TW202307808A - Display device and manufacturing method thereof - Google Patents

Abstract

A display device and a manufacturing method thereof are provided. The display device includes a substrate, a partition layer, a light emitting element and an optical layer. The partition layer is disposed on the substrate and includes an aperture. The light emitting element and the optical layer are disposed in the aperture.

Description

Display device and manufacturing method thereof

The present invention relates to an electronic device and its manufacturing method, and in particular to a display device and its manufacturing method.

Molding or etching processes are often used to process optical layers (eg, microlens structures). Both of these methods are complex and not easy to control the profile of the optical layer.

The invention provides a display device and a manufacturing method thereof, which can simplify the manufacturing difficulty of the optical layer and achieve good optical effect.

In an embodiment of the invention, a display device includes a substrate, a spacer layer, a light emitting element, and an optical layer. The spacer layer is disposed on the substrate and includes openings. The light emitting element and the optical layer are arranged in the opening.

In an embodiment of the invention, a manufacturing method of a display device includes the following steps. Substrate provided. A spacer layer is formed on the substrate, and the spacer layer includes openings. A light emitting element is arranged in the opening. An optical layer is formed within the opening.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and descriptions to refer to the same or like parts.

Certain terms are used throughout the specification and attached claims of this disclosure to refer to particular elements. Those skilled in the art should understand that manufacturers of electronic devices may refer to the same element with different names. This document does not intend to distinguish between those elements that have the same function but have different names. In the following specification and patent application scope, words such as "comprising" and "including" are open-ended words, so they should be interpreted as meaning "including but not limited to...".

The directional terms mentioned herein, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings. Accordingly, the directional terms used are for illustration, not for limitation of the present disclosure. In the drawings, each figure illustrates the general characteristics of methods, structures and/or materials used in particular embodiments. However, these drawings should not be interpreted as defining or limiting the scope or nature encompassed by these embodiments. For example, the relative sizes, thicknesses and positions of layers, regions and/or structures may be reduced or exaggerated for clarity.

A structure (or layer, element, substrate) described in this disclosure is located on/over another structure (or layer, element, substrate), which may mean that the two structures are adjacent and directly connected, or may be Refers to two structures that are adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate element, intermediate substrate, intermediate space) between two structures, the lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the other The upper surface of a structure is adjacent to or directly connected to the lower surface of the intermediary structure. The intermediary structure can be composed of a single-layer or multi-layer physical structure or a non-physical structure without limitation. In this disclosure, when a certain structure is set "on" other structures, it may mean that a certain structure is "directly" on other structures, or that a certain structure is "indirectly" on other structures, that is, between a certain structure and other structures At least one structure is also interposed.

The terms "equal to" or "same" are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1% of a given value or range or within 0.5%.

Words such as "first" and "second" used in the specification and patent claims are used to modify elements, which do not imply and represent that the (or these) elements have any previous ordinal numbers, nor The use of these ordinal numbers is only used to clearly distinguish an element with a certain designation from another element with the same designation. The same wording may not be used in the scope of the patent application and the specification. Accordingly, the first component in the specification may be the second component in the scope of the patent application.

The electrical connection or coupling described in this disclosure can refer to direct connection or indirect connection. In the case where there are switches, diodes, capacitors, inductors, resistors, other suitable components, or a combination of the above components between the terminals of the components on the two circuits, but not limited thereto.

In the present disclosure, the thickness, length and width can be measured by using an optical microscope, and the thickness or width can be measured by a cross-sectional image in an electron microscope, but not limited thereto. In addition, any two values or directions used for comparison may have certain errors. In addition, the terms "equal to", "equal", "same", "substantially" or "substantially" mentioned in the present disclosure generally mean falling within 10% of a given value or range. In addition, the terms "the given range is from the first numerical value to the second numerical value" and "the given range falls within the range from the first numerical value to the second numerical value" mean that the given range includes the first numerical value, the second numerical value and their other values in between. If the first direction is perpendicular to the second direction, the angle between the first direction and the second direction can be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction The angle between the directions may be between 0 degrees and 10 degrees.

