles) after about 30 minutes and dropwise, carry out about 4 Hour reaction to synthesize the resin precursor (P1-1). Next, add maleic anhydride 263g (relative to the epoxy group total amount 100 moles of epoxy compound (a1-1), maleic anhydride is 40 moles) as polybasic acid anhydride (a1-4), carry out about After 2 hours of reaction, vinyl ester resin (A1-1) was obtained. Table 2 shows the compounding quantity of each component.

[合成例2~4、比較合成例1~8] 合成例1中,除設定為表2所記載的原料與配合比以外,以相同方式進行合成。其結果,在合成例2~4中得到乙烯基酯樹脂(A1-2)~(A1-4),在比較合成例5~8中得到乙烯基酯樹脂(A1’-1)~(A1’-4),比較合成例1~4中,樹脂前驅物凝膠化無法繼續進行合成操作而無法得到乙烯基酯樹脂。 [Synthesis Examples 2~4, Comparative Synthesis Examples 1~8] In Synthesis Example 1, the synthesis was carried out in the same manner except that the raw materials and compounding ratios described in Table 2 were set. As a result, vinyl ester resins (A1-2) to (A1-4) were obtained in Synthesis Examples 2 to 4, and vinyl ester resins (A1'-1) to (A1') were obtained in Comparative Synthesis Examples 5 to 8. -4), in Comparative Synthesis Examples 1-4, the resin precursor was gelled and the synthesis operation could not be continued and vinyl ester resin could not be obtained.

[樹脂組成物之測定評估] 對於在上述合成例及比較合成例所得的乙烯基酯樹脂(A1-1)~(A1-4),及(A1’-1)~(A1’-4),進行以下所示項目的測定評估。此等測定評估結果歸納如下述表1所示。 [Determination and Evaluation of Resin Composition] For the vinyl ester resins (A1-1)~(A1-4) and (A1'-1)~(A1'-4) obtained in the above synthesis examples and comparative synthesis examples, the following items were measured and evaluated . The results of these measurement evaluations are summarized in Table 1 below.

<酸價> 乙烯基酯樹脂的酸價依據JIS K6901:2008「部分酸價(指示劑滴定法)」,測定欲與含於乙烯基酯樹脂(A1-1)~(A1-4),及(A1’-1)~(A1’-4)的酸成分進行中和而需要的氫氧化鉀之質量,求得乙烯基酯樹脂(A1-1)~(A1-4),及(A1’-1)~(A1’-4)的酸價。 具體而言,欲使在上述合成例及比較合成例所得的乙烯基酯樹脂的含有量成為65質量%,使用作為含有乙烯性不飽和基的單體(B)的苯氧基乙基甲基丙烯酸酯(昭和電工材料股份有限公司製)進行稀釋而製作混合物,測定欲中和該混合物所含的酸成分之氫氧化鉀的需要質量。然後,將測定值換算成原先數值求得乙烯基酯樹脂之酸價。作為滴定裝置使用「自動滴定管 UCB-2000」(平沼產業股份有限公司製),作為指示劑使用溴麝香草酚藍與酚紅之混合指示劑。 <Acid value> The acid value of vinyl ester resin is determined according to JIS K6901: 2008 "Partial acid value (indicator titration method)", which is intended to be compared with (A1-1)~(A1-4) and (A1'- 1) The mass of potassium hydroxide required to neutralize the acid components of (A1'-4), and obtain vinyl ester resins (A1-1)~(A1-4), and (A1'-1)~ Acid value of (A1'-4). Specifically, in order to make the content of the vinyl ester resin obtained in the above-mentioned synthesis examples and comparative synthesis examples 65% by mass, phenoxyethylmethyl methacrylate was used as the ethylenically unsaturated group-containing monomer (B). Acrylate (manufactured by Showa Denko Materials Co., Ltd.) was diluted to prepare a mixture, and the required mass of potassium hydroxide to neutralize the acid component contained in the mixture was measured. Then, convert the measured value into the original value to obtain the acid value of the vinyl ester resin. "Automatic buret UCB-2000" (manufactured by Hiranuma Sangyo Co., Ltd.) was used as the titration device, and a mixed indicator of bromothymol blue and phenol red was used as the indicator.

