KR20240014514A - Exposure apparatus and device manufacturing method - Google Patents

Abstract

In order to improve the throughput of the exposure device, an exposure device that exposes an object to patterned light generated by a spatial light modulator according to drawing data, comprising: an illumination optical system that irradiates illumination light to the spatial light modulator; and the pattern to the object. A projection optical system that projects light, a first moving body disposed below the projection optical system and holding the object, and a first direction and a second direction orthogonal to each other within a predetermined plane orthogonal to the optical axis of the projection optical system. A first driving unit that moves the first mobile body, a second mobile body that maintains the spatial light modulator, a second driving unit that moves the second mobile body, position information of the object, and position information of the first mobile body. a measuring unit that obtains at least one of the following as a measurement result, and a control unit that controls at least one of driving the second moving body and adjusting the projection optical system based on the measurement result obtained by the measuring unit to control the exposure position of the pattern light. is provided.

Description

Exposure apparatus and device manufacturing method

It relates to an exposure apparatus and a device manufacturing method.

Conventionally, in the lithography process for manufacturing electronic devices (micro devices) such as liquid crystal or organic EL display panels and semiconductor elements (integrated circuits, etc.), a step-and-repeat projection exposure device (so-called stepper), or step ·And-scan type projection exposure devices (so-called scanning steppers (also called scanners)) are used. This type of exposure apparatus projects and exposes a mask pattern for an electronic device onto a photosensitive layer applied to the surface of a substrate to be exposed (hereinafter simply referred to as a substrate) such as a glass substrate, semiconductor wafer, printed wiring board, or resin film. there is.

Since the production of a mask substrate that fixedly forms the mask pattern requires time and expense, a space such as a digital mirror device (DMD) in which a large number of micromirrors with small displacements are regularly arranged is used instead of the mask substrate. An exposure apparatus using a light modulation element (variable mask pattern generator) is known (for example, see Patent Document 1). In the exposure apparatus disclosed in Patent Document 1, for example, illumination light obtained by mixing light from a laser diode (LD) with a wavelength of 375 nm and light from an LD with a wavelength of 405 nm into a multi-mode fiber bundle is applied to a digital mirror device. (DMD), and the reflected light from each of the plurality of tilt-controlled micromirrors is projected and exposed onto the substrate via an imaging optical system and a microlens array.

There is a demand for improvement in throughput of exposure equipment.

Japanese Patent Publication No. 2019-23748

According to the disclosed aspect, the exposure apparatus is an exposure apparatus that exposes an object to pattern light generated by a spatial light modulator according to drawing data, comprising an illumination optical system that irradiates illumination light to the spatial light modulator, and the pattern light to the object. A projection optical system that projects light, a first moving body disposed below the projection optical system and holding the object, and a first direction and a second direction orthogonal to each other within a predetermined plane orthogonal to the optical axis of the projection optical system. A first driving unit that moves the first mobile body, a second mobile body that maintains the spatial light modulator, a second driving unit that moves the second mobile body, position information of the object, and position information of the first mobile body. a measurement unit that measures a measurement result including at least one of the following, and controls at least one of driving the second moving body and adjusting the projection optical system based on the measurement result obtained by the measurement unit to adjust the exposure position of the pattern light. It is provided with a control unit that controls it.

In addition, the structure of the embodiment described later may be appropriately improved, or at least part of it may be replaced with another structure. In addition, the structural requirements for which there is no particular limitation on the arrangement are not limited to the arrangement disclosed in the embodiment and can be arranged in a position where the function can be achieved.

Fig. 1 is a perspective view showing an outline of the external configuration of an exposure apparatus according to an embodiment.
FIG. 2 is a diagram showing an example of the arrangement of a projection area of a DMD projected on a substrate by each projection unit of a plurality of exposure modules.
FIG. 3 is a diagram illustrating the state of continuous exposure in each of four specific projection areas in FIG. 2 .
Fig. 4 is an optical arrangement diagram showing the specific configuration of two exposure modules side by side in the X direction (scanning exposure direction) as seen within the XZ plane.
Figure 5(A) is a diagram schematically showing the DMD, Figure 5(B) is a diagram showing the DMD when the power is OFF, and Figure 5(C) is a diagram for explaining the mirror in the ON state. It is a drawing, and FIG. 5(D) is a drawing for explaining the mirror in the OFF state.
Figures 6(A) and 6(B) are diagrams explaining the optical element formed between the DMD and the first lens group of the projection unit.
FIG. 7 is a diagram showing a schematic configuration of an alignment device formed on a standard for calibration attached to an end portion of a substrate holder of an exposure apparatus.
Fig. 8 is a functional block diagram showing the functional configuration of the exposure control device.
Fig. 9 is a flowchart showing an outline of the procedure when performing exposure processing on a substrate.
Fig. 10 is a diagram showing a case where patterns of four display panels are exposed to one substrate.
11(A) to 11(C) are diagrams showing examples of exposure results from the first exposure process of the display panel.

A pattern exposure apparatus (hereinafter simply referred to as an exposure apparatus) according to one embodiment will be described with reference to the drawings.

[Overall configuration of exposure equipment]

Fig. 1 is a perspective view showing an outline of the external configuration of an exposure apparatus EX according to an embodiment. The exposure device EX is a device that projects exposure light, the intensity distribution of which is dynamically modulated in space, onto a substrate to be exposed by using a spatial light modulator (SLM: Spatial Light Modulator). Examples of spatial light modulators include liquid crystal devices, digital micromirror devices (DMD), and magneto optical spatial light modulators (MOSLM). The exposure apparatus EX according to this embodiment is provided with the DMD 10 as a spatial light modulator, but may be provided with another spatial light modulator.

In a specific embodiment, the exposure apparatus EX is a step-and-scan projection exposure apparatus (scanner) that uses a rectangular (square) glass substrate used in a display device (flat panel display) or the like as an exposure object. The glass substrate is a flat panel display substrate (P) having at least one side length or diagonal length of 500 mm or more and a thickness of 1 mm or less. The exposure device EX exposes a projected image of a pattern created by the DMD to a photosensitive layer (photoresist) formed to a constant thickness on the surface of the substrate P. The substrate P taken out from the exposure apparatus EX after exposure is sent to a predetermined process step (film formation process, etching process, plating process, etc.) after the development process.

The exposure apparatus EX includes a pedestal 2 mounted on an active dust isolation unit 1a, 1b, 1c, 1d (1d not shown), and a surface plate 3 mounted on the pedestal 2. ) and an XY stage 4A that can be moved in two dimensions on the surface plate 3, a first driving unit that moves the A laser measurement interferometer (hereinafter also simply referred to as an interferometer) that measures the two-dimensional moving positions of the substrate holder 4B (first moving body) and the substrate holder 4B (substrate P) (IFX, IFY1 to IFY4) It is provided with a stage device consisting of. Such a stage device is disclosed in, for example, US Patent Publication No. 2010/0018950 and US Patent Publication No. 2012/0057140.

In Fig. 1, the XY plane of the Cartesian coordinate system XYZ is set parallel to the flat surface of the surface 3 of the stage device, and the Additionally, in this embodiment, the direction parallel to the X axis of the coordinate system (XYZ) is set as the scanning movement direction of the substrate P (XY stage 4A) during scan exposure. The movement position of the substrate P in the are measured sequentially. The substrate holder 4B is configured to be slightly movable in the Z-axis direction perpendicular to the XY plane with respect to the Focus adjustment and leveling (parallelism) adjustment of the surface and the imaging plane of the projected pattern are actively performed. Additionally, the substrate holder 4B is configured to be capable of slight rotation (θz rotation) around an axis parallel to the Z axis in order to actively adjust the inclination of the substrate P in the XY plane.