It should be noted that in the following embodiments, without departing from the spirit of the present disclosure, features in several different embodiments may be replaced, reorganized, and mixed to complete other embodiments. As long as the features of the various embodiments do not violate the spirit of the invention or conflict, they can be mixed and matched arbitrarily.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It can be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having meanings consistent with the background or context of the related technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner, Unless otherwise specified in the disclosed embodiments.

In the present disclosure, the electronic device may include a display device, a backlight device, an antenna device, a sensing device or a splicing device, but not limited thereto. The electronic device can be a bendable or flexible electronic device. The display device can be a non-self-luminous display device or a self-luminous display device. The electronic device may, for example, include liquid crystal, light emitting diode, fluorescence, phosphor, quantum dot (QD), other suitable display media, or a combination thereof. The antenna device can be a liquid crystal type antenna device or a non-liquid crystal type antenna device, and the sensing device can be a sensing device for sensing capacitance, light, thermal energy or ultrasonic waves, but not limited thereto. In the present disclosure, the electronic components in the electronic device may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, and the like. The diodes may include light emitting diodes or photodiodes. The light emitting diodes may, for example, include organic light emitting diodes (organic light emitting diodes, OLEDs), submillimeter light emitting diodes (mini LEDs), micro light emitting diodes (micro LEDs) or quantum dot light emitting diodes (quantum light emitting diodes). dot LED), but not limited to. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that, the electronic device can be any permutation and combination mentioned above, but not limited thereto. In addition, the shape of the electronic device can be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The electronic device may have a driving system, a control system, a light source system, ... and other peripheral systems to support a display device, an antenna device, a wearable device (such as including augmented reality or virtual reality), a vehicle device (such as including a car windshield ) or a splicing device. In the following, the display device is used as an electronic device or a splicing device to illustrate the content of the disclosure, but the disclosure is not limited thereto.

It should be noted that the technical solutions provided in different embodiments below can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

FIG. 1 is a schematic cross-sectional view illustrating a manufacturing method of an optical layer. 2 to 7 are partial cross-sectional schematic diagrams of display devices according to various embodiments of the present disclosure, respectively.

Referring to FIG. 1 , in an embodiment of the present disclosure, the method for forming the optical layer L1 may include a printing process. The printing process may include inkjet printing process, but not limited thereto.

Taking FIG. 1 as an example, the spacer layer L2 can be formed first, and the spacer layer L2 has the opening A1. Next, an optical layer L1 is formed in the opening A1. In some embodiments, both the spacer layer L2 and the optical layer L1 can be formed through a printing process, and the materials of the spacer layer L2 and the optical layer L1 can include polymer materials, solvents, and additives, but are not limited thereto. For example, the polymer material included in the optical layer L1 may be, for example, acrylic resin, but not limited thereto.

A specific surface energy phenomenon occurs between the material M of the optical layer L1 and the material of the spacer layer L2 , and the optical layer L1 having a microlens configuration can be formed in the opening A1 . For example, when the contact angle between the material M and the spacer layer L2 is less than 30 degrees, a coffee ring effect (coffee ring effect) will occur to form a microlens configuration as shown in FIG. limit. The microlens configuration is, for example, a ring structure. More specifically, it means that the optical layer L1 has a concave arc-shaped surface S1, which can change the direction of incident light.

By adjusting the contact angle between the optical layer L1 and the spacer layer L2, various parameters of the microlens configuration can be controlled, such as the maximum height H of the microlens configuration in the viewing direction D1 of the display device, and the curvature of the curved surface S1 Or the shape of the microlens configuration, etc., but not limited thereto.