<重量平均分子量Mw、數平均分子量Mn及分子量分布Mw/Mn> 藉由GPC在下述測定條件下測定Mw及Mn,由此等測定值算出Mw/Mn。 (測定條件) ・裝置:「showdex(註冊商標) GPC-101」(昭和電工股份有限公司製) ・管柱:「showdex(註冊商標) LF-804」(昭和電工股份有限公司製) ・檢測器:差示折射計「showdex(註冊商標) RI-71S」(昭和電工股份有限公司製) ・管柱溫度:40℃ ・試料:乙烯基酯樹脂之0.2質量%四氫呋喃溶液 ・展開溶劑:四氫呋喃 ・流速:1.0mL/分鐘 ・試料注入量:20μL ・標準試料:聚苯乙烯 <Weight average molecular weight Mw, number average molecular weight Mn and molecular weight distribution Mw/Mn> Mw and Mn were measured by GPC under the following measurement conditions, and Mw/Mn was computed from these measured values. (measurement conditions) ・Device: "showdex (registered trademark) GPC-101" (manufactured by Showa Denko Co., Ltd.) ・Column: "showdex (registered trademark) LF-804" (manufactured by Showa Denko Co., Ltd.) ・Detector: Differential refractometer "showdex (registered trademark) RI-71S" (manufactured by Showa Denko Co., Ltd.) ・Column temperature: 40°C ・Sample: 0.2% by mass tetrahydrofuran solution of vinyl ester resin ・Developing solvent: Tetrahydrofuran ・Flow rate: 1.0mL/min ・Sample injection volume: 20μL ・Standard sample: polystyrene

<黏度> 將在上述合成例及比較合成例所得的乙烯基酯樹脂65質量%及苯氧基乙基甲基丙烯酸酯35質量%之混合物的黏度,使用E型黏度計「RE-85U」(東機產業股份有限公司公司製,錐板型,錐形轉子1°34’×R24,轉動數:50rpm~0.5rpm),在溫度25℃下進行測定。對應測定黏度,將錐形轉子之轉動數設定在下述表1所示。 <Viscosity> The viscosity of the mixture of 65% by mass of vinyl ester resin and 35% by mass of phenoxyethyl methacrylate obtained in the above synthesis example and comparative synthesis example was measured using an E-type viscometer "RE-85U" (Toki Sangyo Co., Ltd. Co., Ltd., cone-plate type, conical rotor 1°34'×R24, rotation speed: 50rpm~0.5rpm), measured at a temperature of 25°C. Corresponding to the measurement of viscosity, the number of revolutions of the conical rotor was set as shown in Table 1 below.

Figure 02_image001
Figure 02_image003
Figure 02_image001
Figure 02_image003

[樹脂組成物之製造] 下述實施例及比較例中,使用於樹脂組成物的製造之觸變劑的詳細內容如以下所示。 ・觸變劑(1):有機觸變劑;「FlononSP-1000AF」,共榮社化學股份有限公司製 ・觸變劑(2):疏水性二氧化矽;「LeorosealPM-20L」,Tokuyama股份有限公司製 [Manufacture of resin composition] Details of the thixotropic agent used in the production of the resin composition in the following examples and comparative examples are as follows. ・Thixotropic agent (1): Organic thixotropic agent; "Flonon SP-1000AF", manufactured by Kyoeisha Chemical Co., Ltd. ・Thixotropic agent (2): Hydrophobic silica; "Leoroseal PM-20L", manufactured by Tokuyama Co., Ltd.

