TW202320209A - Apparatus for transferring electronic component from flexible carrier substrate to flexible target substrate and method of transferring electronic component - Google Patents

Abstract

An apparatus for transferring an electronic component from a flexible carrier substrate to a flexible target substrate is provided. The apparatus includes a first frame, a second frame, an abutment element and a deformation generating mechanism. The first frame is used to carry the flexible carrier substrate. The second frame is used to carry the flexible target substrate. The abutment element is arranged adjacent to the first frame, and is controlled by a braking mechanism, and can move repeatedly toward and away from the second frame. The deformation generating mechanism is adjacent to the second frame and is arranged opposite to the abutment element. When the abutment element moves toward the second frame, the deformation generating mechanism can form a relative force toward the abutment element at a position where the surface of the flexible target substrate carried by the second frame is relative to the abutment element.

Description

Device for transferring electronic components from a flexible carrier substrate to a flexible target substrate and method for transferring electronic components

The present invention relates to a device for transferring electronic components from a flexible carrier substrate to a flexible target substrate and a method for transferring electronic components.

In the manufacturing process of electronic products, there are often related electronic component transfer steps. For example, in the manufacturing process of light-emitting diode display panels (LED displays), light-emitting diodes are often transferred from one flexible substrate to another by a pick-and-place apparatus. Sexual substrate. However, the throughput or yield of the above method may be low.

The invention provides a device for transferring electronic components from a flexible carrier substrate to a flexible target substrate and a method for transferring electronic components, which can be used for transferring electronic components.

The device for transferring electronic components from a flexible carrier substrate to a flexible target substrate includes a first frame, a second frame, an abutment element and a deformation generating mechanism. The first frame is used for carrying the flexible carrier substrate. The second frame is used to carry the flexible target substrate. The resisting element is arranged adjacent to the first frame, and is controlled by the brake mechanism, and can repeatedly move towards and away from the second frame. The deformation generating mechanism is adjacent to the second frame and is arranged opposite to the resisting element. When the resisting element moves toward the second frame, the position of the surface of the flexible target substrate carried by the second frame relative to the resisting element At the position, a relative force is formed towards the abutment element.

The method for transferring electronic components of the present invention includes the following steps: providing a flexible carrier substrate on which electronic components are carried; providing a flexible target substrate; arranging the flexible carrier substrate and the flexible target substrate oppositely, and making the flexible carrier substrate One side of the flexible bearing substrate carrying electronic components faces the flexible target substrate; applying force to the side of the flexible bearing substrate that does not carry electronic components, so that the electronic components move toward the flexible target substrate; applying a relative force to the flexible target On the substrate, the flexible target substrate is deformed, and the receiving point is defined on the flexible target substrate by deformation, and the peripheral area of the flexible target substrate at the receiving point is kept away from the electronic component; the electronic component is contacted and transferred to the receiving point and stop applying the active force and the opposing force to return the flexible carrier substrate and the flexible target substrate to their original shape.

Based on the above, the device and method of the present invention can be adapted to transfer electronic components from a flexible carrier substrate to a flexible target substrate.

The contents of the following examples are illustrative and not limiting. Also, descriptions of well-known devices, methods and materials may be omitted so as not to obscure the description of the various principles of the invention. Directional terms (eg, up, down, top, bottom) used herein refer only to the pictorial use or corresponding idiom and are not intended to imply absolute orientation. In addition, unless the content clearly indicates otherwise, the singular forms "a", "an", "the" or forms not expressly expressing a quantity may include one or a plurality of forms, ie, include "at least one".

In some drawings, for the sake of clarity, some elements or film layers may be enlarged, reduced or omitted. For example, in FIG. 1A , FIG. 2A or FIG. 3A , the electronic component 810 may be shown enlarged, and/or the thickness of the flexible carrier substrate 130 or the thickness of the flexible target substrate 140 may be shown enlarged.

Similar components are denoted by the same reference numerals, and have similar functions, materials, or formation methods, and descriptions thereof are omitted. It will be apparent to those skilled in the art to which this invention pertains that, from the context of the embodiments and the corresponding illustrations, the invention may be practiced in other embodiments that depart from the specific details disclosed herein.

