CN114076534A - Manufacturing method of high-power temperature equalizing plate structure - Google Patents
Manufacturing method of high-power temperature equalizing plate structure Download PDFInfo
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- CN114076534A CN114076534A CN202010815392.2A CN202010815392A CN114076534A CN 114076534 A CN114076534 A CN 114076534A CN 202010815392 A CN202010815392 A CN 202010815392A CN 114076534 A CN114076534 A CN 114076534A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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Abstract
A manufacturing method of a high-power temperature-equalizing plate structure specifically comprises the following steps: a first substrate having a first support structure is provided. A second substrate having a second support structure corresponding to the first support structure is provided. And respectively paving and coating the capillary structure slurry on the first support structure and the second support structure. And heating the capillary structure slurry to form a first capillary structure coating the first support structure and a second capillary structure coating the second support structure. The peripheries of the first substrate and the second substrate are sealed to form a temperature equalizing plate structure, and the first capillary structure and the second capillary structure are abutted. Therefore, the invention improves the technical problems of the interconnection of the capillary structures on the upper surface and the lower surface of the high-power temperature-uniforming plate and the liquid-phase working fluid, simplifies the complicated manufacturing process of the high-power temperature-uniforming plate element and is more suitable for mass production.
Description
Technical Field
The invention provides a manufacturing method for manufacturing a high-power temperature-equalizing plate structure, in particular to a manufacturing method for a high-power temperature-equalizing plate structure with capillary structures on two surfaces.
Background
The temperature equalizing plate is a heat energy transferring element for electronic equipment and is used in heat conduction and temperature reduction. The flat sealed cavity comprises two substrates, and a flat sealed cavity is formed between the substrates. The sealed cavity is provided with a capillary structure and contains working fluid. The working principle of the vapor chamber is that when part of the vapor chamber is in contact with a Heat source, the working fluid at the Heat absorbing end (Evaporator) in the vapor chamber absorbs the Heat energy of the Heat source and changes from liquid phase to gas phase to release Latent Heat (Latent Heat). The vapor phase working fluid then rapidly flows toward the condensing end (Condenser) away from the heat source. When the working fluid in the gas phase flows to the condensation end in the closed cavity, the working fluid is converted from the gas phase to the liquid phase and flows back to the heat absorption end by the Capillary force (Capillary force) of the Capillary structure. The temperature equalizing plate absorbs a large amount of heat energy generated by Hot spots (Hot spots) of the electronic element rapidly by means of phase change generated by the working fluid during heat absorption and heat release, so that the heat energy is rapidly dispersed to achieve the effect of temperature equalization.
When the power of the electronic component is high, the local area can accumulate heat energy quickly to form a hot spot. When the vapor chamber is used as a heat-releasing and heat-conducting element, the capillary structures are usually disposed on two flat substrates of the vapor chamber, so as to improve the efficiency of the vapor chamber in conducting heat. However, the heat source of the electronic component is often only in contact with one substrate of the temperature equalization plate, and the working fluid in the capillary structure of the other substrate is not easy to circulate gas and liquid.
Therefore, how to achieve the purpose of solving the problem of uneven distribution of the working fluid in the capillary structure, saving labor cost, and improving the efficiency of mass production of high-power uniform-temperature plate element products is a problem to be solved in the field of manufacturing uniform-temperature plates.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for manufacturing a high-power temperature-uniforming plate structure, which can effectively overcome the defects of the prior art, improve the interconnection of the capillary structures on the upper and lower surfaces of the high-power temperature-uniforming plate and the process problem of the liquid-phase working fluid, effectively simplify the complicated manufacturing process of the high-power temperature-uniforming plate, and improve the production efficiency and the product yield, and is more suitable for mass production.
In order to achieve the purpose, the invention discloses a manufacturing method of a high-power temperature equalizing plate structure, which is characterized by comprising the following steps:
providing a first substrate, wherein a first supporting structure is arranged on a first surface of the first substrate;
providing a second substrate, wherein a second surface of the second substrate is provided with a second supporting structure corresponding to the first supporting structure;
respectively laying and coating a capillary structure slurry on the first support structure and the second support structure;
heating the capillary structure slurry to form a first capillary structure coating the first support structure and a second capillary structure coating the second support structure; and
the first substrate and the second substrate are sealed at the periphery to form a temperature equalizing plate structure, and the first supporting structure and the second supporting structure are mutually propped against each other through the first capillary structure and the second capillary structure.
