TW202301957A - Liquid-cooled radiator - Google Patents

Abstract

A liquid-cooled radiator includes a substrate, a cover and a barrier structure. The substrate includes a plate body, a set of first heat dissipation fins and a set of second heat dissipation fins. The set of first heat dissipation fins and the set of second heat dissipation fins protrude from the same side of the plate body. The cover has an inlet and an outlet. The cover is stacked on the plate body, and the cover and the plate body jointly surround the set of first heat dissipation fins and the set of second heat dissipation fins to form a heat exchange chamber. The barrier structure is located between the set of first heat dissipation fins and the set of second heat dissipation fins and divides the heat exchange chamber into a water inlet chamber and a water outlet chamber. The water inlet chamber is connected to the inlet. The water outlet chamber is connected to the outlet. The set of first heat dissipation fins are in the water inlet chamber. The set of second heat dissipation fins are in the water outlet chamber.

Description

Liquid Cooled Radiator

The invention relates to a radiator, in particular to a liquid-cooled radiator.

In a computer system, the central processing unit of the main board, the north bridge chip, the south bridge chip and the graphics chip are all integrated circuit (IC) chips, and the IC chip is the largest heat source when the computer processes calculations. In order to quickly remove the heat energy generated by the IC chip on the main board during high-speed operation, the water cooling system uses a cold plate to directly contact the back of the IC chip, and uses the cooling liquid flowing through the cold plate to take away the waste heat to make the waste heat Conducted to the water cooling row through the circulating water circuit.

However, with the development and progress of science and technology, the heat generated by the operation of IC chips increases accordingly. The heat dissipation capacity of the current water cooling system is no longer sufficient to meet the heat dissipation requirements of IC chips. Therefore, how to further improve the heat dissipation capability of the water cooling system has become a major design issue.

The present invention provides a liquid-cooled heat sink to improve the heat dissipation capacity of the water-cooled heat dissipation system.

A liquid-cooled radiator disclosed in an embodiment of the present invention includes a substrate, a cover and a barrier structure. The substrate includes a plate body, a set of first heat dissipation fins and a set of second heat dissipation fins. The set of first heat dissipation fins and the set of second heat dissipation fins protrude from the same side of the board body. The cover has a water inlet and a water outlet. The cover is stacked on the plate, and the cover and the plate together surround the set of first heat dissipation fins and the set of second heat dissipation fins and jointly form a heat exchange chamber. The blocking structure is located between the group of first cooling fins and the group of second cooling fins, and separates the heat exchange chamber into a water inlet chamber and a water outlet chamber. The water inlet chamber communicates with the water inlet. The water outlet chamber communicates with the water outlet. The group of first cooling fins is located in the water inlet chamber. The group of second cooling fins is located in the water outlet chamber.

According to the liquid-cooled radiator of the above-mentioned embodiment, due to the obstruction of the barrier structure, the cooling fluid will converge after passing through the first heat dissipation fin and the second heat dissipation fin and flow out from the water outlet, so the first heat dissipation fin and the second heat dissipation fin The barrier structure provided in the middle of the fins not only strengthens the overall structural strength of the liquid-cooled radiator. At the same time, the flow direction of the cooling fluid is changed and the heat exchange area between the cooling fluid and the liquid-cooled radiator is increased, thereby improving the heat exchange efficiency between the cooling fluid and the liquid-cooled radiator, and further reducing the temperature of the heat source.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic perspective view of a liquid-cooled radiator 10 according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 .

The liquid-cooled radiator 10 of this embodiment is in thermal contact with a heat source (not shown), for example. The heat source is, for example, a CPU or an image processor. The liquid-cooled heat sink 10 includes a substrate 100 , a cover 200 and a barrier structure 300 .

The substrate 100 is made of thermally conductive material such as metal, and includes a plate body 110 , a set of first heat dissipation fins 120 and a set of second heat dissipation fins 130 . The plate body 110 is used for thermal contact with a heat source. The set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 protrude from the same side of the board body 110 and maintain a gap G therein. The cover 200 has a water inlet 210 and a water outlet 220 . The cover 200 is stacked on the board 110 , and the cover 200 and the board 110 together surround the set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 to form a heat exchange chamber S together. The blocking structure 300 is located between the set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 , and divides the heat exchange chamber S into a water inlet chamber S1 and a water outlet chamber S2 . The water inlet chamber S1 communicates with the water inlet 210 . The water outlet chamber S2 communicates with the water outlet 220 . The set of first cooling fins 120 is located in the water inlet chamber S1. The group of second cooling fins 130 is located in the water outlet chamber S2.

One side of the set of first heat dissipation fins 120 , the set of second heat dissipation fins 130 , and the isolation structure 300 forms a first transmission channel T1 with the cover body 200 . The first transmission channel T1 communicates with the water inlet chamber S1 and the water outlet chamber S2. The opposite sides of the set of first heat dissipation fins 120 , the set of second heat dissipation fins 130 , and the barrier structure 300 and the cover 200 each form a second transmission channel T2 . The second transmission channel T2 communicates with the water inlet chamber S1 and the water outlet chamber S2.

