TW202146237A

TW202146237A - Cover film and preparation method thereof

Info

Publication number: TW202146237A
Application number: TW109119900A
Authority: TW
Inventors: 李韋志; 林志銘; 李建輝
Original assignee: 亞洲電材股份有限公司
Priority date: 2020-06-12
Filing date: 2020-06-12
Publication date: 2021-12-16
Also published as: TWI741648B

Abstract

The present invention provides a cover film and the preparation method thereof. The cover film comprises a carrier layer, a first insulation layer and an adhesive layer, wherein the first insulation layer is disposed between the carrier layer and the adhesive layer. The carrier layer has a side, contacting the first insulation layer, with a surface roughness of 1 to 10000 nm, the first insulation layer has a side, contacting the carrier layer, with a surface roughness of 1 to 10000 nm, and the detach force between the carrier layer and the first insulation layer is equal to or lower than 450g/5cm. The release agent as a dopant into the carrier layer is not needed due to the match of surface roughness between the carrier layer and the insulation layer, such that the detach operation between the carrier layer and the insulation layer is facilitated while the reliability of PCB produced by using the cover film is improved.

Description

Cover film and method of making the same

本發明係有關於一種覆蓋膜，尤係關於用於印刷電路板之覆蓋膜及其製法。 The present invention relates to a cover film, in particular to a cover film for printed circuit boards and a method for making the same.

電子產品在工業設計方面，越來越重視電路布局不外露、美觀、視覺保護等要求，因而有色覆蓋膜(例如，黑色聚醯亞胺膜)的市場需求日益增加。市面上聚醯亞胺膜的生產主要使用流延法(casting)。然而，流延法的拉伸製程會使形成的聚醯亞胺膜殘留應力。 In terms of industrial design of electronic products, more and more attention is paid to the requirements of not exposed circuit layout, aesthetics, and visual protection, so the market demand for colored cover films (eg, black polyimide films) is increasing. The production of polyimide films on the market mainly uses the casting method. However, the stretching process of the casting method will cause residual stress to the formed polyimide film.

此外，聚醯亞胺膜亦存在薄型化設計的瓶頸，難以順應電子產品輕薄化的發展趨勢。具體而言，當聚醯亞胺膜厚度縮小至5~7.5μm時，機械強度、加工操作性、彎折性等基本技術指標皆無法達到業界規範的要求，而且良率低落。 In addition, the polyimide film also has a bottleneck in thin design, and it is difficult to adapt to the development trend of thin and light electronic products. Specifically, when the thickness of the polyimide film is reduced to 5-7.5 μm, the basic technical indicators such as mechanical strength, processing operability, and bending properties cannot meet the requirements of industry standards, and the yield rate is low.

為了解決上述瓶頸，已知的作法是，將習知有色聚醯亞胺膜替換成含有色清漆型絕緣層之覆蓋膜，具體而言，此種覆蓋膜包含有色清漆型絕緣層、有色接著劑、搭配載體及離型膜。值得注意的是，使用有色清漆型絕緣層無須拉伸製程，無殘留應力、尺寸安定性佳，而且清漆型絕緣層藉由塗佈製膜而直接生成於載體層上，對下游製程更易加工。不但如此，通過改變樹脂、摻雜各類粉體、調整摻雜粉體比例或粒徑等方法，還能使有色清漆型絕緣層得到高阻燃性、高離子純度、高硬度、高導熱性、極佳離子遷移性、優良接著力、低反彈力、高柔軟性、可低溫加工、高散熱性、高硬度、極佳耐熱性、優良電氣性能等多種優點。然而，為了使覆蓋膜達到足夠的顯色要求，往往添加大量粉體於有色清漆型絕緣層中，反而造成覆蓋膜機械特性不足。 In order to solve the above bottleneck, a known method is to replace the conventional colored polyimide film with a cover film containing a colored varnish-type insulating layer. Specifically, the cover film includes a colored varnish-type insulating layer, a colored adhesive , with carrier and release film. It is worth noting that the use of the colored varnish-type insulating layer does not require a stretching process, has no residual stress, and has good dimensional stability, and the varnish-type insulating layer is directly formed on the carrier layer by coating film formation, making it easier to process downstream processes. not only In addition, by changing the resin, doping various powders, adjusting the proportion or particle size of the doping powder, etc., the colored varnish-type insulating layer can also obtain high flame retardancy, high ionic purity, high hardness, high thermal conductivity, Excellent ion mobility, excellent adhesion, low rebound, high flexibility, low temperature processing, high heat dissipation, high hardness, excellent heat resistance, excellent electrical properties and many other advantages. However, in order to make the cover film meet the requirements of sufficient color development, a large amount of powder is often added to the colored varnish-type insulating layer, which causes insufficient mechanical properties of the cover film.

此外，習知載體中會添加含有機矽之離型劑，以利於載體與絕緣層或聚醯亞胺膜之間的分離操作。例如，如TW 201808062揭示使用矽烷化合物的離型層，來達到聚醯亞胺膜與載體的分離。又例如，TW I608791B號揭示之電磁波遮蔽材係通過塗佈氨基醇酸樹脂或矽樹脂等離型劑，再經過加熱乾燥實施使載體得以分離。然而，此類做法會形成有機矽殘留，進而導致後續PCB電鍍製程可靠度下降的問題。 In addition, a release agent containing silicone is added to the conventional carrier to facilitate the separation operation between the carrier and the insulating layer or the polyimide film. For example, TW 201808062 discloses the use of a release layer of a silane compound to achieve the separation of the polyimide film and the carrier. For another example, in the electromagnetic wave shielding material disclosed in TW I608791B, the carrier is separated by applying a release agent such as amino alkyd resin or silicone resin, and then heating and drying. However, such a method will result in the formation of silicone residues, which will lead to the problem of reduced reliability of the subsequent PCB electroplating process.

有鑑於此，業界仍需研發和改良覆蓋膜，俾滿足無殘留應力、尺寸安定性佳、顯色性足、高遮蔽性、機械強度優、加工操作性佳、彎折性佳、不添加含有機矽之離型劑等要求。 In view of this, the industry still needs to develop and improve the cover film, so as to meet the requirements of no residual stress, good dimensional stability, sufficient color rendering, high shielding, excellent mechanical strength, good processing operability, good bending, no added containing Silicone release agent and other requirements.

本發明提供一種覆蓋膜，其不但利用有色絕緣層搭配有色接著劑提供高遮蔽性，可降低絕緣層，因而提高整體機械強度提高。本發明還通過絕緣層及載體層粗糙度設計的匹配，促成絕緣層、載體層間的離型操作，而無需在載體層上添加離型劑。而且，本發明之絕緣層無須拉伸製程，無殘留應力、尺寸安定性佳。由於載體層中不添加離型劑、絕緣層中粉體添加量低，整體的機械特性能獲得提升。此外，本發明之覆蓋膜特別適用於高密度組裝之線路板中，應用於電子產品(例如，無線充電器、手機、電腦)或超薄覆蓋膜設計，均能帶來極佳的散熱性。 The present invention provides a cover film, which not only utilizes a colored insulating layer and a colored adhesive to provide high shielding, but also reduces the insulating layer, thereby improving the overall mechanical strength. The invention also promotes the release operation between the insulating layer and the carrier layer by matching the roughness design of the insulating layer and the carrier layer without adding a release agent on the carrier layer. Moreover, the insulating layer of the present invention does not need a stretching process, has no residual stress, and has good dimensional stability. Since no release agent is added to the carrier layer, the insulating layer The powder addition amount is low, and the overall mechanical properties can be improved. In addition, the cover film of the present invention is particularly suitable for high-density assembled circuit boards, and can be applied to electronic products (eg, wireless chargers, mobile phones, computers) or ultra-thin cover film design, which can bring excellent heat dissipation.