Wherein, the step of respectively laying the capillary structure slurry further comprises the following substeps:
and respectively laying the capillary structure slurry on the first surface and the second surface, wherein the capillary structure slurry coats the first support structure and the second support structure.
Wherein the step of heating the capillary structure slurry further comprises the substeps of:
heating the capillary structure slurry to form a first capillary structure covering the first surface and coating the first support structure, and a second capillary structure covering the second surface and coating the second support structure.
Wherein, further comprising the following steps:
laying a copper powder on the first surface; and
sintering the copper powder to form a first copper powder sintered capillary structure covering the first surface and connected with the first capillary structure.
Wherein the step of providing the first substrate further comprises the substeps of:
providing the first substrate with a first groove on the first surface;
laying a support structure slurry in the first groove in a patterned manner; and
heating the support structure slurry to form the patterned first support structure.
Wherein the first support structure is further a first patterned metal support structure.
Wherein the capillary structure slurry further comprises a metal powder, a solvent and a polymer, and the step of heating the capillary structure slurry further comprises the substeps of:
heating and baking the capillary structure slurry to remove the solvent to form a solidified body;
heating the cured body to crack and remove the polymer; and
heating and sintering the metal powder to form the first capillary structure coating the first support structure and the second capillary structure coating the second support structure.
Wherein, further comprising the following steps:
annularly paving a dense wall slurry on the periphery of the first substrate to form a slurry wall;
the slurry wall is heated to form a dense structure wall, and a first groove is formed in the dense structure wall.
Wherein, after the step of sealing the peripheries of the first substrate and the second substrate, the method further comprises the steps of:
processing the temperature-uniforming plate structure to form a temperature-uniforming plate;
the step further comprises the following substeps:
injecting a working fluid into the vapor chamber structure;
pumping air in the vapor chamber structure to form a negative pressure cavity for containing the working fluid, the first capillary structure and the second capillary structure; and
the temperature equalization plate structure is hermetically sealed.
Wherein the temperature equalizing plate structure is used for further processing to manufacture a temperature equalizing plate.
Therefore, the manufacturing method of the high-power temperature-uniforming plate structure provided by the invention designs the capillary structures of the upper cover plate and the lower cover plate to be communicated, so that the liquid-phase working fluid of the non-contact heat source surface can also flow back to the heat absorption area of the contact heat source surface, and the problems of uneven distribution and easy collapse and deformation of the working fluid on the two surfaces of the high-power temperature-uniforming plate are solved. In addition, the capillary structure on the supporting column is manufactured in a slurry printing mode, so that the automation of mass production of products is greatly improved, and the degree of production cost is reduced.
In summary, the present invention provides a method for manufacturing a high power temperature equalization plate structure with capillary structures on both sides, wherein the two substrates are not deformed or collapsed due to the pressure difference by the supporting structure between the two substrates. Moreover, the working fluid can effectively flow between the two substrates, and the heat conduction efficiency and the heat convection efficiency are improved, so that the functions of heat conduction, heat dissipation, heat clearing and temperature equalization are effectively achieved.
Drawings
FIG. 1: a flowchart of the steps of one embodiment of the present invention is shown.
FIG. 2: according to the schematic diagram of the process of FIG. 1.
FIG. 3: a flowchart of steps according to another embodiment of fig. 1 is shown.
FIG. 4: a schematic diagram according to the process of fig. 3 is shown.
FIG. 5: a flowchart illustrating the steps of yet another embodiment of the present invention is shown.
FIG. 6: according to the process of FIG. 5.
FIG. 7: a flowchart illustrating the steps of yet another embodiment of the present invention is shown.
FIG. 8: a top view of the first substrate and the second substrate of the temperature equalization plate according to an embodiment of the invention is shown.
FIG. 9: a top view of the first substrate and the second substrate of the temperature equalization plate according to another embodiment of the present invention is shown.
FIG. 10: a flowchart illustrating the steps of yet another embodiment of the present invention is shown.
FIG. 11: according to the process of FIG. 10.
FIG. 12: a flow chart of further steps of a method of fabricating a capillary structure of a vapor chamber according to yet another embodiment of the present invention is illustrated.
