JP3403467B2 - Manufacturing method of liquid crystal sealing cell - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variety of display devices in recent years.
Liquids that require high reliability and can be used in harsh environments
Novel Liquid Crystal Encapsulation Resin Composition Suitable for Crystal Display
And a method for producing a liquid crystal cell using the resin composition
Is what you do. [0002] In recent years, personal computers have recently been developed.
Centering on computers, audio equipment, measuring equipment, color TVs, etc.
As a result of the rapid progress in computerization, display methods using liquid crystals have become widespread.
It has been adopted well. This consumes very little power,
The driving force is low and sufficient sharpness and contrast
Along with other features such as compactness and light weight.
Price can be achieved, and colorization
Technology has surpassed cathode ray tube (CRT).
Which is conceivable. Because of these advantages, applications of liquid crystal displays
The field is increasingly expanding. [0003] Accordingly, today at the liquid crystal cell manufacturer
Are actively studying ways to improve productivity. Among them
Lowering the curing temperature in the liquid crystal cell manufacturing process,
The shortening of the conversion time has become a major problem. Conventionally, liquid
One-part heat-curable epoxy resin
And an ultraviolet curable resin. For example,
57-137317 and JP-A-59-157330 disclose a one-part
A heat-curable epoxy resin is described. [0004] However, at present, these materials are
The above problems have not been fully solved. That is,
For thermosetting epoxy resin, at normal temperature of 150 ° C for 60 minutes
The above curing time is required, and curing is performed at the lower limit of 130 ° C.
2 hours or more until the required performance appears
Need a long time. On the other hand, UV curable resin
In some cases, there is nothing that can be completely cured at the level of a few minutes.
Need after cure. Also, finally cured
For products, low reliability when wet, one-component heat curing
It does not reach the performance of mold epoxy resin. SUMMARY OF THE INVENTION The present inventors have made the above
As a result of intensive studies to solve the problems, one-part heat curing
Type epoxy resin encapsulant
Hydrazide compounds are also specified as curing accelerators.
Finding that selecting urea compounds is effective
Thus, the present invention has been completed. That is, the present invention relates to an epoxy resin,
Agents, curing accelerators, rubber, coupling agents, fillers and solvents
Using a liquid crystal encapsulating resin composition containing an agent as a main component for the encapsulant
Heat curing in a short time at low temperature
A method for producing a liquid crystal sealing cell, comprising:
In the resin composition, the curing agent is a carbohydrazide.
And / or adipic dihydrazide;
The agent is 3-phenyl-1,1-dimethylurea and / or
It is characterized by being lorophenyl-1,1-dimethylurea
Things. First, the resin composition of the present invention will be specifically described.
I do. The epoxy resin used in the present invention is an epoxy resin in a molecule.
A compound having two or more xyl groups. For example, (1)
Bisphenol A, Bisphenol F, Phenol
Or addition condensation of cresol and formaldehyde
Volak resin, tetrahydroxyphenylmethane and
Hydroxy compounds such as solcinol, diaminodi
Phenylmethane, aniline, xylylenediamine, etc.
Min compounds, glycerin, pentaerythritol, etc.
Polyhydric alcohol, or phthalic acid, hexahydrophthalate
Carboxyl compounds such as luic acid, epichlorohydrin,
Epihalohydrin such as pimohydrin and methyl epi
Polycondensation with methyl epihalohydrin such as chlorohydrin
A resin and a resin obtained by halogenating the polycondensation resin, (2)
Epoxidized fatty acids such as epoxidized soybean oil and their derivatives
Body, (3) epoxidized polybutadiene, epoxidized poly
Epoxidized diene polymers such as isoprene, or
(4) 3,4-epoxy-6-methylcyclohexylmethyl-3,
4-epoxy-6-methylcyclohexane carbonate,
Aliphatic (e.g., 2,3-epoxycyclopentyl) ether
Epoxy resin. These are one or two or more
May be used. Among these, those which are particularly preferable
The group of the above (1), more particularly
Is good. The average molecular weight of the epoxy resin used in the present invention
Is usually 300 to 1500, preferably 400 to 1000. This
If the average molecular weight of the
Adhesion is poor, and sufficient physical and chemical stability cannot be obtained.
