TW202202010A - Transparent circuit board and manufacturing method thereof - Google Patents

Abstract

A method for manufacturing a transparent circuit board, comprising the steps of: providing a carrier board comprising a substrate layer and peelable copper layers disposed on both sides of the substrate layer; electroplating on the peelable copper layer to form multiple electroplated circuits , The electroplated circuit has a snake shape; a plurality of circuit holes are formed in each electroplated circuit; a first transparent cover layer is pressed on the electroplated circuit; etching is performed to obtain a conductive circuit, and the conductive circuit is exposed to the first transparent cover A second transparent cover layer is pressed on one side of the layer, and a plurality of line spacing holes are opened, the line spacing holes penetrate the first transparent cover layer and the second transparent cover layer between each adjacent two conductive lines to obtain a transparent circuit board. In addition, the invention also provides a transparent circuit board.

Description

Transparent circuit board and method of making the same

The invention relates to a transparent circuit board and a manufacturing method thereof.

At present, there are two methods for making transparent flexible circuit boards in the industry: one is to use transparent substrates to make thick copper, usually 12um or 18um rolled copper, and then use the subtractive method to make fine lines and large spacing lines, and finally use transparent The cover film is used for external protection to form a transparent circuit board; the second is to use a transparent substrate to make thin copper, which is usually deposited on the transparent substrate first, then use the additive semi-fabrication method to make fine lines and large spacing lines, and finally use a transparent cover film to make External protection to form a transparent circuit board.

However, the two methods have poor light transmittance and flexural resistance in the production of flexible transparent circuit boards, and are not easy to restore their original shape after being pulled by external forces.

In view of this, it is necessary to provide a transparent circuit board with good light transmittance and flex resistance.

In addition, it is also necessary to provide a method of manufacturing a transparent circuit board.

A method for manufacturing a transparent circuit board, comprising the steps of:

A carrier board is provided, the carrier board includes a base material layer and peelable copper layers disposed on both sides of the base material layer.

Electroplating on the strippable copper layer to form a plurality of electroplating lines, the electroplating lines are in a snake shape, and the electroplating lines include a first surface connected to the strippable copper layer, and a surface away from the first surface. A second surface and two side surfaces connecting the first surface and the second surface.

A plurality of circuit holes are opened in each of the electroplating circuits, and the circuit holes pass through the first surface and the second surface.

A first transparent cover layer is laminated on the electroplating line, and the peelable copper layer is removed so that the first surface is exposed to the first transparent cover layer.

The first surface and the area near the first surface are etched to obtain conductive lines, and a second transparent cover layer is laminated on the side of the conductive lines exposed on the first transparent cover layer. and opening a plurality of line spacing holes, the line spacing holes penetrating the first transparent cover layer and the second transparent cover layer between each adjacent two conductive lines to obtain the transparent circuit board.

Further, the step "electroplating on the peelable copper layer to form a plurality of electroplating lines" specifically includes: arranging a patterned photosensitive layer on the peelable copper layer, and the patterned photosensitive layer includes a plurality of spaced distributions. the slot, the strippable copper layer is exposed in the slot. Electroplating is performed in the slot to form the electroplating line. and removing the patterned photosensitive layer.

Further, the peelable copper layer includes a first copper layer and a second copper layer, the first copper layer is disposed on the base material layer, and the second copper layer is disposed on the first copper layer layer, the bonding strength between the base material layer and the first copper layer is greater than the bonding strength between the first copper layer and the second copper layer.

Further, the material of the electroplating circuit includes a metal element, the electroplating circuit includes a first area and a second area other than the first area, the first area is adjacent to the second surface, the The second region is adjacent to the first surface, the lattice arrangement of the metal element in the first region is the same as the lattice arrangement of the second copper layer, and the metal element in the second region has the same lattice arrangement. The lattice arrangement is different from the lattice arrangement of the metal element in the first region.

Further, the manufacturing method also includes:

The first copper layer is removed so that the second copper layer is attached to the first transparent capping layer. and etching the second copper layer and the first region to obtain the conductive line, and a surface of the second region connecting the first region is formed with a plurality of microstructures.

