TW202203448A - Light source module - Google Patents

Abstract

A light source module including a substrate, a light emitting device, a package structure, and an optical pattern is provided. The light emitting device and the package structure are disposed on a surface of the substrate, and the package structure covers the light emitting device. The package structure has a first groove and a second groove connected to each other. The light emitting device is positioned between the first grove and the substrate. The second groove is positioned between the first groove and the substrate. An orthogonal projection of the area occupied by the first groove on the substrate has a geometric center. The light emitting device is positioned at the geometric center. An orthogonal projection of the area occupied by the second groove on the substrate does not overlap the geometric center. The optical pattern is disposed in the first groove and the second groove, and has a transflective characteristic.

Description

Light source module

The present invention relates to a backlight module, and in particular, to a light source module with an asymmetric package structure.

With the increasing application of non-self-emissive displays such as liquid crystal displays, the design of backlight modules also needs to be adjusted for different applications. In order to meet the needs of display panel products with high dynamic range (HDR) and high contrast, the backlight module needs to have local dimming. Therefore, the direct type backlight module as the main light source structure has gradually become the mainstream of the market. Since this type of backlight module is expected to achieve a relatively thin thickness (for example, the optical distance is less than 10 mm), the light-emitting element is usually covered with an encapsulation layer with a reflective member or a reflective structure to achieve a relatively uniform light-emitting surface of the backlight module. light effect.

However, in the process of transmitting part of the light emitted from the light-emitting element in the encapsulation layer, it will still be transmitted laterally (for example, perpendicular to the light-emitting direction) to adjacent or distant light sources (ie, perpendicular to the light-emitting direction) through multiple total reflections in the encapsulation layer. Another light-emitting element) area, causing the edge halo effect (Halo effect) around the light-emitting area of the light-emitting element, resulting in blurred edges of the displayed image, resulting in a decrease in the overall display quality (such as display contrast). On the other hand, due to the arrangement of the reflector or the reflective structure, the light-emitting surface of this type of backlight module is likely to generate reflective dark spots in the area where the light-emitting elements overlap, which affects the overall light-emitting uniformity. Therefore, how to improve the light emission uniformity of the ultra-thin direct type backlight module is one of the research and development priorities of relevant manufacturers.

The invention provides a light source module, which can effectively improve the total light output and light output uniformity in a specific light output area.

The light source module of the present invention includes a substrate, a light-emitting element, a package structure and an optical pattern. The light emitting element and the encapsulation structure are arranged on the surface of the substrate, and the encapsulation structure covers the light emitting element. The package structure has a first groove and a second groove that are communicated with each other. The light emitting element is located between the first groove and the substrate. The second groove is located between the first groove and the substrate. The vertical projection of the area occupied by the first groove on the substrate has a geometric center. The light-emitting element is located at the geometric center. The vertical projection of the area occupied by the second groove on the substrate does not overlap with the geometric center. The optical pattern is arranged in the first groove and the second groove, and has the characteristics of partial penetration and partial reflection.

In an embodiment of the present invention, the vertical projection of the package structure of the light source module on the substrate has an axis of symmetry. The axis of symmetry passes through the geometric center, and the two grooves and the light-emitting element are arranged along the axis of the axis of symmetry.

In an embodiment of the present invention, the above-mentioned package structure of the light source module further has a first side edge and a second side edge that are opposite to each other in the axial direction of the axis of symmetry. There is a first distance between the first side edge and the geometric center, and a second distance between the second side edge and the geometric center, and the first distance is smaller than the second distance.

In an embodiment of the present invention, the ratio of the first distance to the second distance of the light source module is less than 0.8.

In an embodiment of the present invention, the above-mentioned package structure of the light source module further has a ridgeline defining the first groove. There is a distance D between the ridgeline and the geometric center in the axial direction of the axis of symmetry. The area occupied by the second groove has a width W in the axial direction of the symmetry axis, and satisfies W<D.

In an embodiment of the present invention, the light-emitting element of the above-mentioned light source module has an element length L in the axial direction of the axis of symmetry. The package structure also has a groove bottom surface that defines a second groove. The groove bottom surface has a width W' in the axial direction of the axis of symmetry, and satisfies W' < D-(L/2).

