TWI754224B - Robotic arm calibration device of wafer transfer mechanism and calibration method thereof - Google Patents

Abstract

A robot arm calibration device of a wafer transfer mechanism and a calibration method thereof. An image grabbing assembly and a wafer positioning member loading and unloading mechanism are arranged on a movable end of a first robot arm. The image grabbing assembly has an upper imaging element for positioning the wafer. The component loading and unloading mechanism has a positioning scale, a wafer pick-and-place mechanism is arranged on the movable end of a second mechanical arm, the wafer pick-and-place mechanism is provided with an indicator scale, and a main calibration mechanism has a lower image capturing element and a lower image capturing element. A transparent sheet with a standard scale is arranged above the element; the upper and lower imaging elements respectively capture images of the standard scale, which can correct the image grabbing component and establish the reference point coordinates of the first robotic arm; the lower imaging element sees through the The position image of the positioning scale can correct the loading and unloading mechanism of the wafer positioning member, and calculate the relative coordinates between the image grabbing component and the loading and unloading mechanism of the wafer positioning member; The wafer pick-and-place mechanism is calibrated, and the reference point coordinates of the second robotic arm are established.

Description

Robotic arm calibration device of wafer transfer mechanism and calibration method thereof

The present invention relates to a robot arm calibration device of a wafer transfer mechanism and a calibration method thereof, in particular to a method that can respectively calibrate different robot arms to establish a common reference point coordinate, and simultaneously obtain the relative coordinates of different mechanisms on a single robot arm, so that each A device and method for calibrating a manipulator to maintain accurate movement accuracy.

The general integrated circuit (IC) manufacturing process can be mainly divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging; after the silicon ingot is cut into wafers, it is necessary to The fabrication of integrated circuits can only be completed after multiple procedures such as yellow light, crystal growth, etching, and mechanical grinding. During the above-mentioned fabrication process, the wafers are tested, cleaned, evaporated, dried or soaked. In the organic solvent process, in order to effectively fix the wafers for easy processing, each wafer needs to be fixed on a wafer tray first, and the wafer trays respectively carry the wafers to carry out the processing operations in the above-mentioned processes. .

The basic structure of the conventional wafer disc is a disc body with an area slightly larger than the outer diameter of the wafer, and a separable annular frame body is arranged above the disc body to define a position for accommodating the wafer, and the The periphery of the disk body is provided with a plurality of buckling mechanisms, and the ring-shaped frame body can be clamped by the buckling mechanisms, so as to be pressed on the periphery of the wafer to form a positioning.

In practical applications, in order to process a larger number of wafers at the same time, a plurality of wafer trays are usually arranged on a large-area carrier tray, and the carrier tray can accommodate multiple wafer trays and move them to different locations at the same time. process to effectively increase the efficiency of wafer processing.

With the gradual popularization of automated processing, it is inevitable to use a robotic arm to perform the pick-and-place action between each wafer and each wafer tray in the tray, which not only saves a lot of manpower, but also reduces production costs and improves processing efficiency. trend, and because the general wafer itself is extremely fragile and has extremely high requirements for processing precision, not only the operation accuracy of a single robot arm when picking and placing wafers is extremely high, but also when multiple robots are used. Picking and placing the same wafers must also have the same accuracy; therefore, how to effectively calibrate each manipulator so that it not only maintains proper accuracy when a single manipulator performs different processing actions, but also enables different manipulators to use a common reference To form an excellent relative activity correlation, in order to ensure the operation accuracy of each robot arm to pick and place wafers under the operation requirements of using the robot arm to place each wafer, it is an urgent task for all related industries.

In view of the above-mentioned limitations in the conventional way of picking and placing wafers in each wafer tray on the carrier tray, the inventors have researched and improved methods for these shortcomings, and finally the present invention is produced.

The main purpose of the present invention is to provide a robot arm calibration device of a wafer transfer mechanism and a calibration method thereof, which mainly include an image grabbing component and a wafer positioning member loading and unloading mechanism on a movable end of a first robot arm. The assembly has an upper image pickup element, the wafer positioning member loading and unloading mechanism has a positioning scale, and a main correction mechanism is arranged within the movable range of the first mechanical arm, the main correction mechanism has a lower image pickup element, and the lower image pickup element A transparent sheet with a standard scale is arranged above; the first robotic arm is used to drive the image-grabbing assembly, so that the upper and lower image-taking elements take images of the standard scale respectively, so as to correct the image-grabbing assembly and establish the first The coordinate of the reference point of the robot arm; and the first robot arm drives the wafer positioning member loading and unloading mechanism, and the lower imaging element sees through the position image of the positioning scale, which can correct the wafer positioning member loading and unloading mechanism, and calculate the The relative coordinates between the image grabbing assembly and the wafer positioning member loading and unloading mechanism; therefore, in practical applications, the image grabbing assembly can be used to easily locate the correct position on the to-be-operated area, and then directly use the setting of the relative coordinates to make the The wafer positioning member loading and unloading mechanism is directly moved to the correct position to facilitate subsequent processing operations, which not only simplifies the operation procedure, but also maintains the operation accuracy between different mechanisms on a single robotic arm.

