TW202310696A - Multilayer circuit board provided with impedance-sensitive electronic component and manufacturing method thereof - Google Patents

Abstract

The invention discloses a multi-layer circuit board provided with an impedance sensitive electronic component and a manufacturing method thereof. The multi-layer circuit board comprises a lower main board, an inner circuit board layer and an upper main board, wherein an inductor is arranged on the top surface of the lower mainboard; the inner circuit board layer is located between the upper mainboard and the lower mainboard and is provided with at least one inner circuit board surrounding the inductor, and the top surface of the inner circuit board layer is higher than or equal to the top surface of the inductor; the upper mainboard is provided with at least one impedance sensitive electronic element and an electroplating through hole structure; the electrode of the inductor is inserted into the electroplating through hole structure and is electrically connected with the electroplating through hole structure; through the design of the multi-layer circuit board, the distance between the impedance sensitive electronic element and the inductor can be effectively shortened, and the impedance of the circuit layout is effectively reduced.

Description

Multilayer circuit board provided with impedance-sensitive electronic components and manufacturing method thereof

The present invention relates to a multi-layer circuit board, in particular to a multi-layer circuit board, which is provided with impedance-sensitive electronic components.

Some circuit boards are equipped with impedance-sensitive electronic components (such as power modules) due to functional requirements. Impedance-sensitive electronic components refer to electronic components whose characteristics or performance will be seriously affected by the impedance of the circuit layout. Among them, the power module For example, in the circuit layout of the circuit board, it is hoped that the circuit between the power module and the electrically coupled capacitor or inductor can be shortened as much as possible, so as to reduce the overall impedance of the circuit layout and improve the power output efficiency. However, the conventional design of the circuit board simply places the above-mentioned impedance-sensitive electronic components on one of the layers of the multi-layer circuit board, and the circuit layout and arrangement of the electronic components cannot effectively reduce the overall impedance. The design of the circuit board is not perfect and there is still room for improvement.

One of the purposes of the present invention is to improve the deficiencies in the prior art, and further propose a multi-layer circuit board with impedance-sensitive electronic components. The distance between the circuit layout between the impedance-sensitive electronic components and the inductor is relatively short. Effectively reduce the overall impedance of the line layout.

The reason is that according to the structure of a multi-layer circuit board provided with impedance-sensitive electronic components provided by the present invention, it includes a lower main board, an inner circuit board layer and an upper main board. Wherein, an inductor is arranged on the top surface of the lower main board, and the top surface of the inductor has an electrode. The inner circuit board layer is arranged above the lower main board and has at least one inner circuit board. The at least one inner circuit board surrounds the inductor and is electrically connected to the lower main board. The top surface of the inner circuit board layer is higher than or equal to the top of the inductor. noodle. The upper main board is electrically connected to the inner circuit board layer and is provided with at least one impedance sensitive electronic component and a first electroplating through hole structure on the top surface. The first electroplating hole structure penetrates through the top and bottom surfaces of the upper main board and is electrically connected to the at least one impedance-sensitive electronic component. The electrodes of the inductor are plugged into the first electroplating hole structure and electrically connected to the first electroplating hole structure.

Through the design of the above-mentioned multi-layer circuit board, since the inductor is plugged into the above-mentioned first electroplating through-hole structure through its electrode and forms an electrical coupling with it, the wiring layout between the impedance-sensitive electronic component and the inductor can be effectively shortened. The distance can effectively reduce the overall impedance on the line layout.

In one aspect, in order to effectively adjust the height difference between the upper main board and the lower main board, the at least one inner circuit board can be a plurality of inner circuit boards, and the inner circuit boards are stacked and electrically connected to each other.

In another aspect, each inner circuit board includes a second electroplating through hole structure, the second electroplating through hole structure includes a through hole and two welding pads, the through hole runs through the top and bottom sides of each inner circuit board, and the through hole A metal layer is laid on the wall, and the two welding pads are respectively arranged on the top and bottom surfaces of each inner circuit board and cover the through holes. The two welding pads are electrically connected to the metal layer, and each inner circuit board is connected through the second electroplating through-hole structure. are electrically connected to each other.

