JPWO2022092023A1 - - Google Patents

Info

Publication number
JPWO2022092023A1
JPWO2022092023A1 JP2022559121A JP2022559121A JPWO2022092023A1 JP WO2022092023 A1 JPWO2022092023 A1 JP WO2022092023A1 JP 2022559121 A JP2022559121 A JP 2022559121A JP 2022559121 A JP2022559121 A JP 2022559121A JP WO2022092023 A1 JPWO2022092023 A1 JP WO2022092023A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022559121A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022092023A1 publication Critical patent/JPWO2022092023A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
JP2022559121A 2020-10-28 2021-10-25 Pending JPWO2022092023A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020180714 2020-10-28
PCT/JP2021/039288 WO2022092023A1 (ja) 2020-10-28 2021-10-25 帯電緩和用構造体

Publications (1)

Publication Number Publication Date
JPWO2022092023A1 true JPWO2022092023A1 (ja) 2022-05-05

Family

ID=81382542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022559121A Pending JPWO2022092023A1 (ja) 2020-10-28 2021-10-25

Country Status (3)

Country Link
JP (1) JPWO2022092023A1 (ja)
TW (1) TW202231607A (ja)
WO (1) WO2022092023A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004276131A (ja) * 2003-03-12 2004-10-07 Ckd Corp 真空チャック
JP5225024B2 (ja) * 2008-10-30 2013-07-03 京セラ株式会社 吸着盤および真空吸着装置
JP6976710B2 (ja) * 2016-04-28 2021-12-08 京セラ株式会社 多孔質セラミック体、吸着用部材および多孔質セラミック体の製造方法
JP6885972B2 (ja) * 2017-01-30 2021-06-16 京セラ株式会社 ウエハ搬送用保持具
JP6946076B2 (ja) * 2017-06-29 2021-10-06 日本特殊陶業株式会社 真空吸着部材
JP6976799B2 (ja) * 2017-10-02 2021-12-08 京セラ株式会社 載置用部材

Also Published As

Publication number Publication date
WO2022092023A1 (ja) 2022-05-05
TW202231607A (zh) 2022-08-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230407