1A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. FIG. 1B to FIG. 1D are partial side views of a device for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. FIG. 1E is a schematic bottom view of part of the operation of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to an embodiment of the present invention. For example, FIG. 1B or FIG. 1C may be a partial enlarged view corresponding to the region R1 in FIG. 1A , and FIG. 1D may be a partial enlarged view corresponding to the region R2 in FIG. 1C . In an embodiment, FIG. 1E may be a schematic bottom view corresponding to FIG. 1C .

Referring to FIG. 1A , an electronic component transferring device (may be simply referred to as a device) 100 may be adapted to transfer an electronic component 810 from a flexible carrier substrate 130 to a flexible target substrate 140 (details will be described later). The electronic component transferring device 100 includes a first frame 171 , a second frame 181 , an abutting element 111 and a deformation generating mechanism 120 . The first frame 171 is used for carrying the flexible carrier substrate 130 . The second frame 181 is used to carry the flexible target substrate 140 . The first frame 171 or the second frame 181 allows the flexible target substrate 140 and the flexible carrier substrate 130 to be disposed opposite to each other. The resisting element 111 is disposed adjacent to the first frame 171 . The abutting element 111 can be controlled by the brake mechanism 112, and can face the direction of the second frame 181 (may be referred to as: the second direction D2) and the direction away from the second frame 181 (may be referred to as: the first direction D1). Do repeated moves. The deformation generating mechanism 120 is adjacent to the second frame 181 . The deformation generating mechanism 120 and the resisting element 111 are arranged opposite to each other. When the abutment element 111 moves toward the second frame 181, the deformation generating mechanism 120 can form a position facing the abutment element 111 at the position of the surface of the flexible target substrate 140 carried by the second frame 181 relative to the abutment element 111. force. The detailed structure of the resisting element 111 and/or the deformation generating mechanism 120 and/or their corresponding action methods will be described in detail later.

In this embodiment, the electronic component transfer apparatus 100 may further include a control system 190 . The control system 190 can be connected to corresponding components, elements or units (such as: the first frame 171, the second frame 181, the braking mechanism 112, brake mechanism 122 and/or other devices described later, but not limited), but the present invention is not limited thereto. In an embodiment, the control system 190 may be connected to corresponding components, elements or units by means of wireless signal transmission. That is to say, the electronic component transfer device 100 including the control system 190 and the first frame 171, the second frame 181, the braking mechanism 112, the braking mechanism 122 and/or other devices described later are the same equipment or machine. . In addition, the signal connection mentioned in the present invention can generally refer to the connection mode of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection methods to be the same or different.

In one embodiment, the first frame 171 can indirectly fix the flexible carrier substrate 130 through the carrier frame 172 , but the invention is not limited thereto.

In this embodiment, the flexible carrier substrate 130 may include UV tape or blue tape, but the invention is not limited thereto. In one embodiment, the carrier frame 172 may be called a blue film frame, but the invention is not limited thereto.

In one embodiment, the flexible carrier substrate 130 may be a composite material. For example, the flexible carrier substrate 130 may have a polymer film covered with an adhesive layer.

In this embodiment, the flexible bearing substrate 130 may have a first bearing surface 130a and a second bearing surface 130b opposite to the first bearing surface 130a. The electronic component 810 may be located on the first carrying surface 130 a of the flexible carrying substrate 130 . The first carrying surface 130 a of the flexible carrying substrate 130 may be disposed opposite to the first target surface 140 a of the flexible target substrate 140 .

In this embodiment, the electronic component 810 may include light-emitting crystal grains (such as: Light-emitting diode (Light-emitting diode, LED) chip; but not limited to) or integrated circuit (integrated circuit, IC), but the present invention does not limited to this. In addition, for the sake of clarity, not all electronic components 810 are shown or marked in FIG. 1A or other subsequent figures.

