TW202229362A - Photosensitive resin composition, color filter and display device - Google Patents

Abstract

A photosensitive resin composition is disclosure. The photosensitive resin composition includes: a resin material, a solvent, a colorant, a photopolymerization monomer, and a photopolymerization initiator. The resin material has a T value between 0 and 6.99, wherein the T value is calculated by the following formula: T=[N*(1/Mw)] *S/V, where N is the number of double bonds in the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.

Description

Photosensitive resin composition and color filter

The present disclosure relates to a photosensitive resin composition and a color filter, in particular, to a photosensitive resin composition and a color filter that do not generate air bubbles during drying under reduced pressure.

Color filter is one of the means to make the display achieve full color and increase its added value. Color filters use the method of filtering to generate red (R), green (G), blue (B), and three primary colors of light, and then mix the three primary colors in different intensity ratios to present various colors. The color photosensitive resin composition is the main raw material of a color filter. Color filters are made by coating a glass substrate with a color photosensitive resin composition of three colors of red, green, and blue (RGB) with a specific pattern.

The present disclosure provides a photosensitive resin composition and a color filter that do not generate air bubbles during drying under reduced pressure by adjusting the components of the color photosensitive resin composition.

An object of the present disclosure is to provide a photosensitive resin composition, which includes: a resin material, a solvent, a colorant, a photopolymerization monomer, and a photopolymerization initiator, wherein the resin material has a range of 0 to 6.99 T value, the above T value is calculated by the following formula: T=[N×(1÷Mw)]×S/V, Wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.

Another object of the present disclosure is to provide a color filter formed from any of the above-mentioned photosensitive resin compositions.

It will be further understood that when the terms "comprises", "comprising", "includes" and/or "including" are used in this specification, they refer specifically to the stated features The presence of components, integers, steps, operations, elements, components, and/or groups thereof, but does not preclude the presence or addition of one or more other characteristic components, integers, steps, operations, elements, components, and/or its group. When the singular forms "a (a)" and "an (an)" are used in this specification, they are also intended to include the plural forms unless the context clearly dictates otherwise.

Additionally, unless expressly stated otherwise, numerical values relating to a particular component should be construed as including a tolerance range in the interpretation of the component.

The expression "a to b" used herein to denote a particular numerical range is defined as "≥a and ≤b".

The color filter is prepared by coating the color photosensitive resin composition on a substrate such as glass; exposing part of the color photosensitive resin composition to make it lose its solubility due to polymerization; washing away the unpolymerized color photosensitive resin photosensitive resin composition to form the desired pattern; finally heat or light to harden the remaining color photosensitive resin composition. In order to make the crosslinking reactivity of the color photosensitive resin composition better during exposure, the solvent in the color photosensitive resin composition is usually evacuated to dryness in a low vacuum environment. However, during the process of draining the solvent, the color photosensitive resin composition is likely to be abnormal due to bumping phenomenon, excessive pressure change or uneven air distribution, resulting in the appearance of micro-bubbles in the dried color photosensitive resin composition. The present disclosure provides a photosensitive resin composition and a color filter that do not generate air bubbles during drying under reduced pressure by adjusting the components of the color photosensitive resin composition.

One aspect of the present disclosure relates to a photosensitive resin composition, which includes: a resin material, a solvent, a colorant, a photopolymerization monomer, and a photopolymerization initiator, wherein the resin material has a value calculated by the following formula A T value: T=[N×(1÷Mw)]×S/V, Wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.

In the present disclosure, the number of double bonds of the resin material is obtained by coating the resin material with a thin film with a thickness of 1.0 μm on glass by spin coating to make a sample, and placing the sample in a Fourier transform infrared spectrometer (Bruker Tensor 27+Hyperion 3000) In the above, after calibration with blank glass, select the spectral range from 400 cm ^-1 to 4000 cm ^-1 to measure the FTIR spectrum, and finally use the free spectral database on the Internet to compare the functional groups, such as Japan Industrial Technology Comprehensive The SDBS established by the institute or the NIST established by the American Institute of Standards and Technology can be used.

