TW202240748A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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TW202240748A
TW202240748A TW111108900A TW111108900A TW202240748A TW 202240748 A TW202240748 A TW 202240748A TW 111108900 A TW111108900 A TW 111108900A TW 111108900 A TW111108900 A TW 111108900A TW 202240748 A TW202240748 A TW 202240748A
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堀田奈央
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日商斯庫林集團股份有限公司
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    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

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Abstract

This substrate processing apparatus comprises: a carrier holding unit that holds a carrier for accommodating a substrate or a dummy substrate; a first processing unit group including a plurality of first processing units that process the substrate and that perform processing using the dummy substrate; a second processing unit group including a plurality of second processing units that process the substrate and that perform processing using the dummy substrate; a first dummy substrate accommodation unit; a second dummy substrate accommodation unit; a substrate placement unit on which the substrate is placed; first to third conveyance units; and a controller that controls the first to third conveyance units. The first conveyance unit conveys the substrate between the first processing unit and the substrate placement unit, and conveys the dummy substrate between the first processing unit and the first dummy substrate accommodation unit. The second conveyance unit conveys the substrate between the second processing unit and the substrate placement unit, and conveys the dummy substrate between the second processing unit and the second dummy substrate accommodation unit. The third conveyance unit conveys the substrate between the carrier and the substrate placement unit. The controller executes dummy substrate transfer control to transfer the dummy substrate between the first dummy substrate accommodation unit and the second dummy substrate accommodation unit.

Description

基板處理裝置以及基板處理方法Substrate processing apparatus and substrate processing method

本申請案係主張2021年3月23日所申請的日本專利申請案JP2021-049171的優先權，將日本專利申請案JP2021-049171的全部的揭示內容援用於本申請案。This application claims priority to Japanese Patent Application JP2021-049171 filed on Mar. 23, 2021, and uses all the disclosures of Japanese Patent Application JP2021-049171 for this application.

本發明係有關於一種用以處理基板之裝置以及方法。成為處理的對象之基板係例如包括半導體晶圓、液晶顯示裝置以及有機EL(electroluminescence；電致發光)顯示裝置等之平面顯示器(FPD；Flat Panel Display)用基板、光碟用基板、磁碟用基板、光磁碟用基板、光罩(photomask)用基板、陶瓷基板、太陽電池用基板等。The invention relates to a device and method for processing a substrate. The substrates to be processed are, for example, semiconductor wafers, liquid crystal display devices, and organic EL (electroluminescence; electroluminescence) display devices, such as flat panel display (FPD) substrates, optical disk substrates, and magnetic disk substrates. , Substrates for optical magnetic disks, substrates for photomasks, ceramic substrates, substrates for solar cells, etc.

在半導體裝置的製造工序中，使用用以處理半導體晶圓般的基板之基板處理裝置。此種基板處理裝置的一例係揭示於專利文獻1。此種基板處理裝置係包含：承載器(carrier)保持部，係保持用以收容基板之承載器；複數個處理單元，係處理基板；搬運單元，係在承載器與處理單元之間搬運基板；以及控制單元。當處理單元的不使用持續時間到達預定時間時，控制裝置係對主機(host)裝置請求搬入保持著仿真基板(dummy substrate)的仿真承載器(dummy carrier)。當仿真承載器被搬入至承載器保持部時，搬運單元係將仿真基板從仿真承載器朝處理單元搬運。使用該仿真基板進行處理單元的洗淨。In the manufacturing process of a semiconductor device, a substrate processing apparatus for processing a substrate like a semiconductor wafer is used. An example of such a substrate processing apparatus is disclosed in Patent Document 1. Such a substrate processing device includes: a carrier (carrier) holding part, which holds a carrier for accommodating a substrate; a plurality of processing units, which process the substrate; and a transport unit, which transports the substrate between the carrier and the processing unit; and control unit. When the non-use duration of the processing unit reaches a predetermined time, the control device requests the host device to move in a dummy carrier holding a dummy substrate. When the dummy carrier is carried into the carrier holding part, the transfer unit transfers the dummy substrate from the dummy carrier to the processing unit. Cleaning of the process unit is performed using this dummy substrate.

搬運單元係包含索引機器人(indexer robot)以及主搬運機器人，並在索引機器人與主搬運機器人之間配置有傳遞單元。索引機器人係在承載器與傳遞單元之間搬運基板。主搬運機器人係在傳遞單元與處理單元之間搬運基板。 當仿真承載器載置於承載器保持部時，索引機器人係從仿真承載器取出仿真基板並搬運至傳遞單元。該仿真基板係被主搬運機器人從傳遞單元搬運至處理單元。當結束使用了仿真基板的單元洗淨處理時，主搬運機器人係將仿真基板從處理單元取出並搬運至傳遞單元。該仿真基板係被索引機器人從傳遞單元搬運至仿真承載器。當全部的仿真基板被收容至仿真承載器時，從承載器保持部搬出仿真承載器。 [先前技術文獻] [專利文獻] The transfer unit includes an indexer robot and a main transfer robot, and a transfer unit is arranged between the indexer robot and the main transfer robot. The indexing robot handles substrates between the carrier and the transfer unit. The main transfer robot transfers the substrates between the transfer unit and the processing unit. When the dummy carrier is placed on the carrier holding portion, the index robot takes out the dummy substrate from the dummy carrier and transports it to the transfer unit. The dummy substrate is transported from the transfer unit to the processing unit by the main transport robot. When the unit cleaning process using the dummy substrate is completed, the main transfer robot takes out the dummy substrate from the processing unit and transfers it to the transfer unit. The dummy substrate is transported from the transfer unit to the dummy carrier by an indexing robot. When all the dummy substrates are accommodated in the dummy carrier, the dummy carrier is taken out from the carrier holding portion. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2017-41506號公報。[Patent Document 1] Japanese Patent Laid-Open No. 2017-41506.

[發明所欲解決之課題][Problem to be Solved by the Invention]

如此，仿真基板係從基板處理裝置的外部被導入，通過與製品基板相同的路徑被搬入至處理單元，且從處理單元被搬出並被收容至仿真承載器。因此，為了仿真基板的搬運而使用索引機器人以及主搬運機器人雙方，並通過傳遞單元搬運仿真基板。如此，會與製品基板的搬運干擾從而製品基板的搬運效率變差，結果會妨礙生產性的提升。In this way, the dummy substrate is introduced from the outside of the substrate processing apparatus, carried into the processing unit through the same path as the product substrate, and carried out from the processing unit and stored in the dummy carrier. Therefore, both the index robot and the main transfer robot are used for conveyance of the dummy substrate, and the dummy substrate is conveyed by the transfer unit. This interferes with the conveyance of the product substrate, thereby degrading the conveyance efficiency of the product substrate, which hinders improvement in productivity as a result.

尤其，在以增加處理單元的數量且並行地處理多片製品基板之方式所構成的基板處理裝置中，索引機器人以及主搬運機器人的搬運負擔變大，索引機器人以及主搬運機器人的搬運負擔減輕是生產性提升的關鍵。 此外，仿真承載器被搬入至承載器保持部，仿真承載器會占有承載器保持部，直至仿真基板從仿真承載器朝處理單元被搬運並結束在處理單元中的處理後該仿真基板被收容至承載器為止。因此，由於仿真承載器持續占有承載器保持部，因此會有於製品基板的搬入產生待機時間之疑慮。因此，從此種觀點而言亦會妨礙生產性的提升。 因此，本發明的實施形態之一為提供一種基板處理裝置以及基板處理方法，係能減輕對於製品用的基板的搬運之影響，並能在處理單元內進行使用了仿真基板的處理。 [用以解決課題的手段] In particular, in a substrate processing apparatus configured to increase the number of processing units and process multiple product substrates in parallel, the transfer load of the index robot and the main transfer robot becomes larger, and the reduction of the transfer load of the index robot and the main transfer robot is The key to productivity improvement. In addition, the dummy carrier is carried into the carrier holding part, and the dummy carrier will occupy the carrier holding part until the dummy substrate is transported from the dummy carrier to the processing unit and the dummy substrate is stored in the processing unit after the processing in the processing unit is completed. up to the carrier. Therefore, since the dummy carrier continues to occupy the carrier holding portion, there may be a possibility of a standby time for carrying in a product substrate. Therefore, improvement of productivity is also hindered from such a viewpoint. Therefore, one embodiment of the present invention is to provide a substrate processing apparatus and a substrate processing method which can reduce the influence on the conveyance of substrates for products and can perform processing using a dummy substrate in a processing unit. [Means to solve the problem]

本發明的實施形態之一提供一種基板處理裝置，係包含：承載器保持部，係保持用以收容基板或者仿真基板之承載器；第一處理單元群，係具有複數個第一處理單元，複數個第一處理單元係處理基板且執行使用仿真基板的處理；第二處理單元群，係具有複數個第二處理單元，複數個第二處理單元係處理基板且執行使用仿真基板的處理；第一仿真基板收容部，係收容仿真基板；第二仿真基板收容部，係收容仿真基板；基板載置部，係供基板載置；第一搬運單元，係構成為能夠存取複數個前述第一處理單元、前述基板載置部以及前述第一仿真基板收容部，在複數個前述第一處理單元與前述基板載置部之間搬運基板，並在複數個前述第一處理單元與前述第一仿真基板收容部之間搬運仿真基板；第二搬運單元，係構成為能夠存取複數個前述第二處理單元、前述基板載置部以及前述第二仿真基板收容部，在複數個前述第二處理單元以及前述基板載置部之間搬運基板，並在複數個前述第二處理單元與前述第二仿真基板收容部之間搬運仿真基板；第三搬運單元，係構成為能夠存取被前述承載器保持部保持的承載器以及前述基板載置部，在被前述承載器保持部保持的承載器與前述基板載置部之間搬運基板；以及控制器，係控制前述第一搬運單元、前述第二搬運單元以及前述第三搬運單元，並執行仿真基板移送控制，前述仿真基板移送控制係用以在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。One of the embodiments of the present invention provides a substrate processing device, which includes: a carrier holding part, which holds a carrier for accommodating a substrate or a dummy substrate; a first processing unit group, which has a plurality of first processing units, a plurality of A first processing unit processes a substrate and performs processing using a dummy substrate; a second processing unit group has a plurality of second processing units, and the plurality of second processing units processes a substrate and performs processing using a dummy substrate; The dummy substrate storage part is for accommodating dummy substrates; the second dummy substrate storage part is for accommodating dummy substrates; the substrate loading part is for placing substrates; The unit, the substrate loading unit, and the first dummy substrate storage unit transport substrates between the plurality of first processing units and the substrate loading unit, and transfer substrates between the plurality of first processing units and the first dummy substrate The dummy substrates are transported between the storage parts; the second transfer unit is configured to be able to access a plurality of the aforementioned second processing units, the aforementioned substrate loading parts, and the aforementioned second dummy substrate storage parts, between the plurality of the aforementioned second processing units and The substrate is transported between the aforementioned substrate loading parts, and the dummy substrate is transported between the plurality of the second processing units and the second dummy substrate storage part; the third transport unit is configured to be able to access the carrier holding part the carrier held by the carrier holding unit and the substrate placing unit transport the substrate between the carrier held by the carrier holding unit and the substrate placing unit; and the controller controls the first transport unit and the second transport unit and the third transfer unit, and execute dummy substrate transfer control, wherein the dummy substrate transfer control is used to transfer the dummy substrate between the first dummy substrate storage part and the second dummy substrate storage part.

依據此種構成，由於在基板處理裝置內具備仿真基板收容部，因此在產生需要在處理單元中使用仿真基板時，無須第三搬運單元參與即能在仿真基板收容部與處理單元之間搬運仿真基板。 因此，由於能減輕第三搬運單元的搬運負擔，因此能減輕對於製品用的基板的搬運之影響，並能進行使用了仿真基板的處理。尤其，第三搬運單元的搬運負擔非常大，第三搬運單元係參與在分別具有複數個處理單元的第一處理單元群以及第二處理單元群與被承載器保持部保持的承載器之間的全部的基板的搬運。因此，藉由減輕第三搬運單元的搬運負擔，製品用的基板的搬運效率變佳，相應地能提升生產性。由於第一搬運單元以及第二搬運單元係分擔負責第一處理單元群以及第二處理單元群與基板載置部之間的基板的搬運，因此與第三搬運單元相比搬運負擔小。因此，從生產效率的觀點而言，第一搬運單元以及第二搬運單元負責仿真基板的搬運並不會成為大問題。 According to this configuration, since the dummy substrate storage section is provided in the substrate processing apparatus, when a dummy substrate needs to be used in the processing unit, the dummy substrate can be transferred between the dummy substrate storage section and the processing unit without the participation of the third transfer unit. substrate. Therefore, since the conveyance load of the third conveyance unit can be reduced, the influence on the conveyance of the substrate for a product can be reduced, and processing using a dummy substrate can be performed. In particular, the transport load of the third transport unit is very large, and the third transport unit participates in the transfer between the first processing unit group and the second processing unit group each having a plurality of processing units, and the carrier held by the carrier holding part. Transport of all substrates. Therefore, by reducing the conveying load of the third conveying unit, the conveying efficiency of the substrates for products can be improved, and productivity can be improved correspondingly. Since the first transport unit and the second transport unit share the responsibility of transporting the substrate between the first processing unit group and the second processing unit group and the substrate mounting unit, the transport load is smaller than that of the third transport unit. Therefore, from the viewpoint of production efficiency, it is not a big problem that the first transfer unit and the second transfer unit are responsible for transferring the dummy substrate.

此外，由於第一搬運單元以及第二搬運單元係能分別存取第一仿真基板收容部以及第二仿真基板收容部，因此仿真基板收容部與處理單元之間的仿真基板的搬運係無須經由基板載置部即能進行。因此，由於能減少仿真基板的搬運與製品用的基板的搬運之間的干擾，因此製品用的基板的搬運效率變好，相應地能提升生產性。In addition, since the first transfer unit and the second transfer unit can respectively access the first dummy substrate storage part and the second dummy substrate storage part, the transfer of the dummy substrate between the dummy substrate storage part and the processing unit does not need to pass through the substrate The loading part can be carried out. Therefore, since the interference between the conveyance of the dummy substrate and the conveyance of the substrate for the product can be reduced, the conveyance efficiency of the substrate for the product can be improved, and the productivity can be improved accordingly.

再者，在本實施形態中，第一搬運單元係在第一仿真基板收容部與第一處理單元群之間搬運仿真基板，第二搬運單元係在第二仿真基板收容部與第二處理單元群之間搬運仿真基板。藉此，由於能分散仿真基板的搬運負擔，因此能抑制製品用的基板的搬運與仿真基板的搬運之間的干擾，從而能提升基板的搬運效率。藉此，亦能提升生產性。Furthermore, in this embodiment, the first transport unit transports the dummy substrate between the first dummy substrate storage unit and the first processing unit group, and the second transport unit transports the dummy substrate between the second dummy substrate storage unit and the second processing unit group. Transport dummy boards between groups. Thereby, since the burden of conveying the dummy substrate can be distributed, the interference between the conveyance of the substrate for the product and the conveyance of the dummy substrate can be suppressed, and the efficiency of conveying the substrate can be improved. Thereby, productivity can also be improved.

再者，與專利文獻1的情形不同，承載器保持部亦不會被用以收容仿真基板的仿真承載器長時間地占有。藉此，由於能抑制於收容了製品用的基板之承載器的搬入產生待機時間，因此能有助於生產性的提升。 而且，在本實施形態中，能夠在第一仿真基板收容部與第二仿真基板收容部之間移送仿真基板。因此，由於能在第一處理單元群與第二處理單元群之間彼此調度仿真基板，因此能有效地活用被收容至第一基板收容部以及第二基板收容部的仿真基板。藉此，能減少將已經到達使用界限的仿真基板更換成新的仿真基板的次數。因此，能減少承載器保持部被用以收容仿真基板的仿真承載器占有的次數以及時間。藉此，能有助於生產性的提升。 Furthermore, unlike the case of Patent Document 1, the carrier holding portion is not occupied for a long time by the dummy carrier for accommodating the dummy substrate. Thereby, since it is possible to suppress the standby time for carrying in the carrier accommodating the substrates for products, it can contribute to improvement of productivity. Furthermore, in this embodiment, the dummy substrate can be transferred between the first dummy substrate storage unit and the second dummy substrate storage unit. Therefore, since the dummy substrates can be mutually dispatched between the first processing unit group and the second processing unit group, the dummy substrates stored in the first substrate accommodating portion and the second substrate accommodating portion can be effectively utilized. Thereby, it is possible to reduce the number of times of replacing a dummy board that has reached the usage limit with a new dummy board. Therefore, it is possible to reduce the number of times and time that the carrier holding portion is occupied by the dummy carrier for accommodating the dummy substrate. Thereby, it can contribute to improvement of productivity.

再者，無須等待從基板處理裝置的外部供給仿真基板，即能在處理單元中進行使用了已經導入至基板處理裝置內的仿真基板的處理。因此，由於能無窒礙地進行使用了仿真基板的處理，因此亦能謀求生產性的提升。 在本發明的實施形態之一中，第一搬運單元係構成為皆無法存取第二處理單元以及第二仿真基板收容部。此外，在本發明的實施形態之一中，第二搬運單元係構成為皆無法存取第一處理單元以及第一仿真基板收容部。 Furthermore, without waiting for the dummy substrate to be supplied from outside the substrate processing apparatus, processing using the dummy substrate already introduced into the substrate processing apparatus can be performed in the processing unit. Therefore, since the process using the dummy substrate can be performed without hindrance, productivity can also be improved. In one embodiment of the present invention, the first transport unit is configured such that neither the second processing unit nor the second dummy substrate storage section can be accessed. In addition, in one of the embodiments of the present invention, the second transport unit is configured such that neither the first processing unit nor the first dummy substrate storage section can be accessed.

在本發明的實施形態之一中，前述第三搬運單元係在被承載器保持部保持的承載器與前述基板載置部之間搬運仿真基板。此外，第一搬運單元係在複數個前述第一處理單元、前述基板載置部以及前述第一仿真基板收容部之間搬運仿真基板。此外，第二搬運單元係在複數個前述第二處理單元、前述基板載置部以及前述第二仿真基板收容部之間搬運仿真基板。藉此，能經由基板載置部，將未使用的仿真基板導入至第一仿真基板收容部以及第二仿真基板收容部，並將使用完畢的仿真基板從第一仿真基板收容部以及第二仿真基板收容部朝承載器排出。In one embodiment of the present invention, the third transport unit transports the dummy substrate between the carrier held by the carrier holding unit and the substrate placing unit. In addition, the first transport unit transports the dummy substrate between the plurality of first processing units, the substrate loading portion, and the first dummy substrate storage portion. In addition, the second transport unit transports the dummy substrate among the plurality of the second processing units, the substrate loading portion, and the second dummy substrate storage portion. Thereby, the unused dummy substrate can be introduced into the first dummy substrate storage part and the second dummy substrate storage part through the substrate loading part, and the used dummy substrate can be transferred from the first dummy substrate storage part and the second dummy substrate storage part. The substrate storage portion is discharged toward the carrier.

在本發明的實施形態之一中，前述控制器係當預定的仿真基板移送條件成立時執行前述仿真基板移送控制。藉由此種構成，由於能藉由設定適當的仿真基板移送條件而在第一仿真基板收容部與第二仿真基板收容部之間適當地移送仿真基板，因此能提高仿真基板的利用效率。 在本發明的實施形態之一中，前述控制器係包含：記憶部，係記憶資料，前述資料係包含被收容至前述第一仿真基板收容部的仿真基板的使用歷程資訊以及被收容至前述第二仿真基板收容部的仿真基板的使用歷程資訊；以及判斷部，係基於記憶於前述記憶部的前述資料來判斷前述仿真基板移送條件是否成立。 In one embodiment of the present invention, the controller executes the dummy substrate transfer control when a predetermined dummy substrate transfer condition is established. With this configuration, since the dummy substrate can be appropriately transferred between the first dummy substrate storage unit and the second dummy substrate storage unit by setting appropriate dummy substrate transfer conditions, the utilization efficiency of the dummy substrate can be improved. In one of the embodiments of the present invention, the aforementioned controller includes: a memory unit that stores data, and the aforementioned data includes the use history information of the dummy substrate stored in the first dummy substrate storage unit and the information stored in the first dummy substrate storage unit. 2. information on the use history of the dummy substrate in the dummy substrate storage unit; and a judging unit that judges whether the dummy substrate transfer condition is established based on the aforementioned data stored in the memory unit.

藉由此種構成，由於基於仿真基板的使用歷程來判斷仿真基板移送條件是否成立，因此能適當地判斷是否需要移送仿真基板，相應地能適當地移送仿真基板。 在本發明的實施形態之一中，前述控制器係在前述仿真基板移送控制中以下述方式控制前述第一搬運單元以及前述第二搬運單元：經由前述基板載置部在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 With this configuration, since it is judged based on the use history of the dummy board whether the dummy board transfer condition is established, it is possible to appropriately determine whether the dummy board needs to be transferred, and accordingly, the dummy board can be transferred appropriately. In one embodiment of the present invention, the controller controls the first transfer unit and the second transfer unit in the transfer control of the dummy substrate in such a manner that the first dummy substrate is accommodated in the first dummy substrate via the substrate placement unit. The dummy substrate is transferred between the part and the second dummy substrate storage part.

在此種構成中，仿真基板的移送係經由基板載置部來進行。由於無須頻繁地移送仿真基板，因此構成為第一搬運單元能存取第二仿真基板收容部以及構成為第二搬運單元能存取第一仿真基板收容部之好處較少。儘管如此，減少第一搬運單元以及第二搬運單元的存取目的地係能提高製品用的基板的搬運效率，從而有助於生產性的提升。In such a configuration, the transfer of the dummy substrate is performed via the substrate placement unit. Since the dummy substrates do not need to be transferred frequently, the benefits of configuring the first transfer unit to access the second dummy substrate storage portion and configuring the second transfer unit to access the first dummy substrate storage portion are less. Nevertheless, reducing the access destinations of the first transport unit and the second transport unit can improve the transport efficiency of substrates for products, thereby contributing to the improvement of productivity.

在本發明的實施形態之一中，前述基板載置部係包含：第一基板載置部，係能夠供前述第一搬運單元以及前述第三搬運單元存取；以及第二基板載置部，係能夠供前述第二搬運單元以及前述第三搬運單元存取。此外，前述控制器係在前述仿真基板移送控制中以下述方式控制前述第一搬運單元、前述第二搬運單元以及前述第三搬運單元：前述第一搬運單元係在前述第一仿真基板收容部與前述第一基板載置部之間搬運仿真基板，前述第二搬運單元係在前述第二仿真基板收容部與前述第二基板載置部之間搬運仿真基板，前述第三搬運單元係在前述第一基板載置部與前述第二基板載置部之間搬運仿真基板。In one of the embodiments of the present invention, the aforementioned substrate loading unit includes: a first substrate loading unit capable of being accessed by the aforementioned first transport unit and the aforementioned third transport unit; and a second substrate loading unit, It can be accessed by the aforementioned second transport unit and the aforementioned third transport unit. In addition, the controller controls the first conveying unit, the second conveying unit, and the third conveying unit in the dummy substrate transfer control in such a manner that the first conveying unit is connected between the first dummy substrate accommodating portion and the third conveying unit. The dummy substrates are transported between the first substrate placement parts, the second transfer unit transfers the dummy substrates between the second dummy substrate storage part and the second substrate placement part, and the third transfer unit is between the second dummy substrate storage part and the second substrate placement part. The dummy substrate is transported between a substrate loading part and the second substrate loading part.

在此種構成中，具備有分別與第一搬運單元以及第二搬運單元對應的第一基板載置部以及第二基板載置部。藉此，第一基板載置部以及第二基板載置部係能作成容易藉由第一搬運單元以及第二搬運單元存取的配置。藉此，能提高製品用的基板的搬運效率，從而能謀求生產性的提升。為了移送仿真基板，雖然第三搬運單元係在第一基板載置部與第二基板載置部之間搬運仿真基板，然而由於無須頻繁地移送仿真基板，因此第三搬運單元參與仿真基板的移送所導致的生產性降低係很少。In such a configuration, a first substrate mounting portion and a second substrate mounting portion respectively corresponding to the first conveying unit and the second conveying unit are provided. Thereby, the first substrate mounting part and the second substrate mounting part can be configured to be easily accessed by the first transport unit and the second transport unit. Thereby, the conveyance efficiency of the board|substrate for products can be improved, and productivity can be improved. In order to transfer the dummy substrate, although the third transfer unit transfers the dummy substrate between the first substrate placement part and the second substrate placement part, since it is not necessary to frequently transfer the dummy substrate, the third transfer unit participates in the transfer of the dummy substrate The resulting reduction in productivity is minimal.

在本發明的實施形態之一中，前述第三搬運單元係能夠存取前述第一仿真基板收容部以及前述第二仿真基板收容部。此外，前述控制器係在前述仿真基板移送控制中以下述方式控制前述第三搬運單元：無須經由前述基板載置部地在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。In one embodiment of the present invention, the third transfer unit is capable of accessing the first dummy substrate storage unit and the second dummy substrate storage unit. In addition, in the dummy substrate transfer control, the controller controls the third transfer unit to transfer between the first dummy substrate storage unit and the second dummy substrate storage unit without passing through the substrate loading unit. Simulation substrate.

在此種構成中，由於第三搬運單元能夠存取第一仿真基板收容部以及第二仿真基板收容部，因此能在第一仿真基板收容部與第二仿真基板收容部之間直接地移送仿真基板。由於無須頻繁地移送仿真基板，因此不會有第三搬運單元參與仿真基板的移送會對生產性造成很大的影響之疑慮。 在本發明的實施形態之一中，前述基板處理裝置係包含：第一處理區塊層；以及第二處理區塊層，係位於前述第一處理區塊層的上方；於前述第一處理區塊層配置有前述第一處理單元群，於前述第二處理區塊層配置有前述第二處理單元群。 In this configuration, since the third transfer unit can access the first dummy substrate storage unit and the second dummy substrate storage unit, it is possible to directly transfer the dummy substrate between the first dummy substrate storage unit and the second dummy substrate storage unit. substrate. Since there is no need to frequently transfer the dummy substrate, there is no concern that the third transfer unit participating in the transfer of the dummy substrate will greatly affect the productivity. In one of the embodiments of the present invention, the substrate processing device includes: a first processing block layer; and a second processing block layer located above the first processing block layer; The block layer is configured with the aforementioned first processing unit group, and the aforementioned second processing block layer is configured with the aforementioned second processing unit group.

在本發明的實施形態之一中，前述基板處理裝置係包含：第一處理區塊部；以及第二處理區塊部，係位於前述第一處理區塊部的側方；於前述第一處理區塊部配置有前述第一處理單元群，於前述第二處理區塊部配置有前述第二處理單元群。 在本發明的實施形態之一中，俯視觀看時，前述第一仿真基板收容部以及前述第二仿真基板收容部係與前述基板載置部重疊。 In one of the embodiments of the present invention, the aforementioned substrate processing apparatus includes: a first processing block; and a second processing block, which is located on the side of the first processing block; The first processing unit group is arranged in the block portion, and the second processing unit group is arranged in the second processing block portion. In one embodiment of the present invention, the first dummy substrate storage portion and the second dummy substrate storage portion overlap the substrate placement portion in a plan view.

依據此種構成，能利用基板載置部的上方或者下方的空間以俯視觀看時與基板載置部重疊之方式配置仿真基板收容部。藉此，能實現不會妨礙製品用的基板的搬運之仿真基板收容部的配置，且能有效地利用基板處理裝置內的空間來配置仿真基板收容部。 具體而言，俯視觀看時，仿真基板收容部與基板載置部彼此重疊之配置亦可為被仿真基板收容部收容的仿真基板的一部分或者全部與被基板載置部保持的基板彼此重疊之配置。 According to such a configuration, the dummy substrate accommodating portion can be arranged so as to overlap with the substrate mounting portion in plan view by utilizing the space above or below the substrate mounting portion. Thereby, it is possible to arrange the dummy substrate accommodating part without interfering with the conveyance of the substrate for the product, and to arrange the dummy substrate accommodating part by effectively utilizing the space in the substrate processing apparatus. Specifically, in plan view, the arrangement in which the dummy substrate storage part and the substrate placement part overlap each other may also be an arrangement in which a part or all of the dummy substrate accommodated in the dummy substrate storage part overlaps with the substrate held in the substrate placement part. .

在本發明的實施形態之一中，前述第一仿真基板收容部以及前述第二仿真基板收容部係夾著前述基板載置部上下地分開配置。 本發明的實施形態之一提供一種基板處理方法，係包含：藉由第一搬運單元在屬於第一處理單元群的複數個第一處理單元與基板載置部之間搬運基板之工序；在前述第一處理單元中處理被前述第一搬運單元搬運的基板之工序；藉由前述第一搬運單元在複數個前述第一處理單元與第一仿真基板收容部之間搬運仿真基板之工序；在前述第一處理單元中執行使用了被前述第一搬運單元搬運的仿真基板的仿真處理之工序；藉由第二搬運單元在屬於第二處理單元群的複數個第二處理單元與前述基板載置部之間搬運基板之工序；在前述第二處理單元中處理被前述第二搬運單元搬運的基板之工序；藉由前述第二搬運單元在複數個前述第二處理單元與第二仿真基板收容部之間搬運仿真基板之工序；在前述第二處理單元中執行使用了被前述第二搬運單元搬運的仿真基板的仿真處理之工序；藉由第三搬運單元在被承載器保持部保持的承載器與前述基板載置部之間搬運基板之工序；以及仿真基板移送工序，係在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 In one embodiment of the present invention, the first dummy substrate storage section and the second dummy substrate storage section are arranged vertically and separately with the substrate placement section interposed therebetween. One embodiment of the present invention provides a method for processing a substrate, which includes: using the first transfer unit to transfer the substrate between a plurality of first processing units belonging to the first processing unit group and the substrate mounting part; The process of processing the substrates transported by the first transport unit in the first processing unit; the process of transporting dummy substrates between a plurality of the first processing units and the first dummy substrate storage part by the first transport unit; in the aforementioned In the first processing unit, the process of performing the dummy processing using the dummy substrate carried by the first transfer unit; through the second transfer unit, a plurality of second processing units belonging to the second processing unit group and the substrate placement part are connected The process of transporting substrates between the aforementioned second processing units; the process of processing substrates transported by the aforementioned second transporting units in the aforementioned second handling unit; the process of using the aforementioned second transporting units between a plurality of the aforementioned second handling units and the second dummy substrate storage section The process of transporting the dummy substrate between them; the process of performing the dummy process using the dummy substrate transported by the second transport unit in the second processing unit; the carrier held by the carrier holding part and the The process of transferring the substrate between the aforementioned substrate loading parts; and the process of transferring the dummy substrate is to transfer the dummy substrate between the first dummy substrate storage part and the second dummy substrate storage part.