The exposure apparatus EX further includes an optical surface 5 holding a plurality of exposure (drawing) module groups (MU(A), MU(B), MU(C)), and the optical surface 5 is mounted on a pedestal. It is provided with main columns 6a, 6b, 6c, 6d (6d not shown) supported from (2). Each of the plurality of exposure module groups (MU(A), MU(B), and MU(C)) is mounted on the +Z direction side of the optical surface plate 5. Each of the plurality of exposure module groups (MU(A), MU(B), MU(C)) is mounted on the +Z direction side of the optical surface plate 5, and illuminates the light from the optical fiber unit (FBU). It has an illumination unit (ILU) and a projection unit (PLU) mounted on the -Z direction side of the optical surface 5 and having an optical axis parallel to the Z axis. Additionally, each of the exposure module groups (MU(A), MU(B), and MU(C)) reflects the illumination light from the illumination unit (ILU) toward the -Z direction and makes the light incident on the projection unit (PLU). It is provided with a DMD (10) as a modulation unit. The detailed configuration of the exposure module by the illumination unit (ILU), DMD 10, and projection unit (PLU) will be described later.

A plurality of alignment systems (microscopes) (ALG) for detecting alignment marks formed at a plurality of predetermined positions on the substrate P are mounted on the -Z direction side of the optical surface 5 of the exposure apparatus EX. Additionally, a calibration reference unit (CU) for calibration is formed at an end in the -X direction on the substrate holder 4B. Calibration is the confirmation (correction) of the relative positional relationship within the Confirmation (correction) of the baseline error of each projection position of the pattern image projected from the projection unit (PLU) and the position of each detection field of the alignment system (ALG), and the position of the pattern image projected from the projection unit (PLU) Includes at least one of the following: or image quality verification. In addition, although some parts are not shown in FIG. 1, each of the exposure module groups (MU(A), MU(B), MU(C)) is, as an example, 9 modules spaced at regular intervals in the Y direction in this embodiment. Although they are side by side, the number of modules can be at least or more than 9. Moreover, in FIG. 1, three rows of exposure modules are arranged in the X-axis direction. However, the number of rows of exposure modules arranged in the

2 shows the projection area (IAn) of the DMD 10 projected onto the substrate P by each projection unit (PLU) of the exposure module group (MU(A), MU(B), MU(C)). ) is a diagram showing an example of arrangement, and the rectangular coordinate system XYZ is set the same as in FIG. 1. In this embodiment, the first row exposure module group (MU(A)), the second row exposure module group (MU(B)), and the third row exposure module group (MU(A)) are arranged spaced apart in the X direction (first direction). Each MU(C)) is composed of nine modules aligned in the Y direction (second direction). The exposure module group (MU(A)) consists of 9 modules (MU1 to MU9) arranged in the +Y direction, and the exposure module group (MU(B)) consists of 9 modules arranged in the -Y direction ( It is composed of MU10 to MU18), and the exposure module group (MU(C)) is composed of nine modules (MU19 to MU27) arranged in the +Y direction. The modules (MU1 to MU27) all have the same configuration, and when the exposure module group (MU(A)) and the exposure module group (MU(B)) are set to face each other in the X direction, the exposure module group (MU( B)) and the exposure module group (MU(C)) are in a back-to-back relationship with respect to the X direction.

In FIG. 2, the shape of the projection area (IA1, IA2, IA3, ..., IA27) (which can also be expressed as IAn with n set to 1 to 27) for each of the modules (MU1 to MU27) is, as an example, It has an aspect ratio of approximately 1:2 and is shaped like a rectangle extending in the Y direction. In this embodiment, with the scanning movement of the substrate P in the + Subsequent exposure is performed at each end in the +Y direction. Then, the areas on the substrate P that are not exposed in each of the first and second row projection areas (IA1 to IA18) are successively exposed to each of the third row projection areas (IA19 to IA27). Each center point of the first row projection areas (IA1 to IA9) is located on a line (k1) parallel to the Y axis, and each center point of the second row projection areas (IA10 to IA18) is located on a line (k1) parallel to the Y axis. k2), and the center point of each of the projection areas (IA19 to IA27) in the third row is located on the line (k3) parallel to the Y axis. The gap in the X direction between the line k1 and the line k2 is set to the distance XL1, and the gap in the

Here, the joint between the -Y direction end of the projection area IA9 and the +Y direction end of the projection area IA10 is OLa, and the -Y direction end of the projection area IA10 and the +Y direction end of the projection area IA27 are OLa. When the joint at the end of the direction is OLb, and the joint between the +Y direction end of the projection area IA8 and the -Y direction end of the projection area IA27 is OLc, the state of exposure of the joint is explained in Fig. 3. do. In Fig. 3, the Cartesian coordinate system XYZ is set the same as in Figs. 1 and 2, and the coordinate system It is set to be inclined by an angle θk with respect to the X and Y axes (lines (k1 to k3)) of the Cartesian coordinate system XYZ. That is, the entire DMD 10 is tilted by an angle θk within the XY plane so that the two-dimensional arrangement of the plurality of micromirrors of the DMD 10 becomes the coordinate system X'Y'.

The circular area including each of the projection areas IA8, IA9, IA10, IA27 (and the same for all other projection areas IAn) in FIG. 3 is the circular image field PLf' of the projection unit PLU. represents. In the joint OLa, the projection image of the micromirror is aligned obliquely (angle θk) at the -Y' direction end of the projection area IA9, and the projection image of the micromirror is obliquely aligned at the +Y' direction end of the projection area IA10. (Angle θk) is set so that the projected images of the aligned micromirrors overlap. Moreover, in the joint portion OLb, the projection image of the micromirror aligned obliquely (at an angle θk) at the -Y' direction end of the projection area IA10 and the +Y' direction end of the projection area IA27. The projected images of the micromirrors aligned obliquely (angle θk) are set to overlap. Similarly, in the joint OLc, the projection image of the micromirror aligned obliquely (angle θk) at the +Y' direction end of the projection area IA8 and the -Y' direction end of the projection area IA27. The projected images of the micromirrors aligned obliquely (angle θk) are set to overlap.

[Configuration of lighting unit]

FIG. 4 shows the specific configuration of the module MU18 in the exposure module group (MU(B)) and the module MU19 in the exposure module group (MU(C)) shown in FIGS. 1 and 2 as viewed in the XZ plane. This is an optical layout. The orthogonal coordinate system XYZ in FIG. 4 is set to be the same as the orthogonal coordinate system XYZ in FIGS. 1 to 3. In addition, as is clear from the arrangement of each module in the It is done. Since each optical member in module MU18 and each optical member in module MU19 are each identically constructed from the same material, the optical configuration of module MU18 will mainly be described in detail here. Additionally, the optical fiber unit (FBU) shown in FIG. 1 is composed of 27 optical fiber bundles (FB1 to FB27), corresponding to each of the 27 modules (MU1 to MU27) shown in FIG. 2.

The illumination unit (ILU) of the module (MU18) includes a mirror (100) that reflects the illumination light (ILm) traveling in the -Z direction from the exit end of the optical fiber bundle (FB18), and illuminates the illumination light (ILm) from the mirror 100. -A mirror reflecting in the Z direction (102), an input lens system (104) acting as a collimator lens, an illumination adjustment filter (106), and an optical integrator (108) including a micro-fly-eye (MFE) lens or field lens. ), a condenser lens system 110, and an inclined mirror 112 that reflects the illumination light ILm from the condenser lens system 110 toward the DMD 10. The mirror 102, input lens system 104, optical integrator 108, condenser lens system 110, and tilt mirror 112 are arranged along the optical axis AXc parallel to the Z axis.

The optical fiber bundle FB18 is comprised of one optical fiber wire or a plurality of optical fiber wires bundled together. The illumination light ILm emitted from the exit end of the optical fiber bundle FB18 (each optical fiber line) is set to the numerical aperture (NA, also called diffusion angle) that is incident without being reflected by the input lens system 104 at the rear end. The position of the front focus of the input lens system 104 is set to be the same as the position of the exit end of the optical fiber bundle FB18 in design. In addition, the position of the rear focus of the input lens system 104 is such that the illumination light ILm from a single or plural point light source formed at the exit end of the optical fiber bundle FB18 is adjusted to the MFE lens 108A of the optical integrator 108. ) is set to overlap on the incident surface side. Accordingly, the entrance surface of the MFE lens 108A is Köhler illuminated by the illumination light ILm from the exit end of the optical fiber bundle FB18. Additionally, in the initial state, the geometric center point in the is assumed to be parallel (or coaxial) with the optical axis (AXc).