Wherein N is the number of double bonds of the resin material > 660 is better; preferably greater than or equal to 1000, Mw is preferably the molecular weight of the resin material > 6100; preferably greater than or equal to 8000, S is the acid value of the resin material greater than or equal to 69 is Preferably; preferably greater than or equal to 74, and V is the viscosity of the resin material > 0.4; preferably greater than or equal to 0.9.

The molecular weight of the resin material in the present disclosure is measured by Fourier transform infrared spectroscopy (Bruker Tensor 27+Hyperion 3000) and nuclear magnetic resonance (Bruker AV-500). The detailed measurement method is to coat a thin film with a film thickness of 1.0 μm on the glass by Spin Coating to make a sample, and then scrape off the resin film on the glass with a doctor blade, collect 0.2 grams of powder, and then use the above-mentioned nuclear magnetic resonance apparatus. equipment to measure.

The viscosity of the resin material in the present disclosure is measured with a viscometer (TOKI SANGYO TV-25). The measurement method is to inject 1.3 grams of resin material into the sample cup, then fasten the sample cup to the rotor end, press the start button after completion, and the viscosity value will be displayed on the machine panel after a few minutes.

The acid value of the resin material in the present disclosure is measured by the acid subtraction titration method. Acid-base neutralization titration is a chemical measurement method, which uses strong acid or strong base to titrate alkali or acid solution, and the titration end point is determined by the titration curve measured by the instrument or the color change of the indicator (non-reactive substance).

The T value of the resin material in the present disclosure may be between 0 and 6.99, between 0 and 6.0, between 0 and 5.0, between 0 and 4.0, between 0 and 3.5, between 0.10 and 4.0, preferably 0.1 between 3.5, more preferably between 0.11 and 3.43.

In one embodiment, the resin material may account for 5-25 wt % of the photosensitive resin composition, preferably 8-25 wt %, more preferably 8-21 wt %.

In the photosensitive resin composition of the present disclosure, the purpose of the solvent is mainly to maintain the soluble state of the resin composition, so as to obtain a better coating effect in future use. specific restrictions. The solvent may include organic solvents, inorganic solvents, or a combination thereof. Examples of inorganic solvents may include, but are not limited to, water. Examples of the organic solvent may include, but are not limited to, ester-based solvents, ether-based solvents, ketone-based solvents, alcohol-based solvents, alcohol-ether-based solvents, hydrocarbon-based solvents, pinene-based solvents, or any combination thereof. Examples of ketone-based solvents may include, but are not limited to, acetone, butanone, or any combination thereof. Examples of ether-based solvents may include, but are not limited to, diethyl ether. Examples of alcoholic solvents may include, but are not limited to, methanol, ethanol, n-butanol, or any combination thereof. The alcohol ether solvent refers to a solvent in which the solvent molecule has both alcohol and ether functional groups, examples of which may include but are not limited to ethylene glycol monoethyl ether. Examples of hydrocarbon-based solvents may include, but are not limited to, toluene, xylene, or any combination thereof. Pinene-based solvent is a cyclic compound obtained by distillation of pine resin-based natural resin, examples of which may include but are not limited to turpentine, dipentene, pine oil or any combination thereof. Ester solvents may include, but are not limited to, ethyl acetate (EAC), n-butyl acetate (BAC), propylene glycol monomethyl ether acetate, or any combination thereof. In one embodiment, the solvent may be an ester solvent. In one embodiment, the solvent may comprise propylene glycol monomethyl ether acetate. In one embodiment, the solvent may account for 30-60 wt %, 30-55 wt %, 35-60 wt %, or 35-55 wt % of the photosensitive resin composition.

