CN218783349U - Light source device - Google Patents

Abstract

The application discloses light source device, wherein, light source device includes: the base is electrically insulating and thermally conductive, a pad is arranged on the first surface of the base, and a dam is formed at the edge of the first surface; the light emitting chip is arranged on the bonding pad and used for emitting a first light beam with a divergence angle; the light guide element is used for changing the traveling direction of the first light beam and changing the first light beam into a convergent light beam to be emitted to the cover body; the cover body with light transmission is connected with the box dam and is matched with the base to form an accommodating space for accommodating the light-emitting chip and the light guide element. The beneficial effect of this application is: the light-emitting chip is packaged by using the accommodating space generated by the base, the dam and the cover body, so that the production cost is reduced, and the structure is simplified; in addition, light is condensed by the light guide element, so that the area of a light spot on the cover body is reduced, the central brightness of emergent illumination light is improved, and the color temperature uniformity is improved.

Description

Light source device

Technical Field

The utility model relates to a light source technical field especially relates to a light source device.

Background

At present, two major directions in the field of illumination are light emitting diode illumination and laser fluorescence illumination.

Laser fluorescent lighting has the advantages of high brightness and great distance, as compared to led lighting, but also has the disadvantage of high cost. The existing laser fluorescence lighting technology adopts a coaxial packaging scheme or a scheme of an aluminum nitride + copper base, the two schemes have complicated structures, and the production cost is high. In addition, the existing light source device still has low photopolymerization degree inside and large light spots.

SUMMERY OF THE UTILITY MODEL

The technical problem that this application mainly solved provides a light source device, has solved light source device structure complicacy, high in production cost and improve the central luminance of emergent illumination light and increase the colour temperature homogeneity.

In order to solve the above problem, the present application provides a light source device including: the base is electrically insulating and thermally conductive, a pad is arranged on the first surface of the base, and a dam is formed at the edge of the first surface; the light emitting chip is arranged on the bonding pad and used for emitting a first light beam with a divergence angle; a light guide element for changing the traveling direction of the first light beam and changing the first light beam to be emitted to the cover as a converging light beam; the cover body with light transmission is connected with the box dam and is matched with the base to form an accommodating space for accommodating the light-emitting chip and the light guide element.

Wherein the light directing element comprises a hemispherical lens disposed on the first surface of the base.

The light source device further comprises a wavelength conversion element for converting at least part of the first light beam into a second light beam with different wavelength ranges, and the wavelength conversion element is arranged on at least one of the outer side surface, the inner side surface and the inner part of the cover body.

The plane part of the hemispherical lens and the surface of the ceramic base are arranged at an angle of 45 degrees, and the spherical part of the hemispherical lens faces the light-emitting chip.

The base is provided with a first conducting layer on the first surface, a conducting through hole is formed in the position, corresponding to the first conducting layer, of the base, a second conducting layer is formed on the second surface, opposite to the first surface, of the base, the second conducting layer is electrically connected with the first conducting layer through the conducting through hole, and a wiring terminal of the light-emitting chip is connected with the first conducting layer.

The first conducting layers are arranged on the two sides of the bonding pad at intervals, and the second conducting layers are also arranged on the two sides of the bonding pad at intervals and correspond to the first conducting layers.

And the second surface of the base is also provided with a heat dissipation layer which is arranged at an interval with the second metal layers, is positioned between the two second metal layers and corresponds to the bonding pad.

Wherein, be formed with the sealing weld layer on the lid is connected with the box dam one side surface, the sealing weld layer links to each other with the box dam to the gap between sealing box dam and the lid.

The heat conduction layer is arranged on the surface of at least one side of the cover body and is positioned in the area where the cover body does not pass through the first light beam.

The light source device also comprises a diffusion sheet arranged between the cover body and the hemispherical lens.

