TW202237870A - Method for manufacturing shower head and shower head and plasma processing apparatus - Google Patents

Abstract

The invention provides a showerhead manufacturing method, a showerhead, and a plasma processing apparatus capable of suppressing the occurrence of cracks around a sleeve when used at a high temperature. A method for manufacturing a showerhead for discharging a processing gas for generating plasma into a plasma generation space in a chamber in which a substrate is disposed and plasma is generated in a plasma processing apparatus for performing a processing by plasma on the substrate, the method comprising: a step for preparing a metal base material; a metal base material which constitutes a portion of the main body part having the gas ejection hole and has a sleeve mounting hole; a step of attaching a sleeve having a gas ejection hole inside to the sleeve attachment hole of the base material; a step in which the base material and the sleeve are subjected to HIP treatment, and the sleeve is bonded to the base material by HIP; and a step for forming a ceramic spray film on the chamber-side surface of the base material and the chamber-side surface of the sleeve.

Description

Manufacturing method of shower head, shower head, and plasma treatment device

The disclosure relates to a method for manufacturing a shower head, a shower head, and a plasma treatment device.

In the manufacturing process of flat panel display (FPD), plasma etching or other plasma treatment is applied to the predetermined film formed on the glass substrate of the object to be processed, and microfabrication is applied to form electrodes or wiring.

The plasma processing device for performing such plasma processing is to spray the processing gas into the chamber from the shower head arranged above the mounting table in the state where the substrate is arranged on the mounting table arranged in the chamber, so that Generate plasma.

The showerhead is formed of metal such as aluminum, and since it is exposed to process gas or plasma, various techniques for suppressing corrosion on the showerhead have been proposed.

For example, Patent Document 1 proposes a technology in which a recess is formed on the outlet side of the gas ejection port provided on the base material of the shower head, a cylindrical sleeve is fixed in the recess, and a plasma covering the base material is generated. The plasma-resistant film is formed on the surface of the space side.

(Patent Document) Japanese Patent Laid-Open No. 2017-22356

The present disclosure provides a method for manufacturing a shower head capable of suppressing cracks around a sleeve when used at high temperatures, a shower head, and a plasma treatment device.

A method of manufacturing a shower head related to an embodiment of the present disclosure is to manufacture a In a plasma processing device for processing caused by plasma, the processing gas used to generate the plasma is ejected to the shower head of the plasma generation space in the chamber where the substrate is disposed and the plasma is generated A method for manufacturing a shower head; the shower head includes: a body portion having a plurality of gas ejection holes capable of ejecting the processing gas; Diffusion space; the manufacturing method includes: preparing a metal base material that will constitute the gas ejection hole of the main body and having a plurality of sleeve mounting holes; placing the sleeve with the gas ejection hole inside The process of installing each of the sleeve mounting holes in the base material; the process of performing HIP treatment on the base material and the sleeve to HIP bond the sleeve to the base material; and, between the base material and the sleeve A step of forming a ceramic flame spray coating on one surface of the sleeve on the side of the plasma generating space.

According to the disclosure, it is possible to provide a method for manufacturing a shower head capable of suppressing cracks around the sleeve when used at high temperature, a shower head, and a plasma treatment device.

1: Body container

2: sprinkler head

3: Antenna room

4: chamber

5: support frame

7: Insulation member

13: High frequency antenna

18: The first high-frequency power supply

20: Process gas supply mechanism

50: body part

51: Gas diffusion space

52: Substrate Department

53: Gas ejection part

54: Gas ejection hole

61: Substrate

62,62': Sleeve

63: The first flame sprayed film

64: The second flame spraying film

100: Control Department

G: Substrate

Fig. 1 is a cross-sectional view showing a plasma processing apparatus according to a first embodiment.

FIG. 2 is a diagram showing a part of the gas ejection port of the main body of the shower head constituting the plasma processing apparatus of FIG. 1 .

Fig. 3 is a sectional view illustrating the process of the shower head manufacturing method.

Fig. 4 is a diagram showing cracks generated when a gap is created between the sleeve and the substrate.

Fig. 5 is a diagram showing a case where there is a level difference at the boundary between the gas diffusion space side and the chamber side of the substrate and the sleeve.

Fig. 6 is a diagram showing a part of the gas ejection part of the main body part of the shower head constituting the plasma processing apparatus according to the second embodiment.

Fig. 7 is a diagram showing the results of a heat resistance test of a conventionally bonded sleeve and a HIP bonded sleeve for the gas ejection portion of the showerhead having the structure shown in Fig. 2 .