具言之，本發明之覆蓋膜包括載體層、第一絕緣層、以及接著劑層，該第一絕緣層係形成於該載體層上，該接著劑層係形成於該第一絕緣層上，使該第一絕緣層位於該載體層及該接著劑層之間，其中，接觸該第一絕緣層之側之該載體層的表面粗糙度為1至10000nm，接觸該載體層之側之該第一絕緣層的表面粗糙度為1至10000nm，且該第一絕緣層與該載體層間的離型力為450g/5cm以下。 Specifically, the cover film of the present invention includes a carrier layer, a first insulating layer, and an adhesive layer, the first insulating layer is formed on the carrier layer, and the adhesive layer is formed on the first insulating layer, The first insulating layer is located between the carrier layer and the adhesive layer, wherein the surface roughness of the carrier layer on the side contacting the first insulating layer is 1 to 10000 nm, and the first insulating layer on the side contacting the carrier layer has a surface roughness of 1 to 10000 nm. The surface roughness of an insulating layer is 1 to 10000 nm, and the release force between the first insulating layer and the carrier layer is 450 g/5 cm or less.

於本發明的一具體實施態樣中，接觸該第一絕緣層之側之該載體層的表面粗糙度可為1、4.95、7.6、7.73、7.75、10、11.77、11.89、14.91、14.97、20、30、40、50、60、70、80、90、100、1000、2000、3000、4000、5000、6000、7000、8000、9000或10000nm。本發明所述之數值點，例如本段所述之表面粗糙度數值可作為該數值範圍中的上限、下線或中間值。例如，該載體層接觸該第一絕緣層之側的表面粗糙度為1至2000nm、1至49nm、1至20nm、1至10nm、11至20nm、21至30nm、31至40nm、41至49nm、50至100nm、101至500nm、501至1000nm、1001至1500nm或1501至2000nm。 In an embodiment of the present invention, the surface roughness of the carrier layer on the side contacting the first insulating layer may be 1, 4.95, 7.6, 7.73, 7.75, 10, 11.77, 11.89, 14.91, 14.97, 20 , 30, 40, 50, 60, 70, 80, 90, 100, 1000, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000 or 10000 nm. The numerical points described in the present invention, such as the surface roughness value described in this paragraph, can be used as the upper limit, lower line or middle value in the numerical range. For example, the surface roughness of the side of the carrier layer contacting the first insulating layer is 1 to 2000 nm, 1 to 49 nm, 1 to 20 nm, 1 to 10 nm, 11 to 20 nm, 21 to 30 nm, 31 to 40 nm, 41 to 49 nm, 50 to 100 nm, 101 to 500 nm, 501 to 1000 nm, 1001 to 1500 nm, or 1501 to 2000 nm.

於本發明的一具體實施態樣中，接觸該載體層之側之該第一絕緣層的表面粗糙度可為1、4.95、7.6、7.73、7.75、10、11.77、11.89、14.91、14.97、20、30、40、50、60、70、80、90、100、1000、2000、3000、4000、5000、6000、7000、8000、9000或10000nm。例如，該載體層接觸該第一絕緣層之側的表面粗糙度為1至2000nm、1至49nm、1至20nm、1至10nm、11至20nm、21至30nm、31至40nm、41至49nm、50至100nm、101至500nm、501至1000nm、1001至1500nm或1501至2000nm。 In an embodiment of the present invention, the surface roughness of the first insulating layer on the side contacting the carrier layer may be 1, 4.95, 7.6, 7.73, 7.75, 10, 11.77, 11.89, 14.91, 14.97, 20 , 30, 40, 50, 60, 70, 80, 90, 100, 1000, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000 or 10000 nm. For example, the The surface roughness of the side of the bulk layer in contact with the first insulating layer is 1 to 2000 nm, 1 to 49 nm, 1 to 20 nm, 1 to 10 nm, 11 to 20 nm, 21 to 30 nm, 31 to 40 nm, 41 to 49 nm, 50 to 100 nm, 101 to 500 nm, 501 to 1000 nm, 1001 to 1500 nm or 1501 to 2000 nm.

於本發明的一具體實施態樣中，該第一絕緣層與該載體層間的離型力可為5、6、10、12、13、13、16、17、20、21、25、26、31、33、44、44、47、49、50、51、53、54、54、55、58、63、64、78、78、80、90、100、150、200、250、300、350、400或450g/5cm。例如，該第一絕緣層與該載體層間的離型力為50g/5cm以下、100g/5cm以下、150g/5cm以下、200g/5cm以下、250g/5cm以下、300g/5cm以下、350g/5cm以下、400g/5cm以下或450g/5cm以下。 In an embodiment of the present invention, the release force between the first insulating layer and the carrier layer may be 5, 6, 10, 12, 13, 13, 16, 17, 20, 21, 25, 26, 31, 33, 44, 44, 47, 49, 50, 51, 53, 54, 54, 55, 58, 63, 64, 78, 78, 80, 90, 100, 150, 200, 250, 300, 350, 400 or 450g/5cm. For example, the release force between the first insulating layer and the carrier layer is 50g/5cm or less, 100g/5cm or less, 150g/5cm or less, 200g/5cm or less, 250g/5cm or less, 300g/5cm or less, 350g/5cm or less , 400g/5cm or less or 450g/5cm or less.

於本發明的一具體實施態樣中，接觸該第一絕緣層之側之該載體層的表面粗糙度小於接觸該載體層之側之該第一絕緣層的表面粗糙度。 In an embodiment of the present invention, the surface roughness of the carrier layer on the side contacting the first insulating layer is smaller than the surface roughness of the first insulating layer on the side contacting the carrier layer.

於本發明的一具體實施態樣中，覆蓋膜復包括第二絕緣層，係形成於該第一絕緣層上，使該第二絕緣層位於該第一絕緣層與接著劑層之間。 In an embodiment of the present invention, the cover film further includes a second insulating layer formed on the first insulating layer, so that the second insulating layer is located between the first insulating layer and the adhesive layer.

於本發明的一具體實施態樣中，覆蓋膜復包括離型層，係設於該接著劑層上，使該接著劑層位於該離型層與第一絕緣層之間。 In an embodiment of the present invention, the cover film further includes a release layer, which is disposed on the adhesive layer, so that the adhesive layer is located between the release layer and the first insulating layer.

於本發明的一具體實施態樣中，該載體層、該第一絕緣層及該接著劑層之至少一者包含無機粉體。該無機粉體佔所存在之層體之總固含量的50重量百分比以下，例如1、5、10、15、20、25、30、35、40、45或50重量百分比，或5至35重量百分比。 In an embodiment of the present invention, at least one of the carrier layer, the first insulating layer and the adhesive layer includes inorganic powder. The inorganic powder constitutes less than 50 weight percent of the total solids content of the layer present, such as 1, 5, 10, 15, 20, 25, 30, 35, 40, 45 or 50 weight percent, or 5 to 35 weight percent percentage.