In one embodiment, the second frame 181 can indirectly flex the target substrate 140 through the carrier frame 182 , but the invention is not limited thereto.

In one embodiment, the material of the flexible target substrate 140 may be the same as or similar to that of the flexible carrier substrate 130 , so details are not described here.

The method of transferring the electronic component 810 from the flexible carrier substrate 130 to the flexible target substrate 140 by the electronic component transfer device 100 can be as follows. However, it should be noted that the present invention is not limited to the methods described later. In addition, for the sake of clarity, in the subsequent partial drawings (eg, FIG. 1B to FIG. 1C ), only schematic side cross-sectional views of some components corresponding to the region R1 in FIG. 1A are shown. In addition, for the sake of clarity, some elements or components may be omitted in subsequent partial drawings.

Referring to FIG. 1A , an electronic component transfer device 100 , a flexible carrier substrate 130 carrying an electronic component 810 , and a flexible target substrate 140 are provided. The flexible carrier substrate 130 and the flexible target substrate 140 are arranged oppositely, and the side of the flexible carrier substrate 130 carrying the electronic component 810 faces the flexible target substrate 140 . Then, the following steps are performed in any order: applying a force to the side of the flexible carrier substrate 130 that does not carry the electronic component 810, so that the electronic component 810 moves toward the flexible target substrate 140; and applying a relative force to the flexible target On the substrate 140 , a deformation is generated on the flexible target substrate 140 , and a receiving point is defined on the flexible target substrate 140 by the deformation, and the peripheral area of the flexible target substrate 140 at the receiving point is kept away from the electronic component 810 . In this way, the electronic component 810 can be contacted and transferred to the receiving point. Afterwards, the application of the acting force and the opposing force is stopped in any order, so that the flexible carrier substrate 130 and the flexible target substrate 140 return to their original shapes.

It should be noted that, in FIG. 1A , the quantity and/or arrangement of the electronic components 810 disposed on the flexible carrier substrate 130 are only shown for example, and are not limited in the present invention.

It should be noted that in FIG. 1A , the way of disposing the flexible carrier substrate 130 on the first frame 171 and/or the way of disposing the flexible target substrate 140 on the second frame 181 is only shown as an example. , is not limited in the present invention.

Referring to FIGS. 1A to 1B , the abutting element 111 of the electronic component transfer device 100 is brought close to the flexible carrier substrate 130 to further make the abutting surface 111b of the abutting element 111 (marked in FIG. 1D or FIG. 1E ) against a side of the flexible carrier substrate 130 that does not carry the electronic component 810 (eg, the second carrier surface 130 b ). For example, the abutting element 111 can be moved along the second direction D2 by the braking mechanism 112 , so that at least the abutting element 111 contacts the second bearing surface 130 b of the flexible bearing substrate 130 .

In this embodiment, the resisting element 111 may include a pintle.

In this embodiment, the load-bearing abutting surface 111b of the abutting element 111 may be a plane or nearly a plane. In this way, when the bearing abutting surface 111 b of the abutting element 111 is abutted against the flexible bearing substrate 130 , the possibility of damage or damage to the flexible bearing substrate 130 can be reduced. That is to say, the resisting element 111 (such as a pintle) basically does not penetrate the flexible carrier substrate 130 .

Please continue to refer to FIG. 1A to FIG. 1B , so that at least a part of the deformation generating mechanism 120 of the electronic component transfer device 100 is close to the flexible target substrate 140 . The deformation generating mechanism 120 may include a pintle 121 and a corresponding braking mechanism 122 . The pintle 121 can be moved along the first direction D1 by the braking mechanism 122, so that at least the target abutting surface 121b (marked in FIG. 1D or FIG. 1E) of the pintle 121 is in contact with the second surface of the flexible target substrate 140. Target surface 140b.

In this embodiment, the target abutting surface 121b of the pintle 121 may be a plane or close to a plane. In this way, when the target abutting surface 121 b of the pintle 121 is pressed against the flexible target substrate 140 , the possibility of damage or damage to the flexible target substrate 140 can be reduced. That is to say, the pintle 121 of the deformation generating mechanism 120 basically does not penetrate the flexible target substrate 140 .