In the photosensitive resin composition of the present disclosure, the colorant may include dyes, pigments, or combinations thereof. Examples of dyes may include, but are not limited to, xanthene-based dyes, cyanine-based dyes, triphenylmethane-based dyes, or any combination thereof. Examples of pigments may include, but are not limited to, C.I. Pigment Red R9, R97, R105, R122, R123, R144, R149, R166, R168, R175, R176, R177, R180, R192, R209, R215, R216, R224, R242, R254 , R255, R264, R265; C.I. Pigment Yellow Y3, Y12, Y13, Y14, Y15, Y16, Y17, Y20, Y24, Y31, Y53, Y83, Y86, Y93, Y94, Y109, Y110, Y117, Y125, Y128, Y137, Y138, Y139, Y147, Y148, Y150, Y153, Y154, Y166, Y173, Y194, Y214; C.I. Pigment Blue B15, B15:3, B15:4, B15:6, B60, B80, B16; C.I. Pigment Orange O13, O31, O36, O38, O40, O42, O43, O51, O55, O59, O 61, O64, O65, O71, O73; C.I. Pigment Violet P1, P19, P23, P29, P32, P36, P38; C.I. Pigment Green G1, G2, G4, G7, G8, G10, G13, G14, G15, G17, G18, G19, G26, G36, G45, G48, G50, G51, G54, G55, G58, G59; or any combination thereof. In one embodiment, the colorant accounts for 15-55 wt % of the photosensitive resin composition, preferably 20-55 wt %, more preferably 22-53 wt %.

In the photosensitive resin composition of the present disclosure, the photopolymerizable monomer is not particularly limited, and examples thereof include but are not limited to (meth)acrylic acid, acrylate, styrene, vinyl acetate or any combination thereof. Examples of acrylates may include, but are not limited to, butyl acrylate (BA), methyl acrylate (MA), 2-ethylhexyl acrylate (2-EHA), butyl methacrylate (MBA), methyl methacrylate ester (MMA), tricyclodecyl methacrylate, dipentaerythritol hexaacrylate, or any combination thereof. In one embodiment, the photopolymerizable monomer may be dipentaerythritol hexaacrylate.

In the photosensitive resin composition of the present disclosure, the photopolymerization initiator is not particularly limited, and examples thereof include but are not limited to oxime ester compounds, acetophenone compounds, organic peroxides, biimidazole compounds or any combination thereof. In one embodiment, the photopolymerization initiator may be an acetophenone compound.

In one embodiment, the photosensitive resin composition may further include other additives such as leveling agents, fillers, antioxidants, light stabilizers, chain transfer agents, etc., but is not limited thereto.

Another aspect of the present disclosure relates to a color filter, which can be formed from the photosensitive resin composition of any of the foregoing embodiments. The process for forming the color filter is not particularly limited. In one embodiment, the process for forming a color filter may include, for example, forming a photosensitive resin composition on a substrate, exposing the photosensitive resin composition, and removing the unpolymerized photosensitive resin composition products, and photosensitive resin compositions that are heat-cured and polymerized.

The process of forming the photosensitive resin composition on the substrate is not particularly limited, and examples thereof may include, but are not limited to, an inkjet process, a coating process, a transfer process, or a screen printing process. Substrates may include, but are not limited to, glass, metal, or polyimide substrates. In one embodiment, the substrate may further include various photoresist structures, optical structures, insulating structures, conductive structures, and/or electronic components.

Before exposing the photosensitive resin composition on the substrate, a process of drying the photosensitive resin composition may be further included. The purpose of the process of drying the photosensitive resin composition is to improve the crosslinking reactivity of the photosensitive resin composition by removing the solvent in the photosensitive resin composition. The process of drying the photosensitive resin composition may include a natural drying process, a ventilation drying process, a reduced pressure drying process, a heating drying process, a heating drying process or any combination thereof. The photosensitive resin composition of the present disclosure does not generate air bubbles during and after the drying process under reduced pressure, thereby reducing the possibility of abnormal detection due to air bubbles in the color filter produced thereafter.