The beneficial effect of this application is: the light-emitting chip is packaged by using the accommodating space generated by the base with electrical insulation and thermal conductivity, the box dam and the cover body, so that the production cost is reduced, and the structure is simplified; in addition, light is condensed by the light guide element, so that the area of a light spot on the cover body is reduced, the central brightness of emergent illumination light is improved, and the color temperature uniformity is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a light source device according to an embodiment of the present disclosure;

FIG. 2 is a schematic cross-sectional view of the light source device shown in FIG. 1;

FIG. 3 is a schematic diagram of a first surface of a base of the light source device in FIG. 1;

FIG. 4 is a schematic diagram of a second surface of the base of the light source device in FIG. 1;

fig. 5 is a schematic cross-sectional view of a cover of the light source device in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" typically includes at least two, but does not exclude the presence of at least one.

It should be understood that the term "and/or" as used herein is merely a relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B, may represent: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.

It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

It should be noted that if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of an embodiment of a light source device according to the present application; fig. 2 is a schematic cross-sectional view of the light source device in fig. 1. As shown in fig. 1 and 2, the light source device includes a base 11, a light emitting chip 12, a light guiding element 13, and a cover 141.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a first surface of a base of the light source device in fig. 1. The base 11 is an electrically insulating and thermally conductive base 11, and has a pad 111 and a first metal layer 113 provided on a first surface thereof, and a dam 112 formed on an edge of the first surface. The first metal layer 113 is a strip shape as a whole, and may be modified according to practical situations, such as a portion with a larger width, or an edge with an arc shape, and the like, which is not limited herein. Similarly, the shape of the pad 111 may be defined as needed, and may be rectangular, circular, elliptical, etc., without being limited to a square. Preferably, the base 11 is a ceramic base; in other embodiments, other electrically insulating and thermally conductive bases such as resin bases may be used. The base 11 is provided with a conductive through hole 114 at a position corresponding to the first metal layer 113, and the conductive through hole 114 may be formed by drilling a through hole on the base 11 and then electroplating or filling copper into the through hole. Referring to fig. 4, fig. 4 is a schematic structural diagram of a second surface of the base of the light source device in fig. 1. A second metal layer 115 is formed on a second surface of the base 11 opposite to the first surface, and the second metal layer 115 is disposed at the conductive via 114 to be electrically connected to the first metal layer 113 through the conductive via 114. The light emitting chip 12 is disposed on the bonding pad 111, and the leads of the light emitting chip 12 are connected to the first metal layer 113, and the light emitting chip 12 is electrically connected to the second metal layer 115 through the conductive vias 114. The light emitting chip 12 is for emitting a first light beam having a divergence angle. Thus, the light emitting chip 12 may be connected to an external power source through the second metal layer 115. The pad 111 is a metal layer, which has no connection with the first metal layer 113, and since the base 11 is an insulator, there is no electrical connection between the pad 111 and other structures. The light emitting chip 12 is preferably soldered on the pad 111. Since the light emitting chip 12 has two sets of leads, two first metal layers 113 are disposed at two sides of the bonding pad 111 at intervals, and two second metal layers 115 are also disposed corresponding to the first metal layers 113 in order to correspond to the two sets of leads of the light emitting chip 12. In order to enhance the heat dissipation effect of the light emitting chip 12, a heat dissipation metal layer 116 is further disposed on the second surface of the base 11. The heat dissipation metal layer 116 is disposed at an interval with the second metal layers 115, and is located between the two second metal layers 115, and is disposed corresponding to the pad 111. Since the heat dissipation metal layer 116 is disposed corresponding to the bonding pad 111, that is, the heat dissipation metal layer 116 corresponds to the position of the light emitting chip 12, the heat generated by the light emitting chip 12 is transmitted to the heat dissipation metal layer 116 through the base 11, and the heat dissipation is further accelerated by the heat dissipation metal layer 116. The base 11 may be made of an aluminum nitride ceramic sheet, and a laser drilling method may be used to drill the through holes.

