KR20130123952A - Teaching apparatus and substrate processing apparatus having the same and teaching method - Google Patents

Teaching apparatus and substrate processing apparatus having the same and teaching method Download PDF

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Publication number
KR20130123952A
KR20130123952A KR1020120047499A KR20120047499A KR20130123952A KR 20130123952 A KR20130123952 A KR 20130123952A KR 1020120047499 A KR1020120047499 A KR 1020120047499A KR 20120047499 A KR20120047499 A KR 20120047499A KR 20130123952 A KR20130123952 A KR 20130123952A
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South Korea
Prior art keywords
substrate
reflecting means
distance
distance measuring
unit
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KR1020120047499A
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Korean (ko)
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주광술
문우영
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(주)엠프리시젼
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Priority to KR1020120047499A priority Critical patent/KR20130123952A/en
Publication of KR20130123952A publication Critical patent/KR20130123952A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a teaching apparatus and method, comprising: a test substrate provided with a plurality of reflecting means, a transfer robot for transporting the test substrate, and a plurality of reflecting means irradiating light and receiving light reflected therefrom A teaching apparatus and method are provided that include a distance measurer for measuring the distance of an area.

Description

Teaching apparatus, substrate processing apparatus and teaching method having same {Teaching apparatus and substrate processing apparatus having the same and teaching method}

The present invention relates to a teaching apparatus and method, and more particularly, to a teaching apparatus and a teaching method using the same, which identify a position of a substrate and use the same to correct a transfer position of a transfer robot.

In general, automation equipment including various industrial robots, such as robots for transferring substrates for semiconductors, robots for assembly lines, robots for transport of logistics, robots for inspection, robots for clean rooms, robots for LCD manufacturing, and the like, can be used for a long time in advance. It is programmed to repeat the same operation. In addition, it was confirmed whether the movement path and the working position of the robot were correctly performed, and if an error of the working position was found, the position was corrected by using the position correcting device.

The case where such a position correction apparatus is used in a semiconductor manufacturing process is as follows. For example, in order to form a thin film of a predetermined pattern on the substrate, the substrate is transferred to a process chamber which performs thin film deposition and etching processes using a substrate transfer unit, respectively. The substrate transfer unit includes a transfer robot for accurately transferring the substrate to the process chamber, and the substrate is repeatedly transferred to the plurality of process chambers for performing each process. At this time, it is very important that the substrate is placed exactly at the set position in the process chamber. Thus, a teaching process is performed to detect the position of the substrate at regular time intervals before the transfer of the substrate begins or during the transfer of the substrate. That is, the position of the substrate is detected by teaching and then the position of the substrate is corrected. In addition, when the moving position of the transfer robot is out of the initial setting position while colliding with the input window of the process chamber, the substrate support, etc. during the transfer of the substrate, or when the initial setting position is released due to the accumulated stress in a continuous repetitive operation The process is carried out.

The teaching method of the transfer robot is a so-called direct teaching method in which a user directly grabs a robot arm or a robot hand and corrects the delivery position of a substrate, or a robot is operated by a teaching box to perform a transfer operation. The so-called remote teaching method of sequentially designating a position to be a starting point is generally known. In addition, Japanese Unexamined Patent Publication No. 7-027953 and Japanese Unexamined Patent Publication No. 6-0224284 disclose teaching using a plurality of sensors.

However, since the conventional teaching method is performed while the operator visually confirms the movement of the transfer robot, the precision tends to fluctuate among the operators, thereby lowering the calibration reliability of the transfer operation.

In addition, in view of the fact that the transport robot actually operates in a vacuum state, the teaching is preferably performed in a vacuum state. However, in most cases, the teaching operation is performed while checking with the naked eye or using a separate tool. It will proceed at atmospheric pressure. Therefore, there is a problem that productivity is lowered because a considerable time is delayed in adjusting the pressure in the process chamber and the transfer chamber.

The present invention provides a teaching apparatus and a teaching method which can improve the calibration reliability of the transfer operation of the transfer robot.

The present invention provides a teaching apparatus and a teaching method which can be carried out under the same vacuum and high temperature conditions as the conditions under which the process is performed, and can be carried out during the substrate processing process to improve productivity.

A teaching apparatus of one embodiment of the present invention includes a test substrate provided with a plurality of reflecting means; A transfer robot for transferring the test substrate; And a distance measuring unit for irradiating light to the plurality of reflecting means and receiving light reflected therefrom to measure a distance of an arbitrary region of the test substrate.

The distance measuring unit is provided in one region of the transfer robot.

Further comprising a through hole formed in the test substrate.

The plurality of reflecting means reflects the light to at least one of an outer side, an upper side, and a lower side, and reflects the light reflected therefrom to the distance measuring unit.

The plurality of reflecting means may include at least one first reflecting means for reflecting the light back to the distance measuring part; At least one second reflecting means for reflecting the light between the distance measuring part and the sidewall of the substrate processing chamber; At least one third reflecting means for reflecting the light between the distance measuring part and the gas injector; And at least one fourth reflecting means for reflecting the light between the distance measuring unit and the substrate mounting unit.

The fourth reflecting means reflects the light through the through hole between the distance measuring part and the substrate settled part.

The distance measuring unit irradiates light onto one sidewall of the substrate processing chamber and receives the light reflected therefrom.

According to another aspect of the present invention, there is provided a substrate processing apparatus including a transfer unit configured to transfer a substrate; At least one substrate processing unit connected to the transfer unit to process a substrate; A load lock part connected to the transfer part to receive the substrate; And a teaching apparatus for teaching a position of the substrate, wherein the teaching apparatus comprises: a test substrate provided with a plurality of reflecting means and a through hole; A transfer robot provided in the transfer unit to transfer the test substrate; And a distance measurer provided to the transfer robot and configured to measure the distance of any region of the test substrate by irradiating light onto the plurality of reflecting means and receiving light reflected therefrom.

