TW202223321A - Thin-type two-phase fluid device - Google Patents

Abstract

A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25mm, whereby the object of thinning the heat dissipation device is achieved.

Description

Low Profile Two-Phase Flow Device

A thin two-phase flow device, especially a thin two-phase flow device.

In order to achieve a better heat transfer effect, the heat dissipation device that applies the heat exchange principle of two-phase flow in the heat dissipation field is used as the heat conduction element. Among them, the vapor chamber and the heat pipe are the most popular, and the vapor chamber and the heat pipe are the two-phase flow heat exchange. In principle, a material with better thermal conductivity must be used as the main structure of the vapor chamber and heat pipe. Among them, copper is the most common. The inside of the main body must have a vacuum air-tight chamber and the inner surface of the chamber is provided with capillary structures and fillers. There is a working liquid, so that the two-phase flow (vapor and liquid) circulates inside the vacuum airtight chamber by reducing the boiling point of the working liquid in a vacuum environment, thereby providing better heat conduction efficiency. In the prior art, a capillary structure is arranged on at least one plate body, and then the main body is covered with another plate body, and then the main body is subjected to edge sealing, water filling (liquid working fluid) and vacuuming and other operations. , and then constitute the above-mentioned vapor chamber; the aforementioned capillary structure in the vapor chamber is mainly used as the liquid working fluid to flow back from the condensation zone to the evaporation zone and to store the liquid working fluid in the evaporation zone, and the capillary structure is usually It can be used as a structure that can provide capillary force in the form of sintered body, mesh body, fiber body, groove, etc. The sintered body is mainly covered with metal powder on one side of the plate body, and then the powder is sintered and attached to the plate body by sintering to form a porous capillary structure. The sintered body formed by sintering The capillary structure of the type is the capillary structure with the best capillary force, and the sintering work must heat the adjacent powders to a semi-solid state to connect the powders to each other and form a capillary structure with porous characteristics. The capillary structure of the powder can maintain the characteristics of porosity, so the particle size of the sintered powder has a certain limit, because when the particle size of the sintered powder is too small, the powders will be sintered and melted and have almost no pores between each other, so that it cannot be formed. Porous capillary structure, that is, the capillary structure cannot provide capillary force. In this way, the particle size of the sintered powder used in the existing sintered body cannot be too fine, so that in the capillary structure formed by the existing sintering method, the sintered powder must be selected to have a moderate particle size in order to form particles between the particles. Pores and have the effect of capillary force, but the thickness of the sintered structure will also increase accordingly, which means that the existing sintered body cannot be applied to the extremely thin vapor chamber structure. In addition, the existing vapor chambers using sintered bodies cannot be bent (bent) or flexed. After the vapor chambers are bent (bent), the sintered bodies in the chamber will be damaged and fall off and collapse, resulting in the plate The capillary structure on the body is disabled and loses the effect of temperature uniformity and heat dissipation. Therefore, in order to solve the above-mentioned problem that the existing sintered body cannot be used in the ultra-thin vapor chamber structure, the industry has turned to the groove with poor capillary force in the capillary structure, or the capillary force in the capillary structure is inferior to that of the sintered powder. Try to use the mesh body or woven mesh. Although the mesh body or woven mesh is convenient to set up and can be used for the parts that need to be bent, the mesh body or woven mesh must be installed in the temperature equalizing plate. The working fluid can be diffused by capillary action in the mesh body or woven mesh, but when the mesh body or woven mesh is not completely attached or laid on the surface of the shell or tube wall When the gap is formed, the gap can not provide the capillary force to supply the working liquid to diffuse the vapor-liquid circulation. In addition, the mesh body and the woven mesh are mainly composed of a plurality of filamentous monomers intertwined or woven, because each single The wire diameter and thickness of a filamentary monomer (such as a filamentary metal wire) cannot be changed due to the limitation of current processing machinery and materials, so the mesh body composed of all the filamentous monomers intertwined (or woven) The overall thickness of the mesh (or the woven mesh) cannot be reduced any more, so the existing mesh body and the woven mesh cannot be applied to the ultra-thin vapor chamber structure. Then the next step is to use the groove with poor capillary force, and the groove is mainly formed on the shell wall of the vapor chamber by machining, etc., so as to be used as a capillary structure, but it extends Another problem is that the opening of grooves in the temperature chamber will inevitably lead to the thinning of the shell wall of the temperature chamber, which will not only affect the overall structural strength, but also cause the shell wall to rupture, which will lead to internal damage. The working liquid leaks out and loses the heat dissipation effect of temperature uniformity. The setting of the groove will make the shell wall thinner and reduce the overall structural strength. If the uniform temperature plate is bent and rolled again, it is easy to set the groove Because of these considerations, the industry is afraid to set up grooves as capillary structures in heat pipes or vapor chambers with extremely thin shell walls. Therefore, with the ultra-thin configuration, the overall thickness of the vapor chamber is subject to considerable restrictions. Not only is the thickness of the tube wall conforming to the ultra-thin size limitation, but also its internal airtight chamber and internal capillary structure must be further reduced. Therefore, It can be seen from the use and arrangement of the above capillary structures that the selection and manufacture of capillary structures become a difficult problem when ultra-thin designs are carried out. Therefore, how to achieve ultra-thin, and at the same time have both capillary force and the characteristics of bending or flexing, is actually the most important improvement goal for those skilled in the art.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a thin two-phase flow device that can achieve thinning and can be bent. In order to achieve the above object, the present invention provides a thin two-phase flow device, which comprises: a first plate body, a second plate body, and a polymer layer; The first plate body has a first side surface, a second side surface and a plurality of convex bodies, and the convex bodies are protruded on the first side surface; one side of the second plate body has a nanocapillary layer, and the The nanocapillary layer is formed by mixing a plurality of powders with different particle sizes and is attached to the side surface of the second plate body opposite to the first side surface of the first plate body; the polymer layer is selected from the first and second plates mentioned above. Any one of the body is combined, and the total thickness of the first and second plate bodies and the polymer layer is equal to or less than 0.25MM. The invention can realize the thinning and bending of the heat dissipation device, while maintaining the capillary force of the internal capillary structure, thereby solving the lack of thinning of the conventional heat dissipation device.