Further, the manufacturing method further includes: forming a first blackening layer on at least the second surface, the side surface and the inner surface of the circuit hole of each of the electroplating lines, wherein the first blackening layer is A transparent cover layer is formed on the first blackened layer. and forming a second blackening layer on the conductive circuit, the first blackening layer and the second blackening layer are connected to cover the conductive circuit, wherein the second transparent covering layer is formed on the second blackening layer.

Further, the step of "forming at least a first blackening layer on the second surface, the side surface and the inner surface of the circuit hole of each of the electroplating lines" specifically includes: providing an oxidizing agent, and the oxidizing agent includes At least one of nitric acid solution, potassium sulfide solution, potassium polysulfide solution and potassium thiosulfate solution.

The oxidizing agent is sprayed on the second surface, the side surface and the inner surface of the circuit hole, and the oxidizing agent oxidizes the second surface, the side surface and the inner surface of the circuit hole. and washing and drying to obtain the first blackened layer.

Further, the first transparent cover layer includes a first transparent adhesive layer and a first transparent medium layer disposed on the first transparent adhesive layer, and the second transparent cover layer includes a second transparent adhesive layer and a second transparent medium layer disposed on the second transparent adhesive layer, the conductive circuit is embedded in the first transparent adhesive layer and the second transparent adhesive layer, and the first transparent adhesive layer and the second transparent adhesive layer to fill the circuit holes, the first transparent medium layer is disposed on the side of the first transparent adhesive layer away from the conductive circuit, and the second transparent medium layer is disposed on the side of the conductive circuit. The second transparent adhesive layer is away from the side of the conductive line.

A transparent circuit board includes a conductive circuit, a transparent medium layer arranged on both sides of the conductive circuit, a transparent adhesive layer filled between the transparent medium layer and the conductive circuit, and the conductive circuit includes a penetrating circuit. a plurality of circuit holes, the transparent adhesive layer is filled in the circuit holes, the transparent circuit board further includes a line spacing hole arranged through, and the line spacing hole is arranged between each adjacent two conductive lines .

Further, the transparent circuit board further includes a blackening layer, and the blackening layer is disposed on the outer surface of the conductive circuit and the inner surface of the circuit hole.

Further, the diameter of the line hole is 0.5-1 micrometer, and the line width of the conductive line is 2-15 micrometer.

Compared with the prior art, the transparent circuit board provided by the present invention is provided with circuit holes and line spacing holes, which is beneficial to improve the overall tensile performance of the conductive circuit and the transparent circuit board, and at the same time improve the overall light transmission of the transparent circuit board. sex.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

The present invention provides a method for manufacturing a transparent circuit board 100, comprising the steps of:

S1: Please refer to FIG. 1 , a carrier board 10 is provided, and the carrier board 10 includes a base material layer 11 and peelable copper layers 12 disposed on both sides of the base material layer 11 .

In this embodiment, the peelable copper layer 12 includes a first copper layer 121 and a second copper layer 122 , the first copper layer 121 is disposed on the base material layer 11 , and the second copper layer 121 The layer 122 is disposed on the first copper layer 121 .

In this embodiment, the first copper layer 121 is connected to the base material layer 11 by means of glue, and the second copper layer 122 is connected to the first copper layer 121 by electroplating. The bonding strength between the base material layer 11 and the first copper layer 121 is greater than the bonding strength between the first copper layer 121 and the second copper layer (ie, peeling off the first copper layer The minimum force required for 121 and the substrate layer 11 is greater than the minimum force for peeling the second copper layer 122 and the first copper layer 121). The thickness D1 of the first copper layer 121 is 10-30 microns, and the thickness D2 of the second copper layer 122 is 1-5 microns.

In this embodiment, the base material layer 11 is a hard resin layer, such as epoxy resin or glass fiber cloth. In other embodiments of the present invention, the material of the base material layer 11 can also be a flexible resin layer, such as polyimide, polyethylene terephthalate, polytetrafluoroethylene, polythiamine, polyamide Methyl methacrylate, polycarbonate or polyimide-polyethylene-terephthalate copolymer, etc.

