TW202133314A - Mechanical arm calibration device of wafer transfer mechanism and calibration method thereof including an image capturing component, a wafer positioning member loading and unloading mechanism, and a wafer pick-and-place mechanism - Google Patents
Mechanical arm calibration device of wafer transfer mechanism and calibration method thereof including an image capturing component, a wafer positioning member loading and unloading mechanism, and a wafer pick-and-place mechanism Download PDFInfo
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本發明是有關晶圓轉載機構之機械臂校準裝置及其校準方法,尤指一種可分別校準不同機械臂建立共同之基準點座標,且同時取得單一機械臂上不同機構之相對座標,以使各機械臂可保持準確活動精度之校準裝置及方法。The present invention relates to a robot arm calibration device for a wafer transfer mechanism and a calibration method thereof, in particular to a method that can calibrate different robot arms to establish a common reference point coordinate, and at the same time obtain the relative coordinates of different mechanisms on a single robot arm, so that each A calibration device and method for the robot arm to maintain accurate movement accuracy.
一般的積體電路(integrated circuit, IC)的製造過程主要可分為:矽晶圓製造、積體電路製作以及積體電路封裝等三大部分;當矽晶棒切割成晶圓後,還需要經過黃光、長晶、蝕刻、機械研磨等多道手續繁雜的流程,方能完成積體電路的製作,而在上述的製造過程中,晶圓在進行測試、清洗、蒸鍍、乾燥或浸泡有機溶劑等流程時,為能有效固定晶圓以便於加工,皆需將各晶圓先分別固定於一晶圓盤上,由各該晶圓盤分別承載各晶圓進行上述各流程的加工作業。The general integrated circuit (IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging; when the silicon ingot is cut into wafers, it needs After yellow light, crystal growth, etching, mechanical polishing and other complicated procedures, the production of the integrated circuit can be completed. In the above manufacturing process, the wafer is tested, cleaned, evaporated, dried or soaked. For organic solvents and other processes, in order to effectively fix the wafers for processing, each wafer needs to be fixed on a wafer tray first, and each wafer tray carries each wafer to perform the processing operations of the above processes .
習知的晶圓盤基本結構,乃為一面積略大於晶圓外徑之盤體,於該盤體上方設有一可分離之環形框體,定義出一容置晶圓的位置,且於該盤體的周緣設有複數扣合機構,利用該等扣合機構可夾固該環形框體,以壓制於該晶圓周緣形成定位。The basic structure of the conventional wafer disk is a disk body with an area slightly larger than the outer diameter of the wafer. A separable ring frame is provided above the disk body to define a position for accommodating the wafer. A plurality of buckling mechanisms are arranged on the periphery of the disc body, and the annular frame body can be clamped by the buckling mechanisms to be pressed on the periphery of the wafer to form a positioning.
在實際應用時,為能同時處理較大量之晶圓,大多會將複數晶圓盤設置於一大面積的載盤上,利用該載盤可容置多個晶圓盤並同時移至各不同的加工程序,以有效增加晶圓加工處理的效率。In practical applications, in order to process a larger amount of wafers at the same time, most of the wafer trays are placed on a large-area carrier tray, which can accommodate multiple wafer trays and move them to different types at the same time. Processing procedures to effectively increase the efficiency of wafer processing.
隨著自動化加工的逐漸普及,利用機械臂執行各晶圓與該載盤中各晶圓盤之間的取放動作,不但可節省大量人力,並可降低生產成本、增進加工效率,已為必然的趨勢,而由於一般晶圓本身極為脆弱,且對於加工精密度的要求極高,因此,不但對於單一機械臂取放晶圓時的作業精確度有極高的要求,且在多個機械臂分別取放相同晶圓時亦必須具有相同精確度;故而,如何有效校準各機械臂,使其不但在單一機械臂進行不同加工動作時保持適當準確性,亦可使不同機械臂利用共同的基準點而形成極佳的相對活動關聯性,以便於在利用機械臂放置各晶圓的作業需求下,確保各機械臂取放晶圓的作業精確度,乃為各相關業者所亟待努力的課題。With the gradual popularity of automated processing, it is inevitable to use robotic arms to perform pick-and-place actions between each wafer and each wafer tray in the carrier, which not only saves a lot of manpower, but also reduces production costs and improves processing efficiency. However, since the general wafer itself is extremely fragile and requires extremely high processing precision, not only does it require a single robot arm to pick and place wafers, it also has extremely high requirements for the accuracy of the operation. When picking and placing the same wafers separately, they must have the same accuracy; therefore, how to effectively calibrate each robot arm so that it not only maintains proper accuracy when a single robot arm performs different processing actions, but also allows different robot arms to use a common reference In order to ensure the accuracy of handling wafers by robot arms under the operation requirements of placing wafers by robot arms, it is an urgent task for all related industries to form an excellent relative activity correlation.
有鑑於習見將於載盤上各晶圓盤中取放晶圓的方式有上述限制需求,發明人乃針對該些缺點研究改進之道,終於有本發明產生。In view of the above-mentioned limitation requirements for the conventional way of picking and placing wafers in each wafer tray on the carrier tray, the inventors studied and improved ways to address these shortcomings, and finally the present invention came into being.
