TW202300816A - Laser light source packaging structure - Google Patents

Abstract

The invention is suitable for the technical field of laser wafer packaging, and particularly relates to a laser light source packaging structure which comprises at least one laser wafer, a base, a substrate, a plurality of line bodies, a lens and at least one prism reflector. The base is provided with an inner cavity structure, a laser wafer is attached to the bottom face of the inner cavity structure, and the base is further provided with a plurality of open holes. A conductive circuit is arranged on the substrate, a plurality of contact pads are arranged on the top surface of the substrate, a plurality of bonding pads are arranged on the bottom surface of the substrate, the contact pads are electrically connected with the bonding pads through the conductive circuit, and the contact pads are aligned with the open holes; the line bodies are made of metal materials, are connected with the electrical contacts of the laser wafer, penetrate through the corresponding open holes and are connected with the corresponding contact pads; the lens is arranged on the base and suitable for light beams to penetrate through; and the prism reflector is arranged on the bottom face of the inner cavity structure and used for reflecting the light beams emitted by the laser wafer to the lens. The technical problems that in the prior art, manufacturing cost is high, production efficiency is low, the original size is large, and the heat dissipation effect is poor are solved.

Description

Laser light source packaging structure

The invention relates to the technical field of laser chip packaging, and more specifically relates to a laser light source packaging structure.

Laser light source has the advantages of concentrated beam, high brightness, pure light color, high energy density, etc. It is widely used in optical disc drive, scanner, medical treatment, optical communication, stage lighting and other fields. At present, the laser light source on the market is mainly TO CAN (Transistor-Outline Can) package. This package structure has high manufacturing cost, low production efficiency, large original size, and poor heat dissipation effect. This kind of solder leg type will gradually be eliminated. .

The object of the present invention is to provide a laser light source packaging structure, which aims to solve the technical problems of high manufacturing cost, low production efficiency, large original volume and poor heat dissipation effect in the prior art.

In order to achieve the above object, the technical solution adopted by the present invention is to provide a laser light source packaging structure, including: at least one laser chip; the base is made of metal and has an inner cavity structure, and the laser chip is pasted on the bottom surface of the inner cavity structure. The base is also provided with a plurality of openings, and the openings run through the bottom surface of the inner cavity structure and the bottom surface of the base; the substrate is made of non-metallic material and is provided with conductive lines, and a plurality of contact pads are arranged on the top surface of the substrate. There are a plurality of pads on the bottom surface of the substrate, the contact pads are electrically connected to the pads through conductive lines, the top surface of the substrate is connected to the bottom surface of the base through a heat-conducting material, and the contact pads are aligned with the openings; a plurality of wires , is made of metal, the wire body is connected to the electrical contact of the laser chip, passes through the corresponding opening and connects to the corresponding contact pad; the lens is arranged on the base and the light beam emitted by the laser chip is suitable for passing through the lens; and At least one pleated reflector is arranged on the bottom surface of the inner cavity structure, and the pleated reflector is used for reflecting the light beam emitted by the laser chip to the lens.

In one embodiment, the material of the base is copper.

In one embodiment, the substrate is made of ceramics.

In one of the embodiments, the number of laser chips and the number of reflectors are multiple, and the plurality of laser chips are arranged in a circular form with the center of the bottom surface of the cavity structure as the center, and the plurality of reflectors and the plurality of The laser chips are arranged in one-to-one correspondence, and the reflector is closer to the center of the bottom surface of the inner cavity structure than the corresponding laser chip.

In one embodiment, the light emitting direction of the laser chip is toward the center of the bottom surface of the inner cavity structure, and a plurality of reflectors are arranged in a circular form with the center of the bottom surface of the inner cavity structure as the center.

In one embodiment, the packaging structure of the laser light source further includes a fluorescent sheet, the fluorescent sheet is attached to the lens, and the light beam emitted by the laser chip passes through the fluorescent sheet and the lens sequentially after being reflected by the sapphire reflector.

In one embodiment, the fluorescent sheet is located at the center of the lens, and the area of the fluorescent sheet matches the area enclosed by a plurality of circular reflectors.

In one embodiment, the lens is one or more of a convex lens, a concave lens, a textured lens, and a Fresnel lens.