FIG. 13: a flow chart of further steps of a method of fabricating a capillary structure of a vapor chamber according to yet another embodiment of the present invention is illustrated.
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described and illustrated with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitations are intended to the scope of the invention or its corresponding embodiments, particularly in terms of the specific methods, devices, conditions, materials, and so forth.
In the description of the present invention, it is to be understood that the terms "longitudinal, transverse, upper, lower, front, rear, left, right, top, bottom, inner, outer" and the like refer to orientations or positional relationships based on those shown in the drawings, which are merely for convenience of description and simplicity of description, and do not indicate that the described devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In addition, the indefinite articles "a", "an" and "an" preceding an apparatus or element of the invention are not intended to limit the number requirement (i.e., the number of occurrences) of the apparatus or element. Thus, "a" or "an" should be read to include one or at least one, and the singular form of a device or element also includes the plural form unless the number clearly indicates the singular form.
For convenience of description, the drawings (fig. 2, fig. 4, and fig. 6) and the embodiments of the subsequent portions take the first substrate and the first supporting structure as examples. Unless otherwise stated, the second substrate and the second support structure are the same process or structure as the first substrate.
In one embodiment of manufacturing the high-power temperature-equalizing plate element, the thickness of the high-power temperature-equalizing plate element is between 1.0mm and 3.0mm, and the copper substrate with the concave groove structure is manufactured in a stamping mode. Prefabricating a plurality of copper support columns; and prefabricating a plurality of annular sintered capillary structures with the same height as the copper support columns, and sleeving the copper support columns one by one to form the copper support columns with the capillary structures. And then, the copper support pillars with the capillary structures are arranged on the substrate in a patterned manner. And finally, copper powder is laid in the concave groove structures of the two copper substrates and sintered into a porous capillary structure, and the two covered substrates have connected capillary structures. However, in this embodiment, the step of inserting the annular capillary structure into the copper support posts or the step of arranging the copper support posts in a patterned manner is very difficult to realize automatic production, which is labor-consuming and costly.
Referring to fig. 1 and 2, fig. 1 is a flow chart illustrating a method for manufacturing a capillary structure of a vapor chamber according to an embodiment of the invention. FIG. 2 is a schematic diagram according to the process of FIG. 1. As shown in fig. 1 and fig. 2, the manufacturing method of the high-power temperature-uniforming plate structure of the present invention is applied to the capillary structure supporting column for manufacturing the temperature-uniforming plate element, and the manufacturing method includes the following steps: step S1: a first substrate 1 is provided having a first support structure 12 on a first surface 11. Step S2: a second substrate 2 is provided having a second support structure 22 on a second surface 21 thereof corresponding to the first support structure 12. Step S3: the capillary structure slurry 3 is laid and coated on the first support structure 12 and the second support structure 22, respectively. Step S4: the capillary structure slurry 3 is heated to form a first capillary structure 31 that covers the first support structure 11, and a second capillary structure 32 that covers the second support structure 22. Step S5: the first substrate 11 and the second substrate 21 are sealed at their peripheries to form the vapor chamber structure 5, and the first support structure 12 and the second support structure 22 are abutted against each other through the first capillary structure 31 and the second capillary structure 32. In step S5, before sealing the first substrate and the second substrate, a capillary structure is formed on the inner surface of each of the first substrate and the second substrate.
Further explaining the process flow as shown in fig. 2, first, a plurality of first supporting structures 12 are disposed on the first surface 11 of the first substrate 1. Next, a steel plate 33 is placed on the first substrate 1, and the capillary-structured slurry 3 is scraped in the arrow direction using a scraper 34. At this time, the capillary structure slurry 3 passes through the holes on the steel plate 33 and is spread to the outer layer of the first supporting structure 12. After the laying, the first support structure 12 with the outer layer containing the capillary structure slurry 3 is heated, baked and sintered at different temperatures. Finally, the first capillary structure 31 is formed. The second supporting structure 22 of the second substrate 2 and the first supporting structure 12 of the first substrate are the same in process or structure.
When the capillary structures of the first substrate 1 and the second substrate 2 are connected to each other, a capillary channel that can transport a liquid-phase working fluid is created. The capillary channel enables the liquid phase working fluid in the capillary structure of the condensation area on the substrate which is not contacted with the heat source to flow back to the capillary structure of the heat absorption area on the substrate which is contacted with the heat source, so that the working fluid is changed into a gas phase again.
