TW202140226A - Substrate suction device - Google Patents

Abstract

Provided is a substrate suction device capable of reliably holding even a substrate having a number of through-holes, while eliminating the need for adjusting the position of a suction pad. The substrate suction device (10) is provided with: a rubber pad (30) having a suction-side main surface (31) with sucker portions (61, 71, 81) of a plurality of suction pads (60, 70, 80) extending therefrom, the suction-side main surface 31 having a plurality of depressurizing paths (63, 73, 83) penetrating therethrough and individually communicating with the sucker portions (61, 71, 81); a flow volume control plate (40) mounted to a surface of the rubber pad (30) opposite to the sucker portions (61, 71, 81) and having a plurality of orifices (43) disposed in an opposing manner so as to be in communication individually with the plurality of depressurizing paths (63, 73, 83); and a housing bracket (50) which is mounted so as to define a negative pressure chamber (P) on the back side of the flow volume control plate (40) and to which a depressurizing means (24) for depressurizing the negative pressure chamber (P) is connected.

Description

Substrate adsorption device

The present invention relates to a substrate adsorption device, which is used to adsorb and hold substrates such as printed substrates.

A substrate suction device is used for sucking and holding a substrate such as a printed circuit board (for example, refer to Patent Document 1 and Patent Document 2). Generally, such a substrate adsorption device is configured to include: an adsorption holder having a rubber adsorption pad; and a pressure reducer (for example, an ejector) that can apply negative pressure to the adsorption surface of the adsorption pad .

[Prior Technical Literature] (Patent Document) Patent Document 1: Japanese Patent Application Publication No. 2005-28489 Patent Document 2: Japanese Patent Application Publication No. 2017-127929

[The problem to be solved by the invention] However, in a general substrate suction device, when a rubber suction pad is used to suction the substrate, it is necessary to adjust the position of the suction holder so that the suction pad is aligned to a position of the substrate without a through hole. Therefore, if the position of the through hole differs depending on the substrate, the position of the suction holder must be adjusted in accordance with each other, so there is a problem of time-consuming adjustment. In addition, when a plurality of adsorption pads are installed in one adsorption holder, and the negative pressure flow path of each adsorption pad is merged on the upstream side, if air leakage occurs in one adsorption pad among the plurality of adsorption pads , The suction of all the suction pads is reduced due to the vacuum break, so there is a problem that the substrate cannot be picked up.

In contrast, the technique described in Patent Document 1 discloses an adsorption mechanism that has a large number of ball-type valves. However, because the structure of the adsorption mechanism composed of the ball-type valves is complicated, and the adsorption mechanism has a movable part, there will be Debris generated from the substrate and other airborne dusts are likely to be trapped in the movable part and cause the problem of unsmooth operation. In addition, the technique described in this document has a ball valve. Therefore, when the suction holder is in the horizontal and upward suction posture, the valve may not operate correctly. In addition, the technique described in Patent Document 2 discloses a technique of an adsorption mechanism in which a large number of small pistons are built-in, but an adsorption mechanism with a large number of small pistons is built-in, which is extremely difficult in actual production.

Therefore, the present invention has been completed focusing on this problem. The problem to be solved is to provide a substrate suction device that can reliably suction and hold without adjusting the position of the suction and holding part even for a substrate with multiple through holes. Substrate.

[Technical means to solve the problem] In order to solve the above-mentioned problems, a printed circuit board suction device according to one aspect of the present invention includes: a rubber pad, which is provided with a plurality of suction cups so as to protrude from one surface thereof, and a plurality of decompression paths penetrate to the surface , The plurality of decompression paths are individually connected to each suction cup part; the flow control plate is installed on the opposite side of the aforementioned suction cup part with respect to the aforementioned surface of the rubber pad, and has a plurality of orifices, the plurality of The orifices are arranged oppositely to communicate with the plurality of decompression paths individually; and, the housing bracket, which is mounted on the rubber pad on the back side of the flow control plate in such a way as to divide the negative pressure chamber, and is free On the opposite side of the flow control plate, a pressure reducing means for reducing the pressure of the negative pressure chamber is connected.

[Effects of the invention] According to the present invention, the flow control plate is installed between the decompression path of the suction cup and the negative pressure chamber, and the flow control plate is formed with orifices, so that even for a multi-through hole substrate, it can be applied to a plurality of The pressure of the suction cup part is independent and stable, and reduces the air flow leakage from the suction cup part located on the through hole of the substrate. Therefore, the attraction force of other suction cups that are not located on the through hole is not reduced, so even for the substrate with multiple through holes, the position of the suction pad can be adjusted without the need to adjust the position of the suction pad, and the substrate can be reliably sucked and held.

