TW202318590A - Semiconductor process equipment, tray and cassette - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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Abstract
Description
本申請屬於半導體裝備技術領域,具體涉及一種半導體製程設備、托盤及片盒。The application belongs to the technical field of semiconductor equipment, and in particular relates to a semiconductor process equipment, a tray and a cassette.
增強型等離子體氣相沉積(Plasma Enhanced Chemical Vapor Deposition,PECVD)設備是普遍應用於LED、IC以及微機電系統(Micro Electro Mechanical System,MEMS)等相關領域的一種薄膜沉積設備,主要應用在2吋、4吋、6吋等規格的晶圓表面沉積SiO2、SiNx或SiON薄膜的製程過程,目前該種設備已經大量應用在相關半導體領域。Enhanced plasma vapor deposition (Plasma Enhanced Chemical Vapor Deposition, PECVD) equipment is a thin film deposition equipment commonly used in LED, IC and micro electromechanical systems (Micro Electro Mechanical System, MEMS) and other related fields, mainly used in 2-inch The process of depositing SiO2, SiNx or SiON thin films on the surface of wafers with specifications such as , 4 inches and 6 inches. At present, this kind of equipment has been widely used in related semiconductor fields.
PECVD設備在進行沉積薄膜時,晶圓需要在裝載腔內進行裝載,並由機械手從裝載腔中取出,在傳輸腔中進行中轉,而後傳輸至製程腔中進行製程反應。由於存在同一反應腔進行不同尺寸晶圓的製程需求,一般將晶圓放置在托盤上進行傳輸。為了保證晶圓在反應腔內的位置較為精確,以確保製程的重複性,在傳輸過程中不同尺寸托盤的精確傳輸顯得至關重要。When PECVD equipment is depositing thin films, the wafer needs to be loaded in the loading chamber, taken out from the loading chamber by the robot, transferred in the transfer chamber, and then transferred to the process chamber for process reaction. Due to the process requirements of wafers of different sizes in the same reaction chamber, wafers are generally placed on trays for transport. In order to ensure that the position of the wafer in the reaction chamber is relatively accurate, so as to ensure the repeatability of the process, it is very important to accurately transport the trays of different sizes during the transport process.
然而,一些傳輸裝備無法對裝載腔內不同規格的托盤進行精確定位,導致傳輸精度低;不同托盤的參數需要手動輸入,且在切換不同尺寸的托盤時需要開腔進行各工位校準及動態晶圓定心(Active Wefer Centering,AWC)標定,從而導致耗時耗力且容易出現人為誤差,影響傳輸精度。However, some transmission equipment cannot accurately position the trays of different specifications in the loading chamber, resulting in low transmission accuracy; the parameters of different trays need to be manually input, and when switching trays of different sizes, it is necessary to open the cavity for each station calibration and dynamic wafer Centering (Active Wefer Centering, AWC) calibration, resulting in time-consuming and labor-intensive and prone to human error, affecting transmission accuracy.
本申請實施例的目的是提供一種半導體製程設備、托盤及片盒,能夠解決傳輸精度低、耗時耗力等問題。The purpose of the embodiments of the present application is to provide a semiconductor process equipment, a tray, and a cassette, which can solve the problems of low transmission accuracy, time-consuming and labor-consuming, and the like.
為了解決上述技術問題,本申請是這樣實現的:In order to solve the above-mentioned technical problems, the application is implemented as follows:
本申請實施例提供了一種半導體製程設備,包括製程腔室、傳輸腔室和裝載腔室,該製程腔室用於執行半導體製程,該裝載腔室用於容置片盒,該片盒用於承載托盤,該傳輸腔室中設置有傳輸裝置,用於在該製程腔室和該裝載腔室之間傳輸該托盤;該裝載腔室和該傳輸腔室的交接處設置有圖像識別裝置,該圖像識別裝置用於在該傳輸裝置攜帶該托盤由該裝載腔室向該傳輸腔室移動的過程中,識別該托盤上的預設的特徵圖像,確定該托盤的特徵資訊;該半導體製程設備還包括控制器,該控制器用於獲取該特徵資訊,從預設的托盤資訊庫中查找與該特徵資訊對應的傳輸參數,控制該傳輸裝置根據該傳輸參數傳輸該托盤。An embodiment of the present application provides a semiconductor process equipment, including a process chamber, a transport chamber, and a loading chamber, the process chamber is used to execute semiconductor processes, the loading chamber is used to accommodate a chip box, and the chip box is used for Carrying the tray, the transport chamber is provided with a transport device for transporting the tray between the process chamber and the loading chamber; an image recognition device is provided at the junction of the loading chamber and the transport chamber, The image recognition device is used to identify the preset characteristic image on the tray and determine the characteristic information of the tray during the process of the transfer device carrying the tray from the loading chamber to the transfer chamber; The process equipment also includes a controller, which is used to obtain the characteristic information, search the transmission parameter corresponding to the characteristic information from the preset tray information database, and control the transmission device to transmit the tray according to the transmission parameter.