本發明的實施形態之一的基板處理方法係進一步包含：藉由前述第三搬運單元在被前述承載器保持部保持的承載器與前述基板載置部之間搬運仿真基板之工序；藉由前述第一搬運單元在前述基板載置部與前述第一仿真基板收容部之間搬運仿真基板之工序；以及藉由前述第二搬運單元在前述基板載置部與前述第二仿真基板收容部之間搬運仿真基板。藉此，能經由基板載置部，將未使用的仿真基板導入至第一仿真基板收容部以及第二仿真基板收容部，並能將使用完畢的仿真基板從第一仿真基板收容部以及第二仿真基板收容部朝承載器排出。The substrate processing method according to one embodiment of the present invention further includes: the step of transferring the dummy substrate between the carrier held by the carrier holding part and the substrate mounting part by the third transfer unit; The process of transporting the dummy substrate between the substrate loading unit and the first dummy substrate storage unit by the first transport unit; Handling the dummy substrate. Thereby, the unused dummy substrate can be introduced into the first dummy substrate storage part and the second dummy substrate storage part via the substrate loading part, and the used dummy substrate can be transferred from the first dummy substrate storage part and the second dummy substrate storage part. The dummy substrate storage part is discharged toward the carrier.

在本發明的實施形態之一中，在前述仿真基板移送工序中經由前述基板載置部在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 在本發明的實施形態之一中，前述基板載置部係包含：第一基板載置部，係能夠供前述第一搬運單元以及前述第三搬運單元存取；以及第二基板載置部，係能夠供前述第二搬運單元以及前述第三搬運單元存取。而且，前述仿真基板移送工序係包含：前述第一搬運單元在前述第一仿真基板收容部與前述第一基板載置部之間搬運仿真基板之工序；前述第二搬運單元在前述第二仿真基板收容部與前述第二基板載置部之間搬運仿真基板之工序；以及前述第三搬運單元在前述第一基板載置部與前述第二基板載置部之間搬運仿真基板之工序。 In one embodiment of the present invention, in the dummy substrate transfer step, the dummy substrate is transferred between the first dummy substrate storage unit and the second dummy substrate storage unit via the substrate loading unit. In one of the embodiments of the present invention, the aforementioned substrate loading unit includes: a first substrate loading unit capable of being accessed by the aforementioned first transport unit and the aforementioned third transport unit; and a second substrate loading unit, It can be accessed by the aforementioned second transport unit and the aforementioned third transport unit. Furthermore, the dummy substrate transfer process includes: a step in which the first transfer unit transfers the dummy substrate between the first dummy substrate storage portion and the first substrate placement portion; a process of transporting the dummy substrate between the storage unit and the second substrate loading unit; and a process of transporting the dummy substrate between the first substrate loading unit and the second substrate loading unit by the third transport unit.

在本發明的實施形態之一中，前述第三搬運單元係能夠存取前述第一仿真基板收容部以及前述第二仿真基板收容部；在前述仿真基板移送工序中，前述第三搬運單元係無須經由前述基板載置部地在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 參照隨附的圖式並藉由以下所進行的本發明的詳細的說明，更明瞭上述目的以及其他的目的、特徵、態樣以及優點。 In one of the embodiments of the present invention, the third transfer unit can access the first dummy substrate storage unit and the second dummy substrate storage unit; in the dummy substrate transfer process, the third transfer unit does not need The dummy substrate is transferred between the first dummy substrate storage part and the second dummy substrate storage part via the substrate loading part. The above object and other objects, features, aspects and advantages will be more clearly understood through the following detailed description of the present invention with reference to the accompanying drawings.

圖1係顯示本發明的實施形態之一的基板處理裝置的內部構成之示意性的俯視圖。圖2係從圖1的Ⅱ－Ⅱ線觀看的示意性的縱剖視圖。圖3係從圖1的Ⅲ－Ⅲ線觀看的示意性的橫剖視圖。圖4係顯示從圖1的Ⅳ方向觀看的處理區塊的內部構成之示意性的立視圖。FIG. 1 is a schematic plan view showing the internal structure of a substrate processing apparatus according to one embodiment of the present invention. Fig. 2 is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 . Fig. 3 is a schematic cross-sectional view viewed from line III-III in Fig. 1 . FIG. 4 is a schematic elevational view showing the internal structure of the processing block viewed from the IV direction of FIG. 1 .

基板處理裝置1係包含索引區塊2以及處理區塊3，處理區塊3係鄰接於索引區塊2的橫方向(第一水平方向X)。 索引區塊2係包含複數個(在本實施形態中為四個)承載器保持部25(裝載埠(load port))以及索引機器人26。以下，為了方便說明，針對第一水平方向X，會有將承載器保持部25之側定義成前方且將承載器保持部25之側的相反側定義成後方來說明之情形。 The substrate processing apparatus 1 includes an index block 2 and a processing block 3 , and the processing block 3 is adjacent to the index block 2 in a horizontal direction (a first horizontal direction X). The index block 2 includes a plurality of (four in this embodiment) carrier holders 25 (load ports) and an index robot 26 . Hereinafter, for the convenience of description, with respect to the first horizontal direction X, the side of the carrier holding portion 25 may be defined as the front and the side opposite to the side of the carrier holding portion 25 will be defined as the rear.

複數個承載器保持部25係沿著與第一水平方向X正交之第二水平方向Y排列。各個承載器保持部25係構成為能收容並保持藉由工廠內所具備的承載器搬運機構300自動搬運的承載器C。各個承載器保持部25係構成為能保持一個承載器C。承載器C為基板收容器，係收容處理對象的基板W(以下亦稱為製品基板W)。承載器C的一例為FOUP(Front Opening Unified Pod；前開式晶圓傳送盒)。承載器C係構成為能以層疊狀態保持複數片(例如25片)基板W。更具體而言，承載器C係構成為：在被承載器保持部25保持時，能以水平姿勢沿著上下方向Z的層疊狀態保持複數片基板W。承載器保持部25為收容器保持部的一例，用以保持屬於基板收容器的承載器C。基板W係例如為半導體晶圓。The plurality of carrier holding parts 25 are arranged along the second horizontal direction Y perpendicular to the first horizontal direction X. Each carrier holding part 25 is comprised so that it can accommodate and hold the carrier C automatically conveyed by the carrier conveyance mechanism 300 equipped in a factory. Each carrier holding portion 25 is configured to hold one carrier C. As shown in FIG. The carrier C is a substrate storage container that accommodates a substrate W (hereinafter also referred to as a product substrate W) to be processed. An example of the carrier C is a FOUP (Front Opening Unified Pod; Front Opening Unified Pod). The carrier C is configured to hold a plurality of (for example, 25) substrates W in a stacked state. More specifically, the carrier C is configured to hold a plurality of substrates W in a stacked state along the vertical direction Z in a horizontal posture when held by the carrier holding portion 25 . The carrier holding part 25 is an example of a container holding part, and holds the carrier C belonging to the substrate container. The substrate W is, for example, a semiconductor wafer.

索引機器人26為第三搬運單元的一例。索引機器人26係構成為：能對分別被複數個承載器保持部25保持的承載器C存取，將基板W搬入或者搬出，並在承載器保持部25與處理區塊3之間搬運基板W。在此實施形態中，索引機器人26為具備了多關節臂27的多關節臂機器人。具體而言，索引機器人26係包含：多關節臂27，係連結了複數個臂28；一個以上的手部29，係結合至多關節臂27的前端；以及基台部30，係支撐多關節臂27並使多關節臂27上下動作。用以構成多關節臂27之複數個臂28以及手部29係能夠繞著被設定於各個基端部之垂直的擺動軸線擺動，雖然未圖示但具備有用以擺動各個臂28以及手部29之個別的致動器(典型而言為電動馬達)。The index robot 26 is an example of the third transport unit. The index robot 26 is configured to be able to access the carriers C respectively held by the plurality of carrier holding parts 25, to carry the substrate W in or out, and to transfer the substrate W between the carrier holding part 25 and the processing block 3. . In this embodiment, the index robot 26 is a multi-joint arm robot including a multi-joint arm 27 . Specifically, the indexing robot 26 includes: a multi-joint arm 27 that connects a plurality of arms 28; more than one hand 29 that is coupled to the front end of the multi-joint arm 27; and a base part 30 that supports the multi-joint arm 27 and make the multi-joint arm 27 move up and down. A plurality of arms 28 and hands 29 constituting the multi-joint arm 27 are capable of swinging around a vertical swing axis set at each base end. individual actuators (typically electric motors).

處理區塊3係包含於上下方向Z層疊的複數個第一處理區塊層BL、第二處理區塊層BU。在本實施形態中，處理區塊3係包含第一層(下層)的處理區塊層(以下稱為「第一處理區塊層BL」)以及層疊在第一處理區塊層BL的上方之第二層(上層)的處理區塊層(以下稱為「第二處理區塊層BU」)。以下，在區別第一處理區塊層BL的構成要素與第二處理區塊層BU的構成要素時，針對第一處理區塊層BL的構成要素使用於末尾具有英文字「L」的元件符號，針對第二處理區塊層BU的構成要素使用於末尾具有英文字「U」的元件符號。圖式中的元件符號亦同樣。The processing block 3 includes a plurality of first processing block layers BL and second processing block layers BU stacked in the vertical direction Z. In this embodiment, the processing block 3 includes a processing block layer (hereinafter referred to as "the first processing block layer BL") of the first layer (lower layer) and a layer stacked above the first processing block layer BL. The processing block layer of the second layer (upper layer) (hereinafter referred to as "second processing block layer BU"). Hereinafter, when distinguishing the constituent elements of the first processing block layer BL from the constituent elements of the second processing block layer BU, the constituent elements of the first processing block layer BL are used with the component symbols with the English letter "L" at the end , for the constituent elements of the second processing block layer BU, the component symbols with the English word "U" at the end are used. The same applies to the reference symbols in the drawings.

第一處理區塊層BL以及第二處理區塊層BU的俯視中的內部構成係實質性相同。因此，在圖1中，請留意會藉由將元件符號的末尾的英文字「U」置換成英文字「L」來表示第一處理區塊層BL的構成(俯視中的配置)。 第一處理區塊層BL係包含複數個(在本實施形態中為12個)處理單元11L至13L、21L至23L、31L至33L、41L至43L(以下總稱第一處理區塊層BL的處理單元時稱為「處理單元11L至43L」)，複數個處理單元11L至13L、21L至23L、31L至33L、41L至43L係構成第一處理單元群。第一處理區塊層BL係進一步包含基板載置部6L、仿真基板收容部7L以及主搬運機器人8L。複數個處理單元11L至43L係對基板W進行處理。在本實施形態中，各個處理單元11L至43L為葉片型處理單元，用以逐片處理基板W。基板載置部6L為下述單元：用以暫時保持在索引機器人26與第一處理區塊層BL之間被傳遞的基板W。仿真基板收容部7L係提供仿真基板DW的待機場所，且為下述單元：用以在基板處理裝置1的內部預先保持能夠在處理單元11L至43L使用的仿真基板DW。主搬運機器人8L係構成為能夠存取基板載置部6L、處理單元11L至43L以及仿真基板收容部7L。主搬運機器人8L為第一搬運單元的一例，用以在基板載置部6L與處理單元11L至43L之間搬運基板W且在仿真基板收容部7L與處理單元11L至43L之間搬運仿真基板DW。 The internal configurations in plan view of the first processing block layer BL and the second processing block layer BU are substantially the same. Therefore, in FIG. 1 , please note that the configuration of the first processing block layer BL (arrangement in plan view) is represented by replacing the English character “U” at the end of the element code with the English character “L”. The first processing block layer BL includes a plurality of (12 in this embodiment) processing units 11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L (hereinafter collectively referred to as the processing of the first processing block layer BL) The units are referred to as "processing units 11L to 43L"), and a plurality of processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L to 43L constitute the first processing unit group. The first processing block layer BL further includes a substrate placement unit 6L, a dummy substrate storage unit 7L, and a main transfer robot 8L. The plurality of processing units 11L to 43L process the substrate W. In this embodiment, each of the processing units 11L to 43L is a blade type processing unit for processing the substrate W one by one. The substrate mounting part 6L is a unit for temporarily holding the substrate W transferred between the index robot 26 and the first processing block layer BL. The dummy substrate storage unit 7L provides a standby place for the dummy substrates DW, and is a unit for holding the dummy substrates DW usable in the processing units 11L to 43L in advance in the substrate processing apparatus 1 . The main transfer robot 8L is configured to be able to access the substrate placement portion 6L, the processing units 11L to 43L, and the dummy substrate storage portion 7L. The main transport robot 8L is an example of a first transport unit for transporting the substrate W between the substrate mounting section 6L and the processing units 11L to 43L and transporting the dummy substrate DW between the dummy substrate storage section 7L and the processing units 11L to 43L. .

所謂仿真基板DW為具有與基板W同樣的形狀(例如圓形)以及大小的基板。仿真基板DW係與從承載器C所供給的製品用的基板W不同，並不會被利用於實際的製品的製造。為了執行用以整頓處理單元11L至43L內的環境之預處理(準備處理)以及用以洗淨處理單元11L至43L內之單元洗淨處理等，仿真基板DW係被導入至處理單元11L至43L來使用。以下，將此種使用仿真基板DW的處理稱為「仿真處理」。上面所說明的預處理以及單元洗淨處理為用以維護處理單元11L至43L之維護處理，仿真處理係包含此種維護處理。The so-called dummy substrate DW is a substrate having the same shape (for example, circular shape) and size as the substrate W. The dummy substrate DW is different from the substrate W for a product supplied from the carrier C, and is not used for manufacturing an actual product. The dummy substrate DW is introduced into the processing units 11L to 43L in order to perform preprocessing (preparation processing) for adjusting the environment in the processing units 11L to 43L and unit cleaning processing for cleaning the processing units 11L to 43L. to use. Hereinafter, such processing using the dummy substrate DW is referred to as "dummy processing". The preprocessing and unit cleaning processes described above are maintenance processes for maintaining the processing units 11L to 43L, and the simulation process includes such maintenance processes.

複數個處理單元11L至43L係沿著搬運空間52L配置於與搬運空間52L的兩側且面向搬運空間52L，搬運空間52L係提供搬運路徑51L，搬運路徑51L係藉由主搬運機器人8L搬運基板W之路徑。俯視觀看時，搬運空間52L係於第二水平方向Y具有固定的寬度，並沿著第一水平方向X朝從索引區塊2離開的方向直線性地延伸。搬運空間52L係於上下方向Z具有與第一處理區塊層BL的高度大致同等的高度。俯視觀看時，於搬運空間52L的一側，從接近索引區塊2之側依序沿著搬運路徑51L排列有第一液體供給部91、第一處理單元堆疊部S1L、第一排氣部101、第二液體供給部92、第二處理單元堆疊部S2L以及第二排氣部102。於搬運空間52L的另一側，從接近索引區塊2之側依序沿著搬運路徑51L排列有第三排氣部103、第三處理單元堆疊部S3L、第三液體供給部93、第四排氣部104、第四處理單元堆疊部S4L以及第四液體供給部94。這些構件係以區劃大致立方體形狀的搬運空間52L之方式排列。A plurality of processing units 11L to 43L are disposed on both sides of the transport space 52L along the transport space 52L and face the transport space 52L. The transport space 52L provides a transport path 51L, and the transport path 51L is used to transport the substrate W by the main transport robot 8L. the path. When viewed from above, the transfer space 52L has a constant width in the second horizontal direction Y, and linearly extends in a direction away from the index block 2 along the first horizontal direction X. The transfer space 52L has a height substantially equal to the height of the first processing block layer BL in the vertical direction Z. In a plan view, on one side of the transport space 52L, the first liquid supply unit 91, the first processing unit stacking unit S1L, and the first exhaust unit 101 are arranged sequentially along the transport path 51L from the side close to the index block 2. , the second liquid supply part 92 , the second processing unit stack part S2L, and the second exhaust part 102 . On the other side of the transport space 52L, the third exhaust unit 103, the third processing unit stacking unit S3L, the third liquid supply unit 93, the fourth The exhaust unit 104 , the fourth processing unit stacking unit S4L, and the fourth liquid supply unit 94 . These members are arranged so as to partition the substantially cubic conveyance space 52L.

第一處理單元堆疊部S1L至第四處理單元堆疊部S4L係分別包含於上下方向Z層疊的複數段(在本實施形態為三段)處理單元11L至13L、21L至23L、31L至33L以及41L至43L。第三處理單元堆疊部S3L係夾著搬運空間52L並與第一處理單元堆疊部S1L對向。第四處理單元堆疊部S4L係夾著搬運空間52L並與第二處理單元堆疊部S2L對向。因此，用以構成第三處理單元堆疊部S3L之複數個處理單元31L至33L係夾著搬運空間52L並與用以構成第一處理單元堆疊部S1L之複數段處理單元11L至13L對向。同樣地，用以構成第四處理單元堆疊部S4L之複數段處理單元41L至43L係夾著搬運空間52L並與用以構成第二處理單元堆疊部S2L之複數段處理單元21L至23L對向。在本實施形態中，第一處理區塊層BL係包含12個處理單元11L至13L、21L至23L、31L至33L、41L至43L，這些構件係各三個分開地配置於四個第一處理單元堆疊部S1L至第四處理單元堆疊部S4L。The first processing unit stack S1L to the fourth processing unit stack S4L respectively include a plurality of stages (in this embodiment, three stages) of processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L stacked in the vertical direction Z. to 43L. The third processing unit stack portion S3L is opposed to the first processing unit stack portion S1L across the conveyance space 52L. The fourth processing unit stacking portion S4L is opposed to the second processing unit stacking portion S2L across the conveyance space 52L. Therefore, the plurality of processing units 31L to 33L constituting the third processing unit stack S3L are opposite to the plurality of stages of processing units 11L to 13L constituting the first processing unit stack S1L across the transport space 52L. Similarly, the plurality of processing units 41L to 43L constituting the fourth processing unit stack S4L are opposite to the plurality of processing units 21L to 23L constituting the second processing unit stack S2L across the transport space 52L. In this embodiment, the first processing block layer BL includes 12 processing units 11L to 13L, 21L to 23L, 31L to 33L, and 41L to 43L, and three of these components are separately arranged in four first processing units. The unit stack S1L to the fourth processing unit stack S4L.

搬運空間52L係被中間隔壁16從上方區劃並被下隔壁15從下方區劃，中間隔壁16係配置於與各個第一處理單元堆疊部S1L至第四處理單元堆疊部S4L的最上段的處理單元13L、23L、33L、43L的上表面整合之位置，下隔壁15係配置於與最下段的處理單元11L、21L、31L、41L的下表面整合之位置。全部的處理單元11L至43L係具有基板搬入搬出口37，基板搬入搬出口37係於面向搬運空間52L的位置呈開口。主搬運機器人8L係通過搬運空間52L搬運基板W以及仿真基板DW，經由基板搬入搬出口37對各個處理單元11L至43L搬入基板W以及仿真基板DW並對各個處理單元11L至43L搬出基板W以及仿真基板DW。The transfer space 52L is partitioned from above by the middle partition wall 16 and partitioned from below by the lower partition wall 15. The middle partition wall 16 is arranged on the uppermost processing unit 13L of each of the first processing unit stacking portion S1L to the fourth processing unit stacking portion S4L. , 23L, 33L, 43L upper surfaces are integrated, and the lower partition wall 15 is arranged at a position integrated with the lower surface of the lowermost processing units 11L, 21L, 31L, 41L. All of the processing units 11L to 43L have a substrate loading and unloading port 37, and the substrate loading and unloading port 37 opens at a position facing the transfer space 52L. The main transport robot 8L transports the substrate W and the dummy substrate DW through the transport space 52L, loads the substrate W and the dummy substrate DW into the processing units 11L to 43L through the substrate loading and unloading port 37, and unloads the substrate W and the dummy substrate DW from the processing units 11L to 43L. Substrate DW.

基板載置部6L係配置於索引機器人26與主搬運機器人8L之間。更具體而言，俯視觀看時，基板載置部6L係配置於搬運空間52L內的索引機器人26側的端部。在本實施形態中，基板載置部6L係位於第一液體供給部91與第三排氣部103之間。基板載置部6L係於上下方向Z中配置於中間隔壁16與下隔壁15之間的高度。在本實施形態中，基板載置部6L係配置於從中間隔壁16至上隔壁17為止的高度範圍中的中間高度附近。基板載置部6L的上下方向位置係需要為索引機器人26能夠存取的高度範圍內且為主搬運機器人8L能夠存取的高度範圍內。The substrate placement unit 6L is arranged between the index robot 26 and the main transfer robot 8L. More specifically, the substrate placement unit 6L is arranged at an end portion on the index robot 26 side in the transfer space 52L in plan view. In the present embodiment, the substrate placement unit 6L is located between the first liquid supply unit 91 and the third exhaust unit 103 . The substrate mounting portion 6L is arranged at a height between the intermediate partition wall 16 and the lower partition wall 15 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6L is arranged near the middle height in the height range from the intermediate partition wall 16 to the upper partition wall 17 . The vertical position of the board mounting section 6L needs to be within a height range accessible by the index robot 26 and within a height range accessible by the main transfer robot 8L.

基板載置部6L係包含：未處理基板載置部61，係載置未處理的基板W；以及已處理基板載置部62，係載置處理完畢的基板W。未處理基板載置部61以及已處理基板載置部62係於上下方向Z層疊。較佳為未處理基板載置部61配置於已處理基板載置部62上。 如圖5放大的構成例所示，未處理基板載置部61以及已處理基板載置部62係包含：箱63、64，係沿著第一水平方向X且於索引機器人26之側以及主搬運機器人8L之側的雙方呈開放；以及基板保持架65、66，係配置於箱63、64的內部。基板保持架65、66係具有於上下方向Z排列的複數個(例如10個)基板支撐構件67、68。各個基板支撐構件67、68係構成為：從下方支撐一片基板W的下表面周緣部並以水平姿勢保持該基板W。藉此，未處理基板載置部61以及已處理基板載置部62係分別能於這些基板保持架65、66以於上下方向Z隔著間隔以水平姿勢層疊複數片(例如10片)基板W的狀態來保持複數片基板W。 The substrate placement unit 6L includes: an unprocessed substrate placement unit 61 on which an unprocessed substrate W is placed; and a processed substrate placement unit 62 on which a processed substrate W is placed. The unprocessed substrate mounting part 61 and the processed substrate mounting part 62 are stacked in the vertical direction Z. Preferably, the unprocessed substrate placement part 61 is disposed on the processed substrate placement part 62 . As shown in the enlarged configuration example of FIG. 5 , the unprocessed substrate placement part 61 and the processed substrate placement part 62 include: boxes 63 and 64 along the first horizontal direction X and on the side of the index robot 26 and the main Both sides of the transfer robot 8L are open; and substrate holders 65 , 66 are disposed inside boxes 63 , 64 . The substrate holders 65 and 66 have a plurality of (for example, ten) substrate support members 67 and 68 arranged in the vertical direction Z. Each of the substrate supporting members 67 and 68 is configured to support the peripheral portion of the lower surface of one substrate W from below and hold the substrate W in a horizontal posture. Thereby, the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 can stack a plurality of (for example, 10) substrates W in a horizontal posture on these substrate holders 65 and 66 with intervals in the vertical direction Z, respectively. state to hold a plurality of substrates W.

如圖2所示，以貫通索引區塊2的後隔壁2a以及處理區塊3的前隔壁3a之方式，亦即以貫通索引區塊2與處理區塊3鄰接的隔壁之方式形成有與基板載置部6L對應的窗4L。索引機器人26係能經由窗4L存取基板載置部6L從而對基板載置部6L進行基板W的搬入以及搬出。As shown in Figure 2, in the mode of penetrating the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is to say, forming a connection with the substrate in the manner of penetrating the partition wall adjacent to the index block 2 and the processing block 3 The mounting portion 6L corresponds to the window 4L. The index robot 26 can access the substrate mounting portion 6L through the window 4L, and can carry in and out the substrate W from the substrate mounting portion 6L.

仿真基板收容部7L係設置於與基板載置部6L不同的高度，在本實施形態中在搬運空間52L內配置於基板載置部6L的下方。仿真基板收容部7L係以俯視觀看時與基板載置部6L彼此重疊之方式設置。更具體而言，在基板W被基板載置部6L保持且仿真基板DW被仿真基板收容部7L保持時，以俯視觀看時基板W與仿真基板DW彼此重疊之方式配置有仿真基板收容部7L。基板W與仿真基板DW的俯視的彼此重疊係可為局部性的彼此重疊，亦可為整體性的彼此重疊，亦即仿真基板DW亦可與基板W的大致整體重疊。The dummy substrate housing portion 7L is provided at a different height from the substrate mounting portion 6L, and is disposed below the substrate mounting portion 6L in the transfer space 52L in the present embodiment. The dummy substrate housing portion 7L is provided so as to overlap with the substrate mounting portion 6L in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6L and the dummy substrate DW is held by the dummy substrate storage portion 7L, the dummy substrate storage portion 7L is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W.

仿真基板收容部7L係配置於下隔壁15與中間隔壁16之間，主搬運機器人8L係配置於能夠存取的高度範圍內。索引區塊2的後隔壁2a以及處理區塊3的前隔壁3a亦即索引區塊2與處理區塊3鄰接的隔壁係位於仿真基板收容部7L的前方亦即索引區塊2之側。於這些隔壁未設置有與仿真基板收容部7L對應的窗。因此，在本實施形態中，索引機器人26係無法存取仿真基板收容部7L。The dummy substrate storage unit 7L is arranged between the lower partition wall 15 and the intermediate partition wall 16, and the main transfer robot 8L is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate storage portion 7L, that is, on the side of the index block 2 . No windows corresponding to the dummy substrate housing portion 7L are provided in these partition walls. Therefore, in the present embodiment, the index robot 26 cannot access the dummy substrate storage section 7L.

如圖6放大的構成例所示，仿真基板收容部7L係具備仿真基板保持架71。仿真基板保持架71的構成亦可與基板載置部6L的基板保持架65、66的構成實質性地相同。然而，仿真基板保持架71能夠保持的仿真基板DW的片數係無須與基板保持架65、66能夠保持的基板片數相等。具體而言，仿真基板保持架71係具有排列於上下方向的複數個(例如12個)仿真基板支撐構件72。各個仿真基板支撐構件72係構成為：從下方支撐一片仿真基板DW的下表面周緣部並以水平姿勢保持該仿真基板DW。仿真基板收容部7L係能在仿真基板保持架71於上下方向Z隔著間隔以水平姿勢層疊複數片(例如12片)仿真基板DW的狀態下保持複數片仿真基板DW。亦即，仿真基板收容部7L係具有複數段(在本實施形態中為與第一處理區塊層BL所具備的處理單元的數量相同數量)插槽(以下稱為「仿真基板插槽DL1至DL12」)，複數段插槽係以水平姿勢收容各一片仿真基板DW之方式於上下方向層疊。亦可具備有仿真基板感測器(未圖示)，仿真基板感測器係用以檢測各個仿真基板插槽DL1至DL12中有無仿真基板DW。在本實施形態中，仿真基板收容部7L係與基板載置部6L不同，亦可不具備圍繞所收容的仿真基板DW之箱。當然，亦可具備此種箱。As shown in the enlarged configuration example of FIG. 6 , the dummy substrate storage unit 7L includes a dummy substrate holder 71 . The configuration of the dummy substrate holder 71 may be substantially the same as the configuration of the substrate holders 65 and 66 of the substrate mount portion 6L. However, the number of dummy substrates DW that can be held by the dummy substrate holder 71 is not necessarily equal to the number of substrates that can be held by the substrate holders 65 and 66 . Specifically, the dummy substrate holder 71 has a plurality of (for example, 12) dummy substrate support members 72 arranged in the vertical direction. Each of the dummy substrate supporting members 72 is configured to support the peripheral portion of the lower surface of one dummy substrate DW from below and hold the dummy substrate DW in a horizontal posture. The dummy substrate storage unit 7L can hold a plurality of dummy substrates DW in a state where the dummy substrate holders 71 are stacked horizontally with intervals in the vertical direction Z. That is, the dummy board storage section 7L has a plurality of stages (in this embodiment, the same number as the number of processing units included in the first processing block layer BL) slots (hereinafter referred to as "dummy board slots DL1 to DL1"). DL12"), a plurality of slots are stacked in the up and down direction in a manner of accommodating each dummy substrate DW in a horizontal posture. A dummy substrate sensor (not shown) may also be provided, and the dummy substrate sensor is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DL1 to DL12. In this embodiment, the dummy board storage part 7L is different from the board|substrate mounting part 6L, and the box which surrounds the dummy board|substrate DW accommodated does not need to be provided. Of course, such a box may also be provided.