In an embodiment of the present invention, the package structure of the light source module and the light emitting element have a maximum thickness T and an element thickness t respectively in the direction of the normal line of the surface of the substrate. The virtual connection line with the shortest distance between the ridgeline and the light-emitting element has an included angle θ with the normal direction of the surface of the substrate, and satisfies D=L/2+(T-t)•tanθ.

In an embodiment of the present invention, the above-mentioned package structure of the light source module further has a bottom surface of the groove defining the first groove. The light emitting element has a top surface facing the first groove, and the distance between the bottom surface of the groove of the package structure and the top surface of the light element is greater than 0.

In an embodiment of the present invention, the above-mentioned package structure of the light source module further includes an edge line surrounding the first groove and the second groove and a groove bottom surface defining the second groove. The distance between the ridgeline and the surface of the substrate, in the direction perpendicular to the substrate, defines the maximum thickness of the package structure. There is a distance between the bottom surface of the groove and the ridge in a direction perpendicular to the substrate, and the distance is less than or equal to the maximum thickness of the package structure.

In an embodiment of the present invention, the optical pattern of the above-mentioned light source module includes a first part and a second part. The second part is disposed between the first part and the substrate. The first portion has a plurality of reflective particles, and the second portion has a plurality of wavelength converting particles.

In an embodiment of the present invention, the above-mentioned package structure of the light source module further includes an edge line surrounding the first groove and the second groove and a groove bottom surface defining the second groove. The first portion of the optical pattern contacts the bottom surface of the groove. There is a distance d between the bottom surface of the groove and the ridge in a direction perpendicular to the substrate. The second portion has a thickness t' in a direction perpendicular to the substrate and satisfies t' < 2d/3.

In an embodiment of the present invention, the light transmittance of the optical pattern of the light source module is between 10% and 50%.

In an embodiment of the present invention, the optical pattern of the above-mentioned light source module includes a light-transmitting substrate and a plurality of reflective particles. These reflective particles are dispersed in the light-transmitting base material.

In an embodiment of the present invention, the material of the plurality of reflective particles of the light source module includes silicon dioxide, titanium dioxide, metal materials, or a combination thereof.

Based on the above, in the light source module of an embodiment of the present invention, the light emitting elements are disposed overlappingly in the geometric center of the first groove of the package structure, and the first groove is filled with an optical pattern. The characteristic of partially penetrating and partially reflecting through the optical pattern can adjust the forward light output of the light-emitting element and improve the dark spot phenomenon formed by part of the light reflected by the optical pattern. On the other hand, one side of the light-emitting element is provided with a second groove communicating with the first groove, and the above-mentioned optical pattern further extends into the second groove. Accordingly, most of the light can be deflected toward the side area of the light-emitting element relative to the second groove, so as to effectively increase the light output in a specific area, and at the same time prevent the light from being transmitted to the light-emitting area of the adjacent light-emitting element.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are illustrative and not limiting of the present invention.

FIG. 1 is a schematic top view of a light source module according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the light source module of FIG. 1 . FIG. 3A is an illuminance distribution diagram of the light source module of FIG. 1 without an optical film. FIG. 3B is an illuminance distribution diagram of the light source module of FIG. 1 after passing through the optical film. In particular, Fig. 2 corresponds to the section line A-A' in Fig. 1 . For the sake of clarity, FIG. 1 omits the illustration of the optical film 200 of FIG. 2 .

Referring to FIGS. 1 and 2 , the light source module 10 includes a substrate 100 , a plurality of light emitting elements 110 and a plurality of packaging structures 120 . A plurality of light emitting elements 110 and a plurality of encapsulation structures 120 are disposed on the surface 100s of the substrate 100 , and the encapsulation structures 120 respectively cover the light emitting elements 110 . For example, a plurality of light-emitting elements 110 can be arranged in an array on the substrate 100 (eg, arranged in multiple columns and rows in directions X and Y, respectively), and a plurality of packaging structures 120 overlapping these light-emitting elements 110 are connected to each other arrangement. The material of the packaging structure 120 includes, for example, plastic, resin material (eg, acrylic), or other suitable transparent packaging materials.

It should be noted that, the content disclosed in FIG. 1 is only used for exemplary illustration, and the present invention is not limited to the arrangement of the plurality of light-emitting elements 110 and the plurality of packaging structures 120 . In other embodiments, the arrangement of the plurality of light emitting elements 110 and the plurality of packaging structures 120 can be adjusted according to actual optical design or application requirements. For example, the two adjacent packaging structures 120 can also be arranged separately from each other. on the substrate 100 . On the other hand, in this embodiment, the number of light-emitting elements 110 covered by each package structure 120 is exemplified by one example, which does not mean that the present invention is limited by this. The number of the light-emitting elements 110 covered by the package structure 120 can also be more than two, for example, three light-emitting elements that can emit red light, green light and blue light respectively.

In this embodiment, the light emitting element 110 may be a light emitting diode (LED), such as a sub-millimeter light emitting diode (mini LED) or a micro light emitting diode (micro LED). It should be noted that the vertical projection of the package structure 120 on the surface 100s of the substrate 100 has a substantially rectangular outer contour, but the invention is not limited to this. In other embodiments, the vertical projection of the package structure on the substrate 100 may also have a circular arc shape, a polygon shape, or other suitable shapes. On the other hand, in the present embodiment, the vertical projection of the package structure 120 on the surface 100s of the substrate 100 has an axis of symmetry SA. That is, the two parts of the package structure 120 located on both sides of the symmetry axis SA exhibit mirror symmetry.

In order to deflect most of the light from the light emitting element 110 into one side area of the light emitting element 110 , the encapsulation structure 120 presents an asymmetric structure distribution in a specific direction. For example, the package structure 120 of the present embodiment has an asymmetrical groove overlapping the light-emitting element 110 , and the asymmetrical groove has asymmetry in the axial direction (eg, the direction X) of the symmetry axis SA.

In detail, the above-mentioned asymmetric grooves can be formed by connecting the first groove 120g1 and the second groove 120g2 , and the second groove 120g2 is located between the first groove 120g1 and the substrate 100 . In this embodiment, the vertical projection of the area occupied by the first groove 120g1 on the substrate 100 has a geometric center C, the symmetry axis SA of the package structure 120 passes through the geometric center C, and the area occupied by the second groove 120g2 is on the substrate 100 The vertical projection on does not overlap the geometric center C.

More specifically, the vertical projection of the area occupied by the second groove 120g2 on the substrate 100 overlaps the symmetry axis SA, and is located between the geometric center C and the first side edge 120e1 . In addition, the package structure 120 also has a first side edge 120e1 and a second side edge 120e2 opposite to each other in the axial direction of the symmetry axis SA. There is a first distance L1 between the first side edge 120e1 and the geometric center C, and a second distance L2 between the second side edge 120e2 and the geometric center C, and the first distance L1 is smaller than the second distance L2. In other words, the above-mentioned asymmetric groove is disposed at a position of the package structure 120 closer to the first side edge 120e1. For example, in this embodiment, the ratio of the first distance L1 to the second distance L2 may be less than 0.8, so that the package structure 120 has better asymmetry in the axial direction of the symmetry axis SA.

In this embodiment, the light emitting element 110 can be selectively placed on the position where the substrate 100 overlaps the geometric center C. As shown in FIG. In other words, the second groove 120g2 and the light emitting element 110 are axially arranged along the axis of symmetry SA of the package structure 120 . In order to deflect most of the light from the light emitting element 110 to a specific side area of the light emitting element 110 (eg, the right side area of the light emitting element 110 in FIG. 2 ), the light source module 10 further includes filling the first groove 120g1 and the second groove 120g1 . The optical pattern 130 of the groove 120g2, and the optical pattern 130 has the property of being partially penetrating and partially reflecting (transflective). For example, the optical pattern 130 may include a light-transmitting substrate 131 and a plurality of reflective particles 132 dispersedly disposed in the light-transmitting substrate 131 . The material of the transparent substrate 131 includes, for example, acrylic, epoxy, hexamethyldisiloxane (HMDSO), or other suitable polymer materials. The material of the reflective particles 132 includes, for example, silicon dioxide (SiO ₂ ), titanium dioxide (TiO ₂ ), metal materials, or a combination thereof, or other materials with appropriate reflectivity.

By adjusting the doping concentration of the reflective particles 132, the transmittance of the optical pattern 130 can be adjusted between 10% and 50% (or, the concentration of the reflective particles 132 in the optical pattern 130 can be adjusted between 20% and 60%). , to meet the needs of different optical designs (such as light-emitting light types with different asymmetries). For example, the light LB1 from the light-emitting element 110 and transmitted toward the second groove 120g2 is transmitted toward the side of the light-emitting element 110 away from the second groove 120g2 (eg, the right side in FIG. 2 ) after being reflected by the reflective particles 132 . Similarly, the light (not shown) from the light emitting element 110 and transmitted toward the first groove 120g1 may be transmitted toward the substrate 100 after being reflected by the reflective particles 132 in the first groove 120g1. Since the substrate 100 of this embodiment is a reflective substrate, the light reflected by the reflective particles 132 in the first grooves 120g1 can be further transmitted laterally into the package structure 120 through the reflection of the substrate 100 , but not limited thereto.

Further, the package structure 120 also has a ridgeline RL1 defining the first groove 120g1 , and an included angle θ is formed between the ridgeline RL1 and the dummy connection line IL with the shortest distance between the light-emitting element 110 and the normal direction of the surface 100s of the substrate 100 . , and the configuration relationship between the package structure 120 and the light-emitting element 110 satisfies the following formula: D=L/2+(Tt)•tanθ, where D is the axis of the symmetry axis SA between the ridgeline RL1 and the geometric center C (for example, the direction X ), L is the element length of the light-emitting element 110 in the axial direction of the symmetry axis SA, t is the element thickness of the light-emitting element 110 in the normal direction of the surface 100s of the substrate 100 , T is the thickness of the package structure 120 on the substrate 100 The maximum thickness in the normal direction of the surface 100s.

Specifically, the above-mentioned included angle θ depends on the ratio of the refractive index of the material of the packaging structure 120 to air. In this embodiment, the refractive index of the material of the package structure 120 may be between 1.1 and 1.7. Correspondingly, the above-mentioned included angle θ may be between 36 degrees and 65 degrees. Accordingly, the light of the light emitting element 110 can have a better asymmetric light type after exiting the package structure 120 . It is worth mentioning that, in addition to reflecting part of the light (eg, light LB1 ) from the light-emitting element 110 by the reflective particles 132 of the optical pattern 130 , the refractive index of the encapsulation structure 120 can be selectively larger than the light-transmitting base of the optical pattern 130 . The refractive index of the material 131 enables another part of the light (eg, the light LB2 ) to be totally reflected at the interface between the package structure 120 and the optical pattern 130 , so as to increase the chance of the light being transmitted laterally in the package structure 120 .

For example, the package structure 120 defines the groove bottom surface 120s1 of the first groove 120g1 , and its cross-sectional profile (eg, the XZ plane or the YZ plane) may have an arc segment, and the arc segment extends from the ridge line RL1 to the light-emitting element 110 Directly above. The curvature change of the arc segment can be adjusted according to different total reflection requirements, which is not limited in the present invention. On the other hand, since the optical pattern 130 has an adjustable transmittance, the light output in the forward direction (eg, the direction Z) of the light emitting element 110 can be adjusted, and the reflection of some (forward) light rays passing through the optical pattern 130 can be improved. The dark spots formed later. For example, part of the light (eg, the light LB3 ) transmitted from the light-emitting element 110 toward the first groove 120g1 may directly pass through the optical pattern 130 without being reflected back to the encapsulation structure 120 by the reflective particles 132 .

In this embodiment, the vertical projection of the area occupied by the first groove 120g1 on the surface 100s of the substrate 100 is, for example, a circle whose contour is located at the aforementioned geometric center C. In other words, the width of the vertical projection of the area occupied by the first groove 120g1 on the surface 100s of the substrate 100 in the axial direction of the symmetry axis SA is twice the value of the distance D (ie, 2D in FIG. 1 ) . However, the present invention is not limited thereto, and according to other embodiments, the vertical projection profile of the area occupied by the first groove on the surface 100s of the substrate 100 may also be a quasi-circle, an ellipse, or an ellipse-like shape.

The vertical projection of the area occupied by the second groove 120g2 on the surface 100s of the substrate 100 , its contour is, for example, semicircular, and has a width W smaller than the distance D in the axial direction of the symmetry axis SA, but the present invention does not use this limited. On the other hand, the package structure 120 further has a groove bottom surface 120s2 defining the second groove 120g2, and the vertical projection of the groove bottom surface 120s2 on the surface 100s of the substrate 100 has a width W' in the axial direction of the symmetry axis SA, and satisfies W' < D-(L/2). In this embodiment, the area surrounded by the ridge line RL2 of the second groove 120g2 defined by the package structure 120 and the groove bottom surface 120s2 do not overlap the light emitting element 110 in the normal direction of the surface 100s of the substrate 100, but do not limited. In other embodiments, the light emitting element 110 may partially overlap the area surrounded by the ridgeline RL2 of the package structure 120 defining the second groove 120g2 in the normal direction of the surface 100s of the substrate 100, but not overlap the groove bottom surface 120s2.

It is particularly mentioned that, in this embodiment, the second groove 120g2 may have a high aspect ratio. That is, the sidewall of the package structure 120 defining the second groove 120g2 is steeper. Accordingly, the light from the light-emitting element 110 can be effectively deflected toward the area of the light-emitting element 110 on one side of the light-emitting element 110 relative to the second groove 120g2, so as to increase the light output in a specific area, and at the same time prevent the light from being transmitted to the adjacent light-emitting elements 110. light-emitting area.

In this embodiment, the package structure 120 may optionally have a third groove 120g3, and the first groove 120g1 communicates between the second groove 120g2 and the third groove 120g3. That is to say, the asymmetric groove in this embodiment may be a combination of the first groove 120g1, the second groove 120g2 and the third groove 120g3. It should be noted that the optical pattern 130 is not filled into the third groove 120g3, but the invention is not limited thereto. In other embodiments, the optical pattern 130 may also be filled in the partial area occupied by the third groove 120g3.

In detail, the package structure 120 further has a ridgeline RL3 defining the third groove 120g3, and the ridgeline RL3 surrounds the first groove 120g1 and the second groove 120g2. The vertical projection of the area occupied by the first groove 120g1 and the second groove 120g2 on the surface 100s of the substrate 100 completely overlaps the vertical projection of the area occupied by the third groove 120g3 on the surface 100s of the substrate 100 . More specifically, the vertical projected area of the area occupied by the third groove 120g3 on the surface 100s of the substrate 100 is larger than the vertical projected area of the area occupied by the first groove 120g1 and the second groove 120g2 on the surface 100s of the substrate 100 .

In order to effectively deflect the light transmitted to one side of the light-emitting element 110 in the future (for example, the left side of the light-emitting element 110 in FIG. 2 ) to the other side of the light-emitting element 110 (for example, the right side of the light-emitting element 110 in FIG. 2 ), the packaging structure 120 The distance between the groove bottom surface 120s1 defining the first groove 120g1 and the top surface 110t of the light emitting element 110 needs to be greater than 0 to ensure the reflection effect of the portion of the optical pattern 130 located in the second groove 120g2. It should be understood that, the distance between the bottom surface 120s1 of the groove and the top surface 110t of the light emitting element 110 can be adjusted according to actual light type requirements.

On the other hand, in the normal direction of the surface 100s of the substrate 100, the distance between the ridgeline RL3 and the surface 100s of the substrate 100 can define the maximum thickness T of the package structure 120, and there is a distance between the groove bottom surface 120s2 and the ridgeline RL3 d, and the distance d is smaller than the maximum thickness T of the package structure 120 . In other words, there may be a gap between the bottom surface 120s2 of the groove and the surface 100s of the substrate 100 , and the gap can allow part of the light to pass through to maintain the uniformity of light output on the other side. However, the present invention is not limited thereto, and according to other embodiments, the distance d between the groove bottom surface 120s2 and the ridge line RL3 can also be selectively equal to the maximum thickness T of the package structure 120 . That is to say, the connected first groove 120g1 , the second groove 120g2 and the third groove 120g3 can also penetrate through the package structure 120 , and the optical pattern 130 can directly cover the surface 100s of the substrate 100 .

