TW202307057A - Reaction curable composition - Google Patents

Reaction curable composition Download PDF

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TW202307057A
TW202307057A TW111128381A TW111128381A TW202307057A TW 202307057 A TW202307057 A TW 202307057A TW 111128381 A TW111128381 A TW 111128381A TW 111128381 A TW111128381 A TW 111128381A TW 202307057 A TW202307057 A TW 202307057A
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reaction
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千秋考弘
石川武志
猿渡崇史
藤田遙
小林祐貴
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日商松下知識產權經營股份有限公司
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    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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Abstract

The present disclosure addresses the problem of providing a reaction curable composition that makes it possible to suppress reflection of light on the surface of a cured product by producing the cured product by curing the reaction curable composition. A reaction curable composition according to one aspect of the present disclosure contains a reactive component (A) and a filler (B). The filler (B) contains an antireflection filler (B1). The antireflection filler (B1) has an average particle diameter of 0.8-10 [mu]m, and the antireflection filler (B1) has a plurality of protrusions on the surface of particles thereof. The protrusions have an average diameter of 100-500 nm.

Description

反應硬化性組成物reaction hardening composition

本揭示內容係有關於一種反應硬化性組成物,詳言之係有關於一種含有反應性成分及填料之反應硬化性組成物。The present disclosure relates to a reaction hardenable composition, in particular to a reaction hardenable composition containing reactive ingredients and fillers.

背景技術Background technique

專利文獻1中係揭示一種硬化性一液型環氧樹脂組成物,其含有(a)包含每分子具有2個以上基團的至少1個環氧化合物之環氧成分、潛在性硬化劑成分、觸變性賦予成分、包含每分子具有至少1個第2級或第3級硫醇基的聚硫醇之聚硫醇成分,及包含固體有機酸的穩定化成分,且因應需要亦可包含顔料、填料等。 習知技術文獻 Patent Document 1 discloses a curable one-component epoxy resin composition comprising (a) an epoxy component comprising at least one epoxy compound having two or more groups per molecule, a latent hardener component, A thixotropy-imparting component, a polythiol component comprising a polythiol having at least one 2nd or 3rd thiol group per molecule, and a stabilizing component comprising a solid organic acid, and may also contain a pigment, if necessary, filler etc. Known technical literature

專利文獻 [專利文獻1]日本專利特表2014-500895號公報 patent documents [Patent Document 1] Japanese Patent Application Publication No. 2014-500895

發明概要Summary of the invention

本揭示內容之課題在於提供一種反應硬化性組成物,藉由使其硬化來製作硬化物,可抑制在此硬化物的表面上的光反射。An object of the present disclosure is to provide a reaction-curable composition capable of suppressing light reflection on the surface of the cured product by curing it to produce a cured product.

關於本揭示內容之一態樣的反應硬化性組成物含有反應性成分(A)及填料(B)。前述填料(B)含有抗反射填料(B1)。前述抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下,且前述抗反射填料(B1)於其粒子表面上具有複數個突起。前述突起之平均徑在100nm以上且500nm以下。A reaction-curable composition according to an aspect of the present disclosure contains a reactive component (A) and a filler (B). The aforementioned filler (B) contains an antireflection filler (B1). The average particle size of the aforementioned antireflective filler (B1) is not less than 0.8 μm and not more than 10 μm, and the aforementioned antireflective filler (B1) has a plurality of protrusions on the particle surface. The average diameter of the aforementioned protrusions is not less than 100 nm and not more than 500 nm.

用以實施發明之形態form for carrying out the invention

首先,發明人針對達至本揭示內容完成的原委進行說明。First, the inventors will explain how the present disclosure was accomplished.

作為接著劑、密封材等,會使用含有反應性成分及填料之反應硬化性化合物。例如,專利文獻1(日本專利特表2014-500895號公報)中揭示了一種硬化性一液型環氧樹脂組成物,其含有(a)包含每分子具有2個以上基團的至少1個環氧化合物之環氧成分、潛在性硬化劑成分、觸變性賦予成分、包含每分子具有至少1個第2級或第3級硫醇基的聚硫醇之聚硫醇成分及包含固體有機酸的穩定化成分,且因應需要亦可包含顔料、填料等。As adhesives, sealants, etc., reaction hardening compounds containing reactive components and fillers are used. For example, Patent Document 1 (Japanese Patent Application Laid-Open No. 2014-500895) discloses a curable one-component epoxy resin composition containing (a) at least one ring compound having two or more groups per molecule. Epoxy components of oxygen compounds, latent hardener components, thixotropy-imparting components, polythiol components containing polythiols having at least one secondary or tertiary thiol group per molecule, and solid organic acids Stabilizing components, and pigments, fillers, etc. may also be included as needed.

發明人係著眼於,在將接著劑使用於相機模組等光學機器之製造情況以及在將密封材使用來作為用在影像感測器等光學元件之底部填充劑、側部填充劑或塗層等情況等,接著劑及密封材會因將光進行正反射而成為雜訊的原因之情事。The inventors focused on the use of adhesives in the manufacture of optical devices such as camera modules and the use of sealing materials as underfills, side fillers or coatings for optical components such as image sensors. In other cases, the adhesive and sealing material may cause noise due to regular reflection of light.

於是,發明人針對防眩光法及抗反射法作為抑制使組成物硬化而得到的硬化物表面上的光之正反射的方法來進行研討。Then, the inventors studied the anti-glare method and the anti-reflection method as methods for suppressing regular reflection of light on the surface of a cured product obtained by curing the composition.

但,依據發明人之調查,發現防眩光法有以下問題。However, according to investigations by the inventors, it was found that the anti-glare method has the following problems.

(1)在利用填料進行的防眩光法的情況下,若僅以微細填料或是以大粒徑填料與微細填料之組合來抑制光之正反射,組成物會因含有填料而容易增黏。特別是無溶劑之下由於要抑制過度增黏而必須限制填料量。因此,難以得到較大的反射抑制效果。 (2)在利用相分離法之防眩光法中,非常難以控制硬化物表面之凹凸。 (3)在利用形狀轉印之防眩光法中,由於硬化物之後加工係必要的,因此無法僅藉由使組成物硬化來抑制光之正反射,且特別是在以相機模組作為對象的接著劑的情況係難以進行後加工。 (1) In the case of the anti-glare method using fillers, if only fine fillers or a combination of large particle size fillers and fine fillers are used to suppress the regular reflection of light, the composition will be easily thickened due to the filler. Especially in the absence of solvents, the amount of filler must be limited due to the suppression of excessive viscosification. Therefore, it is difficult to obtain a large reflection suppression effect. (2) In the anti-glare method using the phase separation method, it is very difficult to control the unevenness of the surface of the cured product. (3) In the anti-glare method using shape transfer, since post-processing of the hardened product is necessary, regular reflection of light cannot be suppressed only by hardening the composition, and especially in camera modules In the case of an adhesive, post-processing is difficult.

又,依據發明人之調查,發現抗反射法有以下問題。Also, according to investigations by the inventors, it was found that the anti-reflection method has the following problems.

(1)在利用光學干渉之抗反射法中,由於必須對硬化物賦予積層結構而會成為繁複的程序,且此方法特別是難以適用於接著劑用途。 (2)藉由硬化物之低折射率化而進行的抗反射法,特別是使在如環氧化合物或丙烯酸化合物等接著劑、密封材中利用的包含反應性化合物之組成物硬化而得到的硬化物之折射率,最低低於1.4左右,與空氣之折射率差會很大,因此難以充分地抑制反射。 (3)在利用擬似折射率連續化之抗反射法中,認為會如蛾眼結構般藉由可見光區域波長以下的微細填料在硬化物表面形成凹凸。但,若僅以微細填料或是以大粒徑填料與微細填料之組合來抑制光之正反射,組成物會因含有填料而容易增黏。特別是無溶劑之下由於要抑制過度增黏而必須限制填料量。因此,難以得到較大的反射抑制效果。 (1) In the antireflection method using optical interference, since it is necessary to provide a laminated structure to the cured product, it becomes a complicated procedure, and it is difficult to apply this method particularly to an adhesive agent. (2) Anti-reflection method by lowering the refractive index of the cured product, especially obtained by curing a composition containing a reactive compound used in an adhesive such as an epoxy compound or an acrylic compound, or a sealing material The refractive index of the cured product is lower than about 1.4 at the lowest, and the refractive index difference with air will be large, so it is difficult to sufficiently suppress reflection. (3) In the anti-reflection method using pseudo-refractive index continuation, it is considered that roughness is formed on the surface of the hardened material by fine fillers with wavelengths below the visible light region, like a moth-eye structure. However, if only fine fillers or a combination of large particle size fillers and fine fillers are used to suppress the regular reflection of light, the composition will easily increase viscosity due to the filler. Especially in the absence of solvents, the amount of filler must be limited due to the suppression of excessive viscosification. Therefore, it is difficult to obtain a large reflection suppression effect.

於是,發明人為了提供即便在無後加工等追加處理的情況下,可藉由硬化來製作硬化物,而抑制此硬化物表面上的光之正反射的反應硬化性組成物,進行全心全力的研究開發,從而達至本揭示內容之完成。然而,此本揭示內容之完成的原委當不限制本揭示之內容。亦即,例如反應硬化性組成物之用途並非僅限定於接著劑及密封材,且亦不僅限於必須抑制光之正反射的用途。Therefore, the inventors have worked hard to provide a reaction-curable composition that can produce a cured product by curing even without additional treatment such as post-processing, and suppress regular reflection of light on the surface of the cured product. research and development, so as to achieve the completion of this disclosure. However, the reasons for the completion of this disclosure should not limit the content of this disclosure. That is, for example, the application of the reaction-curable composition is not limited to adhesives and sealing materials, and is not limited to applications that must suppress regular reflection of light.

以下針對本揭示內容之一實施形態進行說明。再者,以下實施形態僅為本揭示內容之各種各樣的實施形態中之一者而已。只要是能達成本揭示內容之目的,以下實施形態可因應設計而進行各種變更。One embodiment of the present disclosure will be described below. In addition, the following embodiment is only one of various embodiment of this indication. As long as the purpose of this disclosure can be achieved, various changes can be made in the following embodiments according to the design.

關於本實施形態之反應硬化性組成物(以下亦稱為組成物(X))含有反應性成分(A)及填料(B)。填料(B)含有抗反射填料(B1)。抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下。抗反射填料(B1)在其粒子表面上具有複數個突起。突起之平均徑在100nm以上且500nm以下。The reaction-curable composition (hereinafter also referred to as composition (X)) of this embodiment contains a reactive component (A) and a filler (B). Filler (B) contains antireflective filler (B1). The average particle diameter of the antireflection filler (B1) is not less than 0.8 μm and not more than 10 μm. The antireflective filler (B1) has a plurality of protrusions on the particle surface thereof. The average diameter of the protrusions is not less than 100 nm and not more than 500 nm.

再者,抗反射填料(B1)只要是滿足前述粒徑條件,且具有前述突起之填料即可。所謂抗反射填料(B1)此名稱,僅是為了區別抗反射填料(B1)及其之外的填料(B2)而進行設定,此名稱中的「抗反射」此措辭當不限定抗反射填料(B1)之特性。Furthermore, the antireflection filler (B1) may be a filler that satisfies the aforementioned particle size requirement and has the aforementioned protrusions. The name of the so-called anti-reflection filler (B1) is only set to distinguish the anti-reflection filler (B1) from other fillers (B2). The term "anti-reflection" in this name should not limit the anti-reflection filler ( The characteristics of B1).

若依據本實施形態,藉由使反應性成分(A)反應而使組成物(X)硬化,可得到硬化物。此硬化物會包含抗反射填料(B1),且此抗反射填料(B1)會易於使光散射,因此可有效地抑制硬化物表面上的光之正反射。因此,本實施形態中,藉由從組成物(X)製作硬化物,可抑制硬化物表面的光之正反射。According to this embodiment, a cured product can be obtained by reacting the reactive component (A) to harden the composition (X). The cured product contains anti-reflective filler (B1), and the anti-reflective filler (B1) tends to scatter light, thereby effectively suppressing regular reflection of light on the surface of the cured product. Therefore, in this embodiment, regular reflection of light on the surface of the cured product can be suppressed by producing the cured product from the composition (X).

又,由於抗反射填料(B1)會非常容易使光散射,因此即便組成物(X)中填料(B)之量並未過多,仍可抑制硬化物表面上的光之正反射。因此,可適度抑制組成物(X)中填料(B)之量,而可抑制組成物(X)因填料(B)所造成之增黏。又因此,例如即便組成物(X)不含溶劑,或組成物(X)中溶劑含量少,組成物(X)仍可具有良好的流動性。Also, since the antireflection filler (B1) scatters light very easily, regular reflection of light on the surface of the cured product can be suppressed even if the amount of the filler (B) in the composition (X) is not too much. Therefore, the amount of the filler (B) in the composition (X) can be moderately suppressed, and the viscosity increase of the composition (X) due to the filler (B) can be suppressed. Therefore, for example, even if the composition (X) does not contain a solvent, or the composition (X) contains a small amount of solvent, the composition (X) can still have good fluidity.

此外,藉由適度抑制組成物(X)中填料(B)之量,亦可實現硬化物之低彈性模數化及高延伸率化。藉此,可提高硬化物之耐衝擊性。In addition, by appropriately suppressing the amount of the filler (B) in the composition (X), it is also possible to achieve a low modulus of elasticity and a high elongation of the cured product. Thereby, the impact resistance of the cured product can be improved.

組成物(X)係1液型且無溶劑,其硬化物較佳對於可見光區域波長的光具有充分優異的抗反射性能。對於近紅外線區域(從800nm至1000nm)之波長的光,組成物(X)之硬化物較佳是仍具有充分優異的抗反射性能。若硬化物具有對於可見光區域波長的光之抗反射性能,例如在將組成物(X)作為相機模組中的接著劑等來使用時,可抑制相機模組內的可見光之反射,藉此可抑制影像感測器等輸出的影像中的光斑雜訊等雜訊。此外,若硬化物具有對於近紅外線區域波長的光之抗反射性能,則可抑制影像感測器等輸出的影像之變色。因此,特別希望在相機模組等內部光路不會反射可見光區域之光及紅外線區域之光。再者,抗反射性能係指可抑制光之正反射的性質之意。The composition (X) is a one-component type and is solvent-free, and its cured product preferably has sufficiently excellent antireflection performance against light having wavelengths in the visible region. The cured product of the composition (X) preferably still has sufficiently excellent antireflection performance for light having a wavelength in the near-infrared region (from 800 nm to 1000 nm). If the cured product has anti-reflection properties for light with wavelengths in the visible region, for example, when the composition (X) is used as an adhesive in a camera module, reflection of visible light in the camera module can be suppressed, thereby enabling Suppresses noise such as speckle noise in images output from image sensors, etc. In addition, if the cured product has anti-reflection performance for light having a wavelength in the near-infrared region, discoloration of an image output from an image sensor or the like can be suppressed. Therefore, it is particularly hoped that the light in the visible light region and the infrared light region will not be reflected in the internal optical path of the camera module or the like. In addition, the antireflection performance means the property which suppresses the regular reflection of light.

