TW202243288A - Display module and display apparatus including the same - Google Patents

Abstract

A display module includes: a circuit substrate, a plurality of light-emitting elements, a shielding layer, a package layer and an optical film. The plurality of light-emitting elements are disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding layer is disposed among the plurality of light-emitting elements on the circuit substrate. The package layer is disposed on the plurality of light-emitting elements and the shielding layer. The optical film is disposed on the package layer. Further, a display apparatus including the display module is also provided.

Description

Display module and display device including same

The present invention relates to a display module, and in particular to a display device including the above display module.

The miniature light-emitting diode display device directly uses the micro-light-emitting diode chip as a light-emitting unit, and achieves the effect of full-surface display by packaging the light-emitting unit on a circuit substrate. Because the reflectivity of the surface of the miniature light-emitting diode chip and its surrounding circuit substrate is different, in order to present a good picture quality, the micro-light-emitting diode chip is usually packaged with a dark-colored encapsulant, and a dark color is coated on the circuit substrate. Ink is used to reduce the reflectivity, so as to prevent the reflected light generated when external light enters the display device from affecting the picture quality of the display device.

However, when viewing the display device at a close distance, it can still be observed that the surface of the chip and the surrounding encapsulant or ink have uneven colors due to the difference in reflectivity, and even a grid-like pattern appears on the display surface.

The invention provides a display module with good image quality.

The invention provides a display device with good image quality.

An embodiment of the present invention proposes a display module, including: a circuit substrate; a plurality of light-emitting elements located on the circuit substrate and electrically connected to the circuit substrate; a light-shielding layer located on the circuit substrate and located between the plurality of light-emitting elements the encapsulation layer is located on the plurality of light-emitting elements and the light-shielding layer; and the optical film is located on the encapsulation layer.

In an embodiment of the present invention, the above-mentioned light-emitting elements have a reflectivity R _c , the optical film has a transmittance T _p , and the light-shielding layer has a reflectivity R _i , and 0.001R _c <T _P ² R _i <0.212R _c .

In an embodiment of the present invention, 0.01<T _p <0.46.

In an embodiment of the present invention, 0.002<R _i <0.307.

In an embodiment of the present invention, the above-mentioned plurality of light emitting elements include red light emitting diodes, green light emitting diodes and blue light emitting diodes.

In an embodiment of the present invention, the above-mentioned encapsulation layer has a transmittance greater than 0.95.

In an embodiment of the present invention, the above-mentioned optical film includes a circular polarizer.

In an embodiment of the present invention, the above-mentioned display module further includes an anti-glare film, an anti-reflection film, a microstructure film, optical glue or a combination thereof.

In an embodiment of the present invention, the above-mentioned display module further includes a plurality of packaging circuit boards, respectively located between the plurality of light-emitting elements and the circuit substrate, and the plurality of packaging circuit boards are respectively electrically connected to the plurality of light-emitting elements and the circuit substrate.

In an embodiment of the present invention, the above-mentioned display module further includes a plurality of packaging pads respectively located on the plurality of packaging circuit boards, and the plurality of packaging pads are respectively electrically connected to the plurality of light emitting elements and the plurality of packaging circuit boards.

In an embodiment of the present invention, the above-mentioned display module further includes a protective layer, wherein the protective layer covers the plurality of packaging pads but does not cover the plurality of light-emitting elements.

In an embodiment of the present invention, the protective layer has a reflectivity R _s , and 0.002<R _s <0.307.

In an embodiment of the present invention, the above-mentioned light-shielding layer or protective layer has a thickness greater than or equal to 1 μm.

In an embodiment of the present invention, the above-mentioned light-shielding layer has a plurality of openings.

In an embodiment of the present invention, the above-mentioned light-shielding layer has a non-uniform reflectance distribution.

An embodiment of the present invention proposes a display device, comprising: a plurality of the above-mentioned display modules, wherein the plurality of display modules are arranged in a matrix.

In an embodiment of the present invention, the above-mentioned display module has central reflectivity and edge reflectivity, there is a first distance between the above-mentioned plurality of light-emitting elements, and there is a second distance between the plurality of display modules, when When the second distance is greater than the first distance, the edge reflectance is greater than the center reflectivity.