The illumination light ILm from the input lens system 104 has its illuminance attenuated to an arbitrary value in the range of 0% to 90% by the illuminance adjustment filter 106, and then is output to the optical integrator 108 (MFE lens 108A, field lens, etc.) and enters the condenser lens system 110. The MFE lens 108A is a two-dimensional arrangement of a large number of rectangular microlenses measuring several tens of micrometers in length and width, and its overall shape is the shape of the entire mirror surface of the DMD 10 in the XY plane (aspect ratio is approximately 1). : It is set to be almost similar to 2). Additionally, the position of the front focus of the condenser lens system 110 is set to be substantially the same as the position of the exit surface of the MFE lens 108A. Therefore, each of the illumination light from the point light source formed on each emission side of the plurality of micro lenses of the MFE lens 108A is converted into a substantially parallel light beam by the condenser lens system 110, and is transmitted to the oblique mirror 112. After reflection, it overlaps on the DMD (10) to create a uniform illuminance distribution. On the exit surface of the MFE lens 108A, a surface light source in which a large number of point light sources (light condensing points) are densely arranged two-dimensionally is created, thereby functioning as a surface light source member.

In the module MU18 shown in FIG. 4, the optical axis AXc parallel to the Z axis passing through the condenser lens system 110 is bent at the inclined mirror 112 and reaches the DMD 10, where the inclined mirror 112 The optical axis between and DMD (10) is referred to as the optical axis (AXb). In this embodiment, the neutral plane including the center point of each of the plurality of micromirrors of the DMD 10 is set parallel to the XY plane. Therefore, the angle formed by the normal line of the neutral plane (parallel to the Z axis) and the optical axis AXb becomes the incident angle θα of the illumination light ILm with respect to the DMD 10. The DMD 10 can be mounted on the lower side of the mount portion 10M fixed to the support column of the lighting unit ILU. In the mount portion 10M, a parallel link mechanism as disclosed in International Patent Publication No. 2006/120927 and a stretchable piezo element are combined to fine-adjust the position and posture of the DMD 10. A fine moving stage (second moving body) 10S is formed. The fine movement stage 10S is movable in the Therefore, by moving the fine stage 10S in the XY direction or rotating θz, the DMD 10 can be moved in the XY direction or rotated θz. Additionally, by using a displacement sensor (not shown), feedback control can be performed on the amount of movement or rotation of the fine movement stage 10S.

[Configuration of DMD]

FIG. 5(A) is a diagram schematically showing the DMD 10, FIG. 5(B) is a diagram showing the DMD 10 when the power is OFF, and FIG. 5(C) is a diagram showing the DMD 10 in the ON state. This is a diagram for explaining the mirror, and FIG. 5(D) is a diagram for explaining the mirror in the OFF state. Additionally, in FIGS. 5(A) to 5(D), mirrors in the ON state are indicated by hatching.

The DMD 10 has a plurality of micromirrors 10a capable of controlling reflection angle changes. In this embodiment, the DMD 10 is of a roll & pitch drive type that switches the ON state and OFF state between the roll direction inclination and the pitch direction inclination of the micromirror 10a.

As shown in Fig. 5(B), when the power is turned off, the reflecting surface of each micromirror 10a is set parallel to the X'Y' plane. The array pitch of each micromirror 10a in the

Each micromirror 10a is turned ON by being tilted around the Y' axis. FIG. 5(C) shows a case where only the central micromirror 10a is in the ON state, and the other micromirrors 10a are in a neutral state (a state that is neither ON nor OFF). Additionally, each micromirror 10a is in an OFF state by being tilted around the X' axis. FIG. 5(D) shows a case where only the central micromirror 10a is in the OFF state and the other micromirrors 10a are in the neutral state. In addition, although not shown for simplification, the micromirror 10a in the ON state is tilted at a predetermined angle from the It is driven to tilt. Additionally, the micromirror 10a in the OFF state is driven to be inclined at a predetermined angle from the X'Y' plane so that the illumination light irradiated to the micromirror 10a in the ON state is reflected in the Y direction in the YZ plane. The DMD 10 generates an exposure pattern by switching the ON and OFF states of each micromirror 10a.

The illumination light reflected by the mirror in the OFF state is absorbed by a light absorber (not shown).

In addition, since the DMD 10 was explained as an example of a spatial light modulator, it was described as a reflective type that reflects laser light, but the spatial light modulator may be a transmissive type that transmits laser light, or a diffractive type that diffracts laser light. You can continue. A spatial light modulator can modulate laser light spatially and temporally.

Returning to FIG. 4, the illumination light ILm irradiated to the ON-state micromirror 10a among the micromirrors 10a of the DMD 10 is reflected in the X direction in the XZ plane toward the projection unit PLU. On the other hand, the illumination light ILm irradiated to the OFF-state micromirror 10a among the micromirrors 10a of the DMD 10 is reflected in the Y direction in the YZ plane so as not to be directed toward the projection unit PLU.

In the optical path between the DMD 10 and the projection unit (PLU), a movable shutter 114 is formed to be insertable and removable for shielding reflected light from the DMD 10 during the non-exposure period. The movable shutter 114 is rotated to an angular position away from the optical path during the exposure period, as shown on the module MU19 side, and is tilted diagonally in the optical path, as shown on the module MU18 side, during the non-exposure period. It is rotated to the angular position where it is inserted. A reflective surface is formed on the DMD 10 side of the movable shutter 114, and the light from the DMD 10 reflected there is irradiated to the light absorber 117. The light absorber 117 absorbs light energy in the ultraviolet wavelength range (wavelength of 400 nm or less) without re-reflecting it and converts it into heat energy. For this reason, a heat dissipation mechanism (heat dissipation fin or cooling mechanism) is also formed in the light absorber 117. In addition, although not shown in FIG. 4, the reflected light from the micromirror 10a of the DMD 10 that is turned OFF during the exposure period is between the DMD 10 and the projection unit PLU, as described above. It is absorbed by the same light absorber (not shown in FIG. 4) installed in the Y direction (direction perpendicular to the paper surface in FIG. 4) with respect to the optical path.

[Configuration of projection unit]

The projection unit (PLU) mounted on the lower side of the optical platform 5 has a double-sided telescopic camera consisting of a first lens group 116 and a second lens group 118 arranged along the optical axis AXa parallel to the Z axis. It is configured as a centric imaging projection lens system. The first lens group 116 and the second lens group 118 are each moved by a fine actuator in a direction along the Z axis (optical axis AXa) with respect to a support column fixedly formed on the lower side of the optical surface 5. It is configured to move in translation. The projection magnification (Mp) of the imaging projection lens system by the first lens group 116 and the second lens group 118 is the array pitch (Pd) of the micromirrors on the DMD 10 and the projection area on the substrate P. It is determined by the relationship between the minimum line width (minimum pixel dimension) (Pg) of the pattern projected within (IAn (n = 1 to 27)).

As an example, when the required minimum line width (minimum pixel dimension) (Pg) is 1 ㎛ and the array pitches (Pdx and Pdy) of micromirrors are each 5.4 ㎛, the projection area (IAn) (DMD) described in FIG. 3 above (10)) The projection magnification Mp is set to about 1/6, taking into account the tilt angle θk in the XY plane. The image forming projection lens system using the lens groups 116 and 118 inverts/inverts the reduced image of the entire mirror surface of the DMD 10 and forms an image on the projection area IA18 (IAn) on the substrate P.