本發明之主要目的在於提供一種晶圓轉載機構之機械臂校準裝置及其校準方法,主要係於一第一機械臂活動端上設有一影像攫取組件及一晶圓定位件裝卸機構,該影像攫取組件具有一上取像元件,該晶圓定位件裝卸機構具有一定位刻度,於該第一機械臂活動範圍內設有一主校正機構,該主校正機構具有一下取像元件,該下取像元件上方設有一具標準刻度之透明片;利用該第一機械臂驅動該影像攫取組件,使該上、下取像元件分別對該標準刻度取像,可校正該影像攫取組件,並建立該第一機械臂之基準點座標;而該第一機械臂驅動該晶圓定位件裝卸機構,由該下取像元件透視該定位刻度的位置影像,可校正該晶圓定位件裝卸機構,並計算出該影像攫取組件及晶圓定位件裝卸機構之間的相對座標;因此在實際應用時,可利用該影像攫取組件先行簡便定位於待作業區域上正確位置,再直接利用該相對座標的設定,而使該晶圓定位件裝卸機構直接移至正確位置,以便於進行後續的加工作業,不但可藉以簡化操作程序,亦可保持單一機械臂上不同機構之間的作業精度。The main purpose of the present invention is to provide a robotic arm calibration device for a wafer transfer mechanism and a calibration method thereof, which are mainly provided with an image grabbing assembly and a wafer positioning member loading and unloading mechanism on a movable end of a first robotic arm. The assembly has an upper image capturing element, the wafer positioning member loading and unloading mechanism has a positioning scale, a main correction mechanism is arranged in the movable range of the first mechanical arm, the main correction mechanism has a lower image capturing element, and the lower image capturing element A transparent sheet with a standard scale is provided on the upper side; the first mechanical arm is used to drive the image capture assembly so that the upper and lower image capture elements capture images of the standard scale respectively. The image capture assembly can be calibrated and the first The reference point coordinates of the robotic arm; and the first robotic arm drives the wafer positioning member loading and unloading mechanism, and the lower image capturing element sees through the position image of the positioning scale, so that the wafer positioning member loading and unloading mechanism can be corrected and the wafer positioning member loading and unloading mechanism can be calculated. The relative coordinates between the image grabbing assembly and the wafer positioning member loading and unloading mechanism; therefore, in actual applications, the image grabbing assembly can be used to easily locate the correct position on the area to be operated, and then directly use the relative coordinate setting to make The wafer positioning member loading and unloading mechanism is directly moved to the correct position to facilitate subsequent processing operations, which not only simplifies the operating procedures, but also maintains the accuracy of operations between different mechanisms on a single robotic arm.
本發明之另一目的在於提供一種晶圓轉載機構之機械臂校準裝置及其校準方法,其另於一第二機械臂之活動端上設有一晶圓取放機構,該晶圓取放機構上設有指示刻度,利用該第二機械臂驅動該晶圓取放機構,使該下取像元件透視該指示刻度的位置影像,可校正該晶圓取放機構,並建立該第二機械臂之基準點座標,且該第二機械臂之基準點座標係與該第一機械臂之基準點座標相同,藉以於該第一、二機械臂之間建立一精確的相互連繫關係。Another object of the present invention is to provide a robotic arm calibration device for a wafer transfer mechanism and a calibration method thereof, which is additionally provided with a wafer pick-and-place mechanism on the movable end of a second robotic arm, and the wafer pick-and-place mechanism is With indicating scale, the second robotic arm is used to drive the wafer pick-and-place mechanism, so that the lower imaging element sees through the position image of the instruction scale, the wafer pick-and-place mechanism can be calibrated, and the second robotic arm is established The reference point coordinates, and the reference point coordinates of the second robot arm are the same as the reference point coordinates of the first robot arm, so that an accurate mutual relationship is established between the first and second robot arms.
為達成上述目的及功效,本發明所採行的技術手段包括:一種晶圓轉載機構之機械臂校準裝置,具有:一第一機械臂,係連結並受一控制模組驅動,於該第一機械臂之活動端上設有一影像攫取組件及一晶圓定位件裝卸機構,該影像攫取組件具有一上取像元件,該晶圓定位件裝卸機構具有一定位面,於該定位面上設有一定位刻度;一第二機械臂,係連結並受該控制模組驅動,於該第二機械臂之活動端上設有一晶圓取放機構,於該晶圓取放機構上設有一指示刻度;一主校正機構,係設置於該第一、二機械臂之活動範圍內,且係連結並受該控制模組驅動,以供分別校正該影像攫取組件及晶圓取放機構的位置,該主校正機構具有一下取像元件,於該下取像元件上方設有一透明片,於該透明片上設有一作為定位基準之標準刻度。In order to achieve the above objectives and effects, the technical means adopted by the present invention include: a robotic arm calibration device of a wafer transfer mechanism, which has: a first robotic arm connected and driven by a control module, and The movable end of the robotic arm is provided with an image grabbing assembly and a wafer positioning member loading and unloading mechanism. The image grabbing assembly has an upper image capturing element. The wafer positioning member loading and unloading mechanism has a positioning surface on which a positioning surface is provided. Positioning scale; a second robotic arm, connected and driven by the control module, a wafer pick-and-place mechanism is provided on the movable end of the second robotic arm, and an indicator scale is provided on the wafer pick-and-place mechanism; A main calibration mechanism is set within the movable range of the first and second robot arms, and is connected and driven by the control module to calibrate the positions of the image grabbing assembly and the wafer pick-and-place mechanism respectively. The correction mechanism has a lower image capturing element, a transparent sheet is arranged above the lower image capturing element, and a standard scale serving as a positioning reference is provided on the transparent sheet.