針對組成物(X)之成分的細節進一步說明。The details of the components of the composition (X) will be further described.

如上所述,在本揭示內容之一實施形態中,組成物(X)含有反應性成分(A)及填料(B)。填料(B)含有抗反射填料(B1)。抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下。於抗反射填料(B1)之粒子表面的10%以上之面積部分較佳具有平均徑100nm以上且500nm以下的突起。突起之平均徑係突起徑之平均値。突起徑係突起之縱徑(長徑的尺寸)及横徑(與長徑正交的方向之尺寸)之平均値。As mentioned above, in one embodiment of the present disclosure, the composition (X) contains the reactive component (A) and the filler (B). Filler (B) contains antireflective filler (B1). The average particle diameter of the antireflection filler (B1) is not less than 0.8 μm and not more than 10 μm. The antireflective filler (B1) preferably has protrusions with an average diameter of 100 nm to 500 nm in an area of 10% or more of the particle surface. The average diameter of protrusions is the average value of protrusion diameters. The protrusion diameter is the average value of the longitudinal diameter (the dimension of the long diameter) and the transverse diameter (the dimension in the direction perpendicular to the long diameter) of the protrusion.

反應性成分(A)係指會藉由反應而高分子化之成分。反應性成分(A)例如可含有反應性化合物(A1),或含有反應性化合物(A1)及會與此反應性化合物(A1)反應之硬化劑(A2)。The reactive component (A) refers to a component that reacts to polymerize. The reactive component (A) may contain, for example, a reactive compound (A1), or a reactive compound (A1) and a hardener (A2) that reacts with the reactive compound (A1).

反應性化合物(A1)例如可含有環氧化合物及丙烯酸化合物中至少一者。The reactive compound (A1) may contain, for example, at least one of epoxy compounds and acrylic compounds.

環氧化合物較佳為1分子中具有2個以上環氧基之化合物。環氧化合物含有例如選自於由以下所構成之群組之至少一種:聯苯型環氧樹脂;雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂等雙酚型環氧樹脂;氫化雙酚A型環氧樹脂、氫化雙酚F型環氧樹脂、氫化雙酚S型環氧樹脂等氫化雙酚型環氧樹脂;含有萘環之環氧樹脂;含有蒽環之環氧樹脂;脂環式環氧樹脂;二環戊二烯型環氧樹脂;酚酚醛清漆型環氧樹脂;甲酚酚醛清漆型環氧樹脂;三苯基甲烷型環氧樹脂;含有溴之環氧樹脂;脂肪族系環氧樹脂;脂肪族聚醚系環氧樹脂;三縮水甘油基三聚異氰酸酯;含有縮水甘油基之矽酮樹脂;及縮水甘油胺型環氧樹脂等。The epoxy compound is preferably a compound having two or more epoxy groups in one molecule. The epoxy compound contains, for example, at least one selected from the group consisting of: biphenyl type epoxy resin; bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, etc. Bisphenol type epoxy resin; Hydrogenated bisphenol type epoxy resin such as hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, hydrogenated bisphenol S type epoxy resin; epoxy resin containing naphthalene ring; Epoxy resins containing anthracyclines; cycloaliphatic epoxy resins; dicyclopentadiene epoxy resins; phenol novolac epoxy resins; cresol novolac epoxy resins; triphenylmethane epoxy resins ; Epoxy resins containing bromine; Aliphatic epoxy resins; Aliphatic polyether epoxy resins; Triglycidyl isocyanate; Silicone resins containing glycidyl groups; .

環氧化合物較佳係包含雙酚型環氧樹脂,且更佳係包含雙酚A型環氧樹脂及雙酚F型環氧樹脂中至少一者。The epoxy compound preferably includes bisphenol epoxy resin, and more preferably includes at least one of bisphenol A epoxy resin and bisphenol F epoxy resin.

丙烯酸化合物係分子中具有丙烯醯基與甲基丙烯醯基中至少一者之化合物。丙烯酸化合物含有例如選自於由以下所構成之群組之至少一種:三羥甲基丙烷三丙烯酸酯、1,6-己烷二醇二丙烯酸酯、二羥甲基-三環癸烷二丙烯酸酯、丙烯醯基嗎啉、四氫糠基丙烯酸酯、4-羥基丙烯酸丁酯、9,9-雙(4-(2-(甲基)丙烯醯氧基乙氧基)苯基)-9H-茀、參-(2-丙烯醯氧基乙基)三聚異氰酸酯、雙-(2-丙烯醯氧基乙基)三聚異氰酸酯、己內酯改質參-(2-丙烯醯氧基乙基)三聚異氰酸酯、三聚異氰酸EO改質二丙烯酸酯及三聚異氰酸EO改質三丙烯酸酯等。Acrylic compounds are compounds having at least one of acryl and methacryl groups in their molecules. The acrylic compound contains, for example, at least one selected from the group consisting of trimethylolpropane triacrylate, 1,6-hexanediol diacrylate, dimethylol-tricyclodecane diacrylate ester, acrylmorpholine, tetrahydrofurfuryl acrylate, 4-hydroxybutyl acrylate, 9,9-bis(4-(2-(meth)acryloxyethoxy)phenyl)-9H -Treme, ginseng-(2-acryloxyethyl) isocyanate, bis-(2-acryloxyethyl) isocyanate, caprolactone modified ginseng-(2-acryloxyethyl) base) isocyanurate, isocyanate EO modified diacrylate and isocyanate EO modified triacrylate, etc.

反應性化合物(A1)較佳於25℃為液狀。此時,可更加抑制組成物(X)之增黏。The reactive compound (A1) is preferably liquid at 25°C. In this case, the thickening of the composition (X) can be further suppressed.

反應性化合物(A1)可包含的化合物並不僅限於環氧化合物及丙烯酸化合物。舉例而言,反應性化合物(A1)亦可含有分子中具有氧呾基之化合物(氧呾化合物)、分子中具有乙烯基之化合物(乙烯基化合物)等。The compounds that can be included in the reactive compound (A1) are not limited to epoxy compounds and acrylic compounds. For example, the reactive compound (A1) may also contain a compound having an oxygen group in the molecule (oxygen compound), a compound having a vinyl group in the molecule (vinyl compound), and the like.

針對反應性成分(A)含有硬化劑(A2)之情況進行說明。The case where the reactive component (A) contains the curing agent (A2) will be described.

硬化劑(A2)含有可與反應性化合物(A1)反應之化合物。硬化劑(A2)包含例如選自於由以下所構成之群組之至少一種:胺化合物、酸酐、酚化合物、硫醇化合物及咪唑化合物。反應性化合物(A1)較佳係含有環氧化合物,且硬化劑(A2)較佳係含有選自於由以下所構成之群組之至少一種:胺化合物、酸酐、酚化合物、硫醇化合物及咪唑化合物。反應性化合物(A1)較佳含有環氧化合物及丙烯酸化合物中至少一者,且硬化劑(A2)較佳含有硫醇化合物。The curing agent (A2) contains a compound that can react with the reactive compound (A1). The curing agent (A2) includes, for example, at least one selected from the group consisting of amine compounds, acid anhydrides, phenol compounds, thiol compounds, and imidazole compounds. The reactive compound (A1) preferably contains an epoxy compound, and the hardener (A2) preferably contains at least one selected from the group consisting of amine compounds, acid anhydrides, phenol compounds, thiol compounds and imidazole compound. The reactive compound (A1) preferably contains at least one of an epoxy compound and an acrylic compound, and the hardener (A2) preferably contains a thiol compound.

胺化合物係分子中具有胺基之化合物。胺化合物含有例如4,4’-二胺基-3,3’-二乙基二苯基甲烷。Amine compounds are compounds with amine groups in their molecules. The amine compound includes, for example, 4,4'-diamino-3,3'-diethyldiphenylmethane.

酸酐例如含有選自於由以下所構成之群組之一種以上:鄰苯二甲酸酐、偏苯三甲酸酐、苯均四酸酐、順丁烯二酸酐、二苯甲酮四羧酸酐、六氫鄰苯二甲酸酐、四氫鄰苯二甲酸酐、甲基六氫鄰苯二甲酸酐、甲基四氫鄰苯二甲酸酐及聚壬二酸酐。The acid anhydride contains, for example, one or more selected from the group consisting of: phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, benzophenone tetracarboxylic anhydride, hexahydro-phthalic anhydride, Phthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and polyazelaic anhydride.

酚化合物係分子中具有酚性羥基之化合物。酚化合物較佳在1分子中具有2個以上酚性羥基。酚化合物含有例如選自於由以下所構成之群組之一種以上:酚酚醛清漆樹脂、甲酚酚醛清漆樹脂、聯苯型酚醛清漆樹脂、三苯基甲烷型樹脂、萘酚酚醛清漆樹脂、酚芳烷基樹脂及聯苯芳烷基樹脂。Phenolic compounds are compounds with phenolic hydroxyl groups in their molecules. The phenolic compound preferably has two or more phenolic hydroxyl groups in one molecule. The phenolic compound contains, for example, one or more selected from the group consisting of: phenol novolak resin, cresol novolak resin, biphenyl novolac resin, triphenylmethane type resin, naphthol novolak resin, phenol Aralkyl resins and biphenyl aralkyl resins.

硫醇化合物係分子中具有硫醇基之化合物。硫醇化合物含有例如新戊四醇四(3-巰基丙酸酯)(例如三菱化學股份有限公司製之品名Epomate QX40)等。Thiol compounds are compounds with thiol groups in their molecules. The thiol compound includes, for example, neopentylitol tetrakis(3-mercaptopropionate) (for example, Epomate QX40 manufactured by Mitsubishi Chemical Corporation) and the like.

咪唑化合物含有例如選自於由以下所構成之群組之至少一種:2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑及2-苯基-4-甲基咪唑等。The imidazole compound contains, for example, at least one selected from the group consisting of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methyl imidazole etc.

再者,即便在反應性化合物(A1)含有環氧化合物以外的化合物時,因應反應性化合物(A1)中所含化合物之種類,硬化劑(A2)仍可含有適當的化合物。Furthermore, even when the reactive compound (A1) contains compounds other than epoxy compounds, the curing agent (A2) may contain an appropriate compound depending on the type of compound contained in the reactive compound (A1).

硬化劑(A2)之含量例如相對於反應性化合物(A1)之1當量,在0.3當量以上且1.5當量以下。The content of the curing agent (A2) is, for example, 0.3 equivalents or more and 1.5 equivalents or less with respect to 1 equivalent of the reactive compound (A1).

組成物(X)亦可含有硬化催化劑。此時,藉由將組成物(X)加熱,組成物(X)之硬化反應會易於進行。硬化催化劑含有例如選自於由以下所構成之群組之至少一種成分:咪唑類、環脒類、第3級胺類、有機膦類、四取代鏻・四取代硼酸鹽、硼酸鹽以外的具有對陰離子之4級鏻鹽,及四苯基硼鹽等。硬化催化劑亦可含有潛在性硬化催化劑。此時,可抑制未被加熱狀態下組成物(X)之反應,而可提高組成物(X)之保存穩定性。潛在性硬化催化劑可含有液狀潛在性硬化促進劑及固體分散型潛在性硬化促進劑中至少一者。潛在性硬化催化劑亦可含有微膠囊型潛在性硬化催化劑。微膠囊型潛在性硬化催化劑含有例如微膠囊化咪唑,其包含作為具有催化劑活性之化合物之咪唑類。硬化催化劑之比率,例如相對於環氧樹脂在0.1%以上且20%以下。The composition (X) may also contain a curing catalyst. At this time, by heating the composition (X), the hardening reaction of the composition (X) is facilitated. The hardening catalyst contains, for example, at least one component selected from the group consisting of imidazoles, cyclic amidines, tertiary amines, organic phosphines, tetrasubstituted phosphonium, tetrasubstituted borates, borates other than Quaternary phosphonium salts of counter anions, tetraphenyl boron salts, etc. The hardening catalyst may also contain a latent hardening catalyst. In this case, the reaction of the composition (X) in the unheated state can be suppressed, and the storage stability of the composition (X) can be improved. The latent hardening catalyst may contain at least one of a liquid latent hardening accelerator and a solid dispersion type latent hardening accelerator. The latent hardening catalyst may also contain a microcapsule type latent hardening catalyst. Microencapsulated latent hardening catalysts contain, for example, microencapsulated imidazoles comprising imidazoles as catalytically active compounds. The ratio of the curing catalyst is, for example, 0.1% to 20% with respect to the epoxy resin.

組成物(X)亦可含有起始劑(C)。起始劑(C)係使反應性成分(A)之反應起始的化合物。例如,在反應性成分(A)含有丙烯酸化合物時,起始劑(C)可含有自由基聚合起始劑。自由基聚合起始劑含有例如選自於由以下所構成之群組之至少一種化合物:芳香族酮類、醯基氧化膦化合物、芳香族鎓鹽化合物、有機過氧化物、硫化合物(噻噸酮化合物、含有硫苯基之化合物等)、六芳基雙咪唑化合物、酮肟酯化合物、硼酸鹽化合物、吖嗪鎓(azinium)化合物、茂金屬化合物、活性酯化合物、具有碳鹵素鍵結之化合物及烷基胺化合物。起始劑(C)之比率,例如相對於丙烯酸化合物在0.1質量%以上且10質量%以下。The composition (X) may also contain an initiator (C). Initiators (C) are compounds which initiate the reaction of the reactive components (A). For example, when the reactive component (A) contains an acrylic compound, the initiator (C) may contain a radical polymerization initiator. The radical polymerization initiator contains, for example, at least one compound selected from the group consisting of aromatic ketones, acyl phosphine oxide compounds, aromatic onium salt compounds, organic peroxides, sulfur compounds (thioxanthene Ketone compounds, compounds containing sulfur phenyl groups, etc.), hexaaryl bis-imidazole compounds, ketoxime ester compounds, borate compounds, azinium (azinium) compounds, metallocene compounds, active ester compounds, compounds with carbon-halogen bonds compounds and alkylamine compounds. The ratio of the initiator (C) is, for example, 0.1% by mass or more and 10% by mass or less with respect to the acrylic acid compound.