The invention discloses a capillary structure of a uniform temperature plate, which is formed by laying capillary structure slurry on a support structure on the surface of a substrate. Compared with the embodiment of prefabricating and sleeving the copper support pillar and the annular sintered capillary structure, the capillary force of the invention is better than that of the capillary structure made of copper powder. Therefore, the invention increases the heat conduction efficiency of the temperature equalizing plate, further has better heat dissipation effect, saves labor cost, improves the product yield and improves the production yield.
In addition, the first substrate 1 may be copper or copper metal. The capillary structure slurry 3 contains copper powder, an organic solvent, copper oxide powder and a polymer. When heated and baked, the organic solvent and the polymer in the capillary structure slurry 3 are removed first, and then heated and sintered to form the first capillary structure 31. The organic solvent and the polymer form a Colloid (Colloid) for dispersing and suspending the copper powder to form the capillary structure slurry 3, so that the first substrate 1 or the first supporting structure 12 on the first surface of the first substrate 1 is laid with the capillary structure slurry 3 and processed to form the first capillary structure 31. The organic solvent may be an alcohol solvent, and the polymer may be a Natural Resin (Natural Resin) or a Synthetic Resin (Synthetic Resin).
In the above embodiments, the capillary structure is laid on the supporting structure, however, the invention is not limited to the capillary structure laid on the substrate surface, and the capillary structure can also be laid by using copper mesh, copper powder, etc. In yet another embodiment, the capillary structure is laid down on the surface of the substrate in the following manner. Referring to fig. 3 and 4, fig. 3 is a flowchart illustrating steps according to another embodiment of fig. 1. FIG. 4 is a schematic diagram illustrating the process according to FIG. 3. In this embodiment, the method for manufacturing the capillary structure of the vapor chamber further includes the following steps, step S6: copper powder 4 is laid on the first surface 11. Step S7: the copper powder 4 is sintered to form a first copper powder sintered capillary structure 41 covering the first surface 11 and joining the first capillary structure 31. The flow of the present embodiment sequentially proceeds to step S1, step S2, step S3 and step S4, and then proceeds to step S6 and step S7. Finally, step S5 is performed again.
As shown in fig. 4, first, a plurality of first supporting structures 12 are disposed on the first surface 11 of the first substrate 1. The steel plate 33 is placed on the first substrate 1. Next, the capillary-structured paste 3 is scraped in a manner of steel plate printing using a doctor blade 34. At this time, the capillary structure slurry 3 passes through the holes on the steel plate 33 and is spread to the outer layer of the first supporting structure 12. After the laying, the first supporting structure 12 with the outer layer containing the capillary structure slurry 3 is heated, baked and sintered at different temperatures. A first capillary structure 31 is formed. Next, the copper powder 4 is further laid on the first surface 11 of the first substrate 1, and heating, baking and sintering are performed at different temperatures, thereby forming the first copper powder sintering capillary structure 41. The second supporting structure 22 of the second substrate and the first supporting structure 12 of the first substrate are the same in process or structure. The copper powder 4 is heated to form the first copper powder sintered wick structure 41. The first copper powder sintered capillary structure 41 sintered by using the copper powder 4 has low material cost, but needs an additional paving process, has high energy consumption, and has a small thickness. In addition, the first copper powder sintering capillary structure 41 and the first capillary structure 31 are continuous planes, so that the working fluid can be continuously transported in the uniform temperature plate.
In addition to the above-mentioned manufacturing methods, one skilled in the art can adjust the most suitable process for this purpose, and the order is not limited to the above. Step S1, step S2, step S6, step S7, step S3, step S4, and step S5 may be performed in this order, that is, step S6 is performed to lay the copper powder on the first surface of the first substrate, step S7 is performed to sinter, and step S3 is performed to lay the capillary structure slurry on the first supporting structure.