In another aspect, the impedance sensitive electronic device can be but not limited to a Smart Power Stage chip.

The present invention also provides a multi-layer circuit board structure provided with impedance sensitive electronic components, which includes a lower main board, an inner circuit board layer and an upper main board. Wherein, an inductor is arranged on the top surface of the lower main board. The inner circuit board layer is arranged above the lower main board and has a plurality of pairs of electrical connection components. The plurality of electrical connection components surround the inductor and are electrically connected to the lower main board. Each group of the plurality of electrical connection components includes a board The board-to-board connector and an internal circuit board, the board-to-board connector includes a connector body and a pin connected to the connector body. Each inner circuit board includes an electroplating through hole structure. The electroplating through hole structure includes a through hole and a welding pad. The through hole runs through the top and bottom sides of the inner circuit board. The through hole is on one side of the inner circuit board and covers the side, the pin is inserted into the through hole, and the top surface of each group of the plurality of electrical connection components is coplanar with the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component on the top surface, and the at least one impedance-sensitive electronic component is electrically connected to the inductor.

In one aspect, the inner circuit board is located above the board-to-board connector, and in some cases, both the inner circuit board and the board-to-board connector may be reversed.

The present invention also provides a method for manufacturing a multilayer circuit board, the steps of which include: preparing a plurality of internal circuit boards stacked and electrically connected to each other; preparing a main board, mechanically and electrically coupling a top surface with an electrode The inductor is on the top surface of the above-mentioned lower main board, the inner circuit boards are arranged on the periphery of the inductor and surround the inductor, and the inner circuit boards are mechanically and electrically coupled on the lower main board; prepare to have a first electroplating An upper main board of the perforated structure, mechanically and electrically coupling at least one impedance-sensitive electronic component on both sides of the first electroplating through-hole structure; an inductor electrode is inserted into the first electroplating through-hole structure of the upper main board, electrically coupled to the inductance The electrodes of the device and the first plated through hole structure are electrically coupled to the inner circuit boards and the upper main board.

In one aspect, before inserting the electrodes of the inductor into the first plated through hole structure of the upper main board, the lower main board with the inner circuit boards and the inductor and the upper main board with the at least one impedance sensitive electronic component are also turned upside down .

The present invention also provides a method for manufacturing a multilayer circuit board, the steps of which include: preparing a plurality of inner circuit boards, wherein each inner circuit board includes an electroplating through hole structure, the electroplating through hole structure includes a through hole and a welding pad, the through hole Through the top and bottom sides of the inner circuit board, the hole wall of the through hole is laid with a metal layer, and the welding pad is set on one side of the inner circuit board and covers the through hole on this side. Prepare the main board, mechanically and electrically An inductor is coupled to the top surface of the lower main board and a plurality of board-to-board connectors disposed on the periphery of the inductor and mechanically and electrically coupled to the lower main board, wherein each board-to-board connector includes a connector The body and a pin connected to the connector body, place the inner circuit boards on the board-to-board connectors and make the electroplating perforation structure of each inner circuit board face the pins of each board-to-board connector correspondingly, so as to The inner circuit boards are pressed down until the top surfaces of the inner circuit boards are coplanar with the top surfaces of the inductors by means of press-fit insertion; an upper main board is prepared, mechanically and electrically coupled At least one impedance-sensitive electronic component is on the top surface of the upper main board; the upper main board is electrically connected to the inner circuit boards, and the at least one impedance-sensitive electronic component and the inductor are electrically coupled through the upper main board.

The technical content and features of the present invention will be described in detail below by referring to several embodiments listed in conjunction with the drawings. The terms "upper", "lower", "inner", "outer", "top", etc. Directional adjectives such as "bottom" are only illustrative descriptions based on the normal use direction, and are not intended to limit the scope of claims.

In order to describe the technical features of the present invention in detail, hereby give the following two embodiments and explain them as follows in conjunction with the drawings, wherein:

As shown in FIG. 1 , the first embodiment provides a multilayer circuit board 1 provided with impedance-sensitive electronic components, which includes a lower main board 10 , an inner circuit board layer 20 and an upper main board 30 .