作為反應性化合物(A1)及硬化劑(A2)或起始劑(C)之組合的範例,可舉環氧化合物與酸酐之組合、環氧化合物與胺化合物之組合、環氧化合物與硫醇化合物之組合、環氧化合物與酚化合物之組合、環氧化合物及丙烯酸化合物與硫醇化合物與起始劑(C)之組合,以及環氧化合物及丙烯酸化合物與胺化合物與起始劑(C)之組合。再者,反應性化合物(A1)與硬化劑(A2)或起始劑(C)之組合並不僅限於前述者。Examples of the combination of the reactive compound (A1) and the hardener (A2) or initiator (C) include a combination of an epoxy compound and an acid anhydride, a combination of an epoxy compound and an amine compound, an epoxy compound and a thiol Combination of compounds, combination of epoxy compound and phenolic compound, combination of epoxy compound, acrylic compound, thiol compound and initiator (C), and epoxy compound, acrylic compound, amine compound and initiator (C) combination. Furthermore, the combination of the reactive compound (A1) and the hardener (A2) or starter (C) is not limited to the aforementioned ones.

如上所述,含有填料(B),且填料(B)含有抗反射填料(B1)。As mentioned above, the filler (B) is contained, and the filler (B) contains the antireflection filler (B1).

如上所述,抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下。若抗反射填料(B1)之平均粒徑在0.8μm以上,組成物(X)將難以增黏。若此平均粒徑在10μm以下,在使組成物(X)浸透至狭窄間隙時及在分配法排出時等可確保組成物(X)之流動性。其平均粒徑較佳在1μm以上,若在1.5μm以上則更佳。並且,其平均粒徑較佳在5μm以下,若在4μm以下則更佳。再者,其平均粒徑係從以雷射繞射散射法測量而得之體積基準之粒度分布而計算出之中間徑。As described above, the average particle diameter of the antireflective filler (B1) is not less than 0.8 μm and not more than 10 μm. If the average particle diameter of the anti-reflective filler (B1) is more than 0.8 μm, the composition (X) will be difficult to thicken. If the average particle size is 10 μm or less, the fluidity of the composition (X) can be ensured when the composition (X) is permeated into a narrow gap and when it is discharged by a dispensing method. The average particle size is preferably at least 1 μm, more preferably at least 1.5 μm. In addition, the average particle size is preferably not more than 5 μm, more preferably not more than 4 μm. Furthermore, the average particle diameter is the median diameter calculated from the volume-based particle size distribution measured by the laser diffraction scattering method.

又,由於突起之平均徑在100nm以上且500nm以下,可藉由抗反射填料(B1)有效地散射可見光,因此可對硬化物賦予良好的抗反射性能。In addition, since the average diameter of the protrusions is not less than 100 nm and not more than 500 nm, visible light can be effectively scattered by the antireflection filler (B1), so that good antireflection performance can be imparted to the cured product.

再者,突起之徑係藉由示差掃描型電子顯微鏡攝影抗反射填料(B1)之粒子,測量出現在所得影像中的粒子之突起的長徑(縱徑)及與此縱徑正交之徑(横徑),再計算出縱徑與横徑之平均値而得到的値。又,突起之平均徑係針對10個粒子之影像中出現的全部突起之徑之平均値。Furthermore, the diameter of the protrusion is to photograph the particles of the anti-reflective filler (B1) by a differential scanning electron microscope, and measure the long diameter (longitudinal diameter) and the diameter perpendicular to the longitudinal diameter of the protrusions of the particles appearing in the obtained image. (transverse diameter), and then calculate the average value of the longitudinal diameter and transverse diameter. In addition, the mean diameter of the protrusions is an average value of the diameters of all the protrusions appearing in the image of 10 particles.

為了能更有效地散射可見光,抗反射填料(B1)之突起之平均徑較佳在200nm以上。此平均徑若在400nm以上則更佳。抗反射填料(B1)之突起之平均徑較佳在500nm以下。抗反射填料(B1)之突起徑之分布中,亦以200nm以上且500nm以下的頻率較高的情況為佳。例如,突起徑在200nm以上且500nm以下之突起的數目合計較佳在突起之數目全體的50%以上。又,令縱軸為突起之數目且令横軸為突起徑之突起徑的頻率分布曲線在突起徑200nm以上且400nm以下之範圍中較佳具有寬峰值,且該寬峰值具有均勻地高的頻率。此時,藉由抗反射填料(B1)之突起,可有效地使可見光域中廣波長域之光散射。In order to more effectively scatter visible light, the average diameter of the protrusions of the anti-reflection filler (B1) is preferably greater than 200 nm. It is more preferable that this average diameter is 400 nm or more. The average diameter of the protrusions of the antireflective filler (B1) is preferably less than 500 nm. Also in the distribution of the protrusion diameters of the antireflective filler (B1), it is preferable that the frequency of 200 nm or more and 500 nm or less is relatively high. For example, the total number of protrusions with a protrusion diameter of 200 nm to 500 nm is preferably 50% or more of the total number of protrusions. Also, the frequency distribution curve of the projection diameter whose vertical axis is the number of projections and whose horizontal axis is the projection diameter preferably has a broad peak in the range of the projection diameter of 200 nm or more and 400 nm or less, and the broad peak has a uniformly high frequency . In this case, the protrusions of the antireflection filler (B1) can effectively scatter light in a wide wavelength region in the visible light region.

抗反射填料(B1)較佳在其粒子表面的10%以上的面積部分具有突起。此時,藉由抗反射填料(B1),可對硬化物賦予更為良好的抗反射性能。此時的粒子表面係指,從抗反射填料(B1)之粒子去除突起時的粒子(以下亦稱為基底粒子)的表面之意。粒子表面的10%以上的面積部分具有突起係指,抗反射填料(B1)之粒子於基底粒子表面具有附著有複數個突起般的形狀,且在基底粒子之表面上附著有突起的部分之面積的合計之比率(以下亦稱為附著面積比率),在基底粒子之表面的全面積的10%以上之意。附著面積比率若在20%以上則更佳,若在30%以上則又更佳。又,附著面積比率例如在100%以下、95%以下,或90%以下。The anti-reflection filler (B1) preferably has protrusions in an area of 10% or more of the particle surface. In this case, the antireflection filler (B1) can impart better antireflection performance to the cured product. The particle surface in this case means the surface of the particle (hereinafter also referred to as base particle) when protrusions are removed from the particle of the antireflection filler (B1). The area of 10% or more of the surface of the particle has protrusions means that the particles of the anti-reflection filler (B1) have a shape in which a plurality of protrusions are attached to the surface of the base particle, and the area of the portion where the protrusions are attached to the surface of the base particle The ratio of the total (hereinafter also referred to as the adhesion area ratio) means 10% or more of the total surface area of the substrate particle. The adhesion area ratio is more preferably 20% or more, and more preferably 30% or more. Also, the adhesion area ratio is, for example, 100% or less, 95% or less, or 90% or less.

再者,附著面積比率係藉由示差掃描型電子顯微鏡攝影,並從所得到的影像計算出粒子面積及突起面積而測定。In addition, the adhesion area ratio was measured by differential scanning electron microscope photography, and the particle area and protrusion area were calculated from the obtained image.

抗反射填料(B1)之粒子係具有核及包覆核之殼之核殼型粒子,且較佳在殼之表面上具有突起。亦即,抗反射填料(B1)之粒子中的基底粒子較佳具有核及殼。此時,藉由核及殼之間的折射率差,可在核及殼之界面上產生光的散射。因此,抗反射填料(B1)可更有效地使光散射。The particles of the antireflection filler (B1) are core-shell particles having a core and a shell covering the core, and preferably have protrusions on the surface of the shell. That is, the base particle in the particles of the antireflection filler (B1) preferably has a core and a shell. At this time, due to the refractive index difference between the core and the shell, light can be scattered at the interface between the core and the shell. Therefore, the antireflection filler (B1) can more effectively scatter light.

抗反射填料(B1)之粒子較佳為有機樹脂粒子。抗反射填料(B1)之粒子之核及殼之各者較佳係包含有機樹脂。在該等情況下,組成物(X)之硬化物可進行低彈性模數化,因此可提高硬化物之衝擊性。The particles of the antireflection filler (B1) are preferably organic resin particles. Each of the core and the shell of the particles of the antireflective filler (B1) preferably comprises an organic resin. In these cases, the elastic modulus of the cured product of the composition (X) can be lowered, so the impact resistance of the cured product can be improved.

抗反射填料(B1)之粒子含有例如選自於由以下所構成之群組之至少一種:PMMA(聚甲基丙烯酸甲酯)等丙烯酸樹脂、矽酮樹脂、苯乙烯樹脂、三聚氰胺樹脂及胺基甲酸酯樹脂等。又,當抗反射填料(B1)之粒子為核殼型粒子時,核及殼之各者含有例如選自於由以下所構成之群組之至少一種:PMMA(聚甲基丙烯酸甲酯)等丙烯酸樹脂、矽酮樹脂、苯乙烯樹脂、三聚氰胺樹脂及胺基甲酸酯樹脂等。The particles of the anti-reflective filler (B1) contain at least one selected from the group consisting of, for example, acrylic resins such as PMMA (polymethyl methacrylate), silicone resins, styrene resins, melamine resins, and amine groups. Formate resin, etc. Also, when the particles of the antireflective filler (B1) are core-shell particles, each of the core and the shell contains, for example, at least one selected from the group consisting of: PMMA (polymethyl methacrylate), etc. Acrylic resin, silicone resin, styrene resin, melamine resin and urethane resin, etc.

當抗反射填料(B1)之粒子為核殼型之粒子時,例如核含有PMMA(聚甲基丙烯酸甲酯)等丙烯酸樹脂,殼及突起之各者則含有矽酮樹脂。此時,藉由抗反射填料(B1)可更有效地散射光,且藉由抗反射填料(B1)可使硬化物更為低彈性模數化。When the particles of the antireflection filler (B1) are core-shell particles, for example, the core contains acrylic resin such as PMMA (polymethyl methacrylate), and each of the shell and protrusions contains silicone resin. In this case, the antireflection filler (B1) can more effectively scatter light, and the antireflection filler (B1) can further lower the modulus of elasticity of the cured product.

當抗反射填料(B1)之粒子為核殼型之粒子時,核亦可為空洞。亦即,抗反射填料(B1)之粒子亦可為具有空洞及包覆空洞之殼之中空粒子。When the particles of the antireflection filler (B1) are core-shell particles, the core may also be a cavity. That is, the particles of the anti-reflection filler (B1) can also be hollow particles with a hollow shell and a shell covering the hollow.

再者,抗反射填料(B1)之粒子亦可不為核殼型之粒子。亦即,抗反射填料(B1)之粒子亦可為整體均質。Furthermore, the particles of the anti-reflective filler (B1) may not be core-shell particles. That is, the particles of the anti-reflective filler (B1) may also be homogeneous as a whole.

抗反射填料(B1)之粒子之折射率較佳係滿足以下至少一者:在1.7以下,以及在反應性成分(A)之硬化物之折射率以下。此時,可維持或減低組成物(X)之硬化物之全光線反射率(亦即,擴散反射率與正反射率之合計)。抗反射填料(B1)之粒子之折射率若在1.6以下則更佳。抗反射填料(B1)之粒子之折射率較佳在1.3以上。The refractive index of the particles of the anti-reflective filler (B1) preferably satisfies at least one of the following: below 1.7, and below the refractive index of the cured product of the reactive component (A). In this case, the total light reflectance (that is, the sum of the diffuse reflectance and the regular reflectance) of the cured product of the composition (X) can be maintained or reduced. The refractive index of the particles of the antireflective filler (B1) is more preferably 1.6 or less. The refractive index of the particles of the anti-reflection filler (B1) is preferably above 1.3.

再者,抗反射填料(B1)之粒子之折射率係指,當抗反射填料(B1)之粒子為整體均質時係該粒子之材質的折射率,當抗反射填料(B1)之粒子為核殼型粒子時為殼之折射率。再者,核之折射率亦與殼相同,較佳係滿足以下至少一者:在1.7以下,以及在反應性成分(A)之硬化物之折射率以下。Furthermore, the refractive index of the particles of the anti-reflection filler (B1) refers to the refractive index of the material of the particles when the particles of the anti-reflection filler (B1) are homogeneous as a whole, and when the particles of the anti-reflection filler (B1) are the core For shell-type particles, it is the refractive index of the shell. Furthermore, the refractive index of the core is also the same as that of the shell, and preferably satisfies at least one of the following: below 1.7, and below the refractive index of the cured product of the reactive component (A).

作為抗反射填料(B1)可使用市售品。例如抗反射填料(B1)可含有品名Silcrusta MKN03。A commercial item can be used as an antireflection filler (B1). For example the antireflective filler (B1) may contain the trade name Silcrusta MKN03.

組成物(X)中的填料(B)亦可進一步含有抗反射填料(B1)以外的填料(B2)。若抗反射填料(B1)以外的填料(B2)之平均粒徑在100nm以上且小於抗反射填料(B1)之平均粒徑,可減低組成物(X)之硬化物之正反射率。再者,即便抗反射填料(B1)以外的填料(B2)之粒徑大於前述範圍,只要此填料(B2)係在組成物(X)之硬化時會部分溶解而使硬化物中的填料(B2)之粒徑變小者,則可藉由填料(B2)減低組成物(X)之硬化物之正反射率。作為可在組成物(X)之硬化時部分溶解的填料(B2)之範例,可列舉粉狀多胺(例如ADEKA股份有限公司製,品名EH-4357S)。亦即,即便組成物(X)中的填料(B2)之平均粒徑大於抗反射填料(B1)之平均粒徑,只要組成物(X)中的填料(B2)之平均粒徑在100nm以上且小於抗反射填料(B1)之平均粒徑即佳。硬化物中的填料(B2)之平均粒徑若在0.1μm以上則更佳,若在0.2μm以上則又更佳。又,填料(B2)之平均粒徑若在3μm以下則更佳,若在2μm以下則又更佳。此平均粒徑係從藉由雷射繞射散射法測量而得之體積基準之粒度分布所計算出之中間徑。填料(B2)亦可在組成物(X)之硬化時完全溶解。此時,由於一旦填料(B2)完全溶解,則抗反射填料(B1)之粒子會容易於硬化物之表面暴露出,因此可更為減低硬化物之正反射率,且填料(B1)之粒子亦難以妨礙硬化物之全光線反射率減低。The filler (B) in the composition (X) may further contain a filler (B2) other than the antireflection filler (B1). If the average particle diameter of the filler (B2) other than the antireflective filler (B1) is more than 100nm and smaller than the average particle diameter of the antireflective filler (B1), the regular reflectance of the cured product of the composition (X) can be reduced. Furthermore, even if the particle size of the filler (B2) other than the antireflective filler (B1) is greater than the aforementioned range, as long as the filler (B2) is partially dissolved when the composition (X) is hardened, the filler (B2) in the hardened product ( If the particle size of B2) becomes smaller, the regular reflectance of the cured product of the composition (X) can be reduced by the filler (B2). As an example of the filler (B2) which can partially dissolve when the composition (X) hardens, powdery polyamine (for example, the product name EH-4357S manufactured by ADEKA Co., Ltd.) is mentioned. That is, even if the average particle diameter of the filler (B2) in the composition (X) is greater than the average particle diameter of the antireflection filler (B1), as long as the average particle diameter of the filler (B2) in the composition (X) is 100 nm or more And it is preferably smaller than the average particle size of the anti-reflection filler (B1). The average particle size of the filler (B2) in the cured product is more preferably at least 0.1 μm, and more preferably at least 0.2 μm. Moreover, it is more preferable that the average particle diameter of a filler (B2) is 3 micrometers or less, and it is still more preferable that it is 2 micrometers or less. The average particle size is the median diameter calculated from the volume-based particle size distribution measured by the laser diffraction scattering method. The filler (B2) can also be completely dissolved when the composition (X) hardens. At this time, once the filler (B2) is completely dissolved, the particles of the anti-reflection filler (B1) will be easily exposed on the surface of the hardened product, so the regular reflectance of the hardened product can be further reduced, and the particles of the filler (B1) It is also difficult to prevent the reduction of the total light reflectance of the cured product.