In an embodiment of the present invention, when the above-mentioned second distance is smaller than the first distance, the edge reflectivity is smaller than the central reflectivity.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

FIG. 1A is a schematic top view of a display module 100 according to an embodiment of the invention. Fig. 1B is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. In order to make the drawing more concise, FIG. 1A schematically shows the circuit substrate 110 , the light emitting element 120 and the light shielding layer 130 , and omits other components.

1A to 1B, the display module 100 includes: a circuit substrate 110; a plurality of light emitting elements 120 located on the circuit substrate 110 and electrically connected to the circuit substrate 110; a light-shielding layer 130 located on the circuit substrate 110, and Located between the plurality of light emitting elements 120 ; the encapsulation layer 140 is located on the plurality of light emitting elements 120 and the light shielding layer 130 ; and the optical film 150 is located on the encapsulation layer 140 .

In the display module 100 according to an embodiment of the present invention, by controlling the reflectivity of the light-shielding layer 130 , the display surface of the display module 100 can have an appearance of uniform color, thereby having good picture quality. Hereinafter, with reference to FIG. 1A to FIG. 1B , the implementation of each element of the display module 100 will be continuously described, but the present invention is not limited thereto.

Please refer to FIG. 1A to FIG. 1B at the same time, the display module 100 may include a plurality of sub-pixels PXs, and the plurality of sub-pixels PXs are arranged in an array. Each sub-pixel PXs is mainly composed of light emitting elements 120 . In some embodiments, the plurality of light-emitting elements 120 can all be blue light-emitting diodes, and the display module 100 can further include a color conversion layer (not shown) disposed on the plurality of light-emitting elements 120, wherein the color conversion The layer may include phosphor powder or similar wavelength conversion material, so that the blue light emitted by the blue light-emitting diode can be converted into light of different colors to achieve a full-color display effect. In other embodiments, the plurality of light-emitting elements 120 may include a plurality of red light-emitting diodes, a plurality of green light-emitting diodes, and a plurality of blue light-emitting diodes, so as to achieve a full-color display effect. When the emission colors of the plurality of light emitting elements 120 are different, the color conversion layer may not be required. In some other embodiments, the plurality of light emitting elements 120 may all be white light emitting diodes, and the color conversion layer may be a color filter layer to achieve a full-color display effect.

In this embodiment, the circuit substrate 110 may include a bottom plate 112 and a circuit layer 114 . The bottom plate 112 can be a transparent bottom plate or a non-transparent bottom plate, and its material can be quartz, glass, polymer or other suitable materials, but the present invention is not limited thereto. The circuit layer 114 may include a plurality of pads PA, PB, PC. Circuits or components required by the display module 100 can also be selectively arranged in the circuit layer 114, such as power lines, driving signal lines, timing signal lines, detection signal lines, current compensation lines, driving elements, switching elements, storage capacitors, etc. , and the above-mentioned lines or components can be electrically connected to the lines or components outside the circuit substrate 110 through the pads PA, PB, PC.

In this embodiment, the display module 100 may further include a driving element DC, and the driving element DC may be electrically connected to the sub-pixels PXs to transmit a signal to the light emitting element 120 . For example, in the sub-pixel PXs, the light emitting element 120 is electrically connected to the pad PA and the pad PB, and the driving element DC can be electrically connected to the pad PA and the pad in each sub-pixel PXs respectively. PB. In some embodiments, the pads PA in the plurality of sub-pixels PXs are separated from each other, and independently receive signals provided by the driving element DC. In some embodiments, the pads PB in the plurality of sub-pixels PXs may be electrically connected to each other and/or the same common voltage is applied to the pads PB during operation. In some embodiments, the driving element DC may be a chip bonded to the circuit substrate 110 or a circuit element (including an active element, a passive element or a combination thereof) directly formed in the circuit substrate 110 .

