TW202223052A - Polymerizable composition, cured product, and method for producing cured product - Google Patents

Polymerizable composition, cured product, and method for producing cured product Download PDF

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TW202223052A
TW202223052A TW110139872A TW110139872A TW202223052A TW 202223052 A TW202223052 A TW 202223052A TW 110139872 A TW110139872 A TW 110139872A TW 110139872 A TW110139872 A TW 110139872A TW 202223052 A TW202223052 A TW 202223052A
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polymerizable composition
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大野泰延
遠藤剛
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日商艾迪科股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes

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Abstract

The purpose of the present invention is to provide a polymerizable composition from which a cured product, that is a thick film having excellent positional precision, can be obtained in a short time. The present invention is a polymerizable composition which contains a cationic photopolymerization initiator, a cationic thermal polymerization initiator and a cationic polymerizable compound. The content of the cationic thermal polymerization initiator is 50-1000 parts by mass relative to 100 parts by mass of the cationic photopolymerization initiator. The cationic photopolymerization initiator preferably contains an aromatic sulfonium salt, and the cationic thermal polymerization initiator preferably contains a benzylphenyl sulfonium salt.

Description

聚合性組合物、硬化物及硬化物之製造方法Polymerizable composition, cured product, and method for producing the cured product

本發明係關於一種聚合性組合物,其含有陽離子光聚合起始劑、陽離子熱聚合起始劑、及陽離子聚合性化合物。The present invention relates to a polymerizable composition containing a cationic photopolymerization initiator, a cationic thermal polymerization initiator, and a cationically polymerizable compound.

陽離子硬化性組合物被用於墨水、塗料、各種塗佈劑、接著劑、光學構件等領域。關於此種硬化性組合物之改良,已有各種報告。Cationic curable compositions are used in fields such as inks, paints, various coating agents, adhesives, and optical members. Various reports have been made regarding the improvement of such curable compositions.

於電子基板中,作為將半導體、光學零件等零件接著於絕緣基板上之方法,有時會使用接著劑。由於近年來電子基板之高積體化,對零件之接著要求較高之位置精度。專利文獻1及2中揭示有如下方法:使用接著劑,藉由紫外線照射步驟進行暫時固定,然後藉由加熱步驟進行正式固定。又,專利文獻1及2中揭示有以環氧樹脂作為主原料之組合物作為用於光學零件之接著之接著劑。 先前技術文獻  專利文獻 In electronic substrates, an adhesive may be used as a method of bonding components such as semiconductors and optical components to an insulating substrate. Due to the high integration of electronic substrates in recent years, high positional accuracy is required for the attachment of components. Patent Documents 1 and 2 disclose a method of temporarily fixing by an ultraviolet irradiation step using an adhesive, and then performing main fixing by a heating step. Moreover, in patent documents 1 and 2, the composition which uses an epoxy resin as a main raw material is disclosed as the adhesive agent used for the adhesion|attachment of an optical component. Prior Art Documents Patent Documents

專利文獻1:日本專利特開2019-019286號公報 專利文獻2:日本專利特開2019-073574號公報 Patent Document 1: Japanese Patent Laid-Open No. 2019-019286 Patent Document 2: Japanese Patent Laid-Open No. 2019-073574

對電子零件等構件固定用接著劑要求於短時間內提供相對較厚且位置精度優異之硬化物,但先前之陽離子硬化性組合物存在硬化性不足之情形。An adhesive for fixing components such as electronic parts is required to provide a relatively thick cured product with excellent positional accuracy in a short period of time, but the conventional cationic curable compositions have insufficient curability.

因此,本發明之目的在於提供一種可於短時間內獲得位置精度優異、具有30 μm以上之厚度(以下,有時會稱為「厚膜」)之硬化物的聚合性組合物。Therefore, an object of the present invention is to provide a polymerizable composition that can obtain a cured product having a thickness of 30 μm or more (hereinafter, sometimes referred to as a “thick film”), which is excellent in positional accuracy in a short period of time.

本發明人等進行了銳意研究,結果得知,藉由併用陽離子光聚合起始劑與陽離子熱聚合起始劑,且較佳為增加陽離子熱聚合起始劑相對於陽離子光聚合起始劑之使用量,使得僅藉由光照射便可獲得厚度為30 μm以上之硬化物,從而完成了本發明。The inventors of the present invention have conducted intensive research, and as a result found that by using a cationic photopolymerization initiator and a cationic thermal polymerization initiator together, it is preferable to increase the ratio of the cationic thermal polymerization initiator to the cationic photopolymerization initiator. The amount used is such that a cured product having a thickness of 30 μm or more can be obtained only by light irradiation, thereby completing the present invention.

即,本發明係一種聚合性組合物,其係含有陽離子光聚合起始劑、陽離子熱聚合起始劑、及陽離子聚合性化合物者,陽離子熱聚合起始劑之含量相對於陽離子光聚合起始劑100質量份為50~1000質量份。That is, the present invention is a polymerizable composition comprising a cationic photopolymerization initiator, a cationic thermal polymerization initiator, and a cationic polymerizable compound, and the content of the cationic thermal polymerization initiator is relative to the cationic photopolymerization initiator. 100 parts by mass of the agent is 50 to 1000 parts by mass.

以下,基於較佳之實施方式對本發明之聚合性組合物進行說明。 本發明之聚合性組合物含有陽離子光聚合起始劑、陽離子熱聚合起始劑、及陽離子聚合性化合物。 Hereinafter, the polymerizable composition of the present invention will be described based on a preferred embodiment. The polymerizable composition of the present invention contains a cationic photopolymerization initiator, a cationic thermal polymerization initiator, and a cationic polymerizable compound.

本發明之聚合性組合物中使用之陽離子光聚合起始劑係可藉由光照射而產生陽離子種或路易斯酸之化合物,其無論係何種化合物均無妨,就硬化性優異之方面而言,較佳為藉由紫外線之照射而釋出路易斯酸之鎓鹽或其衍生物。作為此種化合物之具有代表性者,可例舉由通式[A] m+[B] m-表示之陽離子與陰離子之鹽。 The cationic photopolymerization initiator used in the polymerizable composition of the present invention is a compound that can generate a cationic species or a Lewis acid by light irradiation. It does not matter what kind of compound it is. In terms of excellent curability, Preferably, an onium salt of a Lewis acid or a derivative thereof is released by irradiation with ultraviolet rays. Typical examples of such compounds include salts of cations and anions represented by the general formula [A] m+ [B] m- .

此處,作為陽離子[A] m+,就硬化性優異之方面而言,較佳為鎓離子,其結構例如可由通式[G aQ] m+表示。 式中,G為碳原子數為1~60且可包含數個除碳原子以外之原子之有機基。a為1~5之整數。a個G各自獨立,可相同亦可不同。又,就硬化性優異之方面而言,較佳為至少一個G為具有芳香環之有機基。Q係選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、及N=N所組成之群中之原子或原子團。又,於將Q之原子價設為q時,m=a-q之關係必須成立(其中,N=N被視為原子價為0)。 Here, as the cation [A] m+ , an onium ion is preferable in terms of excellent curability, and its structure can be represented by, for example, the general formula [G a Q] m+ . In the formula, G is an organic group having 1 to 60 carbon atoms and may contain several atoms other than carbon atoms. a is an integer of 1-5. a G is independent of each other and may be the same or different. Moreover, it is preferable that at least one G is an organic group which has an aromatic ring from the point which is excellent in hardenability. Q is an atom or atomic group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. Furthermore, when the valence of Q is set to q, the relationship of m=a-q must be established (wherein, N=N is regarded as 0 as the valence).

又,陰離子[B] m-並無特別限定,就硬化性優異之方面而言,較佳為鹵化物錯合物,其結構例如可由通式[LX b] m-表示。 式中,L為作為鹵化物錯合物之中心原子之金屬或半金屬(Metalloid),例如為B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、或Co等。X為氟、氯、溴、或碘等鹵素原子。b為3~7之整數。又,於將L之原子價設為p時,m=b-p之關係必須成立。 In addition, the anion [B] m- is not particularly limited, but is preferably a halide complex in terms of excellent curability, and its structure can be represented, for example, by the general formula [LX b ] m- . In the formula, L is a metal or semi-metal (Metalloid) as the central atom of the halide complex, such as B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc , V, Cr, Mn, or Co, etc. X is a halogen atom such as fluorine, chlorine, bromine, or iodine. b is an integer of 3-7. Furthermore, when the valence of L is set to p, the relationship of m=b-p must be established.

作為上述通式之陰離子[LX b] m-之具體例,可例舉:過氯酸根離子(ClO 4 -)、四氟硼酸根離子(BF 4 -)、六氟磷酸根離子(PF 6 -)、六氟銻酸根(SbF 6 -)、六氟砷酸根(AsF 6 -)、及六氯銻酸根(SbCl 6 -)等無機離子;氟磺酸根離子(FSO 3 -)、甲苯磺酸根陰離子、三硝基苯磺酸根離子、樟腦磺酸根離子、九氟丁磺酸根離子、及十六氟辛磺酸根離子等磺酸根離子;四芳基硼酸根離子及四(五氟苯基)硼酸根離子等硼酸根離子;甲烷羧酸根離子、乙烷羧酸根離子、丙烷羧酸根離子、丁烷羧酸根離子、辛烷羧酸根離子、三氟甲烷羧酸根離子、苯羧酸根離子、及對甲苯羧酸根離子等羧酸根離子;三氟甲基亞硫酸根離子(CF 3SO 3 -)、甲基硫酸根離子(CH 3OSO 3 -)、雙(三氟甲磺醯基)醯亞胺離子、及三(三氟甲磺醯基)甲基化物離子等。 Specific examples of the anion [LX b ] m- of the above general formula include perchlorate ion (ClO 4 - ), tetrafluoroborate ion (BF 4 - ), hexafluorophosphate ion (PF 6 - ) ), hexafluoroantimonate (SbF 6 - ), hexafluoroarsenate (AsF 6 - ), and hexachloroantimonate (SbCl 6 - ) and other inorganic ions; fluorosulfonate ion (FSO 3 - ), tosylate anion , trinitrobenzenesulfonate ions, camphorsulfonate ions, nonafluorobutanesulfonate ions, and hexafluorooctanesulfonate ions and other sulfonate ions; tetraarylborate ions and tetrakis (pentafluorophenyl)borate ions Borate ions such as ions; methane carboxylate ions, ethane carboxylate ions, propane carboxylate ions, butane carboxylate ions, octane carboxylate ions, trifluoromethane carboxylate ions, benzene carboxylate ions, and p-toluene carboxylate ions Carboxylate ions such as acid ions; trifluoromethyl sulfite ions (CF 3 SO 3 - ), methyl sulfate ions (CH 3 OSO 3 - ), bis(trifluoromethanesulfonyl)imide ions, And tris (trifluoromethanesulfonyl) methide ions and so on.

於本發明中,使用此種鎓鹽中之下述(a)~(c)之芳香族鎓鹽尤其有效。該等中,可單獨使用其一種,或者可將兩種以上混合使用。 (a)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等芳基重氮鎓鹽 (b)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-第三丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪四(五氟苯基)硼酸鹽等二芳基錪鹽 (c)包含由下述群I或群II表示之鋶陽離子與六氟銻離子、四(五氟苯基)硼酸根離子等之鋶鹽 In the present invention, it is particularly effective to use the aromatic onium salts (a) to (c) below among such onium salts. Among these, one kind of them may be used alone, or two or more kinds thereof may be used in combination. (a) Aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, and 4-methylphenyldiazonium hexafluorophosphate (b) Diphenyl iodonium hexafluoroantimonate, bis(4-methylphenyl) iodonium hexafluorophosphate, bis(4-tert-butylphenyl) iodonium hexafluorophosphate, tolyl cumene Diaryl iodonium salts such as tetrakis (pentafluorophenyl) borate (c) Perinium salts containing pericium cations represented by the following group I or group II, hexafluoroantimony ions, tetrakis(pentafluorophenyl)borate ions, and the like

[化1] <群I>

Figure 02_image001
[Chemical 1] <Group I>
Figure 02_image001

[化2] <群II>

Figure 02_image003
[Chemical 2] <Group II>
Figure 02_image003

又,作為其他較佳者,亦可例舉:(η5-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯]-鐵-六氟磷酸鹽等鐵-芳烴錯合物;三(乙醯丙酮)鋁、三(乙基丙酮乙酸)鋁、及三(水楊醛酸)鋁等鋁錯合物與三苯基矽烷醇等矽烷醇類之混合物等。Moreover, as other preferable ones, (η5-2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-n)-(1-methyl) ethyl)benzene]-iron-hexafluorophosphate and other iron-aromatic complexes; aluminum tris (acetone) aluminum, tris (ethyl acetone acetate) aluminum, and tris (salicylic acid) aluminum and other aluminum complexes Compounds and mixtures of silanols such as triphenylsilanol, etc.

該等中,較佳為芳香族錪鹽、芳香族鋶鹽、及鐵-芳烴錯合物,就所獲得之聚合性組合物之硬化性優異之方面而言,尤佳為由下述通式(1)表示之芳香族鋶鹽。Among these, aromatic iodonium salts, aromatic periconium salts, and iron-aromatic complexes are preferred, and in terms of the excellent sclerosing properties of the polymerizable composition obtained, those represented by the following general formula are particularly preferred (1) Aromatic permanium salts.

