TW202314291A - Imaging method and imaging system - Google Patents

Abstract

Disclosed herein is a method comprising sending M bombardment beams (bombardment beams (i), i=1, ..., M) respectively toward target spots (i), i=1, ..., M on a target resulting in radiation beams (i), i=1, ..., M emitting respectively from the target spots (i), i=1, ..., M and propagating toward an object, wherein M is an integer greater than 1; and for each value of i, obtaining a 2D (two-dimensional) image (i) of the object using radiation of the radiation beam (i) that has passed through the object, wherein the target is stationary with respect to the object.

Description

Imaging method and imaging system

The invention relates to an imaging method and an imaging system.

A radiation detector is a device that measures the properties of radiation. Examples of properties may include the spatial distribution of the intensity, phase and polarization of the radiation. The radiation may be radiation that has interacted with the object. For example, the radiation measured by the radiation detector may be radiation that has penetrated the object. The radiation may be electromagnetic radiation, such as infrared light, visible light, ultraviolet light, X-rays or gamma rays. Radiation can also be of other types, such as alpha and beta rays. An imaging system may include one or more image sensors, each of which may have multiple radiation detectors.

This paper discloses a method, which includes: directing M bombardment beams (bombardment beams (i), i=1, ..., M) to target points (i) on the target, i=1, ..., M is sent, thereby obtain the radiation beam (i) that is emitted from the target point (i) i=1, ..., M and propagates to the object respectively, i=1, ..., M, wherein, M is an integer greater than 1; and for each value of i, a 2D (two-dimensional) image (i) of the object is obtained using the radiation of the radiation beam (i) that has passed through the object, wherein the object is relative to the The object is stationary.

In an aspect, the method further comprises reconstructing a 3D (three-dimensional) image of said object from said 2D image (i), i=1, . . . , M.

In an aspect, said obtaining 2D images (i) of said object comprises: using said radiation of said radiation beam (i) that has passed through said object to capture Ni partial images of said object one by one , wherein, Ni is an integer greater than 1; and stitching the Ni partial images of the object to obtain the 2D image (i) of the object.

In one aspect, all Ni, i=1, . . . , M are the same.

In one aspect, each of the M bombardment beams comprises an electron beam.

In one aspect, the target comprises copper or tungsten.

In one aspect, said bombardment beams (i), i=1, . . . , M are sent one by one.

In one aspect, an image sensor acquires all said 2D images (i), i=1, . . . , M.

In an aspect, said transmitting M bombardment beams is performed using a bombardment beam generator comprising a plurality of electron guns, each of said electron guns transmitting at least one of M said bombardment beams.

In one aspect, the bombardment beam generator is physically fixed to the target.

Disclosed herein is an imaging system comprising: a bombardment beam generator; a target; and an image sensor system including at least one image sensor, wherein the bombardment beam generator is It is configured to send M bombardment beams (bombardment beam (i), i=1, ..., M) to the target point (i), i = 1, ..., M on the target, respectively, so as to obtain The radiation beam (i) emitted by the target point (i) i=1,...,M and propagating to the object, i=1,...,M, wherein, M is an integer greater than 1, wherein, the The image sensor system is configured to obtain, for each value of i, a 2D (two-dimensional) image (i) of the object using the radiation of the radiation beam (i) that has passed through the object ), and wherein the target is stationary relative to the object.

In an aspect, the image sensor system is further configured to reconstruct a 3D (three-dimensional) image of the object from the 2D image (i), i=1, . . . , M.

In an aspect, the image sensor system is further configured to obtain the 2D image (i) of the object by using an image of the radiation beam (i) that has passed through the object capturing Ni partial images of the object one by one by the radiation, wherein Ni is an integer greater than 1; and splicing the Ni partial images of the object to obtain the 2D image of the object (i).

In one aspect, all Ni, i=1, . . . , M are the same.

In one aspect, each of the M bombardment beams comprises an electron beam.

In one aspect, the target comprises copper or tungsten.

In one aspect, said bombardment beams (i), i=1, . . . , M are sent one by one.

In one aspect, the image sensors of the image sensor system obtain all of the 2D images (i), i=1, . . . , M.

