TW202318108A - Exposure device and device manufacturing method - Google Patents

Abstract

The present invention is an exposure device which exposes, in order to enhance throughput of the exposure device, an object to patterned light generated by a spatial light modulator according to drawing data, the exposure device comprising: an illumination optical system which irradiates illumination light at the spatial light modulator; a projection optical system which projects the patterned light at the object; a first moving body which is disposed below the projection optical system and holds the object; a first drive unit which moves the first moving body in a first direction and a second direction which are orthogonal to each other within a prescribed plane which is orthogonal to an optical axis of the projection optical system; a second moving body which holds the spatial light modulator; a second drive unit which moves the second moving body; a measurement unit which obtains at least one of position information of the object and position information of the first moving body as a measurement result; and a control unit which controls the exposure position of the patterned light by controlling, on the basis of the measurement result obtained by the measurement unit, at least one of driving of the second moving body and adjustment of the projection optical system.

Description

Exposure apparatus and device manufacturing method

The present invention relates to an exposure device and a device manufacturing method.

In the past, in the lithography process of manufacturing electronic components (microcomponents) such as display panels and semiconductor components (integrated circuits, etc.) using liquid crystal or organic EL, a step-and-repeat projection exposure device (so-called stepper), or Step-and-scan projection exposure devices (so-called scanning steppers (also known as scanners)), etc. This type of exposure device projects and exposes a photomask pattern for electronic components on a photosensitive layer coated on the surface of a substrate to be exposed such as a glass substrate, a semiconductor wafer, a printed wiring substrate, or a resin film (hereinafter referred to simply as a substrate).

It takes time and money to manufacture a photomask substrate that is formed by fixing the photomask pattern. Therefore, instead of a photomask substrate, there is known an exposure device that uses a regular arrangement of a plurality of micromirrors that are slightly displaced. Spatial light modulation devices (variable mask pattern generators) such as digital mirror devices (DMDs) (for example, refer to Patent Document 1). In the exposure apparatus disclosed in Patent Document 1, for example, illumination light obtained by mixing light from a laser diode (LD) with a wavelength of 375 nm and light from an LD with a wavelength of 405 nm is irradiated with a multimode fiber bundle. To the digital mirror device (DMD), through the imaging optical system and the microlens array, the reflected light from each of the plurality of micromirrors controlled by tilt is projected to the substrate for exposure.

It is expected to increase the output of the exposure device. [Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2019-23748

According to the disclosed aspect, the exposure device is for exposing an object to the patterned light generated by the spatial light modulator corresponding to the drawing data, comprising: an illumination optical system for irradiating the illuminating light to the spatial light modulator The projection optical system projects the pattern light onto the object; the first moving body is disposed below the projection optical system and holds the object; the first drive unit makes the first moving body align with the projection optical system The first direction and the second direction that are orthogonal to each other in the predetermined plane with the optical axis orthogonal to each other move; the second moving body holds the above-mentioned spatial light modulator; the second driving part moves the above-mentioned second moving body; the measuring part , measuring a measurement result including at least one of the position information of the object and the position information of the first mobile body; and the control unit, based on the measurement result obtained by the measurement unit, controls the At least one of driving and adjustment of the above-mentioned projection optical system is used to control the exposure position of the above-mentioned pattern light.

In addition, the structure of the embodiment described below can be improved suitably, and can replace at least a part with another structure. Furthermore, the components whose arrangement is not particularly limited are not limited to the arrangement disclosed in the embodiment, and may be arranged at a position where the function can be achieved.

A pattern exposure device (hereinafter simply referred to as an exposure device) according to an embodiment will be described with reference to the drawings.

[Overall configuration of exposure device] FIG. 1 is a perspective view showing an outline of an external configuration of an exposure apparatus EX according to an embodiment. The exposure device EX is a device that uses a spatial light modulator (SLM: Spatial Light Modulator) to dynamically modulate the intensity distribution in the space and project the exposure light onto the exposed substrate. Examples of the spatial light modulator include a liquid crystal element, a digital micromirror device (DMD: Digital Micromirror Device), a magneto-optical spatial light modulator (MOSLM: Magneto Optic Spatial Light Modulator), and the like. The exposure apparatus EX of this embodiment includes DMD10 as a spatial light modulator, but may also include other spatial light modulators.

In a specific embodiment, the exposure apparatus EX is a projection exposure apparatus (scanner) of a step-and-scan method in which a rectangular (square) glass substrate used in a display device (flat panel display) or the like is used as an exposure object. The glass substrate is used as a substrate P for flat panel displays with a length of at least one side or a diagonal length of 500 mm or more and a thickness of 1 mm or less. The exposure apparatus EX exposes the projection image of the pattern produced by DMD to the photosensitive layer (photoresist) formed on the surface of the board|substrate P with a certain thickness. After the exposure, the substrate P carried out from the exposure apparatus EX is sent to a predetermined process step (film formation step, etching step, plating step, etc.) after the development step.

The exposure apparatus EX is equipped with a stage device, and the stage device is composed of a base 2 placed on the active anti-vibration units 1a, 1b, 1c, 1d (1d is not shown), a fixed plate 3 placed on the base 2, The XY stage 4A that can move two-dimensionally on the fixed plate 3, the first drive unit that moves the XY stage 4A, and the substrate holder 4B that absorbs and holds the substrate P on a plane on the XY stage 4A (the first movement body), and a laser length measurement interferometer (hereinafter referred to simply as an interferometer) IFX, IFY1 to IFY4 for measuring the two-dimensional moving position of the substrate holder 4B (substrate P). Such a stage device is disclosed in, for example, US Patent Publication No. 2010/0018950 and US Patent Publication No. 2012/0057140.

In FIG. 1 , the XY plane of the orthogonal coordinate system XYZ is set to be parallel to the flat surface of the fixed plate 3 of the stage device, and the XY stage 4A is set to be able to translate in the XY plane. Moreover, in this embodiment, the direction parallel to the X axis of the coordinate system XYZ is set as the scanning movement direction of the board|substrate P (XY stage 4A) at the time of scanning exposure. The moving position of the substrate P in the X-axis direction is sequentially measured by the interferometer IFX, and the moving position in the Y-axis direction is sequentially measured by at least one (preferably two) of the four interferometers IFY1-IFY4. The substrate holder 4B is configured such that it can move slightly in the direction of the Z-axis perpendicular to the XY plane relative to the XY stage 4A, and can be slightly inclined in any direction relative to the XY plane, and actively moves the surface of the substrate P. Focus adjustment and leveling (parallelism) adjustment with the image plane of the projected pattern. Furthermore, in order to actively adjust the slope of the substrate P in the XY plane, the substrate holder 4B is configured to be slightly rotatable (θz rotation) around an axis parallel to the Z axis.

The exposure device EX is further equipped with an optical platen 5 holding a plurality of exposure (drawing) modules MU(A), MU(B), and MU(C), and main columns 6a, 6b supporting the optical platen 5 from the base 2 , 6c, 6d (6d is not shown). A plurality of exposure module groups MU(A), MU(B), and MU(C) are respectively installed on the +Z direction side of the optical fixed plate 5 . A plurality of exposure module groups MU(A), MU(B), and MU(C) each have an illumination unit ILU installed on the +Z direction side of the optical fixed plate 5 and incident on the illumination light from the optical fiber unit FBU, and an installation The projection unit PLU is on the -Z direction side of the optical plate 5 and has an optical axis parallel to the Z axis. Furthermore, the exposure module groups MU(A), MU(B), and MU(C) each include a DMD 10 as a light modulation unit that reflects the illumination light from the illumination unit ILU toward the −Z direction and enters the projection unit PLU. . The detailed structure of the exposure module composed of the illumination unit ILU, DMD10, and projection unit PLU will be described below.

A plurality of alignment systems (microscopes) ALG for detecting alignment marks formed at predetermined plural positions on the substrate P are attached to the −Z direction side of the optical platen 5 of the exposure apparatus EX. Moreover, the calibration standard part CU for calibration is provided in the edge part of the -X direction on the board|substrate holder 4B. Calibration includes the confirmation (correction) of the relative positional relationship in the XY plane of the detection field of view of each alignment system ALG, and the projection unit PLU of each of the self-exposure module groups MU (A), MU (B), and MU (C) Confirmation (correction) of the baseline error of each projection position of the projected pattern image and the position of the detection field of view of each alignment system ALG, and at least one of confirmation of the position or image quality of the pattern image projected from the projection unit PLU . Furthermore, some parts are not shown in FIG. 1 , and the exposure module groups MU (A), MU (B), and MU (C) are arranged at regular intervals along the Y direction in this embodiment as an example. modules, but the number of modules can be less than 9 or more than 9. Also, in FIG. 1 , three rows of exposure modules are arranged along the X-axis direction, and the number of rows of exposure modules arranged along the X-axis direction may be 2 or less, or may be 4 or more.