[化3]

Figure 02_image005
式中,R 1、R 2、R 3、R 4、R 5、R 6、R 7、R 8、R 9、及R 10分別獨立地表示氫原子、鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、或碳原子數為2~10之酯基,R 11、R 12、R 13、R 14、R 15、R 16、R 17、及R 18分別獨立地表示氫原子、鹵素原子、或碳原子數為1~10之烷基,Z表示氫原子、碳原子數為1~20之烴基,X 1 -表示一價陰離子。 [hua 3]
Figure 02_image005
In the formula, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 each independently represent a hydrogen atom, a halogen atom, and a carbon number of 1 to 10 alkyl group, alkoxy group having 1 to 10 carbon atoms, or ester group having 2 to 10 carbon atoms, R 11 , R 12 , R 13 , R 14 , R 15 , R 16 , R 17 , and R 18 each independently represents a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms, Z represents a hydrogen atom, a hydrocarbon group having 1 to 20 carbon atoms, and X 1 - represents a monovalent anion.

由上述通式(1)表示之芳香族鋶鹽之中,就聚合性組合物之硬化性優異之方面而言,進而較佳為Z為由下述通式(1a)表示之基。Among the aromatic perylene salts represented by the above-mentioned general formula (1), it is more preferable that Z is a group represented by the following general formula (1a) from the viewpoint of excellent curability of the polymerizable composition.

[化4]

Figure 02_image007
式中,R 19、R 20、R 21、R 22、及R 23分別獨立地表示氫原子、鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、或碳原子數為2~10之酯基,*表示鍵結鍵。 [hua 4]
Figure 02_image007
In the formula, R 19 , R 20 , R 21 , R 22 , and R 23 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms. , or an ester group having 2 to 10 carbon atoms, and * represents a bond.

作為上述通式(1)中之鹵素原子,可例舉:氟、氯、溴、及碘等。As a halogen atom in the said general formula (1), fluorine, chlorine, bromine, iodine, etc. are mentioned.

上述通式(1)中之碳原子數為1~10之烷基亦包含基中之氫原子經鹵素原子取代而成之基、以及基中之亞甲基經-O-、-S-、-CO-、-OCO-、-COO-、-C=C-、-NHCO-、-NH-、或-CONH-取代而成之基。作為碳原子數為1~10之烷基之具體例,可例舉:甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、第三丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫基乙基、三甲基矽烷基乙基、第三丁基二甲基矽烷氧基甲基、2-(三甲基矽烷基)乙氧基甲基、第三丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、第三丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥甲基、2-羥乙基、1-羥乙基、2-羥丙基、3-羥丙基、3-羥丁基、4-羥丁基、及1,2-二羥乙基等。The alkyl group having 1 to 10 carbon atoms in the above general formula (1) also includes a group in which the hydrogen atom in the group is substituted by a halogen atom, and the methylene group in the group is -O-, -S-, -CO-, -OCO-, -COO-, -C=C-, -NHCO-, -NH-, or -CONH- substituted group. Specific examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, isobutyl, pentyl yl, isopentyl, third pentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxy butyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoro Methyl, difluoromethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl , dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptafluorooctyl, methoxymethyl , 1,2-epoxyethyl, methoxyethyl, methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, tertiary butylthiomethyl , 4-pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1 -Methyl-1-methoxyethyl, ethyldithioethyl, trimethylsilylethyl, tert-butyldimethylsilyloxymethyl, 2-(trimethylsilyl) Ethoxymethyl, 3rd-butoxycarbonylmethyl, ethoxycarbonylmethyl, ethylcarbonylmethyl, 3rd-butoxycarbonylmethyl, acryloyloxyethyl, methacryloyloxy Ethyl, 2-methyl-2-adamantyloxycarbonylmethyl, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl , 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, and 1,2-dihydroxyethyl, etc.

作為上述通式(1)中之碳原子數為1~10之烷氧基,可例舉:甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、第二丁氧基、第三丁氧基、異丁氧基、戊氧基、異戊氧基、第三戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、及三氟甲氧基等。The alkoxy group having 1 to 10 carbon atoms in the general formula (1) may, for example, include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, and a second butoxy group. radical, tert-butoxy, isobutoxy, pentyloxy, isopentyloxy, tert-pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy, tetrahydrofuranoxy, tetrahydropyridine pyranoxy, 2-methoxyethoxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxyethoxyethoxy, Methoxyethoxyethoxyethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy and the like.

作為上述通式(1)中之碳原子數為2~10之酯基,可例舉:甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、第三丁基羰氧基、甲氧基乙醯氧基、及苯甲醯氧基等。Examples of the ester group having 2 to 10 carbon atoms in the general formula (1) include methoxycarbonyl, ethoxycarbonyl, isopropoxycarbonyl, phenoxycarbonyl, acetyloxy, Propionyloxy, Butyloxy, Chloroacetoxy, Dichloroacetoxy, Trichloroacetoxy, Trifluoroacetoxy, 3-butylcarbonyloxy, Methoxyacetoxy oxy, and benzyloxy, etc.

上述通式(1)中之碳原子數為1~20之烴基並無特別限定,只要其係包含碳原子及氫原子之碳原子數為1~20之基即可,可例舉:碳原子數為1~20之烷基、碳原子數為2~20之烯基、碳原子數為3~20之環烷基、碳原子數為4~20之環烷基烷基、碳原子數為6~20之芳基、及碳原子數為7~20之芳烷基等。又,上述通式(1)中之碳原子數為1~20之烴基亦包含基中之氫原子經鹵素原子取代而成之基、以及基中之亞甲基經-O-、-S-、-CO-、-OCO-、-COO-、-C=C-、-NHCO-、-NH-、或-CONH-取代而成之基。The hydrocarbon group having 1 to 20 carbon atoms in the general formula (1) is not particularly limited, as long as it is a group having 1 to 20 carbon atoms including carbon atoms and hydrogen atoms, for example: carbon atoms Alkyl having 1 to 20 carbon atoms, alkenyl having 2 to 20 carbon atoms, cycloalkyl having 3 to 20 carbon atoms, cycloalkylalkyl having 4 to 20 carbon atoms, An aryl group of 6 to 20, an aralkyl group of 7 to 20 carbon atoms, and the like. In addition, the hydrocarbon group having 1 to 20 carbon atoms in the general formula (1) also includes a group in which the hydrogen atom in the group is substituted by a halogen atom, and the methylene group in the group is replaced by -O-, -S- , -CO-, -OCO-, -COO-, -C=C-, -NHCO-, -NH-, or -CONH- substituted base.

作為上述碳原子數為1~20之烷基,例如可例舉:甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、庚基、異庚基、第三庚基、正辛基、異辛基、第三辛基、2-乙基己基、正壬基、正癸基、正十二烷基、正十八烷基、環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、及環癸基等直鏈、支鏈、及環狀之烷基等。Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, isopropyl, butyl, sec-butyl, tert-butyl, isobutyl, and pentyl. , isopentyl, third pentyl, hexyl, heptyl, isoheptyl, third heptyl, n-octyl, isooctyl, third octyl, 2-ethylhexyl, n-nonyl, n-decyl , n-dodecyl, n-octadecyl, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, and cyclodecyl straight chain, branched , and cyclic alkyl groups, etc.

作為上述碳原子數為2~20之烯基,例如可例舉:乙烯基、2-丙烯基、3-丁烯基、2-丁烯基、4-戊烯基、3-戊烯基、2-己烯基、3-己烯基、5-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基、4-癸烯基、3-十一碳烯基、4-十二碳烯基、3-環己烯基、2,5-環己二烯基-1-甲基、及4,8,12-十四碳三烯基烯丙基等直鏈及環狀之烯基等。Examples of the alkenyl group having 2 to 20 carbon atoms include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, 4- Decenyl, 3-undecenyl, 4-dodecenyl, 3-cyclohexenyl, 2,5-cyclohexadienyl-1-methyl, and 4,8,12-decenyl Linear and cyclic alkenyl such as tetracarbatrienyl allyl, etc.

上述碳原子數為3~20之環烷基係指具有3~20之碳原子之飽和單環式或飽和多環式烷基。例如可例舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基、環癸基、金剛烷基、十氫萘基、八氫并環戊二烯、雙環[1.1.1]戊基、及十四氫蒽基等。The above-mentioned cycloalkyl group having 3 to 20 carbon atoms refers to a saturated monocyclic or saturated polycyclic alkyl group having 3 to 20 carbon atoms. For example, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, adamantyl, decahydronaphthyl, octahydrocyclopentyl Diene, bicyclo[1.1.1]pentyl, and tetradecylhydroanthracenyl, etc.

上述碳原子數為4~20之環烷基烷基係指烷基之氫原子經環烷基取代而成之具有4~20個碳原子之基。例如可例舉:環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基、環癸基甲基、2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、2-環壬基乙基、2-環癸基乙基、3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、3-環辛基丙基、3-環壬基丙基、3-環癸基丙基、4-環丁基丁基、4-環戊基丁基、4-環己基丁基、4-環庚基丁基、4-環辛基丁基、4-環壬基丁基、4-環癸基丁基、3-3-金剛烷基丙基、及十氫萘基丙基等。The above-mentioned cycloalkylalkyl group having 4 to 20 carbon atoms refers to a group having 4 to 20 carbon atoms in which the hydrogen atom of the alkyl group is substituted by a cycloalkyl group. For example, cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, cycloheptylmethyl, cyclooctylmethyl, cyclononylmethyl, cyclodecylmethyl, 2-cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 2-cyclononylethyl, 2-cyclohexylethyl Decylethyl, 3-cyclobutylpropyl, 3-cyclopentylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-cyclononylpropyl , 3-cyclodecylpropyl, 4-cyclobutylbutyl, 4-cyclopentylbutyl, 4-cyclohexylbutyl, 4-cycloheptylbutyl, 4-cyclooctylbutyl, 4 -Cyclononylbutyl, 4-cyclodecylbutyl, 3-3-adamantylpropyl, decalinylpropyl, etc.

作為上述碳原子數為6~20之芳基,例如可例舉:苯基、甲苯基、二甲苯基、乙基苯基、聯苯基、萘基、蒽基、及菲基等、以及該等基中之氫原子經上述烷基、上述烯基、羧基、或鹵素原子等取代而成之基,例如:4-氯苯基、4-羧基苯基、4-乙烯基苯基、4-甲基苯基、及2,4,6-三甲基苯基等。Examples of the aryl group having 6 to 20 carbon atoms include a phenyl group, a tolyl group, a xylyl group, an ethylphenyl group, a biphenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, and the like, and the The hydrogen atom in the base is substituted by the above-mentioned alkyl group, the above-mentioned alkenyl group, carboxyl group, or halogen atom, etc., for example: 4-chlorophenyl, 4-carboxyphenyl, 4-vinylphenyl, 4- Methylphenyl, 2,4,6-trimethylphenyl, etc.

上述碳原子數為7~20之芳烷基係指烷基中之氫原子經芳基取代而成之具有7~20個碳原子之基。例如可例舉:苄基、α-甲基苄基、α,α-二甲基苄基、苯基乙基、及萘基丙基等。上述碳原子數為7~10之芳烷基係指烷基中之氫原子經芳基取代而成之具有7~10個碳原子之基,例如可例舉:苄基、α-甲基苄基、α,α-二甲基苄基、及苯基乙基等。The above-mentioned aralkyl group having 7 to 20 carbon atoms refers to a group having 7 to 20 carbon atoms in which the hydrogen atom in the alkyl group is substituted by an aryl group. For example, a benzyl group, an α-methylbenzyl group, an α,α-dimethylbenzyl group, a phenylethyl group, a naphthylpropyl group, and the like can be mentioned. The above-mentioned aralkyl group with 7 to 10 carbon atoms refers to a group with 7 to 10 carbon atoms formed by replacing the hydrogen atom in the alkyl group with an aryl group, for example, benzyl, α-methylbenzyl group, α,α-dimethylbenzyl, and phenylethyl, etc.

作為上述通式(1)中之由X 1 -表示之一價陰離子,可例舉上述作為陰離子[LX b] m-而例示之陰離子中之一價陰離子。 As the monovalent anion represented by X 1 - in the above general formula (1), the monovalent anion among the anions exemplified above as the anion [LX b ] m- can be exemplified.

由上述通式(1)表示之芳香族鋶鹽中,就所獲得之聚合性組合物之硬化性較高而言,較佳為R 1~R 23中之一個以上為鹵素原子之化合物,尤佳為R 1~R 10中之一個以上為鹵素原子,尤其是氟原子之化合物。就化合物之穩定性較高、所獲得之聚合性組合物之硬化性較高而言,較佳為R 3或R 8為鹵素原子,較佳為R 3及R 8兩者均為鹵素原子,尤其是氟原子。進而,亦較佳為R 15~R 18中之一個以上為鹵素原子,尤其是氯原子。 Among the aromatic perylene salts represented by the above-mentioned general formula (1), the compounds in which one or more of R 1 to R 23 are halogen atoms are preferred in view of the high curability of the polymerizable composition to be obtained, especially A compound in which one or more of R 1 to R 10 is a halogen atom, especially a fluorine atom, is preferable. In terms of higher stability of the compound and higher curability of the polymerizable composition obtained, preferably R 3 or R 8 is a halogen atom, preferably both R 3 and R 8 are halogen atoms, Especially fluorine atoms. Furthermore, it is also preferable that one or more of R 15 to R 18 is a halogen atom, especially a chlorine atom.