依上述結構,其中該主校正機構於該下取像元件旁側設有一測距雷射光源。According to the above structure, the main correction mechanism is provided with a range-finding laser light source beside the lower image-taking element.
依上述結構,其中該複數雷射光源係分別設置於該定位面外旁側至少三點。According to the above structure, the plurality of laser light sources are respectively arranged at at least three points outside the positioning surface.
依上述結構,其中該定位刻度係為選自孔洞或刻度其中之一。According to the above structure, the positioning scale is selected from a hole or a scale.
依上述結構,其中該晶圓取放機構係為一可吸取晶圓之晶圓吸盤。According to the above structure, the wafer pick-and-place mechanism is a wafer chuck capable of sucking wafers.
本發明所採行的技術手段另包括:一種應用前述晶圓轉載機構之機械臂校準方法,至少具有:一「比對下取像元件與上取像元件取得標準刻度的位置差異」步驟,係由該第一機械臂驅動該影像攫取組件移至該主校正機構上方,由該下取像元件直接取得該透明片上之標準刻度的位置影像,形成一下標準位置影像,且該上取像元件取得該透明片上之標準刻度的位置影像,形成一上標準位置影像;由該控制模組比對該下標準位置影像與該上標準位置影像之間差異;一「建立第一機械臂之基準點座標」步驟,係由該第一機械臂驅動該影像攫取組件移至一取像校正位置,使該下標準位置影像與該上標準位置影像相疊合,藉以校正該影像攫取組件取像範圍,並由該控制模組記憶該影像攫取組件之取像校正位置的座標,以建立該第一機械臂之基準點座標;一「比對下取像元件取得定位刻度位置與標準刻度的位置差異」步驟,係由該第一機械臂驅動該晶圓定位件裝卸機構移至該主校正機構上方,由該下取像元件穿透該透明片透視該定位面上該定位刻度的位置影像,形成一定位位置影像,由該控制模組比對該下標準位置影像與該定位位置影像之間差異;一「建立晶圓定位件裝卸機構正確作業位置」步驟,係由該第一機械臂驅動該晶圓定位件裝卸機構移至一裝卸校正位置,使該下標準位置影像與該定位位置影像重疊,藉以校正該晶圓定位件裝卸機構的作業位置,並由該控制模組記憶該晶圓定位件裝卸機構之裝卸校正位置的座標,再計算並記憶該取像校正位置及裝卸校正位置之間的相對座標;一「比對下取像元件取得指示刻度位置與標準刻度的位置差異」步驟,係由該第二機械臂驅動該晶圓取放機構移至該主校正機構上方,由該下取像元件穿透該透明片透視該晶圓取放機構上該指示刻度的位置影像,形成一指示位置影像,然後由該控制模組比對該下標準位置影像與該指示位置影像之間差異;一「建立第二機械臂之基準點座標」步驟,係由該第二機械臂驅動該晶圓取放機構移至一取放校正位置,使該下標準位置影像與該指示位置影像重疊,藉以校正該晶圓取放機構的作業位置,並由該控制模組記憶該晶圓取放機構之取放校正位置的座標,以建立該第二機械臂之基準點座標,且使該第一、二機械臂具有相同之基準點座標。The technical means adopted in the present invention further includes: a method for calibrating a robotic arm using the aforementioned wafer transfer mechanism, at least having: a step of "comparing the position difference between the lower image capturing element and the upper image capturing element to obtain a standard scale", which is The image capture component is driven by the first mechanical arm to move above the main correction mechanism, and the lower image capturing element directly obtains the position image of the standard scale on the transparent film to form a lower standard position image, and the upper image capturing element obtains The position image of the standard scale on the transparent film forms an upper standard position image; the control module compares the difference between the lower standard position image and the upper standard position image; a "establish the reference point coordinates of the first robotic arm "Step, the first mechanical arm drives the image capture assembly to move to an image capture correction position, so that the lower standard position image overlaps the upper standard position image, thereby correcting the image capture range of the image capture assembly, and The control module memorizes the coordinates of the image capture correction position of the image capture component to establish the reference point coordinates of the first robotic arm; a step of "comparing the image capture element to obtain the position difference between the positioning scale position and the standard scale" , The first mechanical arm drives the wafer positioning member loading and unloading mechanism to move above the main correction mechanism, and the lower image capturing element penetrates the transparent sheet to see through the position image of the positioning scale on the positioning surface to form a positioning The position image is compared by the control module to the difference between the standard position image and the positioning position image; a step of "establishing the correct operating position of the wafer positioner handling mechanism" is to drive the wafer by the first robot arm The positioning member loading and unloading mechanism moves to a loading and unloading calibration position, so that the lower standard position image overlaps the positioning position image, so as to calibrate the working position of the wafer positioning member loading and unloading mechanism, and the wafer positioning member loading and unloading is memorized by the control module The coordinates of the mounting and dismounting calibration position of the mechanism are calculated and memorized, and the relative coordinates between the capturing and dismounting calibration position and the mounting and dismounting calibration position are calculated and memorized; a step of "comparing the capturing element to obtain the position difference between the indicated scale position and the standard scale" is performed by The second mechanical arm drives the wafer pick-and-place mechanism to move above the main correction mechanism, and the lower image pick-up element penetrates the transparent sheet to see through the position image of the indicator scale on the wafer pick-and-place mechanism to form an indicator position Then, the control module compares the difference between the standard position image and the indicated position image; a step of "establishing the reference point coordinates of the second robot arm" is that the second robot arm drives the wafer to fetch The placement mechanism is moved to a pick-and-place calibration position, so that the lower standard position image overlaps the indicated position image, so as to calibrate the working position of the wafer pick-and-place mechanism, and the control module memorizes the wafer pick-and-place mechanism's pick-and-place mechanism Set the coordinates of the correction position to establish the reference point coordinates of the second robot arm, and make the first and second robot arms have the same reference point coordinates.
