TW202318590A - Semiconductor process equipment, tray and cassette - Google Patents

Semiconductor process equipment, tray and cassette Download PDF

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Publication number
TW202318590A
TW202318590A TW111139642A TW111139642A TW202318590A TW 202318590 A TW202318590 A TW 202318590A TW 111139642 A TW111139642 A TW 111139642A TW 111139642 A TW111139642 A TW 111139642A TW 202318590 A TW202318590 A TW 202318590A
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Taiwan
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tray
pallet
characteristic information
chamber
transmission
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TW111139642A
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Chinese (zh)
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TWI806790B (en
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程旭文
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大陸商北京北方華創微電子裝備有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67294Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766Mechanical parts of transfer devices

Abstract

A semiconductor process equipment includes a process chamber, a transmission chamber and a loading chamber, wherein the loading chamber is used for holding a cassette, the cassette is used for carrying a tray, and the transmission chamber is provided with a transmission device for transmitting a tray between the process chamber and the loading chamber; An image recognition device is arranged at the junction of the loading chamber and the transmission chamber. The image recognition device is used to recognize the characteristic image preset on the tray and determine the characteristic information of the tray during the movement of the tray carried by the transmission device; The semiconductor process equipment also includes a controller for acquiring feature information, searching the transmission parameters corresponding to the feature information from the preset tray information database, and controlling the transmission device to transmit the tray according to the transmission parameters. A tray applied to semiconductor process equipment and a cassette used for carrying a tray.

Description

半導體製程設備、托盤及片盒Semiconductor process equipment, trays and cassettes

本申請屬於半導體裝備技術領域,具體涉及一種半導體製程設備、托盤及片盒。The application belongs to the technical field of semiconductor equipment, and in particular relates to a semiconductor process equipment, a tray and a cassette.

增強型等離子體氣相沉積(Plasma Enhanced Chemical Vapor Deposition,PECVD)設備是普遍應用於LED、IC以及微機電系統(Micro Electro Mechanical System,MEMS)等相關領域的一種薄膜沉積設備,主要應用在2吋、4吋、6吋等規格的晶圓表面沉積SiO2、SiNx或SiON薄膜的製程過程,目前該種設備已經大量應用在相關半導體領域。Enhanced plasma vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) equipment is a thin film deposition equipment commonly used in LED, IC and micro electromechanical systems (Micro Electro Mechanical System, MEMS) and other related fields, mainly used in 2-inch The process of depositing SiO2, SiNx or SiON thin films on the surface of wafers with specifications such as , 4 inches and 6 inches. At present, this kind of equipment has been widely used in related semiconductor fields.

PECVD設備在進行沉積薄膜時,晶圓需要在裝載腔內進行裝載,並由機械手從裝載腔中取出,在傳輸腔中進行中轉,而後傳輸至製程腔中進行製程反應。由於存在同一反應腔進行不同尺寸晶圓的製程需求,一般將晶圓放置在托盤上進行傳輸。為了保證晶圓在反應腔內的位置較為精確,以確保製程的重複性,在傳輸過程中不同尺寸托盤的精確傳輸顯得至關重要。When PECVD equipment is depositing thin films, the wafer needs to be loaded in the loading chamber, taken out from the loading chamber by the robot, transferred in the transfer chamber, and then transferred to the process chamber for process reaction. Due to the process requirements of wafers of different sizes in the same reaction chamber, wafers are generally placed on trays for transport. In order to ensure that the position of the wafer in the reaction chamber is relatively accurate, so as to ensure the repeatability of the process, it is very important to accurately transport the trays of different sizes during the transport process.

然而,一些傳輸裝備無法對裝載腔內不同規格的托盤進行精確定位,導致傳輸精度低;不同托盤的參數需要手動輸入,且在切換不同尺寸的托盤時需要開腔進行各工位校準及動態晶圓定心(Active Wefer Centering,AWC)標定,從而導致耗時耗力且容易出現人為誤差,影響傳輸精度。However, some transmission equipment cannot accurately position the trays of different specifications in the loading chamber, resulting in low transmission accuracy; the parameters of different trays need to be manually input, and when switching trays of different sizes, it is necessary to open the cavity for each station calibration and dynamic wafer Centering (Active Wefer Centering, AWC) calibration, resulting in time-consuming and labor-intensive and prone to human error, affecting transmission accuracy.

本申請實施例的目的是提供一種半導體製程設備、托盤及片盒,能夠解決傳輸精度低、耗時耗力等問題。The purpose of the embodiments of the present application is to provide a semiconductor process equipment, a tray, and a cassette, which can solve the problems of low transmission accuracy, time-consuming and labor-consuming, and the like.

為了解決上述技術問題,本申請是這樣實現的:In order to solve the above-mentioned technical problems, the application is implemented as follows:

本申請實施例提供了一種半導體製程設備,包括製程腔室、傳輸腔室和裝載腔室,該製程腔室用於執行半導體製程,該裝載腔室用於容置片盒,該片盒用於承載托盤,該傳輸腔室中設置有傳輸裝置,用於在該製程腔室和該裝載腔室之間傳輸該托盤;該裝載腔室和該傳輸腔室的交接處設置有圖像識別裝置,該圖像識別裝置用於在該傳輸裝置攜帶該托盤由該裝載腔室向該傳輸腔室移動的過程中,識別該托盤上的預設的特徵圖像,確定該托盤的特徵資訊;該半導體製程設備還包括控制器,該控制器用於獲取該特徵資訊,從預設的托盤資訊庫中查找與該特徵資訊對應的傳輸參數,控制該傳輸裝置根據該傳輸參數傳輸該托盤。An embodiment of the present application provides a semiconductor process equipment, including a process chamber, a transport chamber, and a loading chamber, the process chamber is used to execute semiconductor processes, the loading chamber is used to accommodate a chip box, and the chip box is used for Carrying the tray, the transport chamber is provided with a transport device for transporting the tray between the process chamber and the loading chamber; an image recognition device is provided at the junction of the loading chamber and the transport chamber, The image recognition device is used to identify the preset characteristic image on the tray and determine the characteristic information of the tray during the process of the transfer device carrying the tray from the loading chamber to the transfer chamber; The process equipment also includes a controller, which is used to obtain the characteristic information, search the transmission parameter corresponding to the characteristic information from the preset tray information database, and control the transmission device to transmit the tray according to the transmission parameter.

本申請實施例還提供了一種托盤,應用於上述半導體製程設備中,該托盤的頂面上設置有特徵圖像,該特徵圖像可被圖像識別裝置識別,該特徵圖像包括該托盤的特徵資訊。The embodiment of the present application also provides a tray, which is applied to the above-mentioned semiconductor manufacturing equipment. A characteristic image is set on the top surface of the tray, and the characteristic image can be recognized by an image recognition device. The characteristic image includes the tray's feature information.

本申請實施例還提供了一種片盒,用於承載上述托盤,該片盒包括多個承載位,每個該承載位均包括相對設置的第一支撐塊和第二支撐塊,該第一支撐塊和該第二支撐塊上分別設有至少一個定位銷,用於與該托盤上的至少兩個定位孔配合,限制該托盤在該片盒中的位置,使該托盤輪廓上沿該托盤傳輸方向距該傳輸腔室最遠的點位於一預設位置處。The embodiment of the present application also provides a chip box, which is used to carry the above-mentioned tray. The block and the second support block are respectively provided with at least one positioning pin, which is used to cooperate with at least two positioning holes on the tray to limit the position of the tray in the cassette, so that the tray can be transported along the outline of the tray. A point farthest in direction from the transfer chamber is located at a predetermined position.