In this embodiment, the light-emitting element 120 may be fabricated on a growth substrate (such as a sapphire substrate), then transferred to the circuit substrate 110 through a mass transfer process, and electrically connected to the pads PA and PB. , therefore, the display module 100 may have a chip on board (COB) form. The light emitting element 120 may be a flip-chip light emitting diode, and the light emitting element 120 may be electrically connected to the corresponding pads PA and PB on the circuit substrate 110 through two electrodes located on the same side of the epitaxial structure. In some embodiments, the light emitting element 120 can also be a vertical light emitting diode, and the electrode on the side of the light emitting element 120 away from the circuit substrate 110 is electrically connected to the corresponding pad PA or pad PB on the circuit substrate 110 via a connecting wire. sexual connection. In some embodiments, other conductive materials or conductive adhesives, such as solder or anisotropic conductive adhesive (ACF), may be included between the light emitting element 120 and the pads PA and PB.

The light shielding layer 130 is located between the light emitting elements 120 , and the light shielding layer 130 can shield the surface of the circuit substrate 110 between the light emitting elements 120 . In this embodiment, the light-shielding layer 130 covers the surface of the circuit substrate 110 between the light-emitting elements 120 and exposes the light-emitting elements 120, so as to absorb the incident light incident on the circuit substrate 110 around the light-emitting element 120 to avoid reflection The light interferes with the light emitted by the light emitting element 120 . In addition, the light-shielding layer 130 can simultaneously cover the circuits on the circuit substrate 110 , such as the pads PA, PB, PC, so as to prevent the circuits on the circuit substrate 110 from being damaged or shorted. In some embodiments, due to differences in manufacturing processes, the light-shielding layer 130 may not cover the pads PA, PB, but the pads PA, PB are partially exposed from the light-shielding layer 130 . In some embodiments, the thickness of the light shielding layer 130 may be greater than or equal to 1 μm, such as 1 μm, 2 μm or 3 μm. The material of the light-shielding layer 130 may be ink or other suitable materials, and the present invention is not limited thereto.

The encapsulation layer 140 covers the light emitting element 120 and the light shielding layer 130 , and the encapsulation layer 140 is filled between the sidewalls of the light emitting element 120 . Further, the encapsulation layer 140 surrounds the sidewall of the light emitting element 120 to provide refraction or scattering for the light emitted by the light emitting element 120 . The encapsulation layer 140 can prevent moisture from entering, so as to maintain the performance and service life of the light emitting element 120 . In this embodiment, the encapsulation layer 140 may have a high transmittance, for example, the transmittance of the encapsulation layer 140 may be greater than 95%, but the invention is not limited thereto. The material of the encapsulation layer 140 may include transparent adhesive material, such as PUR adhesive, epoxy resin (epoxy), silicon adhesive, or other suitable adhesive materials, and the present invention is not limited thereto.

The optical film 150 is disposed on a side of the light emitting element 120 away from the circuit substrate 110 , and the encapsulation layer 140 is located between the optical film 150 and the light emitting element 120 . In this embodiment, the optical film 150 may include a circular polarizer, but the invention is not limited thereto. In some embodiments, the optical film 150 may also include a laminated structure of a linear polarizer and a 1/4 wave plate.

In some embodiments, the display module 100 may further include an optical glue 152 , and the optical film 150 is attached on the encapsulation layer 140 through the optical glue 152 . The material of the optical adhesive 152 includes optical clear adhesive (Optical Clear Adhesive, OCA), optical pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA), silicone adhesive, polyurethane reactive (Polyurethane reactive, PUR) adhesive, polyurethane (Polyurethane, PU ) glue, or other suitable optical grade glue. The optical glue 152 may be optically transparent glue with a higher penetration rate, and the penetration rate of the optical glue 152 may be greater than 90%, but not limited thereto.

In other embodiments, the display module 100 may also include an anti-reflection and anti-glare film 154. The anti-reflection and anti-glare film 154, for example, includes a plurality of surface microstructures and an anti-reflection film coated on these surface microstructures to adjust the display mode. The overall reflectance, anti-glare performance and surface smoothness of the group 100 under ambient light irradiation.

Please refer to FIG. 1B , in this embodiment, in order to make the incident light L1 incident on the light-emitting element 120 and the incident light L2 incident on the light shielding layer 130 have the same reflectivity, so that the entire surface of the display module 100 has a uniform color The display surface of the light-shielding layer 130 will be described below.

For the incident light L1 and the incident light L2, since the transmittance through the optical glue 152 and the anti-reflection and anti-glare film 154 will not be different due to whether the reflective surface of the light-emitting element 120 is a mirror surface or a non-mirror surface, and the optical The transmittance of the glue 152 and the anti-reflection and anti-glare film 154 have the same effect on the total reflectance. Therefore, when comparing the total reflectance, the influence of the transmittance of the optical glue 152 and the anti-reflection and anti-glare film 154 can not be estimated.