The dam 112 is a metal dam or other dam with good heat dissipation performance, preferably a copper dam formed by electroplating on the first surface of the base 11. The dam 112 may have the same shape as the base 11, extend along the edge of the base 11, or adjust the shape of the opening on the side away from the base 11 according to the requirement, for example, the opening on the side away from the base 11 of the dam 112 is circular, oval, rectangular, triangular or other polygonal shape. In this way, the shape of the light emitting surface of the light source device can be adjusted. In addition, in order to enhance the light effect, a light emitting layer may be further disposed on the inner side surface of the box dam 112, and specifically, a reflective coating may be coated or a reflective film may be laid. In addition, when the dam 112 is a copper dam, it may be formed by plating on the edge of the first surface of the base 11, so that the dam 112 and the base 11 may be regarded as an integral structure without forming a gap therebetween and without performing a sealing process. In addition, in order to smooth the surface of the box dam 112, a grinding process may be performed after the formation thereof. The surface of the copper box dam can be plated with nickel or gold or metalized films such as nickel, palladium gold, gold and the like. This not only increases the solderability of the dam 112, but also protects the copper blocks from oxidation. In addition, in the production process of the base 11, the whole plate can be processed instead of being manufactured separately, and the whole plate and the base are spaced at a fixed distance, so that the mounting processing in the following process is facilitated, and the production difficulty is reduced.

The light guiding element 13 is disposed on the first surface of the base 11, corresponding to the light emitting chip 12, and is configured to change the traveling direction of the first light beam and change the first light beam into a converging light beam to be emitted to the cover 141. In the present embodiment, the light directing element 13 comprises a hemispherical lens disposed on the first surface of the base; in other embodiments, the light directing element 13 may also comprise a concave mirror, a refractive mirror, or a combination of a reflective mirror and a converging lens, etc. Wherein, the plane part of the light guiding element 13 is arranged at 45 degrees with the surface of the base 11, and the spherical part of the light guiding element 13 is arranged towards the light emitting chip 12. In this arrangement, the light emitted from the light emitting chip 12 is collected and deflected by the spherical surface of the light guiding element 13 and totally reflected by the plane. As shown in the drawing, the first light flux emitted from the light emitting chip 12 is incident on the spherical portion of the light directing member 13 for the first time, then reduces its divergence angle, reaches the plane of the hemispherical lens, and is reflected to its spherical area at the planar portion, the spherical area converges the light flux, and then exits to a small partial area of the cover 141, thereby changing the first light flux to exit as a converged light flux to the cover 141. Therefore, a light spot having a small area is formed on the surface of the cover 141, which is a main light emitting point of the light source device. In addition, the main heating point of the cover 141 is the position of the light spot, which reduces the range of the light spot, i.e. the heating range.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a cover of the light source device in fig. 1. The cover 141 is a transparent cover 141, and is connected to the dam 112 and forms a receiving space for receiving the light emitting chip 12 and the light guiding element 13 in cooperation with the base 11. It should be noted that the cover 141 and the dam 112 need to be hermetically sealed, so that the accommodating space is a closed space. In this embodiment, the light source device further comprises a wavelength conversion element 142 for converting at least part of the first light beam into a second light beam having a different wavelength range. In some examples, the cover 141 is a sapphire sheet and the wavelength conversion element 142 is a phosphor layer. The sapphire sheet is a substance which is transparent and has a good heat dissipation effect, and can be used for well performing light transmission and heat dissipation. The wavelength conversion element 142 may be sintered on a surface of the cover 141 on a side away from the light emitting chip 12. In other examples, the cover 141 may be made of a material that is transparent or opaque, and a transparent region is disposed on the cover 141, for example, a light through hole formed on the cover 141 or a structure that the transparent region of the cover 141 is transparent, for example, a sapphire sheet, but a transparent structure, for example, a sapphire sheet, may also be disposed in the light through hole, and in these examples, the wavelength conversion element 142 is disposed at the transparent region of the cover 141, specifically, at least one of a side of the light incident region of the cover 141 facing the accommodating space, a side of the light incident region facing away from the accommodating space, and an inside of the transparent region. In other embodiments, the wavelength conversion element may be another element, and is disposed on at least one of the outer side surface, the inner side surface, and the inner portion of the cover 141. Wherein, a sealing welding layer 143 is formed on one side surface of the cover body 141 connected with the box dam 112, the sealing welding layer 143 is connected with the box dam 112, and seals a gap between the box dam 112 and the cover body 141. Since the cover 141 is not easily connected and sealed when directly connected to the box dam 112, the cover 141 can be connected and sealed to the box dam 112 by plating the sealing weld layer 143 thereon, and can be connected by welding, bonding, or the like. In order to enhance the heat dissipation effect, a heat conduction layer is disposed on a surface of the cover 141 away from the light emitting chip 12, and the heat conduction layer is located in a region where the cover 141 does not pass through the first light beam. That is, the cover 141 may include a light emitting region and a non-light emitting region, and the heat conductive layer is disposed on the non-light emitting region. The light-emitting area can be the light spot area, or the light spot area and the area with higher brightness around the light spot area; the non-light-emitting region may be a region corresponding to the dam 112, or a region corresponding to the dam 112 and a region around the dam 112 with lower brightness. With such a structure, the outer surface of the cover 141 can also dissipate heat, thereby enhancing the heat dissipation effect of the light source device.