S2: Please also refer to FIG. 2 to FIG. 6, electroplating to form a plurality of electroplating lines 20 on the strippable copper layer 12, the electroplating lines 20 including a first electrode connected to the strippable copper layer 12 The surface 21 , a second surface 22 away from the first surface 21 , and two side surfaces 23 connecting the first surface 21 and the second surface 22 .

In this embodiment, in step S2, the electroplating includes:

S21: Please refer to FIG. 2, FIG. 3 and FIG. 4, set a photosensitive layer 13 on the peelable copper layer 12, expose and develop the photosensitive layer 13 to obtain a patterned photosensitive layer 131, the graphic The photosensitive layer 131 includes a plurality of grooves 132 distributed at intervals, and part of the peelable copper layer 12 is exposed in the grooves 132. The extension direction of the carrier board 10 is distributed.

In this embodiment, the photosensitive layer 13 includes an adhesive, a photopolymerizable monomer, a photoinitiator, and a plasticizer. Wherein, the adhesive is used to make the photosensitive layer 13 have certain chemical, physical and mechanical properties, and the material of the adhesive includes esterified or amidated polystyrene resin. It does not contain a photosensitive group and is a photo-inert substance. It has good miscibility with components, film-forming properties, developing properties and film-removing properties. The photopolymerizable monomer is the main component of the photosensitive layer 13. In the presence of the photoinitiator, it is polymerized and cured by irradiation with active energy rays such as ultraviolet light, and the obtained cured product is insoluble in the developing solution, while The non-photosensitive part is removed after being developed by a developer, so that the patterned photosensitive layer 131 can be formed. The photopolymerizable monomer mainly includes polyfunctional unsaturated esters, such as triethylene glycol diacrylate, pentaerythritol trienoic acid esters, etc. The photoinitiator is a substance that decomposes into free radicals under the irradiation of ultraviolet light to initiate polymerization and cross-linking reactions, and the photoinitiator includes benzoin ether derivatives, thioxanthone derivatives, biphenyl derivatives, Benzophenone derivatives, etc. The plasticizer is used to increase the toughness of the photosensitive layer 13 , and the plasticizer mainly includes ethylene glycol diacetate and the like.

S22: Referring to FIG. 5 and FIG. 6, electroplating is performed in the slot 132 to form a plurality of the electroplating lines 20 distributed at intervals, and the patterned photosensitive layer 131 is removed. The thickness D3 of the electroplating circuit 20 is less than or equal to the thickness D4 of the photosensitive layer 13 , that is, the first surface 21 is lower than the outer surface of the photosensitive layer 13 or flush with the outer surface of the photosensitive layer 13 .

In this embodiment, a plurality of the electroplating lines 20 match the shape of the slot 132 , that is, the shape is substantially a snake, the second surface 22 is arc-shaped, and the second surface 22 is away from the peelable The copper layer 12 protrudes. By setting the electroplating circuit 20 in a snake shape, when the electroplating circuit 20 is stretched along the extending direction of the carrier board 10 , the electroplating circuit 20 is not easily broken, which is beneficial to increase the transparent circuit board 100 conductivity stability.

In this embodiment, the minimum line distance L1 between each two of the electroplating lines 20 is not less than 0.2-1 mm.

In this example, the material of the electroplating circuit 20 is copper, the electroplating circuit 20 includes a first area 24 and a second area 25 other than the first area 24, and the first area 24 is adjacent to the The second surface 22 and the second area 25 are adjacent to the first surface 21. During the electroplating process in step S22, the first surface 21 and the adjacent area (ie, the second area 25) formed by electroplating are firstly formed. The lattice arrangement of the copper element is the same as that of the second copper layer 122 (that is, the second copper layer 122 is equivalent to a seed crystal, and the crystal lattice of the copper element in the second region 25 is generated and grown in the same way as the seed crystal), and As the electroplating proceeds, another lattice arrangement different from the second copper layer 122 is created on the second region 25 , thereby forming the first region 24 . In other embodiments of the present invention, the material of the electroplating circuit 20 may be a conductive metal such as nickel and silver, or a non-metal conductive material such as carbon.