It should be noted that the present invention does not limit the order in which the pintle 121 of the deformation generating mechanism 120 contacts the flexible target substrate 140 and the resisting element 111 contacts the flexible carrier substrate 130 . For example, the pintle 121 and the abutting element 111 may respectively contact the flexible target substrate 140 and the flexible carrier substrate 130 at the same time or at different times.

Please refer to FIG. 1B to FIG. 1C or 1D, apply a force on the side of the flexible carrier substrate 130 that does not carry the electronic component 810, so that the corresponding electronic component 811 on the flexible carrier substrate 130 (such as: one of the electronic components 810 One of them; labeled in FIG. 1D ) moves toward the flexible target substrate 140 .

For example, the abutting element 111 can be moved by the brake mechanism 112, so that the abutting element 111 contacting the flexible carrier substrate 130 exerts a corresponding force on the flexible carrier substrate 130, so that the flexible carrier substrate 130 A corresponding deflection is generated toward the direction of the flexible target substrate 140 , so that the corresponding electronic components 811 on the flexible carrier substrate 130 can move toward the direction of the flexible target substrate 140 . That is to say, the force exerted on the flexible carrier substrate 130 can be generated by the resisting element 111 abutting against the flexible carrier substrate 130 .

Please continue referring to FIG. 1B to FIG. 1C or 1D , a relative force is applied to the flexible target substrate 140 to deform the flexible target substrate 140 . Moreover, a receiving point can be defined on the deformed flexible target substrate 140 (such as: the flexible target substrate 140 corresponds to the target abutting surface 121b of the pintle 121 of the deformation generating mechanism 120), wherein the flexible target substrate 140 The surrounding area of the receiving point is away from the electronic component 811 . That is to say, in the deformed flexible target substrate 140 , the receiving point is closer to the electronic component 811 to be transferred than other regions other than the receiving point (ie, the peripheral region).

For example, the pintle 121 can be moved by the braking mechanism 122, so that the pintle 121 contacting the flexible target substrate 140 exerts a corresponding relative force on the flexible target substrate 140, so that the flexible target substrate 140 moves toward the flexible target substrate 140. The direction of the permanent carrier substrate 130 produces a corresponding deflection. That is to say, the relative force exerted on the flexible target substrate 140 can be generated by the pintle 121 of the deformation generating mechanism 120 abutting against the flexible target substrate 140 .

It should be noted that the present invention does not limit the order in which the flexible carrier substrate 130 is deformed when an active force is applied and the flexible target substrate 140 is deformed by a relative force.

Please refer to FIG. 1C or 1D, after the flexible carrier substrate 130 is deformed by exerting force and the flexible target substrate 140 is deformed by exerting a relative force, the electronic components 811 on the flexible carrier substrate 130 can be contacted. The receiving point of the flexible target substrate 140 is further transferred to the receiving point of the flexible target substrate 140 .

In this embodiment, the electronic component transferring device 100 may further include a casing 150 . The housing 150 may have a gas chamber 151 , a gas channel 152 and at least one gas opening 153 . The gas channel 152 and the gas opening 153 communicate with the gas chamber 151 . The location of the gas opening 153 corresponds to the flexible carrier substrate 130 . When the resisting element 111 exerts a corresponding force on the flexible bearing substrate 130, the negative pressure generating device 175 can pump air through the gas pipeline 174 connected to the gas passage 152, thereby reducing the deformation of the flexible bearing substrate 130. scope.

Taking FIGS. 1C and 1D as examples, the housing 150 may further have a resisting opening 154 communicating with the air chamber 151 . The resisting element 111 sleeved in the housing 150 can pass through the resisting opening 154 to resist the flexible carrier substrate 130 . When the resisting element 111 exerts a corresponding force on the flexible carrier substrate 130 , the negative pressure generating device 175 can draw air. In this way, the partial area of the flexible carrier substrate 130 corresponding to the abutting opening 154 can produce a corresponding deformation due to the abutment of the abutting element 111 , so that the corresponding electronic component 811 can move toward the direction of the flexible target substrate 140 . Moreover, the air pressure difference generated by the aforementioned pumping (such as: the air pressure outside the housing 150 is greater than the air pressure in the air chamber 151 of the housing 150) can make the other part of the flexible carrier substrate 130 corresponding to the gas opening 153 substantially There will be no deformation. Therefore, the precision of transferring the electronic component 811 can be improved.