In one embodiment, the top surface of the substrate is connected to the bottom surface of the base through solder.

In one of the embodiments, the peripheral wall of the inner cavity structure is stepped, and the lens is assembled on the stepped peripheral wall.

The beneficial effect of the packaging structure of the laser light source provided by the present invention is that compared with the prior art, the TO CAN packaging structure in the prior art includes a cap, a wafer, a gold wire, a pole pin, a base, etc., and the manufacturing cost of this packaging structure is high. The production efficiency is low, and the original volume is large, but the laser light source of the present invention is installed in the base through the patch process, the production cost is low, the production efficiency is high, and the base plate, the reflector and the lens are arranged together, which simplifies the structure. The thermal conductivity is greatly improved and the heat dissipation effect is improved by soldering with the substrate.

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. "Plural" means one or more than one, unless otherwise specifically defined.

In describing the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", " The orientation or positional relationship indicated by "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" etc. is based on the orientation or positional relationship shown in the drawing, and is for convenience only The present invention is described and simplified descriptions do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection, or integral connection; it may be mechanical connection or electrical connection; it may be direct connection or indirect connection through an intermediary, and it may be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

Please refer to FIG. 1 , the present invention provides a specific embodiment of a laser light source packaging structure. In this embodiment, the laser light source packaging structure includes at least one laser chip 2, a base 1, a substrate 4, a plurality of wire bodies 5, Lens 6 and at least one tinted reflector 7.

Among them, the base 1 has an inner cavity structure, and the inner cavity structure is to form a stable environment. The laser chip 2 is arranged in the inner cavity structure through a patch process, that is, it is arranged on the bottom surface of the inner cavity structure, and the base 1 is made of metal. Material, at least one laser chip 2 is pasted on the bottom surface of the inner cavity structure, and the base 1 is also provided with a plurality of openings 10, and the openings 10 run through the bottom surface of the inner cavity structure and the bottom surface of the base 1.

Wherein, the substrate 4 is made of non-metallic material and is provided with conductive circuits. The top surface of the substrate 4 is provided with a plurality of contact pads 9. As shown in FIG. 3 is used for welding with an external circuit board to form an electrical connection; the contact pad 9 is electrically connected to the pad 3 through a conductive line, the top surface of the substrate 4 is connected to the bottom surface of the base 1 through a heat-conducting material, and the contact pad 9 is connected to the opening Hole 10 aligned.

The base 1 is soldered to the substrate 4 through a heat-conducting material, such as solder paste, to reduce intermediate thermal resistance, conduct heat quickly, and effectively accelerate heat transfer. The contact pads 9 are used to connect the laser chip 2 into the circuit, wherein a plurality of wires 5 are made of metal, such as gold wires, and the wires 5 are connected to the electrical contacts of the laser chip 2 and pass through the corresponding openings 10 And connect corresponding contact pad 9, laser chip 2 is connected in the circuit like this. Since the base 1 is made of metal, wires cannot be laid on it, so the laser chip 2 on the base 1 is connected to the contact pads 9 on the non-metallic substrate 4 by passing the wire 5 through the opening 10. , ensuring high heat dissipation efficiency and avoiding electrical short circuit.

The lens 6 is arranged on the base 1. Specifically, it can be used to cover the inner cavity structure. The light beam emitted by the laser chip 2 passes through the lens 6 to obtain the required light shape. The function of the lens 6 is to adjust the light. Specifically, it can be a convex lens, Concave lens, textured lens, Fresnel lens, etc. Different lenses have different dimming effects.

The function of the reflector 7 is that it reflects the light beam emitted by the corresponding laser chip 2 to the lens 6, specifically to change the light path, and it is also arranged in the inner cavity structure of the base 1. On the bottom surface of the bottom surface, its setting position requires that the light beam emitted by the laser chip 2 can hit the corresponding reflective surface to realize reflection towards the lens 6 direction.

The laser chip 2 of this embodiment is arranged on the base 1 through the SMT process, the production cost is low, and the production efficiency is high, and the base plate 4, the reflector 7 and the lens 6 are arranged together, which simplifies the structure. The paste is welded with the substrate 4, which greatly improves the thermal conductivity and improves the heat dissipation effect.

