TW202236916A - 半加成工法用積層體及使用其之印刷配線板 - Google Patents

半加成工法用積層體及使用其之印刷配線板 Download PDF

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Publication number
TW202236916A
TW202236916A TW110140950A TW110140950A TW202236916A TW 202236916 A TW202236916 A TW 202236916A TW 110140950 A TW110140950 A TW 110140950A TW 110140950 A TW110140950 A TW 110140950A TW 202236916 A TW202236916 A TW 202236916A
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TW
Taiwan
Prior art keywords
layer
mentioned
silver particle
conductive
semi
Prior art date
Application number
TW110140950A
Other languages
English (en)
Chinese (zh)
Inventor
深澤憲正
村川昭
白髪潤
Original Assignee
日商Ｄｉｃ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｄｉｃ股份有限公司 filed Critical 日商Ｄｉｃ股份有限公司
Publication of TW202236916A publication Critical patent/TW202236916A/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW110140950A 2020-11-05 2021-11-03 半加成工法用積層體及使用其之印刷配線板 TW202236916A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-184972 2020-11-05
JP2020184972 2020-11-05

Publications (1)

Publication Number Publication Date
TW202236916A true TW202236916A (zh) 2022-09-16

Family

ID=81457249

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110140950A TW202236916A (zh) 2020-11-05 2021-11-03 半加成工法用積層體及使用其之印刷配線板

Country Status (5)

Country Link
JP (1) JP7371778B2 (ja)
KR (1) KR20230098579A (ja)
CN (1) CN116458271A (ja)
TW (1) TW202236916A (ja)
WO (1) WO2022097479A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111373A (ja) * 1993-10-13 1995-04-25 Furukawa Electric Co Ltd:The スルーホール回路基板およびスルーホールメッキ方法
JP3570802B2 (ja) 1995-11-14 2004-09-29 三井化学株式会社 銅薄膜基板及びプリント配線板
US10021789B2 (en) 2007-07-02 2018-07-10 Ebara-Udylite Co., Ltd. Metal-laminated polyimide substrate, and method for production thereof
JP2010272837A (ja) 2009-04-24 2010-12-02 Sumitomo Electric Ind Ltd プリント配線板用基板、プリント配線板、及びプリント配線板用基板の製造方法
WO2013108890A1 (ja) * 2012-01-20 2013-07-25 旭化成イーマテリアルズ株式会社 樹脂組成物、積層体、多層プリント配線板及び多層フレキシブル配線板並びにその製造方法
EP3817524A4 (en) * 2018-06-26 2022-03-16 DIC Corporation METHOD OF MAKING A PRINTED CIRCUIT BOARD

Also Published As

Publication number Publication date
JPWO2022097479A1 (ja) 2022-05-12
JP7371778B2 (ja) 2023-10-31
CN116458271A (zh) 2023-07-18
WO2022097479A1 (ja) 2022-05-12
KR20230098579A (ko) 2023-07-04

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