TW202223322A - Vapor chamber structure - Google Patents

Abstract

A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25mm, whereby the vapor chamber can be extremely thinned.

Description

Vapor chamber structure

The present invention relates to a temperature equalizing plate, especially an extremely thin temperature equalizing plate.

In order to achieve a better heat transfer effect, the heat dissipation device using the two-phase flow heat exchange principle is used as the heat conduction element in the heat dissipation field. According to the exchange principle, a material with better heat conduction efficiency must be used as the main structure of the vapor chamber and heat pipe, among which copper is the most common. Filled with working liquid, the two-phase flow (vapor and liquid) circulates inside the vacuum airtight chamber by lowering the boiling point of the working liquid in a vacuum environment, thereby providing better heat conduction efficiency. In the prior art, a capillary structure is arranged on at least one plate body, and then the main body is covered with another plate body, and then the main body is subjected to edge sealing, water filling (liquid working fluid) and vacuuming and other operations. , and then constitute the above-mentioned vapor chamber; the aforementioned capillary structure in the vapor chamber is mainly used as the liquid working fluid to flow back from the condensation zone to the evaporation zone and to store the liquid working fluid in the evaporation zone, and the capillary structure is usually It can be used as a structure that can provide capillary force in the form of sintered body, mesh body, fiber body, groove, etc. The sintered body is mainly covered with metal powder on one side of the plate body, and then the powder is sintered and attached to the plate body by sintering to form a porous capillary structure. The sintered body formed by sintering The capillary structure of the type is the capillary structure with the best capillary force, and the sintering work must heat the adjacent powders to a semi-solid state to connect the powders to each other and form a capillary structure with porous characteristics. The capillary structure of the powder can maintain the characteristics of porosity, so the particle size of the sintered powder has a certain limit, because when the particle size of the sintered powder is too small, the powders will be sintered and melted and have almost no pores between each other, so that it cannot be formed. Porous capillary structure, that is, the capillary structure cannot provide capillary force. In this way, the particle size of the sintered powder used in the existing sintered body cannot select too fine powder, so that in the capillary structure formed by the existing sintering method, the sintered powder must be selected to have a moderate particle size so that the particles can be formed between the particles. Pores and have the effect of capillary force, but the thickness of the sintered structure will also increase accordingly, which means that the existing sintered body cannot be applied to the extremely thin vapor chamber structure. In addition, the current vapor chamber using the sintered body cannot be partially bent (bent), because if the vapor chamber is bent (bent), the sintered body in the chamber will be damaged and fall off and collapsed, resulting in There is no capillary structure on the board, so the effect of temperature uniformity and heat dissipation is lost. Therefore, in order to solve the above-mentioned problem that the existing sintered body cannot be used in the ultra-thin vapor chamber structure, the industry has turned to the groove with poor capillary force in the capillary structure, or the capillary force in the capillary structure is inferior to that of the sintered powder. Try to use the mesh body or woven mesh. Although the mesh body or woven mesh is convenient to set up and can be used for the parts that need to be bent, the mesh body or woven mesh must be installed in the temperature equalizing plate. The working fluid can be diffused by capillary action in the mesh body or woven mesh only when it is completely attached to the shell wall or pipe wall. Therefore, when the mesh body or woven mesh is not completely attached to the surface of the shell wall or pipe wall, Then it cannot provide the capillary force to supply the working liquid to diffuse the vapor-liquid circulation. In addition, the mesh body and the woven mesh are mainly composed of a plurality of filamentous monomers intertwined or woven. The wire diameter and thickness of the wire (such as filamentary metal wire) cannot be changed due to the limitation of current processing machinery and materials, so the mesh body (or woven mesh) composed of all the multiple filamentary monomers intertwined (or woven) with each other is made. The overall thickness cannot be reduced any more, so the existing grids and woven meshes cannot be applied to the ultra-thin vapor chamber structure either. Then the next step is to use the groove with poor capillary force, and the groove is mainly formed on the shell wall of the vapor chamber by machining, etc., so as to be used as a capillary structure, but it extends Another problem is that the opening of grooves in the temperature chamber will inevitably lead to the thinning of the shell wall of the temperature chamber, which will not only affect the overall structural strength, but also cause the shell wall to rupture, which will lead to internal damage. The working fluid leaks out and loses the effect of temperature uniformity and heat dissipation. Therefore, the installation of grooves will make the shell wall thinner and reduce the overall structural strength. Therefore, if the uniform temperature plate is bent (bent), it is easy to cause damage to the installation. The location of the groove is broken, and based on these considerations, the industry is afraid to use it on a very thin vapor chamber. Therefore, with the ultra-thin configuration, the overall thickness of the vapor chamber is subject to considerable restrictions. Not only is the thickness of the tube wall conforming to the ultra-thin size limitation, but also its internal airtight chamber and internal capillary structure must be further reduced. Therefore, It can be seen from the use and arrangement of the above capillary structures that the selection and manufacture of capillary structures become a difficult problem when ultra-thin designs are carried out. Therefore, how to achieve ultra-thin, and at the same time have capillary force, is the most important improvement goal for those skilled in the art.