S3: Referring to FIG. 7, a plurality of circuit holes 27 are opened in the electroplating circuit 20, and a first intermediate body 30 is obtained, and the circuit holes 27 penetrate through the first surface 21 and the second surface 22, And the diameter R1 of the circuit hole 27 is smaller than the line width W1 of the plated circuit 20 , so that each of the plated circuit 20 is electrically conductive as a whole. By opening a plurality of the circuit holes 27 on the plated circuit 20 , it is beneficial to improve the overall deformation resistance of the plated circuit 20 , and at the same time, the circuit holes 27 can improve the light transmission performance of the subsequent transparent circuit board 100 .

In this embodiment, the circuit hole 27 extends downward and penetrates the second copper layer 122 , the hole diameter R1 of the circuit hole 27 is 0.5˜1 μm, and the line width W1 of the electroplating circuit 20 is 2˜1 μm. 15 microns, on the premise that the line spacing L1 (0.2-1 mm) of the electroplating lines 20 is relatively large, the smaller line width W1 is also beneficial to improve the transparency of the subsequent transparent circuit board 100 .

S4: Please refer to FIG. 8 , at least a first blackening layer 40 (ie, blackening) is provided on the second surface 22 , the side surface 23 of the electroplating circuit 20 and the inner surface of the circuit hole 27 .

In this embodiment, in step S4, the blackening includes the steps:

S40: provide an oxidizing agent, the oxidizing agent comprises at least one in nitric acid solution, potassium sulfide solution, potassium polysulfide solution, potassium thiosulfate solution.

S41: spray the oxidizing agent on the surface of the first intermediate body 30, and the oxidizing agent directly sprays the outer surface of the first intermediate body 30 (including the strippable copper layer 12 except the electroplating circuit 20) The metal element on the outer surface, the second surface 22 of the electroplating circuit 20, the side surface 23 and the inner surface of the circuit hole 27) is directly oxidized to a black metal oxide.

S42: cleaning the excess oxidant on the surface of the first intermediate 30, drying to obtain the first blackened layer 40, the first blackened layer 40 covering the electroplating circuit 20 and the second copper layer 122.

S5: Referring to FIG. 9, a first transparent cover layer 50 is laminated on the first blackened layer 40. The first transparent cover layer 50 includes a first transparent medium layer 51 and is filled in the first transparent medium layer 51. A first transparent adhesive layer 52 between the transparent medium layer 51 and the first blackened layer 40 .

In this embodiment, the first transparent adhesive layer 52 includes a first main body portion 521 and a first protruding portion 522 extending from the first main body portion 521 toward the peelable copper layer 12 . The first protruding portion 522 fills part of the circuit hole 27 , and the first body portion 521 fills the circuit hole 27 between the first transparent medium layer 51 and the first blackening layer 40 except for the circuit hole 27 . outside the gap.

In this embodiment, in step S5, the material of the first transparent medium layer 51 includes polyimide (PI), liquid crystal polymer (LCP), polyethylene terephthalate One of Polyethylene Terephthalate (PET) and Polyethylene Naphthalate (PEN).

The material of the first transparent adhesive layer 52 includes one of polydimethylsiloxane (PDMS) or polyethylene terephthalate (PET). glue.

S6: Referring to FIG. 10, remove the peelable copper layer 12 to obtain a second intermediate body 60, the second intermediate body 60 includes a plurality of the electroplating lines 20 and the first transparent adhesive layer 52, so The electroplating circuit 20 is embedded in the first transparent adhesive layer 52 , and the first surface 21 of the electroplating circuit 20 is exposed to the first transparent adhesive layer 52 .