And especially the heat resistance is reduced. Also this
Exceeds 1500, the adhesive surface after pre-drying has poor adhesion
The pre-dried cell base material and the cell adherend.
If they are misaligned due to external impact, vibration, etc.
Disadvantages such as reduced workability when applying the sealing material.
I do. Here, the average molecular weight is a number average molecular weight.
Yes, if two or more epoxy resins are used,
Mean number average molecular weight. The curing agent used in the present invention is carbohydrazide.
And / or adipic dihydrazide, which are
Chemical formula (1) (Chemical formula 1) _Two NNH-CO-NHNH _Two (1) and chemical formula (2) (Formula 2) _Two NNH-CO- (CH _Two ) _Four -CO-NHNH _Two (2) is represented by As the amount of the curing agent, the amount of the epoxy resin
Usually a hydrazide functional group per mole of epoxy group
0.3 to 1.5 mol, preferably 0.4 to 0.9 mol is desirable.
When the number of moles is less than 0.3 mole, the storage stability of the resin composition is reduced.
The properties are quite good, but the curing is slow and the crosslinking
Degree of adhesion, moisture resistance, electrical properties,
The effect worsens. If this exceeds 1.5 moles,
The tendency is to further improve the storage stability, but the storage stability is extremely
At the same time as the water absorption rate rises and the electrical properties worsen
In addition, the result has a bad influence on the liquid crystal. The curing accelerator used in the present invention is 3-phenyl-
1,1-dimethylurea and / or 3-p-chlorophenyl-1,1-
Dimethyl urea, each of which has the chemical formula (3)
(Formula 3) And chemical formula (4) It is represented by The amount of the curing accelerator may be an epoxy resin,
Agent, rubber and coupling agent in total 100 parts by weight
0.2-5 parts by weight are required. If this amount is less than 0.2 parts by weight
Harden extremely harden and require more heat and time than
I need it. When the amount exceeds 5 parts by weight, the curability becomes
Good, but bad for reliability such as moisture resistance and reactivity with liquid crystal
Will have an effect. The rubber used in the present invention is an epoxy resin
After the sealing material is cured, the rubber particles are dispersed in the resin layer
Is a rubber that can have a so-called sea / island structure
Any may be used. As this rubber, for example,
Kuryl ester type, silicone type, conjugated diene type, ole
Fin type, polyester type, urethane type
But especially acrylic ester, silicone, conjugated die
Polymers are preferred, and acrylic esters and silicones are more preferred.
Ricones are more preferred. These can be used alone
May also be used in combination. As a method for dispersing rubber particles, epoxy resin
Fat or dissolve in epoxy resin
Then, it may be precipitated at the time of curing. With epoxy resin
Raft copolymer, graft copolymer with epoxy resin
A method of generating rubber particles in the presence is also possible. Preferably
Is a graft copolymer with epoxy resin, epoxy resin
Of rubber particles in the presence of a graft copolymer with
A method that easily controls the particle size of rubber, such as a method, is preferable. these
Method has an interaction at the rubber / resin interface and stably separates
That's the way it's scattered. Interaction at rubber and resin interface
Otherwise, it is easy to aggregate after curing and keeps high reliability.
Hateful. Also, if the rubber is appropriately cross-linked,
Rubber particles are not easily deformed by stress
No. [0013] As the acrylic ester rubber, core
Using rubber particles obtained by drying shell type emulsion
Method, and JP-A-55-16053 or JP-A-55-2
There is something like that disclosed in No. 1432, but dispersion
The latter is preferred in terms of method and viscosity after dispersion.
New As the silicone rubber, silicone rubber
Method using microparticles, disclosed in JP-A-60-72957.
A method disclosed in Japanese Patent Application Laid-Open No. 3-170523.
