TW202206768A - A high-power vapor chamber structure manufacturing method - Google Patents

Abstract

A high-power vapor chamber structure manufacturing method includes following steps: providing a first plate having a first support structure; providing a second plate having a second support structure; deploy a wick paste and cover the first support structure and the second support structure separately; heating the wick paste to form a first wick structure and a second wick structure; sealing the edge of the first plate and the second plate to form a vapor chamber structure The present invention solved the problem of the uneven distribution of the working fluid on both side of the high-power vapor chamber structure. The invention improves the technical problems of the mutual connection of wick structures on the upper and lower sides of the high-power vapor chamber and the intercommunication of liquid-phase working fluid, so as to make the manufacturing of high-power vapor chamber devices more convenient and suitable for mass production.

Description

A kind of manufacturing method of high-power uniform temperature plate structure

The present invention provides a method for manufacturing a high-power vapor chamber structure, particularly a method for manufacturing a high-power vapor chamber structure with capillary structures on both sides.

Vapor chamber is a thermal energy transfer structural element used in electronic equipment, which is used for heat conduction and cooling. It includes two substrates, and a flat closed cavity is formed between the substrates. The closed cavity is provided with a capillary structure and accommodates the working fluid. The working principle of the vapor chamber is that when part of the vapor chamber is in contact with the heat source, the working fluid at the end of the vapor chamber absorbs the heat energy of the heat source and changes from the liquid phase to the vapor phase to release latent heat. ). Then, the gas-phase working fluid flows rapidly toward the condensation end (Condenser) away from the heat source. When the working fluid in the gas phase flows to the condensation end in the closed cavity, the working fluid changes from the gas phase to the liquid phase, and flows back to the endothermic end by the capillary force of the capillary structure. Through the phase change of the working fluid during heat absorption and heat release, the vapor chamber quickly absorbs a large amount of heat energy generated by the hot spot of electronic components, so that the heat energy is quickly dispersed to achieve the temperature uniformity effect.

When the power of electronic components is high, it will lead to the rapid accumulation of heat energy in local areas and the formation of hot spots. When the vapor chamber is used as an antipyretic and heat-conducting element, capillary structures are usually arranged on both flat substrates of the vapor chamber, so as to improve the heat conduction efficiency of the vapor chamber. However, the heat source of electronic components is often only in contact with one substrate of the vapor chamber, and the process in the capillary structure of the other substrate is As a fluid, it is more difficult to carry out gas-liquid circulation.

Therefore, how to solve the problem of uneven distribution of the working fluid in the capillary structure, save labor costs, and improve the efficiency of mass production of high-power vapor chamber components is an extremely urgent problem to be solved in the field of vapor chamber fabrication.

In view of this, the present invention proposes a method for manufacturing a high-power temperature equalizing plate structure. The capillary structures of the upper and lower cover plates are designed to be connected, so that the liquid-phase working fluid on the non-contact heat source surface can also flow back to the heat absorption area of the contact heat source surface, so as to solve the problem. The problem of uneven distribution of the working fluid on both sides of the high-power vapor chamber and easy collapse and deformation is solved. In addition, the present invention manufactures the capillary structure on the support column by means of printing paste, thus greatly improving the automation of mass production and reducing the production cost.

The present invention provides a method for manufacturing a high-power vapor chamber structure. The steps include: providing a first substrate with a first support structure on a first surface of the first substrate; providing a second substrate on a second surface of the second substrate There is a second support structure corresponding to the first support structure; respectively laying and covering a capillary structure slurry on the first support structure and the second support structure; heating the capillary structure slurry to form a first support structure covering the first support structure a capillary structure, and a second capillary structure covering the second support structure; and sealing the periphery of the first substrate and the second substrate to form an isothermal plate structure, and the first support structure and the second support structure pass through the first capillary The structure and the second capillary structure abut each other.

Wherein, the step of respectively laying the capillary structure slurry further includes the following sub-steps: respectively laying the capillary structure slurry on the first surface and the second surface, and the capillary structure slurry coats the first support structure and the second support structure.

Wherein, the step of heating the capillary structure slurry further includes the following sub-steps: heating the capillary structure slurry to form a first capillary structure covering the first surface and covering the first support structure, and covering the second surface and covering the second capillary structure The second capillary structure of the support structure.

