TW202218868A - Method for manufacturing protective film forming roll which is produced by winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film - Google Patents

Method for manufacturing protective film forming roll which is produced by winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film Download PDF

Info

Publication number
TW202218868A
TW202218868A TW110129612A TW110129612A TW202218868A TW 202218868 A TW202218868 A TW 202218868A TW 110129612 A TW110129612 A TW 110129612A TW 110129612 A TW110129612 A TW 110129612A TW 202218868 A TW202218868 A TW 202218868A
Authority
TW
Taiwan
Prior art keywords
film
protective film
forming
release
protective
Prior art date
Application number
TW110129612A
Other languages
Chinese (zh)
Inventor
山本大輔
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202218868A publication Critical patent/TW202218868A/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/02Wrappers or flexible covers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/068Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/401Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52Mounting semiconductor bodies in containers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane
    • C09J2483/005Presence of polysiloxane in the release coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Quality & Reliability (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

The present invention provides a method for manufacturing a protective film forming roll which does not easily produce traces. The traces are caused by the winding of the protective film forming film, which will bring traces to the protective film. The manufacturing method of the protective film forming roll includes the following steps: winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film to form a roll; storing the roll at a storage temperature below 10℃ for more than 25 days within 60 days after forming the roll, letting the stripping force for stripping the first release film from the protective film forming film be F1 and the stripping force for stripping the second release film from the protective film forming film be F2, the relationship of F1 > F2 is satisfied, and letting the loss tangent of the protective film forming film at 10DEG C be tan[delta] 10, tan[delta] 10 is less than 1.2.

Description

保護膜形成用片卷的製造方法Manufacturing method of sheet roll for protective film formation

本發明關於一種保護膜形成用片卷的製造方法。尤其關於一種不易產生痕跡的保護膜形成用片卷的製造方法,該痕跡起因於會給保護膜帶來痕跡的保護膜形成膜的捲繞。The present invention relates to a method for producing a sheet roll for forming a protective film. In particular, it is related with the manufacturing method of the sheet roll for protective film formation which is hard to generate|occur|produce a trace which originates in the winding of the protective film formation film which gives a trace to a protective film.

近年來,正在進行利用被稱作倒裝晶片鍵合的安裝方法製造半導體裝置。該安裝方法中,在安裝具有形成有凸塊(bump)等凸狀電極的電路面的半導體晶片時,使半導體晶片的電路面側翻轉(倒裝(face down))而接合於晶片搭載部。因此,半導體裝置具有未形成電路的半導體晶片的背面側露出的結構。In recent years, semiconductor devices have been manufactured using a mounting method called flip-chip bonding. In this mounting method, when mounting a semiconductor wafer having a circuit surface on which convex electrodes such as bumps are formed, the circuit surface side of the semiconductor wafer is inverted (face down) and bonded to the wafer mounting portion. Therefore, the semiconductor device has a structure in which the back side of the semiconductor wafer on which the circuit is not formed is exposed.

因此,為了保護半導體晶片免受搬運時等的衝擊,多在半導體晶片的背面側形成有由有機材料形成的硬質保護膜。這種保護膜例如在將保護膜形成膜貼附於半導體晶圓的背面後,通過固化而形成或以非固化的狀態形成。Therefore, in order to protect the semiconductor wafer from impact during transportation or the like, a hard protective film made of an organic material is often formed on the back surface side of the semiconductor wafer. Such a protective film is formed by, for example, curing or in a non-cured state after attaching a protective film-forming film to the back surface of a semiconductor wafer.

保護膜形成膜與支撐保護膜形成膜的支撐膜一同構成長條狀的護膜形成用片。在使用保護膜形成膜前,通常將該長條狀片捲繞成片卷。而且,在使用保護膜形成膜時,將從片卷中放卷的長條狀的保護膜形成用片切成與所貼附的半導體晶圓大致相同的形狀,然後貼附於半導體晶圓。The protective film forming film constitutes an elongated protective film forming sheet together with a support film supporting the protective film forming film. The elongated sheet is usually wound into a roll before forming a film using a protective film. Furthermore, when a film is formed using a protective film, the long protective film forming sheet unwound from the roll is cut into substantially the same shape as the attached semiconductor wafer, and then attached to the semiconductor wafer.

專利文獻1公開了一種在黏合劑層的兩面設置有第一片及第二片的長條狀的黏合片。黏合劑層可分為沖孔加工部與連續狀廢料部,沖孔加工部的黏合劑層作為黏合劑膜被貼附於例如半導體晶圓的背面。 [現有技術文獻] [專利文獻] Patent Document 1 discloses an elongated pressure-sensitive adhesive sheet in which a first sheet and a second sheet are provided on both surfaces of the pressure-sensitive adhesive layer. The adhesive layer can be divided into a punching part and a continuous waste part, and the adhesive layer of the punching part is attached to the back surface of the semiconductor wafer as an adhesive film, for example. [Prior Art Literature] [Patent Literature]

專利文獻1:國際公開2017/145735號Patent Document 1: International Publication No. 2017/145735

[本發明要解決的技術問題][Technical problem to be solved by the present invention]

藉由使用芯部固定膠帶將所製造的長條狀的保護膜形成用片固定於芯部,利用捲繞裝置對長條狀的保護膜形成用片邊施加規定的張力邊進行捲繞,由此形成保護膜形成用片卷。其結果,應力殘留於捲繞後的長條狀的保護膜形成用片(保護膜形成用片卷)中,在朝向芯部的方向產生收卷壓力。該收卷壓力具有在靠近芯部的保護膜形成用片、即捲繞開始的保護膜形成用片中較大,在片卷的外周側的保護膜形成用片中較小的傾向。The produced long sheet for forming a protective film is fixed to a core using a core fixing tape, and the long sheet for forming a protective film is wound while applying a predetermined tension by a winding device. This formed the sheet roll for protective film formation. As a result, the stress remains in the long sheet for forming a protective film (roll for forming a protective film) after winding, and a winding pressure is generated in the direction toward the core. This winding pressure tends to be large in the protective film forming sheet near the core, that is, in the protective film forming sheet at the start of winding, and small in the protective film forming sheet on the outer peripheral side of the sheet roll.

此外,由於捲繞時的張力的偏差等,即使在同一保護膜形成用片卷中,也有被強烈擠壓的位置與被輕微擠壓的位置,在捲繞後,長時間被強烈擠壓的位置有時會在保護膜形成用片中形成因捲繞導致的痕跡(卷痕)。特別是,保護膜形成用片捲繞開始的位置的收卷壓力較大,同時捲繞後的寬度方向的各位置彼此易產生收卷壓力的偏差。進一步,由於會產生因芯部固定膠帶及保護膜形成用片的厚度導致的段差,因此起因於該段差的收卷壓力變大,或者在寬度方向易產生收卷壓力的偏差。因此,在捲繞後,與片卷的外周側的保護膜形成用片相比,靠近芯部的保護膜形成用片中更容易產生因被部分強烈擠壓導致的卷痕。若產生這種卷痕,則在構成保護膜形成用片的保護膜形成膜中也會產生卷痕。其結果,在將保護膜形成膜貼附於工件並形成保護膜時,卷痕殘留,會引起保護膜的外觀不良。In addition, due to variations in tension during winding, etc., even in the same sheet roll for forming a protective film, there are places that are strongly squeezed and places that are slightly squeezed, and those that are strongly squeezed for a long time after winding The position may form traces (roll marks) due to winding in the sheet for forming a protective film. In particular, the winding pressure at the position where the winding of the sheet for forming a protective film is started is large, and the variation in winding pressure tends to occur at each position in the width direction after winding. Furthermore, since a level difference occurs due to the thickness of the core fixing tape and the sheet for forming a protective film, the winding pressure caused by the level difference increases, or the variation of the winding pressure in the width direction tends to occur. Therefore, after winding, the sheet for forming a protective film close to the core portion is more likely to generate a roll mark due to being partially strongly pressed than the sheet for forming a protective film on the outer peripheral side of the sheet roll. When such curl marks are generated, curl marks also occur in the protective film forming film constituting the sheet for forming a protective film. As a result, when a protective film forming film is attached to a workpiece and a protective film is formed, curl marks remain and the appearance of the protective film is defective.

然而,存在即使在形成片卷時調整捲繞裝置的設定條件,也難以完全抑制伴隨上述收卷壓力的偏差等的卷痕的問題。However, even if the setting conditions of the winding device are adjusted at the time of forming the sheet roll, it is difficult to completely suppress the curling marks caused by the above-described variation in the winding pressure and the like.

本發明鑒於上述實際情況而成,其目的在於提供一種不易產生痕跡的保護膜形成用片卷的製造方法,該痕跡起因於會給保護膜帶來痕跡的保護膜形成膜的捲繞。 [解決技術問題的技術手段] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for producing a sheet roll for forming a protective film that is less likely to produce traces due to winding of the protective film forming film that gives traces to the protective film. [Technical means to solve technical problems]

本發明的方案如下所述。 [1] 一種保護膜形成用片卷的製造方法,其具有:將捲繞具有保護膜形成膜、設置在保護膜形成膜的一個面上的第一剝離膜、及設置在保護膜形成膜的另一個面上的第二剝離膜的長條片而形成的片卷,自形成片卷後起60天之中,於10℃以下的保管溫度保管25天以上的步驟, 將從保護膜形成膜上剝離第一剝離膜的剝離力設為F1,將從保護膜形成膜上剝離第二剝離膜的剝離力設為F2時,滿足F1>F2的關係, 將10℃下的保護膜形成膜的損耗角正切設為tanδ 10時,tanδ 10為1.2以下。 The aspects of the present invention are as follows. [1] A method for producing a sheet roll for forming a protective film, comprising: winding a protective film forming film, a first release film provided on one surface of the protective film forming film, and a The sheet roll formed from the long piece of the second peeling film on the other side is stored at a storage temperature of 10°C or lower for 25 days or more within 60 days after the sheet roll is formed, and a film will be formed from the protective film When the peeling force for peeling the first peeling film from the top is F1, and the peeling force for peeling the second peeling film from the protective film forming film is F2, the relationship of F1>F2 is satisfied, and the protective film forming film at 10° C. When the loss tangent is tanδ 10 , tanδ 10 is 1.2 or less.

[2]根據[1]所述的保護膜形成用片卷的製造方法,其中,在形成片卷後10天之內開始進行於10℃以下的保管溫度進行保管的步驟。[2] The method for producing a sheet roll for forming a protective film according to [1], wherein the step of storing at a storage temperature of 10° C. or lower is started within 10 days after the sheet roll is formed.

[3]根據[1]或[2]所述的保護膜形成用片卷的製造方法,其中,保管溫度為-10℃以上。[3] The manufacturing method of the sheet roll for protective film formation as described in [1] or [2] whose storage temperature is -10 degreeC or more.

[4]根據[1]~[3]中任一項所述的保護膜形成用片卷的製造方法,其中,在第一剝離膜和/或第二剝離膜中,未與保護膜形成膜相接的面經過了剝離處理。[4] The method for producing a sheet roll for forming a protective film according to any one of [1] to [3], wherein the first release film and/or the second release film is not formed into a film with the protective film The adjoining surfaces are peeled off.

[5]根據[1]~[4]中任一項所述的保護膜形成用片卷的製造方法,其中,tanδ 10為0.04以上。 [發明效果] [5] The method for producing a sheet roll for forming a protective film according to any one of [1] to [4], wherein tan δ 10 is 0.04 or more. [Inventive effect]

根據本發明,可提供一種不易產生痕跡的保護膜形成用片卷的製造方法,該痕跡起因於會給保護膜帶來痕跡的保護膜形成膜的捲繞。ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the sheet roll for protective film formation which does not easily generate|occur|produce the trace which originates in the winding of the protective film formation film which gives a trace to a protective film can be provided.

以下,基於具體的實施方案,使用圖式對本發明進行詳細說明。Hereinafter, based on a specific embodiment, this invention is demonstrated in detail using drawing.

首先,對本說明書中使用的主要術語進行說明。First, the main terms used in this specification are explained.

工件為貼附保護膜形成膜並待加工的板狀體。作為工件,例如可列舉出晶圓、面板。具體而言,可列舉出半導體晶圓、半導體面板。作為工件的加工物,例如可列舉出將晶圓單顆化(singulation)而得到的晶片。具體而言,可例示出將半導體晶圓單顆化而得到的半導體晶片。此時,保護膜形成於晶圓的背面側。The workpiece is a plate-shaped body to be processed by attaching a protective film to form a film. Examples of the workpiece include wafers and panels. Specifically, a semiconductor wafer and a semiconductor panel are mentioned. As a workpiece of a workpiece, for example, a wafer obtained by singulating a wafer can be mentioned. Specifically, a semiconductor wafer obtained by singulating a semiconductor wafer can be exemplified. At this time, the protective film is formed on the back side of the wafer.

工件的「表面」是指形成有電路、凸塊等凸狀電極等的面,「背面」是指未形成電路等的面。The "surface" of the workpiece refers to a surface on which bump electrodes such as circuits and bumps are formed, and the "rear surface" refers to a surface on which circuits and the like are not formed.

本說明書中,例如「(甲基)丙烯酸酯」用作表示「丙烯酸酯」及「甲基丙烯酸酯」這兩者的術語,其它類似術語也相同。In this specification, for example, "(meth)acrylate" is used as a term representing both "acrylate" and "methacrylate", and other similar terms are also the same.

在本說明書中,構成各組合物的成分的重量比以固體成分比表示。In this specification, the weight ratio of the components constituting each composition is represented by the solid content ratio.

(1.保護膜形成用片卷) (1.1保護膜形成用片卷的形態) 圖1A示出了利用本實施方案的製造方法製造的保護膜形成用片卷的一個實例。圖1A中,保護膜形成用片卷100為將用於形成保護膜的長條片1捲繞而成的卷。 (1. Sheet roll for protective film formation) (1.1 Form of sheet roll for forming protective film) An example of the sheet roll for protective film formation manufactured by the manufacturing method of this embodiment is shown to FIG. 1A. In FIG. 1A , the sheet roll 100 for forming a protective film is a roll formed by winding the long sheet 1 for forming a protective film.

(1.2保護膜形成用片) 首先,對長條片進行說明。作為長條片的保護膜形成用片1用於將保護膜形成膜貼附於工件。如圖2所示,保護膜形成用片1具有在保護膜形成膜10的一個主面10a上配置有第一剝離膜20、在另一個主面10b上配置有第二剝離膜30的構成。下文中長條片1有時也被稱為保護膜形成用片1。 (1.2 Sheet for forming protective film) First, the long strip will be described. The sheet 1 for protective film formation which is a long sheet is used for attaching a protective film forming film to a workpiece. As shown in FIG. 2, the sheet 1 for protective film formation has the structure which arrange|positioned the 1st release film 20 on one main surface 10a of the protective film formation film 10, and arrange|positioned the 2nd release film 30 in the other main surface 10b. Hereinafter, the long sheet 1 may also be referred to as the sheet 1 for forming a protective film.

將保護膜形成用片1捲繞成卷後,在使用前,對其進行保管。保管時,保護膜形成膜由形成於兩個主面上的第一剝離膜及第二剝離膜支撐。After the sheet 1 for forming a protective film is wound into a roll, it is stored before use. During storage, the protective film forming film is supported by the first release film and the second release film formed on both main surfaces.

使用時,從保護膜形成用片卷中將保護膜形成用片放卷,並將保護膜形成膜裁切成規定的形狀。剝離第二剝離膜後,將保護膜形成膜貼附於工件的背面,並在第一剝離膜的剝離後進行保護膜化。保護膜保護工件或工件的加工物。In use, the sheet for forming a protective film is unwound from the roll for forming a protective film, and the protective film forming film is cut into a predetermined shape. After peeling off the second peeling film, a protective film forming film is attached to the back surface of the workpiece, and after peeling of the first peeling film, the protective film is turned into a protective film. The protective film protects the workpiece or the work of the workpiece.

以下,對構成保護膜形成用片的保護膜形成膜、第一剝離膜及第二剝離膜進行說明。Hereinafter, the protective film forming film, the first peeling film, and the second peeling film constituting the sheet for forming a protective film will be described.

(1.3保護膜形成膜) 如上所述,將保護膜形成膜在貼附於工件後保護膜化,形成用於保護工件或工件的加工物的保護膜。 (1.3 Protective film forming film) As described above, the protective film-forming film is formed into a protective film after being attached to the workpiece, and a protective film for protecting the workpiece or the workpiece of the workpiece is formed.

「保護膜化」是指使保護膜形成膜成為具有用以保護工件或工件的加工物的充分的特性的狀態。具體而言,保護膜形成膜為固化性時,「保護膜化」是指將未固化的保護膜形成膜製成固化物。換言之,經保護膜化的保護膜形成膜為保護膜形成膜的固化物,其與保護膜形成膜不同。"Protective film formation" refers to a state in which a protective film forming film has sufficient characteristics to protect a workpiece or a workpiece of the workpiece. Specifically, when the protective film-forming film is curable, "protective film-forming" means that the uncured protective film-forming film is made into a cured product. In other words, the protective film-forming film formed into a protective film is a cured product of the protective film-forming film, which is different from the protective film-forming film.

在固化性保護膜形成膜上疊合工件後,藉由使保護膜形成膜固化,可將保護膜牢固地黏合於工件,可形成具有耐久性的保護膜。After stacking the workpiece on the curable protective film forming film, by curing the protective film forming film, the protective film can be firmly adhered to the workpiece, and a durable protective film can be formed.

另一方面,保護膜形成膜不含固化性成分並以非固化的狀態使用時,在保護膜形成膜貼附於工件的時刻,該保護膜形成膜被保護膜化。換言之,經保護膜化的保護膜形成膜與保護膜形成膜相同。On the other hand, when the protective film forming film does not contain a curable component and is used in an uncured state, the protective film forming film is converted into a protective film when the protective film forming film is attached to the workpiece. In other words, the protective film-forming film formed into a protective film is the same as the protective film-forming film.

不謀求較高的保護性能時,由於無需使保護膜形成膜固化,因此容易使用保護膜形成膜。When high protective performance is not required, since it is not necessary to harden the protective film forming film, it is easy to use the protective film forming film.