The first lens group 116 of the projection unit (PLU) can be slightly moved in the direction of the optical axis AXa by an actuator to fine-adjust the projection magnification (Mp) (about ±several tens ppm), and the second lens group ( 118) can be slightly moved in the direction of the optical axis (AXa) by an actuator for high-speed adjustment of focus. Additionally, in order to measure the change in position of the surface of the substrate P in the Z-axis direction with submicron precision, a plurality of oblique-incident light type focus sensors 120 are formed on the lower side of the optical surface 5. The plurality of focus sensors 120 change the position of the substrate P in the overall Z-axis direction and the Z-axis direction of partial areas on the substrate P corresponding to each of the projection areas IAn (n = 1 to 27). Measure the change in position or change in partial inclination of the substrate (P).

Additionally, in this embodiment, between the DMD 10 and the first lens group 116, there are two polarization prisms 600a and 600b as shown in FIG. 6(A) or as shown in FIG. 6(B). As shown, two parallel plates 601a and 601b are formed. Hereinafter, the two polarized prisms 600a and 600b and the two parallel plates 601a and 601b are referred to as optical elements (OPE) unless otherwise specified. In addition, in this embodiment, correcting positional misalignment is also referred to as image shifting. Additionally, in this embodiment, the optical element OPE is formed between the DMD 10 and the first lens group 116, but is not limited to this. The optical element OPE may be formed between the first lens group 116 and the second lens group, or between the projection unit PLU and the substrate P. Additionally, a projection optical system is comprised of a projection unit (PLU) and an optical element (OPE).

As explained in FIG. 3 above, the lighting unit (ILU) and projection unit (PLU) as described above need to have the projection area (IAn) tilted by an angle θk in the XY plane, so the DMD 10 in FIG. 4 and the illumination unit ILU (at least the optical path portion of the mirrors 102 to 112 along the optical axis AXc) are arranged to be inclined as a whole by an angle θk in the XY plane.

[Configuration of calibration reference unit (CU)]

FIG. 7 is a diagram showing the schematic configuration of the alignment device 60 formed on the reference unit CU for calibration attached to an end portion on the substrate holder 4B of the exposure apparatus EX. The alignment device 60 includes a reference mark 60a, a two-dimensional imaging element 60e, and the like. The alignment device 60 is used to measure and calibrate the positions of various modules, and is also used to calibrate the alignment system (ALG).

To measure the position of each module (MU1 to MU27), the DMD pattern for calibration is projected onto the reference mark 60a of the alignment device 60 using the projection unit (PLU), and the difference between the reference mark 60a and the DMD pattern is calculated. This is carried out by measuring relative positions.

Additionally, calibration of the alignment system ALG can be performed by measuring the reference mark 60a of the alignment device 60 in the alignment system ALG. That is, the position of the alignment system ALG can be obtained by measuring the reference mark 60a of the alignment device 60 in the alignment system ALG. Additionally, using the reference mark 60a, it becomes possible to obtain the relative positions of the alignment system ALG and the modules MU1 to MU27.

Additionally, the alignment system ALG can measure the position of the alignment mark on the substrate P placed on the substrate holder 4B based on the reference mark 60a of the alignment device 60.

[Configuration of exposure control device]

Various processes, including scanning exposure processing, performed in the exposure apparatus EX having the above configuration are controlled by the exposure control device 300. FIG. 8 is a functional block diagram showing the functional configuration of the exposure control device 300 included in the exposure device EX according to the present embodiment.

The exposure control device 300 includes a drawing data storage unit 310, a control data creation unit 301, a correction data creation unit 302, a drive control unit 304, and an exposure control unit 306. .

In the drawing data storage unit 310, drawing data for a display panel pattern to be exposed in each of a plurality of modules MUn (n = 1 to 27) is stored. The drawing data storage unit 310 transmits drawing data (MD1 to MD27) for pattern exposure to the DMDs 10 of each of the 27 modules (MU1 to MU27) shown in FIG. 2 . The module MUn (n = 1 to 27) selectively drives the micromirror 10a of the DMD 10 based on the drawing data MDn to generate a pattern corresponding to the drawing data MDn, and (P) Projection exposure is performed. That is, the drawing data is data that switches the ON state and OFF state of each micromirror 10a of the DMD 10.

The control data creation unit 301 creates first control data based on the alignment measurement result of the substrate P by the alignment system ALG and outputs it to the drive control unit 304 . The first control data is for driving the fine movement stage 10S of the DMD 10 provided in each module MUn (n = 1 to 27) to correct the positional misalignment of the substrate P based on the alignment measurement results. and data for controlling the driving of the optical system (first lens group 116 and second lens group 118) of the projection unit (PLU) and the driving of the optical element (OPE).

More specifically, when driving the fine stage 10S of the DMD 10, the driving amount of the fine stage 10S of each module MU1 to MU27 is defined based on the first control data. The fine stage 10S driven by the fine stage drive unit 10D is moved in the X direction or Y direction, or rotated in the θz direction. As a result, the projection image projected on the substrate P can be phase-shifted.

Additionally, when adjusting the optical system of the projection unit (PLU), the driving amount of the projection unit (PLU) of each module (MU1 to MU27) or the adjustment amount of the lens within the projection unit (PLU) is defined based on the first control data. do. When driving the projection unit (PLU), the projection unit (PLU) operates at least one lens group of the first lens group 116 or the second lens group 118 by an actuator provided in the projection unit (PLU). Move within the XY plane. As a result, the projection image projected on the substrate P can be phase-shifted. In addition, from the viewpoint of aberration, the projection unit (PLU) equalizes the movement amount of the first lens group 116 and the second lens group 118, so that the first lens group 116 and the second lens group 118 It is more desirable to move . When adjusting the lens in the projection unit (PLU), an actuator provided in the first lens group 116 and the second lens group 118, etc. forms in the first lens group 116 or the second lens group 118. At least one lens is moved within the XY plane. As a result, the projection image projected on the substrate P can be phase-shifted.

Additionally, when driving the two polarization prisms 600a and 600b formed between the DMD 10 of each module (MU1 to MU27) and the first lens group 116, the two polarization prisms 600a and 600b are driven based on the first control data. Define the driving amount of (600a, 600b). By controlling the spacing between the two declination prisms, the projection image projected on the substrate P can be phase-shifted. In addition, the two declination prisms 600a and 600b are not only between the DMD 10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 116 and the second lens group 118. It can also be formed between the lens group 118 and the substrate P.

Additionally, when driving the two parallel plates 601a and 601b formed between the DMD 10 of each module (MU1 to MU27) and the first lens group 116, the two parallel plates 601a and 601b are driven based on the first control data. Define the driving amount of (601a, 601b). By controlling the rotation amount by which the two parallel plates 601a and 601b are rotated by θz, the projection image projected on the substrate P can be phase-shifted. The two parallel plates 601a and 601b are not only between the DMD 10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 118. It can also be formed between (118) and the substrate (P).

Here, the reason for creating the first control data will be explained. For example, let's say that the substrate P is placed on the substrate holder 4B at a position deviated from the designed position. In this case, if scanning exposure is performed as is, the pattern generated based on the drawing data MDn will deviate from the designed position and be exposed to the substrate P. This is a method of exposing a pattern at a predetermined position (design position) of the substrate P placed with the position misaligned in this way, for example, based on the results of alignment measurement of the substrate P by an alignment meter (ALG). Therefore, it is conceivable to rewrite the drawing data MDn according to the substrate P whose position is shifted. However, because the amount of drawing data (MDn) for the display panel is large, rewriting takes a long time (for example, 40 minutes), which may reduce throughput. Moreover, when the amount of positional misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected on the substrate P, the positional misalignment cannot be corrected even if the drawing data is changed. In other words, there are cases where precise correction is difficult due to changes in drawing data.

Therefore, in this embodiment, based on the alignment measurement results of the substrate P by the alignment system ALG, the drawing data MDn is not rewritten, but the projection position of the pattern is moved to obtain the design value of the substrate P. Correct the positional deviation from . Specifically, the projection position of the pattern is moved by controlling the driving of at least one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE. In this way, the positional deviation of the substrate P from the design value can be corrected.

For example, when the substrate P is disposed offset (rotated by α degrees) by α degrees from the design value around the Z axis, the fine movement stage 10S of the DMD 10 is rotated by α degrees and θz from the initial position. By adjusting the positions of the DMD 10 in the X and Y directions, the pattern can be projected to the design position.