本申請實施例還提供了一種托盤,應用於上述半導體製程設備中,該托盤的頂面上設置有特徵圖像,該特徵圖像可被圖像識別裝置識別,該特徵圖像包括該托盤的特徵資訊。The embodiment of the present application also provides a tray, which is applied to the above-mentioned semiconductor manufacturing equipment. A characteristic image is set on the top surface of the tray, and the characteristic image can be recognized by an image recognition device. The characteristic image includes the tray's feature information.
本申請實施例還提供了一種片盒,用於承載上述托盤,該片盒包括多個承載位,每個該承載位均包括相對設置的第一支撐塊和第二支撐塊,該第一支撐塊和該第二支撐塊上分別設有至少一個定位銷,用於與該托盤上的至少兩個定位孔配合,限制該托盤在該片盒中的位置,使該托盤輪廓上沿該托盤傳輸方向距該傳輸腔室最遠的點位於一預設位置處。The embodiment of the present application also provides a chip box, which is used to carry the above-mentioned tray. The block and the second support block are respectively provided with at least one positioning pin, which is used to cooperate with at least two positioning holes on the tray to limit the position of the tray in the cassette, so that the tray can be transported along the outline of the tray. A point farthest in direction from the transfer chamber is located at a predetermined position.
本申請實施例中,通過圖像識別裝置可以識別出托盤上預設的特徵圖像,從而確定托盤的特徵資訊,控制器獲取特徵資訊後從預設的托盤資訊庫中查找與該特徵資訊對應的傳輸參數,而後根據該傳輸參數控制傳輸裝置進行運動,以實現對托盤的傳輸。基於上述設置,可以對不同規格的托盤進行自動識別,從而可以有效解決手動輸入托盤的特徵資訊、傳輸參數的方式帶來的耗時耗力、容易出現誤差的問題,從而保證了不同特徵資訊的托盤的傳輸精度;另外,控制器可以從預設的托盤資訊庫中查找對應的傳輸參數,並使傳輸裝置按照該傳輸參數傳輸托盤,從而無需開腔進行傳輸裝置工位校準,有效解決了開腔導致的耗時耗力的問題。因此,本申請實施例能夠在保證傳輸精度的情況下實現自動化、智慧化傳輸,減少人工勞動,提高了傳輸效率。In the embodiment of the present application, the preset characteristic image on the pallet can be recognized by the image recognition device, so as to determine the characteristic information of the pallet. After obtaining the characteristic information, the controller searches the preset pallet information database for the The transmission parameters, and then control the transmission device to move according to the transmission parameters, so as to realize the transmission of the pallet. Based on the above settings, pallets of different specifications can be automatically identified, which can effectively solve the problems of time-consuming, labor-intensive, and prone to errors caused by manual input of pallet feature information and transmission parameters, thus ensuring the accuracy of different feature information. The transmission accuracy of the pallet; in addition, the controller can look up the corresponding transmission parameters from the preset pallet information database, and make the transmission device transmit the pallet according to the transmission parameters, so that there is no need to open the cavity for calibration of the transmission device station, which effectively solves the problem caused by the cavity opening. time-consuming problem. Therefore, the embodiment of the present application can realize automatic and intelligent transmission while ensuring transmission accuracy, reduce manual labor, and improve transmission efficiency.
以下揭露提供用於實施本揭露之不同構件之許多不同實施例或實例。下文描述組件及配置之特定實例以簡化本揭露。當然,此等僅為實例且非意欲限制。舉例而言,在以下描述中之一第一構件形成於一第二構件上方或上可包含其中該第一構件及該第二構件經形成為直接接觸之實施例,且亦可包含其中額外構件可形成在該第一構件與該第二構件之間,使得該第一構件及該第二構件可不直接接觸之實施例。另外,本揭露可在各個實例中重複參考數字及/或字母。此重複出於簡化及清楚之目的且本身不指示所論述之各個實施例及/或組態之間的關係。The following disclosure provides many different embodiments, or examples, of different means for implementing the disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description a first member is formed over or on a second member may include embodiments in which the first member and the second member are formed in direct contact, and may also include embodiments in which additional members An embodiment may be formed between the first member and the second member so that the first member and the second member may not be in direct contact. Additionally, the present disclosure may repeat reference numerals and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.