A double bond in the epoxy resin
Hydrogenated silicone that can react with
To form a graft,
Method of polymerizing rubber rubber monomer, epoxy resin
Vinyl group-containing silicone that can be polymerized by introducing a heavy bond
A method of reacting a monomer to form a graft,
The silicone rubber monomer is superposed in the presence of this graft.
There is a method of matching. Examples of the conjugated diene rubber include, for example, 1,3-
Butadiene, 1,3-pentadiene, isoprene, 1,3-hex
Polymerize or copolymerize sadien, chloroprene monomers
Can be manufactured and commercial products can be used.
You. In particular, butadiene having a carboxyl group at the terminal
Copolymer with acrylonitrile, having amino group at terminal
Copolymers of butadiene and acrylonitrile
Compared to the type that dissolves in xy resin and deposits rubber when cured
Rubber particles are easy to control. However, control of particle size
Is difficult, the above two methods (acrylic ester rubber and
Insufficient performance compared to silicone rubber)
Sometimes. The average particle size of the rubber used in the present invention is
Particles having a particle size of 0.01 to 5 μm, preferably 0.01 to 2 μm
So-called “sea / island structure”
A good rubber is good. If the average particle size is out of the above range, the present invention
Cannot obtain high reliability, and there is a decrease in performance. Also rubber
The total amount of epoxy resin, curing agent and rubber used is 100
Parts by weight, usually 0.5 to 25 parts by weight, preferably 2 to 20 parts by weight
It is. If this amount is less than 0.5 parts by weight,
If the adhesive strength is not sufficient and exceeds 25 parts by weight, the sealing material
Viscosity rises and the workability such as printability of the sealing material decreases,
Adhesion after pre-drying may cause poor adhesion.
You. Even if these rubbers are used alone or in combination of two or more
Good. The coupling agent used in the present invention includes:
(1) Vinyl trichlorosilane, vinyl tris (β-me
Toxiethoxy) silane, vinyltriethoxysilane,
Vinyltrimethoxysilane, γ-methacryloxypropyl
Vinyl silane coupling such as rutrimethoxysilane
Agent, (2) β- (3,4-epoxycyclohexyl) ethyl
Trimethoxysilane, γ-glycidoxypropyl trime
Toxysilane, γ-glycidoxypropylmethyldiet
Glycidyl silane coupling agents such as xysilane,
(3) N-β- (aminoethyl) -γ-aminopropyl
Trimethoxysilane, N-β- (aminoethyl) -γ-
Aminopropylmethyldimethoxysilane, γ-aminop
Ropirtriethoxysilane, N-phenyl-γ-amino
Aminosilane cups such as propyltrimethoxysilane
Ring agent, (4) isopropyl triisostearoyl
Tanate, isopropyl tridodecyl benzene sulfoni
Lutitanate, isopropyl tris (dioctyl pyro
(Phosphate) titanate, tetraisopropylbis
(Dioctyl phosphite) titanate, tetraoctyl
Rubis (ditridecyl phosphite) titanate, tet
La (2,2-diallyloxymethyl-1-butyl) bis (dito
Lidecyl) phosphite titanate, bis (dioctyl)
Pyrophosphate) oxyacetate titanate,
Squirrel (dioctyl pyrophosphate) ethylene titane
And titanate-based coupling agents such as (5) γ-
Mercaptopropyltrimethoxysilane, γ-chlorop
Special silane-based couplers such as ropirtrimethoxysilane
Agents. These may be used alone or in combination.
May be used. Particularly preferred among these are:
When mixed with epoxy resin as in (2), at room temperature
Has good storage stability and the mixture is a one-part epoxy resin
What can be used as is good. The amount of addition of these coupling agents depends on the present invention.
It varies greatly depending on the composition of the encapsulant used for
Specifically, epoxy resin, curing agent, curing accelerator, rubber and
The total amount of the filler is preferably 0 to 5 parts by weight based on 100 parts by weight.
Basically, in the present invention, a coupling agent is used.