In this embodiment, a preferred embodiment of the base 1 is provided. The material of the base 1 can be metal, preferably red copper. Red copper has excellent thermal conductivity, ductility and corrosion resistance, and red copper also has good weldability. , so the copper can be well welded to the substrate 4 .

In this embodiment, a preferred embodiment of the substrate 4 is provided. The material of the substrate 4 is non-metal, preferably ceramics, on which and in which wires are suitable for laying. Ceramics have good heat conduction and heat dissipation properties. The maximum thermal conductivity of the ceramic substrate 4 is 240 W/mk. The base 1 made of copper and the ceramic substrate 4 are welded together, which also effectively accelerates heat transfer.

Please refer to Fig. 1, in the present embodiment, the quantity of the laser chip 2 and the quantity of the reflector 7 are all multiple, specifically can be 2, 3, 4, 5, 6 etc., specifically according to You need to choose, and you can also choose to use red, blue or green laser chips 2 according to your needs. Different laser chips 2 emit different light colors. When using red laser chips, blue laser chips or green laser chips, Without using the fluorescent sheet 8, red light, blue light or green light can be obtained, and by analogy, the fluorescent sheet 8 can be used according to actual needs.

A plurality of laser chips 2 are arranged in a circular form with the center of the bottom surface of the inner cavity structure as the center of a circle, and a plurality of laser reflectors 7 are arranged in one-to-one correspondence with a plurality of laser chips 2, and the laser reflectors 7 are closer to the inner surface than the corresponding laser chips 2. The center of the bottom surface of the cavity structure, so as to ensure that the light emitted by the multiple laser chips 2 is concentrated on the middle position of the lens 6 to emit light after being reflected by the multiple scalloped reflectors 7 .

The number of laser chips 2 in this embodiment can be selected as one or more, so that it is convenient to select according to needs and meet the product requirements of different powers. The light emitting direction can be directed towards the center of the bottom surface of the inner cavity structure at the same time, and the corresponding reflector 7 can then reflect the light beam in the same direction, so that all the light beams emitted by the laser chip 2 can be emitted from the middle position of the lens 6 The light is emitted to get a concentrated light effect, the light is concentrated in the middle, and the secondary optical design in the cavity can effectively and accurately control the light path, and can achieve an ultra-narrow emission angle.

Specifically, referring to FIG. 4, in one of the specific embodiments, the number of optional laser chips 2 is three, and the three laser chips 2 are respectively attached to the bottom surface of the inner cavity structure of the base 1 in a circular shape. The positive and negative poles of the three laser chips 2 are connected to a plurality of contact pads 9 through a plurality of wires 5, so that the laser chips 2 are connected to the circuit, and the beams emitted by multiple laser chips 2 are directed toward the center of the circumference at the same time , the light beam is reflected to the lens 6 through the corresponding reflector 7, and through the lens 6, the lens 6 has an optical design to obtain the required light output.

In one of the embodiments, the light emitting direction of the laser chip 2 is toward the center of the bottom surface of the inner cavity structure, and a plurality of reflectors 7 are arranged in a circular form with the center of the bottom surface of the inner cavity structure as the center, which can effectively and accurately control the optical path , can achieve ultra-narrow emission angle.

Specifically, 3 laser chips 2 and 3 sapphire reflectors 7 can be designed to be distributed one-to-one uniformly and equally spaced with respect to the form of the circumference, so that 3 light beams with emission directions towards the center of the circumference can be obtained, which are directed to the lens 6 The middle position is also uniformly distributed with respect to the center of the lens 6, so that the outgoing light of the three beams passing through the lens 6 will be concentrated and uniform, so as to obtain the desired beam effect. When the number of laser chips 2 is other When it comes to quantity, the principle is the same, but it can also be adapted according to needs.

Preferably, when the number of laser chips 2 is multiple, it is preferable to use the same number of pleated reflectors 7 as the number of laser chips 2, and the pleated reflectors 7 and the laser chips 2 are arranged in one-to-one correspondence.