In the process of exposing the photosensitive resin composition, a mask having a predetermined pattern can be used to expose the photosensitive resin composition. In one embodiment, a light source such as a mercury lamp, a light emitting diode, a metal halide lamp, or a halogen lamp can be used to irradiate the photosensitive resin composition to cause a polymerization reaction of the photosensitive resin composition, but the present disclosure is not limited thereto. Next, after removing the unpolymerized photosensitive resin composition using a solvent or the like, the polymerized photosensitive resin composition remaining on the substrate is cured by heating. The solvent used to remove the unpolymerized photosensitive resin composition may include an organic solvent, an inorganic solvent, or a combination thereof. The organic solvent may include, but is not limited to, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, alkylamines, ethanolamines, or any combination thereof. Inorganic solvents may include, but are not limited to, sodium hydroxide, potassium hydroxide, silicates, carbonates, borates, ammonia, or any combination thereof.

Hereinafter, the present disclosure will provide several examples to more specifically illustrate the advantages of the photosensitive resin composition according to the embodiments of the present disclosure.

Example 1

In a flask with a stirring device, a funnel, a condenser, a thermometer and a gas introduction tube, 213.6 g of propylene glycol monomethyl ether acetate was placed, and nitrogen was introduced through the gas introduction tube to replace the air in the flask while stirring at the same time propylene glycol monomethyl ether acetate, and the temperature of propylene glycol monomethyl ether acetate was raised to 90°C. After mixing 20.0 g (0.20 mol) of methyl methacrylate, 88.0 g (0.40 mol) of tricyclodecyl methacrylate and 34.4 (0.4 mol) of methacrylic acid, add 4.0 g of methacrylic acid to it. g of tert-butyl peroxy-2-ethylhexanoate to form a mixture. The above mixture was dropped into the above flask through a funnel. After completion of dropping, the copolymerization reaction was carried out by stirring at 95° C. for 3 hours. Next, after replacing the nitrogen in the above-mentioned flask with air, 42.6 g (0.3 moles) of glycidyl methacrylate, 0.6 g of triphenylphosphine (catalyst) and 0.6 g of hydroquinone (polymerization) were added. inhibitor), a ring-opening addition reaction was carried out at 120°C for 6 hours. Next, 221.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution having a solid content concentration of 30 mass % as the resin material 1 .

Example 2

Resin Material 2 was prepared in the same manner as in Example 1 above, except that 243.3 g of propylene glycol monomethyl ether acetate and 200.2 g of propylene glycol monomethyl ether were used.

Example 3

In a flask with a stirring device, a funnel, a condenser, a thermometer and a gas introduction tube, 246.5 g of propylene glycol monomethyl ether acetate was placed, and then stirred while nitrogen was introduced through the gas introduction tube to replace the air in the flask propylene glycol monomethyl ether acetate, and the temperature of propylene glycol monomethyl ether acetate was raised to 90°C. Mix 30.0 g of methyl methacrylate, 33.0 g of tricyclodecyl methacrylate and 28.6 g of methacrylic acid, and then add 5.0 g of tert-butyl peroxy-2-ethylhexanoate. form a mixture. The above mixture was dropped into the above flask through a funnel. After completion of dropping, the copolymerization reaction was carried out by stirring at 95° C. for 3 hours. Next, after replacing the nitrogen in the flask with air, 38.8 g of glycidyl methacrylate, 43.6 g of isooctyl acrylate, 0.6 g of triphenylphosphine (catalyst) and 0.6 g of hydrogen were added Quinone (polymerization inhibitor), a ring-opening addition reaction was carried out at 120°C for 6 hours. Next, 205.4 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution having a solid content concentration of 30% by mass as the resin material 3 .