2 is a diagram showing an example of the configuration of the projection area IAn of the DMD10 projected onto the substrate P by the respective projection units PLU of the exposure module groups MU (A), MU (B), and MU (C), with orthogonal coordinates The system XYZ is set to be the same as in FIG. 1 . In this embodiment, the exposure module group MU (A) of the first row, the exposure module group MU (B) of the second row, and the exposure module of the third row are arranged separately along the X direction (first direction). The group MU(C) is composed of 9 modules arranged along the Y direction (second direction). The exposure module group MU (A) is composed of 9 modules MU1~MU9 arranged along the +Y direction, and the exposure module group MU (B) is composed of 9 modules arranged along the -Y direction It is composed of MU10-MU18, and the exposure module group MU(C) is composed of nine modules MU19-MU27 arranged along the +Y direction. The modules MU1-MU27 all have the same structure, and when the exposure module group MU (A) and the exposure module group MU (B) are set to face each other in the X direction, the exposure module group MU (B) It is in a back-to-back relationship with the exposure module group MU(C) in the X direction.

In FIG. 2 , the shapes of the projected areas IA1, IA2, IA3, . A rectangle with an aspect ratio of 1:2 and extending along the Y direction. In this embodiment, along with the scanning movement of the substrate P in the +X direction, the ends of the first row of projection areas IA1 to IA9 in the -Y direction and the ends of the second row of projection areas IA10 to IA18 in the +Y direction joint exposure. And, the unexposed regions on the substrate P in each of the projection areas IA1 to IA18 of the first and second rows are collectively exposed by the respective regions of the projection areas IA19 to IA27 of the third row. The center points of the projection areas IA1 to IA9 in the first row are located on the line k1 parallel to the Y axis, the center points of the projection areas IA10 to IA18 in the second row are located on the line k2 parallel to the Y axis, and the projection area IA19 in the third row The center points of ~IA27 are located on the line k3 parallel to the Y axis. The distance between the line k1 and the line k2 in the X direction is set as the distance XL1, and the distance between the line k2 and the line k3 in the X direction is set as the distance XL2.

Here, the intermediate portion between the end of the projection area IA9 in the -Y direction and the end of the projection area IA10 in the +Y direction is OLa, and the end of the projection area IA10 in the -Y direction and the end of the projection area IA27 are When the relay portion at the end of the +Y direction is OLb, and the relay portion between the end of the projection area IA8 in the +Y direction and the end of the projection area IA27 in the −Y direction is OLc, as shown in FIG. 3 Explain the status of its joint exposure. In Figure 3, the orthogonal coordinate system XYZ is set to be the same as that in Figure 1 and Figure 2, and the coordinate system X'Y' in the projection areas IA8, IA9, IA10, IA27 (and all other projection areas IAn) is set relative to the The X-axis and Y-axis (lines k1~k3) of the cross coordinate system XYZ are set in the manner of inclination angle θk. That is, in such a manner that the two-dimensional arrangement of a plurality of micromirrors of the DMD 10 becomes the coordinate system X'Y', the entire DMD 10 is inclined by an angle θk in the XY plane.

In FIG. 3 , the circular area including the projection areas IA8 , IA9 , IA10 , and IA27 (and all other projection areas IAn are the same) represents the circular image field PLf′ of the projection unit PLU. In the relay part OLa, the projection image of the micromirrors arranged in the oblique direction (angle θk) along the end of the -Y' direction of the projection area IA9 and the end of the +Y' direction of the projection area IA10 The overlapping mode of the projected images of the micromirrors arranged obliquely (angle θk) is set. Also, in the relay portion OLb, the projection image of the micromirrors arranged in the oblique direction (angle θk) along the end of the -Y' direction of the projection area IA10 and the projection image along the +Y' direction of the projection area IA27 The method of overlapping the projected images of the micromirrors arranged obliquely (angle θk) at the end is set. Similarly, in the relay part OLc, the projection image of the micromirrors arranged in the oblique direction (angle θk) along the end of the +Y' direction of the projection area IA8 is different from that along the -Y' direction of the projection area IA27. The overlapping mode of the projected images of the micromirrors arranged obliquely (angle θk) at the end of the set is set.

〔The composition of the lighting unit〕 Figure 4 is an optical view of the specific composition of the module MU18 in the exposure module group MU (B) and the module MU19 in the exposure module group MU (C) shown in Figure 1 and Figure 2 in the XZ plane configuration diagram. The orthogonal coordinate system XYZ in FIG. 4 is set to be the same as the orthogonal coordinate system XYZ in FIGS. 1 to 3 . Also, it can be seen from the arrangement of the modules in the XY plane shown in FIG. 2 that the module MU18 is staggered by a certain interval in the +Y direction relative to the module MU19, and is arranged in a back-to-back relationship. The optical components in the module MU18 and the optical components in the module MU19 are respectively made of the same material and in the same manner. Therefore, the optical configuration of the module MU18 will be described in detail here. Furthermore, the fiber unit FBU shown in FIG. 1 corresponds to each of the 27 modules MU1-MU27 shown in FIG. 2, and is composed of 27 fiber bundles FB1-FB27.

The illumination unit ILU of the module MU18 is composed of a reflector 100 that reflects the illumination light ILm that advances in the -Z direction from the output end of the fiber bundle FB18, and a reflector 102 that reflects the illumination light ILm from the reflector 100 in the -Z direction. , an input lens system 104 functioning as a collimator lens, an illuminance adjustment filter 106, an optical integrator 108 including a micro-fly-eye (MFE) lens or a field lens, etc., a condenser lens system 110, and The illumination light ILm of 110 is formed by the inclined mirror 112 reflected toward the DMD10. The mirror 102, the input lens system 104, the optical integrator 108, the condensing lens system 110, and the tilt mirror 112 are arranged along the optical axis AXc parallel to the Z axis.

The optical fiber bundle FB18 is composed of one optical fiber or a plurality of optical fiber bundles. The illumination light ILm irradiated from the output end of the optical fiber bundle FB18 (each optical fiber line) is set to a numerical aperture (also referred to as NA, aperture angle) that enters without being repelled by the input lens system 104 at the rear stage. The position of the front focal point of the input lens system 104 is designed to be the same as the position of the output end of the fiber bundle FB18. Furthermore, the position of the rear focal point of the input lens system 104 is such that the illumination light ILm from the single or multiple point light sources formed at the exit end of the fiber bundle FB18 overlaps on the incident surface side of the MFE lens 108A of the optical integrator 108 set up. Therefore, the incident surface of the MFE lens 108A is subjected to Kohler illumination by the illumination light ILm from the output end of the fiber bundle FB18. Furthermore, in the initial state, the geometric center point in the XY plane of the output end of the optical fiber bundle FB18 is located on the optical axis AXc, and the chief ray (center line) of the illumination light ILm from the point light source at the output end of the optical fiber line ) is set parallel (or coaxial) with the optical axis AXc.

The illumination light ILm from the input lens system 104 is incident to the condenser lens through the optical integrator 108 (MFE lens 108A, field lens, etc.) Department 110. The MFE lens 108A is formed by arranging a plurality of rectangular microlenses of tens of μm square two-dimensionally, and its overall shape is roughly the same as the overall shape of the mirror of DMD10 in the XY plane (the aspect ratio is about 1:2). Set up in a similar manner. Also, the position of the front focal point of the condensing lens system 110 is set to be substantially the same as the position of the exit surface of the MFE lens 108A. Therefore, the illumination light from the point light sources formed on the exit sides of the plurality of microlenses of the MFE lens 108A is respectively converted into approximately parallel beams by the condenser lens system 110, reflected by the inclined mirror 112, and then emitted to the DMD10. Overlap to form a uniform illuminance distribution. A surface light source in which a plurality of point light sources (concentrating points) are two-dimensionally densely arranged is generated on the emission surface of the MFE lens 108A, and thus functions as a surface light source-forming member.