In this preferred embodiment mode, the 稜鏡 reflector 7 and the laser chip 2 are arranged in a one-to-one correspondence, and the 稜叡 reflector 7 is arranged in a circular form with the center of the bottom surface of the inner cavity structure as the center of the circle, realizing the independence of each light beam. , so that the light beams emitted by each laser chip 2 can be reflected by a single sapphire reflector 7 without interference with each other, and it is reliably ensured that the light beams propagate along a predetermined trajectory.

Specifically, please refer to Fig. 3 and Fig. 4, the reflector 7 has an inclined reflective surface, which can reflect the light beam at 90 degrees, and reflect it to the lens 6. Since the laser chips 2 are arranged along the circumference, Therefore, the corresponding pleated reflectors 7 are also arranged in a circular form, and the reflection surface of each pleated reflector 7 faces the corresponding laser chip 2 .

In this embodiment, the pleated reflector 7 can be fixedly connected or detachably connected to the bottom surface of the inner cavity structure of the base 1, in order to realize that multiple laser chips 2 and multiple pleated reflectors 7 are arranged in a circular form , Positioning piles can be set on the bottom surface of the inner cavity structure of the base 1, and the positions of the laser wafer 2 and the laser reflector 7 can be positioned through the positioning piles as a reference.

As shown in Figures 1 and 3, the packaging structure of the laser light source also includes a fluorescent sheet 8, which is attached to the lens 6, and the light beam emitted by the laser chip 2 passes through the fluorescent light in sequence after being reflected by the reflector 7. Sheet 8 and lens 6.

In this embodiment, the fluorescent sheet 8 can be set when needed, specifically the fluorescent sheet 8 can change the light color, when using the blue laser chip 2, the corresponding fluorescent sheet 8 can be used to obtain white light, red light, or green light.

In this embodiment, the light beam emitted by the blue laser chip 2 strikes the reflective surface of the reflector 7, and the reflected light becomes white light after passing through the fluorescent sheet 8, and then enters the lens 6 with an optical design, and finally the light that comes out will be able to meet the needs. This packaging structure can directly emit white light, and can also quickly take away the heat of the laser chip 2, and a secondary optical design is made in the inner cavity structure, which is a brand new application.

In one of the embodiments, the fluorescent sheet 8 can be bonded on the bottom surface of the lens 6 through glue, facing the scalloped reflector 7, the fluorescent sheet 8 is located at the center of the lens 6, and the area of the fluorescent sheet 8 matches ( equal to or slightly greater than) the area surrounded by a plurality of 稜鏡 reflectors 7 arranged in the form of a circle, so that the reflection range of the 稜鏡 reflector 7 can be completely within the area range of the fluorescent sheet 8, and the fluorescent sheet The size of 8 is also minimized to avoid waste caused by oversize.

Regarding the form of the lens 6, in the present embodiment, the lens 6 can be one or more of a convex lens, a concave lens, a textured lens, and a Fresnel lens. The light adjustment can be realized through the lens 6. The material of the lens 6 can be glass, and the lens 6 is A single lens 6 can also be a combination of multiple single lenses 6, or even multiple lenses 6, etc., and each lens 6 emits a light beam.

Further, as shown in Figure 1, the surrounding wall of the inner cavity structure is stepped, and the lens 6 also has a stepped structure adapted to it. The lens 6 is assembled on the stepped surrounding wall, and the two are connected together through snap-fitting to realize Effective assembly.

In summary, the beneficial effects of the present invention are as follows: 1. The number of laser chips 2 can be changed according to actual needs to meet product requirements of different powers without enlarging the volume of the packaging structure of the laser light source; 2. Thermoelectric separation, conductive circuit Arranged on a non-metallic substrate 4, the substrate 4 is not electrically connected to the base 1; 3. The heat conduction is rapid, and the base 1 is connected to the substrate 4 through a heat-conducting material to effectively reduce thermal resistance; 4. When the phosphor is included At 8 o'clock, the colored light emitted by the laser chip becomes white light after passing through the fluorescent sheet 8, and there is no need to do another light color conversion outside the encapsulation structure of the laser light source; 5. When the fluorescent sheet 8 is not included, the colored light emitted by the laser chip The light can be emitted directly to reduce loss; 6. The light is concentrated in the middle of the packaging structure of the laser light source, and the secondary optical design in the inner cavity structure can effectively and accurately control the optical path to achieve an ultra-narrow emission angle; 7. The substrate of the packaging structure of the laser light source A plurality of pads 3 are arranged on the bottom surface of 4, which greatly improves the production efficiency and reduces the manufacturing cost compared with the traditional TO package.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.

