TW202306218A - Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel - Google Patents

Abstract

An apparatus for transferring electronic component is used to transfer an electronic component on a flexible carrier to a target substrate. The apparatus includes a first frame, a second frame, an abutment module, an actuator, and a negative pressure generating device. The abutment module includes an abutting element and a guide. The guide can guide the movement of the abutting element. The actuator can actuate the abutment module, so that the abutment element and the guide can move between a start position and an end position of an abutment path, respectively. The negative pressure generating device can be pumped through the abutment module. When the abutment module is pressed against the flexible carrier, a negative pressure can be generated between the abutment module and the flexible carrier by the negative pressure generating device. The abutting element and the guide move simultaneously in at least a part of the abutment path.

Description

Electronic component transfer device, electronic component transfer method, and manufacturing method of light-emitting diode panel

The invention relates to an electronic component transfer device, an electronic component transfer method, and a manufacturing method of a light-emitting diode panel.

In the manufacturing process of electronic products, there are often related electronic component transfer steps. For example, in the manufacturing process of light-emitting diode display panels (LED displays), light-emitting diodes are often placed on thin-film transistor array substrates (TFT arrays) by pick-and-place apparatus. substrate), and then the light-emitting diodes on the thin film transistor array substrate are fixed and electrically connected to the thin film transistor array substrate. However, the throughput or yield of the above method may be low.

The invention provides an electronic component transfer device and an electronic component transfer method, which can be used for transferring electronic components.

The electronic component transfer device is used to transfer the electronic components on the flexible carrier to the target substrate. The electronic component transfer device includes a first frame, a second frame, a resisting module, an actuator and a negative pressure generating device. The first frame is used for carrying the flexible carrier. The second frame is used to carry the target substrate, and makes the target substrate and the flexible carrier relatively arranged. The resisting module is disposed adjacent to the first frame. The resisting module includes resisting elements and guides. The guide part can guide the movement of the abutment element. The actuator is used for actuating the abutment module, so that the abutment element and the guide part of the abutment module can move between the start point and the end point of an abutment path respectively. The negative pressure generating device can draw air through the resisting module. When the abutting module abuts against the flexible carrier, the negative pressure generating device can generate negative pressure between the abutting module and the flexible carrier. The resisting element and the guide in the resisting module move simultaneously in at least a part of the resisting path.

The method for transferring electronic components includes the following steps: providing a flexible carrier with electronic components on one of its surfaces; providing a target substrate; making one surface of the flexible carrier with electronic components opposite to the target substrate; The first abutting surface and the second abutting surface of the surface of the flexible carrier that does not carry electronic components move, wherein the area of the first abutting surface is larger than the area of the second abutting surface; moving the first abutting surface and the second abutment surface, so that at least the second abutment surface contacts a surface of the flexible carrier that does not carry electronic components, and the electronic components are abutted to the target substrate, and between the flexible carrier and the first abutment surface A space is formed between them; a negative pressure is formed in the space; and the second abutting surface is separated from the flexible carrier.

The manufacturing method of the LED panel includes transferring the LEDs to the panel using the aforementioned method.

Based on the above, the electronic component transfer device and electronic component transfer method of the present invention can be adapted to transfer the electronic components on the flexible carrier to the target substrate.

The contents of the following examples are illustrative and not limiting. Also, descriptions of well-known devices, methods and materials may be omitted so as not to obscure the description of the various principles of the invention. Directional terms (eg, up, down, top, bottom) used herein refer only to the pictorial usage or corresponding idiom and are not intended to imply absolute orientation. In addition, unless the content clearly indicates otherwise, the singular forms "a", "an", "the" or forms not expressly expressing a quantity may include one or a plurality of forms, ie, include "at least one".

In some drawings, for the sake of clarity, some elements or film layers may be enlarged, reduced or omitted. Similar components are denoted by the same reference numerals, and have similar functions, materials, or formation methods, and descriptions thereof are omitted. It will be apparent to those skilled in the art to which this invention pertains that, from the context of the embodiments and the corresponding illustrations, the invention may be practiced in other embodiments that depart from the specific details disclosed herein.