In one aspect, the bombardment beam generator includes a plurality of electron guns, each of the electron guns transmitting at least one of the M said bombardment beams.

In one aspect, the bombardment beam generator is physically fixed to the target.

radiation detector

As an example, FIG. 1 schematically shows a radiation detector 100 . Radiation detector 100 may include an array of picture elements 150 (also referred to as sensing elements 150 ). The array may be a rectangular array (as shown in Figure 1), a honeycomb array, a hexagonal array, or any other suitable array. The array of primitives 150 in the example of FIG. 1 has 4 columns and 7 rows; however, in general, the array of primitives 150 can have any number of rows and any number of columns.

Each primitive 150 may be configured to detect radiation incident thereon from a radiation source (not shown), and may be configured to measure properties of the radiation (eg, energy, wavelength, and frequency of particles). Radiation can include particles such as photons and subatomic particles. Each primitive 150 may be configured to count, over a period of time, the number of radiation particles incident thereon whose energies fall within a plurality of energy intervals. All primitives 150 may be configured to count the number of radiation particles incident thereon in multiple energy intervals over the same period of time. When the incident radiation particles have similar energies, the primitive 150 may simply be configured to count the number of radiation particles incident thereon over a period of time without measuring the energy of the individual radiation particles.

Each primitive 150 may have its own analog-to-digital converter (ADC) configured to digitize an analog signal representing the energy of an incident radiation particle into a digital signal, or convert an analog signal representing the total energy of a plurality of incident radiation particles to a digital signal. Analog signals are digitized into digital signals. Primitives 150 may be configured to work in parallel. For example, while one primitive 150 is measuring incident radiation particles, another primitive 150 may be waiting for the radiation particles to arrive. Primitives 150 may not necessarily be individually addressable.

The radiation detector 100 described herein can be used in, for example, X-ray telescopes, X-ray mammography, industrial X-ray defect detection, X-ray microscopy or microradiography, X-ray casting inspection, X-ray non-destructive testing, X-ray weld inspection, X-ray digital subtraction angiography, etc. It may also be appropriate to use the radiation detector 100 in place of a photographic plate, photographic film, PSP plate, X-ray image intensifier, scintillator, or other semiconductor X-ray detector.

Figure 2 schematically illustrates a simplified cross-sectional view of the radiation detector 100 of Figure 1 along line 2-2, according to an embodiment. Specifically, the radiation detector 100 may include a radiation absorbing layer 110 and an electronics layer 120 (which may include one or more ASICs or application specific integrated circuits) for processing or analyzing electrical signals generated in the radiation absorbing layer 110 by incident radiation. . The radiation detector 100 may or may not include a scintillator (not shown). The radiation absorbing layer 110 may include semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe or combinations thereof. The semiconductor material may have a high mass attenuation coefficient for the radiation of interest.

FIG. 3 schematically shows a detailed cross-sectional view of the radiation detector 100 of FIG. 1 along line 2-2 as an example. Specifically, the radiation absorbing layer 110 may include one or more diodes (eg, p-i-n or p-n) formed by the first doped region 111 , one or more discrete regions 114 of the second doped region 113 . The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112 . The discrete regions 114 may be separated from each other by the first doped region 111 or the intrinsic region 112 . The first doped region 111 and the second doped region 113 may have opposite types of doping (eg, region 111 is p-type and region 113 is n-type, or region 111 is n-type and region 113 is p-type). In the example of FIG. 3 , each discrete region 114 of the second doped region 113 forms a diode with the first doped region 111 and optionally the intrinsic region 112 . That is, in the example of FIG. 3, the radiation absorbing layer 110 has a plurality of diodes (more specifically, 7 diodes correspond to 7 primitives 150 in a column in the array of FIG. 3, only two of them are marked 150). Multiple diodes may have an electrical contact 119A as a common (common) electrode. The first doped region 111 may also have discrete portions.