The substrate processing unit includes a substrate processing chamber that provides a reaction space; A substrate placing part provided in the substrate processing chamber to hold the substrate; And a gas supply part provided in the substrate processing chamber to supply source gas.

The plurality of reflecting means may include at least one first reflecting means for reflecting the light back to the distance measuring part; At least one second reflecting means for reflecting the light between the distance measuring part and the sidewall of the substrate processing chamber; At least one third reflecting means for reflecting the light between the distance measuring unit and the gas injector; And at least one fourth reflecting means for reflecting the light between the distance measuring unit and the substrate mounting unit.

The test substrate is transferred into the substrate processing part before starting processing of the processing substrate or during processing of the processing substrate.

The test substrate is transferred into the substrate processing unit under the same conditions as the processing conditions of the process substrate.

Setting a transfer coordinate of the test substrate placed on the substrate setter, measuring a distance reflected by the plurality of reflecting means and incident to the distance measuring unit, and comparing the measured reflection distance with the transfer coordinate Accordingly, the control unit further includes a control unit for calibrating the transport coordinates.

Teaching method according to another aspect of the present invention comprises the steps of providing a test substrate provided with a plurality of reflecting means thereon; Transferring the test substrate into a substrate processing unit; Irradiating light onto the plurality of reflecting means of the test substrate; And measuring a distance between the test substrate and each region of the substrate processing unit by using the light incident again by being reflected back from the plurality of reflecting means.

The test substrate is transferred into the substrate processing unit before starting processing of the processing substrate or during processing of the processing substrate.

The test substrate is transferred into the substrate processing unit under the same conditions as the processing conditions of the process substrate.

And using the measured distance to calibrate the transport coordinates of the transport robot.

In the teaching apparatus according to the embodiments of the present invention, a test substrate provided with a plurality of reflecting means and a through hole is positioned on a substrate settlement unit in a substrate processing unit, and then each angle in the substrate processing unit of the test substrate is adjusted using a distance meter provided on the transfer robot. The distance in the area is measured to detect the position of the test substrate and then reset the transfer coordinates of the transfer robot accordingly.

According to the embodiments of the present disclosure, the transfer robot may be taught while the substrate processing unit and the transfer unit maintain vacuum and process temperatures. Therefore, it is not necessary to adjust the substrate processing unit and the transfer unit to atmospheric pressure or room temperature, thereby preventing the delay of the process time, thereby improving productivity.

In addition, it is not necessary to correct the existing position, it is possible to simply measure the position in the substrate processing portion of the substrate, and the teaching operation can be easily performed.

Since a plurality of sensors are not used, an increase in peripheral devices can be prevented.

1 and 2 are a block diagram and a plan view of a substrate processing apparatus including a teaching apparatus according to an embodiment of the present invention.
3 is a schematic cross-sectional view of a substrate processing unit according to an embodiment of the present invention.
4 is a schematic view of a transfer robot according to an embodiment of the present invention.
5 and 6 are a plan view and a cross-sectional view of a test substrate according to an embodiment of the present invention.
7 to 10 is an open view for explaining the distance measurement of each position of the test substrate according to an embodiment of the present invention.
11 is a flowchart illustrating a teaching method according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information.

1 and 2 are a block diagram and a plan view of a substrate processing apparatus including a teaching apparatus according to an embodiment of the present invention. 3 is a schematic cross-sectional view of a substrate processing unit according to an embodiment of the present invention, and FIG. 4 is a schematic view of a transfer robot. 5 and 6 are schematic plan views and cross-sectional views of a test substrate for detecting a position of a substrate in a substrate processing unit according to an exemplary embodiment of the present invention. 7 to 10 are schematic diagrams for describing distance measurement of respective positions of a test substrate according to an exemplary embodiment. 7 to 10 schematically show only reflecting means of the same purpose.

1 and 2, a substrate processing apparatus according to an embodiment of the present invention includes a transfer unit 1000, at least one substrate processing unit 2000a, 2000b: 2000 connected to a periphery of the transfer unit 1000, and a rod. The lock part 3000 is included. The apparatus further includes a test substrate 4000 which is supplied into the substrate processing unit 2000 and detects a position of the substrate in the substrate processing unit 2000.

As shown in FIG. 3, the substrate processing unit 2000 includes a substrate processing chamber 2100 connected to the transfer unit 1000, a substrate placing unit 2200 provided below the substrate processing chamber 2100 to settle the substrate, A gas injector 2300 disposed on the upper side of the substrate processing chamber 2100 to face the substrate setter 2200 and injecting a reaction gas, and a substrate entrance 2400 that communicates with the transfer chamber 1000 and enters and exits the substrate 10. ). In this case, an opening / closing means 2500 such as a slot valve or a gate valve may be provided between the substrate entrance 2400 and the transfer part 1000. In addition, the substrate processing chamber 2100 may use various chambers such as a chamber for depositing or forming a thin film on the substrate 10, a chamber for etching or cleaning the thin film, or a chamber for performing exposure and development.