於本發明的一具體實施態樣中，該無機粉體的粒徑可為10、20、30、40、50、60、70、80、90、100、200、300、400、500、600、700、800、900、1000、1100、1200、1300、1400、1500、1600、1700、1800、1900或2000nm。具體地，該無機粉體的粒徑可為10至2000nm。 In a specific embodiment of the present invention, the particle size of the inorganic powder may be 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200, 1300, 1400, 1500, 1600, 1700, 1800, 1900 or 2000nm. Specifically, the particle size of the inorganic powder may be 10 to 2000 nm.

於本發明的一具體實施態樣中，該載體層的厚度可為12.5至250μm，例如12.5、15、20、25、30、35、45、50、60、70、80、90、100、110、120、130、140、150、160、170、180、190、200、210、220、230、240或250μm。具體地，該載體層的厚度為12.5至250μm、12.5至30μm、31至50μm、51至100μm、101至150μm、151至200μm或201至250μm。 In an embodiment of the present invention, the thickness of the carrier layer may be 12.5 to 250 μm, such as 12.5, 15, 20, 25, 30, 35, 45, 50, 60, 70, 80, 90, 100, 110 , 120, 130, 140, 150, 160, 170, 180, 190, 200, 210, 220, 230, 240 or 250 μm. Specifically, the carrier layer has a thickness of 12.5 to 250 μm, 12.5 to 30 μm, 31 to 50 μm, 51 to 100 μm, 101 to 150 μm, 151 to 200 μm or 201 to 250 μm.

於本發明的一具體實施態樣中，該第一絕緣層的厚度可為0.5至50μm，例如0.5、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、21、22、23、24、25、26、27、28、29、30、31、32、33、34、35、36、37、38、39、40、41、42、43、44、45、46、47、48、49或50μm。該接著劑層的厚度可為3至25μm，例如3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、21、22、23、24或25μm。 In an embodiment of the present invention, the thickness of the first insulating layer may be 0.5 to 50 μm, such as 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 , 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37 , 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49 or 50 μm. The thickness of the adhesive layer can be 3 to 25 μm , such as 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 , 21, 22, 23, 24 or 25 μm.

於覆蓋膜包括第二絕緣層之具體實施態樣中，該第二絕緣層的厚度可為0.5至50μm，例如0.5、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、21、22、23、24、25、26、27、28、29、30、31、32、33、34、35、36、37、38、39、40、41、42、43、44、45、46、47、48、49或50μm。該第一絕緣層、該第二絕緣層及該接著劑層的整體厚度可為4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20、21、22、23、24、25、26、27、28、29、30、31、32、33、34、3536、37、38、39、40、41、42、43、44、45、46、47、48、49、50、51、52、53、54、55、56、57、58、59、60、61、62、63、64、65、66、67、68、69、70、71、72、73、74或75μm。 In the embodiment in which the cover film includes the second insulating layer, the thickness of the second insulating layer may be 0.5 to 50 μm, such as 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10 , 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35 , 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49 or 50 μm. the first insulating layer, the second insulating layer and The overall thickness of the adhesive layer can be 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24 , 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 3536, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50 , 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74 or 75 μm .

於本發明的一具體實施態樣中，該載體層包括選自聚丙烯、雙向拉伸聚丙烯、聚對苯二甲酸乙二醇酯、聚醯亞胺、聚苯硫醚、聚萘二甲酸乙二醇酯、聚氨酯及聚醯胺所組成群組之至少一種的聚合物。 In an embodiment of the present invention, the carrier layer comprises a material selected from the group consisting of polypropylene, biaxially oriented polypropylene, polyethylene terephthalate, polyimide, polyphenylene sulfide, and polyethylene naphthalate. At least one polymer of the group consisting of glycol ester, polyurethane and polyamide.

於本發明的一具體實施態樣中，該載體層、第一絕緣層及接著劑層中的無機粉體係包括獨立選自硫酸鈣、炭黑、二氧化矽、二氧化鈦、硫化鋅、氧化鋯、碳酸鈣、碳化矽、氮化硼、氧化鋁、滑石粉、氮化鋁、玻璃粉體、石英粉體及黏土所組成群組之至少一種。 In an embodiment of the present invention, the inorganic powder system in the carrier layer, the first insulating layer and the adhesive layer includes calcium sulfate, carbon black, silicon dioxide, titanium dioxide, zinc sulfide, zirconia, At least one of the group consisting of calcium carbonate, silicon carbide, boron nitride, alumina, talc, aluminum nitride, glass powder, quartz powder and clay.

於本發明的一具體實施態樣中，該第一絕緣層及該第二絕緣層的至少一者包括選自環氧樹脂、丙烯酸系樹脂、環氧-丙烯酸改性樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、碳氫樹脂、聚醯亞胺系樹脂、聚醯胺及聚醯胺醯亞胺所組成群組之至少一種的樹脂。 In an embodiment of the present invention, at least one of the first insulating layer and the second insulating layer includes epoxy resin, acrylic resin, epoxy-acrylic modified resin, urethane resin Resin, silicone rubber-based resin, parylene-based resin, bismaleimide-based resin, hydrocarbon resin, polyimide-based resin, polyamide and polyamide-imide group consisting of at least one resin.

於本發明的一具體實施態樣中，該接著劑層包括選自環氧樹脂、丙烯酸系樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物、聚醯亞胺系樹脂及聚醯胺醯亞胺所組成群組之至少一種的樹脂。 In a specific embodiment of the present invention, the adhesive layer comprises epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismalein At least one resin of the group consisting of imine-based resin, styrene-ethylene/butylene-styrene block copolymer, polyimide-based resin and polyimide imine.

於本發明的一具體實施態樣中，該第一絕緣層、第二絕緣層及接著劑層復包括選自有機顏料及無機顏料所組成之群組之至少一種的顏料，其中，該無機顏料包括選自鎘紅、鎘檸檬黃、橘鎘黃、二氧化鈦、炭黑、黑色氧化鐵及黑色錯合物所組成群組之至少一種，該有機顏料包括選自苯胺黑、苝黑、蒽醌黑、鈦黑、聯苯胺類黃色顏料、酞青藍及酞青綠所組成群組之至少一種。 In an embodiment of the present invention, the first insulating layer, the second insulating layer and the adhesive layer comprise at least one pigment selected from the group consisting of organic pigments and inorganic pigments, wherein the inorganic pigments Including at least one selected from the group consisting of cadmium red, cadmium tartrazine, orange cadmium yellow, titanium dioxide, carbon black, black iron oxide and black complexes, the organic pigment includes aniline black, perylene black, anthraquinone black , titanium black, benzidine yellow pigment, at least one of the group consisting of phthalocyanine blue and phthalocyanine green.

於本發明的一具體實施態樣中，該第一絕緣層、第二絕緣層及接著劑層復包括選自含鹵素之化合物、磷系化合物、氮系化合物及硼系化合物所組成之群組之至少一種具阻燃性之化合物。 In an embodiment of the present invention, the first insulating layer, the second insulating layer and the adhesive layer comprise compounds selected from the group consisting of halogen-containing compounds, phosphorus-based compounds, nitrogen-based compounds and boron-based compounds at least one flame retardant compound.