填料(B2)之粒子之形狀較佳為粉碎狀等有角的形狀。此時,可藉由填料(B2)更為減低組成物(X)之硬化物之正反射率。The particle shape of the filler (B2) is preferably a pulverized or angular shape. At this time, the regular reflectance of the cured product of the composition (X) can be further reduced by the filler (B2).

填料(B2)可含有例如樹脂填料及無機填料中至少一者。The filler (B2) may contain, for example, at least one of resin fillers and inorganic fillers.

無機填料含有例如選自於由以下所構成之群組之至少一種:二氧化矽、氧化鋁、硫酸鋇、滑石、黏土、雲母、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鎂、氮化硼、硼酸鋁、鈦酸鋇、鈦酸鍶、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、鋯酸鋇及鋯酸鈣等。The inorganic filler contains, for example, at least one selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide , boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate and calcium zirconate, etc.

樹脂填料可提高硬化物之柔軟性。樹脂填料含有例如選自於由以下所構成之群組之至少一種:矽酮粉末、聚苯乙烯粉末、丙烯酸樹脂粉末、苯并胍胺樹脂粉末及聚丁二烯粉末等,以及包含前述中二種以上樹脂之粉末。再者,樹脂填料可含有的樹脂並不僅限於前述者。矽酮粉末含有例如選自於由以下所構成之群組之至少一種:構成自矽酮橡膠之粉體(矽酮橡膠粉末)、構成自矽酮樹脂之粉體(矽酮樹脂粉末)及具有構成自矽酮橡膠之核與構成自矽酮樹脂之殼之粉體(矽酮複合粉末)。再者,矽酮樹脂係指具有以3維狀矽氧烷鍵結作為主體之骨架的矽酮,且矽酮橡膠係指具有以2維狀矽氧烷鍵結作為主體之骨架的矽酮。Resin fillers can improve the flexibility of hardened products. The resin filler contains, for example, at least one selected from the group consisting of silicone powder, polystyrene powder, acrylic resin powder, benzoguanamine resin powder, polybutadiene powder, etc., and includes the aforementioned two The powder of the above resins. Furthermore, the resins that the resin filler can contain are not limited to the aforementioned ones. The silicone powder contains, for example, at least one selected from the group consisting of: a powder composed of silicone rubber (silicone rubber powder), a powder composed of silicone resin (silicone resin powder), and Powder composed of a core of silicone rubber and a shell of silicone resin (silicone composite powder). In addition, the silicone resin refers to silicone having a skeleton mainly composed of 3-dimensional siloxane bonds, and the silicone rubber refers to silicone having a skeleton mainly composed of 2-dimensional siloxane bonds.

無機填料會使組成物(X)硬化而製作硬化物的過程中的硬化收縮難以發生。因此,組成物(X)會變得更適於相機模組等精密機器中的部件之接著。無機填料含有例如選自於由以下所構成之群組之至少一種:二氧化矽、氧化鋁、硫酸鋇、滑石、黏土、雲母、氫氧化鋁、氫氧化鎂、碳酸鈣、碳酸鎂、氧化鎂、氮化硼、硼酸鋁、鈦酸鋇、鈦酸鍶、鈦酸鈣、鈦酸鎂、鈦酸鉍、氧化鈦、鋯酸鋇及鋯酸鈣等。The inorganic filler hardens the composition (X), and hardening shrinkage in the process of producing a hardened product hardly occurs. Therefore, the composition (X) becomes more suitable for bonding parts in precision machines such as camera modules. The inorganic filler contains, for example, at least one selected from the group consisting of silica, alumina, barium sulfate, talc, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide , boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate and calcium zirconate, etc.

當填料(B)含有抗反射填料(B1)以外的填料(B2)時,為了組成物(X)之硬化物之低彈性模數化,填料(B2)較佳不含二氧化矽及氧化鋁,或者較佳係填料(B2)中的二氧化矽及氧化鋁之含有率低。具體而言,二氧化矽及氧化鋁相對於組成物(X)之比率較佳在10體積%以下。When the filler (B) contains a filler (B2) other than the antireflection filler (B1), it is preferable that the filler (B2) does not contain silica and alumina in order to lower the modulus of elasticity of the cured product of the composition (X). , or preferably the content of silica and alumina in the filler (B2) is low. Specifically, the ratio of silica and alumina to the composition (X) is preferably 10% by volume or less.

包含抗反射填料(B1)之填料(B)相對於組成物(X)之比率較佳在10體積%以上。此時,由於一旦使組成物(X)硬化會因反應性成分(A)之反應造成硬化收縮,抗反射填料(B1)之粒子3會於硬化物1之表面暴露出(參照圖1)。因此,因抗反射填料(B1)造成之光散射作用會顯著產生,且硬化物之正反射率可更為減低。填料(B)之比率若在20體積%以上則更佳,若在25體積%以上則又更佳。又,填料(B)之比率較佳在45體積%以下。此時,可抑制因組成物(X)之填料(B)造成的增黏。此比率若在40體積%以下則更佳,若在35體積%以下則又更佳。The ratio of the filler (B) including the antireflective filler (B1) to the composition (X) is preferably at least 10% by volume. At this time, once the composition (X) is hardened, the reaction of the reactive component (A) causes hardening shrinkage, and the particles 3 of the antireflective filler (B1) are exposed on the surface of the hardened product 1 (see FIG. 1 ). Therefore, the light scattering effect caused by the anti-reflection filler (B1) will be significantly generated, and the regular reflectance of the cured product can be further reduced. The ratio of the filler (B) is more preferably at least 20% by volume, and more preferably at least 25% by volume. Also, the ratio of the filler (B) is preferably at most 45% by volume. In this case, thickening due to the filler (B) of the composition (X) can be suppressed. This ratio is more preferably 40% by volume or less, and more preferably 35% by volume or less.

相對於反應性成分(A)之100質量份,抗反射填料(B1)之量較佳在5質量份以上且82質量份以下。若抗反射填料(B1)之量在5質量份以上,藉由抗反射填料(B1),可特別降低硬化物表面上的光之正反射率。又,若抗反射填料(B1)之量在82質量份以下,可抑制因組成物(X)之抗反射填料(B1)造成的增黏。抗反射填料(B1)之量若在5體積%以上則更佳,若在25體積%以上則又更佳。又,此量若在66體積%以下則更佳,若在43體積%以下則又更佳。The amount of the antireflective filler (B1) is preferably not less than 5 parts by mass and not more than 82 parts by mass relative to 100 parts by mass of the reactive component (A). If the amount of the antireflection filler (B1) is more than 5 parts by mass, the regular reflectance of light on the surface of the cured product can be particularly reduced by the antireflection filler (B1). Also, if the amount of the antireflective filler (B1) is 82 parts by mass or less, thickening due to the antireflective filler (B1) of the composition (X) can be suppressed. The amount of the anti-reflective filler (B1) is more preferably at least 5 vol%, and more preferably at least 25 vol%. Moreover, this amount is more preferably 66 vol% or less, and more preferably 43 vol% or less.

組成物(X)較佳係進一步含有著色材(D)。此時,因在組成物(X)之硬化物內部光會被著色材(D)吸收,可更為減低硬化物之正反射率及全反射率。The composition (X) preferably further contains a coloring material (D). At this time, since the light inside the cured product of the composition (X) is absorbed by the coloring material (D), the regular reflectance and total reflectance of the cured product can be further reduced.

著色材(D)較佳含有選自於由以下所構成之群組之至少一種:碳黑、鈦黑、氮化鋯及染料。此時,更易於減低硬化物之正反射率及全光線反射率。亦即,因藉由著色材(D)使硬化物之透射率下降,可抑制侵入硬化物內部的光在與硬化物相接的部件(被接著體等)之界面上反射而離開至外部。The coloring material (D) preferably contains at least one selected from the group consisting of carbon black, titanium black, zirconium nitride and dyes. In this case, it is easier to reduce the regular reflectance and total light reflectance of the cured product. That is, since the transmittance of the cured product is lowered by the coloring material (D), light entering the cured product can be suppressed from being reflected at the interface of the member (adhered body, etc.) in contact with the cured product to escape to the outside.

組成物(X)之硬化物在從波長400nm至800nm範圍的光之平均透射率較佳在10%以下,若在1%以下則更佳。若透射率在1%以下,侵入硬化物內後於被接著體等反射而出射至外部的光幾乎不會對硬化物之正反射率造成影響。The average transmittance of the cured product of the composition (X) in the wavelength range of 400nm to 800nm is preferably 10% or less, more preferably 1% or less. If the transmittance is less than 1%, the light that penetrates into the cured product, is reflected by the adherend, etc., and exits to the outside hardly affects the regular reflectance of the cured product.

當組成物(X)含有著色材(D)時,相對於反應性成分(A)之100質量份,著色材(D)之量較佳為大於0質量份且在10質量份以下。著色材(D)之量若在0.1質量份以上則更佳,若在0.3質量份以上則又更佳。又,著色材(D)之量若在8質量份以下則更佳,若在5質量份以下則又更佳。When the composition (X) contains the coloring material (D), the amount of the coloring material (D) is preferably greater than 0 parts by mass and not more than 10 parts by mass relative to 100 parts by mass of the reactive component (A). The amount of the coloring material (D) is more preferably at least 0.1 parts by mass, and more preferably at least 0.3 parts by mass. Moreover, if the quantity of a coloring material (D) is 8 mass parts or less, it is more preferable, and it is still more preferable if it is 5 mass parts or less.

在不過度損及本實施形態效果的範圍內,組成物(X)亦可進一步含有前述以外的添加劑。添加劑含有例如選自於由以下所構成之群組之至少一種:聚合抑制劑、自由基捕獲劑、稀釋劑、可撓性賦予劑、偶合劑、抗氧化劑、觸變性賦予劑(觸變賦予劑)及分散劑等。The composition (X) may further contain additives other than those described above within a range not excessively impairing the effects of the present embodiment. The additive contains, for example, at least one selected from the group consisting of: polymerization inhibitors, free radical scavengers, diluents, flexibility imparting agents, coupling agents, antioxidants, thixotropy imparting agents (thixotropy imparting agents ) and dispersants, etc.

組成物(X)較佳不含溶劑,或僅含有作為溶劑不可避免混入之溶劑。當組成物(X)含有溶劑時,溶劑相對於組成物(X)之比率較佳在0.1質量%以下。此時,可適切地將組成物(X)作為接著劑使用,或者適切地使用來製作底部填充劑材。又,在本實施形態中,可一邊抑制組成物(X)之填料(B)所造成的增黏,且可一邊提高組成物(X)之硬化物之抗反射性能,故組成物(X)不含溶劑或組成物(X)中之溶劑含量少,且組成物(X)可具有良好的流動性,因此組成物(X)之塗布性及成形性可變得良好。The composition (X) preferably does not contain a solvent, or contains only a solvent inevitably mixed as a solvent. When the composition (X) contains a solvent, the ratio of the solvent to the composition (X) is preferably 0.1% by mass or less. In this case, the composition (X) can be suitably used as an adhesive, or suitably used to produce an underfill material. Also, in this embodiment, the antireflection performance of the cured product of the composition (X) can be improved while suppressing the thickening caused by the filler (B) of the composition (X), so the composition (X) The composition (X) does not contain a solvent or contains a small amount of solvent, and the composition (X) can have good fluidity, so the coating property and formability of the composition (X) can become good.

組成物(X)之以B型旋轉式黏度計以旋轉速度20rpm之條件測量之25℃下的黏度較佳在200Pa・s以下。此時,組成物(X)可具有特別良好的塗布性及成形性。又,如前所述,在本實施形態中,由於可一邊抑制組成物(X)之填料(B)所造成的增黏,且可一邊提高組成物(X)之硬化物之抗反射性能,因此可實現如前述之組成物(X)之低黏度。此黏度若在100Pa・s以下則更佳,若在50Pa・s以下則又更佳。又,此黏度例如在2Pa・s以上。The viscosity of the composition (X) at 25°C measured with a B-type rotary viscometer at a rotation speed of 20 rpm is preferably below 200 Pa·s. In this case, the composition (X) can have particularly good applicability and formability. Also, as mentioned above, in this embodiment, since the thickening caused by the filler (B) of the composition (X) can be suppressed, and the antireflection performance of the cured product of the composition (X) can be improved, Therefore, the low viscosity of the aforementioned composition (X) can be realized. It is more preferable if the viscosity is below 100Pa·s, and even more preferable if it is below 50Pa·s. Also, this viscosity is, for example, 2 Pa·s or more.

又,組成物(X)之以B型旋轉式黏度計以旋轉速度2rpm之條件測量之25℃下的黏度相對於以B型旋轉式黏度計以旋轉速度20rpm之條件測量之25℃下的黏度之比率(即觸變指數)(10rpm黏度/100rpm黏度)較佳在1以上且7以下。此時,組成物(X)可具有特別良好的流動性,而可更適切地將組成物(X)作為接著劑使用,或者更適切地使用來製作底部填充劑材。特別是,此時,組成物(X)可適切地使用來製作影像感測器用的底部填充劑材。於本實施形態中,由於可一邊抑制組成物(X)之填料(B)所造成的增黏,且可一邊提高組成物(X)之硬化物之抗反射性能,故可實現前述觸變指數。此觸變指數若在1.5以上較佳,若在1.8以上則更佳。再者,此觸變指數若在5.0以下較佳,若在4.0以下又更佳。Also, the viscosity of the composition (X) at 25°C measured with a B-type rotary viscometer at a rotation speed of 2 rpm is relative to the viscosity at 25°C measured with a B-type rotary viscometer at a rotation speed of 20 rpm The ratio (thixotropic index) (10rpm viscosity/100rpm viscosity) is preferably 1 or more and 7 or less. In this case, the composition (X) may have particularly good fluidity, and the composition (X) may be more suitably used as an adhesive, or more suitably used to make an underfill material. In particular, at this time, the composition (X) can be suitably used to produce an underfill material for an image sensor. In this embodiment, since the viscosity increase caused by the filler (B) of the composition (X) can be suppressed, and the antireflection performance of the cured product of the composition (X) can be improved at the same time, the aforementioned thixotropic index can be realized. . The thixotropic index is preferably at least 1.5, and more preferably at least 1.8. Furthermore, if the thixotropic index is below 5.0, it is better, and if it is below 4.0, it is even more preferable.