本申請實施例中,通過圖像識別裝置可以識別出托盤上預設的特徵圖像,從而確定托盤的特徵資訊,控制器獲取特徵資訊後從預設的托盤資訊庫中查找與該特徵資訊對應的傳輸參數,而後根據該傳輸參數控制傳輸裝置進行運動,以實現對托盤的傳輸。基於上述設置,可以對不同規格的托盤進行自動識別,從而可以有效解決手動輸入托盤的特徵資訊、傳輸參數的方式帶來的耗時耗力、容易出現誤差的問題,從而保證了不同特徵資訊的托盤的傳輸精度;另外,控制器可以從預設的托盤資訊庫中查找對應的傳輸參數,並使傳輸裝置按照該傳輸參數傳輸托盤,從而無需開腔進行傳輸裝置工位校準,有效解決了開腔導致的耗時耗力的問題。因此,本申請實施例能夠在保證傳輸精度的情況下實現自動化、智慧化傳輸,減少人工勞動,提高了傳輸效率。In the embodiment of the present application, the preset characteristic image on the pallet can be recognized by the image recognition device, so as to determine the characteristic information of the pallet. After obtaining the characteristic information, the controller searches the preset pallet information database for the The transmission parameters, and then control the transmission device to move according to the transmission parameters, so as to realize the transmission of the pallet. Based on the above settings, pallets of different specifications can be automatically identified, which can effectively solve the problems of time-consuming, labor-intensive, and prone to errors caused by manual input of pallet feature information and transmission parameters, thus ensuring the accuracy of different feature information. The transmission accuracy of the pallet; in addition, the controller can look up the corresponding transmission parameters from the preset pallet information database, and make the transmission device transmit the pallet according to the transmission parameters, so that there is no need to open the cavity for calibration of the transmission device station, which effectively solves the problem caused by the cavity opening. time-consuming problem. Therefore, the embodiment of the present application can realize automatic and intelligent transmission while ensuring transmission accuracy, reduce manual labor, and improve transmission efficiency.

以下揭露提供用於實施本揭露之不同構件之許多不同實施例或實例。下文描述組件及配置之特定實例以簡化本揭露。當然,此等僅為實例且非意欲限制。舉例而言,在以下描述中之一第一構件形成於一第二構件上方或上可包含其中該第一構件及該第二構件經形成為直接接觸之實施例,且亦可包含其中額外構件可形成在該第一構件與該第二構件之間,使得該第一構件及該第二構件可不直接接觸之實施例。另外,本揭露可在各個實例中重複參考數字及/或字母。此重複出於簡化及清楚之目的且本身不指示所論述之各個實施例及/或組態之間的關係。The following disclosure provides many different embodiments, or examples, of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members An embodiment may be formed between the first member and the second member so that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

此外,為便於描述,諸如「下面」、「下方」、「下」、「上方」、「上」及類似者之空間相對術語可在本文中用於描述一個元件或構件與另一(些)元件或構件之關係,如圖中圖解說明。空間相對術語意欲涵蓋除在圖中描繪之定向以外之使用或操作中之裝置之不同定向。設備可以其他方式定向(旋轉90度或按其他定向)且因此可同樣解釋本文中使用之空間相對描述詞。In addition, for ease of description, spatially relative terms such as "below", "below", "under", "above", "upper" and the like may be used herein to describe the relationship between one element or member and another(s) The relationship between elements or components, as illustrated in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.

儘管陳述本揭露之寬泛範疇之數值範圍及參數係近似值,然儘可能精確地報告特定實例中陳述之數值。然而,任何數值固有地含有必然由於見於各自測試量測中之標準偏差所致之某些誤差。再者,如本文中使用,術語「大約」通常意謂在一給定值或範圍之10%、5%、1%或0.5%內。替代地,術語「大約」意謂在由此項技術之一般技術者考量時處於平均值之一可接受標準誤差內。除在操作/工作實例中以外,或除非以其他方式明確指定,否則諸如針對本文中揭露之材料之數量、時間之持續時間、溫度、操作條件、數量之比率及其類似者之全部數值範圍、數量、值及百分比應被理解為在全部例項中由術語「大約」修飾。相應地,除非相反地指示,否則本揭露及隨附發明申請專利範圍中陳述之數值參數係可根據需要變化之近似值。至少,應至少鑑於所報告有效數位之數目且藉由應用普通捨入技術解釋各數值參數。範圍可在本文中表達為從一個端點至另一端點或在兩個端點之間。本文中揭露之全部範圍包含端點,除非另有指定。Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless expressly specified otherwise, all numerical ranges such as for amounts of materials disclosed herein, durations of time, temperatures, operating conditions, ratios of amounts, and the like, Amounts, values and percentages should be understood as being modified by the term "about" in all instances. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the accompanying claims are approximations that may vary as desired. At a minimum, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or as between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise specified.

參考圖1至圖5,本申請實施例公開了一種半導體製程設備。如圖1所示,所公開的半導體製程設備包括裝載腔室100、傳輸腔室200和製程腔室300。其中,製程腔室300用於執行半導體製程,例如,對晶圓進行刻蝕、在晶圓表面形成膜層等製程。裝載腔室100用於容置片盒400,片盒400用於承載托盤500,托盤500用於承載晶圓。如此,在晶圓進行製程之前,通過托盤500和片盒400放置在裝載腔室100中存儲,當需要對晶圓進行製程時,可以將承載有晶圓的托盤500從裝載腔室100中經過傳輸腔室200傳送至製程腔室300,以在製程腔室300中對晶圓進行製程。Referring to FIG. 1 to FIG. 5 , the embodiment of the present application discloses a semiconductor manufacturing equipment. As shown in FIG. 1 , the disclosed semiconductor processing equipment includes a load chamber 100 , a transfer chamber 200 and a process chamber 300 . Wherein, the process chamber 300 is used for performing semiconductor process, for example, etching the wafer, forming a film layer on the surface of the wafer and other processes. The loading chamber 100 is used to accommodate the cassette 400, the cassette 400 is used to carry the tray 500, and the tray 500 is used to carry the wafer. In this way, before the wafer is processed, the tray 500 and the cassette 400 are placed in the loading chamber 100 for storage, and when the wafer needs to be processed, the tray 500 carrying the wafer can pass through the loading chamber 100 The transfer chamber 200 is transferred to the process chamber 300 to process the wafer in the process chamber 300 .

一些實施例中,裝載腔室100、傳輸腔室200和製程腔室300依次佈置。為了將裝載腔室100中的晶圓傳輸至製程腔室300中,在傳輸腔室200中設置傳輸裝置600,可選地,傳輸裝置600可以包括機械手,通過傳輸裝置600可以在製程腔室300和裝載腔室100之間傳輸托盤500,並通過托盤500攜帶晶圓進行傳輸。In some embodiments, the loading chamber 100 , the transfer chamber 200 and the process chamber 300 are arranged in sequence. In order to transfer the wafers in the loading chamber 100 to the process chamber 300, a transfer device 600 is provided in the transfer chamber 200. Optionally, the transfer device 600 may include a manipulator, and the transfer device 600 can be used in the process chamber. The tray 500 is transferred between the loading chamber 300 and the loading chamber 100, and the wafer is carried by the tray 500 for transfer.

為了對多種不同規格的托盤500進行識別,在裝載腔室100和傳輸腔室200的交接處設置圖像識別裝置700,在傳輸裝置600攜帶托盤500由裝載腔室100向傳輸腔室200移動的過程中,可以通過圖像識別裝置700識別托盤500上的預設的特徵圖像,從而根據特徵圖像確定托盤500的特徵資訊(例如編號、序號、標識等)。In order to identify pallets 500 of various specifications, an image recognition device 700 is provided at the junction of the loading chamber 100 and the transfer chamber 200, and the transfer device 600 carries the pallet 500 and moves from the loading chamber 100 to the transfer chamber 200. During the process, the preset characteristic image on the tray 500 can be recognized by the image recognition device 700 , so as to determine the characteristic information (such as number, serial number, logo, etc.) of the tray 500 according to the characteristic image.