本實施方案中,優選保護膜形成膜為固化性。因此,優選保護膜為固化物。作為固化物,例如,可例示出熱固化物、能量射線固化物。本實施方案中,更優選保護膜為熱固化物。In this embodiment, the protective film forming film is preferably curable. Therefore, the protective film is preferably a cured product. As a hardened|cured material, a thermosetting material and an energy ray hardened|cured material can be illustrated, for example. In this embodiment, it is more preferable that the protective film is a thermosetting product.

此外,優選保護膜形成膜在常溫(23℃)下具有黏著性,或者藉由加熱而發揮黏著性。由此,可在保護膜形成膜上疊合工件時將兩者貼合。因此,可在使保護膜形成膜固化前確切地進行定位。Moreover, it is preferable that a protective film-forming film has adhesiveness at normal temperature (23 degreeC), or it exhibits adhesiveness by heating. Thereby, both can be bonded together when stacking a workpiece on the protective film forming film. Therefore, positioning can be accurately performed before curing the protective film-forming film.

保護膜形成膜可以由一層(單層)構成,也可以由兩層以上的多個層構成。保護膜形成膜具有多個層時,這些多個層可以彼此相同也可以不同,構成這些多個層的層的組合沒有特別限制。The protective film forming film may be composed of one layer (single layer), or may be composed of a plurality of layers of two or more layers. When the protective film forming film has a plurality of layers, the plurality of layers may be the same or different from each other, and the combination of the layers constituting the plurality of layers is not particularly limited.

本實施方案中,優選保護膜形成膜為一層(單層)。一層的保護膜形成膜可在厚度上得到較高的精度,因此易於生產。此外,若保護膜形成膜由多個層構成,則需要考慮層間的密合性及各個層的伸縮性,存在由此導致的發生從被黏物上剝離的風險。保護膜形成膜為一層時,可降低上述風險,設計的自由度也得以提高。In the present embodiment, the protective film forming film is preferably one layer (single layer). The one-layer protective film-forming film can obtain high precision in thickness and is therefore easy to produce. In addition, when the protective film forming film is composed of a plurality of layers, the adhesion between layers and the stretchability of each layer need to be considered, and there is a risk of peeling from the adherend due to this. When the protective film forming film is one layer, the above-mentioned risk can be reduced, and the degree of freedom of design can be improved.

保護膜形成膜的厚度沒有特別限制,但優選為小於100μm、70μm以下、45μm以下、30μm以下。藉由使保護膜形成膜的厚度的上限值為上述值,可減小因捲繞開始的位置的保護膜形成用片的厚度導致的段差。The thickness of the protective film forming film is not particularly limited, but is preferably less than 100 μm, 70 μm or less, 45 μm or less, or 30 μm or less. By setting the upper limit of the thickness of the protective film forming film to the above-mentioned value, the level difference due to the thickness of the protective film forming sheet at the position where the winding starts can be reduced.

此外,保護膜形成膜的厚度優選為5μm以上、10μm以上、15μm以上。藉由使保護膜形成膜的厚度的下限值為上述值,作為保護膜,容易獲得保護工件的性能,進一步,在保護膜形成用片卷中,保護膜形成膜起到緩和應力的作用,可以進一步縮短開始出現卷痕的距芯部的長度。Further, the thickness of the protective film forming film is preferably 5 μm or more, 10 μm or more, and 15 μm or more. By setting the lower limit of the thickness of the protective film forming film to the above-mentioned value, it is easy to obtain the performance of protecting the workpiece as the protective film, and further, in the protective film forming sheet roll, the protective film forming film plays a role of relaxing stress, It is possible to further shorten the length from the core at which the curl marks start to appear.

另外,保護膜形成膜的厚度是指保護膜形成膜整體的厚度。例如,由多個層構成的保護膜形成膜的厚度是指構成保護膜形成膜的所有層的合計厚度。In addition, the thickness of a protective film forming film means the thickness of the whole protective film forming film. For example, the thickness of the protective film forming film composed of a plurality of layers refers to the total thickness of all the layers forming the protective film forming film.

(1.3.1 10℃下的保護膜形成膜的損耗角正切) 本實施方案中,10℃下的保護膜形成膜的損耗角正切(tanδ 10)為1.2以下。損耗角正切被定義為「損耗模數/儲能模數」,為利用動態黏彈性測定裝置、根據對施加於對象物的應力的應答而測定的值。藉由使保護膜形成膜的損耗角正切在10℃下在上述範圍內,構成保護膜形成膜的成分變得略有彈性,保護膜形成膜不易變形,因此具有即使在片卷的收卷壓力高的情況下也不易出現卷痕的傾向。因此,本實施方案對10℃下的保護膜形成膜的損耗角正切進行控制。 (1.3.1 Loss tangent of protective film forming film at 10°C) In the present embodiment, the loss tangent (tanδ 10 ) of the protective film forming film at 10°C is 1.2 or less. The loss tangent is defined as "loss modulus/storage modulus", and is a value measured by a dynamic viscoelasticity measuring device in response to a stress applied to an object. By making the loss tangent of the protective film-forming film within the above-mentioned range at 10°C, the components constituting the protective film-forming film become slightly elastic, and the protective film-forming film is not easily deformed, so it has a winding pressure even in the sheet roll. In the case of high, the tendency of curl marks is not easy to appear. Therefore, the present embodiment controls the loss tangent of the protective film forming film at 10°C.

10℃下的保護膜形成膜的損耗角正切(tanδ 10)優選為1.0以下,更優選為0.9以下,進一步優選為0.8以下。此外,10℃下的保護膜形成膜的損耗角正切(tanδ 10)優選為0.04以上,更優選為0.1以上,進一步優選為0.2以上,特別優選為0.3以上。藉由使10℃下的保護膜形成膜的損耗角正切的下限值為上述值,可防止片卷中彎曲的保護膜形成膜在10℃下開裂的現象。 The loss tangent (tanδ 10 ) of the protective film forming film at 10° C. is preferably 1.0 or less, more preferably 0.9 or less, and still more preferably 0.8 or less. Further, the loss tangent (tanδ 10 ) of the protective film forming film at 10° C. is preferably 0.04 or more, more preferably 0.1 or more, still more preferably 0.2 or more, and particularly preferably 0.3 or more. By setting the lower limit of the loss tangent of the protective film forming film at 10°C to the above-mentioned value, the phenomenon that the protective film forming film bent in the sheet roll cracks at 10°C can be prevented.

10℃下的保護膜形成膜的損耗角正切(tanδ 10)利用公知的方法測定即可。例如,可將保護膜形成膜製成規定大小的試樣,利用動態黏彈性測定裝置,在規定的溫度範圍下,以規定的頻率對試樣施加應變,測定彈性模數,並根據所測定的彈性模數計算出10℃下的損耗角正切(tanδ 10)。具體的測定方法會在後述實施例中進行詳細說明。 The loss tangent (tanδ 10 ) of the protective film forming film at 10° C. may be measured by a known method. For example, the protective film-forming film can be made into a sample of a predetermined size, and a dynamic viscoelasticity measuring device can be used to apply strain to the sample at a predetermined frequency in a predetermined temperature range, and measure the elastic modulus. The elastic modulus calculates the loss tangent (tan δ 10 ) at 10°C. The specific measurement method will be described in detail in the following Examples.

(1.4第一剝離膜) 第一剝離膜為能夠以可剝離的方式支撐保護膜形成膜的膜。本實施方案中,優選在將保護膜形成膜貼附於工件後從保護膜形成膜上剝離第一剝離膜。 (1.4 First release film) The first release film is a film capable of peelably supporting the protective film-forming film. In the present embodiment, the first release film is preferably peeled off from the protective film forming film after the protective film forming film is attached to the workpiece.

第二剝離膜可以由一層(單層)或兩層以上的基材構成,從控制剝離性的角度出發,基材的表面可經過剝離處理。即,基材的表面可經過改質,也可以在基材的表面形成不是源自基材的材料。The second release film may be composed of one layer (single layer) or two or more layers of base material, and the surface of the base material may be subjected to a release treatment from the viewpoint of controlling the releasability. That is, the surface of the base material may be modified, or a material not derived from the base material may be formed on the surface of the base material.

第一剝離膜的厚度沒有特別限制,但優選為30μm以上100μm以下。此外,第一剝離膜的厚度更優選為40μm以上,進一步優選為45μm以上。此外,第一剝離膜的厚度更優選為80μm以下,進一步優選為70μm以下。The thickness of the first release film is not particularly limited, but is preferably 30 μm or more and 100 μm or less. Moreover, it is more preferable that the thickness of a 1st peeling film is 40 micrometers or more, and it is still more preferable that it is 45 micrometers or more. Moreover, as for the thickness of a 1st peeling film, it is more preferable that it is 80 micrometers or less, and it is still more preferable that it is 70 micrometers or less.

藉由使第一剝離膜的厚度的下限值為上述值,使用後述的切割刀片形成到達至第一剝離膜的一部分的切口時,可防止切割刀片貫穿第一剝離膜而將第一剝離膜切斷。進一步,在保護膜形成用片卷中,第一剝離膜起到緩和應力的作用,可以進一步縮短開始出現卷痕的距芯部的長度。By making the lower limit of the thickness of the first release film the above-mentioned value, when a notch reaching a part of the first release film is formed using a dicing blade described later, the dicing blade can be prevented from penetrating the first release film and cutting the first release film. cut off. Furthermore, in the sheet roll for protective film formation, the 1st peeling film plays the role of stress relaxation, and can further shorten the length from the core part at which a roll mark starts to appear.

此外,在保護膜形成用片被放卷且保護膜形成膜被切出並被搬運至下一道步驟之前,保護膜形成用片會通過裝置內的導輥等輥,此時,藉由使第一剝離膜的厚度的上限值為上述值,能夠防止保護膜形成膜從第一剝離膜上剝離。進而,可減小因捲繞開始的位置的保護膜形成用片的厚度導致的段差。In addition, before the sheet for forming a protective film is unwound and the protective film forming film is cut out and conveyed to the next step, the sheet for forming a protective film passes through rollers such as guide rollers in the apparatus. At this time, by making the first The upper limit of the thickness of the first release film can be prevented from being peeled off from the first release film. Furthermore, the level difference due to the thickness of the sheet for forming a protective film at the position where the winding starts can be reduced.

另外,第一剝離膜的厚度是指第一剝離膜整體的厚度。例如,由多個層構成的第一剝離膜的厚度是指構成第一剝離膜的所有層的合計厚度。In addition, the thickness of a 1st peeling film means the thickness of the whole 1st peeling film. For example, the thickness of the 1st release film which consists of several layers means the total thickness of all the layers which comprise a 1st release film.

本實施方案中,優選第一剝離膜具有基材與第一剝離劑層。藉由具有第一剝離劑層,容易控制第一剝離膜中形成有第一剝離劑層的面的物性。In this embodiment, it is preferable that the 1st release film has a base material and a 1st release agent layer. By having the first release agent layer, it becomes easy to control the physical properties of the surface on which the first release agent layer is formed in the first release film.

此外,本實施方案中,在保護膜形成用片中,將從保護膜形成膜上剝離第一剝離膜的剝離力設為F1,將後述從保護膜形成膜上剝離第二剝離膜的剝離力設為F2時,F1與F2滿足F1>F2的關係。藉由滿足這種關係,從保護膜形成用片中去除第二剝離膜時,應殘留的保護膜形成膜10不會與第二剝離膜一同被去除,容易將保護膜形成膜10殘留於第一剝離膜上。In addition, in this embodiment, in the sheet for protective film forming, the peeling force for peeling the first release film from the protective film forming film is set to F1, and the peeling force for peeling the second peeling film from the protective film forming film described later is used. When set to F2, F1 and F2 satisfy the relationship of F1>F2. By satisfying this relationship, when the second peeling film is removed from the sheet for forming a protective film, the protective film forming film 10 that should remain is not removed together with the second peeling film, and the protective film forming film 10 is easily left on the first peeling film. a release film.

因此,第一剝離膜為重剝離膜,第二剝離膜為輕剝離膜。Therefore, the first release film is a heavy release film, and the second release film is a light release film.

本實施方案中,F1及F2為使用拉伸試驗機而測定的荷重值。具體的測定方法會在後述實施例中進行詳細說明。In the present embodiment, F1 and F2 are load values measured using a tensile tester. The specific measurement method will be described in detail in the following Examples.

(1.4.1基材) 第一剝離膜的基材只要為在保護膜形成膜貼附於工件之前能夠支撐保護膜形成膜的材料,則沒有特別限定,通常由以樹脂類的材料為主要材料的膜(以下稱為「樹脂膜」)構成。 (1.4.1 Substrate) The base material of the first release film is not particularly limited as long as it is a material that can support the protective film forming film before the protective film forming film is attached to the workpiece. resin film”).

作為樹脂膜的具體實例,可使用聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二醇酯膜、聚萘二甲酸乙二醇酯膜、聚對苯二甲酸丁二醇酯膜、聚氨酯膜、乙烯乙酸乙烯酯共聚物膜、離聚物樹脂膜、乙烯-(甲基)丙烯酸共聚物膜、乙烯-(甲基)丙烯酸酯共聚物膜、聚苯乙烯膜、聚碳酸酯膜、聚醯亞胺膜、氟樹脂膜等。此外,還可以使用這些膜的交聯膜。進一步也可以為這些膜的層疊膜。本實施方案中,從環境安全性、成本等角度、以及抑制伴隨基材的延伸而卷緊的角度出發,優選聚對苯二甲酸乙二醇酯膜。As specific examples of the resin film, polyethylene films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyterephthalene films can be used Ethylene formate film, polyethylene naphthalate film, polybutylene terephthalate film, polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene-(methyl) ) acrylic copolymer film, ethylene-(meth)acrylate copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film, etc. In addition, cross-linked films of these films can also be used. Furthermore, it may be a laminated film of these films. In the present embodiment, a polyethylene terephthalate film is preferable from the viewpoints of environmental safety, cost, and the like, and from the viewpoint of suppressing winding up accompanying the extension of the base material.

對於基材,可以在上述樹脂膜中含有著色劑、阻燃劑、增塑劑、抗靜電劑、潤滑劑、填料等各種添加劑。The base material may contain various additives such as colorants, flame retardants, plasticizers, antistatic agents, lubricants, and fillers in the resin film.

對於基材的厚度,能夠於使用保護膜形成用片的各步驟中適當發揮功能且在上述第一剝離膜的厚度的範圍內,沒有特別限定。基材的厚度優選為30μm以上100μm以下。此外,基材的厚度更優選為40μm以上,進一步優選為45μm以上。此外,基材的厚度更優選為80μm以下,進一步優選為70μm以下。The thickness of the base material is not particularly limited within the range of the thickness of the first release film that can function appropriately in each step of using the sheet for forming a protective film. The thickness of the base material is preferably 30 μm or more and 100 μm or less. Further, the thickness of the base material is more preferably 40 μm or more, and further preferably 45 μm or more. In addition, the thickness of the base material is more preferably 80 μm or less, and further preferably 70 μm or less.

(1.4.2第一剝離劑層) 第一剝離劑層賦予第一剝離膜從保護膜形成膜上剝離的剝離性。第一剝離劑層只要由可賦予剝離性的材料構成,則沒有特別限制。本實施方案中,第一剝離劑層可由將包含脫模劑的第一剝離劑層用組合物固化而得到。 (1.4.2 The first release agent layer) The first release agent layer imparts releasability to the first release film from the protective film-forming film. The first release agent layer is not particularly limited as long as it is composed of a material that can impart releasability. In this embodiment, a 1st release agent layer can be obtained by hardening the composition for 1st release agent layers containing a mold release agent.

第一剝離膜中,優選在基材的表面直接形成第一剝離劑層。藉由在基材的表面直接形成第一剝離劑層,第一剝離膜的生產變得容易,因此可實現降低成本。In the first release film, it is preferable to form the first release agent layer directly on the surface of the base material. By directly forming the first release agent layer on the surface of the base material, the production of the first release film becomes easy, so that cost reduction can be achieved.

第一剝離劑層的厚度沒有特別限制,但優選為30nm以上200nm以下。此外,第一剝離劑層的厚度更優選為50nm以上,進一步優選為80nm以上。此外,第一剝離劑層的厚度更優選為180nm以下。The thickness of the first release agent layer is not particularly limited, but is preferably 30 nm or more and 200 nm or less. In addition, the thickness of the first release agent layer is more preferably 50 nm or more, and further preferably 80 nm or more. Further, the thickness of the first release agent layer is more preferably 180 nm or less.

藉由使第一剝離劑層的厚度在上述範圍內,將保護膜形成膜貼附於工件時,可發揮穩定的剝離性能。By making the thickness of a 1st release agent layer into the said range, when sticking a protective film forming film to a workpiece|work, stable release performance can be exhibited.

此外,本實施方案中,優選除了在第一剝離膜的保護膜形成膜側的面上形成第一剝離劑層以外,在其相反側的面上也形成第一剝離劑層。即,如圖3所示,保護膜形成用片1中,第一剝離膜20具有基材21、與形成於基材21的兩個主面上的第一剝離劑層22、23。第一剝離膜的主面20b(第一剝離劑層22的主面20b)與保護膜形成膜的主面10a相接。第一剝離劑層22與第一剝離劑層23可以由相同的組合物構成,也可以由不同的組合物構成。Moreover, in this embodiment, it is preferable to form a 1st release agent layer on the surface of the opposite side in addition to forming a 1st release agent layer on the surface of the protective film formation film side of a 1st release film. That is, as shown in FIG. 3 , in the sheet 1 for forming a protective film, the first release film 20 has a base material 21 and first release agent layers 22 and 23 formed on both main surfaces of the base material 21 . The main surface 20b of the first release film (the main surface 20b of the first release agent layer 22) is in contact with the main surface 10a of the protective film forming film. The first release agent layer 22 and the first release agent layer 23 may be composed of the same composition or may be composed of different compositions.