如圖2所示，主搬運機器人8L係配置於搬運空間52L內。主搬運機器人8L係包含：手部81，係以水平姿勢保持一片基板；以及手部驅動機構82，係驅動手部81。亦可具備有複數個(例如兩個)手部81。手部驅動機構82係能將手部81於第一水平方向X、第二水平方向Y以及上下方向Z移動，且使手部81繞著鉛直旋轉軸線迴旋。手部驅動機構82係包含兩個支柱83、垂直移動部84、水平移動部85、旋轉部86以及進退部87。於進退部87結合有手部81。在設置有複數個手部81之情形中，較佳為設置有與複數個手部81對應的複數個進退部87。As shown in FIG. 2 , the main transfer robot 8L is arranged in the transfer space 52L. The main transfer robot 8L includes: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . A plurality of (for example, two) hands 81 may be provided. The hand driving mechanism 82 can move the hand 81 in the first horizontal direction X, the second horizontal direction Y, and the vertical direction Z, and make the hand 81 revolve around the vertical rotation axis. The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . The hand part 81 is coupled to the advancing and retreating part 87 . When a plurality of hands 81 are provided, it is preferable to provide a plurality of advancing and retreating portions 87 corresponding to the plurality of hands 81 .

兩個支柱83係沿著第一水平方向X隔著間隔配置並分別被固定於搬運空間52L的側壁。兩個支柱83係沿著上下方向Z延伸，且具有作為用以導引垂直移動部84的垂直移動之導軌的功能。垂直移動部84係具有導軌的形態，遍及兩個支柱83於第一水平方向X延伸且兩端部結合至兩個支柱83。垂直移動部84係構成為一邊被兩個支柱83導引一邊相對於支柱83於上下方向移動。水平移動部85係構成為：被支撐於垂直移動部84上，一邊被垂直移動部84導引一邊相對於垂直移動部84於第一水平方向X移動。旋轉部86係被支撐於水平移動部85。旋轉部86係構成為在水平移動部85上繞著鉛直的旋轉軸線旋轉。於旋轉部86結合有進退部87。進退部87係相對於旋轉軸線於水平方向進退，藉此使手部81於水平方向進退。The two pillars 83 are arranged at intervals along the first horizontal direction X, and are respectively fixed to the side walls of the conveyance space 52L. The two pillars 83 extend in the vertical direction Z, and function as guide rails for guiding the vertical movement of the vertical movement part 84 . The vertical moving part 84 is in the form of a guide rail, extends in the first horizontal direction X across the two pillars 83 , and is connected to the two pillars 83 at both ends. The vertical movement unit 84 is configured to move in the vertical direction with respect to the pillars 83 while being guided by the two pillars 83 . The horizontal movement unit 85 is supported by the vertical movement unit 84 and is configured to move in the first horizontal direction X relative to the vertical movement unit 84 while being guided by the vertical movement unit 84 . The rotating part 86 is supported by the horizontal moving part 85 . The rotation unit 86 is configured to rotate around a vertical rotation axis on the horizontal movement unit 85 . The advancing and retreating portion 87 is coupled to the rotating portion 86 . The advancing and retreating portion 87 advances and retreats in the horizontal direction relative to the rotation axis, whereby the hand 81 advances and retreats in the horizontal direction.

藉由此種構成，主搬運機器人8L係能使手部81存取基板載置部6L，並在主搬運機器人8L與基板載置部6L之間進行基板W的傳遞。主搬運機器人8L係能進一步使手部81存取第一處理區塊層BL內的任意的處理單元11L至43L，並能在主搬運機器人8L與處理單元11L至43L之間進行基板W或者仿真基板DW的傳遞。此外，主搬運機器人8L係能使手部81存取仿真基板收容部7L，並在主搬運機器人8L與仿真基板收容部7L之間進行仿真基板DW的傳遞。而且，主搬運機器人8L係能在第一處理區塊層BL內於基板載置部6L、處理單元11L至43L以及仿真基板收容部7L之間搬運被手部81保持的基板W或者仿真基板DW。With such a configuration, the main transfer robot 8L can make the hand 81 access the substrate placement part 6L, and transfer the substrate W between the main transfer robot 8L and the substrate placement part 6L. The main transfer robot 8L can further enable the hand 81 to access any processing units 11L to 43L in the first processing block layer BL, and can perform substrate W or simulation between the main transfer robot 8L and the processing units 11L to 43L. Substrate DW transfer. In addition, the main transfer robot 8L enables the hand 81 to access the dummy substrate storage section 7L, and transfers the dummy substrate DW between the main transfer robot 8L and the dummy substrate storage section 7L. Furthermore, the main transfer robot 8L can transfer the substrate W held by the hand 81 or the dummy substrate DW between the substrate mounting part 6L, the processing units 11L to 43L, and the dummy substrate storage part 7L in the first processing block layer BL. .

由於第二處理區塊層BU的構成係與第一處理區塊層BL的構成大致相同，因此以下儘可能地省略重複的說明，並主要說明不同的構成。附上與第一處理區塊層BL之情形相同名稱之要素的構成係實質性地相同。 第二處理區塊層BU係包含複數個(在本實施形態中為12個)處理單元11U至13U、21U至23U、31U至33U、41U至43U(以下總稱第二處理區塊層BU的處理單元時稱為「處理單元11U至43U」)，複數個處理單元11U至13U、21U至23U、31U至33U、41U至43U係構成第二處理單元群。第二處理區塊層BU係進一步包含基板載置部6U、仿真基板收容部7U以及主搬運機器人8U。第一液體供給部91至第四液體供給部94以及第一排氣部101至第四排氣部104係遍及第一處理區塊層BL以及第二處理區塊層BU並沿著上下方向Z配置。 Since the configuration of the second processing block layer BU is substantially the same as that of the first processing block layer BL, repeated descriptions will be omitted as much as possible below, and different configurations will be mainly described. The configuration of the elements with the same names as in the case of the first processing block layer BL is substantially the same. The second processing block layer BU is composed of a plurality of (12 in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U (hereinafter collectively referred to as the processing of the second processing block layer BU) The units are referred to as “processing units 11U to 43U”), and a plurality of processing units 11U to 13U, 21U to 23U, 31U to 33U, and 41U to 43U constitute the second processing unit group. The second processing block layer BU further includes a substrate placement part 6U, a dummy substrate storage part 7U, and a main transfer robot 8U. The first liquid supply part 91 to the fourth liquid supply part 94 and the first exhaust part 101 to the fourth exhaust part 104 are throughout the first processing block layer BL and the second processing block layer BU and along the vertical direction Z configuration.

第二處理區塊層BU內的複數個處理單元11U至43U的配置係與第一處理區塊層BL內的複數個處理單元11L至43L的配置實質性地相等。第二處理區塊層BU係具備第一處理單元堆疊部S1U至第四處理單元堆疊部S4U，第一處理單元堆疊部S1U至第四處理單元堆疊部S4U係分別具備於上下方向Z層疊的複數段(在本實施形態中為三段)處理單元11U至13U、21U至23U、31U至33U、41U至43U。The configuration of the plurality of processing units 11U to 43U in the second processing block layer BU is substantially equal to the configuration of the plurality of processing units 11L to 43L in the first processing block layer BL. The second processing block layer BU is equipped with the first processing unit stacking part S1U to the fourth processing unit stacking part S4U, and the first processing unit stacking part S1U to the fourth processing unit stacking part S4U are respectively equipped with a plurality of layers stacked in the vertical direction Z. Stage (three stages in this embodiment) processing units 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U.

第二處理區塊層BU的第一處理單元堆疊部S1U至第四處理單元堆疊部S4U係以俯視觀看時分別與第一處理區塊層BL的第一處理單元堆疊部S1L至第四處理單元堆疊部S4L重疊之方式配置。而且，第一處理區塊層BL以及第二處理區塊層BU各者的第一處理單元堆疊部S1L、S1U係於上下方向Z層疊從而形成第一塔T1，第一塔T1係層疊有複數段(在本實施形態中為6段)處理單元11L、12L、13L、11U、12U、13U。同樣地，第一處理區塊層BL以及第二處理區塊層BU各者的第二處理單元堆疊部S2L、S2U係於上下方向Z層疊從而形成第二塔T2，第二塔T2係層疊有複數段(在本實施形態中為6段)處理單元21L、22L、23L、21U、22U、23U。再者，第一處理區塊層BL以及第二處理區塊層BU各者的第三處理單元堆疊部S3L、S3U係於上下方向Z層疊從而形成第三塔T3，第三塔T3係層疊有複數段(在本實施形態中為6段)處理單元31L、32L、33L、31U、32U、33U。又同樣地，第一處理區塊層BL以及第二處理區塊層BU各者的第四處理單元堆疊部S4L、S4U係於上下方向Z層疊從而形成第四塔T4，第四塔T4係層疊有複數段(在本實施形態中為6段)處理單元41L、42L、43L、41U、42U、43U。The first processing unit stacking portion S1U to the fourth processing unit stacking portion S4U of the second processing block layer BU are respectively connected to the first processing unit stacking portion S1L to the fourth processing unit of the first processing block layer BL when viewed from the top. The stacked parts S4L are arranged so as to overlap each other. Moreover, the first processing unit stacks S1L, S1U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a first tower T1, and the first tower T1 is stacked with a plurality of Segment (six in this embodiment) processing units 11L, 12L, 13L, 11U, 12U, 13U. Similarly, the second processing unit stacks S2L, S2U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a second tower T2, and the second tower T2 is stacked with Multiple stages (six stages in this embodiment) processing units 21L, 22L, 23L, 21U, 22U, 23U. Furthermore, the third processing unit stacks S3L, S3U of each of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a third tower T3, and the third tower T3 is stacked with Multiple stages (six stages in this embodiment) processing units 31L, 32L, 33L, 31U, 32U, 33U. Likewise, the fourth processing unit stacks S4L, S4U of the first processing block layer BL and the second processing block layer BU are stacked in the vertical direction Z to form a fourth tower T4, and the fourth tower T4 is stacked There are a plurality of stages (six stages in this embodiment) of processing units 41L, 42L, 43L, 41U, 42U, and 43U.

被區劃於第二處理區塊層BU內且用以提供搬運路徑51U之搬運空間52U係與第一處理區塊層BL的搬運空間52L重疊。第二處理區塊層BU內的搬運空間52U係被中間隔壁16從下方區劃且被上隔壁17從上方區劃。上隔壁17係配置於與第一塔T1至第四塔T4的最上段的處理單元13U、23U、33U、43U的上表面整合之高度。The transportation space 52U, which is defined in the second processing block layer BU and used to provide the transportation path 51U, overlaps with the transportation space 52L of the first processing block layer BL. The transfer space 52U in the second processing block layer BU is partitioned from below by the middle partition wall 16 and partitioned from above by the upper partition wall 17 . The upper partition wall 17 is disposed at a height integrated with the upper surfaces of the uppermost processing units 13U, 23U, 33U, and 43U of the first to fourth towers T1 to T4.

俯視中的基板載置部6U的配置係與第一處理區塊層BL的情形相同。亦即，基板載置部6U係配置於索引機器人26與主搬運機器人8U之間並配置於搬運空間52U內的索引機器人26之側的端部。第二處理區塊層BU的基板載置部6U係以俯視觀看時與第一處理區塊層BL的基板載置部6L重疊之方式配置。基板載置部6U係於上下方向Z中配置於中間隔壁16與上隔壁17之間的高度。在本實施形態中，基板載置部6U係配置於比從中間隔壁16至上隔壁17為止的高度範圍的中間高度還下方。更具體而言，基板載置部6U係配置於能夠被索引機器人26存取的高度範圍內最高的位置。基板載置部6U的上下方向位置必須為索引機器人26能夠存取的高度範圍內且主搬運機器人8U能夠存取的高度範圍內。與第一處理區塊層BL的情形同樣地，基板載置部6U係包含：未處理基板載置部61，係載置未處理的基板W；以及已處理基板載置部62，係載置處理完畢的基板W。未處理基板載置部61以及已處理基板載置部62的構成係與第一處理區塊層BL的基板載置部6L的情形相同(參照圖5)。The arrangement of the substrate mount portion 6U in plan view is the same as that of the first processing block layer BL. That is, the substrate placement unit 6U is arranged between the index robot 26 and the main transfer robot 8U, and is arranged at an end portion on the side of the index robot 26 in the transfer space 52U. The substrate mounting part 6U of the second processing block layer BU is arranged so as to overlap the substrate mounting part 6L of the first processing block layer BL in plan view. The board|substrate mounting part 6U is arrange|positioned at the height between the intermediate partition wall 16 and the upper partition wall 17 in the up-down direction Z. In the present embodiment, the substrate mounting portion 6U is disposed below the middle height of the height range from the intermediate partition wall 16 to the upper partition wall 17 . More specifically, the substrate placement unit 6U is arranged at the highest position within the height range accessible by the index robot 26 . The vertical direction position of the board|substrate mounting part 6U needs to be within the height range which the index robot 26 can access, and the main transfer robot 8U must fall within the height range which can access. As in the case of the first processing block layer BL, the substrate mounting portion 6U includes: an unprocessed substrate mounting portion 61 for mounting an unprocessed substrate W; and a processed substrate mounting portion 62 for mounting The processed substrate W. The configurations of the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 are the same as those of the substrate mounting portion 6L of the first processing block layer BL (see FIG. 5 ).

以貫通索引區塊2的後隔壁2a以及處理區塊3的前隔壁3a之方式，亦即貫通索引區塊2與處理區塊3鄰接的隔壁之方式，形成有與基板載置部6U對應的窗4U。索引區機器人26係能經由窗4U存取基板載置部6U從而對基板載置部6U進行基板W的搬入以及搬出。 仿真基板收容部7U係設置於與基板載置部6U不同的高度，在本實施形態中在搬運空間52U內配置於基板載置部6U的上方。仿真基板收容部7U係以俯視觀看時與基板載置部6U彼此重疊之方式設置。更具體而言，在基板W被基板載置部6U保持且仿真基板DW被仿真基板收容部7U保持時，以俯視觀看時基板W與仿真基板DW彼此重疊之方式配置有仿真基板收容部7U。基板W與仿真基板DW的俯視的彼此重疊係可為局部性的彼此重疊，亦可為整體性的彼此重疊，亦即仿真基板DW亦可與基板W的大致整體重疊。仿真基板收容部7U係配置於上隔壁17與中間隔壁16之間的高度，主搬運機器人8U係配置於能夠存取的高度範圍內。索引區塊2的後隔壁2a以及處理區塊3的前隔壁3a亦即索引區塊2與處理區塊3鄰接的隔壁係位於仿真基板收容部7U的前方亦即索引區塊2之側。於這些後隔壁2a以及前隔壁3a未設置有與仿真基板收容部7U對應的窗。因此，索引機器人26係無法存取仿真基板收容部7U。 In the way of penetrating the rear partition wall 2a of the index block 2 and the front partition wall 3a of the processing block 3, that is, penetrating through the partition wall adjacent to the index block 2 and the processing block 3, a corresponding substrate mounting portion 6U is formed. Windows 4U. The index area robot 26 can access the substrate mounting part 6U through the window 4U, and can carry in and out the substrate W from the substrate mounting part 6U. The dummy substrate storage unit 7U is provided at a different height from the substrate placement unit 6U, and is disposed above the substrate placement unit 6U in the transfer space 52U in the present embodiment. The dummy substrate housing portion 7U is provided so as to overlap with the substrate mounting portion 6U in plan view. More specifically, when the substrate W is held by the substrate mounting portion 6U and the dummy substrate DW is held by the dummy substrate storage portion 7U, the dummy substrate storage portion 7U is arranged so that the substrate W and the dummy substrate DW overlap each other in plan view. The overlapping of the substrate W and the dummy substrate DW in plan view may be partial or overall, that is, the dummy substrate DW may overlap substantially the entirety of the substrate W. The dummy substrate storage unit 7U is arranged at a height between the upper partition wall 17 and the middle partition wall 16, and the main transfer robot 8U is arranged within a height range that can be accessed. The rear partition wall 2 a of the index block 2 and the front partition wall 3 a of the processing block 3 , that is, the partition wall adjacent to the index block 2 and the processing block 3 , are located in front of the dummy substrate housing portion 7U, that is, on the side of the index block 2 . No window corresponding to the dummy substrate storage portion 7U is provided in the rear partition wall 2a and the front partition wall 3a. Therefore, the index robot 26 cannot access the dummy substrate storage unit 7U.

仿真基板收容部7U的構成亦可與第一處理區塊層BL的仿真基板收容部7L的構成實質性地相同(參照圖6)。仿真基板收容部7U係具有複數段(在本實施形態中為與第二處理區塊層BU所具備的處理單元的數量相同數量)插槽(以下稱為「仿真基板插槽DU1至DU12」)，複數段插槽係以水平姿勢收容各一片仿真基板DW之方式於上下方向層疊。亦可具備有仿真基板感測器，仿真基板感測器係用以檢測各個仿真基板插槽DU1至DU12中有無仿真基板DW。The configuration of the dummy substrate storage unit 7U may be substantially the same as the configuration of the dummy substrate storage unit 7L of the first processing block layer BL (see FIG. 6 ). The dummy substrate housing section 7U has a plurality of slots (in this embodiment, the same number as the number of processing units included in the second processing block layer BU) slots (hereinafter referred to as "dummy substrate slots DU1 to DU12") , the plurality of slots are stacked up and down in the manner of accommodating each dummy substrate DW in a horizontal posture. It may also be provided with a dummy substrate sensor, which is used to detect whether there is a dummy substrate DW in each of the dummy substrate slots DU1 to DU12 .

主搬運機器人8U係配置於搬運空間52U內。主搬運機器人8U係包含：手部81，係以水平姿勢保持一片基板；以及手部驅動機構82，係驅動手部81。手部驅動機構82係包含兩個支柱83、垂直移動部84、水平移動部85、旋轉部86以及進退部87。這些構成係與第一處理區塊層BL的主搬運機器人8L相同。主搬運機器人8U係構成為能夠存取基板載置部6U、處理單元11U至43U以及仿真基板收容部7U。主搬運機器人8U為第二搬運單元的一例，用以在基板載置部6U與處理單元11U至43U之間搬運基板W且在仿真基板收容部7U與處理單元11U至43U之間搬運仿真基板DW。The main transport robot 8U is arranged in the transport space 52U. The main transfer robot 8U includes: a hand 81 for holding a substrate in a horizontal posture; and a hand driving mechanism 82 for driving the hand 81 . The hand driving mechanism 82 includes two pillars 83 , a vertical movement part 84 , a horizontal movement part 85 , a rotation part 86 and an advancing and retreating part 87 . These configurations are the same as those of the main transfer robot 8L of the first processing block layer BL. The main transfer robot 8U is configured to be able to access the substrate placement unit 6U, the processing units 11U to 43U, and the dummy substrate storage unit 7U. The main transfer robot 8U is an example of the second transfer unit for transferring the substrate W between the substrate mounting portion 6U and the processing units 11U to 43U and for transferring the dummy substrate DW between the dummy substrate storage portion 7U and the processing units 11U to 43U. .

第一處理區塊層BL與第二處理區塊層BU係被中間隔壁16區劃，無法越過中間隔壁16搬運製品基板W或者仿真基板DW。換言之，第一處理區塊層BL的主搬運機器人8L係構成為皆無法存取第二處理區塊層BU的處理單元11U至43U、仿真基板收容部7U以及基板載置部6U。同樣地，第二處理區塊層BU的主搬運機器人8U係構成為皆無法存取第一處理區塊層BL的處理單元11L至43L、仿真基板收容部7L以及基板載置部6L。The first processing block layer BL and the second processing block layer BU are partitioned by the intermediate partition wall 16 , and the product substrate W or the dummy substrate DW cannot be transported across the intermediate partition wall 16 . In other words, the main transfer robot 8L of the first processing block layer BL is configured so that none of the processing units 11U to 43U, the dummy substrate storage portion 7U, and the substrate mounting portion 6U of the second processing block layer BU can be accessed. Similarly, the main transfer robot 8U of the second processing block layer BU is configured such that none of the processing units 11L to 43L, the dummy substrate storage portion 7L, and the substrate mounting portion 6L of the first processing block layer BL can access.

第一液體供給部91至第四液體供給部94係區劃液體配管空間，液體配管空間係收容用以供給在處理單元11L至43L、11U至43U所使用的處理液之配管群。各個第一液體供給部91至第四液體供給部94所區劃的液體配管空間係於上下方向Z貫通第一處理區塊層BL以及第二處理區塊層BU。於各個第一液體供給部91至第四液體供給部94收容有處理液配管56，處理液配管56係對俯視觀看時在相同位置於上下方向Z六段地層疊從而形成第一塔T1至第四塔T4之六個處理單元11L、12L、13L、11U、12U、13U、21L、22L、23L、21U、22U、23U、31L、32L、33L、31U、32U、33U、41L、42L、43L、41U、42U、43U供給處理液。亦可於第一液體供給部91至第四液體供給部94進一步地一併收容有處理液關聯機器，處理液關聯機器為設置於配管中途的閥群、流量計、用以暫時儲留處理液之筒槽、用以輸送液體之泵等。The first liquid supply unit 91 to the fourth liquid supply unit 94 define a liquid piping space, and the liquid piping space accommodates a group of piping for supplying processing liquid used in the processing units 11L to 43L, 11U to 43U. The liquid piping space partitioned by each of the first liquid supply part 91 to the fourth liquid supply part 94 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first liquid supply part 91 to the fourth liquid supply part 94 accommodates the processing liquid piping 56, and the processing liquid piping 56 is stacked in six stages at the same position in the vertical direction Z in a plan view to form the first tower T1 to the second tower T1. Six processing units of four towers T4 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, and 43U supply processing liquid. The first liquid supply part 91 to the fourth liquid supply part 94 may further contain processing liquid-related equipment. The processing liquid-related equipment is a group of valves and flowmeters installed in the middle of the piping to temporarily store the processing liquid. Tanks for tanks, pumps for transporting liquids, etc.

第一排氣部101至第四排氣部104係區劃排氣配管空間，排氣配管空間係收容用以將處理單元內部的氛圍(atmosphere)排氣之配管群。各個第一排氣部101至第四排氣部104所區劃的排氣配管空間係於上下方向Z貫通第一處理區塊層BL以及第二處理區塊層BU。於各個第一排氣部101至第四排氣部104收容有排氣配管76，排氣配管76係用以將來自俯視觀看時在相同位置於上下方向Z六段地層疊從而形成第一塔T1至第四塔T4之六個處理單元11L、12L、13L、11U、12U、13U、21L、22L、23L、21U、22U、23U、31L、32L、33L、31U、32U、33U、41L、42L、43L、41U、42U、43U的排氣導引至基板處理裝置1的外部的排氣設備。亦可於第一排氣部101至第四排氣部104進一步地一併收容有切換機構77，切換機構77係因應處理單元內的處理的種類(更具體而言為處理液的種類)來切換排氣配管76。雖然省略圖示，然而第一排氣部101係包含用以驅動切換機構77之致動器種類。The first exhaust section 101 to the fourth exhaust section 104 define an exhaust piping space, and the exhaust piping space accommodates a group of piping for exhausting the atmosphere inside the processing unit. The exhaust piping space partitioned by each of the first exhaust part 101 to the fourth exhaust part 104 penetrates the first processing block layer BL and the second processing block layer BU in the vertical direction Z. Each of the first exhaust section 101 to the fourth exhaust section 104 accommodates exhaust pipes 76, and the exhaust pipes 76 are used to form the first tower by stacking six sections from the same position in the vertical direction Z in a plan view. Six processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U, 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L from T1 to the fourth tower T4 , 43L, 41U, 42U, and 43U are guided to exhaust equipment outside the substrate processing apparatus 1 . A switching mechanism 77 can also be further accommodated in the first exhaust part 101 to the fourth exhaust part 104, and the switching mechanism 77 is configured according to the type of processing in the processing unit (more specifically, the type of processing liquid). The exhaust piping 76 is switched. Although not shown, the first exhaust unit 101 includes an actuator type for driving the switching mechanism 77 .

承載器搬運機構300(參照圖1)以下述方式動作：將收容了未處理的製品基板W的承載器C搬入至承載器保持部25，並將收容了處理完畢的製品基板W的承載器C從承載器保持部25搬出。此外，承載器搬運機構300係以下述方式動作：將收容了未使用的仿真基板DW的供給用的仿真承載器DC搬入至承載器保持部25，並將未使用的仿真基板DW從該供給用的仿真承載器DC移出後，將該仿真承載器DC從承載器保持部25搬出。再者，承載器搬運機構300係以下述方式動作：將用以回收使用完畢的仿真基板DW之回收用的仿真承載器DC搬入至承載器保持部25，並在使用完畢的仿真基板DW被收容至該回收用的仿真承載器DC後，將該回收用的仿真承載器DC從承載器保持部25搬出。仿真承載器DC亦可具有與製品基板W用的承載器C實質性相同的構成。The carrier transport mechanism 300 (see FIG. 1 ) operates in such a manner that the carrier C containing the unprocessed product substrate W is carried into the carrier holding part 25, and the carrier C containing the processed product substrate W is moved into the carrier holding part 25. Take out from the carrier holding part 25. In addition, the carrier transport mechanism 300 is operated so that the supply dummy carrier DC storing the unused dummy substrate DW is carried into the carrier holding part 25, and the unused dummy substrate DW is transferred from the supply dummy carrier DC to the carrier holding part 25. After the dummy carrier DC is removed, the dummy carrier DC is carried out from the carrier holding part 25 . Furthermore, the carrier transport mechanism 300 is operated in such a manner that the dummy carrier DC for recovering the used dummy substrate DW is loaded into the carrier holding unit 25 and stored in the used dummy substrate DW. After reaching the dummy carrier DC for recovery, the dummy carrier DC for recovery is carried out from the carrier holding unit 25 . The dummy carrier DC may have substantially the same configuration as the carrier C for the product substrate W.

典型而言，承載器搬運機構300係包含天花板行進無人搬運工具 (OHT: Overhead Hoist Transport；懸吊式輸送裝置)。承載器搬運機構300係在承載器置放處350與承載器保持部25(裝載埠)之間搬運承載器C。此外，承載器搬運機構300係在仿真承載器置放處351與承載器保持部25之間搬運仿真承載器DC。Typically, the carrier transport mechanism 300 includes an overhead traveling unmanned transport tool (OHT: Overhead Hoist Transport; suspended transport device). The carrier transfer mechanism 300 transfers the carrier C between the carrier placement place 350 and the carrier holding part 25 (loading port). In addition, the carrier transport mechanism 300 transports the dummy carrier DC between the dummy carrier placement place 351 and the carrier holding part 25 .

承載器搬運機構300係被主機電腦(host computer)150控制，搬運承載器C以及仿真承載器DC。主機電腦150係能夠經由通訊線170而與基板處理裝置1的控制器110通訊。 控制器110係控制索引機器人26以及主搬運機器人8L、8U進行基板W以及仿真基板DW的搬運。此外，控制器110係控制處理單元11L至43L、11U至43U的各部執行處理單元11L至43L、11U至43U中的基板處理以及使用了仿真基板DW的仿真處理。 The carrier transport mechanism 300 is controlled by a host computer (host computer) 150 to transport the carrier C and the dummy carrier DC. The host computer 150 can communicate with the controller 110 of the substrate processing apparatus 1 through the communication line 170 . The controller 110 controls the index robot 26 and the main transfer robots 8L and 8U to transfer the substrate W and the dummy substrate DW. In addition, the controller 110 controls each part of the processing units 11L to 43L, 11U to 43U to execute the substrate processing in the processing units 11L to 43L, 11U to 43U and the dummy processing using the dummy substrate DW.

圖7係用以說明處理單元11L至43L、11U至43U(以下在總稱時稱為「處理單元11L至43U」)的構成例之示意性的剖視圖。處理單元11L至43U係包含：單元隔壁36，係形成處理室35(腔室(chamber))；處理罩(processing cup)39，係配置於單元隔壁36內；自轉夾具(spin chuck)40，係配置於處理罩39內；以及噴嘴55，係對被自轉夾具40保持的基板W或者仿真基板DW供給處理液。FIG. 7 is a schematic cross-sectional view for explaining a configuration example of the processing units 11L to 43L, 11U to 43U (hereinafter collectively referred to as “processing units 11L to 43U”). The processing units 11L to 43U include: a unit partition 36 forming a processing chamber 35 (chamber); a processing cup 39 disposed in the unit partition 36; a spin chuck 40 forming a processing chamber 35 (chamber); It is arranged in the processing cover 39 ; and the nozzle 55 supplies the processing liquid to the substrate W or the dummy substrate DW held by the rotary jig 40 .

單元隔壁36係包含：側壁36a，係例如作成俯視觀看時大致矩形；頂壁36b，係區劃上方；以及底壁36c，係區劃下方。側壁36a的一面係具有：基板搬入搬出口37，係面向搬運空間52U並沿著第一水平方向X以及上下方向Z延伸，用以搬入以及搬出基板W或者仿真基板DW。基板搬入搬出口37亦可具有於第一水平方向X延伸的插槽形狀。配置有用以將基板搬入搬出口37打開以及關閉之擋門(shutter)38。基板W或者仿真基板DW係從形成於單元隔壁36的基板搬入搬出口37被搬入並被傳遞至自轉夾具40。The cell partition wall 36 includes: a side wall 36a, which is, for example, substantially rectangular in plan view; a top wall 36b, which is above the section; and a bottom wall 36c, which is below the section. One side of the side wall 36a has a substrate loading and unloading port 37 facing the transportation space 52U and extending along the first horizontal direction X and the vertical direction Z for loading and unloading the substrate W or the dummy substrate DW. The substrate loading/unloading port 37 may have a slot shape extending in the first horizontal direction X. A shutter 38 for opening and closing the substrate loading and unloading port 37 is arranged. The substrate W or the dummy substrate DW is carried in from the substrate carry-in/out port 37 formed in the cell partition wall 36 and transferred to the rotation jig 40 .

自轉夾具40係包含：自轉基座(spin base)45，係以水平姿勢保持一片基板W或者仿真基板DW；以及自轉馬達(spin motor)46，係使自轉基座45繞著鉛直的旋轉軸線旋轉。自轉夾具40亦可為真空型的夾具，用以將基板W或者仿真基板DW的下表面吸附並保持於自轉基座45的上表面。此外，自轉基座45亦可構成機械型的夾具，係具有與基板W或者仿真基板DW對應的圓形的平面形狀，並具備於周緣部的周方向隔著間隔設置的三個以上的保持銷，藉由這些保持銷來握持基板W或者仿真基板DW。The spin fixture 40 includes: a spin base (spin base) 45, which holds a substrate W or a dummy substrate DW in a horizontal posture; and a spin motor (spin motor) 46, which makes the spin base 45 rotate around a vertical rotation axis. . The autorotation jig 40 can also be a vacuum type jig, which is used to absorb and hold the lower surface of the substrate W or the dummy substrate DW on the upper surface of the autorotation base 45 . In addition, the rotation base 45 may also constitute a mechanical jig, which has a circular planar shape corresponding to the substrate W or the dummy substrate DW, and is provided with three or more holding pins arranged at intervals in the circumferential direction of the peripheral portion. , the substrate W or the dummy substrate DW is held by these holding pins.