FIG. 8 is a graph showing the results of heat resistance tests on the conventionally bonded sleeve and the HIP bonded sleeve for the gas ejection portion of the showerhead having the structure shown in FIG. 6 .

Hereinafter, the embodiments will be described with reference to the attached drawings.

<First Embodiment>

First, the first embodiment will be described.

Fig. 1 is a cross-sectional view showing a plasma processing apparatus according to a first embodiment.

The plasma processing apparatus shown in FIG. 1 is configured as an inductively coupled plasma processing apparatus, and is suitable for etching a metal film when forming a thin film transistor on a rectangular substrate, such as a glass substrate for FPD.

This kind of inductively coupled plasma processing device has a square tube-shaped airtight body container 1 made of conductive material, such as aluminum whose inner wall surface is anodized and oxidized. The body container 1 is detachably assembled and grounded via a ground wire 1a.

The main body container 1 is separated up and down by the rectangular shower head 2 formed by insulating the main body container 1. The upper side will become the antenna container 3 that defines the antenna room, and the lower side will define the plasma generation space S Chamber 4 of the processing chamber. The shower head 2 has the function of a metal window and will constitute the top wall of the chamber 4 . The shower head 2 used as the metal window is mainly composed of non-magnetic conductive metal, such as aluminum (Al) material (Al or Al alloy).

Between the side wall 3a of the antenna container 3 and the side wall 4a of the chamber 4 is a support frame 5 protruding from the inner side of the main body container 1 and supporting the shower head 2 . The support frame 5 is made of conductive material, preferably metal such as aluminum. Shower head 2 is configured to be divided into plural parts through insulating member 7 . Then, The divided parts of the sprinkler head 2 are suspended on the top of the main body container 1 by a plurality of suspenders (not shown).

Each divided part of the shower head 2 has a main body 50 and a gas diffusion space (Buffer) 51 disposed inside the main body 50 . The main body portion 50 has a base portion 52 and a gas ejection portion 53 having a plurality of gas ejection holes 54 for ejecting process gas from the gas diffusion space 51 toward the plasma generation space S in the chamber 4 . The gas diffusion space 51 is introduced with a processing gas from the processing gas supply mechanism 20 through the gas supply pipe 51 . The gas diffusion space 51 is connected to a plurality of gas ejection holes 54 , and the processing gas is ejected from the gas diffusion space 51 through the plurality of gas ejection holes 54 . In addition, the base material portion 52 and the gas ejection portion 53 may be formed integrally or separately. In the case of another configuration, the gas ejection part 53 is configured as a shower plate.

The antenna container 3 on the shower head 2 is provided with a high-frequency antenna 13 so as to face the side opposite to the plasma generation space S side of the shower head 2 . The high-frequency antenna 13 is made of a conductive material, such as copper, and is separated from the shower head 2 by a spacer (not shown) made of an insulating member, and will be arranged in a position corresponding to the rectangular shower head 2. The in-plane is formed into, for example, a spiral shape. Also, it may be formed in a loop shape, and the antenna constituting the high-frequency antenna 13 may be one or plural.

The high-frequency antenna 13 is connected to a first high-frequency power supply 18 through a power supply line 16 and a matching unit 17 . Then, during the plasma processing, high-frequency power of, for example, 13.56 MHz is supplied to the high-frequency antenna 13 through the power supply line 16 extending from the first high-frequency power source 18 . Thereby, an induced electric field will be formed in the chamber 4 through the loop current excited by the shower head 2 which functions as the metal window as described later. Then, by this induced electric field, the process gas supplied from the shower head 2 is plasmaized in the plasma generating space S directly below the shower head 2 in the chamber 4, and inductively coupled plasma is generated. . That is, the high-frequency antenna 13 and the first high-frequency power supply 18 function as plasma generating means.

The bottom of the chamber 4 faces the high-frequency antenna 13 with the shower head 2 interposed therebetween, and a rectangular FPD glass substrate (hereinafter referred to simply as the substrate to be processed) is fixed through the insulator member 24 for placing the substrate to be processed. is the mounting table 23 for the substrate G. The mounting platform 23 is made of conductive material, such as aluminum whose surface is anodized. The substrate G placed on the mounting table 23 is sucked and held by an electrostatic chuck (not shown).

An insulating shielding ring 25 a is provided on the upper peripheral portion of the mounting table 23 , and an insulating ring 25 b is provided on the peripheral surface of the mounting table 23 . The mounting table 23 is inserted through the bottom wall of the main body container 1 and the insulator member 24 , and lift pins 26 for carrying in and out the substrate G are inserted. The lift pin 26 is driven up and down by a lift mechanism (not shown) provided outside the main body container 1 to carry out the substrate G in and out.