Referring to FIG. 1 , an electronic component transfer device (may be simply referred to as a device) 100 may be adapted to transfer an electronic component 720 from a flexible carrier 710 to a target substrate 740 (details will be described later). The electronic component transfer device 100 includes a first frame 121 , a second frame 122 , a resisting module 110 (marked in FIG. 2 ), an actuator 130 (marked in FIG. 2 ), and a negative pressure generating device 140 . The first frame 121 is used for carrying the flexible carrier 710 . The second frame 122 is used to carry the target substrate 740 . The second frame 122 allows the target substrate 740 and the flexible carrier 710 to be disposed opposite to each other. The resisting module 110 is disposed adjacent to the first frame 121 . The actuator 130 can be used to actuate the abutment module 110 . The negative pressure generating device 140 can draw air through the resisting module 110 . The detailed structures of the resisting module 110 , the actuator 130 and/or the negative pressure generating device 140 and/or their corresponding actuation methods are described in detail below.

In this embodiment, the electronic component transfer apparatus 100 may further include a control system 150 . The control system 150 can be connected to the corresponding components, components or units (such as: the first frame 121, the second frame 122, the actuator 130, etc. And/or negative pressure generating device 140, but not limited to), but the present invention is not limited thereto. In one embodiment, the control system 150 may be connected to corresponding components, elements or units by means of wireless signal transmission. That is to say, the electronic component transfer device 100 including the control system 150 and the first frame 121 , the second frame 122 , the actuator 130 and/or the negative pressure generating device 140 connected thereto are the same equipment or machine. In addition, the signal connection mentioned in the present invention can generally refer to the connection mode of wired signal transmission or wireless signal transmission. In addition, the present invention does not limit all signal connection methods to be the same or different.

In this embodiment, the material of the first frame 121 may include metal, glass or plastic, but the invention is not limited thereto. In one embodiment, the first frame 121 may include corresponding fixing elements (such as clamps and/or clips; but not limited thereto), and may be suitable for directly and/or indirectly fixing the flexible carrier 710 . For example, the first frame 121 can indirectly fix the flexible carrier 710 through the carrier frame 123 . For another example, where the first frame 121 is in contact with the flexible carrier 710 , the flexible carrier 710 can be directly fixed by mutual friction or other suitable methods.

In one embodiment, the first frame 121 may include corresponding transmission elements (eg, rollers; but not limited thereto), so that the flexible carrier 710 may be transported along a proper direction. It should be noted that the aforementioned fixing element and the aforementioned transmission element may be the same component or different components. For example, the flexible carrier 710 can be sandwiched between two rollers, and in the state of not rotating the rollers, the flexible carrier 710 can be correspondingly fixed; while in the state of rotating the rollers, the flexible carrier 710 can Carrier 710 may be transferred accordingly.

In one embodiment, the first frame 121 may be fixed or erected on the movable unit. In this way, the first frame 121 can move and/or rotate in a corresponding direction according to design requirements. The movable unit can include movable modules commonly used in the design of movable mechanisms (such as: horizontal movement module, vertical movement module, rotation movement module or a combination of the above), which can contain corresponding hardware or software, or Incorporate accessories further. For example, the movable module may have a power supply device, a motor, a belt, a gear, and other related components, which are not limited in the present invention. The aforementioned related components include, for example, communication components, power components, etc., which are not limited in the present invention. The foregoing software includes, for example, spatial position calculation software, error recording software, communication software, etc., which are not limited in the present invention. The foregoing auxiliary components include, for example, moving rails, moving shafts, shock absorbing elements, positioning devices, etc., which are not limited in the present invention.

In this embodiment, the flexible carrier 710 may include UV tape or blue tape, but the invention is not limited thereto. In one embodiment, the carrier frame 123 may be called a blue film frame, but the invention is not limited thereto.

In one embodiment, the flexible carrier 710 may be a composite material. For example, the flexible carrier 710 may have a polymer film or ultra-thin glass covered with an adhesive layer.