Wherein, the manufacturing method of the present invention further comprises the following steps: laying copper powder on the first surface; and sintering the copper powder to form a first copper powder sintered capillary structure covering the first surface and connecting the first capillary structure.

Wherein, the step of providing the first substrate further includes the following sub-steps: providing a first substrate with a first groove on the first surface; patterning a support structure paste in the first groove; and heating the support structure paste to form a patterned first support structure.

Wherein, the first support structure is further a first patterned metal support structure.

Wherein, the capillary structure slurry further includes metal powder, a solvent and a polymer, and the step of heating the capillary structure slurry further includes the following sub-steps: heating and baking the capillary structure slurry to remove the solvent to form a solidified body; heating the solidified body to crack and remove the polymer; and heat and sinter the metal powder to form a first capillary structure that coats the first support structure, and a second capillary structure that coats the second support structure.

In a specific embodiment, a method for manufacturing a high-power vapor chamber structure further includes the following steps: annularly laying a dense wall slurry on the periphery of the first substrate to form a slurry wall; heating the slurry wall to form a slurry wall A dense structure wall is formed, and a first groove is formed in the dense structure wall.

Wherein, in the manufacturing method of the present invention, after the step of sealing the periphery of the first substrate and the second substrate, the following steps are further included: injecting a working fluid into the vapor chamber structure; extracting the air in the vapor chamber structure to form a containing working fluid, a first capillary structure and a second One of the capillary structures is a negative pressure cavity; and a hermetically sealed vapor chamber structure.

Wherein, the vapor chamber structure is used for further processing to manufacture a vapor chamber.

In summary, the present invention provides a method for manufacturing a high-power vapor chamber structure with capillary structures on both sides. The support structure between the two substrates prevents the two substrates from being deformed and collapsed due to the difference in air pressure. . In addition, the working fluid can effectively flow between the two substrates to increase the efficiency of heat conduction and heat convection, so as to effectively achieve the functions of heat conduction, heat dissipation, heat dissipation and temperature uniformity.

1: The first substrate

11: The first surface

12: The first support structure

2: Second substrate

21: Second surface

22: Second support structure

3: capillary structure slurry

31: The first capillary structure

32: Second capillary structure

33: Steel plate

34: Scraper

35: Cured body

4: Copper powder

41: The first copper powder sintered capillary structure

42: Second copper powder capillary structure

5: Vapor chamber structure

51: Endothermic end

52: Condensing end

6: Support structure slurry

61: Columnar support structure

62: Wall Support Structure

S1~S9: Steps

S11~S13: Substeps

S31: Substep

S41~S44: Substeps

S3', S4': Steps

S91: Steps

FIG. 1 is a flow chart showing the steps of an embodiment of the present invention.

FIG. 2 is a schematic diagram according to the flow chart of FIG. 1 .

FIG. 3 is a flow chart of steps according to another embodiment of FIG. 1 .

FIG. 4 is a schematic diagram according to the process shown in FIG. 3 .

FIG. 5 is a flow chart showing the steps of another specific embodiment of the present invention.

FIG. 6 is a schematic diagram according to the flowchart of FIG. 5 .

FIG. 7 is a flow chart showing the steps of another specific embodiment of the present invention.

8 is a top view of the first substrate and the second substrate of the vapor chamber according to an embodiment of the present invention.

FIG. 9 is a top view of the first substrate and the second substrate of the vapor chamber according to another embodiment of the present invention.

FIG. 10 is a flow chart showing the steps of another specific embodiment of the present invention.

FIG. 11 is a schematic diagram according to the flow of FIG. 10 .

12 is a flow chart showing further steps of the method for manufacturing the capillary structure of the vapor chamber according to another embodiment of the present invention.

FIG. 13 is a flow chart showing further steps of the method for manufacturing the capillary structure of the vapor chamber according to another embodiment of the present invention.