A matching device 28 and a second high-frequency power source 29 are provided outside the main body container 1, and the mounting table 23 is connected to the second high-frequency power source 29 through the matching device 28 through a power supply line 28a. This second high-frequency power supply 29 applies high-frequency power for bias voltage, for example, high-frequency power with a frequency of 3.2 MHz, to the mounting table 23 during plasma processing. Ions in the plasma generated in the chamber 4 can be attracted to the substrate G efficiently by the self-bias voltage generated by high-frequency power for this bias voltage.

Moreover, in order to control the temperature of the substrate G in the mounting table 23, a temperature control mechanism and a temperature sensor (both not shown) constituted by a heating mechanism such as a heater or a refrigerant flow path, etc. are provided. The piping or wires for these mechanisms or components are led out of the main body container 1 through the opening 1 b provided on the bottom surface of the main body container 1 and the insulator member 24 .

The side wall 4a of the chamber 4 is provided with a carry-out entrance 27a for carrying the substrate G in and out, and a gate valve 27 for opening and closing it. Also, the bottom of the chamber 4 is connected to an exhaust device 30 including a vacuum pump and the like through an exhaust pipe 31 . With the exhaust device 30, the inside of the chamber 4 is exhausted, so that the inside of the chamber 4 is set and maintained at a predetermined vacuum atmosphere (for example, 1.33Pa) during the plasma treatment.

A fine space (not shown) is formed on the inner side of the substrate G placed on the mounting table 23, and a He gas channel 41 for supplying He gas as a heat transfer gas at a constant pressure is provided. By supplying the heat-transfer gas to the inner surface side of the substrate G in this way, it is possible to suppress a temperature rise or a temperature change of the substrate G due to plasma processing under vacuum.

Such an inductively coupled plasma processing apparatus further includes a control unit 100 . The control unit 100 is constituted by a computer, and has a main control unit constituted by a CPU for controlling each constituent unit of the plasma processing apparatus, an input device, an output device, a display device, and a memory device. The memory device memorizes the parameters of various treatments performed by the plasma treatment device, and is provided with a memory medium storing programs for controlling the treatments performed by the plasma treatment device, that is, treatment recipes. The main control unit controls to recall the predetermined processing recipe stored in the storage medium, and causes the plasma processing apparatus to execute predetermined processing based on the processing recipe.

Next, the shower head 2 will be described in more detail.

Inductively coupled plasma is to induce a magnetic field around the high-frequency antenna by making high-frequency current flow through it, and use the induced electric field excited by the magnetic field to generate a high-frequency discharge, thereby generating plasma. In the case of using a metal window as the top wall of the chamber 4, the high-frequency antenna 13 installed in the circumferential direction in the plane cannot reach the inner side of the metal window, that is, the side of the plasma generation space S, due to eddy currents and magnetic fields. , so no plasma is generated. Therefore, in this embodiment, the shower head 2 functioning as a metal window is divided into multiple structures by the insulating member 7, so that the magnetic field and eddy current generated by the high-frequency current flowing through the high-frequency antenna 13 can reach the plasma. Create a space S.

The shower head 2 is introduced with the processing gas from the processing gas supply mechanism 20 through the gas supply pipe 21 as described above. Then, the introduced processing gas is ejected to the plasma generation space in the chamber 4 through the gas diffusion space 51 and the plurality of gas ejection holes 54 . The shower head 2 may become high temperature due to its own temperature adjustment and the heat input from the plasma. Shower head 2 of the present embodiment is at high temperature It will be heat resistant. Specifically, it has sufficient heat resistance even at a high temperature of 200°C.

FIG. 2 is a diagram showing a part of the gas ejection port of the main body of the shower head constituting the plasma processing apparatus of FIG. 1 .

The main body part 50 including the gas ejection part 53 has a base material 61 , a plurality of sleeves 26 , a first flame sprayed film 63 and a second flame sprayed film 64 .

The base material 61 is made of non-magnetic metal, and is preferably formed of Al material (Al or Al alloy). Examples of Al materials include JIS 6000 series. When the base material 61 is an Al material, an anodic oxide film 61a is provided on the side surface as needed.