In this embodiment, the flexible carrier 710 may have a first surface 710a and a second surface 710b opposite to the first surface 710a. The electronic component 720 may be located on the second surface 710b of the flexible carrier 710 (eg, the lower side in the drawing). The second surface 710 b of the flexible carrier 710 may be disposed opposite to the target substrate 740 .

In this embodiment, the electronic component 720 may include a die 728 and a conductive connector 729 disposed on the die 728 , but the invention is not limited thereto. The die 728 may include a light emitting die (such as a light emitting diode die; but not limited thereto) or an integrated circuit (integrated circuit; IC), but the invention is not limited thereto. In one embodiment, the conductive connecting member 729 includes solder, but the invention is not limited thereto.

In an embodiment, the material of the second frame 122 may include metal, plastic or other materials suitable for supporting or fixing the target substrate 740 .

In one embodiment, the second frame 122 may be fixed or erected on a movable unit (not directly shown). In this way, the second frame 122 can move and/or rotate in a corresponding direction according to design requirements.

In this embodiment, the target substrate 740 may include corresponding lines, wherein the lines may include corresponding pads 741 exposed to the outside. In one embodiment, the target substrate 740 may include a rigid circuit board or a flexible circuit board, but the invention is not limited thereto. In one embodiment, the target substrate 740 may be a circuit board further including active components (such as a TFT array substrate, but not limited thereto).

In one embodiment, the pads 741 may be suitable (but not limited to necessary) for solder to be disposed thereon. Therefore, the pad 741 may also be referred to as a bonding pad.

In an unillustrated embodiment, the electronic component 720 may include a die similar to the aforementioned die 728 , and the target substrate 740 may have a corresponding conductive connector similar to the aforementioned conductive connector 729 .

The method of transferring the electronic component 720 from the flexible carrier 710 to the target substrate 740 by the electronic component transfer apparatus 100 can be as follows. However, it should be noted that the present invention is not limited to the methods described later. In addition, for the sake of clarity, in the subsequent partial drawings (eg, FIG. 2 to FIG. 5 ), only schematic side cross-sectional views of some components corresponding to the region R1 in FIG. 1 are shown. In addition, for the sake of clarity, some elements or components (such as the corresponding gas pipeline 141 or the corresponding signal line 159 ) may be omitted in some subsequent drawings.

Referring to FIG. 1 , an electronic component transferring device 100 is provided. Then, the following steps are performed in any order: disposing the target substrate 740 on the second frame 122 of the electronic component transfer device 100, and disposing the flexible carrier 710 having at least one electronic component 720 disposed thereon on the first frame 121 on. Moreover, the electronic component 720 disposed on the flexible carrier 710 is arranged to face the target substrate 740 with a corresponding distance therebetween. It should be noted that, in FIG. 1 , the quantity and/or arrangement of the electronic components 720 arranged on the flexible carrier 710 are only shown as examples, and are not limited in the present invention. It should be noted that, in FIG. 1 , the manner in which the target substrate 740 is disposed on the second frame 122 of the electronic component transfer device 100 and/or the manner in which the flexible carrier 710 is disposed on the first frame 121 is only an example. It is illustratively shown and not limited in the present invention.

Referring to FIGS. 1 to 2 , the abutting module 110 of the electronic component transfer device 100 is brought close to the flexible carrier 710 in the abutting direction D1 to further abut the abutting surface 110 a of the abutting module 110 against the side of the flexible carrier 710 that does not carry the electronic component 720 (eg, the first surface 710 a ). For example, the guide member 111 and the abutting element 112 can be moved by the actuator 130 , so that at least the abutting element 112 contacts the first surface 710 a of the flexible carrier 710 . In one embodiment, the abutting element 112 and the guide member 111 may contact the first surface 710 a of the flexible carrier 710 at the same time or almost at the same time, but the invention is not limited thereto.

Referring to FIG. 2 , the resisting module 110 may include a resisting element 112 and a guide 111 . The guide 111 can guide the movement of the abutting element 112 . The actuator 130 can directly and/or indirectly actuate the abutting module 110 so that the abutting element 112 and the guide 111 can respectively move from a starting point of the abutting path.