In order for the advantages, spirit and features of the present invention to be more easily and clearly understood, the following will be detailed and discussed with reference to the accompanying drawings by way of embodiments. It should be noted that these embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding embodiments.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal, lateral, upper, lower, front, rear, left, right, top, bottom, inner, outer" etc. is based on the drawings. The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, rather than indicating that the described device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

Furthermore, the indefinite articles "a", "an" and "an" preceding a device or element of the present invention are not limiting on the quantitative requirement (ie, the number of occurrences) of the device or element. Thus "a" should be read to include one or at least one, and a device or element in the singular also includes the plural unless the number clearly refers to the singular.

For convenience of description, the drawings (as shown in FIG. 2 , FIG. 4 , and FIG. 6 ) and the embodiments in the following sections take the first substrate and the first support structure as examples. Unless otherwise stated, the second substrate and the second support structure are the same process or structure as the first substrate.

In an embodiment of manufacturing a high-power temperature uniformity plate element, the high-power temperature uniformity plate element The thickness of the piece is between 1.0mm and 3.0mm, and a copper substrate with a recessed groove structure is produced by stamping. A plurality of copper support columns are prefabricated; a plurality of annular sintered capillary structures with the same height as the copper support columns are also prefabricated, and then the annular capillary structures are wrapped around the copper support columns one by one to form a copper support column with a capillary structure. Then, copper support pillars with capillary structures are patterned one by one on the substrate. Finally, copper powder is placed in the concave groove structure of the two copper substrates and sintered to form a porous capillary structure. However, in this embodiment, the step of inserting the ring-shaped capillary structure into the copper support column or the step of patterning the copper support column is very difficult to realize automatic production, which is labor-intensive and high cost.

Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a flow chart showing the steps of a method for manufacturing a capillary structure of a vapor chamber according to an embodiment of the present invention. FIG. 2 is a schematic diagram according to the flow chart of FIG. 1 . As shown in FIG. 1 and FIG. 2 , the manufacturing method of the high-power vapor chamber structure of the present invention is applied to manufacture the capillary structure support column of the vapor chamber element. The manufacturing method includes the following steps: Step S1 : providing a first substrate 1 , a first support structure 12 is provided on the first surface 11 of the first substrate. Step S2 : providing a second substrate 2 with a second support structure 22 corresponding to the first support structure 12 on the second surface 21 of the second substrate. Step S3 : respectively laying and coating the capillary structure slurry 3 on the first support structure 12 and the second support structure 22 . Step S4 : heating the capillary structure slurry 3 to form a first capillary structure 31 covering the first support structure 11 and a second capillary structure 32 covering the second support structure 22 . Step S5 : sealing the periphery of the first substrate 11 and the second substrate 21 to form the temperature chamber structure 5 , and the first support structure 12 and the second support structure 22 abut against each other through the first capillary structure 31 and the second capillary structure 32 . Wherein, in step S5, before sealing the first substrate and the second substrate, capillary structures have been formed on the respective inner surfaces of the first substrate and the second substrate.

In-depth explanation of the step flow is shown in FIG. 2 . First, a plurality of first support structures 12 are disposed on the first surface 11 of the first substrate 1 . Next, the steel plate 33 is placed on the first substrate 1 , and the capillary structure slurry 3 is scraped in the direction of the arrow using the scraper 34 . At this time, the capillary structure slurry 3 will pass through the holes on the steel plate 33 and then be laid on the outer layer of the first support structure 12 . After the placement is completed, the first support structure 12 whose outer layer contains the capillary structure slurry 3 is heated, baked and sintered at different temperatures. Finally, the first capillary structure 31 is formed. Wherein, the second support structure 22 of the second substrate 2 and the first support structure 12 of the first substrate have the same process or structure.

When the capillary structures of the first substrate 1 and the second substrate 2 are connected to each other, capillary channels that can transport the liquid-phase working fluid are created. The capillary channel enables the liquid-phase working fluid in the condensing zone capillary structure on the substrate not contacting the heat source to flow back into the heat-absorbing zone capillary structure on the substrate contacting the heat source, so that the working fluid changes to gas phase again.

In the present invention, the support structure of the capillary structure slurry is laid on the surface of the substrate to form the capillary structure of the temperature chamber. Compared with the above-mentioned embodiment of prefabricating and sheathing the copper support column and the annular sintered capillary structure, the capillary force of the present invention is also better than that of the capillary structure formed of copper powder. Therefore, the present invention increases the heat conduction efficiency of the vapor chamber, thereby having better heat dissipation effect, saving labor costs, improving product yield and improving production yield.