Several welding pads 11 are laid on the top surface of the lower main board 10 , and an inductor 12 is arranged in the center of the top surface of the lower main board 10 . As shown in FIG. 2 , the inductor 12 structurally includes a body 13 and two electrodes 14 , the bottom of the body 13 is electrically connected to the lower main board 10 , and the two electrodes 14 are disposed on the top surface of the body 13 and extend upward.

The inner circuit board layer 20 is located above the lower main board 10 and includes a plurality of inner circuit boards 21. These inner circuit boards 21 are arranged in groups, and each group of inner circuit boards 21 is composed of a plurality of inner circuit boards. 21 are stacked up and down, and in this embodiment, the number of circuit boards 21 in each group is three. The inner circuit boards 21 surround the inductor 12 , and each set of inner circuit boards 21 is electrically connected to the lower main board 10 . Please refer to FIG. 3 , each inner circuit board 21 includes a plating through hole structure P2 (Plating Through Hole), and the plating through hole structure P2 includes a through hole 23 and two welding pads 24 in structure, and the through hole 23 runs through each inner circuit board 21 The top and bottom sides of the inner circuit board 21 are covered with a metal layer 25 on the wall of the through hole 23 and a resin 26 is arranged in the through hole 23. The two welding pads 24 are respectively arranged on the top and bottom sides of each inner circuit board 21 and cover the The through hole 23 and the two welding pads 24 are electrically connected to the metal layer 25 . By electroplating the through-hole structure P2, the stacked internal circuit boards 21 can be electrically connected to each other effectively, and the height of the top surface of the internal circuit board layer 20 can be controlled so that the top surface of the internal circuit board layer 20 is higher than or equal to the inductance. the top surface of device 12.

Please return to FIG. 1 , the upper main board 30 is located above the inner circuit board layer 20 and several welding pads 31 are laid on the top surface and the bottom surface, so that the upper main board 30 can be electrically connected to the inner circuit board layer 20 through the welding pads 31 . The top surface of the upper main board 30 is provided with two impedance sensitive electronic components 32 arranged at intervals and two plated through hole structures P1 (only one of which is shown in FIG. 1 ) disposed between the two impedance sensitive electronic components 32 . In this embodiment, the impedance sensitive electronic component 32 is a Smart Power Stage chip. In some cases, there may be only one impedance-sensitive electronic component 32 . The structure of the plated through-hole structure P1 of the upper main board 30 is different from the plated through-hole structure P2 of the inner circuit board 21. Specifically, the plated through-hole structure P1 of the upper main board 30 runs through the top and bottom sides of the upper main board 30 and is connected by wires. The two impedance sensitive electronic components 32 are electrically connected, the metal layer 34 is laid on the hole wall of the through hole 33, the electrode 14 of the inductor 12 is inserted into the through hole 33 of the electroplating through hole structure P1 and electrically connected to the electroplating through hole structure P1, so that The two impedance sensitive electronic components 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper main board 30 .

Through the design of the above-mentioned multilayer circuit board 1, since the inductor 12 is inserted into the above-mentioned electroplating through-hole structure P1 through its electrode 14 and forms an electrical coupling with the electroplating through-hole structure P1 of the upper main board 30, the impedance-sensitive electronic component 32 can pass through. The plated through hole structure P1 of the upper main board 30 is electrically connected to the inductor 12 with a shorter wiring layout distance, which can effectively shorten the wiring layout distance between the impedance sensitive electronic component 32 and the inductor 12, and can effectively The overall impedance on the circuit layout can be reduced to a minimum, and the output efficiency of the impedance-sensitive electronic component 32 can be improved.