The method of adjusting the contact angle between the optical layer L1 and the spacer layer L2 may include adjusting the surface tension of at least one of the optical layer L1 and the spacer layer L2. In some embodiments, the surface tension of the optical layer L1 can be adjusted by changing the solvent and/or additives in the material M of the optical layer L1 . In some embodiments, the surface tension of the spacer layer L2 can be adjusted by performing surface treatment on the spacer layer L2. The surface treatment may include applying plasma mixed with argon and oxygen, plasma mixed with argon and chloroform (CHF ₃ ), or plasma mixed with argon and carbon tetrafluoride (CF ₄ ) to the surface of the spacer layer L2. Plasma, argon plasma, or irradiating ultraviolet light, etc., but not limited thereto. In some embodiments, the surface tension of the spacer layer L2 can be adjusted by adjusting the ratio of the fluorine-containing additive in the material of the spacer layer L2 .

The surface energy phenomenon of the printing process is used to form the optical layer L1 with a micro-lens configuration, thereby simplifying the manufacturing difficulty of the optical layer L1. In some embodiments, although not shown, the optical layer L1 may include scattering particles, metal particles or a combination of the two, so as to enhance the reflectivity or light collection effect of the optical layer L1. The material of the scattering particles may include titanium dioxide, but is not limited thereto. The material of the metal particles may include silver, gold or aluminum, but not limited thereto. The optical layer in the following embodiments may also include scattering particles, metal particles or a combination of the above two, which will not be repeated below.

Referring to FIG. 2 , the display device 1 includes a substrate 10 , a spacer layer 11 , a light emitting element 12 and an optical layer 13 . The spacer layer 11 is disposed on the substrate 10 and includes an opening A2. The light emitting element 12 and the optical layer 13 are disposed in the opening A2.

In detail, the substrate 10 can be an array substrate. Although not shown, the array substrate may include a carrier, a driving element, a common electrode, a dielectric layer, etc., but is not limited thereto. The carrier board can be a rigid substrate or a flexible substrate. The material of the carrier includes, for example, silicon (such as polysilicon), glass, quartz, ceramics, sapphire or plastic, but not limited thereto. The drive elements may include transistors. The transistor may include a gate, a semiconductor layer, a source, a drain, etc., but not limited thereto. The material of the semiconductor layer may include amorphous silicon, polysilicon, metal oxide, or a combination thereof. The metal oxide may include Indium Gallium Zinc Oxide (IGZO), but not limited thereto.

The spacer layer 11 is, for example, a pixel definition layer, and the spacer layer 11 can be formed on the substrate 10 through the above-mentioned method (such as printing process). Regarding the content of the spacer layer 11 , reference may be made to the relevant description of the spacer layer L2 above, which will not be repeated here.

The light emitting element 12 is disposed on the substrate 10 and located in the opening A2. In some embodiments, the light emitting element 12 can be fixed on the pad P of the substrate 10 through the conductive member C and electrically connected to the pad P. Referring to FIG. In some embodiments, the material of the pad P may include copper, aluminum, other conductive materials or combinations thereof, but not limited thereto. In some embodiments, the material of the pad P may include Electroless Nickel Immersion Gold (Electroless Nickel Immersion Gold, ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Immersion Silver (Immersion Silver) , Electrolytic Gold or Electrolytic Nickel, but not limited thereto. The material of the conductive member C may include tin, copper paste, other metal materials or anisotropic conductive film (ACF), but not limited thereto.

The light emitting element 12 is used for providing light beams (not shown). The light emitting element 12 may include a light emitting diode (Light Emitting Diode, LED), an organic light emitting diode (Organic Light Emitting Diode, OLED), a submillimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) ) or quantum dot light-emitting diodes (Quantum Dot LED, referred to as QLED or QD-LED). In some embodiments, the light emitting element 12 is a bare die, and each surface of the light emitting element 12 can emit light.

In some embodiments, the display device 1 includes a plurality of light emitting elements 12 , and the plurality of light emitting elements 12 are respectively disposed in the plurality of openings A2 . In some embodiments, the plurality of light emitting elements 12 can be blue light emitting elements that output blue light, but not limited thereto.