作為構成由上述通式(1)表示之芳香族鋶鹽之由X 1 -表示之一價陰離子,較佳為過氯酸根離子(ClO 4 -)、四氟硼酸根離子(BF 4 -)、六氟磷酸根離子(PF 6 -)、六氟銻酸根(SbF 6 -)、六氟砷酸根(AsF 6 -)、及六氯銻酸根(SbCl 6 -)等無機離子;四芳基硼酸根離子及四(五氟苯基)硼酸根離子等硼酸根離子;三(三氟甲磺醯基)甲基化物離子;三氟化三(全氟烷基)膦陰離子,就所獲得之聚合性組合物之硬化性良好而言,尤佳為六氟磷酸根離子(PF 6 -)及六氟銻酸根(SbF 6 -)。 As the monovalent anion represented by X 1 - constituting the aromatic perylene salt represented by the above general formula (1), perchlorate ion (ClO 4 - ), tetrafluoroborate ion (BF 4 - ), Inorganic ions such as hexafluorophosphate (PF 6 - ), hexafluoroantimonate (SbF 6 - ), hexafluoroarsenate (AsF 6 - ), and hexachloroantimonate (SbCl 6 - ); tetraarylborates ions and borate ions such as tetrakis(pentafluorophenyl)borate ions; tris(trifluoromethanesulfonyl) methide ions; tris(perfluoroalkyl) phosphine trifluoride anions. Since the curability of the composition is good, hexafluorophosphate ion (PF 6 - ) and hexafluoroantimonate (SbF 6 - ) are particularly preferred.

作為陽離子光聚合起始劑,亦可使用市售品,例如可例舉:Cyracure UVI-6970、Cyracure UVI-6974、Cyracure UVI-6990、Cyracure UVI-950(以上為Union Carbide公司製造)、Irgacure 261、CG-24-61(以上為BASF公司製造)、DAICATII(Daicel公司製造)、UVAC1591(DAICEL-ALLNEX公司製造)、CI-2481、CI-2734、CI-2823、CI-2758(以上為日本曹達公司製造)、FFC509(3M公司製造)、BBI-102、BBI-101、BBI-103、MPI-103、TPS-103、MDS-103、DTS-103、NAT-103、NDS-103(以上為日本綠化學公司製造)等。As the cationic photopolymerization initiator, commercially available products can also be used, for example, Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (the above are manufactured by Union Carbide), Irgacure 261 , CG-24-61 (made by BASF company above), DAICATII (made by Daicel company), UVAC1591 (made by DAICEL-ALLNEX company), CI-2481, CI-2734, CI-2823, CI-2758 (above are made by Japan Cao Da Company), FFC509 (3M Company), BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, NDS-103 (the above are Japanese Green Chemical Co., Ltd.), etc.

陽離子光聚合起始劑之含量並無特別限制,相對於陽離子聚合性化合物100質量份較佳為0.01~10質量份,更佳為0.1~5.0質量份,尤佳為0.5~3.0質量份。於陽離子光聚合起始劑之含量處於上述範圍內之情形時,所獲得之聚合性組合物之硬化性優異,因此較佳。陽離子光聚合起始劑可單獨使用一種,亦可將兩種以上混合使用。於將兩種以上混合使用之情形時,上述含量係指複數種陽離子光聚合起始劑之合計之含量。The content of the cationic photopolymerization initiator is not particularly limited, but is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 5.0 parts by mass, and particularly preferably 0.5 to 3.0 parts by mass relative to 100 parts by mass of the cationically polymerizable compound. When the content of the cationic photopolymerization initiator is within the above-mentioned range, the sclerosing property of the obtained polymerizable composition is excellent, which is preferable. The cationic photopolymerization initiator may be used alone or in combination of two or more. When two or more kinds are used in combination, the above-mentioned content refers to the total content of a plurality of cationic photopolymerization initiators.

本發明之聚合性組合物中使用之陽離子熱聚合起始劑係可藉由加熱而產生陽離子種或路易斯酸之化合物,其無論係何種化合物均無妨,但歸類為上述陽離子光聚合起始劑之化合物除外。The cationic thermal polymerization initiator used in the polymerizable composition of the present invention is a compound that can generate cationic species or Lewis acid by heating, no matter what kind of compound it is, but it is classified as the above-mentioned cationic photopolymerization initiator Except for the compounds of the drug.

作為陽離子熱聚合起始劑,可例舉:鋶鹽、錪鹽、重氮鎓鹽、鏻鹽、硒鹽、氧鎓鹽、銨鹽、噻吩鎓鹽、四氫噻吩鎓鹽、苄基銨鹽、吡啶鎓鹽、及𨥙鹽等鹽;萘甲醯亞胺磺酸鹽及鄰苯二甲醯亞胺磺酸鹽等醯亞胺磺酸鹽;二伸乙基三胺、三伸乙基三胺、及四伸乙基五胺等多烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、及異佛爾酮二胺等脂環式多胺類;間苯二甲胺、二胺基二苯甲烷、及二胺基二苯基碸等芳香族多胺類;藉由利用常規方法使上述多胺類與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、及雙酚F-二縮水甘油醚等縮水甘油醚類或羧酸之縮水甘油酯類等各種環氧樹脂進行反應而製造之聚環氧加成改性物;藉由利用常規方法使上述有機多胺類與鄰苯二甲酸、間苯二甲酸、及二聚酸等羧酸類進行反應而製造之醯胺化改性物;藉由利用常規方法使上述多胺類、甲醛等醛類、與苯酚、甲酚、二甲苯酚、第三丁基苯酚、及間苯二酚等在核中具有至少一個醛化反應性部位之酚類進行反應而製造之曼尼希改性物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、及二聚酸等脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、及萘二羧酸等芳香族二羧酸類;環己烷二羧酸等脂環式二羧酸類;偏苯三甲酸、1,3,5-苯三甲酸、及蓖麻油脂肪酸之三聚物等三羧酸類;均苯四甲酸等四羧酸類等)之酸酐;安息香甲苯磺酸酯、對硝基苄基-9,10-乙氧基蒽-2-磺酸酯、2-硝基苄基甲苯磺酸酯、2,6-二硝基苄基甲苯磺酸酯、及2,4-二硝基苄基甲苯磺酸酯等磺酸酯;雙氰胺、咪唑類、羧酸酯、胺醯亞胺、及鹵素化合物等,該等可使用一種或將兩種以上混合使用。As cationic thermal polymerization initiators, pernium salts, iodonium salts, diazonium salts, phosphonium salts, selenium salts, oxonium salts, ammonium salts, thiophenium salts, tetrahydrothiophenium salts, benzyl ammonium salts may, for example, be mentioned. , pyridinium salts, and salts such as oxalic acid salts; imide sulfonates such as naphthyl imide sulfonates and phthalimine sulfonates; diethylenetriamine, triethylenetriamine Amines, polyalkyl polyamines such as tetraethylene pentamine; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, and isophor Alicyclic polyamines such as ketone diamine; aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane, and diaminodiphenylene; by using conventional methods to make the above-mentioned polyamines Used with various epoxy resins such as glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, and bisphenol F-diglycidyl ether, or glycidyl esters of carboxylic acids Polyepoxy addition modification products produced by reaction; amidation produced by reacting the above-mentioned organic polyamines with carboxylic acids such as phthalic acid, isophthalic acid, and dimer acid by conventional methods Modified product; the above-mentioned polyamines, aldehydes such as formaldehyde, and phenol, cresol, xylenol, tert-butylphenol, and resorcinol, etc., have at least one hydroformylation in the core by conventional methods Mannich-modified products produced by reacting phenols at reactive sites; polycarboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid) , sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylglutaric acid, 2-methylsuberic acid, Aliphatic dicarboxylic acids such as 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimer acid, and dimer acid; phthalic acid, terephthalic acid, isophthalic acid Aromatic dicarboxylic acids such as dicarboxylic acid and naphthalene dicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexane dicarboxylic acid; trimellitic acid, 1,3,5-benzenetricarboxylic acid, and castor oil fatty acid 3 tricarboxylic acids such as polymers; acid anhydrides of tetracarboxylic acids such as pyromellitic acid, etc.); benzoin tosylate, p-nitrobenzyl-9,10-ethoxyanthracene-2-sulfonate, 2-nitrobenzyl Sulfonates such as benzyl benzyl tosylate, 2,6-dinitrobenzyl tosylate, and 2,4-dinitrobenzyl tosylate; dicyandiamide, imidazoles, carboxylic acids Esters, amide imides, halogen compounds, and the like may be used alone or in combination of two or more.

作為陽離子熱聚合起始劑,就所獲得之聚合性組合物之硬化性良好之方面而言,較佳為鋶鹽。尤其是單苯基鋶鹽由於容易工業上獲得而較佳,作為該單苯基鋶鹽,可例舉:苄基-對羥基苯基甲基鋶鹽、對羥基苯基二甲基鋶鹽、對乙醯氧基苯基二甲基鋶鹽、苄基-對羥基苯基甲基鋶鹽、及苄基苯基鋶鹽等。As a cationic thermal polymerization initiator, a periconium salt is preferable in that the sclerosing property of the polymerizable composition obtained is good. In particular, monophenyl perylene salts are preferable because they are easy to obtain industrially, and examples of the monophenyl perylene salts include benzyl-p-hydroxyphenylmethyl perylene salts, p-hydroxyphenyldimethyl perylene salts, p-Acetyloxyphenyl dimethyl perionate salt, benzyl-p-hydroxyphenyl methyl perionate salt, and benzyl phenyl pernium salt, etc.

其中,就所獲得之聚合性組合物之深部硬化性優異而言,較佳為苄基苯基鋶鹽,尤佳為由下述通式(2)表示之苄基苯基鋶鹽。Among them, since the polymerizable composition obtained is excellent in deep hardening properties, a benzyl phenyl periconium salt is preferable, and a benzyl phenyl periconium salt represented by the following general formula (2) is particularly preferable.

[化5]

Figure 02_image009
式中,R 31表示氫原子、碳原子數為2~10之醯基、或碳原子數為1~10之烷基,R 32、R 33、R 35、R 36、R 37、R 38、R 39、R 40、及R 41分別獨立地表示氫原子、鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、或碳原子數為2~10之酯基,R 32與R 33、R 35與R 36、R 36與R 37、R 37與R 38、R 38與R 39、及R 40與R 41可彼此鍵結,形成碳原子數為3~10之環,R 34表示碳原子數為1~10之烷基或碳原子數為6~20之含芳香環之基,X 2 -表示一價陰離子。 [hua 5]
Figure 02_image009
In the formula, R 31 represents a hydrogen atom, an acyl group having 2 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms, and R 32 , R 33 , R 35 , R 36 , R 37 , R 38 , R 39 , R 40 , and R 41 each independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or an alkoxy group having 2 to 10 carbon atoms. In the ester group, R 32 and R 33 , R 35 and R 36 , R 36 and R 37 , R 37 and R 38 , R 38 and R 39 , and R 40 and R 41 can be bonded to each other to form a carbon number of A ring of 3 to 10, R 34 represents an alkyl group with 1 to 10 carbon atoms or a group containing an aromatic ring with 6 to 20 carbon atoms, and X 2 - represents a monovalent anion.

上述通式(2)中之鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、及碳原子數為2~10之酯基與上述通式(1)中之鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、及碳原子數為2~10之酯基相同。The halogen atom, the alkyl group having 1 to 10 carbon atoms, the alkoxy group having 1 to 10 carbon atoms, and the ester group having 2 to 10 carbon atoms in the above general formula (2) are related to the above general formula ( In 1), the halogen atom, the alkyl group having 1 to 10 carbon atoms, the alkoxy group having 1 to 10 carbon atoms, and the ester group having 2 to 10 carbon atoms are the same.

作為上述通式(2)中之碳原子數為2~10之醯基,可例舉:乙醯基、丙醯基、異丙醯基、丁醯基、異丁醯基、苯甲醯基、氯乙醯基、二氯乙醯基、三氯乙醯基、三氟乙醯基、甲氧基乙醯基、及乙醯乙醯基等。Examples of the acyl group having 2 to 10 carbon atoms in the general formula (2) include acetyl, propionyl, isopropyl, butyl, isobutyl, benzyl, and chloroacetyl. group, dichloroacetyl group, trichloroacetyl group, trifluoroacetyl group, methoxyacetyl group, and acetoacetyl group and the like.

作為上述通式(2)中之碳原子數為6~20之含芳香環之基,可例舉碳原子數為6~20之芳基及碳原子數為7~20之芳烷基等。Examples of the aromatic ring-containing group having 6 to 20 carbon atoms in the general formula (2) include an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and the like.

作為碳原子數為6~20之芳基,例如可例舉:苯基、萘基、及蒽基等。 作為碳原子數為7~20之芳烷基,例如可例舉:苄基、茀基、茚基、及9-茀基甲基等。 As a C6-C20 aryl group, a phenyl group, a naphthyl group, an anthracenyl group, etc. are mentioned, for example. Examples of the aralkyl group having 7 to 20 carbon atoms include a benzyl group, an indenyl group, an indenyl group, and a 9-indenylmethyl group.

作為R 32與R 33、R 35與R 36、R 36與R 37、R 37與R 38、R 38與R 39、及R 40與R 41彼此鍵結而形成之碳原子數為3~10之環,可例舉:環丙烷環、環丁烷環、環戊烷環、環戊烯環、環戊二烯環、環己烷環、環己烯環、苯環、及環辛烷環等。 The number of carbon atoms formed as R 32 and R 33 , R 35 and R 36 , R 36 and R 37 , R 37 and R 38 , R 38 and R 39 , and R 40 and R 41 being bonded to each other is 3 to 10. The ring, for example: cyclopropane ring, cyclobutane ring, cyclopentane ring, cyclopentene ring, cyclopentadiene ring, cyclohexane ring, cyclohexene ring, benzene ring, and cyclooctane ring Wait.

就提高所獲得之聚合性組合物之深部硬化性而言,較佳為由上述通式(2)表示之苄基苯基鋶鹽中之R 31為氫原子或碳原子數為2~10之醯基之化合物,尤佳為R 31為醯基之化合物。 It is preferable that R 31 in the benzyl phenyl peronium salt represented by the general formula (2) is a hydrogen atom or a compound having 2 to 10 carbon atoms in order to improve the deep hardening property of the polymerizable composition obtained. The acyl group is particularly preferably a compound in which R 31 is an acyl group.