[乙烯基酯樹脂(A2)之合成] 將在下述實施例及比較例所使用的乙烯基酯樹脂(A2)如以下所示合成。 具備攪拌機、迴流冷卻管、氣體導入管及溫度計之5L的4口可分離燒瓶中,放入環氧化合物(1)2068g、作為聚合禁止劑的甲基氫醌1.2g(相對於環氧化合物,及甲基丙烯酸之合計100質量份而言為0.04質量份),及作為觸媒的2,4,6-參(二甲基胺基甲基)酚(「SequallTDMP」,精工化學股份有限公司製之純度超過95質量%)9.0g(相對於環氧化合物及甲基丙烯酸之合計100質量份而言為0.3質量份),並加熱至110℃。然後,將作為不飽和一元酸的甲基丙烯酸946g(相對於環氧化合物(1)之環氧基的總量100莫耳而言,酸基為100莫耳)經約30分鐘滴下後,於120℃進行加熱進行約3小時反應後得到樹脂組成物。 將該反應生成物冷卻至90℃,添加作為反應性稀釋劑(含有乙烯性不飽和基的單體(B))的苯氧基乙基甲基丙烯酸酯1628g,製作出乙烯基酯樹脂65質量%(配合成分合計質量基準)及苯氧基乙基甲基丙烯酸酯35質量%之混合物的乙烯基酯樹脂(A2)。 [Synthesis of vinyl ester resin (A2)] Vinyl ester resin (A2) used in the following examples and comparative examples was synthesized as shown below. Equipped with a 5 L separable flask with a stirrer, a reflux cooling tube, a gas inlet tube and a thermometer, 2068 g of epoxy compound (1) and 1.2 g of methyl hydroquinone as a polymerization inhibitor (relative to the epoxy compound, 0.04 parts by mass based on 100 parts by mass of methacrylic acid in total), and 2,4,6-ginseng(dimethylaminomethyl)phenol ("SequallTDMP", manufactured by Seiko Chemicals Co., Ltd.) as a catalyst The purity exceeds 95 mass %) 9.0g (0.3 mass parts with respect to a total of 100 mass parts of epoxy compounds and methacrylic acid), and heated to 110 degreeC. Then, 946 g of methacrylic acid as an unsaturated monobasic acid (acid group is 100 moles relative to the total amount of epoxy groups of epoxy compound (1) 100 moles) was dropped for about 30 minutes. After heating at 120° C. for about 3 hours and reacting, a resin composition was obtained. This reaction product was cooled to 90° C., and 1628 g of phenoxyethyl methacrylate was added as a reactive diluent (ethylenically unsaturated group-containing monomer (B)) to prepare a vinyl ester resin of 65 mass % (Based on the mass of the total ingredients) and 35% by mass of phenoxyethyl methacrylate is a vinyl ester resin (A2) of a mixture.

[實施例1] 各製作出乙烯基酯樹脂(A1-1)25質量份、作為含有乙烯性不飽和基的單體(B)的苯氧基乙基甲基丙烯酸酯13.5質量份之混合物(1),及乙烯基酯樹脂(A2)25質量份與作為含有乙烯性不飽和基的單體(B)的苯氧基乙基甲基丙烯酸酯13.5質量份之混合物(2)。將前述混合物(1)38.5質量份、前述混合物(2)38.5質量份、苯甲基丙烯酸甲酯10質量份、二乙二醇二甲基丙烯酸酯13質量份、水0.5質量份,及觸變劑(1)1.7質量份,以及作為聚合起始劑(E)的2,2-二甲氧基-2-苯基苯乙酮0.2質量份及苯基雙(2,4,6-三甲基苯甲醯基)膦氧化物0.2質量份,使用分散劑(高速分散基「均分散劑2.5型」普里米克斯股份有限公司製)並以2000~3000rpm進行20分鐘混合。繼續,添加作為化合物(C)的氧化鎂(magmicron MD-4AM-2,御國色素公司製之氧化鎂推定含有量30質量%)3質量份,使用前述分散劑,以2000~3000rpm進行1分鐘程度混合後得到樹脂組成物(X-1)。 [Example 1] A mixture (1) of 25 parts by mass of vinyl ester resin (A1-1), 13.5 parts by mass of phenoxyethyl methacrylate as an ethylenically unsaturated group-containing monomer (B), and ethylene Mixture (2) of 25 parts by mass of base ester resin (A2) and 13.5 parts by mass of phenoxyethyl methacrylate as an ethylenically unsaturated group-containing monomer (B). 38.5 parts by mass of the aforementioned mixture (1), 38.5 parts by mass of the aforementioned mixture (2), 10 parts by mass of methyl benzyl methacrylate, 13 parts by mass of diethylene glycol dimethacrylate, 0.5 parts by mass of water, and thixotropic 1.7 parts by mass of agent (1), and 0.2 parts by mass of 2,2-dimethoxy-2-phenylacetophenone and phenylbis(2,4,6-trimethyl 0.2 parts by mass of benzoyl)phosphine oxide, and mixed at 2000-3000 rpm for 20 minutes using a dispersant (high-speed dispersant "homodispersant type 2.5" manufactured by Primix Co., Ltd.). Next, add 3 parts by mass of magnesium oxide (magmicron MD-4AM-2, the estimated content of magnesium oxide produced by Yukuni Color Co., Ltd.: 30% by mass) as compound (C), and use the above-mentioned dispersant at 2000~3000rpm for 1 minute Resin composition (X-1) was obtained after mixing to a certain degree.

[實施例2~18、比較例1~14] 實施例1中,除設定為表5及6所記載的原料與配合比以外以同樣方式製造,得到樹脂組成物(X-2)~(X-18),及(X’-1)~(X’-14)。 [Examples 2-18, Comparative Examples 1-14] In Example 1, it was manufactured in the same manner except that it was set to the raw materials and compounding ratios listed in Tables 5 and 6, to obtain resin compositions (X-2)~(X-18), and (X'-1)~( X'-14).