In this embodiment and other embodiments, the set of first fins 120 includes two sets of first fins 121 , 122 . The two first fin groups 121 and 122 are separated to form a water inlet channel Ci between the two first fin groups 121 and 122 . The first transmission channel T1 communicates with the water inlet channel Ci and the water outlet chamber S2. The set of second cooling fins 130 includes two second fin sets 131 , 132 . The two second fin sets 131 and 132 are separated to form a water outlet channel Co between the two second fin sets 131 and 132 . The first transmission channel T1 communicates with the water inlet channel Ci and the water outlet channel Co.

In this embodiment and other embodiments, the set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 are manufactured through a chipping process to increase the number of first heat dissipation fins 120 and second heat dissipation fins The arrangement density of the fins in 130 further increases the heat dissipation capability of the liquid-cooled radiator 10 .

In this embodiment and other embodiments, one side of the barrier structure 300 is integrally connected to the cover body 200 , and the other side is bonded to the plate body 110 , so as to enhance the structural strength of the liquid-cooled heat sink 10 . However, the connection method of the barrier structure 300 is not intended to limit the present invention, and the barrier structure 300 in other embodiments can also be connected to the plate body 110 and the cover body 200 at opposite sides. Alternatively, the barrier structure 300 may only be connected to the cover body 200 and not connected to the board body 110 .

In this embodiment and other embodiments, the liquid-cooled radiator 10 may further include a fixing member 400 . The fixing member 400 is assembled on the body 110 of the substrate 100 and has multiple assembly structures. These assembly structures include a plurality of first assembly holes 410 and a plurality of second assembly holes 420 . The positions of these first assembly holes 410 and these second assembly holes 420 are at least partly different, and are used to assemble with different two objects respectively, such as the platform that can be assembled with the INTEL central processor or the AMD central processor. platform.

In this embodiment and other embodiments, the liquid-cooled heat sink 10 may further include a plurality of combining parts 500 . These coupling parts 500 are like screws, and are determined to pass through the first assembly hole 410 or the second assembly hole 420 according to the assembly object. For example, if the fixing part 400 is to be installed on a platform matched with an INTEL CPU, the combining parts 500 can pass through the first assembly holes 410 respectively. If the fixing part 400 is to be installed on a platform matched with an AMD CPU, the connecting parts 500 can pass through the second assembly holes 420 respectively.

In this embodiment and other embodiments, the liquid-cooled radiator 10 may further include a water inlet nozzle 510 and a water outlet nozzle 520 . The water inlet nozzle 510 and the water outlet nozzle 520 are installed on the water inlet 210 and the water outlet 220 of the cover body 200 respectively, so as to connect the flow pipe through the water inlet nozzle 510 and the water outlet nozzle 520 .

In this embodiment, the water inlet chamber S1 and the water outlet chamber S2 communicate with the second transmission channel T2 through the first transmission channel T1 , but the present invention is not limited thereto. In other embodiments, the water inlet chamber and the water outlet chamber may communicate only through the first transmission channel or only through the second transmission channel.

In this embodiment, the set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 are manufactured through a chipping process, but the present invention is not limited thereto. In other embodiments, the set of first heat dissipation fins and the set of second heat dissipation fins can also be made by aluminum extrusion process.

See Figure 3. FIG. 3 is a schematic diagram of fluid flow in the liquid-cooled radiator 10 of FIG. 1 .

First, the cooling fluid flows into the water inlet channel Ci of the water chamber S1 through the water inlet 210 of the cover 200 along the direction A. Next, the cooling fluid flows through the gaps of the two first fin sets 121 , 122 of the first heat dissipation fin 120 along the directions B1 , B2 respectively, and flows into the first transmission channel T1 and the second transmission channel T2 of the water chamber S1 . Then, the cooling fluid flows from the first transmission channel T1 and the second transmission channel T2 of the water inlet chamber S1 to the first transmission channel T1 and the second transmission channel T2 of the water outlet chamber S2 along directions C1 and C2 respectively. Next, the cooling fluid flows through the gaps of the second fin sets 131 and 132 of the second heat dissipation fins 130 along directions D1 and D2 respectively and flows into the water outlet channel Co of the water chamber S2 . Then, the cooling fluid flows out from the water outlet chamber S2 along the direction E through the water outlet 220 of the cover 200 .

Due to the obstruction of the barrier structure 300, the cooling fluid will converge after passing through the first heat dissipation fin 120 and the second heat dissipation fin 130 and flow out from the water outlet 220, so the middle of the first heat dissipation fin 120 and the second heat dissipation fin 130 The barrier structure 300 not only strengthens the overall structural strength of the liquid-cooled radiator 10 . At the same time, the flow direction of the cooling fluid is changed and the heat exchange area between the cooling fluid and the liquid-cooled radiator 10 is increased, thereby improving the heat exchange efficiency between the cooling fluid and the liquid-cooled radiator 10 and further reducing the temperature of the heat source.

