TW202231607A - 帶電緩和用構造體 - Google Patents

帶電緩和用構造體 Download PDF

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Publication number
TW202231607A
TW202231607A TW110139879A TW110139879A TW202231607A TW 202231607 A TW202231607 A TW 202231607A TW 110139879 A TW110139879 A TW 110139879A TW 110139879 A TW110139879 A TW 110139879A TW 202231607 A TW202231607 A TW 202231607A
Authority
TW
Taiwan
Prior art keywords
porous membrane
less
porous
adsorption
oxide
Prior art date
Application number
TW110139879A
Other languages
English (en)
Chinese (zh)
Inventor
古川茂伸
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202231607A publication Critical patent/TW202231607A/zh

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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
TW110139879A 2020-10-28 2021-10-27 帶電緩和用構造體 TW202231607A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-180714 2020-10-28
JP2020180714 2020-10-28

Publications (1)

Publication Number Publication Date
TW202231607A true TW202231607A (zh) 2022-08-16

Family

ID=81382542

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110139879A TW202231607A (zh) 2020-10-28 2021-10-27 帶電緩和用構造體

Country Status (3)

Country Link
JP (1) JPWO2022092023A1 (fr)
TW (1) TW202231607A (fr)
WO (1) WO2022092023A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276131A (ja) * 2003-03-12 2004-10-07 Ckd Corp 真空チャック
JP5225024B2 (ja) * 2008-10-30 2013-07-03 京セラ株式会社 吸着盤および真空吸着装置
JP6976710B2 (ja) * 2016-04-28 2021-12-08 京セラ株式会社 多孔質セラミック体、吸着用部材および多孔質セラミック体の製造方法
WO2018139673A1 (fr) * 2017-01-30 2018-08-02 京セラ株式会社 Élément céramique semi-conducteur et support pour transport de plaquette
JP6946076B2 (ja) * 2017-06-29 2021-10-06 日本特殊陶業株式会社 真空吸着部材
JP6976799B2 (ja) * 2017-10-02 2021-12-08 京セラ株式会社 載置用部材

Also Published As

Publication number Publication date
JPWO2022092023A1 (fr) 2022-05-05
WO2022092023A1 (fr) 2022-05-05

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