In one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the air pressure in the air chamber 151 of the housing 150 starts to decrease.

In one embodiment, before the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the air pressure in the air chamber 151 of the housing 150 starts to decrease.

In one embodiment, before starting to reduce the air pressure in the air chamber 151 of the housing 150 , the second loading surface 130 b of the flexible bearing substrate 130 may touch the outer surface of the housing 150 , but the invention is not limited thereto. In an embodiment not shown, there may be a gap between the second loading surface 130b of the flexible loading substrate 130 and the outer surface of the housing 150 before starting to reduce the air pressure in the air chamber 151 of the housing 150 .

1E, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the contact area between the electronic component 811 and the flexible target substrate 140 can be larger than the electronic component 810 by the above method. The contact area with the flexible carrier substrate 130 . In this way, the transfer efficiency and/or transfer yield of the electronic component 811 can be improved.

Please refer to FIG. 1E , in one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the contact area between the pintle 121 of the deformation generating mechanism 120 and the flexible target substrate 140 It may be larger than the contact area between the electronic component 811 and the flexible carrier substrate 130 . In this way, the deviation of the electronic component 811 on the flexible target substrate 140 during transfer can be reduced, and the transfer efficiency and/or transfer yield of the electronic component 811 can be improved.

1D and FIG. 1E, in one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the contact area between the electronic component 810 and the flexible carrier substrate 130 is substantially It may be equal to the contact area between the resisting element 111 and the flexible carrier substrate 130 . Moreover, through the above method, both the flexible carrier substrate 130 and the flexible target substrate 140 can have corresponding deformations, so that other electronic components 812 on the flexible carrier substrate 130 (such as: electronic components 810 that have not been transferred) can be reduced. ) may touch other electronic components 813 (eg, transferred electronic components 810 ) on the flexible target substrate 140 .

In one embodiment, after the electronic component 810 on the flexible carrier substrate 130 touches the receiving point of the flexible target substrate 140, the application of the aforementioned force (such as: pushing the resisting element 111 away from the flexible carrier substrate 130 can be stopped. direction) and/or stop applying the aforesaid relative force (eg, moving the pintle 121 of the deformation generating mechanism 120 away from the flexible target substrate 140 ). Moreover, when or after the abutting element 111 moves away from the flexible carrier substrate 130 and/or when the pintle 121 moves away from the flexible target substrate 140 or after, the flexible carrier substrate 130 and/or the flexible carrier substrate 130 moves away from the flexible target substrate 140 The flexible target substrate 140 can return to its original shape due to its own elasticity/deflection, so that the flexible carrier substrate 130 is completely separated from the electronic component 811 .

2A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. 2B to 2D are schematic side views of partial operations of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. For example, FIG. 2B or FIG. 2C may be a partial enlarged view corresponding to the region R3 in FIG. 2A , and FIG. 2D may be a partial enlarged view corresponding to the region R4 in FIG. 2C . In an embodiment, FIG. 1E may be a schematic bottom view corresponding to FIG. 2C .

Referring to FIG. 2A and FIG. 1A , the electronic component transfer device 200 of this embodiment is similar to the electronic component transfer device 100 of the first embodiment. That is to say, the electronic component transferring device 200 may include the first frame 171 , the second frame 181 , the abutting element 111 and the deformation generating mechanism 220 .

The electronic component transfer device 200 can be adapted to transfer the electronic component 810 from the flexible carrier substrate 130 to the flexible target substrate 140 in a manner similar to that described above. However, it should be noted that the present invention is not limited to the methods described later. In addition, for the sake of clarity, in the subsequent partial drawings (eg, FIG. 2B to FIG. 2C ), only schematic side cross-sectional views of some components corresponding to the region R3 in FIG. 2A are shown. In addition, for the sake of clarity, some elements or components may be omitted in subsequent partial drawings.

