TW202146827A - Heater power supply device of a heat treatment furnace includes a heat treatment furnace, a conductive part, and a power supply part, for controlling temperature atmosphere and avoiding gas outflow - Google Patents

Abstract

The present invention discloses a heater power supply device of a heat treatment furnace. The present invention includes: a heat treatment furnace having a chamber for accommodating a substrate in order to heat and dry the substrate, a heater as a heat generating body is installed in the chamber, and the substrate is heated or dried by the heat of the heater; a conductive unit, which is connected with plural bus bars, and the bus bars are connected with the heating wires of the heater to conduct current; and a power supply unit, which has plural feedthroughs protruding from the outer box of the chamber and is used to conduct current to the bus bars, so as to guide the connection of external power input terminals along the inner and outer housings of the chamber.

Description

Heater power supply device for heat treatment furnace

The present invention relates to a heater power supply device for a heat treatment furnace that connects and conducts an external power source to a heater of a heat treatment furnace to supply the heat treatment furnace.

Organic light-emitting display devices, LCD glass substrates, and the like are used in various image devices such as image screens, TVs, mobile phones, and monitors. Organic light-emitting display devices, LCD glass substrates, and the like are being used in various fields as one of the next-generation displays, and recently, in order to improve performance and yield, development of flat panel display manufacturing technologies in this field has been progressing.

In the process of manufacturing organic light-emitting display devices or LCD glass substrates (hereinafter referred to as "substrates" or "glass substrates") that are typical flat panel displays, temperature control and temperature uniformity are essential to ensure superior substrate quality and yield .

For example, in the manufacturing process of the organic light emitting display device, since the organic layer is formed on the surface of the substrate, it may contain a certain amount of moisture, so a drying process for evaporating the moisture is required.

In the LCD glass substrate manufacturing process, a cleaning process is performed before the photosensitive film is coated on the surface of the substrate, and a heating and drying process for removing moisture is performed after the cleaning process.

In addition, exposure and development processes are performed after the photosensitive film is coated on the LCD glass substrate. A pre-baking and a post-baking process are sequentially performed before and after the exposure and development process.

As such, most processes of substrate fabrication perform heating and drying processes to manufacture the substrate. Moisture generated in the substrate manufacturing process can be removed by ultraviolet rays or heating and drying in a chamber of a heat treatment furnace including a heat-generating body such as a heater (sheath heater).

A heat treatment furnace for a substrate related to this has been proposed in Korean Patent Publication No. 10-2094763.

In addition, in the conventional heat treatment furnace, it is necessary to improve the performance of the power supply unit for supplying power to the heater.

That is, in the power supply unit of the conventional heat treatment furnace, a heater as a heat generating body is formed on the inner side of the inner chamber, and the power supply unit is provided to supply power after passing through the inner chamber, the insulator, and the outer chamber, but the performance is very poor. It is difficult to meet the requirement to minimize the influence on the heat treatment process conditions. For example, the reality is that there are deficiencies in controlling the temperature atmosphere inside the chamber and the outflow of the process gas.

In addition, not only does the impact on the heat treatment process need to be minimized, but there are also limitations in meeting electrical safety standards without electrical problems.

In addition, the power supply section of the heat treatment furnace imposes several performance requirements. For example, it needs to have electrical insulation properties, it needs to have safety that meets the level of electrical safety certification, there is no problem in high temperature use and it can still maintain a certain insulation performance, it can block the outflow of process gas inside the chamber, and it can shorten the maintenance time. And excellent operability and other requirements.

A technical problem to be solved by the present invention is to provide an improved power supply unit management operability including monitoring and maintenance of the power supply unit by separately arranging the heater power supply unit of the heat treatment furnace on the outer casing of the chamber. Heater power supply for heat treatment furnaces.

A technical problem to be solved by the present invention is to provide a heater power supply device for a heat treatment furnace that improves the problem of outflow of process gas inside the chamber through the power supply part by ensuring the durability of the power supply part at a high temperature of the chamber.