Additionally, in this embodiment, since the modules (MUn) (n = 1 to 27) are aligned in the X and Y directions, the control data creation unit 301 also considers the relationship between the modules (MUn). , create first control data. Additionally, the creation time of the first control data is, for example, several seconds.

When a calibration operation is performed between exposure processes, the correction data creation unit 302 creates correction data based on the calibration result and outputs it to the drive control unit 304. The correction data is a fine movement stage ( This is data for correcting the driving amount of 10S), the driving amount of the optical system of the projection unit (PLU), and the driving amount of the optical element (OPE). For example, the correction data includes, for each module MU1 to MU27, an offset value of the drive amount of the fine movement stage 10S of the DMD 10, an offset value of the drive amount of the optical system of the projection unit (PLU), and , the offset value of the driving amount of the optical element (OPE) is defined.

Here, the reason for creating correction data will be explained. For example, if the exposure process is repeated in the exposure apparatus EX, the positions of each component of the exposure apparatus EX may be shifted, and calibration may be required between exposure processes. In general, when calibration is necessary, it is conceivable to re-set the configuration or to rewrite the drawing data to correct the positional misalignment of each configuration.

However, resetting each configuration of the exposure apparatus EX or rewriting the drawing data based on the calibration results takes time and may reduce throughput. Moreover, when the amount of positional misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected on the substrate P, the positional misalignment cannot be corrected even if the drawing data is changed. In other words, there are cases where precise correction is difficult due to changes in drawing data.

Therefore, in this embodiment, when calibration is performed between exposure processes, each configuration of the exposure apparatus EX is not re-set based on the calibration results or drawing data is rewritten, but rather the exposure apparatus The driving amount of the fine stage 10S of the DMD 10, the driving amount of the optical system of the projection unit (PLU), and the driving amount of the optical element OPE are corrected to correct the positional misalignment of each component of (EX). In this way, the correction data creation unit 302 performs correction for correcting the drive amount of the fine stage 10S of the DMD 10, the drive amount of the optical system of the projection unit (PLU), and the drive amount of the optical element (OPE). Write data.

The drive control unit 304 generates second control data obtained by correcting the first control data input from the control data creation unit 301 with correction data input from the correction data creation unit 302.

Additionally, the drive control unit 304 generates second control data by combining the first control data input from the control data creation unit 301 and the calibration result, even if the correction data creation unit 302 does not create correction data. You can do it.

Additionally, the drive control unit 304 determines the drive amount of the fine movement stage 10S of the DMD 10 included in the second control data and the optical system of the projection unit PLU based on the measurement results of the interferometers IFY1 to IFY4. Drive amount control data (CD1 to CD27) that corrects the drive amount of the optical element (OPE) and the drive amount of the optical element (OPE) in real time is created and sent to the modules (MU1 to MU27). The exposure control device 300 (drive control unit 304) may control the first drive unit that moves the XY stage 4A. Additionally, the exposure control device 300 (drive control unit 304) may control the fine stage drive unit 10D. Additionally, the exposure control device 300 (drive control unit 304) may control a drive unit that drives the first lens group 116, the second lens group 118, and the optical element (OPE) formed in the projection optical system. .

Here, the reason why the drive control unit 304 corrects the second control data in real time will be explained. During scanning exposure of the substrate P, there are cases where the substrate holder 4B does not move as designed (for example, it should move straight in the X direction, but moves while meandering, etc.). In this way, when the substrate holder 4B is not moving as designed (for example, when the Y-direction position of the substrate holder 4B at a predetermined X-direction position is different from the designed value), scanning exposure is performed as is. When implemented, the pattern based on the drawing data MDn is shifted from the designed position and exposed to the substrate P. At this time, it is difficult in terms of time to rewrite the drawing data to follow the positional shift of the substrate holder 4B. Moreover, when the amount of positional misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected on the substrate P, the positional misalignment cannot be corrected even if the drawing data is changed. In other words, there are cases where precise correction is difficult due to changes in drawing data.

Therefore, in this embodiment, the drive control unit 304 determines the drive amount of the fine stage 10S of the DMD 10 included in the second control data and the projection unit based on the measurement results of the interferometers IFY1 to IFY4. The modules MU1 to MU2 are controlled using drive amount control data (third control data) (CD1 to CD27) that corrects the drive amount of the optical system of (PLU) and the drive amount of the optical element (OPE) in real time. As a result, it is possible to correct the positional misalignment of the substrate P, the positional misalignment of each component of the exposure apparatus EX, and the positional misalignment of the substrate holder 4B during scanning exposure, so that the pattern can be transferred to the substrate P according to the designed value. Projection exposure is possible.

The modules MU1 to MU27 drive the fine movement stage 10S of the DMD 10 and the projection unit ( Controls the driving of the optical system of the PLU and the driving of the optical element (OPE).

The exposure control unit (sequencer) 306 synchronizes with the scanning exposure (movement position) of the substrate P, and stores the drawing data (MD1 to MD27) from the drawing data storage unit 310 to the modules (MU1 to MU27). The transmission and transmission of drive amount control data (CD1 to CD27) from the drive control unit 304 are controlled.

[Overview of exposure processing sequence]

Next, an outline of the exposure processing sequence in the exposure apparatus EX according to the present embodiment will be described with reference to FIG. 9 . FIG. 9 shows the procedure when exposing the substrate P using the exposure apparatus EX for the first time or when exposing the substrate P using the exposure apparatus EX that has not been used for a long time. This is a flowchart showing the outline of. In the following example, a case where a pattern such as a display panel is scanned and exposed to the substrate P will be explained.

In the procedure shown in FIG. 9, first, an initial calibration operation of the exposure apparatus EX is performed (step S11). In the initial calibration, the settings of each component of the exposure apparatus EX are corrected based on measurement results by an alignment meter (ALG) or the like. For example, the positions of the modules (MU1 to MU27), the initial position or initial posture of each illumination unit (ILU), DMD (10), and projection unit (PLU) of the modules (MU1 to MU27), and the substrate holder (4B). Tilt, etc. are corrected.

Next, the drawing data of the display panel pattern exposed by each of the plurality of modules (MUn) (n = 1 to 27) is loaded into the drawing data storage unit 310 (step S13).

Next, the substrate P is loaded into the main body of the exposure apparatus EX and placed on the substrate holder 4B (step S15).

Next, alignment marks formed at a plurality of predetermined positions on the substrate P are measured by a plurality of alignment meters (ALG) (step S17).

Next, based on the measurement results by the alignment system ALG, the control data creation unit 301 calculates the drive amount of the fine stage 10S of the DMD 10 to correct the positional misalignment of the substrate P, First control data specifying the drive amount of the optical system of the projection unit (PLU) and the drive amount of the optical element (OPE) are created (step S19).

Next, the module MUn (n = 1 to 27) scans and exposes a pattern such as a display panel on the substrate P based on the drawing data MDn and the drive amount control data CDn (step S21 ). The drive amount control data CDn at this time is data obtained by correcting the first control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B) (fourth control data).

When the scanning exposure process is completed, the substrate P is carried out (step S23).

Next, it is determined whether calibration is necessary (step S25). For example, after the previous calibration, when the number of substrates P subjected to the scanning exposure process reaches a predetermined number (for example, 10 sheets), it is determined that calibration is necessary. Alternatively, if a predetermined time passes every day, it is determined that calibration is necessary.

If calibration is unnecessary (step S25/NO), return to step S15. On the other hand, if calibration is necessary (step S25/YES), calibration is performed (step S27).

Next, based on the calibration result in step S27, the correction data creation unit 302 sets the drive amount of the fine movement stage 10S of the DMD 10 to correct the positional misalignment of each device of the exposure apparatus EX. Correction data for correcting the drive amount of the optical system of the projection unit (PLU) or the drive amount of the optical element (OPE) is created (step S29).

Next, a new substrate P is loaded into the main body of the exposure apparatus EX and placed on the substrate holder 4B (step S31).