此外,為便於描述,諸如「下面」、「下方」、「下」、「上方」、「上」及類似者之空間相對術語可在本文中用於描述一個元件或構件與另一(些)元件或構件之關係,如圖中圖解說明。空間相對術語意欲涵蓋除在圖中描繪之定向以外之使用或操作中之裝置之不同定向。設備可以其他方式定向(旋轉90度或按其他定向)且因此可同樣解釋本文中使用之空間相對描述詞。In addition, for ease of description, spatially relative terms such as "below", "below", "under", "above", "upper" and the like may be used herein to describe the relationship between one element or member and another(s) The relationship between elements or components, as illustrated in the figure. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.
儘管陳述本揭露之寬泛範疇之數值範圍及參數係近似值,然儘可能精確地報告特定實例中陳述之數值。然而,任何數值固有地含有必然由於見於各自測試量測中之標準偏差所致之某些誤差。再者,如本文中使用,術語「大約」通常意謂在一給定值或範圍之10%、5%、1%或0.5%內。替代地,術語「大約」意謂在由此項技術之一般技術者考量時處於平均值之一可接受標準誤差內。除在操作/工作實例中以外,或除非以其他方式明確指定,否則諸如針對本文中揭露之材料之數量、時間之持續時間、溫度、操作條件、數量之比率及其類似者之全部數值範圍、數量、值及百分比應被理解為在全部例項中由術語「大約」修飾。相應地,除非相反地指示,否則本揭露及隨附發明申請專利範圍中陳述之數值參數係可根據需要變化之近似值。至少,應至少鑑於所報告有效數位之數目且藉由應用普通捨入技術解釋各數值參數。範圍可在本文中表達為從一個端點至另一端點或在兩個端點之間。本文中揭露之全部範圍包含端點,除非另有指定。Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Furthermore, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Except in operating/working examples, or unless expressly specified otherwise, all numerical ranges such as for amounts of materials disclosed herein, durations of time, temperatures, operating conditions, ratios of amounts, and the like, Amounts, values and percentages should be understood as being modified by the term "about" in all instances. Accordingly, unless indicated to the contrary, the numerical parameters set forth in this disclosure and the accompanying claims are approximations that may vary as desired. At a minimum, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed herein as from one endpoint to the other or as between two endpoints. All ranges disclosed herein are inclusive of endpoints unless otherwise specified.
參考圖1至圖5,本申請實施例公開了一種半導體製程設備。如圖1所示,所公開的半導體製程設備包括裝載腔室100、傳輸腔室200和製程腔室300。其中,製程腔室300用於執行半導體製程,例如,對晶圓進行刻蝕、在晶圓表面形成膜層等製程。裝載腔室100用於容置片盒400,片盒400用於承載托盤500,托盤500用於承載晶圓。如此,在晶圓進行製程之前,通過托盤500和片盒400放置在裝載腔室100中存儲,當需要對晶圓進行製程時,可以將承載有晶圓的托盤500從裝載腔室100中經過傳輸腔室200傳送至製程腔室300,以在製程腔室300中對晶圓進行製程。Referring to FIG. 1 to FIG. 5 , the embodiment of the present application discloses a semiconductor manufacturing equipment. As shown in FIG. 1 , the disclosed semiconductor processing equipment includes a
一些實施例中,裝載腔室100、傳輸腔室200和製程腔室300依次佈置。為了將裝載腔室100中的晶圓傳輸至製程腔室300中,在傳輸腔室200中設置傳輸裝置600,可選地,傳輸裝置600可以包括機械手,通過傳輸裝置600可以在製程腔室300和裝載腔室100之間傳輸托盤500,並通過托盤500攜帶晶圓進行傳輸。In some embodiments, the
為了對多種不同規格的托盤500進行識別,在裝載腔室100和傳輸腔室200的交接處設置圖像識別裝置700,在傳輸裝置600攜帶托盤500由裝載腔室100向傳輸腔室200移動的過程中,可以通過圖像識別裝置700識別托盤500上的預設的特徵圖像,從而根據特徵圖像確定托盤500的特徵資訊(例如編號、序號、標識等)。In order to identify
基於此,通過在裝載腔室100和傳輸腔室200的交接處設置圖像識別裝置700,使得裝載腔室100和傳輸腔室200的交接處附近區域形成圖像識別區,如此,在傳輸裝置600攜帶托盤500經過圖像識別區時,由於不同規格的托盤500上設有不同的特徵圖像,從而可以通過圖像識別裝置700對當前傳輸的托盤500上的特徵圖像進行識別,並根據所識別的托盤500的特徵圖像獲取托盤500的特徵資訊,從而為調整傳輸裝置600的傳輸方式做準備。Based on this, by setting the