Please refer to FIG. 2A and FIG. 2B , in this embodiment, the electronic component transfer device 200 may further include a casing 260 . The housing 260 may have a gas chamber 261 , a gas channel 262 and at least one gas opening 263 . The gas channel 262 and the gas opening 263 communicate with the gas chamber 261 . The position of the gas opening 263 corresponds to the flexible target substrate 140 .

Please refer to FIG. 2B and FIG. 2C or FIG. 2D, when the pintle 121 exerts a corresponding relative force on the flexible target substrate 140, the negative pressure generating device 285 can pump air through the gas pipeline 284 connected to the gas channel 262, and The range in which the flexible target substrate 140 is deformed can be reduced. That is to say, at least the pintle 121 , the braking mechanism 122 , the housing 260 and the negative pressure generating device 285 which are suitable for generating corresponding deformation of the flexible target substrate 140 can be regarded as the deformation generating mechanism 220 . In other words, the deformation generating mechanism 220 may include the pintle 121 , the braking mechanism 122 , the housing 260 and the negative pressure generating device 285 .

Taking FIGS. 2C and 2D as examples, the casing 260 may further have a resisting opening 264 communicating with the air chamber 261 . The pintle 121 sleeved in the casing 260 can pass through the abutting opening 264 to abut against the flexible target substrate 140 . When the pintle 121 of the deformation generating mechanism 220 exerts a corresponding relative force on the flexible target substrate 140 , the negative pressure generating device 285 can pump air through the gas pipeline 284 connected to the gas channel 262 . In this way, the partial area of the flexible target substrate 140 corresponding to the abutment opening 264 can be deformed due to the abutment of the pintle 121, so that the corresponding area abutted by the pintle 121 can move toward the flexible carrier substrate. 130 direction to move. Moreover, the air pressure difference generated by the aforementioned pumping (such as: the air pressure outside the housing 260 is greater than the air pressure in the air chamber 261 of the housing 260) can make the flexible target substrate 140 correspond to the other part of the gas opening 263. There will be no deformation. Therefore, the transfer accuracy of the electronic component 811 can be improved.

In one embodiment, when the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the air pressure in the air chamber 261 of the housing 260 starts to decrease.

In one embodiment, before the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the air pressure in the air chamber 261 of the housing 260 starts to decrease.

In one embodiment, the second target surface 140 b of the flexible target substrate 140 may touch the outer surface of the housing 260 before starting to reduce the air pressure in the air chamber 261 of the housing 260 , but the invention is not limited thereto. In an embodiment not shown, there may be a gap between the second target surface 140 b of the flexible target substrate 140 and the outer surface of the housing 260 before starting to reduce the air pressure in the air chamber 261 of the housing 260 .

Similar to the aforementioned method, in one embodiment, after the electronic component 811 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140, the aforementioned active force and/or the aforementioned opposing force may be stopped. . Moreover, when or after the abutting element 111 moves away from the flexible bearing substrate 130 and/or when or after the pintle 121 of the deformation generating mechanism 220 moves away from the flexible target substrate 140, the flexible bearing substrate The flexible target substrate 130 and/or the flexible target substrate 140 can return to the original shape due to its own elasticity/deflection, so that the flexible carrier substrate 130 and the electronic component 810 are completely separated.

3A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention. 3B to 3D are schematic side views of partial operations of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention. For example, FIG. 3B or FIG. 3C may be a partial enlarged view corresponding to the region R5 in FIG. 3A , and FIG. 3D may be a partial enlarged view corresponding to the region R6 in FIG. 3C . In an embodiment, FIG. 1E may be a schematic bottom view corresponding to FIG. 3C .