於R 32與R 33、R 35與R 36、R 36與R 37、R 37與R 38、R 38與R 39、及R 40與R 41並未彼此鍵結而形成環之情形時,R 32、R 33、R 35、R 36、R 37、R 38、R 39、R 40、及R 41較佳為氫原子。此種結構之化合物之化學性穩定,所獲得之聚合性組合物之深部硬化性亦優異,因此較佳。 When R 32 and R 33 , R 35 and R 36 , R 36 and R 37 , R 37 and R 38 , R 38 and R 39 , and R 40 and R 41 are not bonded to each other to form a ring, R 32 , R 33 , R 35 , R 36 , R 37 , R 38 , R 39 , R 40 , and R 41 are preferably hydrogen atoms. The compound of such a structure is chemically stable, and the polymerizable composition obtained is also excellent in deep hardening property, so it is preferable.

就提高所獲得之聚合性組合物之深部硬化性而言,較佳為R 32與R 33、R 35與R 36、R 37與R 38、R 38與R 39、及R 40與R 41中之一者以上彼此鍵結而形成苯環之化合物,尤佳為R 35與R 36、R 36與R 37、R 37與R 38、及R 38與R 39之任一者彼此鍵結而形成苯環之化合物。 Among R 32 and R 33 , R 35 and R 36 , R 37 and R 38 , R 38 and R 39 , and R 40 and R 41 , are preferred in terms of enhancing the deep sclerosis of the polymerizable composition obtained. A compound in which one or more are bonded to each other to form a benzene ring, particularly preferably one of R 35 and R 36 , R 36 and R 37 , R 37 and R 38 , and R 38 and R 39 are bonded to each other. Benzene ring compound.

作為由X 2 -表示之一價陰離子,較佳為過氯酸根離子(ClO 4 -)、四氟硼酸根離子(BF 4 -)、六氟磷酸根離子(PF 6 -)、六氟銻酸根(SbF 6 -)、六氟砷酸根(AsF 6 -)、及六氯銻酸根(SbCl 6 -)等無機離子,就聚合性組合物之硬化性良好而言,尤佳為六氟磷酸根離子(PF 6 -)及六氟銻酸根(SbF 6 -)。 The monovalent anion represented by X 2 - is preferably perchlorate ion (ClO 4 - ), tetrafluoroborate ion (BF 4 - ), hexafluorophosphate ion (PF 6 - ), hexafluoroantimonate Inorganic ions such as (SbF 6 - ), hexafluoroarsenate (AsF 6 - ), and hexachloroantimonate (SbCl 6 - ), and hexafluorophosphate ions are particularly preferred in terms of good curability of the polymerizable composition (PF 6 - ) and hexafluoroantimonate (SbF 6 - ).

作為由上述通式(2)表示之單苯基鋶鹽,可例舉:苄基-對羥基苯基甲基鋶鹽、苄基-對乙醯氧基苯基甲基鋶鹽、苄基-對羥基苯基甲基鋶鹽、及1-萘基甲基-對羥基苯基甲基鋶鹽等。Examples of the monophenyl perylene salt represented by the general formula (2) include: benzyl-p-hydroxyphenylmethyl perylene salt, benzyl-p-acetoxyphenyl methyl perylene salt, benzyl- p-Hydroxyphenylmethyl perionium salt, 1-naphthylmethyl-p-hydroxyphenylmethyl perionium salt, and the like.

作為陽離子熱聚合起始劑,亦可使用市售品,例如可例舉:CI-2064、CI-2624、CI-2639、CI-2855、CI-2920、CI-2921、CI-2946、CI-3128(以上為日本曹達公司製造)、SI-45、SI-47、SI-60、SI-60L、SI-80、SI-80L、SI-100、SI-100L、SI-110L、SI-145、SI-150、SI-160、SI-180、SI-180L(以上為三新化學公司製造)、TA-90、TA-100、TA-120、TA-160、IK-1、IK-2(以上為San-Apro公司製造)、Adekaopton CP-66、Adekaopton CP-77(以上為ADEKA公司製造)、FC-520(3M公司製造)等。As a cationic thermal polymerization initiator, a commercial item can also be used, for example, CI-2064, CI-2624, CI-2639, CI-2855, CI-2920, CI-2921, CI-2946, CI- 3128 (the above are manufactured by Japan Soda Co., Ltd.), SI-45, SI-47, SI-60, SI-60L, SI-80, SI-80L, SI-100, SI-100L, SI-110L, SI-145, SI-150, SI-160, SI-180, SI-180L (the above are manufactured by Sanshin Chemical Co., Ltd.), TA-90, TA-100, TA-120, TA-160, IK-1, IK-2 (the above are It is manufactured by San-Apro Corporation), Adekaopton CP-66, Adekaopton CP-77 (made by ADEKA Corporation above), FC-520 (made by 3M Corporation), etc.

陽離子熱聚合起始劑之含量相對於陽離子光聚合起始劑100質量份為50~1000質量份。較佳為100~500質量份,尤佳為150~500質量份。於陽離子熱聚合起始劑之含量處於上述範圍內之情形時,所獲得之聚合性組合物之深部硬化性優異,因此較佳。陽離子熱聚合起始劑可單獨使用一種,亦可將兩種以上混合使用。於將兩種以上混合使用之情形時,上述含量係指複數種陽離子熱聚合起始劑之合計含量。The content of the cationic thermal polymerization initiator is 50 to 1000 parts by mass with respect to 100 parts by mass of the cationic photopolymerization initiator. It is preferably 100 to 500 parts by mass, particularly preferably 150 to 500 parts by mass. When the content of the cationic thermal polymerization initiator is within the above-mentioned range, the obtained polymerizable composition is excellent in deep hardening properties, which is preferable. The cationic thermal polymerization initiator may be used alone or in combination of two or more. When two or more kinds are used in combination, the above content refers to the total content of a plurality of cationic thermal polymerization initiators.

本發明之聚合性組合物中使用之陽離子聚合性化合物係由自上述陽離子光聚合起始劑或陽離子熱聚合起始劑產生之陽離子種或路易斯酸引起聚合或交聯反應之化合物,無論係何種化合物均無妨,例如可例舉:環氧化合物、氧環丁烷化合物、環狀內酯化合物、環狀縮醛化合物、環狀硫醚化合物、螺環原酸酯化合物、及乙烯基化合物等。The cationically polymerizable compound used in the polymerizable composition of the present invention is a compound that causes polymerization or crosslinking reaction by cationic species or Lewis acid generated from the above-mentioned cationic photopolymerization initiator or cationic thermal polymerization initiator, regardless of the type. All kinds of compounds are not harmful, for example, epoxy compounds, oxetane compounds, cyclic lactone compounds, cyclic acetal compounds, cyclic sulfide compounds, spiro orthoester compounds, and vinyl compounds, etc. .

作為陽離子聚合性化合物,就深部硬化性優異而言,較佳為於分子內具有複數個引起聚合或交聯反應之基的多官能陽離子聚合性化合物。The cationically polymerizable compound is preferably a polyfunctional cationically polymerizable compound having a plurality of groups that cause polymerization or a crosslinking reaction in the molecule because it is excellent in deep hardening properties.

該等化合物中,就容易獲取、硬化性良好而言,較佳為環氧化合物及氧環丁烷化合物。Among these compounds, an epoxy compound and an oxetane compound are preferable in terms of easy availability and good curability.

作為環氧化合物,可例舉:脂環族環氧化合物、芳香族環氧化合物、及脂肪族環氧化合物等,其中,較佳為脂環族環氧化合物及芳香族環氧化合物。藉由上述陽離子聚合性化合物為上述化合物,所獲得之聚合性組合物之硬化性優異。 再者,環氧化合物包含所有含有環氧基之化合物。例如,含有環氧基及氧環丁基兩者之化合物包含於環氧化合物。 As an epoxy compound, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound, etc. are mentioned, Among them, an alicyclic epoxy compound and an aromatic epoxy compound are preferable. Since the above-mentioned cationically polymerizable compound is the above-mentioned compound, the obtained polymerizable composition is excellent in curability. In addition, the epoxy compound includes all compounds containing an epoxy group. For example, a compound containing both an epoxy group and an oxycyclobutyl group is included in the epoxy compound.

作為上述脂環族環氧化合物之具體例,可例舉含有環烯烴氧化物結構之化合物,該含有環烯烴氧化物結構之化合物係藉由利用氧化劑對具有至少一個脂肪族環之多元醇之聚縮水甘油醚、及含有環己烯結構、環戊烯結構等環烯烴結構之化合物進行環氧化而獲得。作為上述脂環族環氧化合物,例如可例舉:氫化雙酚A二縮水甘油醚、3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧基-1-甲基己烷羧酸3,4-環氧基-1-甲基環己酯、6-甲基-3,4-環氧環己烷羧酸6-甲基-3,4-環氧環己基甲酯、3,4-環氧基-3-甲基環己烷羧酸3,4-環氧基-3-甲基環己基甲酯、3,4-環氧基-5-甲基環己烷羧酸3,4-環氧基-5-甲基環己基甲酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧基)環己烷-間二㗁烷、己二酸雙(3,4-環氧環己基甲基)酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、雙(3,4-環氧環己烷羧酸)乙二酯、環氧六氫鄰苯二甲酸二辛酯、環氧六氫鄰苯二甲酸二-2-乙基己酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧基-2-環氧乙基環己烷、丙烯酸3,4-環氧環己基甲酯、及甲基丙烯酸3,4-環氧環己基甲酯等。 再者,具有脂肪族環及芳香族環兩者之環氧化合物屬於脂環族環氧化合物。 As a specific example of the above-mentioned alicyclic epoxy compound, a compound containing a cycloolefin oxide structure can be exemplified, and the compound containing a cycloolefin oxide structure is obtained by polymerizing a polyol having at least one aliphatic ring with an oxidizing agent. Glycidyl ether and compounds containing cycloolefin structures such as cyclohexene structures and cyclopentene structures are obtained by epoxidizing them. As said alicyclic epoxy compound, hydrogenated bisphenol A diglycidyl ether, 3, 4- epoxy cyclohexane carboxylic acid 3, 4- epoxy cyclohexyl methyl ester, 3, 4- cyclohexyl methyl ester, the Oxy-1-methylhexanecarboxylic acid 3,4-epoxy-1-methylcyclohexyl ester, 6-methyl-3,4-epoxycyclohexanecarboxylic acid 6-methyl-3, 4-Epoxycyclohexylmethylester, 3,4-epoxy-3-methylcyclohexanecarboxylic acid 3,4-epoxy-3-methylcyclohexylmethylester, 3,4-epoxy -5-Methylcyclohexanecarboxylic acid 3,4-epoxy-5-methylcyclohexylmethyl ester, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-cyclohexyl Oxy) cyclohexane-m-dioxane, bis(3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl) adipate Methyl bis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, bis(3,4-epoxycyclohexanecarboxylic acid) ethylene glycol, epoxyhexahydrophthalate Dioctyl formate, Di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-cyclohexane Oxyethylcyclohexane, 3,4-epoxycyclohexylmethyl acrylate, and 3,4-epoxycyclohexylmethyl methacrylate, etc. In addition, the epoxy compound which has both an aliphatic ring and an aromatic ring belongs to an alicyclic epoxy compound.

作為可適宜地用作上述脂環族環氧化合物之市售品,可例舉:UVR-6100、UVR-6105、UVR-6110、UVR-6128、UVR-6200(以上為Union Carbide公司製造)、Celloxide 2021、Celloxide 2021P、Celloxide 2081、Celloxide 2083、Celloxide 2085、Celloxide 2000、Celloxide 3000、Cyclomer A200、Cyclomer M100、Cyclomer M101、Epolead GT-301、Epolead GT-302、Epolead 401、Epolead 403、ETHB、Epolead HD300、EHPE-3150、EHPE-3150CE(以上為Daicel公司製造)、KRM-2110、KRM-2199(以上為ADEKA公司製造)等。 上述脂環族環氧化合物中,就所獲得之聚合性組合物之硬化性優異而言,較佳為具有環氧環己烷結構之環氧樹脂。 Examples of commercially available products that can be suitably used as the above-mentioned alicyclic epoxy compound include UVR-6100, UVR-6105, UVR-6110, UVR-6128, UVR-6200 (the above are manufactured by Union Carbide), Celloxide 2021, Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, Celloxide 2000, Celloxide 3000, Cyclomer A200, Cyclomer M100, Cyclomer M101, Epolead GT-301, Epolead GT-302, Epolead 401, Epolead 403, ETHB, Epolead HD30 , EHPE-3150, EHPE-3150CE (the above are manufactured by Daicel Corporation), KRM-2110, KRM-2199 (the above are manufactured by ADEKA Corporation), etc. Among the above-mentioned alicyclic epoxy compounds, an epoxy resin having an epoxycyclohexane structure is preferable because the obtained polymerizable composition has excellent curability.

作為上述芳香族環氧化合物之具體例,可例舉具有至少一個芳香族環之多酚或其環氧烷加成物之聚縮水甘油醚,例如可例舉:雙酚A、雙酚F、及進而對該等加成環氧烷而成之化合物的縮水甘油醚、以及環氧酚醛清漆樹脂等。 再者,芳香族環氧化合物係指含有芳香環而不含脂肪族環之環氧化合物。 就所獲得之聚合性組合物之深部硬化性優異而言,較佳為芳香族環氧化合物。 Specific examples of the above-mentioned aromatic epoxy compounds include polyphenols having at least one aromatic ring or polyglycidyl ethers of their alkylene oxide adducts, such as bisphenol A, bisphenol F, Further, glycidyl ethers of compounds obtained by adding these alkylene oxides, epoxy novolac resins, and the like. In addition, an aromatic epoxy compound means the epoxy compound which contains an aromatic ring and does not contain an aliphatic ring. Since the obtained polymerizable composition is excellent in deep hardening property, an aromatic epoxy compound is preferable.