The electronics layer 120 may include an electronic system 121 suitable for processing or interpreting signals generated by radiation incident on the radiation absorbing layer 110 . Electronic system 121 may include analog circuits such as filter networks, amplifiers, integrators, and comparators, or digital circuits such as microprocessors and memory. Electronic system 121 may include one or more ADCs (analog-to-digital converters). Electronic system 121 may include elements shared by primitives 150 or elements specific to a single primitive 150 . For example, electronic system 121 may include an amplifier dedicated to each picture element 150 and a microprocessor shared among all picture elements 150 . Electronic system 121 may be electrically connected to graphics element 150 through via 131 . The spaces between the via holes may be filled with a filling material 130 , which may increase the mechanical stability of the connection of the electronic device layer 120 to the radiation absorbing layer 110 . Other bonding techniques may connect electronics 121 to primitive 150 without using vias 131 .

When radiation from a radiation source (not shown) strikes the radiation absorbing layer 110 comprising diodes, radiation particles may be absorbed and generate one or more charge carriers (eg, electrons, holes) through a variety of mechanisms. Charge carriers can drift to the electrodes of one of the diodes under the electric field. The electric field may be an external electric field. Electrical contacts 119B may include discrete portions each in electrical contact with a discrete region 114 . The term "electrical contact" may be used interchangeably with the word "electrode". In an embodiment, the charge carriers may drift in all directions such that charge carriers generated by a single radiation particle are not substantially shared by two distinct discrete regions 114 (herein "substantially not shared by...  ..shared means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete region 114 compared to the rest of the charge carriers ). Charge carriers generated by radiation particles incident around the footprint of one of the discrete regions 114 are substantially not shared with the other of the discrete regions 114 . The primitives 150 associated with the discrete region 114 may be the area surrounding the discrete region 114 in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the The charge carriers flow to the discrete regions 114 . That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow through the primitive 150 .

Figure 4 schematically illustrates a detailed cross-sectional view of the radiation detector 100 of Figure 1 along line 2-2, according to an alternative embodiment. More specifically, the radiation absorbing layer 110 may include resistors of semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe, or combinations thereof, but not diodes. The semiconductor material may have a high mass attenuation coefficient for the radiation of interest. In an embodiment, the electronics layer 120 of FIG. 4 is similar in structure and function to the electronics layer 120 of FIG. 3 .

When radiation strikes the radiation absorbing layer 110, which includes a resistor and does not include a diode, it can be absorbed and generate one or more charge carriers through a variety of mechanisms. Radiation particles can generate anywhere from 10 to 100,000 charge carriers. Charge carriers can drift to electrical contacts 119A and 119B under the electric field. The electric field may be an external electric field. Electrical contacts 119B may include discrete portions. In an embodiment, the charge carriers may drift in all directions such that the charge carriers generated by a single radiation particle are not substantially shared by two different discrete portions of the electrical contact 119B (herein "substantially not shared by ...shared"means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete parts of ). Charge carriers generated by radiation particles incident around the footprint of one of the discrete portions of electrical contact 119B are substantially not shared with the other of the discrete portions of electrical contact 119B. The primitive 150 associated with the discrete portion of the electrical contact 119B may be the area around the discrete portion in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers flow to the discrete portion of electrical contact 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of the charge carriers flow through the picture element associated with a discrete portion of the electrical contact 119B.

Radiation Detector Package

FIG. 5 schematically shows a top view of a package 500 comprising a radiation detector 100 and a printed circuit board (PCB) 510 . The term "PCB" as used herein is not limited to a specific material. For example, a PCB may include semiconductors. The radiation detector 100 may be mounted to the PCB 510 . For clarity, the wiring between the radiation detector 100 and the PCB 510 is not shown. PCB 510 may have one or more radiation detectors 100 . PCB 510 may have an area 512 not covered by radiation detector 100 (eg, to accommodate bond wire 514 ). The radiation detector 100 may have an active area 190 in which the picture element 150 (FIG. 1) is located. The radiation detector 100 may have a peripheral region 195 near the edge of the radiation detector 100 . The peripheral zone 195 has no primitives 150 and the radiation detector 100 does not detect radiation particles incident on the peripheral zone 195 .

