JPWO2022092023A1 - - Google Patents
Info
- Publication number
- JPWO2022092023A1 JPWO2022092023A1 JP2022559121A JP2022559121A JPWO2022092023A1 JP WO2022092023 A1 JPWO2022092023 A1 JP WO2022092023A1 JP 2022559121 A JP2022559121 A JP 2022559121A JP 2022559121 A JP2022559121 A JP 2022559121A JP WO2022092023 A1 JPWO2022092023 A1 JP WO2022092023A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020180714 | 2020-10-28 | ||
PCT/JP2021/039288 WO2022092023A1 (ja) | 2020-10-28 | 2021-10-25 | 帯電緩和用構造体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022092023A1 true JPWO2022092023A1 (ja) | 2022-05-05 |
Family
ID=81382542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022559121A Pending JPWO2022092023A1 (ja) | 2020-10-28 | 2021-10-25 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2022092023A1 (ja) |
TW (1) | TW202231607A (ja) |
WO (1) | WO2022092023A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004276131A (ja) * | 2003-03-12 | 2004-10-07 | Ckd Corp | 真空チャック |
JP5225024B2 (ja) * | 2008-10-30 | 2013-07-03 | 京セラ株式会社 | 吸着盤および真空吸着装置 |
JP6976710B2 (ja) * | 2016-04-28 | 2021-12-08 | 京セラ株式会社 | 多孔質セラミック体、吸着用部材および多孔質セラミック体の製造方法 |
WO2018139673A1 (ja) * | 2017-01-30 | 2018-08-02 | 京セラ株式会社 | 半導電性セラミック部材およびウエハ搬送用保持具 |
JP6946076B2 (ja) * | 2017-06-29 | 2021-10-06 | 日本特殊陶業株式会社 | 真空吸着部材 |
JP6976799B2 (ja) * | 2017-10-02 | 2021-12-08 | 京セラ株式会社 | 載置用部材 |
-
2021
- 2021-10-25 WO PCT/JP2021/039288 patent/WO2022092023A1/ja active Application Filing
- 2021-10-25 JP JP2022559121A patent/JPWO2022092023A1/ja active Pending
- 2021-10-27 TW TW110139879A patent/TW202231607A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202231607A (zh) | 2022-08-16 |
WO2022092023A1 (ja) | 2022-05-05 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240611 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240809 |