The plurality of sleeves 62 are made of corrosion-resistant metals such as stainless steel and Hastelloy (Hastelloy)-like nickel-based alloys, and are formed into a cylindrical shape with a step difference, and can be embedded in the corresponding parts formed by the base material 61. recess (socket installation hole). Inside each sleeve 62 is formed a gas ejection hole 54 penetrating from the gas diffusion space 51 to the plasma generation space S.

The gas ejection hole 54 has a large-diameter portion 54a on the side of the gas diffusion space 51 and a small-diameter portion 54b on the side of the plasma generation space S. Then, the lower end of the small-diameter portion 54b becomes the opening 54c facing the plasma generation space S. As shown in FIG. The purpose of making the plasma generating space S the small-diameter portion 54b is to prevent the plasma from entering deep into the gas ejection hole 54 . The inner diameter of the small-diameter portion 54b is set at, for example, 0.5 to 1 mm.

The sleeve 62 is bonded (HIP bonded) to the base material 61 by hot isostatic pressing (HIP), and is in close contact with the base material 61 in a state where compressive stress is applied to the base material 61 without gaps.

In addition, the base material 61 and the side of the sleeve 62 on the side of the gas diffusion space 51 and the side of the plasma generation space S are preferably uniform as shown in the figure.

The first flame sprayed film 63 is formed on the gas diffusion space 51 side surface of the substrate 61 by flame spraying a material having corrosion resistance to the process gas. The first flame spray coating 63 is preferably impregnated with Impregnated material.

The first flame sprayed film 63 protects the base material 61 when a gas highly corrosive to the base material 61 is used as the processing gas. The first flame sprayed film 63 is made of ceramics. The ceramic constituting the first flame sprayed film 63 is preferably alumina (Al ₂ O ₃ ) or zirconia (ZrO ₂ ). The Al ₂ O ₃ flame spray coating is effective when the shower head 2 is raised to about 200° C. when the Al is etched using Cl ₂ gas. The thickness of the first flame sprayed film 63 is preferably in the range of 80 to 200 μm. In addition, when there is little risk of the processing gas corroding the base material 61, the first flame sprayed film 63 may not be provided.

The second flame spray coating 64 is formed by flame spraying a material having plasma resistance to the plasma of the process gas and formed on the plasma generation space S side surface of the substrate 61 . The second flame spray coating 64 is preferably impregnated with an impregnating material.

The second flame spray coating 64 is used to protect the base material 61 from plasma. The second flame spray coating 64 is also made of ceramics. The second flame sprayed film 64 is preferably a yttrium oxide (Y ₂ O ₃ ) flame sprayed film with high plasma resistance or a Y-Al-Si-O mixed flame sprayed film (yttrium, aluminum and silicon oxide (or silicon nitride) ) containing yttrium oxide. According to the processing gas used, it can also be Al ₂ O ₃ flame spray coating. In addition, by impregnating the second flame sprayed coating 64 with the impregnating material, the pores existing in the flame sprayed coating can be closed, the plasma resistance can be further improved, and the pinhole corrosion resistance can be improved.

The second flame sprayed coating 64 is preferably a quasi-dense flame sprayed coating having high plasma resistance on the surface. The so-called quasi-dense flame sprayed film refers to the flame sprayed film with a lower porosity than the usual flame sprayed film. Compared with the usual film’s porosity of 3%~5%, it is 2~3%. By spraying with quasi-dense flame, the plasma resistance can be further improved. In addition, by combining the quasi-densification of the flame sprayed film and the impregnation material, the plasma resistance can be further improved. The thickness of the second flame sprayed film 64 is preferably in the range of 150 to 500 μm.

When the temperature of the shower head 2 rises to a high temperature of 200° C. or higher, the impregnating material impregnated into the first flame sprayed film 63 and the second flame sprayed film 64 is preferably one with high heat resistance. Also, the impregnating material is preferably a resin impregnating material with good filling properties that can penetrate to a quasi-dense film. From such a point of view, a high-fillability heat-resistant epoxy resin excellent in heat resistance and corrosion resistance is preferable.

Next, the processing operation when plasma processing, such as plasma etching processing, is performed on the substrate G using the inductively coupled plasma processing apparatus configured in this way will be described.

First, with the gate valve 27 open, the substrate G on which a predetermined film is formed is carried into the chamber 4 from the carry-out port 27 a by a transfer mechanism (not shown), and placed on the mounting surface of the mounting table 23 . Next, the substrate G is fixed on the mounting table 23 by an electrostatic chuck (not shown). Then, the chamber 4 is vacuum-exhausted by the exhaust device 30, and the pressure atmosphere in the chamber 4 is maintained at, for example, about 0.66-26.6Pa by a pressure control valve (not shown). In this state, the processing gas is supplied from the processing gas supply mechanism 20 to the shower head 2 with the metal window function through the gas supply pipe 21, and then the processing gas is sprayed into the chamber 4 from the shower head 2 . The space on the inner surface side of the substrate G is supplied with He gas through the He gas channel 41 as heat transfer gas.