Hereinafter, an embodiment of the present invention will be described while appropriately referring to the drawings. In addition, the drawings are schematic diagrams. Therefore, it should be noted that the relationship between the thickness and the plane size, the ratio, etc., are different from reality, and the differences in the relationship between the dimensions and the ratio between the drawings are also included. In addition, the embodiment shown below exemplifies an apparatus and method for realizing the technical idea of the present invention, but the technical idea of the present invention is not limited to the material, shape, structure, and structure of the component parts in the following embodiment. Configuration etc.

The substrate in the example of this embodiment is a printed substrate with a plurality of small through holes formed (for example, the size is 300 mm × 340 mm × 1.6 mm, and the weight is 345 g). The substrate suction device of this embodiment can pick up and transport the printed circuit board without adjusting the position of the suction holding portion for the printed circuit board with multiple through holes. In detail, as shown in FIG. 1, the substrate suction device 10 of this embodiment includes: a rectangular hoist-shaped rubber pad 30, a rectangular plate-shaped flow control plate 40 installed inside the rubber pad 30, and The housing bracket 50 is connected to the air suction source 24.

The housing bracket 50 is a plastic member that has a rectangular shape in plan view. In the center of the top surface of the housing bracket 50, a connection port 21 supporting the shaft portion 20 is installed and fixed by a fixing nut 22. At the upper end of the support shaft portion 20, an air tube 23 is detachably connected to a one touch joint 25. The supporting shaft portion 20 penetrates the inside to form a flow path along the axis, and has a spring-type cushioning function, so that the housing bracket 50 can be slidably moved up and down. The middle part of the support shaft 20 is attached to a conveying machine such as a robot arm with the axis in the vertical direction.

In the housing bracket 50 of this embodiment, the connecting sleeve portion 55 at the center of the upper second lateral wall portion 54 has a connecting port 56 (refer to FIG. ), a female thread is formed on the screw bush in the connecting port 56 and can be screwed with the male thread of the connecting port 21 supporting the front end of the shaft portion 20. The base end side of the support shaft portion 20 is connected via an air tube 23 to a pressure reducing means 24 such as a vacuum generator that can be a suction source. In addition, in the decompression means 24 of the present embodiment, an ejector is used, the suction pressure is -87 kpa, and the suction flow rate is 55 L/min.

As shown in Figure 2, the housing bracket 50 is continuously formed as a rectangular step in the order of the first longitudinal wall portion 51, the first lateral wall portion 52, the second longitudinal wall portion 53, and the second lateral wall portion 54 In this example, the convex edge portion that extends downward is formed on the entire periphery, whereby the area inside the edge portion becomes a concave portion that constitutes a square lifting bucket in this example.

The flow control plate 40 is a metal plate member, and has an elastic ring-shaped portion contact surface 41, a negative pressure chamber dividing surface 42, and a plurality of orifices 43 penetrating the plate thickness direction. The flow control plate 40 is formed into a similar shape having the same size as the rectangular shape that divides the outer edge of the first longitudinal wall portion 51 of the housing bracket 50. In the flow control plate 40, a plurality of (68) through holes having a diameter of Φ0.25 mm are formed as the orifices 43, and they are installed on the inner surface of the recessed portion side of the housing bracket 50, whereby the housing bracket 50 The portion in the rectangular raised bucket-shaped recess that is partitioned together with the upper portion of the flow control plate 40 becomes the negative pressure chamber P.

The rubber pad 30 is an elastic member and has a main surface 31 on the suction side, a longitudinal wall portion 32 of the pad, a lateral wall portion 33 of the pad, a second longitudinal wall portion 34, a first longitudinal wall portion 35, and an elastic engagement convex portion 36 , And is formed into a similar shape with the same size as the housing bracket 50. In the rubber pad 30, a plurality of (in this example, 68 in total) adsorption pads 60, 70, 80 are integrally formed as adsorption holding parts. Suction cup parts 61, 71, 81 are provided so as to protrude toward the main surface 31 of the suction side on the substrate side. The rubber pad 30 has the suction pads 60, 70, 80 side of the suction cup 61, 71, 81 set to the bottom, the pressure reduction path 63, 73, 83 side is set to the top style, and the flow control plate 40 is installed on The state between the rubber pad 30 and the lower end surface of the first longitudinal wall portion 51 is detachably mounted on the lower surface of the housing bracket 50 by its own elastic deformation.

In the example of this embodiment, the rubber pad 30 is elastically fixed by a rectangular ring-shaped elastic engagement protrusion 36 formed on the top facing the first lateral wall 52 The location of the face. Thereby, the through hole of the flow control plate 40 installed between the three types of adsorption pads 60, 70, 80 and the vacuum chamber P is used as the orifice 43, and the size of the through hole is set to be larger than that of the decompression path 63, 73 ,83 has a smaller diameter.