片卷中,由於長條片1沿半徑方向層疊,因此第一剝離膜20的未與保護膜形成膜10相接的面20a和第二剝離膜30的未與保護膜形成膜10相接的面30b相接。因此,第一剝離膜20中,藉由使未與保護膜形成膜10相接的面20a經過剝離處理(藉由形成第一剝離劑層23),接觸的長條片彼此容易滑動,因此可促進後述的收卷壓力的穩定化。In the sheet roll, since the long sheets 1 are stacked in the radial direction, the surface 20a of the first release film 20 not in contact with the protective film forming film 10 and the surface 20a of the second release film 30 not in contact with the protective film forming film 10 The faces 30b are in contact with each other. Therefore, in the first release film 20, by subjecting the surface 20a that is not in contact with the protective film forming film 10 to a release treatment (by forming the first release agent layer 23), the long pieces in contact with each other are easily slid, so that it is possible to Stabilization of the winding pressure described later is promoted.

(1.5第二剝離膜) 第二剝離膜為能夠以可剝離方式支撐保護膜形成膜的膜。本實施方案中,優選在將保護膜形成膜貼附於工件之前將第二剝離膜從保護膜形成膜上剝離。 (1.5 Second release film) The second release film is a film capable of peelably supporting the protective film-forming film. In the present embodiment, it is preferable to peel the second release film from the protective film forming film before attaching the protective film forming film to the workpiece.

與第一剝離膜相同,第二剝離膜可以由一層(單層)或兩層以上的基材構成,從控制剝離性的角度出發,基材的表面可經過剝離處理。即,基材的表面可經過改質,也可以在基材的表面形成不是源自基材的材料。Like the first release film, the second release film may be composed of one layer (single layer) or two or more layers of substrates, and the surface of the substrate may be subjected to release treatment from the viewpoint of controlling the releasability. That is, the surface of the base material may be modified, or a material not derived from the base material may be formed on the surface of the base material.

第二剝離膜的厚度沒有特別限制,但優選為10μm以上75μm以下。此外,第二剝離膜的厚度更優選為18μm以上,進一步優選為24μm以上。此外,第二剝離膜的厚度更優選為60μm以下,進一步優選為45μm以下。從使剝離力F2與剝離力F1為上述的F1>F2的角度出發,第二剝離膜的厚度優選為第一剝離膜的厚度以下,更優選為小於第一剝離膜的厚度。The thickness of the second release film is not particularly limited, but is preferably 10 μm or more and 75 μm or less. Moreover, as for the thickness of a 2nd peeling film, 18 micrometers or more are more preferable, and 24 micrometers or more are still more preferable. Moreover, as for the thickness of a 2nd peeling film, it is more preferable that it is 60 micrometers or less, and it is still more preferable that it is 45 micrometers or less. The thickness of the second release film is preferably less than or equal to the thickness of the first release film, and more preferably smaller than the thickness of the first release film, from the viewpoint of making the peeling force F2 and the peeling force F1 to satisfy the above-mentioned F1>F2.

另外,第二剝離膜的厚度是指第二剝離膜整體的厚度。例如,由多個層構成的第二剝離膜的厚度是指構成第二剝離膜的所有層的合計厚度。In addition, the thickness of a 2nd peeling film means the thickness of the whole 2nd peeling film. For example, the thickness of the 2nd peeling film which consists of several layers means the total thickness of all the layers which comprise a 2nd peeling film.

本實施方案中,優選第二剝離膜具有基材與第二剝離劑層。藉由具有第二剝離劑層,容易控制第二剝離膜中形成有第二剝離劑層的面的物性。In this embodiment, it is preferable that the second release film has a base material and a second release agent layer. By having the second release agent layer, it becomes easy to control the physical properties of the surface on which the second release agent layer is formed in the second release film.

(1.5.1基材) 第二剝離膜的基材可從作為第一剝離膜的基材而例示的材料中適當選擇。 (1.5.1 Substrate) The base material of the second release film can be appropriately selected from the materials exemplified as the base material of the first release film.

(1.5.2第二剝離劑層) 第二剝離膜具有第二剝離劑層時,第二剝離劑層只要由可賦予剝離性的材料構成,則沒有特別限制。例如,與第一剝離劑層相同,第二剝離劑層可藉由將包含矽氧(silicone)類脫模劑的第二剝離劑層用組合物固化而得到。 (1.5.2 Second release agent layer) When the second release film has a second release agent layer, the second release agent layer is not particularly limited as long as the second release agent layer is made of a material capable of imparting releasability. For example, like a 1st release agent layer, a 2nd release agent layer can be obtained by hardening the composition for 2nd release agent layers containing a silicon-oxygen (silicone) type mold release agent.

與第一剝離膜相同,第二剝離膜中,優選在基材的表面上直接形成第二剝離劑層。藉由在基材的表面上直接形成第二剝離劑層,第二剝離膜的生產變得容易,因此可實現降低成本。Like the first release film, in the second release film, it is preferable to form the second release agent layer directly on the surface of the base material. By forming the second release agent layer directly on the surface of the base material, production of the second release film becomes easy, and thus cost reduction can be achieved.

此外,本實施方案中,第二剝離劑層形成於第二剝離膜的保護膜形成膜側的面。即,如圖3所示,保護膜形成用片1中,第二剝離膜30具有基材31、與形成於基材31的保護膜形成膜側的面上的第二剝離劑層32。第二剝離膜30的主面30a(第二剝離劑層32的主面30a)與保護膜形成膜10的主面10b相接。此外,除了在第二剝離膜30的保護膜形成膜側的面上形成第二剝離劑層以外,也可以在其相反側的面30b上形成第二剝離劑層。Moreover, in this embodiment, the 2nd release agent layer is formed in the surface of the protective film formation film side of a 2nd release film. That is, as shown in FIG. 3, in the sheet 1 for protective film formation, the 2nd release film 30 has the base material 31, and the 2nd release agent layer 32 formed on the surface of the base material 31 on the protective film formation film side. The main surface 30 a of the second release film 30 (the main surface 30 a of the second release agent layer 32 ) is in contact with the main surface 10 b of the protective film forming film 10 . Moreover, in addition to forming a 2nd release agent layer on the surface 30b of the protective film formation film side of the 2nd release film 30, you may form a 2nd release agent layer on the surface 30b of the opposite side.

此外,在基材的兩個主面上形成第二剝離劑層時,可以將後述包含第二剝離劑層用組合物的塗佈劑塗佈在基材的兩個主面上而形成第二剝離劑層,也可以將包含第二剝離劑層用組合物的塗佈劑塗佈在基材的一個主面後,將基材捲繞而製成卷,利用第二剝離劑層用組合物的成分從塗佈有塗佈劑的主面轉移至未塗佈塗佈劑的主面的現象(轉移現象),在未塗佈塗佈劑的主面上形成第二剝離劑層。In addition, when forming the second release agent layer on both main surfaces of the base material, the second release agent layer can be formed by applying a coating agent containing a composition for a second release agent layer described later on both main surfaces of the base material. For the release agent layer, after applying the coating agent containing the composition for the second release agent layer to one main surface of the base material, the base material may be wound to form a roll, and the composition for the second release agent layer may be used. The phenomenon (transfer phenomenon) in which the components of the coating agent are transferred from the main surface on which the coating agent is applied to the main surface on which the coating agent is not applied (transfer phenomenon), and a second release agent layer is formed on the main surface on which the coating agent is not applied.

(2.保護膜形成用片卷的製造方法) 在本實施方案的保護膜形成用片卷的製造方法中,首先,將上述具有保護膜形成膜、第一剝離膜及第二剝離膜的保護膜形成用片製造成長邊方向的長度遠遠長於短邊方向的長度的長條片。該長條片利用公知的方法製造即可,具體的方法如後文所述。 (2. Manufacturing method of the sheet roll for protective film formation) In the manufacturing method of the sheet roll for protective film formation of this embodiment, first, the length in the longitudinal direction of the sheet for protective film formation having the above-mentioned protective film formation film, the first release film, and the second release film is manufactured to be much longer than A long piece of length in the short side direction. The long sheet may be produced by a known method, and the specific method will be described later.

然後一邊根據欲貼附保護膜形成膜的工件的尺寸裁剪長條片的寬度方向的兩側以調整寬度方向的尺寸,一邊利用捲繞裝置施加規定的張力而進行捲繞,由此製成保護膜形成用片卷。Then, while cutting both sides in the width direction of the long sheet according to the size of the workpiece to which the protective film forming film is to be attached to adjust the size in the width direction, a predetermined tension is applied by a winding device to wind up, thereby producing a protective film. Sheet rolls for film formation.

另外,工件的寬度為150mm時,優選裁剪後的寬度方向的長度在155~194mm的範圍內,工件的寬度為200mm時,優選裁剪後的寬度方向的長度在205~250mm的範圍內,工件的寬度為300mm時,優選裁剪後的寬度方向的長度在305~350mm的範圍內,工件的寬度為450mm時,優選裁剪後的寬度方向的長度在455~500mm的範圍內。In addition, when the width of the workpiece is 150 mm, the length in the width direction after cutting is preferably in the range of 155 to 194 mm, and when the width of the workpiece is 200 mm, the length in the width direction after cutting is preferably in the range of 205 to 250 mm. When the width is 300 mm, the length in the width direction after cutting is preferably in the range of 305 to 350 mm, and when the width of the workpiece is 450 mm, the length in the width direction after cutting is preferably in the range of 455 to 500 mm.

如圖1B所示,長條片1經由芯部固定膠帶等固定工具80被固定於芯部70,然後利用捲繞裝置邊對長條片1施加規定的張力,邊將長條片1捲繞在芯部70上,由此形成上述片卷100。如上所述,在完成捲繞的片卷中,產生了收卷壓力的偏差,特別是在靠近芯部的長條片中被強烈擠壓的位置易形成會給保護膜帶來痕跡的保護膜形成膜的卷痕。As shown in FIG. 1B , the long sheet 1 is fixed to the core 70 via a fixing tool 80 such as a core fixing tape, and then the long sheet 1 is wound by applying a predetermined tension to the long sheet 1 by the winding device. On the core portion 70, the above-described sheet roll 100 is thus formed. As described above, in the finished sheet roll, there is a variation in the winding pressure, and especially in the long sheet close to the core, the position where the sheet is strongly squeezed tends to form a protective film that gives traces to the protective film Roll marks of the film are formed.

另一方面,推測在形成片卷後、即完成捲繞後,隨著時間的推移,收卷壓力高的位置的收卷壓力逐漸變低,並接近收卷壓力低的位置的收卷壓力。換言之,推測收卷壓力的偏差會伴隨時間的推移而消除,片卷中的收卷壓力得以穩定化(平均化)。因此,雖然片卷中的收卷壓力的偏差最終會被大幅消除,但在收卷壓力的偏差被消除前形成的卷痕即使在收卷壓力的偏差被消除後也仍殘留於保護膜形成膜中。On the other hand, it is presumed that after the sheet roll is formed, that is, after the winding is completed, the winding pressure at the position where the winding pressure is high gradually decreases over time, and approaches the winding pressure at the position where the winding pressure is low. In other words, it is presumed that the variation in the winding pressure is eliminated with the passage of time, and the winding pressure in the sheet roll is stabilized (averaged). Therefore, although the deviation of the winding pressure in the sheet roll is finally largely eliminated, the winding marks formed before the deviation of the winding pressure is eliminated will remain in the protective film-forming film even after the deviation of the winding pressure is eliminated. middle.

然而,對於保護膜形成膜的損耗角正切低,保護膜形成膜不易變形的情況,即使產生收卷壓力的偏差,存在被強烈擠壓的位置,也不易在保護膜形成膜上形成卷痕。此外,若溫度變低,則容易將保護膜形成膜的損耗角正切維持得較低。進一步,如上所述,片卷中的收卷壓力具有隨著時間的推移而穩定化的傾向。However, when the loss tangent of the protective film-forming film is low and the protective film-forming film is not easily deformed, even if there is a variation in the winding pressure and there is a strongly squeezed position, the protective film-forming film is not easily formed with curling marks. Moreover, when the temperature becomes low, it becomes easy to maintain the loss tangent of a protective film formation film low. Further, as described above, the winding pressure in the sheet roll tends to stabilize over time.

(2.1保管步驟) 因此,本實施方案中,一邊將保護膜形成膜的損耗角正切維持在上述範圍內,一邊將剛捲繞的片卷保管規定的時間直至收卷壓力穩定化。 (2.1 Storage Procedure) Therefore, in the present embodiment, the sheet roll just wound is stored for a predetermined time until the winding pressure is stabilized while maintaining the loss tangent of the protective film forming film within the above-mentioned range.

具體而言,本實施方案的保護膜形成用片卷的製造方法具有下述步驟:自形成具有10℃下的保護膜形成膜的損耗角正切(tanδ 10)為1.2以下的保護膜形成膜的片卷後起,保管片卷60天,並在60天之中的25天以上的期間,於10℃以下的保管溫度保管片卷。 Specifically, the manufacturing method of the sheet roll for protective film formation of this embodiment has a process of forming the protective film forming film having a loss tangent (tanδ 10 ) of 1.2 or less from the protective film forming film at 10° C. After the sheet roll, the sheet roll is stored for 60 days, and the sheet roll is stored at a storage temperature of 10° C. or lower during a period of 25 days or more of the 60 days.

對於具有10℃下的保護膜形成膜的損耗角正切(tanδ 10)為1.2以下的保護膜形成膜的片卷,藉由於10℃以下的溫度保管片卷直至片卷的收卷壓力穩定化,保護膜形成膜易於達成上述範圍內的損耗角正切,因此可抑制片卷中的保護膜形成膜上的卷痕的形成。 For a sheet roll having a protective film-forming film whose loss tangent (tanδ 10 ) of the protective film-forming film at 10° C. is 1.2 or less, the sheet roll is stored at a temperature of 10° C. or lower until the winding pressure of the sheet roll is stabilized, The protective film-forming film easily achieves the loss tangent within the above-mentioned range, so that the formation of curl marks on the protective-film-forming film in the sheet roll can be suppressed.

此外,於10℃以下的保管溫度保管片卷的期間優選為30天以上、35天以上、40天以上、45天以上。另一方面,該期間優選為60天以下、59天以下。In addition, the period during which the sheet roll is stored at a storage temperature of 10° C. or lower is preferably 30 days or more, 35 days or more, 40 days or more, or 45 days or more. On the other hand, the period is preferably 60 days or less and 59 days or less.

此外,優選在形成片卷後10天之內、更優選在7天之內、進一步優選在4天之內開始進行於10℃以下的保管溫度下的保管。剛捲繞的片卷中,由於具有收卷壓力的偏差大的傾向,因此藉由確切地將保護膜形成膜的損耗角正切維持得較低,可進一步抑制片卷中的保護膜形成膜上的卷痕的形成。Further, the storage at a storage temperature of 10° C. or lower is preferably started within 10 days, more preferably within 7 days, and even more preferably within 4 days after the sheet roll is formed. In the sheet roll just wound, since there is a tendency that the variation in the winding pressure is large, by keeping the loss tangent of the protective film forming film low with certainty, it is possible to further suppress the increase in the protective film forming film in the sheet roll. formation of curl marks.

此外,保管溫度優選為-10℃以上,更優選為-5℃以上,進一步優選為0℃以上。藉由使保管溫度的下限值為上述值,可抑制保護膜形成膜的彈性模數變得過高,可抑制在保護膜形成膜與剝離膜之間、尤其在保護膜形成膜與第二剝離膜之間發生剝離。Further, the storage temperature is preferably -10°C or higher, more preferably -5°C or higher, and further preferably 0°C or higher. By making the lower limit of the storage temperature the above-mentioned value, the elastic modulus of the protective film-forming film can be suppressed from becoming too high, and the gap between the protective film-forming film and the release film, especially between the protective film-forming film and the second film can be suppressed. Peeling occurs between the release films.

經過上述保管步驟,可得到本實施方案的保護膜形成用片卷。藉由以上述的保管步驟保管保護膜形成膜在10℃下的損耗角正切tanδ 10為1.2以下的保護膜形成用片,即使從保護膜形成用片卷中將保護膜形成用片放卷,也可抑制直至芯部側的保護膜形成用片為止的保護膜形成膜上的卷痕的形成。因此,保護膜的外觀不良得以抑制,能夠毫不浪費地用完本實施方案的保護膜形成用片卷。 Through the above-mentioned storage process, the sheet roll for forming a protective film of the present embodiment can be obtained. Even if the sheet for forming a protective film is unwound from the roll for forming a sheet for forming a protective film by storing the sheet for forming a protective film whose loss tangent tanδ 10 at 10°C is 1.2 or less in the above-mentioned storage procedure, Formation of curl marks on the protective film forming film up to the protective film forming sheet on the core portion side can also be suppressed. Therefore, the appearance defect of a protective film is suppressed, and the sheet roll for protective film formation of this embodiment can be used up without waste.

(2.2長條片的製造方法) 對於本實施方案的保護膜形成用片卷的製造方法,利用公知的方法製造具有上述構成的長條片即可。本實施方案中,對第一剝離膜具有上述的基材與第一剝離劑層、第二剝離膜具有上述的基材與第二剝離劑層的情況進行說明。 (2.2 Manufacturing method of long strip) About the manufacturing method of the sheet roll for protective film formation of this embodiment, what is necessary is just to manufacture the elongate sheet|seat which has the said structure by a well-known method. In this embodiment, the case where a 1st release film has the above-mentioned base material and a 1st release agent layer, and a 2nd release film has the above-mentioned base material and a 2nd release agent layer is demonstrated.

保護膜形成膜使用保護膜形成膜用組合物而形成,第一剝離劑層使用第一剝離劑層用組合物而形成,第二剝離劑層使用第二剝離劑層用組合物而形成。The protective film forming film is formed using the composition for a protective film forming film, the first releasing agent layer is formed using the composition for the first releasing agent layer, and the second releasing agent layer is formed using the composition for the second releasing agent layer.

以下,對保護膜形成膜用組合物、第一剝離劑層用組合物及第二剝離劑層用組合物進行說明。Hereinafter, the composition for protective film forming films, the composition for 1st release agent layers, and the composition for 2nd release agent layers are demonstrated.

