TW202307564A - 感光性薄膜、感光性元件及積層體之製造方法 - Google Patents

感光性薄膜、感光性元件及積層體之製造方法 Download PDF

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TW202307564A
TW202307564A TW111108374A TW111108374A TW202307564A TW 202307564 A TW202307564 A TW 202307564A TW 111108374 A TW111108374 A TW 111108374A TW 111108374 A TW111108374 A TW 111108374A TW 202307564 A TW202307564 A TW 202307564A
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Taiwan
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component
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TW111108374A
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Chinese (zh)
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成田真生
小野敬司
田中志歩
武田明子
渡邊祐作
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日商昭和電工材料股份有限公司
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Publication of TW202307564A publication Critical patent/TW202307564A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
TW111108374A 2021-08-05 2022-03-08 感光性薄膜、感光性元件及積層體之製造方法 TW202307564A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2021/029189 2021-08-05
PCT/JP2021/029189 WO2023012985A1 (ja) 2021-08-05 2021-08-05 感光性フィルム、感光性エレメント、及び、積層体の製造方法

Publications (1)

Publication Number Publication Date
TW202307564A true TW202307564A (zh) 2023-02-16

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Application Number Title Priority Date Filing Date
TW111108374A TW202307564A (zh) 2021-08-05 2022-03-08 感光性薄膜、感光性元件及積層體之製造方法

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CN (1) CN116848461A (ja)
TW (1) TW202307564A (ja)
WO (1) WO2023012985A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931533B2 (ja) * 2005-09-28 2012-05-16 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその積層体
KR102234811B1 (ko) * 2014-05-23 2021-03-31 쇼와덴코머티리얼즈가부시끼가이샤 레지스트 패턴의 형성 방법, 프린트 배선판의 제조 방법, 투영 노광용 감광성 수지 조성물 및 감광성 엘리먼트
JP2017040710A (ja) * 2015-08-18 2017-02-23 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

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CN116848461A (zh) 2023-10-03
WO2023012985A1 (ja) 2023-02-09

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