In this embodiment, referring to FIG. 10 , in step S6 , removing the strippable copper layer 12 includes a step of stripping the first copper layer 121 and the second copper layer of the strippable copper layer 12 122 , so that the second copper layer 122 is attached to the side of the first transparent adhesive layer 52 away from the first transparent medium layer 51 . Because the minimum force required to peel off the first copper layer 121 and the base material layer 11 is greater than the minimum force required to peel off the second copper layer 122 and the first copper layer 121, the first copper layer Layer 121 is easily separated from the second copper layer 122 .

S7: Please refer to FIG. 11 and FIG. 12, etch the first surface 21 of the electroplating circuit 20 and its vicinity to obtain a conductive circuit 26, and set a second blackening layer on the etched area of the conductive circuit 26 41. The second blackening layer 41 is in contact with the first blackening layer 40 to cover the conductive lines 26 .

In this embodiment, please refer to FIG. 11 , in step S7 , etching the electroplating circuit 20 includes a step of: etching and removing the second copper layer 122 and a part of the first copper layer 122 in contact with the second copper layer 122 The blackened layer 40 and the second region 25 of the plated line 20 are etched to obtain a conductive line 26 , and the etched side of the conductive line 26 forms a plurality of microstructures (not shown), the microstructure It is used to enhance the bonding strength of the subsequent conductive lines 26 and the second blackened layer 41 .

In this embodiment, in step S7, the second blackening layer 41 is disposed by disposing the second blackening layer 41 in the area where the conductive lines 26 are etched according to steps S40-S42.

S8: Referring to FIGS. 13 and 14, a second transparent cover layer 70 is pressed together, and the second transparent cover layer 70 includes a second transparent medium layer 71 and is disposed on the second transparent medium layer 71 and the A second transparent adhesive layer 72 between the first transparent cover layers 50 , and a plurality of line spacing holes 80 are opened to obtain the transparent circuit board 100 .

In this embodiment, the second transparent adhesive layer 72 includes a second main body portion 721 and a second protruding portion 722 extending from the second main body portion 721 toward the conductive line 26 . The second protrusions 722 partially fill the circuit holes 27 , the first protrusions 522 and the second protrusions 722 fill the circuit holes 27 , and the second body portion 721 fills the first protrusions 522 and the second protrusions 722 . A gap between the two transparent dielectric layers 71 and the first transparent adhesive layer 52 except for the circuit hole 27 . By filling the first protruding portion 522 and the second protruding portion 722 into the circuit hole 27 , the conductive circuit 26 , the first transparent adhesive layer 52 and the second transparent adhesive layer can be increased. 72 , thereby improving the bonding strength between the electroplating circuit 20 and the first transparent adhesive layer 52 and the second transparent adhesive layer 72 .

In this embodiment, the material of the second transparent medium layer 71 includes polyimide (PI), liquid crystal polymer (LCP), polyethylene terephthalate (Polyethylene Terephthalate) , PET) and one of polyethylene naphthalate (Polyethylene Naphthalate, PEN).

In this embodiment, the material of the second transparent adhesive layer 72 includes one of polydimethylsiloxane (PDMS) or polyethylene terephthalate (PET). Transparent glue with stretchable properties.

In this embodiment, the line-spacing holes 80 are arranged at equal intervals in the region between every two adjacent conductive lines 26 , and the diameter R2 of the line-spacing holes 80 is 100-200 μm.

Referring to FIGS. 14 and 15 , the present invention provides a transparent circuit board 100 . The transparent circuit board 100 includes a conductive circuit 26 , a first transparent medium layer 51 and a second transparent medium layer 51 respectively disposed on both sides of the conductive circuit 26 . The dielectric layer 71 , the first transparent adhesive layer 52 filled between the first transparent dielectric layer 51 and the conductive lines 26 , the second transparent layer 52 filled between the second transparent medium layer 71 and the conductive lines 26 The adhesive layer 72 , the first transparent adhesive layer 52 and the second transparent adhesive layer 72 are also filled in the circuit holes 27 , and the transparent circuit board 100 further includes a line spacing hole 80 disposed therethrough. A spacing hole 80 is disposed between every two adjacent conductive lines 26 .