In another embodiment, the substrate surface and the support structure are simultaneously laid with the capillary structure slurry 3, the detailed steps are described in the following embodiments. Referring to fig. 5 and 6 in combination, fig. 5 is a flow chart illustrating steps of another embodiment of the present invention. FIG. 6 is a schematic diagram according to the process of FIG. 5. As shown in fig. 5 and 6, the step S3 of laying down further includes the following sub-steps: step S31: the capillary structure slurry 3 is respectively laid on the first surface 11 and the second surface 21, and the capillary structure slurry 3 covers the first support structure 12 and the second support structure 22. In addition, the heating step S4 further includes the following substeps: step S41: the capillary structure slurry 3 is heated to form a first capillary structure 31 covering the first surface 11 and covering the first support structure 12, and a second capillary structure 32 covering the second surface 21 and covering the second support structure 22. The capillary structure slurry has fluidity and viscosity, so that the capillary structure slurry can completely coat the substrate and the support structure on the surface of the substrate to form a capillary structure. The manufacturing method of the second supporting structure 22 is the same as the manufacturing method of the first supporting structure 11, and therefore, the description thereof is omitted.
In the embodiment shown in fig. 6, the capillary structure paste 3 covers the first surface 11 of the first substrate 1 and the first supporting structure 12 on the first surface 11, and then is heated to form a first capillary structure 31 covering the first surface 11 and the first supporting structure 12. Correspondingly, the capillary structure slurry 3 covers the second surface 21 of the second substrate 2 and the second supporting structure 211 on the second surface 21, and then is heated to form the second capillary structure 32 by covering the second surface 21 and the second supporting structure 211. The surface of the substrate and the supporting structure are paved with the capillary structure slurry to form the capillary structure, and compared with other modes of paving copper powder or a copper net and the like, the method can reduce additional working procedures and finish paving or sintering at one time.
In the prior art, the capillary structure layer in the high power temperature-uniforming plate is manufactured by pressing and sintering a graphite jig. And the capillary structure of the support structure is manufactured by the manual laying and sintering process of copper powder. Therefore, the fabrication of the capillary structure of the vapor chamber becomes complicated, which is not conducive to automation in mass production, and the capillary force tends to be insufficient. The invention lays the capillary structure slurry on the supporting structure on the surface of the substrate to form the capillary structure of the uniform temperature plate, and the capillary force is better than that of the capillary structure formed by copper powder, thereby increasing the heat conduction efficiency of the uniform temperature plate, further having better heat dissipation effect, saving labor cost, improving the product yield and improving the production yield.
Referring to fig. 7, 8 and 9 in combination, fig. 7 is a flow chart illustrating steps of another embodiment of the present invention. FIG. 8 is a top view of the first substrate and the second substrate of the vapor chamber according to one embodiment of the invention. FIG. 9 is a top view of the first substrate and the second substrate of the temperature-uniforming plate according to another embodiment of the present invention. As shown in fig. 7, the step S1 of providing the first substrate further includes the following sub-steps: step S11: a first substrate having a first recess in a first surface is provided. Step S12: a support structure slurry is graphically laid in the first groove. And step S13: the support structure slurry is heated to form a patterned first support structure. Wherein the support structure slurry 6 has a higher metal solids content and a lower flow force than the capillary structure slurry 3. The support structure slurry 6 is cured by heating to form a dense, very low porosity first support structure 12. The first support structure 12 has a strong supporting force, which is beneficial to the temperature equalization plate not to collapse easily due to air pressure difference. The first support structure formed by curing the support structure slurry is beneficial to elastically adjusting the shape of the support structure, so that the heat dissipation effect of the uniform temperature plate is improved.
The patterned support structure comprises temperature-equalizing plates with different shapes and arrangement. As shown in fig. 8 and 9, the first substrate 1 further includes a heat absorbing end 51 and a condensing end 52, and the working fluid in the heat absorbing end 51 absorbs the heat source and then changes from a liquid phase to a gas phase. Then, the gaseous working fluid is converted from gaseous phase to liquid phase at the condensing end 52, so as to achieve the action of liquid-gas circulation and increase the heat dissipation effect of the temperature equalization plate. The first substrate 1 and the second substrate 2 of fig. 8 and 9 are basically mirror images, and the heat absorbing end 51 and the condensing end 52 are also mirror images.