依上述方法,其中在執行該「比對下取像元件與上取像元件取得標準刻度的位置差異」步驟之前,預先執行一「調整上取像元件對應於標準刻度之鏡頭焦距」步驟,由該主校正機構利用測距雷射光源所產生之雷射光束投射至該影像攫取組件之標準刻度部位,可測量該主校正機構與該標準刻度的距離,並調整該上取像元件之鏡頭焦距,以利於該上取像元件清晰取得該透明片上之標準刻度的位置影像。According to the above method, before performing the step of "comparing the position difference between the lower image capturing element and the upper image capturing element to obtain the standard scale", a step of "adjusting the lens focal length of the upper image capturing element corresponding to the standard scale" is performed in advance, by The main correction mechanism uses the laser beam generated by the distance measuring laser light source to project to the standard scale position of the image capture component, and can measure the distance between the main correction mechanism and the standard scale, and adjust the lens focal length of the upper image capturing element , In order to facilitate the upper image capturing element to clearly obtain the position image of the standard scale on the transparent film.
依上述方法,其中在執行該「比對下取像元件取得定位刻度位置與標準刻度的位置差異」步驟之前,預先執行一「調整下取像元件對應於定位刻度之鏡頭焦距」步驟,由該主校正機構利用測距雷射光源所產生之雷射光束投射至該定位面之定位刻度上,藉以測量該主校正機構與該晶圓定位件裝卸機構的距離,並調整該下取像元件之鏡頭焦距,以利於該下取像元件清晰取得該晶圓定位件裝卸機構之定位刻度的位置影像。According to the above method, before performing the step of "comparing the lower image capturing element to obtain the position difference between the positioning scale and the standard scale", a step of "adjusting the lens focal length of the lower image capturing element corresponding to the positioning scale" is performed in advance. The main calibration mechanism uses the laser beam generated by the distance measuring laser light source to project onto the positioning scale of the positioning surface, so as to measure the distance between the main calibration mechanism and the wafer positioning member loading and unloading mechanism, and adjust the lower image capturing element The focal length of the lens facilitates the lower image capturing element to clearly obtain the position image of the positioning scale of the wafer positioning member loading and unloading mechanism.
依上述方法,其中在執行該「比對下取像元件取得指示刻度位置與標準刻度的位置差異」步驟之前,預先執行一「調整下取像元件對應於指示刻度之鏡頭焦距」步驟,由該主校正機構利用測距雷射光源所產生之雷射光束投射至該晶圓取放機之指示刻度構上,藉以測量該主校正機構與該指示刻度的距離,以調整該下取像元件之鏡頭焦距,以利於該下取像元件清晰取得該晶圓取放機之指示刻度的位置影像。According to the above method, before performing the step of "comparing the lower image capturing element to obtain the position difference between the indicated scale position and the standard scale", a step of "adjusting the lens focal length of the lower image capturing element corresponding to the indicated scale" is performed in advance, and the The main calibration mechanism uses the laser beam generated by the distance measuring laser light source to project onto the indicator scale structure of the wafer pick-and-place machine, so as to measure the distance between the main calibration mechanism and the indicator scale to adjust the lower imaging element The focal length of the lens facilitates the lower image capturing element to clearly obtain the position image of the indicator scale of the wafer pick-and-place machine.
