CN113485070A - Photosensitive resin composition, color filter and display device - Google Patents
Photosensitive resin composition, color filter and display device Download PDFInfo
- Publication number
- CN113485070A CN113485070A CN202110665422.0A CN202110665422A CN113485070A CN 113485070 A CN113485070 A CN 113485070A CN 202110665422 A CN202110665422 A CN 202110665422A CN 113485070 A CN113485070 A CN 113485070A
- Authority
- CN
- China
- Prior art keywords
- resin composition
- photosensitive resin
- resin material
- solvent
- propylene glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000002904 solvent Substances 0.000 claims abstract description 29
- 239000003086 colorant Substances 0.000 claims abstract description 13
- 239000002253 acid Substances 0.000 claims abstract description 12
- 239000000178 monomer Substances 0.000 claims abstract description 8
- 239000003505 polymerization initiator Substances 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- 239000003999 initiator Substances 0.000 abstract description 6
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 32
- 238000000034 method Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 230000008569 process Effects 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 11
- 229910001873 dinitrogen Inorganic materials 0.000 description 11
- 238000001035 drying Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000000049 pigment Substances 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 239000003049 inorganic solvent Substances 0.000 description 4
- 229910001867 inorganic solvent Inorganic materials 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 238000007142 ring opening reaction Methods 0.000 description 4
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 4
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- -1 oxime ester compounds Chemical class 0.000 description 3
- 238000004448 titration Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Natural products CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000005453 ketone based solvent Substances 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- QOSPZWFSEFUMGD-UHFFFAOYSA-N 4-oxatetracyclo[6.2.1.02,7.03,5]undecan-10-yl prop-2-enoate Chemical compound C12C3OC3CC2C2CC(OC(=O)C=C)C1C2 QOSPZWFSEFUMGD-UHFFFAOYSA-N 0.000 description 1
- VDBSRPBXFACZJJ-UHFFFAOYSA-N 4-oxatetracyclo[6.2.1.02,7.03,5]undecan-9-yl prop-2-enoate Chemical compound C12CC3OC3C2C2CC(OC(=O)C=C)C1C2 VDBSRPBXFACZJJ-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 238000001157 Fourier transform infrared spectrum Methods 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 241000779819 Syncarpia glomulifera Species 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 238000002479 acid--base titration Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 150000001923 cyclic compounds Chemical group 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 239000001739 pinus spp. Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- HFQQZARZPUDIFP-UHFFFAOYSA-M sodium;2-dodecylbenzenesulfonate Chemical compound [Na+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HFQQZARZPUDIFP-UHFFFAOYSA-M 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 238000000954 titration curve Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 229940036248 turpentine Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Abstract
The present disclosure relates to a photosensitive resin composition, a color filter and a display device, wherein the photosensitive resin composition comprises: a resin material, a solvent, a colorant, a photopolymerizable monomer, and a photopolymerization initiator, wherein the resin material has a T value between 0 and 6.99, wherein the T value is calculated from the following formula: t [ N × (1 ÷ Mw) ] × S/V, where N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.
Description
Technical Field
The present disclosure relates to a photosensitive resin composition and a color filter, and more particularly, to a photosensitive resin composition and a color filter that do not generate bubbles during drying under reduced pressure.
Background
The color filter is one of means to make the display full color and further to improve its added value. The color filter generates red (R), green (G), blue (B) and three primary colors by filtering, and then mixes the three primary colors in different proportions to present various colors. The Color photosensitive resin composition is a main raw material of a Color Filter (Color Filter). The color filter is made by coating 3 colors of color photosensitive resin composition of red, green, blue (RGB) on a glass substrate by a specific pattern.
The present disclosure provides a photosensitive resin composition and a color filter which do not generate bubbles during reduced pressure drying by adjusting the components of the color photosensitive resin composition.
Disclosure of Invention
An object of the present disclosure is to provide a photosensitive resin composition, which includes: a resin material, a solvent, a colorant, a photopolymerizable monomer, and a photopolymerization initiator, wherein the resin material has a T value that can be between 0 and 6.99, the T value being calculated from the following formula:
T＝[N×(1÷Mw)]×S/V，
wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.
Another object of the present disclosure is to provide a color filter formed from any one of the above photosensitive resin compositions.
Another object of the present disclosure is to provide a display device including any one of the color filters described above.