However, the patterned support structure includes two support structures with different shapes, namely, a pillar structure and a wall structure, and the pillar structure 61 and the wall structure 62 are formed after the capillary structure is laid on the outer layer. The columnar structure is formed by laying a capillary structure outside the columnar supporting structure; the wall-shaped structure is formed by laying the capillary structure outside the wall-shaped supporting structure. Different shapes of support structure arrangements and positions will facilitate actuation of the liquid-gas circulation of the working fluid. The columnar supporting structure 61 is beneficial to the vertical transportation of the gas-phase working fluid, and the wall-shaped capillary supporting structure 62 is beneficial to the horizontal transportation of the condensed liquid-phase working fluid, so that the patterned supporting structure can accelerate the heat conduction rate of the temperature equalization plate to achieve the temperature equalization effect. Especially, as the radial support structure shown in fig. 9, the working fluid gasified from the self-suction end will flush out along the support structure, and the working fluid liquefied from the condensation end will flow along the support structure to the heat-suction end, thereby effectively increasing the heat dissipation and heat clearing efficiency.
Referring to fig. 10 and 11, fig. 10 is a flow chart illustrating steps of another embodiment of the present invention. FIG. 11 is a schematic diagram illustrating a portion of the process flow of FIG. 10. As shown in fig. 10 and 11, the step S4 of heating the capillary structure slurry further includes the following sub-steps: step S42: the capillary structure slurry 3 is heated and baked to remove the solvent to form a solidified body 35. Step S43: the cured body is heated to crack and remove the polymer. And step S44: the metal powder is heated and sintered to form a first capillary structure 31 encasing the first support structure and a second capillary structure 32 encasing the second support structure 22. Wherein, when the solidified body is heated at a high temperature, the polymer is decomposed and eliminated first, and copper powder with a higher melting point and powder gaps are left. During the high-temperature heating process, the copper powder and the powder gaps further form a porous capillary structure.
After the step of sealing the peripheries of the first substrate and the second substrate, the method further includes step S8: and processing the temperature equalizing plate structure to form the temperature equalizing plate. Referring to fig. 12, fig. 12 is a flow chart illustrating further steps of a method for fabricating a capillary structure of a vapor chamber according to an embodiment of the present invention. As shown in fig. 12, the step S8 still further includes the step S80: and injecting working fluid into the temperature-equalizing plate structure. Step S81: and pumping air in the temperature equalizing plate structure to form a negative pressure cavity for containing the working fluid, the first capillary structure and the second capillary structure. Step S82: the temperature equalization plate structure is hermetically sealed. In addition to the above-mentioned manufacturing methods, one skilled in the art can adjust the most suitable process for this purpose, and the method is not limited to the above-mentioned method.
The substrate surface of the vapor chamber includes an annular slurry wall in addition to the support structure, the detailed steps of which are described in the examples below. Please refer to fig. 13. FIG. 13 is a flow chart illustrating further steps in a method of fabricating a capillary structure of a vapor chamber in accordance with one embodiment of the present invention. The manufacturing method of the capillary structure of the vapor chamber further comprises the following steps: step S9: a dense wall slurry is annularly laid on the periphery of the first substrate to form a slurry wall. Step S10: the slurry wall is heated to form a dense structure wall, and a first groove is formed in the dense structure wall. As in the embodiment of fig. 13, steps S1 and S2 are performed sequentially, then step S9 and step S10 are performed, and then step S3, step S4 and step S5 are performed. The dense wall slurry and the support structure slurry can be the same slurry, and are used for supporting two substrates and also can be used as a side wall body of a temperature-uniforming plate. In another embodiment, the steps may be performed according to the sequence of step S9, step S10, step S1, step S2, step S3, step S4, and step S5. And the dense wall slurry is also paved with a second substrate, and the sequence of paving the first substrate and the second substrate is not limited. In addition to the above-mentioned manufacturing methods, one skilled in the art can adjust the most suitable process for this purpose, and the method is not limited to the above-mentioned method. The manufacturing method of the invention is used for preventing the slurry of the capillary structure from overflowing by synchronously baking and sintering the solidified slurry wall, and replaces the conventional manufacturing method of metal grooves, thereby saving the manufacturing time, and saving the equipment investment and the heat energy cost required by baking and heating.
In addition, the thickness of the dense-structure wall may also be determined by the solid content of the capillary-structure slurry 3 and the physical properties of the metal powder.