為使本發明的上述目的、功效及特徵可獲致更具體的瞭解,茲依下列附圖說明如下:In order to obtain a more detailed understanding of the above-mentioned objects, effects and features of the present invention, the following descriptions are given with reference to the following drawings:
請參第1圖所示,可知本發明之主要結構包括:第一機械臂1、影像攫取組件2、晶圓定位件裝卸機構3、第二機械臂4、晶圓取放機構5及主校正機構6等部份;其中該第一機械臂1係連結並受一控制模組(可為一具運算功能之電腦,未繪出)驅動,以供進行多軸樞轉活動。Please refer to Figure 1, it can be seen that the main structure of the present invention includes: the
該影像攫取組件2及晶圓定位件裝卸機構3係分別組設於該第一機械臂1之活動端上;該影像攫取組件2設有一具照明光源之上取像元件21(可為一CCD攝影機),該晶圓定位件裝卸機構3上設有一定位面31,該定位面31(中央)設有一定位刻度32(可為一孔洞或刻度),於該定位面31外周側至少設有二可相對活動之夾持件33,該晶圓定位件裝卸機構3(定位面31)周側設有複數均勻分佈之雷射光源34,該複數雷射光源34係分別設置於該定位面31外旁側至少三點。The
該第二機械臂4係連結並受該控制模組驅動,以供進行多軸活動。The second
該晶圓取放機構5係組設於該第二機械臂4之活動端上,於該晶圓取放機構5上設有一指示刻度51;在一個可行的實施例中,該晶圓取放機構5係為一具有真空吸力之晶圓吸盤。The wafer pick-and-
該主校正機構6係設置於該第一、二機械臂1、4之共同活動範圍內,且係連結並受該控制模組驅動,該主校正機構6設有一具照明光源之下取像元件62(可為一CCD攝影機),以及至少一具量測距離功能之測距雷射光源61;於該下取像元件62上方設有一透明片63,於該透明片63中央設有一標準刻度631。The
請參第3圖所示,可知本發明之校準方法包括:「調整上取像元件21對應於標準刻度631之鏡頭焦距」S11、「比對下取像元件62與上取像元件21取得標準刻度631的位置差異」S12、「建立第一機械臂1之基準點座標」S13、「調整下取像元件62對應於定位刻度32之鏡頭焦距」S14、「比對下取像元件62取得定位刻度32位置與標準刻度631的位置差異」S15、「建立晶圓定位件裝卸機構3正確作業位置」S16、「調整下取像元件62對應於指示刻度51之鏡頭焦距」S17、「比對下取像元件62取得指示刻度51位置與標準刻度631的位置差異」S18、「建立第二機械臂4之基準點座標」S19等步驟;以下即配合第4至17圖,分別說明上述各步驟,以及一實際可行之應用實施例:Please refer to Figure 3, it can be seen that the calibration method of the present invention includes: "adjust the lens focal length of the upper
為便於說明,在第4至17圖中所舉的應用實施例中,係於上述結構中該第一、二機械臂1、4之活動範圍內另設有一載盤7,該載盤7係設置於一滑移機構73上,該滑移機構73具有一滑移座731,該滑移座731係設置於複數平行延伸之滑移導軌732上,於該滑移座731上設有一承置該載盤7之樞轉座733;而於該載盤7上方固定設有一外罩72,該外罩72上設有一凹缺口721,可使該載盤7上之局部晶圓盤71對外裸露,利用該控制模組操作該滑移機構73,可使該滑移座731帶動該樞轉座733於該滑移導軌732二端之間滑移,並可經由該樞轉座733驅動該載盤7樞轉;而於該第一機械臂1之活動範圍內分別另設有一晶圓校正機構8及一置料機構9,該晶圓校正機構8係連結並受該控制模組驅動;在本實施例中,該晶圓校正機構8具有一可供承置該晶圓90之承置座81,承置座81中央設有一貫通孔,於該承置座81上方設有一取像單元82,於該貫通孔下方設有一具真空吸孔之吸頭83,以供吸附該晶圓90,該吸頭83係可受一轉置機構84驅動而執行升降及樞轉等動作,而該置料機構9內部係可供收容複數片狀待加工之晶圓90,且該置料機構9係設置於一升降機構91上,利用該升降機構91可驅動該置料機構9升高或降低位置;但在實際應用時,亦可配合其它組件執行不同操作並達成不同功效,並不局限於圖式所揭露的內容。For ease of description, in the application examples shown in Figures 4 to 17, a
首先,該「調整上取像元件21對應於標準刻度631之鏡頭焦距」S11步驟,係由該第一機械臂1驅動該影像攫取組件2移至該主校正機構6上方(如第4圖所示);由該主校正機構6利用測距雷射光源61所產生之雷射光束611投射至該影像攫取組件2上預設部位,可測量該主校正機構6與該影像攫取組件2(上取像元件21)的距離,並調整該上取像元件21對應於該標準刻度631之鏡頭焦距;以利於該上取像元件21清晰取得該透明片63上之標準刻度631的位置影像。First, in the step S11 of "adjusting the lens focal length of the upper
該「比對下取像元件62與上取像元件21取得標準刻度631的位置差異」S12步驟,係由該下取像元件62直接向上取得該透明片63上之標準刻度631的位置影像,形成一下標準位置影像,且該上取像元件21向下清晰取得該透明片63上之標準刻度631的位置影像,形成一上標準位置影像;由該控制模組比對該下標準位置影像與該上標準位置影像之間差異。The step S12 of "comparing the lower
該「建立第一機械臂1之基準點座標」S13步驟,係由該第一機械臂1驅動該影像攫取組件2移至一取像校正位置,使該下標準位置影像與該上標準位置影像相疊合,藉以校正該影像攫取組件2的取像範圍,並由該控制模組記憶該影像攫取組件2之取像校正位置(正確取像範圍)的座標,以形成該第一機械臂1之基準點(原點)座標。In the step of "establishing the reference point coordinates of the first
該「調整下取像元件62對應於定位刻度32之鏡頭焦距」S14步驟,係由該第一機械臂1驅動該晶圓定位件裝卸機構3移至該主校正機構6上方(如第5圖所示);由該主校正機構6利用測距雷射光源61所產生之雷射光束611投射至該定位面31上,藉以測量該主校正機構6與該定位刻度32的距離,並調整該下取像元件62對應於該定位刻度32之鏡頭焦距。In the step S14 of "adjusting the lens focal length of the lower