The manufacturing method of the multilayer circuit board 1 of the first embodiment will be described below, please refer to FIG. 4, FIG. 5A to FIG. 5P, the above-mentioned manufacturing method includes the following steps:

Step S1.1: Prepare a plurality of internal circuit boards that are stacked and electrically connected to each other. Specifically, prepare a first inner circuit board connecting piece 27B (as shown in Figure 5A), the first inner circuit board connecting piece 27B includes a plurality of first inner circuit boards 21a connected horizontally, and each first inner circuit board 21a are all provided with plated through hole structure P2. A cutting process (routing) is performed to separate each first inner circuit board 21a (as shown in FIG. 5B ). Next, prepare a second inner circuit board connection piece 28B, the second inner circuit board connection piece 28B also has a plurality of second inner circuit boards 21b connected horizontally, and the second inner circuit board 21b is also provided with a plated through hole structure P2 ( As shown in Fig. 5C), the above separated first inner circuit boards 21a are placed on the welding pads 24 of the second inner circuit board connecting piece 28B, and the first inner circuit boards are bonded by surface mount process (SMT). The board 21a is mechanically and electrically coupled to the second inner circuit board connecting piece 28B (as shown in FIG. 5D ), and then the cutting process (routing) is performed to cut the second inner circuit board connecting piece 28B, so that multiple inner circuit board connecting pieces 28B will be formed. A group G1 of internal circuit boards is formed by stacking the first internal circuit board 21 a and the second internal circuit board 21 b up and down (as shown in FIG. 5E ). Afterwards, prepare a third inner circuit board connecting piece 29B, the third inner circuit board connecting piece 29B also has a plurality of third inner circuit boards 21c connected horizontally, and the third inner circuit board 21c is also provided with electroplating through-hole structure P2 (as shown in FIG. 5F ), place the above-mentioned cut inner circuit board group G1 on the welding pad 24 of the third inner circuit board connecting piece 29B, and use the surface mount process (SMT) to place the inner circuit board groups The group G1 is mechanically and electrically coupled to the third inner circuit board connecting piece 29B (as shown in FIG. 5G ), and finally performs a cutting process (routing) to cut the third inner circuit board connecting piece 29B, thus forming multiple groups of the first inner circuit board connecting piece 29B. To the inner circuit board group G2 stacked on top of the third inner circuit boards 21a-21c (as shown in FIG. 5H).

Next, prepare the main board connecting piece 10B, the lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally, lay several welding pads 11 (as shown in Figure 5I) on the top surface of the lower main board connecting piece 10B, and prepare a plurality of top surfaces An inductor 12 with an electrode 14 is executed to glue the inductor 12 on the soldering pad 11 on the top surface of the lower main board connecting piece 10B, and the above-mentioned multiple groups of first to third inner circuit boards 21a- The upper and lower inner circuit board groups G2 of 21c are located on the soldering pads 11 on the top surface of the lower motherboard connecting piece 10B and are located at the periphery of the inductor 12 so as to surround the inductor 12 . The inductor 12 and the above-mentioned inner circuit board group G2 (ie, the inner circuit boards 21a-21c) are mechanically and electrically coupled to the top surface of the lower main board 10 by surface mount process (SMT) (as shown in FIG. 5J ). . Perform a laser cutting process (laser cutting) to separate a plurality of lower main boards 10 with inductors 12 and the inner circuit boards 21a-21c (as shown in FIG. 5K).

Step S1.2: Prepare an upper main board connecting piece 30B. The upper main board connecting piece 30B includes a plurality of upper main boards 30 connected horizontally. Each upper main board 30 has a plated through-hole structure P1 and several welding pads are provided on the top surface 31 (as shown in Figure 5L). A plurality of impedance-sensitive electronic components 32 are arranged on both sides of each plated through-hole structure P1, and the impedance-sensitive electronic components 32 are mechanically and electrically coupled to the top surface of the upper main board 30 by a surface mount process (SMT) (as shown in FIG. 5M), and lay a layer of thermal interface material 36 (Thermal Interface Material; TIM; FIG. 5N ) on each impedance sensitive electronic component 32 .