作為上述脂肪族環氧化合物之具體例,可例舉:脂肪族多元醇或其環氧烷加成物之聚縮水甘油醚、脂肪族長鏈多元酸之聚縮水甘油酯、藉由丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯之乙烯基聚合而合成之均聚物、藉由丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯與其他乙烯基單體之乙烯基聚合而合成之共聚物等,作為具有代表性之化合物,可例舉:1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油之三縮水甘油醚、三羥甲基丙烷之三縮水甘油醚、山梨醇之四縮水甘油醚、二季戊四醇之六縮水甘油醚、聚乙二醇之二縮水甘油醚、及聚丙二醇之二縮水甘油醚等多元醇之縮水甘油醚;藉由對丙二醇、三羥甲基丙烷、及甘油等脂肪族多元醇加成一種以上環氧烷而獲得之聚醚多元醇之聚縮水甘油醚;脂肪族長鏈二元酸之二縮水甘油酯等。進而,可例舉:脂肪族高級醇之單縮水甘油醚;苯酚、甲酚、丁酚、或藉由對該等加成環氧烷而獲得之聚醚醇之單縮水甘油醚;高級脂肪酸之縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化大豆油、及環氧化聚丁二烯等。 再者,脂肪族環氧化合物係指不含芳香環及環氧環己烷結構之環氧化合物。 Specific examples of the above-mentioned aliphatic epoxy compounds include polyglycidyl ethers of aliphatic polyols or their alkylene oxide adducts, polyglycidyl esters of aliphatic long-chain polyacids, polyglycidyl esters of Or homopolymers synthesized by vinyl polymerization of glycidyl methacrylate, copolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate and other vinyl monomers, etc. Typical compounds include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerol triglycidyl ether, and trimethylolpropane triglycidyl ether , the tetraglycidyl ether of sorbitol, the hexaglycidyl ether of dipentaerythritol, the diglycidyl ether of polyethylene glycol, and the glycidyl ether of polyhydric alcohols such as the diglycidyl ether of polypropylene glycol; Polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyols such as methyl propane and glycerin; diglycidyl esters of aliphatic long-chain dibasic acids, etc. Furthermore, monoglycidyl ethers of aliphatic higher alcohols; phenol, cresol, butylphenol, or monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxides to these; Glycidyl ester, epoxidized soybean oil, epoxidized octyl stearate, epoxidized butyl stearate, epoxidized soybean oil, and epoxidized polybutadiene, etc. In addition, an aliphatic epoxy compound means the epoxy compound which does not contain an aromatic ring and an epoxy cyclohexane structure.

作為可適宜地用作上述芳香族環氧化合物及脂肪族環氧化合物之市售品,可例舉:jERYX-4000、jERYX-8000、jER871、jER872、jER157S70、jER806、jER1001、jER152、jER604(以上為三菱化學公司製造)、PY-306、0163、DY-022(以上為Ciba-Geigy公司製造)、KRM-2720、EP-4100、EP-4000、EP-4080、EP-4088、EP-4900、ED-505、ED-506(以上為ADEKA公司製造)、Epolight M-1230、Epolight EHDG-L、Epolight 40E、Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P、Epolight 1500NP、Epolight 1600、Epolight 80MF、Epolight 100MF、Epolight 4000、Epolight 3002、Epolight FR-1500(以上為共榮社化學公司製造)、Sun Tohto ST0000、YD-716、YH-300、PG-202、PG-207、YD-172、YDPN638(以上為新日鐵化學公司製造)、DENACOL EX321、DENACOL EX313、DENACOL 314、DENACOL EX-411、EM-150(以上為長瀨化成公司製造)、EPPN-201、EPPN-502H、NC-3000、NC-7300L、XD-1000、NC-2000-L、NC-7000L、CER-3000-L、EOCN-104S、EOCN-1020、EPPN-501H(以上為日本化藥公司製造)等。As a commercial item which can be suitably used as the said aromatic epoxy compound and aliphatic epoxy compound, jERYX-4000, jERYX-8000, jER871, jER872, jER157S70, jER806, jER1001, jER152, jER604 (above manufactured by Mitsubishi Chemical Corporation), PY-306, 0163, DY-022 (the above are manufactured by Ciba-Geigy Corporation), KRM-2720, EP-4100, EP-4000, EP-4080, EP-4088, EP-4900, ED-505, ED-506 (the above are manufactured by ADEKA), Epolight M-1230, Epolight EHDG-L, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF, Epolight 4000, Epolight 3002, Epolight FR-1500 (the above are manufactured by Kyoeisha Chemical Co., Ltd.), Sun Tohto ST0000, YD-716, YH-300, PG-202, PG-207, YD -172, YDPN638 (the above are manufactured by Nippon Steel Chemical Co., Ltd.), DENACOL EX321, DENACOL EX313, DENACOL 314, DENACOL EX-411, EM-150 (the above are manufactured by Nagase Chemical Co., Ltd.), EPPN-201, EPPN-502H, NC-3000, NC-7300L, XD-1000, NC-2000-L, NC-7000L, CER-3000-L, EOCN-104S, EOCN-1020, EPPN-501H (the above are manufactured by Nippon Kayaku Co., Ltd.), etc.

作為上述氧環丁烷化合物之具體例,例如可例舉:3-乙基-3-羥甲基氧環丁烷、3-(甲基)烯丙氧基甲基-3-乙基氧環丁烷、(3-乙基-3-氧環丁基甲氧基)甲基苯、4-氟-[1-(3-乙基-3-氧環丁基甲氧基)甲基]苯、4-甲氧基-[1-(3-乙基-3-氧環丁基甲氧基)甲基]苯、[1-(3-乙基-3-氧環丁基甲氧基)乙基]苯醚、異丁氧基甲基(3-乙基-3-氧環丁基甲基)醚、異𦯉氧基乙基(3-乙基-3-氧環丁基甲基)醚、異𦯉基(3-乙基-3-氧環丁基甲基)醚、2-乙基己基(3-乙基-3-氧環丁基甲基)醚、乙基二乙二醇(3-乙基-3-氧環丁基甲基)醚、二環戊二烯(3-乙基-3-氧環丁基甲基)醚、二環戊烯氧基乙基(3-乙基-3-氧環丁基甲基)醚、二環戊烯基(3-乙基-3-氧環丁基甲基)醚、四氫呋喃甲基(3-乙基-3-氧環丁基甲基)醚、四溴苯基(3-乙基-3-氧環丁基甲基)醚、2-四溴苯氧基乙基(3-乙基-3-氧環丁基甲基)醚、三溴苯基(3-乙基-3-氧環丁基甲基)醚、2-三溴苯氧基乙基(3-乙基-3-氧環丁基甲基)醚、2-羥乙基(3-乙基-3-氧環丁基甲基)醚、2-羥丙基(3-乙基-3-氧環丁基甲基)醚、丁氧基乙基(3-乙基-3-氧環丁基甲基)醚、五氯苯基(3-乙基-3-氧環丁基甲基)醚、五溴苯基(3-乙基-3-氧環丁基甲基)醚、𦯉基(3-乙基-3-氧環丁基甲基)醚、3,7-雙(3-氧環丁基)-5-氧雜-壬烷、3,3'-(1,3-(2-次甲基)丙烷二基雙(氧亞甲基))雙-(3-乙基氧環丁烷)、1,4-雙[(3-乙基-3-氧環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧環丁基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧環丁基甲基)醚、二環戊烯基雙(3-乙基-3-氧環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧環丁基甲基)醚、三環癸烷二基二亞甲基(3-乙基-3-氧環丁基甲基)醚、三羥甲基丙烷三(3-乙基-3-氧環丁基甲基)醚、1,4-雙(3-乙基-3-氧環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧環丁基甲氧基)己烷、季戊四醇三(3-乙基-3-氧環丁基甲基)醚、季戊四醇四(3-乙基-3-氧環丁基甲基)醚、聚乙二醇雙(3-乙基-3-氧環丁基甲基)醚、二季戊四醇六(3-乙基-3-氧環丁基甲基)醚、二季戊四醇五(3-乙基-3-氧環丁基甲基)醚、二季戊四醇四(3-乙基-3-氧環丁基甲基)醚、己內酯改性二季戊四醇六(3-乙基-3-氧環丁基甲基)醚、己內酯改性二季戊四醇五(3-乙基-3-氧環丁基甲基)醚、二-三羥甲基丙烷四(3-乙基-3-氧環丁基甲基)醚、EO改性雙酚A雙(3-乙基-3-氧環丁基甲基)醚、PO改性雙酚A雙(3-乙基-3-氧環丁基甲基)醚、EO改性氫化雙酚A雙(3-乙基-3-氧環丁基甲基)醚、PO改性氫化雙酚A雙(3-乙基-3-氧環丁基甲基)醚、及EO改性雙酚F(3-乙基-3-氧環丁基甲基)醚等。Specific examples of the above-mentioned oxetane compound include, for example, 3-ethyl-3-hydroxymethyl oxetane, 3-(methyl)allyloxymethyl-3-ethyl oxetane Butane, (3-ethyl-3-oxocyclobutylmethoxy)methylbenzene, 4-fluoro-[1-(3-ethyl-3-oxocyclobutylmethoxy)methyl]benzene, 4-methyl Oxy-[1-(3-ethyl-3-oxocyclobutylmethoxy)methyl]benzene, [1-(3-ethyl-3-oxocyclobutylmethoxy)ethyl]phenyl ether, isobutyl Oxymethyl (3-ethyl-3-oxocyclobutylmethyl) ether, iso(3-ethyl-3-oxocyclobutylmethyl) ether, iso(3-ethyl-3 -Oxycyclobutyl methyl) ether, 2-ethylhexyl (3-ethyl-3-oxocyclobutyl methyl) ether, ethyl diethylene glycol (3-ethyl-3-oxocyclobutyl methyl) ether, diethylene glycol Cyclopentadiene (3-ethyl-3-oxocyclobutylmethyl) ether, dicyclopentenyloxyethyl (3-ethyl-3-oxocyclobutylmethyl) ether, dicyclopentenyl (3- Ethyl-3-oxocyclobutylmethyl) ether, tetrahydrofuranmethyl (3-ethyl-3-oxocyclobutylmethyl) ether, tetrabromophenyl (3-ethyl-3-oxocyclobutylmethyl) ether, 2 - Tetrabromophenoxyethyl (3-ethyl-3-oxocyclobutylmethyl) ether, tribromophenyl (3-ethyl-3-oxocyclobutylmethyl) ether, 2-tribromophenoxyethyl (3-ethyl-3-oxocyclobutylmethyl) ether, 2-hydroxyethyl (3-ethyl-3-oxocyclobutylmethyl) ether, 2-hydroxypropyl (3-ethyl-3-oxo Cyclobutylmethyl) ether, butoxyethyl (3-ethyl-3-oxocyclobutylmethyl) ether, pentachlorophenyl (3-ethyl-3-oxocyclobutylmethyl) ether, pentabromophenyl ( 3-Ethyl-3-oxocyclobutylmethyl) ether, xyl (3-ethyl-3-oxocyclobutylmethyl) ether, 3,7-bis(3-oxocyclobutyl)-5-oxa- Nonane, 3,3'-(1,3-(2-Methylene)propanediylbis(oxymethylene))bis-(3-ethyloxetane), 1,4-bis[ (3-ethyl-3-oxocyclobutylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxocyclobutylmethoxy)methyl]ethane, 1,3-bis [(3-ethyl-3-oxocyclobutylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxocyclobutylmethyl)ether, dicyclopentenylbis(3-ethyl) -3-oxocyclobutyl methyl) ether, triethylene glycol bis(3-ethyl-3-oxocyclobutyl methyl) ether, tetraethylene glycol bis(3-ethyl-3-oxocyclobutyl methyl) ether, Tricyclodecanediyl dimethylene (3-ethyl-3-oxocyclobutylmethyl) ether, trimethylolpropane tris (3-ethyl-3-oxocyclobutylmethyl) ether, 1,4- Bis(3-ethyl-3-oxocyclobutylmethoxy)butane, 1,6-bis(3-ethyl-3-oxocyclobutylmethoxy)hexane, pentaerythritol tris(3-ethyl-3- Oxycyclobutyl methyl) ether, pentaerythritol tetrakis (3-ethyl-3-oxocyclobutyl methyl) ether, polyethylene glycol bis (3-ethyl-3-oxocyclobutyl methyl) ether, dipentaerythritol hexa (3- Ethyl-3 -Oxycyclobutyl methyl) ether, dipentaerythritol penta (3-ethyl-3-oxocyclobutyl methyl) ether, dipentaerythritol tetrakis (3-ethyl-3-oxocyclobutyl methyl) ether, caprolactone modified two Pentaerythritol hexa(3-ethyl-3-oxocyclobutyl methyl) ether, caprolactone modified dipentaerythritol penta(3-ethyl-3-oxocyclobutyl methyl) ether, di-trimethylolpropane tetrakis (3 -Ethyl-3-oxocyclobutylmethyl) ether, EO modified bisphenol A bis(3-ethyl-3-oxocyclobutylmethyl) ether, PO modified bisphenol A bis(3-ethyl-3- Oxycyclobutyl methyl) ether, EO modified hydrogenated bisphenol A bis (3-ethyl-3-oxocyclobutyl methyl) ether, PO modified hydrogenated bisphenol A bis (3-ethyl-3-oxocyclobutyl methyl) ) ether, and EO-modified bisphenol F (3-ethyl-3-oxocyclobutylmethyl) ether, etc.