(2.2.1保護膜形成膜用組合物) 只要保護膜形成膜具有上述的物性,則保護膜形成膜的組成沒有特別限定。本實施方案中,構成保護膜形成膜的組合物(保護膜形成膜用組合物)優選為至少含有聚合物成分(A)與固化性成分(B)及填充材料(E)的樹脂組合物。聚合物成分可視為聚合性化合物進行聚合反應而形成的成分。此外,固化性成分為可進行固化(聚合)反應的成分。另外,本發明中的聚合反應中還包括縮聚反應。 (2.2.1 Composition for forming a protective film) The composition of the protective film forming film is not particularly limited as long as the protective film forming film has the above-mentioned physical properties. In this embodiment, it is preferable that the composition (composition for protective film forming films) which comprises a protective film forming film is a resin composition containing at least a polymer component (A), a curable component (B), and a filler (E). The polymer component can be regarded as a component formed by a polymerization reaction of a polymerizable compound. In addition, a curable component is a component which can undergo a curing (polymerization) reaction. In addition, the polymerization reaction in the present invention also includes a polycondensation reaction.

此外,聚合物成分中包含的成分有時也屬於固化性成分。本實施方案中,當保護膜形成膜用組合物含有這種既屬於聚合物成分又屬於固化性成分的成分時,視作保護膜形成膜用組合物既含有聚合物成分又含有固化性成分。In addition, the component contained in the polymer component may also be a curable component. In the present embodiment, when the composition for a protective film-forming film contains such a component that is both a polymer component and a curable component, it is considered that the composition for a protective film-forming film contains both the polymer component and the curable component.

(2.2.1.1聚合物成分) 聚合物成分(A)使保護膜形成膜具有膜形成性(成膜性),同時提供適度的黏性,確實地使保護膜形成膜均一地貼附於工件。聚合物成分的重量平均分子量通常在5萬~200萬、優選為10萬~150萬、特別優選為20萬~100萬的範圍內。作為這種聚合物成分,例如可使用丙烯酸樹脂、氨基甲酸酯(urethane)樹脂、苯氧基樹脂、矽氧樹脂、飽和聚酯樹脂等,特別優選使用丙烯酸樹脂。 (2.2.1.1 Polymer composition) The polymer component (A) imparts film formability (film-forming properties) to the protective film-forming film, and at the same time provides moderate tackiness, so that the protective film-forming film can be reliably adhered to the workpiece uniformly. The weight average molecular weight of the polymer component is usually in the range of 50,000 to 2,000,000, preferably 100,000 to 1,500,000, and particularly preferably 200,000 to 1,000,000. As such a polymer component, an acrylic resin, a urethane resin, a phenoxy resin, a silicone resin, a saturated polyester resin, etc. can be used, for example, and an acrylic resin is used especially preferably.

另外,在本說明書中,除非另有說明,則「重量平均分子量」是指由凝膠滲透層析(GPC)法測定的聚苯乙烯換算值。基於這種方法的測定例如可以以下述方式進行:使用在TOSOH CORPORATION製造的高速GPC裝置「HLC-8120GPC」中依次連接高速管柱「TSK guard column H XL-H」、「TSK Gel GMH XL」、「TSK Gel G2000 H XL」(以上,全部為TOSOH CORPORATION製造)而成的裝置,在管柱溫度:40℃、進液速度:1.0mL/分鐘的條件下,將檢測器設為示差折射計。 In addition, in this specification, unless otherwise specified, "weight average molecular weight" means the polystyrene conversion value measured by gel permeation chromatography (GPC). Measurement based on this method can be performed, for example, by connecting the high-speed column "TSK guard column H XL -H", "TSK Gel GMH XL", "TSK Gel GMH XL ", For an apparatus made of "TSK Gel G2000 H XL " (all of which are manufactured by TOSOH CORPORATION), the detector was a differential refractometer under the conditions of column temperature: 40°C and liquid feed rate: 1.0 mL/min.

作為丙烯酸樹脂,例如可列舉出由(甲基)丙烯酸酯單體與衍生自(甲基)丙烯酸衍生物的結構單元構成的(甲基)丙烯酸酯共聚物。此處,作為(甲基)丙烯酸酯單體,可優選列舉出烷基的碳原子數為1~18的(甲基)丙烯酸烷基酯,具體而言,可列舉出(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯等。此外,作為(甲基)丙烯酸衍生物,例如可列舉出(甲基)丙烯酸、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸羥基乙酯等。As an acrylic resin, the (meth)acrylate copolymer which consists of a (meth)acrylate monomer and the structural unit derived from a (meth)acrylic acid derivative is mentioned, for example. Here, as a (meth)acrylate monomer, the C1-C18 alkyl (meth)acrylate of an alkyl group is mentioned preferably, and specifically, methyl (meth)acrylate is mentioned. ester, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, etc. Moreover, as a (meth)acrylic acid derivative, (meth)acrylic acid, glycidyl (meth)acrylate, hydroxyethyl (meth)acrylate, etc. are mentioned, for example.

本實施方案中,優選使用甲基丙烯酸縮水甘油酯等在丙烯酸樹脂中引入縮水甘油基。引入了縮水甘油基的丙烯酸樹脂與後文所述的作為熱固性成分的環氧樹脂的互溶性得以提高,具有容易得到性能穩定的保護膜形成膜的傾向。此外,本實施方案中,為了控制對工件的黏合性或黏著物性,優選使用丙烯酸羥基乙酯等在丙烯酸樹脂中引入羥基。In this embodiment, a glycidyl group is preferably introduced into the acrylic resin using glycidyl methacrylate or the like. The mutual solubility of the glycidyl group-introduced acrylic resin and the epoxy resin as a thermosetting component described later is improved, and there is a tendency that a protective film-forming film having stable performance is easily obtained. In addition, in this embodiment, in order to control the adhesiveness to a workpiece or the physical properties of the adhesive, it is preferable to introduce a hydroxyl group into the acrylic resin using hydroxyethyl acrylate or the like.

丙烯酸樹脂的玻璃轉化溫度優選為-70~40℃、-35~35℃、-20~30℃、-10~25℃、-5~20℃。藉由使丙烯酸樹脂的玻璃轉化溫度的下限值為上述值,容易減小保護膜形成膜的tanδ 10。此外,藉由使丙烯酸樹脂的玻璃轉化溫度的上限值為上述值,適度提高保護膜形成膜的黏性,同時提高保護膜形成膜與工件的黏著力,並適度提高保護膜與工件的黏合力。 The glass transition temperature of the acrylic resin is preferably -70 to 40°C, -35 to 35°C, -20 to 30°C, -10 to 25°C, and -5 to 20°C. By making the lower limit of the glass transition temperature of the acrylic resin the above-mentioned value, it becomes easy to reduce the tanδ 10 of the protective film-forming film. In addition, by setting the upper limit of the glass transition temperature of the acrylic resin to the above-mentioned value, the viscosity of the protective film-forming film can be appropriately improved, the adhesion between the protective film-forming film and the workpiece, and the adhesion between the protective film and the workpiece can be appropriately improved. force.

丙烯酸樹脂具有m種(m為2以上的整數)結構單元時,能夠以下述方式算出該丙烯酸樹脂的玻璃轉化溫度。即,分別對衍生出丙烯酸樹脂中的結構單元的m種單體依次分配從1至m的任一不重複的編號,並命名為「單體m」時,丙烯酸樹脂的玻璃轉化溫度(Tg)可使用以下所示的Fox公式計算。 [數學式1]

Figure 02_image001
式中,Tg為丙烯酸樹脂的玻璃轉化溫度;m為2以上的整數;Tgk為單體m的均聚物的玻璃轉化溫度;Wk為丙烯酸樹脂中的由單體m衍生的結構單元m的質量分數,其中,Wk滿足下述式。 [數學式2]
Figure 02_image003
式中,m及Wk與所述m及Wk相同。 When the acrylic resin has m types (m is an integer of 2 or more) structural units, the glass transition temperature of the acrylic resin can be calculated as follows. That is, when m types of monomers from which the structural unit in the acrylic resin is derived are sequentially assigned any non-repeating number from 1 to m, and named "monomer m", the glass transition temperature (Tg) of the acrylic resin It can be calculated using the Fox formula shown below. [Mathematical formula 1]
Figure 02_image001
In the formula, Tg is the glass transition temperature of the acrylic resin; m is an integer of 2 or more; Tgk is the glass transition temperature of the homopolymer of the monomer m; Wk is the mass of the structural unit m derived from the monomer m in the acrylic resin score, where Wk satisfies the following formula. [Mathematical formula 2]
Figure 02_image003
In the formula, m and Wk are the same as the above-mentioned m and Wk.

作為Tgk,能夠使用高分子數據手冊(高分子Data Handbook)、黏著手冊(黏著Handbook)或Polymer Handbook等中記載的值。例如,丙烯酸甲酯的均聚物的Tgk為10℃,丙烯酸正丁酯的均聚物的Tgk為-54℃,甲基丙烯酸甲酯的均聚物的Tgk為105℃,丙烯酸2-羥基乙酯的均聚物的Tgk為-15℃,甲基丙烯酸縮水甘油酯的均聚物的Tgk為41℃,丙烯酸2-乙基己酯的Tgk為-70℃。As Tgk, the value described in Polymer Data Handbook, Adhesion Handbook, Polymer Handbook, or the like can be used. For example, a homopolymer of methyl acrylate has a Tgk of 10°C, a homopolymer of n-butyl acrylate has a Tgk of -54°C, a homopolymer of methyl methacrylate has a Tgk of 105°C, and 2-hydroxyethyl acrylate has a Tgk of 105°C. The Tgk of the ester homopolymer was -15°C, the Tgk of the glycidyl methacrylate homopolymer was 41°C, and the Tgk of 2-ethylhexyl acrylate was -70°C.

將保護膜形成膜用組合物的總重量設為100質量份時的聚合物成分的含量優選為5~80質量份、8~70質量份、10~60質量份、12~55質量份、14~50質量份、15~45質量份。藉由使聚合物成分的含量在上述範圍內,適度提高保護膜形成膜的黏性,同時適度提高保護膜形成膜與工件的黏著力。此外,具有容易抑制卷痕的產生的傾向。When the total weight of the composition for forming a protective film is set to 100 parts by mass, the content of the polymer component is preferably 5 to 80 parts by mass, 8 to 70 parts by mass, 10 to 60 parts by mass, 12 to 55 parts by mass, 14 parts by mass ~50 parts by mass, 15-45 parts by mass. By making the content of the polymer component within the above-mentioned range, the viscosity of the protective film-forming film can be appropriately increased, and the adhesive force between the protective film-forming film and the workpiece can be appropriately increased. In addition, there is a tendency to easily suppress the occurrence of curl marks.

(2.2.1.2熱固性成分) 固化性成分(B)藉由使保護膜形成膜固化而形成硬質保護膜。作為固化性成分,可使用熱固性成分、能量射線固化性成分、或它們的混合物。藉由照射能量射線而使其固化時,保護膜形成膜由於含有後文所述的填充材料及著色料等,因此透光率降低。因此,例如保護膜形成膜的厚度變厚時,能量射線固化容易變得不充分。 (2.2.1.2 Thermosetting components) The curable component (B) forms a hard protective film by curing the protective film-forming film. As the curable component, a thermosetting component, an energy ray-curable component, or a mixture thereof can be used. When it is hardened by irradiating an energy ray, since the protective film forming film contains the filler, coloring material, etc. which are mentioned later, the light transmittance falls. Therefore, for example, when the thickness of the protective film forming film increases, the energy ray curing tends to become insufficient.

另一方面,熱固性的保護膜形成膜即使厚度變厚,也可藉由加熱而充分固化,因此能夠形成保護性能高的保護膜。此外,藉由使用加熱烘箱等通常的加熱設備,可將許多保護膜形成膜統一進行加熱而使其熱固化。On the other hand, a thermosetting protective film-forming film can be sufficiently cured by heating even if its thickness is increased, so that a protective film with high protective performance can be formed. Moreover, by using common heating equipment, such as a heating oven, many protective film forming films can be heated collectively, and can be thermally cured.

因此,本實施方案中,期望固化性成分為熱固性。即,保護膜形成膜優選為熱固性。Therefore, in this embodiment, the curable component is desirably thermosetting. That is, the protective film forming film is preferably thermosetting.

能夠以下述方式判斷保護膜形成膜是否為熱固性。首先,將常溫(23℃)的保護膜形成膜加熱至超過常溫的溫度,接著冷卻至常溫,製成加熱並冷卻後的保護膜形成膜。接著,在相同溫度下對加熱並冷卻後的保護膜形成膜的硬度與加熱前的保護膜形成膜的硬度進行比較時,將加熱並冷卻後的保護膜形成膜更硬的情況判斷為該保護膜形成膜為熱固性。Whether or not the protective film forming film is thermosetting can be determined as follows. First, the protective film-forming film at normal temperature (23° C.) is heated to a temperature exceeding normal temperature, and then cooled to normal temperature to prepare a protective film-forming film after heating and cooling. Next, when the hardness of the protective film-forming film after heating and cooling was compared with the hardness of the protective-film-forming film before heating at the same temperature, the case where the protective film-forming film after heating and cooling was harder was judged to be the protection Film-forming films are thermosetting.

作為熱固性成分,例如優選使用環氧樹脂、熱固性聚醯亞胺樹脂、不飽和聚酯樹脂及它們的混合物。熱固性聚醯亞胺樹脂是指可藉由進行熱固化而形成聚醯亞胺樹脂的聚醯亞胺前驅體與熱固性聚醯亞胺的總稱。As the thermosetting component, for example, epoxy resins, thermosetting polyimide resins, unsaturated polyester resins, and mixtures thereof are preferably used. The thermosetting polyimide resin is a general term for a polyimide precursor and a thermosetting polyimide that can be thermally cured to form a polyimide resin.

作為熱固性成分的環氧樹脂具有若受到加熱則形成三維網狀結構,並形成牢固的覆膜的性質。作為這種環氧樹脂,可使用公知的各種環氧樹脂。本實施方案中,環氧樹脂的分子量(式量)優選為300以上且小於50000、300以上且小於10000、300以上且小於5000、300以上且小於3000。此外,環氧樹脂的環氧當量優選為50~5000g/eq,更優選為100~2000g/eq,進一步優選為150~1000g/eq。The epoxy resin, which is a thermosetting component, has a property of forming a three-dimensional network structure and forming a strong coating when heated. As such an epoxy resin, well-known various epoxy resins can be used. In this embodiment, the molecular weight (formula weight) of the epoxy resin is preferably 300 or more and less than 50,000, 300 or more and less than 10,000, 300 or more and less than 5,000, 300 or more and less than 3,000. In addition, the epoxy equivalent of the epoxy resin is preferably 50 to 5000 g/eq, more preferably 100 to 2000 g/eq, still more preferably 150 to 1000 g/eq.

作為上述環氧樹脂,具體而言,可列舉出雙酚A、雙酚F、間苯二酚、苯基酚醛清漆(phenyl novolac)、甲酚酚醛清漆等酚類的縮水甘油醚;丁二醇、聚乙二醇、聚丙二醇等醇類的縮水甘油醚;鄰苯二甲酸、間苯二甲酸、四氫鄰苯二甲酸等羧酸的縮水甘油醚;用縮水甘油基取代苯胺異氰脲酸酯(aniline isocyanurate)等的鍵合於氮原子的活性氫而成的縮水甘油型或烷基縮水甘油型的環氧樹脂;乙烯基環己烷二環氧化物、3,4-環氧環己基甲基-3,4-二環己烷羧酸酯、2-(3,4-環氧)環己基-5,5-螺(3,4-環氧)環己烷-間二氧六環等的、藉由將分子內的碳碳雙鍵例如氧化等而引入環氧基的所謂的脂環型環氧化物。此外,還能夠使用具有聯苯骨架、二環己二烯骨架、萘骨架等的環氧樹脂。Specific examples of the epoxy resins include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolac, and cresol novolac; butanediol; , glycidyl ethers of alcohols such as polyethylene glycol and polypropylene glycol; glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; substituted aniline isocyanuric acid with glycidyl group Glycidyl-type or alkyl-glycidyl-type epoxy resins of ester (aniline isocyanurate) and other active hydrogen bonded to nitrogen atoms; vinylcyclohexane diepoxide, 3,4-epoxycyclohexyl Methyl-3,4-bicyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane etc., so-called alicyclic epoxides which introduce an epoxy group by, for example, oxidizing a carbon-carbon double bond in the molecule. In addition, epoxy resins having a biphenyl skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, and the like can also be used.

使用熱固性成分作為固化性成分(B)時,優選同時使用固化劑(C)作為助劑。作為針對環氧樹脂的固化劑,優選熱活性型潛伏性環氧樹脂固化劑。「熱活性型潛伏性環氧樹脂固化劑」是指常溫(23℃)下不易與環氧樹脂反應、藉由一定溫度以上的加熱而活化並與環氧樹脂進行反應的類型的固化劑。對於熱活性型潛伏性環氧樹脂固化劑的活化方法,存在:利用基於加熱的化學反應生成活性種(陰離子、陽離子)的方法;在常溫附近穩定分散於環氧樹脂中,在高溫下與環氧樹脂互溶-溶解並開始固化反應的方法;高溫下溶出分子篩封入類型的固化劑後開始固化反應的方法;基於微膠囊的方法等。When a thermosetting component is used as a curable component (B), it is preferable to use a curing agent (C) together as an auxiliary agent. As the curing agent for epoxy resins, a thermally active latent epoxy resin curing agent is preferable. "Thermally active latent epoxy resin curing agent" refers to a curing agent of a type that does not easily react with epoxy resins at room temperature (23°C), and is activated by heating above a certain temperature to react with epoxy resins. For the activation method of thermally active latent epoxy resin curing agent, there are: a method of generating active species (anions, cations) by chemical reaction based on heating; stably dispersed in epoxy resin near normal temperature, and reacted with ring at high temperature Oxygen resins are mutually soluble - a method of dissolving and starting a curing reaction; a method of starting the curing reaction after dissolving a molecular sieve-encapsulated type curing agent at a high temperature; a method based on microcapsules, etc.

例示的方法中,優選在常溫附近穩定分散於環氧樹脂中,在高溫下與環氧樹脂互溶-溶解並開始固化反應的方法。Among the exemplified methods, a method of stably dispersing in the epoxy resin at the vicinity of normal temperature, and mutually dissolving and dissolving with the epoxy resin at a high temperature to initiate a curing reaction is preferable.