An object of the present invention is to provide a vapor chamber structure that can achieve extremely thinning. Another object of the present invention is to provide a vapor chamber structure with better capillary force and bendability (bending). In order to achieve the above object, the present invention provides a temperature chamber structure, comprising an upper plate, a lower plate, an intermediate layer and a polymer layer, the lower plate is covered with the upper plate and jointly defines a chamber, the The chamber is filled with a working fluid, the middle layer is arranged in the chamber, the middle layer is provided with a first side, a second side, a plurality of perforations and a plurality of grooves, the perforations pass through the first and second sides, the A plurality of grooves are arranged on one of the first and second sides, the polymer layer is selected to be combined with any one of the upper and lower plates, and the total thickness of the temperature chamber structure is equal to or less than 0.25MM. The invention can realize the thinning of the heat dissipation unit, and at the same time use the intermediate layer as a capillary structure for providing vapor-liquid circulation of the vapor state and liquid working fluid, so that the lack of thinning of the conventional heat dissipation unit can be solved. The above-mentioned upper plate is composed of a plurality of upper plate bodies superimposed on each other, and the polymer layer is sandwiched between the plurality of upper plate bodies to form the upper plate. The above-mentioned lower plate is composed of a plurality of lower plate bodies superimposed on each other, and the polymer layer is sandwiched between the plurality of lower plate bodies to form the lower plate. The above-mentioned polymer layer is selectively formed on the upper inner side or the upper outer side of the upper plate by means of coating, printing and bonding. The above-mentioned polymer layer is selectively formed on the lower inner side or the lower outer side of the lower plate by means of coating, printing and bonding. The above-mentioned plurality of grooves are formed on the second side of the intermediate layer in a longitudinal direction or a transverse direction or a longitudinal direction and a transverse direction at the same time. The plurality of grooves and the plurality of perforations are staggered or non-staggered. The above-mentioned vapor chamber structure further includes a hydrophilic layer, and the hydrophilic layer is selectively disposed on the upper inner side or the lower inner side or the second side of the intermediate layer and the surfaces of the plurality of grooves. The above-mentioned upper plate has a plurality of convex portions protrudingly disposed on the upper inner side of the upper plate, and the second side of the intermediate layer is attached to the plurality of convex portions.