[樹脂組成物之測定評估] 對於在上述實施例及比較例所得的樹脂組成物(X-1)~(X-18),及(X’-1)~(X’-14),進行以下所示項目的測定評估。此等測定評估結果歸納如下述表5及6所示。 [Determination and Evaluation of Resin Composition] For the resin compositions (X-1) to (X-18) and (X'-1) to (X'-14) obtained in the above-mentioned Examples and Comparative Examples, the following items were measured and evaluated. These measurement and evaluation results are summarized in Tables 5 and 6 below.

<黏度> 製造後立即將各樹脂組成物280g放入於300mL聚容器中,以B型黏度計在溫度25℃測定初期黏度。其後將前述聚容器在密閉狀態下,靜置在溫度25℃之環境下,經2天後,及5天後同樣地測定黏度。 B型黏度計為配合測定黏度範圍,適宜地選擇以下2種中任一者而使用。 (1)「RB80形黏度計」、東機產業股份有限公司製;配合轉子No.3~4測定黏度,使用轉子及轉動數設定在如下述表3所示。 <Viscosity> Immediately after production, 280 g of each resin composition was placed in a 300 mL poly container, and the initial viscosity was measured at a temperature of 25° C. with a B-type viscometer. Thereafter, the aforementioned poly container was placed in a closed state at a temperature of 25° C., and the viscosity was measured in the same manner after 2 days and 5 days. The B-type viscometer is used to suitably select any one of the following two types in order to match the measurement viscosity range. (1) "RB80 type viscometer", manufactured by Toki Sangyo Co., Ltd.; used with rotor No.3~4 to measure viscosity, the used rotor and the number of rotations are set as shown in Table 3 below.

Figure 02_image005
(2)「HBDVE型黏度計」,英弘精機股份有限公司製;T棒錠T-A~T-D,轉動速度:1rpm 配合測定黏度,使用如下述表4所示T棒錠。
Figure 02_image005
(2) "HBDVE type viscometer", manufactured by Hideo Seiki Co., Ltd.; T-bar ingots TA~TD, rotation speed: 1rpm to measure viscosity, using T-bar ingots as shown in Table 4 below.

Figure 02_image007
Figure 02_image007

<增黏性評估> 依據上述黏度之測定結果,將初期黏度為3Pa・s以下,且5天後的黏度為100~2,200Pa・s在範圍內者評估為增黏性良好者。於表5及表6之增黏性的欄中,增黏性良好時評估為「○」,除此以外的情況則以「×」表示。 <Evaluation of Viscosity> According to the measurement results of the above viscosity, those whose initial viscosity is below 3Pa·s and the viscosity after 5 days are within the range of 100-2,200Pa·s are evaluated as those with good viscosity-increasing properties. In the column of the thickening property of Table 5 and Table 6, when the thickening property was good, it was evaluated as "◯", and in other cases, it was indicated with "×".

Figure 02_image009
Figure 02_image009

Figure 02_image011
Figure 02_image011

Figure 02_image013
Figure 02_image013

Figure 02_image015
Figure 02_image015

如表5及表6所記載得知,實施例1~18中,樹脂組成物製造後的黏度(初期黏度)為低,隨著時間經過會增黏,自樹脂組成物製造後5天後的黏度為適宜範圍,即得知可得到增黏不會過度的樹脂組成物。 另一方面,於樹脂組成物中未含有水的比較例1~5之樹脂組成物中得知,樹脂組成物製造後的立即黏度(初期黏度)雖低,但增黏速度為大,自樹脂組成物製造至5天後的黏度為非常大。又,得知使用Mw未達1,500,Mw/Mn未達2.0之乙烯基酯樹脂的比較例6~14中,得到初期黏度過高,或增黏速度小,5天後的黏度未達適宜範圍之樹脂組成物。 As shown in Table 5 and Table 6, in Examples 1 to 18, the viscosity (initial viscosity) of the resin composition after manufacture is low, and the viscosity will increase with time, and the viscosity after 5 days after the resin composition is manufactured When the viscosity is in an appropriate range, it is known that a resin composition that does not increase too much in viscosity can be obtained. On the other hand, in the resin compositions of Comparative Examples 1 to 5 that did not contain water in the resin composition, although the immediate viscosity (initial viscosity) of the resin composition after manufacture was low, the viscosity increasing rate was high, which was obtained from the resin composition. The viscosity of the composition was very large after 5 days from manufacture. In addition, it was found that in Comparative Examples 6-14 using vinyl ester resins whose Mw was less than 1,500 and whose Mw/Mn was less than 2.0, the initial viscosity was too high, or the rate of viscosity increase was low, and the viscosity after 5 days did not reach the appropriate range. resin composition.