作為熱活性型潛伏性環氧樹脂固化劑的具體實例,可列舉出各種鎓鹽或、二元酸二醯肼化合物、雙氰胺、胺加成物固化劑、咪唑化合物等高熔點活性氫化合物等。這些熱活性型潛伏性環氧樹脂固化劑可以單獨使用一種或者組合使用兩種以上。本實施方案特別優選雙氰胺。Specific examples of the thermally active latent epoxy resin curing agent include various onium salts, diacid dihydrazide compounds, dicyandiamide, amine adduct curing agents, imidazole compounds and other high melting point active hydrogen compounds. Wait. These thermally active latent epoxy resin curing agents may be used alone or in combination of two or more. Dicyandiamide is particularly preferred in this embodiment.

此外,作為針對環氧樹脂的固化劑,還優選酚醛樹脂。作為酚醛樹脂,可沒有特別限制地使用烷基酚、多元酚、萘酚等酚類與醛類的縮聚物等。具體而言,可使用苯酚酚醛清漆樹脂、鄰甲酚酚醛清漆樹脂、對甲酚酚醛清漆樹脂、叔丁基苯酚酚醛清漆樹脂、雙環戊二烯甲酚樹脂、聚對乙烯基苯酚樹脂、雙酚A型酚醛清漆樹脂、或它們的改質物等。Moreover, as a hardening|curing agent for epoxy resins, a phenol resin is also preferable. As the phenol resin, polycondensates of phenols and aldehydes such as alkylphenols, polyhydric phenols, and naphthols and the like can be used without particular limitation. Specifically, phenol novolac resin, o-cresol novolak resin, p-cresol novolac resin, t-butylphenol novolak resin, dicyclopentadiene cresol resin, poly-p-vinylphenol resin, bisphenol can be used A-type novolak resins, or their modifications, and the like.

這些酚醛樹脂中包含的酚羥基可藉由加熱容易地與上述環氧樹脂的環氧基進行加成反應,從而形成耐衝擊性高的固化物。The phenolic hydroxyl group contained in these phenol resins can be easily added and reacted with the epoxy group of the epoxy resin by heating to form a cured product with high impact resistance.

相對於環氧樹脂100質量份,固化劑(C)的含量優選為0.01~30質量份、0.1~20質量份、0.2~15質量份、0.3~10質量份。藉由使固化劑(C)的含量的範圍為上述範圍,作為保護膜,容易得到保護工件的性能。The content of the curing agent (C) is preferably 0.01 to 30 parts by mass, 0.1 to 20 parts by mass, 0.2 to 15 parts by mass, and 0.3 to 10 parts by mass relative to 100 parts by mass of the epoxy resin. By making the range of content of a hardening|curing agent (C) into the said range, it becomes easy to obtain the performance which protects a workpiece|work as a protective film.

使用雙氰胺作為固化劑(C)時,進一步優選同時使用固化促進劑(D)。作為固化促進劑,例如優選2-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、2-苯基-4,5-二羥甲基咪唑、2-苯基-4-甲基-5-羥甲基咪唑等咪唑類(一個以上的氫原子被除氫原子以外的基團取代的咪唑)。其中,特別優選2-苯基-4,5-二羥甲基咪唑。When using dicyandiamide as a curing agent (C), it is more preferable to use a curing accelerator (D) together. As the curing accelerator, for example, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4,5-dimethylolimidazole, 2-phenyl- Imidazoles such as 4-methyl-5-hydroxymethylimidazole (imidazoles in which one or more hydrogen atoms are substituted by groups other than hydrogen atoms). Among them, 2-phenyl-4,5-dimethylolimidazole is particularly preferable.

相對於環氧樹脂100質量份,固化促進劑的含量優選為0.01~30質量份、0.1~20質量份、0.2~15質量份、0.3~10質量份。藉由使固化促進劑(D)的含量的範圍為上述範圍,作為保護膜,容易得到保護工件的性能。The content of the curing accelerator is preferably 0.01 to 30 parts by mass, 0.1 to 20 parts by mass, 0.2 to 15 parts by mass, and 0.3 to 10 parts by mass relative to 100 parts by mass of the epoxy resin. By making content of a hardening accelerator (D) into the said range, it becomes easy to obtain the performance which protects a workpiece as a protective film.

將保護膜形成膜用組合物的總重量設為100質量份時的熱固性成分及固化劑的合計含量優選為3~80質量份、5~60質量份、7~50質量份、9~40質量份、10~30質量份。若以這種比例摻合熱固性成分與固化劑,則作為保護膜,容易得到保護工件的性能。When the total weight of the composition for forming a protective film is set to 100 parts by mass, the total content of the thermosetting component and the curing agent is preferably 3 to 80 parts by mass, 5 to 60 parts by mass, 7 to 50 parts by mass, and 9 to 40 parts by mass parts, 10 to 30 parts by mass. When the thermosetting component and the curing agent are blended in such a ratio, the performance of protecting the workpiece can be easily obtained as a protective film.

(2.2.1.3能量射線固化性成分) 固化性成分(B)為能量射線固化性成分時,能量射線固化性成分優選為未固化,優選具有黏著性,更優選未固化且具有黏著性。 (2.2.1.3 Energy ray curable components) When the curable component (B) is an energy ray curable component, the energy ray curable component is preferably uncured, preferably has adhesiveness, and more preferably has uncured and adhesiveness.

能量射線固化性成分為藉由照射能量射線而進行固化的成分,其為用於賦予保護膜形成膜成膜性、可撓性等的成分。The energy ray-curable component is a component that is cured by irradiation with an energy ray, and is a component for imparting film-forming properties, flexibility, and the like to the protective film-forming film.

作為能量射線固化性成分,例如,優選具有能量射線固化性基團的化合物。作為這種化合物,可列舉出公知的化合物。As the energy ray-curable component, for example, a compound having an energy ray-curable group is preferable. As such a compound, a well-known compound is mentioned.

(2.2.1.4填充材料) 藉由使保護膜形成膜含有填充材料(E),將保護膜形成膜保護膜化而得到的保護膜的熱膨脹係數的調節變得容易。藉由使該熱膨脹係數接近工件的熱膨脹係數,與工件的黏合可靠性進一步提高。此外,藉由使保護膜形成膜含有填充材料(E),容易得到硬質保護膜而獲得保護工件的性能,進而可降低保護膜的吸濕率。 (2.2.1.4 Filling material) By making the protective film forming film contain the filler (E), the adjustment of the thermal expansion coefficient of the protective film obtained by converting the protective film forming film into a protective film becomes easy. By making the thermal expansion coefficient close to the thermal expansion coefficient of the workpiece, the adhesion reliability with the workpiece is further improved. Moreover, by making a protective film forming film contain a filler (E), a hard protective film can be easily obtained, the performance of protecting a workpiece can be obtained, and the moisture absorption rate of a protective film can be reduced.

填充材料(E)可以為有機填充材料及無機填充材料中的任一種,從260℃等的高溫下的形狀穩定性的角度出發,優選為無機填充材料。The filler (E) may be either an organic filler or an inorganic filler, but an inorganic filler is preferable from the viewpoint of shape stability at high temperatures such as 260°C.

作為優選的無機填充材料,例如可列舉出二氧化矽、氧化鋁、滑石、碳酸鈣、紅氧化鐵、碳化矽、氮化硼等粉末;將這些無機填充材料球形化而成的珠子;這些無機填充材料的表面改質物;這些無機填充材料的單晶纖維;玻璃纖維等。其中,優選二氧化矽及經表面改質的二氧化矽。經表面改質的二氧化矽優選利用偶合劑進行表面改質,更優選利用矽烷偶合劑進行表面改質。Examples of preferred inorganic fillers include powders of silica, alumina, talc, calcium carbonate, red iron oxide, silicon carbide, boron nitride, etc.; beads formed by spheroidizing these inorganic fillers; Surface modifiers of fillers; single crystal fibers of these inorganic fillers; glass fibers, etc. Among them, silica and surface-modified silica are preferred. The surface-modified silica is preferably surface-modified with a coupling agent, and more preferably surface-modified with a silane coupling agent.

填充材料的平均粒徑優選為0.02~10μm、0.05~5μm、0.10~3μm。The average particle diameter of the filler is preferably 0.02 to 10 μm, 0.05 to 5 μm, and 0.10 to 3 μm.

藉由使填充材料的平均粒徑的範圍為上述範圍,保護膜形成膜用組合物的操作性變得良好。其結果,保護膜形成膜用組合物及保護膜形成膜的品質容易穩定。By making the range of the average particle diameter of a filler into the said range, the handleability of the composition for protective film forming films becomes favorable. As a result, the composition for a protective film-forming film and the quality of the protective film-forming film are easily stabilized.

另外,除非另有說明,則本說明書中「平均粒徑」是指藉由雷射繞射散射法求得的粒度分佈曲線中的、累積值為50%處的粒徑(D50)的值。In addition, unless otherwise specified, the "average particle diameter" in this specification refers to the value of the particle diameter (D50) at 50% of the cumulative value in the particle size distribution curve obtained by the laser diffraction scattering method.

將保護膜形成膜用組合物的總重量設為100質量份時的填充材料的含量優選為15~80質量份、30~75質量份、40~70質量份、45~65質量份。The content of the filler when the total weight of the composition for forming a protective film is 100 parts by mass is preferably 15 to 80 parts by mass, 30 to 75 parts by mass, 40 to 70 parts by mass, and 45 to 65 parts by mass.

藉由使填充材料的含量的下限值為上述值,具有容易減小保護膜形成膜的tanδ 10的傾向。此外,藉由使填充材料的含量的上限值為上述值,具有保護膜形成膜與工件的黏著力提高、且保護膜與工件的黏合力適度提高的傾向。 By making the lower limit of the content of the filler into the above-mentioned value, there is a tendency that tan δ 10 of the protective film-forming film is easily reduced. Moreover, by making the upper limit of content of a filler to the said value, the adhesive force of a protective film forming film and a workpiece|work improves, and there exists a tendency for the adhesive force of a protective film and a workpiece|work to improve moderately.

(2.2.1.5偶合劑) 保護膜形成膜優選含有偶合劑(F)。藉由含有偶合劑,能夠在保護膜形成膜的固化後,提高保護膜與工件的黏合性且不會損害保護膜的耐熱性,同時能夠提高耐水性(耐濕熱性)。作為偶合劑,從其通用性與成本優勢的角度出發,優選矽烷偶合劑。 (2.2.1.5 Coupling agent) The protective film-forming film preferably contains a coupling agent (F). By containing the coupling agent, after curing of the protective film-forming film, the adhesion between the protective film and the workpiece can be improved without impairing the heat resistance of the protective film, and at the same time, the water resistance (moisture and heat resistance) can be improved. As the coupling agent, a silane coupling agent is preferable from the viewpoint of its versatility and cost advantage.

作為矽烷偶合劑,例如可列舉出γ-縮水甘油醚氧基丙基三甲氧基矽烷、γ-縮水甘油醚氧丙基甲基二乙氧基矽烷、β-(3,4-環氧環己基)乙基三甲氧基矽烷、γ-(甲基丙烯醯氧基丙基)三甲氧基矽烷、γ-氨基丙基三甲氧基矽烷、N-6-(氨基乙基)-γ-氨基丙基三甲氧基矽烷、N-6-(氨基乙基)-γ-氨基丙基甲基二乙氧基矽烷、N-苯基-γ-氨基丙基三甲氧基矽烷、γ-脲丙基三乙氧基矽烷、γ-巰丙基三甲氧基矽烷、γ-巰丙基甲基二甲氧基矽烷、雙(3-三乙氧基矽基丙基)四硫化物、甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙醯氧基矽烷、咪唑矽烷等。這些矽烷偶合劑可以單獨使用一種或混合使用兩種以上。Examples of the silane coupling agent include γ-glycidyl etheroxypropyltrimethoxysilane, γ-glycidyl etheroxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl ) ethyltrimethoxysilane, γ-(methacryloyloxypropyl)trimethoxysilane, γ-aminopropyltrimethoxysilane, N-6-(aminoethyl)-γ-aminopropyl Trimethoxysilane, N-6-(aminoethyl)-γ-aminopropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethyl Oxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, bis(3-triethoxysilylpropyl)tetrasulfide, methyltrimethoxysilane , Methyl triethoxy silane, vinyl trimethoxy silane, vinyl triethoxy silane, imidazole silane, etc. These silane coupling agents may be used alone or in combination of two or more.

(2.2.1.6著色劑) 保護膜形成膜優選含有著色劑(G)。由此,可遮蔽晶片等工件的加工物的背面,因此可遮斷電子設備內產生的各種電磁波,降低晶片等工件的加工物的誤動作。 (2.2.1.6 Colorants) The protective film-forming film preferably contains a colorant (G). Thereby, since the back surface of the workpiece such as a wafer can be shielded, various electromagnetic waves generated in the electronic device can be blocked, and malfunction of the workpiece such as a wafer can be reduced.

作為著色劑(G),例如可使用無機類顏料、有機類顏料、有機類染料等公知的顏料。本實施方案中,優選無機類顏料。As a coloring agent (G), well-known pigments, such as an inorganic type pigment, an organic type pigment, and an organic type dye, can be used, for example. In this embodiment, inorganic pigments are preferred.

作為無機類顏料,例如可列舉出碳黑、鈷類色素、鐵類色素、鉻類色素、鈦類色素、釩類色素、鋯類色素、鉬類色素、釕類色素、鉑類色素、ITO(氧化銦錫)類色素、ATO(氧化銻錫)類色素等。其中,特別優選使用碳黑。若為碳黑,則可遮斷較寬的波長範圍的電磁波。Examples of inorganic pigments include carbon black, cobalt pigments, iron pigments, chromium pigments, titanium pigments, vanadium pigments, zirconium pigments, molybdenum pigments, ruthenium pigments, platinum pigments, ITO ( Indium tin oxide) dyes, ATO (antimony tin oxide) dyes, etc. Among them, carbon black is particularly preferably used. In the case of carbon black, electromagnetic waves in a wide wavelength range can be blocked.

保護膜形成膜中的著色劑(尤其是碳黑)的摻合量可根據保護膜形成膜的厚度的不同而不同,例如保護膜形成膜的厚度為20μm時,相對於保護膜形成膜的總質量,著色劑的摻合量優選為0.01~10質量%、0.04~7質量%、0.07~4質量%。藉由使著色劑的摻合量在上述範圍內,具有可使保護膜形成用片卷的卷痕所帶來的保護膜的痕跡在外觀上不顯眼的傾向。The blending amount of the colorant (especially carbon black) in the protective film-forming film may vary depending on the thickness of the protective film-forming film. For example, when the thickness of the protective film-forming film is 20 μm, the amount of In terms of mass, the blending amount of the colorant is preferably 0.01 to 10% by mass, 0.04 to 7% by mass, and 0.07 to 4% by mass. By making the compounding quantity of a coloring agent into the said range, it exists in the tendency to make the trace of a protective film by the roll mark of the sheet roll for protective film formation inconspicuous in appearance.

著色劑(尤其是碳黑)的平均粒徑優選為1~500nm,特別優選為3~100nm,進一步優選為5~50nm。若著色劑的平均粒徑在上述範圍內,則容易將透光率控制在所需範圍。The average particle diameter of the colorant (especially carbon black) is preferably 1 to 500 nm, particularly preferably 3 to 100 nm, and further preferably 5 to 50 nm. When the average particle diameter of the colorant is within the above-mentioned range, the light transmittance can be easily controlled within a desired range.

(2.2.1.7其他添加劑) 在不損害本發明的效果的範圍內,保護膜形成膜用組合物例如還可以含有光聚合引發劑、交聯劑、增塑劑、抗靜電劑、抗氧化劑、吸雜劑、增黏劑、剝離劑等作為其他添加劑。 (2.2.1.7 Other additives) The composition for forming a protective film may further contain, for example, a photopolymerization initiator, a crosslinking agent, a plasticizer, an antistatic agent, an antioxidant, a getter, a tackifier, a Release agent etc. as other additives.

(2.2.2第一剝離劑層用組合物) 本實施方案中,第一剝離劑層用組合物例如可包含醇酸類脫模劑、矽氧類脫模劑、氟類脫模劑、不飽和聚酯類脫模劑、聚烯烴類脫模劑、蠟類脫模劑,其中,優選包含矽氧類脫模劑。第一剝離劑層用組合物包含矽氧類脫模劑時,優選包含矽氧類脫模劑與重剝離添加劑。 (2.2.2 Composition for the first release agent layer) In this embodiment, the composition for the first release agent layer may contain, for example, an alkyd-based mold release agent, a silicone-based mold release agent, a fluorine-based mold release agent, an unsaturated polyester-based mold release agent, and a polyolefin-based mold release agent , Wax-based mold release agents, which preferably contain silicone-based mold release agents. When the composition for the first release agent layer contains a silicone-based release agent, it is preferable to include a silicone-based release agent and a heavy release additive.

(2.2.2.1矽氧類脫模劑) 作為矽氧類脫模劑,可使用摻合了具有二甲基聚矽氧烷作為基本骨架的矽氧的矽氧脫模劑。 (2.2.2.1 Silicon oxide mold release agent) As the silicone-based mold release agent, a silicone mold release agent in which silicone having dimethylpolysiloxane as a basic skeleton is blended can be used.

將第一剝離劑層用組合物(不包括後述催化劑)的總重量設為100質量份時的由二甲基聚矽氧烷形成的矽氧的含量優選為小於100質量份、小於90質量份、小於80質量份、小於70質量份。When the total weight of the composition for the first release agent layer (excluding the catalyst described later) is 100 parts by mass, the content of the silicon oxide formed from dimethylpolysiloxane is preferably less than 100 parts by mass and less than 90 parts by mass , less than 80 parts by mass, less than 70 parts by mass.

該矽氧可以為加成反應型、縮聚反應型、以及紫外線固化型及電子束固化型等能量射線固化型中的任一種,優選為加成反應型矽氧。加成反應型矽氧的反應性高且生產率優異,同時與縮聚反應型相比,具有製造後的剝離力的變化小、沒有固化收縮等優點。The silicone may be any of addition reaction type, polycondensation reaction type, and energy ray curing type such as ultraviolet curing type and electron beam curing type, and is preferably addition reaction type silicone. The addition reaction type siloxane has high reactivity and excellent productivity, and at the same time, compared with the polycondensation reaction type, it has advantages such as less change in the peeling force after manufacture and no curing shrinkage.