Example 4

Nitrogen gas was introduced into the flask with a condenser, a funnel, a thermometer and a stirring device through a gas introduction pipe to replace the air in the flask, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed. While stirring propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate was heated to 85°C. 25 parts by weight of vinyltoluene, 13 parts by weight of acrylic acid and 663 parts by weight of 3,4-epoxytricyclo[5.2.1.02,6]decane-8-yl acrylate with a molar ratio of 1:1 A mixture mixed with 3,4-epoxytricyclo[5.2.1.02,6]decane-9-yl acrylate (trade name "E-DCPA", manufactured by Daicel Co., Ltd.) was dissolved in 220 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The above-mentioned solution was dropped into the above-mentioned flask over about 5 hours. On the other hand, 31 parts by weight of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in 140 parts by weight of propylene glycol monomethyl ether acetate to obtain a polymerization The starter solution was dripped into the flask over about 5 hours using another drip pump. After the drop of the polymerization initiator solution was completed, the temperature was maintained for about 3 hours, and then it was cooled to room temperature to obtain a copolymer solution with a solid content concentration of 28.3 mass % as the resin material 4 .

Example 5

In a flask with a stirring device, a funnel, a condenser, a thermometer and a gas introduction tube, 492.2 g of propylene glycol monomethyl ether acetate was placed, and then stirred while nitrogen was introduced through the gas introduction tube to replace the air in the flask propylene glycol monomethyl ether acetate, and the temperature of propylene glycol monomethyl ether acetate is raised to 100°C. 29.3 g of glycidyl methacrylate and 75.8 g of methacrylic acid were mixed followed by 4.9 g of tert-butyl peroxy-2-ethylhexanoate to form a mixture. The above mixture was dropped into the above flask through a funnel. After completion of dropping, the copolymerization reaction was carried out by stirring at 95° C. for 3 hours. Next, after replacing the nitrogen in the above-mentioned flask with air, 74.4 g of glycidyl methacrylate, 24.7 g of benzyl methacrylate, 0.57 g of triphenylphosphine (catalyst) and 0.6 g were added The hydroquinone (polymerization inhibitor) was subjected to a ring-opening addition reaction at 120° C. for 6 hours. Next, 241.3 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution having a solid content concentration of 29% by mass as the resin material 5 .

Example 6

A suitable amount of nitrogen was flowed in a flask having a condenser, a funnel, a thermometer and a stirring device to set the flask to a nitrogen atmosphere, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed. While stirring propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate was heated to 85°C. A mixture of 37 parts by weight of benzyl methacrylate, 14 parts by weight of glycidyl methacrylate and 209 parts by weight of E-DCPA was dissolved in 40 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The above-mentioned solution was dropped into the above-mentioned flask over about 8 hours. On the other hand, it was prepared by dissolving 23 parts by weight of polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 140 parts by weight of propylene glycol monomethyl ether acetate The polymerization initiator solution was dropped into the flask over about 5 hours using another drop pump. After the drop of the polymerization initiator solution was completed, the temperature was maintained for about 3 hours, and then it was cooled to room temperature to obtain a copolymer solution with a solid content concentration of 35.5% by mass as the resin material 6 .

Example 7

A suitable amount of nitrogen was flowed in a flask having a condenser, a funnel, a thermometer and a stirring device to set the flask to a nitrogen atmosphere, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed. While stirring propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate was heated to 85°C. A mixture of 23 parts by weight of isooctyl acrylate, 18 parts by weight of acrylic acid and 893 parts by weight of E-DCPA was dissolved in 220 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The above-mentioned solution was dropped into the above-mentioned flask over about 5 hours. On the other hand, it was prepared by dissolving 31 parts by weight of polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) in 140 parts by weight of propylene glycol monomethyl ether acetate The polymerization initiator solution was dropped into the flask over about 5 hours using another drop pump. After the drop of the polymerization initiator solution was completed, the temperature was maintained for about 3 hours, and then it was cooled to room temperature to obtain a copolymer solution with a solid concentration of 28.3% by mass as the resin material 7 .

