TW202306009A - Loading device and method for prefabricated wafer carry tray can respectively stack and assemble the wafer ring, the wafer and the cover, precisely move and secure them in different positions on the carry tray - Google Patents

Abstract

A loading device and a method for a prefabricated wafer carry tray are configured to have a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism and a robotic arm on the periphery of a first displacement mechanism. The first displacement mechanism has a first seat. There are a plurality of assembled-member carrying parts arranged on a carry tray, and a plurality of clamps arranged on the periphery of each assembled-member carrying part. A moving end of the robotic arm is disposed with an image capturing component and a loading-unloading mechanism. The wafer ring loading mechanism is configured to place a wafer ring on the first seat, the wafer loading mechanism is configured to place a wafer in the wafer ring, and the cover loading mechanism is configured to stack a cover on the wafer to form an assembled member. A robotic-arm correctable loading and unloading mechanism is configured to be correctly correspondent to the pending assembled-member carrying part on the carry tray. The loading-unloading mechanism releases each clamp, moves the assembled member from the first seat onto the pending assembled-member carrying part, and then locks each clamp to secure the assembled member on the carry tray.

Description

Mounting device and method for precured wafer carrier

The present invention relates to a loading device and method for a precured wafer carrier, in particular to a wafer ring, a wafer, and a cover that can be stacked and combined with a simple mechanism and operation, and can be accurately displaced and fixed on a carrier. Mounting device and method for different positions on a disc.

The general integrated circuit (integrated circuit, IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging. Yellow light, crystal growth, etching, mechanical grinding and other complicated procedures can complete the production of integrated circuits. In the above-mentioned manufacturing process, wafers are tested, cleaned, evaporated, dried or soaked in organic In solvent and other processes, in order to effectively fix the wafers for processing, and to process a large number of wafers at the same time to improve processing efficiency, most wafers are fixed on a large-area carrier, and the carrier is simultaneously carried Each wafer performs the processing operations of the above-mentioned processes.

The basic structure of a common carrier plate is a large-area convex (or concave) arc-shaped disc structure. There are multiple hollow parts on the carrier plate that can accommodate wafers, and on the sides of each hollow part There are multiple fixtures that can fix the wafer. When each wafer is fixed above the hollow part by the fixture (the convex surface of the convex arc surface or the concave surface of the concave arc surface), each wafer can pass through the hollow The part to be processed is exposed outside, so multiple wafers can be accommodated and moved to different processing programs at the same time by using the carrier plate, so as to effectively increase the efficiency of the overall processing of wafers.

With the gradual popularization of automated mechanical processing, it is an inevitable trend to use various automatic machines to perform pick-and-place operations of wafers on the tray, which can not only save a lot of manpower, but also reduce production costs and improve processing efficiency. The circle itself is extremely fragile and has extremely high requirements for processing precision. Therefore, not only does it have extremely high requirements for the operation accuracy of the relevant displacement mechanism when picking and placing the wafer, but also when using multiple displacement mechanisms to perform wafer processing separately. When combining or stacking related components, there must be a precise connection between the displacement mechanisms, otherwise, it is very easy to affect the combination accuracy of the overall displacement and the quality of the finished product, and even cause damage to the semi-finished product; therefore, how to Effectively calibrate each displacement mechanism, so that it not only maintains excellent accuracy when a single displacement mechanism performs different object displacement actions, but also forms an excellent relative activity correlation between different displacement mechanisms to ensure that each displacement mechanism The operation link accuracy of the placement mechanism in the displacement of the same object is a major issue that all related businesses need to work on urgently.

In view of the above-mentioned application requirements of the conventional displacement mechanism that transfers the wafer to the carrier, the inventor researched an improvement method for these requirements, and finally produced the present invention.

The main purpose of the present invention is to provide a loading device and method for a pre-cured wafer carrier, which is equipped with a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism, and a surrounding side of a first displacement mechanism. mechanism and a second displacement mechanism, and a mechanical arm is provided between the first displacement mechanism and the second displacement mechanism; the first displacement mechanism has a first seat that can move backwards, and a In the wafer pretreatment part, a movable carrier plate is provided on the second displacement mechanism, and a plurality of assembly bearing parts are arranged on the carrier plate, and a plurality of clamps are arranged on the periphery of each assembly carrier part, and the movable end of the mechanical arm is An image capture unit and a loading and unloading mechanism are provided; the wafer ring loading mechanism can place a wafer ring in the wafer pretreatment section, and a wafer is placed on the wafer ring by the wafer loading mechanism Inside, a cover is placed in the wafer ring by the cover loading mechanism and stacked on the wafer to form an assembly, so that the peripheral side of the wafer is firmly clamped on the wafer ring and the cover Between the periphery of the wafer, so that the wafer can maintain a good flatness in the assembly, the mechanical arm can drive the loading and unloading mechanism, and the image capture component to correct the loading and unloading operation surface and the image pickup surface respectively, so that the loading and unloading mechanism can be positive And accurately corresponding to the assembly bearing part to be assembled at a position to be assembled on the tray, the loading and unloading mechanism can unlock each clamp first, and then move the assembly from the first seat to the assembly to be assembled Then the loading and unloading mechanism locks the clamps to fix the assembly on the loading portion of the assembly to be assembled, and the tray rotates to move the loading portion of the other assembly to the position to be assembled. The above structure with simple structure and low cost, combined with a rationally planned and smooth operation process, can effectively reduce the construction cost of equipment and improve the efficiency of assembly.

Another object of the present invention is to provide a loading device and method for a pre-cured wafer carrier, which is provided with a plurality of distance measuring elements on the periphery of the loading and unloading mechanism. After the angle is close to the bearing part of the assembly to be assembled, the position of the loading and unloading mechanism can be adjusted so that the distances measured by the distance measuring elements on the sides of the bearing part of the assembly to be assembled are equal, so as to correct the loading and unloading operation of the loading and unloading mechanism The inclination angle of the surface enables the loading and unloading mechanism to be parallel (with the same inclination angle) corresponding to the assembly bearing part to be assembled; and the image capture component can be close to the The assembly bearing part to be assembled is directly captured, and then the position of the image capturing component is adjusted so that its positive direction corresponds to the bearing part of the assembly component to be assembled, so as to correct the position of the image capturing surface of the image capturing component, and at the same time The position of the loading and unloading mechanism is corrected by using the information of the corrected position of the image-taking surface, so that the loading and unloading operation plane can be positively and accurately correspond to the assembly bearing part and its peripheral components to be assembled.

Another object of the present invention is to provide a pre-cured wafer carrier loading device and its method. The top surface of the first base is provided with a backlight surface and a relative displacement jacket on the side of the wafer pre-cured part. Sliding seats, concave arcs are respectively provided on the side of each jacket sliding seat facing the wafer pretreatment part, and an imaging unit is provided on the side of the first displacement mechanism, when the imaging unit is moved to the wafer The wafer image on the top of the ring can be combined with the jacket slides to make the concave arcs form a hole with a backlight effect, so that the wafer can be easily guided to correspond to the wafer ring, which is beneficial to the follow-up The operation of placing the wafer into the wafer ring accurately.

In order to achieve the above-mentioned purpose and effect, the technical means adopted by the present invention include: a pre-cured wafer carrier loading device, including: a first displacement mechanism, connected and driven by a control module, the first The displacement mechanism has a first seat body capable of reciprocating movement, on which a wafer pretreatment part is arranged; a wafer ring loading mechanism arranged on the side of the first displacement mechanism is connected and received Driven by the control module, the wafer ring loading mechanism has a wafer ring feeding seat for supporting the wafer ring, and a wafer ring displacement component is arranged beside the wafer ring feeding seat. The ring displacement component can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer ring between the wafer ring feeding base and the wafer pretreatment part of the first base activities between them; a wafer loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module, and the wafer loading mechanism has a wafer feeding seat for supporting wafers A wafer displacement assembly is provided beside the wafer feeding seat, the wafer displacement assembly has a wafer bracket, and the wafer bracket can be driven by the wafer displacement assembly to carry the wafer The wafer moves between the wafer feeding seat and the wafer pretreatment part of the first seat; a cover loading mechanism arranged on the side of the first displacement mechanism is connected and driven by the control In the module, the cover loading mechanism has a cover material supply seat for supporting the cover, and a cover displacement component is arranged beside the cover supply seat, and the cover displacement component can carry and release the cover, and the cover displacement component can carry and release the cover. Covering the movement between the feeding seat and the wafer pre-processing part of the first seat body; a carrier plate with at least one assembly carrying part on the surface, and a plurality of clamps are respectively provided on the periphery of each assembly carrying part; A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end capable of moving between the first seat and the carrier, and a loading and unloading mechanism is arranged on the movable end.