At this time, the temperature of the main body container 1 and the base material part 52 is adjusted to a high temperature, and after the plasma is generated, the temperature of the shower head 2 becomes a high temperature of 200°C.

Next, a high frequency such as 13.56 MHz is applied to the high frequency antenna 13 from the high frequency power supply 18, thereby generating a uniform induced electric field in the chamber 4 through the shower head 2 functioning as a metal window. With the induced electric field generated in this way, the processing gas will be plasmaized in the plasma generation space S in the chamber 4 to generate high-density inductively coupled plasma. Using this plasma, the substrate G is subjected to plasma etching treatment.

Next, a method of manufacturing the above-mentioned shower head 2 will be described.

Fig. 3 is a sectional view illustrating the process of the shower head manufacturing method. When manufacturing the sprinkler head 2, first as As shown in FIG. 3( a ), the substrate 61 having the sleeve installation hole 61b formed thereon is prepared (step 1). Then, the sleeve 62 is installed in the sleeve installation hole 61b of the substrate 61 (step 2; FIG. 3(b)). Next, the substrate 61 and the installed sleeve 62 are subjected to HIP treatment, so that the sleeve 62 is HIP bonded to the substrate 61 (step 3; FIG. 3(c)). Afterwards, the surfaces of the substrate 61 and the sleeve 62 on the gas diffusion space 51 side and the plasma generation space S side are both ground or ground to become uniform (step 4; FIG. 3( d )). Afterwards, the first flame sprayed film 63 and the second flame sprayed film 64 are formed on the side of the gas diffusion space and the side of the plasma generation space S of the substrate 61 and the sleeve 62 respectively (step 5; FIG. 3( e ) ). When forming the anodized film 61a by anodizing, it is preferable to perform it after HIP joining the sleeve 62 .

HIP treatment is a treatment that simultaneously applies isotropic pressure and high temperature using an inert gas such as Ar gas as a pressure medium to the treatment object. In this embodiment, when the base material 61 is an Al material, the HIP treatment is preferably performed at a pressure of 50-200 MPa and a temperature of 300-550°C. When the base material 61 is made of aluminum such as 6000 series, it will start to soften at about 300°C, and the solid solution temperature is 430~530°C, so HIP treatment can be properly performed at 300~550°C. More preferably, it is 400~450°C. Also, regarding the pressure, a good HIP effect can be obtained at 100 to 150 MPa.

Thereby, the sleeve 62 will be in a HIP bonded state relative to the base material 61 . That is, by performing the HIP treatment, a compressive stress is applied between the sleeve 62 and the base material 61 , so that the sleeve 62 is in close contact with the base material 61 without a gap.

HIP treatment is carried out at high temperature (for example, above 300°C), so even if the operating temperature of the shower head 2 becomes above 200°C, the compressive stress between the sleeve 62 and the base material 61 will still remain, and the two will remain intact. The state of close contact with gaps. Therefore, high heat resistance can be maintained. In this embodiment, since the sleeve 62 is made of metal, thermal shock resistance is high, and high heat resistance up to about 300° C. can be obtained as long as the HIP effect remains.

In the case of bonding the sleeve to the substrate by fitting like the technique of Patent Document 1, when the temperature of the shower head 2 becomes 200° C., a gap is likely to be generated between the sleeve and the substrate. As shown in Figure 4, when a gap 66 is formed between the sleeve 62 and the base material 61, the portion corresponding to the boundary between the sleeve 62 and the base material 61 of the first and second flame sprayed coatings 63, 64 will change. It is easy to produce cracks67. In addition, corrosion occurs on the base material 61 side of the boundary portion between the sleeve 62 and the base material 61 .

On the other hand, in this embodiment, the sleeve 62 is HIP bonded to the base material 61. Even when used at a high temperature of 200° C., the sleeve 62 and the base material 61 are seamlessly bonded, so that the first flame spraying is suppressed. Cracks occur in the film 63 and the second flame sprayed film 64 , and corrosion hardly occurs.