藉由使組成物(X)硬化可得到硬化物。此時,藉由因應組成物(X)所含有的反應性成分(A)之組成及組成物(X)所因應需要而含有的起始劑(C)及催化劑等之組成的適當方法,使反應性成分(A)反應,藉此可使組成物(X)硬化。例如,可藉由加熱組成物(X)而使其硬化。又,當組成物(X)含有起始劑(C)時,可藉由對組成物(X)照射紫外線等光來使組成物(X)硬化,又,亦可在對組成物(X)照射光之後進一步進行加熱藉此使組成物(X)硬化。A cured product can be obtained by curing the composition (X). At this time, by an appropriate method corresponding to the composition of the reactive component (A) contained in the composition (X) and the composition of the initiator (C) and catalyst contained in the composition (X) as needed, the The reactive component (A) reacts to harden the composition (X). For example, the composition (X) can be hardened by heating. Also, when the composition (X) contains the initiator (C), the composition (X) can be cured by irradiating the composition (X) with light such as ultraviolet rays, and it is also possible to cure the composition (X) The composition (X) is cured by further heating after irradiation with light.

圖1中顯示組成物(X)之硬化物1之一個範例的概況。雖然在硬化前抗反射填料(B2)之粒子3係埋在組成物(X)內,然而一旦組成物(X)硬化,會發生反應性成分(A)之反應所造成的硬化收縮,因此抗反射填料(B2)之粒子3會於硬化物1之表面2暴露出。在圖1所示的範例中,粒子3係具有核32及殼31之核殼型粒子,且粒子3在其表面上具有複數個突起33。如上所述,藉由此突起33,硬化物1之表面2會具有微細的凹凸,因此在硬化物1之表面2會容易產生光之擴散反射,且亦可減低此表面2的全光線反射率本身。因此,可減低硬化物1的光之正反射率。又,如上所述,若粒子3為核殼型之粒子,由於藉由核32與殼31之折射率差而會容易產生核32與殼31之界面上的光之擴散反射,因此可更為減低光之正反射率。又,如上所述,若抗反射填料(B1)之平均粒徑在0.8μm以上,組成物(X)會難以增黏,若在10μm以下,則可確保於底部填充劑材製作用途等之中組成物(X)的流動性。An outline of an example of a cured product 1 of the composition (X) is shown in FIG. 1 . Although the particles 3 of the anti-reflective filler (B2) are buried in the composition (X) before hardening, once the composition (X) hardens, hardening shrinkage caused by the reaction of the reactive component (A) will occur, so the antireflection Particles 3 of the reflective filler (B2) are exposed on the surface 2 of the cured product 1 . In the example shown in FIG. 1 , the particle 3 is a core-shell type particle having a core 32 and a shell 31 , and the particle 3 has a plurality of protrusions 33 on its surface. As mentioned above, the surface 2 of the hardened object 1 has fine unevenness due to the protrusions 33, so light diffuse reflection is easily generated on the surface 2 of the hardened object 1, and the total light reflectance of the surface 2 can also be reduced. itself. Therefore, the regular reflectance of light of the cured product 1 can be reduced. Also, as mentioned above, if the particle 3 is a core-shell type particle, due to the difference in refractive index between the core 32 and the shell 31, the diffuse reflection of light on the interface between the core 32 and the shell 31 is likely to occur, so it can be further improved. Reduce the regular reflectivity of light. Also, as mentioned above, if the average particle size of the anti-reflective filler (B1) is 0.8 μm or more, the composition (X) will be difficult to thicken, and if it is 10 μm or less, it can be used for the production of underfill materials, etc. The fluidity of the composition (X).

組成物(X)之硬化物使用積分球於入射角8°測量之波長400nm以上且800nm以下範圍之光的平均正反射率較佳在0.5%以下,若在0.2%以下更佳。以前述方法測量之波長800nm以上且1000nm以下範圍之光的平均正反射率較佳在0.5%以下,若在0.2%以下則更佳。以前述方法測量之波長400nm以上且1000nm以下範圍之光之平均正反射率較佳在0.5%以下,若在0.2%以下則更佳。在此等情況下,可特別減低硬化物中的光之正反射。因此,在將組成物(X)之硬化物適用於光學機器時,可減低硬化物中起因於光反射之雜訊。於本實施形態中,可實現如此低的平均正反射率。除此之外,為了減低雜訊,組成物(X)之硬化物中的擴散反射率亦以較低為佳。The average regular reflectance of the cured product of composition (X) measured at an incident angle of 8° using an integrating sphere for light with a wavelength of not less than 400 nm and not more than 800 nm is preferably not more than 0.5%, more preferably not more than 0.2%. The average regular reflectance of light with a wavelength of 800 nm to 1000 nm measured by the aforementioned method is preferably less than 0.5%, more preferably less than 0.2%. The average regular reflectance of light with a wavelength of 400nm or more and 1000nm or less measured by the aforementioned method is preferably less than 0.5%, more preferably less than 0.2%. In these cases, the regular reflection of light in the cured product can be particularly reduced. Therefore, when the cured product of the composition (X) is applied to an optical device, noise caused by light reflection in the cured product can be reduced. In this embodiment, such a low average regular reflectance can be realized. In addition, in order to reduce noise, the diffuse reflectance of the cured product of the composition (X) is preferably low.

組成物(X)之硬化物之-40℃下的彈性模數(儲存彈性模數)以在10GPa以下為佳。此時,組成物(X)之硬化物容易具有良好的耐衝擊性,因此可特別適切地將組成物(X)作為相機模組用的接著劑使用。再者,-40℃下的彈性模數在10GPa以下係指,在硬化物之玻璃轉移溫度以下的彈性模數較低之意。於本實施形態中,可實現如此的硬化物之低彈性模數。此彈性模數若在6GPa以下則更佳,若在5GPa以下則又更佳。又,此彈性模數例如在1GPa以上。再者,彈性模數之測量方法係於後揭實施例中說明。The elastic modulus (storage elastic modulus) at -40°C of the cured product of the composition (X) is preferably 10 GPa or less. In this case, the cured product of the composition (X) tends to have good impact resistance, so the composition (X) can be used particularly suitably as an adhesive for camera modules. In addition, the elastic modulus at -40°C of 10 GPa or less means that the elastic modulus at or below the glass transition temperature of the cured product is low. In this embodiment, such a low modulus of elasticity of the cured product can be realized. The modulus of elasticity is more preferably below 6 GPa, and more preferably below 5 GPa. In addition, this modulus of elasticity is, for example, 1 GPa or more. Furthermore, the method of measuring the modulus of elasticity is described in the following examples.

如上所述,組成物(X)例如可適合作為接著劑,更具體而言例如可適合作為用來將相機模組等光學機器之構成部件互相接著的接著劑。此時,即便將構成部件互相接著的組成物(X)之硬化物之端部等表面暴露出外部,仍可抑制此表面上的光之正反射。因此,可抑制在相機模組等光學機器中,於接著劑表面反射的光成為雜訊之原因。藉由組成物(X)接著的構成部件之材質雖可舉例如液晶聚合物、聚碳酸酯、聚酯、聚醯亞胺等樹脂材料、鎳、銅等金屬、陶瓷、玻璃或其他各種基板材料等,但不僅限於其等。將組成物(X)作為接著劑使用時,例如在使組成物(X)位於二個構成部件間的狀態下,如上述般使組成物(X)以適當的方法硬化,而可將構成部件互相接著。As described above, the composition (X) is suitable, for example, as an adhesive, more specifically, for example, as an adhesive for bonding components of optical equipment such as a camera module to each other. In this case, even if the surface such as the end portion of the hardened product of the composition (X) to be bonded to each other is exposed to the outside, regular reflection of light on the surface can be suppressed. Therefore, in optical devices such as camera modules, the light reflected on the surface of the adhesive can be prevented from becoming a cause of noise. The material of the constituent parts bonded by the composition (X) may be, for example, resin materials such as liquid crystal polymers, polycarbonate, polyester, polyimide, metals such as nickel and copper, ceramics, glass, or other various substrate materials. etc., but not limited to. When using the composition (X) as an adhesive, for example, in a state where the composition (X) is located between two constituent parts, the composition (X) can be hardened by an appropriate method as described above, and the constituent parts can be follow each other.

如上所述,組成物(X)亦可適切地用來製作底部填充劑材。底部填充劑材係密封印刷配線板等基材與安裝於基材上之安裝部件之間的縫隙之密封材。當安裝部件為影像感測器等光學元件時,可特別適切地使用組成物(X)。此時,即便底部填充劑材之端部等表面暴露出外部,仍可抑制此表面上的光之正反射,因此可抑制光學元件中於底部填充劑材表面正反射的光成為雜訊之原因。在從組成物(X)製作底部填充劑材時,例如可一邊將組成物(X)注入至基材與安裝於基材上的安裝部件之間的縫隙,一邊如上述般以適當的方法使組成物(X)硬化。 (總結) As mentioned above, the composition (X) can also be suitably used to make an underfill material. The underfill material is a sealing material that seals the gap between a base material such as a printed wiring board and mounting components mounted on the base material. The composition (X) can be used particularly suitably when the mounting component is an optical element such as an image sensor. At this time, even if the surface such as the end of the underfill material is exposed to the outside, the regular reflection of light on this surface can still be suppressed, so it is possible to prevent the light regularly reflected on the surface of the underfill material from becoming a cause of noise in the optical element. . When producing an underfill material from the composition (X), for example, injecting the composition (X) into the gap between the base material and the mounting member mounted on the base material, it can be used in an appropriate manner as described above. The composition (X) hardens. (Summarize)

關於本揭示內容之第1態樣之反應硬化性組成物含有反應性成分(A)及填料(B)。填料(B)含有抗反射填料(B1)。抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下,且抗反射填料(B1)在其粒子表面上具有複數個突起。突起之平均徑在100nm以上且500nm以下。The reaction-hardenable composition concerning the 1st aspect of this disclosure contains a reactive component (A) and a filler (B). Filler (B) contains antireflective filler (B1). The average particle size of the antireflective filler (B1) is not less than 0.8 μm and not more than 10 μm, and the antireflective filler (B1) has a plurality of protrusions on the particle surface. The average diameter of the protrusions is not less than 100 nm and not more than 500 nm.

於此態樣中,藉由使反應硬化性組成物而製作硬化物,可抑制此硬化物之表面上光之反射。In this aspect, the reflection of light on the surface of the cured product can be suppressed by producing a cured product from a reaction-curable composition.

第2態樣,係於第1態樣中,抗反射填料(B1)在其粒子表面的10%以上之面積部分具有突起。In the second aspect, in the first aspect, the antireflection filler (B1) has protrusions in an area of 10% or more of the particle surface.

第3態樣,係於第1或第2態樣中,反應性成分(A)含有反應性化合物(A1),且反應性化合物(A1)含有環氧化合物及丙烯酸化合物中至少一者。In the 3rd aspect, in the 1st or 2nd aspect, a reactive component (A) contains a reactive compound (A1), and a reactive compound (A1) contains at least one of an epoxy compound and an acrylic compound.

第4態樣,係於第3態樣中,反應性成分(A)進一步含有會與反應性化合物(A1)反應之硬化劑(A2)。In the fourth aspect, in the third aspect, the reactive component (A) further contains a curing agent (A2) that reacts with the reactive compound (A1).

第5態樣,係於第3或第4態樣中,進一步含有起始劑(C)。A fifth aspect is the third or fourth aspect, further comprising an initiator (C).

第6態樣,係於第1至第5之任一態樣中,抗反射填料(B1)之折射率滿足以下之中至少一者:在1.7以下,以及在反應性成分(A)之硬化物之折射率以下。The sixth aspect is that in any one of the first to fifth aspects, the refractive index of the anti-reflection filler (B1) satisfies at least one of the following: 1.7 or less, and the hardening of the reactive component (A) below the refractive index of the object.

第7態樣,係於第1至第6之任一態樣中,抗反射填料(B1)之粒子係核殼型粒子,其具有核及包覆核之殼,且在殼的表面上具有突起。The seventh aspect is that in any one of the first to sixth aspects, the particles of the anti-reflective filler (B1) are core-shell particles, which have a core and a shell covering the core, and have on the surface of the shell protrusion.

第8態樣,係於第7態樣中,核含有丙烯酸樹脂,且殼及突起之各者含有矽酮。In the eighth aspect, in the seventh aspect, the core contains acrylic resin, and each of the shell and the protrusion contains silicone.

第9態樣,係於第1至第8之任一態樣中,填料(B)相對於反應硬化性組成物之百分比在10體積%以上。In a ninth aspect, in any one of the first to eighth aspects, the percentage of the filler (B) to the reaction-curable composition is 10% by volume or more.

第10態樣,係於第1至第9之任一態樣中,抗反射填料(B1)相對於反應性成分(A)100質量份之量在5質量份以上且82質量份以下。In a tenth aspect, in any one of the first to ninth aspects, the amount of the antireflection filler (B1) is not less than 5 parts by mass and not more than 82 parts by mass relative to 100 parts by mass of the reactive component (A).

第11態樣,係於第1至第10之任一態樣中,反應硬化性組成物進一步含有著色材(D)。In an eleventh aspect, in any one of the first to tenth aspects, the reaction-curable composition further contains a coloring material (D).

第12態樣中,著色材含有選自於由以下所構成之群組之至少一種:碳黑、鈦黑、氮化鋯及染料。In the twelfth aspect, the coloring material contains at least one selected from the group consisting of carbon black, titanium black, zirconium nitride, and dyes.

第13態樣,係於第11或第12態樣中,著色材(D)相對於反應性成分(A)100質量份之量係大於0質量份且在10質量份以下。In a 13th aspect, in the 11th or 12th aspect, the amount of the coloring material (D) is greater than 0 parts by mass and 10 parts by mass or less with respect to 100 parts by mass of the reactive component (A).

第14態樣,係於第1至第13之任一態樣中,反應硬化性組成物之硬化物使用積分球於入射角8°測量的波長400nm以上且800nm以下範圍的光之平均正反射率在0.5%以下。The 14th aspect is the average regular reflection of light with a wavelength of 400nm or more and 800nm or less measured at an incident angle of 8° by the hardened product of the reaction-curable composition in any one of the 1st to 13th aspects. The rate is below 0.5%.

第15態樣,係於第1至第14之任一態樣中,反應硬化性組成物之以B型旋轉式黏度計以20rpm之條件測量之25℃下的黏度在200Pa・s以下。A fifteenth aspect is that in any one of the first to fourteenth aspects, the viscosity of the reaction-curable composition at 25°C measured with a B-type rotary viscometer at 20 rpm is 200 Pa·s or less.