Step S1.3: Invert the lower main board 10 with the inner circuit boards 21a-21c and the inductor 12 and the upper main board connecting sheet 30B with the impedance sensitive electronic components 32, and insert the electrodes 14 of the inductor 12 into the upper main board 30 The electroplated through-hole structure P1 is mechanically and electrically coupled to the inductor 12 and the electroplated through-hole structure P1 by a surface mount process (SMT), and electrically coupled to the inner circuit boards 21a-21c and the upper main board 30 ( Figure 5O). Finally, a laser cutting process (laser cutting) is performed to cut the upper main board connecting piece 30B provided with the inductor 12, the impedance sensitive electronic component 32 and the inner circuit boards 21a-21c, and the present invention can be produced. A plurality of multi-layer circuit boards 1 provided with impedance-sensitive electronic components 32 according to the first embodiment of the invention (as shown in FIG. 5P ).

It should be noted that step S1.2 may be performed before step S1.1, and step S1.2 may even be performed simultaneously with step S1.1.

The present invention further provides a second embodiment, please refer to FIG. 6 . The second embodiment also provides a multilayer circuit board 1' provided with impedance-sensitive electronic components, which can be applied to an inductor 12' in the form of surface mount (SMD). The multilayer circuit board 1' of the second embodiment includes a lower main board 10, an inner circuit board layer 20 and an upper main board 30 structurally.

The top surface of the lower main board 10 is laid with several welding pads 11, and the center of the top surface of the lower main board 10 is provided with an inductor 12'. Both the top surface and the bottom surface of the inductor 12' are provided with electrodes 14, and the inductor 12' is electrically connected to the lower motherboard 10 through the electrodes 14 on the bottom surface.

The inner circuit board layer 20 is disposed above the lower main board 10 and has a plurality of pairs of electrical connection components G3, the plurality of electrical connection components G3 surround the inductor 12' and are electrically connected to the lower main board 10. Each group of electrical connection components G3 includes a board-to-board connector 22 (board-to-board connector; FIG. 7 ) and an inner circuit board 21 ( FIG. 8 ) disposed above the board-to-board connector 22 . Wherein, the board-to-board connector 22 includes a connector body 221 and a pin 222 connected to the connector body 221 . The inner circuit board 21 includes an electroplating through hole structure P3, the electroplating through hole structure P3 includes a through hole 23 and a welding pad 24, the through hole 23 runs through the top and bottom sides of the inner circuit board 21, and the hole wall of the through hole 23 is paved with metal The layer 25 and the soldering pad 24 are disposed on the top surface of the inner circuit board 21 and cover the through hole 23 . The pin 222 of the board-to-board connector 22 is plugged upwardly into the through hole 23 of the plated through hole structure P3 of the inner circuit board 21 , and the board-to-board connector 22 is electrically coupled to the inner circuit board 21 through the pin 222 . In addition, by means of press-fit insertion, the top surface of each group of electrical connection components G3 is coplanar with the top surface of the inductor 12 ′, so as to facilitate the inner circuit board layer 20 and the inductor 12 'Subsequently, electrical coupling with the upper main board 30 can be successfully formed.

The upper main board 30 is disposed above the inner circuit board layer 20 , and a plurality of welding pads 31 are laid on the top surface and the bottom surface of the upper main board 30 . The top surface of the upper main board 30 is provided with two impedance sensitive electronic components 32 arranged at intervals (in this embodiment, the impedance sensitive electronic components 32 are Smart Power Stage module (Smart Power Stage) chips. And in some cases, the upper main board There may be only one impedance sensitive electronic component 32 of 30). The upper main board 30 is electrically connected to the inner circuit board layer 20, and the two impedance sensitive electronic components 32 are electrically connected to the inductor 12' through the upper main board 30, so as to shorten the circuit layout between the two impedance sensitive electronic components 32 and the inductor 12' distance.

Through the design of the multilayer circuit board 1' of the second embodiment, the distance of the circuit layout between the impedance-sensitive electronic component 32 and the inductor 12' can also be shortened, and the overall impedance on the circuit layout can be effectively reduced, and the impedance can be improved. Output efficiency of sensitive electronic components 32 .