作為可適宜地用作上述氧環丁烷化合物之市售品,可例舉:Aronoxetane OXT-101、OXT-121、OXT-221、OXT-212、OXT-211(以上為東亞合成公司製造)、Eternacoll EHO、OXBP、OXTP、OXMA(以上為宇部興產公司製造)等。Examples of commercially available products that can be suitably used as the above-mentioned oxetane compound include Aronoxetane OXT-101, OXT-121, OXT-221, OXT-212, OXT-211 (the above are manufactured by Toagosei Co., Ltd.), Eternacoll EHO, OXBP, OXTP, OXMA (the above are manufactured by Ube Industries Co., Ltd.), etc.

就深部硬化性優異而言,較佳為含有氧環丁烷化合物作為陽離子聚合性化合物之聚合性組合物。作為氧環丁烷化合物,更佳為於同一分子內具有兩個以上氧環丁基之氧環丁烷化合物,尤佳為具有兩個氧環丁基之氧環丁烷化合物。A polymerizable composition containing an oxetane compound as a cationically polymerizable compound is preferable because it is excellent in deep-sclerosis|hardenability. As an oxetane compound, the oxetane compound which has two or more oxycyclobutyl groups in the same molecule is more preferable, and the oxetane compound which has two oxycyclobutyl groups is especially preferable.

氧環丁烷化合物之含量並無特別限制,相對於陽離子聚合性化合物100質量份較佳為5~90質量份,更佳為20~80質量份,尤佳為30~70質量份。於陽離子化合物之含量處於上述範圍內之情形時,所獲得之聚合性組合物之硬化性優異,因此較佳。The content of the oxetane compound is not particularly limited, but is preferably 5 to 90 parts by mass, more preferably 20 to 80 parts by mass, and particularly preferably 30 to 70 parts by mass with respect to 100 parts by mass of the cationically polymerizable compound. When the content of the cationic compound is within the above-mentioned range, the obtained polymerizable composition has excellent curability, which is preferable.

作為其他陽離子聚合性化合物,可例舉:四氫呋喃及2,3-二甲基四氫呋喃等氧環戊烷化合物;三㗁烷、1,3-二氧環戊烷、及1,3,6-三㗁烷環辛烷等環狀縮醛化合物;β-丙內酯及ε-己內酯等環狀內酯化合物;環硫乙烷及硫代表氯醇等硫環丙烷化合物;1,3-丙炔硫化物、及3,3-二甲基硫環丁烷等硫環丁烷化合物;四氫噻吩衍生物等環狀硫醚化合物;乙二醇二乙烯醚、烷基乙烯醚、2-氯乙基乙烯醚、2-羥乙基乙烯醚、三乙二醇二乙烯醚、1,4-環己烷二甲醇二乙烯醚、羥丁基乙烯醚、及丙二醇之丙烯基醚等乙烯醚化合物;藉由環氧化合物與內酯之反應而獲得之螺環原酸酯化合物;苯乙烯、乙烯基環己烯、異丁烯、及聚丁二烯等乙烯性不飽和化合物、以及該等化合物之衍生物等。Examples of other cationically polymerizable compounds include oxycyclopentane compounds such as tetrahydrofuran and 2,3-dimethyltetrahydrofuran; triacetane, 1,3-dioxolane, and 1,3,6-trioxolane Cyclic acetal compounds such as oxanecyclooctane; cyclic lactone compounds such as β-propiolactone and ε-caprolactone; thiocyclopropane compounds such as ethylene sulfide and sulfur-representing chlorohydrin; 1,3-propane Alkyne sulfides, and thiocyclobutane compounds such as 3,3-dimethylthiocyclobutane; cyclic sulfide compounds such as tetrahydrothiophene derivatives; ethylene glycol divinyl ether, alkyl vinyl ether, 2-chloroethylene Vinyl ether compounds such as ethyl vinyl ether, 2-hydroxyethyl vinyl ether, triethylene glycol divinyl ether, 1,4-cyclohexane dimethanol divinyl ether, hydroxybutyl vinyl ether, and propenyl ether of propylene glycol ; Spirocyclic orthoester compounds obtained by the reaction of epoxy compounds and lactones; ethylenically unsaturated compounds such as styrene, vinylcyclohexene, isobutylene, and polybutadiene, and derivatives of these compounds things etc.

本發明之聚合性組合物亦可含有增感劑。 含有增感劑之聚合性組合物由於深部硬化性優異,故較佳。增感劑係指不具有聚合性,藉由與上述陽離子光聚合起始劑併用而促進陽離子聚合之物質,歸類為上述陽離子光聚合起始劑或上述陽離子熱聚合起始劑之化合物除外。 The polymerizable composition of the present invention may also contain a sensitizer. The polymerizable composition containing a sensitizer is preferable because it is excellent in deep hardening properties. A sensitizer refers to a substance that does not have polymerizability and promotes cationic polymerization by being used in combination with the above-mentioned cationic photopolymerization initiator, excluding compounds classified as the above-mentioned cationic photopolymerization initiator or the above-mentioned cationic thermal polymerization initiator.

作為增感劑,可例舉:蒽系增感劑、萘系增感劑、及苯并咔唑系起始劑等,就反應性尤其優異而言,較佳為苯并咔唑系增感劑。該等增感劑可併用兩種以上。將較佳之增感劑之結構於下述例示。Examples of the sensitizer include anthracene-based sensitizers, naphthalene-based sensitizers, benzocarbazole-based initiators, and the like, and benzocarbazole-based sensitizers are preferred in terms of particularly excellent reactivity. agent. Two or more of these sensitizers may be used in combination. The structure of a preferable sensitizer is illustrated below.

[化6]

Figure 02_image011
式中,R表示碳原子數為1~10之烷基。 [hua 6]
Figure 02_image011
In the formula, R represents an alkyl group having 1 to 10 carbon atoms.

增感劑之含量並無特別限制,相對於陽離子光聚合起始劑1 mol,較佳為1~1000 mol,更佳為5~500 mol,尤佳為10~200 mol。於增感劑之含量處於上述範圍內之情形時,所獲得之聚合性組合物之硬化性優異,因此較佳。The content of the sensitizer is not particularly limited, and relative to 1 mol of the cationic photopolymerization initiator, it is preferably 1-1000 mol, more preferably 5-500 mol, and particularly preferably 10-200 mol. When the content of the sensitizer is within the above range, the sclerosing property of the polymerizable composition obtained is excellent, which is preferable.

本發明之聚合性組合物亦可含有硫酸鹽。 含有硫酸鹽之聚合性組合物由於熱穩定性良好且深部硬化性優異,故較佳。硫酸鹽中尤佳為烷基硫酸鹽。作為烷基硫酸鹽之陰離子,可例舉:甲基硫酸根離子、乙基硫酸根離子、及丙基硫酸根離子。 The polymerizable composition of the present invention may also contain sulfate. The polymerizable composition containing sulfate is preferable because it has good thermal stability and is excellent in deep sclerosis. Among the sulfates, alkyl sulfates are particularly preferred. As anion of an alkyl sulfate, a methyl sulfate ion, an ethyl sulfate ion, and a propyl sulfate ion are mentioned.

作為硫酸鹽之陽離子,就聚合性組合物之熱穩定性良好且深部硬化性較高而言,較佳為鋶離子,尤佳為由下述通式(3)表示之鋶離子。The cation of the sulfate is preferably a pericynium ion, and particularly preferably a pericynium ion represented by the following general formula (3), since the polymerizable composition has good thermal stability and high deep hardening properties.

[化7]

Figure 02_image013
式中,R 51表示氫原子、碳原子數為2~10之醯基、或碳原子數為1~10之烷基,R 52、R 53、R 56、及R 57分別獨立地表示氫原子、鹵素原子、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、或碳原子數為2~10之酯基,R 52與R 53及R 56與R 57可彼此鍵結而形成碳原子數為3~10之環,R 54及R 55表示碳原子數為1~20之烴基。 [hua 7]
Figure 02_image013
In the formula, R 51 represents a hydrogen atom, an acyl group having 2 to 10 carbon atoms, or an alkyl group having 1 to 10 carbon atoms, and R 52 , R 53 , R 56 , and R 57 each independently represent a hydrogen atom , halogen atom, alkyl group with 1 to 10 carbon atoms, alkoxy group with 1 to 10 carbon atoms, or ester group with 2 to 10 carbon atoms, R 52 and R 53 and R 56 and R 57 They can be bonded to each other to form a ring having 3 to 10 carbon atoms, and R 54 and R 55 represent a hydrocarbon group having 1 to 20 carbon atoms.

上述通式(3)中之鹵素原子、碳原子數為2~10之醯基、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、碳原子數為2~10之酯基、及碳原子數為3~10之環與上述通式(2)中之鹵素原子、碳原子數為2~10之醯基、碳原子數為1~10之烷基、碳原子數為1~10之烷氧基、碳原子數為2~10之酯基、及碳原子數為3~10之環相同。又,上述通式(3)中之碳原子數為1~20之烴基與上述通式(1)中之碳原子數為1~20之烴基相同。In the above general formula (3), a halogen atom, an acyl group having 2 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, and an alkoxy group having 2 carbon atoms Ester group of to 10, and ring of carbon number of 3 to 10, halogen atom, acyl group of carbon number of 2 to 10, alkyl of carbon number of 1 to 10 in the above general formula (2), The alkoxy group having 1 to 10 carbon atoms, the ester group having 2 to 10 carbon atoms, and the ring having 3 to 10 carbon atoms are the same. In addition, the hydrocarbon group having 1 to 20 carbon atoms in the above general formula (3) is the same as the hydrocarbon group having 1 to 20 carbon atoms in the above general formula (1).

由上述通式(3)表示之陽離子中,就所獲得之聚合性組合物之熱穩定性良好、且深部硬化性優異而言,較佳為R 51為氫原子者。 Among the cations represented by the above-mentioned general formula (3), those in which R 51 is a hydrogen atom are preferable in terms of good thermal stability of the polymerizable composition obtained and excellent deep hardening properties.

由上述通式(3)表示之陽離子中,就所獲得之聚合性組合物之熱穩定性良好、且深部硬化性優異而言,較佳為R 52、R 53、R 56、及R 57為氫原子者。 Among the cations represented by the above-mentioned general formula (3), R 52 , R 53 , R 56 , and R 57 are preferably R 52 , R 53 , R 56 , and R 57 in terms of good thermal stability and excellent deep hardening properties of the polymerizable composition obtained. hydrogen atom.

作為本發明中所使用之硫酸鹽,例如可例舉芳香族鋶烷基硫酸鹽,具體而言可例舉4-羥基苯基(二甲基)鋶甲基硫酸鹽等。As a sulfate used for this invention, an aromatic perylene alkyl sulfate is mentioned, for example, 4-hydroxyphenyl (dimethyl) perylene methyl sulfate etc. are mentioned specifically,.

硫酸鹽之含量並無特別限制,相對於陽離子熱聚合起始劑100質量份較佳為0.01~10質量份,尤佳為0.5~5質量。於硫酸鹽之含量處於上述範圍內之情形時,所獲得之聚合性組合物之熱穩定性良好,硬化性優異,因此較佳。The content of sulfate is not particularly limited, but is preferably 0.01 to 10 parts by mass, particularly preferably 0.5 to 5 parts by mass, relative to 100 parts by mass of the cationic thermal polymerization initiator. When the content of the sulfate is within the above-mentioned range, the obtained polymerizable composition has good thermal stability and excellent curability, which is preferable.

於本發明之聚合性組合物中,通常可視需要添加可溶解或分散上述各成分之溶劑(於大氣壓下、於25℃下以液體之形式存在且不屬於上述各成分之化合物),例如:丙酮、甲基乙基酮、甲基異丁基酮、甲基溶纖劑、乙基溶纖劑、氯仿、二氯甲烷、己烷、庚烷、辛烷、環己烷、苯、甲苯、二甲苯、甲醇、乙醇、及異丙醇等。於本發明之聚合性組合物中,溶劑之含量根據聚合性組合物之用途等適當選擇,並無特別限定,通常當以聚合性組合物之固形物成分(除了溶劑以外之所有成分之合計含量)為5~90質量%之方式含有溶劑時,形成塗膜之情形等之操作變得容易。In the polymerizable composition of the present invention, a solvent that can dissolve or disperse the above components (compounds that exist in the form of liquid under atmospheric pressure and 25°C and does not belong to the above components), such as acetone, may be added as required. , methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, chloroform, dichloromethane, hexane, heptane, octane, cyclohexane, benzene, toluene, dichloromethane Toluene, methanol, ethanol, and isopropanol, etc. In the polymerizable composition of the present invention, the content of the solvent is appropriately selected according to the application of the polymerizable composition, etc., and is not particularly limited. Usually, the solid content of the polymerizable composition (the total content of all components except the solvent) is used. ) is 5-90 mass %, when a solvent is contained, operations, such as the case of forming a coating film, become easy.