基於此,通過在裝載腔室100和傳輸腔室200的交接處設置圖像識別裝置700,使得裝載腔室100和傳輸腔室200的交接處附近區域形成圖像識別區,如此,在傳輸裝置600攜帶托盤500經過圖像識別區時,由於不同規格的托盤500上設有不同的特徵圖像,從而可以通過圖像識別裝置700對當前傳輸的托盤500上的特徵圖像進行識別,並根據所識別的托盤500的特徵圖像獲取托盤500的特徵資訊,從而為調整傳輸裝置600的傳輸方式做準備。Based on this, by setting the image recognition device 700 at the junction of the loading chamber 100 and the transfer chamber 200, the area near the junction of the loading chamber 100 and the transfer chamber 200 forms an image recognition area, so that in the transfer device When 600 carries the tray 500 through the image recognition area, since there are different characteristic images on the tray 500 of different specifications, the characteristic image on the currently transported tray 500 can be recognized by the image recognition device 700, and according to The identified characteristic image of the pallet 500 acquires the characteristic information of the pallet 500 , so as to prepare for adjusting the transmission mode of the transmission device 600 .

半導體製程設備還包括控制器,控制器可以與上述圖像識別裝置700以及傳輸裝置600分別連接,以實現信號傳輸,具體為,圖像識別裝置700可以將托盤500的特徵資訊發送至控制器,由控制器進行分析處理,而後根據分析處理結果控制傳輸裝置600執行相應的傳輸動作。The semiconductor process equipment also includes a controller, which can be connected to the image recognition device 700 and the transmission device 600 respectively to realize signal transmission. Specifically, the image recognition device 700 can send the feature information of the tray 500 to the controller, The controller performs analysis and processing, and then controls the transmission device 600 to perform corresponding transmission actions according to the analysis and processing results.

其中,控制器可以獲取當前傳輸的托盤500的特徵資訊,與此同時,控制器內還可以存儲有托盤資訊庫,托盤資訊庫包括多種不同規格的托盤500的特徵資訊,以及與多種不同規格的托盤500分別對應的傳輸參數。如此,在控制器獲取當前傳輸的托盤500的特徵資訊後,根據該特徵資訊從托盤資訊庫中查找與之相對應的傳輸參數。當查找到對應的傳輸參數後,控制傳輸裝置600根據該傳輸參數對托盤500進行傳輸。Wherein, the controller can acquire the feature information of the currently transmitted tray 500. At the same time, the tray information database can also be stored in the controller. Trays 500 respectively correspond to transmission parameters. In this way, after the controller obtains the feature information of the currently transported tray 500, it searches the tray information database for the corresponding transport parameters according to the feature information. After finding the corresponding transmission parameters, the control transmission device 600 transmits the tray 500 according to the transmission parameters.

本申請實施例提供的半導體製程設備傳輸托盤500的具體過程如下:The specific process of the semiconductor process equipment transport tray 500 provided in the embodiment of the present application is as follows:

將承載多個托盤500的片盒400放置於裝載腔室100中,每個托盤500中可以承載晶圓;控制器控制傳輸裝置600由傳輸腔室200移動至裝載腔室100,拾取托盤500,並控制傳輸裝置600攜帶托盤500由裝載腔室100朝向傳輸腔室200移動;在移動過程中,當托盤500移動至圖像識別裝置700的圖像識別區時,圖像識別裝置700可以對托盤500上預設的特徵圖像進行識別,並根據特徵圖像確定托盤500的特徵資訊,與此同時,將所確定的特徵資訊傳輸至控制器;控制器根據該特徵資訊從預設的托盤資訊庫中查找與之相對應的傳輸參數,而後控制傳輸裝置600按照該傳輸參數傳輸托盤500。Place the cassette 400 carrying a plurality of trays 500 in the loading chamber 100, each tray 500 can carry wafers; the controller controls the transfer device 600 to move from the transfer chamber 200 to the loading chamber 100, pick up the tray 500, And control the transfer device 600 to carry the tray 500 to move from the loading chamber 100 towards the transfer chamber 200; 500 on the preset characteristic image, and determine the characteristic information of the tray 500 according to the characteristic image, and at the same time, transmit the determined characteristic information to the controller; Search the corresponding transmission parameters in the library, and then control the transmission device 600 to transmit the pallet 500 according to the transmission parameters.

基於上述設置,通過圖像識別裝置700可以對不同規格的托盤500進行自動識別,從而可以有效解決手動輸入托盤的特徵資訊、傳輸參數的方式帶來的耗時耗力、容易出現誤差的問題,保證了不同規格的托盤500的傳輸精度和傳輸效率;另外,控制器可以從預設的托盤資訊庫中查找對應的傳輸參數,並使傳輸裝置600按照對應的傳輸參數傳輸托盤500,從而無需開腔進行傳輸裝置600工位校準,有效解決了開腔導致的耗時耗力的問題。因此,本申請實施例能夠在保證傳輸精度的情況下實現自動化、智慧化傳輸,減少人工勞動,提高了傳輸效率。Based on the above settings, the image recognition device 700 can automatically recognize pallets 500 of different specifications, thereby effectively solving the problems of time-consuming, labor-intensive, and error-prone problems caused by manual input of pallet feature information and transmission parameters. The transmission accuracy and transmission efficiency of pallets 500 of different specifications are guaranteed; in addition, the controller can search the corresponding transmission parameters from the preset pallet information database, and make the transmission device 600 transmit the pallets 500 according to the corresponding transmission parameters, so that there is no need to open the cavity Calibrating the transmission device 600 positions effectively solves the time-consuming and labor-intensive problem caused by opening the cavity. Therefore, the embodiment of the present application can realize automatic and intelligent transmission while ensuring transmission accuracy, reduce manual labor, and improve transmission efficiency.

為了能夠從托盤資訊庫中查找到當前傳輸的托盤500的特徵資訊,以及與該特徵資訊對應的傳輸參數,本申請實施例中,通過控制器將獲取的特徵資訊與托盤資訊庫中預存的特徵資訊進行比對,從而可以判斷托盤資訊庫中是否存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊以及與之對應的傳輸參數。In order to be able to find the characteristic information of the currently transmitted pallet 500 from the pallet information database, and the transmission parameters corresponding to the characteristic information, in the embodiment of the present application, the acquired characteristic information is combined with the pre-stored characteristics in the pallet information database through the controller. The information is compared, so that it can be determined whether there is the same characteristic information as the characteristic information of the currently transmitted tray 500 and the corresponding transmission parameters in the pallet information database.

第一種情況,托盤資訊庫中存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊,此種情況下,在傳輸時,可以從托盤資訊庫中查找到對應的傳輸參數,從而使傳輸裝置600可以根據該傳輸參數傳輸托盤500。In the first case, the pallet information database stores the same feature information as the currently transmitted pallet 500. In this case, during transmission, the corresponding transmission parameters can be found from the pallet information database, so that the transmission The device 600 may transport the tray 500 according to the transport parameters.

第二種情況,托盤資訊庫中不存在當前傳輸的托盤500的特徵資訊,此種情況下,若要實現托盤500的傳輸,需要首先在托盤資訊庫中建立該托盤500的資訊檔案,其中包括托盤的特徵資訊以及對應的傳輸參數,以便於為後續查找奠定基礎。In the second case, there is no characteristic information of the currently transmitted pallet 500 in the pallet information database. In this case, to realize the transmission of the pallet 500, it is necessary to first create an information file of the pallet 500 in the pallet information database, which includes The characteristic information of the pallet and the corresponding transmission parameters, so as to lay the foundation for the subsequent search.