半導體製程設備還包括控制器,控制器可以與上述圖像識別裝置700以及傳輸裝置600分別連接,以實現信號傳輸,具體為,圖像識別裝置700可以將托盤500的特徵資訊發送至控制器,由控制器進行分析處理,而後根據分析處理結果控制傳輸裝置600執行相應的傳輸動作。The semiconductor process equipment also includes a controller, which can be connected to the
其中,控制器可以獲取當前傳輸的托盤500的特徵資訊,與此同時,控制器內還可以存儲有托盤資訊庫,托盤資訊庫包括多種不同規格的托盤500的特徵資訊,以及與多種不同規格的托盤500分別對應的傳輸參數。如此,在控制器獲取當前傳輸的托盤500的特徵資訊後,根據該特徵資訊從托盤資訊庫中查找與之相對應的傳輸參數。當查找到對應的傳輸參數後,控制傳輸裝置600根據該傳輸參數對托盤500進行傳輸。Wherein, the controller can acquire the feature information of the currently transmitted
本申請實施例提供的半導體製程設備傳輸托盤500的具體過程如下:The specific process of the semiconductor process
將承載多個托盤500的片盒400放置於裝載腔室100中,每個托盤500中可以承載晶圓;控制器控制傳輸裝置600由傳輸腔室200移動至裝載腔室100,拾取托盤500,並控制傳輸裝置600攜帶托盤500由裝載腔室100朝向傳輸腔室200移動;在移動過程中,當托盤500移動至圖像識別裝置700的圖像識別區時,圖像識別裝置700可以對托盤500上預設的特徵圖像進行識別,並根據特徵圖像確定托盤500的特徵資訊,與此同時,將所確定的特徵資訊傳輸至控制器;控制器根據該特徵資訊從預設的托盤資訊庫中查找與之相對應的傳輸參數,而後控制傳輸裝置600按照該傳輸參數傳輸托盤500。Place the
基於上述設置,通過圖像識別裝置700可以對不同規格的托盤500進行自動識別,從而可以有效解決手動輸入托盤的特徵資訊、傳輸參數的方式帶來的耗時耗力、容易出現誤差的問題,保證了不同規格的托盤500的傳輸精度和傳輸效率;另外,控制器可以從預設的托盤資訊庫中查找對應的傳輸參數,並使傳輸裝置600按照對應的傳輸參數傳輸托盤500,從而無需開腔進行傳輸裝置600工位校準,有效解決了開腔導致的耗時耗力的問題。因此,本申請實施例能夠在保證傳輸精度的情況下實現自動化、智慧化傳輸,減少人工勞動,提高了傳輸效率。Based on the above settings, the
為了能夠從托盤資訊庫中查找到當前傳輸的托盤500的特徵資訊,以及與該特徵資訊對應的傳輸參數,本申請實施例中,通過控制器將獲取的特徵資訊與托盤資訊庫中預存的特徵資訊進行比對,從而可以判斷托盤資訊庫中是否存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊以及與之對應的傳輸參數。In order to be able to find the characteristic information of the currently transmitted
第一種情況,托盤資訊庫中存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊,此種情況下,在傳輸時,可以從托盤資訊庫中查找到對應的傳輸參數,從而使傳輸裝置600可以根據該傳輸參數傳輸托盤500。In the first case, the pallet information database stores the same feature information as the currently transmitted
第二種情況,托盤資訊庫中不存在當前傳輸的托盤500的特徵資訊,此種情況下,若要實現托盤500的傳輸,需要首先在托盤資訊庫中建立該托盤500的資訊檔案,其中包括托盤的特徵資訊以及對應的傳輸參數,以便於為後續查找奠定基礎。In the second case, there is no characteristic information of the currently transmitted
考慮到相鄰兩次傳輸的托盤500的特徵資訊可以相同也可以不同。當相同時,相鄰兩次傳輸的托盤500對應的傳輸參數相同,從而在傳輸當前的托盤500時,可以延用上一次傳輸的托盤500的傳輸參數,從而無需切換傳輸參數即可實現當前托盤500的傳輸;當不同時,相鄰兩次傳輸的托盤500所對應的傳輸參數不同,從而在傳輸當前的托盤500時,需要首先切換至與當前傳輸的托盤500相對應的傳輸參數。It is considered that the characteristic information of the
基於上述情況,在上述第一種情況下,還需要進一步判斷當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊是否一致。當兩次傳輸的托盤500的特徵資訊一致時,表明兩次傳輸的托盤500屬於同一規格的托盤500,此時無需切換傳輸參數,從而可以直接延用上一次的傳輸參數,也即,當前控制器中存儲的傳輸參數,基於此,可以大幅度提高傳輸效率,並且還能夠保證傳輸參數的準確性,進而保證了傳輸精度。相反,當兩次傳輸的托盤500的特徵資訊不一致時,表明當前傳輸的托盤500與上一次傳輸的托盤500的規格不同,需要將傳輸參數切換至與當前傳輸的托盤500相對應的傳輸參數。如此,可以從控制器中預存的托盤資訊庫中查找與當前傳輸的托盤500的特徵資訊相對應的傳輸參數,待查找到對應的傳輸參數後,可以控制傳輸裝置600根據該傳輸參數傳輸托盤500。基於此,可以實現傳輸參數的自動查找和切換,以保證傳輸參數的準確性,進而保證傳輸精度。Based on the above situation, in the above first case, it is necessary to further determine whether the feature information of the currently transmitted