Detailed Description
It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, and/or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. When the singular forms "a" and "an" are used in this specification, the plural forms are intended to be included unless the context clearly dictates otherwise.
In addition, unless explicitly stated otherwise, numerical values associated with a particular component are to be construed as including a range of tolerances in the interpretation of the component.
The expression "a to b" as used herein to denote a particular numerical range is defined as ". gtoreq.a.ltoreq.b".
The color filter is prepared by coating a color photosensitive resin composition on a substrate such as glass; exposing a portion of the color photosensitive resin composition to light to lose its solubility due to polymerization; washing off the unpolymerized color photosensitive resin composition to form a desired pattern; finally, the residual color photosensitive resin composition is hardened by heating or illumination. In order to improve the crosslinking reactivity of the color photosensitive resin composition during exposure, the solvent in the color photosensitive resin composition is usually dried in a low vacuum environment. However, during the process of drying the solvent, the color photosensitive resin composition is likely to be detected as abnormal due to the occurrence of fine bubbles in the dried color photosensitive resin composition caused by bumping phenomenon, excessively rapid pressure change or uneven air flow distribution. The present disclosure provides a photosensitive resin composition and a color filter which do not generate bubbles during reduced pressure drying by adjusting the components of the color photosensitive resin composition.
One aspect of the present disclosure relates to a photosensitive resin composition, which includes: a resin material, a solvent, a colorant, a photopolymerizable monomer, and a photopolymerization initiator, wherein the resin material has a T value calculated by the following formula:
T＝[N×(1÷Mw)]×S/V，
wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.
In the disclosure, the number of double bonds of the resin material is obtained by Coating a film with a thickness of 1.0 μm on glass by Spin Coating to obtain a sample, placing the sample on a Fourier transform infrared spectrometer (Bruker sensor 27+ Hyperion 3000), and selecting a spectrum range from 400cm after correcting with a blank glass-1～4000cm-1Measuring FTIR spectrum, and comparing the time functional groups with a free spectrum database on the network, such as SDBS established by the Japanese Industrial science and technology institute or NIST established by the American Standard technology institute.
Wherein N is the number of double bonds of the resin material is more than 660; preferably 1000 or more, and Mw is more preferably more than 6100; more preferably 8000 or more, S is an acid value of the resin material of 69 or more; preferably 74 or more, and V is a viscosity of the resin material > 0.4; preferably 0.9 or more.
The molecular weight of the resin material in the present disclosure was measured by Fourier transform infrared spectroscopy (Bruker Tensor 27+ Hyperion 3000) and nuclear magnetic resonance spectroscopy (Bruker AV-500). The detailed measurement was performed by Coating a film having a thickness of 1.0 μm on a glass by Spin Coating, scraping off the resin film on the glass with a doctor blade, collecting a powder having a weight of 0.2g, and measuring with the NMR apparatus.
The viscosity of the resin material in the present disclosure is measured by a viscometer (TOKI SANGYO TV-25). The measurement method is to inject 1.3g of resin material into the sample cup, then the sample cup is fastened to the rotor end, and after the measurement is completed, the start button is pressed, and the viscosity value will be displayed on the machine panel in a few minutes later.
The acid value of the resin material in the present disclosure is measured by acid drop titration. Acid-base neutralization titration is a chemical measurement method, which is to titrate a base or an acid solution with strong acid or strong base, and determine the titration end point by the titration curve chart measured by an instrument or the color change of an indicator (non-reaction substance).
In the present disclosure, the T value of the resin material may be between 0 and 6.99, 0 and 6.0, 0 and 5.0, 0 and 4.0, 0 and 3.5, 0.10 and 4.0, preferably 0.1 and 3.5, and more preferably 0.11 and 3.43.
In one embodiment, the resin material can account for 5 to 25 wt%, preferably 8 to 25 wt%, and more preferably 8 to 21 wt% of the photosensitive resin composition.