處理單元11L至43U係包含：一個以上的噴嘴55，係對被自轉夾具40保持的基板W或者仿真基板DW供給處理液。在本實施形態中，具備有複數個噴嘴55。複數個噴嘴55亦可包含：複數個藥液噴嘴，係使用於分別噴出複數種類的藥液。 從噴嘴55對被自轉夾具40保持且旋轉中的基板W或者仿真基板DW的表面供給處理液。噴嘴55係結合至通過第一液體供給部91至第四液體供給部94而配置的處理液配管56。處理液配管56係通過第一液體供給部91至第四液體供給部94繞回且連接至處理液供給源54。於處理液配管56的中途夾設有用以將處理液配管56的流路打開以及關閉之閥59。此外，於處理液配管56的中途夾設有用以將處理液朝向噴嘴55輸送之泵60。閥59以及泵60係配置於第一液體供給部91至第四液體供給部94。處理液供給源54係供給蝕刻液等藥液或者純水(去離子水)等清洗液。亦可因應處理液的種類設置有複數個處理液配管56以及對應的複數個噴嘴55。複數個噴嘴55的一部分或者全部亦可具有移動噴嘴的形態，移動噴嘴的形態係在基板W或者仿真基板DW的上方沿著基板W或者仿真基板DW的上表面移動。移動噴嘴亦可具有下述構造(參照圖1)：藉由配置於自轉夾具40側方的擺動軸58支撐水平的噴嘴臂57的基端部，使擺動軸58繞著鉛直軸線轉動。複數個噴嘴55的一部分或者全部亦可為相對於自轉夾具40的相對位置不會變動的固定噴嘴。 The processing units 11L to 43U include one or more nozzles 55 , and supply the processing liquid to the substrate W or the dummy substrate DW held by the rotary chuck 40 . In this embodiment, a plurality of nozzles 55 are provided. The plurality of nozzles 55 may also include: a plurality of chemical liquid nozzles, which are used to spray a plurality of types of chemical liquids respectively. The processing liquid is supplied from the nozzle 55 to the surface of the rotating substrate W or the dummy substrate DW held by the rotation chuck 40 . The nozzle 55 is connected to the processing liquid pipe 56 arranged through the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid pipe 56 is looped through the first liquid supply part 91 to the fourth liquid supply part 94 and connected to the processing liquid supply source 54 . A valve 59 for opening and closing the flow path of the processing liquid piping 56 is interposed in the middle of the processing liquid piping 56 . In addition, a pump 60 for sending the processing liquid toward the nozzle 55 is interposed in the middle of the processing liquid piping 56 . The valve 59 and the pump 60 are arranged in the first liquid supply part 91 to the fourth liquid supply part 94 . The processing liquid supply source 54 supplies chemical liquid such as etching liquid or cleaning liquid such as pure water (deionized water). A plurality of processing liquid piping 56 and a corresponding plurality of nozzles 55 may also be provided according to the type of processing liquid. Part or all of the plurality of nozzles 55 may be in the form of a moving nozzle that moves above the substrate W or the dummy substrate DW along the upper surface of the substrate W or the dummy substrate DW. The moving nozzle may also have a structure (refer to FIG. 1 ) in which a base end of a horizontal nozzle arm 57 is supported by a swing shaft 58 disposed on the side of the rotation jig 40 so that the swing shaft 58 rotates around a vertical axis. Some or all of the plurality of nozzles 55 may be fixed nozzles whose relative positions with respect to the rotary jig 40 do not change.

單元隔壁36內的氛圍係經由貫通單元隔壁36之排氣連接管75而被排氣。排氣連接管75係連接至配置在第一排氣部101至第四排氣部104的排氣配管76。排氣連接管75亦可經由切換機構77連接至複數個排氣配管76。切換機構77係以下述方式動作：例如因應從複數個噴嘴55噴出的處理液的種類(例如藥液的種類)，將來自排氣連接管75的排氣導引至被預先賦予對應至該處理液的種類之排氣配管76。The atmosphere in the unit partition wall 36 is exhausted through the exhaust connection pipe 75 penetrating the unit partition wall 36 . The exhaust connection pipe 75 is connected to the exhaust pipes 76 arranged in the first exhaust section 101 to the fourth exhaust section 104 . The exhaust connection pipe 75 may be connected to a plurality of exhaust pipes 76 via a switching mechanism 77 . The switching mechanism 77 is operated in the following manner: For example, in response to the type of processing liquid (such as the type of chemical liquid) ejected from the plurality of nozzles 55, the exhaust from the exhaust connection pipe 75 is guided to the area assigned in advance corresponding to the processing. Exhaust piping 76 for the type of liquid.

圖8係用以說明與基板處理裝置1的控制有關的構成之方塊圖。基板處理裝置1係具備控制器110。控制器110亦可為包含處理器111(CPU(Central Processing Unit；中央處理單元))以及記憶體112(記憶部)之電腦。處理器111係執行被儲存於記憶體112的程式120。藉此，控制器110係實現：基板搬運動作，係藉由索引機器人26以及主搬運機器人8L、8U搬運基板W或者仿真基板DW；基板處理動作，係藉由處理單元11L至43U處理基板W；以及仿真處理動作，係在處理單元11L至43U中執行使用了仿真基板DW的仿真處理。為了這些動作，控制器110係控制基板處理裝置1所具備的各種控制對象。控制對象係包含索引機器人26、主搬運機器人8L、8U以及處理單元11L至43U等所具備的驅動部。再者，控制器110的控制對象係包含：致動器種類，係配置於第一排氣部101至第四排氣部104，且包含配置於第一液體供給部91至第四液體供給部94的閥95以及泵60。FIG. 8 is a block diagram for explaining the structure related to the control of the substrate processing apparatus 1 . The substrate processing apparatus 1 includes a controller 110 . The controller 110 may also be a computer including a processor 111 (CPU (Central Processing Unit; Central Processing Unit)) and a memory 112 (memory unit). The processor 111 executes the program 120 stored in the memory 112 . In this way, the controller 110 realizes: the substrate transport operation, the substrate W or the dummy substrate DW is transported by the index robot 26 and the main transport robots 8L, 8U; the substrate processing operation, the substrate W is processed by the processing units 11L to 43U; And the simulation processing operation is to execute the simulation processing using the dummy substrate DW in the processing units 11L to 43U. For these operations, the controller 110 controls various control objects included in the substrate processing apparatus 1 . Control objects include driving units included in the index robot 26 , the main transfer robots 8L and 8U, and the processing units 11L to 43U. Moreover, the control object of the controller 110 includes: the types of actuators, which are arranged in the first exhaust part 101 to the fourth exhaust part 104, and include the actuators arranged in the first liquid supply part 91 to the fourth liquid supply part. 94 valve 95 and pump 60.

於記憶體112儲存有各種資料130。資料130係包含：製品處方(products recipe)131，係用以處理製品用的基板W；以及仿真處理處方132，係用於使用了仿真基板DW的仿真處理。製品處方131為用以規定基板W的搬運動作以及對於基板W的處理內容之資料。仿真處理處方132為用以規定仿真基板DW的搬運動作以及使用了仿真基板DW的處理內容之資料。控制器110係在處理基板W時，依循製品處方131控制控制對象；在執行仿真處理時，依循仿真處理處方132控制控制對象。Various data 130 are stored in the memory 112 . The data 130 includes: a products recipe (products recipe) 131 for processing the substrate W for products; and a dummy processing recipe 132 for dummy processing using the dummy substrate DW. The product recipe 131 is data for specifying the transport operation of the substrate W and the processing content of the substrate W. The simulation processing recipe 132 is data for specifying the transfer operation of the dummy board DW and the content of processing using the dummy board DW. The controller 110 controls the control object according to the product recipe 131 when processing the substrate W; and controls the control object according to the simulation processing recipe 132 when executing the simulation process.

製品處方131亦可藉由來自能夠通訊地被連接至控制器110之主機電腦150的資料通訊而被賦予並被儲存於記憶體112。仿真處理處方132亦可同樣地藉由來自主機電腦150的資料通訊而被賦予並被儲存於記憶體112。此外，這些製品處方131、仿真處理處方132亦可讓操作者使用連接至控制器110的使用者介面140來輸入或者編輯。仿真處理處方132亦可因應製品處方131的內容由控制器110自動地生成。製品處方131以及仿真處理處方132皆無須為一個種類，且複數個製品處方131或者複數個仿真處理處方132亦可儲存於記憶體112。Product recipe 131 may also be assigned and stored in memory 112 by data communication from host computer 150 communicatively connected to controller 110 . The simulation processing recipe 132 can also be given and stored in the memory 112 through data communication from the host computer 150 in the same way. In addition, these product recipes 131 and simulation processing recipes 132 can also be input or edited by the operator using the user interface 140 connected to the controller 110 . The simulation processing recipe 132 can also be automatically generated by the controller 110 according to the contents of the product recipe 131 . The product recipe 131 and the simulation processing recipe 132 do not need to be of the same type, and a plurality of product recipes 131 or a plurality of simulation processing recipes 132 can also be stored in the memory 112 .

例如，仿真處理處方132係包含：預處理處方，係規定預處理，該預處理係對仿真基板DW實施與製品用的基板W同樣的處理。預處理處方亦可為下述處方：在製品處方131中，將搬入至處理單元11L至43U的基板從製品用的基板W置換成仿真基板DW。此種預處理處方亦可為控制器110基於製品處方131自動地生成。例如，在進行用以對基板W供給高溫的處理液之處理的情形中，藉由執行預處理，能將高溫的處理液導引至噴嘴55，且能藉由高溫的處理液加熱處理液配管56以及處理單元11L至43U的內部。藉此，能在經過適當的溫度管理的環境對製品用的基板W供給適當的溫度的處理液。如此，預處理為準備處理的一例，為了適當地處理製品用的基板W而整頓處理單元11L至43U的處理環境。For example, the simulation processing recipe 132 includes a preprocessing recipe that prescribes preprocessing in which the same processing as that of the substrate W for the product is performed on the dummy substrate DW. The preprocessing recipe may be a recipe for replacing substrates carried into the processing units 11L to 43U from the substrates W for products with dummy substrates DW in the product recipe 131 . Such a pretreatment recipe can also be automatically generated by the controller 110 based on the product recipe 131 . For example, in the case of performing a process for supplying a high-temperature processing liquid to the substrate W, by performing pre-processing, the high-temperature processing liquid can be guided to the nozzle 55, and the processing liquid piping can be heated by the high-temperature processing liquid. 56 and the interior of the processing units 11L to 43U. Thereby, the processing liquid at an appropriate temperature can be supplied to the substrate W for a product in an environment with appropriate temperature control. In this way, the pre-processing is an example of pre-processing, and the processing environments of the processing units 11L to 43U are adjusted in order to properly process the substrate W for products.

此外，仿真處理處方132係包含：單元洗淨處方，係使自轉夾具40保持仿真基板DW，並洗淨處理單元11L至43U的內部。依循單元洗淨處方所進行的單元洗淨處理係使自轉夾具40保持仿真基板DW並使仿真基板DW旋轉，在此狀態下將洗淨液(藥液或者純水)供給至仿真基板DW。藉此，在仿真基板DW上接受離心力的洗淨液係飛散至自轉夾具40的周圍從而洗淨處理罩39的內部。由於因應需要使處理罩39上下動作從而洗淨液相對於處理罩39的內壁面之射入位置會上下地變化，因此能有效率地洗淨處理罩39的內壁面。此外，亦能藉由處理罩39的上下動作或者自轉夾具40的上下動作將仿真基板DW配置於比處理罩39的上端還上方，對處理罩39的外部的處理室35的內部供給洗淨液，從而洗淨處理室35的內部。Furthermore, the dummy processing recipe 132 includes a unit cleaning recipe for cleaning the inside of the processing units 11L to 43U while holding the dummy substrate DW in the rotary jig 40 . In the unit cleaning process according to the unit cleaning recipe, the dummy substrate DW is held and rotated by the rotary jig 40 , and a cleaning solution (chemical solution or pure water) is supplied to the dummy substrate DW in this state. Thereby, the cleaning solution subjected to the centrifugal force on the dummy substrate DW is scattered around the rotation jig 40 to clean the inside of the processing cover 39 . Since the injection position of the cleaning solution relative to the inner wall surface of the processing cover 39 is vertically changed by moving the processing cover 39 up and down as required, the inner wall surface of the processing cover 39 can be cleaned efficiently. In addition, the dummy substrate DW can be arranged above the upper end of the processing cover 39 by the vertical movement of the processing cover 39 or the vertical movement of the rotation jig 40, and the cleaning solution can be supplied to the inside of the processing chamber 35 outside the processing cover 39. , thereby cleaning the inside of the processing chamber 35.

儲存於記憶體112的資料130係進一步包含：仿真基板表133，係將複數個處理單元11L至43U與仿真基板收容部7L、7U的仿真基板插槽DL1至DL12、DU1至DU12賦予對應。於複數個仿真基板插槽DL1至DL12、DU1至DU12分別附有唯一的仿真基板插槽號碼(仿真基板插槽識別資訊)。而且，對各個處理單元11L至43U賦予對應一個仿真基板插槽號碼。仿真基板表133係將第一處理區塊層BL的複數個(在本實施形態中為12個)處理單元11L至43U與該第一處理區塊層BL的仿真基板收容部7L的複數個(在本實施形態中為12個)仿真基板插槽號碼一對一地賦予對應。此外，仿真基板表133係將第二處理區塊層BU的複數個(在本實施形態中為12個)處理單元11L至43U與該第二處理區塊層BU的仿真基板收容部7U的複數個(在本實施形態中為12個)仿真基板插槽號碼一對一地賦予對應。因此，仿真基板表133係將基板處理裝置1所具備的複數個(在本實施形態中為24個)處理單元11L至43U與仿真基板收容部7L、7U的複數個(在本實施形態中為24個)插槽號碼一對一地賦予對應。The data 130 stored in the memory 112 further includes: a dummy board table 133 , which associates a plurality of processing units 11L to 43U with the dummy board slots DL1 to DL12 and DU1 to DU12 of the dummy board storage parts 7L and 7U. Unique dummy board slot numbers (dummy board slot identification information) are attached to the plurality of dummy board slots DL1 to DL12, DU1 to DU12 respectively. Also, a corresponding one of the dummy board slot numbers is assigned to each of the processing units 11L to 43U. The dummy substrate table 133 is a list of a plurality (12 in this embodiment) of the processing units 11L to 43U of the first processing block layer BL and a plurality of ( In the present embodiment, there are 12) dummy substrate slot numbers are assigned one-to-one correspondence. In addition, the dummy substrate table 133 is a combination of a plurality of (12 in this embodiment) processing units 11L to 43U of the second processing block layer BU and a plurality of dummy substrate storage parts 7U of the second processing block layer BU. Each (12 in the present embodiment) dummy substrate slot numbers are assigned a one-to-one correspondence. Therefore, the dummy substrate table 133 is a list of a plurality of (24 in this embodiment) processing units 11L to 43U included in the substrate processing apparatus 1 and a plurality of dummy substrate storage units 7L and 7U (in this embodiment, 24) Slot numbers are given one-to-one correspondence.

儲存於記憶體112的資料130係進一步包含仿真基板歷程資料134。仿真基板歷程資料134係包含用以表示仿真基板DW的使用歷程之資料(使用歷程資訊)，該仿真基板DW係被收容至分別與仿真基板收容部7L、7U的複數個仿真基板插槽號碼對應的仿真基板插槽DL1至DL12、DU1至DU12。較佳為使用歷程係包含仿真基板DW被使用於處理單元11L至43U的處理之使用次數(累積次數)、仿真基板DW被使用於處理單元11L至43U的處理之使用時間(累積時間)以及仿真基板DW在處理單元11L至43U所接受之處理內容的歷程的至少一者。The data 130 stored in the memory 112 further includes simulated substrate history data 134 . The dummy board history data 134 includes data (usage history information) for indicating the use history of the dummy board DW, which is accommodated to correspond to a plurality of dummy board slot numbers of the dummy board storage parts 7L and 7U, respectively. Dummy baseboard slots DL1 to DL12, DU1 to DU12. Preferably, the usage history includes the number of times (cumulative times) when the dummy substrate DW is used in the processing of the processing units 11L to 43U, the usage time (cumulative time) of the dummy substrate DW being used in the processing of the processing units 11L to 43U, and the simulation At least one of the histories of the processing contents received by the substrate DW in the processing units 11L to 43U.

儲存於記憶體112的資料130係進一步包含：單元使用歷程資料135，係表示各個處理單元11L至43U的單元使用歷程。較佳為單元使用歷程資料135係包含各個處理單元11L至43U的基板處理片數以及不使用持續時間，該不使用持續時間係表示各個處理單元11L至43U不被使用於基板處理之連續時間。由於處理單元11L至43U的內部的環境係會因為反復進行基板處理而緩緩地惡化，因此較佳為對無須維護即能連續地進行處理之基板片數設定適當的上限。此外，當未處理基板W之時間變長時，處理單元11L至43U的內部的環境會緩緩地惡化。具體而言，會有附著於處理罩39的內壁等之藥液乾燥並結晶化從而成為微粒(particle)的原因之情形。此外，在使用溫度比室溫還高之高溫的處理液之情形中，當因為不使用狀態持續導致處理液的流通被長時間地阻斷時，處理液配管56或者噴嘴55的溫度會降低。因此，會有下述情形：在下一次噴出處理液時，處理液的熱量被處理液配管56或者噴嘴55奪取，從而剛噴出的處理液的溫度變得不適當。因此，較佳為亦針對不使用持續時間設定適當的上限。將單元使用歷程資料135(基板處理片數、不使用持續時間等)與對應的設定值進行比較，藉此能判斷是否需要對處理單元11L至43U進行維護。The data 130 stored in the memory 112 further includes: unit usage history data 135 , which represents the unit usage history of each processing unit 11L to 43U. Preferably, the unit use history data 135 includes the number of substrates processed by each processing unit 11L to 43U and the non-use duration, which represents the continuous time that each processing unit 11L to 43U is not used for substrate processing. Since the internal environment of the processing units 11L to 43U gradually deteriorates due to repeated substrate processing, it is preferable to set an appropriate upper limit on the number of substrates that can be continuously processed without maintenance. In addition, when the time for which the substrate W is not processed becomes longer, the environment inside the processing units 11L to 43U gradually deteriorates. Specifically, the chemical solution adhering to the inner wall of the processing cover 39 or the like dries and crystallizes to cause particles. Also, in the case of using a treatment liquid whose temperature is higher than room temperature, if the flow of the treatment liquid is blocked for a long time due to the continuation of non-use, the temperature of the treatment liquid pipe 56 or the nozzle 55 will drop. Therefore, when the processing liquid is discharged next time, the heat of the processing liquid is taken away by the processing liquid pipe 56 or the nozzle 55, and the temperature of the processing liquid just discharged may become inappropriate. Therefore, it is preferable to set an appropriate upper limit also for the non-use duration. Comparing the unit use history data 135 (the number of substrates processed, the non-use duration, etc.) with the corresponding set values, it can be determined whether the processing units 11L to 43U need to be maintained.

圖9係用以說明與仿真處理有關的控制器110的動作之流程圖。控制器110係針對複數個處理單元11L至43U各者並行地或者依序地執行圖9的處理。 控制器110係判斷是否在對象的處理單元11L至43U中執行製品用的基板W的處理(步驟A1)。當在處理單元11L至43U中結束基板W的處理且處理完畢的基板W從處理單元11L至43U被搬出時(步驟A1：否)，控制器110係參照該處理單元11L至43U的單元使用歷程資料135來判斷基板處理片數是否已經到達設定值(步驟A2)。在基板處理片數為設定值以上時(步驟A2：是)，控制器110係判斷成單元洗淨執行條件(維護執行條件的一例)已經充足，為了洗淨處理單元11L至43U的內部而依循單元洗淨處方執行單元洗淨處理(維護處理的一例)(步驟A3)。此外，控制器110係將該處理單元的基板處理片數重置成初始值(例如為零)並更新單元使用歷程資料135(步驟A4)。 FIG. 9 is a flowchart for explaining the operation of the controller 110 related to the simulation process. The controller 110 executes the process of FIG. 9 in parallel or sequentially for each of the plurality of processing units 11L to 43U. The controller 110 judges whether or not the processing of the substrate W for a product is performed in the target processing units 11L to 43U (step A1 ). When the processing of the substrate W in the processing units 11L to 43U is completed and the processed substrate W is carried out from the processing units 11L to 43U (step A1: No), the controller 110 refers to the unit use history of the processing units 11L to 43U Data 135 to determine whether the number of substrates processed has reached the set value (step A2). When the number of substrates to be processed is equal to or greater than the set value (step A2: Yes), the controller 110 judges that the unit cleaning execution condition (an example of the maintenance execution condition) is sufficient, and follows to clean the inside of the processing units 11L to 43U. The unit cleaning recipe executes unit cleaning processing (an example of maintenance processing) (step A3). In addition, the controller 110 resets the number of substrates processed by the processing unit to an initial value (for example, zero) and updates the unit use history data 135 (step A4 ).

單元洗淨處理為仿真處理的一例，並包含仿真基板搬入步驟A31、仿真處理步驟A32以及仿真基板收容步驟A33。仿真基板搬入步驟A31為下述步驟：主搬運機器人8L、8U係從對應的仿真基板插槽DL1至DL12、DU1至DU12搬出仿真基板DW，朝處理單元11L至43U搬運並搬入至該處理單元。仿真處理步驟A32為用以在該處理單元中執行使用了仿真基板DW的處理之步驟，在此為該處理單元的內部的洗淨處理。仿真基板收容步驟A33為下述步驟：在處理單元內部的洗淨之後，從該處理單元搬出仿真基板DW並搬運且收容至原本的仿真基板插槽DL1至DL12、DU1至DU12。控制器110係參照仿真基板表133來特定與該處理單元11L至43U對應的仿真基板插槽DL1至DL12、DU1至DU12，並執行仿真基板搬入步驟A31以及仿真基板收容步驟A33。The unit cleaning process is an example of a dummy process, and includes a dummy substrate loading step A31 , a dummy processing step A32 , and a dummy substrate storage step A33 . The dummy substrate loading step A31 is the following steps: the main transfer robots 8L and 8U carry out the dummy substrate DW from the corresponding dummy substrate slots DL1 to DL12 and DU1 to DU12, and carry it to and into the processing units 11L to 43U. The dummy processing step A32 is a step for executing processing using the dummy substrate DW in the processing unit, and here is cleaning processing inside the processing unit. The dummy board storage step A33 is a step of unloading the dummy board DW from the processing unit after cleaning the inside of the processing unit, transporting and storing it in original dummy board slots DL1 to DL12 , DU1 to DU12 . The controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U, and executes the dummy board loading step A31 and the dummy board storing step A33 .

當結束單元洗淨處理時，控制器110係判斷是否需要用以整頓處理單元11L至43U的處理環境(處理條件)之預處理(步驟A5、A6)。具體而言，控制器110係調查是否從主機電腦150被賦予製品基板的處理請求(處理預約)(步驟A5)。當被賦予製品基板的處理請求時(步驟A5：是)，控制器110係判斷該處理單元11L至43U的不使用持續時間是否已經到達設定值(步驟A6)。在不使用持續時間為設定值以上之情形(步驟A6：是)，亦即在處理單元11L至43U超過預定的長時間未被使用於製品用的基板W之情形中，控制器110係判斷成需要預處理，亦即判斷成預處理執行條件(維護執行條件的一例)已經充足。When the unit cleaning process is finished, the controller 110 judges whether pre-processing for adjusting the processing environment (processing conditions) of the processing units 11L to 43U is necessary (steps A5, A6). Specifically, the controller 110 checks whether or not a processing request (processing reservation) for a product substrate has been given from the host computer 150 (step A5). When given a processing request for a product substrate (step A5: Yes), the controller 110 judges whether the non-use duration of the processing units 11L to 43U has reached a set value (step A6). In the case where the non-use duration is more than the set value (step A6: Yes), that is, in the case where the processing units 11L to 43U have not been used for a substrate W for a product for a predetermined long time, the controller 110 determines that Preprocessing is required, that is, it is determined that the preprocessing execution condition (an example of maintenance execution condition) is sufficient.

當判斷成需要預處理時，控制器110係依循預處理處方執行預處理(預處理步驟A7)。具體而言，控制器110係參照仿真基板表133來特定與該處理單元11L至43U對應的仿真基板插槽DL1至DL12、DU1至DU12。而且，控制器110係控制主搬運機器人8L、8U從被特定的仿真基板插槽搬出仿真基板DW，並將該仿真基板DW搬運至該處理單元11L至43U(仿真基板搬入步驟A71)。在該仿真基板DW的搬運後，主機電腦150係在該處理單元11L至43U中對仿真基板DW執行與針對製品用的基板W之處理同樣的處理(仿真處理步驟A72)。當該處理結束時，主機電腦150係控制主搬運機器人8L、8U從該處理單元11L至43U取出仿真基板DW並搬運至原本的仿真基板插槽，使該仿真基板DW收容至該仿真基板插槽(仿真基板收容步驟A73)。如此，當執行預處理時，控制器110係將不使用持續時間重置成初始值(例如為零)並更新單元使用歷程資料135(步驟A8)。When it is determined that pre-processing is required, the controller 110 executes pre-processing according to the pre-processing recipe (pre-processing step A7). Specifically, the controller 110 refers to the dummy board table 133 to specify the dummy board slots DL1 to DL12 and DU1 to DU12 corresponding to the processing units 11L to 43U. Then, the controller 110 controls the main transfer robots 8L, 8U to unload the dummy substrate DW from the specified dummy substrate slot, and transfer the dummy substrate DW to the processing units 11L to 43U (dummy substrate loading step A71). After the transfer of the dummy substrate DW, the host computer 150 executes the same processing as that for the substrate W for a product on the dummy substrate DW in the processing units 11L to 43U (simulation processing step A72 ). When the processing ends, the host computer 150 controls the main transfer robots 8L and 8U to take out the dummy substrate DW from the processing units 11L to 43U and transport it to the original dummy substrate slot, so that the dummy substrate DW is stored in the dummy substrate slot. (dummy board storage step A73). Thus, when performing the preprocessing, the controller 110 resets the non-use duration to an initial value (for example, zero) and updates the unit usage history data 135 (step A8 ).

如上所述，在已被賦予製品基板W的處理請求(處理預約)之時間點，控制器110係執行預處理。預處理係包含仿真基板DW的搬運(仿真基板搬入步驟A71)以及使用該仿真基板DW的仿真處理(仿真處理步驟A72)。因此，與基板搬入動作(製品基板搬入步驟A20)並行地執行預處理(仿真基板搬入步驟A71以及／或者仿真處理步驟A72)或者在基板搬入動作(製品基板搬入步驟A20)之前執行預處理(仿真基板搬入步驟A71以及／或者仿真處理步驟A72)；基板搬入動作(製品基板搬入步驟A20)係將收容了製品基板W的承載器C保持於承載器保持部25，且索引機器人26從承載器C取出處理對象的基板W並朝基板載置部6L、6U搬運。此時，索引機器人26係不參與仿真基板DW的搬運。因此，不會妨礙索引機器人26對於製品基板W的搬運，能在處理區塊3的內部搬運仿真基板DW並執行預處理。As described above, the controller 110 executes the pre-processing when a processing request (processing reservation) is given to the product substrate W. The preprocessing includes conveyance of the dummy substrate DW (dummy substrate loading step A71 ) and simulation processing using the dummy substrate DW (simulation processing step A72 ). Therefore, preprocessing (simulation substrate loading step A71 and/or simulation processing step A72) is performed in parallel with the substrate loading operation (product substrate loading step A20) or preprocessing (simulation processing step A72) is performed before the substrate loading operation (product substrate loading step A20). Substrate loading step A71 and/or simulation processing step A72); the substrate loading operation (product substrate loading step A20) is to hold the carrier C containing the product substrate W in the carrier holding part 25, and the indexing robot 26 moves from the carrier C The substrate W to be processed is taken out and conveyed toward the substrate placement parts 6L, 6U. At this time, the index robot 26 does not participate in the conveyance of the dummy substrate DW. Therefore, the transfer of the product substrate W by the index robot 26 is not hindered, and the dummy substrate DW can be transferred and pre-processed inside the processing block 3 .

此外，雖然為了方便說明而於圖9顯示索引機器人26所為之製品基板搬入步驟A20，然而並非表示與預處理步驟A7之間的前後關係為如圖所示。亦能夠在預處理步驟A7之前或者與預處理步驟A7並行地進行(開始)製品基板搬入步驟A20，且亦能夠在預處理步驟A7之後進行(開始)製品基板搬入步驟A20。In addition, although the product substrate carrying-in step A20 performed by the index robot 26 is shown in FIG. 9 for convenience of description, it does not mean that the front-rear relationship with the preprocessing step A7 is as shown in the figure. The product substrate carrying-in step A20 can also be performed (started) before the preprocessing step A7 or in parallel with the preprocessing step A7, and the product substrate carrying-in step A20 can also be performed (started) after the preprocessing step A7.

