TW202212139A - 含有透明高耐熱薄膜之積層體 - Google Patents
含有透明高耐熱薄膜之積層體 Download PDFInfo
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Applications Claiming Priority (4)
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| JP2020094845 | 2020-05-29 | ||
| JP2020-094845 | 2020-05-29 | ||
| JP2020186386 | 2020-11-09 | ||
| JP2020-186386 | 2020-11-09 |
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| TW202212139A true TW202212139A (zh) | 2022-04-01 |
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| TW110119365A TW202212139A (zh) | 2020-05-29 | 2021-05-28 | 含有透明高耐熱薄膜之積層體 |
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| US (1) | US20230173800A1 (https=) |
| EP (1) | EP4159431A4 (https=) |
| JP (1) | JPWO2021241570A1 (https=) |
| KR (1) | KR20220166332A (https=) |
| CN (1) | CN115551713B (https=) |
| TW (1) | TW202212139A (https=) |
| WO (1) | WO2021241570A1 (https=) |
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| FR200E (https=) | ||||
| JPS534490B2 (https=) | 1973-06-04 | 1978-02-17 | ||
| JP5152104B2 (ja) * | 2009-06-08 | 2013-02-27 | 東洋紡株式会社 | 積層体およびその製造方法 |
| JP5304490B2 (ja) | 2009-07-02 | 2013-10-02 | 東洋紡株式会社 | 積層体およびその製造方法 |
| WO2012050072A1 (ja) * | 2010-10-13 | 2012-04-19 | 東洋紡績株式会社 | ポリイミドフィルムとその製造方法、積層体の製造方法 |
| WO2012141293A2 (ja) * | 2011-04-15 | 2012-10-18 | 東洋紡績株式会社 | 積層体とその製造方法および、この積層体を用いたデバイス構造体の作成方法 |
| JP5224011B2 (ja) * | 2011-04-15 | 2013-07-03 | 東洋紡株式会社 | 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法 |
| JP2013226784A (ja) * | 2012-03-27 | 2013-11-07 | Toyobo Co Ltd | 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法 |
| JP6580808B2 (ja) | 2012-06-19 | 2019-09-25 | 日鉄ケミカル&マテリアル株式会社 | 表示装置及びその製造方法 |
| JP6363077B2 (ja) * | 2013-07-24 | 2018-07-25 | ユニチカ株式会社 | 積層体およびその処理法ならびにフレキシブルデバイスの製造方法 |
| JP6332617B2 (ja) * | 2014-04-16 | 2018-05-30 | 東洋紡株式会社 | ポリイミド前駆体フィルム層/無機基板積層体、およびその製造方法、ポリイミドフィルム層/無機基板積層体の製造方法、およびフレキシブル電子デバイスの製造方法 |
| US10155864B2 (en) * | 2014-05-24 | 2018-12-18 | Kaneka Corporation | Alkoxysilane-modified polyamic acid solution, laminate and flexible device using same, polyimide film, and production method for laminate |
| JP6571094B2 (ja) * | 2014-09-19 | 2019-09-04 | ユニチカ株式会社 | 積層体およびフレキシブルデバイスの製造方法 |
| JP6966847B2 (ja) * | 2016-08-10 | 2021-11-17 | 日鉄ケミカル&マテリアル株式会社 | 透明ポリイミドフィルムの製造方法 |
| CN107722268B (zh) * | 2016-08-10 | 2021-12-21 | 日铁化学材料株式会社 | 聚酰亚胺前体、聚酰亚胺及透明聚酰亚胺膜的制造方法 |
| US11274182B2 (en) * | 2017-05-11 | 2022-03-15 | Kaneka Corporation | Poly(amic acid), poly(amic acid) solution, polyimide, polyimide film, layered product, flexible device, and production method for polyimide film |
| CN111527150B (zh) * | 2017-12-26 | 2023-05-30 | 株式会社钟化 | 聚酰胺酸组合物及其制造方法、聚酰亚胺薄膜、层叠体及其制造方法、及挠性装置 |
| KR102013534B1 (ko) * | 2018-12-24 | 2019-08-22 | 에스케이씨코오롱피아이 주식회사 | 디스플레이 기판 제조용 폴리아믹산 조성물 및 이를 이용하여 디스플레이용 기판을 제조하는 방법 |
| KR102097431B1 (ko) * | 2019-05-13 | 2020-04-07 | 에스케이씨코오롱피아이 주식회사 | 폴리이미드 및 이의 제조 방법 |
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2021
- 2021-05-25 US US17/995,239 patent/US20230173800A1/en not_active Abandoned
- 2021-05-25 CN CN202180034225.7A patent/CN115551713B/zh active Active
- 2021-05-25 KR KR1020227039210A patent/KR20220166332A/ko not_active Ceased
- 2021-05-25 JP JP2022526576A patent/JPWO2021241570A1/ja active Pending
- 2021-05-25 WO PCT/JP2021/019786 patent/WO2021241570A1/ja not_active Ceased
- 2021-05-25 EP EP21812566.4A patent/EP4159431A4/en not_active Withdrawn
- 2021-05-28 TW TW110119365A patent/TW202212139A/zh unknown
Also Published As
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|---|---|
| CN115551713B (zh) | 2025-03-21 |
| KR20220166332A (ko) | 2022-12-16 |
| EP4159431A4 (en) | 2024-07-03 |
| WO2021241570A1 (ja) | 2021-12-02 |
| CN115551713A (zh) | 2022-12-30 |
| EP4159431A1 (en) | 2023-04-05 |
| JPWO2021241570A1 (https=) | 2021-12-02 |
| US20230173800A1 (en) | 2023-06-08 |
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