In the module MU18 shown in Figure 4, the optical axis AXc parallel to the Z axis passing through the condenser lens system 110 is bent by the inclined reflector 112 to reach the DMD10, and the optical axis between the inclined reflector 112 and the DMD10 is set is the optical axis AXb. In the present embodiment, the center points of the plurality of micromirrors including DMD10 are set to be parallel to the XY plane. Therefore, the angle formed by the normal line (parallel to the Z-axis) of the neutral surface and the optical axis AXb becomes the incident angle θα of the illumination light ILm with respect to the DMD 10 . The DMD 10 is installed on the lower side of the mounting part 10M fixed to the support column of the lighting unit ILU. In order to fine-tune the position or posture of the DMD 10, a micro-motion stage (second moving body) composed of a parallel mechanism and a piezoelectric element that can be stretched is installed in the assembly part 10M, such as disclosed in International Patent No. 2006/120927 10S. The fine movement stage 10S is movable in the X direction and the Y direction by the fine movement stage drive unit 10D (second drive unit), and is capable of θz rotation (Z axis). Therefore, by moving the fine movement stage 10S in the XY direction or rotating θz, it is possible to move the DMD 10 in the XY direction or rotate θz. Also, by using a displacement sensor (not shown), feedback control can be performed on the amount of movement or rotation of the fine movement stage 10S.

[Constitution of DMD] Fig. 5(A) is a diagram schematically showing the DMD10, Fig. 5(B) is a diagram showing the DMD10 when the power is OFF, and Fig. 5(C) is a diagram for explaining the reflector in the open state , Figure 5 (D) is a diagram used to illustrate the mirror in the closed state. Furthermore, in FIGS. 5(A) to 5(D), the reflectors in the open state are indicated by hatching.

The DMD 10 has a plurality of micromirrors 10a capable of controlling the change of the reflection angle. In this embodiment, the DMD 10 is set as a rolling and pitching driving method in which the on state and the off state are switched by the inclination in the rolling direction and the inclination in the pitch direction of the micromirror 10a.

As shown in FIG. 5(B), when the power is turned off, the reflective surface of each micromirror 10a is set to be parallel to the X'Y' plane. The arrangement pitch in the X' direction of each micromirror 10a is set to Pdx (μm), and the arrangement pitch in the Y' direction is set to Pdy (μm), but it is practically set to Pdx=Pdy.

Each micromirror 10a is turned on by inclination around the Y' axis. In FIG. 5(C), only the micromirror 10a in the center is turned on and the other micromirrors 10a are set to a neutral state (not turned on or off). Moreover, each micromirror 10a becomes an OFF state by inclining around the X' axis. In FIG.5(D), the case where only the central micromirror 10a is turned off and the other micromirrors 10a are made neutral is shown. Moreover, it is not shown for simplification, but the micromirror 10a in the open state is driven in a manner of tilting a predetermined angle from the X'Y' plane, so that the illumination light irradiated to the micromirror 10a in the open state is reflected toward The X direction of the XZ plane. Also, the off-state micromirror 10a is driven by tilting a predetermined angle from the X'Y' plane, so that the illuminating light irradiated to the on-state micromirror 10a is reflected toward the Y direction in the YZ plane. The DMD10 generates an exposure pattern by switching the on state and the off state of each micromirror 10a.

The illuminating light reflected by the reflector in the closed state is absorbed by a light absorber not shown.

Furthermore, since the DMD10 is used as an example of the spatial light modulator for description, it will be described in the form of a reflective type that reflects laser light, but the spatial light modulator may be of a transmission type that allows laser light to Diffraction type of laser light diffraction. A spatial light modulator can modulate laser light both spatially and temporally.

Returning to FIG. 4 , the illumination light ILm irradiated to the micromirror 10 a in the ON state among the micromirrors 10 a of the DMD 10 is reflected toward the X direction in the XZ plane toward the projection unit PLU. On the other hand, among the micromirrors 10a of the DMD10, the illumination light ILm irradiated to the micromirror 10a in the closed state is reflected toward the Y direction in the YZ plane so as not to go toward the projection unit PLU.

In the optical path between the DMD10 and the projection unit PLU, a movable shutter 114 for shielding the reflected light from the DMD10 during the non-exposure period is provided in a detachable manner. As shown on the side of module MU19, the movable baffle 114 rotates to an angular position retreating from the optical path during the exposure period, and rotates to an angular position obliquely inserted into the optical path as shown on the side of module MU18 during the non-exposure period. Since the reflective surface is formed on the DMD 10 side of the movable shutter 114 , the reflected light from the DMD 10 is irradiated to the light absorber 117 . The light absorber 117 absorbs light energy in the ultraviolet wavelength region (wavelength below 400 nm) and converts it into heat energy without re-reflecting it. Therefore, a heat radiation mechanism (radiation fin or cooling mechanism) is also provided in the light absorber 117 . Furthermore, although not shown in FIG. 4 , the reflected light from the micromirror 10a of the DMD10 which is turned off in the exposure period is as described above, along the Y direction ( Figure 4 is absorbed by the same light absorber (not shown in Figure 4) installed in the direction perpendicular to the paper.

〔The composition of the projection unit〕 The projection unit PLU installed on the lower side of the optical fixed disk 5 is used as a telecentric imaging projection lens system composed of the first lens group 116 and the second lens group 118 arranged along the optical axis AXa parallel to the Z axis. constituted. The first lens group 116 and the second lens group 118 are respectively relative to the support columns fixed on the lower side of the optical fixed plate 5 and are translated in the direction along the Z axis (optical axis AXa) by a micro actuator. constituted in a manner. The projection magnification Mp of the imaging projection lens system formed by the first lens group 116 and the second lens group 118 is based on the arrangement pitch Pd of the micromirrors on the DMD10 and the projection area IAn (n=1-27) projected onto the substrate P The relationship between the minimum line width (minimum pixel size) Pg of the pattern is determined.

As an example, when the required minimum line width (minimum pixel size) Pg is 1 μm and the arrangement pitches Pdx and Pdy of the micromirrors are 5.4 μm respectively, the projected area IAn illustrated in Figure 3 above is also considered (DMD10) The inclination angle θk in the XY plane, and the projection magnification Mp is set to about 1/6. The imaging projection lens formed by the lens groups 116 and 118 inverts/inverts the overall reduced image of the mirror of the DMD 10 to form an image in the projection area IA18 (IAn) on the substrate P.

The first lens group 116 of the projection unit PLU can be finely moved along the optical axis AXa direction by the actuator in order to fine-tune the projection magnification Mp (about ± tens of ppm), and the second lens group 118 can be used for high-speed adjustment of the focus. It can be slightly moved along the optical axis AXa direction by the actuator. Furthermore, in order to measure the position change of the surface of the substrate P in the Z-axis direction with sub-micron accuracy, a plurality of oblique incident light type focus sensors 120 are provided on the lower side of the optical platen 5 . The plurality of focus sensors 120 change the position of the entire Z-axis direction of the substrate P, the position changes of the partial areas on the substrate P corresponding to each projection area IAn (n=1-27), or the position change of the substrate P The partial tilt change of P is measured.

Also, in this embodiment, between the DMD10 and the first lens group 116, there are two deflection angles 600a, 600b as shown in FIG. 6(A) or two parallel lenses as shown in FIG. 6(B). Plates 601a, 601b. Hereinafter, unless otherwise specified, the two off-angles 600a, 600b and the two parallel flat plates 601a, 601b are referred to as an optical element OPE. In addition, in the present embodiment, correcting a positional shift is also referred to as displacing an image. Moreover, in this embodiment, the optical element OPE is disposed between the DMD 10 and the first lens group 116 , but it is not limited thereto. The optical element OPE can also be disposed between the first lens group 116 and the second lens group, or between the projection unit PLU and the substrate P. As shown in FIG. Furthermore, the projection optical system is constituted by the projection unit PLU and the optical element OPE.

As the above illumination unit ILU and projection unit PLU are as explained in FIG. 3 above, the projection area IAn in the XY plane needs an inclination angle θk, so the DMD10 and the illumination unit ILU in FIG. 4 (at least along the optical axis AXc) The mirror 102 to the optical path part of the mirror 112) are arranged so as to be inclined at an angle θk in the XY plane as a whole.

[Configuration of reference unit CU for calibration] FIG. 7 is a diagram showing a schematic configuration of an alignment device 60 provided on a calibration reference portion CU attached to an end portion on the substrate holder 4B of the exposure apparatus EX. The alignment device 60 includes a reference mark 60a, a two-dimensional imaging element 60e, and the like. The alignment device 60 is used for the measurement and calibration of the positions of various modules, and also for the calibration of the alignment system ALG.