Therefore, in this embodiment, the incident light L1 can be described as first passing through the optical film 150 and the encapsulation layer 140, then reflected by the reflective surface of the light emitting element 120, and then passing through the encapsulation layer 140 and the optical film 150 again to leave the display. module 100, so the total reflectance R _T of the incident light L1 can be obtained as follows: R _T = T _P ² T _g ² R _c Equation (1),

Where T _p is the transmittance of the optical film 150 , T _g is the transmittance of the encapsulation layer 140 , and R _c is the reflectance of the light emitting element 120 .

In this embodiment, when the transmittance of the encapsulation layer 140 is greater than 98%, then: T _g ² ≒1 can be obtained.

Generally speaking, the transmittance T _p of the optical film 150 is about 0.46, but considering that the reflective properties of the reflective surface of the light-emitting element 120 can be between a specular surface and a non-specular surface (or a foggy surface), and if the incident light L1 passes through the optical When the circular polarizer of the film 150 is mirror-reflected and emitted through the optical film 150 again, the intensity of the reflected light will be extremely low. Therefore, for the incident light L1, it can be obtained: 0.001<T _P ² <(0.46) ² , That is, 0.001<T _P ² <0.212, which can be brought into formula (1) to get: 0.001R _c <R _T <0.212R _c formula (2).

In addition, in view of the fact that the reflectivity of a general display module is 6.5%, in order to improve it, the maximum reflectivity of the incident light L1 is limited to be less than 6.5%, and the reflectivity _Rc of the light-emitting element 120 is set to be greater than 0.5, which is brought into Formula (2) can be obtained: 0.0005<R _T <0.065 Formula (3).

Similarly, for the incident light L2, the incident light L2 can be described as passing through the optical film 150 and the encapsulation layer 140 first, then being reflected by the light shielding layer 130, and then passing through the encapsulation layer 140 and the optical film 150 again to leave the display module. Group 100. Therefore, the total reflectance R _U of the incident light L2 can be obtained as follows: R _U =T _P ² T _g ² R _i ,

Wherein R _i is the reflectance of the light shielding layer 130 .

Since the transmittance of the encapsulation layer 140 is greater than 98%, formula (4) can be obtained: R _U =T _P ² R _i .

In order to make the total reflectance R _U of the incident light L2 approximate to the total reflectance R _T of the incident light L1, that is, R _U has the same range as R _T , the formula (4) is brought into the formula (2) and formula (3) It can be obtained: 0.001R _c <T _P ² R _i <0.212R _c , and 0.0005<T _P ² R _i <0.065.

Since the surface of the light-shielding layer 130 is closer to the matte surface, for the incident light L2, T _P ² ≦0.212 can be obtained.

Therefore, it can be obtained that: 0.0005<0.212 R _i <0.065, so 0.002<R _i <0.307.

It can be known from the above derivation _process that in the display module ₁₀₀ of this _embodiment , the corresponding The reflectance R _i of the light shielding layer 130 ranges so that the incident light L2 and the incident light L1 have similar or the same total reflectance.

Referring to FIG. 1A , in some embodiments, the light-shielding layer 130 may also have a plurality of openings O1 , or partially use ink with high reflectivity to increase the local reflectivity. In some embodiments, the light-shielding layer 130 may also have a plurality of low-reflectivity ink patterns BD to locally lower the reflectivity of the light-shielding layer 130 . In some embodiments, the light-shielding layer 130 can be formed by using a variety of inks with different reflectivities, or locally using inks with different concentrations to adjust the reflectance distribution of the light-shielding layer 130 so that the light-shielding layer 130 has non-uniform reflectance. distributed. In this way, for example, when the light-emitting elements 120 are relatively close to each other to generate bright lines or relatively far away to generate dark lines according to design requirements, the reflectivity of the light-shielding layer 130 can be locally adjusted to make the display of the display module 100 The mask has an evenly colored appearance.