The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings. The present invention provides a vapor chamber structure. Referring to FIG. 1, it is an exploded schematic view of the first embodiment of the present invention; FIG. 2 is a combined cross-sectional view and a partial enlarged schematic view of the first embodiment of the present invention. As shown in the figure, the temperature chamber structure 1 includes an upper plate 11 , a lower plate 13 , an intermediate layer 15 and a polymer layer 16 , and the upper plate 11 has an upper outer side 111 , an upper inner side 112 and a plurality of protrusions 113, the plurality of protruding parts 113 are protruded on the upper inner side 112, the lower plate 13 has a lower outer side 131 and a lower inner side 132, the lower inner side 132 is opposite to the upper inner side 112, and the lower plate 13 is connected with the upper plate 11 cover and jointly define a chamber 14, and the chamber 14 is filled with a working fluid (such as pure water). The upper plate 11 and the lower plate 13 are made of any one of copper, aluminum, stainless steel and commercial pure titanium, and the thicknesses of the upper and lower plates 11 and 13 are respectively about 0.05MM (mm). In a possible embodiment, the vapor chamber structure 1 can also be a hot plate structure. The intermediate layer 15 can be a piece or a plate system disposed in the chamber 14, and the intermediate layer 15 has a first side 151, a second side 152, a plurality of through holes 153 and a plurality of grooves 154. The first side 151 and the second side 152 are respectively in contact with the corresponding lower inner side 132 and the plurality of convex portions 113, and the plurality of grooves 154 are arranged on the first side 151 or the second side 152, or grooves are arranged on both sides. The grooves 154 , in this embodiment, the plurality of grooves 154 are arranged at intervals on the second side 152 of the intermediate layer 15 , that is, the plurality of grooves 154 are staggered and formed on the second side of the intermediate layer 15 . The two sides 152 are connected with the plurality of longitudinal grooves 154 and the plurality of transverse grooves 154 , so that the liquid working fluid can quickly flow back to the lower inner side along the longitudinal and transverse grooves 154 by the capillary force of the plurality of grooves 154 132 (ie evaporation zone). The thickness of the intermediate layer 15 is about 0.05MM (mm). The plurality of through holes 153 pass through the first and second sides 151 and 152 , and the plurality of through holes 153 and the plurality of grooves 154 are staggered or non-staggered. In this embodiment, the plurality of through holes 153 and the plurality of grooves 154 are horizontally arranged with each other. The staggered arrangement is illustrative and not limiting. Therefore, through the design of the grooves 154 provided on one or both sides of the intermediate layer 15 and the through holes 153 penetrating the intermediate layer 15 of the present invention, the plurality of grooves 154 can provide liquid working fluid for backflow, and the plurality of through holes 153 It can be used as a vapor channel for working fluid to evaporate and vaporize, so as to realize a capillary suction structure with a gas circulation channel and a liquid return at the same time, which can not only solve the problem that the internal cavity 14 is narrow and difficult to set the capillary structure when the heat dissipation unit is thinned, but also The intermediate layer 15 can also be used as a support structure for the vapor chamber structure 1 , so that the chamber 14 of the vapor chamber structure 1 can maintain its integrity without being squeezed and deformed to lose the effect of vapor-liquid circulation. In another possible embodiment, the plurality of through-holes 153 and the plurality of grooves 154 are arranged in a vertical, vertical, and staggered arrangement. In another embodiment, the plurality of trenches 154 are laterally or longitudinally formed on the second side 152 of the intermediate layer 15 . The polymer layer 16 is, for example, a synthetic polymer (such as polyethylene (PE), P.V.C, nylon, dacron, ABS or SBR) or an inorganic polymer (such as quartz, asbestos, mica or graphite). 16 is selected to be combined with any one of the upper and lower boards 11 and 13, and the polymer layer 16 is selectively formed on any of the upper board 11 and the lower board 13 by coating, printing, bonding and laminating. On one surface (such as the upper outer side 111 surface, the upper inner side 112 surface, the lower inner side 132 surface or the lower outer side 131 surface), in this embodiment, the polymer layer 16 is formed on the lower outer side 131 of the lower plate 13 by coating. On the surface, and the overall thickness of the vapor chamber structure 1 is equal to 0.25MM (mm), but not limited thereto. During specific implementation, the overall thickness of the temperature chamber structure 1 may also be less than 0.25MM. Please refer to FIG. 3A , which is a cross-sectional view of the vapor chamber structure 1 according to the second embodiment of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the previous embodiments, so it will not be repeated here. The difference between the two is that the polymer layer 16 is disposed or sandwiched between the upper plate 11 and/or the lower plate Between the plates 13, and the upper plate 11 (and/or the lower plate 13) is composed of a plurality of upper plate bodies 110 (and/or lower plate bodies 130) superimposed on each other. Please refer to FIG. 3B , which is a cross-sectional view of the vapor chamber structure 1 according to the third embodiment of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the previous embodiments, so it will not be repeated here. The difference between the two is that the vapor chamber structure 1 further includes a hydrophilic layer 18, and the hydrophilic layer 18 is selected and arranged. on the surface of the upper inner side 112 or the lower inner side 132 or the second side 152 of the intermediate layer 15 and the plurality of grooves 154 . To sum up, through the design of the vapor chamber structure 1 of the present invention, the problem that various capillary structures applied in the prior art are limited and cannot be smoothly reduced in ultra-thin shape can be effectively improved. Therefore, because the overall thickness of the vapor chamber structure 1 of the present invention is equal to or less than 0.25MM, the present invention improves the defect that the capillary structure cannot be extremely thin in the prior art.