1: Base 2:Laser chip 3:Pad 4: Substrate 5: line body 6: Lens 7: 稜鏡 reflector 8: fluorescent film 9: Contact pad 10: Hole opening

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings that need to be used in the embodiments or descriptions of the prior art. Obviously, the drawings in the following descriptions are only some of the present invention. Embodiments, for those with ordinary knowledge in the art, other drawings can also be obtained based on these drawings on the premise of not paying creative work. FIG. 1 is an exploded schematic diagram of a packaging structure of a laser light source provided by an embodiment of the present invention; Fig. 2 is a schematic bottom view of the substrate disposed at the bottom of the base; Fig. 3 is a schematic cross-sectional view of the packaging structure of the laser light source provided by the embodiment of the present invention; Fig. 4 is a schematic top view of the internal structure of the base of the laser light source packaging structure provided by the embodiment of the present invention.

1: Base

2:Laser chip

4: Substrate

5: line body

6: Lens

7: 稜鏡 reflector

8: fluorescent film

9: Contact pad

10: Hole opening

Claims (10)

A laser light source packaging structure, including: at least one laser chip; A base is made of metal and has an inner cavity structure. The laser chip is pasted on the bottom surface of the inner cavity structure. The base is also provided with a plurality of openings. the bottom surface and the bottom surface of the base; A substrate is made of non-metallic material and is provided with a conductive circuit. The top surface of the substrate is provided with a plurality of contact pads, and the bottom surface of the substrate is provided with a plurality of pads. The plurality of contact pads are respectively connected through the conductive circuit. electrically connected to the plurality of pads, the top surface of the substrate is connected to the bottom surface of the base through a heat-conducting material, and the plurality of contact pads are respectively aligned with the plurality of openings; A plurality of wires are made of metal, and each of the plurality of wires is connected to the electrical contacts of the laser chip, passes through the corresponding openings, and connects to the corresponding contact pads; A lens is arranged on the base and the light beam emitted by the laser chip is adapted to pass through the lens; and At least one pleated reflector is arranged on the bottom surface of the inner cavity structure, and the pleated reflector is used for reflecting the light beam emitted by the laser chip to the lens. The packaging structure of the laser light source as claimed in item 1, wherein the material of the base is copper. The packaging structure of the laser light source as claimed in item 2, wherein the substrate is made of ceramics. The packaging structure of the laser light source as claimed in claim 1, wherein the number of the at least one laser chip and the number of the at least one laser reflector are multiple, and the plurality of laser chips are based on the bottom surface of the cavity structure The center is the center of the circle and arranged in the form of a circle, the plurality of reflectors are arranged in one-to-one correspondence with the plurality of laser chips, and the reflectors are closer to the center of the bottom surface of the inner cavity structure than the corresponding laser chips. The packaging structure of the laser light source as claimed in item 4, wherein the light emitting direction of the laser chip is towards the center of the bottom surface of the inner cavity structure, and the plurality of reflectors are centered on the center of the bottom surface of the inner cavity structure Arranged in the form of a circle for the center of the circle. The laser light source packaging structure as described in any one of claim 1 to claim 5, wherein the laser light source packaging structure further includes a fluorescent sheet, the fluorescent sheet is attached to the lens, and the laser chip emits The light beam passes through the fluorescent sheet and the lens sequentially after being reflected by the sapphire reflector. The packaging structure of the laser light source as claimed in claim 6, wherein the fluorescent sheet is located at the center of the lens, and the area of the fluorescent sheet matches the area enclosed by the plurality of circular reflectors. The laser light source package structure according to any one of claim 1 to claim 5, wherein the lens is one or more of a convex lens, a concave lens, a textured lens, and a Fresnel lens. The laser light source package structure as claimed in claim 1, wherein the top surface of the substrate is connected to the bottom surface of the base through solder. The packaging structure of the laser light source as claimed in Claim 9, wherein the surrounding wall of the cavity structure is stepped, and the lens is assembled on the stepped surrounding wall.

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