FIG. 2 is a schematic cross-sectional view of a display module 200 according to an embodiment of the invention. Compared with the display module 100 shown in FIG. 1 , the difference in the structure of the display module 200 shown in FIG. and then assembled on the circuit substrate 110 , therefore, the display module 200 may have a package on board (Package on board, POB) form.

Referring to FIG. 2 , in this embodiment, the encapsulation circuit board 160 is located between the light emitting element 120 and the circuit substrate 110 , and the encapsulation circuit board 160 is electrically connected to the light emitting element 120 and the circuit substrate 110 . For example, the packaging circuit board 160 may include a plurality of packaging pads PD, PE located on the packaging circuit board 160 , and the packaging pads PD, PE may be respectively electrically connected to two electrodes of the light emitting element 120 . On the other hand, the packaging pads PD and PE on the packaging circuit board 160 can be electrically connected to the pads PA and PB on the circuit substrate 110 respectively. In this way, the two electrodes of the light emitting element 120 can be electrically connected to the pads PA, PB on the circuit substrate 110 respectively through the packaging pads PD, PE on the packaging circuit board 160 .

In this embodiment, the display module 200 may further include a protective layer 170, the protective layer 170 may cover the surface of the packaging circuit board 160 not covered by the light-emitting element 120, and expose the light-emitting element 120, so that it can absorb the light incident on the light-emitting element All incident light on the circuit board 160 around the package 120 is used to prevent reflected light from interfering with the light emitted by the light emitting element 120 . In addition, the protection layer 170 can also protect the circuits on the packaging circuit board 160 , for example, the protection layer 170 can cover the packaging pads PD and PE to prevent the circuits on the packaging circuit board 160 from being damaged or shorted. In some embodiments, the thickness of the protection layer 170 may be greater than 1 μm, and the material of the protection layer 170 may be solder resist, ink or other suitable materials, but the invention is not limited thereto.

In this embodiment, after the light-emitting element 120 is arranged on the packaging circuit board 160, the protective layer 170 can be formed on the packaging circuit board 160, and then the light-emitting element 120 can be packaged with the packaging layer 140, and then the packaging circuit board 160 can be arranged on the packaging circuit board 160. On the circuit substrate 110 , a light-shielding layer 130 is then formed on the circuit substrate 110 . Therefore, the encapsulation layer 140 covers the light emitting element 120 and the protective layer 170 , and the encapsulation layer 140 does not cover the light shielding layer 130 . In some embodiments, the thickness of the protective layer may be greater than or equal to 1 μm, but not limited thereto.

Referring to FIG. 2 , in this embodiment, the incident light L1 is incident on the light emitting element 120 , the incident light L2 is incident on the light shielding layer 130 , and the incident light L3 is incident on the protection layer 170 . In order to make the incident light L2 incident on the light-shielding layer 130 and the incident light L3 incident on the protective layer 170 have the same reflectance as the incident light L1 incident on the light emitting element 120, so that the entire surface of the display module 200 presents a consistent color. , how to define the reflectance range of the light-shielding layer 130 and the protection layer 170 will be described below.

In this embodiment, the incident light L2 first passes through the optical film 150 , then is reflected by the light shielding layer 130 , and then passes through the optical film 150 again. Although the incident light L2 does not pass through the encapsulation layer 140 , since the transmittance of the encapsulation layer 140 can be close to 1, the range of reflectance of the light shielding layer 130 can be similar to the range obtained by the display module 100 of the foregoing embodiment.

In this embodiment, the incident light L3 can be described as first passing through the optical film 150 and the encapsulation layer 140 , then being reflected by the protective layer 170 , and then passing through the encapsulation layer 140 and the optical film 150 again to leave the display module 200 . Therefore, the total reflectance R _V of the incident light L3 can be obtained as follows: R _V =T _P ² T _g ² R _s ,

Wherein R _s is the reflectivity of the protective layer 170 .

Since the transmittance of the encapsulation layer 140 is greater than 98%, it can be obtained that:

R _V = T _P ² R _s formula (5).

In order to make the total reflectance R _V of the incident light L3 approximate to the total reflectance R _T of the incident light L1, that is, R _V has the same range as R _T , the formula (5) is brought into the formula (2) and formula (3) It can be obtained: 0.001R _c <T _P ² R _s <0.212R _c , and 0.0005<T _P ² R _s <0.065.