According to the above structure, the movable end of the mechanical arm is provided with an image capture unit capable of obtaining images; the loading and unloading mechanism is respectively provided with a clamping unit that can be opened and closed relatively to clamp the assembly, and a plurality of corresponding and unlocking components. The clamp operation component of the clamp and a plurality of distance-measuring components that can measure the distance.

According to the above structure, the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams, and are respectively arranged at at least three points around the loading and unloading mechanism.

According to the above structure, a second displacement mechanism connected and driven by the control module is provided beside the first displacement mechanism, and the second displacement mechanism has a second seat body that can move backwards. The body is provided with a pivoting assembly capable of bearing the tray.

According to the above structure, wherein the wafer pretreatment part is a hollow hole, a support seat is provided in the hollow hole, a groove is recessed on the top surface of the support seat, and on both sides of the groove A plurality of suction holes capable of sucking air are provided; a support base lifting assembly is provided at the bottom of the support base, and the support base lifting assembly can drive the support base to perform lifting movements.

According to the above structure, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat body is provided with a plurality of jacket slide seats that can move relatively reciprocally on the periphery of the wafer pre-processing part, The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and an image capture that can grab an image is provided above the side of the first guide rail unit.

According to the above structure, an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole capable of ejecting air downward, and a plurality of air suction holes capable of sucking air are provided on the top surface of the wafer carrier.

According to the above structure, a wafer ring lifting assembly is arranged below the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer ring feeding seat to lift and lower, and the wafer ring displacement assembly has A liftable wafer ring displacement slide seat, a wafer ring displacement guide rail capable of moving forward is provided on the wafer ring displacement slide seat, and a wafer ring displacement guide rail capable of clamping is provided on the wafer ring displacement guide rail The clamping component of the wafer ring; a wafer lifting component is arranged under the wafer feeding base, and the wafer lifting component can drive the wafer feeding base to lift. The wafer displacement component has a plurality of Wafer displacement guide rails parallel to the first guide rails, and a wafer displacement slide seat that is arranged on each of the wafer displacement guide rails and can move back and forth, and a vertically movable slide seat is provided on the wafer displacement slide seat. The telescopic assembly for lifting and lowering, the wafer bracket is set at the movable end of the telescopic assembly; a cover lifting assembly is provided under the cover feeding base, and the cover lifting assembly can drive the cover feeding base to lift and lower. The cover displacement assembly has a cover displacement slide seat that can be raised and lowered, and a cover displacement guide rail that can move horizontally and backwards is provided on the cover displacement slide seat, and a cover displacement guide rail that can hold the cover is provided on the cover displacement guide rail Gripper set.

According to the above structure, wherein the outer peripheral ring of the wafer ring is provided with an outer ring flange, the inner peripheral ring of the wafer ring is provided with an inner ring flange; the cover center is provided with a ring protrusion; the wafer feeding seat Wafer cassettes capable of accommodating wafers at intervals are provided on the top.

The technical means adopted by the present invention also include: a loading method using the aforementioned loading device, including: a program of "positioning the carrier plate, the wafer ring, the wafer, and the cover respectively", which is to place an empty carrier The tray is set at the preset assembly position, and each wafer ring, wafer, and cover are respectively placed at the preset feeding position; a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism "Procedure, a wafer ring is displaced from the feeding position by the wafer ring loading mechanism and supported in the wafer pre-processing part of the first seat; a "wafer loading mechanism places a The wafer is placed in the wafer ring" procedure, which is to move a wafer to the first displacement mechanism by the wafer loading mechanism for alignment, and then place the wafer in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks Placed on the wafer, so that the wafer ring, wafer, and cover are stacked to form an assembly; a "loading and unloading mechanism corrects the loading and unloading work surface" program, which is driven by the control module. The loading and unloading mechanism on the robotic arm Adjust the position so that the distances measured by each distance-measuring element on the side of the mounting part of the assembly to be assembled at a position to be assembled on the tray are equal in length, and the loading and unloading mechanism can be positively and parallel to a preset loading and unloading work surface The loading part of the assembly to be assembled is used to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism, and the information of the corrected loading and unloading operation surface is stored by the control module; The image of the periphery of the loading part of the assembly, and the correction of the image-taking surface" program is that the control module drives the image capture component on the robotic arm, and inspects the object to be assembled according to the inclination angle and direction of the corrected loading and unloading work surface. The image of the periphery of the assembly bearing part and each fixture, and adjust the image capture component to a preset image capture surface that corresponds to the position of the assembly load bearing part and each clamp to be assembled, so as to correct the image capture component The position of the image-taking surface, and the information of the corrected image-taking surface is stored by the control module, and at the same time, the control module uses the information of the corrected image-taking surface to further correct the relative position of the loading and unloading operation surface, so that the loading and unloading operation The surface can accurately correspond to the position of the loading part of the assembly to be assembled and the positions of the fixtures; a procedure of "displacing and locking the assembly on the loading part of the assembly to be assembled by the loading and unloading mechanism" is controlled by the The module drives the loading and unloading mechanism on the mechanical arm to displace the assembly from the first seat and lock it on the bearing part of the assembly to be assembled.

According to the above method, the program of "loading and unloading mechanism correcting the loading and unloading operation surface" includes: a "mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the loading part of the assembly to be assembled The step of "distance from the edge" is that the control module drives the loading and unloading mechanism on the robotic arm to move to the top of the carrier in the direction and angle of the preset loading and unloading reference value; The distance between the sides of the bearing part of the assembly; a step of "controlling the module to adjust the position of the loading and unloading mechanism so that the measurement distances of each distance measuring element are equal in length, so as to correct the inclination angle of the loading and unloading work surface" is performed by the control module Drive the loading and unloading mechanism on the mechanical arm to adjust the position, so that the distances detected by each distance measuring element to the side of the bearing part of the assembly to be assembled are equal in length, so as to ensure that the loading and unloading work surface of the loading and unloading mechanism is positive and parallel Corresponding to the loading part of the assembly to be assembled, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; and the control module stores the information of the corrected loading and unloading operation surface; The image of the periphery of the loading part of the assembly, and the correction of the image surface" program has: a "mechanical arm drives the image capture component to approach the carrier plate at the same inclination angle as the corrected loading and unloading work surface, and obtain the assembly to be assembled The position image of the carrying part and each fixture" step is that the control module drives the image capture component on the robotic arm to move to the assembly to be assembled in the same direction and inclination angle as the corrected loading and unloading work surface. Above the part, use the image capture component to obtain the image around the component bearing part to be assembled, so as to confirm the position of the component load bearing part to be assembled and each fixture; a "control module adjusts the position of the image capture component to make it Correctly correspond to the bearing part of the assembly to be assembled, so as to correct the position of its image-taking surface, and use the information of the corrected image-taking surface to correct the loading and unloading operation surface, so that it is positively and accurately corresponding to the bearing of the assembly to be assembled "Part" step, the control module drives the image capture component on the mechanical arm to adjust its position, so that the image capture component is kept correctly corresponding to the assembly bearing part and each fixture to be assembled, so as to correct the image capture component The position of the image-taking surface; and the control module stores the information of the calibrated image-taking surface, and can calculate the corrected position information of the loading and unloading mechanism, so that the loading and unloading mechanism can be driven by the mechanical arm to move to the correct position in the positive direction. And flushly correspond to the position of the bearing part of the assembly to be assembled.

According to the above method, the procedure of "moving and locking the assembly by the loading and unloading mechanism on the bearing part of the assembly to be assembled" includes: a step of "unlocking each clamp by the loading and unloading mechanism", which is first driven by the control module The loading and unloading mechanism on the mechanical arm moves to the top of the loading part of the assembly to be assembled, and uses each clamp to operate the components to loosen each clamp; a "loading and unloading mechanism moves the assembly to the loading part of the assembly to be assembled" The step is to drive the loading and unloading mechanism on the mechanical arm by the control module to move above the wafer pretreatment part of the first seat, use the clamping component to clamp the assembly, and then move the assembly to the On the bearing part of the assembly to be assembled; a step of "locking the clamps of the loading and unloading mechanism to fix the assembly" is to use the clamps to operate the components to lock the clamps so that the assembly can be fixed on the assembly to be assembled on the part carrier.