在上述第二種情況下,可以在托盤資訊庫中建立托盤500的資訊檔案。如圖5所示,具體過程如下:In the above second case, an information file of the
首先進行傳輸條件的檢查,當滿足傳輸測試條件時,將托盤500放置於片盒400上,並進行精確定位,在托盤500放置無問題的情況下,記錄當前托盤500的特徵資訊,如尺寸等;記錄完成後,按照傳輸裝置600工位校準方法對製程腔室300各工位進行校準;記錄校準完成後的工位值。校準完成後,傳輸裝置600攜帶托盤500經過製程腔室300,AWC感測器記錄傳輸裝置600攜帶托盤500經過製程腔室300時的示教中心(即,校準後的托盤500的圓心),完成AWC標定,從而形成當前傳輸的托盤500的資訊檔案。調試過程覆蓋所需要使用的多種不同規格的托盤500,從而對多個不同規格的托盤500建立傳輸用的托盤資訊庫。First, check the transmission conditions. When the transmission test conditions are met, place the
可以理解的是,當前傳輸的托盤500的特徵資訊不存在於托盤資訊庫中時,可以提示該托盤500無法進行傳輸,需要開腔調試建立該托盤500的特徵資訊以及傳輸參數。一些實施例中,可以按照上述傳輸裝置600調試的流程進行工位校準和AWC標定,待標定完成後,即可存儲相對應的傳輸參數至托盤資訊庫中,其中包括工位參數和AWC感測器參數,從而,在托盤資訊庫中形成當前傳輸的托盤500的資訊檔案,以便於後續傳輸該種規格的托盤500時調用。It can be understood that when the feature information of the currently transmitted
基於上述設置,將托盤500的特徵資訊存儲至托盤資訊庫中,也即,在托盤資訊庫中建立托盤500的資訊檔案,如此,在後續需要傳輸該種規格的托盤500時,可以直接從托盤資訊庫中調用,從而無需開腔進行各工位校準和AWC標定,進而提高了托盤500的傳輸效率。Based on the above settings, the feature information of the
可選地,傳輸參數可以包括托盤500的尺寸和該尺寸的托盤500對應的工位參數,基於此,在傳輸某種尺寸的托盤500時,可以從托盤資訊庫中調用與該尺寸的托盤500相對應的工位參數,從而可以按照該工位參數將托盤500傳輸至對應的工位。Optionally, the transmission parameters may include the size of the
其中,工位參數可以包括工位伸縮值、工位旋轉值、工位高位值和工位低位元值,根據這些參數值可以確定托盤500的具體傳輸位置,從而可以保證托盤500的傳輸精度。Wherein, the station parameters may include station stretching value, station rotation value, station high station value and station low station value, according to these parameter values, the specific transmission position of the
此處需要說明的是,上述工位伸縮值、工位旋轉值、工位高位值和工位低位值均可以理解為與托盤500的傳輸工位相關的參數,基於這些參數值可以確定托盤500的傳輸方式。It should be noted here that the above-mentioned station expansion and contraction value, station rotation value, station high position value and station low position value can all be understood as parameters related to the transmission station of the
可選地,傳輸腔室200與製程腔室300的交接處設有兩個晶圓自動對心的AWC(Active Wafer Centering,晶圓自動定心)感測器,即,第一AWC感測器810和第二AWC感測器820,兩個AWC感測器的連線與托盤500的傳輸路徑垂直,且兩個AWC感測器各自距離垂足的距離不等。容易理解,將托盤500的傳輸路徑視為一條直線,該直線位於兩個AWC感測器之間,且與兩個AWC感測器的連線相互垂直,兩個AWC感測器的連線包括第一線段和第二線段,其中,第一線段為其中一個AWC感測器與該直線相交的垂線,第二線段為另一個AWC感測器與該直線相交的垂線,兩個垂線與該直線的交點即為垂足。並且,第一線段與第二線段的長度不等,即,兩個AWC感測器各自距離垂足的距離不等。Optionally, two automatic wafer centering AWC (Active Wafer Centering, wafer automatic centering) sensors are provided at the junction of the
可選地,傳輸參數還包括:該尺寸的托盤500對應的AWC感測器參數,其中,AWC感測器參數包括:第一AWC感測器810前端觸發延遲時間、第一AWC感測器810後端觸發延時時間、第二AWC感測器820前端觸發延遲時間和第二AWC感測器820後端觸發延遲時間。Optionally, the transmission parameters also include: AWC sensor parameters corresponding to the
基於上述設置,在傳輸裝置600傳輸托盤500的過程中,會經過每個AWC感測器兩次,總共四次,通過四次經過AWC感測器時傳輸裝置600的位置可以計算出當前傳輸托盤500的圓心,從而實現傳輸裝置600的AWC標定。基於此,可以按照上述傳輸裝置600的AWC標定方法對製程腔室300中的傳輸工位進行示教,確定傳輸裝置600的示教中心。實際運動過程中,在傳輸裝置600攜帶托盤500經過AWC感測器時的實際中心與示教中心存在偏差的情況下,當傳輸裝置600運動到製程腔室300時,傳輸裝置600可以根據偏差進行補償,以確保托盤500在製程腔室300中位置的一致性。Based on the above settings, in the process of the