Referring to FIG. 3A and FIG. 2A , the electronic component transfer device 300 of this embodiment is similar to the electronic component transfer device 200 of the second embodiment. That is to say, the electronic component transferring device 300 may include the first frame 171 , the second frame 181 , the abutting element 111 and the deformation generating mechanism 320 .

The electronic component transfer device 300 can be adapted to transfer the electronic component 810 from the flexible carrier substrate 130 to the flexible target substrate 140 in a manner similar to that described above. However, it should be noted that the present invention is not limited to the methods described later. In addition, for the sake of clarity, in subsequent partial drawings (eg, FIG. 3B to FIG. 3C ), only schematic side cross-sectional views of some components corresponding to the R5 region in FIG. 3A are shown. In addition, for the sake of clarity, some elements or components may be omitted in subsequent partial drawings.

Please refer to FIG. 3A and FIG. 3B , in this embodiment, the electronic component transfer device 300 may further include a casing 360 . The housing 360 may have a gas chamber 261 , a gas channel 262 , at least one gas opening 263 and a protrusion 365 . The protrusion 365 may correspond to the flexible target substrate 140 , and the protrusion 365 may be located at an edge of the case 360 .

Please continue referring to FIG. 3B to FIG. 3C or FIG. 3D , a relative force is applied to the flexible target substrate 140 to deform the flexible target substrate 140 . Moreover, a receiving point can be defined on the deformed flexible target substrate 140 , wherein the flexible target substrate 140 is away from the electronic component 811 in the peripheral area of the receiving point. That is, in the deformed flexible target substrate 140 , the receiving point is closer to the pre-transferred electronic component 811 than other regions (ie, peripheral regions) other than the receiving point.

For example, the negative pressure generating device 285 can draw air. In this way, as shown in FIGS. 3B to 3C , the partial area of the flexible target substrate 140 corresponding to the gas opening 263 may be relatively concave in the second direction D2 due to the air pressure difference. Moreover, a partial area of the flexible carrier substrate 130 corresponding to the abutting opening 154 may relatively protrude in the first direction D1 due to the abutting of the abutting element 111 . That is to say, the relative force applied to the flexible target substrate 140 can be formed by pumping air to the flexible target substrate 140 and abutting against the pintle 121 . That is to say, at least the pintle 121 , the braking mechanism 122 , the casing 360 and the negative pressure generating device 285 which are suitable for the flexible target substrate 140 to generate corresponding deformation can be regarded as the deformation generating mechanism 320 . In other words, the deformation generating mechanism 320 may include the pintle 121 , the braking mechanism 122 , the housing 360 and the negative pressure generating device 285 . Through the aforementioned method, the transfer accuracy of the electronic component 810 can be improved.

In one embodiment, before the electronic component 810 on the flexible carrier substrate 130 contacts the receiving point of the flexible target substrate 140 , the air pressure in the air chamber 261 of the casing 360 starts to decrease.

In one embodiment, the second target surface 140b of the flexible target substrate 140 may touch the outer surface of the housing 360 (such as the convex surface of the housing 360) before starting to reduce the air pressure in the air chamber 261 of the housing 360. 365) or the target abutting surface 121b of the pintle 121, but the present invention is not limited thereto. In an unillustrated embodiment, before starting to reduce the air pressure in the air chamber 261 of the housing 360, the second loading surface 130b of the flexible bearing substrate 130 and the outer surface of the housing 360 (such as: the housing 360 There may be a gap between the protrusion 365) and/or the target abutting surface 121b of the pintle 121.

Components or elements in all drawings can be turned into components presented in another unshown drawing through appropriate inversion, rotation, arrangement and/or combination. For example, in an unillustrated drawing or embodiment, its aspect may be the rotation or upside-down flip of FIG. 1A , FIG. 2A or FIG. 3A . For another example, in an unillustrated drawing or embodiment, the housing corresponding to the resisting element 111 may be the same as or similar to the housing corresponding to the needle pintle 121 .

The method for transferring electronic components in the above embodiments can be applied to any suitable manufacturing process of electronic devices. For example, the electronic component 720 may include an LED wafer, and the above transfer method may be a part of the manufacturing process of the LED panel.

