TW201741360A - Curable composition, method for curing same, and cured product obtained thereby - Google Patents

Curable composition, method for curing same, and cured product obtained thereby Download PDF

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TW201741360A
TW201741360A TW105143044A TW105143044A TW201741360A TW 201741360 A TW201741360 A TW 201741360A TW 105143044 A TW105143044 A TW 105143044A TW 105143044 A TW105143044 A TW 105143044A TW 201741360 A TW201741360 A TW 201741360A
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curable composition
compound
mass
epoxy compound
component
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Kazuteru Nagasaka
Yasunobu Ohno
Kazuhiko Matsudo
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Adeka Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used

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Abstract

Provided is a curable composition that is useful in an optical film, has excellent adhesive properties, and has a low viscosity, as well as a method for curing said composition, and a cured product obtained through said method. The curable composition comprises 100 parts by mass of a cationic curable component (A), and 0.1 to 15 parts by mass of a cationic polymerization initiator (B), wherein the cationic curable component (A) includes, as essential components thereof, an alicyclic epoxy compound (A1), an aliphatic epoxy compound (A2), and an oxetane compound (A3). The cationic curable component (A) preferably further contains an aromatic epoxy compound (A4).

Description

硬化性組成物、其硬化方法、藉此所得之硬化物 Curable composition, hardening method thereof, and cured product obtained thereby

本發明係關於一種硬化性組成物、其硬化方法、藉此所得之硬化物及接著劑,詳細而言係關於對光學薄膜為有用、密著性為優異、且低黏度之硬化性組成物、其硬化方法、藉此所得之硬化物。 The present invention relates to a curable composition, a curing method thereof, and a cured product and an adhesive obtained thereby, and more particularly to a curable composition which is useful for an optical film, has excellent adhesion, and has low viscosity. The hardening method, and the hardened material obtained thereby.

由環氧樹脂等所成之硬化性組成物係對於各種基材之接著性為優異,又,利用硬化劑來使環氧樹脂硬化而成之硬化物,其耐熱性、耐藥品性、電特性、機械特性等較為優異,因而被使用在油墨、塗料、各種塗布劑、接著劑、光學構件等的領域中。 A curable composition made of an epoxy resin or the like is excellent in adhesion to various substrates, and is a cured product obtained by curing an epoxy resin with a curing agent, and has heat resistance, chemical resistance, and electrical properties. Since it is excellent in mechanical properties and the like, it is used in the fields of inks, paints, various coating agents, adhesives, optical members, and the like.

例如專利文獻1中提案著一種陽離子聚合性接著劑,其係含有氧雜環丁烷化合物、芳香族縮水甘油醚與陽離子聚合起始劑。又,專利文獻2中提案著一種作為偏光板用接著劑的光硬化性組成物,其係含有光硬化性成分、矽烷偶合劑及光陽離子聚合起始劑,該光硬化性成分包含具有脂環式環氧基之環氧化合物。進而,專利文獻3中提案著一種陽離子性接著劑,其係作為偏光板用陽離子 性接著劑,含有環氧化合物、氧雜環丁烷化合物及光陽離子性聚合起始劑。進而又在專利文獻4中提案著一種陽離子聚合性組成物,其係作為陽離子聚合性有機物質含有芳香族環氧化合物、及脂肪族環氧化合物或脂環式環氧化合物。 For example, Patent Document 1 proposes a cationically polymerizable adhesive containing an oxetane compound, an aromatic glycidyl ether, and a cationic polymerization initiator. Further, Patent Document 2 proposes a photocurable composition as an adhesive for a polarizing plate, which contains a photocurable component, a decane coupling agent, and a photocationic polymerization initiator, and the photocurable component contains an alicyclic ring. An epoxy compound of the epoxy group. Further, Patent Document 3 proposes a cationic adhesive which is used as a cation for a polarizing plate. The adhesive contains an epoxy compound, an oxetane compound, and a photocationic polymerization initiator. Further, in Patent Document 4, a cationically polymerizable composition is proposed which contains an aromatic epoxy compound, an aliphatic epoxy compound or an alicyclic epoxy compound as a cationically polymerizable organic substance.

〔先前技術文獻〕 [Previous Technical Literature] 〔專利文獻〕 [Patent Document]

專利文獻1:日本特開2010-229392號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2010-229392

專利文獻2:日本特開2013-210445號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2013-210445

專利文獻3:日本特表2014-505274號公報 Patent Document 3: Japanese Patent Publication No. 2014-505274

專利文獻4:國際公開2015/005211號公報 Patent Document 4: International Publication No. 2015/005211

然而,將專利文獻1~4所記載之樹脂組成物使用於光學薄膜用之情形時,專利文獻1~4所記載之樹脂組成物難以取得密著性或塗布性之高度平衡,因而現狀為要求著對光學薄膜為有用的嶄新的硬化性組成物。 However, when the resin composition described in Patent Documents 1 to 4 is used for an optical film, the resin compositions described in Patent Documents 1 to 4 are difficult to obtain a high degree of balance between adhesion and coating properties, and thus the current situation is required. A new curable composition useful for optical films.

因此,本發明之目的係提供一種對光學薄膜為有用、密著性為優異、且低黏度之硬化性組成物、其硬化方法、藉此所得之硬化物。 Accordingly, an object of the present invention is to provide a curable composition which is useful for an optical film, has excellent adhesion, and has a low viscosity, a curing method thereof, and a cured product obtained thereby.

本發明人為解決上述課題經深入研究之結果發現,藉由調整硬化性組成物中之陽離子硬化性成分的組成,可取得密著性及塗布性之高度平衡,而完成本發明。 As a result of intensive studies, the inventors of the present invention have found that a high degree of balance between adhesion and coating properties can be obtained by adjusting the composition of the cation-curable component in the curable composition, and the present invention has been completed.

即,本發明之硬化性組成物,其係含有陽離子硬化性成分(A)100質量份、陽離子聚合起始劑(B)0.1~15質量份之硬化性組成物,其特徵為,前述陽離子硬化性成分(A)係以脂環式環氧化合物(A1)、脂肪族環氧化合物(A2)、及氧雜環丁烷化合物(A3)作為必要成分。 In other words, the curable composition of the present invention contains a curable composition of 100 parts by mass of the cationic curable component (A) and 0.1 to 15 parts by mass of the cationic polymerization initiator (B), and is characterized in that the cationic hardening is carried out. The component (A) contains an alicyclic epoxy compound (A1), an aliphatic epoxy compound (A2), and an oxetane compound (A3) as essential components.

本發明之硬化性組成物中,作為前述陽離子硬化性成分(A),以進而含有芳香族環氧化合物(A3)為較佳。又,本發明之硬化性組成物中,以進而含有具有環氧基之矽烷偶合劑(C)0.1~15質量份為較佳(但,陽離子硬化性成分(A)除外)。進而,本發明之硬化性組成物中,在前述陽離子硬化性成分(A)100質量%中,前述脂環式環氧化合物(A1)為1~30質量%為較佳。進而,又在本發明之硬化性組成物中,以前述脂環式環氧化合物(A1)係以選自3’,4’-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、7-氧雜二環[4.1.0]庚烷,聚[氧基-(1-側氧基-1,6-己二基)]衍生物、己二酸雙[(7-氧雜二環[4.1.0]庚烷-3-基)甲基]酯、1,2-環氧基-4-乙烯基環己烷、3,4-環氧基環己基甲基甲基丙烯酸酯及檸檬烯二氧化物之群之至少1種為較佳。又,本發明之硬化性組成物中,前述氧雜環丁烷化合物(A3)係以選自3-乙基-3-(己氧基甲 基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、伸苯二甲基雙氧雜環丁烷、3-乙基-3-(3-乙基-3-氧雜環丁基甲基氧基甲基)氧雜環丁烷之群之至少1種為較佳。 In the curable composition of the present invention, the cation curable component (A) further preferably contains an aromatic epoxy compound (A3). Further, the curable composition of the present invention preferably contains 0.1 to 15 parts by mass of the decane coupling agent (C) having an epoxy group (except for the cation curable component (A)). Furthermore, in the curable composition of the present invention, the alicyclic epoxy compound (A1) is preferably 1 to 30% by mass in 100% by mass of the cation curable component (A). Further, in the curable composition of the present invention, the alicyclic epoxy compound (A1) is selected from a 3',4'-epoxycyclohexylmethyl-3,4-epoxy ring. Hexane carboxylate, 7-oxabicyclo[4.1.0]heptane, poly[oxy-(1-o-oxy-1,6-hexanediyl)] derivative, adipic acid bis[( 7-oxabicyclo[4.1.0]heptan-3-yl)methyl]ester, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl At least one of a group of methacrylate and limonene dioxide is preferred. Further, in the curable composition of the present invention, the oxetane compound (A3) is selected from the group consisting of 3-ethyl-3-(hexyloxymethyl) Oxycyclobutane, 3-ethyl-3-(hydroxymethyl)oxetane, benzylenedioxybutane, 3-ethyl-3-(3-ethyl At least one of the group of 3-oxetanylmethyloxymethyl)oxetane is preferred.

又,本發明之硬化性組成物之硬化方法,其特徵係將本發明之硬化物藉由活性能量線之照射或加熱而使其硬化。 Further, the method for curing a curable composition of the present invention is characterized in that the cured product of the present invention is cured by irradiation or heating of an active energy ray.

進而,本發明之硬化物,其特徵係由本發明之硬化性組成物所成。 Further, the cured product of the present invention is characterized by being formed of the curable composition of the present invention.

依據本發明,可提供對光學薄膜為有用、密著性為優異、且低黏度之硬化性組成物、其硬化方法、藉此所得之硬化物。 According to the present invention, it is possible to provide a curable composition which is useful for an optical film, has excellent adhesion, and has a low viscosity, a curing method thereof, and a cured product obtained thereby.