1: Vapor chamber structure 11: Upper board 110: Upper body 111: upper outer side 112: Upper Medial 113: convex part 13: Lower board 130: Lower body 131: Lower outer side 132: Lower Medial 14: Chamber 15: middle layer 151: First side 152: Second side 153: Perforation 154: Groove 16: Polymer layer 18: Hydrophilic layer

FIG. 1 is an exploded schematic view of the first embodiment of the present invention. FIG. 2 is a combined cross-sectional view and a partial enlarged schematic view of the first embodiment of the present invention. FIG. 3A is a schematic cross-sectional view of the assembly of the second embodiment of the present invention. FIG. 3B is a schematic cross-sectional view of the assembly of the third embodiment of the present invention.

11: Upper board

111: upper outer side

112: Upper Medial

113: convex part

13: Lower board

131: Lower outer side

132: Lower Medial

15: middle layer

151: First side

152: Second side

153: Perforation

154: Groove

16: Polymer layer

Claims (9)

A vapor chamber structure, comprising: an upper plate with an upper outer side and an upper inner side; The lower plate has a lower outer side and a lower inner side, so that the lower plate and the upper plate are correspondingly covered and jointly define a chamber, and the chamber is filled with a working fluid; An intermediate layer is disposed in the chamber, the intermediate layer is provided with a first side, a second side, a plurality of perforations and a plurality of grooves, the plurality of perforations pass through the first and second sides, and the plurality of grooves are disposed in at least one of the first and second sides; and A polymer layer is selected to be combined with any one of the upper and lower plates, so that the overall thickness of the vapor chamber structure is equal to or less than 0.25MM. The vapor chamber structure described in claim 1, wherein the upper plate is composed of a plurality of upper plate bodies superimposed on each other, and the polymer layer is sandwiched between the plurality of upper plate bodies to form the upper plate. The vapor chamber structure described in claim 1, wherein the lower plate is composed of a plurality of lower plate bodies superimposed on each other, and the polymer layer is sandwiched between the plurality of lower plate bodies to form the lower plate. The vapor chamber structure as described in claim 1, wherein the polymer layer is selectively formed on the upper inner side or the upper outer side of the upper plate by means of coating, printing and bonding. The vapor chamber structure as described in claim 1, wherein the polymer layer is selectively formed on the lower inner side or the lower outer side of the lower plate by means of coating, printing and bonding The vapor chamber structure as described in claim 1, wherein the plurality of grooves are staggered and formed on the second side of the intermediate layer in a longitudinal direction or a transverse direction or a longitudinal direction and a transverse direction at the same time. The vapor chamber structure as described in claim 1, wherein the plurality of grooves and the plurality of perforations are staggered or non-staggered. The vapor chamber structure described in claim 1 further comprises a hydrophilic layer, the hydrophilic layer is selectively disposed on the upper inner side or the lower inner side or the second side of the intermediate layer and the surfaces of the plurality of grooves. The vapor chamber structure as described in claim 1, wherein the upper plate has a plurality of convex portions protruding from the upper inner side of the upper plate, and the second side of the intermediate layer is in contact with the plurality of convex portions Assume.

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