The substrate processing chamber 2100 has a predetermined inner space including an approximately circular planar portion and a sidewall portion extending upwardly from the planar portion, and the inner space is hermetically maintained by a chamber lid (not shown) positioned above. Here, the substrate processing chamber 2100 may be manufactured in various shapes in addition to the circular shape, for example, may be manufactured in a shape corresponding to the substrate shape. The substrate processing chamber 2100 is preferably made of a metal material having excellent wear resistance, heat resistance, and corrosion resistance. In addition, at least one exhaust port (not shown) may be provided at a side surface of the substrate processing chamber 2100, and the exhaust port may be connected to an exhaust device (not shown) through an exhaust pipe (not shown). The substrate setter 2200 may be provided with a heating means (not shown) such as a heater at an inner side or a lower side thereof to heat the substrate seated on the substrate setter 2200 to a predetermined temperature. In addition, a cooling means (not shown) may be further provided inside the substrate setter 2200 to adjust the temperature of the substrate together with the heating means. In addition, a driving shaft 2210 connected to a rotation motor (not shown) may be provided below the substrate setter 2200, thereby rotating the substrate setter 2200. The gas injection unit 2300 supplies a plurality of source gases from the outside into the substrate processing chamber 2100. Accordingly, a raw material storage unit (not shown) for storing a plurality of raw material gases is provided outside the substrate processing chamber 2100, and a supply pipe 2310 is provided between the gas injection unit 2300 and the raw material storage unit to store the raw material gas from the raw material storage unit. The source gas is supplied to the gas injection unit 2300. The source gas may be supplied with various materials according to a thin film formed on a substrate, a thin film to be etched, and the like.

The load lock part 3000 communicates with a load lock chamber 3100 connected to the transfer part 1000, a substrate accommodating part 3200 provided in the load lock chamber 3100 to accommodate at least one substrate, and the transfer part 1000. The load lock board | substrate entrance part 3300 is provided. Here, the substrate accommodating part 3200 may accommodate at least one substrate in which a process such as thin film deposition and etching is performed in the substrate processing chamber 2100. In addition, the substrate accommodating part 3200 may accommodate a plurality of substrates and at least one test substrate 4000 as illustrated in FIGS. 5 and 6 for detecting substrate positions in the substrate processing chamber 2100. . That is, the test substrate 4000 may be accommodated in the substrate accommodating part 3200 to confirm the substrate position. Meanwhile, an opening / closing means 3400 such as a slot valve or a gate valve may be provided between the load lock part 3000 and the transfer part 1000.

The transfer unit 1000 may include a transfer chamber 1100 provided between the substrate processing unit 2000 and the load lock unit 3000, a transfer robot 1200 provided in the transfer chamber 1100 to transfer the substrate and the test substrate 4000. Measurement results of the distance measuring unit 1250 and the distance measuring unit 1250 provided in a predetermined area on the transfer robot 1200 to measure distances in a plurality of areas of the test substrate 4000 positioned in the substrate processing unit 2000. The controller 1300 performs automatic teaching on the transfer robot 1200 and controls a movement operation of the transfer robot 1200 by using the automatic teaching result. Here, the transfer robot 1200, the distance measuring unit 1250, and the test substrate 4000 may be included in the teaching apparatus. In addition, a part of the controller 1300 may be included in the teaching apparatus.

The transfer chamber 1100 may be manufactured in a pentagonal shape, for example, and two substrate processing chambers 2100 and one load lock chamber 3100 may be connected to the transfer chamber 1100. However, the transfer chamber 1100 may be manufactured in a circular, elliptical or polygonal shape, two or more substrate processing units 2000 may be connected to the transfer chamber 1100, and one or more load lock units 3000 may be provided.

As shown in FIG. 4, the transfer robot 1200 includes a driving unit 1210 for driving according to a control signal of the controller 1300, a driving shaft 1220 for transmitting a driving force of the driving unit 1210, and one end thereof to the driving shaft. The robot arm 1230 and the robot hand 1240 provided at the other end of the robot arm 1230 to support a substrate are included. The apparatus further includes a distance measuring unit 1250 provided in a predetermined region of the robot arm 1230. At this time, it is effective that the robot arm 1230 has a multi-joint structure (1231, 1232, 1233). Through this, the substrate can be stably transferred in the narrow transfer chamber 1100. In addition, the distance measuring unit 1250 may be provided at an upper portion of the robot arm 1230, and may be provided at an upper portion of the robot arm 1233 connected to the robot hand 1240. The distance measuring unit 1250 may use an optical sensor including a light emitting unit emitting a predetermined light, for example, a laser, and a light receiving unit receiving light reflected from the test substrate 4000. Of course, the present invention is not limited thereto, and an ultrasonic sensor or an infrared sensor may be used for distance measurement. Meanwhile, the distance measuring unit 1250 checks whether the substrate processing unit 2000 is opened or closed to perform a substrate processing process of depositing a thin film or the like on the substrate 10 in addition to the teaching process of irradiating light onto the test substrate 4000. It can be used to. That is, when the transfer robot 1200 moves while the opening and closing means 2500 of the substrate processing unit 2000 is closed, the opening and closing means 2500 and the transfer robot 1200 collide with each other. ) May be damaged or an error may occur in the transfer coordinates of the transfer robot 1200. Therefore, it is preferable to check whether the opening / closing means 2500 is opened or closed before the transfer robot 1200 moves to the substrate processing unit 2000. To this end, the robot hand 1240 of the transfer robot 1200 is directed toward the substrate processing chamber 2100, and then a laser is irradiated from the distance measuring unit 1250 provided on the transfer robot 1200 so that the opening and closing means 2500 Check the opening and closing. That is, the laser beam emitted from the distance measuring unit 1250 reflects and receives the light to determine whether the opening and closing means 2500 is opened or closed. To this end, the control unit 1300 stores at least one of the distance between the distance measuring unit 1250 and the opening and closing means 2500 and the distance to the side wall of the substrate processing chamber 2100 facing the distance measuring unit 1250. do.