The manufacturing method of the multilayer circuit board 1' of the second embodiment will be described below, please refer to Fig. 9, Fig. 10A to Fig. 10K, the above-mentioned manufacturing method includes the following steps:

Step S2.1: Prepare a plurality of inner circuit boards. Specifically, prepare an inner circuit board connection piece 21B (as shown in FIG. 10A ), the inner circuit board connection piece 21B includes a plurality of inner circuit boards 21 connected horizontally, and each inner circuit board 21 includes an electroplating through hole structure P3 (please refer to FIG. Referring to FIG. 8 ), the electroplating through hole structure P3 includes a through hole 23 and a welding pad 24, the through hole 23 runs through the top and bottom sides of the inner circuit board 21, the hole wall of the through hole 23 is laid with a metal layer 25, and the welding pad 24 It is disposed on the top surface of the inner circuit board 21 and covers the through hole 23 . After that, a cutting process (routing) is performed to separate each inner circuit board 21 from the inner circuit board connecting piece 21B (as shown in FIG. 10B ).

Step S2.2: Prepare the main board connecting piece 10B. The lower main board connecting piece 10B includes a plurality of lower main boards 10 connected horizontally, and lay several welding pads 11 on the top surface of the lower main board connecting piece 10B (as shown in FIG. 10C ). A plurality of surface-mounted (SMD) inductors 12' and a plurality of board-to-board connectors 22 are prepared. Mechanically and electrically couple the inductor 12' and the above-mentioned board-to-board connector 22 to the top surface of the lower motherboard connection piece 10B (as shown in FIG. 10D ) by surface mount process (SMT) and configure the board-to-board connections The inductor 22 is on the periphery of the inductor 12' and surrounds the inductor 12'. Each board-to-board connector 22 includes a connector body 221 and a pin 222 connected to the connector body 221 (please refer to FIG. 7 ), and the pin 222 extends upward. A laser cutting process (laser cutting) is performed to separate the lower motherboard 10 each provided with the inductor 12' and the board-to-board connector 22 (as shown in FIG. 10E ). Place the inner circuit boards 21 on the board-to-board connectors 22 and make the plated through-hole structure P3 of each inner circuit board 21 correspondingly face the pins 222 of each board-to-board connector 22, using a press fit insertion machine (Press-fit insertion machine), the inner circuit boards 21 are pressed down until the top surfaces of the inner circuit boards 21 are coplanar with the top surface of the inductor 12' in a press-fit insertion manner (press-fit insertion) Figure 10F).

Step S2.3: prepare an upper main board connecting piece 30B, the upper main board connecting piece 30B includes a plurality of upper main boards 30 connected horizontally, prepare a plurality of impedance sensitive electronic components 32, and arrange them on positions corresponding to each upper main board 30 At least one of the impedance-sensitive electronic components 32 is mechanically and electrically coupled to the top surface of the upper motherboard connecting sheet 30B by surface mount process (SMT) (as shown in FIG. 10H ).

Step S2.4: Invert the lower main board 10 provided with the board-to-board connector 22, the inner circuit board 21 and the inductor 12', and the upper main board connecting piece 30B provided with the impedance-sensitive electronic components 32, and configure the above-mentioned inverted The lower main board 10 is above the above-mentioned inverted upper main board connecting sheet 30B, and the inner circuit boards 21 are mechanically and electrically coupled to the bottom surface of the upper main board connecting sheet 30B by surface mount process (SMT) (as shown in FIG. 10I ), and allow the impedance sensitive electronic components 32 to be electrically coupled to the inductor 12' through the upper motherboard connection piece 30B. Afterwards, a layer of thermal interface material 36 (Thermal Interface Material; TIM; FIG. 10J ) is laid on each impedance-sensitive electronic component 32 . Finally, a laser cutting process (laser cutting) is performed to cut the upper main board connecting sheet 30B, and then a plurality of multilayer circuit boards 1' provided with impedance-sensitive electronic components 32 according to the second embodiment of the present invention can be produced (as shown in FIG. 10K).

It should be noted that step S2.3 may be performed before step S2.1, and step S2.3 may even be performed simultaneously with step S2.1.

Finally, it must be stated again that the methods and constituent elements disclosed in the foregoing embodiments of the present invention are for illustration only, and are not intended to limit the scope of the patent of the present invention. Or the replacement with other equivalent elements should still belong to the category covered by the patent scope of the present invention application.