〔實施發明之最佳形態〕 [Best Practice for Carrying Out the Invention]

以下,對於本發明之硬化性組成物、其硬化方法、藉此所得之硬化物及接著劑進行詳細說明。 Hereinafter, the curable composition of the present invention, the method for curing the same, and the cured product and the adhesive obtained thereby will be described in detail.

本發明之硬化性組成物係含有陽離子硬化性成分(A)100質量份、陽離子聚合起始劑(B)0.1~15質量份(以下,分別亦稱為「(A)成分」及「(B)成分」)。較佳為進而含有具有環氧基之矽烷偶合劑(C)0.1~15質量份(但,陽離子硬化性成分(A)除外)。本發明之硬化性組成物中,(A)成分係以脂環式環氧化合 物(A1)、脂肪族環氧化合物(A2)及氧雜環丁烷化合物(A3)作為必要成分,較佳為進而含有芳香族環氧化合物(A4)。以下,對於(A)~(C)成分進行詳細說明。 The curable composition of the present invention contains 100 parts by mass of the cationic curable component (A) and 0.1 to 15 parts by mass of the cationic polymerization initiator (B) (hereinafter, also referred to as "(A) component" and "(B, respectively). )ingredient"). It is preferable to further contain 0.1 to 15 parts by mass of the decane coupling agent (C) having an epoxy group (except for the cation hardening component (A)). In the curable composition of the present invention, the component (A) is an alicyclic epoxide The compound (A1), the aliphatic epoxy compound (A2), and the oxetane compound (A3) are essential components, and further preferably contain an aromatic epoxy compound (A4). Hereinafter, the components (A) to (C) will be described in detail.

<陽離子硬化性成分(A)> <Cationic hardening component (A)>

使用於本發明之硬化物之(A)成分係利用藉由能量線照射或加熱而活性化的陽離子聚合起始劑來引起高分子化、或交聯反應之化合物,並以脂環式環氧化合物(A1)、脂肪族環氧化合物(A2)及氧雜環丁烷化合物(A3)作為必要成分,較佳為含有芳香族環氧化合物(A4)。 The component (A) used in the cured product of the present invention is a compound which causes polymerization or crosslinking reaction by using a cationic polymerization initiator which is activated by energy ray irradiation or heating, and is an alicyclic epoxy. The compound (A1), the aliphatic epoxy compound (A2) and the oxetane compound (A3) preferably contain an aromatic epoxy compound (A4) as an essential component.

作為脂環式環氧化合物(A1)之具體例,可舉出具有至少1個脂環式環的多元醇的聚縮水甘油醚化物、或藉由利用氧化劑將含有環己烯或環戊烯環之化合物進行環氧化而得到之含有環己烯氧化物或環戊烯氧化物之化合物。可舉出例如氫化雙酚A二縮水甘油醚、3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯、6-甲基-3,4-環氧基環己基甲基-6-甲基-3,4-環氧基環己烷羧酸酯、3,4-環氧基-3-甲基環己基甲基-3,4-環氧基-3-甲基環己烷羧酸酯、3,4-環氧基-5-甲基環己基甲基-3,4-環氧基-5-甲基環己烷羧酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、3,4-環氧基-6-甲基環己烷羧酸酯、亞甲基雙(3,4-環氧基環己烷)、丙烷-2,2-二基-雙(3,4-環氧基環己烷)、2,2- 雙(3,4-環氧基環己基)丙烷、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧基環己烷羧酸酯)、環氧基六氫鄰苯二甲酸二辛酯、環氧基六氫鄰苯二甲酸二-2-乙基己酯、1-環氧基乙基-3,4-環氧基環己烷、1,2-環氧基-2-環氧基乙基環己烷、7-氧雜二環[4.1.0]庚烷,聚[氧基-(1-側氧基-1,6-己二基)]衍生物、己二酸雙[(7-氧雜二環[4.1.0]庚烷-3-基)甲基]酯、α-氧化蒎烯、檸檬烯二氧化物、3’,4’-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、1,2-環氧基-4-乙烯基環己烷、3,4-環氧基環己基甲基甲基丙烯酸酯等。該等之中,就密著性提升之觀點而言,以氫化雙酚A二縮水甘油醚、3,4-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯或3,4-環氧基-1-甲基環己基-3,4-環氧基-1-甲基己烷羧酸酯為較佳。 Specific examples of the alicyclic epoxy compound (A1) include a polyglycidyl ether compound of a polyol having at least one alicyclic ring, or a cyclohexene or cyclopentene ring by using an oxidizing agent. A compound containing a cyclohexene oxide or a cyclopentene oxide obtained by epoxidation of a compound. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-lanyl Cyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxy Cyclohexane carboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy 5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis(3,4-epoxycyclohexylmethyl)adipate, 3 , 4-epoxy-6-methylcyclohexanecarboxylate, methylene bis(3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4- Epoxycyclohexane), 2,2- Bis(3,4-epoxycyclohexyl)propane, dicyclopentadiene diepoxide, ethyl bis(3,4-epoxycyclohexanecarboxylate), epoxy hexahydroortho Dioctyl phthalate, di-2-ethylhexyl hexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy Benz-2-epoxyethylcyclohexane, 7-oxabicyclo[4.1.0]heptane, poly[oxy-(1-o-oxy-1,6-hexanediyl)] derivative , adipic acid bis[(7-oxabicyclo[4.1.0]heptan-3-yl)methyl]ester, α-pinene oxide, limonene dioxide, 3',4'-epoxy Cyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate Wait. Among these, in terms of adhesion improvement, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate Or 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate is preferred.

作為脂環式環氧化合物(A1),可使用市售品可舉出例如Celloxide 2021P、Celloxide 2081、Celloxide 2000、Celloxide 3000、CYCLOMER M100(DAICEL公司製);CYRACURE UVR-6128(Dow Chemical公司製)等。 For the alicyclic epoxy compound (A1), for example, Celloxide 2021P, Celloxide 2081, Celloxide 2000, Celloxide 3000, CYCLOMER M100 (manufactured by DAICEL), and CYRACURE UVR-6128 (manufactured by Dow Chemical Co., Ltd.) can be used. Wait.

本發明之硬化性組成物中,相對於(A)成分100質量%,脂環式環氧化合物(A1)為1~60質量%,特別是以5~50質量%就黏度、塗布性及反應性提升為較佳。 In the curable composition of the present invention, the alicyclic epoxy compound (A1) is from 1 to 60% by mass, particularly from 5 to 50% by mass, based on 100% by mass of the component (A), viscosity, coatability and reaction. Sexual improvement is preferred.

所謂脂肪族環氧化合物(A2)係指未被分類成脂環式環氧化合物(A1)或後述之芳香族環氧化合物 (A4)之環氧化合物,作為脂肪族環氧化合物之具體例,可舉出脂肪族醇的縮水甘油醚化物、烷基羧酸的縮水甘油酯等的單官能環氧化合物、或脂肪族多元醇或該環氧烷加成物的聚縮水甘油醚化物、脂肪族長鏈多元酸的聚縮水甘油酯等的多官能環氧化合物。作為代表性之化合物,可舉出烯丙基縮水甘油醚、丁基縮水甘油醚、2-乙基己基縮水甘油醚、C12~13混合烷基縮水甘油醚、1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油的三縮水甘油醚、三羥甲丙烷的三縮水甘油醚、山梨糖醇的四縮水甘油醚、二季戊四醇的六縮水甘油醚、聚乙二醇的二縮水甘油醚、聚丙二醇的二縮水甘油醚等的多元醇的縮水甘油醚、又藉由將1種或2種以上的環氧烷加成於丙二醇、三羥甲丙烷、甘油等的脂肪族多元醇所得到之聚醚多醇的聚縮水甘油醚化物、脂肪族長鏈二元酸的二縮水甘油酯。進而,可舉出脂肪族高階醇的單縮水甘油醚或高階脂肪酸的縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。該等之中,以脂肪族醇的縮水甘油醚化物或脂肪族多元醇或該環氧烷加成物的聚縮水甘油醚化物,就黏度、塗布性及反應性提升為較佳,進而,以乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、新戊二醇二縮水甘油醚或1,6-己二醇二縮水甘油醚為較佳。 The aliphatic epoxy compound (A2) means an aromatic epoxy compound which is not classified into an alicyclic epoxy compound (A1) or a later-described aromatic epoxy compound. The epoxy compound of the (A4), as a specific example of the aliphatic epoxy compound, may be a monofunctional epoxy compound such as a glycidyl ether compound of an aliphatic alcohol or a glycidyl ester of an alkyl carboxylic acid, or an aliphatic plural. A polyfunctional epoxy compound such as an alcohol or a polyglycidyl ether compound of the alkylene oxide adduct or a polyglycidyl ester of an aliphatic long-chain polybasic acid. Typical examples of the compound include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C12-13 mixed alkyl glycidyl ether, and 1,4-butanediol dihydrate. Glycerol ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerol, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, a glycidyl ether of a polyhydric alcohol such as hexa-glycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol or diglycidyl ether of polypropylene glycol, and addition of one or more alkylene oxides A polyglycidyl ether ester of a polyether polyol obtained from an aliphatic polyol such as propylene glycol, trimethylolpropane or glycerin, or a diglycidyl ester of an aliphatic long-chain dibasic acid. Further, examples thereof include monoglycidyl ether of an aliphatic higher-order alcohol, glycidyl ester of a higher-order fatty acid, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, and epoxidized polycondensation. Butadiene, etc. Among these, it is preferred that the glycidyl ether compound of an aliphatic alcohol or an aliphatic polyhydric alcohol or a polyglycidyl ether compound of the alkylene oxide adduct is improved in viscosity, coatability and reactivity. Ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether or 1,6-hexanediol diglycidyl ether is preferred.

作為脂肪族環氧化合物(A2),可使用市售品可舉出例如Denacol EX-121、Denacol EX-171、 Denacol EX-192、Denacol EX-211、Denacol EX-212、Denacol EX-313、Denacol EX-314、Denacol EX-321、Denacol EX-411、Denacol EX-421、Denacol EX-512、Denacol EX-521、Denacol EX-611、Denacol EX-612、Denacol EX-614、Denacol EX-622、Denacol EX-810、Denacol EX-811、Denacol EX-850、Denacol EX-851、Denacol EX-821、Denacol EX-830、Denacol EX-832、Denacol EX-841、Denacol EX-861、Denacol EX-911、Denacol EX-941、Denacol EX-920、Denacol EX-931(Nagase ChemteX公司製);EpolightM-1230、Epolight40E、Epolight100E、Epolight200E、Epolight400E、Epolight70P、Epolight200P、Epolight400P、Epolight1500NP、Epolight1600、Epolight80MF、Epolight100MF(共榮社化學公司製)、Adeka Glycirol ED-503、Adeka Glycirol ED-503G、Adeka Glycirol ED-506、Adeka Glycirol ED-523P(ADEKA公司製)等。 As the aliphatic epoxy compound (A2), commercially available products such as Denacol EX-121 and Denacol EX-171 can be used. Denacol EX-192, Denacol EX-211, Denacol EX-212, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-622, Denacol EX-810, Denacol EX-811, Denacol EX-850, Denacol EX-851, Denacol EX-821, Denacol EX-830, Denacol EX-832, Denacol EX-841, Denacol EX-861, Denacol EX-911, Denacol EX-941, Denacol EX-920, Denacol EX-931 (manufactured by Nagase ChemteX); Epolight M-1230, Epolight 40E, Epolight 100E, Epolight 200E , Epolight400E, Epolight70P, Epolight200P, Epolight400P, Epolight1500NP, Epolight1600, Epolight80MF, Epolight100MF (manufactured by Kyoeisha Chemical Co., Ltd.), Adeka Glycirol ED-503, Adeka Glycirol ED-503G, Adeka Glycirol ED-506, Adeka Glycirol ED-523P (ADEKA Company system) and so on.

本發明之硬化性組成物中,相對於(A)成分100質量%,脂肪族環氧化合物(A2)為5~40質量%,特別是以20~30質量%就黏度、塗布性及反應性提升為較佳。 In the curable composition of the present invention, the aliphatic epoxy compound (A2) is 5 to 40% by mass, particularly 20 to 30% by mass, in terms of viscosity, coatability, and reactivity with respect to 100% by mass of the component (A). Upgrade is better.

作為氧雜環丁烷化合物(A3),可舉出3,7-雙(3-氧雜環丁基)-5-氧雜-壬烷、1,4-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁基甲 氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁基甲氧基)己烷、3-乙基-3-(3-乙基-3-氧雜環丁基甲基氧基甲基)氧雜環丁烷、伸苯二甲基雙氧雜環丁烷(xylylenebisoxetane)等的二官能氧雜環丁烷化合物、3-乙基-3-[(苯氧基)甲基]氧雜環丁烷、3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(2-乙基己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、3-乙基-3-(氯甲基)氧雜環丁烷等的單官能氧雜環丁烷化合物等,以單官能脂肪族氧雜環丁烷化合物就黏度及反應性之點而言為較佳。該等係可1種單獨或亦可組合2種以上來使用。 Examples of the oxetane compound (A3) include 3,7-bis(3-oxetanyl)-5-oxa-decane and 1,4-bis[(3-ethyl-3). -oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,3-bis[(3-B Alkyl-3-oxetanyl Oxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, four Ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis (3) -ethyl-3-oxetanylmethoxy)hexane, 3-ethyl-3-(3-ethyl-3-oxetanylmethyloxymethyl)oxetane, benzophenone a difunctional oxetane compound such as methyl dioxetane (xylylenebisoxetane), 3-ethyl-3-[(phenoxy)methyl]oxetane, 3-ethyl-3 -(hexyloxymethyl)oxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl) a monofunctional oxetane compound such as oxetane or 3-ethyl-3-(chloromethyl)oxetane, and a monofunctional aliphatic oxetane compound for viscosity and reaction It is preferred in terms of sex. These may be used alone or in combination of two or more.

作為氧雜環丁烷化合物(A3),可使用將陽離子聚合性單體作為主要成分之市售品,可舉出例如2-羥基乙基乙烯基醚、二乙二醇單乙烯基醚、4-羥基丁基乙烯基醚(丸善石油化學公司製);Aron Oxetane OXT-121、OXT-221、EXOH、POX、OXA、OXT-101、OXT-211、OXT-212(東亞合成公司製)、ETERNACOLL OXBP、OX TP(宇部興產公司製)等。 As the oxetane compound (A3), a commercially available product containing a cationically polymerizable monomer as a main component can be used, and examples thereof include 2-hydroxyethyl vinyl ether and diethylene glycol monovinyl ether. -Hydroxybutyl vinyl ether (manufactured by Maruzen Petrochemical Co., Ltd.); Aron Oxetane OXT-121, OXT-221, EXOH, POX, OXA, OXT-101, OXT-211, OXT-212 (manufactured by Toagosei Co., Ltd.), ETERNACOLL OXBP, OX TP (made by Ube Industries Co., Ltd.).

本發明之硬化性組成物中,相對於(A)成分100質量%,氧雜環丁烷化合物(A3)為10~40質量%,特別是以20~30質量%就黏度、塗布性及反應性提升為較 佳。 In the curable composition of the present invention, the oxetane compound (A3) is 10 to 40% by mass, particularly 20 to 30% by mass, based on 100% by mass of the component (A), viscosity, coating property and reaction. Sexual ascension good.

所謂芳香族環氧化合物(A4)係指具有複數環氧基且包含芳香環之環氧化合物,作為多官能芳香族環氧化合物之具體例,可舉出酚、甲酚、丁酚等具有至少1個芳香族環的一元酚、或該環氧烷加成物的單/聚縮水甘油醚化物、例如雙酚A、雙酚F、或對該等進而加成環氧烷之化合物的縮水甘油醚化物或酚系酚醛清漆型環氧化合物;間苯二酚或氫醌、兒茶酚等的具有2個以上的酚性羥基之芳香族化合物的縮水甘油醚;苯二甲醇或苯二乙醇、苯二丁醇等的具有2個以上的醇性羥基之芳香族化合物的聚縮水甘油醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等的具有2個以上的羧酸之多元酸芳香族化合物的聚縮水甘油酯、苯甲酸或甲苯甲酸、萘甲酸等的苯甲酸類的聚縮水甘油酯、苯甲酸的縮水甘油酯、氧化苯乙烯或二乙烯基苯的環氧化物等。該等之中,以含有選自酚類的聚縮水甘油醚、具有2個以上醇性羥基之芳香族化合物的聚縮水甘油醚化物、多元酚類的聚縮水甘油醚化物、苯甲酸類的聚縮水甘油酯、多元酸類的聚縮水甘油酯之群中至少1種,就硬化性組成物的低黏度化之觀點而言為較佳。特別是作為芳香族環氧化合物,以雙酚A型環氧化合物、雙酚F型環氧化合物、雙酚E型環氧化合物、酚系酚醛清漆型環氧化合物,因對於硬化性為優異故為較佳。 The aromatic epoxy compound (A4) is an epoxy compound having a plurality of epoxy groups and containing an aromatic ring, and specific examples of the polyfunctional aromatic epoxy compound include at least phenol, cresol, butanol, and the like. a monocyclic phenol of one aromatic ring, or a mono/polyglycidyl ether compound of the alkylene oxide adduct, such as bisphenol A, bisphenol F, or glycidol of a compound which further adds alkylene oxide An ether compound or a phenolic novolak type epoxy compound; a glycidyl ether of an aromatic compound having two or more phenolic hydroxyl groups such as resorcinol, hydroquinone or catechol; benzenedimethanol or phenylenediethanol; a polyglycidyl ether compound of an aromatic compound having two or more alcoholic hydroxyl groups such as phenylbutanol; and a dimer having two or more carboxylic acids such as phthalic acid, terephthalic acid or trimellitic acid Polyglycidyl ester of acid aromatic compound, polyglycidyl benzoate such as benzoic acid or toluic acid, naphthoic acid, glycidyl benzoate, styrene oxide or epoxide of divinylbenzene. Among these, polyglycidyl ether compound containing polyglycidyl ether selected from phenols, aromatic compound having two or more alcoholic hydroxyl groups, polyglycidyl ether compound of polyphenols, and polycondensation of benzoic acid At least one of the group of the glycidyl ester and the polyglycidyl ester of the polybasic acid is preferred from the viewpoint of low viscosity of the curable composition. In particular, as the aromatic epoxy compound, a bisphenol A epoxy compound, a bisphenol F epoxy compound, a bisphenol E epoxy compound, or a phenol novolak epoxy compound is excellent in curability. It is better.

作為芳香族環氧化合物(A4),可使用市售品,可舉出例如Denacol EX-121、Denacol EX-145、 Denacol EX-146、Denacol EX-147、Denacol EX-201、Denacol EX-203、Denacol EX-711、Denacol EX-721、On Court EX-1020、On Court EX-1030、On Court EX-1040、On Court EX-1050、On Court EX-1051、On Court EX-1010、On Court EX-1011、On Court 1012(Nagase ChemteX公司製);OGSOL PG-100、OGSOL EG-200、OGSOL EG-210、OGSOL EG-250(大阪Gas Chemicals公司製);HP4032、HP4032D、HP4700(DIC公司製);ESN-475V(新日鐵住金化學公司製);Epikote YX8800(三菱化學公司製);Marr proof G-0105SA、Marr proof G-0130SP(日油公司製);EPICLON N-665、EPICLON HP-7200(DIC公司製);EOCN-1020、EOCN-102S、EOCN-103S、EOCN-104S、XD-1000、NC-3000、EPPN-501H、EPPN-501HY、EPPN-502H、NC-7000L(日本化藥公司製);ADEKA RESIN EP-4000、ADEKA RESIN EP-4005、ADEKA RESIN EP-4100、ADEKA RESIN EP-4901(ADEKA公司製);TECHMORE VG-3101L(PRINTEC公司製)等。 A commercially available product can be used as the aromatic epoxy compound (A4), and examples thereof include Denacol EX-121 and Denacol EX-145. Denacol EX-146, Denacol EX-147, Denacol EX-201, Denacol EX-203, Denacol EX-711, Denacol EX-721, On Court EX-1020, On Court EX-1030, On Court EX-1040, On Court EX-1050, On Court EX-1051, On Court EX-1010, On Court EX-1011, On Court 1012 (manufactured by Nagase ChemteX); OGSOL PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG- 250 (manufactured by Osaka Gas Chemicals Co., Ltd.); HP 4032, HP4032D, HP4700 (manufactured by DIC Corporation); ESN-475V (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.); Epikote YX8800 (manufactured by Mitsubishi Chemical Corporation); Marr proof G-0105SA, Marr proof G-0130SP (manufactured by Nippon Oil Co., Ltd.); EPICLON N-665, EPICLON HP-7200 (manufactured by DIC Corporation); EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN -501H, EPPN-501HY, EPPN-502H, NC-7000L (manufactured by Nippon Kayaku Co., Ltd.); ADEKA RESIN EP-4000, ADEKA RESIN EP-4005, ADEKA RESIN EP-4100, ADEKA RESIN EP-4901 (made by ADEKA) ;TECHMORE VG-3101L (manufactured by PRINTEC).

本發明之硬化性組成物中,相對於(A)成分100質量%,芳香族環氧化合物(A4)為20~60質量%,特別是以30~50質量%就硬化性提升之觀點而言為較佳。 In the curable composition of the present invention, the aromatic epoxy compound (A4) is 20 to 60% by mass based on 100% by mass of the component (A), and particularly 30 to 50% by mass, from the viewpoint of improvement in hardenability. It is better.

本發明之硬化性組成物中,作為陽離子硬化性成分(A),進而亦可加入乙烯基醚化合物(A5)。作為乙烯基醚化合物(A5),可舉出例如二乙二醇單乙烯基 醚、三乙二醇二乙烯基醚、n-十二烷基乙烯基醚、環己基乙烯基醚、2-乙基己基乙烯基醚、2-氯乙基乙烯基醚、乙基乙烯基醚、異丁基乙烯基醚、三乙二醇乙烯基醚、2-羥基乙基乙烯基醚、4-羥基丁基乙烯基醚、1,6-環己烷二甲醇單乙烯基醚、乙二醇二乙烯基醚、1,4-丁二醇二乙烯基醚、1,6-環己烷二甲醇二乙烯基醚等。 In the curable composition of the present invention, a vinyl ether compound (A5) may be further added as the cation curable component (A). As the vinyl ether compound (A5), for example, diethylene glycol monovinyl group Ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether , isobutyl vinyl ether, triethylene glycol vinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexane dimethanol monovinyl ether, ethylene Alcohol divinyl ether, 1,4-butanediol divinyl ether, 1,6-cyclohexane dimethanol divinyl ether, and the like.

本發明之硬化性組成物中,(A)成分中之脂環式環氧化合物(A1)、脂肪族環氧化合物(A2)、氧雜環丁烷化合物(A3)、芳香族環氧化合物(A4)及乙烯基醚化合物(A5)的使用比例,相對於(A)成分100質量%,以脂環式環氧化合物(A1)1~30質量%、脂肪族環氧化合物(A2)5~40質量%、氧雜環丁烷化合物(A3)10~40質量%、芳香族環氧化合物(A4)20~60質量%、及乙烯基醚化合物(A5)1~15質量份,就黏度、塗布性、反應性及硬化性提升為較佳。 In the curable composition of the present invention, the alicyclic epoxy compound (A1), the aliphatic epoxy compound (A2), the oxetane compound (A3), and the aromatic epoxy compound in the component (A) ( The ratio of the use of the A4) and the vinyl ether compound (A5) is 1 to 30% by mass of the alicyclic epoxy compound (A1) and the aliphatic epoxy compound (A2) 5 to 100% by mass of the component (A). 40% by mass, oxetane compound (A3) 10 to 40% by mass, aromatic epoxy compound (A4) 20 to 60% by mass, and vinyl ether compound (A5) 1 to 15 parts by mass, viscosity, Improvement in coatability, reactivity, and hardenability is preferred.

<陽離子聚合起始劑(B)> <Cationic polymerization initiator (B)>

使用於本發明之硬化性組成物之(B)成分,只要是可藉由能量線照射或加熱而開始陽離子聚合並釋放出物質的化合物即可,任何化合物皆可,但較佳為藉由能量線的照射而釋放出路易斯酸的鎓鹽之複鹽、或其衍生物。作為相關化合物之代表性例子,可舉出以下述一般式所表示之陽離子與陰離子的鹽。 The component (B) used in the curable composition of the present invention may be any compound as long as it is a compound which can initiate cationic polymerization by light irradiation or heating, and is preferably released by a substance. The double salt of the cerium salt of the Lewis acid, or a derivative thereof, is released by irradiation of the wire. Representative examples of the related compound include a salt of a cation and an anion represented by the following general formula.

[A]r+[B]r- [A] r+ [B] r-

於此,陽離子[A]r+以鎓為較佳,其構造係可以例如下述一般式來表示。 Here, the cation [A]r+ is preferably 鎓, and its structure can be represented, for example, by the following general formula.

[(R2)aQ]r+ [(R 2 ) a Q] r+

進而,於此R2係碳原子數為1~60,亦可包含幾個除碳原子以外的原子的有機基。a係1~5的整數。a個的R2為各自獨立,可以相同亦可以不同。又,至少1個以具有芳香環的如上述般的有機基為較佳。Q係選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N=N所成之之群之原子或原子團。又,將陽離子[A]r+中之Q的原子價設為q時,r=a-q之關係必須成立(但,N=N作為原子價0來處理)。 Further, the R 2 -based carbon atom may have from 1 to 60 carbon atoms, and may contain several organic groups other than carbon atoms. a is an integer from 1 to 5. Each of R 2 is independent and may be the same or different. Further, at least one organic group having an aromatic ring as described above is preferred. Q is selected from the group consisting of atoms, or groups of atoms formed of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. Further, when the valence of Q in the cation [A] r+ is q, the relationship of r = aq must be established (however, N = N is treated as the valence of 0).

又,陰離子[B]r-係以鹵化物錯合體為較佳,該構造係可以例如下述一般式來表示。 Further, the anion [B]r- is preferably a halide complex, and the structure can be represented, for example, by the following general formula.

[LYb]r- [LY b ] r-

進而,於此L係鹵化物錯合體的中心原子之金屬或半金屬(Metalloid),為B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。Y為鹵素原子。B係3~7的整數。又,將陰離子[B]r-中之L的原子價設為p時,r=b-p之關係必須成立。 Further, the metal or semimetal of the central atom of the L-based halide complex is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V. , Cr, Mn, Co, etc. Y is a halogen atom. B is an integer from 3 to 7. Further, when the valence of L in the anion [B] r- is p, the relationship of r = bp must be established.

作為一般式的陰離子[LYb]r-之具體例,可舉出肆(五氟苯基)硼酸根、四(3,5-二氟-4-甲氧基苯基)硼酸根、四氟硼酸根(BF4)-、六氟磷酸根(PF6)-、六氟銻酸根(SbF6)-、六氟砷酸根(AsF6)-、六氯銻酸根(SbCl6)-等。 Specific examples of the general anion [LY b ] r- include quinone (pentafluorophenyl) borate, tetrakis(3,5-difluoro-4-methoxyphenyl)borate, and tetrafluoroethylene. Boric acid (BF 4 ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - and the like.

又,陰離子[B]r-係亦可較佳使用以下述一般式所表示之構造者。 Further, as the anion [B] r- system, a structure represented by the following general formula can be preferably used.

[LYb-1(OH)]r- [LY b-1 (OH)] r-

L、Y、b係與上述為相同。又,作為其他可使用的陰離子,可舉出過氯酸離子(ClO4)-、三氟甲基亞硫酸離子(CF3SO3)-、氟磺酸離子(FSO3)-、甲苯磺酸陰離子、三硝基苯磺酸陰離子、樟腦磺酸根、九氟丁烷磺酸根、十六氟辛烷磺酸根、四芳基硼酸根、肆(五氟苯基)磺酸根等。 The L, Y, and b systems are the same as described above. Further, examples of other anions which can be used include perchloric acid ions (ClO 4 ) - , trifluoromethyl sulfite ions (CF 3 SO 3 ) - , fluorosulfonic acid ions (FSO 3 ) - , toluenesulfonic acid. Anion, trinitrobenzenesulfonic acid anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, ruthenium (pentafluorophenyl)sulfonate, and the like.

本發明中,如此等鎓鹽之中,以使用下述之(i)~(iii)的芳香族鎓鹽為特佳。本發明之硬化性組成物中,可單獨使用該等中之1種、或亦可併用2種以上。 In the present invention, among the above-mentioned sulfonium salts, the aromatic sulfonium salts of the following (i) to (iii) are particularly preferred. In the curable composition of the present invention, one of these may be used alone or two or more of them may be used in combination.

(i)苯基重氮六氟磷酸鹽、4-甲氧基苯基重氮六氟銻酸鹽、4-甲基苯基重氮六氟磷酸鹽等的芳基重氮鎓鹽 (i) aryldiazonium salt such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate or 4-methylphenyldiazonium hexafluorophosphate

(ii)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-tert-丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪肆(五氟苯基)硼酸鹽等的二芳基錪鎓鹽 (ii) diphenylphosphonium hexafluoroantimonate, bis(4-methylphenyl)phosphonium hexafluorophosphate, bis(4-tert-butylphenyl)phosphonium hexafluorophosphate, tolylcumene Diarylsulfonium salt of quinone (pentafluorophenyl) borate

(iii)下述群I或群II所表示之鋶陽離子與六氟銻離子、六氟磷酸根離子、肆(五氟苯基)硼酸根離子等的鋶鹽 (iii) a phosphonium salt of a phosphonium cation represented by the following group I or group II, and a hexafluoroantimonium ion, a hexafluorophosphate ion, or a quinone (pentafluorophenyl) borate ion;

又,作為其他較佳者,可舉出(η5-2,4-環戊二烯-1-基)〔(1,2,3,4,5,6-η)-(1-甲基乙基)苯〕-鐵-六氟磷酸鹽等的鐵-芳烴錯合體、或參(乙醯丙酮)鋁、參(乙基丙酮乙酸)鋁、參(水楊醛酸)鋁等的鋁錯合體與三苯基矽烷醇等的矽烷醇類的混合物;噻吩鎓鹽、四氫噻吩鎓鹽(thiolanium)、苄基銨、吡啶鎓鹽、肼鎓鹽等的鹽;二乙三胺、三乙三胺、四乙五胺等的聚烷基多胺類;1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛酮二胺等的脂環式多胺類;m-二甲苯二胺、二胺基二苯基甲烷、二胺基二苯基碸等的芳香族多胺類;藉由利用常法使上述多胺類、與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、雙酚F-二縮水甘油醚等的縮 水甘油醚類或羧酸的縮水甘油酯類等的各種環氧化合物進行反應而製造的聚環氧基成改質物;藉由利用常法使上述有機多胺類、與鄰苯二甲酸、間苯二甲酸、二聚酸等的羧酸類進行反應而製造的醯胺化改質物;藉由利用常法將上述多胺類與甲醛等的醛類及酚、甲酚、二甲酚、第三丁酚、間苯二酚等的在核上具有至少一個醛化反應性部位的酚類進行反應而製造的曼尼希(Mannich)化改質物;多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、3,8-二甲基癸二酸、3,7-二甲基癸二酸、氫化二聚酸、二聚酸等的脂肪族二羧酸類;鄰苯二甲酸、對苯二甲酸、間苯二甲酸、萘二羧酸等的芳香族二羧酸類;環己烷二羧酸等的脂環式二羧酸類;偏苯三甲酸、均苯三甲酸、蓖麻油脂肪酸的三聚物等的三羧酸類;焦蜜石酸等的四羧酸類等)的酸酐;二氰二胺、咪唑類、羧酸酯、磺酸酯、胺醯亞胺等。 Further, as another preferred one, (η 5 -2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methyl An iron-aromatic hydrocarbon complex such as ethyl)benzene]-iron-hexafluorophosphate or an aluminum miscide such as aluminum acetylate, aluminum ginseng or aluminum ginseng (salicylic acid) a mixture of a decyl alcohol such as a triphenyl decyl alcohol; a salt of a thiophene sulfonium salt, a thiolanium salt, a benzyl ammonium salt, a pyridinium salt, a phosphonium salt or the like; a diethylenetriamine, a triethylamine Polyalkyl polyamines such as triamine, tetraethylenepentamine, etc.; 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophorone II An alicyclic polyamine such as an amine; an aromatic polyamine such as m-xylylenediamine, diaminodiphenylmethane or diaminodiphenylphosphonium; and the above polyamines by a usual method And various epoxy resins such as glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, or glycidyl esters of carboxylic acid a polyepoxy group produced by reacting a compound to form a modified substance; by using a conventional method to make the above organic polyamines, and adjacent An amide-modified product produced by reacting a carboxylic acid such as phthalic acid, isophthalic acid or a dimer acid; and the above-mentioned polyamines and aldehydes such as formaldehyde and phenol, cresol, and the like by a conventional method Mannich modified product produced by reacting phenols having at least one hydroformylation site on the nucleus such as cresol, tromide, resorcin, etc.; polycarboxylic acid (oxalic acid, C Diacid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid , 3-methyladipate, 3-methylglutaric acid, 2-methyloctanedioic acid, 3,8-dimethylsebacic acid, 3,7-dimethylsebacic acid, hydrogenated dimerization An aliphatic dicarboxylic acid such as an acid or a dimer acid; an aromatic dicarboxylic acid such as phthalic acid, terephthalic acid, isophthalic acid or naphthalene dicarboxylic acid; or an alicyclic ring such as cyclohexane dicarboxylic acid. a dicarboxylic acid; a tricarboxylic acid such as trimellitic acid, trimesic acid, a trimer of a castor oil fatty acid; a tetracarboxylic acid such as pyromic acid; or an acid anhydride; dicyandiamide, an imidazole, Carboxylic ester, sulfonate Ester, amine (PEI) and the like.

該等之中,就實用面與光感度提升之觀點而言,以使用芳香族錪鎓鹽、芳香族鋶鹽、鐵-芳烴錯合體為較佳。 Among these, in view of the improvement of the practical surface and the light sensitivity, it is preferred to use an aromatic onium salt, an aromatic onium salt, or an iron-aromatic hydrocarbon complex.

相對於(A)成分之(B)成分的使用比例並無特別限定,在不阻礙本發明之目的的範圍內依大概通常的使用比例來使用即可,例如相對於(A)成分100質量份,(B)成分為0.1~15質量份,較佳可設為1~10質量 份。若過少時硬化將容易變得不充分,若過多時將對於硬化物的吸水率或硬化物強度等的諸物性有不良影響之情形。 The ratio of use of the component (B) of the component (A) is not particularly limited, and may be used in an approximate usual use ratio within a range not inhibiting the object of the present invention, for example, 100 parts by mass relative to the component (A). The component (B) is 0.1 to 15 parts by mass, preferably 1 to 10 by mass. Share. When the amount is too small, the hardening is likely to be insufficient, and if it is too large, the physical properties such as the water absorption rate of the cured product and the strength of the cured product may be adversely affected.

<具有環氧基之矽烷偶合劑(C)> <Centane coupling agent (C) having an epoxy group>

使用於本發明之(C)成分係具有環氧基之矽烷偶合劑,但不包含相當於(A)成分者。作為(C)成分,可使用環氧基官能性烷氧基矽烷,可舉出例如γ-縮水甘油氧基丙基三甲氧基矽烷、γ-縮水甘油氧基丙基三乙氧基矽烷、γ-縮水甘油氧基丙基甲基二甲氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等。 The component (C) used in the present invention is a decane coupling agent having an epoxy group, but does not contain a component corresponding to the component (A). As the component (C), an epoxy-functional alkoxydecane can be used, and examples thereof include γ-glycidoxypropyltrimethoxydecane, γ-glycidoxypropyltriethoxydecane, and γ. - glycidoxypropylmethyldimethoxydecane, γ-glycidoxypropylmethyldiethoxydecane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane Wait.

作為(C)成分,可使用市售品可舉出例如D2632、G0261、G0210、T2675(東京化成公司製);KBM-303、KBM-402、KBM-403、KBE-402、KBE-403(Shin-Etsu Silicone公司製)等。 For the component (C), for example, D2632, G0261, G0210, and T2675 (manufactured by Tokyo Chemical Industry Co., Ltd.); KBM-303, KBM-402, KBM-403, KBE-402, and KBE-403 (Shin) can be used. -Etsu Silicone Co., Ltd.).

(C)成分的使用量並無特別限定,例如相對於(A)成分100質量份,(C)成分為0.1~15質量份,較佳可設為1~10質量份。 The amount of the component (C) to be used is not particularly limited. For example, the component (C) is 0.1 to 15 parts by mass, preferably 1 to 10 parts by mass, per 100 parts by mass of the component (A).

<其他之成分> <Other ingredients>

本發明之硬化性組成物中,因應所需可使用增感劑及/或增感助劑。增感劑是在比陽離子聚合起始劑(B)所顯示的最大吸收波長更長的波長處顯示最大吸收,為使藉由 陽離子聚合起始劑(B)之聚合起始反應促進之化合物。又,增感助劑係可進一步促進增感劑之作用之化合物。 In the curable composition of the present invention, a sensitizer and/or a sensitizing aid may be used as needed. The sensitizer exhibits maximum absorption at a wavelength longer than the maximum absorption wavelength shown by the cationic polymerization initiator (B), A compound which promotes the polymerization initiation reaction of the cationic polymerization initiator (B). Further, the sensitizer is a compound which further promotes the action of the sensitizer.

作為增感劑及增感助劑,可舉出蒽系化合物、萘系化合物等。 Examples of the sensitizer and the sensitizing agent include an anthraquinone compound and a naphthalene compound.

作為蒽系化合物,可舉出例如下式(1)所表示者。 The oxime compound is, for example, represented by the following formula (1).

(式中,R1及R2各自獨立表示為碳原子數1~6的烷基或碳原子數2~12的烷氧基烷基,R3表示為氫原子或碳原子數1~6的烷基)。 (wherein R 1 and R 2 are each independently represented by an alkyl group having 1 to 6 carbon atoms or an alkoxyalkyl group having 2 to 12 carbon atoms; and R 3 is represented by a hydrogen atom or a carbon number of 1 to 6; alkyl).

若舉出上述式(1)所表示之蒽系化合物之具體例,有如以下般之化合物。 Specific examples of the oxime-based compound represented by the above formula (1) include the following compounds.

9,10-二甲氧基蒽、9,10-二乙氧基蒽、9,10-二丙氧基蒽、9,10-二異丙氧基蒽、9,10-二丁氧基蒽、9,10-二戊氧基蒽、9,10-二己氧基蒽、9,10-雙(2-甲氧基乙氧基)蒽、9,10-雙(2-乙氧基乙氧基)蒽、9,10-雙(2-丁氧基乙氧基)蒽、9,10-雙(3-丁氧基丙氧基)蒽、2-甲基-或2-乙基-9,10-二甲氧基蒽、2-甲基-或2-乙基-9,10-二乙氧基蒽、2-甲基-或2-乙基-9,10-二丙氧基蒽、2-甲基-或2-乙基-9,10-二異丙氧基蒽、2-甲基-或2-乙基-9,10-二丁氧基蒽、2-甲基-或2-乙基-9,10-二戊氧基蒽、2-甲基-或 2-乙基-9,10-二己氧基蒽等。 9,10-Dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-diisopropoxyanthracene, 9,10-dibutoxyanthracene , 9,10-dipentyloxy fluorene, 9,10-dihexyloxy fluorene, 9,10-bis(2-methoxyethoxy) fluorene, 9,10-bis(2-ethoxylated Oxy) ruthenium, 9,10-bis(2-butoxyethoxy)anthracene, 9,10-bis(3-butoxypropoxy)anthracene, 2-methyl- or 2-ethyl- 9,10-Dimethoxyanthracene, 2-methyl- or 2-ethyl-9,10-diethoxyanthracene, 2-methyl- or 2-ethyl-9,10-dipropoxy Bismuth, 2-methyl- or 2-ethyl-9,10-diisopropoxy oxime, 2-methyl- or 2-ethyl-9,10-dibutoxyanthracene, 2-methyl- Or 2-ethyl-9,10-dipentyloxy guanidine, 2-methyl- or 2-ethyl-9,10-dihexyloxyfluorene or the like.

作為萘系化合物,可舉出例如下式(2)所表示者。 The naphthalene compound is, for example, represented by the following formula (2).

(式中,R4及R5各自獨立表示為氫原子或碳原子數1~6的烷基)。 (wherein R 4 and R 5 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms).

若舉出上述式(2)所表示之萘系化合物之具體例時,有如以下般之化合物。 When a specific example of the naphthalene compound represented by the above formula (2) is given, there are the following compounds.

4-甲氧基-1-萘酚、4-乙氧基-1-萘酚、4-丙氧基-1-萘酚、4-丁氧基-1-萘酚、4-己氧基-基-1-萘酚、1,4-二甲氧基萘、1-乙氧基-4-甲氧基萘、1,4-二乙氧基萘、1,4-二丙氧基萘、1,4-二丁氧基萘等。 4-methoxy-1-naphthol, 4-ethoxy-1-naphthol, 4-propoxy-1-naphthol, 4-butoxy-1-naphthol, 4-hexyloxy- 1-naphthol, 1,4-dimethoxynaphthalene, 1-ethoxy-4-methoxynaphthalene, 1,4-diethoxynaphthalene, 1,4-dipropoxynaphthalene, 1,4-Dibutoxynaphthalene or the like.

相對於上述(A)成分之增感劑及增感助劑的使用比例並無特別限定,只要不阻礙本發明之目的之範圍內,依大概通常的使用比例來使用即可,例如相對於(A)成分的100質量份,增感劑及增感助劑分別為0.1~3質量份,就硬化性提升之觀點而言為較佳。 The ratio of use of the sensitizer and the sensitizing agent to the component (A) is not particularly limited, and may be used in an approximate usual use ratio as long as it does not inhibit the object of the present invention, for example, relative to ( 100 parts by mass of the component A), the sensitizer and the sensitizer are each 0.1 to 3 parts by mass, and it is preferable from the viewpoint of improvement in hardenability.

本發明之硬化性組成物,因應所需藉由使用熱塑性有機聚合物,亦可改善硬化物之特性。作為熱塑性有機聚合物,可舉出例如聚苯乙烯、聚甲基丙烯酸甲酯、甲基丙烯酸甲酯-丙烯酸乙酯共聚物、聚(甲基)丙烯 酸、苯乙烯-(甲基)丙烯酸共聚物、(甲基)丙烯酸-甲基丙烯酸甲酯共聚物、(甲基)丙烯酸縮水甘油酯-聚(甲基)丙烯酸甲酯共聚物、聚乙烯基丁縮醛、纖維素酯、聚丙烯醯胺、飽和聚酯等。 The curable composition of the present invention can also improve the properties of the cured product by using a thermoplastic organic polymer as needed. Examples of the thermoplastic organic polymer include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, and poly(methyl) propylene. Acid, styrene-(meth)acrylic acid copolymer, (meth)acrylic acid-methyl methacrylate copolymer, glycidyl (meth)acrylate-poly(methyl) methacrylate copolymer, polyvinyl Butyral, cellulose ester, polypropylene decylamine, saturated polyester, and the like.

本發明之硬化性組成物中,並無特別限制可使用能夠溶解或分散上述(A)、(B)及(C)的各成分的一般所用之溶媒,可舉出例如甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等的酮類;乙基醚、二噁烷、四氫呋喃、1,2-二甲氧基乙烷、1,2-二乙氧基乙烷、丙二醇單甲基醚、二丙二醇二甲基醚等的醚系溶媒;乙酸甲酯、乙酸乙酯、乙酸-n-丙酯、乙酸異丙酯、乙酸n-丁酯、乙酸環己酯、乳酸乙酯、琥珀酸二甲酯、單異丁酸酯(texanol)等的酯系溶媒;乙二醇單甲基醚、乙二醇單乙基醚等的溶纖劑系溶媒;甲醇、乙醇、異-或n-丙醇、異-或n-丁醇、戊醇等的醇系溶媒;乙二醇單甲基乙酸酯、乙二醇單乙基乙酸酯、丙二醇-1-單甲基醚-2-乙酸酯(PGMEA)、二丙二醇單甲基醚乙酸酯、3-甲氧基丁基乙酸酯、乙氧基乙基丙酸酯等的醚酯系溶媒;苯、甲苯、二甲苯等的BTX系溶媒;己烷、庚烷、辛烷、環己烷等的脂肪族烴系溶媒;松節油、D-檸檬烯、蒎烯等的萜烯系烴油;礦油精、Swasol # 310(Cosmo Matsuyama Oil(股))、Solvesso # 100(Exxon Chemical(股))等的石蠟系溶媒;四氯化碳、三氯甲烷、三氯乙烯、二氯甲烷、1,2-二氯乙烷等的鹵化 脂肪族烴系溶媒;氯苯等的鹵化芳香族烴系溶媒;碳酸伸丙酯(propylene carbonate)、卡必醇系溶媒、苯胺、三乙基胺、吡啶、乙酸、乙腈、二硫化碳、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡咯啶酮、二甲基亞碸、水等,該等的溶媒係可使用1種或可作為2種以上的混合溶媒來使用。 The curable composition of the present invention is not particularly limited, and a solvent which can be used for dissolving or dispersing the components (A), (B) and (C) can be used, and examples thereof include methyl ethyl ketone. a ketone such as methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone or 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, An ether solvent such as 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether or dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, acetic acid - An ester-based solvent such as n-propyl ester, isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate, or texanol; Solvent-based solvent such as base ether or ethylene glycol monoethyl ether; alcohol-based solvent such as methanol, ethanol, iso- or n-propanol, iso- or n-butanol or pentanol; Methyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl Ether esters such as acetoxyacetate and ethoxyethyl propionate a solvent; a BTX-based solvent such as benzene, toluene or xylene; an aliphatic hydrocarbon-based solvent such as hexane, heptane, octane or cyclohexane; or a terpene-based hydrocarbon oil such as turpentine, D-limonene or decene; Paraffin-based solvent such as mineral spirits, Swasol #310 (Cosmo Matsuyama Oil), Solvesso # 100 (Exxon Chemical), carbon tetrachloride, chloroform, trichloroethylene, dichloromethane, 1 Halogenation of 2-dichloroethane An aliphatic hydrocarbon solvent; a halogenated aromatic hydrocarbon solvent such as chlorobenzene; propylene carbonate, carbitol solvent, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N - dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylhydrazine, water, etc., one or two of these solvents may be used. The above mixed solvent is used.

又,本發明之硬化性組成物中,只要不損及本發明之效果,因應所需可添加其他的單體、其他的能量線感受性聚合起始劑、無機填料、有機填料、顏料、染料等的著色劑、消泡劑、增稠劑、界面活性劑、整平劑、阻燃劑、觸變劑、稀釋劑、可塑劑、穩定劑、阻聚劑、紫外線吸收劑、抗氧化劑、靜電防止劑、流動調整劑、接著促進劑等的各種樹脂添加物等。 Further, in the curable composition of the present invention, other monomers, other energy ray-sensitive polymerization initiators, inorganic fillers, organic fillers, pigments, dyes, and the like may be added as needed, as long as the effects of the present invention are not impaired. Coloring agent, defoaming agent, thickener, surfactant, leveling agent, flame retardant, thixotropic agent, diluent, plasticizer, stabilizer, polymerization inhibitor, ultraviolet absorber, antioxidant, static electricity prevention Various resin additives such as a solvent, a flow regulator, and a subsequent accelerator.

本發明之硬化性組成物係可利用輥塗布、淋幕式塗布、各種的印刷、浸漬等的周知之手段塗布在支撐基體上。又,可暫時在薄膜等的支撐基體上施予後,轉印至其他的支撐基體上,其適用方法並無限制。 The curable composition of the present invention can be applied to a support substrate by well-known means such as roll coating, curtain coating, various printing, and immersion. Further, it can be temporarily applied to a support substrate such as a film and then transferred to another support substrate, and the method of application is not limited.

作為支撐基體的材料,並無特別限制可使用一般所使用者,可舉出例如玻璃等的無機材料;二乙醯基纖維素、三乙醯基纖維素(TAC)、丙醯基纖維素、丁醯基纖維素、乙醯基丙醯纖維素、硝化纖維素等的纖維素酯;聚醯胺;聚醯亞胺;聚胺基甲酸酯;環氧樹脂;聚碳酸酯;聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚對苯二甲酸丁二酯、聚-1,4-環己烷對苯二甲酸二甲酯、聚乙烯 -1,2-二苯氧基乙烷-4,4’-二羧酸酯、聚對苯二甲酸丁二酯等的聚酯;聚苯乙烯;聚乙烯、聚丙烯、聚甲基戊烯等的聚烯烴;聚乙酸乙烯酯、聚氯乙烯、聚氟乙烯等的乙烯基化合物;聚甲基丙烯酸甲酯、聚丙烯酸酯等的丙烯酸系樹脂;聚碳酸酯;聚碸;聚醚碸;聚醚酮;聚醚醯亞胺;聚氧乙烯、降莰烯樹脂、環烯烴聚合物(COP)等的高分子材料。尚,對於支撐基體亦可進行電暈放電處理、焰火處理、紫外線處理、高周波處理、輝光放電處理、活性等離子處理、雷射處理等的表面活性化處理。 The material of the support substrate is not particularly limited and can be used as a general user, and examples thereof include inorganic materials such as glass; diacetyl cellulose, triethyl cellulose (TAC), and propyl cellulose. Cellulose esters of butyl sulfonium cellulose, acetyl hydrazine cellulose, nitrocellulose, etc.; polydecylamine; poly phthalimide; polyurethane; epoxy resin; polycarbonate; Ethylene glycol, polyethylene naphthalate, polybutylene terephthalate, dimethyl 1,4-cyclohexane terephthalate, polyethylene -1,2-diphenoxyethane-4,4'-dicarboxylate, polyester such as polybutylene terephthalate; polystyrene; polyethylene, polypropylene, polymethylpentene Polyolefins such as polyvinyl acetate, polyvinyl chloride, polyvinyl fluoride, etc.; acrylic resins such as polymethyl methacrylate and polyacrylate; polycarbonate; polyfluorene; polyether oxime; Polyether ketone; polyether quinone imine; polymer material such as polyoxyethylene, norbornene resin, cycloolefin polymer (COP). Further, the support substrate may be subjected to surface activation treatment such as corona discharge treatment, fireworks treatment, ultraviolet treatment, high-frequency treatment, glow discharge treatment, active plasma treatment, or laser treatment.

作為本發明之硬化性組成物及其硬化物之具體的用途,可舉出以光學薄膜、接著劑、眼鏡、攝影用透鏡為代表的光學材料、塗料、塗布劑、襯料劑、油墨、阻劑、液狀阻劑、印刷版、絕緣清漆、絕緣薄片、層合板、印刷基板、半導體裝置用‧LED封裝用‧液晶注入口用‧有機EL用‧光元件用‧電氣絕緣用‧電子零件用‧分離膜用等的密封劑、成形材料、油灰、玻璃纖維含浸劑、填料劑、半導體用‧太陽電池用等的鈍化膜、層間絕緣膜、保護膜、液晶顯示裝置的背光源中所使用的稜鏡透鏡薄片、投影電視等的螢幕所使用的菲涅耳透鏡薄片、雙凸透鏡薄片等的透鏡薄片的透鏡部、或使用如此般薄片的背光源等、微透鏡等的光學透鏡、光學元件、光偶合器、光學波導、光學的造形用注模劑等。 Specific examples of the use of the curable composition of the present invention and the cured product thereof include optical materials, paints, coating agents, lining agents, inks, and resists represented by optical films, adhesives, glasses, and photographic lenses. Agent, liquid resist, printing plate, insulating varnish, insulating sheet, laminate, printed circuit board, semiconductor device, LED package, liquid crystal injection port, organic EL, optical component, electrical insulation, electronic component ‧Use of sealing agent for forming film, molding material, putty, glass fiber impregnating agent, filler, passivation film for semiconductor, solar cell, etc., interlayer insulating film, protective film, and backlight for liquid crystal display device a lens portion of a lens sheet such as a Fresnel lens sheet or a lenticular lens sheet used for a screen such as a lenticular lens sheet or a projection television, or an optical lens or an optical element such as a microlens or the like using such a sheet-like backlight; An optical coupler, an optical waveguide, an optical molding agent, and the like.

例如適用作為光學薄膜之情形時,作為基材使用金屬、木材、橡膠、塑膠、玻璃、陶瓷製品等,利用 上述之手段在基材上塗布本發明之硬化性組成物,並藉由上述之手段進行光照射或加熱而使其硬化。作為光學薄膜之代表性的構成,可舉出在透明支撐體上,因應所需設置有底塗層、抗反射層、硬塗層、氣體阻障層、潤滑層、黏著劑層等的各層。 For example, when it is used as an optical film, metal, wood, rubber, plastic, glass, ceramics, etc. are used as a substrate. The above-described means applies the curable composition of the present invention to a substrate, and is cured by light irradiation or heating by the above means. As a typical configuration of the optical film, each layer such as an undercoat layer, an antireflection layer, a hard coat layer, a gas barrier layer, a lubricant layer, and an adhesive layer may be provided on the transparent support.

又,作為支撐基體,可使用無機材料作為基材,亦可使用將藉由上述之方法所塗布的膜、或將藉由真空蒸鍍法、離子電鍍法、等離子CVD法、離子輔助法、反應性濺鍍法、化學氣相沈積法等的各種蒸鍍法所製作的膜進行層合者。 Further, as the support substrate, an inorganic material may be used as the substrate, and a film coated by the above method may be used, or a vacuum deposition method, an ion plating method, a plasma CVD method, an ion assist method, or a reaction may be used. A film produced by various vapor deposition methods such as a sputtering method or a chemical vapor deposition method is laminated.

若藉由蒸鍍法將膜進行層合之情形,作為基材係以使用玻璃為較佳,膜厚係依所使用的無機材料的種類等而有所不同,例如為5~300nm。蒸鍍膜係可僅形成在基板的單面、或亦可形成在基板的雙面。作為無機材料,可使用例如矽(Si)、鋁(Al)、鎂(Mg)、鈣(Ca)、鉀(K)、錫(Sn)、銦(In)、鈉(Na)、硼(B)、鈦(Ti)、鉛(Pb)、鋯(Zr)、釔(Y)、銻(Sb)等的氧化物、或銦‧錫複合氧化物(簡稱ITO)、銻‧錫複合氧化物(簡稱為ATO)等的複合氧化物。 When the film is laminated by a vapor deposition method, it is preferable to use glass as the substrate, and the film thickness varies depending on the type of the inorganic material to be used, and is, for example, 5 to 300 nm. The vapor deposition film may be formed only on one side of the substrate or may be formed on both sides of the substrate. As the inorganic material, for example, bismuth (Si), aluminum (Al), magnesium (Mg), calcium (Ca), potassium (K), tin (Sn), indium (In), sodium (Na), boron (B) can be used. ), oxides of titanium (Ti), lead (Pb), zirconium (Zr), yttrium (Y), yttrium (Sb), or indium ‧ tin composite oxide (abbreviated as ITO), yttrium-tin composite oxide ( A composite oxide such as ATO).

藉由能量線的照射,使本發明之硬化性組成物硬化之情形時,作為能量線,可舉出紫外線、電子線、X線、放射線、高周波等,以紫外線在經濟上為最佳。作為紫外線的光源,可舉出紫外線雷射、水銀燈、氙雷射、金屬鹵素燈等。 When the curable composition of the present invention is cured by irradiation with an energy ray, ultraviolet rays, electron beams, X-rays, radiation, high frequency, and the like are exemplified as energy rays, and ultraviolet rays are economically preferable. Examples of the light source of the ultraviolet light include an ultraviolet laser, a mercury lamp, a xenon laser, and a metal halide lamp.

藉由加熱使本發明之硬化性組成物硬化之情形時之條件為以70~250℃下1~100分鐘。預烘烤(PAB;Pre appliedbake)後,進行加壓,可後烘烤(PEB;Post exposure bake),亦可用不同多個階段的溫度來烘烤。 The condition in which the curable composition of the present invention is cured by heating is 1 to 100 minutes at 70 to 250 °C. After prebaking (PAB; Pre applied bake), pressurization, post exposure bake (PEB; Post exposure bake), or baking at different stages of temperature.

加熱條件係依各成分的種類及調配比例而有所不同,例如以70~180℃下,若烘箱時為5~15分鐘、若加熱板時為1~5分鐘。之後,為了使塗膜硬化為180~250℃,較佳以200~250℃下,若烘箱時為30~90分鐘、若加熱板時為5~30分鐘藉由加熱處理從而得到硬化膜。 The heating conditions vary depending on the type of each component and the blending ratio. For example, at 70 to 180 ° C, the oven is 5 to 15 minutes, and when the plate is heated, it is 1 to 5 minutes. Thereafter, in order to cure the coating film to 180 to 250 ° C, it is preferably 200 to 250 ° C, 30 to 90 minutes in an oven, and 5 to 30 minutes in a hot plate to obtain a cured film by heat treatment.

〔實施例〕 [Examples]

以下,關於將本發明之硬化性組成物及其硬化性組成物硬化後所得到之硬化物,藉由使用實施例及比較例來詳細地說明,但本發明並非被限定於該等的實施例中。尚,實施例及比較例中,份係指質量份之意。 Hereinafter, the cured product obtained by curing the curable composition of the present invention and the curable composition thereof will be described in detail by using examples and comparative examples, but the present invention is not limited to the examples. in. In the examples and comparative examples, the parts mean the parts by mass.

[實施例1~7、比較例1~4]依下述表1、2表示之調配將各成分充分地混合,各自可得到實施例1~7及比較例1~4之組成物。作為(A)成分係使用下述之化合物(A1-1)、(A2-1)~(A2-3)、(A3-1)、(A3-2)及(A4-1),作為(B)成分及(C)成分係使用下述之化合物(B)、及化合物(C-1)、化合物(C-2)。 [Examples 1 to 7 and Comparative Examples 1 to 4] The components shown in the following Tables 1 and 2 were sufficiently mixed, and the compositions of Examples 1 to 7 and Comparative Examples 1 to 4 were obtained. As the component (A), the following compounds (A1-1), (A2-1) to (A2-3), (A3-1), (A3-2), and (A4-1) were used as (B). The component (C) is the following compound (B), and the compound (C-1) and the compound (C-2).

化合物A1-1:Celloxide 2021P(脂環式環氧:DAICEL公司製) Compound A1-1: Celloxide 2021P (alicyclic epoxy: manufactured by DAICEL Co., Ltd.)

化合物A2-1:1,4-丁二醇二縮水甘油醚 Compound A2-1: 1,4-butanediol diglycidyl ether

化合物A2-2:Adeka Glycirol ED-523T(脂肪族環氧:ADEKA公司製) Compound A2-2: Adeka Glycirol ED-523T (aliphatic epoxy: manufactured by ADEKA)

化合物A2-2:新戊二醇二縮水甘油醚 Compound A2-2: Neopentyl glycol diglycidyl ether

化合物A3-1:Aron Oxetane OXT-221(氧雜環丁烷:東亞合成公司製) Compound A3-1: Aron Oxetane OXT-221 (oxetane: manufactured by Toagosei Co., Ltd.)

化合物A3-2:Aron Oxetane OXT-101(氧雜環丁烷:東亞合成公司製) Compound A3-2: Aron Oxetane OXT-101 (oxetane: manufactured by Toagosei Co., Ltd.)

化合物A4-1:ADEKA RESIN EP-4100(雙酚A型多官能環氧:ADEKA公司製) Compound A4-1: ADEKA RESIN EP-4100 (bisphenol A type polyfunctional epoxy: manufactured by ADEKA Corporation)

化合物(B):下述式(3)所表示之化合物及下述式(4)所表示之化合物之混合物的碳酸伸丙酯50%溶液 Compound (B): a propylene carbonate 50% solution of a mixture of a compound represented by the following formula (3) and a compound represented by the following formula (4)

化合物C-1:KBM-403(矽烷偶合劑:Shin-Etsu Silicone公司製) Compound C-1: KBM-403 (decane coupling agent: manufactured by Shin-Etsu Silicone Co., Ltd.)

化合物C-2:KBE-403(矽烷偶合劑:Shin-Etsu Silicone公司製) Compound C-2: KBE-403 (decane coupling agent: manufactured by Shin-Etsu Silicone Co., Ltd.)

對於所得到之實施例1~7及比較例1~4之硬化性組成物,進行下述評估。將評估結果合併記錄在表1、2。 The following evaluations were performed on the curable compositions of Examples 1 to 7 and Comparative Examples 1 to 4 thus obtained. The results of the evaluation are combined and recorded in Tables 1 and 2.

(黏度) (viscosity)

分別將所得到之實施例1~7及比較例1~4之硬化性組成物,在25℃下藉由E型黏度計來測定黏度。將結果合併記錄在表1、2。 The obtained curable compositions of Examples 1 to 7 and Comparative Examples 1 to 4 were each measured for viscosity at 25 ° C by an E-type viscometer. The results are combined and recorded in Tables 1 and 2.

(密著性1) (Adhesiveness 1)

分別將所得到之實施例1~5及比較例1~3之硬化性組成物,藉以棒式塗布# 3塗布在一片的玻璃基板(5cm×10cm)後,與裁切成2cm寬的COP(環烯烴聚合物)薄膜貼合,使用金屬鹵素燈以照度250mW/cm2下照射1000mJ/cm2的能量來進行接著而得到試片。進行所得到之試片的90度剝離試驗。將結果合併記錄在表1、2。 The obtained curable compositions of Examples 1 to 5 and Comparative Examples 1 to 3 were respectively applied to a glass substrate (5 cm × 10 cm) by a bar coating #3, and cut into a COP of 2 cm width ( The cycloolefin polymer film was bonded, and a test piece was obtained by irradiating an energy of 1000 mJ/cm 2 at an illuminance of 250 mW/cm 2 using a metal halide lamp. A 90 degree peel test of the obtained test piece was performed. The results are combined and recorded in Tables 1 and 2.

(密著性2) (Adhesiveness 2)

分別將所得到之實施例6、7及比較例4之組成物,塗布在一片的TAC薄膜後,使用貼合機來與施予電暈放 電處理的COP(環烯烴聚合物)薄膜貼合,使用無電極紫外光燈照射1000mJ/cm2的能量來進行接著而得到試片。進行所得到之試片的90度剝離試驗。將結果合併記錄在表1、2。 The obtained compositions of Examples 6 and 7 and Comparative Example 4 were applied to a single TAC film, and then bonded to a COP (cycloolefin polymer) film to which corona discharge treatment was applied using a bonding machine. The test piece was obtained by irradiating an energy of 1000 mJ/cm 2 with an electrodeless ultraviolet lamp. A 90 degree peel test of the obtained test piece was performed. The results are combined and recorded in Tables 1 and 2.

藉由表1、2可得知本發明之硬化性組成物係密著性為優異、且低黏度。 It can be seen from Tables 1 and 2 that the curable composition of the present invention is excellent in adhesion and low in viscosity.

Claims (9)

一種硬化性組成物,其係含有陽離子硬化性成分(A)100質量份、陽離子聚合起始劑(B)0.1~15質量份之硬化性組成物,其特徵為,前述陽離子硬化性成分(A)係以脂環式環氧化合物(A1)、脂肪族環氧化合物(A2)、及氧雜環丁烷化合物(A3)作為必要成分。 A curable composition containing 100 parts by mass of a cationic curable component (A) and 0.1 to 15 parts by mass of a cationic polymerization initiator (B), wherein the cationically curable component (A) The alicyclic epoxy compound (A1), the aliphatic epoxy compound (A2), and the oxetane compound (A3) are essential components. 如請求項1之硬化性組成物,其中,作為前述陽離子硬化性成分(A),進而含有芳香族環氧化合物(A4)。 The curable composition of claim 1, wherein the cation curable component (A) further contains an aromatic epoxy compound (A4). 如請求項1之硬化性組成物,其中,進而含有具有環氧基之矽烷偶合劑(C)0.1~15質量份(但,陽離子硬化性成分(A)除外)。 The curable composition of claim 1, further comprising 0.1 to 15 parts by mass of the decane coupling agent (C) having an epoxy group (except for the cation hardening component (A)). 如請求項1之硬化性組成物,其中,在前述陽離子硬化性成分(A)100質量%中,前述脂環式環氧化合物(A1)為1~30質量%。 The curable composition of claim 1, wherein the alicyclic epoxy compound (A1) is from 1 to 30% by mass based on 100% by mass of the cation curable component (A). 如請求項1之硬化性組成物,其中,前述脂環式環氧化合物(A1)係選自3’,4’-環氧基環己基甲基-3,4-環氧基環己烷羧酸酯、7-氧雜二環[4.1.0]庚烷,聚[氧基-(1-側氧基-1,6-己二基)]衍生物、己二酸雙[(7-氧雜二環[4.1.0]庚烷-3-基)甲基]酯、1,2-環氧基-4-乙烯基環己烷、3,4-環氧基環己基甲基甲基丙烯酸酯及檸檬烯二氧化物之群之至少1種。 The sclerosing composition of claim 1, wherein the alicyclic epoxy compound (A1) is selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate Acid ester, 7-oxabicyclo[4.1.0]heptane, poly[oxy-(1-sideoxy-1,6-hexanediyl)] derivative, adipic acid bis[(7-oxygen) Heterobicyclo[4.1.0]heptan-3-yl)methyl]ester, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate At least one of a group of esters and limonene dioxide. 如請求項1之硬化性組成物,其中,前述氧雜環 丁烷化合物(A3)係選自3-乙基-3-(己氧基甲基)氧雜環丁烷、3-乙基-3-(羥基甲基)氧雜環丁烷、伸苯二甲基雙氧雜環丁烷、3-乙基-3-(3-乙基-3-氧雜環丁基甲基氧基甲基)氧雜環丁烷之群之至少1種。 The sclerosing composition of claim 1, wherein the aforementioned oxygen heterocycle The butane compound (A3) is selected from the group consisting of 3-ethyl-3-(hexyloxymethyl)oxetane, 3-ethyl-3-(hydroxymethyl)oxetane, and benzophenone At least one of a group of methyl dioxetane and 3-ethyl-3-(3-ethyl-3-oxetanylmethyloxymethyl)oxetane. 一種硬化性組成物之硬化方法,其特徵係將請求項1~6中任一項之硬化性組成物,藉由活性能量線之照射而使其硬化。 A method of curing a curable composition, characterized in that the curable composition according to any one of claims 1 to 6 is cured by irradiation with an active energy ray. 一種硬化性組成物之硬化方法,其特徵係將請求項1~6中任一項之硬化性組成物,藉由加熱而使其硬化。 A method of curing a curable composition, characterized in that the curable composition according to any one of claims 1 to 6 is cured by heating. 一種硬化物,其特徵係由請求項1~6中任一項之硬化性組成物所成。 A cured product characterized by the curable composition of any one of claims 1 to 6.
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