According to the present invention, the object can be achieved by a heater power supply device for a heat treatment furnace, the power supply device including a heat treatment furnace having a chamber for accommodating a substrate for heating and drying the substrate, and a heat generating body is installed in the chamber. a heater for heating or drying the substrate with the heat of the heater; a conductive part connected to a plurality of bus bars connected to the heating wire of the heater to conduct current; and a power supply part , which has a plurality of feedthroughs protruding from the outer box of the chamber and used to conduct current to the bus bar, thereby guiding the connection of external power input terminals along the inner and outer boxes of the chamber.

According to an embodiment of the present invention, the power supply part may have an opening hole through which the lead wire protrudes, and include a box for protecting the lead wire and externally performing maintenance.

According to an embodiment of the present invention, one end of the box body may have a temperature control sensor guide window that can control the temperature of the heater in the chamber, and the inner side of the box body includes a heat-resistant casing and a block for blocking the chamber Temperature sensor gasket for the outflow of heat and fluid from the room to the outside.

According to an embodiment of the present invention, the leads may be configured to mount a silicon ring on the outer box of the chamber and be guided to the silicon ring to maintain high temperature insulating properties.

According to an embodiment of the present invention, the silicon ring may be configured to mount a metal bushing on the outer box of the chamber and be guided to the metal bushing to maintain a high temperature seal.

According to an embodiment of the present invention, in order to prevent high temperature corrosion, the lead wire may be composed of a nickel material.

According to an embodiment of the present invention, in order to maintain sealing, the silicon ring may be composed of a plurality of sealing rings or balance seats.

The present invention has the effect of improving the management operability of the power supply part including monitoring and maintenance by separately providing the heater power supply part of the heat treatment furnace in the outer box of the chamber.

In addition, the lead wires are guided to the outer casing of the chamber and fixed by the silicon ring and the spacer which are insulators that can be used at high temperature, so that the durability of the power supply part at high temperature of the chamber can be ensured, and the efficiency can be effectively The effect of the phenomenon that the process gas inside the chamber is effectively blocked through the outflow of the power supply part.

Hereinafter, the content of the heater power supply device of the heat treatment furnace according to the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Generally, a heat treatment furnace for heat-treating substrates may have a furnace door on the rear side and a shutter on the front side, so as to place the substrates to be heat-treated into pre-set stages in the chamber or remove the substrates after the heat treatment process from the chamber.

Further, the heat treatment furnace has a chamber for accommodating the substrate to be heated or dried, and a heat generating body composed of a heater is installed in the chamber, whereby the substrate can be heated by heat generated from the heater or dried by evaporating moisture. In addition, it differs depending on the configuration, but generally, the upper and lower parts of the heater are provided with upper/lower heat transfer plates in close contact therewith, whereby the substrate heating process can be efficiently performed.

In addition, one side of the chamber of the heat treatment furnace has a gas supply port for inflow of the fluid containing the process gas, and an exhaust port for discharging the fluid in the chamber, and includes a gas supply port for supporting and holding up the chamber. The frame of the support and the conductive part connected with the plurality of bus bars. The bus bar is connected with the heating wire of the heater to conduct current.

In addition, the heat treatment furnace includes a heater inside the chamber in order to remove the moisture remaining on the substrate during the heat treatment process of the substrate, and in order to improve the quality of the product, a more efficient and high-performance process capability is required.

In addition, in order to mass-produce more products by shortening the heat treatment process time, a heat treatment furnace that can rapidly increase the temperature inside the chamber and can be rapidly cooled while having excellent durability in structure is required.

The existing heat treatment furnace needs to improve the performance of the power supply unit that supplies power to the heater. That is, a heater as a heat generating body is formed on the inner side of the inner chamber, and the power supply part is provided to pass through the inner chamber and the insulating material and the outer chamber to supply power, but its performance is difficult to meet the requirements of minimizing the influence on the heat treatment process conditions. Require.

For example, it is difficult to maintain the temperature atmosphere inside the chamber and control the outflow of the process gas in the form of the existing power supply part.

