TW202243559A - 金屬基材基板 - Google Patents

金屬基材基板 Download PDF

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Publication number
TW202243559A
TW202243559A TW111100034A TW111100034A TW202243559A TW 202243559 A TW202243559 A TW 202243559A TW 111100034 A TW111100034 A TW 111100034A TW 111100034 A TW111100034 A TW 111100034A TW 202243559 A TW202243559 A TW 202243559A
Authority
TW
Taiwan
Prior art keywords
insulating layer
formula
substrate
metal
thickness
Prior art date
Application number
TW111100034A
Other languages
English (en)
Chinese (zh)
Inventor
石川史朗
Original Assignee
日商三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱綜合材料股份有限公司 filed Critical 日商三菱綜合材料股份有限公司
Publication of TW202243559A publication Critical patent/TW202243559A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
TW111100034A 2021-01-05 2022-01-03 金屬基材基板 TW202243559A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021000329A JP2022105790A (ja) 2021-01-05 2021-01-05 金属ベース基板
JP2021-000329 2021-01-05

Publications (1)

Publication Number Publication Date
TW202243559A true TW202243559A (zh) 2022-11-01

Family

ID=82357986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111100034A TW202243559A (zh) 2021-01-05 2022-01-03 金屬基材基板

Country Status (3)

Country Link
JP (1) JP2022105790A (fr)
TW (1) TW202243559A (fr)
WO (1) WO2022149558A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132112B2 (ja) * 1996-11-11 2008-08-13 独立行政法人科学技術振興機構 アクチュエータ機能をもつ積層複合材料とその使用方法
JP2008218596A (ja) * 2007-03-02 2008-09-18 Denki Kagaku Kogyo Kk 金属ベース回路基板及びその製造方法
JP2015043417A (ja) * 2013-07-26 2015-03-05 大日本印刷株式会社 パワーモジュール用金属配線基板、パワーモジュール及びパワーモジュール用基板、並びにパワーモジュール用金属配線基板の製造方法
JP6377035B2 (ja) * 2015-11-09 2018-08-22 三菱電機株式会社 加熱剥離型粘着シート及び部品の製造方法

Also Published As

Publication number Publication date
WO2022149558A1 (fr) 2022-07-14
JP2022105790A (ja) 2022-07-15

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