Furthermore, the first substrate 1 may be copper or copper metal. The capillary structure paste 3 contains copper powder, organic solvent, copper oxide powder and polymer. During heating and baking, the organic solvent and polymer in the capillary structure slurry 3 will be removed first, and then the first capillary structure 31 is formed by heating and sintering. The organic solvent and the polymer form a colloid for dispersing and suspending the copper powder to form the capillary structure slurry 3, so as to facilitate the first substrate 1 or the first support structure 12 on the first surface of the first substrate 1, The capillary structure slurry 3 is laid and processed to form the first capillary structure 31 . Organic solvents can It is an alcohol solvent, and the polymer can be a natural resin (Natural Resin) or a synthetic resin (Synthetic Resin).

The above embodiments describe the method of laying the capillary structure on the support structure. However, the present invention is not limited to the method of laying the capillary structure on the surface of the substrate, and copper mesh, copper powder, etc. can also be used for laying. In yet another specific embodiment, the manner of laying the capillary structure on the surface of the substrate is as follows. Please refer to FIG. 3 and FIG. 4 . FIG. 3 is a flow chart of steps according to another specific embodiment of FIG. 1 . FIG. 4 is a schematic diagram according to the process shown in FIG. 3 . In this embodiment, the method for fabricating the capillary structure of the vapor chamber further includes the following steps, step S6 : laying the copper powder 4 on the first surface 11 . Step S7 : sintering the copper powder 4 to form the first copper powder sintering capillary structure 41 covering the first surface 11 and connecting the first capillary structure 31 . The process of this embodiment is to perform step S1 , step S2 , step S3 and step S4 in sequence, and then perform step S6 and step S7 . Finally, step S5 is performed again.

As shown in FIG. 4 , first, a plurality of first support structures 12 are disposed on the first surface 11 of the first substrate 1 . The steel plate 33 is placed on the first substrate 1 . Next, the capillary structure paste 3 is scraped by stencil printing using a doctor blade 34 . At this time, the capillary structure slurry 3 will pass through the holes on the steel plate 33 and then be laid on the outer layer of the first support structure 12 . After the laying is completed, the first support structure 12 whose outer layer contains the capillary structure slurry 3 is heated, baked and sintered at different temperatures. The first capillary structure 31 is formed. Next, the copper powder 4 is placed on the first surface 11 of the first substrate 1 to perform heating, baking and sintering at different temperatures, thereby forming the first copper powder sintered capillary structure 41 . Wherein, the second support structure 22 of the second substrate and the first support structure 12 of the first substrate are of the same process or structure. The above-mentioned copper powder 4 is heated to form a first copper powder sintered capillary structure 41 . Using the copper powder 4 to sinter into the first copper powder sintered capillary structure 41 has low material cost, but requires additional laying and fabrication. process, high energy consumption, and the thickness of the copper powder capillary structure is small. In addition, the first copper powder sintered capillary structure 41 and the first capillary structure 31 are continuous planes, so that the working fluid can be continuously transported in the vapor chamber.

In addition to the above-mentioned manufacturing methods, for this purpose, those skilled in the art can adjust the most suitable manufacturing method by themselves, and the above-mentioned order is not limited. The sequence of step S1, step S2, step S6, step S7, step S3, step S4, step S5 can also be used, that is, step S6 is first performed to lay copper powder on the first surface of the first substrate and step S7 is performed. After sintering, step S3 of laying the capillary structure slurry on the first support structure is performed.

In another specific embodiment, the capillary structure slurry 3 is used to lay the substrate surface and the supporting structure at the same time. The detailed steps are described in the following embodiments. Please refer to FIG. 5 and FIG. 6 together. FIG. 5 is a flow chart illustrating the steps of another specific embodiment of the present invention. FIG. 6 is a schematic diagram according to the flowchart of FIG. 5 . As shown in FIG. 5 and FIG. 6 , the laying step S3 further includes the following sub-steps: Step S31 : laying the capillary structure slurry 3 on the first surface 11 and the second surface 21 respectively, and the capillary structure slurry The material 3 covers the first support structure 12 and the second support structure 22 . In addition, the heating step S4 further includes the following sub-steps: step S41 : heating the capillary structure slurry 3 to form a first capillary structure 31 covering the first surface 11 and covering the first support structure 12 , and covering the second surface 21 and The second capillary structure 32 covering the second support structure 22 is covered. Among them, the capillary structure slurry has fluidity and viscosity, so that it can completely coat the substrate and the supporting structure on the surface of the substrate to form the capillary structure. The fabrication method of the second support structure 22 is the same as the fabrication method of the first support structure 11 , so it will not be repeated here.