In this embodiment, the transparent circuit board 100 further includes a first blackening layer 40 and a second blackening layer 41 connected to the first blackening layer 40 . The first blackening layer 40 and the second blackening layer 41 The second blackening layer is disposed on the outer surface of the conductive line 26 and the inner surface of the line hole 27 .

Compared with the prior art, the transparent circuit board and the manufacturing method thereof provided by the present invention have the following advantages:

(1) The arrangement of the line holes and the line spacing holes is beneficial to improve the tensile resistance of the conductive line and the transparent circuit board as a whole, and at the same time improve the light transmittance of the transparent circuit board as a whole.

(2) The blackening layer can improve the overall visual light transmittance of the transparent circuit board, and at the same time increase the bonding strength between the conductive circuit and the transparent adhesive layer.

(3) Two transparent circuit boards can be produced at the same time by the method of electroplating and laminating on the carrier board, with high efficiency, and the lamination process is easy to control the overall thickness of the transparent circuit board.

(4) The main components of the transparent circuit board are copper and base material, there is no heavy metal, it can be recycled after use, and it is environmentally friendly.

In addition, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the present invention.

100: Transparent circuit board 10: Carrier board 11: Substrate layer 12: Strippable copper layer 121: The first copper layer 122: Second copper layer 13: Photosensitive layer 131: Patterned photosensitive layer 132: Slotted 20: Electroplating circuit 21: First surface 22: Second surface 23: Side 24: The first area 25: Second area 26: Conductive Lines 27: Line hole 30: The first intermediate 40: The first blackening layer 41: Second blackening layer 50: First transparent cover layer 51: the first transparent medium layer 52: The first transparent adhesive layer 521: The first main body 522: The first protrusion 60: Second Intermediate 70: Second transparent cover 71: Second transparent medium layer 72: Second transparent adhesive layer 721: Second main body 722: Second protrusion 80: Line spacing hole R1, R2: aperture W1: line width L1: line spacing D1, D2, D3, D4: Thickness

FIG. 1 is a schematic diagram of a carrier board provided by an embodiment of the present invention.

FIG. 2 is a schematic view of the carrier shown in FIG. 1 after a photosensitive layer is provided.

FIG. 3 is a schematic view of the photosensitive layer shown in FIG. 2 after exposure.

FIG. 4 is a schematic diagram of obtaining a patterned photosensitive layer after developing the photosensitive layer shown in FIG. 3 .

FIG. 5 is a schematic diagram of the patterned photosensitive layer shown in FIG. 4 after electroplating in the slot.

FIG. 6 is a schematic view of FIG. 5 after removing the patterned photosensitive layer.

FIG. 7 is a schematic diagram of FIG. 6 after the circuit holes are opened.

FIG. 8 is a schematic diagram of FIG. 7 after the first blackening layer is provided.

FIG. 9 is a schematic diagram of FIG. 8 after laminating the first transparent substrate layer.

FIG. 10 is a schematic diagram of FIG. 9 after peeling off the first copper foil layer.

FIG. 11 is a schematic diagram of FIG. 10 after the first copper foil layer is etched away.

FIG. 12 is a schematic diagram of FIG. 11 after the second blackening layer is provided.

FIG. 13 is a schematic diagram of FIG. 12 after laminating the second transparent substrate layer.

FIG. 14 is a schematic diagram of FIG. 13 after the line spacing holes are opened.

FIG. 15 is a top view of a transparent circuit board provided by an embodiment of the present invention.

26: Conductive Lines

27: Line hole

50: First transparent cover layer

80: Line spacing hole

W1: line width

L1: line spacing

R2: Aperture

Claims (10)