作為加成反應型矽氧的具體實例,可列舉出在分子的末端和/或側鏈具備2個以上乙烯基、烯丙基、丙烯基、及己烯基等碳原子數為2~10的烯基的有機聚矽氧烷。Specific examples of addition-reaction-type siloxanes include those having 2 to 10 carbon atoms such as vinyl, allyl, propenyl, and hexenyl groups at the terminal and/or side chain of the molecule. Alkenyl organopolysiloxanes.

使用這種加成反應型矽氧時,優選同時使用交聯劑及催化劑。When such an addition reaction type silica is used, it is preferable to use a crosslinking agent and a catalyst together.

作為交聯劑,例如可列舉出在1分子中至少具有2個鍵合於矽原子的氫原子的有機聚矽氧烷。As a crosslinking agent, the organopolysiloxane which has at least 2 hydrogen atoms couple|bonded with a silicon atom in 1 molecule is mentioned, for example.

作為交聯劑的具體實例,可列舉出二甲基氫甲矽烷氧基末端封端二甲基矽氧烷-甲基氫矽氧烷共聚物、三甲基甲矽烷氧基末端封端二甲基矽氧烷-甲基氫矽氧烷共聚物、三甲基甲矽烷氧基末端封端甲基氫聚矽氧烷、聚(氫倍半矽氧烷)等。Specific examples of the crosslinking agent include dimethylhydrosiloxy-terminated dimethylsiloxane-methylhydrosiloxane copolymer, trimethylsiloxy-terminated dimethyl Siloxane-methylhydrosiloxane copolymer, trimethylsiloxy-terminated methylhydropolysiloxane, poly(hydrosilsesquioxane), etc.

作為催化劑,可列舉出微粒狀鉑、吸附於碳粉末載體上的微粒狀鉑、氯鉑酸、醇改質氯鉑酸、氯鉑酸的烯烴錯合物、鈀、及銠等鉑族金屬類化合物等。Examples of catalysts include particulate platinum, particulate platinum adsorbed on a carbon powder carrier, chloroplatinic acid, alcohol-modified chloroplatinic acid, olefin complexes of chloroplatinic acid, palladium, and platinum group metals such as rhodium. compounds, etc.

藉由使用上述催化劑,可更有效地進行第一剝離劑層用組合物的固化反應。By using the said catalyst, the hardening reaction of the composition for 1st release agent layers can progress more efficiently.

從使剝離力F1在上述範圍內的角度出發,將第一剝離劑層用組合物(不包括催化劑)的總重量設為100質量份時的矽氧類脫模劑的含量優選為30~100質量份、50~100質量份。From the viewpoint of making the peeling force F1 within the above-mentioned range, the content of the silicone-based mold release agent when the total weight of the composition for the first release agent layer (excluding the catalyst) is 100 parts by mass is preferably 30 to 100 parts by mass, 50 to 100 parts by mass.

(2.2.2.2重剝離添加劑) 重剝離添加劑用於增大從保護膜形成膜上剝離第一剝離膜的剝離力F1。作為重剝離添加劑,例如可列舉出矽氧樹脂、矽烷偶合劑等矽氧烷,其中,優選使用矽氧樹脂。 (2.2.2.2 Heavy Peel Additives) The heavy peeling additive is used to increase the peeling force F1 for peeling the first peeling film from the protective film-forming film. Examples of the heavy release additive include siloxanes such as silicone resins and silane coupling agents, and among them, silicone resins are preferably used.

作為矽氧樹脂,例如優選使用包含作為單官能度矽氧烷單元[R 3SiO 1/2]的M單元、與作為四官能度矽氧烷單元[SiO 4/2]的Q單元的MQ樹脂。另外,M單元中的3個R分別獨立地表示氫原子、羥基或有機基團。從容易抑制矽氧轉移的角度出發,M單元中的3個R中的1個以上優選為羥基或乙烯基,更優選為乙烯基。 As the silicone resin, it is preferable to use, for example, an MQ resin containing an M unit as a monofunctional siloxane unit [R 3 SiO 1/2 ] and a Q unit as a tetrafunctional siloxane unit [SiO 4/2 ] . In addition, the three Rs in the M unit each independently represent a hydrogen atom, a hydroxyl group, or an organic group. From the viewpoint of easy inhibition of silicon-oxygen transfer, one or more of the three Rs in the M unit is preferably a hydroxyl group or a vinyl group, and more preferably a vinyl group.

將第一剝離劑層用組合物(不包括催化劑)的總重量設為100質量份時的重剝離添加劑的含量優選為0~50質量份、5~45質量份、10~40質量份。When the total weight of the composition for the first release agent layer (excluding the catalyst) is 100 parts by mass, the content of the heavy release additive is preferably 0 to 50 parts by mass, 5 to 45 parts by mass, and 10 to 40 parts by mass.

此外,在基材的兩個主面上形成第一剝離劑層時,可以將後述包含第一剝離劑層用組合物的塗佈劑塗佈在基材的兩個主面上而形成第一剝離劑層,也可以將包含第一剝離劑層用組合物的塗佈劑塗佈在基材的一個主面後,將基材捲繞而製成卷,利用第一剝離劑層用組合物的成分從塗佈有塗佈劑的主面轉移至未塗佈塗佈劑的主面的現象(轉移現象),在未塗佈塗佈劑的主面形成第一剝離劑層。In addition, when forming the first release agent layer on both main surfaces of the base material, the first release agent layer can be formed by applying a coating agent containing the composition for the first release agent layer to be described later on both main surfaces of the base material. For the release agent layer, after applying the coating agent containing the composition for the first release agent layer to one main surface of the base material, the base material may be wound to form a roll, and the composition for the first release agent layer may be used. A phenomenon (transfer phenomenon) in which the components of the coating agent are transferred from the main surface on which the coating agent is applied to the main surface on which the coating agent is not applied (transfer phenomenon), and a first release agent layer is formed on the main surface on which the coating agent is not applied.

第一剝離膜中,例如能夠以下述方式判斷基材是否經過了剝離處理。第一剝離劑層包含上述的矽氧類脫模劑時,利用X射線光電子能譜法(XPS)對第一剝離膜的兩個主面進行表面分析,根據得到的光譜算出矽原子的比率,若為規定值以上,則判斷為經過了剝離處理。具體的測定方法會在後述實施例中進行詳細說明。In the first release film, for example, whether or not the base material has undergone a release treatment can be determined as follows. When the first release agent layer contains the above-mentioned silicone-based release agent, the surface analysis of the two main surfaces of the first release film is performed by X-ray photoelectron spectroscopy (XPS), and the ratio of silicon atoms is calculated from the obtained spectrum, If it is a predetermined value or more, it will be judged that a peeling process has been performed. The specific measurement method will be described in detail in the following Examples.

此外,基材由聚對苯二甲酸乙二醇酯膜構成時,對第一剝離膜的兩個主面測定水的接觸角,若接觸角為規定值以上,則判斷為經過了剝離處理。具體的測定方法會在後述實施例中進行詳細說明。Moreover, when the base material consists of a polyethylene terephthalate film, the contact angle of water was measured with respect to both main surfaces of a 1st peeling film, and it was judged that the peeling process was performed when the contact angle was a predetermined value or more. The specific measurement method will be described in detail in the following Examples.

(2.2.3第二剝離劑層用組合物) 第二剝離劑層用組合物只要滿足上述的F1與F2的關係,則可從第一剝離劑層用組合物中例示的材料中選擇。其中,優選作為重剝離添加劑而例示的材料的含量少於在第一剝離劑層用組合物中的含量、或者不包含。 (2.2.3 Composition for the second release agent layer) The composition for the second release agent layer can be selected from the materials exemplified in the composition for the first release agent layer as long as the relationship between F1 and F2 described above is satisfied. Among them, it is preferable that the content of the material exemplified as the heavy release additive is less than the content in the composition for the first release agent layer, or not included.

另外,在不損害本發明的效果的範圍內,第一剝離劑層用組合物及第二剝離劑層用組合物可在剝離劑層中含有通常使用的添加劑。作為這種添加劑,可列舉出染料及分散劑等。Moreover, in the range which does not impair the effect of this invention, the composition for 1st release agent layers and the composition for 2nd release agent layers may contain the normally used additive in a release agent layer. As such an additive, a dye, a dispersing agent, etc. are mentioned.

此外,從將剝離力調節得較低的角度、及更容易形成利用了上述轉移現象的剝離劑層的角度出發,可以在剝離劑層用組合物(第一剝離劑層用組合物及第二剝離劑層用組合物)中添加矽氧油。In addition, from the viewpoint of adjusting the peeling force to be low, and from the viewpoint of making it easier to form the release agent layer utilizing the above-mentioned transfer phenomenon, the composition for the release agent layer (the composition for the first release agent layer and the second release agent layer) Silicone oil is added to the release agent layer composition).

(2.2.4長條片的製造步驟) 製造長條片時,首先,製備上述保護膜形成膜用組合物、第一剝離劑層用組合物及第二剝離劑層用組合物。本實施方案中,從調節黏度從而提高塗佈性的角度出發,優選製備用稀釋溶劑稀釋包含上述各成分的保護膜形成膜用組合物及剝離劑層用組合物而成的塗佈劑。 (2.2.4 Manufacturing steps of long strips) When producing a long sheet, first, the above-mentioned composition for protective film forming films, the composition for 1st release agent layers, and the composition for 2nd release agent layers are prepared. In the present embodiment, it is preferable to prepare a coating agent prepared by diluting the composition for protective film-forming films and the composition for releasing agent layers containing each of the above components with a diluting solvent, from the viewpoint of improving the coating properties by adjusting the viscosity.

作為稀釋溶劑,可列舉出甲苯等芳香族烴、乙酸乙酯等脂肪酸酯、甲基乙基酮等酮、己烷、庚烷等脂肪族烴等有機溶劑等。這些稀釋溶劑可以單獨使用一種,也可以同時使用兩種以上。Examples of the dilution solvent include aromatic hydrocarbons such as toluene, fatty acid esters such as ethyl acetate, ketones such as methyl ethyl ketone, organic solvents such as aliphatic hydrocarbons such as hexane and heptane, and the like. These dilution solvents may be used individually by 1 type, and may use 2 or more types together.

作為包含保護膜形成膜用組合物的塗佈劑的固體成分濃度,優選為20~80質量%,更優選為30~70質量%。另一方面,包含第一剝離劑層用組合物及第二剝離劑層用組合物的塗佈劑的固體成分濃度優選為0.3~10質量%,更優選為0.5~5質量%,進一步優選為0.5~3質量%。The solid content concentration of the coating agent containing the composition for forming a protective film is preferably 20 to 80% by mass, and more preferably 30 to 70% by mass. On the other hand, the solid content concentration of the coating agent containing the composition for the first release agent layer and the composition for the second release agent layer is preferably 0.3 to 10% by mass, more preferably 0.5 to 5% by mass, and still more preferably 0.5 to 3 mass %.

本實施方案中,利用公知的方法在基材的一個面上塗佈包含第一剝離劑層用組合物的塗佈劑後,藉由使該塗膜乾燥並固化,形成第一剝離劑層。由此得到第一剝離膜。也能夠以相同的方式製作第二剝離膜。In this embodiment, after coating the coating agent containing the composition for a 1st release agent layer on one surface of a base material by a well-known method, the 1st release agent layer is formed by drying and hardening this coating film. Thus, a first release film was obtained. The second release film can also be produced in the same manner.

然後,在基材的兩個主面上形成剝離劑層時,可以在基材的另一個面上塗佈剝離劑層用組合物的塗佈劑而形成。或者,也可以用下述方式形成:將塗佈剝離劑層用組合物的塗佈劑而形成的第一剝離膜捲繞成卷,並例如於30℃、保管7天等的期間,以利用上述的轉移現象,使剝離劑層用組合物的成分轉移至另一個面。Then, when forming a release agent layer on both main surfaces of a base material, it can coat and form the coating agent of the composition for release agent layers on the other surface of a base material. Alternatively, it may be formed by winding the first release film formed by applying the coating agent of the release agent layer composition into a roll, and storing it at 30° C. for a period of 7 days, for example, to use The above-mentioned transfer phenomenon causes the components of the release agent layer composition to transfer to the other surface.

本實施方案中,利用公知的方法將包含保護膜形成膜用組合物的塗佈劑塗佈於第一剝離膜的第一剝離劑層上、或第二剝離膜的第二剝離劑層上,然後進行加熱、乾燥而形成塗膜。接著,在該塗膜上貼合第二剝離膜的第二剝離劑層、或第一剝離膜的第一剝離劑層,製造保護膜形成用片(長條片)。本實施方案中,從使剝離力F1在上述範圍內的角度、及使F1>F2的角度出發,優選將包含保護膜形成膜用組合物的塗佈劑塗佈於第一剝離膜的第一剝離劑層上,而不是第二剝離劑層上。In this embodiment, the coating agent containing the composition for forming a protective film is applied on the first release agent layer of the first release film or the second release agent layer of the second release film by a known method, Then, heating and drying are performed to form a coating film. Next, the 2nd release agent layer of the 2nd release film, or the 1st release agent layer of the 1st release film is bonded together on this coating film, and the sheet (long sheet) for protective film formation is manufactured. In this embodiment, it is preferable to apply the coating agent containing the composition for protective film-forming films to the first part of the first release film from the viewpoint of making the peeling force F1 within the above-mentioned range and from the viewpoint of making F1>F2 on the release agent layer, not the second release agent layer.

作為包含各組合物的塗佈劑的塗佈方法,例如可例示出旋塗法、噴塗法、棒塗法、刮刀塗佈法、輥塗法、輥式刮刀塗佈法、刮板塗佈法、模塗法、凹版塗佈法。As a coating method of the coating agent containing each composition, for example, a spin coating method, a spray coating method, a bar coating method, a blade coating method, a roll coating method, a roll blade coating method, and a blade coating method can be exemplified , Die coating method, Gravure coating method.

(3.裝置的製造方法) 作為使用了藉由本實施方案的方法製造之保護膜形成用片卷的裝置的製造方法的一個實例,對製造藉由對貼附有保護膜形成膜的晶圓進行加工而得到的帶保護膜的晶片的方法進行說明。 (3. Manufacturing method of the device) As an example of a manufacturing method using an apparatus using the sheet roll for forming a protective film produced by the method of the present embodiment, a process for producing a protective film-attached wafer obtained by processing a wafer to which the protective film forming film is attached is produced. The wafer method will be described.

首先,如圖4所示,從保護膜形成用片卷100中將長條片1放卷,使用切割刀片50在長條片上形成貫穿第二剝離膜30及保護膜形成膜10、並到達至第一剝離膜20的一部分的切口40。藉由從形成了切口40的長條片中去除第二剝離膜及不要的保護膜形成膜,可得到圓形的保護膜形成膜。First, as shown in FIG. 4 , the long sheet 1 is unwound from the sheet roll 100 for forming a protective film, and the dicing blade 50 is used to form on the long sheet penetrating the second peeling film 30 and the protective film forming film 10 , reaching to The cutout 40 of a part of the first release film 20 . A circular protective film-forming film can be obtained by removing the second release film and the unnecessary protective-film-forming film from the elongated sheet on which the slits 40 are formed.

接著,如圖5A所示,將圓形的保護膜形成膜11貼附於作為工件的晶圓60的背面60b,如圖5B所示,從層疊體上剝離第一剝離膜20並將保護膜形成膜11保護膜化而形成保護膜15。接著,將具有保護膜的晶圓單顆化,得到帶保護膜的晶片。另外,可在將晶圓單顆化後進行保護膜化。Next, as shown in FIG. 5A , the circular protective film forming film 11 is attached to the back surface 60 b of the wafer 60 as a workpiece, and as shown in FIG. 5B , the first release film 20 is peeled off from the laminate and the protective film The forming film 11 is turned into a protective film to form a protective film 15 . Next, the wafer with a protective film is singulated to obtain a wafer with a protective film. In addition, the protective film can be formed after the wafers are singulated.

由於可抑制保護膜形成膜上的卷痕的形成,因此在保護膜的表面,痕跡也得以抑制。因此,可得到保護膜的外觀不良得以抑制之帶保護膜的晶片。Since the formation of curl marks on the protective film forming film can be suppressed, the marks can also be suppressed on the surface of the protective film. Therefore, the wafer with a protective film in which the appearance defect of a protective film is suppressed can be obtained.

(4.變形例) 圖3示出了下述構成:在第一剝離膜20中,在未與保護膜形成膜10相接的面20a上形成有第一剝離劑層23,在第二剝離膜30中,在未與保護膜形成膜10相接的面30b上未形成第二剝離劑層,但本實施方案並不限定於該構成。 (4. Modifications) FIG. 3 shows a configuration in which the first release agent layer 23 is formed on the surface 20 a not in contact with the protective film forming film 10 in the first release film 20 , and the second release film 30 is formed on the surface 20 a not in contact with the protective film forming film 10 . The second release agent layer is not formed on the surface 30b in contact with the protective film forming film 10, but the present embodiment is not limited to this configuration.

例如,也可以為下述構成:在第一剝離膜中,在未與保護膜形成膜相接的面上形成有第一剝離劑層,在第二剝離膜中,在未與保護膜形成膜相接的面上形成有第二剝離劑層。此外,還可以為下述構成:在第一剝離膜中,在未與保護膜形成膜相接的面上未形成第一剝離劑層,在第二剝離膜中,在未與保護膜形成膜相接的面上形成有第二剝離劑層。For example, in the first release film, a first release agent layer may be formed on the surface that is not in contact with the protective film forming film, and in the second release film, a film not formed with the protective film may be formed. A second release agent layer is formed on the contact surface. In addition, in the first release film, the first release agent layer may not be formed on the surface that is not in contact with the protective film forming film, and the second release film may have a configuration in which the film is not formed with the protective film. A second release agent layer is formed on the contact surface.

此外,圖4中,雖然用以形成欲貼附於工件的保護膜形成膜的切口為圓形,但只要為封閉形狀,則也可以為其他形狀。作為其他形狀,例如可例示出三角形等多邊形、橢圓形等。此外,優選封閉形狀與工件的形狀相對應。In addition, in FIG. 4, although the incision for forming the protective film forming film to be attached to the workpiece|work is circular, as long as it is a closed shape, other shapes may be sufficient. As other shapes, for example, a polygon such as a triangle, an ellipse, or the like can be exemplified. Furthermore, it is preferable that the closed shape corresponds to the shape of the workpiece.