本申請實施例中,托盤500的傳輸參數可以包括托盤編號、托盤尺寸、對應的工位參數和對應的AWC感測器參數,具體詳見下表。
可選地,圖像識別裝置700可以是條碼識別感測器,相應地,特徵圖像可以是條碼510。如此,在傳輸裝置600攜帶托盤500由裝載腔室100向傳輸腔室200移動時,條碼識別感測器可以對托盤500上的條碼510進行識別,從而確定托盤500的特徵資訊。當然,圖像識別裝置700還可以採用其他構件,對應的特徵圖像也可以採用其他形式,本申請實施例中對於圖像識別裝置700以及特徵圖像的具體形式不作具體限定。Optionally, the
為了能夠調用不同規格的托盤500的特徵資訊以及對應的傳輸參數,並將傳輸參數應用至傳輸裝置600,使傳輸裝置600能夠精准、快捷地傳輸托盤500,本申請實施例中,在托盤資訊庫中存儲多種不同規格的托盤500的特徵資訊以及對應的傳輸參數。In order to be able to call the feature information and corresponding transmission parameters of
例如,某種規格的托盤500,其具有對應的托盤500尺寸和對應的傳輸參數。當需要傳輸該種型號的托盤500時,可以從托盤資訊庫中直接調用托盤500的特徵資訊以及與該特徵資訊對應的傳輸參數,其中包括托盤500的尺寸、與該尺寸對應的工位參數,以及與該尺寸對應的AWC感測器參數,從而控制傳輸裝置600根據上述各種傳輸參數傳輸托盤500,無需重新輸入傳輸參數,提高了傳輸效率,保證了傳輸精度。For example, a
本申請實施例還公開了一種托盤500,該托盤500應用於上述半導體製程設備中,其中,托盤500的頂面上設置特徵圖像,該特徵圖像可以被圖像識別裝置700識別,且特徵圖像包括托盤500的特徵資訊。The embodiment of the present application also discloses a
可選地,特徵圖像可以是條碼510,相應地,圖像識別裝置700可以採用條碼識別感測器。不同規格的托盤500具有不同形式的條碼510,具體如圖3所示。Optionally, the feature image may be a
為了實現對托盤500的定位,一些實施例中,在托盤500上設置至少兩個定位孔,至少兩個定位孔用於一一對應地與設置於片盒400上的至少兩個定位銷410配合,限制托盤500在片盒400中的位置,使托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點位於一預設位置處。In order to realize the positioning of the
在放置托盤500時,將托盤500上的定位孔與片盒400上的定位銷410對應配合,如此,通過片盒400可以對托盤500起到承載作用,通過定位銷410與定位孔的配合可以實現對托盤500的精確定位,從而保證托盤500在片盒400上的位置精度,進而保證托盤500在裝載腔室100中的初始位置的精度。When placing the
可選地,托盤500上設置兩個定位孔,相應地,片盒400上設置兩個定位銷410,且托盤500上的兩個定位孔對稱設置在傳輸方向的兩側,也即,兩個定位孔的連線與傳輸方向垂直,如此,可以覆蓋製程要求的多種不同尺寸的托盤500。不同尺寸的托盤500上的兩個定位孔的位置不同,兩個定位孔的位置的設置方式需要滿足使不同尺寸的托盤500有規律的放置,以便於傳輸裝置600拾取,例如基於定位孔不同尺寸的托盤500放置在片盒400上後,不同尺寸的托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點均位於一預設位置處,即不同尺寸的托盤500輪廓在這個預設位置處相切,這個預設位置可以根據片盒400的結構和尺寸靈活的設置。Optionally, two positioning holes are set on the
可選地,托盤500的厚度可以為4mm-6mm,且定位銷410的高度設計為1.5mm,直徑設計為4mm。相應地,托盤500上設置的定位孔的深度可以為2mm,直徑為6mm,以保證定位銷410能夠穿入定位孔中。基於上述設置,通過至少兩個定位孔一一對應地與至少兩個定位銷410的配合,可以確保托盤500放置在片盒400上位置的唯一性,以保證不同尺寸的托盤500在裝載腔室100中的位置精度。Optionally, the thickness of the
參考圖2,本申請實施例還公開了一種片盒400,該片盒400用於承載托盤500。其中,片盒400包括多個承載位,每個承載位均包括相對設置的第一支撐塊420和第二支撐塊430,第一支撐塊420和第二支撐塊430上分別設有至少一個定位銷410,用於一一對應地與托盤500上的至少兩個定位孔配合,限制托盤500在片盒400中的位置,使托盤500輪廓上沿托盤500傳輸方向距傳輸腔室200最遠的點位於一預設位置處。Referring to FIG. 2 , the embodiment of the present application also discloses a
可選地,片盒400可以包括頂板、底板、第一側板和第二側板,其中,頂板和底板平行設置,且兩者之間形成一定間距,第一側板和第二側板均連接在頂板和底板之間,且第一側板和第二側板間隔設置。為了承載多個托盤500,在第一側板的朝向第二側板的側面設有多個第一支撐塊420,多個第一支撐塊420沿垂直於頂板的方向間隔設置,如此,相鄰兩個第一支撐塊420之間形成用於容納托盤500局部的第一卡槽,同樣地,相鄰兩個第二支撐塊430之間形成用於容納托盤500局部的第二卡槽,且多個第一卡槽與多個第二卡槽一一對應設置,從而,對應設置的第一卡槽和第二卡槽形成用於承載托盤500的承載位。Optionally, the
此外,同一片盒400可以相容多種不同尺寸的托盤500,在設計片盒400時,將片盒400的尺寸按照最大托盤500的尺寸設計。基於此,在將托盤500放置於片盒400後,將托盤500的邊緣與片盒400一側的邊緣相抵,從而可以通過片盒400對不同尺寸的托盤500進行精確定位,以保證托盤500在裝載腔室100中的位置精度。In addition, the