Although it is desirable to maintain the performance,
The higher the ratio, the better the performance without adding it
Demonstrate. If this amount exceeds 5 parts by weight,
The cohesive strength of
Invite. The filler used in the present invention includes (1) charcoal
Carbonates such as calcium acid and magnesium carbonate;
Sulfates such as aluminum and magnesium sulfate; aluminum silicate
And silicates such as zirconium silicate; iron oxide, titanium oxide
Acids such as tan, aluminum oxide (alumina), and zinc oxide
Compounds: kaolin, talc, asbestos powder, quartz powder, clouds
Mother, inorganic filler such as glass fiber, and (2) polyether
Tylene powder, polypropylene powder, polyvinyl chloride powder, poly
Styrene powder, polyvinyl acetate powder, polystyrene-vinyl acetate
Nyl copolymer powder, polymethacrylate powder, polyurethane
Powder, polyester powder, urea resin powder, phenol resin
There are organic fillers such as powder and epoxy resin powder. The amount of these fillers to be used in the present invention
Large depending on the composition of the sealing material, especially the type of filler itself
Although it varies, it is generally
Thus, 1 to 100 parts by weight is desirable. This amount is less than 1 part by weight
When full, the coating workability is poor and the applied pattern is retained.
Defects such as poor properties are likely to occur. Also, this amount is 100 weight
Exceeding the quantity part will hinder application by screen printing etc.
Tends to be messy. In addition, when mixing the filler,
To prevent screen clogging during screen printing
Kneading with three rolls, etc.
New The solvent used in the present invention has a boiling point of
Those having a temperature of 70 to 250 ° C are desirable. Specifically, n-hepta
, N-octane, n-decane, cyclohexane, ben
Zen, toluene, xylene, ethylbenzene, diethyl
Charcoal such as benzene, aminobenzene, naphthalene and pinene
Hydrogenates: carbon tetrachloride, ethylene chloride, 1,1,1-trichloro
Loethane, 1,1,1,2-tetrachloroethane, hexachloro
Ethane, trichloroethylene, tetrachloroethylene,
1,2,3-trichloropropane, butyl chloride, amyl chloride,
2-ethylhexyl chloride, ethylene bromide, tetrabromo
Ethane, chlorobenzene, 1,2,4-trichlorobenzene,
Halogenated hydrocarbons such as bromobenzene; ethanol
, 2-propanol, n-amino alcohol, fusel
Oil, n-hexanol, methylamino alcohol, 2-d
Tilbutanol, n-heptanol, n-octano
, N-decanol, cyclohexanol, benzyl
Alcohols such as alcohol and furfuryl alcohol; n
-Butyl ether, n-hexyl ether, ethyl
Nyl ether, 1,4-dioxane, trioxane, diethyl
Ethers and acetals such as luacetal;
Tyl ketone, methyl-n-butyl ketone, methyl-n-
Amyl ketone, acetonylacetone, isophorone, cyclone
Ketones such as rohexanone and acetophenone;
Pill, isobutyl formate, ethyl acetate, n-butyl acetate
Benzyl acetate, isoamyl acetate, ethyl lactate, benzoate
Esters such as methyl fragrance and diethyl oxalate;
Glycol, methyl cellosolve, methyl cellosolve
Acetate, cellosolve acetate, dibutyl cellosol
, Methyl carbitol, carbitol acetate,
Tyl carbitol, propylene glycol, hexylene
Polyhydric alcohols such as glycols and their derivatives; Dimethi
Sulfur-containing solvents such as rusulfoxide; formamide, N, N
-Nitrogen-containing solvents such as dimethylformamide and the like.
You. These solvents may be one kind or two kinds.
Any combination of the above may be used. When the boiling point of the solvent used in the present invention is less than 70 ° C.
Solvent evolves during storage of the encapsulant or during application of the encapsulant.
Occurs, increasing the viscosity of the sealing material, significantly deteriorating workability.
You. If its boiling point exceeds 250 ° C,
Takes a long time, and solvent
Danger of residue remaining and impairing the performance of the sealing material in the cell
Is preferred, and the adhesive performance may be insufficient.