The robot arm 1230 moves within a set transfer coordinate and moves the substrate positioned on the robot hand 1240 to a corresponding location, for example, the substrate settling unit 2200 of the substrate processing unit 2000 and the number of substrates of the load lock chamber 3000. The payment 3200 is placed. To this end, the corresponding coordinates for moving the substrate are stored, for example, coordinates corresponding to the center point of the substrate setter 2200. Using the stored coordinates, the transfer robot 1200 may arrange the center of the substrate supported by the robot hand 1240 to coincide with the center point of the substrate setter 2200. However, a teaching process of detecting the position of the substrate at a predetermined time interval before the transfer of the substrate starts or during the transfer of the substrate is performed. That is, the position of the substrate to be transferred is detected and the transfer state of the substrate is corrected according to the detection result. In addition, when the moving position of the transfer robot is out of the initial setting position while colliding with the input window of the process chamber or the substrate support during the transfer of the substrate, and the initial setting position is removed by the accumulated stress due to the continuous repetitive work The process is carried out. For this teaching, the test substrate 4000 and the distance measuring unit 1250 are used to measure the position of the substrate in the substrate processing chamber 2100. That is, the distance measuring unit 1250 may measure a position in the substrate processing unit 2000 of each area of the test substrate 4000 and then correct the transfer coordinates of the transfer robot 1200 accordingly. To this end, the control unit 1300 is a teaching control module 1310 for calculating the transfer coordinates of the transfer robot 1200 using the value measured by the distance measuring unit 1250, and the transfer calculated in the teaching control module 1310. The transfer coordinate storage unit 1320 stores the coordinates, and the control module 1330 controls the movement of the transfer robot 1200 using the stored transfer coordinates. Therefore, in the present embodiment, the test substrate 4000 is placed on the substrate setter 2200 in the substrate processor 2000 by the transfer robot 1200, and then the distance measuring unit 1250 provided on the transfer robot 1200. The distance between each area of the test substrate 4000 and each area of the substrate processing unit 2000 opposite to the area is measured by using. The teaching control module 1310 calculates a transport coordinate by calculating a distance from a center point of the substrate setter 2200 using the measured distance, and stores the transport coordinates 1320. The control module 1330 controls the movement of the transfer robot 1200 using the transfer coordinates stored in the transfer coordinate storage unit 1320. As described above, the transfer coordinates of the transfer robot 1200 may be corrected.

The test substrate 4000 may be transferred from the substrate accommodating part 3200 of the load lock part 3000 to the substrate placing part 2200 in the substrate processing part 2000 by the transfer robot 1200. The test substrate 4000 may be made of the same substrate as the substrate on which the process is performed in the substrate processing unit 2000. That is, the test substrate 4000 may have the same material, thickness, and shape as the process substrate. For example, the test substrate 4000 may use the same circular silicon substrate as the process substrate. In addition, a plurality of reflecting means 4100 may be provided on the test substrate 4000, and a plurality of through holes 4200 may be provided on the test substrate 4000. 6 is a cross-sectional view taken along the edge of the test substrate 4000 from the region A to the region C of FIG. 5.

The reflecting means 4100 reflects the laser emitted from the distance measuring unit 1250 provided on the transfer robot 1200 to receive the light from the distance measuring unit 1250, or the plurality of areas set in the substrate processing unit 2000. The distance measuring unit 1250 receives the reflected light and reflects the laser reflected back from the plurality of areas of the substrate processing unit 2000 again. To this end, the reflecting means 4100 may include, for example, a first reflecting means 4110 for reflecting a laser emitted from the distance measuring unit 1250, a plurality of regions of the test substrate 4000, and the substrate processing chamber 2100. Second reflecting means 4120 for reflecting the laser between the sidewalls, third reflecting means 4130 for reflecting the laser between the plurality of regions of the test substrate 4000 and the gas injector 2300, and a test substrate ( And fourth reflecting means 4140 reflecting the laser between the plurality of regions of the substrate 4000 and the substrate support 2200. Accordingly, the reflecting means 4100 may be made of a reflective material, for example, metal, to reflect the laser, and may be manufactured to have a predetermined angle to reflect the laser to each area in the substrate processing unit 2000.

In this case, the plurality of reflecting means 4100 is divided into four regions A, B, C, and D, for example, at an angle of 90 ° clockwise from the region irradiated with the laser from the distance measuring unit 1250. Assume that two reflecting means 4130, 4140 are provided in region A, four reflecting means 4120, 4110, 4140, 4130 are provided between region B and region C, and between region C and region D. Four reflecting means 4140, 4130, 4110, 4120 may be provided. More specifically, four reflecting means 4120, 4110, 4140, and 4130 may be provided in sequence between the B area and the 45 ° point between the B area and the C area, and from the D area to the D area and the C area. Four reflecting means 4140, 4130, 4110, 4120 can be provided in sequence between points up to 45 ° between the regions. In this case, the position of the reflecting means 4100 may be adjusted so that the reflecting means 4100 located at the front side does not prevent the laser from being irradiated to the reflecting means 4100 at the rear side. In addition, the reflecting means 4100 for the same purpose may be provided in different positions and arranged in a triangular composition. For example, the third reflecting means 4130 may be provided between the A region, the B region and the C region, and the C region and the D region, and they may have a triangular composition. In addition, the fourth reflecting means 4140 may be spaced apart from the third reflecting means 4130 to be provided between the region A, the region B and the region C, and the region C and the region D so that they may have a triangular composition. However, the second reflecting means 4120 may be provided in the region B and the region D, which means that the laser emitted from the position detector 1250 passes between the two reflecting means 4130 and 4140 in front of the substrate processing chamber on the opposite side. This is because the light is immediately reflected on the sidewall of the 2100 and is incident to the position detector 1250 and used to measure the distance to the sidewall of the substrate processing chamber 2100. Further, the first reflecting means 4110 is provided between the second reflecting means 4120 and the fourth reflecting means 4140 between the B region and the C region, and the third reflecting means 4130 between the C region and the D region. ) And the second reflecting means 4120.