第16態樣,係於第1至第15之任一態樣中,反應硬化性組成物之以B型旋轉式黏度計以2rpm之條件測量之25℃下的黏度相對於以B型旋轉式黏度計以20rpm之條件測量之25℃下的黏度之比(即觸變指數)在1以上且7以下。The 16th aspect is that in any one of the 1st to 15th aspects, the viscosity of the reaction hardening composition at 25°C measured with a B-type rotary viscometer at 2 rpm is relative to the viscosity of the reaction-hardening composition measured with a B-type rotary viscometer The viscosity ratio (thixotropic index) at 25°C measured by the viscometer at 20 rpm is between 1 and 7.

第17態樣,係於第1至第16之任一態樣中,反應硬化性組成物之硬化物之-40℃下的彈性模數在10GPa以下。A seventeenth aspect is any one of the first to sixteenth aspects, wherein the cured product of the reaction-curable composition has an elastic modulus at -40°C of 10 GPa or less.

第18態樣,係於第1至第17之任一態樣中,反應硬化性組成物不含溶劑,或是僅含有作為溶劑不可避免混入的溶劑。In an eighteenth aspect, in any one of the first to seventeenth aspects, the reaction-curable composition does not contain a solvent, or contains only a solvent that is unavoidably mixed as a solvent.

第19態樣,係於第1至第18之任一態樣中,反應硬化性組成物係接著劑。A nineteenth aspect is any one of the first to eighteenth aspects, wherein the reaction hardening composition is an adhesive.

第20態樣,係於第1至第18之任一態樣中,反應硬化性組成物係用於底部填充劑材製作的組成物。 實施例 A 20th aspect is any one of the 1st to 18th aspects, wherein the reaction hardening composition is a composition used for making an underfill material. Example

以下係提示本實施形態更為具體的實施例。再者,本實施形態並不限制於僅為下述實施例。 1.組成物之製備 The following is a more specific example of this embodiment. In addition, this embodiment is not limited only to the following examples. 1. Preparation of the composition

藉由混合表1至表4所示原料來製備組成物。表1至表4所示原料之細節係如下所述。Compositions were prepared by mixing the raw materials shown in Table 1 to Table 4. Details of the raw materials shown in Tables 1 to 4 are as follows.

-YD8125:液狀雙酚A型環氧樹脂。日鐵化學&材料股份有限公司製,品名YD8125。比重1.2。-YD8125: Liquid bisphenol A epoxy resin. Nippon Steel Chemical & Materials Co., Ltd., product name YD8125. Specific gravity 1.2.

-YDF8170:液狀雙酚F型環氧樹脂。日鐵化學&材料股份有限公司製,品名YDF8170。比重1.2。-YDF8170: Liquid bisphenol F epoxy resin. Nippon Steel Chemical & Materials Co., Ltd., product name YDF8170. Specific gravity 1.2.

-#230:1,6-己烷二醇二丙烯酸酯。大阪有機化學工業股份有限公司製。品名Viscoat #230。比重1.02。- #230: 1,6-Hexanediol diacrylate. Made by Osaka Organic Chemical Industry Co., Ltd. Product name Viscoat #230. The specific gravity is 1.02.

-MH-700:液狀酸酐。新日本理化股份有限公司製,品名Rikacid MH-700。比重1.2。-MH-700: Liquid anhydride. Made by Nippon Chemical Co., Ltd., product name Rikacid MH-700. Specific gravity 1.2.

-EH-4357S:粉狀多胺。ADEKA股份有限公司製,品名EH-4357S。比重1.2。-EH-4357S: Polyamine in powder form. Made by ADEKA Co., Ltd., product name EH-4357S. Specific gravity 1.2.

-QX40:液狀硫醇化合物。三菱化學股份有限公司製。新戊四醇四(3-巰基丙酸酯)。品名Epomate QX40。比重1.26。-QX40: Liquid thiol compound. Manufactured by Mitsubishi Chemical Corporation. Neopentylthritol tetrakis(3-mercaptopropionate). The product name is Epomate QX40. The specific gravity is 1.26.

-MEH8000H:液狀烯丙基化酚酚醛清漆樹脂。明和化成股份有限公司製,品名MEH8000H。比重1.2。- MEH8000H: Liquid allylated phenol novolac resin. Made by Meihe Chemical Co., Ltd., product name MEH8000H. Specific gravity 1.2.

-Omnirad 184:1-羥基環己基-苯基酮。IGM Resins B.V.製,品名Omnirad 184。比重1.2。- Omnirad 184: 1-Hydroxycyclohexyl-phenyl ketone. IGM Resins B.V. product name Omnirad 184. Specific gravity 1.2.

-2P4MZ:2-苯基-4-甲基咪唑。四國化成工業股份有限公司製。比重1.1。-2P4MZ: 2-phenyl-4-methylimidazole. Shikoku Chemical Industry Co., Ltd. Specific gravity 1.1.

-HXA9322HP:微膠囊化咪唑。旭化成E材料股份有限公司製,品名Novacure HXA9322HP。-HXA9322HP: microencapsulated imidazole. Made by Asahi Kasei E Materials Co., Ltd., product name Novacure HXA9322HP.

-填料#1:於粒子表面具有突起,且具有構成自聚甲基丙烯酸甲酯之核及構成自矽酮樹脂之殼之核殼型粒子。平均粒徑3μm。突起徑0.2~0.4μm。平均突起徑0.3μm。突起之附著面積比率60%。日興RICA股份有限公司製,品名Silcrusta MKN03。比重1.2。- Filler #1: core-shell type particles having protrusions on the particle surface, and having a core composed of polymethyl methacrylate and a shell composed of silicone resin. The average particle size is 3 μm. The protrusion diameter is 0.2~0.4μm. The average protrusion diameter is 0.3 μm. The attachment area ratio of protrusions is 60%. Made by Nikko RICA Co., Ltd., product name Silcrusta MKN03. Specific gravity 1.2.

-填料#2:球狀二氧化矽。平均粒徑0.3μm。Admatechs公司製,品名SC1053SQ。比重2.2。- Filler #2: Spherical silica. The average particle size is 0.3 μm. Made by Admatechs, product name SC1053SQ. Specific gravity 2.2.

-填料#3:球狀矽酮粉末。日興RICA股份有限公司製,品名MSP-SN08。平均粒徑0.8μm。比重1.2。- Filler #3: Spherical silicone powder. Made by Nikko RICA Co., Ltd., product name MSP-SN08. The average particle size is 0.8 μm. Specific gravity 1.2.

-填料#4:表面具有突起之矽酮粉末。平均粒徑4μm。突起徑0.1μm以下。平均突起徑0.1μm以下。日興RICA股份有限公司製,品名MSPTKN04。 比重1.2。- Filler #4: Silicone powder with protrusions on the surface. The average particle size is 4μm. The protrusion diameter is 0.1 μm or less. The average protrusion diameter is 0.1 μm or less. Made by Nikko RICA Co., Ltd., product name MSPTKN04. Specific gravity 1.2.

-填料#5:表面具有突起之矽酮粉末。平均粒徑6μm。突起徑0.4μm以上,平均突起徑0.6μm。日興RICA股份有限公司製,品名NHRASN06。比重1.2。- Filler #5: Silicone powder with protrusions on the surface. The average particle size is 6μm. The protrusion diameter is 0.4 μm or more, and the average protrusion diameter is 0.6 μm. Made by Nikko RICA Co., Ltd., product name NHRASN06. Specific gravity 1.2.

-填料#6:球狀二氧化矽。平均粒徑1.0μm。Admatechs公司製,品名SC4053SQ。比重2.2。- Filler #6: Spherical silica. The average particle size is 1.0 μm. Admatechs company make, product name SC4053SQ. Specific gravity 2.2.

-MA600MJ2:碳黑。平均粒徑20nm。三菱化學股份有限公司製,品名MA600MJ2。比重1.8。-MA600MJ2: carbon black. The average particle size is 20nm. Mitsubishi Chemical Co., Ltd. product name MA600MJ2. Specific gravity 1.8.

-UF-8:鈦黑。平均粒徑20nm。三菱材料電子化成股份有限公司製。品名UF-8。比重3.9。 2.評定試驗 -UF-8: titanium black. The average particle size is 20nm. Made by Mitsubishi Materials Corporation. Product name UF-8. Specific gravity 3.9. 2. Evaluation test

針對前述組成物進行下述評定試驗。將其結果示於表1至表4。 (1)硬化物之製作 The following evaluation tests were performed on the aforementioned compositions. The results are shown in Tables 1 to 4. (1) Production of hardened products

藉由將組成物塗布於載玻片,而製作20mm×50mm×0.2mm之尺寸的膜。A film having a size of 20 mm×50 mm×0.2 mm was produced by applying the composition on a slide glass.

於實施例1~10及比較例15~20,藉由加熱前述膜使其硬化,而得到硬化物。加熱時的溫度及時間,於實施例1及2以及比較例15~20係120℃及3小時,於實施例3~8係80℃及1小時,於實施例9及10係120℃及3小時。In Examples 1-10 and Comparative Examples 15-20, the said film was heated and hardened, and the hardened|cured material was obtained. The temperature and time during heating are 120°C and 3 hours in Examples 1 and 2 and Comparative Examples 15-20, 80°C and 1 hour in Examples 3-8, and 120°C and 3 hours in Examples 9 and 10. Hour.

實施例11及12中,係藉由將前述膜照射紫外線隨後加熱使其硬化,而得到硬化物。紫外線之照射條件係波長365nm、照度500mW/cm 2、積算光量2000mJ/cm 2。加熱時之溫度及時間係80℃及1小時。 In Examples 11 and 12, a cured product was obtained by irradiating the above-mentioned film with ultraviolet rays and then heating and curing it. The irradiation conditions of ultraviolet rays are wavelength 365nm, illuminance 500mW/cm 2 , and integrated light quantity 2000mJ/cm 2 . The temperature and time during heating are 80°C and 1 hour.

實施例13及14中,係藉由將前述膜照射紫外線使其硬化,而得到硬化物。紫外線之照射條件係波長365nm、照度500mW/cm 2、積算光量2000mJ/cm 2。 (2)25℃下的黏度 In Examples 13 and 14, a cured product was obtained by irradiating the above-mentioned film with ultraviolet rays and curing it. The irradiation conditions of ultraviolet rays are wavelength 365nm, illuminance 500mW/cm 2 , and integrated light quantity 2000mJ/cm 2 . (2) Viscosity at 25°C

使用B型旋轉式黏度計(東機產業股份有限公司製,型號TVB-10),以旋轉速度20rpm之條件測量於25℃之組成物之黏度。 (3)於25℃之觸變指數 Using a B-type rotary viscometer (manufactured by Toki Sangyo Co., Ltd., model TVB-10), the viscosity of the composition at 25° C. was measured at a rotation speed of 20 rpm. (3) Thixotropic index at 25°C

使用B型旋轉式黏度計(東機產業股份有限公司製,型號TVB-10),以旋轉速度2rpm之條件測量25℃下的組成物之黏度。從此結果及依據前述「(1)25℃下的黏度」得到的黏度,計算出以旋轉速度20rpm之條件測量之25℃下的黏度與以旋轉速度2rpm之條件測量之25℃下的黏度之比(即觸變指數)(2rpm黏度/20rpm黏度)。 (4)400-800nm平均正反射率 Using a B-type rotary viscometer (manufactured by Toki Sangyo Co., Ltd., model TVB-10), the viscosity of the composition at 25° C. was measured at a rotation speed of 2 rpm. From this result and the viscosity obtained from the aforementioned "(1) Viscosity at 25°C", calculate the ratio of the viscosity at 25°C measured at a rotation speed of 20 rpm to the viscosity at 25°C measured at a rotation speed of 2 rpm (Thixotropic index) (2rpm viscosity/20rpm viscosity). (4) 400-800nm average positive reflectance

使用於前述「(1)硬化物之製作」製作的硬化物來作為評定用樣品,針對此評定用樣品,使用島津製作所股份有限公司製的分光光度計UV-3600i Plus,測量於入射角8°之全光線反射率,以及於入射角0°之擴散反射率。計算出全光線反射率與擴散反射率之差來作為正反射率。從此結果求出波長400-800nm範圍之正反射率之平均値,令其為平均正反射率。 (5)800-1000nm平均正反射率 The cured product produced in the above "(1) Production of cured product" was used as a sample for evaluation, and the sample for evaluation was measured at an incident angle of 8° using a spectrophotometer UV-3600i Plus manufactured by Shimadzu Corporation. The total light reflectance, and the diffuse reflectance at an incident angle of 0°. The difference between the total light reflectance and the diffuse reflectance was calculated as the regular reflectance. From this result, the average value of the regular reflectance in the wavelength range of 400-800 nm was obtained, and it was made the average regular reflectance. (5) 800-1000nm average positive reflectance

使用於前述「(1)硬化物之製作」製作的硬化物來作為評定用樣品,針對此評定用樣品,使用島津製作所股份有限公司製的分光光度計UV-3600i Plus,測量於入射角8°之全光線反射率,以及於入射角0°之擴散反射率,計算出全光線反射率與擴散反射率之差來作為正反射率。從此結果求出波長800-1000nm範圍之正反射率之平均値,令其為平均正反射率。 (6)400-800nm平均擴散反射率 The cured product produced in the above "(1) Production of cured product" was used as a sample for evaluation, and the sample for evaluation was measured at an incident angle of 8° using a spectrophotometer UV-3600i Plus manufactured by Shimadzu Corporation. The total light reflectance, and the diffuse reflectance at an incident angle of 0°, calculate the difference between the total light reflectance and the diffuse reflectance as the regular reflectance. From this result, the average value of the regular reflectance in the wavelength range of 800-1000 nm was obtained, and it was made the average regular reflectance. (6) 400-800nm average diffuse reflectance

使用於前述「(1)硬化物之製作」製作的硬化物來作為評定用樣品,針對此評定用樣品,使用島津製作所股份有限公司製的分光光度計UV-3600i Plus,測量於入射角0°之擴散反射率。從此結果求出波長400-800nm範圍之擴散反射率之平均値,令其為平均擴散反射率。 (7)800-1000nm平均擴散反射率 The cured product produced in the above "(1) Preparation of cured product" was used as an evaluation sample, and the evaluation sample was measured at an incident angle of 0° using a spectrophotometer UV-3600i Plus manufactured by Shimadzu Corporation. The diffuse reflectivity. From this result, the average value of the diffuse reflectance in the wavelength range of 400-800nm was obtained, and it was made the average diffuse reflectance. (7) 800-1000nm average diffuse reflectance

使用於前述「(1)硬化物之製作」製作的硬化物來作為評定用樣品,針對此評定用樣品,使用島津製作所股份有限公司製的分光光度計UV-3600i Plus,測量於入射角0°之擴散反射率。從此結果求出波長800-1000nm之範圍之擴散反射率之平均値,令其為平均擴散反射率。 (8)400-1000nm平均透射率 The cured product produced in the above "(1) Preparation of cured product" was used as an evaluation sample, and the evaluation sample was measured at an incident angle of 0° using a spectrophotometer UV-3600i Plus manufactured by Shimadzu Corporation. The diffuse reflectivity. From this result, the average value of the diffuse reflectance in the wavelength range of 800-1000 nm was obtained, and it was made the average diffuse reflectance. (8) 400-1000nm average transmittance

使用於前述「(1)硬化物之製作」製作的硬化物來作為評定用樣品,針對此評定用樣品,使用島津製作所股份有限公司製的分光光度計UV-3600i Plus,測量於入射角0°之光之透射率。從此結果求出波長400-1000nm之範圍之透射率之平均値,令其為平均透射率。 (9)接著力 The cured product produced in the above "(1) Preparation of cured product" was used as an evaluation sample, and the evaluation sample was measured at an incident angle of 0° using a spectrophotometer UV-3600i Plus manufactured by Shimadzu Corporation. The transmittance of light. From the results, the average value of the transmittance in the range of wavelength 400-1000nm was obtained, and it was made the average transmittance. (9) Adherence

以下述方法測量將組成物作為接著劑使用時的接著力。於玻璃製的被接著體上塗布組成物而製作直徑3mm、厚度0.5mm之塗膜。以與前述「(1)硬化物之製作」的情況相同的條件使此塗膜硬化,而得到硬化物。藉由剪力測試機測量硬化物對於被接著體之剪切接著強度。Adhesive force when the composition was used as an adhesive was measured by the following method. The composition was coated on a glass substrate to prepare a coating film with a diameter of 3 mm and a thickness of 0.5 mm. This coating film was cured under the same conditions as in the case of the aforementioned "(1) Preparation of cured product" to obtain a cured product. The shear bonding strength of the cured product to the bonded body was measured by a shear testing machine.