I don't. The reason for adding a solvent in the present invention is that
In order to give fluidity and coatability
If it is compatible, it is not always necessary to add. Dissolution
The amount of the agent must meet these conditions,
Generally, 0 to 70 weight per 100 weight parts of epoxy resin
Parts, preferably 5 to 40 parts by weight are suitable. In the present invention, other publicly known
Use of additives does not impair the effects of the present invention
If it is within the range, it does not matter at all. They are, for example,
Thixotropic agents such as Aerosil, pigments, dyes, plasticizers,
They are ring agents, defoamers, and reactive diluents. Next, a typical production method of the present invention will be described in detail.
Will be described. The above-mentioned epoxy resin, curing agent, curing acceleration
Agent, rubber, coupling agent, filler and solvent as main components
Filler to obtain the desired gap in the encapsulant
Screen-printing or letterpress printing
Print, dispenser, etc., on the cell substrate
Suitable film thickness, usually 2-3 times the desired film thickness.
And apply preliminary drying in a drying oven or the like. And
Adhesive, adhere to the collet, press the collet,
Drying oven, hot plate, heater
-Heat-cured by means of block, infrared heater, etc.
Let The base material for cells used in the present invention includes (1) gas
An inorganic material such as a glass, (2)
Surface-treated with a surface treatment agent such as a pulling agent;
(3) Organic substances as shown below
Material: polyethylene terephthalate (PE
T), polybutylene terephthalate (PBT), Niro
(6-6Ny etc.), polyacetal (POM), polyf
Phenylene sulfide (PPS), polyetherether
Ketone (PEEK), wholly aromatic polyester (LC
P), crystalline thermoplastic resins such as thermoplastic fluororesins;
Carbonate (PC), modified polyphenylene oxide
(Modified PPO), polyarylate (PAR), polysul
Phone (PSF), polyethersulfone (PES),
Reetherimide (PEI), Polyamideimide (PA
Amorphous thermoplastic resin such as I); polytetrafluoroethylene
Len (PTFE), polyimide (PI), polyaminobi
Non-thermoplastic resins such as sumaleimide and triazine resins, and
And (4) applying the organic material to the surface of a silane coupling agent or the like.
Surface treated with treating agent; transparent electrode, alignment film, etc.
One. The present invention also relates to a cell deposition used in the present invention.
The material is the same as (1) and (2) above for the cell substrate.
Representative, having the same material and shape as the cell substrate
May be different or different
No. The preliminary drying in the present invention means that
Evaporates the contained solvent and water, and then deposits the cells
The sealing material layer adheres to the adherend when the material is covered and heated and cured.
This means that leveling is performed to fit the part.
Pre-drying conditions are usually from room temperature to 100 ° C in a stream of air.
In the range of 5 minutes to 6 hours, productivity, economy, sealing material
Considering the stability of
Good. Heat curing in the present invention, in the sealing material component
Make sure that the curing reaction between the epoxy resin and the curing agent
And the sealing material seals the cell substrate and the cell adherend.
It means to be bonded. Curing conditions include airflow
Medium, 120 ° C x 60 minutes to demonstrate sufficient sealing performance
Wear. The present invention will now be described with reference to Synthesis Examples, Examples and Comparative Examples.
The invention will be described in detail. In the following, "part" and "%"
Is based on weight. Synthesis Example 1 The following rubber components were synthesized. Bisphenol
Bisphenol made from F and epichlorohydrin
F epoxy resin (Epiclon 830S; trade name, Dainippon
Ink Co., Ltd.) 600 parts, acrylic acid 12 parts, and triethyl
Add 1 part of ruamine, raise the temperature to 110 ° C, and react for 5 hours.