Next, alignment marks formed at a plurality of predetermined positions on the newly loaded substrate P are measured by a plurality of alignment meters ALG (step S33).

Next, based on the measurement results by the alignment system ALG, the control data creation unit 301 calculates the drive amount of the fine stage 10S of the DMD 10 to correct the positional misalignment of the substrate P, First control data specifying the drive amount of the optical system of the projection unit (PLU) and the drive amount of the optical element (OPE) are created (step S35).

Next, the drive control unit 304 generates second control data by correcting the first control data created in step S35 with the correction data created in step S29 (step S37).

Additionally, step S29 may be omitted, and the drive control unit 304 may create second control data based on the first control data and the calibration result.

Next, the module MUn (n = 1 to 27) scans and exposes a pattern such as a display panel on the substrate P based on the drawing data MDn and the drive amount control data CDn (step S39) ). The drive amount control data CDn at this time is data obtained by correcting the second control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B) (third control data).

When the scanning exposure process is completed, the substrate P is carried out (step S41).

Next, it is determined whether calibration is necessary (step S43). For example, after the previous calibration, when the number of substrates P subjected to the scanning exposure process reaches a predetermined number (for example, 10 sheets), it is determined that calibration is necessary.

If calibration is unnecessary (step S43/NO), return to step S31. On the other hand, if calibration is necessary (step S43/YES), calibration is performed (step S27).

In this way, the process of FIG. 9 is repeated until manufacturing of a predetermined number of display panels is completed. Additionally, the processing of steps S25 to S29 may be omitted. In this case, the processing after step S31 is not performed, and it is sufficient to return to step S15 after completion of step S23. In this case, in step S21, the drive control unit 304 controls the drive amount by correcting the first control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B). Just send data (CDn) to each module (MUn).

As explained in detail above, according to the present embodiment, the exposure apparatus EX includes the substrate holder 4B and a DMD 10 that generates a pattern corresponding to the drawing data MDn (n = 1 to 27). ) and a plurality of illumination units (ILU) that irradiate illumination light to each of the DMDs 10, and a pattern formed by each of the DMDs 10 is projected onto the substrate P placed on the substrate holder 4B. and a plurality of modules (MU1 to MU27) each including a plurality of projection units (PLU). The exposure device EX further operates the module ( MU1 to MU27 are provided with a drive control unit 304 that controls the driving of each DMD 10, the driving of the projection unit (PLU), and the driving of the optical element (OPE). Drawing data MDn is generated so that a predetermined pattern is exposed at a predetermined position on the substrate P according to at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure device EX. In the case of rewriting, it takes time to rewrite the drawing data MDn, and the throughput of the exposure apparatus EX decreases. The drive control unit 304 drives the DMD 10 according to at least one of the substrate P state, the substrate holder 4B state, and the exposure apparatus EX state without changing the drawing data MDn, Since the drive of the projection unit (PLU) and the drive of the optical element (OPE) are controlled, a predetermined pattern can be exposed at a predetermined position on the substrate P while suppressing a decrease in the throughput of the exposure device EX. there is. Moreover, when the amount of positional misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected on the substrate P, it is difficult to correct the positional misalignment by rewriting the drawing data. In this embodiment, since the positional misalignment is corrected by driving the DMD 10, driving the projection unit PLU, and driving the optical element OPE, the amount of the positional misalignment is the amount of the pattern projected on the substrate P. Even when it is smaller than the minimum line width, positional misalignment can be corrected. Thereby, exposure precision improves.

Additionally, in the present embodiment, the exposure apparatus EX includes an alignment system ALG that measures the state of the substrate P with respect to the substrate holder 4B, and an alignment system ALG based on the measurement results by the alignment system ALG. , a device that controls the driving of at least one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE so that the pattern is projected at a predetermined position on the substrate P. 1. A control data creation unit for creating control data is provided. Then, the drive control unit 304 drives the fine movement stage 10S of the DMD 10, drives the optical system of the projection unit (PLU), and drives the optical element (OPE), based on the first control data. Control. As a result, the pattern can be exposed to the substrate P by correcting the positional deviation from the designed position of the substrate P without lowering the throughput. Additionally, even when the amount of positional misalignment is smaller than the minimum line width of the pattern projected on the substrate P, the positional misalignment can be corrected.

Additionally, in this embodiment, the exposure apparatus EX is provided with a correction data creation unit 302 that creates correction data for correcting the first control data based on the calibration result, and the drive control unit 304 has a , based on the second control data obtained by correcting the first control data with the correction data, driving the fine movement stage 10S of the DMD 10, driving the optical system of the projection unit (PLU), and optical element (OPE). Controls the operation of Thereby, the pattern can be exposed to the substrate P by correcting the positional misalignment of each component of the exposure apparatus EX without reducing the throughput. Additionally, even when the amount of positional shift of each component of the exposure apparatus EX is smaller than the minimum line width of the pattern projected on the substrate P, the positional shift can be corrected.

Additionally, in this embodiment, the exposure apparatus EX is provided with interferometers IFY1 to IFY4 that measure positional information of the substrate holder 4B with respect to the surface 3 or the optical surface 5, and a drive control unit. 304 is based on drive amount control data (CDn) (n = 1 to 27) obtained by correcting the second control data based on the positional information of the substrate holder 4B measured by the interferometers IFY1 to IFY4. Thus, the driving of the fine stage 10S of the DMD 10 of each module (MUn), the driving of the optical system of the projection unit (PLU), and the driving of the optical element (OPE) are controlled. Accordingly, even when the substrate holder 4B does not move according to the designed value during the scanning exposure period, a predetermined pattern can be exposed at the designed position of the substrate P without reducing throughput. Additionally, even when the amount of positional shift of the substrate holder 4B is smaller than the minimum line width of the pattern projected on the substrate P, the positional shift can be corrected.

(variation example)

The exposure apparatus EX according to the above embodiment can be used even when exposing a different pattern to the substrate P that has already been exposed to a predetermined pattern.

In the manufacture of a flat panel display, after exposing the first pattern to the substrate P, a second pattern different from the first pattern may be exposed. For example, in the first time, the first pattern is exposed to the substrate P using an exposure apparatus using a mask substrate, and in the second time, the second pattern is exposed to the substrate P using the exposure apparatus EX according to this embodiment. expose.

FIG. 10 is a diagram showing a case where four display panel patterns are exposed to one substrate P. In the example of FIG. 10 , it is assumed that the patterns of four display panels (PNL1 to PNL4) are exposed to one substrate (P) by the first exposure process. In Fig. 10, hatched portions represent areas exposed in the first exposure process, and black circles in each area represent alignment marks (AM). Additionally, in Fig. 10, the dotted line represents the cutting line when each panel is removed, and the dashed line represents the position where the display panel (PNL2) and its alignment mark (AM) were to be exposed in the first exposure process. It is showing.

In the example of FIG. 10 , the pattern of the display panel PNL2 is exposed with a large deviation from the designed position compared to the other display panels PNL1, PNL3, and PNL4. In this case, if the drawing data of the second exposure process is rewritten to fit the exposed area of the display panel PNL2 by the first exposure process, it takes a long time to rewrite the drawing data, and the throughput decreases. .

In this case, according to the exposure apparatus EX according to the above embodiment, the second pattern can be exposed to fit the exposed area of the first pattern of the display panel PNL2 as follows.

First, the position of the area where the first pattern of the display panels PNL1 to PNL4 is actually exposed is measured by the alignment system ALG. The control data creation unit 301 creates first control data so that the deviation of the exposed area of the first pattern of the display panel PNL2 from the design position is corrected based on the measurement result of the alignment system ALG. do. The drive control unit 304 controls the drive of the optical system of the projection unit PLU and the fine movement stage 10S of the DMD 10 of the modules MU1 to MU27 based on the first control data, thereby preventing the deviation from the designed position. For the display panel PNL2 in which one pattern has been exposed, a second pattern can be exposed in the exposed area of the first pattern.