考慮到相鄰兩次傳輸的托盤500的特徵資訊可以相同也可以不同。當相同時,相鄰兩次傳輸的托盤500對應的傳輸參數相同,從而在傳輸當前的托盤500時,可以延用上一次傳輸的托盤500的傳輸參數,從而無需切換傳輸參數即可實現當前托盤500的傳輸;當不同時,相鄰兩次傳輸的托盤500所對應的傳輸參數不同,從而在傳輸當前的托盤500時,需要首先切換至與當前傳輸的托盤500相對應的傳輸參數。It is considered that the characteristic information of the pallets 500 transmitted twice adjacently may be the same or different. When they are the same, the transmission parameters corresponding to the pallets 500 transmitted twice adjacently are the same, so that when the current pallet 500 is transmitted, the transmission parameters of the pallet 500 transmitted last time can be used, so that the current pallet can be realized without switching the transmission parameters. 500 transmission; when different, the transmission parameters corresponding to the pallets 500 that are transmitted twice adjacently are different, so when the current pallet 500 is transmitted, it is necessary to switch to the transmission parameters corresponding to the current pallet 500 first.

基於上述情況,在上述第一種情況下,還需要進一步判斷當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊是否一致。當兩次傳輸的托盤500的特徵資訊一致時,表明兩次傳輸的托盤500屬於同一規格的托盤500,此時無需切換傳輸參數,從而可以直接延用上一次的傳輸參數,也即,當前控制器中存儲的傳輸參數,基於此,可以大幅度提高傳輸效率,並且還能夠保證傳輸參數的準確性,進而保證了傳輸精度。相反,當兩次傳輸的托盤500的特徵資訊不一致時,表明當前傳輸的托盤500與上一次傳輸的托盤500的規格不同,需要將傳輸參數切換至與當前傳輸的托盤500相對應的傳輸參數。如此,可以從控制器中預存的托盤資訊庫中查找與當前傳輸的托盤500的特徵資訊相對應的傳輸參數,待查找到對應的傳輸參數後,可以控制傳輸裝置600根據該傳輸參數傳輸托盤500。基於此,可以實現傳輸參數的自動查找和切換,以保證傳輸參數的準確性,進而保證傳輸精度。Based on the above situation, in the above first case, it is necessary to further determine whether the feature information of the currently transmitted tray 500 is consistent with the feature information of the last transmitted tray 500 . When the characteristic information of the pallets 500 transmitted twice is consistent, it indicates that the pallets 500 transmitted twice belong to the pallet 500 of the same specification. At this time, there is no need to switch the transmission parameters, so that the transmission parameters of the last time can be directly used, that is, the current control Based on the transmission parameters stored in the device, the transmission efficiency can be greatly improved, and the accuracy of the transmission parameters can be guaranteed, thereby ensuring the transmission accuracy. On the contrary, when the characteristic information of the pallet 500 transmitted twice is inconsistent, it indicates that the specification of the pallet 500 transmitted currently is different from that of the pallet 500 transmitted last time, and the transmission parameter needs to be switched to the transmission parameter corresponding to the pallet 500 currently transmitted. In this way, the transmission parameters corresponding to the characteristic information of the currently transmitted pallet 500 can be searched from the pallet information database pre-stored in the controller. After the corresponding transmission parameters are found, the transmission device 600 can be controlled to transmit the pallet 500 according to the transmission parameters. . Based on this, automatic searching and switching of transmission parameters can be realized to ensure the accuracy of transmission parameters and further ensure transmission accuracy.

在上述第二種情況下,可以在托盤資訊庫中建立托盤500的資訊檔案。如圖5所示,具體過程如下:In the above second case, an information file of the pallet 500 can be created in the pallet database. As shown in Figure 5, the specific process is as follows:

首先進行傳輸條件的檢查,當滿足傳輸測試條件時,將托盤500放置於片盒400上,並進行精確定位,在托盤500放置無問題的情況下,記錄當前托盤500的特徵資訊,如尺寸等;記錄完成後,按照傳輸裝置600工位校準方法對製程腔室300各工位進行校準;記錄校準完成後的工位值。校準完成後,傳輸裝置600攜帶托盤500經過製程腔室300,AWC感測器記錄傳輸裝置600攜帶托盤500經過製程腔室300時的示教中心(即,校準後的托盤500的圓心),完成AWC標定,從而形成當前傳輸的托盤500的資訊檔案。調試過程覆蓋所需要使用的多種不同規格的托盤500,從而對多個不同規格的托盤500建立傳輸用的托盤資訊庫。First, check the transmission conditions. When the transmission test conditions are met, place the tray 500 on the cassette 400 and perform precise positioning. If there is no problem with the placement of the tray 500, record the characteristic information of the current tray 500, such as size, etc. ; After the recording is completed, calibrate each station of the process chamber 300 according to the station calibration method of the transmission device 600 ; record the station value after the calibration is completed. After the calibration is completed, the transport device 600 carries the tray 500 through the process chamber 300, and the AWC sensor records the teaching center (that is, the center of the circle of the tray 500 after calibration) when the transport device 600 carries the tray 500 through the process chamber 300. The AWC is calibrated to form an information file of the currently transported pallet 500 . The commissioning process covers multiple pallets 500 of different specifications that need to be used, so that a pallet information database for transmission is established for multiple pallets 500 of different specifications.

可以理解的是,當前傳輸的托盤500的特徵資訊不存在於托盤資訊庫中時,可以提示該托盤500無法進行傳輸,需要開腔調試建立該托盤500的特徵資訊以及傳輸參數。一些實施例中,可以按照上述傳輸裝置600調試的流程進行工位校準和AWC標定,待標定完成後,即可存儲相對應的傳輸參數至托盤資訊庫中,其中包括工位參數和AWC感測器參數,從而,在托盤資訊庫中形成當前傳輸的托盤500的資訊檔案,以便於後續傳輸該種規格的托盤500時調用。It can be understood that when the feature information of the currently transmitted pallet 500 does not exist in the pallet information database, it may be prompted that the pallet 500 cannot be transmitted, and the feature information and transmission parameters of the pallet 500 need to be opened for debugging. In some embodiments, station calibration and AWC calibration can be performed according to the above-mentioned debugging process of the transmission device 600. After the calibration is completed, the corresponding transmission parameters can be stored in the pallet information database, including station parameters and AWC sensing Therefore, an information file of the currently transmitted pallet 500 is formed in the pallet information database, so as to be called when the pallet 500 of this specification is subsequently transmitted.

基於上述設置,將托盤500的特徵資訊存儲至托盤資訊庫中,也即,在托盤資訊庫中建立托盤500的資訊檔案,如此,在後續需要傳輸該種規格的托盤500時,可以直接從托盤資訊庫中調用,從而無需開腔進行各工位校準和AWC標定,進而提高了托盤500的傳輸效率。Based on the above settings, the feature information of the pallet 500 is stored in the pallet information database, that is, the information file of the pallet 500 is established in the pallet information database, so that when the pallet 500 of this specification needs to be transmitted in the future, it can be directly obtained from the pallet. It can be called from the information base, so that there is no need to open the cavity to perform calibration of each station and AWC calibration, thereby improving the transmission efficiency of the pallet 500.

可選地,傳輸參數可以包括托盤500的尺寸和該尺寸的托盤500對應的工位參數,基於此,在傳輸某種尺寸的托盤500時,可以從托盤資訊庫中調用與該尺寸的托盤500相對應的工位參數,從而可以按照該工位參數將托盤500傳輸至對應的工位。Optionally, the transmission parameters may include the size of the pallet 500 and the station parameters corresponding to the pallet 500 of this size. Based on this, when a pallet 500 of a certain size is transmitted, the pallet 500 of the size can be called from the pallet information library. Corresponding station parameters, so that the tray 500 can be transferred to the corresponding station according to the station parameters.

其中,工位參數可以包括工位伸縮值、工位旋轉值、工位高位值和工位低位元值,根據這些參數值可以確定托盤500的具體傳輸位置,從而可以保證托盤500的傳輸精度。Wherein, the station parameters may include station stretching value, station rotation value, station high station value and station low station value, according to these parameter values, the specific transmission position of the pallet 500 can be determined, thereby ensuring the transmission accuracy of the pallet 500 .