Also, as shown in FIG. 5 , when there is a level difference between the substrate 61 and the side of the sleeve 62 on the side of the gas diffusion space 51 and the side of the plasma generation space S, corresponding to the first flame sprayed coating 63 and The film quality of the step portion of the second flame sprayed film 64 is different from that of other portions, and cracks may easily occur. Therefore, the surfaces of the base material 61 and the sleeve 62 on the side of the gas diffusion space 51 and the side of the plasma generation space S are preferably ground so as to be uniform. Thereby, there is no level difference between the base material 61 and the sleeve 62 of the first flame sprayed film 63 and the second flame sprayed film 64, and the effect of suppressing the generation of cracks can be enhanced.

However, when cracking of the flame spray coating can be sufficiently suppressed only by HIP joining the sleeve 62 or when the level difference is small, such grinding processing is not necessarily required.

The first flame sprayed film 63 and the second flame sprayed film 64 are sprayed on the base material 61 and the side of the sleeve 62 on the side of the gas diffusion space 51 and the plasma by melting the particles of the above-mentioned materials or in a state close to it. Create one side of the space S side to be formed. As described above, the first flame spray coating 63 is not necessarily required.

When forming the first flame sprayed film 63 and the second flame sprayed film 64, at the use temperature In the case of 200°C, by heating the substrate to a temperature close to 150-250°C for flame spraying, cracks on the first flame sprayed film 63 and the second flame sprayed film 64 can be made more difficult to occur.

Since the sleeve 62 and the base material 61 must be closely bonded by HIP treatment, in the case of forming the anodized film 61a, the HIP treatment will be performed in the absence of the anodized film 61a, and the anodized film 61a The formation of is carried out after the HIP treatment. In addition, since the first and second flame sprayed coatings 63 and 64 must be formed directly on the base material 61, it is preferable to shield these surfaces during anodic oxidation. In addition, when the 1st flame spraying film 63 is not formed, one surface of the base material 61 by the side of the gas diffusion space 51 will be the state which formed the anodic oxide film 61a.

<Second Embodiment>

Next, a second embodiment will be described.

In this embodiment, the basic structure of the plasma processing apparatus is the same as that of the first embodiment, but only the structure of the gas ejection portion of the shower head is different from the first embodiment.

Fig. 6 is a diagram showing a part of the gas ejection part of the main body part of the shower head constituting the plasma processing apparatus according to the second embodiment.

The gas ejection part 53' has a base material 61, a plurality of sleeves 62', a first flame sprayed film 63 and a second flame sprayed film 64. The structure of the base material 61, the 1st flame sprayed film 63, and the 2nd flame sprayed film 64 is the same as that of 1st Embodiment. Similarly to the first embodiment, when there is little risk of corrosion of the base material 61 by the processing gas, the first flame sprayed film 63 may not be provided.

The sleeve 62 ′ is formed of Al ₂ O ₃ -like ceramics, and becomes cylindrical to be inserted into the corresponding concave portion (sleeve installation hole) formed in the base material 61 . A gas ejection hole 54' penetrating from the gas diffusion space 51 to the plasma generation space S is formed inside each sleeve 62'. Since ceramics are difficult to process, the sleeve 62' is different from the sleeve 62 of the first embodiment in that its basic shape is linear, and the gas ejection hole 54' is also linear. The inner diameter of the gas ejection hole 54' is set at, for example, 0.5 to 1 mm. A track-like groove 62'a is formed in the center of the outer periphery of the sleeve 62'.

The sleeve 62' is bonded to the base material 61 by HIP processing (HIP bonding), and is in close contact with the base material 61 without a gap in a state where compressive stress is applied to the base material 61. Since the joining temperature of the HIP of the Al base material hardly causes interdiffusion of materials, the linear sleeve may be pulled out. On the other hand, although the sleeve 62' is linear, since the groove 62'a is formed on the outer peripheral portion, the substrate 61 flows into the groove 62'a during HIP bonding, and the substrate 61 is tightly adhered to the sleeve 62. ', can prevent the pull-out of the sleeve 62'.

In this embodiment, it is also preferable to make the substrate 61 and the side of the sleeve 62' on the side of the gas diffusion space 51 and the side of the plasma generation space S all be uniform.

In the method of manufacturing the shower head, steps 1 to 5 that are the same as those in the first embodiment can be performed. In this embodiment, as in the first embodiment, by performing the HIP treatment, a compressive stress can be applied between the sleeve 62' and the base material 61, so that the sleeve 62' can be stretched with respect to the base material 61. Closely bond without gaps. Then, even if the shower head 2 becomes a high temperature of 200°C, there will still be compressive stress between the sleeve 62' and the base material 61, and the two can maintain a close contact state without gaps, and maintain a heat-resistant temperature of about 200°C. sex. However, the thermal expansion coefficient of the ceramics constituting the sleeve 62' is smaller than that of the Al-like metal constituting the base material 61, so due to the difference in thermal expansion with the base material 61, the heat resistance is lower than that of the metal of the first embodiment. The sleeve 62 tends to be low.