預處理處方係規定預處理，該預處理係對仿真基板DW進行應對製品用的基板W進行的處理。因此，對仿真基板DW執行預處理，藉此仿真基板DW會消耗。具體而言，對仿真基板DW進行使用了具有蝕刻作用的藥液之預處理，藉此仿真基板DW的表面被蝕刻從而仿真基板DW的厚度係減少。因此，當執行預處理處方時，控制器110係更新被賦予對應至該處理單元11L至43U之仿真基板插槽DL1至DL12、DU1至DU12的仿真基板歷程資料134(步驟A9)。例如，在仿真基板歷程資料134包含使用次數資料之情形中，將使用次數資料遞增(increment)。The preprocessing recipe prescribes the preprocessing which performs the processing corresponding to the substrate W for a product on the dummy substrate DW. Therefore, preprocessing is performed on the dummy substrate DW, whereby the dummy substrate DW is consumed. Specifically, the dummy substrate DW is pretreated with a chemical solution having an etching effect, whereby the surface of the dummy substrate DW is etched and the thickness of the dummy substrate DW is reduced. Therefore, when executing the preprocessing recipe, the controller 110 updates the dummy board history data 134 assigned to the dummy board slots DL1-DL12, DU1-DU12 corresponding to the processing units 11L-43U (step A9). For example, in the case that the simulated substrate history data 134 includes the use count data, the use count data is incremented.

當結束預處理時，控制器110係執行依循製品處方的控制(步驟A12)。藉此，主搬運機器人8L、8U係從基板載置部6L、6U取出基板W並搬運至處理單元11L至43U(基板搬入步驟A121)。接著，在處理單元11L至43U中對基板W執行使用了處理液(藥液、清洗液等)的處理(處理步驟A122)。結束後，主搬運機器人8L、8U係取出處理完畢的基板W並搬運至基板載置部6L、6U(基板收容步驟A123)。在存在未處理的基板W之情形中(複數片基板W的連續處理之情形中)(步驟A13：是)，反復進行同樣的動作。在此期間，當該處理單元的基板處理片數到達設定值時(步驟A14：是)，返回步驟A3並執行單元洗淨處理。在不是連續處理之情形中(步驟A13：否)，返回並反復進行步驟A1開始的處理。When the preprocessing is finished, the controller 110 performs control according to the product prescription (step A12). Thereby, the main transfer robots 8L, 8U take out the substrate W from the substrate placement parts 6L, 6U, and transfer it to the processing units 11L to 43U (substrate carrying-in step A121 ). Next, processing using a processing liquid (chemical liquid, cleaning liquid, etc.) is performed on the substrate W in the processing units 11L to 43U (processing step A122 ). After completion, the main transport robots 8L and 8U take out the processed substrate W and transport it to the substrate mounting parts 6L and 6U (substrate storage step A123 ). When there is an unprocessed substrate W (in the case of continuous processing of a plurality of substrates W) (step A13: Yes), the same operation is repeated. During this period, when the number of substrates processed by the processing unit reaches the set value (step A14: Yes), return to step A3 and perform unit cleaning. In the case of not continuous processing (step A13: NO), return to and repeat the processing starting from step A1.

若無來自主機電腦150的處理請求(處理預約)(步驟A5：否)，則控制器110係判斷待機狀態的持續時間亦即不使用持續時間是否已經到達設定值(步驟A15)。若不使用持續時間未到達設定值，則成為待機狀態。當不使用持續時間到達設定值時(步驟A15：是)，控制器110係執行預先設定的維護處理(步驟A16)。維護處理亦可為單元洗淨處理。與步驟A3的情形同樣地，單元洗淨處理係可為使用了仿真基板DW的處理(仿真處理的一種)，亦可為未使用仿真基板DW的處理。此外，維護處理亦可為與預處理類似的處理。此外，維護處理亦可為其他的處理。維護處理係主要為用以將處理單元11L至43U的處理室35內的環境保持在適合製品用的基板W的處理的狀態之處理，亦可為基板處理裝置1的使用者預先設定之處理。將使用仿真基板DW的仿真處理作為維護處理來進行之情形中，維護處理係包含：步驟A161，係從對應的仿真基板插槽取出仿真基板DW並搬入至該處理單元；步驟A162，係在處理單元內進行使用了仿真基板DW的仿真處理；以及步驟A163，係在步驟A162的處理後，將仿真基板DW收容至對應的仿真基板插槽。If there is no processing request (processing reservation) from the host computer 150 (step A5: No), then the controller 110 judges whether the duration of the standby state, that is, the non-use duration has reached the set value (step A15). If the non-use duration does not reach the set value, it will enter the standby state. When the non-use duration reaches the set value (step A15: Yes), the controller 110 executes a preset maintenance process (step A16). The maintenance treatment may also be unit cleaning treatment. As in the case of step A3, the unit cleaning process may be a process using the dummy substrate DW (a type of dummy process), or may be a process not using the dummy substrate DW. In addition, the maintenance processing may be similar to the pre-processing. In addition, maintenance processing may be other processing. The maintenance process is mainly a process for maintaining the environment in the processing chamber 35 of the processing units 11L to 43U in a state suitable for processing the substrate W for products, and may be a process previously set by the user of the substrate processing apparatus 1 . In the case where the simulation processing using the dummy substrate DW is performed as maintenance processing, the maintenance processing includes: Step A161, taking out the dummy substrate DW from the corresponding dummy substrate slot and loading it into the processing unit; The simulation processing using the dummy substrate DW is performed in the unit; and step A163 is to store the dummy substrate DW in the corresponding dummy substrate slot after the processing in step A162.

在沒有來自主機電腦150的處理請求(處理預約)之時間點，控制器110係無法自動地計畫與製品處方131同樣的預處理。因此，較佳為即使隨時執行維護處理(步驟A16)，在有來自主機電腦150的處理請求(處理預約)時執行與該製品處理對應的預處理(預處理步驟A7)。When there is no processing request (processing reservation) from the host computer 150, the controller 110 cannot automatically plan the same preprocessing as the product prescription 131. Therefore, it is preferable to perform preprocessing corresponding to the product processing (preprocessing step A7) when there is a processing request (processing reservation) from the host computer 150 even if maintenance processing is performed at any time (step A16).

仿真基板DW係被預先導入至基板處理裝置1的內部並被收容至仿真基板收容部7L、7U。具體而言，例如藉由工廠內所具備的承載器搬運機構300(參照圖1)將收容了仿真基板DW的供給用的仿真承載器DC傳遞至承載器保持部25。索引機器人26係從供給用的仿真承載器DC取出仿真基板DW並搬運至基板載置部6L、6U。第一處理區塊層BL的主搬運機器人8L係將仿真基板DW從基板載置部6L搬運並收容至仿真基板收容部7L。第二處理區塊層BU的主搬運機器人8U係將仿真基板DW從基板載置部6U搬運並收容至仿真基板收容部7U。The dummy substrate DW is introduced into the inside of the substrate processing apparatus 1 in advance and accommodated in the dummy substrate storage parts 7L, 7U. Specifically, the supply dummy carrier DC containing the dummy substrate DW is transferred to the carrier holding unit 25 by, for example, a carrier transport mechanism 300 (see FIG. 1 ) provided in the factory. The index robot 26 takes out the dummy substrate DW from the dummy carrier DC for supply, and conveys it to the substrate mounting parts 6L, 6U. The main transport robot 8L of the first processing block layer BL transports and stores the dummy substrate DW from the substrate loading unit 6L to the dummy substrate storage unit 7L. The main transport robot 8U of the second processing block layer BU transports and accommodates the dummy substrate DW from the substrate mounting portion 6U to the dummy substrate storage portion 7U.

當新的仿真基板DW被導入並被收容至仿真基板收容部7L、7U時，控制器110係將與被收容有新的仿真基板DW的仿真基板插槽對應的仿真基板歷程資料134重置成初始值。 在更換基板處理裝置1內的仿真基板DW時，藉由主搬運機器人8L、8U以及索引機器人26將仿真基板DW從仿真基板收容部7L、7U搬運至被承載器保持部25保持的回收用的仿真承載器DC。具體而言，在更換對象的仿真基板DW被收容至第一處理區塊層BL的仿真基板收容部7L時，主搬運機器人8L係將該仿真基板DW從仿真基板收容部7L搬運至基板載置部6L。在更換對象的仿真基板DW被收容至第二處理區塊層BU的仿真基板收容部7U時，主搬運機器人8U係將該仿真基板DW從仿真基板收容部7U搬運至基板載置部6U。索引機器人26係將被載置於基板載置部6L、6U的仿真基板DW搬運並收容至被承載器保持部25保持的回收用的仿真承載器DC。在複數片仿真基板DW為更換對象時，反復進行同樣的動作。 When a new dummy board DW is imported and accommodated in the dummy board storage parts 7L, 7U, the controller 110 resets the dummy board history data 134 corresponding to the dummy board slot in which the new dummy board DW is housed. initial value. When the dummy substrate DW in the substrate processing apparatus 1 is replaced, the dummy substrate DW is conveyed from the dummy substrate storage parts 7L and 7U by the main transfer robots 8L and 8U and the index robot 26 to the recycling space held by the carrier holding part 25. Emulate the bearer DC. Specifically, when the dummy substrate DW to be replaced is accommodated in the dummy substrate storage section 7L of the first processing block layer BL, the main transport robot 8L transports the dummy substrate DW from the dummy substrate storage section 7L to the substrate mounting unit 7L. Department 6L. When the dummy substrate DW to be exchanged is stored in the dummy substrate storage section 7U of the second processing block layer BU, the main transfer robot 8U transports the dummy substrate DW from the dummy substrate storage section 7U to the substrate mounting section 6U. The index robot 26 transports and accommodates the dummy substrate DW placed on the substrate placement units 6L and 6U in the dummy carrier DC for recovery held by the carrier holding unit 25 . When a plurality of dummy substrates DW are to be replaced, the same operation is repeated.

圖10A以及圖10B係用以說明與未使用的仿真基板搬入至仿真基板收容部7L、7U以及從仿真基板收容部7L、7U搬出使用完畢的仿真基板相關的動作例之流程圖。 首先，參照圖10A。控制器110係參照仿真基板歷程資料134算出狀態資料(status data)(步驟S1)，該狀態資料係表示是否更換仿真基板DW。用以算出狀態資料之算出式係被儲存於記憶體112。算出式亦可以表格(table)的形式儲存於記憶體112。例如，當使用次數到達預定的臨限值時，狀態資料係成為用以表示需要更換之值。狀態資料係針對被收容至仿真基板收容部7L、7U的全部的仿真基板DW被算出。用以算出狀態資料之算出式係不一定在複數個仿真基板DW之間是共通的。如上所述，複數個仿真基板DW係被一對一地賦予對應至複數個處理單元。在各個處理單元中所執行的製品基板W的處理以及仿真處理係不一定是共通的。因此，能針對與各個處理單元對應的各個仿真基板DW個別地設定算出式。亦即，於記憶體112儲存有複數個算出式，使用與各個仿真基板DW對應(亦即與各個處理單元對應)的算出式來算出狀態資料。控制器110亦可在每次各個仿真基板DW在對應的處理單元被使用時，亦即在每次仿真基板歷程資料134被更新時，算出狀態資料並將最新的狀態資料儲存於記憶體112。 10A and 10B are flowcharts illustrating an example of operations related to loading unused dummy substrates into the dummy substrate storage parts 7L, 7U and unloading used dummy substrates from the dummy substrate storage parts 7L, 7U. First, refer to FIG. 10A. The controller 110 calculates status data (status data) referring to the dummy board history data 134 (step S1 ), the status data indicates whether to replace the dummy board DW. The calculation formula for calculating the state data is stored in the memory 112 . The calculation formula can also be stored in the memory 112 in the form of a table. For example, when the number of times of use reaches a predetermined threshold, the status data becomes a value indicating that it needs to be replaced. The state data is calculated for all the dummy substrates DW stored in the dummy substrate storage units 7L and 7U. The calculation formula system for calculating the state data is not necessarily common among a plurality of dummy substrates DW. As described above, a plurality of dummy boards DW are assigned one-to-one correspondence to a plurality of processing units. The processing of the product substrate W and the simulation processing performed in each processing unit are not necessarily common. Therefore, calculation formulas can be individually set for each dummy substrate DW corresponding to each processing unit. That is, a plurality of calculation formulas are stored in the memory 112, and the state data is calculated using the calculation formula corresponding to each dummy board DW (that is, corresponding to each processing unit). The controller 110 can also calculate the state data and store the latest state data in the memory 112 each time each dummy substrate DW is used in the corresponding processing unit, that is, each time the dummy substrate history data 134 is updated.

控制器110係執行作為判斷部的功能，該判斷部係基於狀態資料來判斷是否需要更換仿真基板DW。具體而言，判斷是否為表示其中任一個仿真基板DW的狀態資料需要更換之值(步驟S2)。 在其中任一個仿真基板DW需要更換之情形中(步驟S2：是)，控制器110係判斷在基板處理裝置1內是否存在能代替該仿真基板DW之其他的仿真基板DW(步驟S3、S5)。 The controller 110 functions as a judging unit that judges whether the dummy substrate DW needs to be replaced based on the state data. Specifically, it is judged whether it is a value indicating that the status data of any one of the dummy substrates DW needs to be replaced (step S2). In the case where any one of the dummy substrates DW needs to be replaced (step S2: Yes), the controller 110 determines whether there is another dummy substrate DW that can replace the dummy substrate DW in the substrate processing apparatus 1 (steps S3, S5) .

當在處理單元的基板處理後產生污染等問題時，亦包含仿真基板DW為污染源的可能性，會有需要查明原因之情形。當在複數個處理單元中使用共通的仿真基板DW時，由於難以查明原因，因此較佳為複數個處理單元與複數個仿真基板DW係一對一地賦予對應。因此，即使任一個仿真基板DW達至使用期限亦以其他的仿真基板DW來代替該仿真基板DW之情事為不佳的情形。然而，只要於基板處理裝置1內存在有未使用的仿真基板DW，則即使該未使用的仿真基板DW被使用來代替已經到達使用期限的仿真基板DW，亦不會有上述般的問題。如上所述複數個處理單元並未限定於進行相同的處理，因此在複數個處理單元中進行仿真處理的頻率不一定相等。When problems such as contamination occur after substrate processing in the processing unit, the dummy substrate DW may also be a source of contamination, and there may be cases where it is necessary to find out the cause. When a common dummy board DW is used in a plurality of processing units, since it is difficult to find out why, it is preferable that a plurality of processing units and a plurality of dummy boards DW be associated one-to-one. Therefore, even if any one of the dummy boards DW reaches the end of its life, it is not preferable to replace the dummy board DW with another dummy board DW. However, as long as there is an unused dummy substrate DW in the substrate processing apparatus 1 , even if the unused dummy substrate DW is used instead of the dummy substrate DW that has reached its expiration date, the above-mentioned problems do not occur. As mentioned above, the plurality of processing units are not limited to perform the same processing, so the frequencies of performing simulation processing in the plurality of processing units are not necessarily equal.

詳細地說明，首先，控制器110係判斷是否於收容有該仿真基板DW的仿真基板收容部7L、7U的其他的插槽是否收容有能夠代替使用的仿真基板DW(步驟S3)。所謂能夠代替使用的仿真基板DW係指基本上尚未被使用於仿真處理的仿真基板DW。在此情形中，控制器110係基於各個仿真基板DW的仿真基板歷程資料134來判斷是否能夠代替使用。然而，亦可不是只要未使用則立即判斷成能夠代替使用，而是另外設置有其他的判斷規則。例如，即使為未使用的仿真基板DW，在被賦予關聯至特定的處理單元之情形中，亦可構成為基於預先制定的追加的判斷規則來判斷該仿真基板DW是否能夠代替使用。To describe in detail, first, the controller 110 judges whether or not a dummy board DW that can be used instead is housed in another slot of the dummy board housing parts 7L, 7U that house the dummy board DW (step S3). The dummy substrate DW that can be used instead refers to a dummy substrate DW that has basically not been used in the simulation process. In this case, the controller 110 determines whether it can be used instead based on the dummy substrate history data 134 of each dummy substrate DW. However, instead of immediately judging that it can be used instead as long as it is not used, another judging rule may be provided separately. For example, even if an unused dummy board DW is associated with a specific processing unit, it may be configured to judge whether or not the dummy board DW can be used instead based on an additional judgment rule established in advance.

若找到能夠代替使用的仿真基板DW，則控制器110係在相同的仿真基板收容部7L、7U內藉由主搬運機器人8L、8U替換需要更換的仿真基板DW以及代替使用的仿真基板DW(步驟S4)，亦即在相同的仿真基板收容部7L、7U內藉由主搬運機器人8L、8U替換使用完畢的仿真基板DW以及未使用的仿真基板DW(步驟S4)。亦即，主搬運機器人8L、8U係從插槽取出使用完畢的仿真基板DW並搬運至未使用的仿真基板DW的插槽，且從該插槽取出未使用的仿真基板DW並將使用完畢的仿真基板DW搬入至該插槽。再者，主搬運機器人8L、8U係將所取出的未使用的仿真基板DW搬入至使用完畢的仿真基板DW的原本的插槽。假如仿真基板收容部7L、7U具有多餘的插槽，則亦可將使用完畢的仿真基板DW搬入至多餘的插槽。If a dummy substrate DW that can be used instead is found, the controller 110 replaces the dummy substrate DW that needs to be replaced and the dummy substrate DW that needs to be replaced in the same dummy substrate accommodating part 7L, 7U by the main transport robot 8L, 8U (step S4), that is, the used dummy substrate DW and the unused dummy substrate DW are replaced by the main transfer robots 8L, 8U in the same dummy substrate accommodating parts 7L, 7U (step S4). That is, the main transfer robots 8L and 8U take out the used dummy board DW from the slot and transport it to the slot of the unused dummy board DW, and take out the unused dummy board DW from the slot and transfer the used dummy board DW to the slot of the unused dummy board DW. The dummy board DW is loaded into this slot. Furthermore, the main transport robots 8L and 8U carry the unused dummy board DW taken out into the original slot of the used dummy board DW. If the dummy board storage parts 7L and 7U have extra slots, the used dummy boards DW can be loaded into the extra slots.

亦可取代進行此種的仿真基板DW的搬運，控制器110係更新仿真基板表133(參照圖8)，藉此更新用以表示仿真基板收容部7L、7U的插槽與處理單元11L至43U之間的對應關係之資料。亦即，只要將未使用的仿真基板DW的插槽賦予對應至已被賦予對應至使用完畢的仿真基板DW的插槽之處理單元即可。如此，即無須搬運仿真基板DW。Instead of carrying out such dummy substrate DW, the controller 110 updates the dummy substrate table 133 (refer to FIG. 8 ), thereby updating the slots and processing units 11L to 43U for representing the dummy substrate accommodating portions 7L and 7U. Correspondence between data. That is, what is necessary is just to assign the slot corresponding to the unused dummy board DW to the processing unit already assigned to the slot corresponding to the used dummy board DW. In this way, there is no need to carry the dummy substrate DW.

在相同的仿真基板收容部7L、7U未存在有能夠代替使用的仿真基板DW之情形中(步驟S3：否)，控制器110係判斷是否於另一個仿真基板收容部7L、7U亦即是否於另一方的仿真基板收容部7L、7U存在有能夠代替使用的仿真基板DW(步驟S5)。與上述情形同樣地，控制器110係基於各個仿真基板DW的仿真基板歷程資料134來判斷是否存在能夠代替使用的仿真基板DW。若找到能夠代替使用的仿真基板DW，則控制器110係作成搬運排程並予以執行(步驟S6：仿真基板移送控制、仿真基板移送工序)，該搬運排程係用以移送該能夠代替使用的仿真基板DW亦即未使用的仿真基板DW。In the case where there is no substitute dummy substrate DW in the same dummy substrate accommodating portion 7L, 7U (step S3: No), the controller 110 judges whether the dummy substrate DW is in another dummy substrate accommodating portion 7L, 7U, that is, whether The dummy board DW which can be used instead exists in the other dummy board|substrate accommodating part 7L, 7U (step S5). Similar to the above case, the controller 110 determines whether there is a dummy board DW that can be used instead, based on the dummy board history data 134 of each dummy board DW. If a dummy substrate DW that can be used instead is found, the controller 110 creates and executes a transfer schedule (step S6: dummy substrate transfer control, dummy substrate transfer process), and the transfer schedule is used to transfer the dummy substrate DW that can be used instead The dummy substrate DW is an unused dummy substrate DW.

例如，在第一處理區塊層BL的仿真基板收容部7L中發生需要更換的仿真基板DW時，思考於仿真基板收容部7L內未存在有能夠代替使用的仿真基板DW之情形。而且，設想於第二處理區塊層BU的仿真基板收容部7U內找到能夠代替使用的仿真基板DW(未使用的仿真基板)之情形。在此情形中，控制器110係作成下述般的搬運動作用的搬運排程。亦即，主搬運機器人8U係將未使用的仿真基板DW從仿真基板收容部7U搬運至基板載置部6U。之後，索引機器人26係將該未使用的仿真基板DW從基板載置部6U搬運至基板載置部6L。之後，主搬運機器人8L係將該未使用的仿真基板DW從基板載置部6L搬運至仿真基板收容部7L的空的插槽。For example, when a dummy substrate DW that needs to be replaced occurs in the dummy substrate storage portion 7L of the first processing block layer BL, it is considered that there is no dummy substrate DW that can be used instead in the dummy substrate storage portion 7L. Furthermore, it is assumed that a dummy substrate DW (unused dummy substrate) that can be used instead is found in the dummy substrate storage unit 7U of the second processing block layer BU. In this case, the controller 110 creates a transfer schedule for the following transfer actions. That is, the main transport robot 8U transports the unused dummy substrate DW from the dummy substrate storage section 7U to the substrate mounting section 6U. Thereafter, the index robot 26 transports the unused dummy substrate DW from the substrate mounting portion 6U to the substrate mounting portion 6L. Thereafter, the main transport robot 8L transports the unused dummy substrate DW from the substrate mounting portion 6L to an empty slot of the dummy substrate storage portion 7L.

在假設於仿真基板收容部7L未存在有應收容未使用的仿真基板DW的空的插槽之情形中，控制器110係計畫下述動作(仿真基板搬出動作)，在前述般的搬運動作之前，從仿真基板收容部7L搬出使用完畢的仿真基板DW從而確保空的插槽。仿真基板搬出動作亦可為下述動作：將使用完畢的仿真基板DW收容至被承載器保持部25保持的承載器。典型而言，此情形中的承載器為用以回收使用完畢的仿真基板DW之專用的承載器，亦即為回收用的仿真承載器DC。由於回收用的仿真承載器DC係因應需要被供給至承載器保持部25，因此通常所有的承載器保持部25(裝載埠)係被用以收容製品基板之一般的承載器C佔有，於承載器保持部25應該未存在有回收用的仿真承載器DC。因此，控制器110係計畫下述搬運動作：將使用完畢的仿真基板DW搬運至另一方的第二處理區塊層BU的仿真基板收容部7U的空的插槽。Assuming that there is no empty slot for storing an unused dummy board DW in the dummy board storage section 7L, the controller 110 plans the following operation (dummy board unloading operation), and in the above-mentioned carrying operation Previously, the used dummy board DW was unloaded from the dummy board storage section 7L to secure an empty slot. The unloading operation of the dummy substrate may be an operation of storing the used dummy substrate DW in the carrier held by the carrier holding unit 25 . Typically, the carrier in this case is a dedicated carrier for recycling the used dummy substrate DW, that is, a dummy carrier DC for recycling. Since the recycled dummy carrier DC is supplied to the carrier holding portion 25 as needed, all the carrier holding portion 25 (loading port) is usually occupied by the general carrier C for accommodating product substrates. The dummy carrier DC for recycling should not exist in the carrier holding unit 25 . Therefore, the controller 110 plans a transfer operation of transferring the used dummy substrate DW to an empty slot of the dummy substrate storage unit 7U of the other second processing block layer BU.

此種情形中的搬運動作的一例係如下所述。主搬運機器人8L係以一方的手部保持從第二處理區塊層BU移送而至的未使用的仿真基板DW，並以另一方的手部從仿真基板收容部7L搬出使用完畢的仿真基板DW。藉此，由於仿真基板收容部7L確保有空的插槽，因此將以一方的手部所保持的未使用的仿真基板DW搬入至確保的空的插槽。亦即，主搬運機器人8L係以下述方式動作：針對收容有使用完畢的仿真基板DW的插槽，更換使用完畢的仿真基板DW與未使用的仿真基板DW。主搬運機器人8L係將已搬出的使用完畢的仿真基板DW搬運至基板載置部6L。之後，索引機器人26係將使用完畢的仿真基板DW從基板載置部6L搬運至第二處理區塊層BU用的基板載置部6U。之後，主搬運機器人8U係將使用完畢的仿真基板DW從基板載置部6U搬運至仿真基板收容部7U的空的插槽。由於從仿真基板收容部7U的一個插槽搬出未使用的仿真基板DW，因此於仿真基板收容部7U至少存在有一個空的插槽。An example of the carrying operation in this case is as follows. The main transport robot 8L holds the unused dummy substrate DW transferred from the second processing block floor BU with one hand, and unloads the used dummy substrate DW from the dummy substrate storage part 7L with the other hand. . Thereby, since the empty slot is secured in the dummy board storage section 7L, the unused dummy board DW held by one hand is carried into the secured empty slot. That is, the main transfer robot 8L operates to replace the used dummy board DW with the unused dummy board DW for the slot in which the used dummy board DW is accommodated. The main transport robot 8L transports the used dummy substrate DW that has been unloaded to the substrate mounting unit 6L. After that, the index robot 26 transports the used dummy substrate DW from the substrate mounting part 6L to the substrate mounting part 6U for the second processing block layer BU. Thereafter, the main transport robot 8U transports the used dummy substrate DW from the substrate placement portion 6U to an empty slot in the dummy substrate storage portion 7U. Since the unused dummy board DW is taken out from one slot of the dummy board storage section 7U, at least one empty slot exists in the dummy board storage section 7U.

在本例子中，雖然先開始未使用的仿真基板DW的搬運，然而亦能先開始使用完畢的仿真基板DW的搬運。此情形中的搬運動作的一例係如下述。主搬運機器人8L係將使用完畢的仿真基板DW從仿真基板收容部7L搬運至基板載置部6L。之後，索引機器人26係將該使用完畢的仿真基板DW從基板載置部6L搬運至基板載置部6U。之後，主搬運機器人8U係將該使用完畢的仿真基板DW從基板載置部6U搬運至仿真基板收容部7U。主搬運機器人8U係以一方的手部保持從第一處理區塊層BL移送而至的使用完畢的仿真基板DW，並以另一方的手部從仿真基板收容部7U搬出未使用的仿真基板DW。藉此，由於仿真基板收容部7U確保有空的插槽，因此將以一方的手部所保持的使用完畢的仿真基板DW搬入至確保的空的插槽。亦即，主搬運機器人8U係以下述方式動作：針對收容有未使用的仿真基板DW的插槽，更換未使用的仿真基板DW與使用完畢的仿真基板DW。主搬運機器人8U係將已搬出的未使用的仿真基板DW搬運至基板載置部6U。之後，索引機器人26係將未使用的仿真基板DW從基板載置部6U搬運至第一處理區塊層BL用的基板載置部6L。之後，主搬運機器人8L係將未使用的仿真基板DW從基板載置部6L搬運至仿真基板收容部7U的空的插槽。由於從仿真基板收容部7L的一個插槽搬出使用完畢的仿真基板DW，因此於仿真基板收容部7L至少存在有一個空的插槽。In this example, although the conveyance of the unused dummy board DW is started first, it is also possible to start the conveyance of the used dummy board DW first. An example of the carrying operation in this case is as follows. The main transport robot 8L transports the used dummy substrate DW from the dummy substrate storage section 7L to the substrate placement section 6L. Thereafter, the index robot 26 transports the used dummy substrate DW from the substrate mounting portion 6L to the substrate mounting portion 6U. Thereafter, the main transport robot 8U transports the used dummy substrate DW from the substrate mounting portion 6U to the dummy substrate storage portion 7U. The main transfer robot 8U holds the used dummy substrate DW transferred from the first processing block layer BL with one hand, and unloads the unused dummy substrate DW from the dummy substrate storage part 7U with the other hand. . Thereby, since the empty slot is secured in the dummy board storage section 7U, the used dummy board DW held by one hand is carried into the reserved empty slot. That is, the main transfer robot 8U operates so as to replace the unused dummy board DW with the used dummy board DW for the slot storing the unused dummy board DW. The main transport robot 8U transports the unused dummy substrate DW that has been unloaded to the substrate mounting unit 6U. Thereafter, the index robot 26 transports the unused dummy substrate DW from the substrate mounting portion 6U to the substrate mounting portion 6L for the first processing block layer BL. Thereafter, the main transport robot 8L transports the unused dummy substrate DW from the substrate placement portion 6L to an empty slot of the dummy substrate storage portion 7U. Since the used dummy board DW is taken out from one slot of the dummy board storage section 7L, at least one empty slot exists in the dummy board storage section 7L.

亦可與第一處理區塊層BL的主搬運機器人8L將使用完畢的仿真基板DW從仿真基板收容部7L搬出並搬運至基板載置部6L之動作並行地，進行第二處理區塊層BU的主搬運機器人8U將未使用的仿真基板DW從仿真基板收容部7U搬出並搬運至基板載置部6U之動作。在此情形中，能縮短仿真基板DW的移送(更換)所需的時間。The second processing block layer BU can also be carried out in parallel with the operation of the main transfer robot 8L of the first processing block layer BL taking out the used dummy substrate DW from the dummy substrate storage part 7L and transporting it to the substrate mounting part 6L. The operation of the main transfer robot 8U carrying out the unused dummy substrate DW from the dummy substrate accommodating part 7U to the substrate mounting part 6U. In this case, the time required for the transfer (replacement) of the dummy substrate DW can be shortened.

在第二處理區塊層BU的仿真基板收容部7U內的仿真基板DW需要更換並代替使用第一處理區塊層BL的仿真基板收容部7L內的未使用的仿真基板DW之情形中的搬運動作亦同樣。此情形的搬運動作例的說明係能在上述的動作例的說明中更換第一處理區塊層BU與第二處理區塊層BL的讀法、更換主搬運機器人8U與主搬運機器人8L的讀法、更換仿真基板收容部7U與仿真基板收容部7L的讀法、更換基板載置部6U與基板載置部6L的讀法即可，因此省略說明。Transfer in case the dummy substrate DW in the dummy substrate storage section 7U of the second processing block layer BU needs to be replaced and replaced with the unused dummy substrate DW in the dummy substrate storage section 7L of the first processing block layer BL The same goes for actions. The description of the transport operation example in this case can replace the reading method of the first processing block layer BU and the second processing block layer BL, and the reading method of the main transfer robot 8U and the main transfer robot 8L in the description of the above-mentioned operation example. The reading method of replacing the dummy substrate storage portion 7U and the dummy substrate storage portion 7L, and the reading method of replacing the substrate mounting portion 6U and the substrate mounting portion 6L are sufficient, and therefore descriptions thereof are omitted.