於本發明的一具體實施態樣中，該第一絕緣層中的具阻燃性之化合物佔該第一絕緣層總固含量的1至40重量百分比，該第二絕緣層中的具阻燃性之化合物佔該第二絕緣層總固含量的1至40重量百分比，且該接著劑層中的具阻燃性之化合物佔該接著劑層總固含量的1至50重量百分比。 In an embodiment of the present invention, the flame retardant compound in the first insulating layer accounts for 1 to 40 weight percent of the total solid content of the first insulating layer, and the flame retardant compound in the second insulating layer The flame-retardant compound accounts for 1 to 40 weight percent of the total solid content of the second insulating layer, and the flame-retardant compound in the adhesive layer accounts for 1 to 50 weight percent of the total solid content of the adhesive layer.

本發明復提供一種覆蓋膜的製備方法，其包括：於載體層的表面上塗佈第一絕緣層原料；在50至180℃固化該第一絕緣層原料，以形成有第一絕緣層；以塗佈法或轉印法將有色接著劑層形成於該第一絕緣層的表面上；以及將離型層貼覆於該接著劑層的表面上。 The present invention further provides a method for preparing a cover film, which includes: coating a first insulating layer raw material on the surface of a carrier layer; curing the first insulating layer raw material at 50 to 180° C. to form a first insulating layer; A colored adhesive layer is formed on the surface of the first insulating layer by a coating method or a transfer method; and a release layer is attached on the surface of the adhesive layer.

於本發明的另一具體實施態樣中，覆蓋膜的製備方法更包括：在形成該接著劑層之前，於該第一絕緣層的表面上塗佈第二絕緣層原料；以及在50至180℃下固化該第二絕緣層原料，以形成第二絕緣層。 In another embodiment of the present invention, the preparation method of the cover film further includes: before forming the adhesive layer, coating a second insulating layer raw material on the surface of the first insulating layer; and at 50 to 180 The second insulating layer raw material is cured at °C to form a second insulating layer.

根據本發明的有色薄型化覆蓋膜及其製備方法，至少具有以下優點： The colored thinned cover film and the preparation method thereof according to the present invention have at least the following advantages:

一、本發明藉由無機粉體來達到具非天然色，使有色絕緣層搭配有色接著劑提供高遮蔽性，可降低絕緣層中的粉體添加量，使整體的機械特性能獲得提升。 1. In the present invention, inorganic powder is used to achieve non-natural color, so that the colored insulating layer is matched with colored adhesive to provide high shielding properties, which can reduce the amount of powder added in the insulating layer and improve the overall mechanical properties.

二、本發明通過添加無機粉體，促成該載體層與該絕緣層間表面粗糙度匹配，進而可依各種產品需求將離型力控制在所設計範圍。 2. The present invention promotes the matching of the surface roughness between the carrier layer and the insulating layer by adding inorganic powder, so that the release force can be controlled within the designed range according to various product requirements.

三、本發明之覆蓋膜通過絕緣層及載體層的粗糙度設計的匹配，促成絕緣層、載體層間的離型操作，而無需在載體層中添加離型劑或含有機矽之離型劑。 3. The cover film of the present invention facilitates the release operation between the insulating layer and the carrier layer by matching the roughness design of the insulating layer and the carrier layer, without adding a release agent or a silicone-containing release agent in the carrier layer.

四、本發明之載體層中不添加離型劑，也能後續PCB產品提供優異加工性，同時因不添加離型劑而提升PCB產品的可靠度。 4. No release agent is added to the carrier layer of the present invention, which can also provide excellent processability for subsequent PCB products, and at the same time, the reliability of PCB products is improved because no release agent is added.

五、本發明之覆蓋膜特別適用於高密度組裝之線路板中，應用於電子產品(例如，無線充電器、手機、電腦)或超薄覆蓋膜設計，均能帶來極佳的散熱性。 5. The cover film of the present invention is particularly suitable for high-density assembled circuit boards, and can be applied to electronic products (eg, wireless chargers, mobile phones, computers) or ultra-thin cover film design, which can bring excellent heat dissipation.

六、本發明之絕緣層無須拉伸製程，無殘留應力、尺寸安定性佳。 6. The insulating layer of the present invention does not need a stretching process, has no residual stress, and has good dimensional stability.

100:覆蓋膜 100: cover film

101:載體層 101: carrier layer

1011:無機粉體 1011: Inorganic Powder

102:第一絕緣層 102: first insulating layer

1021:無機粉體 1021: Inorganic powder

103:接著劑層 103: Adhesive layer

104:離型層 104: release layer

105:第二絕緣層 105: Second insulating layer

第1圖是本發明覆蓋膜的結構示意圖。 Figure 1 is a schematic view of the structure of the cover film of the present invention.

第2圖是本發明另一覆蓋膜的結構示意圖。 Fig. 2 is a schematic view of the structure of another cover film of the present invention.

以下係藉由特定的具體實施例說明本發明之實施方式，熟習此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之優點及功效。 The following describes the implementation of the present invention through specific embodiments, and those skilled in the art can easily understand the advantages and effects of the present invention from the contents disclosed in this specification.

須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如“第一”、“第二”、“上”、“下”及“一”等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。此外，本文所有範圍和值都係包含及可合併的。落在本文中所述的範圍內之任何數值或點，例如任何整數都可以作為最小值或最大值以導出下位範圍等。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the present invention without affecting the effect and the purpose that the present invention can achieve. The technical content disclosed by the invention can be covered within the scope. At the same time, terms such as "first", "second", "upper", "lower" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The scope of implementation and the change or adjustment of its relative relationship shall also be regarded as the scope of the present invention, provided that there is no substantial change in the technical content. Furthermore, all ranges and values herein are inclusive and combinable. Any value or point falling within a range described herein, eg, any integer, can be taken as a minimum or maximum value to derive a lower range, etc.

如第1圖所示，為本發明覆蓋膜的具體實施態樣。詳細而言，覆蓋膜100包括載體層101、第一絕緣層102及接著劑層103，第一絕緣層102係形成於該載體層101上，接著劑層103係形成於該第一絕緣層102上，使該第一絕緣層102位於該載體層101及該接著劑層103之間。 As shown in FIG. 1, it is a specific embodiment of the coverlay film of the present invention. Specifically, the cover film 100 includes a carrier layer 101 , a first insulating layer 102 and an adhesive layer 103 , the first insulating layer 102 is formed on the carrier layer 101 , and the adhesive layer 103 is formed on the first insulating layer 102 On the above, the first insulating layer 102 is located between the carrier layer 101 and the adhesive layer 103 .