The power supply of the heat treatment furnace imposes several performance requirements. For example, it needs to have electrical insulation properties, and it needs to have safety that meets the level of electrical safety certification. It can maintain a certain insulation performance without problems when used at high temperatures, and it can block the outflow of process gas inside the chamber. It can shorten the maintenance time and Excellent operability and other requirements.

Therefore, the present invention proposes a power supply unit 400 capable of improving the management operability of the power supply unit 400 including monitoring and maintenance of the power supply unit 400 by separately disposing the heater power supply unit of the heat treatment furnace 100 in the outer box 210 of the chamber 200 . A heater power supply device of the heat treatment furnace 100 .

In addition, the present invention guides the leads 430 to the outer case 220 of the chamber 200 and fixes them by using the silicon ring 440 and the metal bushing 450 as insulators that can still be used at high temperatures, thereby providing a method that can ensure a high temperature of the chamber 200 The heater power supply device of the heat treatment furnace 100 is durable and can effectively block the phenomenon that the process gas inside the chamber 200 flows out through the power supply part 400 .

The content of the preferred embodiment according to the present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is an example of a heat treatment furnace 100 according to an embodiment of the present invention. FIG. 2 is an example showing the front surface of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 3 is an example of a top view of the heat treatment furnace 100 according to an embodiment of the present invention. FIG. 4 is an example showing one side of the heat treatment furnace 100 according to an embodiment of the present invention.

The drawings illustrated in FIGS. 1 to 4 show the overall structure of the heat treatment furnace 100 , which are examples of the heat treatment furnace 100 including the chamber 200 .

According to the heat treatment furnace 100 of the present invention, as shown in FIGS. 1 to 4 , the heat treatment furnace 100 for heat-treating substrates may have a furnace door 110 on the rear side and a shutter 120 on the front side, so as to place the substrates to be heat-treated into the chamber Each stage preset in the 200 or the substrate after the heat treatment process is carried out from the chamber 200 .

In addition, the heat treatment furnace 100 has a chamber 200 for accommodating the substrate to be heated or dried, and a heating body composed of a heater is installed in the chamber 200, whereby the substrate can be heated by the heat generated from the heater or by evaporating moisture Dry.

In addition, it may vary depending on the configuration, but in general, upper/lower heat transfer plates are provided on the upper and lower parts of the heater 230 in close contact therewith, so that the substrate heating process can be efficiently performed.

In addition, the heat treatment furnace 100 has a gas supply port on one side of the chamber 200 for inflow of the fluid containing the process gas, and an exhaust port for exhausting the fluid in the chamber 200, and includes a gas supply port for supporting and supporting The frame of the support of the chamber 200 and the conductive part 500 connected with the plurality of bus bars 510 are connected with the heating wire of the heater to conduct current.

For reference, the basic components forming the heat treatment furnace 100, such as heaters, upper/lower heat transfer plates, supply and exhaust systems for process gas, including the conductive parts 500 of the bus bars 510 for supplying power to the heaters The components are not directly related to the present invention. In addition, the basic components of the heat treatment furnace 100 are not related to the gist of the present invention, and are known components, so the description thereof will be omitted in the present invention.

The main components of the heater power supply device of the heat treatment furnace 100 according to the present invention will be described with reference to FIGS. 5 to 7 .

FIG. 5 is an example of an exploded view showing part A selected from FIG. 4 , which is an example of a power supply part according to an embodiment of the present invention.

FIG. 6 is an example showing a state in which the power supply part is assembled to the chamber side according to an embodiment of the present invention.

FIG. 7 is an example showing a state in which the power supply part is assembled to the chamber side according to an embodiment of the present invention.

The heater power supply device of the heat treatment furnace 100 according to the embodiment of the present invention has the chamber 200 for accommodating the substrate for heating and drying the substrate, and includes the power supply unit 400 for supplying power to the heater 230 of the heat treatment furnace 100 . The chamber 200 is provided with a heater 230 as a heat generating body, so that the substrate is heated or dried by the heat of the heater 230 .

The heat treatment furnace 100 is formed with conductive parts 500 connected to a plurality of bus bars 510 connected to heating wires of the heaters 230 to conduct current.