In the photosensitive resin composition of the present disclosure, the purpose of the solvent is mainly to maintain the solubility state of the resin composition, so as to obtain a better coating effect in future use, and therefore, the solvent is not particularly limited in use as long as the above effect is achieved. The solvent may comprise an organic solvent, an inorganic solvent, or a combination thereof. Examples of inorganic solvents may include, but are not limited to, water. Examples of the organic solvent may include, but are not limited to, ester solvents, ether solvents, ketone solvents, alcohol ether solvents, hydrocarbon solvents, terpene solvents, or any combination thereof. Examples of ketone solvents may include, but are not limited to, acetone, butanone, or any combination thereof. Examples of the ether solvent may include, but are not limited to, diethyl ether. Examples of the alcoholic solvent may include, but are not limited to, methanol, ethanol, n-butanol, or any combination thereof. The alcohol ether solvent refers to a solvent having a functional group of both alcohols and ethers in a solvent molecule, and examples thereof may include, but are not limited to, ethylene glycol monoethyl ether. Examples of hydrocarbon based solvents may include, but are not limited to, toluene, xylene, or any combination thereof. The terpene-based solvent is a cyclic compound obtained by distilling a rosin-based natural resin, and examples thereof may include, but are not limited to, turpentine, dipentene, pine oil, or any combination thereof. The ester solvent may include, but is not limited to, Ethyl Acetate (EAC), n-Butyl Acetate (BAC), propylene glycol monomethyl ether acetate, or any combination thereof. In one embodiment, the solvent may be an ester solvent. In one embodiment, the solvent may comprise propylene glycol monomethyl ether acetate. In one embodiment, the solvent can account for 30-60 wt%, 30-55 wt%, 35-60 wt%, or 35-55 wt% of the photosensitive resin composition. In one embodiment, the resin material: the weight ratio of the solvent is 1: 1.5-1: 5.
in the photosensitive resin composition of the present disclosure, the colorant may include a dye, a pigment, or a combination thereof. Examples of dyes may include, but are not limited to, xanthene-based dyes, cyanine-based dyes, triphenylmethane-based dyes, or any combination thereof. Examples of pigments may include, but are not limited to, c.i. pigment red R9, R97, R105, R122, R123, R144, R149, R166, R168, R175, R176, R177, R180, R192, R209, R215, R216, R224, R242, R254, R255, R264, R265; c.i. pigment yellow Y3, Y12, Y13, Y14, Y15, Y16, Y17, Y20, Y24, Y31, Y53, Y83, Y86, Y93, Y94, Y109, Y110, Y117, Y125, Y128, Y137, Y138, Y139, Y147, Y148, Y150, Y153, Y154, Y166, Y173, Y194, Y214; c.i. pigment blue B15, B15: 3. b15: 4. b15: 6. b60, B80, B16; c.i. pigment orange O13, O31, O36, O38, O40, O42, O43, O51, O55, O59, O61, O64, O65, O71, O73; c.i. pigment violet P1, P19, P23, P29, P32, P36, P38; c.i. pigment green G1, G2, G4, G7, G8, G10, G13, G14, G15, G17, G18, G19, G26, G36, G45, G48, G50, G51, G54, G55, G58, G59; or any combination thereof. In one embodiment, the colorant is 15 to 55 wt%, preferably 20 to 55 wt%, and more preferably 22 to 53 wt% of the photosensitive resin composition. In one embodiment, the resin material: solvent: the weight ratio of the colorant is 3-10: 15: 5 to 30.
In the photosensitive resin composition of the present disclosure, the photopolymerizable monomer is not particularly limited, and examples thereof may include, but are not limited to, (meth) acrylic acid, acrylate, styrene, vinyl acetate, or any combination thereof. Examples of acrylates may include, but are not limited to, Butyl Acrylate (BA), Methyl Acrylate (MA), 2-ethylhexyl acrylate (2-EHA), butyl Methacrylate (MBA), Methyl Methacrylate (MMA), tricyclodecyl methacrylate, dipentaerythritol hexaacrylate, or any combination thereof. In one embodiment, the photopolymerizable monomer may be dipentaerythritol hexaacrylate. In one embodiment, the photopolymerizable monomer is 2 to 5 wt% of the photosensitive resin composition.
In the photosensitive resin composition of the present disclosure, the photopolymerization initiator is not particularly limited, and examples thereof may include, but are not limited to, oxime ester compounds, acetophenone compounds, organic peroxides, biimidazole compounds, or any combination thereof. In one embodiment, the photopolymerization initiator may be an acetophenone compound.
In an embodiment, the photosensitive resin composition may further include other additives such as a leveling agent, a filler, an antioxidant, a light stabilizer, a chain transfer agent, and the like, but is not limited thereto.