The above-mentioned objects of the present invention and their structural and functional characteristics will be described with reference to the preferred embodiments of the accompanying drawings. Please refer to Figures 1 and 2, which are three-dimensional exploded and combined cross-sectional views of the first embodiment of the thin two-phase flow device of the present invention. The thin two-phase flow device 1 includes: a first plate body 11, a first Two plate bodies 12, a polymer layer 13; The first plate body 11 has a first side surface 111, a second side surface 112 and a plurality of protrusions 113, the protrusions 113 are protruded from the first side surface 111; one side of the second plate body 12 has a The nanocapillary layer 14 is formed by mixing a plurality of powders with different particle sizes, and is adsorbed and attached to a side of the second plate 12 opposite to the first side 111 of the first plate 11 . On the side surface, the first and second plates 11 and 12 overlap each other to define an airtight chamber 15 , and the nanocapillary layer 14 is disposed in the airtight chamber 15 and inside the airtight chamber 15 Filled with a working liquid (not shown). The polymer layer 13 is selected to be combined with any one of the first and second plate bodies 11 and 12, and the total thickness of the thin two-phase flow device is equal to or less than 0.25MM. The polymer layer 13 is selected to be combined with the surface of any one of the first and second plate bodies 11 and 12 by coating, printing or bonding. The heat dissipating device in this embodiment is implemented with a temperature equalizing plate as an illustration, but it is not limited, and can also be a thin plate heat pipe. The first and second plate bodies 11 and 12 in this embodiment are made of copper, aluminum, Either stainless steel or commercial pure titanium, and the thicknesses of the first and second plate bodies 11 and 12 are respectively about 0.1MM. The nanocapillary layer 14 has a plurality of first powders 141 and a plurality of second powders 142, the particle size of the first powder 141 is larger than the particle size of the second powder 142, and the first and second powders 141 and 142 are mixed And formed on the side of the second plate body 12 opposite to the first plate body 11 by sintering, bonding, spraying, printing, etc., or the nano-capillary layer 14 passes through a colloid (liquid or solid) The powders of different sizes are adhered and arranged on the surface of the second plate body 12 , when the liquid colloid is air-dried, a plurality of powders of different size particles will be attached to the surface of the second plate body 12 to form the nanocapillary Layer 14. Please refer to FIG. 3, which is a cross-sectional view of the second embodiment of the thin two-phase flow device of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the first plate body 11 is composed of a plurality of plate bodies 11a superimposed on each other, and the plate bodies 11a sandwich the polymer layer 13 to form the first plate The body 11 means that the first plate body 11 is formed by overlapping a plurality of plate bodies 11a, and the polymer layer 13 is arranged between the plate bodies 11a, and the polymer layer 13 is supported by the plate bodies. 11a is sandwiched, stacked and closed to form the first plate body 11. On the contrary, the second plate body 12 has the same structure as the first plate body 11. The polymer layer 13 is disposed on the second plate body 11. The insides of the plate bodies 12 are superimposed and integrated with each other. This embodiment is implemented as an illustration of the former, but it is not limited thereto. Please refer to FIG. 4 , which is a cross-sectional view of the third embodiment of the thin two-phase flow device of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that the protruding bodies 113 are recessed from the second side surface 112 to the first side surface 111 and then protrude out of the first side surface 111 , and are selected to contact or not contact the first side surface 111 . Nanocapillary layer 14 . Please refer to FIG. 5, which is a cross-sectional view of the fourth embodiment of the thin two-phase flow device of the present invention. As shown in the figure, the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The difference between this embodiment and the aforementioned first embodiment is that this embodiment further has a hydrophilic layer 2 , and the hydrophilic layer 2 is selectively disposed on the first side surface 111 of the aforementioned first plate body 11 or the second plate body 12 Opposite to one side of the first side surface 111 of the first plate body 11 or the surface of the nanocapillary layer 14 . Of course, the above-mentioned first side 111 of the first board 11 and the side of the second board 12 opposite to the first side 111 of the first board 11 and the surface of the nanocapillary layer 14 can also be provided at the same time. The hydrophilic layer 2, in this embodiment, is set by selecting any one of the positions, but it is not limited thereto. The main purpose of this case is to provide a thin two-phase flow device, especially a vapor chamber or a flat heat pipe. Since various capillary structures applied in the prior art are limited when applied in thinning, it is impossible to smoothly make the vapor chamber and the flat heat pipe. The flat heat pipe is successfully thinned, so this case improves the lack of capillary structure that cannot be thinned in the thinning process of the vaporizing plate and the heat pipe. Printing, electrostatic adsorption, etc. are arranged on the thin plate, so that in addition to reducing the thickness of the capillary structure to achieve the effect of thinning, the capillary force is still maintained and the thin two-phase flow device has the effect of being bendable, so The porous powder capillary structure with the best retention of capillary force is realized. At the same time, with the design of the polymer layer 13, the effect of thinning the capillary structure can be achieved, and the capillary force of the capillary structure will not be damaged after being bent. The characteristic of bending and bending, so that the overall thickness of the heat dissipation device can be greatly reduced, and even the overall thickness can reach equal to or less than 0.25MM. The present invention improves the traditional capillary structure that cannot be thinned. Through improved technical means and structure Further achieve a structure that cannot be manufactured by conventional knowledge.