該「比對下取像元件62取得定位刻度32位置與標準刻度631的位置差異」S15步驟,係由該下取像元件62可直接向上觀視取得該透明片63上標準刻度631位置影像(即該下標準位置影像);同時該下取像元件62向上(穿透該透明片63)透視該定位面31上該定位刻度32(孔洞或刻度)的位置影像,形成一定位位置影像,由該控制模組比對該下標準位置影像與該定位位置影像之間差異。In the step S15 of "comparing the lower
該「建立晶圓定位件裝卸機構3正確作業位置」S16步驟,係由該第一機械臂1驅動該晶圓定位件裝卸機構3移至一裝卸校正位置,使該下標準位置影像與該定位位置影像重疊,藉以校正該晶圓定位件裝卸機構3的作業位置,並由該控制模組記憶該晶圓定位件裝卸機構3之裝卸校正位置(正確作業位置)的座標,再計算並記憶該取像校正位置及裝卸校正位置之間的相對座標。In the step S16 of "establishing the correct operating position of the wafer positioning
在上述各步驟中,該影像攫取組件2經由該主校正機構6校準後,可建立一作為第一機械臂1起始標準之基準點(原點)座標,而該晶圓定位件裝卸機構3經由該主校正機構6校準後,可產生一該晶圓定位件裝卸機構3與該影像攫取組件2之間的相對座標;因此,可藉以建立該晶圓定位件裝卸機構3與影像攫取組件2之間的相對位置關係,在後續的作業中,可利用具有影像攫取功能之該影像攫取組件2先行定位於待作業區域(如:晶圓盤)上正確位置,再由該晶圓定位件裝卸機構3直接利用該相對座標可快速移至該正確位置,以便於進行後續的加工作業。In the above steps, after the
請參第6至9圖所示,在實際應用時,該晶圓定位件裝卸機構3與該影像攫取組件2經由該主校正機構6校準後,該第一機械臂1可驅動該影像攫取組件2移至該載盤7上方(如第6圖所示),以確認該晶圓盤71的位置並檢視該晶圓盤71上的狀況(是否有殘留之晶圓90碎屑或破片),再由該控制模組參考該相對位置座標,由該第一機械臂1驅動該晶圓定位件裝卸機構3接近該晶圓盤71,使該複數(至少三個)雷射光源34所產生相同長度之雷射光束,可共同投射於該晶圓盤71上,藉以使該定位面31對準(平行於)該晶圓盤71(如第7圖所示),再將該晶圓盤71周緣預先設置之晶圓定位件711解除鎖掣之後,利用該夾持件33取出該晶圓定位件711,並維持夾持狀態(如第8、9圖所示)。Please refer to Figures 6-9. In practical applications, after the wafer positioning member loading and
該「調整下取像元件62對應於指示刻度51之鏡頭焦距」S17步驟,係由該第二機械臂4驅動該晶圓取放機構5移至該主校正機構6上方(如第10圖所示);由該主校正機構6利用測距雷射光源61所產生之雷射光束611投射至該晶圓取放機構5之指示刻度51上,藉以測量該主校正機構6與該指示刻度51的距離,以調整該下取像元件62對應於該指示刻度51之鏡頭焦距。In the step S17 of "adjusting the lens focal length of the lower
該「比對下取像元件62取得指示刻度51位置與標準刻度631的位置差異」S18步驟,係由該下取像元件62可直接觀視取得該透明片63上標準刻度631位置影像(即該下標準位置影像);同時該下取像元件62(穿透該透明片63)透視該晶圓取放機構5上該指示刻度51的位置影像,形成一指示位置影像,然後由該控制模組比對該下標準位置影像與該指示位置影像之間差異。In the step S18 of "comparing the lower
該「建立第二機械臂4之基準點座標」S19步驟,係由該第二機械臂4驅動該晶圓取放機構5移至一取放校正位置,使該下標準位置影像與該指示位置影像重疊,藉以校正該晶圓取放機構5的作業位置,並由該控制模組記憶該晶圓取放機構5之取放校正位置(正確作業位置)的座標,形成該第二機械臂4之基準點(原點)座標。In the step S19 of "establishing the reference point coordinates of the
在上述個步驟中,該晶圓取放機構5經由該主校正機構6校準後,可建立一作為第二機械臂4起始標準之基準點(原點)座標,且該第二機械臂4與該第一機械臂1具有相同之基準點座標,藉以形成一相互準確連繫之關係。In the above steps, after the wafer pick-and-
請參第11至17圖所示,在實際應用時,當該晶圓取放機構5經由該主校正機構6校準後,該第二機械臂4可驅動該晶圓取放機構5移至該置料機構9中取出待加工之晶圓90(如第11圖所示),並將該晶圓90放置於該晶圓校正機構8之承置座81上(如第12圖所示),由該晶圓校正機構8之取像單元82先取得該晶圓90之編碼及缺口位置(如第13圖所示),再由該控制模組依據該欲置入晶圓盤71之缺口位置計算該晶圓90所需調整的角度,由該轉置機構84驅動該吸頭83吸附該晶圓90上升(脫離該承置座81),並轉動該晶圓90,以將該晶圓90之缺口調整至正確的角度;然後該轉置機構84帶動該吸頭83吸附該晶圓90下降,以將該晶圓90回置於該承置座81上。Please refer to Figures 11-17. In actual application, when the wafer pick-and-
再由該第二機械臂4驅動該晶圓取放機構5將該具有正確缺口角度之晶圓90由該晶圓校正機構8之承置座81上取出,並放置於該載盤7之該晶圓盤71上(如第14圖所示)。Then the second
然後,該第一機械臂1驅動該影像攫取組件2移至該載盤7上(如第15圖所示),並取得前一步驟所放置的晶圓90之影像,以確認該晶圓90是否完整且是否被放置於正確位置,另由該第一機械臂1驅動該晶圓定位件裝卸機構3將該夾持件33所夾持之該晶圓定位件711結合於該晶圓盤71上(如第16圖所示),藉由該晶圓定位件711壓合於該晶圓90周緣形成定位(如第17圖所示)。Then, the
然後,該樞轉座733驅動該載盤7轉動,使該已承載晶圓90之該晶圓盤71轉至該外罩72下方,且另一未放置晶圓90之晶圓盤71移至該外罩72的凹缺口721下方形成裸露,以便於依序重覆上述放置晶圓等動作,將不同晶圓90分別固定於各晶圓盤71上;最後,當該載盤7之各晶圓盤71皆已承載晶圓90之後,該滑移機構73之滑移座731沿該滑移導軌732向外滑動,以便於將該載盤7移至下一工序。Then, the