此處需要說明的是,上述工位伸縮值、工位旋轉值、工位高位值和工位低位值均可以理解為與托盤500的傳輸工位相關的參數,基於這些參數值可以確定托盤500的傳輸方式。It should be noted here that the above-mentioned station expansion and contraction value, station rotation value, station high position value and station low position value can all be understood as parameters related to the transmission station of the pallet 500, based on these parameter values, the pallet 500 can be determined the transmission method.

可選地,傳輸腔室200與製程腔室300的交接處設有兩個晶圓自動對心的AWC(Active Wafer Centering,晶圓自動定心)感測器,即,第一AWC感測器810和第二AWC感測器820,兩個AWC感測器的連線與托盤500的傳輸路徑垂直,且兩個AWC感測器各自距離垂足的距離不等。容易理解,將托盤500的傳輸路徑視為一條直線,該直線位於兩個AWC感測器之間,且與兩個AWC感測器的連線相互垂直,兩個AWC感測器的連線包括第一線段和第二線段,其中,第一線段為其中一個AWC感測器與該直線相交的垂線,第二線段為另一個AWC感測器與該直線相交的垂線,兩個垂線與該直線的交點即為垂足。並且,第一線段與第二線段的長度不等,即,兩個AWC感測器各自距離垂足的距離不等。Optionally, two automatic wafer centering AWC (Active Wafer Centering, wafer automatic centering) sensors are provided at the junction of the transfer chamber 200 and the process chamber 300, that is, the first AWC sensor 810 and the second AWC sensor 820 , the connection line of the two AWC sensors is perpendicular to the transmission path of the tray 500 , and the distances between the two AWC sensors and the vertical feet are different. It is easy to understand that the transmission path of the tray 500 is regarded as a straight line, which is located between two AWC sensors and is perpendicular to the connection line of the two AWC sensors. The connection line of the two AWC sensors includes The first line segment and the second line segment, wherein, the first line segment is a vertical line where one AWC sensor intersects the line, the second line segment is a vertical line where the other AWC sensor intersects the line, and the two perpendicular lines are The point of intersection of these lines is the vertical foot. Moreover, the lengths of the first line segment and the second line segment are different, that is, the distances between the two AWC sensors and the vertical feet are different.

可選地,傳輸參數還包括:該尺寸的托盤500對應的AWC感測器參數,其中,AWC感測器參數包括:第一AWC感測器810前端觸發延遲時間、第一AWC感測器810後端觸發延時時間、第二AWC感測器820前端觸發延遲時間和第二AWC感測器820後端觸發延遲時間。Optionally, the transmission parameters also include: AWC sensor parameters corresponding to the pallet 500 of this size, wherein the AWC sensor parameters include: the front-end trigger delay time of the first AWC sensor 810, the first AWC sensor 810 The back-end trigger delay time, the front-end trigger delay time of the second AWC sensor 820 and the second AWC sensor 820 back-end trigger delay time.

基於上述設置,在傳輸裝置600傳輸托盤500的過程中,會經過每個AWC感測器兩次,總共四次,通過四次經過AWC感測器時傳輸裝置600的位置可以計算出當前傳輸托盤500的圓心,從而實現傳輸裝置600的AWC標定。基於此,可以按照上述傳輸裝置600的AWC標定方法對製程腔室300中的傳輸工位進行示教,確定傳輸裝置600的示教中心。實際運動過程中,在傳輸裝置600攜帶托盤500經過AWC感測器時的實際中心與示教中心存在偏差的情況下,當傳輸裝置600運動到製程腔室300時,傳輸裝置600可以根據偏差進行補償,以確保托盤500在製程腔室300中位置的一致性。Based on the above settings, in the process of the transport device 600 transporting the tray 500, it will pass each AWC sensor twice, a total of four times, and the position of the transport device 600 when passing the AWC sensor four times can calculate the current transport tray 500, so as to realize the AWC calibration of the transmission device 600. Based on this, the transfer station in the process chamber 300 can be taught according to the above-mentioned AWC calibration method of the transfer device 600 , and the teaching center of the transfer device 600 can be determined. During the actual movement, when the actual center of the transfer device 600 carrying the tray 500 passes the AWC sensor, there is a deviation from the teaching center. compensation to ensure the consistency of the position of the tray 500 in the process chamber 300 .

本申請實施例中,托盤500的傳輸參數可以包括托盤編號、托盤尺寸、對應的工位參數和對應的AWC感測器參數,具體詳見下表。 托盤編號 N 托盤編號,用於識別托盤序號 托盤尺寸 R 通過編號,確認托盤尺寸 PM1工位 R PM1工位伸縮值 T PM1工位旋轉值 BTO PM1工位高位值 Lower PM1工位低位值 PM1 AWC 左感測器 DEL-EX LD 伸展時前端觸發感測器的延遲時間 DEL-EX TRL 伸展時後端觸發感測器的延遲時間 PM1 AWC 右感測器 DEL-EX LD 伸展時前端觸發感測器的延遲時間 DEL-EX TRL 伸展時後端觸發感測器的延遲時間 In the embodiment of the present application, the transmission parameters of the pallet 500 may include pallet number, pallet size, corresponding station parameters and corresponding AWC sensor parameters, see the following table for details. pallet number N Pallet number, used to identify the serial number of the pallet pallet size R Confirm pallet size by serial number PM1 station R PM1 station stretch value T PM1 station rotation value BTO PM1 station high value Lower Low value of PM1 station PM1 AWC Left Sensor DEL-EX LD Delay time for front-end trigger sensor when extending DEL-EX TRL Delay time for backend to trigger sensor when stretching PM1 AWC Right Sensor DEL-EX LD Delay time for front-end trigger sensor when extending DEL-EX TRL Delay time for backend to trigger sensor when stretching

可選地,圖像識別裝置700可以是條碼識別感測器,相應地,特徵圖像可以是條碼510。如此,在傳輸裝置600攜帶托盤500由裝載腔室100向傳輸腔室200移動時,條碼識別感測器可以對托盤500上的條碼510進行識別,從而確定托盤500的特徵資訊。當然,圖像識別裝置700還可以採用其他構件,對應的特徵圖像也可以採用其他形式,本申請實施例中對於圖像識別裝置700以及特徵圖像的具體形式不作具體限定。Optionally, the image recognition device 700 may be a barcode recognition sensor, and correspondingly, the characteristic image may be the barcode 510 . In this way, when the transfer device 600 carries the tray 500 and moves from the loading chamber 100 to the transfer chamber 200 , the barcode recognition sensor can recognize the barcode 510 on the tray 500 to determine the characteristic information of the tray 500 . Of course, the image recognition device 700 can also use other components, and the corresponding feature images can also take other forms, and the specific forms of the image recognition device 700 and feature images are not specifically limited in this embodiment of the application.

為了能夠調用不同規格的托盤500的特徵資訊以及對應的傳輸參數,並將傳輸參數應用至傳輸裝置600,使傳輸裝置600能夠精准、快捷地傳輸托盤500,本申請實施例中,在托盤資訊庫中存儲多種不同規格的托盤500的特徵資訊以及對應的傳輸參數。In order to be able to call the feature information and corresponding transmission parameters of pallets 500 of different specifications, and apply the transmission parameters to the transmission device 600, so that the transmission device 600 can accurately and quickly transmit the pallet 500, in the embodiment of the present application, in the pallet information database The feature information and corresponding transmission parameters of pallets 500 of various specifications are stored in the storage.

例如,某種規格的托盤500,其具有對應的托盤500尺寸和對應的傳輸參數。當需要傳輸該種型號的托盤500時,可以從托盤資訊庫中直接調用托盤500的特徵資訊以及與該特徵資訊對應的傳輸參數,其中包括托盤500的尺寸、與該尺寸對應的工位參數,以及與該尺寸對應的AWC感測器參數,從而控制傳輸裝置600根據上述各種傳輸參數傳輸托盤500,無需重新輸入傳輸參數,提高了傳輸效率,保證了傳輸精度。For example, a pallet 500 of a certain specification has a corresponding size of the pallet 500 and a corresponding transmission parameter. When it is necessary to transmit the pallet 500 of this type, the characteristic information of the pallet 500 and the transmission parameters corresponding to the characteristic information can be directly called from the pallet information database, including the size of the pallet 500 and the station parameters corresponding to the size, And the AWC sensor parameters corresponding to the size, so as to control the transfer device 600 to transfer the tray 500 according to the above-mentioned various transfer parameters, without re-inputting the transfer parameters, improving the transfer efficiency and ensuring the transfer accuracy.