For example, as shown in FIG. 2 , the abutment module 110 may further include a casing (or called: casing) 113 . The resisting element 112 and the guide piece 111 can be sleeved in the casing 113 . Moreover, the abutting element 112 and the guide piece 111 can move in the casing 113 . The guide 111 may be the same or similar to a cap. The abutting element 112 may be the same as or similar to a thimble. The resisting element 112 can be sleeved in the guide 111 . Moreover, the resisting element 112 can move in the guiding channel 111d of the guiding member 111 . The actuator 130 can directly and/or indirectly abut against the abutting element 112 . The actuator 130 can indirectly resist the guide 111 through the elastic mechanism 114 . The guide 111 has a first abutting surface 111a, the abutting element 112 has a second abutting surface 112a, and the abutting surface 110a of the abutting module 110 at least includes the first abutting surface 111a and the second abutting surface 112a .

FIG. 7 may be a schematic top view corresponding to FIG. 2 . Referring to FIG. 7 , viewed from a direction parallel to the abutting direction D1 , the area of the first abutting surface 111 a may be larger than the area of the second abutting surface 112 a.

Referring to FIG. 7 , the projection of the abutting surface 110 a on a projection plane (eg, a virtual plane perpendicular to the abutting direction) basically overlaps the projection of an electronic component 720 on the aforementioned projection plane. In one embodiment, within the projection range of the abutment surface 110a on the aforementioned projection surface, it basically only corresponds to a specific electronic component 720 (such as: abutment module 110 in FIGS. 1 to 5 and FIG. 7 Corresponding electronic components 721). In this way, the accuracy or accuracy of the transfer can be improved, and/or the possibility of transfer errors (such as transferring other electronic components adjacent to the electronic component 721 together) can be reduced.

In this embodiment, as shown in FIG. 7 , the outer edge of the housing 113 may be circular, but the invention is not limited thereto. In this embodiment, as shown in FIG. 7 , the inner edge of the housing 113 and the outer edge of the guide 111 may be circular, but the invention is not limited thereto. In this embodiment, as shown in FIG. 7 , the guide channel 111d of the guide member 111 and the outer edge of the resisting element 112 may be circular, but the invention is not limited thereto.

Please refer to FIG. 2 to FIG. 3 , by the abutment of the abutment module 110, at least the abutment element 112 and the guide member 111 can be moved to the end of the abutment path, so that the electronic component 721 can be abutted against the target substrate 740 .

In this embodiment, as shown in FIG. 3 , the abutting element 112 and the guiding member 111 can simultaneously contact the first surface 710 a of the flexible carrier 710 . In this way, the deflection of the electronic component 720 may be reduced; and/or, the stress-bearing area of the flexible carrier 710 and/or the electronic component 720 may be increased, and the flexible carrier 710 and/or the electronic component 720 may be reduced. possibility of injury or damage.

In one embodiment, when the abutting module 110 contacts the first surface 710a of the flexible carrier 710 to make the electronic component 721 abut the target substrate 740, the first abutting surface 111a of the guide 111 may partially contact The first surface 710 a of the flexible carrier 710 . Taking FIG. 3 as an example, a space S3 may be (but not limited to) formed between the flexible carrier 710 and the first abutting surface 111 a due to the bending of the flexible carrier 710 .

In one embodiment, after the electronic component 721 is pressed against the target substrate 740 , the electronic component 721 can be soldered and fixed on the target substrate 740 by a suitable method (eg, heating, but not limited).

Referring to FIG. 3 to FIG. 4 , negative pressure can be formed between the first surface 710 a of the flexible carrier 710 and the first abutting surface 111 a, and the guide 111 can move away from the flexible carrier 710 .