該載體層101包含無機粉體1011時，該無機粉體1011佔所存在之層體(載體層101)之總固含量的50重量百分比以下。該第一絕緣層102包含無機粉體1021時，該無機粉體1021佔所存在之層體(第一絕緣層102)之總固含量的50重量百分比以下。藉此，可提升整體機械強度。此外，該無機粉體1011及該無機粉體1021之任一者的粒徑為10至2000nm。該無機粉體1011及該無機粉體1021之任一者包括選自硫酸鈣、炭黑、二氧化矽、二氧化鈦、硫化鋅、氧化鋯、碳酸鈣、碳化矽、氮化硼、氧化鋁、滑石粉、氮化鋁、玻璃粉體、石英粉體及黏土所組成群組之至少一種。 When the carrier layer 101 includes the inorganic powder 1011 , the inorganic powder 1011 accounts for 50 weight percent or less of the total solid content of the layer (the carrier layer 101 ) present. When the first insulating layer 102 includes the inorganic powder 1021 , the inorganic powder 1021 accounts for less than 50 weight percent of the total solid content of the existing layer (the first insulating layer 102 ). Thereby, the overall mechanical strength can be improved. In addition, the particle diameter of any one of the inorganic powder 1011 and the inorganic powder 1021 is 10 to 2000 nm. Any one of the inorganic powder 1011 and the inorganic powder 1021 includes calcium sulfate, carbon black, silicon dioxide, titanium dioxide, zinc sulfide, zirconia, calcium carbonate, silicon carbide, boron nitride, aluminum oxide, talc At least one of the group consisting of powder, aluminum nitride, glass powder, quartz powder and clay.

接觸該第一絕緣層102之側之該載體層101的表面粗糙度為1至10000nm，接觸該載體層101之側之該第一絕緣層102的表面粗糙度為1至10000nm，且該第一絕緣層102與該載體層101間的離型力為450g/5cm以下。較佳地，接觸該第一絕緣層102之側之該載體層101的表面粗糙度為1至2000nm，接觸該載體層101之側之該第一絕緣層102的表面粗糙度為1至2000nm。 The surface roughness of the carrier layer 101 on the side contacting the first insulating layer 102 is 1 to 10000 nm, the surface roughness of the first insulating layer 102 on the side contacting the carrier layer 101 is 1 to 10000 nm, and the first The release force between the insulating layer 102 and the carrier layer 101 is 450 g/5 cm or less. Preferably, the surface roughness of the carrier layer 101 on the side contacting the first insulating layer 102 is 1-2000 nm, and the surface roughness of the first insulating layer 102 on the side contacting the carrier layer 101 is 1-2000 nm.

該載體層101的厚度為12.5至250μm。該載體層101包括選自聚丙烯、雙向拉伸聚丙烯、聚對苯二甲酸乙二醇酯、聚醯亞胺、聚苯硫醚、聚萘二甲酸乙二醇酯、聚氨酯及聚醯胺所組成群組之至少一種的聚合物。 The thickness of the carrier layer 101 is 12.5 to 250 μm. The carrier layer 101 comprises selected from polypropylene, biaxially oriented polypropylene, polyethylene terephthalate, polyimide, polyphenylene sulfide, polyethylene naphthalate, polyurethane and polyamide at least one polymer of the group consisting of.

該第一絕緣層102的厚度為0.5至50μm，該接著劑層103的厚度為3至25μm。形成該第一絕緣層102之材質包括選自環氧樹脂、丙烯酸系樹脂、環氧-丙烯酸改性樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、碳氫樹脂、聚醯亞胺系樹脂、聚醯胺及聚醯胺醯亞胺所組成群組之至少一種的樹脂。 The thickness of the first insulating layer 102 is 0.5 to 50 μm , and the thickness of the adhesive layer 103 is 3 to 25 μm . The material for forming the first insulating layer 102 includes epoxy resin, acrylic resin, epoxy-acrylic modified resin, urethane resin, silicone rubber resin, parylene resin, bismuth resin At least one resin selected from the group consisting of lyimide resin, hydrocarbon resin, polyimide resin, polyimide and polyimide.

該接著劑層103包括選自環氧樹脂、丙烯酸系樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、苯乙烯-乙烯/丁烯-苯乙烯嵌段共聚物、聚醯亞胺系樹脂及聚醯胺醯亞胺所組成群組之至少一種的樹脂。 The adhesive layer 103 includes epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, At least one resin of the group consisting of styrene-ethylene/butylene-styrene block copolymer, polyimide resin and polyimide.

此外，該第一絕緣層102及接著劑層103復包括獨立選自有機顏料及無機顏料所組成之群組之至少一種的顏料，其中，該無機顏料包括選自鎘紅、鎘檸檬黃、橘鎘黃、二氧化鈦、炭黑、黑色氧化鐵及黑色錯合物所組成群組之至少一種，該有機顏料包括選自苯胺黑、苝黑、蒽醌黑、鈦黑、聯苯胺類黃色顏料、酞青藍及酞青綠所組成群組之至少一種。 In addition, the first insulating layer 102 and the adhesive layer 103 further comprise at least one pigment independently selected from the group consisting of organic pigments and inorganic pigments, wherein the inorganic pigment comprises cadmium red, cadmium tartrazine, orange At least one of the group consisting of cadmium yellow, titanium dioxide, carbon black, black iron oxide and black complexes, the organic pigment includes aniline black, perylene black, anthraquinone black, titanium black, benzidine yellow pigment, phthalocyanine black At least one of the group consisting of cyan blue and phthalocyanine green.

較佳地，該第一絕緣層102及接著劑層103復包括獨立選自含鹵素之化合物、磷系化合物、氮系化合物及硼系化合物所組成之群組之至少一種具阻燃性之化合物。於本具體實施態於一實施態樣中，該第一絕緣層102中的具阻燃性之化合物佔該第一絕緣層102總固含量的1至40重量百分比，該接著劑層103中的具阻燃性之化合物佔該接著劑層103總固含量的1至50重量百分比。 Preferably, the first insulating layer 102 and the adhesive layer 103 further comprise at least one flame retardant compound independently selected from the group consisting of halogen-containing compounds, phosphorus-based compounds, nitrogen-based compounds and boron-based compounds . In this embodiment, in one embodiment, the flame retardant compound in the first insulating layer 102 accounts for 1 to 40 weight percent of the total solid content of the first insulating layer 102 , and the compound in the adhesive layer 103 The flame-retardant compound accounts for 1 to 50 weight percent of the total solid content of the adhesive layer 103 .

本發明之一具體實施態樣之覆蓋膜100的製備方法係包括下述步驟：步驟一、於載體層101的表面上塗佈第一絕緣層原料；步驟二、在50至180℃下固化該第一絕緣層原料，以形成有第一絕緣層102；步驟三、以塗佈法或轉印法將有色接著劑層103形成於該第一絕緣層102的表面上；步驟四、將離型層104貼覆於接著劑層103的表面上。由此可知，本具體實施態樣之覆蓋膜100包括一層的絕緣層，具體實施例如下述表1的實施例1至15及表2的實施例A4至A7所列。 The preparation method of the cover film 100 according to an embodiment of the present invention includes the following steps: step 1, coating a first insulating layer raw material on the surface of the carrier layer 101; step 2, curing the film at 50 to 180° C. The first insulating layer raw material is used to form the first insulating layer 102; the third step is to form the colored adhesive layer 103 on the surface of the first insulating layer 102 by a coating method or a transfer method; the fourth step is to release the mold The layer 104 is attached to the surface of the adhesive layer 103 . From this, it can be seen that the cover film 100 of this embodiment includes an insulating layer, and specific examples are listed in Examples 1 to 15 in Table 1 and Examples A4 to A7 in Table 2 below.