In addition, the power supply unit 400 for supplying power to the heater 230 of the heat treatment furnace 100 has a plurality of lead wires 430 protruding from the outer case body 220 of the chamber 200 and conducting current to the bus bars 510 , so as to follow the inner case of the chamber 200 The body 210 and the outer case body 220 guide the connection of the external power input terminal.

In addition, as shown in FIG. 5 , the power feeding part 400 has an opening hole 412 through which the lead wire 430 protrudes, and has a box 410 for protecting the lead wire 430 and performing maintenance. Wherein, the box body 410 may be attached to the outer box body 220 of the chamber 200 .

Further, as shown in FIG. 5 , one end of the box 410 of the power supply unit 400 has a temperature control sensor guide window 411 capable of controlling the temperature of the heater in the chamber 200 , and the inner side of the box 410 includes a heat-resistant casing 420 and the temperature sensor gasket 421 capable of blocking the outflow of heat and fluid in the chamber 200 to the outside.

In addition, as shown in FIGS. 6 and 7 , the lead wires 430 of the power supply part 400 are guided to the silicon ring 440 mounted on the outer box body 220 of the chamber 200 to maintain high-temperature insulation performance.

In addition, as shown in FIG. 6 and FIG. 7 , the lead 430 of the power supply unit 400 , the silicon ring 440 supported and fixed on the outer box 220 of the chamber 200 is guided to the metal bush 450 installed on the outer box 220 of the chamber 200 to Keep high temperature sealed.

In addition, as shown in FIG. 7 , the metal bushing 450 of the power supply part 400 is in close contact with the silicon ring 440 and the silicon sealing ring 452 to maintain high temperature sealing.

In addition, the lead wire 430 of the power supply part 400 is made of nickel metal material to prevent high temperature corrosion.

In addition, in FIGS. 1 and 4 , the cooling jacket 300 forms a cooling airflow and uniformly cools the chamber 200 through a cooling airflow channel formed inside the chamber 200 .

In addition, in FIG. 5 , the flange portion 413 is formed along the corners of the case 410 for the case 410 to be mounted along the surface of the outer case 220 of the chamber 200 . The gasket 453 may be used to seal the case 410 installed along the surface of the outer case 220 of the chamber 200 .

In addition, in FIGS. 6 and 7 , an assembly hole 451 is formed in the metal bush 450 , and the assembly hole 451 is for guiding one end of the silicon ring 440 to be tightly assembled to the metal bush 450 . The guide bracket 460 can be assembled on the outer box body 220 of the chamber 200 to guide the placement of the silicon ring 440 .

As described above, the heater power supply device of the heat treatment furnace 100 according to the present invention supplies power to the heater 230 inside the chamber 200 so that the heat required in the heat treatment process of the substrate conforms to the heat treatment conditions of the substrate, so that the heat treatment of the substrate can be performed craft.

If power is supplied to the conductive part 500 formed inside the chamber 200 through the power supply part 400 , the heater 230 functions as a flat plate heating body and transmits heat to the substrate, so that the heat treatment process can be performed in the chamber 200 .

The power supply by the power supply unit 400 can be divided and supplied according to the control area, and the supplied power can be freely adjusted as needed.

The power supply can be individually controlled by a plurality of wirings, and each lead wire 430 for power supply is configured to have a structure capable of satisfying capacitance, insulating performance, and sealing performance, and can be used at high temperatures.

The leads 430 are supported on the outer casing 220 of the chamber 200 through the silicon ring 440 , and the silicon ring 440 is guided to the metal bushing 450 mounted on the outer casing 220 of the chamber 200 , so as to perform the function of maintaining high temperature sealing.

In addition, according to the power supply device of the heat treatment furnace 100 of the present invention, several performances required in the heat treatment furnace 100 can be satisfied.

For example, it may have electrical insulating properties. High temperature sealing can be ensured, so it has safety that meets the level of electrical safety certification.

In addition, there is no problem in high temperature use, and a certain insulation performance can be maintained.