為了實現對托盤500的定位,可以在片盒400和托盤500上分別設置定位結構。一些實施例中,在對應設置的第一支撐塊420上設置至少一個定位銷410,在第二支撐塊430上設置至少一個定位銷410,且在托盤500上設置至少兩個定位孔。如此,在托盤500承載於片盒400時,定位孔與定位銷410一一對應配合,此時,可以對托盤500輪廓上沿傳輸方向距離傳輸腔室200最遠的點的位置確定,從而可以對片盒400中的托盤500進行精確定位。In order to realize the positioning of the
本申請實施例提供的半導體製程設備中,托盤的傳輸方式如圖4所示,具體包括:In the semiconductor process equipment provided in the embodiment of the present application, the transmission mode of the tray is shown in Figure 4, which specifically includes:
通過相互配合的定位銷410和定位孔對承載於片盒400上的托盤500進行定位;傳輸裝置600攜帶托盤500從裝載腔室100向傳輸腔室200移動;在移動過程中,圖像識別裝置700識別托盤500上的圖像特徵,並根據圖像特徵確定托盤500的特徵資訊;控制器獲取托盤500的特徵資訊後將該特徵資訊與托盤資訊庫中存有的特徵資訊進行比對,判斷托盤資訊庫中是否存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊;在托盤資訊庫中存有與當前傳輸的托盤500的特徵資訊相同的特徵資訊的情況下,判斷當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊是否一致;當當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊一致時,直接採用當前的傳輸參數傳輸托盤500;當當前傳輸的托盤500的特徵資訊與上一次傳輸的托盤500的特徵資訊不一致時,再從托盤資訊庫中查找與當前傳輸的托盤500的特徵資訊相對應的傳輸參數,並控制傳輸裝置600根據該傳輸參數傳輸托盤500;在托盤資訊庫中不存在當前傳輸的托盤500的特徵資訊的情況下,在托盤資訊庫中建立當前托盤500的資訊檔案,以便於調用該規格的托盤500的特徵資訊和傳輸參數。The tray 500 carried on the film box 400 is positioned by the positioning pin 410 and the positioning hole that cooperate with each other; the transfer device 600 carries the tray 500 to move from the loading chamber 100 to the transfer chamber 200; during the movement, the image recognition device 700 identifies the image features on the tray 500, and determines the feature information of the tray 500 according to the image features; the controller obtains the feature information of the tray 500, compares the feature information with the feature information stored in the tray information database, and judges Whether there is the same characteristic information as the characteristic information of the currently transmitted pallet 500 in the pallet information database; if there is the same characteristic information as the currently transmitted pallet 500 in the pallet information database, determine the currently transmitted pallet Whether the characteristic information of the pallet 500 is consistent with the characteristic information of the pallet 500 transmitted last time; when the characteristic information of the pallet 500 transmitted currently is consistent with the characteristic information of the pallet 500 transmitted last time, the current transmission parameter is directly used to transmit the pallet 500; when When the characteristic information of the currently transmitted tray 500 is inconsistent with the characteristic information of the last transmitted tray 500, the transmission parameter corresponding to the characteristic information of the currently transmitted tray 500 is searched from the tray information database, and the transmission device 600 is controlled according to the characteristic information. Transmission