image sensor

FIG. 6 schematically shows a cross-sectional view of an image sensor 600 according to an embodiment. Image sensor 600 may include one or more packages 500 of FIG. 5 mounted to system PCB 650 . As an example, FIG. 6 shows two packages 500 . Electrical connection between PCB 510 and system PCB 650 may be achieved through bond wires 514 . To accommodate bond wires 514 on PCB 510 , PCB 510 may have an area 512 not covered by radiation detector 100 . To accommodate bond wires 514 on system PCB 650 , there may be a gap between packages 500 . The gap may be about 1 mm or more. Radiation particles incident on the perimeter region 195 , the region 512 or the gap cannot be detected by the package 500 on the system PCB 650 . A dead zone of a radiation detector (eg, radiation detector 100 ) is a region of a radiation receiving surface of the radiation detector where radiation particles incident thereon cannot be detected by the radiation detector. A dead zone of a package (eg, package 500 ) is an area of the package's radiation receiving surface where radiation particles incident thereon cannot be detected by one or more radiation detectors in the package. In the example shown in FIGS. 5 and 6 , the dead zone of package 500 includes perimeter zone 195 and region 512 . The dead zone (eg, 688 ) of an image sensor (eg, image sensor 600 ) having a group of packages (eg, package 500 mounted on the same PCB and arranged in the same layer or in different layers) includes The combination of the dead zone of each package in the group and each gap between each package.

In an embodiment, radiation detector 100 ( FIG. 1 ), operated by itself, may be considered an image sensor. In an embodiment, package 500 (FIG. 5) operating by itself may be considered an image sensor.

Image sensor 600 including radiation detector 100 may have dead zone 688 where incident radiation cannot be detected. However, image sensor 600 may capture multiple partial images of an object or scene (not shown), and then these captured partial images may be stitched to form an image of the entire object or scene.

imaging system

7A-7C schematically illustrate perspective views of an imaging system 700 in operation according to an embodiment. In an embodiment, imaging system 700 may include bombardment beam generator 710, target 725, and image sensor system 100a+100b+100c. In an embodiment, bombardment beam generator 710 may be configured to generate a bombardment beam (eg, an electron beam) toward target 725 .

In an embodiment, the target 725 may have a ring shape as shown. In an embodiment, there may be three target points 720a, 720b, and 720c on the surface of the target 725 . Each of target points 720a, 720b, and 720c may be an area or field on the surface of target 725 that is to receive bombardment particles (eg, electrons) from bombardment beam generator 710 . The three black circles representing the three target points 720a, 720b, and 720c only roughly indicate the location of the target points 720a, 720b, and 720c on the target 725, and do not necessarily indicate the size, shape, or orientation of the target points 720a, 720b, and 720c.

In an embodiment, target 725 may be made of copper or tungsten. As shown, target 725 may be one-piece. Alternatively, target 725 may include multiple separate components (not shown).

In an embodiment, image sensor system 100a+100b+100c may include 3 radiation detectors 100a, 100b and 100c, which may be similar to radiation detector 100 of FIG. 1 . The three parallelograms representing the three radiation detectors 100a, 100b, 100c only roughly indicate the positions and orientations of the radiation detectors 100a, 100b, 100c, and do not necessarily indicate the size and shape of the radiation detectors 100a, 100b, 100c. In an embodiment, radiation detectors 100a, 100b, and 100c may be physically fixed to circular track 105, as shown.

In an embodiment, object 730 may be positioned between target points 720a, 720b, and 720c and image sensor system 100a+100b+100c, as shown, for imaging by imaging system 700 . Object 730 may be a patient whose body parts need to be imaged for medical diagnostic purposes. In an embodiment, target points 720a, 720b, and 720c may be such that when a bombardment beam (e.g., an electron beam) from bombardment beam generator 710 strikes target 725 at target points 720a, 720b, and 720c, the radiation beam (e.g., X Rays) will be emitted from target points 720a, 720b and 720c and propagate towards object 730.

In an embodiment, target 725 may be stationary relative to object 730 during operation of imaging system 700 to image object 730 . In an embodiment, the track 105 may be stationary relative to the object 730 during operation of the imaging system 700 to image the object 730 .