[樹脂組成物的硬化物之製造] [實施例19] 於在實施例1製造的樹脂組成物(X-1),使用250W的金屬鹵素燈(吸收峰波長420nm,照度20mW/cm 2),照射60分鐘光照射,得到170mm×170mm,厚度4mm之硬化物1(鑄造品)。 且上述照度為使用照度計「IL1400A」(國際光科技有限公司製,受光器型式SEL005,測定波長區域:380~ 450nm,中央值:415nm)進行測定。 [Manufacture of hardened resin composition] [Example 19] For the resin composition (X-1) produced in Example 1, a 250W metal halide lamp (absorption peak wavelength 420nm, illuminance 20mW/cm 2 ), Irradiate with light for 60 minutes to obtain hardened product 1 (cast product) with a size of 170 mm×170 mm and a thickness of 4 mm. In addition, the above-mentioned illuminance was measured using an illuminance meter "IL1400A" (manufactured by International Optical Technology Co., Ltd., receiver type SEL005, measurement wavelength range: 380 to 450 nm, median value: 415 nm).

[實施例20] 實施例19中,取代樹脂組成物(X-1)而添加表4所記載的樹脂組成物以外,其他同樣下得到含有光聚合起始劑的樹脂組成物(Y-2)後,得到硬化物2。 [Example 20] In Example 19, except that the resin composition described in Table 4 was added instead of the resin composition (X-1), a resin composition (Y-2) containing a photopolymerization initiator was obtained in the same manner, and a cured product was obtained. 2.

[實施例21] 對於玻璃纖維之短切氈(fiberglass chopped strand mat;「MC 450A」,日東紡績股份有限公司製),含浸在實施例1所製造的樹脂組成物(X-1),重疊3片並在23℃下進行5天養護後,使用250W的金屬鹵素燈(吸收峰波長420nm,照度25mW/cm 2),得到170mm×170mm之厚度3.1mm的硬化物3(FRP:玻璃纖維含有量31質量%)。 [Example 21] For fiberglass chopped strand mat (fiberglass chopped strand mat; "MC 450A", manufactured by Nitto Industries Co., Ltd.), the resin composition (X-1) produced in Example 1 was impregnated, and 3 layers were stacked. After curing for 5 days at 23°C, a 250W metal halide lamp (absorption peak wavelength 420nm, illuminance 25mW/cm 2 ) was used to obtain a hardened product 3 with a thickness of 170mm×170mm and a thickness of 3.1mm (FRP: glass fiber content 31% by mass).

[實施例22] 實施例21中,取代樹脂組成物(X-1)使用在實施例15所製造的樹脂組成物(X-15)以外,同樣地得到硬化物4。 [Example 22] In Example 21, except that the resin composition (X-15) produced in Example 15 was used instead of the resin composition (X-1), a cured product 4 was obtained in the same manner.

[樹脂組成物的硬化物之測定評估] 對於在上述實施例19~22所得的硬化物,進行以下項目的測定評估。此等測定評估結果如下述表7及8所示。 對於測定評估用試驗片,使用將各硬化物切成長度80mm,寬度10mm加工後在溫度25℃其相對濕度50%之環境下進行24小時養護者。 [Measurement and evaluation of cured product of resin composition] For the cured products obtained in Examples 19 to 22 above, measurement and evaluation of the following items were performed. The results of these measurement evaluations are shown in Tables 7 and 8 below. As for the test piece for measurement and evaluation, each hardened product was cut into length 80mm, width 10mm, and then cured for 24 hours at a temperature of 25°C and a relative humidity of 50%.

<彎曲強度> 依據JIS K7171:2016,使用萬能材料試驗機(「TensilonUCT-1T」,東方科技股份有限公司製,支點間距離48mm,試驗速度1.3mm/分鐘),在溫度23℃且濕度50%之環境下,對於測定評估用試驗片5片進行測定,將該平均值作為樹脂組成物的硬化物之彎曲強度。 <Bending Strength> According to JIS K7171:2016, using a universal material testing machine ("TensilonUCT-1T", manufactured by Dongfang Technology Co., Ltd., the distance between the fulcrums is 48mm, and the test speed is 1.3mm/min), in an environment with a temperature of 23°C and a humidity of 50%. The measurement was performed on 5 test pieces for measurement and evaluation, and the average value was taken as the flexural strength of the cured product of the resin composition.