The optical layer 13 is disposed on the substrate 10 and located in the opening A2. The optical layer 13 can be formed on the substrate 10 through the above methods (such as printing process). Regarding the content of the optical layer 13 , reference may be made to the related description of the above optical layer L1 , which will not be repeated here.

The manufacturing method of the display device 1 includes, for example, the following steps. A substrate 10 is provided. A spacer layer 11 is formed on the substrate 10, and the spacer layer 11 includes an opening A2. The light emitting element 12 is disposed in the opening A2. The optical layer 13 is formed in the opening A2.

In some embodiments, the light emitting element 12 may be disposed in the opening A2 first, and then the optical layer 13 is formed. In other embodiments, the optical layer 13 may be formed in the opening A2 first, and then the light emitting element 12 is disposed.

The optical layer 13 is located or formed in the opening A2 , or further located or formed between the light emitting element 12 and the spacer layer 11 . The size of the hole A2 in FIG. 2 (such as the width W2 in the direction D2) can be larger than the size of the hole A1 in FIG. Since the width W2 of the opening A2 in the direction D2 is relatively large, the optical layer 13 may, for example, be disconnected in the middle of the opening A2 as viewed from the top view direction D1 of the display device 1, and a further formation including a disconnection ring structure. The optical layer 13 has, for example, a concave arc-shaped surface S2. In some embodiments, the concave arc surface S2 may be discontinuous, but not limited thereto. The curved surface S2 connects one side of the optical layer 13 adjacent to the spacer layer 11 (such as the first side E1) and the other side of the optical layer 13 adjacent to the light-emitting element 12 (such as the second side E2), wherein the optical layer 13 is adjacent to the spacer layer 11 The height H1 of one side (such as the first side E1 ) of the optical layer 13 is greater than the height H2 of the other side (such as the second side E2 ) of the optical layer 13 adjacent to the light emitting element 12 .

Through the arc-shaped surface S2 of the optical layer 13 , the light emitted from the light-emitting element 12 (for example, the light emitted from multiple sides of the light-emitting element 12 ) can be concentrated and transmitted upwards, thereby helping to improve the light extraction efficiency.

According to different requirements, the display device 1 may further include other elements and/or film layers. For example, the display device 1 may further include an adhesive material 14 filled into the opening A2 to fix the light emitting element 12 . In some embodiments, the optical layer 13 is formed before filling the adhesive material 14 , and the optical layer 13 is covered by the adhesive material 14 and located between the adhesive material 14 and the substrate 10 . In some embodiments, the adhesive material 14 may include an underfill, and a part of the adhesive material 14 may be filled between the light-emitting element 12 and the substrate 10 to reduce the influence of thermal stress or physical stress on the light-emitting element 12 or strengthen the The connection between the light emitting element 12 and the pad P.

In some embodiments, the refractive index of the adhesive material 14 is greater than the refractive index of the optical layer 13 . For example, the difference in refractive index between the adhesive material 14 and the optical layer 13 is at least greater than 0.05, so that light can be transmitted upward concentratedly by total internal reflection (TIR) at the interface between the adhesive material 14 and the optical layer 13, thereby Improve light extraction efficiency.

In some embodiments, the display device 1 may further include a substrate 15, a light absorbing layer 16, a color filter 17, a spacer layer 18, a color conversion pattern 19, a color conversion pattern 20, a light scattering layer 21, an encapsulation layer 22, a spacer Component 23 and adhesive layer 24, but not limited thereto.

The substrate 15 is opposed to the substrate 10 . The substrate 15 can be a rigid substrate or a flexible substrate. The material of the substrate 15 includes, for example, glass, quartz, ceramics, sapphire or plastic, but is not limited thereto. In some embodiments, the substrate 15 can be a flexible substrate, and the material of the substrate 15 can include polycarbonate (polycarbonate, PC), polyimide (polyimide, PI), polypropylene (polypropylene, PP), polypara Polyethylene terephthalate (PET), other suitable flexible materials or a combination of the aforementioned materials, but not limited thereto.