Example 8

In a flask with a stirring device, a funnel, a condenser, a thermometer and a gas introduction tube, 446.4 g of propylene glycol monomethyl ether acetate was placed, and then stirred while nitrogen was introduced through the gas introduction tube to replace the air in the flask propylene glycol monomethyl ether acetate, and the temperature of propylene glycol monomethyl ether acetate is raised to 100°C. 27.4 g of glycidyl methacrylate and 77.3 g of methacrylic acid were mixed followed by 6.0 g of tert-butyl peroxy-2-ethylhexanoate to form a mixture. The above mixture was dropped into the above flask through a funnel. After completion of dropping, the copolymerization reaction was carried out by stirring at 100° C. for 3 hours. Next, after replacing the nitrogen in the flask with air, 69.5 g of glycidyl methacrylate, 47.2 g of benzyl methacrylate, 0.55 g of triphenylphosphine (catalyst), and 0.55 g of The hydroquinone (polymerization inhibitor) was subjected to a ring-opening addition reaction at 120° C. for 6 hours. Next, 208.6 g of propylene glycol monomethyl ether was added to this reaction solution to obtain a copolymer solution having a solid content concentration of 30% by mass as the resin material 8 .

Measure and calculate the number N of double bonds of resin materials 1~8 with FTIR, measure and calculate the molecular weight Mw of resin materials 1~8 with NMR and FTIR, measure and calculate the acid value S of resin materials 1~8 with acid-base titration, And measure the viscosity V of the resin material 1~8 with a viscometer, and calculate the T value of the resin material 1~8 according to the following formula. The number of double bonds, molecular weight, acid value, viscosity and T value calculated by the resin materials 1~8 are shown in Table 1 below: T=[N×(1÷Mw)]×S/V Table 1 Resin material 1 2 3 4 5 6 7 8 molecular weight 6400 6100 9200 10420 32100 8810 10930 27900 Acid value 35.4 68.5 39 112 104.1 100 149 74.2 Number of double bonds 350 370 660 1024 1110 3327 1348 1160 viscosity 0.2 0.2 0.4 229 3 337 41 0.9 T value 9.68 20.78 6.99 0.05 1.20 0.11 0.45 3.43

The above-mentioned resin materials 1 to 8 are combined with dipentaerythritol hexaacrylate (KAYARAD (registered trademark) DPHA, manufactured by Nippon Kayaku Co., Ltd.) as a photopolymerizable monomer, and an acetophenone compound (trade name) as a photopolymerization initiator. : Trolly PBG-327) and O-acyl oxime compound (trade name: BASF OXE-01), polyether-modified silicone oil (Toray Silicone SH8400, manufactured by Toray Dow Corning Co., Ltd.) as a leveling agent, as a solvent Propylene glycol monomethyl ether acetate (PGMEA) mixed solvent and colorant were mixed in the weight percentages shown in Tables 2 to 4 below to form photosensitive resin compositions 1-1 to 8-3.