In addition, the outflow of the process gas inside the chamber 200 can be effectively blocked by the sealing member, and the case 410 is provided outside the power supply part 400, so that maintenance time can be shortened and good operability can be ensured.

As described above, according to the heater power supply device of the heat treatment furnace 100 of the present invention, the heater power supply part 400 of the heat treatment furnace 100 is separately provided on the outer case 220 of the chamber 200, thereby improving the power supply including the power supply part 400. The power supply section 400 manages operational advantages including monitoring and maintenance.

In addition, the durability of the power feeding part 400 at a high temperature of the chamber 200 can be ensured, and there is an advantage that the problem of outflow of the process gas inside the chamber 200 through the power feeding part 400 can be effectively alleviated.

Although the present invention is described with reference to an embodiment shown in the accompanying drawings, the present invention is not limited to these embodiments, and modifications and variations can be made within the scope of not departing from the gist of the present invention, and these modifications and variations belong to the technology of the present invention Thought.

100: Heat treatment furnace 110: Furnace Door Department 120: Blocker part 200: Chamber 210: Inner box 220: Outer box 230: Heater 300: Cooling Jacket 400: Power Supply Department 410: Box 411: Temperature control sensor guide window 412: open hole 413: Flange 420: Shell 421: Temperature sensor gasket 430: Lead 440: Silicon Ring 450: Metal Bushing 451: Assembly hole 452: Silicon seal 453: Gasket 460: Guide bracket 500: Conductive part 510: Bus bar

FIG. 1 is an example of a heat treatment furnace according to an embodiment of the present invention. FIG. 2 is an example showing a front surface of a heat treatment furnace according to an embodiment of the present invention. FIG. 3 is a top view of an example of a heat treatment furnace according to an embodiment of the present invention. FIG. 4 is an example showing one side of a heat treatment furnace according to an embodiment of the present invention. FIG. 5 is an example of an exploded view showing part A selected from FIG. 4 , which is an example of a power supply part according to an embodiment of the present invention. FIG. 6 is an example showing a state in which the power supply part is assembled to the chamber side according to an embodiment of the present invention. FIG. 7 is an example showing a state in which the power supply part is assembled to the chamber side according to an embodiment of the present invention.

400: Power Supply Department

410: Box

411: Temperature control sensor guide window

412: open hole

413: Flange

420: Shell

421: Temperature sensor gasket

430: Lead

440: Silicon Ring

450: Metal Bushing

453: Gasket

Claims (7)

A heater power supply device for a heat treatment furnace, comprising: a heat treatment furnace having a chamber for accommodating a substrate for heating and drying the substrate, and a heater as a heat generating body is installed in the chamber so as to heat or dry the substrate by using the heat of the heater; a conductive portion connected to a plurality of bus bars connected to heating wires of the heater to conduct current; and The power supply part has a plurality of feedthroughs protruding from the outer casing of the chamber and conducting current to the bus bar, thereby guiding the connection of external power input terminals along the inner and outer casings of the chamber. The heater power supply device for a heat treatment furnace according to claim 1, wherein the power supply part has an opening through which the lead wire protrudes, and includes a box for protecting the lead wire and for external maintenance. The heater power supply device for a heat treatment furnace according to claim 2, wherein one end of the box body has a temperature control sensor guide window that can control the temperature of the heater in the chamber, and the inner side of the box body includes a heat-resistant A flexible housing and a temperature sensor gasket for blocking the outflow of heat and fluid in the chamber to the outside. The heater power supply device for a heat treatment furnace as claimed in claim 1, wherein a silicon ring is installed on the outer box of the chamber, and the lead wire is guided to the silicon ring to maintain high temperature insulating properties. The heater power supply device for a heat treatment furnace as claimed in claim 4, wherein a metal bushing is installed on the outer casing of the chamber, and the silicon ring is guided to the metal bushing to maintain high temperature sealing. The heater power supply device for a heat treatment furnace according to claim 1, wherein the lead wire is composed of a nickel material to prevent high temperature corrosion. The heater power supply device for a heat treatment furnace according to claim 5, wherein the silicon ring is composed of a plurality of sealing rings or balance seats to keep the sealing.

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