如表1所示，係記載實施例1至實施例15覆蓋膜中絕緣層與載體層的表面粗糙度和離型力。其中，表面粗糙度的量測係使用原子力顯微鏡(Atomic Force Microscope，簡稱AFM)；離型力的量測係使用拉力測試儀，並按照ASTM D3330規範進行。 As shown in Table 1, the surface roughness and release force of the insulating layer and the carrier layer in the cover films of Examples 1 to 15 are described. Among them, the measurement system of surface roughness uses atomic force Microscope (Atomic Force Microscope, AFM for short); the measurement of the release force is carried out using a tensile tester and according to the ASTM D3330 specification.

表1

Table 1

表1中，實施例1至14的絕緣層102及載體層101添加各種比例的炭黑的無機粉體及/或各種比例的黑色顏料，其中，實施例1至14的黑色顏料包括50重量百分比的黑色氧化鐵、15重量比的黑色錯合物、20重量比的苯胺黑、10重量百分比的炭黑以及5重量比的鈦黑。較佳地，黑色錯合物可為酸性黑，例如酸性黑220。有色接著劑層包括聚醯亞胺化合物、固化劑、環氧樹脂、粉體，其中，固化劑添加量為聚醯亞胺主劑之0.1%，環氧樹脂添加量為總固含量之2.4%，粉體添加量為總固含量之6.3%，固化劑為鄰苯二甲酸酐、粉體主要為炭黑。絕緣層厚度為5μm，載體層厚度為25μm，有色接著劑15μm。 In Table 1, the insulating layer 102 and the carrier layer 101 of Examples 1 to 14 are added with various proportions of carbon black inorganic powder and/or various proportions of black pigments, wherein the black pigments of Examples 1 to 14 include 50 weight percent of black iron oxide, 15 weight ratio of black complex, 20 weight ratio of aniline black, 10 weight percent of carbon black and 5 weight ratio of titanium black. Preferably, the black complex can be acid black, such as acid black 220. The colored adhesive layer includes polyimide compound, curing agent, epoxy resin, and powder. The curing agent is added in an amount of 0.1% of the main polyimide agent, and the epoxy resin is added in an amount of 2.4% of the total solid content. , the amount of powder added is 6.3% of the total solid content, the curing agent is phthalic anhydride, and the powder is mainly carbon black. The thickness of the insulating layer is 5 μm , the thickness of the carrier layer is 25 μm , and the color adhesive is 15 μm .

由表1結果可知，本發明通過添加無機粉體1011、1021，促成該載體層101與該絕緣層102間表面粗糙度匹配，可賦予絕緣層102、載體層101之至少一者具一定粗糙度，進而控制離型力範圍。因此，能在製程中，因應各種產品需求條件，進行操作。此外，比較例1的載體層未添加無機粉體，處於離型力過大無法離型的情況。一般而言，為解決此方式會在載體層中上添加離型劑，此種做法與本發明做法方式不同。載體層的粗糙度變化會影響產品之絕緣層粗糙度，表面越粗糙之載體對於絕緣層表面具有粗化之效果。 It can be seen from the results in Table 1 that the present invention promotes the matching of the surface roughness between the carrier layer 101 and the insulating layer 102 by adding the inorganic powders 1011 and 1021, and can impart a certain roughness to at least one of the insulating layer 102 and the carrier layer 101 , and then control the release force range. Therefore, it can be operated in response to various product requirements in the process. In addition, in the carrier layer of Comparative Example 1, the inorganic powder was not added, and the release force was too large and the release was not possible. Generally speaking, in order to solve this problem, a release agent is added to the carrier layer, which is different from the method of the present invention. The change of the roughness of the carrier layer will affect the roughness of the insulating layer of the product. The rougher the surface of the carrier, the rougher the surface of the insulating layer.

如第2圖所示，為本發明覆蓋膜之另一具體實施態樣。詳細而言，覆蓋膜100包括載體層101、第一絕緣層102、第二絕緣層105及接著劑層103，該第一絕緣層102係形成於該載體層101上，該第二絕緣層105係形成於該第一絕緣層102上，該接著劑層103係形成於該第二絕緣層105上，使該第二絕緣層105位於該第一絕緣層102與該接著劑層103之間。 As shown in FIG. 2, it is another specific embodiment of the cover film of the present invention. In detail, the cover film 100 includes a carrier layer 101 , a first insulating layer 102 , a second insulating layer 105 and an adhesive layer 103 , the first insulating layer 102 is formed on the carrier layer 101 , the second insulating layer 105 The adhesive layer 103 is formed on the first insulating layer 102 , and the adhesive layer 103 is formed on the second insulating layer 105 , so that the second insulating layer 105 is located between the first insulating layer 102 and the adhesive layer 103 .

本具體實施態樣中，載體層101、無機粉體1011、第一絕緣層102、無機粉體1021、接著劑層103及離型層104的材質、尺寸、厚度或粗糙度等等各種限制與前述實施態樣中相應元件的限制相同，在此不另贅述。 In this embodiment, the material, size, thickness or roughness of the carrier layer 101 , the inorganic powder 1011 , the first insulating layer 102 , the inorganic powder 1021 , the adhesive layer 103 and the release layer 104 are limited and The limitations of the corresponding elements in the foregoing embodiments are the same, and are not described herein again.

該第二絕緣層105的厚度為0.5至50μm。本具體實施態樣中，該第二絕緣層105不包含無機粉體，僅該第一絕緣層102包含無機粉體1021，但本發明不受此限制。此外，在其它具體實施態樣中，該第二絕緣層105的層數可為一層、兩層或兩層以上，但本發明不受此限制。通過多層數的絕緣層設計，可提升整體機械強度。 The thickness of the second insulating layer 105 is 0.5 to 50 μm . In this embodiment, the second insulating layer 105 does not contain inorganic powder, and only the first insulating layer 102 contains inorganic powder 1021 , but the present invention is not limited thereto. In addition, in other specific embodiments, the number of layers of the second insulating layer 105 may be one layer, two layers or more than two layers, but the present invention is not limited thereto. The overall mechanical strength can be improved through the design of multiple insulating layers.

第二絕緣層105包括選自環氧樹脂、丙烯酸系樹脂、環氧-丙烯酸改性樹脂、氨基甲酸酯系樹脂、矽橡膠系樹脂、聚對環二甲苯系樹脂、雙馬來醯亞胺系樹脂、碳氫樹脂、聚醯亞胺系樹脂、聚醯胺及聚醯胺醯亞胺所組成群組之至少一種的樹脂。 The second insulating layer 105 includes epoxy resin, acrylic resin, epoxy-acrylic modified resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide At least one resin of the group consisting of resin, hydrocarbon resin, polyimide resin, polyamide and polyamide imide.

第二絕緣層105復包括選自有機顏料及無機顏料所組成之群組之至少一種的顏料，其中，該無機顏料包括選自鎘紅、鎘檸檬黃、橘鎘黃、二氧化鈦、炭黑、黑色氧化鐵及黑色錯合物所組成群組之至少一種，該有機顏料包括選自苯胺黑、苝黑、蒽醌黑、鈦黑、聯苯胺類黃色顏料、酞青藍及酞青綠所組成群組之至少一種。 The second insulating layer 105 further comprises at least one pigment selected from the group consisting of organic pigments and inorganic pigments, wherein the inorganic pigment comprises cadmium red, cadmium tartrazine, cadmium orange yellow, titanium dioxide, carbon black, black At least one of the group consisting of iron oxide and a black complex, the organic pigment is selected from the group consisting of aniline black, perylene black, anthraquinone black, titanium black, benzidine yellow pigment, phthalocyanine blue and phthalocyanine green at least one of them.