Another aspect of the present disclosure relates to a color filter, which can be formed from the photosensitive resin composition of any of the above embodiments. The process for forming the color filter is not particularly limited. In one embodiment, the process for forming the color filter can include, for example, forming a photosensitive resin composition on a substrate, exposing the photosensitive resin composition to light, removing the unpolymerized photosensitive resin composition, and curing the polymerized photosensitive resin composition by heating.
The process of forming the photosensitive resin composition on the substrate is not particularly limited, and examples thereof may include, but are not limited to, an inkjet process, a coating process, a transfer process, or a screen printing process. The substrate may include, but is not limited to, a glass, metal, or polyimide substrate. In one embodiment, the substrate may further include various photoresist structures, optical structures, insulating structures, conductive structures, and/or electronic components.
The process of drying the photosensitive resin composition may further be included before exposing the photosensitive resin composition on the substrate. The process of drying the photosensitive resin composition aims at improving the crosslinking reactivity of the photosensitive resin composition by removing the solvent in the photosensitive resin composition. The process for drying the photosensitive resin composition may comprise a natural drying process, a through-air drying process, a reduced pressure drying process, a heat drying process or any combination thereof. The photosensitive resin composition disclosed by the invention does not generate bubbles during and after the reduced pressure drying process, so that the possibility that the color filter manufactured later is detected to be abnormal due to the bubbles can be reduced.
The photosensitive resin composition can be exposed by using a mask having a predetermined pattern in the process of exposing the photosensitive resin composition. In one embodiment, the photosensitive resin composition may be irradiated by a light source such as a mercury lamp, a light emitting diode, a metal halogen lamp, or a halogen lamp to generate a polymerization reaction of the photosensitive resin composition, but the disclosure is not limited thereto. Next, after removing the unpolymerized photosensitive resin composition by a method such as a solvent, the polymerized photosensitive resin composition remaining on the substrate is heat-cured. The solvent used to remove the unpolymerized photosensitive resin composition may comprise an organic solvent, an inorganic solvent, or a combination thereof. The organic solvent may include, but is not limited to, tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, alkylamines, ethanolamine, or any combination thereof. The inorganic solvent may include, but is not limited to, sodium hydroxide, potassium hydroxide, silicates, carbonates, borates, ammonia, or any combination thereof.
Hereinafter, the present disclosure will provide several examples to more specifically illustrate the advantages that can be obtained by the photosensitive resin composition according to the embodiments of the present disclosure.
Example 1
After 213.6g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a funnel, a condenser, a thermometer, and a gas inlet tube, the temperature of the propylene glycol monomethyl ether acetate was raised to 90 ℃ while stirring the propylene glycol monomethyl ether acetate while introducing nitrogen gas through the gas inlet tube to replace the air in the flask. After mixing 20.0g (0.20 mole) of methyl methacrylate, 88.0g (0.40 mole) of tricyclodecyl methacrylate and 34.4 g (0.4 mole) of methacrylic acid, 4.0g of tert-butyl peroxy-2-ethylhexanoate was added to form a mixture. The mixture was dropped into the flask via a funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for 3 hours to effect copolymerization. Then, 42.6g (0.3 mol) of glycidyl methacrylate, 0.6g of triphenylphosphine (catalyst), and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and ring-opening addition reaction was carried out at 120 ℃ for 6 hours, after replacing the nitrogen gas in the flask with air. Subsequently, 221.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass as a resin material 1.
Example 2
Resin material 2 was prepared in the same manner as in example 1 above, except that 243.3g of propylene glycol monomethyl ether acetate and 200.2g of propylene glycol monomethyl ether were used.
Example 3
After 246.5g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a funnel, a condenser, a thermometer, and a gas inlet tube, the temperature of the propylene glycol monomethyl ether acetate was raised to 90 ℃ while stirring the propylene glycol monomethyl ether acetate while introducing nitrogen gas through the gas inlet tube to replace the air in the flask. After mixing 30.0g of methyl methacrylate, 33.0g of tricyclodecyl methacrylate and 28.6g of methacrylic acid, 5.0g of tert-butyl peroxy-2-ethylhexanoate was added to form a mixture. The mixture was dropped into the flask via a funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for 3 hours to effect copolymerization. Then, after replacing the nitrogen gas in the flask with air, 38.8g of epoxypropyl methacrylate, 43.6g of isooctyl acrylate, 0.6g of triphenylphosphine (catalyst), and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and ring-opening addition reaction was carried out at 120 ℃ for 6 hours. Subsequently, 205.4g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid content of 30% by mass as a resin material 3.