The first reflecting means 4110 reflects the laser emitted from the distance measuring unit 1250 to the distance measuring unit 1250 to receive the light from the distance measuring unit 1250. Through this, the position of the test substrate 4000 may be detected to determine the misalignment of the test substrate 4000. That is, the distance between the two first reflecting means 4110 from the distance measuring unit 1250 is set to set the position at which the substrate is placed, for example, as shown in FIG. 4110 are provided in two regions facing each other to equalize the distance T11 between the distance measuring unit 1250 and the two first reflecting means 4110. Of course, the two first reflecting means 4110 may be arranged such that the distance from the distance measuring unit 1250 is different. In this state, when the distance between the two first reflecting means 4110 measured from the distance measuring unit 1250 is different, it may be determined that the position of the test substrate 4000 is shifted. For example, as indicated by a dotted line in FIG. 7, the distance T12 between the distance measuring unit 1250 and the first reflecting means 4110 located near the B region is located near the distance measuring unit 1250 and the D region. When the distance between the first reflecting means 4110 is greater than the distance T13, it may be determined that the position of the test substrate 4000 is shifted so that the first reflecting means 4110 near the B region moves further toward the C region. In addition, when the distance between the distance measuring unit 1250 and the first reflecting means 4110 located near the B region and the D region is shorter or longer than the set distance, the test substrate 4000 is located in front of or behind the set position. You can judge. Therefore, the position of the substrate may be corrected when teaching the transfer robot 1200 using the distance measured by the first reflecting means 4110.

The second reflecting means 4120 may be provided in at least two areas, and may be provided in the B area and the D area. The second reflecting means 4120 reflects the laser emitted from the distance measuring unit 1250 to the sidewall of the substrate processing chamber 2100, and again reflects the laser reflected from the sidewall of the substrate processing chamber 2100 to the distance measuring unit 1250. Reflected by) to receive it from the distance measuring unit 1250. That is, the second reflecting means 4120 reflects the laser between the sidewall of the substrate processing chamber 2100 and the distance measurer 1250. In this case, the laser may be irradiated directly onto the sidewall of the substrate processing chamber 2100 without using the second reflecting means 4120 to measure the distance between the substrate processing chamber 2100 and the distance measuring unit 1250. . For example, the laser emitted from the position detector 1250 passes directly between the two reflecting means 4130 and 4140 in front and is reflected directly on the side wall of the substrate processing chamber 2100 on the opposite side, and then enters the distance measuring unit 1250 again. Can be. That is, the distance between the three regions of the sidewall of the substrate processing chamber 2100 and the distance measuring unit 1250 may be measured by the two second reflecting means 4120 and the laser direct irradiation. In this case, three regions of the substrate processing chamber 2100 to be measured may have an equilateral triangle composition. Through this, the distance between the test substrate 4000 and the sidewall of the substrate processing chamber 2100 may be detected. That is, as shown in FIG. 8, the distance T21 and T22 between the sidewalls of the substrate processing chamber 2100 and the substrate processing chamber by direct irradiation from the distance measuring unit 1250 through the two second reflecting means 4120. The distance T23 between the 2100 is set to set the distance between the substrate and the side wall of the substrate processing chamber 2100. The measured distances of the second reflecting means 4120 and the distance by direct irradiation are set. If it is different from the distance, it may be determined that the test substrate 4000 is out of position. For example, when the distance T24 measured by the first reflecting means 4110 located in the region B is shorter than the set distance T21, the test substrate 4000 may be further moved toward the region B. FIG. In this case, the distance T25 measured by the first reflecting means 4110 positioned in the region D may be longer than the set distance T22. Therefore, the distance between the substrate and the substrate processing chamber 2100 during the teaching of the transfer robot 1200 may be corrected by using the distance between the sidewall of the substrate processing chamber 2100 and the direct irradiation distance of the second reflecting means 4120. have.

The third reflecting means 4130 may be provided in at least three regions, and may be provided between the A region, the B region and the C region, and the C region and the D region. The third reflecting means 4130 reflects the laser emitted from the distance measurer 1250 toward the gas injector 2300, and reflects the laser reflected from the gas injector 2300 back to the distance measurer 1250. To receive it by the distance measuring unit 1250. That is, the third reflecting means 4130 reflects the laser between the gas injector 2300 and the distance measurer 1250. At this time, the three regions of the gas injection unit 2300 to be measured may have a composition of an equilateral triangle. Through this, the distance between the test substrate 4000 and the gas injection unit 2200 may be detected. That is, as shown in FIG. 9, the distances T31 and T32 between the test substrate 4000 and the gas injector 2200 may be set by setting the distance between the three third reflecting means 4130 from the distance measuring unit 1250. , T33). When the measured distances of the three third reflecting means 4130 are different from the set distances, the heights of at least one region of the test substrate 4000 may be shifted. For example, when the distance T34 reflected by the third reflecting means 4130 located between the C region and the D region is shorter than the set distance T33, the correspondence between the C region and the D region of the test substrate 4000 is achieved. It can be determined that the region to be located toward the gas injection unit 2300, that is, the upper side. Therefore, the height of at least one region of the substrate may be corrected when teaching the transfer robot 1200 by using the distance between the gas injector 2200 and the third reflecting means 4130.