The measurement of the position of each module MU1-MU27 is performed by projecting the calibration DMD pattern onto the fiducial mark 60a of the alignment device 60 by using the projection unit PLU, and measuring the relative position between the fiducial mark 60a and the DMD pattern.

Also, the calibration of the alignment system ALG can be performed by measuring the reference mark 60a of the alignment device 60 using the alignment system ALG. That is, the position of the alignment system ALG can be obtained by measuring the reference mark 60a of the alignment device 60 using the alignment system ALG. Furthermore, the relative positions of the alignment system ALG and the modules MU1 to MU27 can be obtained using the reference marks 60a.

Moreover, the alignment system ALG can measure the position of the alignment mark on the board|substrate P mounted on the board|substrate holder 4B based on the fiducial mark 60a of the alignment apparatus 60.

[Structure of Exposure Control Device] Various processes including the scanning exposure process performed in the exposure apparatus EX having the above configuration are controlled by the exposure control device 300 . FIG. 8 is a functional block diagram showing the functional configuration of an exposure control device 300 included in the exposure apparatus EX of this embodiment.

The exposure control device 300 includes a drawing data storage unit 310 , a control data creation unit 301 , a correction data creation unit 302 , a drive control unit 304 , and an exposure control unit 306 .

The drawing data of the patterns for the display panel exposed by a plurality of modules MUn (n=1 to 27) respectively are stored in the drawing data storage unit 310 . The drawing data storage unit 310 sends the drawing data MD1-MD27 for pattern exposure to the respective DMD10 of the 27 modules MU1-MU27 shown in FIG. 2 . The module MUn (n=1-27) selectively drives the micromirror 10a of the DMD10 according to the drawing data MDn, generates a pattern corresponding to the drawing data MDn, and projects it onto the substrate P for exposure. That is, the drawing data is the data which switches the on state and the off state of each micromirror 10a of DMD10.

The control data creation part 301 creates the 1st control data based on the alignment measurement result of the board|substrate P using the alignment system ALG, and outputs it to the drive control part 304. The first control data is used to control the driving and projection unit PLU of the micro-motion stage 10S of the DMD10 included in each module MUn (n=1~27) in such a way that the positional deviation of the substrate P is corrected based on the alignment measurement result The driving data of the optical system (the first lens group 116 and the second lens group 118 ) and the driving of the optical element OPE.

More specifically, when driving the fine movement stage 10S of the DMD10, the driving amount of the fine movement stage 10S of each module MU1-MU27 is defined according to the first control data. The fine movement stage 10S driven by the fine movement stage drive unit 10D moves in the X direction and the Y direction, or rotates in the θz direction. As a result, the projection image projected onto the substrate P can be image shifted.

Moreover, when adjusting the optical system of the projection unit PLU, the driving amount of the projection unit PLU of each module MU1-MU27 or the adjustment amount of the lens in the projection unit PLU is defined according to the first control data. In the case of driving the projection unit PLU, the projection unit PLU moves at least one lens group of the first lens group 116 or the second lens group 118 in the XY plane through the actuator etc. of the projection unit PLU. As a result, the projection image projected onto the substrate P can be image shifted. Also, from the viewpoint of image difference, it is more preferable for the projection unit PLU to move the first lens group 116 and the second lens group 118 so that the movement amounts of the first lens group 116 and the second lens group 118 are the same. When adjusting the lenses in the projection unit PLU, at least one lens disposed in the first lens group 116 or the second lens group 118 can be adjusted by the actuators provided in the first lens group 116 and the second lens group 118 Move in the XY plane. As a result, the projection image projected onto the substrate P can be image shifted.

Also, when driving the two deflection angles 600a, 600b arranged between the DMD10 of each module MU1-MU27 and the first lens group 116, the two deflection angles 600a, 600b are defined according to the first control data. drive volume. By controlling the interval between the two deflection angles, it is possible to cause an image shift in the projected image projected onto the substrate P. Also, the two deflection angles 600a, 600b can be arranged not only between the DMD10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 118 and the second lens group 118. between substrates P.

Furthermore, when driving the two parallel flat plates 601a, 601b disposed between the DMD10 of each module MU1-MU27 and the first lens group 116, the driving amount of the two parallel flat plates 601a, 601b is defined according to the first control data. By controlling the amount of rotation of the two parallel flat plates 601a and 601b to rotate θz, it is possible to cause image displacement in the projection image projected onto the substrate P. Two parallel flat plates 601a, 601b can be arranged not only between the DMD10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 118 and the substrate P .

Here, the reason for creating the first control data will be described. For example, the substrate P is placed on the substrate holder 4B at a position shifted from the designed position. In this case, if the scanning exposure is directly performed, the pattern generated based on the drawing data MDn is shifted from the designed position and exposed on the substrate P. As a method of exposing a pattern at a predetermined position (design position) of the substrate P placed with the position shifted in the above-mentioned manner, for example, based on the alignment measurement results of the substrate P using the alignment system ALG, it is considered to The substrate P rewrites the drawing data MDn. However, since the amount of drawing data MDn used for the display panel is large, it takes a long time (for example, 40 minutes) to rewrite, which may reduce the yield. Also, when the amount of misalignment is smaller than the minimum line width (minimum pixel size) of the pattern projected onto the substrate P, the misalignment cannot be corrected even if the drawing data is changed. That is, it may be difficult to perform correction with high accuracy by changing the drawing data.

Therefore, in this embodiment, based on the alignment measurement result of the substrate P using the alignment system ALG, instead of rewriting the drawing data MDn, the projected position of the pattern is shifted, and the position deviation of the substrate P relative to the design value is corrected. shift. Specifically, by controlling the drive of at least one of the micro-motion stage 10S of the DMD 10 , the optical system of the projection unit PLU, and the optical element OPE, the projection position of the pattern is shifted. Thereby, the positional deviation of the board|substrate P with respect to a design value can be corrected.

For example, when the substrate P is arranged with a deviation of α degrees (rotation α degrees) from the design value around the Z axis, by rotating the fine movement stage 10S of the DMD 10 by α degrees from the initial position θz, the X direction of the DMD 10 And the position in the Y direction can be adjusted, so that the pattern can be projected to the design position.

Furthermore, in this embodiment, since the modules MUn (n=1-27) are arranged along the X direction and the Y direction, the control data creating unit 301 also considers the relationship between the modules MUn to create the first control data. Furthermore, the production time of the first control data is, for example, about several seconds.

When calibration is performed between exposure processing and exposure processing, the correction data creation unit 302 creates correction data based on the calibration result, and outputs the correction data to the drive control unit 304 . The correction data is used to correct the driving amount of the micro-movement stage 10S of the DMD10 and the position of the projection unit PLU by correcting the positional deviation of the components of the exposure device EX (such as the module MUn, the alignment system ALG, etc.) according to the calibration results. Data on the driving amount of the optical system and the driving amount of the optical element OPE. For example, in the correction data, for each module MU1~MU27, define the offset value of the driving amount of the micro-motion stage 10S of the DMD10, the offset value of the driving amount of the optical system of the projection unit PLU, and the driving amount of the optical element OPE the offset value.

Here, the reason for creating the correction data will be explained. For example, if the exposure process is repeated in the exposure apparatus EX, the positions of the components of the exposure apparatus EX will shift, and calibration may be required between exposure processes. Usually, when calibration is required, it is considered to reset the composition or rewrite the drawing data in a way of correcting the positional offset of each composition.

However, resetting each configuration of the exposure apparatus EX or rewriting the drawing data based on the calibration results will take time and may reduce throughput. Also, when the amount of misalignment is smaller than the minimum line width (minimum pixel size) of the pattern projected onto the substrate P, the misalignment cannot be corrected even if the drawing data is changed. That is, it may be difficult to perform correction with high accuracy by changing the drawing data.

Therefore, in this embodiment, when calibration is performed between exposure processing and exposure processing, instead of resetting each configuration of the exposure device EX or rewriting the drawing data based on the calibration result, the exposure device EX is corrected. Correct the driving amount of the micro-motion stage 10S of the DMD10, the driving amount of the optical system of the projection unit PLU, and the driving amount of the optical element OPE by means of the positional deviation of each component. The correction data creation unit 302 creates correction data for correcting the driving amount of the fine movement stage 10S of the DMD 10 , the driving amount of the optical system of the projection unit PLU, and the driving amount of the optical element OPE in the above-mentioned manner.