較佳地，第二絕緣層105復包括選自含鹵素之化合物、磷系化合物、氮系化合物及硼系化合物所組成之群組之至少一種具阻燃性之化合物。 Preferably, the second insulating layer 105 further comprises at least one compound with flame retardancy selected from the group consisting of halogen-containing compounds, phosphorus-based compounds, nitrogen-based compounds and boron-based compounds.

該第一絕緣層102中的具阻燃性之化合物佔該第一絕緣層102總固含量的1至40重量百分比，該第二絕緣層105中的具阻燃性之化合物佔該第二絕緣層105總固含量的1至40重量百分比，且該接著劑層103中的具阻燃性之化合物佔該接著劑層103總固含量的1至50重量百分比。 The flame retardant compound in the first insulating layer 102 accounts for 1 to 40 weight percent of the total solid content of the first insulating layer 102, and the flame retardant compound in the second insulating layer 105 accounts for the second insulating layer 105. The total solid content of the layer 105 is 1 to 40 weight percent, and the flame retardant compound in the adhesive layer 103 accounts for 1 to 50 weight percent of the total solid content of the adhesive layer 103 .

本具體實施態樣之覆蓋膜100的製備方法係包括下述步驟：步驟一、於載體層101的表面上塗佈第一絕緣層原料；步驟二、在50至180℃下固化該第一絕緣層原料，以形成有第一絕緣層102；步驟三、於該第一絕緣層102的表面上塗佈第二絕緣層原料；步驟四、在50至180℃下固化該第二絕緣層原料，以形成有該第二絕緣層105；步驟五、以塗佈法或轉印法將有色接著劑層103形成於第二絕緣層105的表面上；步驟六、將離型層104貼覆於該接著劑層103的表面上。由此可知，本具體實施態樣之覆蓋膜100包括兩層的絕緣層，具體實施例下述如實施例A1至A3所示。 The preparation method of the cover film 100 of this embodiment includes the following steps: step 1, coating a first insulating layer raw material on the surface of the carrier layer 101; step 2, curing the first insulating layer at 50 to 180° C. layer raw material to form the first insulating layer 102; step 3, coating the second insulating layer raw material on the surface of the first insulating layer 102; step 4, curing the second insulating layer raw material at 50 to 180 ℃, to form the second insulating layer 105; step 5, form the colored adhesive layer 103 on the surface of the second insulating layer 105 by coating method or transfer method; step 6, stick the release layer 104 on the surface of the second insulating layer 105 on the surface of the adhesive layer 103 . From this, it can be seen that the cover film 100 of the present embodiment includes two insulating layers, and specific examples are shown in Examples A1 to A3 below.

本發明製備得到之覆蓋膜100後續續可應用於PCB加工，通過離型操作後，可獲得絕緣膜、接著劑層與電路布局的具體疊構。表2記載實施例A1至A7的具體疊構、與現有聚醯亞胺膜覆於電路布局之具體疊構，以及兩者基本性能比較結果。其中，熱傳導係數及導熱阻值的量測係使用熱導係數儀(hot disk)，並按照ASTM D5470規範進行；耐擊穿電壓的量測係使用耐壓分析儀，並按照ASTM D149規範進行；尺寸安定性的量測係使用二次元坐標測量儀，並按照IPC-TM-6502.2.4C規範進行。 The cover film 100 prepared by the present invention can be subsequently applied to PCB processing. After the release operation, the specific stacking structure of the insulating film, the adhesive layer and the circuit layout can be obtained. Table 2 records the specific stacking structures of Examples A1 to A7, the specific stacking structures of the existing polyimide film covering the circuit layout, and the comparison results of the basic properties of the two. Among them, the thermal conductivity and thermal resistance are measured using a thermal conductivity meter (hot disk) in accordance with the ASTM D5470 specification; the breakdown voltage is measured using a withstand voltage analyzer and is performed in accordance with the ASTM D149 specification; The measurement system of dimensional stability uses a two-dimensional coordinate measuring instrument and is carried out in accordance with the IPC-TM-6502.2.4C specification.

表2

Table 2

表2中，有色接著劑層包括聚醯亞胺化合物、固化劑、環氧樹脂、粉體，其中，固化劑添加量為聚醯亞胺主劑之0.1%，環氧樹脂添加量為總固含量之2.4%，粉體添加量為總固含量之6.3%，固化劑為鄰苯二甲酸酐、粉體主要為炭黑。實施例的絕緣層為聚醯胺醯亞胺，實施例A1至 A3之覆蓋膜100包括兩層絕緣膜，實施例A4至A7之覆蓋膜100包括一層絕緣膜。實施例A1至A3中，第一絕緣層102添加炭黑為總固含量之10%，第二絕緣層105未添加粉體。實施例A4至A7中，第一絕緣層102添加炭黑為總固含量之10%。另一方面，比較例B1、B2絕緣層為深圳瑞華泰之聚醯亞胺薄膜HV；比較例B3、B4絕緣層為杜邦黑色聚醯亞胺薄膜Kapton。比較例B1及B2為市面上使用單軸延伸薄膜之類似規格覆蓋膜，比較例B3及B4為市面上使用雙軸延伸薄膜之類似規格覆蓋膜。 In Table 2, the colored adhesive layer includes a polyimide compound, a curing agent, an epoxy resin, and powder, wherein the curing agent is added in an amount of 0.1% of the polyimide main agent, and the epoxy resin is added in an amount of the total solids. The content of the powder is 2.4%, the amount of powder added is 6.3% of the total solid content, the curing agent is phthalic anhydride, and the powder is mainly carbon black. The insulating layer of the embodiment is polyamide imide, the embodiment A1 to The cover film 100 of A3 includes two layers of insulating films, and the cover films 100 of Examples A4 to A7 include one layer of insulating films. In Examples A1 to A3, carbon black was added to the first insulating layer 102 at 10% of the total solid content, and no powder was added to the second insulating layer 105 . In Examples A4 to A7, carbon black was added to the first insulating layer 102 at 10% of the total solid content. On the other hand, the insulating layers of Comparative Examples B1 and B2 are polyimide film HV of Shenzhen Ruihuatai; the insulating layers of Comparative Examples B3 and B4 are DuPont black polyimide film Kapton. Comparative Examples B1 and B2 are cover films of similar specifications using uniaxially stretched films on the market, and Comparative Examples B3 and B4 are cover films of similar specifications using biaxially stretched films on the market.