The light absorbing layer 16 is disposed on the surface of the substrate 15 facing the substrate 10 and overlaps with the spacer layer 11 in the plan view direction D1 of the display device. The material of the light absorbing layer 16 can be any material capable of absorbing light, such as a black matrix, but not limited thereto. The light absorbing layer 16 has an opening A3.

The color filter 17 overlaps with the light-emitting element 12 in the viewing direction D1 of the display device, and the color filter 17 may include a plurality of filter patterns, for example, a red filter pattern 17R that allows red light to pass through and filters the rest of the color light. , the green light filter pattern 17G that allows green light to pass and filter other color light, and the blue light filter pattern 17B that allows blue light to pass and filter other color light, but not limited thereto. A plurality of filter patterns are respectively disposed in the plurality of openings A3.

The spacer layer 18 is disposed on the surface of the light absorbing layer 16 facing the substrate 10 . The spacer layer 18 can be a polymer material that absorbs or reflects visible light. For example, the material of the spacer layer 18 may include titanium dioxide (TiO ₂ ), carbon black (Carbon Black), titanium black (Tilox Black), siloxane (Siloxane), acrylic with black dye, other suitable materials or the above-mentioned combination, but not limited thereto. In addition, the composition of the spacer layer 18 can adjust the mixing ratio of different materials according to requirements, so that the spacer layer 18 can be formed in a state including white, gray or black, but not limited thereto. In some embodiments, the material of the spacer layer 11 may be the same as the material contained in the spacer layer 18 , which will not be repeated here. The spacer layer 18 has openings A4. The opening A4 overlaps with the opening A3 in the plan view direction D1 of the display device.

The color conversion pattern 19 , the color conversion pattern 20 and the light scattering layer 21 are respectively disposed in the plurality of openings A4 . The color conversion pattern 19 and the color conversion pattern 20 may include wavelength conversion materials, such as fluorescence (fluorescence), phosphorescence (phosphor), quantum dots (Quantum Dot, QD), other suitable materials capable of converting the color of light, or a combination of the above, but This is not the limit. In some embodiments, the color conversion pattern 19 includes, for example, a wavelength conversion material that converts blue light into red light, the color conversion pattern 20 includes, for example, a wavelength conversion material that converts blue light into green light, and the light scattering layer 21 includes, for example, light scattering particles. , but not limited to this.

The encapsulation layer 22 is disposed on the surface of the spacer layer 18 , the color conversion pattern 19 , the color conversion pattern 20 and the light scattering layer 21 facing the substrate 10 . In some embodiments, the encapsulation layer 22 may include transparent materials, water and oxygen blocking materials, other suitable materials or combinations thereof, but is not limited thereto. For example, the material of the encapsulation layer 22 may include epoxy resin, acylic-based resin, silicone, polyimide polymer or a combination thereof, but not limited to this. In some embodiments, the water and oxygen blocking material may include silicon oxide, silicon nitride, silicon oxynitride or a combination thereof, but not limited thereto. In some embodiments, the encapsulation layer 22 may include a bandpass filter or an optical stack formed by stacking multiple layers of high and low refractive indices alternately, so as to reflect red light and green light and pass blue light, thereby improving light extraction efficiency. . In some embodiments, the encapsulation layer 22 may be a stacked layer of the above-mentioned various functional layers.

The spacer 23 is disposed between the encapsulation layer 22 and the spacer layer 11 , and the spacer 23 can be used to seal the adhesive layer 24 . The adhesive layer 24 can be optically clear adhesive (OCA) or optically clear resin (OCR), but not limited thereto.

Referring to FIG. 3 , the main differences between the display device 1A and the display device 1 in FIG. 2 are described as follows. In the display device 1A, the light emitting element overlapping the green filter pattern 17G in the plan view direction D1 of the display device is replaced from the light emitting element 12 in FIG. 2 to the light emitting element 12A in FIG. 3 . The light emitting element 12A and the light emitting element 12 emit light of different colors. For example, the light emitting element 12A emits green light, while the light emitting element 12 emits blue light. In addition, the color conversion pattern 20 in FIG. 2 is replaced with a light scattering layer 21A. The light scattering layer 21A includes, for example, light scattering particles, but is not limited thereto.