To sum up, the electronic component transfer device and electronic component transfer method of the present invention can be adapted to transfer the electronic components on the flexible carrier substrate to the flexible target substrate.

100, 200, 300: device 111: Resisting element 111b: load-bearing abutment surface 112: braking mechanism 120, 220, 320: deformation generating mechanism 121: Pinpin 121b: Target abutment surface 122: brake mechanism 130: flexible carrier substrate 130a, 130b: bearing surfaces 140: Flexible target substrate 140a, 140b: target surface 150, 260, 360: Shell 151, 261: air chamber 152, 262: gas channel 153, 263: gas opening 154, 264: against the opening 171: First frame 181: Second frame 172, 182: carrier frame 174, 284: gas pipeline 175, 285: negative pressure generating device 190: Control system 191: signal line 365: Raised 810, 811, 812, 813: electronic components D1: the first direction D2: Second direction R1, R2, R3, R4, R5, R6: Regions

1A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. FIG. 1B to FIG. 1D are partial side views of a device for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a first embodiment of the present invention. FIG. 1E is a schematic bottom view of part of the operation of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to an embodiment of the present invention. 2A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. 2B to 2D are schematic side views of partial operations of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a second embodiment of the present invention. 3A is a schematic partial side view of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention. 3B to 3D are schematic side views of partial operations of an apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate according to a third embodiment of the present invention.

111: Resisting element

111b: load-bearing abutment surface

120: Deformation generating mechanism

121: Pinpin

121b: Target abutment surface

130: flexible carrier substrate

130a, 130b: bearing surfaces

140: Flexible target substrate

140a, 140b: target surface

150: shell

154: against the opening

810, 811, 812, 813: electronic components

Claims (12)

An apparatus for transferring electronic components from a flexible carrier substrate to a flexible target substrate comprising: a first frame, which is used to carry the flexible carrier substrate; a second frame, which is used to carry the flexible target substrate; a resisting element, which is arranged adjacent to the first frame and controlled by a brake mechanism, can repeatedly move toward and away from the second frame; and A deformation generating mechanism, which is adjacent to the second frame and opposite to the resisting element, can be used for the flexible target carried by the second frame when the resisting element moves towards the second frame A relative force toward the resisting element is formed at the position of the substrate surface relative to the resisting element. The device as claimed in claim 1, wherein the relative force is formed by a pintle moving toward the abutting element. The device as claimed in claim 1, wherein the relative force is formed by drawing a vacuum on the flexible target substrate carried by the second frame in the same direction as the resisting element moves through a pintle. The device according to claim 3, wherein the pintle is moved in the direction of the resisting element. The device as claimed in claim 3, wherein the pintle is stationary. The device according to claim 1, wherein the electronic component is an LED chip. A method of transferring electronic components, comprising: providing a flexible carrier substrate on which an electronic component is mounted; providing a flexible target substrate; The flexible carrier substrate and the flexible target substrate are arranged oppositely, and one side of the flexible carrier substrate carrying the electronic component faces the flexible target substrate; applying a force to a surface of the flexible carrier substrate not carrying the electronic component, so that the electronic component moves toward the flexible target substrate; exerting a relative force on the flexible target substrate, causing the flexible target substrate to produce a deformation, and defining a receiving point on the flexible target substrate by the deformation, and making the flexible target substrate in the position of the receiving point The surrounding area is away from the electronic component; contact and transfer the electronic component to the receiving point; and Stopping the application of the acting force and the opposing force returns the flexible carrier substrate and the flexible target substrate to their original shape. The method as claimed in claim 7, wherein the force is generated by an ejector pin abutting against the flexible carrier substrate. The method as claimed in claim 8, wherein the ejector pin does not break through the flexible carrier substrate when abutting. The method of claim 7, wherein the relative force is generated by a pintle against the flexible target substrate. The method as claimed in claim 10, wherein the relative force is further formed by evacuating the flexible target substrate and abutting against the pintle. The method according to claim 7, wherein the electronic component is an LED chip.

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