In other embodiments, the cover 141 may be replaced by other transmissive lenses, and the wavelength conversion element 142 may be phosphor or other photoluminescent material. In addition, if a blue light source is required, the wavelength conversion element 142 may be omitted, and the sapphire sheet cover 141 may be used as it is.

In other embodiments, a diffusion sheet may be further disposed on a surface of the cover 141 facing or away from the light emitting chip 12. When the diffusion sheet is disposed on the surface of the cover 141 away from the light emitting chip 12, light passing through the cover 141 can be better diffused, thereby forming a better illumination effect. Preferably, the diffusion sheet is provided between the cover 141 and the hemispherical lens, and can control the spot shape and power density of light incident on the cover 141, thereby adjusting the heat generation of the cover 141. The diffusion sheet can be a sheet, can also be a hemispherical or fan-shaped bulge, and can also be provided with a plurality of bulge structures arranged in an array. In some embodiments, a diffusion sheet is located on the optical path between the light directing element 13 and the wavelength converting element 142, the first light beam emitted through the light directing element 13 is changed into a converging light beam, and the focal point of the converging light beam is located on the wavelength converting element 142, for example, the wavelength converting element 142 may be a phosphor sheet, a fluorescent glass, or the like having a structure of a fluorescent material, and when the first light beam is focused on the wavelength converting element 142, a local heat accumulation is easily generated to cause a deterioration of the wavelength converting element 142, and for this reason, the diffusion sheet is added on the optical path between the light directing element 13 and the wavelength converting element 142 to appropriately increase the size of the spot of the first light beam incident on the wavelength converting element 142, thereby reducing the optical power density of the first light beam and reducing the local heat accumulation of the wavelength converting element 142.

In a preferred embodiment, the light emitting chip 12 is a blue laser chip with a wavelength of 450 nm. Use soldering tin or nanometer silver to glue with laser instrument chip and paste 11 insides of base, be convenient for lead away the heat that laser instrument chip produced fast, avoid influencing laser instrument chip's photoelectric conversion efficiency. If the nano silver adhesive is used, an automatic chip mounter can be used for whole-board pasting, and the production efficiency can be greatly improved. Similarly, the fixing mode of the light guide element 13 may be glue or nano silver glue, so that a chip mounter may be used to perform full-page operation, thereby improving production efficiency.