Example 4
Through a gas inlet tube, nitrogen gas was introduced into a flask equipped with a condenser, a funnel, a thermometer, and a stirrer so as to replace the air in the flask, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed therein. The propylene glycol monomethyl ether acetate was heated to 85 ℃ while stirring the propylene glycol monomethyl ether acetate. A mixture of 25 parts by weight of vinyltoluene, 13 parts by weight of acrylic acid, and 663 parts by weight of 3, 4-epoxytricyclo [5.2.1.02,6] decan-8-yl acrylate and 3, 4-epoxytricyclo [5.2.1.02,6] decan-9-yl acrylate (trade name "E-DCPA", manufactured by Dacellosolve Co., Ltd.) in a molar ratio of 1:1 was dissolved in 220 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The solution was dropped into the flask over about 5 hours. On the other hand, a polymerization initiator solution prepared by dissolving 31 parts by weight of 2,2' -azobis (2, 4-dimethylvaleronitrile), a polymerization initiator, in 140 parts by weight of propylene glycol monomethyl ether acetate, was dropped into the flask using another dropping pump for about 5 hours. After the completion of dropping of the polymerization initiator solution, the temperature was maintained for about 3 hours, followed by cooling to room temperature to obtain a copolymer solution having a solid concentration of 28.3% by mass as the resin material 4.
Example 5
In a flask equipped with a stirrer, a funnel, a condenser, a thermometer and a gas inlet tube, 492.2g of propylene glycol monomethyl ether acetate was placed, and while stirring the propylene glycol monomethyl ether acetate while introducing nitrogen gas through the gas inlet tube to replace the air in the flask, the temperature of the propylene glycol monomethyl ether acetate was raised to 100 ℃. After mixing 29.3g of glycidyl methacrylate and 75.8g of methacrylic acid, 4.9g of tert-butyl peroxy-2-ethylhexanoate were added to form a mixture. The mixture was dropped into the flask via a funnel. After completion of the dropping, the mixture was stirred at 95 ℃ for 3 hours to effect copolymerization. Then, 74.4g of epoxypropyl methacrylate, 24.7g of benzyl methacrylate, 0.57g of triphenylphosphine (catalyst) and 0.6g of hydroquinone (polymerization inhibitor) were added thereto, and ring-opening addition reaction was carried out at 120 ℃ for 6 hours, after replacing the nitrogen gas in the flask with air. Subsequently, 241.3g of propylene glycol monomethyl ether was added to the reaction solution to obtain a copolymer solution having a solid concentration of 29% by mass as a resin material 5.
Example 6
In a flask equipped with a condenser, a funnel, a thermometer, and a stirring device, an appropriate amount of nitrogen gas was flowed to place the flask in a nitrogen atmosphere, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed. The propylene glycol monomethyl ether acetate was heated to 85 ℃ while stirring the propylene glycol monomethyl ether acetate. A mixture of 37 parts by weight of benzyl methacrylate, 14 parts by weight of glycidyl methacrylate and 209 parts by weight of E-DCPA was dissolved in 40 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The solution was dropped into the flask over about 8 hours. On the other hand, a polymerization initiator solution prepared by dissolving 23 parts by weight of 2,2' -azobis (2, 4-dimethylvaleronitrile), a polymerization initiator, in 140 parts by weight of propylene glycol monomethyl ether acetate, was dropped into the flask using another dropping pump for about 5 hours. After the completion of dropping of the polymerization initiator solution, the temperature was maintained for about 3 hours, followed by cooling to room temperature to obtain a copolymer solution having a solid concentration of 35.5% by mass as the resin material 6.