<彎曲彈性率> 依據JIS K7171:2016,使用萬能材料試驗機(「TensilonUCT-1T」,東方科技股份有限公司製,支點間距離48mm,試驗速度1.3mm/分鐘),在溫度23℃且濕度50%之環境下,對於測定評估用試驗片5片進行測定,將該平均值作為樹脂組成物的硬化物之彎曲彈性率。 <Bending modulus> According to JIS K7171:2016, using a universal material testing machine ("TensilonUCT-1T", manufactured by Dongfang Technology Co., Ltd., the distance between the fulcrums is 48mm, and the test speed is 1.3mm/min), in an environment with a temperature of 23°C and a humidity of 50%. The measurement was performed on 5 test pieces for measurement and evaluation, and the average value was taken as the flexural modulus of the cured product of the resin composition.

<負載撓度溫度> 對於在實施例19及20所得的硬化物1及2(鑄造品),依據JIS K7191-1:2015,使用負載撓度溫度(HDT)測定裝置(「HDT測試儀S-3M」,股份有限公司東洋精機製作所製),對於測定評估用試驗片3片進行測定,將該平均值作為樹脂組成物的硬化物之負載撓度溫度。 <Load deflection temperature> For hardened products 1 and 2 (cast products) obtained in Examples 19 and 20, a load deflection temperature (HDT) measuring device ("HDT tester S-3M", Toyo Co., Ltd.) was used according to JIS K7191-1:2015 Seiki Seisakusho Co., Ltd.) was measured on 3 test pieces for measurement and evaluation, and the average value was taken as the load deflection temperature of the cured product of the resin composition.

<巴氏硬度> 對於在實施例21及22所得的硬化物3及4(FRP),依據JIS K7060:1995,使用巴氏硬度計(「GYZJ 934-1」,Barber Coleman Ltd.製),對於測定評估用試驗片10片的光照射面之背面進行測定,將該平均值作為硬化物之巴氏硬度。 <Barcol Hardness> For hardened products 3 and 4 (FRP) obtained in Examples 21 and 22, a Barcol hardness tester ("GYZJ 934-1", manufactured by Barber Coleman Ltd.) was used in accordance with JIS K7060: 1995, and the test piece for measurement and evaluation was used. The measurement was performed on the back of the light-irradiated surface of 10 sheets, and the average value was taken as the Barcol hardness of the cured product.

Figure 02_image017
Figure 02_image017

Figure 02_image019
Figure 02_image019

由樹脂組成物的硬化物之彎曲強度、彎曲彈性率、負載撓度溫度,及巴氏硬度之測定評估結果可得知,所得的硬化物具有充分機械性強度者。 [產業上可利用性] From the measurement and evaluation results of the flexural strength, flexural modulus, load deflection temperature, and Barcol hardness of the cured product of the resin composition, it can be seen that the obtained cured product has sufficient mechanical strength. [industrial availability]

依據本實施形態,提供一種初期黏度為低,且隨著時間經過可增黏之樹脂組成物。又,提供將該樹脂組成物含浸於纖維基材片材的複合材料。該複合材料具有藉由增黏而可保持形狀的樹脂組成物,可得到施工性為良好且強度優異的硬化物。因此,適用於固定結構物之補強或修復用途,可作為預浸料、預成型體、襯材、襯材等而較佳使用。According to this embodiment, there is provided a resin composition whose initial viscosity is low and which can be increased over time. Also, a composite material is provided in which a fibrous base sheet is impregnated with the resin composition. This composite material has a resin composition capable of retaining its shape by thickening, and a cured product with good workability and excellent strength can be obtained. Therefore, it is suitable for the reinforcement or repair of fixed structures, and can be preferably used as prepreg, preform, lining material, lining material, etc.