又,只要不損及本發明之效果,則可視需要添加如下各種添加劑:苯并三唑系、三𠯤系、及苯甲酸酯系之紫外線吸收劑;酚系、磷系、及硫系之抗氧化劑;陽離子系界面活性劑、陰離子系界面活性劑、非離子系界面活性劑、及兩性界面活性劑等抗靜電劑;鹵素系化合物、磷酸酯系化合物、磷酸醯胺系化合物、三聚氰胺系化合物、氟樹脂或金屬氧化物、(聚)磷酸三聚氰胺、及(聚)磷酸哌𠯤等阻燃劑;烴系、脂肪酸系、脂肪族醇系、脂肪族酯系、脂肪族醯胺系、及金屬皂系之潤滑劑;顏料及碳黑等著色劑;薰製二氧化矽、微粒子二氧化矽、矽石、矽藻土類、黏土、高嶺土、矽藻土、矽膠、矽酸鈣、絹雲母、高嶺石、燧石、長石粉、蛭石、厄帖浦石、滑石、雲母、鐵滑石、葉蠟石、及矽土等矽酸系無機添加劑;玻璃纖維及碳酸鈣等填充劑;成核劑及結晶促進劑等結晶劑;矽烷偶合劑及可撓性聚合物等橡膠彈性賦予劑;其他單體、消泡劑、增黏劑、調平劑、塑化劑、聚合抑制劑、抗靜電劑、流動調整劑、偶合劑及接著促進劑等。於本發明之聚合性組合物中,該等各種添加劑之使用量合計為50質量%以下。Moreover, as long as the effect of the present invention is not impaired, the following various additives may be added as needed: benzotriazole-based, tris-based, and benzoate-based ultraviolet absorbers; phenol-based, phosphorus-based, and sulfur-based UV absorbers Antioxidants; antistatic agents such as cationic surfactants, anionic surfactants, nonionic surfactants, and amphoteric surfactants; halogen compounds, phosphate ester compounds, amide phosphate compounds, melamine compounds , fluorine resin or metal oxide, (poly) melamine phosphate, and (poly) piperazine phosphate and other flame retardants; hydrocarbon series, fatty acid series, aliphatic alcohol series, aliphatic ester series, aliphatic amide series, and metal Soap-based lubricants; pigments and colorants such as carbon black; fumed silica, micro-particle silica, silica, diatomaceous earth, clay, kaolin, diatomaceous earth, silica gel, calcium silicate, sericite, Silica-based inorganic additives such as kaolinite, flint, feldspar powder, vermiculite, etiprite, talc, mica, iron talc, pyrophyllite, and silica; fillers such as glass fiber and calcium carbonate; nucleating agents and Crystallizing agents such as crystallization accelerators; rubber elasticity imparting agents such as silane coupling agents and flexible polymers; other monomers, defoaming agents, tackifiers, leveling agents, plasticizers, polymerization inhibitors, antistatic agents, Flow modifiers, coupling agents and adhesion promoters, etc. In the polymerizable composition of the present invention, the total usage amount of these various additives is 50% by mass or less.

本發明之聚合性組合物可藉由照射紫外線等活性能量線而硬化,通常自照射起0.1秒~數分鐘後可硬化成指觸乾燥狀態或溶劑不溶性之狀態。作為合適之活性能量線,可為任意活性能量線,只要其誘發光酸產生劑之分解即可,較佳為利用自超高壓、高壓、中壓、及低壓水銀燈、氙氣燈、碳弧燈、金屬鹵化物燈、螢光燈、鎢絲燈、準分子燈、殺菌燈、準分子雷射、氮雷射、氬離子雷射、氦鎘雷射、氦氖雷射、氪離子雷射、各種半導體雷射、YAG(Yttrium Aluminum Garnet,釔鋁石榴石)雷射、發光二極體、CRT(cathode-ray tube,陰極射線管)光源等獲得之具有200 nm至700 nm之波長之電磁波能量及電子線、X射線、以及放射線等高活性能量線。The polymerizable composition of the present invention can be cured by irradiation with active energy rays such as ultraviolet rays, and is usually cured to a dry state or a solvent-insoluble state after 0.1 seconds to several minutes from the irradiation. As a suitable active energy ray, any active energy ray can be used as long as it induces the decomposition of the photoacid generator, and it is preferable to use self-ultra-high pressure, high pressure, medium pressure, and low pressure mercury lamps, xenon lamps, carbon arc lamps, Metal halide lamps, fluorescent lamps, tungsten lamps, excimer lamps, germicidal lamps, excimer lasers, nitrogen lasers, argon ion lasers, helium cadmium lasers, helium neon lasers, krypton ion lasers, various Electromagnetic wave energy with a wavelength of 200 nm to 700 nm obtained by semiconductor laser, YAG (Yttrium Aluminum Garnet, yttrium aluminum garnet) laser, light emitting diode, CRT (cathode-ray tube, cathode ray tube) light source, etc. Electron beams, X-rays, and high-activity energy beams such as radiation.

活性能量線之照射時間因活性能量線之強度、塗膜厚、或陽離子聚合性有機化合物而異,通常0.1秒~10秒左右即充分。但是,針對相對較厚之塗膜,較佳為設為較以上更長之照射時間。於活性能量線照射後0.1秒~數分鐘之後,大部分組合物由於陽離子聚合而指觸乾燥,但較佳為視情況併用由加熱或熱感應頭等產生之熱能以促進陽離子聚合。The irradiation time of the active energy ray varies depending on the strength of the active energy ray, the thickness of the coating film, or the cationically polymerizable organic compound, but usually about 0.1 to 10 seconds is sufficient. However, for a relatively thick coating film, it is preferable to set the irradiation time longer than the above. After 0.1 seconds to several minutes after the active energy ray irradiation, most of the composition is dry to the touch due to cationic polymerization, but it is preferable to use thermal energy generated by heating or a thermal induction head as appropriate to promote cationic polymerization.

又,本發明之聚合性組合物可藉由利用加熱板等熱板、大氣烘箱、惰性氣體烘箱、真空烘箱、及熱風回圈烘箱等之加熱而硬化。In addition, the polymerizable composition of the present invention can be hardened by heating with a hot plate such as a hot plate, an air oven, an inert gas oven, a vacuum oven, a hot air circulation oven, or the like.

熱硬化時之加熱溫度並無特別限定,就促進陽離子聚合性化合物之聚合之方面而言,較佳為70~200℃,更佳為90~150℃。又,硬化時間並無特別限定,就提高生產性之方面而言,較佳為1~60分鐘,更佳為1~30分鐘。The heating temperature at the time of thermosetting is not particularly limited, but from the viewpoint of accelerating the polymerization of the cationically polymerizable compound, it is preferably 70 to 200°C, more preferably 90 to 150°C. In addition, the curing time is not particularly limited, but from the viewpoint of improving productivity, it is preferably 1 to 60 minutes, and more preferably 1 to 30 minutes.

進而,本發明之聚合性組合物可併用活性能量線之照射及加熱而硬化。於此情形時,可於對聚合性組合物照射活性能量線之後進行加熱,亦可於對聚合性組合物進行加熱之後照射活性能量線。就於用作構件固定接著劑之情形時之位置精度提高的方面而言,較佳為於對組合物照射活性能量線之後進行加熱。Furthermore, the polymerizable composition of the present invention can be cured by combining irradiation with active energy rays and heating. In this case, heating may be performed after irradiating the polymerizable composition with active energy rays, or after heating the polymerizable composition, active energy rays may be irradiated. It is preferable to heat the composition after irradiating the composition with active energy rays, from the viewpoint of improving the positional accuracy when used as a member fixing adhesive.

於在本發明之聚合性組合物之硬化中併用活性能量線之照射及加熱之情形時,作為所使用之活性能量線及加熱裝置,可無特別限制地使用上述者,就深部硬化性優異而言,較佳為使用紫外線作為活性能量線。In the case where irradiation and heating of active energy rays are used in combination with the curing of the polymerizable composition of the present invention, as the active energy rays and heating means to be used, the above-mentioned ones can be used without particular limitation, and they are excellent in deep curing properties. In other words, it is preferable to use ultraviolet rays as the active energy rays.

作為本發明之聚合性組合物之具體用途,可用於如下等各種用途:光學濾光片;塗料;塗佈劑;襯裡劑;接著劑;印刷版;絕緣清漆;絕緣片材;積層板;印刷基片;半導體裝置用、LED(light-emitting diode,發光二極體)封裝用、液晶注入口用、有機EL(Electroluminescence,電致發光)用、光學元件用、電絕緣用、電子零件用、及分離膜用等之密封劑;成形材料;油灰;玻璃纖維含浸劑;封堵劑;半導體用及太陽能電池用等之鈍化膜;層間絕緣膜;保護膜;印刷基板;彩色電視、PC(Personal Computer,個人電腦)顯示器、攜帶型資訊終端、及CCD(Charge Coupled Device,電荷耦合裝置)影像感測器之彩色濾光片;電漿顯示面板用之電極材料;印刷油墨;牙科用組合物;光造形用樹脂;液狀及乾燥膜;微小機械零件;玻璃纖維電纜塗層;全像記錄用材料等,其用途並無特別限制。 [實施例] Specific applications of the polymerizable composition of the present invention include various applications such as: optical filters; coatings; coating agents; lining agents; adhesives; printing plates; insulating varnishes; insulating sheets; laminates; printing Substrates; for semiconductor devices, for LED (light-emitting diode) packaging, for liquid crystal injection ports, for organic EL (Electroluminescence), for optical components, for electrical insulation, for electronic parts, and sealants for separation films; molding materials; putties; glass fiber impregnating agents; blocking agents; passivation films for semiconductors and solar cells; interlayer insulating films; protective films; printed substrates; color TV, PC (Personal Computer, personal computer) monitor, portable information terminal, and CCD (Charge Coupled Device, charge coupled device) image sensor color filter; Electrode material for plasma display panel; Printing ink; Dental composition; Resins for photoforming; liquid and dry films; micro-mechanical parts; glass fiber cable coatings; [Example]

以下,列舉實施例等對本發明進而詳細地進行說明,但本發明並不限定於該等實施例等。Hereinafter, the present invention will be described in more detail with reference to Examples and the like, but the present invention is not limited to these Examples and the like.

[實施例1~32及比較例1~10] 以表1~4所示之組成將各成分與溶劑(碳酸丙二酯)混合,進行攪拌直至不存在不溶物為止,獲得各實施例及比較例之聚合性組合物。 陽離子聚合性化合物A-1~A-4、陽離子光聚合起始劑B-1~B-2、陽離子熱聚合起始劑C-1~C-3、增感劑D-1~D-4、穩定劑E-1、自由基聚合性化合物F-1~F-2、及光自由基聚合起始劑G-1分別為具有以下結構之化合物。 [Examples 1 to 32 and Comparative Examples 1 to 10] Each component and a solvent (propylene carbonate) were mixed with the composition shown in Tables 1-4, and it stirred until an insoluble thing did not exist, and the polymerizable composition of each Example and a comparative example was obtained. Cationic polymerizable compounds A-1 to A-4, cationic photopolymerization initiators B-1 to B-2, cationic thermal polymerization initiators C-1 to C-3, sensitizers D-1 to D-4 , Stabilizer E-1, radically polymerizable compounds F-1 to F-2, and photoradical polymerization initiator G-1 are compounds having the following structures, respectively.

[化8]

Figure 02_image015
[hua 8]
Figure 02_image015

[化9]

Figure 02_image017
[Chemical 9]
Figure 02_image017

[化10]

Figure 02_image019
[Chemical 10]
Figure 02_image019

[化11]

Figure 02_image021
[Chemical 11]
Figure 02_image021

[化12]

Figure 02_image023
[Chemical 12]
Figure 02_image023

[化13]

Figure 02_image025
[Chemical 13]
Figure 02_image025

[化14]

Figure 02_image027
[Chemical 14]
Figure 02_image027

(保存穩定性) 製備聚合性組合物之後,對在25℃下保存1週後之黏度變化率進行評價。將結果彙總於表1~4。將黏度變化率未達10%者設為A,將黏度變化率為10%以上且未達25%者設為B,將黏度變化率為25%以上且未達50%者設為C,將黏度變化率為50%以上者設為D。黏度變化越小,保存穩定性越優異,因此越佳。 (Storage stability) After preparing the polymerizable composition, the viscosity change rate after storage at 25°C for 1 week was evaluated. The results are summarized in Tables 1 to 4. Set the viscosity change rate of less than 10% as A, set the viscosity change rate of 10% or more and less than 25% as B, set the viscosity change rate of 25% or more and less than 50% as C, set A viscosity change rate of 50% or more was set as D. The smaller the viscosity change, the more excellent the storage stability, and thus the better.

(深部硬化性) 藉由棒式塗佈機,將聚合性組合物以達到規定膜厚(100 μm、50 μm、及30 μm)之方式分別塗佈於離型膜(Lumirror T60;東麗公司製造),使用波長為365 nm之LED光源(100 mW/cm 2)以500 mJ/cm 2進行曝光之後,於室溫下靜置2小時。其後,將離型膜剝離,對剝離面之狀態進行確認。於剝離面無法確認出黏性之情形判斷為可獲得硬化物,於確認出黏性之情形判斷為無法獲得硬化物。越可獲得膜厚較大之硬化物,作為構件用接著劑越佳。將結果彙總於表1~4。 A:可獲得膜厚為100 μm之硬化物。 B:雖無法獲得膜厚為100 μm之硬化物,但可獲得膜厚為50 μm之硬化物。 C:雖無法獲得膜厚為50 μm之硬化物,但可獲得膜厚為30 μm之硬化物。 D:無法獲得膜厚為30 μm之硬化物。 (Deep curability) The polymerizable composition was applied to a release film (Lumirror T60; Toray Corporation) with a bar coater so as to have predetermined film thicknesses (100 μm, 50 μm, and 30 μm), respectively. production), and after exposure at 500 mJ/cm 2 using an LED light source (100 mW/cm 2 ) with a wavelength of 365 nm, it was left to stand at room temperature for 2 hours. Then, the release film was peeled off, and the state of the peeled surface was confirmed. When the stickiness was not confirmed on the peeled surface, it was judged that a hardened product could be obtained, and when the stickiness was confirmed, it was judged that a hardened product could not be obtained. The thicker the cured product can be obtained, the better it is as an adhesive for components. The results are summarized in Tables 1 to 4. A: A cured product with a film thickness of 100 μm can be obtained. B: Although a cured product with a film thickness of 100 μm could not be obtained, a cured product with a film thickness of 50 μm was obtained. C: Although a cured product with a film thickness of 50 μm could not be obtained, a cured product with a film thickness of 30 μm was obtained. D: A cured product with a film thickness of 30 μm could not be obtained.

