以下，對於本發明之組合物，基於較佳之實施形態進行說明。 本發明之組合物含有陽離子聚合性化合物(A)、光酸產生劑(B)、及熱酸產生劑(C)。以下，對於各成分依次進行說明。 作為用於本發明之組合物之陽離子聚合性化合物(A)，若為藉由利用光照射或加熱產生陽離子種或路易斯酸之光酸產生劑或熱酸產生劑而高分子化之化合物、或發生交聯反應之化合物，則可為任何化合物，並不受到特別限定，若列舉一例則如下。 作為陽離子聚合性化合物(A)，可列舉：例如環氧化合物、氧雜環丁烷化合物、環狀內酯化合物、環狀縮醛化合物、環狀硫醚化合物、螺原酸酯化合物、乙烯系化合物等，可使用該等之1種或2種以上。於該等化合物之中，容易獲得、使用便利之環氧化合物適合。作為該環氧化合物，芳香族環氧化合物、脂環族環氧化合物、脂肪族環氧化合物等適合。 作為陽離子聚合性化合物，其中，較佳為芳香族環氧化合物、脂環族環氧化合物，特佳為芳香族環氧化合物。藉由上述陽離子聚合性化合物為上述之化合物，而相對於曝光量之變化，所獲得之硬化物之形狀變化變得較少。 再者，環氧化合物可包含所有包含環氧結構者。例如，包含環氧結構及氧雜環丁烷結構之兩者之化合物可包含於環氧化合物。 作為上述脂環族環氧化合物之具體例，可列舉藉由將具有至少1個脂環族環之多元醇之聚縮水甘油醚或含環己烯環或環戊烯環之化合物利用氧化劑進行環氧化所獲得的含有環氧環己烷或環氧環戊烷之化合物。作為上述脂環族環氧化合物，可列舉：例如氫化雙酚A二縮水甘油醚、3,4-環氧環己基甲基-3,4-環氧環己烷羧酸酯、3,4-環氧-1-甲基環己基-3,4-環氧-1-甲基己烷羧酸酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧環己烷羧酸酯、3,4-環氧-3-甲基環己基甲基-3,4-環氧-3-甲基環己烷羧酸酯、3,4-環氧-5-甲基環己基甲基-3,4-環氧-5-甲基環己烷羧酸酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧)環己烷-間二㗁烷、雙(3,4-環氧環己基甲基)己二酸酯、3,4-環氧-6-甲基環己基羧酸酯、亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧環己烷羧酸酯)、環氧六氫鄰苯二甲酸二辛酯、環氧六氫鄰苯二甲酸二-2-乙基己酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧-2-2環氧乙基環己烷、3,4-環氧環己基甲基丙烯酸酯、3,4-環氧環己基甲基甲基丙烯酸酯等。 再者，包含脂環族環及芳香族環之兩者之環氧化合物能夠成為相當於脂環族環氧化合物者。 作為能夠適合用作上述脂環族環氧化合物之市售品，可列舉：UVR-6100、UVR-6105、UVR-6110、UVR-6128、UVR-6200(以上為聯合碳化合物公司製造)、Celloxide 2021、Celloxide 2021P、Celloxide 2081、Celloxide 2083、Celloxide 2085、Celloxide 2000、Celloxide 3000、Cyclomer A200、Cyclomer M100、Cyclomer M101、Epolead GT-301、Epolead GT-302、Epolead 401、Epolead 403、ETHB、Epolead HD300、EHPE-3150、EHPE-3150CE(以上為大賽璐股份有限公司製造)、KRM-2110、KRM-2199(以上為ADEKA股份有限公司製造)等。 於上述脂環族環氧化合物之中，具有環氧環己烷結構之環氧樹脂於硬化性(硬化速度)之方面較佳。 作為上述芳香族環氧化合物之具體例，可列舉具有至少1個芳香族環之多酚或其環氧烷加成物之聚縮水甘油醚，可列舉例如雙酚A、雙酚F、或對該等進一步加成環氧烷而得之化合物之縮水甘油醚或環氧酚醛清漆樹脂等。 作為上述脂肪族環氧化合物之具體例，可列舉：脂肪族多元醇或其環氧烷加成物之聚縮水甘油醚、脂肪族長鏈多元酸之聚縮水甘油酯、丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯之藉由乙烯基聚合所合成之均聚物、丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯與其他乙烯基單體之藉由乙烯基聚合所合成之共聚物等。作為上述脂肪族環氧化合物之代表性化合物，可列舉：於1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油之三縮水甘油醚、三羥甲基丙烷之三縮水甘油醚、山梨糖醇之四縮水甘油醚、二季戊四醇之六縮水甘油醚、聚乙二醇之二縮水甘油醚、聚丙二醇之二縮水甘油醚等多元醇之縮水甘油醚、又藉由對丙二醇、三羥甲基丙烷、甘油等脂肪族多元醇加成1種或2種以上之環氧烷所獲得之聚醚多元醇之聚縮水甘油醚、脂肪族長鏈二酸之二縮水甘油酯。進而，可列舉：脂肪族高級醇之單縮水甘油醚或苯酚、甲酚、丁基苯酚、及藉由對該等加成環氧烷所獲得之聚醚醇之單縮水甘油醚、高級脂肪酸之縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化大豆油、環氧化聚丁二烯等。 此外，脂肪族環氧化合物可不包含脂環族環及芳香族環。 作為可適合用作上述芳香族環氧化合物及脂肪族環氧化合物之市售品，可列舉：jERYX-4000、jERYX-8000、jER871、jER872、jER157S70、jER806、jER1001、jER152、jER604(三菱化學公司製造)PY-306、0163、DY-022(以上為汽巴嘉基公司製造)、KRM-2720、EP-4100、EP-4000、EP-4080、EP-4088、EP-4900、ED-505、ED-506(ADEKA公司製造)、Epolight M-1230、Epolight EHDG-L、Epolight 40E、Epolight 100E、Epolight 200E、Epolight 400E、Epolight 70P、Epolight 200P、Epolight 400P、Epolight 1500NP、Epolight 1600、Epolight 80MF、Epolight 100MF、Epolight 4000、Epolight 3002、Epolight FR-1500(共榮社化學公司製造)、Sun Tohto ST0000、YD-716、YH-300、PG-202、PG-207、YD-172、YDPN638(新日鐵化學公司製造)DENACOL EX321、DENACOL EX313、DENACOL314、DENACOL EX-411、EM-150(長瀨化成公司製造)、EPPN-201、EPPN-502H、NC-3000、NC-7300L、XD-1000、NC-2000-L、NC-7000L、CER-3000-L、EOCN-104S、EOCN-1020、EPPN-501H(日本化藥公司製造)等。 作為可用作陽離子聚合性化合物(A)之上述氧雜環丁烷化合物之具體例，可列舉例如以下之化合物。可例示：3-乙基-3-羥基甲基氧雜環丁烷、3-(甲基)烯丙氧基甲基-3-乙基氧雜環丁烷、(3-乙基-3-氧雜環丁烷基甲氧基)甲基苯、4-氟-[1-(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、4-甲氧基-[1-(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、[1-(3-乙基-3-氧雜環丁烷基甲氧基)乙基]苯醚、異丁氧甲基(3-乙基-3-氧雜環丁烷基甲基)醚、異𦯉氧基乙基(3-乙基-3-氧雜環丁烷基甲基)醚、異𦯉基(3-乙基-3-氧雜環丁烷基甲基)醚、2-乙基己基(3-乙基-3-氧雜環丁烷基甲基)醚、乙基二乙二醇(3-乙基-3-氧雜環丁烷基甲基)醚、二環戊二烯(3-乙基-3-氧雜環丁烷基甲基)醚、二環戊烯氧基乙基(3-乙基-3-氧雜環丁烷基甲基)醚、二環戊烯基(3-乙基-3-氧雜環丁烷基甲基)醚、四氫呋喃甲基(3-乙基-3-氧雜環丁烷基甲基)醚、四溴苯基(3-乙基-3-氧雜環丁烷基甲基)醚、2-四溴苯氧基乙基(3-乙基-3-氧雜環丁烷基甲基)醚、三溴苯基(3-乙基-3-氧雜環丁烷基甲基)醚、2-三溴苯氧基乙基(3-乙基-3-氧雜環丁烷基甲基)醚、2-羥乙基(3-乙基-3-氧雜環丁烷基甲基)醚、2-羥丙基(3-乙基-3-氧雜環丁烷基甲基)醚、丁氧基乙基(3-乙基-3-氧雜環丁烷基甲基)醚、五氯苯基(3-乙基-3-氧雜環丁烷基甲基)醚、五溴苯基(3-乙基-3-氧雜環丁烷基甲基)醚、𦯉基(3-乙基-3-氧雜環丁烷基甲基)醚、3,7-雙(3-氧雜環丁基)-5-氧雜-壬烷、3,3’-(1,3-(2-甲烯基)丙二基雙(甲醛))雙-(3-乙基氧雜環丁烷)、1,4-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、1,2-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]乙烷、1,3-雙[(3-乙基-3-氧雜環丁烷基甲氧基)甲基]丙烷、乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、二環戊烯基雙(3-乙基-3-氧雜環丁烷基甲基)醚、三乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、四乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、三環癸烷二基二亞甲基(3-乙基-3-氧雜環丁烷基甲基)醚、三羥甲基丙烷三(3-乙基-3-氧雜環丁烷基甲基)醚、1,4-雙(3-乙基-3-氧雜環丁烷基甲氧基)丁烷、1,6-雙(3-乙基-3-氧雜環丁烷基甲氧基)己烷、季戊四醇三(3-乙基-3-氧雜環丁烷基甲基)醚、季戊四醇四(3-乙基-3-氧雜環丁烷基甲基)醚、聚乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、二季戊四醇六(3-乙基-3-氧雜環丁烷基甲基)醚、二季戊四醇五(3-乙基-3-氧雜環丁烷基甲基)醚、二季戊四醇四(3-乙基-3-氧雜環丁烷基甲基)醚、己內酯改性二季戊四醇六(3-乙基-3-氧雜環丁烷基甲基)醚、己內酯改性二季戊四醇五(3-乙基-3-氧雜環丁烷基甲基)醚、二-三羥甲基丙烷四(3-乙基-3-氧雜環丁烷基甲基)醚、EO改性雙酚A雙(3-乙基-3-氧雜環丁烷基甲基)醚、PO改性雙酚A雙(3-乙基-3-氧雜環丁烷基甲基)醚、EO改性氫化雙酚A雙(3-乙基-3-氧雜環丁烷基甲基)醚、PO改性氫化雙酚A雙(3-乙基-3-氧雜環丁烷基甲基)醚、EO改性雙酚F(3-乙基-3-氧雜環丁烷基甲基)醚等。 作為可適合用作上述氧雜環丁烷化合物之市售品之具體產品名稱，可列舉：ARONE OXETANE OXT-101、OXT-121、OXT-221、OXT-212、OXT-211(以上為東亞合成股份有限公司製造)、ETERNACOLL EHO、OXBP、OXTP、OXMA(以上為宇部興產股份有限公司製造)等。該等可單獨使用1種，或可組合使用2種以上。 該等氧雜環丁烷化合物若於特別需要可撓性之情形時使用有效，令人滿意。 作為其他陽離子聚合性化合物(A)，可列舉：四氫呋喃、2,3-二甲基四氫呋喃等氧雜環戊烷化合物、三㗁烷、1,3-二氧雜環戊烷、1,3,6-三㗁烷環辛烷等環狀縮醛化合物、β-丙內酯、ε-己內酯等環狀內酯化合物、環硫乙烷、硫表氯醇等環硫乙烷化合物、1,3-二硫代丙炔、3,3-二甲基環硫烷等環硫烷化合物、四氫噻吩衍生物等環狀硫醚化合物、乙二醇二乙烯醚、烷基乙烯醚、2-氯乙基乙烯醚、2-羥基乙基乙烯醚、三乙二醇二乙烯醚、1,4-環己烷二甲醇二乙烯醚、羥基丁基乙烯醚、丙二醇之丙烯醚等乙烯醚化合物、藉由環氧化合物與內酯之反應所獲得之螺原酸酯化合物、苯乙烯、乙烯環己烯、異丁烯、聚丁二烯等乙烯性不飽和化合物及上述衍生物等。 於本發明中，可配合使用上述陽離子聚合性化合物之中1種或2種以上作為陽離子聚合性化合物(A)。 作為陽離子聚合性化合物，環氧化合物於硬化物之耐熱性及透明性之方面特佳。 用於本發明之組合物之所謂光酸產生劑(B)，若為能夠利用光照射產生陽離子種或路易斯酸之化合物則可為任意者，較佳為作為藉由紫外線之照射釋出路易斯酸之鎓鹽的複鹽、或其衍生物。作為該化合物之代表者，可列舉下述通式 [A]m+
[B]m-
所示之陽離子與陰離子之鹽。 其中陽離子[A]m+
較佳為鎓，該結構可藉由例如下述通式 [(Ra
)a
Q]m+
表示。 式中，Ra
係碳原子數為1～60，亦可包含幾個碳原子以外之原子之有機基。a為1～5之整數。a個Ra
分別獨立，存在相同或不同之情形。又，至少1個較佳為具有芳香環之如上述之有機基。Q係選自由S、N、Se、Te、P、As、Sb、Bi、O、I、Br、Cl、F、N＝N所組成之群中之原子或原子團。又，將陽離子[A]m+
中之Q之原子價設為q之時，需要m＝a－q之關係成立(其中，N＝N視為原子價0)。 又，陰離子[B]m-
並不受到特別限定，較佳為鹵化物錯合物，該結構可藉由例如下述通式 [LXb
]m-
表示。 式中，L為作為鹵化物錯合物之中心原子之金屬或半金屬(Metalloid)，為B、P、As、Sb、Fe、Sn、Bi、Al、Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co等。X為鹵素原子。b為3～7之整數。又，將陰離子[B]m-
中之L之原子價設為p之時，需要m＝b－p之關係成立。 作為上述通式之陰離子[LXb
]m-
之具體例，可列舉：過氯酸根離子(ClO4
)-
、四氟硼酸根離子(BF4
)-
、六氟磷酸根離子(PF6
)-
、六氟銻酸鹽(SbF6
)-
、六氟砷酸鹽(AsF6
)-
、六氯銻酸鹽(SbCl6
)-
等無機離子；氟磺酸根離子(FSO3
)-
、甲苯磺酸根陰離子、三硝基苯磺酸根離子、樟腦磺酸根離子、九氟丁磺酸根離子、十六氟辛磺酸根離子等磺酸根離子；四芳基硼酸根離子、四(五氟苯基)硼酸根離子等硼酸根離子；甲羧酸根離子、乙羧酸根離子、丙羧酸根離子、丁羧酸根離子、辛羧酸根離子、三氟甲羧酸根離子、苯羧酸根離子、對甲苯羧酸根離子等羧酸根離子；三氟甲基亞硫酸根離子(CF3
SO3
)-
、甲基硫酸根離子(CH3
OSO3
)-
、雙(三氟甲磺醯基)醯亞胺離子、三(三氟甲磺醯基)甲基化物離子等。 又，陰離子[B]m-
亦可較佳地使用下述通式[LXb － 1
(OH)]m-
所示之結構者。L，X，b與上述相同。 於本發明中，於此類鎓鹽之中，使用下述(1)～(3)之芳香族鎓鹽特別有效。自該等之中，可單獨使用該1種或混合使用2種以上。 (1)苯基重氮鎓六氟磷酸鹽、4-甲氧基苯基重氮鎓六氟銻酸鹽、4-甲基苯基重氮鎓六氟磷酸鹽等芳基重氮鎓鹽 (2)二苯基錪六氟銻酸鹽、二(4-甲基苯基)錪六氟磷酸鹽、二(4-第三丁基苯基)錪六氟磷酸鹽、甲苯基異丙苯基錪四(五氟苯基)硼酸鹽等二芳基錪鹽 (3)下述群I或群II所示之鋶陽離子與六氟銻離子、四(五氟苯基)硼酸鹽離子等鋶鹽 [化1] ＜群I＞ 。 [化2] ＜群II＞ 。 又，作為其他較佳者，亦可列舉(η5
-2,4-環戊二烯-1-基)[(1,2,3,4,5,6-η)-(1-甲基乙基)苯]-鐵-六氟磷酸鹽等鐵-芳烴錯合物或三(乙醯丙酮)鋁、三(乙基丙酮乙酸)鋁、三(水楊醛酸)鋁等鋁錯合物與三苯基矽烷醇等矽烷醇類之混合物等。 於該等之中，自實用面及感光度之觀點而言，較佳為使用芳香族錪鹽、芳香族鋶鹽、鐵-芳烴錯合物，下述通式(1)所示之芳香族鋶鹽自感度之方面而言進一步較佳。 [化3]。 (式中，R1
、R2
、R3
、R4
、R5
、R6
、R7
、R8
、R9
、R10
、R19
、R20
、R21
、R22
及R23
分別獨立地表示氫原子、鹵素原子、碳原子數1～10之烷基、碳原子數1～10之烷氧基或碳原子數2～10之酯基，R11
、R12
、R13
、R14
、R15
、R16
、R17
及R18
分別獨立地表示氫原子、鹵素原子或碳原子數1～10之烷基，X1 -
表示一價之陰離子)。 於上述通式(1)所示之芳香族鋶鹽中，作為R1
、R2
、R3
、R4
、R5
、R6
、R7
、R8
、R9
、R10