For example, in the housing 113 , there may be an air chamber S1 between the actuator 130 and the guide 111 . The guide 111 has a gas passage 111c communicating with the gas chamber S1. The housing 113 has a gas passage 113c communicating with the gas chamber S1. The negative pressure generating device 140 can pump air through the gas pipeline 141 connected to the gas channel 113c, so as to reduce the air pressure in the air chamber S1, so as to draw air through the gas channel 111c of the guide member 111. In this way, the space S4 between the first surface 710a of the flexible carrier 710 and the first abutting surface 111a can form a negative pressure (ie, the air pressure is lower than the ambient air pressure). That is to say, the air pressure of the air chamber S1 and/or the space S4 in FIG. 4 is substantially lower than the air pressure of the air chamber S1 and/or the space S3 in FIG. 3 .

In an embodiment, the elastic mechanism 114 may include passive elastic elements (such as springs or O-rings; but not limited thereto). In this way, while negative pressure is formed in the space between the first surface 710a of the flexible carrier 710 and the first abutting surface 111a by means of the aforementioned air pumping, the guide 111 can be moved due to the air pressure difference. Move in a direction away from the flexible carrier 710 .

In an embodiment, the elastic mechanism 114 may include an active elastic element (eg, an actuating element). When or after the negative pressure is formed in the space between the first surface 710a of the flexible carrier 710 and the first abutting surface 111a by means of the aforementioned air pumping, the guide 111 can be activated at an appropriate time. According to the adjustment of the elastic member of the formula, it moves in a direction away from the target substrate 740 .

When a negative pressure is formed between the first surface 710a of the flexible carrier 710 and the first abutting surface 111a, and the guide 111 moves away from the flexible carrier 710, the abutting element 112 can be activated by The actuation of the device 130 makes the second abutting surface 112 a of the abutting element 112 still abut against the first surface 710 a of the flexible carrier 710 . Moreover, the electronic component 721 can still be located on a part of the second surface 710b corresponding to the second abutting surface 112a, and another part of the second surface 710b corresponding to the first abutting surface 111a can be separated from the second surface 710b due to the air pressure difference. The electronic components 721 are separated.

In this embodiment, the partial separation between the flexible carrier 710 and the electronic component 721 by the above-mentioned method may be referred to as a first-stage separation.

Referring to FIG. 4 to FIG. 5 , after the aforementioned first-stage separation is completed, the abutting element 112 can be moved away from the target substrate 740 by actuation of the actuator 130 .

In one embodiment, when or after the resisting element 112 moves away from the target substrate 740, the flexible carrier 710 can return to its original shape as shown in FIG. 5 by virtue of its own elasticity/deflection. It is completely separated from the electronic component 721 .

In one embodiment, when or after the abutting element 112 moves away from the target substrate 740, the gap between the first surface 710a of the flexible carrier 710 and the abutting surface 110c can still be made by the above-mentioned pumping method. Negative pressure is formed between them, and can return to the original state as shown in FIG. 5 and be completely separated from the electronic component 721 .

In this embodiment, the complete separation between the flexible carrier 710 and the electronic component 721 by the above-mentioned method may be referred to as a second-stage separation.

In this embodiment, the flexible carrier 710 can be separated from the electronic component 721 more easily or completely by the above two-stage separation method (ie, the aforementioned first-stage separation and second-stage separation); and /Or when the flexible carrier 710 is separated from the electronic component 721 , the possibility of separation or deviation of the electronic component 721 from the target substrate 740 can be reduced.

5 to 6, if the electronic component 721 has been transferred to the target substrate 740 well, the first frame 121, the second frame 122, the abutting module 110 and/or the actuator 130 can be properly positioned. Direction (such as: a direction D2 perpendicular to the abutting direction D1) to move another electronic component 722 (another of the electronic components 720 that is different from a specific electronic component 721) in the same or similar manner to the foregoing ) to transfer.

In one embodiment, the resisting module 110 and/or the actuator 130 may be fixed or erected on a movable unit (not shown). In this way, the resisting module 110 and/or the actuator 130 can be based on the design requirements, and by the movable modules in the movable mechanism (such as: horizontal movement module, vertical movement module, rotation movement module) or a combination of the above) to move and/or rotate in the corresponding direction (such as: as shown in FIG. 6 , but not limited thereto).

The method for transferring electronic components in the above embodiments can be applied to any suitable manufacturing process of electronic devices. For example, the electronic component 720 may include an LED wafer, and the above transfer method may be a part of the manufacturing process of the LED panel.