According to the above method, the step of "the loading and unloading mechanism locks the clamps to fix the assembly" is followed by a step of "the loading and unloading mechanism disengages the assembly and the tray rotates", which is to release the assembly after each clamping assembly Afterwards, the control module drives the pivoting assembly to drive the tray to pivot, so that the assembly carrying portion that has fixed the assembly pivots to move to a side position, and the assembly carrying portion that is vacant on the other side moves To the original to-be-assembled position to form another to-be-assembled assembly bearing part.

According to the above method, wherein the procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" includes: a "moving the wafer by the wafer loading mechanism on the first displacement mechanism, and straighten the wafer" step is to move the wafer above the wafer pre-processing part of the first seat by the wafer carrier, and use the imaging unit to obtain the image of the wafer, so as to view the Whether the position of the wafer is correct or not, cooperate with the two jacket slides with backlight surfaces to be close to each other, so that the two concave arcs are combined into a round hole corresponding to the wafer pre-processing part, and then the control module passes through the The wafer displacement component drives the wafer bracket to correct the position, so that the wafer can be guided to a position corresponding to the center of the wafer ring; a "first displacement mechanism moves the wafer to the wafer ring The "inner" step is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer bracket is separated from the wafer in the groove; then the wafer is displaced The component drives the wafer bracket to move out of the first seat; the support base lifting component drives the support base down, so that the wafer moves down in the wafer ring.

According to the above method, wherein the procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" includes: a "wafer loading mechanism carries a wafer, and guides the wafer during the displacement process." Wafer" step, is that the control module drives the wafer shifting assembly to drive the wafer bracket to support a wafer from the wafer feeding seat, and the wafer is close to the air nozzle, and the air injection head is used to The jet hole of the head sprays air on the wafer, which can guide the wafer and keep it stably in the correct position on the wafer carrier; a "wafer loading mechanism" moves the wafer to the On the first displacement mechanism, and guide the wafer" step is to move the wafer above the wafer pre-processing part of the first seat by the wafer carrier, and use the imaging unit to obtain the wafer The image of the wafer is used to check whether the position of the wafer is correct, and the two jacket slides with backlight surfaces are close to each other, so that the two concave arcs are combined into a round hole corresponding to the wafer pretreatment part, and then the The control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to a position corresponding to the center of the wafer ring; a "first displacement mechanism moves the wafer Into the wafer ring" step is to separate the two jacket slides, and then drive the support base up by the support base lifting assembly, so that the wafer bracket is separated from the wafer in the groove; and then The wafer shifting component drives the wafer bracket to move out of the first seat; the supporting base lifting component drives the supporting base down, so that the wafer moves down in the wafer ring.

In order to obtain a more specific understanding of the above-mentioned purpose, effect and characteristics of the present invention, the following drawings are hereby described as follows:

Please refer to Figures 1 to 3, it can be seen that the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring loading mechanism 2, a wafer loading mechanism 3, a cover loading mechanism 4, and a second displacement mechanism 5 and mechanical arm 6 etc. parts; wherein the first displacement mechanism 1 is connected and driven by a control module (which can be a computer with computing function, not shown), the first displacement mechanism 1 has a plurality of parallel extending The first guide rails 11, and a first base body 12 that is arranged on each of the first guide rails 11 and can move back and forth, and a wafer pretreatment part 121 (which can be a hollow hole) is provided on the first base body 12 , a support seat 13 is provided in the wafer pre-treatment section 121, and the support seat 13 is driven by a support seat lifting assembly 133 to perform lifting actions. The groove track 131 is provided with a plurality of suction holes 132 capable of sucking air on both sides of the groove track 131 .

In a feasible embodiment, the top surface of the first base body 12 is provided with a plurality of jacket slides 15 on the peripheral side of the wafer pretreatment part 121, and the top side of each jacket slide 15 has a backlight. surface, and a concave arc portion 151 is provided on one side of each jacket slide seat 15 facing the wafer pre-treatment portion 121; and an image capturing unit 16 capable of capturing images is provided above the first guide rail 11.

The wafer ring loading mechanism 2 is arranged on one side of the first guide rail 11, and is connected to and driven by the control module (not shown). The wafer ring feeding seat 21 of the wafer ring 2a, and a wafer ring lifting assembly 22 supported under the wafer ring feeding seat 21, the wafer ring lifting assembly 22 can drive the wafer ring The feeding seat 21 moves up and down, and a wafer ring displacement assembly 23 is provided beside the wafer ring supply seat 21. The wafer ring displacement assembly 23 has a wafer ring displacement slide seat that can be raised and lowered. 232, on the wafer ring displacement slide 232, a wafer ring displacement guide rail 231 that can move laterally back and forth is provided, and a set of clamping components 233 that can be opened and closed relatively is provided on the wafer ring displacement guide rail 231 .

In a feasible embodiment, an outer ring flange 21a is provided on the upper ring of the outer periphery of the wafer ring 2a, and an inner ring flange 22a is provided on the lower ring of the inner peripheral edge of the wafer ring 2a.

The wafer loading mechanism 3 is arranged on one side of the first guide rail 11, is connected and driven by the control module (not shown), the wafer loading mechanism 3 has a plurality of wafers 3a for supporting The wafer feeding base 31, and a wafer lifting assembly 32 supported under the wafer feeding base 31, the wafer lifting assembly 32 can drive the wafer feeding base 31 to move up and down. Wafer feeding seat 31 top is provided with an air spray head 35, and this air spray head 35 has the air spray hole 351 that can spray air downward; The circle displacement assembly 33 has a plurality of wafer displacement guide rails 331 parallel to the first guide rail 11, and a wafer displacement slide 332 that is arranged on each of the wafer displacement guide rails 331 and can move back and forth. A telescopic assembly 333 that can be vertically lifted is provided on the wafer displacement slide 332, and a wafer bracket 34 is provided at the movable end of the telescopic assembly 333, and a plurality of suckable air is provided on the top surface of the wafer bracket 34. The exhaust hole 341.

In a feasible embodiment, the outer diameter of the wafer 3a is slightly smaller than the inner diameter of the wafer ring 2a, and a preset fixed number of wafers 3a can be stored in a wafer cassette 30a at intervals in advance, and then the The wafer cassette 30a is placed on the wafer feeding base 31 for easy displacement of each wafer 3a.

The cover loading mechanism 4 is arranged on one side of the first guide rail 11, is connected and driven by the control module (not shown), the cover loading mechanism 4 has a cover 4a that can support multiple stacks The cover feed seat 41, and a cover lifting assembly 42 supported under the cover feed seat 41, the cover lift assembly 42 can drive the cover feed seat 41 to move up and down, and the cover feed seat 41 A cover displacement assembly 43 is provided on the side, and the cover displacement assembly 43 has a cover displacement slide seat 432 that can be lifted and lowered, and a cover displacement guide rail 431 that can move horizontally and backwards is provided on the cover displacement slide seat 432. A set of jaw sets 433 that can be opened and closed relatively is provided on the covering displacement guide rail 431 .

In a feasible embodiment, the cover 4a is a sheet with an outer diameter close to the outer diameter of the wafer 3a, and a ring protrusion that can be clamped by the jaw set 433 is provided in the center of the cover 4a 41a.

The second displacement mechanism 5 is arranged laterally beside one end of the first guide rail 11, connected and driven by the control module (not shown), the second displacement mechanism 5 has a plurality of second guide rails 51 extending in parallel , and a second base body 52 that is arranged on each of the second guide rails 51 and can move back and forth. A pivot assembly 53 is provided on the second base body 52, and a load can be placed on the pivot assembly 53. Plate 50.

In a feasible embodiment, the carrier plate 50 is a disc-shaped structure with a convex arc surface, and a plurality of assembly bearing parts 501 (which can be a hollow part) are arranged on the surface of the carrier plate 50. A plurality of clamps 502 are respectively provided on the peripheral side of the part carrying part 501 (hollow part).

The mechanical arm 6 is arranged between the first displacement mechanism 1 and the second displacement mechanism 5, is connected and driven by the control module (not shown), and an image capturing component is arranged at the movable end of the mechanical arm 6 61 and a loading and unloading mechanism 62; the image capture component 61 has an image capturing component 611 that can capture images, the loading and unloading mechanism 62 has two clamping components 622 that can be opened and closed relatively, and a plurality of clamp operating components 623 corresponding to each clamp 502 And a plurality of distance-measuring elements 621, the plurality of distance-measuring elements 621 can be respectively arranged at least three points around the loading and unloading mechanism 62, and can generate laser light sources for distance-measuring laser beams 6211.

Please refer to Figure 4, it can be seen that the operation method of the present invention includes: a P1 program of "positioning the carrier plate, wafer ring, wafer, and cover respectively", and a "wafer ring setting mechanism to place a wafer ring Transfer to the first displacement mechanism" P2 procedure, a "wafer placement mechanism to place a wafer in the wafer ring" P3 procedure, a "cover placement mechanism to place a cover on the wafer On the wafer in the ring, a P4 program of an assembly is formed, a P5 program of "loading and unloading mechanism corrects the loading and unloading operation surface", and an "image capture component inspects the image of the periphery of the assembly bearing part to be assembled on the carrier plate, and corrects the image taken Image plane" P6 program, a "loading and unloading mechanism to displace and lock the assembly on the bearing part of the assembly to be assembled" P7 program; wherein:

The P1 procedure of "positioning the carrier plate, wafer ring, wafer, and cover separately" is to set an empty carrier plate 50 at the preset assembly position, and place each wafer ring 2a, wafer 3a, and cover 4a They are respectively placed in the preset feeding position; it has in sequence: "the tray is moved to the operation position on the second displacement mechanism" step S11, "the wafer cassette containing the wafer is placed on the wafer placement mechanism; the wafer The ring and the cover are respectively placed on the wafer ring loading mechanism and the cover loading mechanism” step S12, and the “wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism” step S13.

The "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" P2 program is that the control module drives the wafer ring loading mechanism 2 to move a wafer ring 2a from the feeding Positioning, displacement and support in the wafer pretreatment part 121 of the first seat 12; it has: "the wafer ring loading mechanism displaces and positions a wafer ring in the first displacement mechanism" step S21 .

The "wafer placement mechanism moves a wafer into the wafer ring" P3 procedure is that the control module drives the wafer placement mechanism 3 to move a wafer 3a to the first displacement mechanism 1 Then, the wafer 3a is placed in the wafer ring 2a; it has the sequence of: "the wafer loading mechanism carries a wafer, and guides the wafer during the displacement process" S31 step , "The wafer placement mechanism moves the wafer on the first displacement mechanism, and guides the wafer" S32 step, "The first displacement mechanism moves the wafer into the wafer ring" S33 step.

The P4 procedure of "the cover placement mechanism stacks a cover on the wafer in the wafer ring to form an assembly" is that the control module drives the cover placement mechanism 4 to move a cover 4a to the The wafer ring 2a is stacked on the wafer 3a, so that the wafer ring 2a, the wafer 3a, and the cover 4a are stacked to form an assembly 20a, and the peripheral side of the wafer 3a is clamped firmly. It is held between the periphery of the wafer ring 2a and the cover 4a so that the wafer 3a can maintain a good flatness in the assembly 20a; it has: "a cover placement mechanism transfers a cover to the wafer ring, and stacked on the wafer to form an assembly" S41 step.

The "Loading and Unloading Mechanism Corrects the Loading and Unloading Operation Surface" P5 program is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust its position, so that each distance measuring element 621 measures the position of a position to be assembled on the carrier plate 50. The distances between the sides of the assembly carrying part 501 to be assembled are equal, so that the loading and unloading mechanism 62 can be paralleled (with the same inclination angle) and positively correspond to the assembly carrying part 501 to be assembled, so as to correct the loading and unloading operation of the loading and unloading mechanism 62 The inclination angle of the surface, and the information of the corrected loading and unloading operation surface is stored by the control module; it has in sequence: "The mechanical arm drives the loading and unloading mechanism to approach the loading plate with the preset loading and unloading reference value, and uses the distance measuring element to measure and The distance between the edge of the loading part of the assembly to be assembled" step S51, "the control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each distance measuring element are equal, so as to correct the inclination angle of the loading and unloading work surface" S52 step.

The P6 program of "the image capture unit checks the image of the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface" is driven by the control module to drive the image capture unit 61 on the mechanical arm 6 after the aforementioned calibration The inclination angle and direction of the loading and unloading work surface Check the image of the periphery of the assembly carrying part 501 and each clamp 502 to be assembled, and adjust the position of the image capture component 61 to correctly correspond to the assembly carrying part 501 and its clamps 502 , so as to correct the position of the image capturing surface of the image capturing component 61, and store the information of the corrected image capturing surface by the control module, and at the same time, the control module uses the information of the corrected image capturing surface to further correct the loading and unloading operation The relative position of the surface makes the loading and unloading work surface accurately correspond to the position of the assembly bearing part 501 and its clamp 502 to be assembled; it has in sequence: "the mechanical arm drives the image capture assembly to be the same as the corrected loading and unloading The inclination angle of the work surface is close to the carrier plate, and the image of the position of the assembly bearing part and each fixture to be assembled is obtained." Step S61, "The control module adjusts the position of the image capture component so that it correctly corresponds to the assembly load to be assembled part, so as to correct the position of the image-taking surface, and use the information of the corrected image-taking surface to correct the loading and unloading operation surface, so that it is positively and accurately corresponding to the assembly carrying part to be assembled" Step S62.

The "loading and unloading mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled" P7 procedure is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to displace the assembly 20a And locked on the assembly carrying part 501 to be assembled; it has in sequence: "the loading and unloading mechanism unlocks each clamp" S71 step, "the loading and unloading mechanism moves the assembly to the assembly carrying part to be assembled" Step S72, "the loading and unloading mechanism locks the clamps so as to fix the assembly" step S73, "the loading and unloading mechanism disengages the assembly, and the tray rotates" S74 step.

The following is to cooperate with Figures 5 to 33 to illustrate the above steps respectively and form a practical and feasible application example:

Firstly, in the step S11 of "moving the tray to the working position on the second displacement mechanism", the second displacement mechanism 5 is driven by the control module, so that the second seat body 52 is moved to each second guide rail 51 away from the One end of the first displacement mechanism 1, so that an empty tray 50 is placed on the second base 52 (as shown in Figure 5); The second guide rail 51 moves to a preset working position close to the first displacement mechanism 1 (as shown in FIG. 6 ).

The step S12 of "place the wafer cassette containing the wafer on the wafer loading mechanism; place the wafer ring and the cover on the wafer ring loading mechanism and the cover loading mechanism respectively" is to stack the plurality of wafer rings 2a Placed on the wafer ring feeding seat 21 of the wafer ring loading mechanism 2 (that is, the feeding position of the wafer ring 2a), and a plurality of wafer cassettes 30a containing wafers 3a arranged at intervals are placed on the wafer ring On the wafer feeding seat 31 of the wafer loading mechanism 3 (that is, the feeding position of the wafer 3a), and a plurality of coverings 4a are stacked on the covering feeding seat 41 of the covering loading mechanism 4 (that is, the covering 4a Then the first base body 12 can be moved to the position where each first guide rail 11 is close to the side of the wafer ring loading mechanism 2 (as shown in FIG. 5 ).

The "wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism" step S13, which is to make the wafer feeding seat 31 turn the opening of each wafer cassette 30a to face the first displacement mechanism as required. One side of a displacement mechanism 1 (as shown in Figure 6).

In step S21 of the "wafer ring loading mechanism displacing and positioning a wafer ring in the first displacement mechanism", the control module drives the wafer ring loading mechanism 2 to displace the wafer ring The clamping assembly 233 of the assembly 23 clamps a wafer ring 2a on the wafer ring feeding seat 21, and moves up and down with the wafer ring displacement slide seat 232 and slides laterally with the wafer ring displacement guide rail 231. The wafer ring 2a is moved into the wafer pretreatment part 121 of the first seat 12 (as shown in Figures 7, 8, and 9); then, the clamping component 233 is separated from the wafer ring 2a, so that the The wafer ring 2a can use the outer ring flange 21a to lean against the edge of the wafer pre-processing part 121 (as shown in FIG. 10 ) to form a position.

In actual application, the wafer ring lifting component 22 can cooperate to drive the wafer ring feeding seat 21 to lift up and down, so that the wafer ring displacement component 23 can more easily clamp the wafer ring 2a at a proper position.

In the step S31 of "carrying a wafer by the wafer loading mechanism and leveling the wafer during the displacement process", the control module drives the wafer loading mechanism 3 to make the wafer displacement assembly 33 The wafer displacement slide 332 moves, and the telescopic component 333 is extended, so that the wafer bracket 34 can extend into a wafer cassette 30a to support a wafer 3a (as shown in Figure 11), and then The wafer 3a moves out of the wafer cassette 30a (as shown in Figure 12) and approaches the air spray head 35, and uses the air spray hole 351 of the air spray head 35 to spray air on the wafer 3a (as shown in Figures 13 and 14). ), the wafer 3a can be leveled, and then the exhaust holes 341 are pumped, so that the wafer 3a can be stably positioned at the correct position on the wafer carrier 34 and avoid warping.

In actual application, the wafer lifting assembly 32 can cooperate to drive the wafer feeding base 31 to lift, so that the wafer bracket 34 can more easily support the wafer 3 a in the wafer cassette 30 a at a proper position.

The "wafer loading mechanism moves the wafer on the first displacement mechanism, and guides the wafer" step S32, which is to drive the wafer loading mechanism 3 by the control module to make the wafer The displacement component 33 drives the wafer carrier 34 to move the wafer 3a to the top of the wafer pretreatment part 121 of the first seat 12 (as shown in FIG. 15 ), and the image pickup unit 16 is used to obtain the wafer The image of the circle 3a can be used to check whether the position of the wafer 3a is correct. In addition, the two jacket slides 15 with backlight surfaces can be combined to make the two concave arcs 151 combine to form a pair corresponding to the pre-treatment of the wafer. 121 of the round hole (as shown in Figure 16), and then the wafer displacement assembly 33 drives the wafer holder 34 to correct the position, so that the wafer 3a is guided and positioned correctly on the slide of the two jackets. The center of the concave arc portion 151 of the seat 15 (that is, the center of the wafer ring 2a).

The step S33 of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides 15, and then the support base 13 is driven up by the support base lifting assembly 133, and at the same time Each suction hole 132 pumps air so that the wafer 3a can be adsorbed on the support seat 13. At this time, each suction hole 341 of the wafer carrier 34 stops pumping air, and the wafer carrier 34 is in the concave position. The groove 131 is separated from the bottom surface of the wafer 3a (as shown in FIG. 17); then the telescopic assembly 333 shrinks, so that the wafer carrier 34 moves out of the top of the first seat 12 (as shown in FIG. 18); Then, the support base lifting assembly 133 drives the support base 13 down, so that the wafer 3a moves down on the inner ring flange 22a of the inner periphery of the wafer ring 2a (as shown in Figure 19), and the wafer 3a The wafer 3 a is held in a state of being sucked by the holder 13 .

In the step S41 of "moving a cover in the wafer ring by the cover loading mechanism, and stacking it on the wafer to form an assembly", the first seat 12 can be moved along the first guide rail as required. 11 Move to a position close to the side of the cover loading mechanism 4 (as shown in Figure 20); and then drive the cover loading mechanism 4 by the control module, so that the jaw set 433 of the cover displacement component 43 clamps Hold the ring convex part 41a of a cover 4a on the cover material supply seat 41 (as shown in Figures 21 and 22), and move up and down with the cover displacement slide seat 432 and slide laterally on the cover displacement guide rail 431, the cover can be 4a is moved into the wafer pretreatment part 121 and superimposed on the wafer 3a (as shown in Figures 23 and 24); then, the jaw set 433 releases the ring protrusion 41a (as shown in Figure 25 shown), so that the stacked wafer ring 2a, wafer 3a, and cover 4a form an assembly 20a (as shown in Figure 26).

In actual application, the cover lifting component 42 can cooperate to drive the cover feeding base 41 to lift, so that the cover displacement component 43 can more easily clamp the cover 4a at a proper position.

In the step S51 of "the mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the mounting part of the assembly to be assembled", the control module drives the mechanical arm 6 The upper loading and unloading mechanism 62 moves to a position to be assembled on the carrier plate 50 with the direction and angle of the preset loading and unloading reference value; 501 side distance (as shown in Figure 27).

In a feasible embodiment, the distance-measuring element 621 is a laser light source, which can be respectively projected on the peripheral side of the assembly bearing part 501 to be assembled through the laser beam 6211, so as to detect the distance.

The "control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each distance measuring element are equal in length, so as to correct the inclination angle of the loading and unloading operation surface" S52 step is detected by the control module according to each distance measuring element 621 The difference in the measured distance (that is, the projected length of the laser beam 6211) drives the loading and unloading mechanism 62 on the mechanical arm 6 to adjust its position, so that each distance measuring element 621 (laser light source) detects the circumference of the assembly bearing part 501 to be assembled. The side distance (laser beam 6211) is equal in length, so as to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism 62, and ensure that the surface of the bottom side of the loading and unloading mechanism 62 (ie, the loading and unloading operation surface) is parallel to the to-be-assembled The assembly carrying part 501; and the control module can store the information of the corrected loading and unloading operation surface.

The step S61 of "the manipulator drives the image capturing component to approach the tray at the same inclination angle as the calibrated loading and unloading work surface, and obtains the position images of the loading part and each fixture of the assembly to be assembled" is controlled by the control module Drive the image capturing component 61 on the mechanical arm 6 to move to the top of the component bearing part 501 to be assembled at the same inclination angle and direction as the corrected loading and unloading work surface, and use the image capturing component 611 to obtain the component to be assembled The image of the periphery of the component carrying portion 501 (as shown in FIG. 28 ) is used to confirm the positions of the component carrying portion 501 and each jig 502 to be assembled.

The "control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and uses the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that It is positively and accurately corresponding to the assembly carrying part to be assembled. In step S62, the control module obtains the image position difference of the assembly carrying part 501 to be assembled according to the above, and drives the image on the mechanical arm 6. Grabbing component 61 to adjust the position, so as to correct the image capturing surface of the image capturing component 61, and ensure that the image capturing component 61 correctly corresponds to the assembly carrying part 501 and each fixture 502 to be assembled; and the control module can store the The information of the captured image surface after correction (as shown in Figure 28).

In a feasible embodiment, each fixture 502 is provided with a positioning mark (not shown, it can be a cross scale or other marked structure) at a predetermined position on the periphery of each fixture 502, and the image capturing component of the image capturing component 61 A corresponding relative mark can be set on the lens of 611 (not shown, it can be a cross scale or other marked structure); when the image capturing component 61 adjusts its position, the relative mark coincides with the positioning mark, that is The effect of correcting the position of the image capturing surface of the image capturing component 61 can be achieved.

Since the image capture unit 61 captures images at the same inclination angle and direction as the corrected loading and unloading surface, after correcting the position of the image capturing surface, the control module can use the corrected position of the image capturing surface Calculate and store the position information that needs to be corrected again by the loading and unloading mechanism 62, so that the control module can directly and quickly drive the loading and unloading mechanism 62 to move to the positive direction and accurately correspond to the assembly to be assembled again through the mechanical arm 6 The position of the bearing part 501.

In the step S71 of "unlocking the clamps by the loading and unloading mechanism", the control module first drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to the top of the loading part 501 of the assembly to be assembled, and uses the clamp operating components 623 to loosen each clamp. Fixture 502 (as shown in Figure 29).

The step S72 of "moving the assembly by the loading and unloading mechanism to the loading part of the assembly to be assembled" is that the control module drives the loading and unloading mechanism 62 on the mechanical arm 6 to move to the crystal of the first base 12. Above the round pretreatment part 121, use the clamping component 622 to clamp the assembly 20a (at this time, each suction hole 132 stops suction, and the support seat 13 releases the state of adsorption to the wafer 3a, as shown in Figure 30 shown), and then move the assembly 20a to the above-mentioned assembly bearing part 501 to be assembled (as shown in Figures 31 and 32).

In the step S73 of "locking the clamps of the loading and unloading mechanism to fix the assembly", the control module drives the clamp operating components 623 to lock the clamps 502, so that the assembly 20a can be fixed on the assembly to be assembled on the part carrying part 501 (as shown in Fig. 32).

The "loading and unloading mechanism disengages the assembly, and the tray rotates" step S74, after each clamping assembly 622 releases the assembly 20a, the control module drives the pivoting assembly 53 to drive the tray 50 to pivot, The assembly carrying portion 501 that has fixed the assembly 20a is pivotally moved to a side position, and the empty assembly carrying portion 501 on the other side is moved to the original position to be assembled to form another assembly carrying portion 501 to be assembled ( As shown in FIG. 33 ), in order to repeat the above steps, each assembly 20a is respectively fixed on each assembly bearing portion 501 to be assembled of the tray 50 .

Based on the above, the pre-cured wafer carrier mounting device and method of the present invention can indeed achieve the use of simple mechanisms and operations to separately assemble the wafer ring, wafer, and cover, and accurately shift and fix them on a carrier The effects of different positions above are actually a novel and progressive invention, and I have filed an application for an invention patent in accordance with the law; but the content of the above description is only a description of the preferred embodiment of the present invention. Changes, modifications, changes or equivalent replacements extended by the scope should also fall within the scope of the patent application of the present invention.

1: The first displacement mechanism

11: The first rail

12: The first body

121:Wafer pretreatment department

13: Support seat

131: Groove channel

132: suction hole

133: Support seat lift assembly

15: Jacket sliding seat

151: Concave arc

16: Image acquisition unit

2: Wafer ring loading mechanism

21: Wafer ring feeding seat

22:Wafer Ring Lifting Assembly

23: Wafer Ring Displacement Assembly

231: Wafer ring displacement guide rail

232: Wafer ring displacement slide seat

233: clamping components

2a: wafer ring

20a: Assemblies

21a: Outer ring flange

22a: Inner ring flange

3: Wafer loading mechanism

31:Wafer feeding seat

32:Wafer Lifting Assembly

33:Wafer displacement assembly

331: Wafer displacement guide rail

332: Wafer displacement slider

333: telescopic components

34:Wafer carrier

341: Air extraction hole

35: jet head

351: fumarole

3a: Wafer

30a: Wafer Cassette

4: Cover the loading mechanism

41: Covering the feeding seat

42: Cover lift assembly

43: Cover displacement components

431: cover displacement guide

432: cover displacement slide

433: Gripper set

4a: Covering

41a: ring convex part

5: The second displacement mechanism

51: Second guide rail

52:Second body

53:Pivot assembly

50: carrier disk

501: Assembly bearing part

502: fixture

6: Mechanical arm

61:Image capture component

611: image acquisition component

62: Loading and unloading mechanism

621: Ranging element

6211: laser beam

622: clamping components

623: Fixture operation components

A: The image capture component and loading and unloading mechanism in Figure 1

P1: The tray, wafer ring, wafer, and cover are placed in position

P2: The wafer ring placement mechanism moves a wafer ring into the first displacement mechanism

P3: The wafer placement mechanism moves a wafer into the wafer ring

P4: The cover placement mechanism stacks a cover on the wafer in the wafer ring to form an assembly

P5: The loading and unloading mechanism corrects the loading and unloading work surface

P6: The image capture component checks the image around the carrier part of the assembly to be assembled on the carrier plate, and corrects the image capture surface

P7: The loading and unloading mechanism displaces and locks the assembly on the bearing portion of the assembly to be assembled

S11: The tray moves to the working position on the second displacement mechanism

S12: The wafer cassette containing the wafers is placed on the wafer loading mechanism; the wafer ring and cover are respectively placed on the wafer ring loading mechanism and the cover loading mechanism

S13: The wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism

S21: The wafer ring placement mechanism displaces and positions a wafer ring in the first displacement mechanism

S31: The wafer placement mechanism carries a wafer, and guides the wafer during the displacement process

S32: the wafer loading mechanism moves the wafer on the first displacement mechanism, and guides the wafer

S33: the first displacement mechanism moves the wafer into the wafer ring

S41: the cover placement mechanism moves a cover into the wafer ring, and stacks it on the wafer to form an assembly

S51: The mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the assembly to be assembled.

S52: The control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each ranging element are equal in length, so as to correct the inclination angle of the loading and unloading operation surface

S61: The robotic arm drives the image capture component to approach the carrier at the same inclination angle as the calibrated loading and unloading work surface, and obtains the position images of the loading part and each fixture of the assembly to be assembled.

S62: The control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and use the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that It is positive and exactly corresponds to the carrier part of the assembly to be assembled

S71: The loading and unloading mechanism unlocks each fixture

S72: The loading and unloading mechanism displaces the assembly on the bearing part of the assembly to be assembled

S73: The loading and unloading mechanism locks each fixture to fix the assembly

S74: The loading and unloading mechanism breaks away from the assembly, and the tray rotates

Figure 1 is a three-dimensional exploded view of the overall structure and related components of the present invention.

Figure 2 is a schematic diagram of the partial structure of the present invention; it reveals the structure of the first seat body and related supporting seats and other parts.

Figure 3 is a partial enlarged view of part A in Figure 1; it reveals the structure of the image capture component and the loading and unloading mechanism assembled on the robotic arm.

Fig. 4 is the operation flowchart of the present invention.

Fig. 5 is a schematic diagram of the state where the wafer ring, wafer and cover are respectively placed at the feeding position according to the present invention.

Fig. 6 is an action diagram of the wafer loading mechanism of the present invention driving each wafer cassette to pivot toward the direction of the first displacement mechanism.

Figure 7 is the action diagram (1) of the wafer ring displacement assembly of the present invention for displacing the wafer ring.

Figure 8 is the action diagram (2) of the wafer ring displacement component of the present invention for displacing the wafer ring.

Figure 9 is the action diagram (3) of the wafer ring displacement component of the present invention for displacing the wafer ring.

Fig. 10 is the movement diagram (4) of the wafer ring displacement assembly of the present invention for displacing the wafer ring.

Fig. 11 is an operation diagram (1) of the wafer shifting unit of the present invention for shifting wafers.

Fig. 12 is the movement diagram (2) of the wafer displacement unit of the present invention for displacing wafers.

Fig. 13 is an action diagram of the present invention using air injection from the air injection head to guide the wafer flat on the wafer carrier.

Fig. 14 is the movement diagram (3) of the wafer displacement unit of the present invention for displacing wafers.

Fig. 15 is an operation diagram (4) of the wafer displacement unit of the present invention for displacing wafers.

Fig. 16 is an action diagram of the present invention using the imaging unit to inspect the wafer on the first seat, and guiding the wafer position through the two jacket slides.

Fig. 17 is an action diagram of the raising of the support seat of the present invention to support the wafer.

Figure 18 is an action diagram of moving out the wafer carrier of the present invention.

Fig. 19 is an action diagram of lowering the supporting seat of the present invention to place the wafer in the wafer ring.

Fig. 20 is an action diagram of the displacement of the first seat body of the present invention to the side position of the cover loading mechanism.

Fig. 21 is an action diagram (1) of the covering displacement assembly of the present invention for displacing and covering.

Fig. 22 is the action diagram (2) of the cover displacement assembly of the present invention for displacement and cover.

Fig. 23 is the action diagram (3) of the cover displacement assembly of the present invention for displacement and cover.

Fig. 24 is the action diagram (4) of the cover displacement assembly of the present invention for displacement and cover.

Fig. 25 is an action diagram of the jaw group of the cover displacement assembly of the present invention detaching from the cover.

Fig. 26 is a schematic diagram of the present invention when the cover displacement component has completed cover placement and the mechanical arm has not yet moved.

Fig. 27 is an action diagram of the loading and unloading mechanism of the present invention using the distance-measuring element to align with the loading part of the assembly to be assembled on the carrier plate, thereby calibrating the inclination angle of the loading and unloading work surface.

Fig. 28 is an action diagram of the present invention using the image capturing component to obtain the image of the loading part of the assembly to be assembled, and thereby correct the position of the image capturing surface.

Figure 29 is an action diagram of the present invention using the loading and unloading mechanism to unlock the clamps around the bearing part of the assembly to be assembled.

Fig. 30 is the action diagram (1) of the present invention using the loading and unloading mechanism to move the wafer ring from the first seat to the loading part of the assembly to be assembled.

Fig. 31 is the action diagram (2) of the present invention using the loading and unloading mechanism to move the wafer ring from the first seat to the loading part of the assembly to be assembled.

Figure 32 is an action diagram of the present invention using the loading and unloading mechanism to lock and lock the clamps around the bearing part of the assembly to be assembled.

Fig. 33 is an action diagram of the pivoting action of the loading and unloading mechanism of the present invention after the loading and unloading mechanism is detached from the loading tray.

1: The first displacement mechanism

11: The first rail

12: The first body

15: Jacket sliding seat

16: Image acquisition unit

2: Wafer ring loading mechanism

21: Wafer ring feeding seat

22:Wafer Ring Lifting Assembly

23: Wafer Ring Displacement Assembly

231: Wafer ring displacement guide rail

232: Wafer ring displacement slide seat

2a: wafer ring

21a: Outer ring flange

22a: Inner ring flange

3: Wafer loading mechanism

31:Wafer feeding seat

32:Wafer Lifting Assembly

33:Wafer displacement assembly

34:Wafer carrier

341: Air extraction hole

3a: Wafer

30a: Wafer Cassette

4: Cover the loading mechanism

41: Covering the feeding seat

42: Cover lift assembly

43: Cover displacement components

4a: Covering

41a: ring convex part

5: The second displacement mechanism

51: Second guide rail

52:Second body

53: Pivot assembly

50: carrier disk

501: Assembly bearing part

502: fixture

6: Mechanical arm

61:Image capture component

611: image acquisition component

62: Loading and unloading mechanism

A: The image capture component and loading and unloading mechanism in Figure 1

Claims (23)

A loading device for a pre-cured wafer carrier, comprising: A first displacement mechanism, which is connected and driven by a control module, the first displacement mechanism has a first base body capable of reciprocating movement, and a wafer pretreatment part is arranged on the first base body; A wafer ring loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The wafer ring loading mechanism has a wafer ring feeding seat for supporting the wafer ring , a wafer ring displacement component is provided beside the wafer ring feeding seat, the wafer ring displacement component can carry and release the wafer ring, and the wafer ring displacement component can carry the wafer The ring moves between the wafer ring feeding seat and the wafer pretreatment part of the first seat; A wafer loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The wafer loading mechanism has a wafer feeding seat for supporting the wafer. A wafer displacement assembly is arranged on the side of the round feeding seat, and the wafer displacement assembly has a wafer bracket, and the wafer bracket can be driven by the wafer displacement assembly to carry the wafer on the Movement between the wafer feeding seat and the wafer pre-processing part of the first seat; A cover loading mechanism arranged on the side of the first displacement mechanism is connected to and driven by the control module. The cover loading mechanism has a cover supply seat for supporting the cover, and is next to the cover supply seat. A cover displacement component is provided on the side, and the cover displacement component can carry and release the cover, and move between the cover feeding seat and the wafer pretreatment part of the first base; A carrier plate, with at least one assembly bearing part on the surface, and a plurality of clamps are respectively arranged on the periphery of each assembly bearing part; A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end capable of moving between the first seat and the carrier, and at least one loading and unloading mechanism is provided on the movable end. The loading device of the pre-cured wafer carrier as described in claim 1, wherein the movable end of the mechanical arm is provided with an image capture component capable of obtaining images; A clamping component holding the assembly, a plurality of clamp operating components corresponding to and unlocking each clamp, and a plurality of distance-measuring components capable of measuring distances. The precured wafer carrier loading device as described in Claim 2, wherein the plurality of distance-measuring elements are laser light sources capable of generating distance-measuring laser beams, and are respectively arranged at least three points on the periphery of the loading and unloading mechanism . The loading device of the pre-cured wafer carrier as described in claim 2, wherein a second displacement mechanism connected and driven by the control module is provided beside the first displacement mechanism, and the second displacement mechanism has a movable The second base body that moves back and forth is provided with a pivoting assembly capable of bearing the tray on the second base body. The loading device of the pre-cured wafer carrier as described in claim 1, wherein the wafer pre-treatment part is a hollow hole, and a support seat is arranged in the hollow hole, and the top surface of the support seat is concave There is a groove channel, and a plurality of suction holes capable of sucking air are provided on the second side of the groove channel; a support base lifting component is provided at the bottom of the support base, and the support base lifting component can drive the support The seat moves up and down. The loading device of the pre-treatment type wafer carrier as described in claim 2, wherein the wafer pre-treatment part is a hollow hole, and a support seat is arranged in the hollow hole, and the top surface of the support seat is concave There is a groove channel, and a plurality of suction holes capable of sucking air are provided on the second side of the groove channel; a support base lifting component is provided at the bottom of the support base, and the support base lifting component can drive the support The seat moves up and down. The loading device of the pre-cured wafer carrier as described in claim 1, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. The loading device of the pre-cured wafer carrier as described in claim 2, wherein the first base system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first base is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. The loading device of the pre-cured wafer carrier as described in claim 6, wherein the first seat system is arranged on a plurality of first guide rails extending in parallel, and the top surface of the first seat is around the wafer pre-treatment part There are a plurality of jacket slides on the side that can move relative to each other. The top side of each jacket slide has a backlight surface, and a concave arc is provided on the side of each jacket slide facing the wafer pre-processing part; and on the side of the jacket slide An imaging unit capable of capturing images is arranged above the side of the first guide rail. The loading device of the pre-cured wafer carrier as described in claim 7, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downward, and the top of the wafer carrier The surface is equipped with a plurality of suction holes that can suck air. The loading device of the pre-cured wafer carrier as described in claim 8, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downwards, and the top of the wafer carrier The surface is equipped with a plurality of suction holes that can suck air. The loading device of the pre-cured wafer carrier as described in claim 9, wherein an air spray head is arranged above the wafer feeding seat, and the air spray head has an air spray hole that can spray air downward, and the top of the wafer bracket The surface is equipped with a plurality of suction holes that can suck air. The loading device of the pre-cured wafer carrier as described in claim 1, 2 or 3, wherein a wafer ring lifting assembly is provided under the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer The ring feeding seat performs lifting action. The wafer ring displacement assembly has a wafer ring displacement slide seat that can be raised and lowered. A wafer ring that can move forward is arranged on the wafer ring displacement slide seat. Displacing the guide rail, a clamping assembly capable of clamping the wafer ring is provided on the wafer ring displacement guide rail; a wafer lifting assembly is provided below the wafer feeding seat, and the wafer lifting assembly can drive the wafer ring. The wafer feeding seat moves up and down. The wafer displacement assembly has a plurality of wafer displacement guide rails parallel to the first guide rail, and a wafer that is arranged on each wafer displacement guide rail and can move back and forth. The displacement slide seat is provided with a telescopic assembly that can be vertically lifted on the wafer displacement slide seat, and the wafer bracket is arranged at the movable end of the telescopic assembly; a cover lift assembly is provided under the cover feed seat, The cover lifting assembly can drive the cover feeding seat to lift. The cover displacement assembly has a cover displacement sliding seat that can be lifted and lowered. Set the guide rail, on the cover displacement guide rail, a jaw group capable of clamping the cover is provided. The loading device of the precured wafer carrier as described in claim 1, 2 or 3, wherein the outer peripheral ring of the wafer ring is provided with an outer ring flange, and the inner peripheral ring of the wafer ring is provided with an inner ring A flange; a ring protrusion is provided in the center of the cover; a wafer cassette capable of accommodating wafers at intervals is provided on the wafer feeding seat. A loading method using the loading device described in claim 1 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. A loading method using the loading device described in claim 4 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism calibration loading and unloading work surface" program is that the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position, so that each distance measuring element measures the loading of the assembly to be assembled at a position to be assembled on the carrier The distance between the sides of the loading and unloading mechanism is equal, and the loading and unloading mechanism can have a preset loading and unloading work surface facing forward and parallel to the loading part of the assembly to be assembled, so as to correct the inclination angle of the loading and unloading work surface of the loading and unloading mechanism, and by the The control module stores the information of the corrected loading and unloading operation surface; A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. A loading method using the loading device described in claim 9 above, comprising: 1. The procedure of "positioning trays, wafer rings, wafers, and covers respectively" is to set an empty tray at the preset assembly position, and place each wafer ring, wafer, and covers respectively at the preset supply positioning; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism correction loading and unloading work surface" program, the control module drives the loading and unloading mechanism on the mechanical arm to adjust the position, so that each distance measuring element measures the assembly to be assembled at a to-be-assembled position on the carrier The distance between the sides of the loading and unloading mechanism is equal, so that a preset loading and unloading operation surface of the loading and unloading mechanism is positive and parallel to the loading and unloading section of the assembly to be assembled, so as to correct the loading and unloading operation surface of the loading and unloading mechanism, and the control module The group stores the information of the corrected loading and unloading operation surface; A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism to move and lock the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. A loading method using the loading device described in claim 12 above, comprising: 1. The procedure of "positioning the tray, wafer ring, wafer, and cover separately" is to set an empty carrier tray at the preset assembly