1,1': multi-layer circuit board 10: Lower the motherboard 10B: Connecting the lower main board 11: Welding pad 12,12': Inductor 13: Ontology 14: electrode 20: inner circuit board layer 21: Inner circuit board 22: Board-to-board connector 221: connector body 222: plug 23: Through hole 24: Welding pad 25: metal layer 26: Resin 30: on the motherboard 30B: Connecting the main board 31: Welding pad 32: Impedance sensitive electronic components 33: through hole 34: metal layer 36: thermal interface material 21B: Inner circuit board connection 27B: The first inner circuit board connection 21a: the first inner circuit board 28B: The second inner circuit board connection 21b: The second inner circuit board 29B: The third inner circuit board connection 21c: The third inner circuit board G1, G2: inner circuit board group G3: electrical connection components P1, P2, P3: plated through-hole structure

The detailed structure, characteristics, and manufacturing method of the above-mentioned multilayer circuit board provided with impedance-sensitive electronic components will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are only examples To illustrate, it should not be used to limit the patent scope of the present invention, wherein:

Fig. 1 is the schematic sectional view of the multilayer circuit board of the first embodiment; Fig. 2 is the perspective view of the inductor of the first embodiment; 3 is a schematic cross-sectional view of the inner circuit board of the first embodiment, used to illustrate the second electroplating through-hole structure; Fig. 4 is the flow chart of the steps of the manufacturing method of the multilayer circuit board of the first embodiment; 5A to 5P are schematic cross-sectional views corresponding to the steps of FIG. 4; Fig. 6 is the schematic cross-sectional view of the multilayer circuit board of the second embodiment; Fig. 7 is a schematic diagram of the appearance of the board-to-board connector of the second embodiment; FIG. 8 is a schematic cross-sectional view of the inner circuit board of the second embodiment, used to illustrate the electroplating through-hole structure; Fig. 9 is the flow chart of the steps of the manufacturing method of the multilayer circuit board of the second embodiment; and 10A to 10K are schematic cross-sectional views corresponding to the steps in FIG. 9 .

1: Multi-layer circuit board

10: Lower the motherboard

11: Welding pad

12: Inductor

13: Ontology

14: electrode

20: inner circuit board layer

21: Inner circuit board

30: on the motherboard

31: Welding pad

32: Impedance sensitive electronic components

33: through hole

34: metal layer

P1: Plated perforated structure

Claims (12)