It is worth noting that in the axial direction of the symmetry axis SA, the change of the slope of the surface 120as of the package structure 120 on one side of the asymmetric groove is different from the change of the slope of the surface 120bs on the other side of the asymmetric groove. For example, the slope of the surface 120as of the package structure 120 located on one side of the light-emitting element 110 gradually increases from the ridge line RL3 to the first side edge 120e1 at a first rate of change, and the slope of the surface 120bs of the package structure 120 located on the other side of the light-emitting element 110 From the ridge line RL3 to the second side edge 120e2, the second change rate gradually increases, and the second change rate is smaller than the first change rate. Since the light-emitting element 110 is disposed closer to the first side edge 120e1 , the surface 120bs with a relatively gentle slope can increase the chance of light passing laterally in the package structure 120 , which helps to improve the uniformity of light output from the light-emitting element 110 toward a specific side. sex.

Referring to FIG. 3A , through the above-mentioned arrangement of the package structure 120 and the optical pattern 130 , the light emitting pattern of the light emitting element 110 can be asymmetric in the direction X (ie, the axis of the symmetry axis SA of the package structure 120 ), but Symmetry in direction Y. As shown in the illuminance distribution curve on the right side in FIG. 3A , the light output of the light emitting element 110 on the XZ plane is mostly concentrated on a specific side (eg, the lower side of the horizontal dotted line in FIG. 3A ). On the contrary, as shown in the lower illuminance distribution curve in FIG. 3A , the light output of the light-emitting element 110 on the YZ plane is evenly distributed on opposite sides of the light-emitting element 110 (for example, the left and right sides of the vertical dotted line in FIG. 3A ).

Please continue to refer to FIG. 2 , in particular, the light source module 10 of this embodiment may further include an optical film 200 , which is disposed on the plurality of light emitting elements 110 and the plurality of packaging structures 120 overlappingly. The optical film 200 may be, but not limited to, a silicon film, a diffuser, a combination of the above-mentioned multilayers, or other optical films suitable for improving uniformity. In other embodiments, the optical film 200 may also be a wavelength conversion film, and the wavelength conversion film includes, for example, a quantum dot film, a phosphor film, and the like. For example, in this embodiment, the optical film 200 is, for example, a film having a plurality of iris structures (not shown), and these iris structures can be used to deflect the light from the package structure 120 to a predetermined value In order to improve the light output of the light source module 10 within the viewing angle range. As shown in FIG. 3B , the light emitting pattern of the light emitting element 110 has symmetry in at least two axial directions (eg, the direction X and the direction Y) after being acted by the optical film 200 . More specifically, the light source module 10 of this embodiment can be used as a backlight module with high light-gathering properties.

Hereinafter, other embodiments will be listed to describe the present disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted.

FIG. 4 is a schematic top view of a package structure according to another embodiment of the present invention. FIG. 5 is a schematic top view of a package structure according to still another embodiment of the present invention. Referring to FIG. 4 , the difference between the package structure 120A of the present embodiment and the package structure 120 in FIG. 1 is that the configurations of the second grooves are different. Specifically, the vertical projection profile of the area occupied by the second groove 120g2A of the package structure 120A on the surface 100s (as shown in FIG. 2 ) of the substrate 100 is like a meniscus. In detail, a portion of the ridgeline RL2A of the package structure 120A defining the second groove 120g2A is bent toward the first side edge 120e1 of the package structure 120A.

However, the present invention is not limited to this. In yet another embodiment shown in FIG. 5 , the ridgeline RL2B of the package structure 120B defining the second groove 120g2B may also be bent toward the second side edge 120e2 of the package structure 120B in its entire section. In other words, the vertical projection profile of the second groove 120g2B of FIG. 5 on the surface 100s of the substrate 100 (as shown in FIG. 2 ) may also be a football shape.

In particular, since the package structure 120A of FIG. 4 (or the package structure 120B of FIG. 5 ), the optical pattern and the light-emitting element are similar to the light source module 10 of FIGS. 1 and 2 , the detailed description can refer to the foregoing The relevant paragraphs of the embodiment will not be repeated here.

6 is a schematic cross-sectional view of a light source module according to a second embodiment of the present invention. Referring to FIG. 6 , the difference between the light source module 10A of the present embodiment and the light source module 10 of FIG. 2 is that the composition of the optical patterns is different. Specifically, the optical pattern 130A of the light source module 10A includes a first part 130A1 and a second part 130A2 , and the second part 130A2 is disposed between the first part 130A1 and the substrate 100 . It should be noted that the first part 130A1 of the optical pattern 130A has a light-transmitting base material 131 and a plurality of reflective particles 132 dispersedly arranged in the light-transmitting base material 131 , while the second part 130A2 has a light-transmitting base material 133 and dispersed A plurality of wavelength conversion particles 134 disposed in the light-transmitting substrate 133 .

In this embodiment, the materials of the transparent substrate 131 of the first portion 130A1 and the transparent substrate 133 of the second portion 130A2 can be selectively the same, but not limited thereto. Since the functions of the reflective particles 132 of the first part 130A1 are similar to those of the reflective particles 132 in FIG. 2 , please refer to the relevant paragraphs of the foregoing embodiments for detailed description, which will not be repeated here.

For example, the wavelength conversion particles 134 of the second portion 130A2 of the optical pattern 130A may have a single particle size or multiple particle sizes to meet different light mixing requirements. Specifically, in this embodiment, the first portion 130A1 and the second portion 130A2 of the optical pattern 130A are respectively disposed in the first groove 120g1 and the second groove 120g2 of the package structure 120 . The second portion 130A2 has a thickness t' in the direction normal to the surface 100s of the substrate 100, and satisfies t'<2d/3, where d is the normal between the groove bottom surface 120s2 and the ridge line RL3 at the surface 100s of the substrate 100 distance in the direction. Accordingly, the light mixing effect of the light exiting the package structure 120 can be optimized.

However, the present invention is not limited thereto, and in other embodiments, the first portion 130A1 of the optical pattern 130A can also be further filled into the second groove 120g2 of the package structure 120, or the second portion 130A2 can also be further filled into the package inside the first groove 120g1 of the structure 120 . In other words, the present invention is not limited to the content disclosed in FIG. 6 (ie, the interface between the first portion 130A1 and the second portion 130A2 of the optical pattern 130A is flush with the bottom surface 120s1 of the groove of the package structure 120 ).

To sum up, in the light source module according to an embodiment of the present invention, the light emitting elements are disposed overlappingly in the geometric center of the first groove of the package structure, and the first groove is filled with an optical pattern. The characteristic of partially penetrating and partially reflecting through the optical pattern can adjust the forward light output of the light-emitting element and improve the dark spot phenomenon formed by part of the light reflected by the optical pattern. On the other hand, one side of the light-emitting element is provided with a second groove communicating with the first groove, and the above-mentioned optical pattern further extends into the second groove. Accordingly, most of the light can be deflected toward the side area of the light-emitting element relative to the second groove, so as to effectively increase the light output in a specific area, and at the same time prevent the light from being transmitted to the light-emitting area of the adjacent light-emitting element.

Although the present invention has been disclosed above by the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.

10, 10A: light source module 100: Substrate 100s, 120as, 120bs: Surface 110: Light-emitting element 110t: top surface 120, 120A, 120B: Package structure 120e1: First side edge 120e2: Second side edge 120g1: first groove 120g2, 120g2A, 120g2B: Second groove 120g3: The third groove 120s1, 120s2: groove bottom 130, 130A: Optical pattern 130A1: Part 1 130A2: Part II 131, 133: light-transmitting substrate 132: Reflected Particles 134: Wavelength Conversion Particles 200: Optical film C: geometric center d, D: distance IL: virtual wire L: element length L1: first distance L2: Second distance LB1, LB2, LB3: Light RL1, RL2, RL2A, RL2B, RL3: Ridges SA: Symmetry axis t: component thickness t': thickness T: maximum thickness W, W': width X, Y, Z: direction θ: included angle A-A': section line

FIG. 1 is a schematic top view of a light source module according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the light source module of FIG. 1 . FIG. 3A is an illuminance distribution diagram of the light source module of FIG. 1 without an optical film. FIG. 3B is an illuminance distribution diagram of the light source module of FIG. 1 after passing through the optical film. FIG. 4 is a schematic top view of a package structure according to another embodiment of the present invention. FIG. 5 is a schematic top view of a package structure according to still another embodiment of the present invention. 6 is a schematic cross-sectional view of a light source module according to a second embodiment of the present invention.