綜合以上所述,本發明晶圓轉載機構之機械臂校準裝置及其校準方法確可達成分別校準不同機械臂建立共同之基準點座標,且建立單一機械臂上不同機構之相對座標之功效,實為一具新穎性及進步性之發明,爰依法提出申請發明專利;惟上述說明之內容,僅為本發明之較佳實施例說明,舉凡依本發明之技術手段與範疇所延伸之變化、修飾、改變或等效置換者,亦皆應落入本發明之專利申請範圍內。Based on the above, the robot arm calibration device and the calibration method of the wafer transfer mechanism of the present invention can indeed calibrate different robot arms to establish a common reference point coordinate, and establish the effect of establishing the relative coordinates of different mechanisms on a single robot arm. For a novel and progressive invention, Yan applied for an invention patent in accordance with the law; however, the content of the above description is only a description of the preferred embodiments of the present invention, and all changes and modifications based on the technical means and scope of the present invention Any changes or equivalent replacements shall also fall within the scope of the patent application of the present invention.
1:第一機械臂1: The first robotic arm
2:影像攫取組件2: Image grabbing component
21:上取像元件21: Upper imaging element
3:晶圓定位件裝卸機構3: Wafer positioning part loading and unloading mechanism
31:定位面31: Positioning surface
32:定位刻度32: positioning scale
33:夾持件33: Clamping parts
34:雷射光源34: Laser light source
4:第二機械臂4: The second robotic arm
5:晶圓取放機構5: Wafer pick-and-place mechanism
51:指示刻度51: indicating scale
6:主校正機構6: Main calibration mechanism
61:測距雷射光源61: Ranging laser light source
611:雷射光束611: Laser beam
62:下取像元件62: Bottom image capturing element
63:透明片63: transparent sheet
631:標準刻度631: standard scale
7:載盤7: loading plate
71:晶圓盤71: Wafer tray
711:晶圓定位件711: Wafer locator
72:外罩72: outer cover
721:凹缺口721: Notch
73:滑移機構73: Sliding Mechanism
731:滑移座731: sliding seat
732:滑移導軌732: Sliding Guide
733:樞轉座733: pivot seat
8:晶圓校正機構8: Wafer calibration mechanism
81:承置座81: Socket
82:取像單元82: Acquisition unit
83:吸頭83: suction head
84:轉置機構84: Transpose organization
9:置料機構9: Feeding mechanism
90:晶圓90: Wafer
91:升降機構91: Lifting mechanism
S11:調整上取像元件對應於標準刻度之鏡頭焦距S11: Adjust the lens focal length of the upper imaging element corresponding to the standard scale
S12:比對下取像元件與上取像元件取得標準刻度的位置差異S12: Compare the position difference between the lower image capturing element and the upper image capturing element to obtain the standard scale
S13:建立第一機械臂之基準點座標S13: Establish the reference point coordinates of the first robotic arm
S14:調整下取像元件對應於定位刻度之鏡頭焦距S14: Adjust the lens focal length of the lower imaging element corresponding to the positioning scale
S15:比對下取像元件取得定位刻度位置與標準刻度的位置差異S15: Compare the position of the image capturing component to obtain the difference between the position of the positioning scale and the standard scale
S16:建立晶圓定位件裝卸機構正確作業位置S16: Establish the correct working position of the wafer positioning unit loading and unloading mechanism
S17:調整下取像元件對應於指示刻度之鏡頭焦距S17: Adjust the lens focal length of the lower imaging element corresponding to the indicator scale
S18:比對下取像元件取得指示刻度位置與標準刻度的位置差異S18: Compare the image capturing component to obtain the difference between the position of the indicator scale and the standard scale
S19:建立第二機械臂之基準點座標S19: Establish the reference point coordinates of the second robotic arm
第1圖係本發明之整體結構示意圖。Figure 1 is a schematic diagram of the overall structure of the present invention.