The drive control unit 304 generates second control data obtained by correcting the first control data input from the control data creation unit 301 with the correction data input from the correction data creation unit 302 .

In addition, the drive control unit 304 may generate the second control data by combining the first control data input from the control data creation unit 301 and the calibration result without using the correction data creation unit 302 to create the correction data.

In addition, the driving control unit 304 creates driving amount control data CD1-CD27 and outputs them to the modules MU1-MU27. The driving amount control data CD1-CD27 are based on the measurement results of the interferometers IFY1-IFY4 and are included in the second control data. The driving amount of the micro-motion stage 10S of the DMD10, the driving amount of the optical system of the projection unit PLU, and the driving amount of the optical element OPE are obtained by real-time correction. The exposure control device 300 (drive control unit 304 ) can also control the first drive unit that moves the XY stage 4A. In addition, the exposure control device 300 (drive control unit 304 ) may control the fine movement stage drive unit 10D. In addition, the exposure control device 300 (drive control unit 304 ) can also control and drive the first lens group 116 , the second lens group 118 , and the drive unit of the optical element OPE provided in the projection optical system.

Here, the reason why the drive control unit 304 modifies the second control data in real time will be described. In the scanning exposure of the board|substrate P, the board|substrate holder 4B may not move as designed (For example, it should go straight along the X direction, but it may meander, etc.). As described above, when the substrate holder 4B does not move as designed (for example, the Y-direction position of the substrate holder 4B at the predetermined X-direction position is different from the design value), if the scanning exposure is directly performed, then The pattern according to the drawing data MDn is shifted from the designed position and exposed on the substrate P. In this case, it is time-consuming to rewrite the drawing data so as to follow the positional shift of the substrate holder 4B. Also, when the amount of misalignment is smaller than the minimum line width (minimum pixel size) of the pattern projected onto the substrate P, the misalignment cannot be corrected even if the drawing data is changed. That is, it may be difficult to perform correction with high accuracy by changing the drawing data.

Therefore, in this embodiment, the drive control unit 304 controls the drive amount of the micro-motion stage 10S of the DMD 10 and the drive of the optical system of the projection unit PLU included in the second control data based on the measurement results of the interferometers IFY1 to IFY4. The driving amount control data (third control data) CD1~CD27 control modules MU1~MU2 after real-time correction of the driving amount and the driving amount of the optical element OPE. Thereby, the positional deviation of the substrate P, the positional deviation of each component of the exposure apparatus EX, and the positional deviation of the substrate holder 4B during scanning exposure can be corrected, and the pattern can be projected on the substrate P as designed. exposure.

During the scanning exposure, the modules MU1~MU27 control the data CD1~CD27 based on the driving amount sent from the driving control part 304 to drive the fine movement stage 10S of the DMD10, the optical system of the projection unit PLU, and the optical element OPE. drive control.

The exposure control unit (sequencer) 306 synchronizes with the scanning exposure (moving position) of the substrate P, sends out the drawing data MD1-MD27 from the drawing data storage unit 310 to the modules MU1-MU27 and controls the driving amount data CD1-CD27 automatically. The output of the drive control unit 304 is controlled.

[Outline of Exposure Processing Sequence] Next, the outline of the exposure processing procedure in the exposure apparatus EX of this embodiment is demonstrated with reference to FIG. 9. FIG. FIG. 9 is a flow chart showing an outline of the procedure when exposing the substrate P using the exposure apparatus EX for the first time or exposing the substrate P using the exposure apparatus EX that has not been used for a long time. In the following example, the case where the pattern scanning exposure of a display panel etc. is made to the board|substrate P is demonstrated.

In the sequence shown in FIG. 9, the initial calibration of the exposure apparatus EX is performed first (step S11). In the initial calibration, the settings of the components of the exposure apparatus EX are corrected based on the measurement results of the alignment system ALG and the like. For example, the positions of the modules MU1-MU27, the initial positions or initial postures of the illumination units ILU, DMD10, and projection unit PLU of the respective modules MU1-MU27, the slope of the substrate holder 4B, etc. are corrected.

Next, the drawing data of the pattern for the display panel exposed respectively by a plurality of modules MUn (n=1-27) is loaded into the drawing data memory part 310 (step S13).

Next, the substrate P is carried into the main body of the exposure apparatus EX, and placed on the substrate holder 4B (step S15 ).

Next, the alignment marks formed at predetermined plural positions on the board|substrate P are measured using several alignment systems ALG (step S17).

Next, based on the measurement results of the alignment system ALG, the control data creation unit 301 creates the driving amount of the fine movement stage 10S of the DMD 10 , the driving amount of the optical system of the projection unit PLU, and The first control data of the driving amount of the optical element OPE (step S19 ).

Next, the module MUn (n=1-27) scans and exposes the pattern of the display panel on the substrate P according to the drawing data MDn and the driving amount control data CDn (step S21 ). The driving amount control data CDn at this time is data (fourth control data) obtained by correcting the first control data in real time based on the measurement results of the interferometers IFY1-IFY4 (ie, the position of the substrate holder 4B).

After the scanning exposure process is completed, the board|substrate P is carried out (step S23).

Next, it is judged whether calibration is required (step S25). For example, when the number of substrates P subjected to scanning exposure processing reaches a predetermined number (for example, 10) after the previous calibration, it is determined that calibration is necessary. Or when a predetermined time has passed every day, it is judged that calibration is required.

When calibration is unnecessary (step S25/No), return to step S15. On the other hand, when calibration is required (step S25/Yes), calibration is performed (step S27).

Next, the correction data production unit 302 creates a method for correcting the driving amount of the micro-motion stage 10S of the DMD 10 and the driving of the optical system of the projection unit PLU by correcting the positional deviation of each device of the exposure device EX according to the calibration result in step S27. Correction data of the amount or the driving amount of the optical element OPE (step S29).

Next, a new substrate P is loaded into the exposure apparatus EX main body, and placed on the substrate holder 4B (step S31 ).

Next, the alignment marks formed at predetermined plural positions on the board|substrate P carried in newly are measured using several alignment systems ALG (step S33).

Next, based on the measurement results of the alignment system ALG, the control data creation unit 301 creates the driving amount of the fine movement stage 10S of the DMD 10 , the driving amount of the optical system of the projection unit PLU, and The first control data of the driving amount of the optical element OPE (step S35 ).

Next, the drive control unit 304 generates second control data obtained by correcting the first control data prepared in step S35 with the correction data prepared in step S29 (step S37 ).

Furthermore, step S29 may also be omitted, and the drive control unit 304 generates the second control data according to the first control data and the calibration result.

Next, the module MUn (n=1-27) scans and exposes the pattern of the display panel on the substrate P according to the drawing data MDn and the driving amount control data CDn (step S39 ). The driving amount control data CDn at this time is the data obtained by correcting the second control data (third control data) in real time based on the measurement results of the interferometers IFY1-IFY4 (ie, the position of the substrate holder 4B).

After the scanning exposure process is completed, the board|substrate P is carried out (step S41).

Next, it is judged whether calibration is required (step S43). For example, when the number of substrates P subjected to scanning exposure processing reaches a predetermined number (for example, 10) after the previous calibration, it is determined that calibration is necessary.

When calibration is not required (step S43/No), return to step S31. On the other hand, when calibration is required (step S43/Yes), calibration is performed (step S27).

As described above, the process of FIG. 9 is repeated until the production of a predetermined number of display panels is completed. Furthermore, the processing of steps S25 to S29 may also be omitted. In this case, the processing after step S31 is not performed, and it is sufficient to return to step S15 after step S23 is completed. In this case, in step S21, the driving control unit 304 sends the driving amount control data CDn obtained by correcting the first control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (that is, the position of the substrate holder 4B) to each module. Just group MUn.