According to the liquid-cooled radiator of the above-mentioned embodiment, due to the obstruction of the barrier structure, the cooling fluid will converge after passing through the first heat dissipation fin and the second heat dissipation fin and flow out from the water outlet, so the first heat dissipation fin and the second heat dissipation fin The barrier structure provided in the middle of the fins not only strengthens the overall structural strength of the liquid-cooled radiator. At the same time, the flow direction of the cooling fluid is changed and the heat exchange area between the cooling fluid and the liquid-cooled radiator is increased, thereby improving the heat exchange efficiency between the cooling fluid and the liquid-cooled radiator, and further reducing the temperature of the heat source.

Moreover, the fixing part has a plurality of first assembly holes and a plurality of second assembly holes. The positions of these first assembly holes and these second assembly holes are at least partly different, and are used to assemble with two different objects respectively, such as the platform that can be selected to be assembled on the platform matched with the INTEL central processor or the platform matched with the AMD central processor . In order to realize the demand that a single liquid-cooled radiator can share multiple platforms, so as to increase the total production quantity of products and reduce production costs.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10: Liquid-cooled radiator 100: Substrate 110: board body 120: the first cooling fin 121, 122: the first fin group 130: the second cooling fin 131, 132: the second fin group 200: cover body 210: water inlet 220: water outlet 300: barrier structure 400:Fixer 410: The first assembly hole 420: The second assembly hole 500: Combination 510: water inlet nozzle 520: water spout S: heat exchange chamber S1: Water entry chamber S2: outlet chamber Ci: water inlet channel Co: outlet channel T1: the first transmission channel T2: the second transmission channel G: Gap A, B1, B2, C1, C2, D1, D2, E: direction

FIG. 1 is a schematic perspective view of a liquid-cooled radiator according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 . FIG. 3 is a schematic diagram of fluid flow in the liquid-cooled radiator of FIG. 1 .

100: Substrate

110: board body

120: the first cooling fin

121, 122: the first fin group

130: the second cooling fin

131, 132: the second fin group

200: cover body

210: water inlet

220: water outlet

300: barrier structure

Ci: water inlet channel

Co: outlet channel

T1: the first transmission channel

T2: the second transmission channel

A, B1, B2, C1, C2, D1, D2, E: direction

Claims (10)

A liquid-cooled radiator comprising: A substrate, including a plate body, a set of first heat dissipation fins and a set of second heat dissipation fins, the set of first heat dissipation fins and the set of second heat dissipation fins protrude from the same side of the plate body; The cover has a water inlet and a water outlet, the cover is stacked on the plate, and the cover and the plate together surround the set of first cooling fins and the set of second cooling fins And jointly form a heat exchange chamber; and a barrier structure, located between the group of first heat dissipation fins and the group of second heat dissipation fins, and separate the heat exchange chamber into a water inlet chamber and a water outlet chamber , the water inlet chamber communicates with the water inlet, the water outlet chamber communicates with the water outlet, the group of first cooling fins is located in the water inlet chamber, and the group of second cooling fins is located in the water outlet chamber. The liquid-cooled radiator as described in Claim 1, wherein one side of the set of first heat dissipation fins, the set of second heat dissipation fins, and the barrier structure and the cover form a first transmission channel, the first heat dissipation fin A transmission channel connects the water inlet chamber and the water outlet chamber. The liquid-cooled radiator as described in claim 2, wherein the group of first fins includes two first fin groups, and the two first fin groups are separated to form a gap between the two first fin groups. The water inlet channel, the first transmission channel communicates with the water inlet channel and the water outlet chamber. The liquid-cooled radiator as described in claim 3, wherein the group of second fins includes two second fin groups, and the two second fin groups are separated to form a gap between the two second fin groups. The water outlet channel, the first transmission channel communicates with the water inlet channel and the water outlet channel. The liquid-cooled radiator as described in Claim 1, wherein the set of first heat dissipation fins, the set of second heat dissipation fins, and the opposite sides of the barrier structure form a second transmission channel with the cover body, the The second transmission channel communicates with the water inlet chamber and the water outlet chamber. The liquid-cooled radiator according to claim 1, wherein one side of the barrier structure is integrally connected to the cover body, and the other side is joined to the plate body. The liquid-cooled radiator as claimed in claim 1, wherein opposite sides of the blocking structure are respectively bonded to the plate body and the cover body. The liquid-cooled heat sink as described in claim 1, wherein the set of first heat dissipation fins and the set of second heat dissipation fins are manufactured through a chipping process. The liquid-cooled heat sink as described in Claim 1 further comprises a fixing piece, the fixing piece is assembled on the board body of the substrate, and has a plurality of assembly structures, and these assembly structures are used to communicate with another through a combination piece A group of objects. The liquid-cooled radiator as claimed in claim 9, wherein the assembly structures include a plurality of first assembly holes and a plurality of second assembly holes, and the positions of the first assembly holes and the second assembly holes are at least partially are different, and are used to assemble with two different objects respectively.

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