Referring to FIG. 4 , the main differences between the display device 1B and the display device 1A in FIG. 3 are described as follows. In the display device 1B, the light emitting element overlapping the red filter pattern 17R in the plan view direction D1 of the display device is replaced from the light emitting element 12 in FIG. 3 to the light emitting element 12B in FIG. 4 . Light emitting element 12B, light emitting element 12A, and light emitting element 12 emit light of different colors. For example, the light emitting element 12B emits red light, the light emitting element 12A emits green light, and the light emitting element 12 emits blue light. In addition, the display device 1B may omit, for example, the spacer layer 18 , the color conversion pattern 19 , the light scattering layer 21 , the light scattering layer 21A, and the encapsulation layer 22 in FIG. 3 , but is not limited thereto.

Please refer to FIG. 5 , the main differences between the display device 1C and the display device 1B in FIG. 4 are described as follows. For example, the display device 1C may omit the substrate 15 , the light absorbing layer 16 , the color filter 17 , the spacer 23 and the adhesive layer 24 in FIG. 4 . In addition, the display device 1C may further include a light absorbing layer 25 . The light absorbing layer 25 is disposed on the spacer layer 11 and overlaps with the spacer layer 11 in the plan view direction D1 of the display device.

The light absorbing layer 25 can be used to absorb ambient light or reduce the reflection of ambient light, thereby increasing the contrast of the display device 1C. For example, the material of the light absorbing layer 25 can be any material capable of absorbing light, such as a black matrix, but not limited thereto. In some embodiments, the light absorbing layer 25 can be formed on the spacer layer 11 through a printing process, but not limited thereto.

Referring to FIG. 6 , the main differences between the display device 1D and the display device 1C in FIG. 5 are described as follows. The display device 1D may further include a color filter 17 to increase color purity. The red filter pattern 17R, the green filter pattern 17G, and the blue filter pattern 17B of the color filter 17 are arranged on the adhesive material 14 and are respectively connected to the light-emitting element 12B, the light-emitting element 12A, and the light-emitting element 12B in the plan view direction D1 of the display device. Elements 12 overlap.

Referring to FIG. 7 , the main differences between the display device 1E and the display device 1B of FIG. 4 are described as follows. In the display device 1E, the optical layer 13 is located/formed on the light emitting element 12 . For example, the optical layer 13 is formed after filling the adhesive material 14 , so that the optical layer 13 is located/formed on the light emitting element 12 and the adhesive material 14 . In some embodiments, the top surface of the adhesive material 14 may be equal to or lower than the top surface of the light emitting element 12 , but not limited thereto. In some embodiments, the adhesive material 14 has a high penetration rate, so it can completely cover the top surface of the light emitting element 12 . In addition, the red filter pattern 17R, green filter pattern 17G, and blue filter pattern 17B of the color filter 17 can be respectively formed on the light emitting element 12B, the light emitting element 12A, and the light emitting element 12, so that the optical layer 13 is positioned on the red filter. Between the light pattern 17R and the light emitting element 12B, between the green filter pattern 17G and the light emitting element 12A, or between the blue filter pattern 17B and the light emitting element 12 . In addition, the refractive index of the color filter 17 (including the red filter pattern 17R, the green filter pattern 17G and the blue filter pattern 17B) is greater than that of the optical layer 13 , for example. For example, the difference in refractive index between the color filter 17 and the optical layer 13 can be at least greater than 0.05, so as to facilitate light extraction.

To sum up, in the embodiments of the present disclosure, the surface energy phenomenon of the printing process can be used to form the optical layer with the microlens configuration, thereby simplifying the manufacturing difficulty of the optical layer and achieving good optical effects.