The fourth reflecting means 4140 may be provided in at least three regions, and may be provided between the A region, the B region and the C region, and the C region and the D region. The fourth reflecting means 4140 reflects the laser emitted from the distance measuring unit 1250 toward the substrate placing unit 2200, and reflects the laser reflected from the substrate placing unit 2200 back to the distance measuring unit 1250. To receive it by the distance measuring unit 1250. That is, the fourth reflecting means 4140 reflects the laser between the substrate settling unit 2200 and the distance measuring unit 1250. However, the through-holes around the fourth reflecting means 4140 of the test substrate 4000 in order for the laser reflected from the fourth reflecting means 4140 to penetrate the test substrate 4000 and enter the substrate settlement portion 2200. 4200 is formed. In addition, a through hole 1241 may be formed in a predetermined region of the robot hand 1240 in an area corresponding to the through hole 4200. That is, the laser generated from the distance measuring unit 1250 is reflected by the fourth reflecting means 4140 and the substrate is passed through the through hole 4200 of the test substrate 4000 and the through hole 1241 of the robot hand 1240. It may be incident on the settled portion 2200. At this time, the three regions of the substrate settlement portion 2200 to be measured may have an equilateral triangle composition. Through this, the distance between the test substrate 4000 and the substrate setter 2200 may be detected. That is, as shown in FIG. 10, the distances T41, T42, and T43 between the substrate and the substrate setter 2200 may be set by setting the distance between the three fourth reflecting means 4140 from the distance measuring unit 1250. For example, when the measured distances of the three fourth reflecting means 4140 are different from the set distances, it may be determined that the heights of at least one region of the test substrate 4000 are shifted. For example, when the distance T44 reflected by the fourth reflecting means 4140 located between the C region and the D region is longer than the set distance T43, the correspondence between the C region and the D region of the test substrate 4000 is achieved. It can be determined that the region to be located toward the gas injection unit 2300, that is, the upper side. Accordingly, the height of at least one region of the substrate may be corrected when the transfer robot 1200 is taught using the distance between the substrate setter 2200 and the fourth reflecting means 4140. On the other hand, the distance measured by the third reflecting means 4130 and the distance measured by the fourth reflecting means 4140 may have a mutually opposite relationship. For example, when the distance measured by the third reflecting means 4130 is shorter than the set distance, the distance measured by the fourth reflecting means 4140 may be longer than the set distance. That is, when at least one region of the test substrate 4000 is moved toward the gas injector 2300 and the distance is shortened, the distance between the substrate setters 2200 of the region may be increased.

As described above, the teaching apparatus according to the exemplary embodiment of the present disclosure may include a test substrate 4000 provided with a plurality of reflecting means 4100 and a through hole 4200 on the substrate setter 2200 in the substrate processor 2000. After positioning, the distance of each region of the test substrate 4000 may be measured by using the distance measuring unit 1250 provided on the transfer robot 1200 to measure the position of each region of the test substrate 4000. Is detected and then used to reset the transfer coordinates of the transfer robot 1200 accordingly. That is, the plurality of reflecting means 4100 is irradiated from the distance measuring unit 1250 to a plurality of regions of each of the sidewall of the substrate processing chamber 2100, the substrate settling unit 2200, and the gas injecting unit 2300, for example. By reflecting the lasers and reflecting the lasers reflected back from them, the distance measuring unit 1250 receives the position of the test substrate 4000 by receiving the light, which can be used to reset the transfer coordinates of the transfer robot 1210. have. At this time, the substrate processing unit 2000 and the transfer unit 1000 may perform teaching while maintaining vacuum and process temperatures. Therefore, it is not necessary to adjust the substrate processing unit 2000 and the transfer unit 1000 to atmospheric pressure or room temperature, thereby preventing the delay of the process time, thereby improving productivity. In addition, since a plurality of sensors are not used, an increase in peripheral devices generated by using a plurality of sensors can be prevented.

The teaching method using the teaching apparatus according to an embodiment of the present invention will be described with reference to FIG. 11 as follows.

Referring to FIG. 11, in the teaching method according to an exemplary embodiment, a step (S110) of providing a test substrate 4000 having a plurality of reflecting means 4100 provided thereon, and a substrate processing unit ( 2000, transferring the test substrate 4000 to the inside (S120), irradiating the laser from the distance measuring unit 1250 to the plurality of reflecting means 4100 of the test substrate 4000 (S130), and Measuring the distance of each region of the test substrate 4000 by using the laser reflected back from the reflecting means 4100 (S140), and using the measured distance, the test substrate 4000 and the substrate processing unit ( Calculating a transport coordinate by calculating distances of a plurality of areas within the area 2000; and using the calculated transport coordinates to reset the transport coordinates of the transport robot 1200 (S160). Referring to the teaching method according to an embodiment of the present invention in more detail as follows.

S110: A plurality of reflecting means 4100 and a plurality of through holes 4200 are provided on the test substrate 4000. In this case, the test substrate 4000 may use a substrate having the same material and the same shape as a substrate for a process in which a process such as a thin film deposition process or an etching process is performed. In addition, the test substrate 4000 may be provided in the load lock unit 3000 together with at least one process substrate to confirm the substrate position. In this case, the load lock part 3000 is provided with a substrate accommodating part 3200 capable of accommodating a plurality of substrates, and a plurality of process substrates and at least one test substrate 4000 are provided in the substrate accommodating part 3200. For example, it can be stacked and stored in a vertical direction. In addition, in the transfer robot 1200 which transfers the substrate and the test substrate 4000 to the substrate processing unit 2000 or the load lock unit 3000, transfer coordinates of the substrate transferred into the substrate processing unit 2000 are set in advance. The transfer coordinates may include a seating position of the substrate, a distance between the substrate and sidewalls of the substrate processing chamber 2100, a distance between the substrate and the substrate placing portion 2200, a distance between the substrate and the gas injecting portion 2300, and the like. Can be. Accordingly, for example, the center point of the substrate may be positioned on the center point of the substrate setter 2200 in the substrate processing chamber 2100.