基於此結果,以下述基準評定接著力。 A:15MPa以上。 B:5MPa以上且小於15MPa。 C:小於5MPa。 (10)彈性模數 Based on this result, the adhesive force was evaluated on the basis of the following criteria. A: More than 15MPa. B: 5 MPa or more and less than 15 MPa. C: Less than 5 MPa. (10) modulus of elasticity

於玻璃板上配置聚對苯二甲酸乙二酯製的離形薄膜,於離型薄膜上配置具有俯視3mm×50mm、厚度0.5mm之空間的矽酮製間隔件。將組成物流入間隔件內空間後,在間隔件上表面配置聚對苯二甲酸乙二酯製的離形薄膜,且在離型薄膜上配置玻璃板。接著以與前述「(1)硬化物之製作」的情況相同的條件使組成物硬化,而做成評定用樣品。A release film made of polyethylene terephthalate was placed on the glass plate, and a spacer made of silicone having a space of 3 mm×50 mm in plan view and 0.5 mm in thickness was placed on the release film. After the composition was flowed into the inner space of the spacer, a release film made of polyethylene terephthalate was placed on the upper surface of the spacer, and a glass plate was placed on the release film. Next, the composition was cured under the same conditions as in the case of the aforementioned "(1) Preparation of cured product" to prepare a sample for evaluation.

使用日立High-Tech Science股份有限公司製的黏彈性測量裝置DMA7100,將此評定用樣品以測量周波數:1Hz、測量模式:拉伸的條件測量-40℃下的儲存彈性模數,並以下述基準進行評定。 A:1GPa以上且小於4GPa。 B:4GPa以上且小於7GPa。 C:7GPa以上。 [表1]   實施例 1 2 3 4 5 6 7 反應性化合物(質量份) YD8125 21 21 33 33 33 21 21 YDF8170 21 21 33 33 33 21 21 #230               硬化劑(質量份)     MH-700 57 57           EH-4357S     11 11 11     QX40           32 32 MEH8000H               起始劑(質量份) OMNIRAD 184               催化劑(質量份)   2P4MZ 1 1           HXA9322HP     23 23 23 26 26 填料(質量份)         填料#1 43 66 5 25 66 5 25 填料#2               填料#3               填料#4               填料#5               填料#6               顔料(質量份) MA600MJ2 1 1 1 1 1 1 1 UF-8               抗反射填料合計之體積比率 30% 40% 5% 20% 40% 5% 20% 填料合計之體積比率 30% 40% 23% 35% 51% 13% 27% 評定                 25℃下的黏度 (Pa・s) 7 35 3 7 150 3 15 觸變指數 1.5 2.0 1.9 2.1 2.6 1.1 1.2 400-800nm平均正反射率(%) <0.2 <0.2 0.3 <0.2 <0.2 0.3 <0.2 800-1000nm平均正反射率(%) <0.2 <0.2 0.45 <0.2 <0.2 0.45 <0.2 400-800nm平均擴散反射率(%) 4.7 3.2 5.5 4.5 3.8 5.7 4.5 800-1000nm平均擴散反射率(%) 4.6 3.1 5.5 4.4 3.7 5.7 4.4 400-1000nm平均透射率(%) <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 接著力(MPa) A B A A B A A 彈性模數(GPa) B B B B B A B [表2]   實施例 8 9 10 11 12 13 14 反應性化合物(質量份) YD8125 21 27 27 17 17     YDF8170 21 27 27 17 17     #230       19 19 51.8 51.8 硬化劑(質量份)     MH-700               EH-4357S               QX40 32     38.8 38.8 47.6 47.6 MEH8000H   45 45         起始劑(質量份) OMNIRAD 184       1.2 1.2 0.6 0.6 催化劑(質量份)   2P4MZ   1 1         HXA9322HP 26     7 7     填料(質量份)         填料#1 66 43 66 43 66 43 82 填料#2               填料#3               填料#4               填料#5               填料#6               顔料(質量份) MA600MJ2 1 1 1         UF-8       1 1 1 1 抗反射填料合計之體積比率 40% 30% 40% 30% 40% 30% 45% 填料合計之體積比率 45% 30% 40% 32% 41% 30% 45% 評定                 25℃下的黏度 (Pa・s) 50 15 50 5 120 3 10 觸變指數 1.5 1.2 1.5 1.6 2.1 2.9 4.5 400-800nm平均正反射率(%) <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 800-1000nm平均正反射率(%) <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 400-800nm平均擴散反射率(%) 3.3 5.1 3.5 5 4.2 3.5 2.4 800-1000nm平均擴散反射率(%) 3.2 5 3.4 5 4.1 3.5 2.4 400-1000nm平均透射率(%) <0.1 <0.1 <0.1 2 2 2 2 接著力(MPa) B A B A A B B 彈性模數(GPa) B B B A A A A [表3]   比較例 15 16 17 18 19 20 反應性化合物(質量份) YD8125 21 21 21 21 21 21 YDF8170 21 21 21 21 21 21 #230             硬化劑(質量份)     MH-700 57 57 57 57 57 57 EH-4357S             QX40             MEH8000H             起始劑(質量份) OMNIRAD 184             催化劑(質量份)   2P4MZ 1 1 1 1 1 1 HXA9322HP             填料(質量份)         填料#1 0           填料#2   79         填料#3     43       填料#4       43     填料#5         43   填料#6           79 顔料(質量份) MA600MJ2 1 1 1 1 1 1 UF-8             抗反射填料合計之體積比率 0% 0% 0% 0% 0% 0% 填料合計之體積比率 0% 30% 30% 30% 30% 55% 評定                 25℃下的黏度(Pa・s) 3 250 20 9 6 16 觸變指數 2.1 1.8 1.3 1.7 1.5 1.3 400-800nm平均正反射率(%) 3.6 2.6 2.5 2.2 1.7 2.6 800-1000nm平均正反射率(%) 3.8 2.9 2.8 2.5 2 2.9 400-800nm平均擴散反射率(%) 3.1 3.4 3.5 3.8 4.3 3.4 800-1000nm平均擴散反射率(%)   3.1 3.2 3.5 4 3.1 400-1000nm平均透射率(%) <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 接著力(MPa) A B B B B B 彈性模數(GPa) B C B B B C 3.追加評定 (1)填料#1之突起之評定 Using a viscoelasticity measuring device DMA7100 manufactured by Hitachi High-Tech Science Co., Ltd., the sample for evaluation was measured under the conditions of frequency frequency: 1 Hz, measurement mode: tensile, and the storage elastic modulus at -40°C was measured as follows. Benchmarks are assessed. A: 1 GPa or more and less than 4 GPa. B: 4 GPa or more and less than 7 GPa. C: 7 GPa or more. [Table 1] Example 1 2 3 4 5 6 7 Reactive compounds (parts by mass) YD8125 twenty one twenty one 33 33 33 twenty one twenty one YDF8170 twenty one twenty one 33 33 33 twenty one twenty one #230 Hardener (parts by mass) MH-700 57 57 EH-4357S 11 11 11 QX40 32 32 MEH8000H Initiator (parts by mass) OMNIRAD 184 Catalyst (parts by mass) 2P4MZ 1 1 HXA9322HP twenty three twenty three twenty three 26 26 Filler (parts by mass) Filler #1 43 66 5 25 66 5 25 Filler #2 Filler #3 Filler #4 Filler #5 Filler #6 Pigment (parts by mass) MA600MJ2 1 1 1 1 1 1 1 UF-8 Total volume ratio of anti-reflective filler 30% 40% 5% 20% 40% 5% 20% The volume ratio of the total filler 30% 40% twenty three% 35% 51% 13% 27% assessment Viscosity at 25°C (Pa・s) 7 35 3 7 150 3 15 Thixotropic index 1.5 2.0 1.9 2.1 2.6 1.1 1.2 400-800nm average regular reflectance (%) <0.2 <0.2 0.3 <0.2 <0.2 0.3 <0.2 800-1000nm average regular reflectance (%) <0.2 <0.2 0.45 <0.2 <0.2 0.45 <0.2 400-800nm average diffuse reflectance (%) 4.7 3.2 5.5 4.5 3.8 5.7 4.5 800-1000nm average diffuse reflectance (%) 4.6 3.1 5.5 4.4 3.7 5.7 4.4 400-1000nm average transmittance (%) <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 Adhesion force (MPa) A B A A B A A Elastic modulus (GPa) B B B B B A B [Table 2] Example 8 9 10 11 12 13 14 Reactive compounds (parts by mass) YD8125 twenty one 27 27 17 17 YDF8170 twenty one 27 27 17 17 #230 19 19 51.8 51.8 Hardener (parts by mass) MH-700 EH-4357S QX40 32 38.8 38.8 47.6 47.6 MEH8000H 45 45 Initiator (parts by mass) OMNIRAD 184 1.2 1.2 0.6 0.6 Catalyst (parts by mass) 2P4MZ 1 1 HXA9322HP 26 7 7 Filler (parts by mass) Filler #1 66 43 66 43 66 43 82 Filler #2 Filler #3 Filler #4 Filler #5 Filler #6 Pigment (parts by mass) MA600MJ2 1 1 1 UF-8 1 1 1 1 Total volume ratio of anti-reflective filler 40% 30% 40% 30% 40% 30% 45% The volume ratio of the total filler 45% 30% 40% 32% 41% 30% 45% assessment Viscosity at 25°C (Pa・s) 50 15 50 5 120 3 10 Thixotropic index 1.5 1.2 1.5 1.6 2.1 2.9 4.5 400-800nm average regular reflectance (%) <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 800-1000nm average regular reflectance (%) <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 <0.2 400-800nm average diffuse reflectance (%) 3.3 5.1 3.5 5 4.2 3.5 2.4 800-1000nm average diffuse reflectance (%) 3.2 5 3.4 5 4.1 3.5 2.4 400-1000nm average transmittance (%) <0.1 <0.1 <0.1 2 2 2 2 Adhesion force (MPa) B A B A A B B Elastic modulus (GPa) B B B A A A A [table 3] comparative example 15 16 17 18 19 20 Reactive compounds (parts by mass) YD8125 twenty one twenty one twenty one twenty one twenty one twenty one YDF8170 twenty one twenty one twenty one twenty one twenty one twenty one #230 Hardener (parts by mass) MH-700 57 57 57 57 57 57 EH-4357S QX40 MEH8000H Initiator (parts by mass) OMNIRAD 184 Catalyst (parts by mass) 2P4MZ 1 1 1 1 1 1 HXA9322HP Filler (parts by mass) Filler #1 0 Filler #2 79 Filler #3 43 Filler #4 43 Filler #5 43 Filler #6 79 Pigment (parts by mass) MA600MJ2 1 1 1 1 1 1 UF-8 Total volume ratio of anti-reflective filler 0% 0% 0% 0% 0% 0% The volume ratio of the total filler 0% 30% 30% 30% 30% 55% assessment Viscosity at 25°C (Pa・s) 3 250 20 9 6 16 Thixotropic index 2.1 1.8 1.3 1.7 1.5 1.3 400-800nm average regular reflectance (%) 3.6 2.6 2.5 2.2 1.7 2.6 800-1000nm average regular reflectance (%) 3.8 2.9 2.8 2.5 2 2.9 400-800nm average diffuse reflectance (%) 3.1 3.4 3.5 3.8 4.3 3.4 800-1000nm average diffuse reflectance (%) 3.1 3.2 3.5 4 3.1 400-1000nm average transmittance (%) <0.1 <0.1 <0.1 <0.1 <0.1 <0.1 Adhesion force (MPa) A B B B B B Elastic modulus (GPa) B C B B B C 3. Additional evaluation (1) Evaluation of the protrusion of packing #1

使用示差掃描型電子顯微鏡攝影前述填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之粒子而得到影像。將影像示於圖7。如圖7所示,填料#1之粒子在其表面全體範圍具有突起。自影像針對10個粒子(突起數合計100個以上)測量突起之縱徑(長徑之尺寸)及横徑(與長徑正交的方向之尺寸),並計算出縱徑與横徑之平均値來作為突起之徑。The particles of the aforementioned filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03) were photographed using a differential scanning electron microscope to obtain an image. The image is shown in FIG. 7 . As shown in FIG. 7, the particles of filler #1 have protrusions on the entire surface. Measure the longitudinal diameter (the dimension of the long diameter) and the transverse diameter (the dimension perpendicular to the long diameter) of the protrusions from the image for 10 particles (the total number of protrusions is more than 100), and calculate the average of the longitudinal and transverse diameters The value is used as the diameter of the protrusion.