When in use, the positive electrode and the negative electrode of the external power supply are respectively connected with the two second metal layers 115, and power is supplied to the light-emitting chip 12 through the conductive through hole 114 and the first metal layer 113. After the light emitting chip 12 emits light, part of the light is directly incident to the cover 141, and part of the light is incident to a small area of the cover 141 after being converged by the light guiding element 13. The cover 141 converts the light into blue light, and the wavelength conversion element 142 on the surface converts the blue light into white light or other colors of light. The heat of the light emitting chip 12 is conducted away through the base 11, and the heat generated when the wavelength conversion element 142 absorbs blue light is conducted to the dam 112 through the cover 141, and is dissipated through the dam 112. Since the dam 112 is directly disposed on the base 11, a sealing structure is formed between the dam and the base 11, and only the cover 14 and the dam 112 need to be sealed. Therefore, the light source device of the present application has a simple structure, only the cover 141 and the dam 112 need to be sealed during packaging, and the base 11 has a low cost, so that the production process and the cost can be reduced. On one hand, the traveling direction of the first light beam emitted by the light guide element 13 in the horizontal direction is changed to be upward, and the first light beam is emitted through the cover body 142 with light transmittance, so that the horizontal and vertical spaces in the accommodating space are reasonably utilized, the whole volume is reduced, on the other hand, the first light beam emitted originally and having a divergence angle is changed into a convergent light beam to be incident on the wavelength conversion element 142, so that the first light beam incident on the wavelength conversion element 142 is concentrated in a small-size light spot range, the central brightness of the second light beam emitted after conversion is improved, and the color temperature uniformity is improved.

The beneficial effect of this application is: the light-emitting chip is packaged by using the accommodating space generated by the ceramic base, the dam and the cover body, so that the production cost is reduced, and the structure is simplified; in addition, the light traveling direction is changed and the light is condensed through the hemispherical lens, so that the space is reasonably utilized, the central brightness of the illumination light is improved, and the color temperature uniformity is improved.

The above embodiments are merely examples, and not intended to limit the scope of the present application, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present application, or those directly or indirectly applied to other related arts, are included in the scope of the present application.

Claims (10)

1. A light source device, characterized in that the light source device comprises:

the packaging structure comprises a base with electric insulation and heat conductivity, wherein a bonding pad is arranged on a first surface of the base, and a box dam is formed at the edge of the first surface;

the light emitting chip is arranged on the bonding pad and used for emitting a first light beam with a divergence angle;

the light guide element is used for changing the traveling direction of the first light beam and changing the first light beam into a convergent light beam to be emitted to the cover body;

the cover body with light transmission is connected with the dam and matched with the base to form an accommodating space for accommodating the light-emitting chip and the light guide element.

2. The light source device of claim 1, wherein the light directing element comprises a hemispherical lens disposed on the first surface of the base.

3. The light source device according to claim 1, further comprising a wavelength conversion element configured to convert at least part of the first light beam into a second light beam having a different wavelength range, wherein the wavelength conversion element is disposed on at least one of an outer side surface, an inner side surface, and an inner portion of the cover.

4. The light source device of claim 2, wherein the planar portion of the hemispherical lens is disposed at an angle of 45 degrees to the surface of the base, and the spherical portion of the hemispherical lens is disposed toward the light emitting chip.

5. The light source device according to any one of claims 1 to 4, wherein a first conductive layer is further disposed on the first surface of the base, a conductive through hole is disposed at a position of the base corresponding to the first conductive layer, a second conductive layer is formed on a second surface of the base opposite to the first surface, the second conductive layer is electrically connected to the first conductive layer through the conductive through hole, and the connection terminal of the light emitting chip is connected to the first conductive layer.

6. The light source device according to claim 5, wherein two first conductive layers are provided and spaced apart from each other on both sides of the pad, and two second conductive layers are also provided and correspond to the first conductive layers.

7. The light source device according to claim 6, wherein a heat dissipation metal layer and a second metal layer are further disposed on the second surface of the base, spaced apart from the second metal layer, and disposed between the two second metal layers and corresponding to the bonding pads.

8. The light source device according to claim 1, wherein a seal-welding layer is formed on a surface of the cover body on a side to which the dam is connected, the seal-welding layer being connected to the dam and sealing a gap between the dam and the cover body.

9. The light source device according to claim 8, wherein a heat conductive layer is disposed on at least one side surface of the cover, and the heat conductive layer is located in a region where the cover does not pass through the first light beam.

10. The light source device according to claim 2, further comprising a diffusion sheet provided between the cover and the hemispherical lens.

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