The above embodiments are only used to illustrate the technical solution of the present disclosure, rather than to limit it; although the present disclosure has been described in detail with reference to the foregoing embodiments, those with ordinary knowledge in the technical field should understand that: it can still understand the foregoing The technical solutions recorded in each embodiment are modified, or some or all of the technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments disclosed in this disclosure.

Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that anyone with ordinary knowledge in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure, and The features of each embodiment can be arbitrarily mixed and replaced to form other new embodiments. In addition, the protection scope of the present disclosure is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and anyone with ordinary knowledge in the technical field can learn from the content of the present disclosure It is understood that the current or future developed process, machine, manufacture, material composition, device, method and step can be used according to the present disclosure as long as it can perform substantially the same function or obtain substantially the same result in the embodiments described herein. Therefore, the protection scope of the present disclosure includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present disclosure also includes the combination of each claim and the embodiments. The scope of protection of this disclosure should be defined by the scope of the attached patent application.

1, 1A, 1B, 1C, 1D, 1E: display device 10, 15: Substrate 11, 18, L2: spacer layer 12, 12A, 12B: light emitting elements 13. L1: optical layer 14: Adhesive material 16, 25: light absorbing layer 17:Color filter 17R: Red filter pattern 17G: Green filter pattern 17B: Blue filter pattern 19, 20: Color conversion pattern 21, 21A: light scattering layer 22: Encapsulation layer 23: spacer 24: Adhesive layer A1, A2, A3, A4: opening C: Conductive parts D1: overlooking direction D2: Direction E1: first side E2: second side H: maximum height H1, H2: Height M: material P: Pad S1, S2: curved surface W1, W2: Width

FIG. 1 is a schematic cross-sectional view illustrating a manufacturing method of an optical layer. 2 to 7 are partial cross-sectional schematic diagrams of display devices according to various embodiments of the present disclosure, respectively.

L1: optical layer

L2: spacer layer

A1: Hole opening

D1: overlooking direction

D2: Direction

H: maximum height

M: material

S1: curved surface

W1: width

Claims (18)

A display device comprising: Substrate; a spacer layer disposed on the substrate and comprising openings; a light emitting element disposed in the opening; and The optical layer is arranged in the opening. The display device according to claim 1, wherein the optical layer is located between the light emitting element and the spacer layer. The display device according to claim 1, wherein the optical layer is located on the light emitting element. The display device according to claim 1, wherein the optical layer is a ring structure. The display device according to claim 1, wherein the height of the side of the optical layer adjacent to the spacer layer is greater than the height of the other side of the optical layer adjacent to the light emitting element. The display device according to claim 1, wherein the optical layer has a concave curved surface. The display device as described in claim 1, further comprising: A color filter overlaps with the light emitting element in a plan view direction of the display device. The display device as described in claim 1, further comprising: The light absorbing layer overlaps with the spacer layer in a plan view direction of the display device. The display device according to claim 1, wherein the optical layer includes scattering particles. The display device according to claim 1, wherein the optical layer comprises metal particles. A method of manufacturing a display device, comprising: Provide the substrate; forming a spacer layer on the substrate, the spacer layer comprising openings; a light emitting element is disposed within the opening; and An optical layer is formed within the opening. The method of manufacturing a display device according to claim 11, wherein the optical layer is formed between the light emitting element and the spacer layer. The method of manufacturing a display device according to claim 11, wherein the optical layer is formed on the light emitting element. The method for manufacturing a display device as claimed in claim 11, wherein the optical layer is formed in the opening through a printing process. The method for manufacturing a display device as claimed in claim 14, wherein the printing process is an inkjet printing process. The method for manufacturing a display device according to claim 11, further comprising: Adhesive material is filled into the opening to fix the light-emitting element. The method of manufacturing a display device according to claim 16, wherein the optical layer is formed before filling the adhesive material. The method of manufacturing a display device according to claim 16, wherein the optical layer is formed after filling the adhesive material.

Images