As shown in the embodiment of FIG. 6 , the capillary structure slurry 3 covers the first surface 11 of the first substrate 1 and the first support structure 12 on the first surface 11 , and then is heated to form a coating on the first surface. The surface 11 and the first support structure 12 form a first capillary structure 31 . Correspondingly, the capillary structure slurry 3 covers the second surface 21 of the second substrate 2 and the second support structure 211 on the second surface 21 , and then is heated to cover the second surface 21 and the second support structure 211 to form the second support structure 211 . Capillary structure 32 . The surface of the substrate and the support structure are also laid with capillary structure slurry to form a capillary structure. Compared with other methods such as laying copper powder or copper mesh, additional processes can be reduced, and the laying or sintering can be completed at one time.

In the prior art, the capillary structure layer in the high-power vapor chamber is made by pressing a graphite jig to perform a sintering process. And the capillary structure for making the support structure is a manual laying and sintering process of copper powder. Therefore, the fabrication of the capillary structure of the vapor chamber becomes complicated, which is not conducive to the automation of mass production, and the capillary force is often insufficient. In the present invention, the support structure of the capillary structure slurry is laid on the surface of the substrate to form the capillary structure of the temperature equalizing plate. The efficiency of heat conduction of the board, and then have better heat dissipation effect, and save labor costs, improve product yield and improve production yield.

Please refer to FIG. 7 , FIG. 8 and FIG. 9 together. FIG. 7 is a flow chart showing the steps of another specific embodiment of the present invention. 8 is a top view of the first substrate and the second substrate of the vapor chamber according to an embodiment of the present invention. FIG. 9 is a top view of the first substrate and the second substrate of the vapor chamber according to another embodiment of the present invention. As shown in FIG. 7 , the step S1 of providing the first substrate further includes the following sub-steps: Step S11 : providing a first substrate having a first groove on the first surface. Step S12: Graphically laying a support structure slurry in the first groove. and step S13 : heating the support structure slurry to form a patterned first support structure. Wherein, the metal solid content of the support structure slurry 6 is higher than that of the capillary structure slurry 3, and the fluidity is lower. After the support structure slurry 6 is heated and solidified, a dense and extremely low porosity first support structure 12 is formed. The first supporting structure 12 has a strong supporting force, which is beneficial for the vapor chamber to not collapse due to the difference in air pressure. Among them, it is formed by curing the supporting structure slurry The first support structure is beneficial to elastically adjust the shape of the support structure, so as to improve the heat dissipation effect of the temperature equalizing plate.

Among them, the patterned support structure includes temperature chambers of different shapes and arrangements. As shown in FIG. 8 and FIG. 9 , the first substrate 1 further includes an endothermic end 51 and a condensing end 52 . After the endothermic end 51 absorbs the heat source, the working fluid changes from liquid phase to gas phase. Then, the working fluid in the gas phase is transformed from the gas phase to the liquid phase at the condensing end 52 , so that the liquid-gas circulation can be achieved, thereby increasing the heat dissipation effect of the vapor chamber. The first substrate 1 and the second substrate 2 in FIGS. 8 and 9 are in principle mirror-symmetrical, and the heat-absorbing end 51 and the condensation end 52 are also symmetrical.