The photosensitive resin composition 1-1~8-3 is coated on the glass substrate with a coating thickness of 1 um~4 um, and then the photosensitive resin composition 1-1~8 is coated on it with a vacuum equipment The glass substrate of -3 was placed in an environment with an atmospheric pressure of less than 150pa for 1 minute, and then it was taken out and observed with a CCD to see if there were air bubbles in the photosensitive resin compositions 1-1 to 8-3. Each photosensitive resin composition 1-1 The components of ~8-3 and the results of bubble generation are shown in Tables 2 to 4 below. Table 2 Composition (weight percent)\Photosensitive resin composition 1-1 2-1 3-1 4-1 5-1 6-1 7-1 8-1 blue paint 12.4 dye 10 Resin material 1 16.9 Resin material 2 16.9 Resin material 3 16.9 Resin material 4 16.9 Resin material 5 16.9 Resin material 6 16.9 Resin material 7 16.9 Resin material 8 16.9 photopolymerizable monomer 4.2 photopolymerization initiator 2.09 leveling agent 0.01 solvent 54.4 T value of resin 9.68 20.78 6.99 0.05 1.20 0.11 0.45 3.43 The effect of anti-bubble X X X table 3 Composition (weight percent)\Photosensitive resin composition 1-2 2-2 3-2 4-2 5-2 6-2 7-2 8-2 red pigment 48.8 yellow pigment 3.4 Resin material 1 8.5 Resin material 2 8.5 Resin material 3 8.5 Resin material 4 8.5 Resin material 5 8.5 Resin material 6 8.5 Resin material 7 8.5 Resin material 8 8.5 photopolymerizable monomer 2.8 photopolymerization initiator 1.32 leveling agent 0.02 solvent 35.16 T value of resin 9.68 20.78 6.99 0.05 1.20 0.11 0.45 3.43 The effect of anti-bubble X X X Table 4 Composition (weight percent)\Photosensitive resin composition 1-3 2-3 3-3 4-3 5-3 6-3 7-3 8-3 green paint 25.5 yellow pigment 12.9 Resin material 1 21.0 Resin material 2 21.0 Resin material 3 21.0 Resin material 4 21.0 Resin material 5 21.0 Resin material 6 21.0 Resin material 7 21.0 Resin material 8 21.0 photopolymerizable monomer 3.8 photopolymerization initiator 1.04 leveling agent 0.02 solvent 35.74 T value of resin 9.68 20.78 6.99 0.05 1.20 0.11 0.45 3.43 The effect of anti-bubble X X X

From the results disclosed in Tables 1 to 4 above, it can be seen that the photosensitive resin compositions 1-1 to 3-3 containing the resin materials 1 to 3 with a T value >6.99 will suffer from bumping phenomenon and pressure changes in a vacuum environment. Too fast or uneven air distribution leads to the appearance of micro-bubbles in the dried photosensitive resin compositions 1-1 to 3-3, and the color filter produced therefrom is abnormally detected. In contrast, the photosensitive resin compositions 4-1 to 8-3 containing the resin materials 4 to 8 with a T value of less than 6.99 did not generate micro-bubbles when dried in a vacuum environment. The resin material between 6.99 can make the color filter with better quality.

The features of several embodiments of the present disclosure are summarized above, so that those with ordinary knowledge in the technical field to which the present disclosure pertains can more easily understand the viewpoints of the embodiments of the present disclosure. Those skilled in the art to which the present disclosure pertains should appreciate that they can, based on the embodiments of the present disclosure, design or modify other processes and structures to achieve the same objectives and/or advantages of the embodiments described herein. Those with ordinary knowledge in the technical field to which the present disclosure pertains should also understand that such equivalent processes and structures do not depart from the spirit and scope of the present disclosure, and they can, without departing from the spirit and scope of the present disclosure, Make all kinds of changes, substitutions, and substitutions.

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Claims (10)

A photosensitive resin composition, comprising: a resin material having a T value between 0 and 6.99; a solvent; a colorant; a photopolymerizable monomer; and a photopolymerization initiator, where the T value is calculated by the following formula: T=[N×(1÷Mw)]×S/V, Wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material. The photosensitive resin composition according to claim 1, wherein the T value is between 0 and 3.5. The photosensitive resin composition according to claim 1, wherein the resin material accounts for 5-25 wt% of the photosensitive resin composition. The photosensitive resin composition according to claim 1, wherein the photopolymerizable monomer accounts for 2-5 wt% of the photosensitive resin composition. The photosensitive resin composition according to claim 1, wherein the resin material: the solvent has a weight ratio of 1:1.5 to 1:5. The photosensitive resin composition according to claim 5, wherein the weight ratio of the resin material: the solvent: the colorant is 3~10:15:5~30. The photosensitive resin composition according to claim 1, wherein the acid value of the resin material is greater than or equal to 69, and/or the viscosity of the resin material is greater than 0.4. The photosensitive resin composition according to claim 1, wherein the molecular weight of the resin material>6100, and/or the number of double bonds of the resin material>660. A color filter formed from the photosensitive resin composition according to any one of claims 1 to 8. A display device comprising the color filter of any one of claim 9.