本申請實施例還公開了一種托盤500,該托盤500應用於上述半導體製程設備中,其中,托盤500的頂面上設置特徵圖像,該特徵圖像可以被圖像識別裝置700識別,且特徵圖像包括托盤500的特徵資訊。The embodiment of the present application also discloses a tray 500, which is applied to the above-mentioned semiconductor manufacturing equipment, wherein a characteristic image is set on the top surface of the tray 500, the characteristic image can be recognized by the image recognition device 700, and the characteristic The image includes characteristic information of the tray 500 .

可選地,特徵圖像可以是條碼510,相應地,圖像識別裝置700可以採用條碼識別感測器。不同規格的托盤500具有不同形式的條碼510,具體如圖3所示。Optionally, the feature image may be a barcode 510, and accordingly, the image recognition device 700 may use a barcode recognition sensor. Pallets 500 of different specifications have barcodes 510 in different forms, as shown in FIG. 3 .

為了實現對托盤500的定位,一些實施例中,在托盤500上設置至少兩個定位孔,至少兩個定位孔用於一一對應地與設置於片盒400上的至少兩個定位銷410配合,限制托盤500在片盒400中的位置,使托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點位於一預設位置處。In order to realize the positioning of the tray 500, in some embodiments, at least two positioning holes are provided on the tray 500, and the at least two positioning holes are used to cooperate with at least two positioning pins 410 provided on the cassette 400 one by one. , restricting the position of the tray 500 in the cassette 400 so that the point on the outline of the tray 500 along the transport direction of the tray 500 that is farthest from the transport chamber 200 is located at a preset position.

在放置托盤500時,將托盤500上的定位孔與片盒400上的定位銷410對應配合,如此,通過片盒400可以對托盤500起到承載作用,通過定位銷410與定位孔的配合可以實現對托盤500的精確定位,從而保證托盤500在片盒400上的位置精度,進而保證托盤500在裝載腔室100中的初始位置的精度。When placing the tray 500, the positioning hole on the tray 500 is matched with the positioning pin 410 on the film box 400, so that the tray 500 can be loaded by the film box 400, and the cooperation of the positioning pin 410 and the positioning hole can Accurate positioning of the tray 500 is achieved, thereby ensuring the accuracy of the position of the tray 500 on the cassette 400 , thereby ensuring the accuracy of the initial position of the tray 500 in the loading chamber 100 .

可選地,托盤500上設置兩個定位孔,相應地,片盒400上設置兩個定位銷410,且托盤500上的兩個定位孔對稱設置在傳輸方向的兩側,也即,兩個定位孔的連線與傳輸方向垂直,如此,可以覆蓋製程要求的多種不同尺寸的托盤500。不同尺寸的托盤500上的兩個定位孔的位置不同,兩個定位孔的位置的設置方式需要滿足使不同尺寸的托盤500有規律的放置,以便於傳輸裝置600拾取,例如基於定位孔不同尺寸的托盤500放置在片盒400上後,不同尺寸的托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點均位於一預設位置處,即不同尺寸的托盤500輪廓在這個預設位置處相切,這個預設位置可以根據片盒400的結構和尺寸靈活的設置。Optionally, two positioning holes are set on the tray 500, correspondingly, two positioning pins 410 are set on the cassette 400, and the two positioning holes on the tray 500 are symmetrically set on both sides of the transport direction, that is, two The connection line of the positioning holes is perpendicular to the conveying direction, so that the trays 500 of various sizes required by the manufacturing process can be covered. The positions of the two positioning holes on the trays 500 of different sizes are different, and the setting method of the positions of the two positioning holes needs to satisfy the regular placement of the trays 500 of different sizes so that the transfer device 600 can pick them up, for example, based on the different sizes of the positioning holes After the trays 500 of different sizes are placed on the cassette 400, the points on the contours of the trays 500 of different sizes along the conveying direction of the trays 500 that are farthest from the transfer chamber 200 are located at a preset position, that is, the contours of the trays 500 of different sizes are located at a preset position. The preset position is tangent, and the preset position can be flexibly set according to the structure and size of the cassette 400 .

可選地,托盤500的厚度可以為4mm-6mm,且定位銷410的高度設計為1.5mm,直徑設計為4mm。相應地,托盤500上設置的定位孔的深度可以為2mm,直徑為6mm,以保證定位銷410能夠穿入定位孔中。基於上述設置,通過至少兩個定位孔一一對應地與至少兩個定位銷410的配合,可以確保托盤500放置在片盒400上位置的唯一性,以保證不同尺寸的托盤500在裝載腔室100中的位置精度。Optionally, the thickness of the tray 500 may be 4mm-6mm, and the height of the positioning pin 410 is designed to be 1.5mm, and the diameter is designed to be 4mm. Correspondingly, the positioning hole provided on the tray 500 may have a depth of 2mm and a diameter of 6mm, so as to ensure that the positioning pin 410 can penetrate into the positioning hole. Based on the above-mentioned settings, through the one-to-one matching of at least two positioning holes with at least two positioning pins 410, the uniqueness of the position where the tray 500 is placed on the cassette 400 can be ensured, so that trays 500 of different sizes can be placed in the loading chamber. Positional accuracy in 100's.

參考圖2,本申請實施例還公開了一種片盒400,該片盒400用於承載托盤500。其中,片盒400包括多個承載位,每個承載位均包括相對設置的第一支撐塊420和第二支撐塊430,第一支撐塊420和第二支撐塊430上分別設有至少一個定位銷410,用於一一對應地與托盤500上的至少兩個定位孔配合,限制托盤500在片盒400中的位置,使托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點位於一預設位置處。Referring to FIG. 2 , the embodiment of the present application also discloses a chip box 400 for carrying a tray 500 . Wherein, the chip box 400 includes a plurality of bearing positions, and each bearing position includes a first supporting block 420 and a second supporting block 430 which are arranged oppositely, and at least one positioning bracket is respectively arranged on the first supporting block 420 and the second supporting block 430. The pins 410 are used to cooperate with at least two positioning holes on the tray 500 one by one, to limit the position of the tray 500 in the cassette 400, so that the outline of the tray 500 is farthest from the transfer chamber 200 along the transfer direction of the tray 500 The point is located at a preset position.

可選地,片盒400可以包括頂板、底板、第一側板和第二側板,其中,頂板和底板平行設置,且兩者之間形成一定間距,第一側板和第二側板均連接在頂板和底板之間,且第一側板和第二側板間隔設置。為了承載多個托盤500,在第一側板的朝向第二側板的側面設有多個第一支撐塊420,多個第一支撐塊420沿垂直於頂板的方向間隔設置,如此,相鄰兩個第一支撐塊420之間形成用於容納托盤500局部的第一卡槽,同樣地,相鄰兩個第二支撐塊430之間形成用於容納托盤500局部的第二卡槽,且多個第一卡槽與多個第二卡槽一一對應設置,從而,對應設置的第一卡槽和第二卡槽形成用於承載托盤500的承載位。Optionally, the chip box 400 may include a top board, a bottom board, a first side board and a second side board, wherein the top board and the bottom board are arranged in parallel with a certain distance between them, and the first side board and the second side board are connected between the top board and the second side board. Between the base plates, the first side plate and the second side plate are spaced apart. In order to carry multiple trays 500, a plurality of first support blocks 420 are provided on the side of the first side plate facing the second side plate, and the plurality of first support blocks 420 are arranged at intervals along the direction perpendicular to the top plate, so that two adjacent A first slot for accommodating a part of the tray 500 is formed between the first support blocks 420. Similarly, a second slot for accommodating a part of the tray 500 is formed between two adjacent second support blocks 430, and a plurality of The first card slot is provided in one-to-one correspondence with the plurality of second card slots, so that the correspondingly provided first card slot and the second card slot form a bearing position for carrying the tray 500 .