As described in detail above, according to the present embodiment, the exposure apparatus EX includes a substrate holder 4B and a plurality of modules MU1 to MU27 each including generation and drawing data MDn (n=1 to 27 ) corresponding to the pattern DMD10, a plurality of illumination units ILU for respectively irradiating illumination light to DMD10, and a plurality of projection units PLU for projecting patterns respectively formed by DMD10 onto the substrate P mounted on the substrate holder 4B. The exposure apparatus EX further includes a drive control unit 304 that controls the module MU1 according to at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure apparatus EX without changing the drawing data MDn. The driving of DMD10 of ~MU27, the driving of projection unit PLU, and the driving of optical element OPE. When the drawing data MDn is rewritten to expose a predetermined pattern at a predetermined position on the substrate P according to at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure device EX, the drawing data MDn The rewriting takes time, and the throughput of the exposure apparatus EX decreases. Since the drive control unit 304 does not change the drawing data MDn, it controls the drive of the DMD10, the drive of the projection unit PLU, and the optical element OPE according to at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure device EX. Therefore, it is possible to suppress the decrease in the throughput of the exposure device EX, and to expose a predetermined pattern at a predetermined position of the substrate P. In addition, when the amount of misalignment is smaller than the minimum line width (minimum pixel size) of the pattern projected onto the substrate P, it is difficult to correct the misalignment by rewriting the drawing data. In this embodiment, the positional deviation is corrected by driving the DMD10, the driving of the projection unit PLU, and the driving of the optical element OPE, so even when the positional deviation is smaller than the minimum line width of the pattern projected onto the substrate P , can also correct the positional offset. Thereby, exposure precision improves.

Also, in this embodiment, the exposure apparatus EX is provided with: an alignment system ALG for measuring the state of the substrate P relative to the substrate holder 4B; Based on the measurement result of the ALG, the driving of at least one of the fine movement stage 10S of the DMD 10 , the optical system of the projection unit PLU, and the optical element OPE is controlled in such a way that the pattern is projected to a predetermined position of the substrate P. Furthermore, the drive control unit 304 controls the drive of the micro-motion stage 10S of the DMD 10 , the drive of the optical system of the projection unit PLU, and the drive of the optical element OPE according to the first control data. Thereby, the position deviation of the substrate P relative to the designed position can be corrected, and patterns can be exposed on the substrate P without reducing the yield. Moreover, even when the amount of misalignment is smaller than the minimum line width of the pattern projected onto the substrate P, the misalignment can be corrected.

Also, in this embodiment, the exposure apparatus EX is provided with a correction data creation unit 302. The correction data creation unit 302 creates correction data for correcting the first control data based on the calibration result. The second control data obtained by correcting the control data controls the driving of the micro-motion stage 10S of the DMD 10 , the driving of the optical system of the projection unit PLU, and the driving of the optical element OPE. Thereby, the positional displacement of each structure of the exposure apparatus EX can be corrected, and a pattern can be exposed on the board|substrate P, without reducing throughput. Moreover, even when the amount of misalignment of each component of the exposure apparatus EX is smaller than the minimum line width of the pattern projected onto the substrate P, the misalignment can be corrected.

In addition, in this embodiment, the exposure apparatus EX includes interferometers IFY1 to IFY4 that measure the position information of the substrate holder 4B relative to the platen 3 or the optical platen 5, and the drive control unit 304 based on the The position information of the substrate holder 4B measured by the interferometers IFY1~IFY4 controls the driving of the micro-motion stage 10S of the DMD10 of each module MUn according to the driving amount control data CDn (n=1~27) after the second control data is corrected , The drive of the optical system of the projection unit PLU, and the drive of the optical element OPE. Thereby, even when the substrate holder 4B does not move as designed during the scanning exposure period, a predetermined pattern can be exposed at the designed position on the substrate P without lowering the yield. Moreover, even when the amount of misalignment of the substrate holder 4B is smaller than the minimum line width of the pattern projected onto the substrate P, the misalignment can be corrected.

(modified example) The exposure apparatus EX of the said embodiment can also be used for exposing other patterns to the board|substrate P which exposed the predetermined pattern.

In the manufacture of a flat panel display, after exposing the first pattern on the substrate P, there is a case where a second pattern different from the first pattern is exposed. For example, the first pattern is exposed on the substrate P by the exposure apparatus using the mask substrate for the first time, and the second pattern is exposed on the substrate P by the exposure apparatus EX of this embodiment for the second time.

FIG. 10 is a diagram showing how patterns for four display panels are exposed on one substrate P. As shown in FIG. In the example of FIG. 10 , the patterns of four display panels PNL1 to PNL4 are exposed on one substrate P by the first exposure process. In FIG. 10 , the hatched portion represents the region exposed by the first exposure process, and the black circle in each region represents the alignment mark AM. In addition, in FIG. 10 , the dotted line indicates the cutting line for separating each panel, and the dot chain line indicates the position where the display panel PNL2 and its alignment mark AM should be exposed by the first exposure process.

In the example of FIG. 10, compared with other display panels PNL1, PNL3, PNL4, the pattern of the display panel PNL2 is shifted and exposed largely from a design position. In this case, if the drawing data of the second exposure process is rewritten so as to overlap the exposed area of the first exposure process of the display panel PNL2, the rewriting of the drawing data will take a long time and the yield will decrease.

In this case, according to the exposure apparatus EX of the said embodiment, it can expose a 2nd pattern so that it may overlap with the exposed area|region of the 1st pattern of the display panel PNL2 as follows.

Firstly, the positions of the regions of the first patterns that are actually exposed to the display panels PNL1 - PNL4 are measured by the alignment system ALG. Based on the measurement result of the alignment system ALG, the control data creation unit 301 creates the first control data so as to correct the deviation of the exposed area of the first pattern of the display panel PNL2 from the design position. The drive control unit 304 controls the drive of the micro-movement stage 10S of the DMD10 of the modules MU1-MU27 and the optical system of the projection unit PLU according to the first control data, so that the display panel PNL2 with the first pattern can be exposed for the deviation from the design position. , exposing the second pattern on the exposed area of the first pattern.

That is, in the modified example, it can also be considered that the first control data corresponding to the position shift of the exposed area relative to the designed position is created for each area of the display panels PNL1 to PNL4.

As mentioned above, when exposing a substrate P on which a plurality of first patterns have been exposed, the second pattern must overlap the exposed area of the first pattern, even if the exposed area of the first pattern is from the designed position Offset, in the exposure device EX of this embodiment, the second pattern can be superimposed on the exposed area of the first pattern for exposure without reducing the throughput.

Furthermore, at this time, in order to cause the image displacement to occur in the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2, it is preferable to slightly move the DMD10 compared to the end of the exposure of the pattern from the display panel PNL1. The state of the stage 10S, the state of the optical system of the projection unit PLU, and the state of the optical element OPE are changed to the time required for exposing the display panel PNL2, and the time setting for moving the substrate holder 4B to the distance D1 is longer. Here, the state of the fine movement stage 10S refers to the relative position information of the DMD 10 with respect to the substrate holder 4B, the XY stage 4A, the optical plate 5 or the plate 3 or the inclination angle in the θz axis direction. Also, the state of the optical system of the projection unit PLU refers to the first lens group 116, the second lens group 118, and the respective lenses included in the first lens group 116 and the second lens group 118 relative to the substrate holder 4B and the XY stage. 4A. The relative position information of the optical fixed plate 5 or the fixed plate 3, etc. Furthermore, the state of the optical element OPE refers to relative position information of the optical element OPE with respect to the substrate holder 4B, the XY stage 4A, the optical platen 5 or the platen 3 , and the like. Also, if the optical element OPE is a pair of declination angles, the interval between a pair of declination angles or the rotation angle of each declination angle are also included in the state of the optical element OPE. Also, if the optical element OPE is a pair of parallel plates, the distance between the pair of parallel plates or the rotation angle of each parallel plate is also included in the state of the optical element OPE. Therefore, the exposure apparatus EX of the said embodiment can expose display panel PNL1 and display panel PNL2 by one scanning exposure. In addition, when the exposure device EX is exposed by one scanning exposure, after exposing the exposure area of the display panel PNL1, it moves the DMD 10 at the end of the exposure of the pattern of the display panel PNL1 while advancing the distance D1. At least one of the state of the stage 10S, the state of the optical system of the projection unit PLU, and the state of the optical element OPE is changed to a state for exposing the display panel PNL2 to expose the exposure area of the display panel PNL2.

The exposure control device 300 (drive control unit 304 ) included in the exposure device EX moves the XY stage 4A along the scanning direction (X-axis direction), and after exposing the exposure area of the display panel PNL1 on the substrate P, the display panel PNL2 The exposure area of the display panel PNL1 is exposed, and the setting of the exposure device EX is changed while the projection optical system advances over the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2.

The exposure control device 300 (drive control unit 304 ) included in the exposure device EX changes the setting of the exposure device EX by controlling the fine movement stage 10S of the DMD 10 or the drive of the projection optical system.