Example 7
In a flask equipped with a condenser, a funnel, a thermometer, and a stirring device, an appropriate amount of nitrogen gas was flowed to place the flask in a nitrogen atmosphere, and 100 parts by weight of propylene glycol monomethyl ether acetate was placed. The propylene glycol monomethyl ether acetate was heated to 85 ℃ while stirring the propylene glycol monomethyl ether acetate. A mixture of 23 parts by weight of isooctyl acrylate, 18 parts by weight of acrylic acid, and 893 parts by weight of E-DCPA was dissolved in 220 parts by weight of propylene glycol monomethyl ether acetate to prepare a solution. The solution was dropped into the flask over about 5 hours. On the other hand, a polymerization initiator solution prepared by dissolving 31 parts by weight of 2,2' -azobis (2, 4-dimethylvaleronitrile), a polymerization initiator, in 140 parts by weight of propylene glycol monomethyl ether acetate, was dropped into the flask using another dropping pump for about 5 hours. After the completion of dropping of the polymerization initiator solution, the temperature was maintained for about 3 hours, followed by cooling to room temperature to obtain a copolymer solution having a solid concentration of 28.3 mass% as the resin material 7.
Example 8
446.4g of propylene glycol monomethyl ether acetate was placed in a flask equipped with a stirrer, a funnel, a condenser, a thermometer, and a gas inlet tube, and then while stirring the propylene glycol monomethyl ether acetate while introducing nitrogen gas through the gas inlet tube to replace the air in the flask, the temperature of the propylene glycol monomethyl ether acetate was raised to 100 ℃. 27.4g of glycidyl methacrylate and 77.3g of methacrylic acid were mixed and 6.0g of tert-butyl peroxy-2-ethylhexanoate was added to form a mixture. The mixture was dropped into the flask via a funnel. After completion of the dropping, the mixture was stirred at 100 ℃ for 3 hours to effect copolymerization. Then, 69.5g of epoxypropyl methacrylate, 47.2g of benzyl methacrylate, 0.55g of triphenylphosphine (catalyst) and 0.55g of hydroquinone (polymerization inhibitor) were added thereto, and ring-opening addition reaction was carried out at 120 ℃ for 6 hours, after replacing the nitrogen gas in the flask with air. Subsequently, 208.6g of propylene glycol monomethyl ether was added to the reaction solution, to obtain a copolymer solution having a solid content of 30% by mass as a resin material 8.
FTIR is used for measuring and calculating the number N of double bonds of the resin materials 1-8, NMR is matched with FTIR for measuring and calculating the molecular weight Mw of the resin materials 1-8, an acid-base titration method is used for measuring and calculating the acid value S of the resin materials 1-8, a viscometer is used for measuring the viscosity V of the resin materials 1-8, and the T value of the resin materials 1-8 is calculated according to the following formula. The number of double bonds, molecular weight, acid value, viscosity of the resin materials 1 to 8 and the results of T values calculated using the same are shown in the following Table 1:
T＝[N×(1÷Mw)]×S/V
TABLE 1
The photosensitive resin compositions 1-1 to 8-3 were prepared by mixing the resin materials 1 to 8 with dipentaerythritol hexaacrylate (KaYARAD (registered trademark) DPHA, manufactured by Nippon Kagaku K.K.), an acetophenone compound (trade name: Tronly PBG-327) and an O-acyloxime compound (trade name: BASF OXE-01) as photopolymerization initiators, a polyether modified Silicone oil (Toray Silicone SH8400, manufactured by Toray Conning K.K.) as leveling agents, a Propylene Glycol Monomethyl Ether Acetate (PGMEA) as a solvent, and a colorant in the following weight percentages shown in tables 2 to 4.
The photosensitive resin composition 1-1 to 8-3 with 1um to 4um coating thickness coated on the glass substrate, then by vacuum equipment coated with the photosensitive resin composition 1-1 to 8-3 glass substrate is placed in the atmospheric pressure of 150Pa below environment for 1 minutes, and then the CCD to view the photosensitive resin composition 1-1 to 8-3 whether there is bubble generation, each photosensitive resin composition 1-1 to 8-3 components and bubble generation results are shown in the following table 2 to 4.
TABLE 2
TABLE 3
TABLE 4
As can be seen from the results shown in tables 1 to 4 above, the photosensitive resin compositions 1-1 to 3-3 containing the resin materials 1 to 3 with T value > 6.99 will cause the dried photosensitive resin compositions 1-1 to 3-3 to generate micro-bubbles under vacuum environment due to bumping phenomenon, too fast pressure change or uneven air flow distribution, so that the color filters manufactured by using the compositions will be detected to be abnormal. In contrast, the photosensitive resin compositions 4-1 to 8-3 comprising the resin materials 4 to 8 having a T value of less than 6.99 do not generate micro-bubbles when dried in a vacuum environment, and thus, color filters having better quality can be obtained by using the resin materials having a T value of 0 to 6.99.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the embodiments of the present disclosure. Those skilled in the art should appreciate that they may readily use the disclosed conception and specific embodiments as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent processes and structures do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the present disclosure.