Since the surface of the protective layer 170 is closer to the matte surface, for the incident light L3, T _P ² ≦0.212 can be obtained.

Therefore, it can be concluded that: 0.0005<0.212 R _s <0.065, so 0.002<R _s <0.307.

It can be seen from the above derivation process that in the display module 200 of this embodiment, the light-shielding ratio can be obtained from the transmittance T _g of the encapsulation layer 140 , the transmittance T _p of the optical film 150 , and the reflectance R _c of the light emitting element 120 . The reflectivity R _i of the layer 130 and the reflectivity R _s of the protection layer 170 range such that the incident light L1 , the incident light L2 and the incident light L3 all have similar or the same total reflectivity.

In this embodiment, the light-shielding layer 130 and the protective layer 170 may also have multiple openings, or locally use ink patterns with high reflectivity, low reflectivity or different concentrations to locally adjust the light-shielding layer 130 and the protective layer. The reflectivity of 170 makes the light-shielding layer 130 and the protective layer 170 have a non-uniform reflectance distribution, and the reflectance of the light-shielding layer 130 and the protective layer 170 can be locally adjusted according to the demand, so that the display surface of the display module 200 has a color Uniform appearance, but can have good picture quality.

FIG. 3 is a schematic top view of a display device 10 according to an embodiment of the invention. The display device 10 may include a plurality of display modules 300, wherein the display module 300 may be the display module 100 or the display module 200 described in the above embodiments. A plurality of display modules 300 can be arranged in a matrix and spliced together to form the display device 10 .

In this embodiment, the display device 10 may include six display modules 300 , and the six display modules 300 are arranged in a matrix of 3×2 to be spliced. Each display module 300 includes a plurality of light emitting elements 120 , wherein there is a horizontal distance D1 and a vertical distance D3 between two adjacent light emitting elements 120 . The center of the display module 300 may have a central reflectance R _M , and the central reflectance R _M may be an average reflectance of the central area of the display module 300 . In addition, in the display device 10 , there may be a lateral distance D2 and a vertical distance D4 between two adjacent display modules 300 , and the edges of the display modules 300 may have an edge reflectivity R _N . In this embodiment, since the horizontal spacing D2 between the display modules 300 is greater than the horizontal spacing D1 between the light emitting elements 120, and the vertical spacing D4 between the display modules 300 is greater than the vertical spacing D3 between the light emitting elements 120, As a result, dark lines appear between the display modules 300 . Therefore, the opening O2 can be formed in the light-shielding layer 130 at the edge of the display module 300 to locally increase the edge reflectivity _RN of the display module 300, so that the edge reflectivity _RN of the display module 300 is greater than the center reflectivity _RM to eliminate dark lines between the display modules 300, so that the display device 10 has a good picture quality.

FIG. 4 is a schematic top view of a display device 20 according to an embodiment of the invention. The display device 20 may include a plurality of display modules 400, wherein the display module 400 may be the display module 100 or the display module 200 described in the above embodiments, and the plurality of display modules 400 are arranged in a matrix and spliced to form a display device 20.

Compared with the display device 10 shown in FIG. 3, the difference of the display device 20 shown in FIG. There is a vertical distance D4 and a horizontal distance D6 between the display modules 400 . Because the vertical distance D4 is greater than the vertical distance D3 , horizontal dark lines are generated between the display modules 400 , and because the horizontal distance D6 is smaller than the horizontal distance D5 , vertical bright lines are generated between the display modules 400 . Therefore, the opening O3 can be formed in the light-shielding layer 130 at the lateral edge of the display module 400 to locally increase the edge reflectance R _N1 of the display module 400, so that the edge reflectance R _N1 of the display module 400 is greater than the central reflectance R _M , so as to eliminate the horizontal dark lines between the display modules 400. At the same time, the low-reflectivity ink pattern BD can be partially used in the light-shielding layer 130 at the longitudinal edge of the display module 400 to locally reduce the edge reflectivity R _N2 of the display module 400, so that the edge reflectivity R _N2 of the display module 400 is smaller than the central reflectance R _M , thereby eliminating the vertical bright lines between the display modules 400 . In this way, the horizontal dark lines and vertical bright lines between the display modules 400 can be eliminated at the same time, so that the display device 20 can have a good picture quality.