、R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
及R23
所示之鹵素原子，可列舉氟、氯、溴、碘等。 於上述通式(1)所示之芳香族鋶鹽中，R1
、R2
、R3
、R4
、R5
、R6
、R7
、R8
、R9
、R10
、R11
、R12
、R13
、R14
、R15
、R16
、R17
、R18
、R19
、R20
、R21
、R22
及R23
所示之碳原子數1～10之烷基存在經鹵素原子取代之情形，又，存在該烷基中之亞甲基經-O-、-S-、-CO-、-OCO-、-COO-、-C＝C-、-NHCO-、-NH-或-CONH-取代之情形。作為碳原子數1～10之烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲基硫乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧乙基、甲氧基乙基、甲氧基乙氧基甲基、甲基硫甲基、乙氧基乙基、丁氧基甲基、第三丁基硫甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫乙基、三甲基矽烷基乙基、第三丁基二甲基矽烷氧基甲基、2-(三甲基矽烷基)乙氧基甲基、第三丁氧基羰基甲基、乙氧基羰基甲基、乙基羰基甲基、第三丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥甲基、2-羥乙基、1-羥乙基、2-羥丙基、3-羥丙基、3-羥丁基、4-羥丁基、1,2-二羥乙基等。 於上述通式(1)所示之芳香族鋶鹽中，作為R1
、R2
、R3
、R4
、R5
、R6
、R7
、R8
、R9
、R10
、R19
、R20
、R21
、R22
及R23
所示之碳原子數1～10之烷氧基，可列舉：甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基、第二丁氧基、第三丁氧基、異丁氧基、戊氧基、異戊氧基、第三戊氧基、己氧基、環己氧基、環己基甲氧基、四氫呋喃氧基、四氫吡喃氧基、2-甲氧基乙氧基、3-甲氧基丙氧基、4-甲氧基丁氧基、2-丁氧基乙氧基、甲氧基乙氧基乙氧基、甲氧基乙氧基乙氧基乙氧基、3-甲氧基丁氧基、2-甲硫基乙氧基、三氟甲氧基等。 於上述通式(1)所示之芳香族鋶鹽中，作為R1
、R2
、R3
、R4
、R5
、R6
、R7
、R8
、R9
、R10
、R19
、R20
、R21
、R22
及R23
所示之碳原子數2～10之酯基，可列舉：甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、第三丁基羰氧基、甲氧基乙醯氧基、苯甲醯氧基等。 於上述通式(1)所示之芳香族鋶鹽中，作為X1 -
所示之一價之陰離子，並不受到特別限定，較佳可列舉：過氯酸根離子(ClO4
)-
、四氟硼酸根離子(BF4
)-
、六氟磷酸根離子(PF6
)-
、六氟銻酸鹽(SbF6
)-
、六氟砷酸鹽(AsF6
)-
、六氯銻酸鹽(SbCl6
)-
等無機離子；四芳基硼酸根離子、四(五氟苯基)硼酸根離子等硼酸根離子；三(三氟甲磺醯基)甲基化物離子；三氟化三(全氟烷基)膦陰離子。 於本發明中，於上述通式(1)所示之芳香族鋶鹽中，較佳為R3
、R8
及R13
之至少一個為鹵素原子。又，較佳為R3
及R8
之至少一個為鹵素原子，更佳為兩者為鹵素原子，於此情形時，鹵素原子較佳為氟。又，R13
較佳為鹵素原子，更佳為氯。藉由將R3
、R8
及/或R13
設為上述基，可獲得相對於曝光量之變化而所獲得之硬化物之形狀變化更少之組合物，故而較佳。 作為上述光酸產生劑(B)，亦可使用市售品，可列舉：例如Cyracure UVI-6970、Cyracure UVI-6974、Cyracure UVI-6990、Cyracure UVI-950(美國聯合碳化合物公司製造)、Irgacure 261、CG-24-61(BASF公司製造)、DAICATII(Daicel公司製造)、UVAC1591(Daicel-Allnex公司製造)、CI-2481、CI-2734、CI-2823、CI-2758(以上為日本曹達公司製造)、FFC509(3M公司)、BBI-102、BBI-101、BBI-103、MPI-103、TPS-103、MDS-103、DTS-103、NAT-103、NDS-103(Midori Kagaku公司製造)等。 相對於上述陽離子聚合性化合物(A)，光酸產生劑(B)之使用比率不受到特別限定，於不妨礙本發明之目的之範圍內以大致正常之使用比率使用即可，例如相對於陽離子聚合性化合物(A)100質量份，可將光酸產生劑(B)設為0.05～20質量份、較佳地設為0.1～15質量份。若光酸產生劑(B)之使用比率過少，則硬化容易變得不充分，若過多，則存在對硬化物之強度帶來不良影響之情形。 用於本發明之組合物之所謂熱酸產生劑(C)係利用加熱產生陽離子種或路易斯酸之化合物，可列舉：除了例示為光酸產生劑(B)者之鋶鹽、錪鹽、重氮鎓鹽、鏻鹽、硒鹽、氧鎓鹽、銨鹽、噻吩鎓鹽、硫雜環戊鎓鹽、苄基銨、吡啶鎓鹽、肼鎓鹽等鹽；萘甲醯基醯亞胺磺酸鹽、鄰苯二甲醯亞胺磺酸鹽等醯亞胺磺酸鹽；二伸乙基三胺、三伸乙基三胺、四伸乙基五胺等聚烷基聚胺類；1,2-二胺基環己烷、1,4-二胺基-3,6-二乙基環己烷、異佛爾酮二胺等脂環式聚胺類；間苯二甲胺、二胺基二苯甲烷、二胺基二苯基碸等芳香族聚胺類；藉由將上述聚胺類與苯基縮水甘油醚、丁基縮水甘油醚、雙酚A-二縮水甘油醚、雙酚F-二縮水甘油醚等縮水甘油醚類或羧酸之縮水甘油酯類等各種環氧樹脂利用常法進行反應而製造之多聚環氧加成改性物；藉由將上述有機聚胺類與鄰苯二甲酸、異鄰苯二甲酸、二聚酸等羧酸類利用常法進行反應而製造之醯胺改性物；藉由將上述聚胺類與甲醛等醛類及苯酚、甲酚、二甲苯酚、第三丁基苯酚、間苯二酚等於核具有至少1個醛化反應性場所之酚類利用常法進行反應而製造之曼尼希化改性物；多元羧酸(草酸、丙二酸、琥珀酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、十二烷二酸、2-甲基琥珀酸、2-甲基己二酸、3-甲基己二酸、3-甲基戊二酸、2-甲基辛二酸、癸二酸3,8-二甲酯、癸二酸3,7-二甲酯、氫化二聚酸、二聚酸等脂肪族二羧酸類；鄰苯二甲酸、對苯二甲酸、異鄰苯二甲酸、萘二羧酸等芳香族二羧酸類；環己烷二羧酸等脂環式二羧酸類；偏苯三甲酸、均苯三酸、蓖麻油脂肪酸之三聚物等三羧酸類；均苯四甲酸等四羧酸類等)之酸酐；安息香甲苯磺酸酯、對硝基苄基-9,10-乙氧基蒽-2-磺酸酯、2-硝基苄基甲苯磺酸酯、2,6-二硝基苄基甲苯磺酸酯、2,4-二硝基苄基甲苯磺酸酯之磺酸酯；雙氰胺、咪唑類、羧酸酯、胺醯亞胺、鹵素化合物等，該等可使用1種或混合使用2種以上。 作為上述熱酸產生劑(C)，單苯基鋶鹽於工業上容易獲得，故而較佳。作為該單苯基鋶鹽，可列舉：苄基-對羥基苯基甲基鋶鹽、對羥基苯基二甲基鋶鹽、對乙醯氧基苯基二甲基鋶鹽、苄基-對羥基苯基甲基鋶鹽、苄基苯基鋶鹽等。 於上述熱酸產生劑(C)之中，下述通式(2)所示者即使添加量較少亦充分發揮效果，且容易獲得工業之原料，故而較佳。 [化4]。 (式中，R31
及R32
分別獨立地表示碳原子數1～10之烷基、碳原子數6～20之芳基或碳原子數7～20之芳基烷基，R33
、R34
、R35
、R36
及R37
分別獨立地表示氫原子、羥基、鹵素原子或碳原子數1～10之烷基，X2 -
表示一價之陰離子)。 上述通式(2)中，作為R31
、R32
、R33
、R34
、R35
、R36
及R37
所示之碳原子數1～10之烷基、R33
、R34
、R35
、R36
及R37
所示之鹵素原子、X2 -
所示之一價之陰離子，可列舉上述通式(1)所例示者。 上述通式(2)中，作為R31
及R32
所示之碳原子數6～20之芳基，可列舉：例如苯基、萘基、蒽基等。 上述通式(2)中，作為R31
及R32
所示之碳原子數7～20之芳基烷基，可列舉：例如苄基、茀基、茚基、9-茀基甲基等。 R31
及R32
較佳為一者為碳原子數1～10之烷基，另一者為碳原子數1～10烷基或碳原子數7～20之芳基烷基，其中，更佳為兩者為碳原子數1～10烷基。 又，上述通式(2)中，較佳為R35
為羥基。 藉由將R31
、R32
及/或R35
設為上述基，可獲得相對於曝光量之變化而所獲得之硬化物之形狀變化更少之組合物，故而較佳。 作為X2 -
所示之一價之陰離子，比X1 -
所示之一價之陰離子產生之酸較弱者，即作為鹽pKa較大者，藉由光酸產生劑(B)之陰離子與熱酸產生劑(C)之陰離子無法發生鹽交換，故而較佳。作為X2 -
所示之一價之陰離子，較佳為過氯酸根離子(ClO4
)-
、四氟硼酸根離子(BF4
)-
、六氟磷酸根離子(PF6
)-
、六氟銻酸鹽(SbF6
)-
、六氟砷酸鹽(AsF6
)-
、六氯銻酸鹽(SbCl6
)-
等無機離子、甲基硫酸根離子。 於本發明之組合物中，於使用上述通式(1)所示之芳香族鋶鹽作為光酸產生劑(B)，使用上述通式(2)所示之化合物作為熱酸產生劑(C)之情形時，X1 -
所示之一價之陰離子與X2 -
所示之一價之陰離子之較佳組合如下。藉由採用下述組合，可獲得相對於曝光量之變化而所獲得之硬化物之形狀變化更少之組合物，故而較佳。 (1)X1 -
為四(五氟苯基)硼酸根離子，X2 -
為甲基硫酸根離子之組合。 (2)X1 -
為四(五氟苯基)硼酸根離子，X2 -
為六氟磷酸根離子(PF6
)-
之組合。 (3)X1 -
為六氟銻酸鹽(SbF6
)-
，X2 -
為甲基硫酸根離子之組合。 (4)X1 -
為三(三氟甲磺醯基)甲基化物離子，X2 -
為甲基硫酸根離子之組合。 上述熱酸產生劑(C)之加熱溫度為70～180℃，較佳為90～140℃。 作為上述熱酸產生劑(C)，亦可使用市售品，可列舉例如以下之商品。可列舉：CI-2064、CI-2624、CI-2639、CI-2855、CI-2920、CI-2921、CI-2946、CI-3128(日本曹達公司製造)、SI-45、SI-47、SI-60、SI-60L、SI-80、SI-80L、SI-100、SI-100L、SI-110L、SI-145、SI-150、SI-160、SI-180、SI-180L(三新化學公司製造)、TA-90、TA-100、TA-120、TA-160、IK-1、IK-2(San-Apro公司製造)、Adekaopton CP-66、Adekaopton CP-77(ADEKA公司製造)、FC-520(3M公司製造)等。 相對於上述陽離子聚合性化合物(A)之熱酸產生劑(C)之使用比率不受到特別限定，於不妨礙本發明之目的之範圍內以大致正常之使用比率使用即可，例如，相對於陽離子聚合性化合物(A)100質量份，可將熱酸產生劑(C)設為0.0000001～0.5質量份、較佳地設為0.000001～0.1質量份。 光酸產生劑(B)與熱酸產生劑(C)之質量比以前者：後者計設為100：0.00001～100：5時，容易進行感度控制，成型製程改善，故而較佳。 於本發明之組合物中，通常可根據需要添加可溶解或分散上述各成分之溶劑，例如：丙酮、甲基乙基酮、甲基異丁基酮、甲基溶纖劑、乙基溶纖劑、氯仿、二氯甲烷、己烷、庚烷、辛烷、環己烷、苯、甲苯、二甲苯、甲醇、乙醇、異丙醇。於本發明之組合物中，溶劑之含量根據組合物之用途等進行適當選擇，不受到特別限定，通常，若本發明之組合物中以固形物成分(溶劑以外之所有成分之總含量)為5～90質量%之方式含有溶劑，則適合如波長截止濾光鏡製造時般藉由塗佈使用本發明之組合物之情形。 又，只要無損於本發明之效果，就可根據需要添加苯并三唑系、三𠯤系、苯甲酸酯系之紫外線吸收劑；酚系、磷系、硫系抗氧化劑；陽離子系界面活性劑、陰離子系界面活性劑、非離子系界面活性劑、兩性界面活性劑等所組成之抗靜電劑；鹵素系化合物、磷酸酯系化合物、磷醯胺系化合物、三聚氰胺系化合物、氟樹脂或金屬氧化物、(聚)磷酸三聚氰胺、(聚)磷酸哌𠯤等阻燃劑；烴系、脂肪酸系、脂肪族醇系、脂肪族酯系、脂肪族醯胺系或金屬皂系潤滑劑；顏料、炭黑等著色劑；薰製二氧化矽、微粒子二氧化矽、矽石、矽藻土類、黏土、高嶺土、矽藻土、矽膠、矽酸鈣、絹雲母、高嶺石、燧石、長石粉、蛭石、厄帖浦石、滑石、雲母、鐵滑石、葉蠟石、二氧化矽等矽酸系無機添加劑；玻璃纖維、碳酸鈣等填充劑；成核劑、結晶促進劑等結晶劑、矽烷偶合劑、可撓性聚合物等橡膠彈性賦予劑、增感劑、其他單體、消泡劑、增黏劑、調平劑、塑化劑、聚合抑制劑、防靜電劑、流動調節劑、偶合劑、助黏劑等各種添加劑。該等各種添加劑之使用量於本發明之組合物中總計設為50質量%以下。 本發明之組合物可藉由照射紫外線等活性能量射線而硬化，通常自照射開始至0.1秒～數分鐘後可硬化至指觸乾燥狀態或溶劑不溶性之狀態。作為適當之活性能量射線，只要誘發光酸產生劑之分解，則可為任意者，較佳為利用自超高、高、中、低壓水銀燈、氙氣燈、碳弧燈、金屬鹵化物燈、螢光燈、鎢絲燈、準分子燈、殺菌燈、準分子雷射、氮雷射、氬離子雷射、氦鎘雷射、氦氖雷射、氪離子雷射、各種半導體雷射、YAG(Yttrium Aluminum Garnet，釔鋁石榴石)雷射、發光二極體、CRT(Cathode Ray Tube，陰極射線管)光源等所獲得之具有2000埃至7000埃之波長之電磁波能或電子束、X射線、放射線等高活性能量射線。 活性能量射線之照射時間因活性能量射線之強度、塗膜厚度或陽離子聚合性有機化合物而異，通常0.1秒～10秒左右足夠。然而，對於相對厚之塗裝物，較佳為耗費此以上之照射時間。於活性能量射線照射後0.1秒～數分鐘後，大部分組合物藉由陽離子聚合而指觸乾燥，於某些情形時，為了促進陽離子聚合而併用利用加熱或熱感應頭等所得之熱能亦較佳。 又，本發明之組合物可藉由利用加熱板等熱板或大氣烘箱、惰性氣體烘箱、真空烘箱、熱風迴圈烘箱等所得之加熱而硬化。 作為本發明之組合物之熱硬化時之加熱溫度，不受到特別限定，自促進環氧樹脂之反應方面而言，較佳為70～200℃，更佳為90～150℃。 作為本發明之組合物之熱硬化時之硬化時間，不受到特別限定，自生產性提高方面而言，較佳為1～60分鐘，更佳為1～30分鐘。 進而，本發明之組合物可藉由活性能量射線之照射及加熱而硬化。於本發明之組合物之硬化中併用活性能量射線之照射及加熱之情形時，可於對組合物照射活性能量射線之後進行加熱，或可於加熱組合物之後照射活性能量射線，於圖案形狀之精度提高方面，較佳為於對組合物照射活性能量射線之後進行加熱。 作為本發明之組合物之硬化中併用活性能量射線之照射及加熱之情形所使用的活性能量射線及加熱裝置，可無特別限制地使用上述者，較佳為使用紫外線作為活性能量射線。 作為本發明之組合物之具體用途，可使用於光學濾光片、塗料、塗佈劑、襯砌劑、接著劑、印刷版、絕緣漆、絕緣片材、積層板、印刷基片、半導體裝置用、LED(Light Emitting Diode，發光二極體)封裝用、液晶注入口用、有機EL(Electro Luminescence，電致發光)用、光元件用、電氣絕緣用、電子零件用、分離膜用等之密封劑、成形材料、膩子、玻璃纖維浸漬劑、填隙材料、半導體用、太陽能電池用等之鈍化膜、層間絕緣膜、保護膜、印刷基板、或彩色電視機、PC(Personal Computer，個人電腦)顯示器、攜帶型資訊終端、CCD(Charge Coupled Device，電荷耦合元件)影像感測器之彩色濾光片、電漿顯示面板用之電極材料、印刷油墨、牙科用組合物、光造形用樹脂、液狀及乾燥膜之兩者、微小機械零件、玻璃纖維電纜塗佈、全像記錄用材料之各種用途，於該用途中無特別限制。 [實施例] 以下，列舉實施例等對本發明進行更詳細之說明，但本發明並不限定於該等實施例等。 [實施例1～17及比較例1～3]組合物N0.1～N0.17及比較組合物N0.1～N0.3之製備 以[表1]～[表3]所示之組成混合各成分，攪拌至不溶物消失，獲得組合物N0.1～N0.17及比較組合物N0.1～N0.3。此外，[表1]～[表3]中之各符號分別表示如下。又，[表1]～[表3]中之數值表示質量份。 陽離子聚合性化合物(A) A-1：EHPE-3150(Daicel公司製造環氧樹脂 脂環族環氧化合物) A-2：EOCN-104S(日本化藥公司製造環氧樹脂 芳香族環氧化合物) 光酸產生劑(B) [化5][化6][化7][化8][化9]。 熱酸產生劑(C) [化10]C-1係上述通式(2)中R31
及R32
之兩者為烷基之化合物。 [化11]C-2係上述通式(2)中R31
為烷基、R32
為芳基烷基之化合物。 溶劑(D) D-1：丙二醇-1-單甲醚-2-乙酸酯 D-2：甲基乙基酮 D-3：甲苯 D-4：二丙酮醇 其他成分(E) E-1：KBE-403(Shin-Etsu Silicones公司製造矽烷偶合劑) E-2：AO-60(ADEKA公司製造酚系抗氧化劑) [表1]
[表2]
[表3]
[圖案形成性評價] 關於所獲得之實施例及比較例，以下述基準進行圖案形成性評價。 [評價例1-1～1-17及比較評價例1-1～1-3] 將實施例1～17所獲得之組合物N0.1～N0.17及比較例1～3所獲得之比較組合物N0.1～N0.3分別於玻璃基板以2000 rpm×10秒之條件利用旋轉塗佈法進行塗佈，利用加熱板進行乾燥(100℃，3分鐘)。於所獲得之塗膜利用曝光部寬度20 μm之光罩以超高壓水銀燈照射任意曝光量。將曝光後之塗膜利用加熱板進行加熱(120℃，5分鐘)。於甲苯：甲基乙基酮＝1：1之混合溶劑中浸漬除去未曝光部，使用光學顯微鏡(基恩士公司製造VK-X100)測量圖案形狀。 將圖案形狀寬度(曝光部寬度)變為20 μm時之曝光量設為X0
(mJ/cm2
)，分別測量曝光量增加10 mJ/cm2
之情形與減少10 mJ/cm2
之情形之形狀寬度，將相對於曝光量變化之形狀變化藉由下述式進行計算而作為圖案形成性評價。將結果示於[表4]及[表5]。此外，數值越靠近100，對相對於曝光量之增減之圖案形狀之影響越小，圖案形成性優異。 (相對於曝光量之變化之形狀變化)＝(各曝光量下之曝光部之線寬)/20×100 [表4]
＊1：硬化至未曝光部而無法維持形狀，故無法測量。 ＊2：不留圖案，故無法測量 [表5]
[評價例2-1～2-4] 將實施例7、9、10及12所獲得之組合物N0.7、N0.9、N0.10及N0.12分別於玻璃基板以2000 rpm×10秒之條件利用旋轉塗佈法進行塗佈，利用加熱板進行乾燥(100℃，3分鐘)。於所獲得之塗膜利用曝光部寬度20 μm之光罩以超高壓水銀燈照射20 mJ/cm2
之曝光量。將曝光後之塗膜利用加熱板進行加熱(120℃，5分鐘)。於甲苯：甲基乙基酮＝1：1之混合溶劑中浸漬除去未曝光部，使用光學顯微鏡(基恩士公司製造VK-X100)目測確認成形性。 [表6]
自以上之結果顯而易見：含有上述陽離子聚合性化合物(A)、光酸產生劑(B)、及熱酸產生劑(C)之本發明之組合物於硬化物之光照射時之形狀變化較少。又，即使是20 mJ/cm2
左右之較少曝光量，成形性亦良好，故本發明之組合物為高感度。因此，本發明之組合物作為光學濾光片之原料有用。Hereinafter, the composition of the present invention will be described based on preferred embodiments. The composition of the present invention contains a cationically polymerizable compound (A), a photoacid generator (B), and a thermal acid generator (C). Hereinafter, each component will be described in order. The cationically polymerizable compound (A) used in the composition of the present invention is a compound which is polymerized by a photoacid generator or a thermal acid generator which generates a cationic species or a Lewis acid by light irradiation or heating, or The compound which undergoes the crosslinking reaction may be any compound, and is not particularly limited, and examples thereof are as follows. Examples of the cationically polymerizable compound (A) include an epoxy compound, an oxetane compound, a cyclic lactone compound, a cyclic acetal compound, a cyclic thioether compound, a spiroorthoester compound, and an ethylene system. One or two or more kinds of these compounds can be used. Among these compounds, an epoxy compound which is easy to obtain and which is convenient to use is suitable. As the epoxy compound, an aromatic epoxy compound, an alicyclic epoxy compound, an aliphatic epoxy compound, or the like is suitable. The cationically polymerizable compound is preferably an aromatic epoxy compound or an alicyclic epoxy compound, and particularly preferably an aromatic epoxy compound. When the above cationically polymerizable compound is the above-mentioned compound, the shape change of the obtained cured product becomes small with respect to the change in the amount of exposure. Furthermore, the epoxy compound may comprise all those comprising an epoxy structure. For example, a compound containing both an epoxy structure and an oxetane structure may be included in the epoxy compound. Specific examples of the alicyclic epoxy compound include a polyglycidyl ether having a polyhydric alcohol having at least one alicyclic ring or a compound containing a cyclohexene ring or a cyclopentene ring. A compound containing epoxycyclohexane or epoxycyclopentane obtained by oxidation. Examples of the alicyclic epoxy compound include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, and 3,4- Epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3, 4-epoxycyclohexane carboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-ring Oxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4 -epoxy)cyclohexane-m-dioxane, bis(3,4-epoxycyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylene Bis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethyl bis(3,4-epoxycyclohexanecarboxylate), epoxy hexahydroortylene Dioctyl formate, di-2-ethylhexyl hexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-2 ring Oxyethylcyclohexane, 3,4-epoxycyclohexyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, and the like. Further, an epoxy compound containing both an alicyclic ring and an aromatic ring can be equivalent to an alicyclic epoxy compound. As a commercial item which can be suitably used as the above-mentioned alicyclic epoxy compound, UVR-6100, UVR-6105, UVR-6110, UVR-6128, UVR-6200 (The above is manufactured by Union Carbon Compound Co., Ltd.), Celloxide 2021, Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, Celloxide 2000, Celloxide 3000, Cyclomer A200, Cyclomer M100, Cyclomer M101, Epolead GT-301, Epolead GT-302, Epolead 401, Epolead 403, ETHB, Epolead HD300, EHPE-3150, EHPE-3150CE (above is manufactured by Daicel Co., Ltd.), KRM-2110, KRM-2199 (above, manufactured by ADEKA Co., Ltd.). Among the above alicyclic epoxy compounds, an epoxy resin having an epoxycyclohexane structure is preferred in terms of hardenability (hardening rate). Specific examples of the aromatic epoxy compound include a polyglycidyl ether having at least one aromatic ring polyphenol or an alkylene oxide adduct thereof, and examples thereof include bisphenol A, bisphenol F, and The glycidyl ether or epoxy novolac resin of the compound obtained by further adding an alkylene oxide. Specific examples of the aliphatic epoxy compound include polyglycidyl ether of an aliphatic polyhydric alcohol or an alkylene oxide adduct thereof, polyglycidyl ester of an aliphatic long-chain polybasic acid, glycidyl acrylate or methyl group. A homopolymer synthesized by vinyl polymerization of a glycidyl acrylate, a glycidyl acrylate or a glycidyl methacrylate, a copolymer synthesized by vinyl polymerization of another vinyl monomer, or the like. Representative examples of the aliphatic epoxy compound include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerol triglycidyl ether, and trishydroxyl a glycidyl ether of a polyhydric alcohol such as a triglycidyl ether of a propane, a tetraglycidyl ether of sorbitol, a hexahydroglycidyl ether of dipentaerythritol, a diglycidyl ether of polyethylene glycol, or a diglycidyl ether of polypropylene glycol. Further, a polyglycidyl ether of a polyether polyol obtained by adding one or more kinds of alkylene oxides to an aliphatic polyol such as propylene glycol, trimethylolpropane or glycerin, or a fatty long-chain diacid Glycidyl ester. Further, examples thereof include a monoglycidyl ether of an aliphatic higher alcohol, phenol, cresol, butylphenol, and a monoglycidyl ether of a polyether alcohol obtained by adding the alkylene oxide, and a higher fatty acid. Glycidyl ester, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, epoxidized polybutadiene, and the like. Further, the aliphatic epoxy compound may not contain an alicyclic ring and an aromatic ring. Commercial products which can be suitably used as the above-mentioned aromatic epoxy compound and aliphatic epoxy compound include jERYX-4000, jERYX-8000, jER871, jER872, jER157S70, jER806, jER1001, jER152, and jER604 (Mitsubishi Chemical Co., Ltd. Manufactured) PY-306, 0163, DY-022 (above is manufactured by Ciba Jiaji), KRM-2720, EP-4100, EP-4000, EP-4080, EP-4088, EP-4900, ED-505, ED-506 (made by ADEKA), Epolight M-1230, Epolight EHDG-L, Epolight 40E, Epolight 100E, Epolight 200E, Epolight 400E, Epolight 70P, Epolight 200P, Epolight 400P, Epolight 1500NP, Epolight 1600, Epolight 80MF, Epolight 100MF, Epolight 4000, Epolight 3002, Epolight FR-1500 (manufactured by Kyoeisha Chemical Co., Ltd.), Sun Tohto ST0000, YD-716, YH-300, PG-202, PG-207, YD-172, YDPN638 (Nippon Steel Made by Chemical Company) DENACOL EX321, DENACOL EX313, DENACOL314, DENACOL EX-411, EM-150 (manufactured by Changchun Chemical Co., Ltd.), EPPN-201, EPPN-502H, NC-3000, NC-7300L, XD-1000, NC- 2000-L, NC-7000L, CER-3000-L, EOCN-104S, EOCN-1020, EPPN-501H (Japan Chemical Industries, Ltd.) and so on. Specific examples of the above oxetane compound which can be used as the cationically polymerizable compound (A) include the following compounds. It can be exemplified by 3-ethyl-3-hydroxymethyloxetane, 3-(methyl)allyloxymethyl-3-ethyloxetane, (3-ethyl-3- Oxetane methoxy)methylbenzene, 4-fluoro-[1-(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 4-methoxy- [1-(3-Ethyl-3-oxetanylmethoxy)methyl]benzene, [1-(3-ethyl-3-oxetanylmethoxy)ethyl] Phenyl ether, isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, isodecyloxyethyl (3-ethyl-3-oxetanylmethyl) Ether, isodecyl (3-ethyl-3-oxetanylmethyl)ether, 2-ethylhexyl (3-ethyl-3-oxetanylmethyl)ether, ethyl Diethylene glycol (3-ethyl-3-oxetanylmethyl)ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl)ether, dicyclopentane Alkenyloxyethyl (3-ethyl-3-oxetanylmethyl)ether, dicyclopentenyl (3-ethyl-3-oxetanylmethyl)ether, tetrahydrofuran (3-ethyl-3-oxetanylmethyl)ether, tetrabromophenyl(3-ethyl-3-oxetanylmethyl)ether, 2-tetrabromophenoxy Ethyl (3-ethyl-3-oxetanylmethyl) , tribromophenyl (3-ethyl-3-oxetanylmethyl)ether, 2-tribromophenoxyethyl (3-ethyl-3-oxetanylmethyl) Ether, 2-hydroxyethyl (3-ethyl-3-oxetanylmethyl)ether, 2-hydroxypropyl (3-ethyl-3-oxetanylmethyl)ether, Butoxyethyl (3-ethyl-3-oxetanylmethyl)ether, pentachlorophenyl (3-ethyl-3-oxetanylmethyl)ether, pentabromobenzene (3-ethyl-3-oxetanylmethyl)ether, fluorenyl (3-ethyl-3-oxetanylmethyl)ether, 3,7-bis(3-oxo Heterocyclic butyl)-5-oxa-decane, 3,3'-(1,3-(2-methylenyl)propanedibis(formaldehyde)) bis-(3-ethyloxetane Alkane), 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetane) Alkyl methoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl 3-oxetanylmethyl)ether, dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl)ether, triethylene glycol bis(3-ethyl- 3-oxetanylmethyl)ether, tetraethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, three Decanediyldimethylene (3-ethyl-3-oxetanylmethyl)ether, trimethylolpropane tris(3-ethyl-3-oxetanylmethyl) Ether, 1,4-bis(3-ethyl-3-oxetanylmethoxy)butane, 1,6-bis(3-ethyl-3-oxetanylmethoxy) Hexane, pentaerythritol tris(3-ethyl-3-oxetanylmethyl)ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl)ether, polyethylene glycol Bis(3-ethyl-3-oxetanylmethyl)ether, dipentaerythritol hexa(3-ethyl-3-oxetanylmethyl)ether, dipentaerythritol penta(3-ethyl 3-oxetanylmethyl)ether, dipentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl)ether, caprolactone modified dipentaerythritol hexa(3-ethyl- 3-oxetanylmethyl)ether, caprolactone modified dipentaerythritol penta(3-ethyl-3-oxetanylmethyl)ether, di-trimethylolpropane tetra(3) -Ethyl-3-oxetanylmethyl)ether, EO-modified bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, PO-modified bisphenol A double (3-ethyl-3-oxetanylmethyl)ether, EO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanyl) Ether, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanylmethyl)ether, EO modified bisphenol F (3-ethyl-3-oxetane Methyl)ether and the like. Specific product names which can be suitably used as a commercial product of the above oxetane compound include ARONE OXETANE OXT-101, OXT-121, OXT-221, OXT-212, and OXT-211 (the above is East Asian synthesis) Co., Ltd. manufactures), ETERNACOLL EHO, OXBP, OXTP, OXMA (above manufactured by Ube Industries Co., Ltd.). These may be used alone or in combination of two or more. These oxetane compounds are effective and satisfactory if they are particularly required to be flexible. Examples of the other cationically polymerizable compound (A) include an oxolane compound such as tetrahydrofuran or 2,3-dimethyltetrahydrofuran, trioxane, 1,3-dioxolane, and 1,3. a cyclic acetal compound such as 6-trioxane cyclooctane, a cyclic lactone compound such as β-propiolactone or ε-caprolactone, an episulfide compound such as ethylene sulfide or sulfur epichlorohydrin, 1 a cyclic thioether compound such as 3-dithiopropyne or 3,3-dimethylcyclosulfane or a cyclic thioether compound such as a tetrahydrothiophene derivative, ethylene glycol divinyl ether or alkyl vinyl ether, 2 Vinyl ether compounds such as -chloroethyl vinyl ether, 2-hydroxyethyl vinyl ether, triethylene glycol divinyl ether, 1,4-cyclohexane dimethanol divinyl ether, hydroxybutyl vinyl ether, propylene glycol propylene ether A spiro orthoester compound obtained by a reaction between an epoxy compound and a lactone, an ethylenically unsaturated compound such as styrene, ethylene cyclohexene, isobutylene or polybutadiene, or the like. In the present invention, one or two or more kinds of the above cationically polymerizable compounds may be used in combination as the cationically polymerizable compound (A). As the cationically polymerizable compound, the epoxy compound is particularly excellent in heat resistance and transparency of the cured product. The photoacid generator (B) used in the composition of the present invention may be any one which can produce a cationic species or a Lewis acid by light irradiation, and is preferably a Lewis acid which is released by irradiation of ultraviolet rays. a double salt of a salt or a derivative thereof. As a representative of the compound, the following general formula [A] can be cited.m+
[B]M-
Salts of the cations and anions shown. Where cation [A]m+
Preferably, the structure can be obtained by, for example, the following formula [(Ra
)a
Q]m+
Said. Where, Ra
It is an organic group having 1 to 60 carbon atoms and may contain atoms other than carbon atoms. a is an integer from 1 to 5. a Ra
Separate, there are the same or different situations. Further, at least one of the organic groups as described above preferably having an aromatic ring. The Q group is selected from an atom or an atom group in a group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N=N. Again, the cation [A]m+
When the atomic price of Q is set to q, the relationship of m=a-q is required (where N=N is regarded as the atomic price of 0). Again, anion [B]M-
It is not particularly limited, and is preferably a halide complex, and the structure can be, for example, by the following formula [LX]b
]M-
Said. In the formula, L is a metal or a semimetal which is a central atom of a halide complex, and is B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co, and the like. X is a halogen atom. b is an integer from 3 to 7. Also, the anion [B]M-
When the atomic price of L is set to p, the relationship of m=b-p is required to be established. As an anion of the above formula [LXb
]M-
Specific examples include perchlorate ion (ClO)4
)-
, tetrafluoroborate ion (BF4
)-
, hexafluorophosphate ion (PF6
)-
Hexafluoroantimonate (SbF)6
)-
Hexafluoroarsenate (AsF6
)-
Hexachloroantimonate (SbCl)6
)-
Inorganic ion; fluorosulfonate ion (FSO3
)-
, sulfonate ion such as toluenesulfonate anion, trinitrobenzenesulfonate ion, camphorsulfonate ion, nonafluorobutanesulfonate ion, hexadecanolsulfonate ion; tetraarylborate ion, tetrakis(pentafluorobenzene) Boric acid ion such as borate ion; carboxylate ion, carboxylate ion, propionate ion, butyrate ion, octyl carboxylate ion, trifluoromethanecarboxylate ion, benzoate ion, p-toluene carboxylate Carboxylate ion such as acid ion; trifluoromethylsulfite ion (CF3
SO3
)-
Methylsulfate ion (CH3
OSO3
)-
, bis(trifluoromethanesulfonyl) quinone imine ion, tris(trifluoromethanesulfonyl) methide ion, and the like. Again, anion [B]M-
It is also preferred to use the following formula [LX]b - 1
(OH)]M-
The structure shown. L, X, b are the same as described above. In the present invention, among the above-mentioned onium salts, the aromatic onium salts of the following (1) to (3) are particularly effective. These may be used alone or in combination of two or more. (1) an aryldiazonium salt such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate or 4-methylphenyldiazonium hexafluorophosphate ( 2) Diphenylphosphonium hexafluoroantimonate, bis(4-methylphenyl)phosphonium hexafluorophosphate, bis(4-t-butylphenyl)phosphonium hexafluorophosphate, tolylpyridylphenyl a diarylsulfonium salt such as tetrakis(pentafluorophenyl)borate (3) a phosphonium cation represented by the following group I or group II, and a phosphonium salt such as a hexafluoroantimonium ion or a tetrakis(pentafluorophenyl)borate ion; [Chemical 1] <Group I> . [Chemical 2] <Group II> . Further, as other preferred ones, (η5
-2,4-cyclopentadien-1-yl)[(1,2,3,4,5,6-η)-(1-methylethyl)benzene]-iron-hexafluorophosphate - an aromatic hydrocarbon complex or a mixture of an aluminum complex such as tris(acetonitrile)aluminum, tris(ethylacetoacetate)aluminum, tris(salicylic acid)aluminum, or the like, and a decyl alcohol such as triphenylnonanol. Among these, from the viewpoint of the practical surface and the sensitivity, it is preferred to use an aromatic sulfonium salt, an aromatic sulfonium salt, an iron-aromatic hydrocarbon complex, and an aromatic compound represented by the following formula (1). The onium salt is further preferred in terms of sensitivity. [Chemical 3]. (where, R1
, R2
, R3
, R4
, R5
, R6
, R7
, R8
, R9
, R10
, R19
, R20
, Rtwenty one
, Rtwenty two
And Rtwenty three
Each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms or an ester group having 2 to 10 carbon atoms, R11
, R12
, R13
, R14
, R15
, R16
, R17
And R18
Respectively represent a hydrogen atom, a halogen atom or an alkyl group having 1 to 10 carbon atoms, X1 -
Represents a monovalent anion). In the aromatic onium salt represented by the above formula (1), as R1
, R2
, R3
, R4
, R5
, R6
, R7
, R8
, R9
, R10
, R11
, R12
, R13
, R14
, R15
, R16
, R17
, R18
, R19
, R20
, Rtwenty one
, Rtwenty two
And Rtwenty three
Examples of the halogen atom shown include fluorine, chlorine, bromine, and iodine. In the aromatic onium salt represented by the above formula (1), R1
, R2
, R3
, R4
, R5
, R6
, R7
, R8
, R9
, R10
, R11
, R12
, R13
, R14
, R15
, R16
, R17
, R18
, R19
, R20
, Rtwenty one
, Rtwenty two
And Rtwenty three
The alkyl group having 1 to 10 carbon atoms is shown to be substituted by a halogen atom, and the methylene group in the alkyl group is present by -O-, -S-, -CO-, -OCO-, -COO -, -C=C-, -NHCO-, -NH- or -CONH- substitution. Specific examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, a second butyl group, a third butyl group, an isobutyl group, and a pentyl group. Isoamyl, third amyl, hexyl, cyclohexyl, heptyl, octyl, decyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl , 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl , difluoromethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, di Chlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, decafluorohexyl, pentafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1 ,2-epoxyethyl, methoxyethyl, methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, tert-butylthiomethyl, 4 -pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)B , 1-methyl-1-methoxyethyl, ethyldithioethyl, trimethyldecylethyl, tert-butyldimethylnonyloxymethyl, 2-(trimethyldecane Ethyloxymethyl, tert-butoxycarbonylmethyl, ethoxycarbonylmethyl, ethylcarbonylmethyl, tert-butoxycarbonylmethyl, acryloxyethyl, methacryl Oxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl, ethyl ethylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxy Ethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl and the like. In the aromatic onium salt represented by the above formula (1), as R1
, R2
, R3
, R4
, R5
, R6
, R7
, R8
, R9
, R10
, R19
, R20
, Rtwenty one
, Rtwenty two
And Rtwenty three
Examples of the alkoxy group having 1 to 10 carbon atoms shown include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a second butoxy group, and a third butoxy group. Isobutoxy, pentyloxy, isopentyloxy, third pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethoxy, tetrahydrofuranyloxy, tetrahydropyranyloxy, 2-methoxy Ethyloxy, 3-methoxypropoxy, 4-methoxybutoxy, 2-butoxyethoxy, methoxyethoxyethoxy, methoxyethoxyethoxy Ethyl ethoxy, 3-methoxybutoxy, 2-methylthioethoxy, trifluoromethoxy, and the like. In the aromatic onium salt represented by the above formula (1), as R1
, R2
, R3
, R4
, R5
, R6
, R7
, R8
, R9
, R10
, R19
, R20
, Rtwenty one
, Rtwenty two
And Rtwenty three
The ester group having 2 to 10 carbon atoms shown may, for example, be a methoxycarbonyl group, an ethoxycarbonyl group, an isopropoxycarbonyl group, a phenoxycarbonyl group, an ethyloxy group, a propyloxy group or a butyloxy group. , chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, tert-butylcarbonyloxy, methoxyethoxycarbonyl, benzhydryloxy Wait. In the aromatic sulfonium salt represented by the above formula (1), as X1 -
The one-valent anion shown is not particularly limited, and preferably, perchlorate ion (ClO)4
)-
, tetrafluoroborate ion (BF4
)-
, hexafluorophosphate ion (PF6
)-
Hexafluoroantimonate (SbF)6
)-
Hexafluoroarsenate (AsF6
)-
Hexachloroantimonate (SbCl)6
)-
And other inorganic ions; tetraarylborate ion, boric acid ion such as tetrakis(pentafluorophenyl)borate ion; tris(trifluoromethanesulfonyl)methide ion; tris(perfluoroalkyl) trifluoride Phosphine anion. In the present invention, among the aromatic onium salts represented by the above formula (1), R is preferred.3
, R8
And R13
At least one of them is a halogen atom. Also, preferably R3
And R8
At least one of them is a halogen atom, more preferably both are halogen atoms, and in this case, the halogen atom is preferably fluorine. Also, R13
It is preferably a halogen atom, more preferably chlorine. By putting R3
, R8
And / or R13
It is preferable to use the above-mentioned group to obtain a composition having less change in the shape of the cured product obtained by a change in the amount of exposure. As the photoacid generator (B), a commercially available product may be used, and examples thereof include Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (manufactured by U.S. Carbon Corporation), and Irgacure. 261, CG-24-61 (manufactured by BASF), DAICATII (manufactured by Daicel), UVAC1591 (manufactured by Daicel-Allnex), CI-2481, CI-2734, CI-2823, CI-2758 (above is Japan's Soda Corporation) Manufacturing), FFC509 (3M Company), BBI-102, BBI-101, BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, NDS-103 (manufactured by Midori Kagaku Co., Ltd.) Wait. The use ratio of the photoacid generator (B) to the cationically polymerizable compound (A) is not particularly limited, and may be used in a substantially normal use ratio within a range not inhibiting the object of the present invention, for example, relative to a cation. The photoacid generator (B) can be used in an amount of 0.05 to 20 parts by mass, preferably 0.1 to 15 parts by mass, per 100 parts by mass of the polymerizable compound (A). When the ratio of use of the photoacid generator (B) is too small, the curing tends to be insufficient, and if it is too large, the strength of the cured product may be adversely affected. The so-called thermal acid generator (C) used in the composition of the present invention is a compound which generates a cationic species or a Lewis acid by heating, and examples thereof include a phosphonium salt, a phosphonium salt, and a heavy one which are exemplified as the photoacid generator (B). a salt of a sulfonium salt, a strontium salt, a selenium salt, an oxonium salt, an ammonium salt, a thiophene sulfonium salt, a thiolane sulfonium salt, a benzylammonium salt, a pyridinium salt or a sulfonium salt; a sulfonium imide sulfonate such as an acid salt or a phthalimide sulfonate; a polyalkyl polyamine such as a diethyltriamine, a tri-ethyltriamine or a tetraethylamethyleneamine; , an alicyclic polyamine such as 2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane or isophorone diamine; m-xylylenediamine; An aromatic polyamine such as aminodiphenylmethane or diaminodiphenylphosphonium; by using the above polyamines with phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, double a polyepoxy addition modification product produced by reacting various epoxy resins such as glycidyl ethers such as phenol F-diglycidyl ether or glycidyl esters of carboxylic acid by a conventional method; by using the above organic polyamine And phthalate a guanamine modified product produced by a reaction of a carboxylic acid such as isophthalic acid or a dimer acid by a conventional method; and the above-mentioned polyamines and aldehydes such as formaldehyde, phenol, cresol, xylenol, and Trienylphenol, resorcinol is equivalent to a Mannich modification modified by a conventional method in which a phenol having at least one hydroformylation site is nucleated; a polycarboxylic acid (oxalic acid, malonic acid, amber) Acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyl Adipic acid, 3-methylglutaric acid, 2-methyl suberic acid, 3,8-dimethyl ester of sebacic acid, 3,7-dimethyl ester of sebacic acid, hydrogenated dimer acid, dimerization An aliphatic dicarboxylic acid such as an acid; an aromatic dicarboxylic acid such as phthalic acid, terephthalic acid, isophthalic acid or naphthalene dicarboxylic acid; or an alicyclic dicarboxylic acid such as cyclohexane dicarboxylic acid; An anhydride of a tricarboxylic acid such as trimesic acid, trimesic acid, a terpolymer of a castor oil fatty acid, a tetracarboxylic acid such as pyromellitic acid, or the like; benzoin tosylate, p-nitrobenzyl-9,10- Ethoxy oxime-2-sulfonate Acid ester, 2-nitrobenzyl tosylate, 2,6-dinitrobenzyl tosylate, 2,4-dinitrobenzyl tosylate sulfonate; dicyandiamide, Imidazole, a carboxylic acid ester, an amine sulfimine, a halogen compound, etc. may be used alone or in combination of two or more. As the above thermal acid generator (C), a monophenylphosphonium salt is preferable because it is industrially easy to obtain. Examples of the monophenylphosphonium salt include a benzyl-p-hydroxyphenylmethyl phosphonium salt, a p-hydroxyphenyl dimethyl sulfonium salt, a p-ethoxycarbonyl phenyl dimethyl sulfonium salt, and a benzyl-pair. Hydroxyphenyl methyl phosphonium salt, benzyl phenyl phosphonium salt, and the like. Among the above-mentioned thermal acid generators (C), those represented by the following formula (2) are more effective even if the amount of addition is small, and an industrial raw material is easily obtained. [Chemical 4]. (where, R31
And R32
Each independently represents an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms or an arylalkyl group having 7 to 20 carbon atoms, R33
, R34
, R35
, R36
And R37
Respectively represent a hydrogen atom, a hydroxyl group, a halogen atom or an alkyl group having 1 to 10 carbon atoms, X2 -
Represents a monovalent anion). In the above formula (2), as R31
, R32
, R33
, R34
, R35
, R36
And R37
The alkyl group having 1 to 10 carbon atoms is shown, R33
, R34
, R35
, R36
And R37
Halogen atom shown, X2 -
The one-valent anion shown is exemplified by the above formula (1). In the above formula (2), as R31
And R32
Examples of the aryl group having 6 to 20 carbon atoms shown include a phenyl group, a naphthyl group, an anthracenyl group and the like. In the above formula (2), as R31
And R32
Examples of the arylalkyl group having 7 to 20 carbon atoms shown include a benzyl group, a decyl group, a fluorenyl group, and a 9-fluorenylmethyl group. R31
And R32
Preferably, one is an alkyl group having 1 to 10 carbon atoms, and the other is an arylalkyl group having 1 to 10 carbon atoms or 7 to 20 carbon atoms, and more preferably both are carbon. The number of atoms is 1 to 10 alkyl groups. Further, in the above formula (2), R is preferred.35
It is a hydroxyl group. By putting R31
, R32
And / or R35
It is preferable to use the above-mentioned group to obtain a composition having less change in the shape of the cured product obtained by a change in the amount of exposure. As X2 -
One of the anions shown, than the X1 -
The acid produced by the one-valent anion is weaker, that is, as the salt pKa is larger, since the anion of the photoacid generator (B) and the anion of the thermal acid generator (C) are not salt-exchanged, it is preferred. . As X2 -
One of the anions shown, preferably perchlorate ion (ClO4
)-
, tetrafluoroborate ion (BF4
)-
, hexafluorophosphate ion (PF6
)-
Hexafluoroantimonate (SbF)6
)-
Hexafluoroarsenate (AsF6
)-
Hexachloroantimonate (SbCl)6
)-
Such as inorganic ions, methyl sulfate ions. In the composition of the present invention, the aromatic sulfonium salt represented by the above formula (1) is used as the photoacid generator (B), and the compound represented by the above formula (2) is used as the thermal acid generator (C). In the case of X1 -
One of the anions shown with X2 -
A preferred combination of one of the anions shown is as follows. By using the combination described below, a composition having less change in the shape of the cured product obtained with respect to the change in the amount of exposure can be obtained, which is preferable. (1)X1 -
Is tetrakis(pentafluorophenyl)borate ion, X2 -
It is a combination of methyl sulfate ions. (2)X1 -
Is tetrakis(pentafluorophenyl)borate ion, X2 -
Hexafluorophosphate ion (PF6
)-
The combination. (3)X1 -
Hexafluoroantimonate (SbF)6
)-
,X2 -
It is a combination of methyl sulfate ions. (4)X1 -
Is a tris(trifluoromethanesulfonyl)methide ion, X2 -
It is a combination of methyl sulfate ions. The heating temperature of the above thermal acid generator (C) is 70 to 180 ° C, preferably 90 to 140 ° C. As the thermal acid generator (C), a commercially available product can also be used, and for example, the following products can be mentioned. Can be listed as: CI-2064, CI-2624, CI-2639, CI-2855, CI-2920, CI-2921, CI-2946, CI-3128 (manufactured by Japan Soda Corporation), SI-45, SI-47, SI -60, SI-60L, SI-80, SI-80L, SI-100, SI-100L, SI-110L, SI-145, SI-150, SI-160, SI-180, SI-180L (Sanxin Chemical Manufactured by the company, TA-90, TA-100, TA-120, TA-160, IK-1, IK-2 (manufactured by San-Apro), Adekaopton CP-66, Adekaopton CP-77 (made by ADEKA), FC-520 (made by 3M Company) and so on. The use ratio of the thermal acid generator (C) to the cationically polymerizable compound (A) is not particularly limited, and may be used at a substantially normal use ratio within a range not inhibiting the object of the present invention, for example, relative to 100 parts by mass of the cationically polymerizable compound (A), the thermal acid generator (C) can be 0.0000001 to 0.5 parts by mass, preferably 0.000001 to 0.1 parts by mass. The mass ratio of the photoacid generator (B) to the thermal acid generator (C) is higher than the former: when the latter is set to 100:0.00001 to 100:5, sensitivity control is easy, and the molding process is improved, which is preferable. In the composition of the present invention, a solvent capable of dissolving or dispersing the above components may be added as needed, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve. Agent, chloroform, dichloromethane, hexane, heptane, octane, cyclohexane, benzene, toluene, xylene, methanol, ethanol, isopropanol. In the composition of the present invention, the content of the solvent is appropriately selected depending on the use of the composition, etc., and is not particularly limited. Usually, in the composition of the present invention, the solid content (the total content of all components other than the solvent) is When the solvent is contained in a form of 5 to 90% by mass, it is suitable for the case where the composition of the present invention is applied by coating as in the case of the wavelength cut filter. Further, as long as the effects of the present invention are not impaired, a benzotriazole-based, triterpenoid-based or benzoic acid-based ultraviolet absorber may be added as needed; phenolic, phosphorus-based, and sulfur-based antioxidants; Antistatic agent composed of a reagent, an anionic surfactant, a nonionic surfactant, an amphoteric surfactant, or the like; a halogen compound, a phosphate compound, a phosphonamine compound, a melamine compound, a fluororesin or a metal Flame retardant such as oxide, (poly)phosphoric acid melamine or (poly)phosphonium phosphate; hydrocarbon, fatty acid, aliphatic alcohol, aliphatic ester, aliphatic amide or metal soap lubricant; pigment, Coloring agent such as carbon black; scented cerium oxide, fine particle cerium oxide, vermiculite, diatomaceous earth, clay, kaolin, diatomaceous earth, tannin, calcium silicate, sericite, kaolinite, vermiculite, feldspar powder, Lanthanum, erbium, talc, mica, iron talc, pyrophyllite, cerium oxide and other inorganic additives; glass fiber, calcium carbonate and other fillers; nucleating agent, crystallization promoter and other crystallizers, decane Rubber elastic imparting agent such as mixture and flexible polymer, sensitizer, other monomer, antifoaming agent, tackifier, leveling agent, plasticizer, polymerization inhibitor, antistatic agent, flow regulator, and even Mixtures, adhesion promoters and other additives. The amount of each of these additives is set to 50% by mass or less in total in the composition of the present invention. The composition of the present invention can be cured by irradiation with an active energy ray such as ultraviolet rays, and is usually hardened to a dry state of a touch or a solvent insoluble state from the start of irradiation to 0.1 second to several minutes. As an appropriate active energy ray, any decomposition may be employed as long as the decomposition of the photoacid generator is induced, and it is preferable to use a self-super high, high, medium, and low pressure mercury lamp, a xenon lamp, a carbon arc lamp, a metal halide lamp, and a firefly. Lights, tungsten lamps, excimer lamps, germicidal lamps, excimer lasers, nitrogen lasers, argon ion lasers, cadmium cadmium lasers, helium lasing lasers, helium ion lasers, various semiconductor lasers, YAG ( Yttrium Aluminum Garnet, yttrium aluminum garnet, electromagnetic wave energy or electron beam, X-ray, obtained from a laser, a light-emitting diode, a CRT (Cathode Ray Tube) source, etc., having a wavelength of 2000 Å to 7000 Å, High-activity energy rays such as radiation. The irradiation time of the active energy ray varies depending on the intensity of the active energy ray, the thickness of the coating film, or the cationically polymerizable organic compound, and is usually sufficient from about 0.1 second to about 10 seconds. However, for relatively thick coatings, it is preferred to consume the above irradiation time. After 0.1 second to several minutes after the irradiation of the active energy ray, most of the composition is dry-touched by cationic polymerization, and in some cases, heat energy obtained by using a heating or heat-sensing head or the like in order to promote cationic polymerization is also used. good. Further, the composition of the present invention can be hardened by heating using a hot plate such as a hot plate or an atmospheric oven, an inert gas oven, a vacuum oven, a hot air loop oven or the like. The heating temperature at the time of thermal curing of the composition of the present invention is not particularly limited, and is preferably 70 to 200 ° C, more preferably 90 to 150 ° C from the viewpoint of promoting the reaction of the epoxy resin. The curing time in the case of heat curing of the composition of the present invention is not particularly limited, and is preferably from 1 to 60 minutes, more preferably from 1 to 30 minutes, from the viewpoint of improvement in productivity. Further, the composition of the present invention can be hardened by irradiation with an active energy ray and heating. In the case of the curing of the composition of the present invention in combination with the irradiation and heating of the active energy ray, the composition may be heated after the active energy ray is irradiated, or the active energy ray may be irradiated after heating the composition, in the shape of the pattern. In terms of improving the precision, it is preferred to heat the composition after irradiating the active energy ray. The active energy ray and the heating device used for the irradiation and heating of the active energy ray in the curing of the composition of the present invention can be used without particular limitation, and it is preferred to use ultraviolet rays as the active energy ray. As a specific use of the composition of the present invention, it can be used for optical filters, coatings, coating agents, lining agents, adhesives, printing plates, insulating varnishes, insulating sheets, laminated sheets, printed substrates, and semiconductor devices. Sealing for LED (Light Emitting Diode), liquid crystal injection, organic EL (Electro Luminescence), optical components, electrical insulation, electronic components, separation membranes, etc. Passivation film, interlayer insulating film, protective film, printed circuit board, or color television, PC (Personal Computer, personal computer) for agent, molding material, putty, glass fiber impregnating agent, gap filler, semiconductor, solar cell, etc. Display, portable information terminal, color filter of CCD (Charge Coupled Device) image sensor, electrode material for plasma display panel, printing ink, dental composition, photo-forming resin, liquid Various uses of the shape and the dry film, the micro mechanical parts, the glass fiber cable coating, and the hologram recording material are not particularly limited in this application. [Examples] Hereinafter, the present invention will be described in more detail by way of examples and the like, but the invention is not limited to the examples and the like. [Examples 1 to 17 and Comparative Examples 1 to 3] The preparations of the compositions N0.1 to N0.17 and the comparative compositions N0.1 to N0.3 were mixed in the compositions shown in [Table 1] to [Table 3]. Each component was stirred until the insoluble matter disappeared, and the compositions N0.1 to N0.17 and the comparative compositions N0.1 to N0.3 were obtained. Further, each of the symbols in [Table 1] to [Table 3] is expressed as follows. Further, the numerical values in [Table 1] to [Table 3] represent parts by mass. Cationic polymerizable compound (A) A-1: EHPE-3150 (epoxy alicyclic epoxy compound manufactured by Daicel Co., Ltd.) A-2: EOCN-104S (epoxy resin aromatic epoxy compound manufactured by Nippon Kayaku Co., Ltd.) Photoacid generator (B) [Chemical 5][Chemical 6][Chemistry 7][化8][Chemistry 9]. Hot acid generator (C) [Chemical 10]C-1 is R in the above formula (2)31
And R32
Both are alkyl compounds. [11]C-2 is R in the above formula (2)31
Is alkyl, R32
A compound which is an arylalkyl group. Solvent (D) D-1: propylene glycol-1-monomethyl ether-2-acetate D-2: methyl ethyl ketone D-3: toluene D-4: diacetone alcohol other component (E) E-1 : KBE-403 (Shun-Etsu Silicones Co., Ltd. manufactures decane coupling agent) E-2: AO-60 (phenolic antioxidant manufactured by ADEKA) [Table 1]
[Table 2]
[table 3]
[Pattern Formability Evaluation] With respect to the obtained examples and comparative examples, the pattern formation property evaluation was performed based on the following criteria. [Evaluation Examples 1-1 to 1-17 and Comparative Evaluation Examples 1-1 to 1-3] Comparisons of the compositions N0.1 to N0.17 obtained in Examples 1 to 17 and Comparative Examples 1 to 3 were obtained. Each of the compositions N0.1 to N0.3 was applied by a spin coating method on a glass substrate at 2000 rpm × 10 seconds, and dried by a hot plate (100 ° C, 3 minutes). The obtained coating film was irradiated with an arbitrary exposure amount with an ultrahigh pressure mercury lamp using a photomask having an exposure portion width of 20 μm. The exposed coating film was heated by a hot plate (120 ° C, 5 minutes). The unexposed portion was immersed in a mixed solvent of toluene:methyl ethyl ketone = 1:1, and the pattern shape was measured using an optical microscope (VK-X100 manufactured by Keyence Corporation). The exposure amount when the pattern shape width (exposure portion width) is changed to 20 μm is set to X.0
(mJ/cm2
), separately measuring the exposure increase by 10 mJ/cm2
The situation is reduced by 10 mJ/cm2
In the case of the shape width of the case, the shape change with respect to the change in the exposure amount was calculated by the following formula to evaluate the pattern formability. The results are shown in [Table 4] and [Table 5]. Further, the closer the value is to 100, the smaller the influence on the pattern shape with respect to the increase or decrease of the exposure amount, and the pattern formability is excellent. (Change in shape with respect to change in exposure amount) = (line width of exposure portion at each exposure amount) / 20 × 100 [Table 4]
*1: It is hard to measure until it is hardened to the unexposed part, and it cannot be measured. *2: No pattern is left, so it cannot be measured [Table 5]
[Evaluation Examples 2-1 to 2-4] The compositions N0.7, N0.9, N0.10 and N0.12 obtained in Examples 7, 9, 10 and 12 were respectively placed on a glass substrate at 2000 rpm × 10 The conditions of seconds were applied by a spin coating method, and dried by a hot plate (100 ° C, 3 minutes). The obtained coating film was irradiated with an ultrahigh pressure mercury lamp at 20 mJ/cm using a photomask having an exposure portion width of 20 μm.2
The amount of exposure. The exposed coating film was heated by a hot plate (120 ° C, 5 minutes). The unexposed portion was immersed in a mixed solvent of toluene:methyl ethyl ketone = 1:1, and the moldability was visually observed using an optical microscope (VK-X100, manufactured by Keyence Corporation). [Table 6]
As is apparent from the above results, the composition of the present invention containing the above cationically polymerizable compound (A), photoacid generator (B), and thermal acid generator (C) has less shape change upon light irradiation of the cured product. . Again, even 20 mJ/cm2
The composition of the present invention is high in sensitivity because the amount of exposure on the left and right is small and the formability is also good. Therefore, the composition of the present invention is useful as a raw material for an optical filter.