Claims (10)
1. A photosensitive resin composition, comprising:
a resin material having a T value between 0 and 6.99;
a solvent;
a colorant;
a photo-polymerization monomer; and
a photo-polymerization initiator,
wherein the value of T is calculated by the following formula:
T＝[N×(1÷Mw)]×S/V，
wherein N is the number of double bonds of the resin material, Mw is the molecular weight of the resin material, S is the acid value of the resin material, and V is the viscosity of the resin material.
2. The photosensitive resin composition according to claim 1, wherein the value of T is between 0 and 3.5.
3. The photosensitive resin composition according to claim 1, wherein the resin material is 5 to 25 wt% of the photosensitive resin composition.
4. The photosensitive resin composition according to claim 1, wherein the photopolymerizable monomer is 2 to 5 wt% of the photosensitive resin composition.
5. The photosensitive resin composition according to claim 1, wherein the resin material: the weight ratio of the solvent is 1: 1.5-1: 5.
6. the photosensitive resin composition according to claim 5, wherein the resin material: the solvent is as follows: the colorant is prepared from the following components in percentage by weight: 15: 5 to 30.
7. The photosensitive resin composition according to claim 1, wherein the acid value of the resin material is 69 or more, and/or the viscosity of the resin material is > 0.4.
8. The photosensitive resin composition according to claim 1, wherein the molecular weight of the resin material is > 6100, and/or the number of double bonds of the resin material is > 660.
9. A color filter formed from the photosensitive resin composition according to any one of claims 1 to 8.
10. A display device comprising the color filter according to any one of claim 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109146756 | 2020-12-30 | ||
| TW109146756A TWI807240B (en) | 2020-12-30 | 2020-12-30 | Photosensitive resin composition, color filter and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113485070A true CN113485070A (en) | 2021-10-08 |
Family
ID=77935129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110665422.0A Pending CN113485070A (en) | 2020-12-30 | 2021-06-16 | Photosensitive resin composition, color filter and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113485070A (en) |
| TW (1) | TWI807240B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0841150A (en) * | 1994-08-01 | 1996-02-13 | Daicel Chem Ind Ltd | Curable resin composition |
| JPH08259624A (en) * | 1995-03-20 | 1996-10-08 | Daicel Chem Ind Ltd | Unsaturated group-containing curable resin and curable resin composition using the same |
| JP2001081285A (en) * | 1999-09-10 | 2001-03-27 | Dainippon Ink & Chem Inc | Actinic-radiation-curable resin composition |
| KR20100051395A (en) * | 2008-11-07 | 2010-05-17 | 주식회사 엘지화학 | Photoresist resin composition and the liquid crystal display comprising micropattern thereof |
| KR20100100005A (en) * | 2009-03-04 | 2010-09-15 | 동우 화인켐 주식회사 | Colored photosensitive resin composition, and color filter and liquid crystal display device prepared by using the same |
| KR20110039033A (en) * | 2009-10-09 | 2011-04-15 | 동우 화인켐 주식회사 | A colored photosensitive resin composition, color filter and liquid crystal display device having the same |
| KR20110045530A (en) * | 2009-10-27 | 2011-05-04 | 동우 화인켐 주식회사 | Red colored photosensitive resin composition, color filter and liquid crystal display device having the same |
| KR20150106637A (en) * | 2014-03-12 | 2015-09-22 | 동우 화인켐 주식회사 | Colored photosensitive resin composition and color filter using the same |
| KR20170111655A (en) * | 2016-03-29 | 2017-10-12 | 동우 화인켐 주식회사 | Colored photosensitive resin composition for organic light emitting diodes, color filter and image display device produced using the same |
| CN111624853A (en) * | 2019-07-10 | 2020-09-04 | 住华科技股份有限公司 | Colored resin composition, and color filter and display device using same |
-
2020
- 2020-12-30 TW TW109146756A patent/TWI807240B/en active
-
2021
- 2021-06-16 CN CN202110665422.0A patent/CN113485070A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0841150A (en) * | 1994-08-01 | 1996-02-13 | Daicel Chem Ind Ltd | Curable resin composition |