以上,對本發明的實施方案進行了說明,但本發明並不受上述的實施方案的任何限定,可在本發明的範圍內以各種方式進行改變。 [實施例] The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments at all, and can be changed in various ways within the scope of the present invention. [Example]

以下,使用實施例對發明進行更詳細的說明,但本發明並不限定於這些實施例。Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples.

(第一剝離膜的製作) 首先,為了製備第一剝離劑層用組合物,準備下述的成分。 (α)矽氧類脫模劑 (α-1)含有具備乙烯基的有機聚矽氧烷及具備氫矽烷基(hydrosilyl group)的有機聚矽氧烷的矽氧類脫模劑(Dow Corning Toray Co., Ltd.製造,BY24-561,固體成分30質量%) (α-2)二甲基聚矽氧烷(Shin-Etsu Chemical Co., Ltd.製造,商品名稱:X-62-1387,重量平均分子量:2000) (β)矽氧樹脂 具備乙烯基的MQ樹脂(Dow Corning Toray Co., Ltd.製造,SD-7292,固體成分71質量%) (γ)催化劑 鉑(Pt)催化劑(Dow Corning Toray Co., Ltd.製造,SRX-212,固體成分100質量%) (Production of the first release film) First, in order to prepare the composition for 1st release agent layers, the following components were prepared. (α) Silicon oxide mold release agent (α-1) Silicone-based mold release agent (manufactured by Dow Corning Toray Co., Ltd., BY24- 561, solid content 30% by mass) (α-2) Dimethylpolysiloxane (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: X-62-1387, weight average molecular weight: 2000) (β) Silicone resin MQ resin with vinyl group (manufactured by Dow Corning Toray Co., Ltd., SD-7292, solid content 71% by mass) (γ) Catalyst Platinum (Pt) catalyst (manufactured by Dow Corning Toray Co., Ltd., SRX-212, solid content 100% by mass)

接著,摻合67.5質量份(固體成分比)的(α-1)、2.5質量份(固體成分比)的(α-2)、30質量份(固體成分比)的(β)及6.7質量份(固體成分比)的(γ)並進行混合,利用甲苯與甲基乙基酮的混合溶劑(甲苯/甲基乙基酮=1/1(質量比))以固體成分濃度為2質量%的方式進行稀釋,製備包含第一剝離劑層用組合物的塗佈劑。Next, 67.5 parts by mass (solid content ratio) of (α-1), 2.5 parts by mass (solid content ratio) of (α-2), 30 parts by mass (solid content ratio) of (β), and 6.7 parts by mass were blended (solid content ratio) (γ) and mixed, using a mixed solvent of toluene and methyl ethyl ketone (toluene/methyl ethyl ketone = 1/1 (mass ratio)) with a solid content concentration of 2 mass % Diluted in a manner to prepare a coating agent containing the composition for the first release agent layer.

將包含所製備的第一剝離劑層形成用組合物的塗佈劑以加熱、乾燥後的膜厚為0.15μm的方式塗佈在作為基材的PET膜(Mitsubishi Chemical Corporation製造,商品名稱:DIAFOIL(註冊商標)T-100,厚度:50μm)的兩個主面上,在PET膜的兩個主面上形成第一剝離劑層,製作第一剝離膜。The coating agent containing the prepared composition for forming a first release agent layer was coated on a PET film (manufactured by Mitsubishi Chemical Corporation, trade name: DIAFOIL) as a base material so that the film thickness after heating and drying was 0.15 μm. (registered trademark) T-100, thickness: 50 μm) on both main surfaces, a first release agent layer was formed on both main surfaces of a PET film to prepare a first release film.

(第二剝離膜的製作) 作為第二剝離膜,使用PET膜的一個面經過了剝離處理的膜(Lintec Corporation製造的「SP-PET381031」,厚度38μm)。 (Production of the second release film) As a 2nd peeling film, the film ("SP-PET381031" manufactured by Lintec Corporation, thickness 38 micrometers) whose one surface of a PET film was peeled was used.

(保護膜形成膜的製作) 以表1所示的摻合比(固體成分換算)混合以下的各成分,利用甲基乙基酮以固體成分濃度為50質量%的方式進行稀釋,製備包含保護膜形成膜用組合物的塗佈劑。 (A)聚合物成分 (A-1)將丙烯酸正丁酯55質量份、丙烯酸甲酯10質量份、甲基丙烯酸縮水甘油酯20質量份及丙烯酸2-羥基乙酯15質量份共聚而成的(甲基)丙烯酸酯共聚物(重量平均分子量:80萬、玻璃轉化溫度:-28℃) (A-2)將丙烯酸正丁酯27質量份、丙烯酸甲酯38質量份、甲基丙烯酸縮水甘油酯20質量份及丙烯酸2-羥基乙酯15質量份共聚而成的(甲基)丙烯酸酯共聚物(重量平均分子量:50萬、玻璃轉化溫度:-9℃) (B)固化性成分(熱固性成分) (B-1)雙酚A型環氧樹脂(Mitsubishi Chemical Corporation製造,jER828,環氧當量184~194g/eq) (B-2)丙烯酸酯橡膠微粒分散雙酚A型液狀環氧樹脂(NIPPON SHOKUBAI CO., LTD.製造,BPA328,環氧當量230g/eq,丙烯酸酯橡膠含量20phr) (B-3)雙環戊二烯型環氧樹脂(DIC CORPORATION製造,EPICLON HP-7200HH,軟化點88~98℃,環氧當量255~260g/eq) (C)固化劑:雙氰胺(Mitsubishi Chemical Corporation製造,DICY7) (D)固化促進劑:2-苯基-4,5-二羥甲基咪唑(SHIKOKU CHEMICALS CORPORATION製造,CUREZOL 2PHZ) (E)填充材料:環氧基修飾球狀二氧化矽填料(Admatechs公司製造,SC2050MA,平均粒徑0.5μm) (F)矽烷偶合劑:γ-縮水甘油醚氧基丙基三甲氧基矽烷(Shin-Etsu Chemical Co., Ltd.製造,KBM403,甲氧基當量12.7mmol/g,分子量236.3) (G)著色劑:碳黑(Mitsubishi Chemical Corporation製造,MA600B,平均粒徑28nm) (Production of protective film forming film) The following components were mixed at the blending ratio (in terms of solid content) shown in Table 1, and diluted with methyl ethyl ketone so that the solid content concentration might be 50% by mass to prepare a coating containing the composition for forming a protective film. Cloth. (A) Polymer component (A-1) (meth)acrylate obtained by copolymerizing 55 parts by mass of n-butyl acrylate, 10 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate, and 15 parts by mass of 2-hydroxyethyl acrylate Copolymer (weight average molecular weight: 800,000, glass transition temperature: -28°C) (A-2) (meth)acrylate obtained by copolymerizing 27 parts by mass of n-butyl acrylate, 38 parts by mass of methyl acrylate, 20 parts by mass of glycidyl methacrylate and 15 parts by mass of 2-hydroxyethyl acrylate Copolymer (weight average molecular weight: 500,000, glass transition temperature: -9°C) (B) Curable component (thermosetting component) (B-1) Bisphenol A epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER828, epoxy equivalent 184-194 g/eq) (B-2) Acrylate rubber microparticle-dispersed bisphenol A type liquid epoxy resin (manufactured by NIPPON SHOKUBAI CO., LTD., BPA328, epoxy equivalent 230 g/eq, acrylate rubber content 20 phr) (B-3) Dicyclopentadiene type epoxy resin (manufactured by DIC CORPORATION, EPICLON HP-7200HH, softening point 88~98°C, epoxy equivalent 255~260g/eq) (C) Curing agent: Dicyandiamide (manufactured by Mitsubishi Chemical Corporation, DICY7) (D) Curing accelerator: 2-phenyl-4,5-dimethylolimidazole (manufactured by SHIKOKU CHEMICALS CORPORATION, CUREZOL 2PHZ) (E) Filling material: Epoxy modified spherical silica filler (manufactured by Admatechs, SC2050MA, average particle size 0.5 μm) (F) Silane coupling agent: γ-glycidyloxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., KBM403, methoxyl equivalent 12.7 mmol/g, molecular weight 236.3) (G) Colorant: carbon black (manufactured by Mitsubishi Chemical Corporation, MA600B, average particle size 28 nm)

將包含所製備的保護膜形成膜用組合物的塗佈劑塗佈在製作的第一剝離膜的形成有第一剝離劑層的面上,於100℃乾燥2分鐘形成厚度為20μm的保護膜形成膜。接著,將準備的第二剝離膜的形成有第二剝離劑層的面貼附在保護膜形成膜上,由此得到在保護膜形成膜的一個主面上形成有第一剝離膜、在另一個主面上形成有第二剝離膜的保護膜形成用片(第一剝離膜/保護膜形成膜/第二剝離膜的結構體)。貼附條件為溫度60℃、壓力0.4MPa、速度1m/分鐘。The coating agent containing the prepared composition for forming a protective film was applied on the surface of the prepared first release film on which the first release agent layer was formed, and dried at 100° C. for 2 minutes to form a protective film having a thickness of 20 μm form a film. Next, the surface of the prepared second release film on which the second release agent layer is formed is attached to the protective film-forming film, whereby the first release film is formed on one main surface of the protective film-forming film, and the other is formed on the other main surface. A sheet for forming a protective film (a structure of a first peeling film/protective film forming film/second peeling film) having a second peeling film formed on one main surface. The attachment conditions were a temperature of 60° C., a pressure of 0.4 MPa, and a speed of 1 m/min.

(片卷的製作) 一邊使用雙軸捲繞分切機(TOIZAKI BUSSAN CO., LTD.製造)將得到的保護膜形成用片裁剪成寬320mm,一邊經由使用寬5mm、厚40μm的芯部固定膠帶,將裁剪的保護膜形成用片呈卷狀捲繞在中空狀的塑膠芯(芯部)上,該塑膠芯(芯部)具有與保護膜形成用片被裁剪的寬度相同的寬度(320mm)且直徑為3英寸。捲繞條件為用於控制捲繞時的張力的磁粉制動器的電流錶顯示0.25A的條件。捲繞的保護膜形成用片的長度為50m。裁剪速度為5m/分鐘。 (production of rolls) While cutting the obtained sheet for forming a protective film into a width of 320 mm using a biaxial winding slitter (manufactured by TOIZAKI BUSSAN CO., LTD.), the cutout was protected by a core fixing tape with a width of 5 mm and a thickness of 40 μm. The film-forming sheet is wound in a roll on a hollow plastic core (core) having the same width (320 mm) as the protective film-forming sheet is cut out and having a diameter of 3 inches . The winding condition is a condition in which the ammeter of the magnetic powder brake for controlling the tension during winding shows 0.25 A. The length of the sheet for protective film formation wound up was 50 m. The cutting speed is 5m/min.

藉由以下述所示的保管條件(模式1~4)保管捲繞的保護膜形成用片(實施例1~3及比較例1~2),由此得到保護膜形成用片卷。By storing the wound sheet for protective film formation (Examples 1 to 3 and Comparative Examples 1 to 2) under the storage conditions (patterns 1 to 4) shown below, a sheet roll for protective film formation was obtained.

模式1中,從捲繞後起於23℃靜置3天後,於5±4℃靜置40天,再次於23℃靜置17天(實施例1及比較例1)。模式2中,從捲繞後起於23℃靜置3天後,於5±4℃靜置50天,再次於23℃靜置7天(實施例2)。模式3中,從捲繞後起於23℃靜置3天後,於5±4℃靜置30天,再次於23℃靜置27天(實施例3)。模式4中,從捲繞後起於23℃靜置60天(比較例4)。In Mode 1, after being left at 23° C. for 3 days after winding, it was left at 5±4° C. for 40 days, and again at 23° C. for 17 days (Example 1 and Comparative Example 1). In mode 2, after being left at 23°C for 3 days after winding, it was left at 5±4°C for 50 days, and again at 23°C for 7 days (Example 2). In mode 3, after being left at 23°C for 3 days after winding, it was left at 5±4°C for 30 days, and again at 23°C for 27 days (Example 3). In Mode 4, it was left to stand at 23° C. for 60 days after winding (Comparative Example 4).

接著,進行下述的測定及評價。Next, the following measurement and evaluation were performed.

(10℃下的保護膜形成膜的損耗角正切tanδ 10) 從製作的保護膜形成用片中剝離第一剝離膜及第二剝離膜,並層疊多片保護膜形成膜,形成厚度為200μm±20μm的保護膜形成膜的層疊體。將該層疊體以寬度為4mm的方式切斷,得到測定用試樣。 (Loss tangent tanδ 10 of protective film forming film at 10° C.) The first release film and the second release film were peeled from the produced protective film forming sheet, and a plurality of protective film forming films were laminated to have a thickness of 200 μm± The protective film of 20 micrometers forms the laminated body of a film. This laminated body was cut|disconnected so that the width|variety might be 4 mm, and the sample for measurement was obtained.

使用黏彈性測定裝置(ORIENTEC Co., Ltd.製造的「RHEOVIBRON DDV-01FP」),對於上述的測定用試樣,以頻率11Hz、夾頭間距離15mm、升溫速度3℃/分鐘的測定條件在拉伸模式下測定-20℃~50℃的測定用試樣的tanδ,並根據這些值算出10℃下的損耗角正切tanδ 10。將實施例1~3及比較例1、2的試樣的測定結果示於表1。 Using a viscoelasticity measuring device (“RHEOVIBRON DDV-01FP” manufactured by ORIENTEC Co., Ltd.), the above-mentioned measurement samples were measured under the measurement conditions of a frequency of 11 Hz, a distance between chucks of 15 mm, and a heating rate of 3°C/min. The tanδ of the measurement sample at -20°C to 50°C was measured in the tensile mode, and the loss tangent tanδ 10 at 10°C was calculated from these values. Table 1 shows the measurement results of the samples of Examples 1 to 3 and Comparative Examples 1 and 2.

(剝離膜的剝離處理的有無的評價) 從得到的片卷中將保護膜形成用片放卷,在距保護膜形成用片藉由芯部固定膠帶被固定在塑膠芯上的起始部分1m的位置,沿寬度方向切取3處50mm×50mm的保護膜形成用片。 (Evaluation of presence or absence of peeling treatment of peeling film) From the obtained sheet roll, the sheet for forming a protective film was unwound, and at a position of 1 m from the starting part where the sheet for forming a protective film was fixed to the plastic core by the core fixing tape, three places of 50 mm × 50 mm were cut in the width direction. 50mm sheet for forming a protective film.

從切取的保護膜形成用片中剝離第一剝離膜及第二剝離膜,利用下述條件對第一剝離膜中未與保護膜形成膜貼合的面進行XPS測定。同樣地,利用下述條件對第二剝離膜中未與保護膜形成膜貼合的面進行XPS測定。對藉由切取保護膜形成用片而得到的3片第一剝離膜與3片第二剝離膜各進行1次XPS測定。 XPS裝置:ULVAC-PHI, INCORPORATED.製造的QuanteraSXM X射線:AlKα(1486.6eV) 取出角度:45° 測定元素:矽(Si)、碳(C)、氧原子(O) The 1st peeling film and the 2nd peeling film were peeled off from the sheet for protective film formation cut out, and the XPS measurement was performed on the surface which is not bonded to the protective film forming film in the first peeling film under the following conditions. Similarly, XPS measurement was performed on the surface not bonded to the protective film-forming film in the second release film under the following conditions. The XPS measurement was performed once for each of three first release films and three second release films obtained by cutting out the sheet for protective film formation. XPS unit: QuanteraSXM by ULVAC-PHI, INCORPORATED. X-ray: AlKα (1486.6eV) Take-out angle: 45° Determination elements: silicon (Si), carbon (C), oxygen atom (O)

根據得到的測定結果,對第一剝離膜及第二剝離膜,分別根據各測定元素量(XPS計數)算出下述所示的矽原子比率,並算出其平均值。 矽原子比率(原子%)=[(Si元素量)/[(C元素量)+(O元素量)+(Si元素量)]]×100 Based on the obtained measurement results, the silicon atomic ratio shown below was calculated from the amount of each measurement element (XPS count) for the first release film and the second release film, and the average value was calculated. Silicon atomic ratio (atomic %) = [(Si element amount)/[(C element amount) + (O element amount) + (Si element amount)]]×100

基於得到的平均值,利用以下的判定基準進行評價。將判定A及判定B的情況判斷為經過了剝離處理。將實施例1~3及比較例1、2的試樣的測定結果示於表1。 判定A:第一剝離膜及第二剝離膜中的至少一者的平均值為1.0原子%以上 判定B:不滿足判定A,第一剝離膜及第二剝離膜中的至少一者的平均值為0.1原子%以上且小於1.0原子% 判定C:第一剝離膜及第二剝離膜兩者的平均值小於0.1原子% Based on the obtained average value, evaluation was performed using the following judgment criteria. The cases of Judgment A and Judgment B were judged as having undergone the peeling process. Table 1 shows the measurement results of the samples of Examples 1 to 3 and Comparative Examples 1 and 2. Judgment A: The average value of at least one of the first release film and the second release film is 1.0 atomic % or more Judgment B: Judgment A is not satisfied, and the average value of at least one of the first release film and the second release film is 0.1 atomic % or more and less than 1.0 atomic % Judgment C: The average value of both the first release film and the second release film is less than 0.1 atomic %

準備塗佈包含保護膜形成膜用組合物的塗佈劑之前的第一剝離膜,並從第一剝離膜中以50mm×50mm的尺寸沿寬度方向切取3處。使用上述XPS裝置,利用與上述相同的條件對第一剝離膜的兩個主面中欲塗佈包含保護膜形成膜用組合物的塗佈劑的面進行剝離處理的有無的評價。其結果,對於第一剝離膜的試樣,確認到矽原子比率的3處平均值為1.0原子%以上。The 1st release film before coating the coating agent containing the composition for protective film-forming films was prepared, and cut out 3 places in the width direction from the 1st release film in the size of 50 mm x 50 mm. Using the said XPS apparatus, the presence or absence of a peeling process was evaluated with respect to the surface to which the coating agent containing the composition for protective film-forming films is to be applied among the two main surfaces of the first release film under the same conditions as described above. As a result, in the sample of the first release film, it was confirmed that the average value of the silicon atomic ratio was 1.0 atomic % or more in three places.