Another object of the present invention is to provide a robot arm calibration device of a wafer transfer mechanism and a calibration method thereof. In addition, a wafer pick-and-place mechanism is provided on the movable end of a second robot arm. There is an indicator scale, and the second robot arm is used to drive the wafer pick-and-place mechanism, so that the lower imaging element can see through the position image of the indicator scale, the wafer pick-and-place mechanism can be corrected, and the second robot arm can be established. The reference point coordinate system, and the reference point coordinate system of the second manipulator is the same as the reference point coordinate of the first manipulator, so as to establish an accurate mutual relationship between the first manipulator and the two manipulators.

In order to achieve the above objects and effects, the technical means adopted in the present invention include: a robotic arm calibration device for a wafer transfer mechanism, comprising: a first robotic arm, which is connected and driven by a control module, and is located in the first robotic arm. The movable end of the robotic arm is provided with an image grabbing assembly and a wafer positioning member loading and unloading mechanism, the image grabbing assembly has an upper image pickup element, the wafer positioning member loading and unloading mechanism has a positioning surface, and a wafer positioning member is provided on the positioning surface. a positioning scale; a second manipulator is connected and driven by the control module, a wafer pick-and-place mechanism is arranged on the movable end of the second manipulator, and an indicator scale is provided on the wafer pick-and-place mechanism; A main calibration mechanism is arranged within the movable range of the first and second robotic arms, and is connected and driven by the control module for calibrating the positions of the image grabbing component and the wafer pick-and-place mechanism respectively. The calibration mechanism has a lower image pickup element, a transparent sheet is arranged above the lower image pickup element, and a standard scale as a positioning reference is arranged on the transparent sheet.

According to the above structure, the main calibration mechanism is provided with a distance measuring laser light source beside the lower imaging element.

According to the above structure, the plurality of laser light sources are respectively disposed at at least three points outside the positioning surface.

According to the above structure, the positioning scale is selected from one of holes or scales.

According to the above structure, the wafer pick-and-place mechanism is a wafer chuck capable of sucking wafers.

The technical means adopted in the present invention further include: a method for calibrating a robotic arm using the aforementioned wafer transfer mechanism, at least comprising: a step of "compare the position difference between the lower imaging element and the upper imaging element to obtain a standard scale", which is The image grabbing component is driven by the first robotic arm to move above the main calibration mechanism, and the lower image capturing element directly obtains the position image of the standard scale on the transparent sheet to form a lower standard position image, and the upper image capturing element obtains the position image of the standard scale. The position image of the standard scale on the transparent sheet forms an upper standard position image; the control module compares the difference between the lower standard position image and the upper standard position image; a "establishing the reference point coordinates of the first robotic arm" ” step, the first robotic arm drives the image-grabbing component to move to an image-taking calibration position, so that the lower standard position image and the upper standard-position image are superimposed, so as to correct the image-grabbing range of the image-grabbing component, and The control module memorizes the coordinates of the image-capturing calibration position of the image-grabbing component to establish the reference point coordinates of the first robotic arm; a step of "comparing the lower-image-capturing component to obtain the position difference between the positioning scale position and the standard scale" is driven by the first robotic arm to move the wafer positioning member loading and unloading mechanism to the top of the main calibration mechanism, and the lower imaging element penetrates the transparent sheet to see through the position image of the positioning scale on the positioning surface to form a positioning a position image, the control module compares the difference between the lower standard position image and the positioning position image; a step of "establishing the correct working position of the wafer positioning member loading and unloading mechanism" is that the first robotic arm drives the wafer The positioning member loading and unloading mechanism is moved to a loading and unloading calibration position, so that the lower standard position image and the positioning position image are overlapped, so as to correct the working position of the wafer positioning member loading and unloading mechanism, and the wafer positioning member loading and unloading is memorized by the control module. The coordinates of the loading and unloading calibration position of the mechanism, and then calculate and memorize the relative coordinates between the image capturing calibration position and the loading and unloading calibration position; a step of "comparing the lower image capturing element to obtain the position difference between the indicated scale position and the standard scale" is set by The second robotic arm drives the wafer pick-and-place mechanism to move above the main calibration mechanism, and the lower imaging element penetrates the transparent sheet to see through the position image of the indicator scale on the wafer pick-and-place mechanism to form an indicator position image, and then the control module compares the difference between the image of the lower standard position and the image of the indicated position; a step of "establishing the reference point coordinates of the second robot arm" is that the second robot arm drives the wafer fetching The positioning mechanism is moved to a pick-and-place calibration position, so that the image of the lower standard position overlaps with the image of the indicated position, so as to correct the working position of the wafer pick-and-place mechanism, and the control module memorizes the pick-and-place mechanism of the wafer. The coordinates of the calibration position are placed to establish the reference point coordinates of the second manipulator, and the first and second manipulators have the same reference point coordinates.