| JPH08259624A (en) * | 1995-03-20 | 1996-10-08 | Daicel Chem Ind Ltd | Unsaturated group-containing curable resin and curable resin composition using the same |
| JP2001081285A (en) * | 1999-09-10 | 2001-03-27 | Dainippon Ink & Chem Inc | Actinic-radiation-curable resin composition |
| KR20100051395A (en) * | 2008-11-07 | 2010-05-17 | 주식회사 엘지화학 | Photoresist resin composition and the liquid crystal display comprising micropattern thereof |
| KR20100100005A (en) * | 2009-03-04 | 2010-09-15 | 동우 화인켐 주식회사 | Colored photosensitive resin composition, and color filter and liquid crystal display device prepared by using the same |
| KR20110039033A (en) * | 2009-10-09 | 2011-04-15 | 동우 화인켐 주식회사 | A colored photosensitive resin composition, color filter and liquid crystal display device having the same |
| KR20110045530A (en) * | 2009-10-27 | 2011-05-04 | 동우 화인켐 주식회사 | Red colored photosensitive resin composition, color filter and liquid crystal display device having the same |
| KR20150106637A (en) * | 2014-03-12 | 2015-09-22 | 동우 화인켐 주식회사 | Colored photosensitive resin composition and color filter using the same |
| KR20170111655A (en) * | 2016-03-29 | 2017-10-12 | 동우 화인켐 주식회사 | Colored photosensitive resin composition for organic light emitting diodes, color filter and image display device produced using the same |
| CN111624853A (en) * | 2019-07-10 | 2020-09-04 | 住华科技股份有限公司 | Colored resin composition, and color filter and display device using same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202229362A (en) | 2022-08-01 |
| TWI807240B (en) | 2023-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI806434B (en) | Photosensitive resin composition, and method for producing same, color filter, and method for producing same, and image display element | |
| JP5736038B2 (en) | Copolymer, resin composition and photosensitive resin composition containing the copolymer, and color filter | |
| CN101517486B (en) | Photosensitive resin composition | |
| KR20170063762A (en) | Alkali-soluble resin, photosensitive resin composition, and use thereof | |
| WO2014194630A1 (en) | Green photoresist, colour filter and preparation method and colour display device thereof | |
| KR20180059239A (en) | Photosensitive resin composition, black pixel defining layer using the same and display device | |
| CN109471331B (en) | Resin composition, photosensitive resin composition, resin cured film, and image display element | |
| JP2010054912A (en) | Color photosensitive resin composition | |
| JP2016126324A (en) | Colored photosensitive resin composition | |
| TWI600970B (en) | Resin composition, color filter, production method of color filter, and image display element | |
| CN113485070A (en) | Photosensitive resin composition, color filter and display device | |
| CN115160483B (en) | Copolymer and photosensitive resin composition for color filters | |
| CN111615650B (en) | Photosensitive resin composition for color filter, image display element, and method for producing color filter | |
| KR101835500B1 (en) | Photosensitive resin composition and color filter using the same | |
| WO2020109347A1 (en) | Acrylic polymerized polysiloxane, composition comprising the same, and cured film produced using the same | |
| KR20090098416A (en) | Alkaline developing photosensitive binder and the method for processing thereof | |
| JP2019031627A (en) | Alkali-soluble resin, photosensitive resin composition for color filter containing the same, and color filter | |
| CN114621388A (en) | Resin polymer, photocuring composition and application thereof | |
| WO2023119900A1 (en) | Photosensitive resin composition and color filter | |
| TWI805272B (en) | Photosensitive resin composition, color filter and display device | |
| KR101661672B1 (en) | Photosensitive resin composition and color filter using the same | |
| KR20150033962A (en) | Photosensitive resin composition and color filter using the same | |
| TWI770994B (en) | Coloring resin composition, method of manufacturing the same, and method of manufacturing photoresist structure | |
| KR101710409B1 (en) | Photosensitive phosphorus-containing unsaturated acrylic compositions and the method of manufacturing the same | |
| WO2017022299A1 (en) | Curable (meth)acrylate polymer, curable composition, color filter, and image display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |