TW202204909A - Testing fixture for ball grid array package chip to solve the problem of the prior art in poor positioning accuracy of the chip under test - Google Patents

Abstract

The present invention relates to a testing fixture for a ball grid array package chip, which defines a pressing space inside a base and pivots with a pair of elastic pressing pieces. The bottom of the pushing space defines an accommodating hole, and the bottom surface of the base is combined with a top support diaphragm, which defines guide positioning holes relative to solder ball pins of a chip to be tested. The bottom surface of the base has several combination columns. The top support diaphragm defines several combination holes relative to each combination column. Each combination column is inserted into each combination hole and followed by hot pressing to form a fixed flange. In this way, the problem of the prior art in poor positioning accuracy of the chip under test is solved, so the positioning accuracy of the chip under test is improved.

Description

Inspection jig for ball grid array package chip

The present invention relates to a test fixture for ball grid array packaging chips, in particular to a designer for combining a top support film with guiding and positioning holes relative to the solder ball pins of the chip to be tested to the bottom surface of a base.

Press, the bottom surface of the ball grid array package (Ball grid array packed) chip has many solder ball pins, and the solder ball pins can be used to directly contact the test circuit board for testing operations: as shown in Fig. 1, the conventional The ball grid array package chip inspection fixture has a pushing space 11 inside a base 10 and a pair of elastic pressing parts 12 are pivoted. The pushing space 11 has an accommodating hole 13 at the bottom. The accommodating hole 13. The bottom edge has a top support flange 14: During the test, the pair of elastic pressing parts 12 are pushed up first, so that the wafer pusher (not shown) will suck and move the wafer 20 to be tested to the accommodating hole 13. The supporting flange 14 supports and positions the wafer 20 to be tested, and allows the pair of elastic pressing members 12 to restore the state of pressing the wafer 20 to be tested, so that the testing operation can be performed on the wafer 20 to be tested: however, the accommodating hole 13 The size must be slightly larger than the size of the wafer to be tested 20 to help the wafer pusher to move the wafer to be tested 20 to the accommodating hole 13, but it may also cause deviation in the positioning of the wafer to be tested 20. This in turn affects the performance or/and correctness of the test operation.

The main purpose of the present invention is to solve the problem of poor positioning accuracy of the wafer under test caused by the prior art, and has the effect of improving the positioning accuracy of the wafer under test.

Another object of the present invention is to improve the accuracy of the test.

Another object of the present invention is to prevent damage to the structure of the chip to be tested.

In order to achieve the above-mentioned effect, the structural feature of the present invention is that there is a pushing space inside a base, and the bottom of the pushing space has an accommodating hole, and the bottom surface of the base is combined with a top support film, the top support film There are guiding and positioning holes corresponding to the solder ball pins of the chip to be tested.

In addition, a pair of elastic pressing parts are pivoted inside the base: the bottom end of the guide and positioning hole also has a lower chamfer; the top of the guide and positioning hole also has an upper chamfer; the bottom surface of the base has several combining columns, the The top support membrane has several coupling holes relative to each of the coupling posts: each coupling post is inserted into each of the coupling holes to form a fixing flange by hot pressing.

In this way, the top support film with guiding and positioning holes relative to the solder ball pins of the chip to be tested is combined with the bottom surface of the base. When the chip pusher sucks the chip to be tested to the accommodating hole, the chip to be tested will Because the solder ball pins are naturally guided by the guiding and positioning holes, they can be quickly and accurately positioned on the top support diaphragm.

First, please refer to [FIG. 2] to [FIG. 4], in the present invention, a base 30 has a pressing space 31 and a pair of elastic pressing pieces 32 pivotally arranged therein. The bottom of the pressing space 31 has a container The bottom surface of the base 30 is combined with a top support film 40, and the top support film 40 has guiding and positioning holes 41 relative to the solder ball pins 21 of the chip 20 to be tested: wherein, the bottom surface of the base 30 has several Each of the coupling posts 34 has a plurality of coupling holes 42 relative to each of the coupling posts 34 . The coupling posts 34 are inserted into the coupling holes 42 to form fixing flanges 341 by thermocompression.

Based on such a configuration, the present invention combines the top support film 40 with the guiding and positioning holes 41 relative to the solder ball pins 21 of the chip to be tested 20 to the bottom surface of the base 30 . When the chip pusher sucks the chip to be tested 20 When reaching the accommodating hole 33 , the chip to be tested 20 will be quickly and accurately positioned on the top support film 40 due to its solder ball pins 21 being naturally guided by the guiding and positioning holes 41 , and the top of the guiding and positioning holes 41 It can also have an upper chamfer 412 to further strengthen the guiding effect of the guiding and positioning holes 41 : therefore, it has the effect of improving the positioning accuracy of the wafer to be tested.

Furthermore, the bottom end of the guide positioning hole 41 also has a lower chamfer 411. When the test circuit board contacted by the solder ball pins 21 of the chip 20 to be tested is a rubber socket type (Rubber Socket Type), the lower chamfer 411 is formed. The contact area between the solder ball pins 21 and the test circuit board can be increased, which further improves the accuracy of the test. Type), the lower chamfer 411 can make the contact process between the solder ball pins 21 and the test circuit board, and have a retreat space to prevent the structure of the solder ball pins 21 from being damaged, and further has the effect of preventing the structure of the chip to be tested from being damaged.

To sum up, the structure disclosed in the present invention is unprecedented, and can indeed achieve the improvement of efficacy, and is available for industrial use, and fully complies with the requirements of an invention patent. , without any sense of virtue.

However, the drawings and descriptions disclosed above are only preferred embodiments of the present invention, and modifications or equivalent changes made by those skilled in the art according to the spirit of the present case should still be included in the scope of the patent application of the present case.

10: Pedestal 11: Push the space 12: Elastic pressing parts 13: accommodating hole 14: Top support flange 20: Wafer to be tested 21: Solder Ball Pins 30: Pedestal 31: Push Space 32: Elastic pressing 33: accommodating hole 34: Binding column 341: Fixed flange 40: top support diaphragm 41: Guide positioning hole 411: Lower chamfer 412: Upper chamfer 42: binding hole

[FIG. 1] is a cross-sectional view of the structure of a conventional ball grid array package chip inspection jig. [FIG. 2] is a cross-sectional view of the structure of the present invention. [Fig. 3] is a structural appearance view (1) of the present invention. [Fig. 4] is a structural appearance view (2) of the present invention.

20: Wafer to be tested

21: Solder Ball Pins

30: Pedestal

31: Push Space

32: Elastic pressing

33: accommodating hole

341: Fixed flange

40: top support diaphragm

41: Guide positioning hole

411: Lower chamfer

412: Upper chamfer

Claims (6)

A detection fixture for ball grid array packaging chips is provided with a pushing space inside a base, an accommodating hole is arranged at the bottom of the pushing space, and a top support film is combined with the bottom surface of the base, and the top support film There are guiding and positioning holes corresponding to the solder ball pins of the chip to be tested. The inspection jig for ball grid array packaged chips according to claim 1, wherein a pair of elastic pressing parts are pivoted inside the base. The inspection jig of the ball grid array package chip according to claim 1 or 2, wherein the bottom end of the guiding and positioning hole further has a lower chamfer. The inspection jig of the ball grid array package chip according to claim 3, wherein the top of the guide positioning hole further has an upper chamfer. The inspection jig for ball grid array packaging chips according to claim 4, wherein the bottom surface of the base has a plurality of bonding posts, and the top support film has a plurality of bonding holes relative to each of the bonding posts. The inspection jig for ball grid array packaging chips according to claim 5, wherein each of the bonding posts is inserted into each of the bonding holes to form a fixing flange by thermocompression.

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