A multilayer circuit board provided with impedance sensitive electronic components, comprising: As for the main board, an inductor is provided on the top surface, and an electrode is provided on the top surface of the inductor; An inner circuit board layer is arranged above the lower main board and has at least one inner circuit board, the at least one inner circuit board surrounds the inductor and is electrically connected to the lower main board, the top surface of the inner circuit board layer is higher than or equal to the the top surface of the inductor; An upper main board, which is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component and a first electroplating through-hole structure on the top surface, and the first electroplating through-hole structure penetrates the top and bottom sides of the upper main board and is electrically connected to the At least one impedance-sensitive electronic component, the electrode of the inductor is plugged into the first electroplating hole structure and electrically connected to the first electroplating hole structure. The multi-layer circuit board as claimed in claim 1, wherein the at least one inner circuit board is a plurality of inner circuit boards, and the inner circuit boards are stacked and electrically connected to each other. The multilayer circuit board as claimed in claim 2, wherein each inner circuit board includes a second plated through hole structure, the second plated through hole structure includes a through hole and two welding pads, and the through hole penetrates each inner circuit board The top and bottom sides of the inner circuit board are covered with a metal layer on the wall of the through hole. The two welding pads are respectively arranged on the top and bottom sides of each inner circuit board and cover the through hole. The two welding pads are electrically connected to the metal layer. layer, and each of the inner circuit boards is electrically connected to each other through the second plated through hole structure. The multilayer circuit board as claimed in any one of claims 1 to 3, wherein the at least one impedance-sensitive electronic component is a Smart Power Stage chip. A multilayer circuit board provided with impedance sensitive electronic components, comprising: Next to the main board, there is an inductor on the top surface; An inner circuit board layer is arranged above the lower main board and has a plurality of pairs of electrical connection components, the plurality of electrical connection components surround the inductor and are electrically connected to the lower main board, each of the plurality of electrical connection components Both include a board-to-board connector and an inner circuit board, the board-to-board connector includes a connector body and a pin connected to the connector body, the inner circuit board includes a plated through-hole structure, and the plated through-hole structure includes There is a through hole and a welding pad, the through hole runs through the top and bottom sides of the inner circuit board, the hole wall of the through hole is covered with a metal layer, the welding pad is arranged on one side of the inner circuit board and covers the through hole hole, the pin is plugged into the through hole, and the top surface of each of the plurality of groups of electrical connection components is coplanar with the top surface of the inductor; An upper main board is electrically connected to the inner circuit board layer and has at least one impedance sensitive electronic component on the top surface, and the impedance sensitive electronic component is electrically connected to the inductor. The multi-layer circuit board as claimed in claim 5, wherein the inner circuit board is located above the board-to-board connector. The multilayer circuit board as claimed in claim 5 or 6, wherein the at least one impedance-sensitive electronic component is a Smart Power Stage chip. A method for manufacturing a multilayer circuit board, the steps of which include: Prepare a plurality of internal circuit boards stacked on each other and electrically connected; prepare a main board, mechanically and electrically couple an inductor with an electrode on the top surface to the top surface of the lower main board, and configure the internal circuit boards on the top surface of the lower main board The periphery of the inductor and surrounding the inductor are mechanically and electrically coupled to the inner circuit boards on the lower main board; preparing an upper main board having a first plating through hole structure, mechanically and electrically coupling at least one impedance sensitive electronic component to the first plating through hole structure; Inserting the electrode of the inductor into the first plated through hole structure of the upper main board, electrically coupling the electrode and the first plated through hole structure and electrically coupling the inner circuit boards and the upper main board. The method for manufacturing a multilayer circuit board as claimed in item 8, wherein before inserting the electrode of the inductor into the first plated through-hole structure of the upper main board, the inner circuit board and the inductor are also inverted The lower main board and the upper main board are provided with the impedance sensitive electronic components. The method for manufacturing a multilayer circuit board according to claim 8, wherein each inner circuit board includes a second plated through hole structure, and the second plated through hole structure includes a through hole and two welding pads, and the through hole runs through each of the plated through holes The top and bottom sides of the inner circuit board, the hole wall of the through hole is laid with a metal layer, the two welding pads are respectively arranged on the top and bottom sides of each inner circuit board and cover the through hole, the two welding pads are electrically The metal layer is connected, and each of the inner circuit boards is electrically connected to each other through the second plated through hole structure. A method for manufacturing a multilayer circuit board, the steps of which include: Prepare a plurality of internal circuit boards, wherein each of the internal circuit boards includes an electroplating through hole structure, the electroplating through hole structure includes a through hole and a welding pad, the through hole penetrates the top and bottom sides of the inner circuit board, the through hole A metal layer is laid on the hole wall of the hole, and the welding pad is arranged on one side of the inner circuit board and covers the through hole; Prepare a mainboard, mechanically and electrically couple an inductor to the top surface of the lower mainboard and a plurality of board-to-board connectors arranged around the inductor and mechanically and electrically coupled to the lower mainboard, Wherein each of the board-to-board connectors includes a connector body and a pin connected to the connector body; placing the inner circuit boards on the board-to-board connectors and making the electroplating of each inner circuit board The perforation structure faces the pins of the board-to-board connectors correspondingly, and presses down the inner circuit boards in a press-fit insertion manner until the top surfaces of the inner circuit boards are aligned with the inductors. Coplanar top surface; preparing an upper main board, mechanically and electrically coupling at least one impedance sensitive electronic component to the top surface of the upper main board; The upper circuit board and the inner circuit boards are electrically coupled, and the at least one impedance sensitive electronic component and the inductor are electrically coupled through the upper main board. The method for manufacturing a multilayer circuit board as claimed in claim 11 further includes laying a layer of thermal interface material on the at least one impedance-sensitive electronic component.

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