Claims (19)

一種樹脂組成物,其中含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種化合物(C),與選自水及含有羥基的化合物的至少1種化合物(D),前述乙烯基酯樹脂(A)含有乙烯基酯樹脂(A1),前述乙烯基酯樹脂(A1)的重量平均分子量(Mw)為1,500以上,重量平均分子量Mw與數平均分子量Mn之比(Mw/Mn)為2.0以上。A resin composition comprising a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), at least one compound selected from oxides and hydroxides of metals belonging to group 2 elements ( C), and at least one compound (D) selected from water and hydroxyl-containing compounds, the aforementioned vinyl ester resin (A) contains vinyl ester resin (A1), the weight average molecular weight of the aforementioned vinyl ester resin (A1) (Mw) is 1,500 or more, and the ratio (Mw/Mn) of the weight average molecular weight Mw to the number average molecular weight Mn is 2.0 or more. 如請求項1之樹脂組成物,其中前述乙烯基酯樹脂(A1)之重量平均分子量(Mw)為35,000以下。The resin composition according to claim 1, wherein the weight average molecular weight (Mw) of the vinyl ester resin (A1) is 35,000 or less. 如請求項1或2之樹脂組成物,其中前述乙烯基酯樹脂(A1)之重量平均分子量Mw與數平均分子量Mn之比(Mw/Mn)為18以下。The resin composition according to claim 1 or 2, wherein the ratio (Mw/Mn) of the weight average molecular weight Mw to the number average molecular weight Mn of the vinyl ester resin (A1) is 18 or less. 如請求項1或2之樹脂組成物,其中前述乙烯基酯樹脂(A1)之酸價為5KOHmg/g以上。The resin composition according to claim 1 or 2, wherein the acid value of the above-mentioned vinyl ester resin (A1) is 5KOHmg/g or more. 如請求項1或2之樹脂組成物,其中前述乙烯基酯樹脂(A1)之酸價為100KOHmg/g以下。The resin composition according to claim 1 or 2, wherein the acid value of the above-mentioned vinyl ester resin (A1) is 100KOHmg/g or less. 如請求項1或2之樹脂組成物,其中前述乙烯基酯樹脂(A1)為樹脂前驅物(P1)與多元酸酐(a1-4)之加成反應生成物,前述樹脂前驅物(P1)為,相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳而言,將於1分子中具有2個環氧基的環氧化合物(a1-1)、不飽和一元酸(a1-2)及多元酸酐(a1-3)進行反應至來自前述多元酸酐(a1-3)的酸基之總量成為5~25莫耳而得的反應生成物。The resin composition according to claim 1 or 2, wherein the aforementioned vinyl ester resin (A1) is an addition reaction product of the resin precursor (P1) and polybasic acid anhydride (a1-4), and the aforementioned resin precursor (P1) is , with respect to the total amount of epoxy groups of the aforementioned epoxy compound (a1-1) 100 moles, the epoxy compound (a1-1) having two epoxy groups in one molecule, the unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) react until the total amount of the acid group derived from the said polybasic acid anhydride (a1-3) becomes 5-25 mol and the reaction product obtained. 如請求項6之樹脂組成物,其中前述環氧化合物(a1-1)為雙酚型環氧樹脂。The resin composition according to claim 6, wherein the epoxy compound (a1-1) is a bisphenol epoxy resin. 如請求項6之樹脂組成物,其中前述不飽和一元酸(a1-2)為選自(甲基)丙烯酸及巴豆酸的至少1種。The resin composition according to claim 6, wherein the unsaturated monobasic acid (a1-2) is at least one selected from (meth)acrylic acid and crotonic acid. 如請求項6之樹脂組成物,其中前述多元酸酐(a1-3)為二元酸酐。The resin composition according to claim 6, wherein the polybasic acid anhydride (a1-3) is a dibasic acid anhydride. 如請求項6之樹脂組成物,其中前述多元酸酐(a1-4)為二元酸酐。The resin composition according to claim 6, wherein the polybasic acid anhydride (a1-4) is a dibasic acid anhydride. 如請求項6之樹脂組成物,其中前述乙烯基酯樹脂(A)進一步含有乙烯基酯樹脂(A2),前述乙烯基酯樹脂(A2)為於1分子中具有2個以上環氧基的環氧化合物(a2-1)及不飽和一元酸(a2-2)之反應生成物。The resin composition according to claim 6, wherein the vinyl ester resin (A) further contains a vinyl ester resin (A2), and the vinyl ester resin (A2) is a ring having two or more epoxy groups in one molecule. A reaction product of an oxygen compound (a2-1) and an unsaturated monobasic acid (a2-2). 