According to the above method, before performing the step of "compare the position difference between the lower image pickup element and the upper image pickup element to obtain the standard scale", a step of "adjust the lens focal length of the upper image pickup element corresponding to the standard scale" is performed in advance, and the The main calibration mechanism uses the laser beam generated by the distance measuring laser light source to project the laser beam to the standard scale part of the image grabbing component, so as to measure the distance between the main calibration mechanism and the standard scale, and adjust the lens focal length of the upper imaging element , so that the upper imaging element can clearly obtain the position image of the standard scale on the transparent sheet.

According to the above method, before performing the step of "compare the lower image capturing element to obtain the position difference between the position of the positioning scale and the standard scale", a step of "adjusting the lens focal length of the lower image capturing element corresponding to the positioning scale" is performed in advance. The main calibration mechanism uses the laser beam generated by the distance measuring laser light source to project on the positioning scale of the positioning surface, so as to measure the distance between the main calibration mechanism and the wafer positioning member loading and unloading mechanism, and adjust the position of the lower imaging element. The focal length of the lens is used to facilitate the lower image pickup element to clearly obtain the position image of the positioning scale of the wafer positioning member loading and unloading mechanism.

According to the above method, before performing the step of "compare the lower image capturing element to obtain the position difference between the indicated scale position and the standard scale", a step of "adjusting the lens focal length of the lower image capturing element corresponding to the indicated scale" is performed in advance, and the The main calibration mechanism uses the laser beam generated by the distance measuring laser light source to project on the indicating scale of the wafer pick-and-place machine, so as to measure the distance between the main calibration mechanism and the indicating scale, so as to adjust the position of the lower imaging element. The focal length of the lens is used to facilitate the lower image pickup element to clearly obtain the position image of the indication scale of the wafer pick-and-place machine.

In order to obtain a more specific understanding of the above-mentioned objects, effects and features of the present invention, the following descriptions are given in accordance with the following drawings:

Referring to FIG. 1, it can be seen that the main structure of the present invention includes: a first robot arm 1, an image grabbing assembly 2, a wafer positioning member loading and unloading mechanism 3, a second robot arm 4, a wafer pick-and-place mechanism 5, and a main calibration Parts such as mechanism 6; wherein the first mechanical arm 1 is connected and driven by a control module (which may be a computer with computing function, not shown) for performing multi-axis pivoting activities.

The image grabbing assembly 2 and the wafer positioning member loading and unloading mechanism 3 are respectively assembled on the movable end of the first robot arm 1; The wafer positioning member loading and unloading mechanism 3 is provided with a positioning surface 31, the positioning surface 31 (center) is provided with a positioning scale 32 (which can be a hole or a scale), and at least two A relatively movable clamping member 33 , the wafer positioning member loading and unloading mechanism 3 (positioning surface 31 ) is provided with a plurality of uniformly distributed laser light sources 34 on the periphery, and the plurality of laser light sources 34 are respectively arranged outside the positioning surface 31 At least three points on the side.

The second robotic arm 4 is connected and driven by the control module for multi-axis movement.

The wafer pick and place mechanism 5 is assembled on the movable end of the second robot arm 4, and an indicator scale 51 is provided on the wafer pick and place mechanism 5; in a possible embodiment, the wafer pick and place The mechanism 5 is a wafer chuck with vacuum suction.

The main calibration mechanism 6 is disposed within the common movable range of the first and second robotic arms 1 and 4, and is connected to and driven by the control module. The main calibration mechanism 6 is provided with an imaging element under the illumination light source 62 (can be a CCD camera), and at least one distance measuring laser light source 61 with a distance measuring function; a transparent sheet 63 is arranged above the lower imaging element 62, and a standard scale 631 is arranged in the center of the transparent sheet 63 .

Referring to FIG. 3, it can be seen that the calibration method of the present invention includes: “adjust the focal length of the upper image capturing element 21 corresponding to the standard scale 631” S11, “compare the lower image capturing element 62 with the upper image capturing element 21 to obtain a standard "Position difference of scale 631" S12, "Establish the coordinates of the reference point of the first robot arm 1" S13, "Adjust the lens focal length of the lower image pickup element 62 corresponding to the positioning scale 32" S14, "Compare the lower image pickup element 62 to obtain the positioning" The position difference between the position of the scale 32 and the standard scale 631" S15, "Establish the correct working position of the wafer positioning member loading and unloading mechanism 3" S16, "Adjust the lower image pickup element 62 corresponding to the lens focal length of the indicating scale 51" S17, "Compare the lower The imaging element 62 obtains the position difference between the position of the indicated scale 51 and the standard scale 631" S18, "establishes the reference point coordinates of the second manipulator 4" S19 and other steps; the following will be combined with Figures 4 to 17 to describe the above steps respectively, And a practical application example:

For the convenience of description, in the application embodiments shown in Figs. 4 to 17, a carrier plate 7 is additionally provided within the movable range of the first and second manipulator arms 1 and 4 in the above structure. is arranged on a sliding mechanism 73, the sliding mechanism 73 has a sliding seat 731, the sliding seat 731 is arranged on a plurality of sliding guide rails 732 extending in parallel, and a bearing is arranged on the sliding seat 731 The pivot seat 733 of the carrier 7; and a cover 72 is fixed above the carrier 7. The cover 72 is provided with a concave notch 721, so that part of the wafer disk 71 on the carrier 7 can be exposed to the outside. The control module operates the sliding mechanism 73 , so that the sliding seat 731 can drive the pivoting seat 733 to slide between the two ends of the sliding guide rail 732 , and can drive the carrier plate 7 through the pivoting seat 733 pivoting; and a wafer calibration mechanism 8 and a material loading mechanism 9 are respectively provided within the movable range of the first robotic arm 1, and the wafer calibration mechanism 8 is connected and driven by the control module; in this implementation In an example, the wafer calibration mechanism 8 has a support seat 81 for holding the wafer 90 , a through hole is formed in the center of the support seat 81 , and an imaging unit 82 is arranged above the support seat 81 . A suction head 83 with a vacuum suction hole is arranged below the through hole for sucking the wafer 90. The suction head 83 can be driven by a transposing mechanism 84 to perform lifting and pivoting actions, and the loading mechanism The inside of 9 can accommodate a plurality of wafers 90 to be processed, and the loading mechanism 9 is arranged on a lifting mechanism 91, and the lifting mechanism 91 can be used to drive the loading mechanism 9 to raise or lower the position; but In practical application, different operations can also be performed in conjunction with other components to achieve different effects, which are not limited to the contents disclosed in the drawings.

First, in the step S11 of "adjusting the lens focal length of the upper image capturing element 21 corresponding to the standard scale 631", the first robotic arm 1 drives the image capturing assembly 2 to move above the main calibration mechanism 6 (as shown in FIG. 4 ). shown); the laser beam 611 generated by the distance measuring laser light source 61 is projected by the main calibration mechanism 6 to a preset position on the image-grabbing component 2, and the main calibration mechanism 6 and the image-grabbing component 2 (above) can be measured. The distance of the image pickup element 21), and adjust the lens focal length of the upper image pickup element 21 corresponding to the standard scale 631;

The step S12 of "compare the lower image capturing element 62 and the upper image capturing element 21 to obtain the position difference of the standard scale 631" is to obtain the position image of the standard scale 631 on the transparent sheet 63 directly upward from the lower image capturing element 62, A next standard position image is formed, and the upper image capturing element 21 clearly obtains the position image of the standard scale 631 on the transparent sheet 63 downward to form an upper standard position image; the control module compares the lower standard position image with that of the lower standard position image. The difference between the images on the standard position.

In the step S13 of "establishing the reference point coordinates of the first robot arm 1", the first robot arm 1 drives the image grabbing component 2 to move to an image capturing correction position, so that the lower standard position image and the upper standard position image are overlapping each other to correct the image capturing range of the image grabbing component 2 , and the control module memorizes the coordinates of the image capturing correction position (correct image capturing range) of the image grabbing component 2 to form the first robotic arm 1 The coordinates of the reference point (origin).

In the step S14 of “adjusting the lens focal length of the lower image pickup element 62 corresponding to the positioning scale 32 ”, the first robot arm 1 drives the wafer positioning member loading and unloading mechanism 3 to move above the main calibration mechanism 6 (as shown in FIG. 5 ). The laser beam 611 generated by the distance measuring laser light source 61 is projected on the positioning surface 31 by the main calibration mechanism 6, so as to measure the distance between the main calibration mechanism 6 and the positioning scale 32, and adjust the The lower image pickup element 62 corresponds to the lens focal length of the positioning scale 32 .

The step S15 of "comparing the lower imaging element 62 to obtain the position difference between the position of the positioning scale 32 and the standard scale 631" is that the lower imaging element 62 can directly look up to obtain the position image of the standard scale 631 on the transparent sheet 63 ( That is, the lower standard position image); at the same time, the lower image pickup element 62 sees the position image of the positioning scale 32 (hole or scale) on the positioning surface 31 upward (penetrating the transparent sheet 63 ) to form a positioning position image, which is composed of The control module compares the difference between the lower standard position image and the positioning position image.

In the step S16 of "establishing the correct working position of the wafer positioning member loading and unloading mechanism 3", the first robotic arm 1 drives the wafer positioning member loading and unloading mechanism 3 to move to a loading and unloading calibration position, so that the lower standard position image and the positioning The position images are overlapped, so as to correct the working position of the wafer positioning member loading and unloading mechanism 3, and the control module will memorize the coordinates of the loading and unloading correction position (correct working position) of the wafer positioning member loading and unloading mechanism 3, and then calculate and memorize the coordinates of the loading and unloading correction position (correct working position) of the wafer positioning member loading and unloading mechanism 3. The relative coordinates between the acquisition correction position and the loading and unloading correction position.

In the above steps, after the image grabbing component 2 is calibrated by the main calibration mechanism 6, a reference point (origin) coordinate can be established as the starting standard of the first robot arm 1, and the wafer positioning member loading and unloading mechanism 3 After being calibrated by the main calibration mechanism 6, a relative coordinate between the wafer positioning member loading and unloading mechanism 3 and the image grabbing assembly 2 can be generated; therefore, the wafer positioning member loading and unloading mechanism 3 and the image grabbing assembly 2 can be established thereby. The relative positional relationship between them, in the subsequent operation, the image grabbing component 2 with the image grabbing function can be used to first locate the correct position on the to-be-operated area (eg: wafer tray), and then the wafer positioner can be used for loading and unloading. The mechanism 3 can quickly move to the correct position by directly using the relative coordinates, so as to facilitate subsequent processing operations.

Please refer to FIGS. 6 to 9. In practical application, after the wafer positioning member loading and unloading mechanism 3 and the image grabbing assembly 2 are calibrated by the main calibration mechanism 6, the first robot arm 1 can drive the image grabbing assembly. 2 Move to the top of the carrier tray 7 (as shown in Fig. 6) to confirm the position of the wafer tray 71 and check the condition on the wafer tray 71 (whether there are any remaining chips or fragments of the wafer 90), Then, the control module refers to the relative position coordinates, and the first robotic arm 1 drives the wafer positioning member loading and unloading mechanism 3 to approach the wafer tray 71 , so that the multiple (at least three) laser light sources 34 generate the same The laser beam of the length can be projected on the wafer tray 71 together, so that the positioning surface 31 is aligned (parallel to) the wafer tray 71 (as shown in FIG. 7 ), and then the wafer tray 71 After the wafer positioning member 711 pre-arranged at the periphery is unlocked, the wafer positioning member 711 is taken out by the clamping member 33 and maintained in the clamping state (as shown in Figs. 8 and 9).

In step S17 of “adjusting the lens focal length of the lower image pickup element 62 corresponding to the indication scale 51 ”, the second robot arm 4 drives the wafer pick-and-place mechanism 5 to move above the main calibration mechanism 6 (as shown in FIG. 10 ). shown); the laser beam 611 generated by the main calibration mechanism 6 using the ranging laser light source 61 is projected onto the indication scale 51 of the wafer pick-and-place mechanism 5, so as to measure the main calibration mechanism 6 and the indication scale 51 to adjust the lens focal length of the lower image pickup element 62 corresponding to the indication scale 51 .

In the step S18 of “compare the lower imaging element 62 to obtain the position difference between the position of the indicated scale 51 and the standard scale 631 ”, the lower imaging element 62 can directly observe and obtain the position image of the standard scale 631 on the transparent sheet 63 (ie The lower standard position image); at the same time, the lower image pickup element 62 (penetrating the transparent sheet 63) sees through the position image of the indicating scale 51 on the wafer pick-and-place mechanism 5 to form an indicating position image, which is then controlled by the control module. The group compares the difference between the lower standard position image and the indicated position image.

In the step S19 of "establishing the reference point coordinates of the second robot arm 4", the second robot arm 4 drives the wafer pick-and-place mechanism 5 to move to a pick-and-place correction position, so that the lower standard position image and the indicated position The images are overlapped to correct the working position of the wafer pick-and-place mechanism 5 , and the control module memorizes the coordinates of the pick-and-place correction position (correct working position) of the wafer pick-and-place mechanism 5 to form the second robotic arm 4 The coordinates of the reference point (origin).

In the above steps, after the wafer pick-and-place mechanism 5 is calibrated by the main calibration mechanism 6, a reference point (origin) coordinate can be established as the starting standard of the second robot arm 4, and the second robot arm 4 It has the same reference point coordinates as the first robot arm 1 , thereby forming an accurate relationship with each other.

Please refer to Figures 11 to 17. In practical applications, after the wafer pick-and-place mechanism 5 is calibrated by the main calibration mechanism 6, the second robot arm 4 can drive the wafer pick-and-place mechanism 5 to move to the The wafer 90 to be processed is taken out from the loading mechanism 9 (as shown in FIG. 11 ), and the wafer 90 is placed on the bearing seat 81 of the wafer calibration mechanism 8 (as shown in FIG. 12 ), The image capturing unit 82 of the wafer calibration mechanism 8 first obtains the code of the wafer 90 and the position of the notch (as shown in FIG. 13 ), and then the control module determines the position of the notch to be placed in the wafer tray 71 according to the position of the notch. Calculate the angle that the wafer 90 needs to be adjusted, and the suction head 83 is driven by the transposing mechanism 84 to suck the wafer 90 up (separate from the support seat 81 ), and rotate the wafer 90 , so that the wafer 90 The notch is adjusted to the correct angle; then the transposing mechanism 84 drives the suction head 83 to suck the wafer 90 down, so as to place the wafer 90 back on the receiving seat 81 .

The wafer pick-and-place mechanism 5 is then driven by the second robotic arm 4 to take the wafer 90 with the correct notch angle from the holder 81 of the wafer alignment mechanism 8 and place it on the wafer 7 of the carrier tray 7 . on the wafer tray 71 (as shown in Fig. 14).

Then, the first robotic arm 1 drives the image-grabbing component 2 to move onto the carrier tray 7 (as shown in FIG. 15 ), and acquires the image of the wafer 90 placed in the previous step to confirm the wafer 90 Whether it is complete and placed in the correct position, and the first robotic arm 1 drives the wafer positioning member loading and unloading mechanism 3 to combine the wafer positioning member 711 clamped by the clamping member 33 with the wafer tray 71 (as shown in FIG. 16 ), the wafer positioning member 711 is pressed against the periphery of the wafer 90 to form positioning (as shown in FIG. 17 ).

Then, the pivot seat 733 drives the carrier tray 7 to rotate, so that the wafer tray 71 on which the wafers 90 have been placed is rotated under the cover 72, and another wafer tray 71 without the wafer 90 is moved to the The underside of the concave notch 721 of the cover 72 is exposed, so as to repeat the above operations such as placing wafers in sequence, and fix different wafers 90 on the wafer trays 71 respectively; After the wafers 90 have been loaded at 71 , the sliding seat 731 of the sliding mechanism 73 slides outward along the sliding guide rail 732 , so as to move the carrier tray 7 to the next process.

Based on the above, the robot arm calibration device and calibration method of the wafer transfer mechanism of the present invention can indeed achieve the effect of calibrating different robot arms to establish a common reference point coordinate, and to establish the relative coordinates of different mechanisms on a single robot arm. For a novel and progressive invention, it is required to apply for an invention patent in accordance with the law; however, the content of the above description is only a description of the preferred embodiment of the present invention, including any changes and modifications extended by the technical means and scope of the present invention. , changes or equivalent replacements shall also fall within the scope of the patent application of the present invention.

1: The first robotic arm

2: Image grab component

21: Upper acquisition element

3: Wafer positioner loading and unloading mechanism

31: Positioning surface

32: Positioning scale

33: Clamps

34: Laser light source

4: The second robotic arm

5: Wafer pick and place mechanism

51: Indicating scale

6: The main correction mechanism

61: Ranging laser light source

611: Laser Beam

62: lower image element

63: transparent sheet

631: Standard scale

7: Loading disk

71: Wafer tray

711: Wafer Positioner

72: Cover

721: Recessed Notch

73: Sliding mechanism

731: Sliding seat

732: Sliding rails

733: Pivot Seat

8: Wafer Correction Mechanism

81: Holder

82: Acquisition unit

83: Tip

84: Transpose Mechanism

9: Feeding mechanism

90: Wafer

91: Lifting mechanism

S11: Adjust the lens focal length of the upper imaging element corresponding to the standard scale

S12: Compare the position difference between the lower imaging element and the upper imaging element to obtain the standard scale

S13: Establish the coordinates of the reference point of the first robotic arm

S14: Adjust the lens focal length of the lower imaging element corresponding to the positioning scale

S15: Comparing the lower imaging element to obtain the position difference between the positioning scale position and the standard scale

S16: Establish the correct working position of the wafer positioning member loading and unloading mechanism

S17: Adjust the focal length of the lens corresponding to the indicated scale of the lower image pickup element

S18: Compare the lower imaging element to obtain the position difference between the indicated scale position and the standard scale

S19: Establish the reference point coordinates of the second robotic arm

Figure 1 is a schematic diagram of the overall structure of the present invention.

Figure 2 is a partial enlarged schematic view of the main calibration mechanism of the present invention.

Fig. 3 is a flow chart of the calibration method of the present invention.

FIG. 4 is a schematic diagram of the state of the image grabbing assembly of the present invention above the main calibration mechanism.

FIG. 5 is a schematic view of the state of the wafer positioning member loading and unloading mechanism of the present invention above the main calibration mechanism.

FIG. 6 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.

FIG. 7 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray.

FIG. 8 is a schematic diagram of the state of the wafer positioning member loading and unloading mechanism of the present invention when the wafer positioning member is removed.

Fig. 9 is a partial enlarged schematic view of part A of Fig. 8.

FIG. 10 is a schematic view of the state of the wafer pick-and-place mechanism of the present invention above the main calibration mechanism.

FIG. 11 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention taking out the wafers from the loading mechanism.

FIG. 12 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention placing the wafer on the wafer calibration mechanism.

FIG. 13 is a schematic diagram of the state of the wafer calibration mechanism of the present invention for calibration of wafers.

FIG. 14 is a schematic diagram of the movement of the wafer pick-and-place mechanism of the present invention to transfer the wafer onto the wafer tray.

FIG. 15 is a schematic diagram of the state of the image grabbing device of the present invention for confirming the position of the wafer on the carrier plate.