In this embodiment, the grinding process of step 4 is also not essential, and it is not necessary to perform such grinding process when cracking of the flame spray coating can be sufficiently suppressed only by HIP-joining the sleeve 62' or when the step difference is small.

Moreover, in this embodiment, when forming the anodic oxide film 61a, it is also in HIP For subsequent treatment, the faces of the flame sprayed films 63, 64 are preferably masked. In addition, when the 1st flame spraying film 63 is not formed, one surface of the base material 61 by the side of the gas diffusion space 51 is the state which formed the anodic oxide film 61a.

<Experiment example>

Here, for the gas ejection part of the shower head with the structure shown in FIG. 2 and the structure shown in FIG. 6, the heat resistance test was carried out by conventionally connecting the sleeve and HIP joint. Al (A6061) is used as the base material, stainless steel (SUS316L) is used as the metal sleeve in the structure shown in Figure 2, and Al ₂ O ₃ is used as the ceramic sleeve in the structure shown in Figure 6. Also, in either structure, an Al ₂ O ₃ flame sprayed coating is used as the first flame sprayed coating on the side of the gas diffusion space, and a mixed flame sprayed coating (SP flame sprayed coating) containing Y ₂ O ₃ is used as the electrode. The second flame spray coating on the S side of the slurry generation space.

The temperature resistance test was carried out on the sprinklers with varying temperatures. The heat resistance test uses a high-temperature drying oven to perform heat cycle tests at various temperatures on the sprinkler head. The results for the shower head using the stainless steel sleeve are shown in FIG. 7 and the results for the shower head using the ceramic sleeve are shown in FIG. 8 .

As shown in Fig. 7, in the structure of Fig. 2 using a stainless steel sleeve, compared with the case where a crack enters the flame sprayed film at 200°C after the sleeve is bonded, the case of the HIP jointed sleeve is less No cracking of the flame sprayed film was observed even at 300°C.

Also, as shown in FIG. 8, in the structure of FIG. 6 using a ceramic sleeve, compared to the case where cracks enter the flame spray coating at 180°C after bonding the sleeve, the HIP bonding sleeve In the case, no cracking of the flame sprayed coating was observed up to 200°C.

From the above, it was confirmed that in any sleeve, joining the sleeve by HIP improves the heat resistance more than the case of joining the sleeve.

<other applicable>

As mentioned above, although embodiment was demonstrated, all the points of the embodiment disclosed this time should be considered as an illustration and not a limiter. The above-mentioned embodiments can also be omitted, replaced, and changed in various forms without departing from the scope of the appended patent application and its gist.

For example, in the above-mentioned embodiment, although the example of using the inductively coupled plasma processing device as the plasma processing device for plasma etching is shown, it is not limited to this, as long as the base material of the gas ejection part is a metal shower head, Other plasma processing devices such as capacitively coupled plasma processing devices may also be used. In the case of a capacitively coupled plasma processing device or the like, there is no need to divide the shower head.

In addition, in the above-mentioned embodiment, although the plasma etching device is used as an example to illustrate, it is not limited to this, and any plasma processing device using a plasma with a highly corrosive gas such as plasma ashing or plasma CVD can be used. Be applicable.

61: Substrate

61b: Sleeve installation hole

62: Sleeve

63: The first flame sprayed film

64: The second flame spraying film

Claims (20)