如請求項11之樹脂組成物,其中相對於前述乙烯基酯樹脂(A1)與前述乙烯基酯樹脂(A2)之合計100質量份而言,前述乙烯基酯樹脂(A1)為35~90質量份,前述乙烯基酯樹脂(A2)為10~65質量份。The resin composition according to claim 11, wherein the vinyl ester resin (A1) is 35 to 90 parts by mass relative to the total of 100 parts by mass of the vinyl ester resin (A1) and the vinyl ester resin (A2) parts, the aforementioned vinyl ester resin (A2) is 10 to 65 parts by mass. 如請求項1或2之樹脂組成物,其中前述化合物(C)為氧化鎂。The resin composition according to claim 1 or 2, wherein the aforementioned compound (C) is magnesium oxide. 如請求項1或2之樹脂組成物,其中進一步含有聚合起始劑(E)。The resin composition according to claim 1 or 2, further comprising a polymerization initiator (E). 如請求項1或2之樹脂組成物,其中聚合起始劑(E)為光聚合起始劑。The resin composition according to claim 1 or 2, wherein the polymerization initiator (E) is a photopolymerization initiator. 如請求項1或2之樹脂組成物,其中相對於前述乙烯基酯樹脂(A)與前述含有乙烯性不飽和基的單體(B)之合計100質量份而言,含有前述乙烯基酯樹脂(A)20~80質量份,含有前述含有乙烯性不飽和基的單體(B)20~80質量份,含有前述化合物(C)0.01~6質量份,含有前述化合物(D)0.01~3質量份。The resin composition according to claim 1 or 2, wherein said vinyl ester resin is contained with respect to a total of 100 parts by mass of said vinyl ester resin (A) and said ethylenically unsaturated group-containing monomer (B) (A) 20 to 80 parts by mass, containing 20 to 80 parts by mass of the aforementioned ethylenically unsaturated group-containing monomer (B), containing 0.01 to 6 parts by mass of the aforementioned compound (C), and containing 0.01 to 3 parts by mass of the aforementioned compound (D) parts by mass. 一種樹脂組成物之製造方法,其係含有乙烯基酯樹脂(A)、含有乙烯性不飽和基的單體(B)、選自屬於第2族元素的金屬之氧化物及氫氧化物的至少1種之化合物(C),與選自水及含有羥基的化合物的至少1種之化合物(D)的樹脂組成物之製造方法,其中前述乙烯基酯樹脂(A)含有乙烯基酯樹脂(A1),其係含有下述步驟1~3的樹脂組成物之製造方法; 步驟1:將於1分子中具有2個環氧基之環氧化合物(a1-1)、不飽和一元酸(a1-2)及多元酸酐(a1-3)進行反應至,相對於前述環氧化合物(a1-1)之環氧基的總量100莫耳,前述來自多元酸酐(a1-3)的酸基之總量成為5~25莫耳而得到樹脂前驅物(P1)之步驟, 步驟2:使前述樹脂前驅物(P1)及多元酸酐(a1-4)進行加成反應後得到前述乙烯基酯樹脂(A1)之步驟, 步驟3:混合前述乙烯基酯樹脂(A)、前述含有乙烯性不飽和基的單體(B)、前述化合物(C)與前述化合物(D)而得到樹脂組成物之步驟。 A method for producing a resin composition comprising a vinyl ester resin (A), an ethylenically unsaturated group-containing monomer (B), and at least A method for producing a resin composition of a compound (C) and at least one compound (D) selected from water and hydroxyl-containing compounds, wherein the vinyl ester resin (A) contains a vinyl ester resin (A1 ), which is a method for producing a resin composition comprising the following steps 1 to 3; Step 1: react epoxy compound (a1-1), unsaturated monobasic acid (a1-2) and polybasic acid anhydride (a1-3) with 2 epoxy groups in 1 molecule until, relative to the aforementioned epoxy The total amount of epoxy groups in compound (a1-1) is 100 moles, and the total amount of acid groups derived from polybasic acid anhydride (a1-3) is 5-25 moles to obtain the resin precursor (P1), Step 2: the step of obtaining the aforementioned vinyl ester resin (A1) after the aforementioned resin precursor (P1) and polybasic acid anhydride (a1-4) undergo an addition reaction, Step 3: a step of mixing the aforementioned vinyl ester resin (A), the aforementioned ethylenically unsaturated group-containing monomer (B), the aforementioned compound (C) and the aforementioned compound (D) to obtain a resin composition. 一種複合材料,其中含有如請求項1~16中任一項之樹脂組成物與纖維基材薄片(F)。A composite material, which contains the resin composition according to any one of claims 1 to 16 and a fibrous substrate sheet (F). 如請求項18之複合材料,其為管材修補用。Such as the composite material of claim 18, which is used for repairing pipes.
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