In summary, the electronic component transfer device and the electronic component transfer method of the present invention can be adapted to transfer the electronic components on the flexible carrier to the target substrate.

100: Electronic component transfer device 110: Resisting module 110a: abutting surface 111: guide piece 111a: first abutment surface 111c: gas channel 111d: Guide channel 112: Resisting element 112a: the second abutment surface 113: Shell 113c: gas channel 114: elastic mechanism 121: First frame 122: Second frame 123: carrier frame 130: Actuator 140: Negative pressure generating device 141: Gas pipeline 150: Control system 159: Signal line 710: flexible carrier 710a: first surface 710b: second surface 720, 721, 722: electronic components 728: grain 729: Conductive connector 740: target substrate 741: Pad D1: Arriving direction D2: A direction perpendicular to the abutment direction D1 R1: Region S1: air chamber S3, S4: space

FIG. 1 is a schematic side view of a partial operation of an electronic component transfer device according to an embodiment of the present invention. 2 to 5 are partial side cross-sectional schematic diagrams of a partial actuation mode of an electronic component transfer device according to an embodiment of the present invention. FIG. 6 is a schematic partial side view of a partial operating mode of an electronic component transfer device according to an embodiment of the present invention. FIG. 7 is a partial top view of an electronic component transfer device according to an embodiment of the present invention.

100: Electronic component transfer device

110: Resisting module

110a: abutting surface

121: First frame

122: Second frame

123: carrier frame

130: Actuator

140: Negative pressure generating device

141: Gas pipeline

150: Control system

159: Signal line

710: flexible carrier

710a: first surface

710b: second surface

720, 721: Electronic components

728: grain

729: Conductive connector

740: target substrate

741: Pad

D1: Arriving direction

R1: Region

Claims (7)

An electronic component transfer device is used to transfer an electronic component on a flexible carrier to a target substrate, and the electronic component transfer device includes: a first frame for carrying the flexible carrier; a second frame, used to carry the target substrate, and make the target substrate and the flexible carrier relatively arranged; a resisting module, arranged adjacent to the first frame, which includes a resisting element and a guide, wherein the guide can guide the movement of the resisting element; an actuator, which is used to actuate the abutment module, so that the abutment element and the guide of the abutment module can move between the beginning and the end of an abutment path, respectively; and A negative pressure generating device, which can pump air through the resisting module, and when the resisting module resists the flexible carrier, a negative pressure can be generated between the resisting module and the flexible carrier pressure; Wherein, the resisting element and the guide member in the resisting module move simultaneously in at least a part of the resisting path. The electronic component transfer device as claimed in claim 1, wherein the resisting component and the guide move simultaneously from the starting point of the resisting path to the end point of the resisting path. The electronic component transfer device as claimed in claim 1, wherein the guide member leaves the end of the resisting path earlier than the resisting component. A method for transferring electronic components, comprising: providing a flexible carrier carrying an electronic component on one of its surfaces; providing a target substrate; disposing one surface of the flexible carrier carrying electronic components opposite to the target substrate; Provide a first abutting surface and a second abutting surface that can move respectively to the surface of the flexible carrier that does not carry electronic components, wherein the area of the first abutting surface is larger than that of the second abutting surface area; moving the first abutting surface and the second abutting surface so that at least the second abutting surface contacts a surface of the flexible carrier not carrying an electronic component, abutting the electronic component to the target substrate, and forming a space between the flexible carrier and the first abutting surface; creating a negative pressure in the space; and The second abutment surface is separated from the flexible carrier. The electronic component transfer method as described in claim 4, wherein the first abutting surface and the second abutting surface contact the flexible carrier at the same time, the electronic component is abutted to the target substrate, and then the second abutting surface An abutment surface leaves the flexible carrier first. The method for transferring electronic components as claimed in claim 4, wherein the second abutting surface leaves the flexible carrier while forming a negative pressure. A method for manufacturing a light-emitting diode panel, which includes using the method described in any one of Claims 4 to 6 to transfer light-emitting diodes to the panel.

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