FIG. 16 is a schematic diagram of the state in which the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to install the wafer positioning member.

FIG. 17 is a schematic view of the state in which the wafer positioning member of the present invention is fixed on the wafer tray and the wafer positioning member loading and unloading mechanism is moved back to the initial position.

1: The first robotic arm

2: Image grab component

21: Upper acquisition element

3: Wafer positioner loading and unloading mechanism

31: Positioning surface

32: Positioning scale

33: Clamps

34: Laser light source

4: The second robotic arm

5: Wafer pick and place mechanism

51: Indicating scale

6: The main correction mechanism

61: Ranging laser light source

611: Laser Beam

62: lower image element

63: transparent sheet

631: Standard scale

Claims (10)

A robotic arm calibration device of a wafer transfer mechanism, comprising: a first robotic arm, which is connected and driven by a control module, an image grabbing component and a wafer positioning member are arranged on the movable end of the first robotic arm A loading and unloading mechanism, the image grabbing assembly has an upper image pickup element, the wafer positioning member loading and unloading mechanism has a positioning surface, and a positioning scale is arranged on the positioning surface; a second robotic arm is connected and controlled by the control module Drive, a wafer pick-and-place mechanism is arranged on the movable end of the second robot arm, an indicator scale is arranged on the wafer pick-and-place mechanism; a main calibration mechanism is arranged on the movement of the first and second robot arms within the range, and is connected and driven by the control module for calibrating the positions of the image grabbing assembly and the wafer pick-and-place mechanism respectively, the main calibration mechanism has a lower image pickup element, and a lower image pickup element is provided above the lower image pickup element. The transparent sheet is provided with a standard scale as a positioning reference on the transparent sheet. The robotic arm calibration device of the wafer transfer mechanism described in the first item of the scope of the patent application, wherein a plurality of laser light sources are arranged on the peripheral side of the positioning surface of the wafer positioning member loading and unloading mechanism, and the plurality of laser light sources are respectively arranged on the Locate at least three points on the outside of the plane. The robotic arm calibration device of the wafer transfer mechanism as described in claim 1, wherein the positioning scale is selected from one of holes or scales. The robotic arm calibration device for a wafer transfer mechanism as described in item 1 of the scope of the patent application, wherein the wafer pick-and-place mechanism is a wafer chuck capable of sucking wafers. The robotic arm calibration device of the wafer transfer mechanism according to any one of the claims 1 to 4 of the scope of the application, wherein the main calibration mechanism is provided with a distance measuring laser light source beside the lower imaging element. A method for calibrating a robot arm using the wafer transfer mechanism described in any one of the above-mentioned claims 1 to 4, comprising at least: 1. Comparing the position difference between the lower imaging element and the upper imaging element to obtain a standard scale ” step, the image grabbing component is driven by the first robotic arm to move above the main calibration mechanism, and the lower image capturing element directly obtains the position image of the standard scale on the transparent sheet to form a standard position image, and the upper The image capturing element obtains the position image of the standard scale on the transparent sheet to form an upper standard position image; the control module compares the difference between the lower standard position image and the upper standard position image; a "build a first robotic arm" The first robot arm drives the image-grabbing component to move to an image-taking correction position, so that the lower standard position image and the upper standard position image are superimposed, so as to correct the image-grabbing component. the image range, and the control module memorizes the coordinates of the image-capturing correction position of the image-grabbing component to establish the reference point coordinates of the first robotic arm; "Position difference" step, the first robotic arm drives the wafer positioning member loading and unloading mechanism to move above the main calibration mechanism, and the lower imaging element penetrates the transparent sheet to see through the positioning scale on the positioning surface. Position image of the scale , forming a positioning position image, and the control module compares the difference between the lower standard position image and the positioning position image; a step of "establishing the correct working position of the wafer positioning member loading and unloading mechanism" is performed by the first robotic arm Drive the wafer positioning member loading and unloading mechanism to move to a loading and unloading calibration position, so that the lower standard position image and the positioning position image overlap, so as to correct the wafer positioning Positioning the working position of the component loading and unloading mechanism, and the control module memorizes the coordinates of the loading and unloading correction position of the wafer positioning member loading and unloading mechanism, and then calculates and memorizes the relative coordinates between the image acquisition correction position and the loading and unloading correction position; a " The step of comparing the lower imaging element to obtain the position difference between the indicated scale position and the standard scale is that the second robotic arm drives the wafer pick-and-place mechanism to move above the main calibration mechanism, and the lower imaging element penetrates the The transparent sheet sees through the position image of the indicating scale on the wafer pick-and-place mechanism to form an indicating position image, and then the control module compares the difference between the lower standard position image and the indicating position image; The reference point coordinates of the robot arm" step, the second robot arm drives the wafer pick-and-place mechanism to move to a pick-and-place correction position, so that the lower standard position image and the indicated position image overlap, so as to correct the wafer pick and place. The working position of the wafer pick-and-place mechanism, and the control module memorizes the coordinates of the pick-and-place correction position of the wafer pick-and-place mechanism to establish the reference point coordinates of