11: The first board body 11a: Board body 111: The first side 112: Second side 113: Convex 12: Second board body 13: Polymer layer 14: Nanocapillary layer 141: First Powder 142: Second Powder 15: Airtight Chamber 2: Hydrophilic layer

Figure 1 is an exploded perspective view of the first embodiment of the thin two-phase flow device of the present invention; Fig. 2 is a combined cross-sectional view of the first embodiment of the thin two-phase flow device of the present invention; Figure 3 is a cross-sectional view of the second embodiment of the thin two-phase flow device of the present invention; FIG. 4 is a cross-sectional view of the third embodiment of the thin two-phase flow device of the present invention; FIG. 5 is a cross-sectional view of the fourth embodiment of the thin two-phase flow device of the present invention.

11: The first board body

113: Convex

12: Second board body

13: Polymer layer

14: Nanocapillary layer

141: First Powder

142: Second Powder

15: Airtight Chamber

Claims (8)

A thin two-phase flow device, comprising: a first plate body with a first side surface, a second side surface and a plurality of protrusions, the protrusions are protruded on the first side surface; A second plate with a nanocapillary layer on one side, the nanocapillary layer is formed by mixing a plurality of powders with different particle sizes and attached to the first side of the second plate opposite to the first plate one side surface; A polymer layer is selected to be combined with any one of the first and second plate bodies, and the total thickness of the thin two-phase flow device is equal to or less than 0.25MM. The thin two-phase flow device according to claim 1, wherein the first plate system is composed of a plurality of plates superimposed on each other, and the plates sandwich the polymer layer to form the first plate. The thin two-phase flow device according to claim 1, wherein the second plate system is composed of a plurality of plates superimposed on each other, and the plates sandwich the polymer layer to form the second plate. The thin two-phase flow device according to claim 1, wherein the nanocapillary layer has a plurality of first powders and a plurality of second powders, and the particle size of the first powder is larger than the particle size of the second powder, The first and second powders are mixed and formed on the side of the second plate body opposite to the first plate body by means of sintering, bonding, spraying, printing and the like. The thin two-phase flow device according to claim 1, wherein the polymer layer is selectively formed on the surface of any one of the first and second plates by means of coating, printing and bonding. The thin two-phase flow device according to claim 1, wherein the convex systems are recessed from the second side surface to the first side surface and then protrude out of the first side surface. The thin two-phase flow device according to claim 1, further comprising a hydrophilic layer, and the hydrophilic layer is selectively disposed on the first side of the first plate body or the second plate body is opposite to the first plate One side of the first side of the body or the surface of the nanocapillary layer. The thin two-phase flow device according to claim 1, wherein the first and second plates are superimposed on each other to define an airtight chamber, and the nanocapillary layer is disposed in the airtight chamber, and the The airtight chamber is filled with a working liquid.

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