第2圖係本發明之主校正機構的局部放大示意圖。Figure 2 is a partial enlarged schematic diagram of the main correction mechanism of the present invention.
第3圖係本發明之校準方法流程圖。Figure 3 is a flow chart of the calibration method of the present invention.
第4圖係本發明之影像攫取組件於主校正機構上方的狀態示意圖。Figure 4 is a schematic diagram of the state of the image capture assembly of the present invention above the main correction mechanism.
第5圖係本發明之晶圓定位件裝卸機構於主校正機構上方的狀態示意圖。Figure 5 is a schematic diagram of the state of the wafer positioning member loading and unloading mechanism above the main calibration mechanism of the present invention.
第6圖係本發明之影像攫取組件於載盤上方正確對應於晶圓盤的狀態示意圖。Figure 6 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.
第7圖係本發明之晶圓定位件裝卸機構移至晶圓盤上的狀態示意圖。Figure 7 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray.
第8圖係本發明之晶圓定位件裝卸機構取下晶圓定位件的狀態示意圖。Fig. 8 is a schematic diagram of the state of removing the wafer positioning member by the wafer positioning member loading and unloading mechanism of the present invention.
第9圖係第8圖之A部位的局部放大示意圖。Figure 9 is a partial enlarged schematic diagram of part A in Figure 8.
第10圖係本發明之晶圓取放機構於主校正機構上方的狀態示意圖。Figure 10 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention above the main calibration mechanism.
第11圖係本發明之晶圓取放機構由置料機構中取出晶圓的狀態示意圖。Figure 11 is a schematic diagram of the wafer pick-and-place mechanism of the present invention taking out the wafer from the loading mechanism.
第12圖係本發明之晶圓取放機構將晶圓置於晶圓校正機構上的動作示意圖。FIG. 12 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention when the wafer is placed on the wafer calibration mechanism.
第13圖係本發明之晶圓校正機構校正晶圓的狀態示意圖。Figure 13 is a schematic diagram of the state of the wafer calibration mechanism of the present invention to calibrate the wafer.
第14圖係本發明之晶圓取放機構將晶圓移置於晶圓盤上的動作示意圖。FIG. 14 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention to move the wafer onto the wafer tray.
第15圖係本發明之影像攫取組件確認載盤上晶圓位置的狀態示意圖。Figure 15 is a schematic diagram of the state of the image grabbing assembly of the present invention confirming the position of the wafer on the carrier.
第16圖係本發明之晶圓定位件裝卸機構移至晶圓盤上裝設晶圓定位件的狀態示意圖。FIG. 16 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to install the wafer positioning member.
第17圖係本發明之晶圓定位件固定於晶圓盤上且晶圓定位件裝卸機構移回初始位置的狀態示意圖。FIG. 17 is a schematic diagram of the state where the wafer positioning member of the present invention is fixed on the wafer tray and the wafer positioning member loading and unloading mechanism is moved back to the initial position.
1:第一機械臂1: The first robotic arm
2:影像攫取組件2: Image grabbing component
21:上取像元件21: Upper imaging element
3:晶圓定位件裝卸機構3: Wafer positioning part loading and unloading mechanism
31:定位面31: Positioning surface
32:定位刻度32: positioning scale
33:夾持件33: Clamping parts
34:雷射光源34: Laser light source
4:第二機械臂4: The second robotic arm
5:晶圓取放機構5: Wafer pick-and-place mechanism
51:指示刻度51: indicating scale
6:主校正機構6: Main calibration mechanism
61:測距雷射光源61: Ranging laser light source
611:雷射光束611: Laser beam
62:下取像元件62: Bottom image capturing element
63:透明片63: transparent sheet
631:標準刻度631: standard scale
Claims (9)
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