10: Light source module

100: Substrate

100s, 120as, 120bs: Surface

110: Light-emitting element

110t: top surface

120: Package structure

120e1: First side edge

120e2: Second side edge

120g1: first groove

120g2: Second groove

120g3: The third groove

120s1, 120s2: groove bottom

130: Optical Pattern

131: Light-transmitting substrate

132: Reflected Particles

200: Optical film

C: geometric center

d, D: distance

IL: virtual wire

L: element length

L1: first distance

L2: Second distance

LB1, LB2, LB3: Light

RL1, RL3: Ridgeline

t: component thickness

T: maximum thickness

W, W': width

X, Y, Z: direction

θ: included angle

A-A': section line

Claims (14)

A light source module, comprising: a substrate; a light-emitting element disposed on a surface of the substrate; an encapsulation structure disposed on the surface of the substrate and covering the light-emitting element, the encapsulation structure has a first groove and a second groove that communicate with each other, and the light-emitting element is located between the first groove and the substrate the second groove is located between the first groove and the substrate, wherein the vertical projection of the area occupied by the first groove on the substrate has a geometric center, the light-emitting element is located at the geometric center, and the The vertical projection of the area occupied by the second groove on the substrate does not overlap the geometric center; and An optical pattern is arranged in the first groove and the second groove, and has the characteristics of partial penetration and partial reflection. The light source module of claim 1, wherein the vertical projection of the package structure on the substrate has a symmetry axis, the symmetry axis passes through the geometric center, and the second groove and the light-emitting element are along the symmetry axis axial arrangement. The light source module according to claim 2, wherein the package structure further has a first side edge and a second side edge opposite to each other in the axial direction of the symmetry axis, and between the first side edge and the geometric center There is a first distance, a second distance between the second side edge and the geometric center, and the first distance is smaller than the second distance. The light source module of claim 3, wherein a ratio of the first distance to the second distance is less than 0.8. The light source module according to claim 2, wherein the package structure further has an edge line defining the first groove, and a distance D in the axial direction of the symmetry axis between the edge line and the geometric center, the second The area occupied by the groove has a width W in the axial direction of the symmetry axis, and satisfies W<D. The light source module according to claim 5, wherein the light-emitting element has an element length L in the axial direction of the symmetry axis, the package structure further has a groove bottom surface defining the second groove, and the groove bottom surface is in the The axis of symmetry has a width W' in the axial direction, and satisfies W' < D-(L/2). The light source module according to claim 6, wherein the package structure and the light-emitting element respectively have a maximum thickness T and an element thickness t in the normal direction of the surface of the substrate, and the gap between the edge and the light-emitting element is There is an included angle θ between a virtual connection line with the shortest distance and the normal direction of the surface of the substrate, and satisfies D=L/2+(Tt)•tanθ. The light source module of claim 1, wherein the package structure further has a groove bottom surface defining the first groove, the light-emitting element has a top surface facing the first groove, and the package structure has a bottom surface. The distance between the bottom surface of the groove and the top surface of the light-emitting element is greater than 0. The light source module of claim 1, wherein the package structure further has an edge line surrounding the first groove and the second groove and a groove bottom surface defining the second groove, the edge line and the substrate The distance between the surfaces in the direction perpendicular to the substrate defines a maximum thickness of the package structure, there is a distance between the bottom surface of the groove and the ridge in the direction perpendicular to the substrate, and the distance is less than equal to the maximum thickness of the package structure. The light source module of claim 1, wherein the optical pattern includes a first part and a second part, the second part is disposed between the first part and the substrate, the first part has a plurality of reflective particles, and The second portion has a plurality of wavelength converting particles. The light source module of claim 10, wherein the package structure further has an edge line surrounding the first groove and the second groove and a groove bottom surface defining the second groove, the optical pattern The first part contacts the bottom surface of the groove, there is a distance d between the bottom surface of the groove and the ridge in the direction perpendicular to the substrate, the second part has a thickness t' in the direction perpendicular to the substrate, and satisfies t' < 2d/3. The light source module of claim 1, wherein the light transmittance of the optical pattern is between 10% and 50%. The light source module of claim 1, wherein the optical pattern comprises: a light-transmitting substrate; and A plurality of reflective particles are dispersedly arranged in the light-transmitting base material. The light source module of claim 13, wherein the material of the reflective particles comprises silicon dioxide, titanium dioxide, metal materials or a combination thereof.

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