S120: The test substrate 4000 is placed on the robot hand 1240 of the transfer robot 1200 and then transferred into the substrate processing chamber 2100. That is, the test substrate 4000 may be used to detect the position of the substrate transferred into the substrate processing chamber 2100 by the transfer robot 1200. In this case, the position in the substrate processing unit 2000 of the substrate transferred from the transfer robot 1200 may be detected by using the test substrate 4000 at predetermined intervals before processing the substrate or after processing the plurality of substrates. . This is possible because the test substrate 4000 is supplied to the load lock part 3000 together with the plurality of process substrates. In addition, the transfer robot 1200 transfers the test substrate 4000 into the substrate processing chamber 2100 according to the set coordinates. For example, the center point of the test substrate 4000 corresponds to the center point of the substrate setter 2200. The test substrate 4000 is transferred onto the substrate settlement portion 2200 so as to be carried out.

S130: After the test substrate 4000 positioned on the transfer robot 1200 is positioned on the set substrate settling unit 2200, a plurality of reflecting means 4100 of the test substrate 4000 are emitted from the distance measuring unit 1250. Investigate with). In this case, the laser may be irradiated to the plurality of reflecting means 4100 simultaneously, and may be irradiated to the reflecting means 4100 sequentially. For example, a laser can be irradiated to the reflecting means 4100 sequentially provided from the B region to the D region of the test substrate 4000. The reflecting means 4100 reflects the laser emitted from the distance measuring unit 1250 provided on the transfer robot 1200 to receive the light from the distance measuring unit 1250, or the plurality of areas set in the substrate processing unit 2000. The distance measuring unit 1250 receives the reflected light and reflects the laser reflected back from the plurality of areas of the substrate processing unit 2000 again. For this purpose, the reflecting means 4100 may include, for example, a first reflecting means 4110 for reflecting a laser emitted from the distance measuring unit 4200, a plurality of regions of the test substrate 4000, and the substrate processing chamber 2100. Second reflecting means 4120 for reflecting the laser between the sidewalls, third reflecting means 4130 for reflecting the laser between the plurality of regions of the test substrate 4000 and the gas injector 2300, and a test substrate ( And fourth reflecting means 4140 reflecting the laser between the plurality of regions of the substrate 4000 and the substrate support 2200. In addition, the laser may be directly irradiated from the distance measuring unit 1250 to one sidewall of the substrate processing chamber 2100 without using a reflecting means. In addition, at least two reflecting means 4100 of the same purpose are provided to be spaced apart from each other by a predetermined interval.

S140: The distance measuring unit 1250 is disposed within the distance measuring unit 1250 and the substrate processing chamber 2100 by using the reflection means 1250 or the laser reflected from the sidewall of the substrate processing chamber 2100 of the same purpose. The distance of each area can be measured. For example, the distance measuring unit 1250 may be disposed between the distance measuring unit 1250 and the two first reflecting means 4110 using a laser that is reflected on two first reflecting means 4110 spaced apart from each other and is incident again. The distance between the three regions of the sidewall of the substrate processing chamber 2100 and the distance measuring unit 1250 may be measured by the two second reflecting means 4120 and the laser direct irradiation. In addition, the distance measuring unit 1250 may measure the distance between the gas injection unit 2300 and the distance measuring unit 1250 by the laser reflected by the three third reflecting means 4130. The distance between the substrate setter 2200 and the distance measurer 1250 may be measured by the laser reflected by the four reflecting means 4140.

S150: The teaching control module 1310 of the controller 1300 calculates the transport distance by calculating the separation distance by using the measured distance between the distance measuring unit 1250 and the reflecting means 4100. In addition, the newly measured distance may be compared with a previously set distance. That is, the position at which the substrate is placed is set in advance by setting the distance between the distance measuring unit 1250 and the first reflecting means 4110. When the measured distances of the first reflecting means 4110 are different, the test substrate It can be determined that the position of 4000 is shifted. For example, the distance between the distance measuring unit 1250 and the first reflecting means 4110 located near the region B is greater than the distance between the distance measuring unit 1250 and the first reflecting means 4110 positioned near the region D. In this case, it may be determined that the position of the test substrate 4000 is shifted so that the first reflecting means 4110 near the B region moves further toward the C region, and the distance measuring unit 1250 is located near the B region and the D region. When the distance between the first reflecting means 4110 is shorter or longer than the set distance, it may be determined that the test substrate 4000 is located in front of or behind the set position. In addition, the distance between the substrate and the sidewall of the substrate processing chamber 2100 is set by setting the distance between the distance measuring unit 1250 and the second reflecting means 4120 and the distance by direct irradiation. When the distance of the second reflecting means 4120 and the distance by direct irradiation are different from the set distance, it may be determined that the position of the test substrate 4000 is shifted. For example, when the distance measured by the second reflecting means 4120 in the region B is longer than the set distance, it may be determined that the test substrate 4000 is further moved toward the region D. In addition, the distance between the test substrate 4000 and the gas injector 2200 may be set by setting the distance between the distance measuring unit 1250 and the third reflecting means 4130. When the distance of 4130 is different from the set distance, it may be determined that the height of at least one region of the test substrate 4000 is shifted. For example, when the distance reflected by the third reflecting means 4130 located between the B region and the C region is shorter than the set distance, the region corresponding to the B region and the C region of the test substrate 4000 may be a gas injector. It can be determined that it is positioned high toward 2300, that is, upward. Meanwhile, the distance between the substrate and the substrate setter 2200 is set by setting the distance between the distance measuring unit 1250 and the fourth reflecting means 4140. The measured distances of the four fourth reflecting means 4140 are measured. Is different from the set distance, it may be determined that the height in at least one region of the test substrate 4000 is shifted. For example, when the distance reflected by the fourth reflecting means 4140 positioned between the B and C regions is longer than the set distance, the region corresponding to the B and C regions of the test substrate 4000 may be a gas injector. It can be determined that it is positioned high toward 2300, that is, upward.