Epoxy resin with acrylic acid residue introduced
613 parts were manufactured. Next, add butyl acrylate
350 parts, glycidyl methacrylate 20 parts, divinyl vinyl
1 part of senzen, 1 part of azobisdimethylvaleronitrile, and
And 2 parts of azobisisobutyronitrile at 70 ° C for 3 hours
And further polymerized at 90 ° C for 1 hour,
Thus, a graft polymer with a polyester was produced. This polymerization
The body (R-1) has a so-called sea / island structure with an average particle size of 0.05 μm.
305g / eq epoxy equivalent, rubber content 3
It is 7.9%. Synthesis Example 2 An acrylic acid residue was introduced in the same manner as in Synthesis Example 1.
613 parts of epoxy resin were manufactured. Next,
5 parts of xyethyl acrylate, 10 parts of butyl acrylate
And 1 part of azobisisobutyronitrile at 70 ° C
For 3 hours and then at 90 ° C for 1 hour.
A graft polymer with an acrylic ester was produced. Change
In addition, in the silicone having a methoxy group in the molecule,
70 parts of intercalator and 0.3 parts of dibutyltin dilaurate
For 1 hour. The last 30 minutes of the reaction
Under reduced pressure of 20 Torr to remove methanol
Was. In this way, the modified epoxy resin and silicone
Thus, a graft with the compound was prepared. In addition to this,
Mixture of thermosetting silicone rubber (weight ratio of 1: 1) 30
0 parts, and react for 2 hours with vigorous stirring.
A rubber-dispersed epoxy resin was produced. This polymer
(R-2) has a so-called sea / island structure with an average particle size of 1.5 μm.
Has an epoxy equivalent of 308 g / eq and a rubber content of 30.0
%. Examples 1 to 7 and Comparative Examples 1 to 15 Tables 1 to 7 for Examples 1 to 7 and Table 2 for Comparative Examples 1 to 8
In Comparative Examples 9 to 15, respectively, at the ratios shown in Table 3,
Henschel mixer, Dalton mixer or various raw materials
Is mixed with a ball mill and then with a ceramic three roll
Kneading until the particle size of filler and curing agent is 10 μm or less
did. 100 parts of mixture and spacer (diameter 5 μm, milled
Fiber) were mixed well at room temperature. The resulting liquid
Crystal sealing resin composition, transparent electrode and alignment film were applied
Paint a pattern on a glass substrate by screen printing.
Clothed. Next, pre-dry at 80 ° C for 20 minutes and cool to room temperature.
Was. Further, the other glass-coated substrate is attached, and a pressing jig is attached.
, And then fully cured at 120 ° C. for 60 minutes. here
Of the above patterns with an adhesion area of 10 mm x 10 mm
For the measurement of adhesive strength (surface tension adhesive strength)
Was. On the other hand, for 1 inch panel with 1 mm seal width,
A biphenyl-type liquid crystal is filled in the obtained empty panel from the liquid crystal filling port.
Enclose and fill the opening with Structbond ES-281 (trade name,
(Manufactured by Mitsui Toatsu Chemicals, Inc.) to produce a liquid crystal panel.
The electrical characteristics of the obtained liquid crystal panel were evaluated. These conclusions
The results are shown in Tables 4 and 5. The liquid crystal encapsulating resin composition and the prepared
The evaluation of the test piece was performed as follows.・ Storage stability: 100 g of the composition was placed in a polyethylene container (volume).
Volume of 100 ml) and put at 5 ° C and 20 ° C respectively.