綜上所述,本申請實施例中,實現了不同規格的托盤500的精確定位,並實現了托盤500的自動識別,在切換不同規格的托盤500時,自動調用傳輸裝置600的特徵資訊和對應的傳輸參數,並根據對應的傳輸參數傳輸托盤500,以確保不同規格的托盤500的精確、高效傳輸。In summary, in the embodiment of the present application, the precise positioning of
前述內容概括數項實施例之特徵,使得熟習此項技術者可更佳地理解本揭露之態樣。熟習此項技術者應瞭解,其等可容易地使用本揭露作為用於設計或修改用於實行本文仲介紹之實施例之相同目的及/或達成相同優點之其他製程及結構之一基礎。熟習此項技術者亦應瞭解,此等等效構造不背離本揭露之精神及範疇,且其等可在不背離本揭露之精神及範疇之情況下在本文中作出各種改變、置換及更改。The foregoing content summarizes the features of several embodiments, so that those skilled in the art can better understand aspects of the present disclosure. Those skilled in the art should appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
100:裝載腔室 200:傳輸腔室 300:製程腔室 400:片盒 410:定位銷 420:第一支撐塊 430:第二支撐塊 500:托盤 510:條碼 600:傳輸裝置 700:圖像識別裝置 810:第一AWC感測器 820:第二AWC感測器 100: loading chamber 200: transfer chamber 300: process chamber 400: film box 410: positioning pin 420: The first support block 430: the second support block 500: tray 510: barcode 600: transmission device 700: Image recognition device 810: First AWC sensor 820:Second AWC sensor
當結合附圖閱讀時,從以下詳細描述最佳理解本揭露之態樣。應注意,根據產業中之標準實踐,各種構件未按比例繪製。事實上,為了論述的清楚起見可任意增大或減小各種構件之尺寸。 圖1為本申請實施例公開的半導體製程設備的結構示意圖; 圖2為本申請實施例公開的片盒的結構示意圖; 圖3為本申請實施例公開的(a)-(h)不同形式的條碼的示意圖; 圖4為本申請實施例公開的托盤傳輸的原理圖; 圖5為本申請實施例公開的建立托盤資訊庫的原理圖。 Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various components are not drawn to scale. In fact, the dimensions of the various components may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 is a schematic structural diagram of semiconductor manufacturing equipment disclosed in an embodiment of the present application; Fig. 2 is a structural schematic diagram of the cassette disclosed in the embodiment of the present application; Fig. 3 is a schematic diagram of barcodes in different forms (a)-(h) disclosed in the embodiment of the present application; FIG. 4 is a schematic diagram of the pallet transport disclosed in the embodiment of the present application; FIG. 5 is a schematic diagram of establishing a pallet information database disclosed in the embodiment of the present application.
100:裝載腔室 100: loading chamber
200:傳輸腔室 200: transfer chamber
300:製程腔室 300: process chamber
400:片盒 400: film box
410:定位銷 410: positioning pin
500:托盤 500: tray
510:條碼 510: barcode
600:傳輸裝置 600: transmission device
700:圖像識別裝置 700: Image recognition device
810:第一AWC感測器 810: First AWC sensor
820:第二AWC感測器 820:Second AWC sensor
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US20020070983A1 (en) * | 2000-12-07 | 2002-06-13 | Kozub Thomas A. | Automated wafer handling with graphic user interface |
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CN103811292B (en) * | 2012-11-07 | 2016-08-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon chip process and treat system and processing method |
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