將此結果示於圖2之圖表中。於此圖表中,分別地,横軸表示突起之徑,縱軸則表示頻率(突起之個數)。如此結果所示,填料#1之突起之徑的頻率在200nm至500nm的範圍內係均勻地高。 (2)填料比較評定 The results are shown in the graph of FIG. 2 . In this graph, the horizontal axis represents the diameter of the protrusions, and the vertical axis represents the frequency (the number of protrusions), respectively. As shown by this result, the frequency of the protrusion diameter of filler #1 is uniformly high in the range of 200 nm to 500 nm. (2) Comparative evaluation of fillers

混合除了不含填料之外具有實施例1組成之混合物以及前述填料#1,以使得填料#1之比率成為40質量%,而製備組成物。又,使用填料#3(日興RICA股份有限公司製,品名MSP-SN08)、填料#4(日興RICA股份有限公司製,品名MSPTKN04)及填料#5(日興RICA股份有限公司製,品名NHRASN06)之各者來代替填料#1,而相同地製備組成物。A mixture having the composition of Example 1 except that the filler was not contained, and the aforementioned filler #1 were mixed so that the ratio of the filler #1 became 40% by mass to prepare a composition. Also, filler #3 (manufactured by Nikko RICA Co., Ltd., product name MSP-SN08), filler #4 (manufactured by Nikko RICA Co., Ltd., product name MSPTKN04), and filler #5 (manufactured by Nikko RICA Co., Ltd., product name NHRASN06) were used. Each was used instead of Filler #1, and the composition was prepared in the same manner.

以刮板將各組成物塗布於載玻片上,隨後藉由在120℃加熱3小時以使其硬化,藉此製作厚度0.2μm之膜狀硬化物。以目視確認使用填料#1之情況的硬化物之外觀之後,發現相較於其他硬化物,其表面光澤較低。Each composition was coated on a glass slide with a spatula, and then hardened by heating at 120° C. for 3 hours to produce a film-like cured product with a thickness of 0.2 μm. Visually confirming the appearance of the cured product in the case of using filler #1, it was found that the surface gloss was lower than that of other cured products.

又,以與前述「2.評定試驗」之「(4)400-800nm平均正反射率」相同的方法測量各硬化物之表面的平均正反射率。其結果,相對於使用填料#3之情況的平均正反射率為2.53%、使用填料#4之情況的平均正反射率為2.18%、使用填料#5之情況的平均正反射率為1.70%,使用填料#1之情況的平均正反射率係顯著地低至0.14%。 (3)填料摻合量評定 Also, the average regular reflectance of the surface of each cured product was measured by the same method as in "(4) 400-800nm average regular reflectance" of the aforementioned "2. Evaluation test". As a result, the average regular reflectance in the case of using filler #3 was 2.53%, the average regular reflectance in the case of using filler #4 was 2.18%, and the average regular reflectance in the case of using filler #5 was 1.70%, The average regular reflectance with Filler #1 was significantly lower at 0.14%. (3) Evaluation of filler blending amount

除了將組成物中的填料#1之比率變更成0體積%、10體積%、20體積%、30體積%、32體積%及35體積%各者之外,製備與前述「(2)填料比較評定」之情況相同之組成物。In addition to changing the ratio of filler #1 in the composition to 0% by volume, 10% by volume, 20% by volume, 30% by volume, 32% by volume and 35% by volume, the preparation was compared with the aforementioned "(2) Filler "Assessment" situation of the same composition.

使用各組成物,與前述「(2)填料比較評定」之情況相同地進行,製作膜狀之硬化物。Using each composition, it carried out similarly to the case of said "(2) Filler comparison evaluation", and produced the hardened|filmed material.

分別以與前述「2.評定試驗」之「(4)400-800nm平均正反射率」及「(6)400-800nm平均擴散反射率」的情況相同的方法測量各硬化物的表面之正反射率光譜及擴散反射率光譜。又,針對各硬化物,自正反射率光譜及擴散反射率光譜求得全光線反射率光譜。分別將正反射率光譜示於圖3,將擴散反射率光譜示於圖4,將全光線反射率光譜示於圖5。Measure the regular reflection on the surface of each cured product in the same way as the above-mentioned "(4) 400-800nm average regular reflectance" and "(6) 400-800nm average diffuse reflectance" in the aforementioned "2. Evaluation test" Ratio spectrum and diffuse reflectance spectrum. Also, for each cured product, the total light reflectance spectrum was obtained from the regular reflectance spectrum and the diffuse reflectance spectrum. The regular reflectance spectrum is shown in FIG. 3 , the diffuse reflectance spectrum is shown in FIG. 4 , and the total light reflectance spectrum is shown in FIG. 5 .

如此結果所示,填料#1之比率變得越高,正反射率變得越低,特別是填料#1之比率從20體積%變化至30體積%時正反射率會變得極端地低。又,填料#1之比率變得越高,有擴散反射率變高的傾向,特別是填料#1之比率從20體積%變化至30體積%時擴散反射率會變得極端地高,填料#1之比率變得更高。推測此乃因一旦填料#1之比率成為30體積%,於硬化物的表面填料#1之粒子會暴露出外部,故填料#1所造成之光的擴散會飛躍性地增大所致。又,全光線反射率會因填料#1之比率變得越高而變低。 (4)硬化物的表面影像 As shown in this result, the higher the ratio of filler #1 becomes, the lower the regular reflectance becomes, especially when the ratio of filler #1 changes from 20% by volume to 30% by volume, the regular reflectance becomes extremely low. Also, the higher the ratio of filler #1, the higher the diffuse reflectance tends to be. In particular, when the ratio of filler #1 is changed from 20% by volume to 30% by volume, the diffuse reflectance becomes extremely high. Filler #1 The ratio of 1 becomes higher. This is presumed to be because when the ratio of filler #1 becomes 30% by volume, the particles of filler #1 are exposed to the outside on the surface of the cured product, so the diffusion of light by filler #1 increases dramatically. Also, the total light reflectance becomes lower as the ratio of filler #1 becomes higher. (4) Surface image of hardened material

前述「(3)填料摻合量評定」之中,當組成物中的填料#1之比率為30體積%之情況下,使用示差掃描型電子顯微鏡攝影硬化物的表面而得之影像係示於圖6。據此,可確認當填料#1之比率為30體積%時,填料#1之粒子係於硬化物的表面暴露出。In the aforementioned "(3) Evaluation of filler blending amount", when the ratio of filler #1 in the composition is 30% by volume, the image obtained by photographing the surface of the hardened product using a differential scanning electron microscope is shown in Figure 6. From this, it can be confirmed that when the ratio of filler #1 is 30% by volume, the particles of filler #1 are exposed on the surface of the cured product.

1:硬化物 2:表面 3:粒子 31:殼 32:核 33:突起 1: Hardened 2: surface 3: Particles 31: shell 32: nuclear 33:Protrusion

[圖1]圖1係本揭示內容之一實施形態中反應硬化性組成物之硬化物的一例之示意性截面圖。[ Fig. 1] Fig. 1 is a schematic cross-sectional view of an example of a hardened product of a reaction-curable composition in an embodiment of the present disclosure.

[圖2]圖2係表示填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之粒子所具有的突起徑之頻率之圖表。[ Fig. 2] Fig. 2 is a graph showing the frequency of protrusion diameters of particles of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03).

[圖3]圖3係表示關於填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之濃度不同的複數種組成物之硬化物之各者的正反射率光譜之圖表。[ Fig. 3] Fig. 3 is a graph showing regular reflectance spectra for each of cured products of a plurality of compositions having different concentrations of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03).

[圖4]圖4係表示關於填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之濃度不同的複數種組成物之硬化物之各者的擴散反射率光譜之圖表。[ Fig. 4] Fig. 4 is a graph showing the diffuse reflectance spectrum of each of cured products of a plurality of compositions having different concentrations of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03).

[圖5]圖5係表示關於填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之濃度不同的複數種組成物之硬化物之各者的全光線反射率光譜之圖表。[ Fig. 5] Fig. 5 is a graph showing the total light reflectance spectrum of each of cured products of a plurality of compositions having different concentrations of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03).

[圖6]圖6係使用示差掃描型電子顯微鏡來攝影填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之濃度為30體積%的組成物之硬化物的表面而得之影像。[ Fig. 6 ] Fig. 6 is an image obtained by using a differential scanning electron microscope to photograph the surface of the cured product of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03) with a concentration of 30% by volume.

[圖7]圖7係使用示差掃描型電子顯微鏡來攝影填料#1(日興RICA股份有限公司製,品名Silcrusta MKN03)之粒子而得之影像。[ Fig. 7] Fig. 7 is an image obtained by photographing particles of filler #1 (manufactured by Nikko RICA Co., Ltd., product name Silcrusta MKN03) using a differential scanning electron microscope.

1:硬化物 1: Hardened

2:表面 2: surface

3:粒子 3: Particles

31:殼 31: shell

32:核 32: nuclear

33:突起 33:Protrusion

Claims (20)

一種反應硬化性組成物,含有反應性成分(A)及填料(B), 前述填料(B)含有抗反射填料(B1), 前述抗反射填料(B1)之平均粒徑在0.8μm以上且10μm以下,且前述抗反射填料(B1)在其粒子表面上具有複數個突起, 前述突起之平均徑在100nm以上且500nm以下。 A reaction-curable composition comprising a reactive component (A) and a filler (B), The aforementioned filler (B) contains an antireflection filler (B1), The average particle size of the aforementioned antireflective filler (B1) is not less than 0.8 μm and not more than 10 μm, and the aforementioned antireflective filler (B1) has a plurality of protrusions on the particle surface, The average diameter of the aforementioned protrusions is not less than 100 nm and not more than 500 nm. 如請求項1之反應硬化性組成物,其中前述抗反射填料(B1)在其粒子表面的10%以上之面積部分具有前述突起。The reaction hardening composition according to claim 1, wherein the anti-reflection filler (B1) has the protrusions on an area of 10% or more of the particle surface. 如請求項1或2之反應硬化性組成物,其中前述反應性成分(A)含有反應性化合物(A1),且前述反應性化合物(A1)含有環氧化合物及丙烯酸化合物中至少一者。The reaction hardening composition according to claim 1 or 2, wherein the reactive component (A) contains a reactive compound (A1), and the reactive compound (A1) contains at least one of an epoxy compound and an acrylic compound. 如請求項3之反應硬化性組成物,其中前述反應性成分(A)進一步含有會與前述反應性化合物(A1)反應之硬化劑(A2)。The reaction-curable composition according to claim 3, wherein the reactive component (A) further contains a curing agent (A2) that reacts with the reactive compound (A1). 如請求項3之反應硬化性組成物,其進一步含有起始劑(C)。The reaction-curable composition according to claim 3, which further contains an initiator (C). 如請求項1或2之反應硬化性組成物,其中前述抗反射填料(B1)之折射率滿足以下之中至少一者:在1.7以下,以及在前述反應性成分(A)之硬化物之折射率以下。The reaction hardening composition according to claim 1 or 2, wherein the refractive index of the aforementioned antireflective filler (B1) satisfies at least one of the following: below 1.7, and the refractive index of the hardened product of the aforementioned reactive component (A) below the rate. 如請求項1或2之反應硬化性組成物,其中前述抗反射填料(B1)之粒子係核殼型粒子,其具有核及包覆前述核之殼,且在前述殼的表面上具有前述突起。The reaction hardening composition according to Claim 1 or 2, wherein the particles of the aforementioned antireflective filler (B1) are core-shell particles having a core and a shell covering the core, and having the aforementioned protrusions on the surface of the aforementioned shell . 如請求項7之反應硬化性組成物,其中前述核含有丙烯酸樹脂,且前述殼及前述突起之各者含有矽酮。The reaction-curable composition according to claim 7, wherein the core contains acrylic resin, and each of the shell and the protrusion contains silicone. 如請求項1或2之反應硬化性組成物,其中前述填料(B)相對於前述反應硬化性組成物之百分比在10體積%以上。The reaction-hardening composition according to claim 1 or 2, wherein the percentage of the aforementioned filler (B) relative to the aforementioned reaction-hardening composition is 10% by volume or more. 如請求項1或2之反應硬化性組成物,其中前述抗反射填料(B1)相對於前述反應性成分(A)100質量份之量在5質量份以上且82質量份以下。The reaction curable composition according to claim 1 or 2, wherein the amount of the antireflective filler (B1) is 5 parts by mass to 82 parts by mass relative to 100 parts by mass of the reactive component (A). 如請求項1或2之反應硬化性組成物,其進一步含有著色材(D)。The reaction-curable composition according to claim 1 or 2, which further contains a coloring material (D). 如請求項11之反應硬化性組成物,其中前述著色材含有選自於由以下所構成之群組之至少一種:碳黑、鈦黑、氮化鋯及染料。The reaction hardening composition according to claim 11, wherein the coloring material contains at least one selected from the group consisting of carbon black, titanium black, zirconium nitride and dyes. 如請求項11之反應硬化性組成物,其中前述著色材(D)相對於前述反應性成分(A)100質量份之量係大於0質量份且在10質量份以下。The reaction-curable composition according to claim 11, wherein the amount of the coloring material (D) relative to 100 parts by mass of the reactive component (A) is greater than 0 parts by mass and not more than 10 parts by mass. 如請求項1或2之反應硬化性組成物,其中前述反應硬化性組成物之硬化物使用積分球於入射角8°測量的波長400nm以上且800nm以下範圍的光之平均正反射率在0.5%以下。The reaction-curable composition according to claim 1 or 2, wherein the hardened product of the above-mentioned reaction-curable composition has an average regular reflectance of 0.5% for light with a wavelength of more than 400nm and less than 800nm measured at an incident angle of 8° using an integrating sphere the following. 如請求項1或2之反應硬化性組成物,其以B型旋轉式黏度計以20rpm之條件測量之25℃下的黏度在200Pa・s以下。The reaction hardening composition according to claim 1 or 2, whose viscosity at 25°C measured with a B-type rotary viscometer at 20 rpm is below 200 Pa·s. 如請求項1或2之反應硬化性組成物,其以B型旋轉式黏度計以2rpm之條件測量之25℃下的黏度相對於以B型旋轉式黏度計以20rpm之條件測量之25℃下的黏度之比,即觸變指數,在1以上且7以下。For the reaction hardening composition of claim 1 or 2, the viscosity at 25°C measured with a B-type rotary viscometer at 2 rpm is relative to the viscosity at 25°C measured at 20 rpm with a B-type rotary viscometer The ratio of viscosity, that is, the thixotropic index, is above 1 and below 7. 如請求項1或2之反應硬化性組成物,其中前述反應硬化性組成物之硬化物之-40℃下的彈性模數在10GPa以下。The reaction-curable composition according to claim 1 or 2, wherein the elastic modulus of the hardened product of the reaction-curable composition at -40°C is 10 GPa or less. 如請求項1或2之反應硬化性組成物,其不含溶劑,或是僅含有作為溶劑不可避免混入的溶劑。The reaction-curable composition according to claim 1 or 2 does not contain a solvent, or contains only a solvent that is inevitably mixed as a solvent. 如請求項1或2之反應硬化性組成物,其係接著劑。The reaction hardening composition according to claim 1 or 2, which is an adhesive. 如請求項1或2之反應硬化性組成物,其係用於底部填充劑材製作的組成物。The reaction hardening composition according to claim 1 or 2, which is a composition used for making underfill materials.
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