the second robotic arm, and make the first and second robotic arms have the same coordinates of the reference point. A method for calibrating a robot arm using the wafer transfer mechanism described in item 5 of the aforementioned patent scope, at least comprising: a step of "comparing the position difference between the lower imaging element and the upper imaging element to obtain a standard scale", wherein the The first robotic arm drives the image grabbing component to move above the main calibration mechanism, and the lower image capturing element directly obtains the position image of the standard scale on the transparent sheet to form a standard position image, and the upper image capturing element obtains the transparent The position image of the standard scale on the chip forms an upper standard position image; the control module compares the difference between the lower standard position image and the upper standard position image; a step of "establishing the reference point coordinates of the first robotic arm" , is driven by the first robotic arm to move the image-grabbing component to an image-capturing calibration position, so that the lower standard position shadows The image is superimposed on the upper standard position image, so as to correct the image capturing range of the image grabbing element, and the control module memorizes the coordinates of the image grabbing correction position of the image grabbing element to establish the reference point of the first robotic arm Coordinates; a step of "comparing the lower image pickup element to obtain the position difference between the positioning scale position and the standard scale", in which the first robotic arm drives the wafer positioning member loading and unloading mechanism to move above the main calibration mechanism, and the lower pickup The image element penetrates the transparent sheet to see through the position image of the positioning scale on the positioning surface to form a positioning position image, and the control module compares the difference between the lower standard position image and the positioning position image; The step of correct working position of the circular positioning member loading and unloading mechanism is that the first robotic arm drives the wafer positioning member loading and unloading mechanism to move to a loading and unloading calibration position, so that the lower standard position image and the positioning position image are overlapped, so as to correct the wafer The working position of the loading and unloading mechanism of the circular positioning member, and the control module memorizes the coordinates of the loading and unloading correction position of the loading and unloading mechanism of the wafer positioning member, and then calculates and memorizes the relative coordinates between the image-taking correction position and the loading and unloading correction position; one In the step of "comparing the lower imaging element to obtain the position difference between the indicated scale position and the standard scale", the second robotic arm drives the wafer pick-and-place mechanism to move above the main calibration mechanism, and the lower imaging element penetrates The transparent sheet sees through the position image of the indicating scale on the wafer pick-and-place mechanism to form an indicating position image, and then the control module compares the difference between the lower standard position image and the indicating position image; The second robot arm drives the wafer pick-and-place mechanism to move to a pick-and-place calibration position, so that the lower standard position image and the indicated position image overlap, thereby calibrating the wafer The working position of the pick-and-place mechanism, and the seat of the pick-and-place correction position of the wafer pick-and-place mechanism is memorized by the control module to establish the reference point coordinates of the second manipulator, and make the first and second manipulators have the same reference point coordinates. The method for calibrating a robot arm of a wafer transfer mechanism as described in item 7 of the scope of the patent application, wherein before performing the step of "compare the position difference between the lower image pickup element and the upper image pickup element to obtain the standard scale", a " "Adjust the focal length of the lens corresponding to the standard scale of the upper image capturing element" step, the main calibration mechanism uses the laser beam generated by the ranging laser light source to project the laser beam to the standard scale part of the image grabbing component, and the main calibration mechanism and the standard scale can be measured. The distance of the standard scale is adjusted, and the focal length of the lens of the upper imaging element is adjusted, so that the upper imaging element can clearly obtain the position image of the standard scale on the transparent film. The method for calibrating a robot arm of a wafer transfer mechanism as described in item 7 of the scope of the patent application, wherein before executing the step of "comparing the imaging element to obtain the position difference between the position of the positioning scale and the standard scale", an "adjustment" is performed in advance The step of lowering the image pickup element corresponding to the lens focal length of the positioning scale, the main calibration mechanism uses the laser beam generated by the ranging laser light source to project on the positioning scale of the positioning surface, so as to measure the main calibration mechanism and the crystal. The distance of the mounting and dismounting mechanism of the circular positioning member is adjusted, and the focal length of the lens of the lower imaging element is adjusted, so that the lower imaging element can clearly obtain the position image of the positioning scale of the mounting and dismounting mechanism of the wafer positioning element. The method for calibrating a robot arm of a wafer transfer mechanism as described in item 7 of the scope of the patent application, wherein before performing the step of "comparing the imaging element to obtain the position difference between the indicated scale position and the standard scale", an "adjustment" is performed in advance The step of lowering the image pickup element corresponding to the lens focal length of the indicating scale, the main calibration mechanism uses the laser beam generated by the ranging laser light source to project on the indicating scale of the wafer pick-and-place mechanism, so as to measure the main calibration mechanism distance from the indicated scale to adjust the lower The lens focal length of the imaging element is used to facilitate the lower imaging element to clearly obtain the position image of the indication scale of the wafer pick-and-place mechanism.

Images