In addition, the control section included in the exposure apparatus EX drives the XY stage 4A, the fine movement stage driving section 10D for changing at least one of the position and posture of the spatial light modulator 10, and the first stage provided in the projection optical system. The lens group 116, the second lens group 118, and the driving part of the optical element OPE are controlled so that the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2 arranged on the substrate P along the scanning direction (X-axis direction) are relatively projected. The optical axis of the optical system drives the XY stage 4A so that it moves to the same side in the scanning direction (X-axis direction), and displays the exposure area and display panel PNL1 on the substrate P moving along the scanning direction (X-axis direction). The area (distance D) between the exposure areas of the panel PNL2 crosses the above-mentioned optical axis to drive the micro-motion stage driving part 10D and drive at least one of the driving parts of the first lens group 116, the second lens group 118, and the optical element OPE By.

If the distance D1 is set in the above manner, there is no need to wait for the state of the fine movement stage 10S of the DMD 10, the state of the optical system of the projection unit PLU, and the state of the optical element OPE to become the state for exposing the display panel PNL2, and continue Exposure processing is performed, so yield can be improved.

Furthermore, for example, the position deviation of the exposed area relative to the design value caused by the first exposure process of the display panel PNL2 is even if the micro-motion stage 10S of the DMD10, the optical system of the projection unit PLU, and the optical element OPE are used When the projection position of the pattern deviates by an amount that cannot be corrected, the exposure process may not be started, but the information is displayed on the display device of the exposure device EX, and the operator of the exposure device EX can choose whether to continue the exposure process. Alternatively, a warning may be output from the exposure device EX. Alternatively, the operator can choose whether to continue the exposure process, whether to suspend the exposure process, or whether to expose patterns known to be defective on the substrate P.

In addition, the exposure result (exposure shape) of the first exposure process of the display panel PNL1 is not a quadrilateral of PNL1 as shown in Figure 10, but a barrel shape as shown in Figure 11(A) or a roll as shown in Figure 11(B) In the case of a bobbin shape. In such a case, when exposing the display panel PNL1 for the second time, it is necessary to perform exposure while performing an image shift at each position of the display panel PNL1. Therefore, based on the measurement result of the alignment mark AM of the display panel PNL1 obtained by the alignment system ALG, the fine movement stage 10S of the DMD10, the optical system and the optical elements of the projection unit PLU are driven in real time during the exposure process of the display panel PNL1 OPE. Thereby, the projection position of a pattern can be corrected at each position of the display panel PNL1. In addition, the shape of the display panel PNL1 is not limited thereto, and the right side of the PNL1 is in the shape of a barrel and the left side of the PNL1 is in the shape of a bobbin as shown in FIG. 11(C) . Furthermore, such an exposure result is not limited to PNL1, and the same exposure result may be obtained also in PLN2-4.

Moreover, the exposure apparatus EX of said embodiment can expose display panel PNL1 and display panel PNL3 by one scanning exposure. In order to simultaneously expose the display panel PNL1 and the display panel PNL3, the alignment system ALG performs two measurements of the alignment mark AM of the display panel PNL1 (first measurement) and the measurement of the alignment mark AM of the display panel PNL3 (second measurement). Alignment measurement of display panels PNL1 and PLN3. By performing the first measurement, the exposure result of the display panel PNL1 can be measured, and by performing the second measurement, the exposure result of the display panel PNL3 can be measured. Moreover, the exposure apparatus EX of said embodiment can expose display panel PNL1 and display panel PNL2 by one scanning exposure. The distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2 can be set to be greater than the exposure field of view of the exposure module. In addition, when there is no problem with the accuracy, the distance D1 can also be set to be smaller than the exposure field of view of the exposure module.

Furthermore, in exposure module group MU (A), PNL3 is exposed using modules MU1-MU4, and PNL1 is exposed using modules MU5-MU9. At this time, during the process of exposing the display panel PNL3, the modules MU1-MU4 drive the micro-motion stage 10S of the DMD10, the optical system and the optical element OPE of the projection unit PLU in real time according to the measurement results of the second measurement, and correct the projection of the pattern. exposure on one side of the position. During the process of exposing the display panel PNL1, the modules MU5-MU9 drive the fine movement stage 10S of the DMD10, the optical system and the optical element OPE of the projection unit PLU in real time according to the measurement results of the first measurement, and correct the projection position of the pattern while correcting exposure. Thereby, it is possible to perform exposure while correcting a plurality of panels PNL1 and PLN3 by one scanning exposure.

Here, it is assumed that the modules MU1 to MU4 expose the display panel PNL3, and the modules MU5 to MU9 expose the display panel PNL1, but they can be appropriately set. Moreover, the exposure module group MU(B) and the exposure module group MU(C) are also the same as the exposure module group MU(A).

Also, for example, the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2 is relatively short, and there is no time to drive the micro-motion stage 10S of the DMD10 and the projection unit PLU during the movement distance D1 of the substrate holder 4B. When the optical system is driven or the optical element OPE is driven, the information can also be displayed on the display device of the exposure device EX, and the operator of the exposure device EX can choose whether to continue the exposure process. Alternatively, the operator can choose whether to continue the exposure process, whether to suspend the exposure process, or whether to expose patterns known to be defective on the substrate P.

Furthermore, in the above-mentioned embodiments and modifications, the drive control unit 304 controls the drive of the fine movement stage 10S of the DMD 10 , the drive of the optical system of the projection unit PLU, and the drive of the optical element OPE, but the present invention is not limited thereto. The drive control unit 304 may control the drive of any one of the fine movement stage 10S of the DMD 10 , the optical system of the projection unit PLU, and the optical element OPE. Furthermore, when the alignment system ALG, calibration, and the position deviation measured by the interferometers IFY1~IFY4 exceed the predetermined amount determined by the operator in advance, it can be determined in advance whether to expose, whether to continue exposing, whether to re-align, etc. Formulation information (exposure conditions).

In addition, in the above embodiment, the drive control unit 304 corrects the first control data or the second control data based on the measurement results of the interferometers IFY1-IFY4, but may not perform correction based on the measurement results of the interferometers IFY1-IFY4. In this case, the drive control unit 304 may control the drive of the fine movement stage 10S of the DMD 10 , the drive of the optical system of the projection unit PLU, and the drive of the optical element OPE according to the first control data or the second control data.

The foregoing embodiments are preferred embodiments of the present invention. However, it is not limited to this, and various deformation|transformation can be implemented in the range which does not deviate from the gist of this invention.

1a, 1b, 1c: active anti-vibration unit 2: base 3:Fixed 4A: XY stage 4B: Substrate holder (first moving body) 5: Optical fixed plate 6a, 6b, 6c: main column 10: DMD 10a: Micromirror 10D: Micro-motion stage driving part (second driving part) 10M: Assembly Department 10S: micro-motion stage (second moving body) 60: Alignment device 60a: Fiducial mark 60e: Two-dimensional photography components 100, 102: reflector 104: Input lens system 106: Illumination adjustment filter 108: Optical integrator 108A: MFE lens 110: Concentrating lens system 112: Tilting mirror 114: Movable baffle 116: the first lens group 117: light absorber 118: Second lens group 300: exposure control device 301: Control Data Production Department 302: Correction data production department 304: Drive control department 306: Exposure Control Department 310: Depict data memory department 600a, 600b: declination angle 601a, 601b: parallel plates ALG: alignment system AM: Alignment Mark AXa~AXc: optical axis CD1～CD27: driving quantity control data CU: Reference Unit for Calibration EX: Exposure device FB18: Fiber Optic Bundle FBU: Fiber Optic Unit IA1~IAn: projection area IFX, IFY1～IFY4: Interferometer (measurement department) ILm: illumination light ILU: Lighting Unit k1～k3: line MU(A), MU(B), MU(C): exposure module group MU1～MU27: module OLa, OLb, OLc: relay unit OPE: optical element P: Substrate PLf': circular image field PLU: projection unit PNL1～PNL4: display panel XL1, XL2: Distance

[FIG. 1] It is a perspective view which shows the outline of the external appearance structure of the exposure apparatus which concerns on one embodiment. [Fig. 2] is a diagram showing an arrangement example of the projection area of the DMD projected onto the substrate by the respective projection units of a plurality of exposure modules. [FIG. 3] It is a figure explaining the joint exposure state of each of the 4 projection areas specified in FIG. 2. [FIG. [Fig. 4] It is an optical configuration diagram of the specific composition of two exposure modules arranged along the X direction (scanning exposure direction) observed in the XZ plane. [Fig. 5(A)] is a diagram schematically showing the DMD, Fig. 5(B) is a diagram showing the DMD when the power is turned off, and Fig. 5(C) is used to explain the reflector in the open state Fig. 5(D) is a diagram for explaining the mirror in the closed state. [FIG. 6(A)] and [FIG. 6(B)) are diagrams for explaining optical elements provided between the DMD and the first lens group of the projection unit. [ Fig. 7] Fig. 7 is a diagram showing a schematic configuration of an alignment device provided on a calibration reference portion attached to an end portion of a substrate holder of an exposure apparatus. [ Fig. 8 ] is a functional block diagram showing the functional configuration of the exposure control device. [FIG. 9] It is a flow chart which shows the outline|summary of the procedure at the time of performing exposure processing to a board|substrate. [FIG. 10] It is a figure which shows the state of exposing the pattern of 4 display panels on 1 board|substrate. [ FIGS. 11(A) to 11(C)] are diagrams showing examples of exposure results of the first exposure process of the display panel.