However, in the patterned support structure, there are two different shapes of support structures, a column shape and a wall shape, and after the capillary structure is laid on the outer layer, a column structure 61 and a wall structure 62 are respectively formed. The columnar structure is that the capillary structure is laid outside the columnar support structure; the wall-like structure is that the capillary structure is laid outside the wall-like support structure. The arrangement and location of the support structures of different shapes will facilitate the actuation of the liquid-gas circulation of the working fluid. The column-shaped support structure 61 is conducive to the vertical transport of the gas phase working fluid, and the wall-shaped capillary support structure 62 is beneficial to the horizontal transport of the liquid-phase working fluid after condensation. Therefore, the patterned support structure can accelerate the heat transfer rate of the vapor chamber to achieve The effect of temperature uniformity. Especially in the radial support structure shown in Figure 9, the working fluid vaporized from the heat-absorbing end will rush out along the support structure, and the working fluid liquefied from the condensing end will flow along the support structure to the heat-absorbing end. Increase the efficiency of heat dissipation and heat dissipation.

Please refer to FIG. 10 and FIG. 11 . FIG. 10 is a flow chart showing the steps of another specific embodiment of the present invention. FIG. 11 is a schematic diagram according to a part of the step flow of FIG. 10 . As shown in FIG. 10 and FIG. 11 , the step S4 of heating the capillary structure slurry further includes the following sub-steps: Step S42 : heating and baking the capillary structure slurry 3 to remove the solvent to form a solidified body 35 . Step S43: add Thermally cured to cleave and remove polymer. And step S44 : heating and sintering the metal powder to form the first capillary structure 31 covering the first support structure and the second capillary structure 32 covering the second support structure 22 . Among them, when the solidified body is heated at a high temperature, the polymer will be decomposed and eliminated first, leaving copper powder and powder gaps with a higher melting point. During the high temperature heating process, the copper powder and the powder gap further form a porous capillary structure.

After the step of sealing the periphery of the first substrate and the second substrate, the step S8 is further included: processing the vapor chamber structure to form a vapor chamber. Please refer to FIG. 12 . FIG. 12 is a flow chart showing further steps of the method for manufacturing the capillary structure of the vapor chamber according to an embodiment of the present invention. As shown in FIG. 12 , step S8 further includes step S80 : injecting the working fluid into the vapor chamber structure. Step S81 : extracting the air in the vapor chamber structure to form a negative pressure cavity containing the working fluid, the first capillary structure and the second capillary structure. Step S82: Hermetically seal the vapor chamber structure. In addition to the above-mentioned manufacturing methods, for this purpose, those skilled in the art can adjust the most suitable manufacturing method by themselves, and are not limited to the above-mentioned methods.

In addition to the support structure, the substrate surface of the temperature chamber also includes an annular slurry wall. The detailed steps are described in the following examples. See Figure 13. FIG. 13 is a flow chart showing further steps of the method for manufacturing the capillary structure of the vapor chamber according to an embodiment of the present invention. The method for manufacturing the capillary structure of the vapor chamber further includes the following steps: Step S9 : annularly laying a dense wall slurry on the periphery of the first substrate to form a slurry wall. Step S10 : heating the slurry wall to form a dense structure wall, and forming a first groove in the dense structure wall. In the embodiment of FIG. 13 , steps S1 and S2 are performed in sequence, then steps S9 and S10 are performed, and then steps S3 , S4 and S5 are performed. Wherein, the dense wall slurry and the aforementioned support structure slurry can be the same slurry, which is used to support two substrates, and can also be used as the side wall of the soaking plate. In another specific embodiment, it can also be First, follow the order of step S9, step S10, step S1, step S2, step S3, step S4, and step S5. Wherein, the dense wall paste is also laid on the second substrate, and the order of laying the first substrate and the second substrate is not limited. In addition to the above-mentioned manufacturing methods, for this purpose, those skilled in the art can adjust the most suitable manufacturing method by themselves, and are not limited to the above-mentioned methods. The manufacturing method of the present invention uses simultaneous baking and sintering to solidify the slurry wall to prevent the capillary structure slurry from overflowing, replacing the conventional manufacturing method of metal grooves, thereby saving manufacturing time and saving baking and heating The required equipment investment and thermal energy costs.

In addition, the thickness of the dense structure wall can also be determined by the solid content of the capillary structure slurry 3 and the physical properties of the metal powder.