To sum up, the display module of the present invention controls the reflectivity of the light-shielding layer so that the display surface of the display module can have an appearance of uniform color, thereby obtaining good picture quality. In addition, the display device of the present invention can eliminate dark lines or bright lines between display modules by adjusting the reflectivity of the light-shielding layer, thereby having good image quality.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10, 20: display device 100, 200, 300, 400: display module 110: circuit substrate 112: Bottom plate 114: circuit layer 120: Light emitting element 130: shading layer 140: encapsulation layer 150: Optical film 152: optical glue 154: Anti-reflection and anti-glare film 160: Packaging circuit board 170: protective layer A-A': hatching BD: low reflectivity ink pattern D1, D2, D5, D6: Horizontal spacing D3, D4: vertical spacing DC: drive element L1, L2, L3: incident light O1, O2, O3: opening PA, PB, PC: pad PD, PE: packaging pad PXs: sub-pixels

FIG. 1A is a schematic top view of a display module according to an embodiment of the invention. Fig. 1B is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. FIG. 2 is a schematic cross-sectional view of a display module according to an embodiment of the invention. FIG. 3 is a schematic top view of a display device according to an embodiment of the invention. FIG. 4 is a schematic top view of a display device according to an embodiment of the invention.

100: display module

110: circuit substrate

112: Bottom plate

114: circuit layer

120: Light emitting element

130: shading layer

140: encapsulation layer

150: Optical film

152: optical glue

154: Anti-reflection and anti-glare film

L1, L2: incident light

PA, PB, PC: Pads

Claims (18)

A display module, comprising: circuit substrate; a plurality of light-emitting elements located on the circuit substrate and electrically connected to the circuit substrate; a light-shielding layer located on the circuit substrate and between the plurality of light-emitting elements; an encapsulation layer located on the plurality of light emitting elements and the light shielding layer; and An optical film is located on the encapsulation layer. The display module according to claim 1, wherein the plurality of light emitting elements have a reflectivity R _c , the optical film has a transmittance T _p , the light-shielding layer has a reflectivity R _i , and 0.001R _c <T _P ² R _i &lt; 0.212 R _c . The display module as claimed in item 2, wherein 0.01<T _p <0.46. The display module as claimed in item 2, wherein 0.002<R _i <0.307. The display module as claimed in claim 1, wherein the plurality of light emitting elements include red light emitting diodes, green light emitting diodes and blue light emitting diodes. The display module according to claim 1, wherein the transmittance of the encapsulation layer is greater than 0.95. The display module according to claim 1, wherein the optical film includes a circular polarizer. The display module according to claim 1, further comprising an anti-glare film, an anti-reflection film, a microstructure film, optical glue or a combination thereof. The display module according to claim 1, further comprising a plurality of packaging circuit boards, respectively located between the plurality of light emitting elements and the circuit substrate, and the plurality of packaging circuit boards are respectively electrically connected to the multiple a light emitting element and the circuit substrate. The display module according to claim 9, further comprising a plurality of packaging pads respectively located on the plurality of packaging circuit boards, and the plurality of packaging pads are respectively electrically connected to the plurality of light-emitting elements and the plurality of packaging pads. packaged circuit board. The display module according to claim 10, further comprising a protective layer, wherein the protective layer covers the plurality of packaging pads but does not cover the plurality of light emitting elements. The display module according to claim 11, wherein the protective layer has a reflectivity R _s , and 0.002<R _s <0.307. The display module according to claim 11, wherein the thickness of the light-shielding layer or the protective layer is greater than or equal to 1 μm. The display module according to claim 1, wherein the light-shielding layer has a plurality of openings. The display module according to claim 1, wherein the light-shielding layer has a non-uniform reflectance distribution. A display device comprising: A plurality of display modules as described in Claim 1, wherein the plurality of display modules are arranged in a matrix. The display device according to claim 16, wherein the display module has central reflectivity and edge reflectivity, the plurality of light-emitting elements has a first distance, and the plurality of display modules has a first distance Two intervals, when the second interval is greater than the first interval, the edge reflectance is greater than the central reflectance. The display device according to claim 17, wherein when the second pitch is smaller than the first pitch, the edge reflectivity is smaller than the central reflectivity.

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