First 2D image capture

In an embodiment, referring to FIG. 7A , the first 2D (two-dimensional) image capture may be performed as follows. Bombardment beam generator 710 may generate bombardment beam 712a toward target point 720a on target 725 , causing radiation beam 722a to be emitted from target point 720a toward object 730 . Using the radiation of radiation beam 722a that has passed through object 730 , radiation detector 100a may capture a first 2D image of object 730 .

Second 2D image capture

In an embodiment, referring to FIG. 7B , the second 2D image capture may be performed as follows. Bombardment beam generator 710 may generate bombardment beam 712b toward target point 720b on target 725 , causing radiation beam 722b to be emitted from target point 720b toward object 730 . Using the radiation of radiation beam 722b that has passed through object 730 , radiation detector 100b may capture a second 2D image of object 730 .

Third 2D image capture

In an embodiment, referring to FIG. 7C , the third 2D image capture may be performed as follows. Bombardment beam generator 710 may generate bombardment beam 712c toward target point 720c on target 725, thereby causing radiation beam 722c to be emitted from target point 720c toward object 730. Using the radiation of radiation beam 722c that has passed through object 730 , radiation detector 100c may capture a third 2D image of object 730 .

Flowchart for recap

FIG. 8 shows a flowchart 800 outlining the operation of the imaging system 700 described above. Specifically, in step 810, M bombardment beams (bombardment beam (i), i=1, ..., M) are respectively sent to the target point (i), i = 1, ..., M on the target, Thus, radiation beams (i), i=1, . . . , M emitted from target points (i) i=1, . . . For example, referring to Fig. 7A to Fig. 8, three bombardment beams 712a, 712b and 712c (where M=3) are respectively sent to target points 720a, 720b and 720c on the target 725, thereby obtaining Radiation beams 722 a , 722 b , and 722 c are emitted and propagate toward object 730 .

In step 820, for each value of i, a 2D image (i) of the object is obtained using the radiation of the radiation beam (i) that has passed through the object. For example, for i=1, a first 2D image of object 730 is obtained using radiation of radiation beam 722a ( FIG. 7A ) that has passed through object 730 . For i=2, a second 2D image of the object 730 is obtained using the radiation of the radiation beam 722b ( FIG. 7B ) that has passed through the object 730 . For i=3, a third 2D image of the object 730 is obtained using the radiation of the radiation beam 722c ( FIG. 7C ) that has passed through the object 730 .

Also in step 820, the target is stationary relative to the object. For example, target 725 is stationary relative to object 730 .

3D image reconstruction

In an embodiment, referring to step 820 in the flowchart 800 of FIG. 8 , a 3D (three-dimensional) image of an object may be reconstructed from a 2D image (i), i=1, . . . ,M. For example, referring to FIGS. 7A to 7C , the 3D image of the object 730 may be reconstructed from the first 2D image, the second 2D image, and the third 2D image of the object 730 (as described above). In an embodiment, radiation detectors 100a, 100b, and 100c may be configured to communicate with each other such that at least one of them has access to all of the first, second, and third 2D images, and may be accessed by the first, second and the third 2D image to reconstruct a 3D image.

A single radiation detector acquires all 2D images

In an embodiment, referring to step 820 of the flowchart 800 of FIG. 6 , a single image sensor may be used to obtain all 2D images (i), i=1, . . . , M. For example, referring to FIGS. 7A-7C , instead of the three radiation detectors 100a, 100b, and 100c described above for obtaining the first, second, and third 2D images, respectively, the radiation detector 100a (itself may be considered is the image sensor) can move along the track 105 and obtain all the first, second and third 2D images. This is possible if the first 2D image capture, the second 2D image capture and the third 2D image capture are performed one by one. This means that the bombardment beam generator 710 sends the bombardment beams 712a, 712b and 712c one by one.

Specifically, when bombardment beam generator 710 sends bombardment beam 712a (FIG. 7A), radiation detector 100a may be in its position as shown in FIG. 7A and may capture a first 2D image. Later, in an embodiment, when bombardment beam generator 710 sends bombardment beam 712b (FIG. 7B), radiation detector 100a may be at the location of radiation detector 100b as shown in FIG. 7B and may capture a second 2D map picture. Later, in an embodiment, when bombardment beam generator 710 sends bombardment beam 712c (FIG. 7C), radiation detector 100a may be at the location of radiation detector 100c as shown in FIG. 7C and may capture a third 2D map picture. As a result, the radiation detector 100a acquires all of the first, second and third 2D images.