(硬化收縮率) 藉由棒式塗佈機,將聚合性組合物以膜厚達到30 μm之方式分別塗佈於離型膜(Lumirror T60;東麗公司製造),使用波長為365 nm之LED光源(100 mW/cm 2)以500 mJ/cm 2進行曝光之後,於室溫下靜置2小時。其後,將離型膜剝離,獲得樣品。對於所獲得之樣品及硬化前之樣品分別使用氣體比重瓶測定密度(JIS Z8837)。其後,根據硬化前後之密度變化之比率算出硬化收縮率。硬化收縮率越小,位置精度越高,因此作為構件用接著劑越佳。將結果彙總於表1~4。 A:硬化收縮率未達4%。 B:硬化收縮率為4%以上且未達7%。 C:硬化收縮率為7%以上。 (Curing Shrinkage) The polymerizable composition was separately coated on a release film (Lumirror T60; manufactured by Toray Industries) with a film thickness of 30 μm using a bar coater, and an LED with a wavelength of 365 nm was used. After exposure by a light source (100 mW/cm 2 ) at 500 mJ/cm 2 , it was left to stand at room temperature for 2 hours. After that, the release film was peeled off to obtain a sample. The density of the obtained sample and the sample before hardening was measured using a gas pycnometer (JIS Z8837). Then, the hardening shrinkage rate was calculated from the ratio of the density change before and after hardening. The smaller the hardening shrinkage rate, the higher the positional accuracy, and therefore the better as an adhesive for members. The results are summarized in Tables 1 to 4. A: The hardening shrinkage ratio is less than 4%. B: The hardening shrinkage ratio is 4% or more and less than 7%. C: The hardening shrinkage ratio is 7% or more.

[表1]    實施例 1 2 3 4 5 6 7 8 9 10 11 12 陽離子聚合性化合物 A-1 - - - - 50 50 50 50 - - - - A-2 50 50 - - 50 50 50 50 50 50 - - A-3 50 50 50 50 - - - - 50 50 50 50 A-4 - - 50 50 - - - - - - 50 50 陽離子光聚合起始劑 B-1 1 1 1 1 1 1 1 1 1 1 1 1 B-2 - - - - - - - - - - - - 陽離子熱聚合起始劑 C-1 0.5 - - - - - - - 2 - - - C-2 - 0.5 0.5 - 0.5 0.5 0.5 0.5 - 2 2 - C-3 - - - 0.5 - - - - - - - 2 增感劑 D-1 - - - - 0.05 - - - - - - - D-2 - - - - - 0.033 - - - - - - D-3 - - - - - - 0.05 - - - - - D-4 - - - - - - - 0.05 - - - - 穩定劑 E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 溶劑(碳酸丙二酯) 2 2 2 2 2 2 2 2 2 2 2 2 評價 保存穩定性 B A C B A A A A B A C B 深部硬化性 A B A A A A A A A B A A 硬化收縮率 A A A A A A A A A A A A [Table 1] Example 1 2 3 4 5 6 7 8 9 10 11 12 Cationic polymerizable compound A-1 - - - - 50 50 50 50 - - - - A-2 50 50 - - 50 50 50 50 50 50 - - A-3 50 50 50 50 - - - - 50 50 50 50 A-4 - - 50 50 - - - - - - 50 50 Cationic photopolymerization initiator B-1 1 1 1 1 1 1 1 1 1 1 1 1 B-2 - - - - - - - - - - - - Cationic thermal polymerization initiator C-1 0.5 - - - - - - - 2 - - - C-2 - 0.5 0.5 - 0.5 0.5 0.5 0.5 - 2 2 - C-3 - - - 0.5 - - - - - - - 2 Sensitizer D-1 - - - - 0.05 - - - - - - - D-2 - - - - - 0.033 - - - - - - D-3 - - - - - - 0.05 - - - - - D-4 - - - - - - - 0.05 - - - - stabilizer E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 Solvent (Propylene Carbonate) 2 2 2 2 2 2 2 2 2 2 2 2 Evaluation storage stability B A C B A A A A B A C B deep sclerosis A B A A A A A A A B A A Hardening shrinkage A A A A A A A A A A A A

[表2]    實施例 13 14 15 16 17 18 19 20 21 22 23 24 陽離子聚合性化合物 A-1 50 50 50 50 - - - - 50 50 50 50 A-2 50 50 50 50 50 50 - - 50 50 50 50 A-3 - - - - 50 50 50 50 - - - - A-4 - - - - - - 50 50 - - - - 陽離子光聚合起始劑 B-1 1 1 1 1 - - - - - - - - B-2 - - - - 1 1 1 1 1 1 1 1 陽離子熱聚合起始劑 C-1 - - - - 0.5 - - - - - - - C-2 2 2 2 2 - 0.5 0.5 - 0.5 0.5 0.5 0.5 C-3 - - - - - - - 0.5 - - - - 增感劑 D-1 0.05 - - - - - - - 0.05 - - - D-2 - 0.033 - - - - - - - 0.033 - - D-3 - - 0.05 - - - - - - - 0.05 - D-4 - - - 0.05 - - - - - - - 0.05 穩定劑 E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 溶劑(碳酸丙二酯) 2 2 2 2 2 2 2 2 2 2 2 2 評價 保存穩定性 A A A A B A C B A A A A 深部硬化性 A A A A A B A A A A A A 硬化收縮率 A A A A A A A A A A A A [Table 2] Example 13 14 15 16 17 18 19 20 twenty one twenty two twenty three twenty four Cationic polymerizable compound A-1 50 50 50 50 - - - - 50 50 50 50 A-2 50 50 50 50 50 50 - - 50 50 50 50 A-3 - - - - 50 50 50 50 - - - - A-4 - - - - - - 50 50 - - - - Cationic photopolymerization initiator B-1 1 1 1 1 - - - - - - - - B-2 - - - - 1 1 1 1 1 1 1 1 Cationic thermal polymerization initiator C-1 - - - - 0.5 - - - - - - - C-2 2 2 2 2 - 0.5 0.5 - 0.5 0.5 0.5 0.5 C-3 - - - - - - - 0.5 - - - - Sensitizer D-1 0.05 - - - - - - - 0.05 - - - D-2 - 0.033 - - - - - - - 0.033 - - D-3 - - 0.05 - - - - - - - 0.05 - D-4 - - - 0.05 - - - - - - - 0.05 stabilizer E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 Solvent (Propylene Carbonate) 2 2 2 2 2 2 2 2 2 2 2 2 Evaluation storage stability A A A A B A C B A A A A deep sclerosis A A A A A B A A A A A A Hardening shrinkage A A A A A A A A A A A A

[表3]    實施例 25 26 27 28 29 30 31 32 陽離子聚合性化合物 A-1 - - - - 50 50 50 50 A-2 50 50 - - 50 50 50 50 A-3 50 50 50 50 - - - - A-4 - - 50 50 - - - - 陽離子光聚合起始劑 B-1 - - - - - - - - B-2 1 1 1 1 1 1 1 1 陽離子熱聚合起始劑 C-1 2 - - - - - - - C-2 - 2 2 - 2 2 2 2 C-3 - - - 2 - - - - 增感劑 D-1 - - - - 0.05 - - - D-2 - - - - - 0.033 - - D-3 - - - - - - 0.05 - D-4 - - - - - - - 0.05 穩定劑 E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 溶劑(碳酸丙二酯) 2 2 2 2 2 2 2 2 評價 保存穩定性 B A C B A A A A 深部硬化性 A B A A A A A A 硬化收縮率 A A A A A A A A [table 3] Example 25 26 27 28 29 30 31 32 Cationic polymerizable compound A-1 - - - - 50 50 50 50 A-2 50 50 - - 50 50 50 50 A-3 50 50 50 50 - - - - A-4 - - 50 50 - - - - Cationic photopolymerization initiator B-1 - - - - - - - - B-2 1 1 1 1 1 1 1 1 Cationic thermal polymerization initiator C-1 2 - - - - - - - C-2 - 2 2 - 2 2 2 2 C-3 - - - 2 - - - - Sensitizer D-1 - - - - 0.05 - - - D-2 - - - - - 0.033 - - D-3 - - - - - - 0.05 - D-4 - - - - - - - 0.05 stabilizer E-1 0.06 0.06 0.06 0.06 0.06 0.06 0.06 0.06 Solvent (Propylene Carbonate) 2 2 2 2 2 2 2 2 Evaluation storage stability B A C B A A A A deep sclerosis A B A A A A A A Hardening shrinkage A A A A A A A A

[表4]    比較例 1 2 3 4 5 6 7 8 9 10 陽離子聚合性化合物 A-1 - - 50 50 50 50 50 - - - A-2 50 - 50 50 50 50 50 - - - A-3 50 50 - - - - - - - - A-4 - 50 - - - - - - - - 陽離子光聚合起始劑 B-1 1 1 1 1 1 1 1 - - - B-2 - - - - - - - - - - 陽離子熱聚合起始劑 C-1 - - - - - - - - - - C-2 - - - - - - - - - - C-3 - - - - - - - - - - 自由基聚合性化合物 F-1 - - - - - - - 100 34 - F-2 - - - - - - - - 66 100 光自由基聚合起始劑 G-1 - - - - - - - 2 2 2 增感劑 D-1 - - - 0.05 - - - - - - D-2 - - - - 0.033 - - - - - D-3 - - - - - 0.05 - - - - D-4 - - - - - - 0.05 - - - 穩定劑 E-1 - - - - - - - - - - 溶劑(碳酸丙二酯) 2 2 2 2 2 2 2 2 2 2 評價 保存穩定性 A A A A A A A A A A 深部硬化性 D D D D D D D B B B 硬化收縮率 A A A A A A A C C C [Table 4] Comparative example 1 2 3 4 5 6 7 8 9 10 Cationic polymerizable compound A-1 - - 50 50 50 50 50 - - - A-2 50 - 50 50 50 50 50 - - - A-3 50 50 - - - - - - - - A-4 - 50 - - - - - - - - Cationic photopolymerization initiator B-1 1 1 1 1 1 1 1 - - - B-2 - - - - - - - - - - Cationic thermal polymerization initiator C-1 - - - - - - - - - - C-2 - - - - - - - - - - C-3 - - - - - - - - - - free radical polymerizable compound F-1 - - - - - - - 100 34 - F-2 - - - - - - - - 66 100 Photoradical Polymerization Initiator G-1 - - - - - - - 2 2 2 Sensitizer D-1 - - - 0.05 - - - - - - D-2 - - - - 0.033 - - - - - D-3 - - - - - 0.05 - - - - D-4 - - - - - - 0.05 - - - stabilizer E-1 - - - - - - - - - - Solvent (Propylene Carbonate) 2 2 2 2 2 2 2 2 2 2 Evaluation storage stability A A A A A A A A A A deep sclerosis D D D D D D D B B B Hardening shrinkage A A A A A A A C C C

根據表1~4明確可知,本發明之聚合性組合物之保存穩定性、感度、深部硬化性、及位置精度優異。本發明之聚合性組合物之用途並無限制,尤其是可用作以電子零件或配線、車輛材料等為代表之構件固定接著劑。 [產業上之可利用性] As is clear from Tables 1 to 4, the polymerizable composition of the present invention is excellent in storage stability, sensitivity, deep curability, and positional accuracy. The use of the polymerizable composition of the present invention is not limited, and in particular, it can be used as an adhesive for fixing components represented by electronic parts, wiring, and vehicle materials. [Industrial Availability]

本發明之聚合組合物可藉由照射活性能量線於短時間內獲得位置精度優異之厚膜之硬化物,生產性較高,因此可用作用於需要厚膜之硬化物之用途的聚合性組合物。The polymer composition of the present invention can obtain a cured product of a thick film with excellent positional accuracy in a short time by irradiating active energy rays, and has high productivity, so it can be used as a polymerizable composition for applications requiring a cured product of a thick film .

Claims (8)

一種聚合性組合物,其係含有陽離子光聚合起始劑、陽離子熱聚合起始劑、及陽離子聚合性化合物者, 陽離子熱聚合起始劑之含量相對於陽離子光聚合起始劑100質量份為50~1000質量份。 A polymerizable composition comprising a cationic photopolymerization initiator, a cationic thermal polymerization initiator, and a cationic polymerizable compound, The content of the cationic thermal polymerization initiator is 50 to 1000 parts by mass with respect to 100 parts by mass of the cationic photopolymerization initiator. 如請求項1之聚合性組合物,其中陽離子光聚合起始劑含有芳香族鋶鹽。The polymerizable composition according to claim 1, wherein the cationic photopolymerization initiator contains an aromatic perylene salt. 如請求項1之聚合性組合物,其中陽離子熱聚合起始劑含有苄基苯基鋶鹽。The polymerizable composition according to claim 1, wherein the cationic thermal polymerization initiator contains benzyl phenyl perionate. 如請求項1之聚合性組合物,其中陽離子聚合性化合物含有氧環丁烷化合物。The polymerizable composition of claim 1, wherein the cationically polymerizable compound contains an oxetane compound. 如請求項1之聚合性組合物,其含有增感劑。The polymerizable composition of claim 1, which contains a sensitizer. 如請求項1之聚合性組合物,其含有烷基硫酸鹽。The polymerizable composition of claim 1, which contains an alkyl sulfate. 一種硬化物,其係如請求項1至6中任一項之聚合性組合物之硬化物。A hardened product, which is the hardened product of the polymerizable composition according to any one of claims 1 to 6. 一種硬化物之製造方法,其包括對如請求項1至6中任一項之聚合性組合物進行光照射之步驟。A method for producing a cured product, comprising the step of irradiating the polymerizable composition according to any one of claims 1 to 6 with light.
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EP1752483A1 (en) * 2005-02-08 2007-02-14 The Yokohama Rubber Co., Ltd. Oxetane compound and hardenable composition containing the same
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