That is, in the modified example, it can be said that first control data according to the positional deviation from the designed position of the exposed area is created for each area of the display panels PNL1 to PNL4.

In this way, when the second pattern must be exposed by overlapping it on the exposed area of the first pattern for one substrate P on which a plurality of first patterns have been exposed, the exposed area of the first pattern is designed. Even if it is shifted from the position, the exposure apparatus EX according to the present embodiment can expose the second pattern in line with the exposed area of the first pattern without reducing throughput.

Also, at this time, the distance D1 between the exposed area of the display panel PNL1 and the exposed area of the display panel PNL2 is the DMD when exposure of the pattern of the display panel PNL1 is completed for phase shifting. The time required to change from the state of the fine movement stage 10S in (10), the state of the optical system of the projection unit PLU, and the state of the optical element OPE to the state for exposing the display panel PNL2 is longer than the time required. , it is preferable that the time for the substrate holder 4B to move the distance D1 is set to be longer. Here, the state of the fine movement stage 10S refers to the relative position information of the DMD 10 with respect to the substrate holder 4B, XY stage 4A, optical surface 5, or surface 3, or the tilt angle in the θz axis direction. Point to the back. In addition, the state of the optical system of the projection unit (PLU) refers to the first lens group 116 and the second lens group ( 118), refers to relative position information of each lens included in the first lens group 116 and the second lens group 118. Additionally, the state of the optical element OPE refers to information on the relative position of the optical element OPE with respect to the substrate holder 4B, the XY stage 4A, the optical surface 5, or the surface 3. Additionally, if the optical element OPE is a pair of polarization prisms, the spacing between the pair of polarization prisms, the rotation angle of each polarization prism, etc. are also included in the state of the optical element OPE. Additionally, if the optical element OPE is a pair of parallel plates, the spacing between the pair of parallel plates, the rotation angle of each parallel plate, etc. are also included in the state of the optical element OPE. Accordingly, the exposure apparatus EX according to the above embodiment can expose the display panel PNL1 and the display panel PNL2 through one scanning exposure. Additionally, in the case of exposing with one scanning exposure, the exposure apparatus EX exposes the exposure area of the display panel PNL1 and then exposes the pattern of the display panel PNL1 while advancing the distance D1. exposing the display panel PNL2 to at least one of the state of the fine movement stage 10S of the DMD 10, the state of the optical system of the projection unit (PLU), and the state of the optical element OPE when the The state is changed to expose the exposed area of the display panel PNL2.

The exposure control device 300 (drive control unit 304) included in the exposure apparatus EX moves the XY stage 4A in the scanning direction (X-axis direction) to display the display panel PNL1 of the substrate P. After exposing the exposure area of the display panel PNL2, the exposure area of the display panel PNL2 is exposed, while the projection optical system advances the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2. Change the settings of the exposure device (EX).

The exposure control device 300 (drive control unit 304) included in the exposure device EX controls the driving of the fine movement stage 10S of the DMD 10 or the projection optical system to set the exposure device EX. Change .

In addition, the control unit provided in the exposure apparatus EX is formed in the projection optical system and a fine-movement stage driver 10D that changes at least one of the XY stage 4A and the position and posture of the spatial light modulator 10. Controls the driving unit that drives the first lens group 116, the second lens group 118, and the optical element OPE, and exposes the exposed area of the display panel PNL1 parallel to the scanning direction (X-axis direction) on the substrate P. and driving the The fine stage driver 10D and the first lens group ( 116), the second lens group 118, and at least one of the driving units that drive the optical element OPE is driven.

When the distance D1 is set as above, the state of the fine movement stage 10S of the DMD 10, the state of the optical system of the projection unit (PLU), and the state of the optical element (OPE) are displayed on the display panel (PNL2). Since exposure processing can be continued without waiting for the state to be in a state for performing exposure, throughput can be improved.

In addition, for example, the positional deviation of the exposed area from the design value due to the first exposure process of the display panel PNL2 may be caused by the fine movement stage 10S of the DMD 10 and the optical system of the projection unit PLU. If the amount is such that it cannot be corrected even if the projection position of the pattern is moved by driving the optical element OPE, the exposure process is not started, and the information is displayed on the display device provided in the exposure device EX, You may have the operator of the exposure apparatus EX choose whether to continue the exposure process. Alternatively, the exposure apparatus EX may output a warning. Alternatively, the operator may be able to select whether to continue the exposure process, stop the exposure process, or expose a pattern on the substrate P that can be identified as a defective product.

Additionally, the exposure result (exposure shape) of the display panel PNL1 in the first exposure process is not a rectangle like PNL1 in FIG. 10, but a barrel shape like FIG. 11(A) or a barrel shape like FIG. 11(B). There are cases where it has the same reel-shaped shape. In this case, when performing the second exposure on the display panel PNL1, it is necessary to expose while phase-shifting each position of the display panel PNL1. Therefore, based on the measurement result of the alignment mark AM of the display panel PNL1 by the alignment system ALG, the fine movement stage 10S of the DMD 10 and the projection unit are moved in real time during exposure of the display panel PNL1. It drives the optical system (PLU) and the optical element (OPE). Thereby, the projection position of the pattern at each position of the display panel PNL1 can be corrected. In addition, the shape of the display panel PNL1 is not limited to this, and the right side of PNL1 is barrel-shaped, and the left side of PNL1 is spool-shaped, as shown in FIG. 11(C). There is also a case where two shapes are combined. Includes. In addition, this exposure result is not limited to PNL1, and the same exposure result may also be obtained for PLN2 to PLN4.

Additionally, the exposure apparatus EX according to the above embodiment can expose the display panel PNL1 and the display panel PNL3 through one scanning exposure. In order to simultaneously expose the display panel PNL1 and the display panel PNL3, the alignment system ALG measures the alignment mark AM of the display panel PNL1 (first measurement) and the measurement of the alignment mark AM of the display panel PNL3. In the measurement of the alignment mark (AM) (second measurement), the alignment of the two display panels (PNL1, PLN3) is measured. By performing the first measurement, the exposure result of the display panel PNL1 can be measured, and by performing the second measurement, the exposure result of the display panel PNL3 can be measured. Additionally, the exposure apparatus EX according to the above embodiment can expose the display panel PNL1 and the display panel PNL2 through one scanning exposure. The distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2 can be set to be larger than the exposure field of view of the exposure module. In addition, when there is no problem with accuracy, the distance D1 may be set smaller than the exposure field of view of the exposure module.

Additionally, in the exposure module group MU(A), the display panel PNL3 is exposed using the modules MU1 to MU4, and the display panel PNL1 is exposed using the modules MU5 to MU9. At this time, while exposing the display panel PNL3, the modules MU1 to MU4 operate the optical system of the fine movement stage 10S of the DMD 10 and the projection unit PLU in real time based on the measurement results of the second measurement. Exposure is performed while correcting the projection position of the pattern by driving the optical element (OPE). While exposing the display panel PNL1, the modules MU5 to MU9 monitor the optical system and optical elements ( OPE) is driven to perform exposure while correcting the projection position of the pattern. Accordingly, exposure can be performed while correcting multiple panels (PNL1 and PLN3) with one scanning exposure.

Here, it is assumed that the modules MU1 to MU4 expose the display panel PNL3 and the modules MU5 to MU9 expose the display panel PNL1, but these are set appropriately. Additionally, the exposure module group (MU(B)) and the exposure module group (MU(C)) are the same as the exposure module group (MU(A)).

Additionally, for example, the distance D1 between the exposed area of the display panel PNL1 and the exposed area of the display panel PNL2 is short, so that while the substrate holder 4B moves the distance D1, the DMD 10 ) Even when the driving of the fine movement stage 10S, the driving of the optical system of the projection unit (PLU), or the driving of the optical element (OPE) is delayed, the information is displayed on the display device provided in the exposure apparatus EX, You may have the operator of the exposure apparatus EX choose whether to continue the exposure process. Alternatively, the operator may be able to select whether to continue the exposure process, stop the exposure process, or expose a pattern on the substrate P that can be identified as a defective product.