Multiple partial images per 2D image

In an embodiment, referring to step 820 in the flowchart 800 of FIG. 8, said obtaining the 2D image (i) of the object may comprise (A) capturing the object one by one using the radiation of the radiation beam (i) that has passed through the object Ni partial images, wherein Ni is an integer greater than 1; and (B) splicing the Ni partial images of the object to obtain a 2D image (i) of the object. For example, referring to FIG. 7A , for the first 2D image capture (ie, for i=1), instead of capturing the first 2D image in one shot as described above, the radiation detector 100a can use radiation that has passed through the object 730 N1 partial images of object 730 are captured using radiation from beam 722a.

Specifically, assuming N1=3, while radiation beam 722a is on, radiation detector 100a may capture a first partial image of object 730 when radiation detector 100a is at a first position as shown in FIG. 7A . Next, in an embodiment, radiation detector 100a may be moved along track 105 to a second position (not shown) while radiation beam 722a is still on, and then capture A second partial image of object 730 . Next, in an embodiment, while radiation beam 722a is still on, radiation detector 100a may be moved further along track 105 to a third position (not shown), and then A third partial image of object 730 is captured. Next, in an embodiment, the first, second and third partial images may be stitched together by the radiation detector 100 a to obtain a first 2D image of the object 730 .

In an embodiment, the second 2D image and the third 2D image may be obtained in a similar manner by the radiation detectors 100b and 100c, respectively. Alternatively, radiation detector 100a can move along track 105 alone and capture all nine partial images of object 730 (assuming N1=N2=N3=3), thereby obtaining all first, second and third 2D image.

In an embodiment, all Ni, i=1, . . . , M may be the same. For example, in the above embodiment, N1=N2=N3=3. In other words, in order to obtain each of the first, second and third 2D images, 3 partial images of the object 730 may be captured one by one and then stitched to obtain the 2D image as described above. Usually, Ni, i=1,..., M do not have to be the same. For example, N1=3, N2=4, and N3=2 may also be used.

More About Bombardment Beam Generators

In an embodiment, referring to FIGS. 7A-7C , bombardment beam generator 710 may be stationary relative to object 730 . In an embodiment, bombardment beam generator 710 may be physically fixed to target 725 .

In an embodiment, bombardment beam generator 710 may include a plurality of electron guns (not shown), each of which may transmit at least one of bombardment beams 712a, 712b, and 712c. For example, bombardment beam generator 710 may include a first electron gun and a second electron gun (not shown), wherein the first electron gun transmits bombardment beam 712a and the second electron gun transmits bombardment beams 712b and 712c. In an embodiment, the second electron gun may send the bombardment beams 712b and 712c one by one.

Although various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and not limitation, with the true scope and spirit being indicated by the appended claims.

2-2: Line 100: radiation detector 100a, 100b, 100c: radiation detectors 105: track 110: Radiation absorbing layer 111: the first doped region 112: Intrinsic area 113: the second doped region 114: discrete area 119A, 119B: electrical contacts 120: Electronic device layer 121: Electronic system 130: filling material 131: Through hole 150: primitive 190: effective area 195: Surrounding area 500: Encapsulation 510: printed circuit board 512: area 514: bonding wire 600: image sensor 650: System PCB 688: dead zone 700: Imaging system 710: Bombardment Beam Generator 712a, 712b, 712c: bombardment beams 720a, 720b, 720c: target points 722a, 722b, 722c: radiation beams 725: target 730: object 800: flow chart 810, 820: steps

Fig. 1 schematically shows a radiation detector according to an embodiment. Fig. 2 schematically shows a simplified cross-sectional view of a radiation detector according to an embodiment. Fig. 3 schematically shows a detailed cross-sectional view of a radiation detector according to an embodiment. Figure 4 schematically shows a detailed cross-sectional view of a radiation detector according to an alternative embodiment. Fig. 5 schematically shows a top view of a package comprising a radiation detector and a printed circuit board (PCB) according to an embodiment. FIG. 6 schematically illustrates a cross-sectional view of an image sensor including the package of FIG. 5 mounted to a system PCB (Printed Circuit Board) according to an embodiment. 7A-7C schematically illustrate perspective views of an imaging system in operation according to an embodiment. Figure 8 shows a flowchart outlining the operation of the imaging system.