在基板處理裝置1內未存在有能夠代替使用的仿真基板DW之情形中(步驟S4以及步驟S5的雙方皆為否)，控制器110係對主機電腦150發送用以請求更換仿真基板DW之仿真基板更換請求(步驟S7)。 控制器110亦可編程為：在每次在任一個處理單元進行仿真處理時，算出被收容於仿真基板收容部7L、7U且能夠代替使用的未使用的仿真基板DW的片數。在此情形中，較佳為控制器110係當基板處理裝置1內的能夠代替使用的未使用的仿真基板DW的片數成為預定的臨限值(例如1)以下時，將仿真基板更換請求發送至主機電腦150。此外，控制器110亦可進一步考慮在任一個處理單元的處理的緊急度的資訊等，將仿真基板更換請求發送至主機電腦150。例如，在即使能夠代替使用的未使用的仿真基板DW的片數超過臨限值，亦研判能夠代替使用的未使用的仿真基板DW的片數會因為已經被排程的仿真處理而在不久的將來成為臨限值以下之情形中，亦可發行仿真基板更換請求。 When there is no substitute dummy substrate DW in the substrate processing apparatus 1 (No in both steps S4 and S5), the controller 110 sends a simulation message requesting replacement of the dummy substrate DW to the host computer 150. Substrate replacement request (step S7). The controller 110 may also be programmed to calculate the number of unused dummy substrates DW that are accommodated in the dummy substrate accommodating parts 7L, 7U and can be replaced every time a dummy process is performed in any one of the processing units. In this case, it is preferable that the controller 110 issues a dummy substrate replacement request when the number of unused dummy substrates DW that can be replaced in the substrate processing apparatus 1 becomes less than or equal to a predetermined threshold value (for example, 1). sent to the host computer 150. In addition, the controller 110 may further consider information such as the urgency of processing in any one processing unit, and send a dummy board replacement request to the host computer 150 . For example, even if the number of unused dummy substrates DW that can be replaced exceeds the threshold value, it is judged that the number of unused dummy substrates DW that can be replaced will be reduced in the near future due to the scheduled simulation processing. In the future, when the value becomes below the threshold value, a dummy board replacement request can also be issued.

主機電腦150係當從基板處理裝置1接受仿真基板更換請求時，判斷基板處理裝置1的承載器保持部25的任一者是否保持有回收用的仿真承載器DC。若全部的承載器保持部25皆未保持有回收用的仿真承載器DC，則主機電腦150係計畫承載器搬運機構300所為之回收用的仿真承載器DC的供給，並依循此計畫使承載器搬運機構300作動。若任一個承載器保持部25保持有回收用的仿真承載器DC，則主機電腦150係判斷基板處理裝置1的承載器保持部25的任一者是否保持有供給用的仿真承載器DC。若全部的承載器保持部25皆未保持有供給用的仿真承載器DC，則主機電腦150係計畫承載器搬運機構300所為之供給用的仿真承載器DC的供給，並依循此計畫使承載器搬運機構300作動。The host computer 150 determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds a dummy carrier DC for recovery when receiving a dummy substrate replacement request from the substrate processing apparatus 1 . If all the carrier holding parts 25 do not hold the dummy carrier DC for recycling, the host computer 150 will plan the supply of the dummy carrier DC for recycling by the carrier transport mechanism 300, and follow this plan to use The carrier transport mechanism 300 operates. If any carrier holding unit 25 holds a dummy carrier DC for recovery, the host computer 150 determines whether any of the carrier holding units 25 of the substrate processing apparatus 1 holds a dummy carrier DC for supply. If all the carrier holders 25 do not hold the dummy carrier DC for supply, the host computer 150 plans the supply of the dummy carrier DC for the supply by the carrier transport mechanism 300, and uses the plan according to the plan. The carrier transport mechanism 300 operates.

參照圖10B。基板處理裝置1的控制器110係以下述方式動作：在回收用的仿真基板承載器DC被任一個承載器保持部25時(步驟S11：是)，將使用完畢的仿真基板DW搬入至回收用的仿真承載器DC (步驟S12)。亦即，使用完畢的仿真基板DW係被主搬運機器人8U、8L從仿真基板收容部7L、7U搬運至基板載置部6L、6U，並被索引機器人26從基板載置部6L、6U搬運並收容至回收用的仿真承載器DC。基板處理裝置1的控制器110係以下述方式動作，在供給用的仿真承載器DC被任一個承載器保持部25保持時(步驟S13：是)，將未使用的仿真基板DW從供給用的仿真承載器DC搬運至仿真基板收容部7L、7U(步驟S14)。亦即，未使用的仿真基板DW係被索引機器人26從供給用的仿真承載器DC搬運至基板載置部6L、6U，並被主搬運機器人8U、8L從基板載置部6L、6U搬入至仿真基板收容部7L、7U。Refer to Figure 10B. The controller 110 of the substrate processing apparatus 1 operates in the following manner: when the dummy substrate carrier DC for recycling is held by any of the carrier holding sections 25 (step S11: Yes), the used dummy substrate DW is loaded into the dummy substrate carrier DC for recycling. The simulated carrier DC (step S12). That is, the used dummy substrate DW is conveyed from the dummy substrate accommodating parts 7L and 7U to the substrate mounting parts 6L and 6U by the main transfer robots 8U and 8L, and is conveyed from the substrate mounting parts 6L and 6U by the index robot 26 and Contained in the dummy carrier DC for recovery. The controller 110 of the substrate processing apparatus 1 operates in such a manner that when the dummy carrier DC for supply is held by any one of the carrier holding sections 25 (step S13: Yes), the unused dummy substrate DW is transferred from the dummy carrier DC for supply. The dummy carrier DC is conveyed to the dummy board storage parts 7L and 7U (step S14 ). That is, the unused dummy substrate DW is carried by the index robot 26 from the dummy carrier DC for supply to the substrate placement parts 6L, 6U, and is carried in from the substrate placement parts 6L, 6U by the main transfer robots 8U, 8L. The dummy board storage parts 7L, 7U.

當仿真基板收容部7L、7U的某個插槽的仿真基板DW與未使用的仿真基板DW更換時，與該插槽對應(亦即與被收容於該插槽的仿真基板DW對應)的仿真基板歷程資料134係被重置成初始值(圖10A的步驟S8、圖10B的步驟S15)。 在下述情形時不需要圖10A所示的基板處理裝置1內之未使用的仿真基板DW的移送：在供給用的仿真承載器DC被承載器保持部25保持(步驟S13)，且能藉由從供給用的仿真承載器DC所供給的未使用的仿真基板DW置換使用完畢的仿真基板DW時。亦即，只要將未使用的仿真基板DW從供給用的仿真承載器DC搬運至仿真基板收容部7L、7U來取代在仿真基板收容部7L、7U之間移送未使用的仿真基板DW即可。因此，亦可將供給用的仿真承載器DC未被承載器保持部25保持之情事或者無法以被承載器保持部25保持的供給用的仿真承載器DC的未使用的仿真基板DW進行置換之情事作為仿真基板移送條件之一。 When the dummy board DW in a certain slot of the dummy board storage unit 7L, 7U is replaced with an unused dummy board DW, the dummy board corresponding to the slot (that is, corresponding to the dummy board DW accommodated in the slot) The substrate history data 134 is reset to an initial value (step S8 in FIG. 10A , step S15 in FIG. 10B ). The transfer of the unused dummy substrate DW in the substrate processing apparatus 1 shown in FIG. When replacing the used dummy substrate DW with the unused dummy substrate DW supplied from the dummy carrier DC for supply. That is, instead of transferring the unused dummy substrate DW between the dummy substrate storage parts 7L and 7U, it is only necessary to transfer the unused dummy substrate DW from the supply dummy carrier DC to the dummy substrate storage parts 7L and 7U. Therefore, when the supply dummy carrier DC is not held by the carrier holding unit 25 or the unused dummy substrate DW of the supply dummy carrier DC held by the carrier holding unit 25 cannot be replaced. The situation is used as one of the conditions for simulating substrate transfer.

此外，在下述情形時不需要基板處理裝置1內之使用完畢的仿真基板DW的移送：在回收用的仿真承載器DC被承載器保持部25保持(步驟S11)，且能藉由將使用完畢的仿真基板DW收容至回收用的仿真承載器DC時。亦即，只要將使用完畢的仿真基板DW從仿真基板收容部7L、7U搬運至回收用的仿真承載器DC來取代在仿真基板收容部7L、7U之間移送使用完畢的仿真基板DW即可。因此，亦可將回收用的仿真承載器DC未被承載器保持部25保持之情事或者無法將使用完畢的仿真基板DW收容至被承載器保持部25保持的回收用的仿真承載器DC之情事作為仿真基板移送條件之一。In addition, it is unnecessary to transfer the used dummy substrate DW in the substrate processing apparatus 1 when the dummy carrier DC for recovery is held by the carrier holding unit 25 (step S11) When the dummy substrate DW is accommodated in the dummy carrier DC for recovery. That is, instead of transferring the used dummy substrate DW between the dummy substrate storage parts 7L and 7U, it is only necessary to transfer the used dummy substrate DW from the dummy substrate storage parts 7L and 7U to the recycling dummy carrier DC. Therefore, the case where the dummy carrier DC for recovery is not held by the carrier holding unit 25 or the case where the used dummy substrate DW cannot be accommodated in the dummy carrier DC for recovery held by the carrier holding unit 25 can also be eliminated. As one of the conditions for simulating substrate transfer.

再者亦會有下述情形：根據基板處理裝置1的運轉狀況以及承載器搬運機構300的運轉狀況，比起在仿真基板收容部7L、7U之間移送仿真基板DW，等待供給用的仿真承載器DC的到達係能更快地將使用完畢的仿真基板DW與未使用的仿真基板DW置換。在此種情形中，無須在仿真基板收容部7L、7U之間進行仿真基板DW的移送。因此，亦可將下述情事作為仿真基板移送條件之一：比起等待從基板處理裝置1的外部供給仿真基板DW，在基板處理裝置1內進行仿真基板DW的移送係能更快地將未使用完畢的仿真基板DW置換成未使用的仿真基板DW。Furthermore, depending on the operation status of the substrate processing apparatus 1 and the operation status of the carrier transport mechanism 300, instead of transferring the dummy substrate DW between the dummy substrate storage parts 7L and 7U, waiting for the dummy carrier for supply may occur. The arrival system of the device DC can replace the used dummy substrate DW with the unused dummy substrate DW more quickly. In this case, it is not necessary to transfer the dummy substrate DW between the dummy substrate storage parts 7L, 7U. Therefore, as one of the dummy substrate transfer conditions, the following may be considered as one of the dummy substrate transfer conditions: transferring the dummy substrate DW inside the substrate processing apparatus 1 can transfer the dummy substrate DW faster than waiting for the dummy substrate DW to be supplied from outside the substrate processing apparatus 1. The used dummy board DW is replaced with an unused dummy board DW.

如上所述，依據本實施形態，與索引區塊2的橫方向鄰接的處理區塊3係將複數個第一處理區塊層BL、第二處理區塊層BU於上下方向Z層疊而構成。而且，於各個第一處理區塊層BL、第二處理區塊層BU具備有用以收容仿真基板DW之仿真基板收容部7L、7U。由於能將仿真基板DW收容至第一處理區塊層BL、第二處理區塊層BU的內部，因此在處理單元11L至43U中無須使用仿真基板DW時，能以索引機器人26不參與的方式在仿真基板收容部7L、7U與處理單元11L至43U之間搬運仿真基板DW。As described above, according to this embodiment, the processing block 3 adjacent to the index block 2 in the horizontal direction is formed by stacking a plurality of first processing block layers BL and second processing block layers BU in the vertical direction Z. Moreover, dummy substrate storage parts 7L and 7U for accommodating the dummy substrate DW are provided in each of the first processing block layer BL and the second processing block layer BU. Since the dummy substrate DW can be accommodated inside the first processing block layer BL and the second processing block layer BU, when the dummy substrate DW does not need to be used in the processing units 11L to 43U, the index robot 26 can be used without participation. The dummy substrate DW is conveyed between the dummy substrate storage units 7L, 7U and the processing units 11L to 43U.

因此，由於能減輕索引機器人26的搬運負擔，因此能一邊減輕對於製品用的基板W的搬運造成影響一邊進行使用了仿真基板DW的處理。尤其，用以在分別具有複數個處理單元11L至43L、11U至43U的複數個第一處理區塊層BL、第二處理區塊層BU與承載器保持部25之間搬運基板W之索引機器人26的搬運負擔係非常地大。因此，藉由減輕索引機器人26的搬運負擔，製品用的基板W的搬運效率變佳，從而能提升生產性。由於各個第一處理區塊層BL、第二處理區塊層BU的主搬運機器人8L、8U係負責在該第一處理區塊層BL、第二處理區塊層BU內搬運基板W，因此與索引機器人26相比搬運負擔較小。因此，從生產效率的觀點而言，主搬運機器人8L、8U負責在第一處理區塊層BL、第二處理區塊層BU的內部搬運仿真基板DW並不會造成大的問題。Therefore, since the conveyance load of the index robot 26 can be reduced, the processing using the dummy substrate DW can be performed while reducing the influence on the conveyance of the substrate W for products. In particular, an indexing robot for transferring a substrate W between a plurality of first processing block layers BL, a second processing block layer BU having a plurality of processing units 11L to 43L, 11U to 43U, respectively, and a carrier holding portion 25 The handling burden of 26 is very large. Therefore, by reducing the conveyance load of the index robot 26, the conveyance efficiency of the substrate W for products becomes better, and productivity can be improved. Since the main transfer robots 8L and 8U of each of the first processing block layer BL and the second processing block layer BU are responsible for transferring the substrate W in the first processing block layer BL and the second processing block layer BU, the same The index robot 26 has a smaller load than that of transport. Therefore, from the viewpoint of production efficiency, it is not a big problem that the main transfer robots 8L and 8U are in charge of transferring the dummy substrate DW inside the first processing block layer BL and the second processing block layer BU.

此外，由於仿真基板收容部7L、7U位於第一處理區塊層BL、第二處理區塊層BU內，因此仿真基板收容部7L、7U與處理單元11L至43U之間的仿真基板DW的搬運係無須經由用以在索引機器人26與第一處理區塊層BL、第二處理區塊層BU之間進行基板傳遞之基板載置部6L、6U即能進行。因此，由於能減輕仿真基板DW的搬運與製品用的基板W的搬運之間的干擾，因此製品用的基板W的搬運效率變佳，從而能提升生產性。In addition, since the dummy substrate storage parts 7L and 7U are located in the first processing block layer BL and the second processing block layer BU, the transfer of the dummy substrate DW between the dummy substrate storage parts 7L and 7U and the processing units 11L to 43U It can be performed without going through the substrate placement parts 6L, 6U for substrate transfer between the index robot 26 and the first processing block layer BL and the second processing block layer BU. Therefore, since the interference between the conveyance of the dummy substrate DW and the conveyance of the substrate W for the product can be reduced, the conveyance efficiency of the substrate W for the product can be improved, and productivity can be improved.

再者，與專利文獻1的情形不同，承載器保持部25亦不會被用以收容仿真基板DW的仿真承載器長時間地佔有。藉此，由於能抑制於收容了製品用的基板W的承載器C的搬入產生待機時間，因此有助於生產性的提升。 此外，在本實施形態中，在各個第一處理區塊層BL、第二處理區塊層BU中，複數個處理單元11L至43L、11U至43U係沿著搬運路徑51L、51U排列於搬運路徑51L、51U的兩側且於上下方向Z層疊地排列，該搬運路徑51L、51U係藉由主搬運機器人8L、8U搬運基板W之路徑。因此，以能有效率地進行主搬運機器人8L、8U所為之基板搬運之方式設計第一處理區塊層BL、第二處理區塊層BU內的複數個處理單元11L至43U的配置。藉此，能有助於生產性的提升。 Furthermore, unlike the case of Patent Document 1, the carrier holding portion 25 is not occupied for a long time by the dummy carrier for accommodating the dummy substrate DW. Thereby, since it is possible to suppress a standby time for carrying in the carrier C that accommodates the substrate W for a product, it contributes to an improvement in productivity. In addition, in this embodiment, in each of the first processing block layer BL and the second processing block layer BU, a plurality of processing units 11L to 43L, 11U to 43U are arranged on the conveyance path along the conveyance path 51L, 51U Both sides of 51L and 51U are stacked in the vertical direction Z, and the conveyance paths 51L and 51U are paths for conveying the substrate W by the main conveyance robots 8L and 8U. Therefore, the arrangement of the plurality of processing units 11L to 43U in the first processing block layer BL and the second processing block layer BU is designed so that the substrate transfer by the main transfer robots 8L and 8U can be efficiently performed. Thereby, it can contribute to improvement of productivity.

此外，在本實施形態中，基板載置部6L、6U以及仿真基板收容部7L、7U皆配置於索引機器人26與主搬運機器人8L、8U之間。藉此，能有效率地進行經由基板載置部6L、6U所進行之索引機器人26與主搬運機器人8L、8U之間的基板W的搬運。而且，能將仿真基板收容部7L、7U配置於不會與索引機器人26所為之基板W的搬運以及主搬運機器人8L、8U所為之基板W的搬運干擾之位置。因此，不會對製品用的基板W的搬運造成影響地能將仿真基板DW保持於第一處理區塊層BL、第二處理區塊層BU內。In addition, in the present embodiment, both the substrate placement parts 6L, 6U and the dummy substrate storage parts 7L, 7U are arranged between the index robot 26 and the main transfer robots 8L, 8U. Thereby, the substrate W can be efficiently transferred between the index robot 26 and the main transfer robots 8L and 8U via the substrate mounts 6L and 6U. Furthermore, the dummy substrate storage units 7L, 7U can be arranged at positions where they do not interfere with the conveyance of the substrate W by the index robot 26 and the conveyance of the substrate W by the main conveyance robots 8L, 8U. Therefore, the dummy substrate DW can be held in the first processing block layer BL and the second processing block layer BU without affecting the conveyance of the substrate W for products.

更具體而言，在本實施形態中，仿真基板收容部7L、7U與基板載置部6L、6U係彼此錯開高度立體性地配置。藉此，有效地利用第一處理區塊層BL、第二處理區塊層BU內的空間並將仿真基板收容部7L、7U適當地配置於第一處理區塊層BL、第二處理區塊層BU內。結果，實現不會妨礙製品用的基板W的搬運之仿真基板收容部7L、7U的配置。More specifically, in the present embodiment, the dummy substrate storage parts 7L, 7U and the substrate mounting parts 6L, 6U are three-dimensionally arranged with a height shifted from each other. Thereby, the space in the first processing block layer BL and the second processing block layer BU is effectively used and the dummy substrate storage parts 7L and 7U are appropriately arranged in the first processing block layer BL and the second processing block layer. Within the layer BU. As a result, the arrangement of the dummy substrate storage parts 7L, 7U that does not hinder the conveyance of the substrate W for products is realized.

再者，在本實施形態中，仿真基板收容部7L、7U係以俯視觀看時與基板載置部6L、6U重疊之方式配置。藉此，利用基板載置部6L、6U的上方或者下方的空間來配置仿真基板收容部7L、7U。藉此，實現不會妨礙製品用的基板W的搬運之仿真基板收容部7L、7U的配置，能有效地利用第一處理區塊層BL、第二處理區塊層BU內的空間來配置仿真基板收容部7L、7U。如上所述，仿真基板收容部7L、7U俯視觀看時與基板載置部6L、6U彼此重疊之配置具體而言亦可為被收容至仿真基板收容部7L、7U的仿真基板DW的一部分或者全部與被基板載置部6L、6U保持的基板W彼此重疊之配置。In addition, in this embodiment, the dummy board|substrate accommodating part 7L, 7U is arrange|positioned so that it may overlap with the board|substrate mounting part 6L, 6U in planar view. Thereby, the dummy substrate accommodating parts 7L, 7U are arranged using the space above or below the substrate mounting parts 6L, 6U. Thereby, the arrangement of the dummy substrate accommodating parts 7L and 7U that do not hinder the conveyance of the substrate W for products can be realized, and the dummy substrates can be arranged by effectively utilizing the space in the first processing block layer BL and the second processing block layer BU. The board|substrate accommodating part 7L, 7U. As described above, the dummy board storage parts 7L, 7U may be arranged to overlap with the board mounting parts 6L, 6U in a plan view. Specifically, a part or all of the dummy board DW housed in the dummy board storage parts 7L, 7U may also be used. Arrangement overlapping with the board|substrate W held by the board|substrate mounting part 6L, 6U.

更具體而言，在本實施形態中，於第一處理區塊層BL(下層的處理區塊層)上層疊有第二處理區塊層BU(上層的處理區塊層)。而且，在第一處理區塊層BL中，仿真基板收容部7L係位於基板載置部6L的下方。另一方面，在第二處理區塊層BU中，仿真基板收容部7U係位於基板載置部6U的下方。藉此，能減少第一處理區塊層BL的基板載置部6L與第二處理區塊層BU之間的基板載置部6U之間的高低差。藉此，由於能縮短索引機器人26所為之上下方向Z的基板搬運行程，因此能減輕索引機器人26的搬運負擔。因此，能提高製品用的基板W的搬運效率並有助於生產性的提升。More specifically, in this embodiment, the second processing block layer BU (upper processing block layer) is stacked on the first processing block layer BL (lower processing block layer). Moreover, in the first processing block layer BL, the dummy substrate storage part 7L is located below the substrate placement part 6L. On the other hand, in the second processing block layer BU, the dummy substrate accommodating portion 7U is located below the substrate mounting portion 6U. Thereby, the level difference between the substrate mounting part 6L of the first processing block layer BL and the substrate mounting part 6U between the second processing block layer BU can be reduced. Thereby, since the board|substrate conveyance stroke of the up-down direction Z by the index robot 26 can be shortened, the conveyance load of the index robot 26 can be reduced. Therefore, the conveyance efficiency of the substrate W for products can be improved and contribute to improvement of productivity.

此外，在本實施形態中，各個第一處理區塊層BL、第二處理區塊層BU的仿真基板收容部7L、7U係包含與該第一處理區塊層BL、第二處理區塊層BU所含有的複數個處理單元11L至43L、11U至43U相同數量的複數個仿真基板插槽DL1至DL12、DU1至DU12。而且，各個仿真基板插槽DL1至DL12、DU1至DU12係構成為保持一片仿真基板DW。藉此，能在各個第一處理區塊層BL、第二處理區塊層BU內預先保持與處理單元11L至43L、11U至43U相同數量的仿真基板DW。因此，若產生需要將仿真基板DW搬入至任一個處理單元11L至43L、11U至43U，則能藉由主搬運機器人8L、8U速迅地將仿真基板DW搬入至該處理單元並進行仿真處理。由於索引機器人26不參與仿真基板DW的搬入，因此能抑制或者防止對製品用的基板W的搬運造成影響。In addition, in this embodiment, the dummy substrate storage parts 7L and 7U of each of the first processing block layer BL and the second processing block layer BU include The plurality of processing units 11L to 43L, 11U to 43U contained in the BU have the same number of dummy substrate slots DL1 to DL12, DU1 to DU12. Furthermore, each of the dummy board slots DL1 to DL12 and DU1 to DU12 is configured to hold one dummy board DW. Thereby, the same number of dummy substrates DW as the number of processing units 11L to 43L, 11U to 43U can be held in each of the first processing block layer BL and the second processing block layer BU. Therefore, if there is a need to carry the dummy substrate DW into any of the processing units 11L to 43L, 11U to 43U, the main transfer robots 8L and 8U can quickly carry the dummy substrate DW into the processing unit and perform simulation processing. Since the index robot 26 does not participate in the carrying-in of the dummy substrate DW, it is possible to suppress or prevent the influence on the conveyance of the substrate W for products.

再者，在本實施形態中，各個第一處理區塊層BL、第二處理區塊層BU的複數個處理單元11L至43L、11U至43U與該處理區塊層的複數個仿真基板插槽DL1至DL12、DU1至DU12係一對一地賦予對應。而且，主搬運機器人8L、8U係在彼此對應的仿真基板插槽DL1至DL12、DU1至DU12與處理單元11L至43L、11U至43U之間搬運仿真基板DW。藉由此種構成，被仿真基板插槽保持的仿真基板DW係能作為用於對應的處理單元之專用的仿真基板。藉此，容易地管理仿真基板DW的使用歷程。Furthermore, in this embodiment, the plurality of processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU and the plurality of dummy substrate slots of the processing block layer DL1 to DL12 and DU1 to DU12 are assigned a one-to-one correspondence. Also, the main transport robots 8L, 8U transport the dummy substrate DW between the corresponding dummy substrate slots DL1 to DL12, DU1 to DU12 and the processing units 11L to 43L, 11U to 43U. With this configuration, the dummy board DW held by the dummy board slot can be used as a dedicated dummy board for the corresponding processing unit. Thereby, the usage history of the dummy substrate DW can be easily managed.

此外，在本實施形態中，控制器110係當仿真處理條件(單元洗淨執行條件、預處理執行條件、維護執行條件)充足時，控制主搬運機器人8L、8U將仿真基板DW從仿真基板收容部7L、7U搬運至處理單元11L至43L、11U至43U，並在該處理單元中執行仿真處理。如此，由於能藉由第一處理區塊層BL、第二處理區塊層BU內的仿真基板DW的搬運開始仿真處理，因此能抑制或者防止對製品用的基板W的搬運造成影響，並迅速地開始仿真處理。In addition, in this embodiment, the controller 110 controls the main transfer robots 8L and 8U to store the dummy substrate DW from the dummy substrate when the dummy processing conditions (unit cleaning execution conditions, preprocessing execution conditions, and maintenance execution conditions) are sufficient. The parts 7L, 7U are carried to the processing units 11L to 43L, 11U to 43U, and simulation processing is performed in the processing units. In this way, since the dummy process can be started by conveying the dummy substrate DW in the first processing block layer BL and the second processing block layer BU, it is possible to suppress or prevent the influence on the conveyance of the substrate W for products, and quickly to start the simulation process.

此外，依據本實施形態，控制器110控制基板處理裝置1的各部，藉此執行以下的工序。亦即，在各個第一處理區塊層BL、第二處理區塊層BU內執行：仿真基板搬入工序(步驟A31、A71、A161)，主搬運機器人8L、8U係將被收容至該處理區塊層內的仿真基板收容部7L、7U的仿真基板DW搬入至該處理區塊層內的複數個處理單元11L至43L、11U至43U的任一者。接著執行：仿真處理工序(步驟A32、A72、A162)，係在該處理單元內進行使用了被搬入的仿真基板DW的仿真處理。再者，在仿真處理後執行下述工序(步驟A33、A73、A163)：主搬運機器人8L、8U係將仿真基板DW從處理單元取出並搬運至仿真基板收容部7L、7U。又，執行下述工序(步驟A121)：將被載置於該第一處理區塊層BL、第二處理區塊層BU的基板載置部6L、6U的基板W搬入至該第一處理區塊層BL、第二處理區塊層BU的複數個處理單元11L至43L、11U至43U的任一者。接著，執行下述工序(步驟A122)：在該處理單元內處理被搬入的該基板W。藉此，能一邊減輕索引機器人26的搬運負擔，一邊在各個第一處理區塊層BL、第二處理區塊層BU的處理單元11L至43L、11U至43U中進行使用了仿真基板DW的處理。藉此，能提升生產效率。In addition, according to the present embodiment, the controller 110 controls each part of the substrate processing apparatus 1 to execute the following steps. That is to say, in each of the first processing block layer BL and the second processing block layer BU, the simulation substrate loading process (steps A31, A71, A161) is executed, and the main transfer robots 8L and 8U will be accommodated in the processing area The dummy substrates DW of the dummy substrate storage units 7L and 7U in the block layer are carried into any one of the plurality of processing units 11L to 43L and 11U to 43U in the processing block layer. Next, a simulation processing step (steps A32, A72, A162) is performed, in which simulation processing using the loaded dummy substrate DW is performed in the processing unit. Furthermore, after the simulation processing, the following steps are executed (steps A33, A73, A163): the main transport robots 8L, 8U take out the dummy substrate DW from the processing unit and transport it to the dummy substrate storage parts 7L, 7U. In addition, the following process (step A121) is performed: the substrate W placed on the substrate mounting parts 6L and 6U of the first processing block layer BL and the second processing block layer BU is carried into the first processing block Any one of the plurality of processing units 11L to 43L, 11U to 43U of the block layer BL and the second processing block layer BU. Next, a step (step A122 ) of processing the loaded substrate W in the processing unit is performed. Thereby, the processing using the dummy substrate DW can be performed in the processing units 11L to 43L, 11U to 43U of the first processing block layer BL and the second processing block layer BU while reducing the load on the indexing robot 26. . Thereby, production efficiency can be improved.