position, and place each wafer ring, wafer, and cover separately on the feeding position; A procedure of "moving a wafer ring into the first displacement mechanism by the wafer ring loading mechanism", is that the wafer ring loading mechanism displaces a wafer ring from the feeding position and supports it on the In the wafer preparation department of the first seat; A procedure of "moving a wafer into the wafer ring by the wafer loading mechanism" is that the wafer loading mechanism moves a wafer to the first displacement mechanism for alignment, and then the wafer is The circle is placed in the wafer ring; A procedure of "stacking a cover on the wafer in the wafer ring by the cover placement mechanism to form an assembly" is that the cover placement mechanism transfers a cover to the wafer ring and stacks placed on the wafer so that the wafer ring, wafer, and cover are stacked to form an assembly; A "loading and unloading mechanism calibration loading and unloading work surface" program is that the control module drives the mechanical arm to adjust the position of the loading and unloading mechanism, so that each distance measuring element measures the assembly to be assembled at a position to be assembled on the carrier The distance between the sides of the loading part is equal, so that the loading and unloading mechanism can be positively and parallel to the loading part of the assembly to be assembled, so as to correct the loading and unloading working surface of the loading and unloading mechanism, and store the loading and unloading working surface by the control module the information of A procedure of "the image capture component inspects the image around the periphery of the assembly bearing part to be assembled on the tray, and corrects the image capture surface", is that the control module drives the image capture component on the mechanical arm, and loads and disassembles it according to the aforementioned calibration The inclination angle and direction of the working surface inspect the images of the periphery of the component bearing part to be assembled and the images of each fixture, and adjust the image capture component to correctly correspond to the component bearing part and the preset image capturing surface The position of each fixture is used to correct the position of the image capturing surface of the image capture component, and the information of the corrected image capturing surface is stored by the control module, and the control module uses the information of the corrected image capturing surface to further correct The relative position of the loading and unloading operation surface enables the loading and unloading operation surface to accurately correspond to the position of the loading part of the assembly to be assembled and the positions of each fixture; A "loading and unloading mechanism displaces and locks the assembly on the bearing part of the assembly to be assembled" procedure, the control module drives the loading and unloading mechanism on the mechanical arm to move the assembly from the first seat Place and lock on the bearing part of the assembly to be assembled. The loading method of the precured wafer carrier as described in claim 16, wherein the "loading and unloading mechanism corrects the loading and unloading operation surface" program has: A step of "the mechanical arm drives the loading and unloading mechanism to approach the carrier plate with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance from the edge of the assembly to be assembled", which is driven by the control module. The loading and unloading mechanism moves to the top of the loading tray in the direction and angle of the preset loading and unloading reference value; and uses each distance measuring element to detect the distance to the surrounding side of the loading part of the assembly to be assembled; 1. The step of "controlling the module to adjust the position of the loading and unloading mechanism so that the measuring distances of the distance measuring components are equal in length, thereby correcting the inclination angle of the loading and unloading work surface", is that the control module drives the loading and unloading mechanism on the mechanical arm to adjust Position, so that the distance from each distance measuring element to the surrounding side of the assembly bearing part to be assembled is equal, so as to ensure that the loading and unloading operation surface of the loading and unloading mechanism is positively and parallelly corresponding to the assembly bearing part to be assembled, In order to correct the inclination angle of the loading and unloading operation surface of the loading and unloading mechanism; and the control module stores the information of the corrected loading and unloading operation surface; The "image capturing component checks the image of the periphery of the carrier part of the assembly to be assembled on the tray, and corrects the image capturing surface" program has: A step of "the robotic arm drives the image capture component to approach the carrier plate at the same inclination angle as the corrected loading and unloading work surface, and obtains the position image of the loading part of the assembly to be assembled and each fixture" is driven by the control module The image capture component on the mechanical arm is moved to the top of the assembly bearing part to be assembled in the same direction and inclination angle as the corrected loading and unloading work surface, and the periphery of the assembly load bearing part to be assembled is obtained by using the image capture component image, so as to confirm the position of the bearing part of the assembly to be assembled and each fixture; A "control module adjusts the position of the image capturing component so that it correctly corresponds to the bearing part of the assembly to be assembled, so as to correct the position of its image capturing surface, and uses the information of the corrected image capturing surface to correct the loading and unloading operation surface, so that In the step of "directly and accurately corresponding to the bearing part of the assembly to be assembled", the control module drives the image capture component on the mechanical arm to adjust its position, so that the image capture component remains correctly aligned with the assembly to be assembled The carrying part and each fixture are used to correct the position of the image capturing surface of the image capture component; and the control module stores the information of the corrected image capturing surface, and can calculate the corrected position information of the loading and unloading mechanism, so that it can be passed through The mechanical arm drives the loading and unloading mechanism to move to a position that is exactly and parallel to the bearing part of the assembly to be assembled. The loading method of the precured wafer carrier as described in claim 16, wherein the procedure of "moving and locking the assembly by the loading and unloading mechanism on the loading part of the assembly to be assembled" has: 1. The step of "unlocking the clamps by the loading and unloading mechanism". First, the control module drives the loading and unloading mechanism on the mechanical arm to move above the loading part of the assembly to be assembled, and releases the clamps by using the clamp operating components; A step of "loading and unloading mechanism to move the assembly on the loading part of the assembly to be assembled" is that the control module drives the loading and unloading mechanism on the mechanical arm to move to the wafer pretreatment part of the first seat Above, the assembly is clamped by the clamping assembly, and then the assembly is moved to the bearing part of the assembly to be assembled; A step of "locking the clamps of the loading and unloading mechanism to fix the assembly" is to use the clamps to operate the components to lock the clamps so that the assembly can be fixed on the bearing part of the assembly to be assembled. The loading method of the pre-cured wafer carrier as described in claim 20, wherein after the step of "the loading and unloading mechanism locks the clamps to fix the assembly", there is another step of "the loading and unloading mechanism disengages the assembly, and the carrier rotates ” step, after the clamping components are released from the assembly, the control module drives the pivoting assembly to drive the tray to pivot, so that the assembly carrying part that has fixed the assembly pivots and moves aside side position, and the vacant assembly carrying part on the other side is moved to the original to-be-assembled position to form another assembly-carrying part to be assembled. The method for placing a precured wafer carrier as described in claim 17, wherein the procedure of "moving a wafer into the wafer ring by the wafer placing mechanism" has: A step of "moving the wafer on the first displacement mechanism by the wafer loading mechanism and guiding the wafer" is to move the wafer to the wafer of the first seat by the wafer carrier. Above the round pretreatment part, use the imaging unit to obtain the image of the wafer, so as to check whether the position of the wafer is correct, cooperate with the two jacket slides with backlight surface to be close together, so that the two concave arcs are combined Form a hole corresponding to the wafer pre-processing part, and then the control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to the correct corresponding wafer ring central location; A step of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer support The frame is separated from the wafer in the groove; then the wafer displacement component drives the wafer bracket to move out of the first base; The circle moves down within the wafer ring. The method for placing a precured wafer carrier as described in Claim 18, wherein the procedure of "moving a wafer into the wafer ring by the wafer placing mechanism" has: A step of "carrying a wafer by the wafer loading mechanism and leveling the wafer during the displacement process" is that the control module drives the wafer displacement component to drive the wafer carrier to be supplied by the wafer A wafer is supported on the material seat, and the wafer is approached to the jet head, and the jet hole of the jet head is used to blow air on the wafer, so that the wafer can be leveled and kept on the wafer holder stably the correct position on the shelf; A step of "moving the wafer on the first displacement mechanism by the wafer loading mechanism and guiding the wafer" is to move the wafer to the wafer of the first seat by the wafer carrier. Above the round pre-curing part, use the imaging unit to obtain the image of the wafer, so as to check whether the position of the wafer is correct, cooperate with the two jacket slides with backlight surface to be close to each other, so that the two concave arcs are combined into one Corresponding to the round hole of the wafer pre-processing part, the control module drives the wafer carrier to correct the position through the wafer displacement component, so that the wafer can be guided to the center of the wafer ring the location of A step of "moving the wafer into the wafer ring by the first displacement mechanism" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer support The frame is separated from the wafer in the groove; then the wafer displacement component drives the wafer bracket to move out of the first base; The circle moves down within the wafer ring.

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