Left for a month. During that time, measure the viscosity twice, and then
The rise rate was determined.・ Adhesive strength: Immediately after preparing a test piece and in boiling water
After immersion for 3 to 5 hours, the surface tensile adhesive strength was measured.・ Electrical characteristics: Immediately after manufacturing a liquid crystal panel and
The current between terminals after leaving for 1000 hours in an environment of 0 ° C x 95% RH
The value was measured and the rate of change was determined. [Table 1] * 1: Bisphenol F / epichlorohydrin polycondensation
Type epoxy resin number average molecular weight 400, epoxy equivalent 190g / eq * 2: Bisphenol A / epichlorohydrin polycondensation
Epoxy resin number average molecular weight 900, epoxy equivalent 450-500 g / eq * 3: ADH, adipic dihydrazide * 4: 3-PC, 3-p-chlorophenyl-1,1-dimethyl
Luurea * 5: 3-PF, 3-phenyl-1,1-dimethylurea * 6: Glycidylsilane-based coupling agent [Table 2] * 1: Bisphenol F / epichlorohydrin polycondensation
Type epoxy resin number average molecular weight 400, epoxy equivalent 190g / eq * 2: Bisphenol A / epichlorohydrin polycondensation
Epoxy resin number average molecular weight 900, epoxy equivalent 450-500 g / eq * 3: ADH, adipic dihydrazide * 4: 3-PC, 3-p-chlorophenyl-1,1-dimethyl
Luurea * 5: 3-PF, 3-phenyl-1,1-dimethylurea * 6: Glycidylsilane-based coupling agent [Table 3] * 1: Bisphenol F / epichlorohydrin polycondensation
Type epoxy resin number average molecular weight 400, epoxy equivalent 190g / eq * 2: Bisphenol A / epichlorohydrin polycondensation
Type epoxy resin number average molecular weight 900, epoxy equivalent 450-500 g / eq * 4: 3-PC, 3-p-chlorophenyl-1,1-dimethyl
Luurea * 5: 3-PF, 3-phenyl-1,1-dimethylurea * 6: Glycidylsilane coupling agent * 7: DDH, dodecanoic acid dihydrazide * 8: VDH, 1,3-bis (hydrazinocarbo Etch
) -5-Isopropylhydantoin [Table 4] [Table 5] According to the present invention, the prior art has been achieved.
Low temperature and short time heat curing conditions (for example, 120
(° C x 60 minutes) to obtain a highly reliable liquid crystal sealing cell
Can be. This is a factor in the manufacturing process of liquid crystal sealing cells.
Energy saving and cost reduction.

Continuation of the front page (56) References JP-A-6-73164 (JP, A) JP-A-61-36317 (JP, A) JP-A-59-126511 (JP, A) JP-A-57-137317 (JP, A) JP-A-60-202116 (JP, A) JP-A-61-40317 (JP, A) JP-A-61-43616 (JP, A) JP-A-1-247418 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) C08L 63/00-63/10 C08G 59/40 C08G 59/50 C08L 21/00 G02F 1/1339 505

Claims (1)

(57) Patent Claims 1. A epoxy resin, curing agent, curing accelerator, and the rubber, the coupling agent, mainly fillers and solvents, the
The curing agent is carbohydrazide and / or dihydradipic acid
The amount of the curing agent is azide,
The hydrazide functional group is usually 0.3 to
1.5 moles, and the curing accelerator is 3-phenyl-1,1-dimethyl
Luurea and / or 3-p-chlorophenyl-1,1-dimethyl urine
And the amount of the curing accelerator depends on the amount of the epoxy resin, the curing agent,
0.2 to 100 parts by weight of the
5 parts by weight, and the coupling agent is β- (3,4-E
Poxycyclohexyl) ethyltrimethoxysilane, γ
-Glycidoxypropyltrimethoxysilane, γ-gly
Glycidides such as sidoxypropylmethyldiethoxysilane
Silane coupling agent, the amount of coupling agent added
Is epoxy resin, curing agent, curing accelerator, rubber and filling
0 to 5 parts by weight (but 0% by weight)
And the rubber has an average particle size of 0.01.
So-called sea / island structure dispersed at ~ 5μm
It is a rubber that can be used, and the amount used is epoxy resin, hard
0.5 to 25 weight parts in total 100 parts by weight of the agent and rubber
Part, and the filler is 100 parts by weight of epoxy resin.
1 to 100 parts by weight with respect to parts by weight,
By using a liquid crystal sealing resin composition comprising 0 to 70 parts by weight with respect to 100 parts by weight of resin as a sealing material, the composition can be heat-cured at a low temperature and in a short time. To manufacture a sealed liquid crystal cell.