亦可藉由控制器110的控制，與基板搬入工序(製品基板搬入步驟A20)並行地執行上面所說明的仿真基板搬入工序(步驟A71)，或者在該基板搬入工序(製品基板搬入步驟A20)之前先執行上面所說明的仿真基板搬入工序(步驟A71)，該基板搬入工序(製品基板搬入步驟A20)係索引機器人26從被承載器保持部25保持的承載器C取出基板W並搬入至任一個第一處理區塊層BL、第二處理區塊層BU的基板載置部6L、6U。藉此，藉由索引機器人26將製品用的基板W搬入至第一處理區塊層BL、第二處理區塊層BU，另一方面在各個第一處理區塊層BL、第二處理區塊層BU內將仿真基板DW搬入至處理單元11L至43L、11U至43U。由於索引機器人26亦可不參與仿真基板DW的搬入，因此不用等待索引機器人26搬運基板W即能在第一處理區塊層BL、第二處理區塊層BU內進行仿真基板DW的搬運，或者與基板搬運並行地在第一處理區塊層BL、第二處理區塊層BU內進行仿真基板DW的搬運。因此，能減輕索引機器人26的搬運負擔，從而能在第一處理區塊層BL、第二處理區塊層BU內迅速地將仿真基板DW搬運至處理單元。Under the control of the controller 110, the dummy substrate carrying-in process (step A71) described above may be executed in parallel with the substrate carrying-in process (product substrate carrying-in step A20), or in the substrate carrying-in process (product substrate carrying-in step A20) The dummy substrate carrying-in process (step A71) described above is executed earlier. In this substrate carrying-in process (product substrate carrying-in step A20), the index robot 26 takes out the substrate W from the carrier C held by the carrier holding part 25 and carries it into any A substrate mounting portion 6L, 6U of the first processing block layer BL and the second processing block layer BU. In this way, the substrate W for the product is carried into the first processing block layer BL and the second processing block layer BU by the indexing robot 26, and on the other hand, each of the first processing block layer BL and the second processing block layer In the layer BU, the dummy substrate DW is carried into the processing units 11L to 43L, 11U to 43U. Since the index robot 26 may not participate in the loading of the dummy substrate DW, the dummy substrate DW can be carried in the first processing block layer BL and the second processing block layer BU without waiting for the index robot 26 to carry the substrate W, or with The substrate conveyance carries out conveyance of the dummy substrate DW in the first processing block layer BL and the second processing block layer BU in parallel. Therefore, the conveyance load of the index robot 26 can be reduced, and the dummy substrate DW can be conveyed to the processing unit quickly in the first processing block layer BL and the second processing block layer BU.

再者，亦可藉由控制器110的控制，與基板搬入工序(製品基板搬入步驟A20)並行地執行上面所說明的仿真處理工序(步驟A72)，或者在該基板搬入工序(製品基板搬入步驟A20)之前先執行上面所說明的仿真處理工序(步驟A72)，該基板搬入工序(製品基板搬入步驟A20)係藉由索引機器人26將製品用的基板W搬入至基板載置部6L、6U。藉此，能減輕索引機器人26的搬運負擔，從而能在第一處理區塊層BL、第二處理區塊層BU內迅速地開始仿真處理。例如，當從主機電腦150接受基板處理的請求時，能響應該基板處理的請求於適當的時期開始仿真基板DW的搬運以及緊接著的仿真處理。藉此，由於能在適當的時期整頓處理單元11L至43L、11U至43U內的環境，因此當收容了製品用的基板W的承載器C被搬入至承載器保持部25時，能迅速地開始基板W的處理。藉此，能有助於生產性的提升。Furthermore, under the control of the controller 110, the above-described simulation processing step (step A72) may be executed in parallel with the substrate carrying-in step (product substrate carrying-in step A20), or may be performed in parallel with the substrate carrying-in step (product substrate carrying-in step A20). A20) Before performing the above-described simulation process (step A72), the substrate carrying process (product substrate carrying step A20) is to carry the substrate W for the product into the substrate mounting parts 6L, 6U by the index robot 26. Thereby, the load of conveyance of the index robot 26 can be reduced, and the simulation process can be started rapidly in the 1st processing block layer BL, and the 2nd processing block layer BU. For example, when a substrate processing request is received from the host computer 150 , the transfer of the simulation substrate DW and the subsequent simulation processing can be started at an appropriate timing in response to the substrate processing request. Thereby, since the environment in the processing units 11L to 43L, 11U to 43U can be adjusted at an appropriate time, when the carrier C containing the substrate W for the product is loaded into the carrier holding part 25, the process can be quickly started. Substrate W processing. Thereby, it can contribute to improvement of productivity.

此外，在本實施形態中執行下述工序：在第一處理區塊層BL的仿真基板收容部7L與第二處理區塊層BU的仿真基板收容部7U之間移送仿真基板DW。因此，由於能在第一處理區塊層BL、第二處理區塊層BU之間彼此調度仿真基板DW，因此能有效地活用被收容至仿真基板收容部7L、7U的仿真基板DW。藉此，能減少將已經到達使用界限的仿真基板DW更換成新的仿真基板DW的次數。因此，能減少承載器保持部25被用以收容仿真基板DW的仿真承載器DC占有的次數以及時間。藉此，能有助於生產性的提升。Moreover, in this embodiment, the process of transferring the dummy substrate DW between the dummy substrate storage part 7L of the 1st processing block layer BL and the dummy substrate storage part 7U of the 2nd processing block layer BU is performed. Therefore, since the dummy substrates DW can be mutually scheduled between the first processing block layer BL and the second processing block layer BU, the dummy substrates DW accommodated in the dummy substrate storage portions 7L, 7U can be effectively utilized. Thereby, the number of times of replacing the dummy board DW that has reached the usage limit with a new dummy board DW can be reduced. Therefore, the number of times and time that the carrier holding portion 25 is occupied by the dummy carrier DC for accommodating the dummy substrate DW can be reduced. Thereby, it can contribute to improvement of productivity.

再者，無須等待從基板處理裝置1的外部供給仿真基板DW，即能進行使用了已經導入至基板處理裝置1內的仿真基板DW的仿真處理。因此，由於能無窒礙地進行仿真處理，因此亦能謀求生產性的提升。 此外，在仿真基板收容部7L、7U之間的仿真基板DW的移送係將基於仿真基板歷程資料134所算出的狀態資料成為需要更換的值等(仿真基板移送條件的成立)作為條件來執行。藉此，由於能適當地進行仿真基板DW的移送，因此能提高仿真基板DW的利用效率。如上所述，亦可將下述情形等加入至仿真基板移送條件：於承載器保持部25未保持有供給用的仿真承載器DC之情形；以及於被承載器保持部25保持的供給用的仿真承載器DC未收容有能與使用完畢的仿真基板DW置換的未使用的仿真基板DW之情形。此外，亦可將在基板處理裝置1內的仿真基板DW的移送能比來自基板處理裝置1的外部的仿真基板DW的供給還早結束之情形加入至仿真基板移送條件。 Furthermore, it is possible to perform a simulation process using the dummy substrate DW already introduced into the substrate processing apparatus 1 without waiting for the supply of the dummy substrate DW from outside the substrate processing apparatus 1 . Therefore, since simulation processing can be performed without hindrance, productivity can also be improved. Furthermore, the transfer of the dummy substrate DW between the dummy substrate accommodating sections 7L and 7U is performed on the condition that the state data calculated based on the dummy substrate history data 134 becomes a value requiring replacement (satisfaction of the dummy substrate transfer condition). Thereby, since the transfer of the dummy board DW can be performed appropriately, the utilization efficiency of the dummy board DW can be improved. As described above, the following cases may also be added to the dummy substrate transfer conditions: the case where the dummy carrier DC for supply is not held in the carrier holding section 25; When the dummy carrier DC does not house an unused dummy substrate DW that can be replaced with a used dummy substrate DW. In addition, the fact that the transfer of the dummy substrate DW in the substrate processing apparatus 1 can be completed earlier than the supply of the dummy substrate DW from outside the substrate processing apparatus 1 may be added to the dummy substrate transfer condition.

圖11係用以說明本發明的第二實施形態的基板處理裝置的構成之示意性的縱剖視圖，且顯示相當於圖2的縱剖面之縱剖面中的構成。當與上述第一實施形態比較時，在本實施形態中移除用以區分第一處理區塊層BL與第二處理區塊層BU之中間隔壁16。再者，用以導引主搬運機器人8L、8U的上下動作之支柱83係遍及第一處理區塊層BL以及第二處理區塊層BU上下地延伸。藉此，主搬運機器人8L、8U係構成為能以比第一實施形態的情形還大的行程上下地動作。當然，控制器110係以主搬運機器人8L、8U不會彼此干擾之方式控制主搬運機器人8L、8U的動作。FIG. 11 is a schematic vertical cross-sectional view for explaining the structure of a substrate processing apparatus according to a second embodiment of the present invention, and shows the structure in a vertical cross-section corresponding to the vertical cross-section in FIG. 2 . When compared with the above-mentioned first embodiment, in this embodiment, the partition wall 16 for distinguishing the first processing block layer BL from the second processing block layer BU is removed. Furthermore, the pillars 83 for guiding the vertical movements of the main transfer robots 8L and 8U extend up and down throughout the first processing block layer BL and the second processing block layer BU. Thereby, the main transfer robots 8L and 8U are configured to be able to move up and down with a stroke larger than that of the first embodiment. Of course, the controller 110 controls the actions of the main transport robots 8L, 8U so that the main transport robots 8L, 8U do not interfere with each other.

此外，在本實施形態中，第一實施形態中的兩個基板載置部6U、6L係被置換成一個基板載置部6。基板載置部6係在第一處理區塊層BL與第二處理區塊層BU被共用。亦即，第一處理區塊層BL的主搬運機器人8L係能夠存取基板載置部6，並在基板載置部6與第一處理區塊層BL的處理單元11L至43L之間搬運製品基板W。此外，主搬運機器人8L係在基板載置部6、處理單元11L至43L以及仿真基板收容部7L之間搬運仿真基板DW。同樣地，第二處理區塊層BU的主搬運機器人8U係能夠存取基板載置部6，並在基板載置部6與第二處理區塊層BU的處理單元11U至43U之間搬運製品基板W。此外，主搬運機器人8U係在基板載置部6、處理單元11U至43U以及仿真基板收容部7U之間搬運仿真基板DW。In addition, in this embodiment, the two substrate mounting parts 6U and 6L in the first embodiment are replaced with one substrate mounting part 6 . The substrate mounting part 6 is shared between the first processing block layer BL and the second processing block layer BU. That is, the main transfer robot 8L of the first processing block layer BL can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11L to 43L of the first processing block layer BL. Substrate W. In addition, the main transport robot 8L transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11L to 43L, and the dummy substrate storage section 7L. Similarly, the main transfer robot 8U of the second processing block layer BU can access the substrate mounting part 6, and transfer products between the substrate mounting part 6 and the processing units 11U to 43U of the second processing block layer BU. Substrate W. In addition, the main transport robot 8U transports the dummy substrate DW between the substrate mounting section 6 , the processing units 11U to 43U, and the dummy substrate storage section 7U.

基板載置部6係具備未處理基板載置部61以及已處理基板載置部62。然而，由於基板載置部6係在第一處理區塊層BL以及第二處理區塊層BU被共用，因此較佳為未處理基板載置部61以及已處理基板載置部62係分別具備基板保持架65、66，基板保持架65、66係具有比第一實施形態的情形還多的插槽。較佳為基板載置部6所具備的基板保持架65、66的至少一個(亦即一部分或者全部)的插槽係配置成能夠被雙方的主搬運機器人8L、8U存取。更詳細而言，較佳為未處理基板載置部61的基板保持架65(參照圖5)的至少一個(亦即一部分或者全部)插槽係配置成能夠被雙方的主搬運機器人8L、8U存取。同樣地，較佳為已處理基板載置部62的基板保持架66(參照圖5)的至少一個(亦即一部分或者全部)的插槽係配置成能夠被雙方的主搬運機器人8L、8U存取。以下，將雙方的主搬運機器人8L、8U能夠存取的插槽稱為「共用插槽」。The substrate placement unit 6 includes an unprocessed substrate placement unit 61 and a processed substrate placement unit 62 . However, since the substrate mounting portion 6 is shared by the first processing block layer BL and the second processing block layer BU, it is preferable that the unprocessed substrate mounting portion 61 and the processed substrate mounting portion 62 respectively have The substrate holders 65, 66 have more slots than in the case of the first embodiment. Preferably, at least one (that is, a part or all) of the slots of the substrate holders 65 and 66 included in the substrate mounting unit 6 is arranged so as to be accessible by both main transfer robots 8L and 8U. More specifically, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 65 (refer to FIG. 5 ) of the unprocessed substrate placement part 61 is arranged so that it can be used by both main transfer robots 8L and 8U. access. Similarly, it is preferable that at least one (that is, a part or all) of the slots of the substrate holder 66 (see FIG. 5 ) of the processed substrate loading unit 62 is arranged so that it can be stored by both main transfer robots 8L and 8U. Pick. Hereinafter, the slots that can be accessed by both main transport robots 8L and 8U are referred to as "common slots".

較佳為基板載置部6係配置成能夠被索引機器人26存取。更詳細而言，較佳為索引機器人26係構成為：能夠存取基板載置部6的基板保持架65、66的全部的插槽，且能將製品基板W或者仿真基板DW搬入至這些插槽或者從這些插槽搬出。 當需要在處理區塊第一處理區塊層BL、第二處理區塊層BU之間移送仿真基板DW時，控制器110係作成用以在仿真基板收容部7L、7U之間在經由基板載置部6的搬運路徑搬運仿真基板DW之計畫，並依循該計畫使主搬運機器人8L、8U動作。 Preferably, the substrate placement part 6 is configured to be accessible by the indexing robot 26 . More specifically, it is preferable that the index robot 26 is configured to be able to access all the slots of the substrate holders 65, 66 of the substrate placement unit 6, and to be able to carry the product substrate W or the dummy substrate DW into these slots. slots or move from these slots. When it is necessary to transfer the dummy substrate DW between the first processing block layer BL and the second processing block layer BU of the processing block, the controller 110 is configured to transfer the dummy substrate DW between the dummy substrate storage parts 7L and 7U The plan for transporting the dummy substrate DW in the transport path of the setting unit 6 is made, and the main transport robots 8L and 8U are operated according to the plan.

具體而言，將被收容於仿真基板收容部7L的仿真基板DW搬運至仿真基板收容部7U時，主搬運機器人8L係從仿真基板收容部7L搬出移送對象的仿真基板DW，並將該仿真基板DW搬入至基板載置部6的插槽。此時，第一處理區塊層BL的主搬運機器人8L係將仿真基板DW搬入至基板載置部6的共用插槽。移送對象的仿真基板DW被搬入至共用插槽後，第二處理區塊層BU的主搬運機器人8U係從基板載置部6的共用插槽搬出該仿真基板DW並搬入至仿真基板收容部7U。如此，將仿真基板DW從第一處理區塊層BL移送至第二處理區塊層BU。Specifically, when transferring the dummy substrate DW stored in the dummy substrate storage section 7L to the dummy substrate storage section 7U, the main transfer robot 8L takes out the dummy substrate DW to be transferred from the dummy substrate storage section 7L, and transfers the dummy substrate DW to the dummy substrate storage section 7L. The DW is loaded into the slot of the substrate mounting unit 6 . At this time, the main transfer robot 8L of the first processing block layer BL carries the dummy substrate DW into the common slot of the substrate placement unit 6 . After the dummy substrate DW to be transferred is loaded into the common slot, the main transfer robot 8U of the second processing block floor BU unloads the dummy substrate DW from the common slot of the substrate placement part 6 and carries it into the dummy substrate storage part 7U. . In this way, the dummy substrate DW is transferred from the first processing block layer BL to the second processing block layer BU.

將被收容於仿真基板收容部7U的仿真基板DW搬運至仿真基板收容部7L之情形的動作係與上述說明相反。亦即，主搬運機器人8U係從仿真基板收容部7U搬出移送對象的仿真基板DW並將該仿真基板DW搬入至基板載置部6的共用插槽。之後，第一處理區塊層BL的主搬運機器人8L係從基板載置部6的共用插槽搬出該仿真基板DW並搬入至仿真基板收容部7L。如此，將仿真基板DW從第二處理區塊層BU移送至第一處理區塊層BL。The operation in the case of transferring the dummy substrate DW stored in the dummy substrate storage section 7U to the dummy substrate storage section 7L is the reverse of the above description. That is, the main transfer robot 8U unloads the dummy substrate DW to be transferred from the dummy substrate storage section 7U, and carries the dummy substrate DW into the common slot of the substrate mounting section 6 . Thereafter, the main transfer robot 8L of the first processing block layer BL unloads the dummy substrate DW from the common slot of the substrate mounting section 6 and carries it into the dummy substrate storage section 7L. In this way, the dummy substrate DW is transferred from the second processing block layer BU to the first processing block layer BL.

於在第一處理區塊層BL與第二處理區塊層BU之間更換仿真基板DW之情形中，只要依序地進行或者並行地進行上面所說明的兩個動作即可。 藉由控制器110計畫並執行上面所說明的動作，藉此達成仿真基板DW的移送。 在本實施形態中，由於基板載置部6係具有主搬運機器人8L、8U雙方能夠存取的共用插槽，因此能夠以索引機器人26不參與的方式進行仿真基板DW的移送。藉此，由於能減輕索引機器人26的搬運負擔，因此有助於生產性的提升。 In the case of exchanging the dummy substrate DW between the first processing block layer BL and the second processing block layer BU, it is sufficient to perform the two operations described above sequentially or in parallel. The transfer of the dummy substrate DW is achieved by planning and executing the actions described above by the controller 110 . In the present embodiment, since the substrate placement unit 6 has a common slot that both the main transfer robots 8L and 8U can access, it is possible to transfer the dummy substrate DW without the index robot 26 participating. Thereby, since the conveyance load of the index robot 26 can be reduced, it contributes to improvement of productivity.

圖12係用以說明本發明的第三實施形態的基板處理裝置的構成之縱剖視圖，並顯示相當於圖2的縱剖面之縱剖面中的構成。在第一實施形態中，於索引區塊2以及處理區塊3所鄰接的後隔壁2a以及前隔壁3a形成有與基板載置部6L、6U對應的窗4L、4U，且未形成有與仿真基板收容部7L、7U對應的窗。相對於此，在本實施形態中，於後隔壁2a以及前隔壁3a追加有與仿真基板收容部7L、7U對應的窗5L、5U。12 is a vertical sectional view for explaining the structure of a substrate processing apparatus according to a third embodiment of the present invention, and shows the structure in a vertical section corresponding to the vertical section in FIG. 2 . In the first embodiment, the windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are formed on the rear partition wall 2a and the front partition wall 3a adjacent to the index block 2 and the processing block 3, and windows 4L, 4U corresponding to the substrate placement parts 6L, 6U are not formed. The corresponding windows of the board housing parts 7L and 7U. On the other hand, in the present embodiment, windows 5L, 5U corresponding to the dummy substrate storage portions 7L, 7U are added to the rear partition wall 2a and the front partition wall 3a.

藉由設置此種追加的窗5L、5U，在將仿真基板DW導入至第一處理區塊層BL、第二處理區塊層BU時，索引機器人26係能直接存取仿真基板收容部7L、7U並搬入仿真基板DW。再者，於需要在第一處理區塊層BL的仿真基板收容部7L與第二處理區塊層BU的仿真基板收容部7L之間移送仿真基板DW之情形中，索引機器人26係能直接存取這些仿真基板收容部7L並在這些仿真基板收容部7L之間移送仿真基板DW。主搬運機器人8L、8U皆無須參與仿真基板DW的移送。因此，能減輕主搬運機器人8L、8U的搬運負擔從而謀求生產性的提升。By providing such additional windows 5L, 5U, when introducing the dummy substrate DW into the first processing block layer BL and the second processing block layer BU, the index robot 26 can directly access the dummy substrate storage part 7L, 7U and moved into the dummy substrate DW. Moreover, in the case where it is necessary to transfer the dummy substrate DW between the dummy substrate accommodating portion 7L of the first processing block layer BL and the dummy substrate accommodating portion 7L of the second processing block layer BU, the indexing robot 26 can directly store These dummy substrate storage parts 7L are taken, and the dummy substrate DW is transferred between these dummy substrate storage parts 7L. Neither the main transfer robots 8L nor 8U need to participate in the transfer of the dummy substrate DW. Therefore, the conveyance load of the main conveyance robots 8L and 8U can be reduced, and productivity can be improved.

圖13係顯示本發明的第四實施形態的基板處理裝置的內部構成之示意性的俯視圖。在第一實施形態中，複數個處理單元11L至43U係被區分成第一處理單元群與第二處理單元群，且於第一處理單元群與第二處理單元群之間設置有水平的中間隔壁16，第一處理單元群係設置於下段的第一處理區塊層BL，第二處理單元群係設置於上段的第二處理區塊層BU。相對於此，在本實施形態中，未設置有用以將處理區塊3內的空間上下地區分之中間隔壁16，取而代之的是具備有用以將處理區塊3內的空間於水平方向區分之中央隔壁18。Fig. 13 is a schematic plan view showing the internal structure of a substrate processing apparatus according to a fourth embodiment of the present invention. In the first embodiment, the plurality of processing units 11L to 43U are divided into a first processing unit group and a second processing unit group, and a horizontal middle is provided between the first processing unit group and the second processing unit group. In the next wall 16 , the first processing unit group is arranged on the first processing block layer BL at the lower stage, and the second processing unit group is arranged on the second processing block layer BU at the upper stage. On the other hand, in this embodiment, the middle partition wall 16 for dividing the space in the processing block 3 up and down is not provided, but a central wall 16 for dividing the space in the processing block 3 in the horizontal direction is provided instead. 18 next door.

從承載器保持部25之側觀看第一水平方向X之俯視觀看時，中央隔壁18係將處理區塊3內的空間左右地區分。中央隔壁18為平板狀的隔壁，在處理區塊3的第二水平方向Y(左右方向)的中央附近沿著第一水平方向X以及上下方向Z延伸。中央隔壁18係形成：第一處理區塊部B1，係配置於中央隔壁18的一側；以及第二處理區塊部B2，係配置於中央隔壁18的另一側。亦即，第一處理區塊部B1以及第二處理區塊部B2係配置於彼此的側方。處理區塊3所具備的複數個處理單元11L至43U係被區分為：第一處理單元群G1，係包含於第一處理區塊部B1；以及第二處理單元群G2，係包含於第二處理區塊部B2。由於複數個處理單元11L至43U的配置係與第一實施形態類似，因此在圖13中於複數個處理單元11L至43U附上與圖1相同的元件符號。第一處理單元群G1係由用以形成第一塔T1以及第二塔T2之複數個處理單元11L、12L、13L、11U、12U、13U、21L、22L、23L、21U、22U、23U所構成。第二處理單元群G2係由用以構成第三塔T3以及第四塔T4之複數個處理單元31L、32L、33L、31U、32U、33U、41L、42L、43L、41U、42U、43U所構成。The central partition wall 18 divides the space in the processing block 3 to the left and right when viewed from the side of the carrier holding portion 25 in a plan view in the first horizontal direction X. The central partition wall 18 is a flat partition wall and extends along the first horizontal direction X and the vertical direction Z near the center of the processing block 3 in the second horizontal direction Y (left-right direction). The central partition 18 is formed: the first processing block B1 is disposed on one side of the central partition 18 ; and the second processing block B2 is disposed on the other side of the central partition 18 . That is, the first processing block part B1 and the second processing block part B2 are arranged on the sides of each other. The plurality of processing units 11L to 43U included in the processing block 3 are divided into: a first processing unit group G1 included in the first processing block part B1; and a second processing unit group G2 included in the second processing unit group G2. Process block part B2. Since the configuration of the plurality of processing units 11L to 43U is similar to that of the first embodiment, in FIG. 13 the same reference numerals as in FIG. 1 are assigned to the plurality of processing units 11L to 43U. The first processing unit group G1 is composed of a plurality of processing units 11L, 12L, 13L, 11U, 12U, 13U, 21L, 22L, 23L, 21U, 22U, 23U for forming the first tower T1 and the second tower T2 . The second processing unit group G2 is composed of a plurality of processing units 31L, 32L, 33L, 31U, 32U, 33U, 41L, 42L, 43L, 41U, 42U, 43U for forming the third tower T3 and the fourth tower T4 .

與第一處理單元群G1對應地，於中央隔壁18的一側設置有第一主搬運機器人8A。第一主搬運機器人8A係在被中央隔壁18與第一處理單元群G1之間區劃的第一搬運空間53A內動作，藉此製品基板W以及仿真基板DW係通過第一搬運空間53A被搬運。同樣地，與第二處理單元群G2對應地，於中央隔壁18的另一側設置有第二主搬運機器人8B。第二主搬運機器人8B係在被中央隔壁18與第二處理單元群G2之間區劃的第二搬運空間53B內動作，藉此製品基板W以及仿真基板DW係通過第二搬運空間53B被搬運。由於第一主搬運機器人8A以及第二主搬運機器人8B的構成係與圖11所示的第二實施形態的情形大致相同，因此於對應構成部分附上相同的元件符號並省略說明。然而，在本實施形態中，用以導引上下方向移動之支柱83係被固定於中央隔壁18。Corresponding to the first processing unit group G1, a first main transfer robot 8A is installed on one side of the central partition wall 18 . The first main transport robot 8A operates in the first transport space 53A partitioned between the central partition wall 18 and the first processing unit group G1, whereby the product substrate W and the dummy substrate DW are transported through the first transport space 53A. Similarly, corresponding to the second processing unit group G2, the second main transfer robot 8B is installed on the other side of the central partition wall 18 . The second main transport robot 8B operates in the second transport space 53B partitioned between the central partition wall 18 and the second processing unit group G2, whereby the product substrate W and the dummy substrate DW are transported through the second transport space 53B. Since the configurations of the first main transfer robot 8A and the second main transfer robot 8B are substantially the same as those of the second embodiment shown in FIG. 11 , corresponding components are given the same reference numerals and descriptions thereof are omitted. However, in this embodiment, the pillar 83 for guiding the movement in the vertical direction is fixed to the central partition wall 18 .

再者，與第一處理單元群G1對應地，於第一搬運空間53A中之與索引區塊2鄰接之端部設置有第一基板載置部6A。再者，以在俯視觀看時與第一基板載置部6A一部分或者全部重疊之方式於第一基板載置部6A的上方以及／或者下方配置有第一仿真基板收容部7A。同樣地，與第二處理單元群G2對應地，於第二搬運空間53B中之與索引區塊2鄰接之端部設置有第二基板載置部6B。再者，以俯視觀看時與第二基板載置部6B一部分或者全部重疊之方式於第二基板載置部6B的上方以及／或者下方配置有第二仿真基板收容部7B。Furthermore, corresponding to the first processing unit group G1 , a first substrate mounting portion 6A is provided at an end portion adjacent to the index block 2 in the first transfer space 53A. Furthermore, the first dummy substrate housing portion 7A is arranged above and/or below the first substrate mounting portion 6A so as to partially or completely overlap the first substrate mounting portion 6A in plan view. Similarly, corresponding to the second processing unit group G2, a second substrate mounting portion 6B is provided at an end portion adjacent to the index block 2 in the second transfer space 53B. In addition, the second dummy substrate accommodating portion 7B is disposed above and/or below the second substrate mounting portion 6B so as to partially or completely overlap the second substrate mounting portion 6B in plan view.

第一主搬運機器人8A係能夠存取用以構成第一處理單元群G1之複數個處理單元、第一基板載置部6A以及第一仿真基板收容部7A。藉此，第一主搬運機器人8A係在用以構成第一處理單元群G1之複數個處理單元與第一基板載置部6A之間搬運製品基板W。此外，第一主搬運機器人8A係在用以構成第一處理單元群G1之複數個處理單元、第一基板載置部6A以及第一仿真基板收容部7A之間搬運仿真基板DW。在本實施形態中，第一主搬運機器人8A皆無法存取第二處理單元群G2、第二基板載置部6B以及第二仿真基板收容部7B。The first main transfer robot 8A can access a plurality of processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. Thereby, the first main transfer robot 8A transfers the product substrate W between the plurality of processing units constituting the first processing unit group G1 and the first substrate placement unit 6A. In addition, the first main transport robot 8A transports the dummy substrate DW between the processing units constituting the first processing unit group G1 , the first substrate loading unit 6A, and the first dummy substrate storage unit 7A. In the present embodiment, none of the first main transfer robot 8A can access the second processing unit group G2, the second substrate placement unit 6B, and the second dummy substrate storage unit 7B.

同樣地，第二主搬運機器人8B係能夠存取用以構成第二處理單元群G2之複數個處理單元、第二基板載置部6B以及第二仿真基板收容部7B。藉此，第二主搬運機器人8B係在用以構成第二處理單元群G2之複數個處理單元與第二基板載置部6B之間搬運製品基板W。此外，第二主搬運機器人8B係在用以構成第二處理單元群G2之複數個處理單元、第二基板載置部6B以及第二仿真基板收容部7B之間搬運仿真基板DW。在本實施形態中，第二主搬運機器人8B皆無法存取第一處理單元群G1、第一基板載置部6A以及第一仿真基板收容部7A。Similarly, the second main transfer robot 8B can access a plurality of processing units constituting the second processing unit group G2 , the second substrate placement part 6B, and the second dummy substrate storage part 7B. Thereby, the second main transfer robot 8B transfers the product substrate W between the plurality of processing units constituting the second processing unit group G2 and the second substrate mounting unit 6B. In addition, the second main transport robot 8B transports the dummy substrate DW between the processing units constituting the second processing unit group G2 , the second substrate loading unit 6B, and the second dummy substrate storage unit 7B. In this embodiment, none of the second main transfer robot 8B can access the first processing unit group G1 , the first substrate placement unit 6A, and the first dummy substrate storage unit 7A.

索引機器人26係能夠存取被承載器保持部25保持的承載器C、仿真承載器DC、第一基板載置部6A以及第二基板載置部6B，並在承載器C、仿真承載器DC、第一基板載置部6A以及第二基板載置部6B之間搬運製品基板W以及仿真基板DW。在本實施形態中，索引機器人26皆無法存取第一仿真基板收容部7A以及第二仿真基板收容部7B。當然，索引機器人26皆無法存取第一處理單元群G1以及第二處理單元群G2。The indexing robot 26 is able to access the carrier C held by the carrier holding unit 25, the dummy carrier DC, the first substrate placement unit 6A, and the second substrate placement unit 6B, and it can access the carrier C, the dummy carrier DC , The product substrate W and the dummy substrate DW are conveyed between the first substrate mounting part 6A and the second substrate mounting part 6B. In this embodiment, neither the index robot 26 can access the first dummy substrate storage unit 7A nor the second dummy substrate storage unit 7B. Of course, neither the indexing robot 26 can access the first processing unit group G1 or the second processing unit group G2.