由表2結果可知，實施例A1至A7的熱傳導係數、導熱阻值、耐擊穿電壓各方面特性表現均佳，總體性能符合業界需求。詳言之，實施例A1至A7皆具有較高之熱傳導係數、較低之導熱阻值，可提供優異散熱能力；而比較例B1至B4皆具有較低之熱傳導係數、較高之導熱阻值，其散熱能力較差。再者，實施例A1至A7還表現出較佳的尺寸安定性，總體性能符合業界需求。反觀比較例B1至B4使用經拉伸製程的覆蓋膜，結果顯示其成品尺寸安定性均較差，尤其是，比較例B1、B2使用流延法生產未經雙軸延伸之聚醯亞胺膜，其成品尺安定性最差。 It can be seen from the results in Table 2 that the thermal conductivity, thermal resistance, and breakdown voltage of Examples A1 to A7 are all good, and the overall performance meets the requirements of the industry. Specifically, Examples A1 to A7 have higher thermal conductivity and lower thermal resistance, which can provide excellent heat dissipation capability; while Comparative Examples B1 to B4 have lower thermal conductivity and higher thermal resistance , its heat dissipation capacity is poor. Furthermore, Examples A1 to A7 also show better dimensional stability, and the overall performance meets the requirements of the industry. On the other hand, Comparative Examples B1 to B4 use the cover films through the stretching process, and the results show that the dimensional stability of the finished products is poor. In particular, Comparative Examples B1 and B2 use the casting method to produce polyimide films without biaxial stretching. Its finished ruler has the worst stability.

上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範圍所列。 The above embodiments are used to illustrate the principles and effects of the present invention, but not to limit the present invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the right of the present invention should be listed in the scope of the patent application described later.

100:覆蓋膜 100: cover film

101:載體層 101: carrier layer

1011:無機粉體 1011: Inorganic Powder

102:第一絕緣層 102: first insulating layer

1021:無機粉體 1021: Inorganic powder

103:接著劑層 103: Adhesive layer

104:離型層 104: Release layer

Claims

A cover film comprising:

carrier layer;

a first insulating layer formed on the carrier layer; and

An adhesive layer is formed on the first insulating layer, so that the first insulating layer is located between the carrier layer and the adhesive layer;

Wherein, the surface roughness of the carrier layer on the side contacting the first insulating layer is 1 to 10000 nm, the surface roughness of the first insulating layer on the side contacting the carrier layer is 1 to 10000 nm, and the first insulating layer The release force with the carrier layer is 450g/5cm or less.

The cover film as described in claim 1, wherein the surface roughness of the carrier layer on the side contacting the first insulating layer is 1 to 2000 nm, and the surface of the first insulating layer on the side contacting the carrier layer has a surface roughness of 1 to 2000 nm. The roughness is 1 to 2000 nm.

The cover film of claim 1, wherein the surface roughness of the carrier layer on the side contacting the first insulating layer is smaller than the surface roughness of the first insulating layer on the side contacting the carrier layer.

The cover film as described in item 1 of the claimed scope further comprises a second insulating layer formed on the first insulating layer, so that the second insulating layer is located between the first insulating layer and the adhesive layer.

The cover film as described in claim 1 of the claimed scope further comprises a release layer, which is disposed on the adhesive layer, so that the adhesive layer is located between the release layer and the first insulating layer.

The cover film according to claim 1, wherein at least one of the carrier layer, the first insulating layer and the adhesive layer comprises inorganic powder, and the inorganic powder accounts for the total solids of the existing layers 50 weight percent or less of the content.

The cover film as described in claim 6, wherein at least one of the carrier layer, the first insulating layer and the adhesive layer comprises inorganic powder, and the inorganic powder accounts for the total solids of the existing layer. 5 to 35 weight percent of the content.

The cover film according to claim 6, wherein the particle size of the inorganic powder is 10 to 2000 nm.

The cover film according to claim 1, wherein the carrier layer has a thickness of 12.5 to 250 μm.

The cover film according to claim 1, wherein the thickness of the first insulating layer is 0.5 to 50 μm , and the thickness of the adhesive layer is 3 to 25 μm .

The cover film according to claim 4, wherein the thickness of any one of the first insulating layer and the second insulating layer is 0.5 to 50 μm , and the thickness of the adhesive layer is 3 to 25 μm m.

The cover film according to claim 1, wherein the carrier layer is selected from the group consisting of polypropylene, biaxially oriented polypropylene, polyethylene terephthalate, polyimide, polyphenylene sulfide, At least one polymer of the group consisting of polyethylene naphthalate, polyurethane and polyamide.

The cover film according to claim 6, wherein the inorganic powder system in the carrier layer, the first insulating layer and the adhesive layer is independently selected from calcium sulfate, carbon black, silicon dioxide, titanium dioxide, and zinc sulfide. , at least one of the group consisting of zirconia, calcium carbonate, silicon carbide, boron nitride, alumina, talc, aluminum nitride, glass powder, quartz powder and clay.

The cover film according to claim 4, wherein at least one of the first insulating layer and the second insulating layer comprises epoxy resin, acrylic resin, epoxy-acrylic modified resin, amino Formate resin, silicone rubber resin, parylene resin, At least one resin of the group consisting of bismaleimide resin, hydrocarbon resin, polyimide resin, polyimide and polyimide.

The cover film according to claim 1, wherein the adhesive layer comprises epoxy resins, acrylic resins, urethane resins, silicone rubber resins, parylene resins, At least one resin of the group consisting of bismaleimide resin, styrene-ethylene/butylene-styrene block copolymer, polyimide resin and polyimide.

The cover film according to item 4 of the claimed scope, wherein the first insulating layer, the second insulating layer and the adhesive layer further comprise at least one pigment independently selected from the group consisting of organic pigments and inorganic pigments,

Wherein, the inorganic pigment includes at least one selected from the group consisting of cadmium red, cadmium tartrazine, orange cadmium yellow, titanium dioxide, carbon black, black iron oxide and black complexes,

The organic pigment includes at least one selected from the group consisting of aniline black, perylene black, anthraquinone black, titanium black, benzidine yellow pigment, phthalocyanine blue and phthalocyanine green.

The cover film according to claim 4, wherein the first insulating layer, the second insulating layer and the adhesive layer comprise compounds selected from the group consisting of halogen-containing compounds, phosphorus-based compounds, nitrogen-based compounds and boron-based compounds At least one flame retardant compound of the group consisting of.

The cover film of claim 17, wherein the flame-retardant compound in the first insulating layer accounts for 1 to 40 weight percent of the total solid content of the first insulating layer, and the second insulating layer The flame retardant compound accounts for 1 to 40 weight percent of the total solid content of the second insulating layer, and the flame retardant compound in the adhesive layer accounts for 1 to 50 weight percent of the total solid content of the adhesive layer. .

The cover film of claim 17, wherein the flame-retardant compound in the first insulating layer accounts for 5 to 35 weight percent of the total solid content of the first insulating layer, and the second insulating layer The flame retardant compound accounts for 5 to 35% of the total solid content of the second insulating layer and the flame-retardant compound in the adhesive layer accounts for 5 to 35 weight percent of the total solid content of the adhesive layer.

A method for preparing a cover film as described in item 1 of the scope of the application, comprising:

Coating the first insulating layer raw material on the surface of the carrier layer;

curing the first insulating layer raw material at 50 to 180° C. to form a first insulating layer;

forming an adhesive layer on the surface of the first insulating layer by a coating method or a transfer method; and

A release layer is attached to the surface of the adhesive layer.

The method for preparing a cover film as described in item 20 of the scope of the application, further comprising:

Before forming the adhesive layer, coating a second insulating layer raw material on the surface of the first insulating layer; and

The second insulating layer raw material is cured at 50 to 180° C. to form a second insulating layer.