A method for manufacturing a transparent circuit board, comprising the steps of: A carrier board is provided, the carrier board includes a base material layer and peelable copper layers disposed on both sides of the base material layer; Electroplating on the strippable copper layer to form a plurality of electroplating lines, the electroplating lines are in a snake shape, and the electroplating lines include a first surface connected to the strippable copper layer, and a surface away from the first surface. a second surface and two side surfaces connecting the first surface and the second surface; opening a plurality of circuit holes in each of the electroplating lines, the circuit holes passing through the first surface and the second surface; laminating a first transparent cover layer on the electroplating circuit, and removing the peelable copper layer so that the first surface is exposed to the first transparent cover layer; etching the first surface and the area near the first surface to obtain conductive lines, and pressing a second transparent cover layer on the side of the conductive lines exposed on the first transparent cover layer; and A plurality of line spacing holes are opened, and the line spacing holes pass through the first transparent cover layer and the second transparent cover layer between each adjacent two conductive lines, so as to obtain the transparent circuit board. The method for manufacturing a transparent circuit board as claimed in claim 1, wherein the step "electroplating on the peelable copper layer to form a plurality of electroplating lines" specifically includes: A patterned photosensitive layer is arranged on the peelable copper layer, the patterned photosensitive layer includes a plurality of grooves distributed at intervals, and the peelable copper layer is exposed in the grooves; electroplating in the slot to form the plated line; and The patterned photosensitive layer is removed. The method for manufacturing a transparent circuit board according to claim 2, wherein the peelable copper layer comprises a first copper layer and a second copper layer, the first copper layer is placed on the base material layer, The second copper layer is arranged on the first copper layer, and the bonding strength between the base material layer and the first copper layer is greater than that between the first copper layer and the second copper layer. Bond strength. The method for manufacturing a transparent circuit board according to claim 3, wherein the material of the electroplating circuit includes a metal element, the electroplating circuit includes a first area and a second area other than the first area, and the The first region is adjacent to the second surface, the second region is adjacent to the first surface, and the lattice arrangement of the metal element in the first region is the same as the lattice arrangement of the second copper layer , the lattice arrangement of the metal element in the second region is different from the lattice arrangement of the metal element in the first region. The manufacturing method of the transparent circuit board according to claim 4, wherein the manufacturing method further comprises: removing the first copper layer such that the second copper layer is attached to the first transparent capping layer; and The second copper layer and the first region are etched to obtain the conductive trace, and a surface of the second region connecting the first region is formed with a plurality of microstructures. The manufacturing method of the transparent circuit board according to claim 5, wherein the manufacturing method further comprises: A first blackening layer is formed on at least the second surface, the side surface and the inner surface of the circuit hole of each of the electroplating lines, wherein the first transparent cover layer is formed on the first black layer on the chemical layer; and A second blackening layer is formed on the conductive line, the first blackening layer and the second blackening layer are connected to cover the conductive line, wherein the second transparent covering layer is formed on on the second blackening layer. The method for manufacturing a transparent circuit board according to claim 1, wherein the first transparent cover layer comprises a first transparent adhesive layer and a first transparent medium layer disposed on the first transparent adhesive layer, so The second transparent cover layer includes a second transparent adhesive layer and a second transparent medium layer disposed on the second transparent adhesive layer, and the conductive circuit is embedded in the first transparent adhesive layer and the first transparent adhesive layer. In the two transparent adhesive layers, the first transparent adhesive layer and the second transparent adhesive layer fill the circuit holes, and the first transparent medium layer is disposed on the first transparent adhesive layer away from the conductive circuit. On one side, the second transparent medium layer is disposed on the side of the second transparent adhesive layer away from the conductive circuit. A transparent circuit board, comprising a conductive circuit, a transparent medium layer disposed on both sides of the conductive circuit, a transparent adhesive layer filled between the transparent medium layer and the conductive circuit, and the conductive circuit includes a through-hole A plurality of circuit holes are provided, and the transparent adhesive layer is filled in the circuit holes, and the transparent circuit board also includes a line spacing hole arranged through it, and the line spacing holes are arranged on every two adjacent conductive lines. between. The transparent circuit board according to claim 8, wherein the transparent circuit board further comprises a blackening layer, and the blackening layer is disposed on the outer surface of the conductive circuit and the inner surface of the circuit hole. The transparent circuit board according to claim 8, wherein the hole diameter of the circuit hole is 0.5-1 μm, and the line width of the conductive circuit is 2-15 μm.

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