To sum up, the method of the present invention solves the problem of large problems by laying and heating the capillary structure slurry on the first support structure and the second support structure to further form the porous first capillary structure and the second capillary structure. The problem of uneven distribution of the working fluid on both sides of the power vapor chamber and easy collapse and deformation. At the same time, the capillary structure paste is laid by printing, which also reduces and saves the cost of making high-power vapor chambers. In addition, in the present invention, the dense wall slurry is deposited on the first surface of the first substrate in an additive manner, and heated to form a dense structure wall. The dense structure wall can form grooves on the surface of the substrate, thereby replacing the existing etching process to form the grooves on the metal sheet, so as to greatly reduce the manufacturing cost. In addition, the use of printing paste to form the capillary structure facilitates mass production efficiency and reduces production costs. Moreover, the vapor chamber made by this method can have a patterned interior cavity to facilitate the circulation of the working fluid.

The process of manufacturing the annular capillary structure by die laying and sintering, and then fitting the copper support column requires a lot of labor costs. The manufacturing method of the high-power vapor chamber structure of the present invention provides a vapor chamber support structure comprising a capillary structure slurry laid. Support structure in the present invention It can be laid by automatic printing. Thereby, the design can be more flexible, and the high-power vapor chamber containing the capillary structure support column can be mass-produced more efficiently.

Through the detailed description of the preferred embodiments above, it is hoped that the features and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, the intention is to cover various modifications and equivalent arrangements within the scope of the claimed scope of the present invention. Therefore, the scope of the patentable scope for which the present invention is claimed should be construed in the broadest sense in accordance with the above description so as to encompass all possible modifications and equivalent arrangements.

S1~S5: Steps

Claims (10)

A method for manufacturing a high-power vapor chamber structure, the steps comprising: providing a first substrate with a first support structure on a first surface of the first substrate; providing a second substrate, a second surface of the second substrate has a second support structure corresponding to the first support structure; respectively laying and coating a capillary structure slurry on the first support structure and the second support structure; heating the capillary structure slurry to form a first capillary structure covering the first support structure, and a second capillary structure covering the second support structure; and The peripheral edges of the first substrate and the second substrate are sealed to form an isothermal plate structure, and the first support structure and the second support structure abut against each other through the first capillary structure and the second capillary structure. The manufacturing method described in claim 1, wherein the step of laying the capillary structure slurry respectively further comprises the following sub-steps: The capillary structure slurry is respectively laid on the first surface and the second surface, and the capillary structure slurry covers the first support structure and the second support structure. The manufacturing method as described in claim 2, wherein the step of heating the capillary structure slurry further comprises the following sub-steps: The capillary structure slurry is heated to form a first capillary structure covering the first surface and covering the first support structure, and a second capillary structure covering the second surface and covering the second support structure. The manufacturing method described in item 1 of the scope of the application further comprises the following steps: laying a copper powder on the first surface; and The copper powder is sintered to form a first copper powder sintered capillary structure covering the first surface and connecting the first capillary structure. The manufacturing method described in claim 1, wherein the step of providing the first substrate further includes the following sub-steps: providing the first substrate with a first groove on the first surface; patterningly placing a support structure slurry within the first groove; and The support structure slurry is heated to form the patterned first support structure. The manufacturing method as described in claim 1, wherein the first support structure is further a first patterned metal support structure. The manufacturing method of claim 1, wherein the capillary structure slurry further comprises a metal powder, a solvent and a polymer, and the step of heating the capillary structure slurry further comprises the following sub-steps: heating and baking the capillary structure slurry to remove the solvent to form a solidified body; heating the solidified body to crack and remove the polymer; and The metal powder is heated and sintered to form the first capillary structure that coats the first support structure, and the second capillary structure that coats the second support structure. The manufacturing method described in item 1 of the scope of the application further comprises the following steps: annularly laying a dense wall slurry on the periphery of the first substrate to form a slurry wall; The slurry wall is heated to form a dense structure wall, and a first groove is formed in the dense structure wall. The manufacturing method according to item 1 of the claimed scope, wherein after the step of sealing the peripheries of the first substrate and the second substrate, there is a further step: processing the uniform temperature plate structure to form a uniform temperature plate; This step further contains the following sub-steps: injecting a working fluid into the vapor chamber structure; extracting the air in the vapor chamber structure to form a negative pressure cavity containing the working fluid, the first capillary structure and the second capillary structure; and Hermetically seal the vapor chamber structure. The manufacturing method as described in claim 1, wherein the vapor chamber structure is used for further processing to manufacture a vapor chamber.

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