300: exposure control device

301: Control Data Production Department

302: Correction data production department

304: Drive control department

306: Exposure Control Department

310: Depict data memory department

ALG: alignment system

CD1~CD27: driving volume control data

IFY1~IFY4: Interferometer (measurement department)

MD1~MD27: depict data

MU1~MU3, MU26, MU27: modules

Claims (16)

An exposure device for exposing an object with patterned light generated by a spatial light modulator corresponding to drawing data, comprising: The illumination optics system irradiates illumination light to the above-mentioned spatial light modulator; a projection optics system for projecting the above-mentioned pattern light onto the above-mentioned object; The first moving body is arranged below the above-mentioned projection optical system, and holds the above-mentioned object; a first drive unit for moving the first moving body in a first direction and a second direction orthogonal to each other in a predetermined plane perpendicular to the optical axis of the projection optical system; The second mobile body holds the above-mentioned spatial light modulator; a second drive unit for moving the second moving body; The measurement unit obtains a measurement result including at least one of the position information of the object and the position information of the first moving body; and The control unit controls at least one of driving of the second movable body and adjustment of the projection optical system based on the measurement result obtained by the measurement unit, thereby controlling the exposure position of the pattern light. The exposure device according to claim 1, wherein the projection optical system has a pair of optical elements, The control unit controls driving of the pair of optical elements based on the measurement result. The exposure device according to claim 1 or 2, wherein the projection optical system has a first lens group and a second lens group, The control unit adjusts at least one of the first lens group and the second lens group. The exposure device according to claim 1 or 2, wherein the projection optical system has a first lens group and a second lens group, The control unit drives at least one of the first lens group or the second lens group along the optical axis direction. The exposure device according to claim 2, wherein the above-mentioned pair of optical elements has a first deflection angle and a second deflection angle, The control unit adjusts the distance between the first deflection angle and the second deflection angle to control the exposure position of the pattern light. The exposure device according to claim 2, wherein the pair of optical elements has a first parallel plate and a second parallel plate, The control unit moves or rotates at least one of the first parallel plate and the second parallel plate to control the exposure position of the pattern light. The exposure apparatus according to any one of claims 1 to 6, which has a plurality of module units, and the module unit has the above-mentioned illumination optical system, the above-mentioned projection optical system, the above-mentioned spatial light modulator, the above-mentioned second moving body, And the above-mentioned second drive unit. The exposure device according to claim 1, wherein the above-mentioned object has a first area and a second area, and the first area and the second area have an exposed first pattern on the above-mentioned object, The above-mentioned drawing data is data for forming a second pattern different from the above-mentioned first pattern in the above-mentioned first region and the above-mentioned second region, The measuring unit measures: the first information is the relative position information of the first area relative to the first moving body; and the second information is the relative position information of the second area relative to the first moving body, Equipped with a first production department for producing first control data, the first control data is based on the above-mentioned first information and the above-mentioned second information, and controls the above-mentioned second At least one of driving the moving body and adjusting the projection optical system when exposing the second pattern to the first region and the second region. The exposure device according to claim 8, wherein the first region and the second region are arranged at a distance from each other in the first direction of the object, In order for the control unit to change the state of the second moving body from the state of the second moving body at the end of the exposure of the first area to the start of the exposure of the second area while moving the distance between the first area and the second area In order to change the state of the projection optical system from the state of the projection optical system at the end of the exposure of the first region to the state of the projection optical system at the start of the exposure of the second region Control the adjustment of the above-mentioned projection optical system according to the state. The exposure device according to claim 8 or 9, wherein the above-mentioned first pattern is a pattern after exposure using a photomask substrate. A device manufacturing method using an exposure device comprising: an illumination optical system for irradiating illumination light to a spatial light modulator; and a projection optical system having a pattern to be generated by the above-mentioned spatial light modulator The light is projected onto the optical element mounted on the object of the first moving body, The manufacturing method of the component includes: A step of obtaining a measurement result including at least one of the position information of the object and the position information of the first moving body by the measurement unit; and A step of controlling at least one of driving of the second moving body holding the spatial light modulator or adjustment of the projection optical system by the control unit based on the measurement result obtained by the measurement unit. An exposure device for exposing a second pattern light generated by a spatial light modulator to an object having a first region exposed to a first pattern, comprising: The illumination optics system irradiates illumination light to the above-mentioned spatial light modulator; a projection optics system for projecting the above-mentioned second pattern light onto the above-mentioned object; The first moving body is arranged below the above-mentioned projection optical system, and holds the above-mentioned object; a first drive unit for moving the first moving body in a direction perpendicular to the optical axis of the projection optical system; The second mobile body holds the above-mentioned spatial light modulator; a second drive unit for moving the second moving body; a measurement unit, which measures the exposure result of the first pattern in the first region and obtains the measurement result; and The control unit controls at least one of driving of the second moving body and adjustment of the projection optical system based on the measurement result, and controls an exposure position of the second pattern light during exposure of the first region. An exposure device for exposing a second pattern light generated by a spatial light modulator on an object having a first region exposed with a first pattern and a second region, comprising: The illumination optics system irradiates illumination light to the above-mentioned spatial light modulator; a projection optics system for projecting the above-mentioned second pattern light onto the above-mentioned object; The first moving body is arranged below the above-mentioned projection optical system, and holds the above-mentioned object; a first drive unit for moving the first moving body in a direction perpendicular to the optical axis of the projection optical system; The second mobile body holds the above-mentioned spatial light modulator; a second drive unit for moving the second moving body; a measurement unit that obtains a first measurement result obtained by measuring the exposure result of the first pattern in the first region and a second measurement result obtained by measuring the exposure result of the first pattern in the second region; and The control unit controls at least one of the driving of the second moving body and the adjustment of the projection optical system based on the first measurement result and the second measurement result, before exposing the first area and the second area. During the process, the exposure position of the above-mentioned second pattern light is controlled. The exposure device according to claim 13, wherein the first moving body moves in a first direction perpendicular to the optical axis during exposure, The first region and the second region are arranged along the first direction. An exposure device, comprising: The stage moves the exposed object along the scanning direction; Spatial light modulator; The lighting optics system illuminates the above-mentioned spatial light modulator; a projection optics system that irradiates the light reflected by the reflector of the spatial light modulator to the above-mentioned exposure object; and Control Department, The control unit moves the stage along the scanning direction, exposes the first area of the exposure target, then exposes the second area, and advances the distance between the first area and the second area in the projection optical system. Change the setting of the above exposure device during the period. An exposure device that scans and exposes the above-mentioned substrate by light passing through a spatial light modulator while moving the substrate along the scanning direction, and has: a stage that holds the above-mentioned substrate and moves along the above-mentioned scanning direction, The first drive unit changes at least one of the position and posture of the above-mentioned spatial light modulator; The projection optics system projects the light passing through the above-mentioned spatial light modulator onto the above-mentioned substrate; the second driving unit is installed in the above-mentioned projection optical system, and drives the optical element; and a control unit that controls the stage, the first drive unit, and the second drive unit, The control unit drives the stage so that the first region and the second region arranged along the scanning direction on the substrate move to the same side of the scanning direction with respect to the optical axis of the projection optical system, and On the substrate moving in the scanning direction, at least one of the first drive unit and the second drive unit is driven in a state where the region between the first region and the second region crosses the optical axis.

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