此外,同一片盒400可以相容多種不同尺寸的托盤500,在設計片盒400時,將片盒400的尺寸按照最大托盤500的尺寸設計。基於此,在將托盤500放置於片盒400後,將托盤500的邊緣與片盒400一側的邊緣相抵,從而可以通過片盒400對不同尺寸的托盤500進行精確定位,以保證托盤500在裝載腔室100中的位置精度。In addition, the same cassette 400 can be compatible with multiple pallets 500 of different sizes. When designing the cassette 400 , the size of the cassette 400 is designed according to the size of the largest pallet 500 . Based on this, after the tray 500 is placed in the film box 400, the edge of the tray 500 is pressed against the edge of one side of the film box 400, so that the trays 500 of different sizes can be accurately positioned by the film box 400 to ensure that the tray 500 Positional accuracy in the load chamber 100 .

為了實現對托盤500的定位,可以在片盒400和托盤500上分別設置定位結構。一些實施例中,在對應設置的第一支撐塊420上設置至少一個定位銷410,在第二支撐塊430上設置至少一個定位銷410,且在托盤500上設置至少兩個定位孔。如此,在托盤500承載於片盒400時,定位孔與定位銷410一一對應配合,此時,可以對托盤500輪廓上沿傳輸方向距離傳輸腔室200最遠的點的位置確定,從而可以對片盒400中的托盤500進行精確定位。In order to realize the positioning of the tray 500 , positioning structures may be provided on the cassette 400 and the tray 500 respectively. In some embodiments, at least one positioning pin 410 is provided on the corresponding first support block 420 , at least one positioning pin 410 is provided on the second support block 430 , and at least two positioning holes are provided on the tray 500 . In this way, when the tray 500 is loaded on the cassette 400, the positioning holes and the positioning pins 410 are in one-to-one correspondence. At this time, the position of the point on the outline of the tray 500 along the transport direction farthest from the transport chamber 200 can be determined, so that Precise positioning of the tray 500 in the cassette 400 is performed.

本申請實施例提供的半導體製程設備中,托盤的傳輸方式如圖4所示,具體包括:In the semiconductor process equipment provided in the embodiment of the present application, the transmission mode of the tray is shown in Figure 4, which specifically includes:

通過相互配合的定位銷410和定位孔對承載於片盒400上的托盤500進行定位;傳輸裝置600攜帶托盤500從裝載腔室100向傳輸腔室200移動;在移動過程中,圖像識別裝置700識別托盤500上的圖像特徵,並根據圖像特徵確定托盤500的特徵資訊;控制器獲取托盤500的特徵資訊後將該特徵資訊與托盤資訊庫中存有的特徵資訊進行比對,判斷托盤資訊庫中是否存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊;在托盤資訊庫中存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊的情況下,判斷當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊是否一致;當當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊一致時,直接採用當前的傳輸參數傳輸托盤500;當當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊不一致時,再從托盤資訊庫中查找與當前傳輸的托盤500的特徵資訊相對應的傳輸參數,並控制傳輸裝置600根據該傳輸參數傳輸托盤500;在托盤資訊庫中不存在當前傳輸的托盤500的特徵資訊的情況下,在托盤資訊庫中建立當前托盤500的資訊檔案,以便於調用該規格的托盤500的特徵資訊和傳輸參數。The tray 500 carried on the film box 400 is positioned by the positioning pin 410 and the positioning hole that cooperate with each other; the transfer device 600 carries the tray 500 to move from the loading chamber 100 to the transfer chamber 200; during the movement, the image recognition device 700 identifies the image features on the tray 500, and determines the feature information of the tray 500 according to the image features; the controller obtains the feature information of the tray 500, compares the feature information with the feature information stored in the tray information database, and judges Whether there is the same characteristic information as the characteristic information of the currently transmitted pallet 500 in the pallet information database; if there is the same characteristic information as the currently transmitted pallet 500 in the pallet information database, determine the currently transmitted pallet Whether the characteristic information of the pallet 500 is consistent with the characteristic information of the pallet 500 transmitted last time; when the characteristic information of the pallet 500 transmitted currently is consistent with the characteristic information of the pallet 500 transmitted last time, the current transmission parameter is directly used to transmit the pallet 500; when When the characteristic information of the currently transmitted tray 500 is inconsistent with the characteristic information of the last transmitted tray 500, the transmission parameter corresponding to the characteristic information of the currently transmitted tray 500 is searched from the tray information database, and the transmission device 600 is controlled according to the characteristic information. Transmission parameter transmission tray 500; In the case that there is no characteristic information of the currently transmitted tray 500 in the tray information database, an information file of the current tray 500 is established in the tray information database, so as to call the characteristic information of the tray 500 of this specification and Transfer parameters.

綜上所述,本申請實施例中,實現了不同規格的托盤500的精確定位,並實現了托盤500的自動識別,在切換不同規格的托盤500時,自動調用傳輸裝置600的特徵資訊和對應的傳輸參數,並根據對應的傳輸參數傳輸托盤500,以確保不同規格的托盤500的精確、高效傳輸。In summary, in the embodiment of the present application, the precise positioning of trays 500 of different specifications is realized, and the automatic identification of trays 500 is realized. When switching trays 500 of different specifications, the characteristic information and corresponding information of the transmission device 600 are automatically called transfer parameters, and transfer the pallet 500 according to the corresponding transfer parameter, so as to ensure the accurate and efficient transfer of the pallet 500 of different specifications.

前述內容概括數項實施例之特徵,使得熟習此項技術者可更佳地理解本揭露之態樣。熟習此項技術者應瞭解,其等可容易地使用本揭露作為用於設計或修改用於實行本文仲介紹之實施例之相同目的及/或達成相同優點之其他製程及結構之一基礎。熟習此項技術者亦應瞭解,此等等效構造不背離本揭露之精神及範疇,且其等可在不背離本揭露之精神及範疇之情況下在本文中作出各種改變、置換及更改。The foregoing content summarizes the features of several embodiments, so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.

100:裝載腔室 200:傳輸腔室 300:製程腔室 400:片盒 410:定位銷 420:第一支撐塊 430:第二支撐塊 500:托盤 510:條碼 600:傳輸裝置 700:圖像識別裝置 810:第一AWC感測器 820:第二AWC感測器 100: loading chamber 200: transfer chamber 300: process chamber 400: film box 410: positioning pin 420: The first support block 430: the second support block 500: tray 510: barcode 600: transmission device 700: Image recognition device 810: First AWC sensor 820:Second AWC sensor

當結合附圖閱讀時,從以下詳細描述最佳理解本揭露之態樣。應注意,根據產業中之標準實踐,各種構件未按比例繪製。事實上,為了論述的清楚起見可任意增大或減小各種構件之尺寸。 圖1為本申請實施例公開的半導體製程設備的結構示意圖; 圖2為本申請實施例公開的片盒的結構示意圖; 圖3為本申請實施例公開的(a)-(h)不同形式的條碼的示意圖; 圖4為本申請實施例公開的托盤傳輸的原理圖; 圖5為本申請實施例公開的建立托盤資訊庫的原理圖。 Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 is a schematic structural diagram of semiconductor manufacturing equipment disclosed in an embodiment of the present application; Fig. 2 is a structural schematic diagram of the cassette disclosed in the embodiment of the present application; Fig. 3 is a schematic diagram of barcodes in different forms (a)-(h) disclosed in the embodiment of the present application; FIG. 4 is a schematic diagram of the pallet transport disclosed in the embodiment of the present application; FIG. 5 is a schematic diagram of establishing a pallet information database disclosed in the embodiment of the present application.