In summary, the method of the present invention further forms the first and second porous capillary structures by spreading and heating the capillary structure slurry on the first and second support structures, thereby solving the problems of uneven distribution of the working fluid on both sides of the high power temperature equalization plate and easy collapse and deformation. In addition, the invention lays the dense wall slurry on the first surface of the first substrate in an additive mode, and heats the slurry to form the dense structure wall. The dense structure wall can form a groove on the surface of the substrate, thereby replacing the existing etching process to form a groove on a metal sheet, and greatly reducing the manufacturing cost. In addition, the formation of the capillary structure using the printing paste is advantageous in terms of efficiency in mass production and reduction in production cost. Moreover, the temperature-equalizing plate manufactured by the method can be provided with an internal cavity with a graphical design so as to facilitate the circulation of working fluid.
The process flow of manufacturing the annular capillary structural member by laying and sintering the die and then sheathing the copper support pillar needs to consume a large amount of labor cost. The invention provides a method for manufacturing a high-power temperature-equalizing plate structure, which provides a temperature-equalizing plate support structure paved with slurry with a capillary structure. The support structure of the present invention may be laid down by automated printing. Therefore, the high-power temperature-equalizing plate containing the supporting columns with the capillary structures can be more flexible in design and more efficient in mass production.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.
Claims (10)
1. A manufacturing method of a high-power temperature-equalizing plate structure is characterized by comprising the following steps:
providing a first substrate, wherein a first supporting structure is arranged on a first surface of the first substrate;
providing a second substrate, wherein a second surface of the second substrate is provided with a second supporting structure corresponding to the first supporting structure;
respectively laying and coating a capillary structure slurry on the first support structure and the second support structure;
heating the capillary structure slurry to form a first capillary structure coating the first support structure and a second capillary structure coating the second support structure; and
the first substrate and the second substrate are sealed at the periphery to form a temperature equalizing plate structure, and the first supporting structure and the second supporting structure are mutually propped against each other through the first capillary structure and the second capillary structure.
2. The method for manufacturing a high power thermal insulation plate structure according to claim 1, wherein the step of spreading the capillary structure slurry respectively further comprises the following sub-steps:
and respectively laying the capillary structure slurry on the first surface and the second surface, wherein the capillary structure slurry coats the first support structure and the second support structure.
3. The method for manufacturing a high power thermal equalization plate structure as claimed in claim 2, wherein the step of heating the capillary structure slurry further comprises the sub-steps of:
heating the capillary structure slurry to form a first capillary structure covering the first surface and coating the first support structure, and a second capillary structure covering the second surface and coating the second support structure.
4. The method for manufacturing a high power temperature equalization plate structure as claimed in claim 1, further comprising the steps of:
laying a copper powder on the first surface; and
sintering the copper powder to form a first copper powder sintered capillary structure covering the first surface and connected with the first capillary structure.
5. The method for manufacturing a high power temperature equalization plate structure as claimed in claim 1, wherein the step of providing the first substrate further comprises the sub-steps of:
providing the first substrate with a first groove on the first surface;
laying a support structure slurry in the first groove in a patterned manner; and
heating the support structure slurry to form the patterned first support structure.
6. The method of claim 1, wherein the first support structure is further a first patterned metal support structure.
7. The method for manufacturing a high power thermal equalization plate structure as claimed in claim 1, wherein the capillary structure slurry further comprises a metal powder, a solvent and a polymer, and the step of heating the capillary structure slurry further comprises the substeps of:
heating and baking the capillary structure slurry to remove the solvent to form a solidified body;
heating the cured body to crack and remove the polymer; and
heating and sintering the metal powder to form the first capillary structure coating the first support structure and the second capillary structure coating the second support structure.
8. The method for manufacturing a high power temperature equalization plate structure as claimed in claim 1, further comprising the steps of:
annularly paving a dense wall slurry on the periphery of the first substrate to form a slurry wall;
the slurry wall is heated to form a dense structure wall, and a first groove is formed in the dense structure wall.
9. The method for manufacturing a high power temperature equalization plate structure as claimed in claim 1, wherein after the step of sealing the peripheries of the first substrate and the second substrate, there is further step of:
processing the temperature-uniforming plate structure to form a temperature-uniforming plate;
the step further comprises the following substeps:
injecting a working fluid into the vapor chamber structure;
pumping air in the vapor chamber structure to form a negative pressure cavity for containing the working fluid, the first capillary structure and the second capillary structure; and
the temperature equalization plate structure is hermetically sealed.
10. The method of manufacturing a high power vapor-temperature plate structure according to claim 1, wherein the vapor-temperature plate structure is used for further processing to manufacture a vapor-temperature plate.
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