準備貼附於保護膜形成膜之前的第二剝離膜,並從第二剝離膜中以50mm×50mm的尺寸沿寬度方向切取3處。使用上述XPS裝置,利用與上述相同的條件對第二剝離膜的兩個主面中欲貼附於保護膜形成膜的面進行剝離處理的有無的評價。其結果,對於第二剝離膜的試樣,確認到矽原子比率的3處平均值為1.0原子%以上。The 2nd peeling film before sticking to the protective film formation film was prepared, and it cut out 3 places in the width direction from the 2nd peeling film in the size of 50 mm x 50 mm. Using the said XPS apparatus, the presence or absence of a peeling process was evaluated with respect to the surface to be attached to the protective film forming film among the two main surfaces of the 2nd peeling film under the same conditions as the above. As a result, in the sample of the second release film, it was confirmed that the average value of the silicon atomic ratio was 1.0 atomic % or more in three places.

(剝離膜的水的接觸角的評價) 從得到的片卷中將保護膜形成用片放卷,在距保護膜形成用片藉由芯部固定膠帶被固定在塑膠芯上的起始部分1m的位置,沿寬度方向切取3處50mm×50mm的保護膜形成用片。 (Evaluation of water contact angle of peeling film) From the obtained sheet roll, the sheet for forming a protective film was unwound, and at a position of 1 m from the starting part where the sheet for forming a protective film was fixed to the plastic core by the core fixing tape, three places of 50 mm × 50 mm were cut in the width direction. 50mm sheet for forming a protective film.

從切取的保護膜形成用片中剝離第一剝離膜及第二剝離膜,利用下述條件對第一剝離膜中未與保護膜形成膜貼合的面測定水的接觸角。同樣地,利用下述條件對第二剝離膜中未與保護膜形成膜貼合的面測定水的接觸角。對藉由切取保護膜形成用片而得到的3片第一剝離膜與3片第二剝離膜各進行5次水的接觸角的測定。 接觸角測定裝置:Kyowa Interface Science, Inc製造,全自動接觸角儀DM-701 滴加量:2μL 環境:溫度23℃、濕度50% The 1st peeling film and the 2nd peeling film were peeled off from the sheet for protective film formation cut out, and the contact angle of water was measured on the surface which is not bonded to the protective film forming film among the first peeling films under the following conditions. In the same manner, the contact angle of water was measured on the surface not bonded to the protective film-forming film in the second release film under the following conditions. The measurement of the contact angle of water was performed 5 times each about 3 sheets of 1st peeling films and 3 sheets of 2nd peeling films obtained by cutting out the sheet for protective film formation. Contact angle measuring device: Kyowa Interface Science, Inc., fully automatic contact angle meter DM-701 Dropping volume: 2μL Environment: temperature 23℃, humidity 50%

對第一剝離膜及第二剝離膜,分別算出得到的測定結果的平均值。基於得到的平均值,利用以下的判定基準進行評價。將判定A的情況判斷為經過了剝離處理。將實施例1~3及比較例1、2的試樣的測定結果示於表1。 判定A:第一剝離膜及第二剝離膜中的至少一者的平均值為78以上 判定C:第一剝離膜及第二剝離膜兩者的平均值為77以下 About the 1st peeling film and the 2nd peeling film, the average value of the obtained measurement result was computed, respectively. Based on the obtained average value, evaluation was performed using the following judgment criteria. In the case of determination A, it was determined that the peeling process was performed. Table 1 shows the measurement results of the samples of Examples 1 to 3 and Comparative Examples 1 and 2. Judgment A: The average value of at least one of the first release film and the second release film is 78 or more Judgment C: The average value of both the first release film and the second release film is 77 or less

(從保護膜形成膜上剝離第一剝離膜的剝離力F1) 從得到的保護膜形成用片中剝離第二剝離膜。利用熱層壓(70℃,1m/分鐘)將厚度為25μm的良黏合PET(TOYOBO Co., Ltd.製造,PET25A-4100)的良黏合面貼附在藉由剝離露出的保護膜形成膜的表面,從而製作層疊體樣品。將層疊體樣品裁切成100mm寬,製作測定用樣品。利用雙面膠帶將測定用樣品的第一剝離膜的背面固定於硬質支撐板。 (Peeling force F1 for peeling the first peeling film from the protective film forming film) The second release film was peeled off from the obtained sheet for forming a protective film. By thermal lamination (70° C., 1 m/min), the well-adhesive PET (PET25A-4100, manufactured by TOYOBO Co., Ltd.) with a thickness of 25 μm was attached to the protective film-forming film exposed by peeling. surface to produce laminate samples. The laminate sample was cut into a width of 100 mm to prepare a sample for measurement. The back surface of the 1st release film of the sample for a measurement was fixed to the hard support plate with the double-sided tape.

使用萬能型拉伸試驗機(Shimadzu Corporation製造,產品名稱「AUTOGRAPH(註冊商標)AG-IS」),以100mm的測定距離、180°的剝離角度、1m/分鐘的剝離速度將保護膜形成膜/良黏合PET的複合(一體型)體從第一剝離膜上剝離,並測定此時的荷重。將測定的荷重中除測定距離的最初10mm的荷重與最後10mm的荷重以外的80mm間的荷重的平均值作為剝離力F1。Using a universal tensile tester (manufactured by Shimadzu Corporation, product name "AUTOGRAPH (registered trademark) AG-IS"), the protective film was formed into a film/ The composite (integrated) body of the well-adhered PET was peeled off from the first release film, and the load at that time was measured. Among the measured loads, the average value of the loads between 80 mm except the load of the first 10 mm and the load of the last 10 mm of the measurement distance was taken as the peeling force F1.

(從保護膜形成膜上剝離第二剝離膜的剝離力F2) 將得到的保護膜形成用片裁切成100mm寬,製作測定用樣品。利用雙面膠帶將測定用樣品的第一剝離膜的背面固定於硬質支撐板。 (Peeling force F2 for peeling the second peeling film from the protective film forming film) The obtained sheet for forming a protective film was cut into a width of 100 mm to prepare a sample for measurement. The back surface of the 1st release film of the sample for a measurement was fixed to the hard support plate with the double-sided tape.

使用萬能型拉伸試驗機(Shimadzu Corporation製造,產品名稱「AUTOGRAPH(註冊商標)AG-IS」),以100mm的測定距離、180°的剝離角度、1m/分鐘的剝離速度將第二剝離膜從測定用樣品上剝離,並測定此時的荷重。將測定的荷重中除測定距離的最初10mm的荷重與最後10mm的荷重以外的80mm間的荷重的平均值作為剝離力F2。Using a universal tensile tester (manufactured by Shimadzu Corporation, product name "AUTOGRAPH (registered trademark) AG-IS"), the second release film was subjected to a measurement distance of 100 mm, a peeling angle of 180°, and a peeling speed of 1 m/min. The sample for measurement was peeled off, and the load at that time was measured. Among the measured loads, the average value of the loads between 80 mm except the load of the first 10 mm and the load of the last 10 mm of the measurement distance was taken as the peeling force F2.

對得到的剝離力F1及F2進行比較,確認到所有試樣的F1比F2大。The obtained peel forces F1 and F2 were compared, and it was confirmed that F1 was larger than F2 in all the samples.

(卷痕的評價) 從保管60天後的保護膜形成用片卷中將長條片由最外層以3m/分鐘的速度放卷,測定開始出現允許範圍外的卷痕的「距芯部的長度」。由5名判定員同時以肉眼確認是否為允許範圍外的卷痕,若3名判斷為允許範圍外,則判斷為允許範圍外的卷痕。將實施例1~3及比較例1、2的試樣的評價結果示於表1。 判定A:0米以上、小於4米 判定B:4米以上、小於6米 判定C:6米以上、小於8米 判定D:8米以上、小於10米 判定E:10米以上 (evaluation of curl marks) The long sheet was unwound at a speed of 3 m/min from the outermost layer from the roll for forming a protective film after storage for 60 days, and the "length from the core" at which a roll mark outside the allowable range began to appear was measured. Five judges simultaneously checked whether the curl marks were outside the allowable range with the naked eye, and when three judges judged that the curl marks were outside the allowable range, they were judged as curl marks outside the allowable range. Table 1 shows the evaluation results of the samples of Examples 1 to 3 and Comparative Examples 1 and 2. Judgment A: more than 0 meters, less than 4 meters Judgment B: more than 4 meters, less than 6 meters Judgment C: more than 6 meters, less than 8 meters Judgment D: more than 8 meters, less than 10 meters Judgment E: 10 meters or more

[表1]

Figure 02_image005
[Table 1]
Figure 02_image005

根據表1,可確認保護膜形成膜在10℃下的損耗角正切(tanδ 10)為1.2以下、且捲繞後的保護膜形成用片卷的保管條件滿足上述條件時,保護膜形成用片卷中的保護膜形成膜上的卷痕的形成得以抑制。 According to Table 1, when the loss tangent (tanδ 10 ) of the protective film forming film at 10° C. is 1.2 or less and the storage conditions of the roll for protective film forming after winding satisfies the above conditions, the protective film forming sheet The formation of roll marks on the protective film forming film in the roll is suppressed.

1:保護膜形成用片 10,11:保護膜形成膜 10a,10b,20b,30a:主面15:保護膜 20:第一剝離膜 20a,30b:面 21:基材 22,23:第一剝離劑層 30:第二剝離膜 31:基材 32:第二剝離劑層 40:切口 50:切割刀片 60:晶圓 60b:背面 70:芯部 80:固定工具 100:保護膜形成用片卷 IB:部分 1: Sheet for forming protective film 10,11: Protective film forming film 10a, 10b, 20b, 30a: main surface 15: protective film 20: First release film 20a, 30b: face 21: Substrate 22, 23: First release agent layer 30: Second release film 31: Substrate 32: Second release agent layer 40: Cut 50: Cutting Blade 60: Wafer 60b: Back 70: Core 80: Fixing tools 100: Sheet roll for forming protective film IB: Part

圖1A為本實施方案的保護膜形成用片卷的一個實例的立體示意圖。 圖1B為圖1A的IB部分的放大截面示意圖。 圖2為本實施方案的保護膜形成用片的一個實例的截面示意圖。 圖3為示出第一剝離膜及第二剝離膜具有第一剝離劑層及第二剝離劑層的截面示意圖。 圖4為從本實施方案的保護膜形成用片卷中放卷並形成有切口的長條片的立體示意圖。 圖5A為示出保護膜形成膜與第一剝離膜的層疊體貼附於工件的截面示意圖。 圖5B為示出貼附於工件的保護膜形成膜被保護膜化的截面示意圖。 1A is a schematic perspective view of an example of the sheet roll for forming a protective film of the present embodiment. FIG. 1B is an enlarged schematic cross-sectional view of portion IB of FIG. 1A . 2 is a schematic cross-sectional view of an example of the protective film-forming sheet of the present embodiment. 3 is a schematic cross-sectional view showing that a first release film and a second release film have a first release agent layer and a second release agent layer. 4 : is a perspective schematic diagram of the elongate sheet|seat in which the slit was formed by unwinding from the sheet roll for protective film formation of this embodiment. 5A is a schematic cross-sectional view showing that a laminate of a protective film forming film and a first release film is attached to a workpiece. 5B is a schematic cross-sectional view showing that the protective film-forming film attached to the workpiece is formed into a protective film.

1:保護膜形成用片 1: Sheet for forming protective film

100:保護膜形成用片卷 100: Sheet roll for forming protective film

IB:部分 IB: Part

Claims (5)

一種保護膜形成用片卷的製造方法,其具有:將捲繞具有保護膜形成膜、設置在所述保護膜形成膜的一個面上的第一剝離膜、及設置在所述保護膜形成膜的另一個面上的第二剝離膜的長條片而形成的片卷,自形成所述片卷形成後起60天之中,於10℃以下的保管溫度保管25天以上的步驟, 將從所述保護膜形成膜上剝離所述第一剝離膜的剝離力設為F1,將從所述保護膜形成膜上剝離所述第二剝離膜的剝離力設為F2時,滿足F1>F2的關係, 將10℃下的所述保護膜形成膜的損耗角正切設為tanδ 10時,tanδ 10為1.2以下。 A method for producing a sheet roll for forming a protective film, comprising: winding a protective film forming film, a first release film provided on one surface of the protective film forming film, and a first release film provided on the protective film forming film The sheet roll formed by the long piece of the second peeling film on the other side of the sheet, the step of storing at a storage temperature of 10°C or less for 25 days or more within 60 days after the formation of the sheet roll, will be removed from the When the peeling force for peeling off the first release film from the protective film forming film is F1, and the peeling force for peeling the second peeling film from the protective film forming film is F2, F1>F2 is satisfied. In relation, when the loss tangent of the protective film forming film at 10° C. is tanδ 10 , tanδ 10 is 1.2 or less. 如請求項1所述的保護膜形成用片卷的製造方法,其中,自形成所述片卷後10天之內開始進行於10℃以下的保管溫度進行保管的步驟。The manufacturing method of the sheet roll for protective film formation according to claim 1, wherein the step of storing at a storage temperature of 10° C. or lower is started within 10 days after the sheet roll is formed. 如請求項1或2所述的保護膜形成用片卷的製造方法,其中,所述保管溫度為-10℃以上。The manufacturing method of the sheet roll for protective film formation as described in Claim 1 or 2 whose said storage temperature is -10 degreeC or more. 如請求項1~3中任一項所述的保護膜形成用片卷的製造方法,其中,在所述第一剝離膜和/或所述第二剝離膜中,未與所述保護膜形成膜相接的面經過了剝離處理。The method for producing a sheet roll for forming a protective film according to any one of claims 1 to 3, wherein the first release film and/or the second release film is not formed with the protective film The side where the films meet is peeled off. 如請求項1~4中任一項所述的保護膜形成用片卷的製造方法,其中,tanδ 10為0.04以上。 The manufacturing method of the sheet roll for protective film formation in any one of Claims 1-4 whose tan delta 10 is 0.04 or more.
TW110129612A 2020-08-12 2021-08-11 Method for manufacturing protective film forming roll which is produced by winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film TW202218868A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-136455 2020-08-12
JP2020136455A JP7448442B2 (en) 2020-08-12 2020-08-12 Manufacturing method of sheet roll for forming protective film

Publications (1)

Publication Number Publication Date
TW202218868A true TW202218868A (en) 2022-05-16

Family

ID=80283136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110129612A TW202218868A (en) 2020-08-12 2021-08-11 Method for manufacturing protective film forming roll which is produced by winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film

Country Status (4)

Country Link
JP (1) JP7448442B2 (en)
KR (1) KR20220020769A (en)
CN (1) CN114075413A (en)
TW (1) TW202218868A (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009256458A (en) 2008-04-16 2009-11-05 Hitachi Chem Co Ltd Pressure-sensitive adhesive sheet and method for manufacturing semiconductor device
JP4956560B2 (en) 2009-01-14 2012-06-20 古河電気工業株式会社 Wafer processing tape roll packaging method
JP2012044193A (en) 2011-09-15 2012-03-01 Toray Ind Inc Adhesive sheet for semiconductor device, component for semiconductor device and semiconductor device using the same
JP2016111165A (en) 2014-12-04 2016-06-20 古河電気工業株式会社 Tape for wafer processing
JP2017145735A (en) 2016-02-17 2017-08-24 日立オートモティブシステムズ株式会社 Control device for internal combustion engine and warming-up method for exhaust emission control catalyst
MY186890A (en) 2016-02-24 2021-08-26 Lintec Corp Adhesive sheet and usage method therefor
JP6852030B2 (en) 2018-09-25 2021-03-31 古河電気工業株式会社 Electronic device packaging tape

Also Published As

Publication number Publication date
CN114075413A (en) 2022-02-22
JP7448442B2 (en) 2024-03-12
JP2022032572A (en) 2022-02-25
KR20220020769A (en) 2022-02-21

Similar Documents

Publication Publication Date Title
TWI675900B (en) Composite sheet for forming protective film
TWI634187B (en) Protective film forming film, protective film forming sheet, and inspection method
TWI706023B (en) Sheet for forming protective film and method of manufacturing tip having protective film
TWI666236B (en) Protective film forming film, protective film forming sheet, protective film forming composite sheet, and method for manufacturing processed product
TWI671338B (en) Film for forming protective film, composite film for forming protective film
TWI664688B (en) Protective film forming film, protective film forming sheet, protective film forming composite sheet, and inspection method
TWI702643B (en) Plates for semiconductor processing
JP2019096913A (en) Sheet for resin film formation and composite sheet for resin film formation
TW202206279A (en) Protection-film forming sheet and method for processing protection-film forming sheet comprising a protection-film forming film and a first peeling film that is disposed on one major surface of the protection-film forming film in a peelable manner
TW202218868A (en) Method for manufacturing protective film forming roll which is produced by winding the long strips of the protective film forming film, the first release film provided on one surface of the protective film forming film, and the second release film provided on the other surface of the protective film forming film
JP7453879B2 (en) Protective film forming sheet roll and protective film forming sheet roll manufacturing method
JP7448441B2 (en) Protective film forming sheet and manufacturing method thereof
JP7277380B2 (en) Adhesive films for semiconductors and adhesive sheets for semiconductors
TW202218869A (en) Protective film forming sheet and manufacturing method thereof capable of sufficiently suppressing defects in scrap removal even when the cut width in a hole punching process is relatively narrow
TW202238699A (en) Support sheet, composite sheet for forming protective film, and manufacturing method of device wherein the support sheet is capable of taking into account of both poor drawing out of the sheet and identifiability of laser marking when viewed through a substrate
TW202124157A (en) Film for forming protective film, composite sheet for forming protective film, and production method of small piece with protective film
CN115851144A (en) Protective film forming film, protective film forming sheet, protective film forming composite sheet, rework method, and device manufacturing method
JP2019135753A (en) Adhesive sheet and method for manufacturing semiconductor device