100:裝載腔室 100: loading chamber

200:傳輸腔室 200: transfer chamber

300:製程腔室 300: process chamber

400:片盒 400: film box

410:定位銷 410: positioning pin

500:托盤 500: tray

510:條碼 510: barcode

600:傳輸裝置 600: transmission device

700:圖像識別裝置 700: Image recognition device

810:第一AWC感測器 810: First AWC sensor

820:第二AWC感測器 820:Second AWC sensor

Claims (10)

一種半導體製程設備,包括一製程腔室、一傳輸腔室和一裝載腔室,該製程腔室用於執行半導體製程,該裝載腔室用於容置一片盒,該片盒用於承載托盤,該傳輸腔室中設置有一傳輸裝置,該傳輸裝置用於在該製程腔室和該裝載腔室之間傳輸該托盤,其中, 該裝載腔室和該傳輸腔室的交接處設置有一圖像識別裝置,該圖像識別裝置用於在該傳輸裝置攜帶該托盤由該裝載腔室向該傳輸腔室移動的過程中,識別該托盤上的一預設的特徵圖像,確定該托盤的一特徵資訊; 該半導體製程設備還包括一控制器,該控制器用於獲取該特徵資訊,從預設的托盤資訊庫中查找與該特徵資訊對應的一傳輸參數,控制該傳輸裝置根據該傳輸參數傳輸該托盤。 A semiconductor process equipment, comprising a process chamber, a transfer chamber and a loading chamber, the process chamber is used to perform semiconductor process, the loading chamber is used to accommodate a cassette, the cassette is used to carry a tray, A transport device is disposed in the transport chamber, and the transport device is used to transport the tray between the process chamber and the loading chamber, wherein, An image recognition device is provided at the junction of the loading chamber and the transfer chamber, and the image recognition device is used to identify the tray when the transfer device carries the tray and moves from the loading chamber to the transfer chamber. A preset characteristic image on the pallet, to determine a characteristic information of the pallet; The semiconductor manufacturing equipment also includes a controller, the controller is used to obtain the characteristic information, search for a transmission parameter corresponding to the characteristic information from a preset tray information database, and control the transmission device to transmit the tray according to the transmission parameter. 如請求項1所述的半導體製程設備,其中,該控制器還用於獲取該特徵資訊,與該托盤資訊庫中的預存的特徵資訊比對,判斷該托盤資訊庫中是否存有與獲取的該特徵資訊相同的特徵資訊;在該托盤資訊庫中存有與獲取的該特徵資訊相同的特徵資訊的情況下,判斷該特徵資訊與上一次傳輸的托盤的特徵資訊是否一致;當該特徵資訊與上一次傳輸的托盤的特徵資訊一致時,直接採用當前的傳輸參數傳輸該托盤;當該特徵資訊與上一次傳輸的托盤的特徵資訊不一致時,再從該托盤資訊庫中查找與該特徵資訊對應的傳輸參數,控制該傳輸裝置根據該傳輸參數傳輸該托盤。The semiconductor manufacturing equipment as described in claim 1, wherein the controller is further used to obtain the characteristic information, compare it with the pre-stored characteristic information in the tray information database, and determine whether the obtained and obtained information is stored in the tray information database The characteristic information that is the same as the characteristic information; if the characteristic information that is the same as the obtained characteristic information is stored in the pallet information database, determine whether the characteristic information is consistent with the characteristic information of the last transmitted pallet; when the characteristic information When the characteristic information of the pallet transmitted last time is consistent, the current transmission parameters are directly used to transmit the pallet; when the characteristic information is inconsistent with the characteristic information of the pallet transmitted last time, the characteristic information is searched from the pallet information database The corresponding transmission parameter is used to control the transmission device to transmit the tray according to the transmission parameter. 如請求項1或2所述的半導體製程設備,其中,該傳輸參數包括:該托盤的尺寸和該尺寸的該托盤對應的一工位參數,該工位參數包括一工位伸縮值、一工位旋轉值、一工位高位值和一工位低位值。The semiconductor manufacturing equipment as described in claim 1 or 2, wherein the transmission parameters include: the size of the tray and a station parameter corresponding to the tray of the size, and the station parameter includes a station expansion and contraction value, a work station bit rotation value, one bit high bit value and one bit low bit value. 如請求項3所述的半導體製程設備,其中,該傳輸腔室與該製程腔室的交接處設有兩個晶圓自動對心的AWC感測器,兩個該AWC感測器的連線與該托盤的傳輸路徑垂直,且兩個該AWC感測器各自距離垂足的距離不等。The semiconductor processing equipment as described in claim 3, wherein, the junction of the transfer chamber and the process chamber is provided with two AWC sensors for automatic wafer centering, and the connection lines of the two AWC sensors It is perpendicular to the conveying path of the pallet, and the distances between the two AWC sensors and the vertical feet are different. 如請求項4所述的半導體製程設備,其中,該傳輸參數還包括:該尺寸的該托盤對應的一AWC感測器參數,該AWC感測器參數包括一第一AWC感測器前端觸發延遲時間、一第一AWC感測器後端觸發延遲時間、一第二AWC感測器前端觸發延遲時間和一第二AWC感測器後端觸發延遲時間。The semiconductor manufacturing equipment as described in claim 4, wherein the transmission parameter further includes: an AWC sensor parameter corresponding to the tray of the size, and the AWC sensor parameter includes a front-end trigger delay of a first AWC sensor time, a first AWC sensor back-end trigger delay time, a second AWC sensor front-end trigger delay time, and a second AWC sensor back-end trigger delay time. 如請求項1所述的半導體製程設備,其中,該圖像識別裝置為條碼識別感測器,該特徵圖像為條碼。The semiconductor manufacturing equipment according to claim 1, wherein the image recognition device is a barcode recognition sensor, and the characteristic image is a barcode. 一種托盤,用於請求項1-6任一項所述的半導體製程設備中,其中,該托盤的頂面上設置有一特徵圖像,該特徵圖像可被一圖像識別裝置識別,該特徵圖像包括該托盤的特徵資訊。A tray used in the semiconductor processing equipment described in any one of claims 1-6, wherein a characteristic image is provided on the top surface of the tray, and the characteristic image can be recognized by an image recognition device, the characteristic The image contains information about the characteristics of the pallet. 如請求項7所述的托盤,其中,該特徵圖像為條碼。The tray according to claim 7, wherein the characteristic image is a barcode. 如請求項7所述的托盤,其中,該托盤上還設置有至少兩個定位孔,至少兩個該定位孔用於一一對應地與設置於片盒上的至少兩個定位銷配合,限制該托盤在該片盒中的位置,使該托盤輪廓上沿該托盤傳輸方向距該傳輸腔室最遠的點位於一預設位置處。The tray according to claim 7, wherein at least two positioning holes are provided on the tray, and at least two positioning holes are used to match with at least two positioning pins provided on the cassette one by one, limiting The position of the tray in the cassette is such that the point on the outline of the tray that is farthest from the transfer chamber along the transfer direction of the tray is located at a predetermined position. 一種片盒,用於承載如請求項7-9任一項所述的托盤,其中,該片盒包括多個承載位,每個該承載位均包括相對設置的一第一支撐塊和一第二支撐塊,該第一支撐塊和該第二支撐塊上分別設有至少一個定位銷,用於一一對應地與該托盤上的至少兩個定位孔配合,限制該托盤在該片盒中的位置,使該托盤輪廓上沿該托盤傳輸方向距該傳輸腔室最遠的點位於一預設位置處。A film box for carrying the tray as described in any one of claim items 7-9, wherein the film box includes a plurality of bearing positions, each of which includes a first supporting block and a first supporting block oppositely arranged. Two support blocks, the first support block and the second support block are respectively provided with at least one positioning pin, which is used to match with at least two positioning holes on the tray one by one, so as to limit the tray in the cassette position, so that the point on the outline of the tray that is farthest from the transfer chamber along the transfer direction of the tray is located at a preset position.
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