100a, 100b, 100c: radiation detectors

105: track

700: Imaging system

710: Bombardment Beam Generator

712a: Bombardment Beam

720a, 720b, 720c: target points

722a: Radiation Beam

725: target

730: object

Claims (20)

A method of imaging comprising: Send M bombardment beams (bombardment beam (i), i=1, ..., M) to the target point (i) on the target, i = 1, ..., M, so as to get the results from the target point (i ) radiation beams (i) emitted by i=1,...,M and propagating to the object, i=1,...,M, wherein M is an integer greater than 1; and For each value of i, a 2D (two-dimensional) image (i) of said object is obtained using the radiation of said radiation beam (i) which has passed through said object, Wherein, the target is stationary relative to the object. The imaging method according to claim 1, further comprising reconstructing a 3D (three-dimensional) image of the object from the 2D image (i), i=1, . . . , M. The imaging method according to claim 1, wherein said obtaining said 2D image (i) of said object comprises: capturing Ni partial images of the object one by one using radiation of the radiation beam (i) that has passed through the object, where Ni is an integer greater than 1; and Stitching the Ni partial images of the object, so as to obtain the 2D image (i) of the object. The imaging method as claimed in claim 3, wherein all Ni, i=1, . . . , M are the same. The imaging method of claim 1, wherein each of the M bombardment beams comprises an electron beam. The imaging method according to claim 1, wherein the target comprises copper or tungsten. The imaging method according to claim 1, wherein the bombardment beams (i), i=1, ..., M are sent one by one. The imaging method according to claim 1, wherein all the 2D images (i) are obtained using an image sensor, i=1, . . . , M. The imaging method according to claim 1, wherein the sending of the M bombardment beams is performed using a bombardment beam generator, and the bombardment beam generator includes a plurality of electron guns, and each of the electron guns sends the M at least one of the bombardment beams. The imaging method of claim 9, wherein the bombardment beam generator is physically fixed to the target. An imaging system comprising: bombardment beam generator; target; and image sensor system comprising at least one image sensor, Wherein, the bombardment beam generator is configured to send M bombardment beams (bombardment beam (i), i=1, ..., M) to the target point (i) on the target, i = 1, ... ..., M, so as to obtain the radiation beams (i), i=1, ..., M emitted from the target point (i) i=1, ..., M and propagating to the object respectively, wherein, M is an integer greater than 1, wherein the image sensor system is configured, for each value of i, to obtain a 2D (two-dimensional) map of the object using the radiation of the radiation beam (i) that has passed through the object like (i), and Wherein, the target is stationary relative to the object. The imaging system according to claim 11, wherein the image sensor system is further configured to reconstruct the 3D (three-dimensional )image. The imaging system according to claim 11, wherein the image sensor system is further configured to obtain the 2D image (i) of the object by: capturing Ni partial images of the object one by one using radiation of the radiation beam (i) that has passed through the object, where Ni is an integer greater than 1; and Stitching the Ni partial images of the object, so as to obtain the 2D image (i) of the object. The imaging system of claim 13, wherein all Ni, i=1, . . . , M are the same. The imaging system of claim 11, wherein each of the M bombardment beams comprises an electron beam. The imaging system of claim 11, wherein the target comprises copper or tungsten. The imaging system according to claim 11, wherein the bombardment beams (i), i=1, . . . , M are sent one by one. The imaging system according to claim 11, wherein the image sensors of the image sensor system obtain all of the 2D images (i), i=1, . . . , M. The imaging system according to claim 11, wherein the bombardment beam generator comprises a plurality of electron guns, each of which transmits at least one of the M bombardment beams. The imaging system of claim 19, wherein the bombardment beam generator is physically fixed to the target.

Images