即使在此種構成的基板處理裝置1中，亦與第一實施形態的情形相同，能因應需要在第一仿真基板收容部7A與第二仿真基板收容部7B之間移送仿真基板DW。 亦可將第四實施形態仿照上面所說明的第二實施形態(參照圖11)進行變化，設置有索引機器人26、第一主搬運機器人8A以及第二主搬運機器人8B能夠共通地存取的基板載置部，以取代第一基板載置部6A以及第二基板載置部6B。例如，能於中央隔壁18的索引區塊2側的端部設置切口，並配置被第一處理單元群G1以及第二處理單元群G2共用的基板載置部。藉由設置此種共用的基板載置部，能以索引機器人26不參與的方式，藉由第一主搬運機器人8A以及第二主搬運機器人8B在第一仿真基板收容部7A與第二仿真基板收容部7B之間移送仿真基板DW。 Also in the substrate processing apparatus 1 having such a configuration, as in the case of the first embodiment, the dummy substrate DW can be transferred between the first dummy substrate storage unit 7A and the second dummy substrate storage unit 7B as needed. The fourth embodiment can also be changed in the same manner as the second embodiment (see FIG. 11 ) described above, and a substrate that can be accessed in common by the index robot 26, the first main transfer robot 8A, and the second main transfer robot 8B is provided. The mounting portion is used instead of the first substrate mounting portion 6A and the second substrate mounting portion 6B. For example, a notch can be provided at the end of the central partition wall 18 on the index block 2 side, and a substrate mounting portion shared by the first processing unit group G1 and the second processing unit group G2 can be arranged. By providing such a shared substrate loading unit, the first dummy substrate storage unit 7A and the second dummy substrate can be placed between the first dummy substrate storage unit 7A and the second dummy substrate by the first main transfer robot 8A and the second main transfer robot 8B without the participation of the index robot 26 . The dummy substrate DW is transferred between the storage units 7B.

此外，亦可將第四實施形態仿照上面所說明的第三實施形態(參照圖12)進行變化，構成為索引機器人26能夠存取第一仿真基板收容部7A以及第二仿真基板收容部7B。藉此，能以第一主搬運機器人8A以及第二主搬運機器人8B不參與的方式，藉由索引機器人26在第一仿真基板收容部7A與第二仿真基板收容部7B之間移送仿真基板DW。In addition, the fourth embodiment can also be modified like the above-described third embodiment (see FIG. 12 ), so that the index robot 26 can access the first dummy board storage unit 7A and the second dummy board storage unit 7B. Thereby, the dummy substrate DW can be transferred between the first dummy substrate storage section 7A and the second dummy substrate storage section 7B by the index robot 26 without the participation of the first main transfer robot 8A and the second main transfer robot 8B. .

以上，雖然已說明本發明的四個實施形態，然而本發明亦可進一步以其他的形態來實施。例如，雖然在上述第一實施形態等中顯示層疊兩層的第一處理區塊層BL、第二處理區塊層BU所構成的處理區塊3的構成，然而亦可層疊三層以上的處理區塊層來構成處理區塊。此外，雖然在上述第一實施形態等中顯示具有三段地層疊有各個第一處理區塊層BL、第二處理區塊層BU的處理單元配置之例子，然而各個處理區塊層所含有的處理單元亦可為二段地層疊，亦可為四段以上地層疊，亦可一段地配置有全部的處理單元。再者，雖然在上述第一實施形態等中顯示於搬運路徑51L、51U的兩側配置有處理單元11L至43U的例子，然而亦可於搬運路徑51L、51U的一側配置有處理單元。此外，雖然在上述第一實施形態等中沿著搬運路徑51L、51U於搬運路徑51L、51U的一側配置有兩個處理單元，然而亦可配置有一個處理單元或者亦可配置有三個以上的處理單元。Although four embodiments of the present invention have been described above, the present invention can also be implemented in other forms. For example, in the above-mentioned first embodiment, etc., although the configuration of the processing block 3 composed of the first processing block layer BL and the second processing block layer BU stacked in two layers is shown, three or more layers of processing blocks may be stacked. block layer to form processing blocks. In addition, although the above-mentioned first embodiment and the like show an example of a processing unit arrangement in which the first processing block layer BL and the second processing block layer BU are stacked in three stages, each processing block layer includes The processing units may be stacked in two stages, or may be stacked in four or more stages, or all the processing units may be arranged in one stage. Furthermore, although the example in which the processing units 11L to 43U are arranged on both sides of the conveyance paths 51L and 51U was shown in the first embodiment, the processing units may be arranged on one side of the conveyance paths 51L and 51U. In addition, although two processing units are arranged on one side of the conveyance paths 51L, 51U along the conveyance paths 51L, 51U in the above-mentioned first embodiment, one processing unit may be arranged, or three or more may be arranged. processing unit.

再者，在上述第一實施形態等中，於各個第一處理區塊層BL、第二處理區塊層BU的仿真基板收容部7L、7U設置有與處理單元11L至43L、11U至43U相同數量的仿真基板插槽DL1至DL12、DU1至DU12，這些仿真基板插槽DL1至DL12、DU1至DU12係與處理單元11L至43L、11U至43U一對一地對應。然而，亦可將各個第一處理區塊層BL、第二處理區塊層BU中的仿真基板插槽的數量設定成比處理單元的數量還少，並將一個仿真基板插槽賦予對應至複數個處理單元。Furthermore, in the above-mentioned first embodiment, etc., the dummy substrate storage parts 7L and 7U of the first processing block layer BL and the second processing block layer BU are provided with the same A number of dummy base slots DL1 to DL12 , DU1 to DU12 correspond one-to-one to the processing units 11L to 43L, 11U to 43U. However, it is also possible to set the number of dummy substrate slots in each of the first processing block layer BL and the second processing block layer BU to be less than the number of processing units, and assign one dummy substrate slot corresponding to a plurality of processing unit.

雖然已經詳細地說明本發明的實施形態，然而這些實施形態僅為用以明瞭本發明的技術內容之具體例，本發明不應被解釋成限定在這些具體例，本發明僅被隨附的申請專利範圍所限定。Although the embodiments of the present invention have been described in detail, these embodiments are only specific examples for clarifying the technical content of the present invention. limited by the scope of the patent.

1:基板處理裝置 2:索引機器人 2a:後隔壁 3:處理區塊 3a:前隔壁 4L,4U,5L,5U:窗 6,6L,6U:基板載置部 6A:第一基板載置部 6B:第二基板載置部 7A:第一仿真基板收容部 7B:第二仿真基板收容部 7L,7U:仿真基板收容部 8A:第一主搬運機器人 8B:第二主搬運機器人 8L,8U:主搬運機器人 11L至13L,21L至23L,31L至33L,41L至43L,11U至13U,21U至23U,31U至33U,41U至43U:處理單元 15:下隔壁 16:中間隔壁 17:上隔壁 18:中央隔壁 25:承載器保持部 26:索引機器人 27:多關節臂 28:臂 29,81:手部 30:基台部 35:處理室 36:單元隔壁 36a:側壁 36b:頂壁 36c:底壁 37:搬出口 38:擋門 39:處理罩 40:自轉夾具 45:自轉基座 46:自轉馬達 51L,51U:搬運路徑 52L,52U:搬運空間 53A:第一搬運空間 53B:第二搬運空間 54:處理液供給源 55:噴嘴 56:處理液配管 57:噴嘴臂 58:擺動軸 59:閥 60:泵 61:未處理基板載置部 62:已處理基板載置部 63,64:箱 65,66:基板保持架 67,68:基板支撐構件 71:仿真基板保持架 72:仿真基板支撐構件 75:排氣連接管 76:排氣配管 77:切換機構 82:手部驅動機構 83:支柱 84:垂直移動部 85:水平移動部 86:旋轉部 87:進退部 91:第一液體供給部 92:第二液體供給部 93:第三液體供給部 94:第四液體供給部 101:第一排氣部(排氣部) 102:第二排氣部(排氣部) 103:第三排氣部(排氣部) 104:第四排氣部(排氣部) 110:控制器 111:處理器 112:記憶體 120:程式 130:資料 131:製品處方 132:仿真處理處方 133:仿真基板表 134:仿真基板歷程資料 135:單元使用歷程資料 140:使用者介面 150:主機電腦 170:通訊線 300:承載器搬運機構 350:承載器置放處 351:仿真承載器置放處 A7:預處理步驟 A20:製品基板搬入步驟 A71:仿真基板搬入步驟 A72:仿真處理步驟 A73:仿真基板收容步驟 A121:基板搬入步驟 A122:處理步驟 A123:基板收容步驟 B1:第一處理區塊部 B2:第二處理區塊部 BL:第一處理區塊層 BU:第二處理區塊層 C:承載器 DC:仿真承載器 DL1至DL12,DU1至DU12:仿真基板插槽 DW:仿真基板 G1:第一處理單元群 G2:第二處理單元群 S1L,S1U:第一處理單元堆疊部 S2L,S2U:第二處理單元堆疊部 S3L,S3U:第三處理單元堆疊部 S4L,S4U:第四處理單元堆疊部 T1:第一塔 T2:第二塔 T3:第三塔 T4:第四塔 W:製品基板(基板) X:第一水平方向 Y:第二水平方向 Z:上下方向 1: Substrate processing device 2: Indexing Bots 2a: Rear Bulkhead 3: Processing blocks 3a: front next door 4L, 4U, 5L, 5U: window 6, 6L, 6U: Substrate mounting part 6A: The first substrate loading part 6B: The second substrate loading part 7A: The first dummy substrate storage unit 7B: Second Dummy Substrate Storage Unit 7L, 7U: dummy board housing 8A: The first main handling robot 8B: The second main handling robot 8L, 8U: Main handling robot 11L to 13L, 21L to 23L, 31L to 33L, 41L to 43L, 11U to 13U, 21U to 23U, 31U to 33U, 41U to 43U: Processing Unit 15: next door 16: middle partition 17: next door 18: Next to the center 25: Carrier holding part 26: Indexing Bots 27:Multi-joint arm 28: arm 29,81: hand 30: abutment 35: Processing room 36: Next door to the unit 36a: side wall 36b: top wall 36c: bottom wall 37: export 38: door stop 39: Handling Hood 40: Rotation fixture 45: Rotation base 46: Rotation motor 51L, 51U: Transport path 52L, 52U: transport space 53A: The first handling space 53B: Second handling space 54: Treatment liquid supply source 55: Nozzle 56: Treatment liquid piping 57:Nozzle arm 58: Oscillating shaft 59: Valve 60: pump 61: unprocessed substrate loading part 62: Processed substrate loading unit 63,64: box 65,66: Substrate holder 67,68: Substrate support member 71:Simulation substrate holder 72:Simulation substrate support member 75: Exhaust connecting pipe 76: Exhaust piping 77:Switch mechanism 82:Hand drive mechanism 83: Pillar 84: Vertical movement department 85: Horizontal movement department 86:Rotation 87: Advance and retreat 91: The first liquid supply unit 92: Second liquid supply part 93: The third liquid supply unit 94: The fourth liquid supply unit 101: the first exhaust part (exhaust part) 102: the second exhaust part (exhaust part) 103: The third exhaust part (exhaust part) 104: The fourth exhaust part (exhaust part) 110: Controller 111: Processor 112: Memory 120: program 130: Information 131: Product prescription 132: Simulation processing prescription 133: Simulation substrate table 134: Simulation substrate history data 135: Unit usage history data 140: User Interface 150: host computer 170: communication line 300: carrier handling mechanism 350: Carrier Placement 351: Simulation carrier placement A7: Preprocessing steps A20: Product substrate loading steps A71: Steps for loading the dummy board A72: Simulation processing steps A73: Dummy board containment steps A121: Substrate loading procedure A122: Processing steps A123: Substrate containment procedure B1: The first processing block department B2: The second processing block BL: The first processing block layer BU: the second processing block layer C: carrier DC: Dummy Carrier DL1 to DL12, DU1 to DU12: Dummy base slots DW: Dummy Substrate G1: The first processing unit group G2: The second processing unit group S1L, S1U: first processing unit stack S2L, S2U: second processing unit stack S3L, S3U: third processing unit stack S4L, S4U: fourth processing unit stack T1: The first tower T2: the second tower T3: The third tower T4: The fourth tower W: Product substrate (substrate) X: the first horizontal direction Y: the second horizontal direction Z: up and down direction

[圖1]係顯示本發明的實施形態之一的基板處理裝置的內部構成之示意性的俯視圖。 [圖2]係從圖1的Ⅱ－Ⅱ線觀看的示意性的縱剖視圖。 [圖3]係從圖1的Ⅲ－Ⅲ線觀看的示意性的橫剖視圖。 [圖4]係顯示從圖1的Ⅳ方向觀看的處理區塊的內部構成之示意性的立視圖。 [圖5]係用以說明基板載置部的構成例之圖。 [圖6]係用以說明仿真基板收容部的構成例之圖。 [圖7]係用以說明處理單元的構成例之示意性的剖視圖。 [圖8]係用以說明與基板處理裝置的控制有關的構成之方塊圖。 [圖9]係用以說明與仿真處理有關的控制器的動作之流程圖。 [圖10A]係用以說明與未使用的仿真基板搬入至仿真基板收容部以及從仿真基板收容部搬出使用完畢的仿真基板相關的動作例之流程圖。 [圖10B]係用以說明與未使用的仿真基板搬入至仿真基板收容部以及從仿真基板收容部搬出使用完畢的仿真基板相關的動作例之流程圖。 [圖11]係顯示本發明的其他實施形態的基板處理裝置的內部構成之示意性的縱剖視圖。 [圖12]係顯示本發明的又一個其他實施形態的基板處理裝置的內部構成之示意性的縱剖視圖。 [圖13]係顯示本發明的其他實施形態的基板處理裝置的內部構成之示意性的俯視圖。 [FIG. 1] It is a schematic plan view which shows the internal structure of the substrate processing apparatus which is one embodiment of this invention. [ Fig. 2 ] is a schematic longitudinal sectional view viewed from line II-II in Fig. 1 . [ Fig. 3 ] is a schematic cross-sectional view viewed from line III-III in Fig. 1 . [ Fig. 4 ] is a schematic elevational view showing the internal configuration of the processing block viewed from the IV direction in Fig. 1 . [FIG. 5] It is a figure for demonstrating the structure example of a board|substrate mounting part. [FIG. 6] It is a figure for demonstrating the example of the structure of a dummy board|substrate accommodating part. [ Fig. 7 ] is a schematic cross-sectional view for explaining a configuration example of a processing unit. [FIG. 8] It is a block diagram for demonstrating the structure related to the control of a substrate processing apparatus. [ Fig. 9 ] is a flowchart for explaining the operation of the controller related to the simulation process. [ FIG. 10A ] is a flowchart for explaining an example of operations related to loading of unused dummy substrates into the dummy substrate storage unit and unloading of used dummy substrates from the dummy substrate storage unit. [ FIG. 10B ] is a flowchart for explaining an example of an operation related to carrying an unused dummy substrate into the dummy substrate storage unit and carrying out a used dummy substrate from the dummy substrate storage unit. [ Fig. 11 ] is a schematic longitudinal sectional view showing the internal structure of a substrate processing apparatus according to another embodiment of the present invention. [ Fig. 12] Fig. 12 is a schematic longitudinal sectional view showing an internal structure of a substrate processing apparatus according to still another embodiment of the present invention. [ Fig. 13 ] is a schematic plan view showing an internal configuration of a substrate processing apparatus according to another embodiment of the present invention.

1:基板處理裝置 1: Substrate processing device

2:索引機器人 2: Indexing Bots

2a:後隔壁 2a: Rear Bulkhead

3:處理區塊 3: Processing blocks

3a:前隔壁 3a: front next door

4L,4U:窗 4L, 4U: window

6L,6U:基板載置部 6L, 6U: Substrate mounting section

7L,7U:仿真基板收容部 7L, 7U: dummy board housing

8L,8U:主搬運機器人 8L, 8U: Main handling robot

11L,11U,12L,12U,13L,13U,21L,21U,22L,22U,23L,23U:處理單元 11L, 11U, 12L, 12U, 13L, 13U, 21L, 21U, 22L, 22U, 23L, 23U: processing unit

15:下隔壁 15: next door

16:中間隔壁 16: middle partition

17:上隔壁 17: next door

25:承載器保持部 25: Carrier holding part

26:索引機器人 26: Indexing Bots

27:多關節臂 27:Multi-joint arm

28:臂 28: arm

29,81:手部 29,81: hand

30:基台部 30: abutment

37:搬出口 37: export

51L,51U:搬運路徑 51L, 51U: Transport path

52L,52U:搬運空間 52L, 52U: transport space

61:未處理基板載置部 61: unprocessed substrate loading part

62:已處理基板載置部 62: Processed substrate loading unit

71:仿真基板保持架 71:Simulation substrate holder

82:手部驅動機構 82:Hand drive mechanism

83:支柱 83: Pillar

84:垂直移動部 84: Vertical movement department

85:水平移動部 85: Horizontal movement department

86:旋轉部 86:Rotation

87:進退部 87: Advance and retreat

92:第二液體供給部 92: Second liquid supply unit

101:第一排氣部(排氣部) 101: the first exhaust part (exhaust part)

102:第二排氣部(排氣部) 102: the second exhaust part (exhaust part)

BL:第一處理區塊層(處理區塊層) BL: The first processing block layer (processing block layer)

BU:第二處理區塊層(處理區塊層) BU: The second processing block layer (processing block layer)

C:承載器 C: carrier

DW:仿真基板 DW: Dummy Substrate

S1L,S1U:第一處理單元堆疊部 S1L, S1U: first processing unit stack

S2L,S2U:第二處理單元堆疊部 S2L, S2U: second processing unit stack

T1:第一塔 T1: The first tower

T2:第二塔 T2: the second tower

W:製品基板(基板) W: Product substrate (substrate)

X:第一水平方向 X: the first horizontal direction

Y:第二水平方向 Y: the second horizontal direction

Z:上下方向 Z: up and down direction

Claims (14)

一種基板處理裝置，係包含： 承載器保持部，係保持用以收容基板或者仿真基板之承載器； 第一處理單元群，係具有複數個第一處理單元，複數個前述第一處理單元係處理基板且執行使用仿真基板的處理； 第二處理單元群，係具有複數個第二處理單元，複數個前述第二處理單元係處理基板且執行使用仿真基板的處理； 第一仿真基板收容部，係收容仿真基板； 第二仿真基板收容部，係收容仿真基板； 基板載置部，係供基板載置； 第一搬運單元，係構成為能夠存取複數個前述第一處理單元、前述基板載置部以及前述第一仿真基板收容部，在複數個前述第一處理單元以及前述基板載置部之間搬運基板，並在複數個前述第一處理單元與前述第一仿真基板收容部之間搬運仿真基板； 第二搬運單元，係構成為能夠存取複數個前述第二處理單元、前述基板載置部以及前述第二仿真基板收容部，在複數個前述第二處理單元以及前述基板載置部之間搬運基板，並在複數個前述第二處理單元與前述第二仿真基板收容部之間搬運仿真基板； 第三搬運單元，係構成為能夠存取被前述承載器保持部保持的承載器以及前述基板載置部，在被前述承載器保持部保持的前述承載器與前述基板載置部之間搬運基板；以及 控制器，係控制前述第一搬運單元、前述第二搬運單元以及前述第三搬運單元，並執行仿真基板移送控制，前述仿真基板移送控制係用以在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 A substrate processing device, comprising: The carrier holding part is used to hold the carrier for accommodating the substrate or the dummy substrate; The first processing unit group has a plurality of first processing units, and the plurality of first processing units process substrates and perform processing using dummy substrates; The second processing unit group has a plurality of second processing units, and the plurality of the aforementioned second processing units process substrates and perform processing using dummy substrates; The first dummy substrate storage part is for accommodating the dummy substrate; The second dummy substrate storage part is for accommodating the dummy substrate; The substrate loading part is used for loading the substrate; The first transfer unit is configured to be able to access a plurality of the first processing units, the substrate loading unit, and the first dummy substrate storage unit, and to transfer between the plurality of the first processing units and the substrate loading unit. substrate, and transport the dummy substrate between the plurality of first processing units and the first dummy substrate storage section; The second transport unit is configured to be able to access a plurality of the second processing units, the substrate placement unit, and the second dummy substrate storage unit, and to transfer between the plurality of the second processing units and the substrate placement unit. substrate, and transport the dummy substrate between the plurality of second processing units and the second dummy substrate storage section; The third transfer unit is configured to be able to access the carrier held by the carrier holding unit and the substrate placing unit, and to transfer the substrate between the carrier held by the carrier holding unit and the substrate placing unit. ;as well as The controller controls the first conveying unit, the second conveying unit, and the third conveying unit, and executes dummy substrate transfer control. The dummy substrates are transferred between the dummy substrate storage parts. 如請求項1所記載之基板處理裝置，其中前述控制器係當預定的仿真基板移送條件成立時執行前述仿真基板移送控制。The substrate processing apparatus as described in claim 1, wherein the controller executes the dummy substrate transfer control when a predetermined dummy substrate transfer condition is established. 如請求項2所記載之基板處理裝置，其中前述控制器係包含： 記憶部，係記憶資料，前述資料係包含被收容至前述第一仿真基板收容部的仿真基板的使用歷程資訊以及被收容至前述第二仿真基板收容部的仿真基板的使用歷程資訊；以及 判斷部，係基於記憶於前述記憶部的前述資料來判斷前述仿真基板移送條件是否成立。 The substrate processing device as described in claim 2, wherein the aforementioned controller includes: The memory unit is memory data, the aforementioned data includes the use history information of the dummy substrate stored in the first dummy substrate storage part and the use history information of the dummy substrate stored in the second dummy substrate storage part; and The judging unit judges whether or not the dummy substrate transfer condition is established based on the data stored in the memory unit. 如請求項1所記載之基板處理裝置，其中前述控制器係在前述仿真基板移送控制中以下述方式控制前述第一搬運單元以及前述第二搬運單元：經由前述基板載置部在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。The substrate processing apparatus as described in claim 1, wherein the controller controls the first transport unit and the second transport unit in the simulation substrate transfer control in the following manner: The dummy substrate is transferred between the substrate storage part and the second dummy substrate storage part. 如請求項1所記載之基板處理裝置，其中前述基板載置部係包含： 第一基板載置部，係能夠供前述第一搬運單元以及前述第三搬運單元存取；以及 第二基板載置部，係能夠供前述第二搬運單元以及前述第三搬運單元存取； 前述控制器係在前述仿真基板移送控制中以下述方式控制前述第一搬運單元、前述第二搬運單元以及前述第三搬運單元：前述第一搬運單元係在前述第一仿真基板收容部與前述第一基板載置部之間搬運仿真基板，前述第二搬運單元係在前述第二仿真基板收容部與前述第二基板載置部之間搬運仿真基板，前述第三搬運單元係在前述第一基板載置部與前述第二基板載置部之間搬運仿真基板。 The substrate processing device as described in claim 1, wherein the aforementioned substrate loading part includes: The first substrate loading part can be accessed by the first transport unit and the third transport unit; and The second substrate loading part is capable of being accessed by the aforementioned second transport unit and the aforementioned third transport unit; The controller controls the first transfer unit, the second transfer unit, and the third transfer unit in the transfer control of the dummy substrate as follows: The dummy substrate is transported between a substrate loading part, the second transport unit transports the dummy substrate between the second dummy substrate storage part and the second substrate loading part, and the third transport unit is between the first substrate The dummy substrate is conveyed between the placing unit and the second substrate placing unit. 如請求項1所記載之基板處理裝置，其中前述第三搬運單元係能夠存取前述第一仿真基板收容部以及前述第二仿真基板收容部； 前述控制器係在前述仿真基板移送控制中以下述方式控制前述第三搬運單元：無須經由前述基板載置部地在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 The substrate processing device as described in claim 1, wherein the third transfer unit is capable of accessing the first dummy substrate storage section and the second dummy substrate storage section; In the dummy substrate transfer control, the controller controls the third transfer unit to transfer the dummy substrate between the first dummy substrate storage unit and the second dummy substrate storage unit without passing through the substrate loading unit. . 如請求項1所記載之基板處理裝置，其中包含： 第一處理區塊層；以及 第二處理區塊層，係位於前述第一處理區塊層的上方； 於前述第一處理區塊層配置有前述第一處理單元群； 於前述第二處理區塊層配置有前述第二處理單元群。 The substrate processing device as described in Claim 1, which includes: first process the block layer; and The second processing block layer is located above the first processing block layer; The aforementioned first processing unit group is configured on the aforementioned first processing block layer; The aforementioned second processing unit group is configured on the aforementioned second processing block layer. 如請求項1所記載之基板處理裝置，其中前包含： 第一處理區塊部；以及 第二處理區塊部，係位於前述第一處理區塊部的側方； 於前述第一處理區塊部配置有前述第一處理單元群； 於前述第二處理區塊部配置有前述第二處理單元群。 The substrate processing device as described in Claim 1, which includes: the first processing block; and The second processing block is located on the side of the first processing block; The aforementioned first processing unit group is arranged in the aforementioned first processing block; The second processing unit group is arranged in the second processing block. 如請求項1至8中任一項所記載之基板處理裝置，其中俯視觀看時，前述第一仿真基板收容部以及前述第二仿真基板收容部係與前述基板載置部重疊。The substrate processing apparatus according to any one of Claims 1 to 8, wherein the first dummy substrate storage section and the second dummy substrate storage section overlap the substrate mounting section when viewed from above. 如請求項9所記載之基板處理裝置，其中前述第一仿真基板收容部以及前述第二仿真基板收容部係夾著前述基板載置部上下地分開配置。The substrate processing apparatus according to claim 9, wherein the first dummy substrate storage unit and the second dummy substrate storage unit are vertically and separately arranged with the substrate placement unit in between. 一種基板處理方法，係包含： 藉由第一搬運單元在屬於第一處理單元群的複數個第一處理單元與基板載置部之間搬運基板之工序； 在前述第一處理單元中處理被前述第一搬運單元搬運的基板之工序； 藉由前述第一搬運單元在複數個前述第一處理單元與第一仿真基板收容部之間搬運仿真基板之工序； 在前述第一處理單元中執行使用了被前述第一搬運單元搬運的仿真基板的仿真處理之工序； 藉由第二搬運單元在屬於第二處理單元群的複數個第二處理單元與前述基板載置部之間搬運基板之工序； 在前述第二處理單元中處理被前述第二搬運單元搬運的基板之工序； 藉由前述第二搬運單元在複數個前述第二處理單元與第二仿真基板收容部之間搬運仿真基板之工序； 在前述第二處理單元中執行使用了被前述第二搬運單元搬運的仿真基板的仿真處理之工序； 藉由第三搬運單元在被承載器保持部保持的承載器與前述基板載置部之間搬運基板之工序；以及 仿真基板移送工序，係在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 A substrate processing method, comprising: a process of transporting the substrate between the plurality of first processing units belonging to the first processing unit group and the substrate mounting portion by the first transport unit; The process of processing the substrate transported by the first transport unit in the first process unit; A process of transporting dummy substrates between the plurality of first processing units and the first dummy substrate storage portion by the first transfer unit; A step of performing a simulation process using a dummy substrate transported by the first transport unit in the first processing unit; a process of transporting the substrate between the plurality of second processing units belonging to the second processing unit group and the aforementioned substrate loading unit by the second transport unit; The process of processing the substrate transported by the second transport unit in the second process unit; A process of transporting dummy substrates between the plurality of second processing units and the second dummy substrate storage unit by the second transfer unit; A process of performing a simulation process using a dummy substrate transported by the second transport unit in the second processing unit; A step of transferring the substrate between the carrier held by the carrier holding portion and the substrate mounting portion by the third transfer unit; and In the dummy substrate transfer process, the dummy substrate is transferred between the first dummy substrate storage unit and the second dummy substrate storage unit. 如請求項11所記載之基板處理方法，其中在前述仿真基板移送工序中經由前述基板載置部在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。The substrate processing method according to claim 11, wherein in the dummy substrate transfer step, the dummy substrate is transferred between the first dummy substrate storage part and the second dummy substrate storage part via the substrate mounting part. 如請求項11所記載之基板處理方法，其中前述基板載置部係包含： 第一基板載置部，係能夠供前述第一搬運單元以及前述第三搬運單元存取；以及 第二基板載置部，係能夠供前述第二搬運單元以及前述第三搬運單元存取； 前述仿真基板移送工序係包含： 前述第一搬運單元在前述第一仿真基板收容部與前述第一基板載置部之間搬運仿真基板之工序； 前述第二搬運單元在前述第二仿真基板收容部與前述第二基板載置部之間搬運仿真基板之工序；以及 前述第三搬運單元在前述第一基板載置部與前述第二基板載置部之間搬運仿真基板之工序。 The substrate processing method as described in Claim 11, wherein the aforementioned substrate loading part includes: The first substrate loading part can be accessed by the first transport unit and the third transport unit; and The second substrate loading part is capable of being accessed by the aforementioned second transport unit and the aforementioned third transport unit; The aforementioned simulated substrate transfer process includes: a process of the first transfer unit transferring the dummy substrate between the first dummy substrate storage part and the first substrate placement part; a process of the second transport unit transporting the dummy substrate between the second dummy substrate storage part and the second substrate placement part; and The third conveying unit is a process of conveying the dummy substrate between the first substrate mounting part and the second substrate mounting part. 如請求項11所記載之基板處理方法，其中前述第三搬運單元係能夠存取前述第一仿真基板收容部以及前述第二仿真基板收容部； 在前述仿真基板移送工序中，前述第三搬運單元係無須經由前述基板載置部地在前述第一仿真基板收容部與前述第二仿真基板收容部之間移送仿真基板。 The substrate processing method as described in claim 11, wherein the third transfer unit is capable of accessing the first dummy substrate storage section and the second dummy substrate storage section; In the dummy substrate transfer step, the third transfer unit transfers the dummy substrate between the first dummy substrate storage unit and the second dummy substrate storage unit without passing through the substrate loading unit.
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