A method of manufacturing a shower head, which is manufactured in a plasma processing device for applying plasma to a substrate, spraying the processing gas used to generate the plasma to the substrate on which the plasma is disposed, and generating the plasma The method of manufacturing the shower head of the plasma generating space in the chamber; The shower head is provided with: a main body part having a plurality of gas ejection holes capable of ejecting the processing gas; and a gas diffusion space provided in the main body part through which the processing gas is introduced and communicated with the gas ejection holes; The manufacturing method includes: a step of preparing a metal base material that will constitute the gas ejection hole of the main body and has a plurality of sleeve mounting holes; a step of installing a sleeve having the gas ejection hole inside it in each of the sleeve installation holes of the substrate; HIPing the substrate and the sleeve to HIP bond the sleeve to the substrate; and A step of forming a ceramic flame spray coating on the base material and the sleeve on the side of the plasma generation space. The manufacturing method of the shower head as claimed in item 1 of the scope of the patent application further includes: before the formation of the flame sprayed film, the substrate and the side of the sleeve at the side of the plasma generation space are uniformly aligned. The process of grinding or grinding. Such as the method of manufacturing the shower head of claim 1 or 2, wherein the substrate is made of aluminum, and the HIP treatment is carried out at a temperature above 300°C and below 550°C. Such as the manufacturing method of the shower head in item 3 of the scope of the patent application, wherein the HIP treatment is carried out at a temperature above 400°C and below 450°C. The manufacturing method of the shower head according to any one of items 1 to 4 of the scope of the patent application, wherein the sleeve is made of corrosion-resistant metal material. For example, the method of manufacturing the showerhead in claim 5 of the patent scope, wherein the process of forming the flame sprayed film on the side of the plasma generation space is to heat the base material to a temperature state of above 150°C and below 250°C Come down and proceed. The manufacturing method of the shower head according to any one of items 1 to 4 of the scope of the patent application, wherein the sleeve is made of ceramics. The method of manufacturing a shower head according to any one of claims 1 to 7 of the patent claims, wherein the flame sprayed film formed on the side of the plasma generating space contains yttrium oxide. The method of manufacturing a shower head according to any one of claims 1 to 8 of the patent claims, further comprising: a step of forming a ceramic flame sprayed film on the substrate and the side of the sleeve on the side of the gas diffusion space. The method for manufacturing a shower head as claimed in claim 9 of the scope of the patent application further includes: before the process of forming a flame sprayed film on the base material and the side of the sleeve on the side of the gas diffusion space, use the base material and the sleeve The process of lapping or lapping is carried out in such a way that the surface of the cylinder on the side of the plasma diffusion space is uniform. The method of manufacturing a shower head according to any one of claims 1 to 10 of the scope of the patent application, wherein the main body part is combined with a plate-shaped gas ejection part in a manner covering the recessed part on the substrate part having a recessed part, and the plate-shaped gas ejection part is The ejection part is provided with a plurality of sleeves having the base material and the gas ejection hole, and the space formed by the concave part and the gas ejection part becomes the gas diffusion space. A shower head, in a plasma processing device for applying plasma processing to a substrate, sprays the processing gas used to generate the plasma into a chamber in which the substrate is disposed and generates plasma Sprinklers in the plasma generating space; Equipped with: a body portion having a plurality of gas ejection holes capable of ejecting the processing gas; and a gas diffusion space provided in the body portion to introduce the processing gas and communicate with the gas ejection holes; The part of the body part having the gas ejection hole has: a substrate consisting of metal; a sleeve mounted on the substrate and having the gas ejection hole inside; and A flame spray coating made of ceramics is formed on the plasma generating space side of the base material and the sleeve; The sleeve is HIP bonded to the substrate. As the shower head of claim 12, wherein the base material and the side of the sleeve on the side of the chamber are uniform. Such as the shower head of item 12 or 13 of the patent application, wherein the base material is made of aluminum material. For the shower head according to any one of items 12 to 14 of the patent application scope, wherein the sleeve is made of corrosion-resistant metal material or ceramics. The shower head according to any one of items 12 to 15 of the patent application scope, wherein the flame sprayed film contains yttrium oxide. The shower head according to any one of the 12th to 16th claims of the patent application, which further has other ceramic flame spray coatings formed on the base material and the side of the sleeve on the side of the gas diffusion space. As for the shower head of item 17 of the scope of the patent application, wherein the base material and the side of the sleeve on the side of the gas diffusion space are uniform. A plasma processing device is a plasma processing device for processing substrates with plasma, which includes: a chamber for receiving the substrate; a mounting table for mounting the substrate in the chamber; If the shower head of any one of items 12 to 18 of the scope of the patent application is installed in the chamber opposite to the mounting table, the processing gas used to generate the plasma will be supplied to the electrode in the chamber. Pulp creates space. Such as the plasma processing device of claim 19 in the scope of the patent application, wherein the plasma generating mechanism is constituted as a high-frequency power supply having a high-frequency antenna, and supplies high-frequency power to the high-frequency antenna, by supplying high-frequency power to The high-frequency antenna will generate inductively coupled plasma in the plasma generating space in the chamber; The shower head is configured to constitute the top wall of the chamber, and has the function of a metal window as the inductively coupled plasma, and is divided into a plurality of structures through an insulating member, so that the high frequency The magnetic field and eddy current generated by the high-frequency current of the antenna can reach the side of the chamber.

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