In addition, in the above embodiment and modification, the drive control unit 304 drives the fine movement stage 10S of the DMD 10, drives the optical system of the projection unit (PLU), and drives the optical element (OPE). Although it is said that it controls, it is not limited to this. The drive control unit 304 may control the drive of any one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit (PLU), and the optical element (OPE). In addition, when the amount of positional deviation measured by the alignment meter (ALG), calibration, and interferometer (IFY1 to IFY4) exceeds the specified amount predetermined by the operator, a recipe is provided to determine whether to expose, continue exposure, or re-align. It may be determined in advance as information (exposure conditions).

In addition, in the above embodiment, the drive control unit 304 corrects the first control data or the second control data based on the measurement results of the interferometers IFY1 to IFY4, but based on the measurement results of the interferometers IFY1 to IFY4. There is no need to perform basic correction. In this case, the drive control unit 304 drives the fine movement stage 10S of the DMD 10, drives the optical system of the projection unit (PLU), and controls the optical element based on the first control data or the second control data. You can control the operation of (OPE).

The above-described embodiments are examples of preferred implementations of the present invention. However, it is not limited to this, and various modifications and implementations can be made without departing from the gist of the present invention.

4B: Substrate holder
10:DMD
10a: micromirror
10S: Fine stage
116: 1st lens group
118: second lens group
300: exposure control device
301: Control data writing unit
302: Correction data writing unit
304: Drive control unit
ALG: Alignment system
EX: Exposure device
IFY1 ~ IFY4: Interferometry
MU1 ~ MU27: Module
P: substrate
PLU: projection unit

Claims (16)

An exposure device that exposes an object to patterned light generated by a spatial light modulator according to drawing data,
an illumination optical system that irradiates illumination light to the spatial light modulator;
a projection optical system that projects the pattern light onto the object;
a first moving body disposed below the projection optical system and holding the object;
a first driving unit that moves the first moving object in a first direction and a second direction orthogonal to each other within a predetermined plane orthogonal to the optical axis of the projection optical system;
a second moving body holding the spatial light modulator;
a second driving unit that moves the second moving object;
a measurement unit that obtains a measurement result including at least one of position information of the object and position information of the first moving object;
An exposure apparatus comprising a control unit that controls at least one of driving of the second moving body and adjustment of the projection optical system based on the measurement result obtained by the measurement unit, and controls an exposure position of the pattern light. According to claim 1,
The projection optical system has a pair of optical elements,
The exposure apparatus wherein the control unit controls driving of the pair of optical elements based on the measurement results. The method of claim 1 or 2,
The projection optical system has a first lens group and a second lens group,
The exposure apparatus wherein the control unit adjusts at least one of the first lens group and the second lens group. The method of claim 1 or 2,
The projection optical system has a first lens group and a second lens group,
The exposure apparatus wherein the control unit drives at least one of the first lens group or the second lens group in the optical axis direction. According to claim 2,
The pair of optical elements has a first declination prism and a second declination prism,
The exposure apparatus wherein the control unit controls an exposure position of the pattern light by adjusting an interval between the first declination prism and the second declination prism. According to claim 2,
The pair of optical elements has a first parallel plate and a second parallel plate,
The exposure apparatus wherein the control unit moves or rotates at least one of the first parallel plate and the second parallel plate to control the exposure position of the pattern light. The method according to any one of claims 1 to 6,
An exposure apparatus comprising a plurality of module units having the illumination optical system, the projection optical system, the spatial light modulator, the second moving body, and the second driving unit. According to claim 1,
the object has a first region and a second region having a first pattern exposed on the object,
The drawing data is data for forming a second pattern different from the first pattern in the first area and the second area,
The measurement unit measures first information, which is relative position information of the first area with respect to the first moving object, and second information, which is relative positional information of the second area with respect to the first moving object,
Based on the first information and the second information, driving the second movable body when exposing the second pattern to the first area and the second area, and An exposure apparatus comprising a first creation unit that creates first control data for controlling at least one of adjustment of the projection optical system when exposing the second pattern. According to claim 8,
The first area and the second area are formed at a distance in the first direction of the object,
While moving the distance between the first area and the second area, the control unit changes the state from the state of the second moving object at the end of exposure of the first area to the start of exposure of the second area. controlling the second driving unit to change the state of the second moving body from the state of the projection optical system at the end of exposure of the first area to the state of the projection optical system at the start of exposure of the second area. An exposure apparatus that controls adjustment of the projection optical system to change states. According to claim 8 or 9,
An exposure apparatus wherein the first pattern is a pattern exposed using a mask substrate. Manufacturing a device using an exposure apparatus including an illumination optical system that irradiates illumination light to a spatial light modulator, and a projection optical system having an optical element that projects the pattern light generated by the spatial light modulator onto an object mounted on a first moving body. As a method,
obtaining, by a measurement unit, a measurement result including at least one of position information of the object and position information of the first moving object;
A device manufacturing method comprising controlling, by a control unit, at least one of driving a second moving body holding the spatial light modulator or adjusting the projection optical system based on the measurement result obtained by the measurement unit. An exposure apparatus for exposing a second pattern light generated by a spatial light modulator to an object having a first area to which a first pattern is exposed,
an illumination optical system that irradiates illumination light to the spatial light modulator;
a projection optical system that projects the second pattern light onto the object;
a first moving body disposed below the projection optical system and holding the object;
a first driving unit that moves the first moving body in a direction perpendicular to the optical axis of the projection optical system;
a second moving body holding the spatial light modulator;
a second driving unit that moves the second moving object;
a measurement unit that measures an exposure result of the first pattern in the first area and obtains a measurement result;
A control unit that controls at least one of driving of the second moving body and adjustment of the projection optical system based on the measurement result, and controls an exposure position of the second pattern light while exposing the first area. exposure device. An exposure apparatus for exposing a second pattern light generated by a spatial light modulator to an object having a first area and a second area to which a first pattern is exposed,
an illumination optical system that irradiates illumination light to the spatial light modulator;
a projection optical system that projects the second pattern light onto the object;
a first moving body disposed below the projection optical system and holding the object;
a first driving unit that moves the first moving body in a direction perpendicular to the optical axis of the projection optical system;
a second moving body holding the spatial light modulator;
a second driving unit that moves the second moving object;
a measurement unit that acquires a first measurement result measuring an exposure result of the first pattern in the first area and a second measurement result measuring an exposure result of the first pattern in the second area;
Based on the first measurement result and the second measurement result, at least one of driving of the second moving body and adjustment of the projection optical system is controlled to produce the second pattern while exposing the first area and the second area. An exposure apparatus comprising a control unit that controls the exposure position of light. According to claim 13,
The first moving body is moved in a first direction perpendicular to the optical axis during exposure,
The exposure apparatus wherein the first area and the second area are arranged along the first direction. a stage for moving the exposure object in the scanning direction;
spatial light modulator,
an illumination optical system that illuminates the spatial light modulator,
a projection optical system that irradiates light reflected from a mirror of the spatial light modulator to the exposure target;
An exposure apparatus having a control unit,
The control unit moves the stage in the scanning direction to expose the first area that is the exposure target and then exposes the second area, and the projection optical system moves the distance between the first area and the second area. An exposure apparatus that changes settings of the exposure apparatus during operation. An exposure device that scans and exposes a substrate with light through a spatial light modulator while moving the substrate in a scanning direction, comprising:
a stage that holds the substrate and moves it in the scanning direction;
a first driving unit that changes at least one of the position and posture of the spatial light modulator;
a projection optical system that projects light through the spatial light modulator onto the substrate;
a second driving unit formed within the projection optical system and driving an optical element;
It has a control unit that controls the stage, the first driving unit, and the second driving unit,
The control unit drives the stage so that the first area and the second area parallel to the scanning direction on the substrate move to the same side as the scanning direction with respect to the optical axis of the projection optical system, and the control unit moves in the scanning direction. An exposure apparatus that drives at least one of the first drive unit and the second drive unit in a state where an area between the first area and the second area on the substrate intersects the optical axis.

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