S160: When the newly measured distance is different from the previously set distance, the measured distance is stored in the transfer coordinate storage unit 1320. That is, the transfer coordinate storage unit 1320 may modify the previously set coordinates to newly measured coordinates. The control module 1330 may control the movement of the transfer robot 1200 using the transfer coordinates stored in the transfer coordinate storage unit 1320.

Although the technical idea of the present invention has been specifically described according to the above embodiments, it should be noted that the above embodiments are for explanation purposes only and not for the purpose of limitation. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention.

1000: transfer unit 1100: transfer chamber
1200: transfer robot 1300: control unit
2000: substrate processing unit 2100: substrate processing chamber
2200 substrate mounting portion 2300 gas injection unit
3000: load lock unit 3100: load lock chamber
3200: substrate storage part 3300: substrate entrance part

Claims (17)

A test substrate provided with a plurality of reflecting means;
A transfer robot for transferring the test substrate; And
And a distance measuring unit for irradiating light to the plurality of reflecting means and receiving light reflected therefrom to measure a distance of an arbitrary region of the test substrate.
The teaching apparatus of claim 1, wherein the distance measuring unit is provided in one region of the transfer robot.
The teaching apparatus of claim 1, further comprising a through hole formed in the test substrate.
The teaching apparatus of claim 3, wherein the plurality of reflecting means reflects the light to at least one of an outer side, an upper side, and a lower side, and reflects the light reflected therefrom to the distance measuring unit. The method of claim 3, wherein the plurality of reflecting means,
At least one first reflecting means for reflecting the light back to the distance measuring unit;
At least one second reflecting means for reflecting the light between the distance measuring part and the sidewall of the substrate processing chamber;
At least one third reflecting means for reflecting the light between the distance measuring part and the gas injector; And
And at least one of at least one fourth reflecting means for reflecting the light between the distance measuring portion and the substrate settlement portion.
The teaching apparatus of claim 5, wherein the fourth reflecting means reflects the light through the through hole between the distance measuring part and the substrate settling part.
The teaching apparatus of claim 4, wherein the distance measuring unit irradiates light onto one sidewall of the substrate processing chamber and receives the light reflected therefrom.
A transfer unit transferring a substrate;
At least one substrate processing unit connected to the transfer unit to process a substrate;
A load lock part connected to the transfer part to receive the substrate; And
Teaching device for teaching the position of the substrate,
The teaching device,
A test substrate provided with a plurality of reflecting means and a through hole;
A transfer robot provided in the transfer unit to transfer the test substrate; And
And a distance measuring unit provided in the transfer robot and configured to measure the distance of any region of the test substrate by irradiating light onto the plurality of reflecting means and receiving light reflected therefrom.
The method of claim 8, wherein the substrate processing unit,
A substrate processing chamber providing a reaction space;
A substrate placing part provided in the substrate processing chamber to hold the substrate; And
And a gas supply unit provided in the substrate processing chamber to supply raw material gas.
The method of claim 9, wherein the plurality of reflecting means,
At least one first reflecting means for reflecting the light back to the distance measuring unit;
At least one second reflecting means for reflecting the light between the distance measuring part and the sidewall of the substrate processing chamber;
At least one third reflecting means for reflecting the light between the distance measuring unit and the gas injector; And
And at least one of at least one fourth reflecting means for reflecting the light between the distance measuring part and the substrate mounting part.
The substrate processing apparatus of claim 10, wherein the test substrate is transferred into the substrate processing unit before starting processing of the processing substrate or during processing of the processing substrate.
The substrate processing apparatus of claim 11, wherein the test substrate is transferred into the substrate processing unit under the same conditions as the processing conditions of the processing substrate.
The method of claim 12, wherein the transfer coordinates of the test substrate placed on the substrate setter are set, the distance reflected by the plurality of reflecting means and incident to the distance measuring unit is measured, and the measured reflection distance is And a control unit for comparing the transport coordinates and correcting the transport coordinates accordingly.
Providing a test substrate provided with a plurality of reflecting means thereon;
Transferring the test substrate into a substrate processing unit;
Irradiating light onto the plurality of reflecting means of the test substrate; And
And measuring a distance between the test substrate and each region of the substrate processing unit by using the light incident back from the plurality of reflecting means.
The teaching method of claim 14, wherein the test substrate is transferred into the substrate processing portion before starting processing of the processing substrate or during processing of the processing substrate.
The teaching method of claim 15, wherein the test substrate is transferred into the substrate processing unit under the same conditions as the processing conditions of the processing substrate. 17. The teaching method of claim 16, further comprising using the measured distance to calibrate the transport coordinates of the transfer robot.
KR1020120047499A 2012-05-04 2012-05-04 Teaching apparatus and substrate processing apparatus having the same and teaching method KR20130123952A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102394037B1 (en) * 2021-04-01 2022-05-06 주식회사 써치앤델브 Method for determining the location of the process wafer entering the wafer cassette using the testing wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102394037B1 (en) * 2021-04-01 2022-05-06 주식회사 써치앤델브 Method for determining the location of the process wafer entering the wafer cassette using the testing wafer

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