Each of the large-sized adsorption pads 60 of the present embodiment is configured to have a suction cup portion 61, a serpentine tube portion 62, a decompression path 63, and an elastic ring portion 64. Similarly, each of the medium-sized adsorption pads 70 is configured to have a suction cup part 71, a serpentine tube part 72, a decompression path 73, and an elastic ring-shaped part 74. In the same manner, each small suction pad 80 is configured to have a suction cup part 81, a serpentine tube part 82, a decompression path 83, and an elastic ring-shaped part 84. The suction cup surface M of the multi-mouth suction pad composed of these plural suction pads 60, 70, and 80 are located on the same surface without external force.

When the housing bracket 50 is attached to the rubber pad 30 with the flow control plate 40 installed inside the rubber pad 30, the respective elastic ring portions 64, 74, 84 of the three types of adsorption pads 60, 70, and 80 It is pressed to the elastic ring portion abutting surface 41, thereby exerting a sealing function on the back surface of the portion formed as the main surface 31 on the suction side, thereby reliably preventing air from the orifice 43 and the decompression path 63, 73 , 83 The part of the ring in contact is leaking. In addition, the respective serpentine tube portions 62, 72, 82 of the three types of adsorption pads 60, 70, and 80 can be stretched and tilted in the direction opposite to the substrate, thereby flexibly responding to the height difference or slight difference of the substrate surface. The difference in relative distances such as inclination can stabilize the adsorption properties of the respective suction cup parts 61, 71, and 81.

In the main surface 31 on the suction side of the rubber pad 30, a plurality of (68) communication holes are respectively provided at positions opposite to the plurality of orifices 43 of the flow control plate 40 as decompression paths 63, 73, 83 . Here, the decompression paths 63, 73, and 83 located at the edge of the main surface 31 on the suction side are formed as inclined decompression paths. In the rubber pad 30 of this embodiment, among the plurality of pressure-reduction paths 63, 73, 83, the axes of the pressure-reduction paths 63, 73, and 83 located at the four peripheries of the rubber pad 30 itself, when viewed from the side, are It is installed obliquely so as to approach the outer peripheral surface from the inner side in the thickness direction of the portion formed as the suction side main surface 31 toward the outer side. As described above, the diameters of the plurality of (68) decompression paths 63, 73, and 83 are larger than the diameter of the orifice 43 of the flow control plate 40. A plurality of (68) rubber suction cups 61, 71, 81 are provided on the other side of the rubber mat 30 at respective positions of the plurality of (68) decompression paths 63, 73, and 83, Used as the suction holding part of the multi-mouth suction pad.

In the example of this embodiment, as shown in the plan view of the suction cup surface of the suction cup parts 61, 71, 81 in Figure 3, three types of large suction pads 60, medium suction pads 70, The small suction pad 80 has suction cup parts 61, 71, and 81 whose suction cup surface diameters are different from each other. The respective suction cup portions 61, 71, and 81 of the rubber pad 30 of the present embodiment are arranged at the intersection of the hexagonal lattice when viewed from the top of the suction side main surface 31, and are arranged at positions different from each other. In addition, in the same figure, in order to easily visually distinguish the three different types of suction cup surface diameters, the suction cup portion 61 of the suction pad 60 with the largest suction cup surface diameter is indicated by a thick solid line at the edge of the suction cup surface diameter. ; The suction cup portion 81 of the suction pad 80 with the smallest diameter of the suction cup surface, with a thin solid line to indicate the edge of the suction cup surface diameter; The edge of the diameter.

Here, as shown in the figure, in a plan view, with respect to the other suction pads 70, 80 with different diameters, the suction pad 60 with the largest suction surface diameter among the 3 types of suction pads 60, 70, 80 is arranged on top of each other. Different locations, and the overall plan is a hexagonal grid. The chuck parts 61 with the largest chuck surface diameter are arrange|positioned so that they may not be arrange|positioned at the adjacent intersection point of a hexagonal lattice. In a plan view, among the three types of suction pads 60, 70, and 80, the suction pads 80 with the smallest sucker surface diameter are arranged at different positions, and the suction pads 81 with the smallest sucker surface diameter are not arranged in the hexagonal area. Layout of the grid at the adjacent intersection point.

In detail, in the same figure, set the column marks from A to J (except I), mark the adsorption pad 80 as "small", mark the adsorption pad 70 as "medium", and mark the adsorption pad 60 If it is "large", the three types of adsorption pads 60, 70, and 80 are arranged as follows as a whole. Row A: large medium small medium medium small medium large Row B: Small Medium Large Medium Large Medium Small Line C: Medium Medium Small Medium Medium Small Medium Medium Row D: Small Large Medium Small Medium Large Small Row E: large medium small medium medium small medium large Line F: Small Large Medium Small Medium Large Small Line G: Medium Medium Small Medium Medium Small Medium Medium Line H: Small Medium Large Medium Large Medium Small Row J: large medium small medium medium small medium large

Next, the function and effect of the substrate adsorption device 10 of this embodiment will be described. The substrate adsorption device 10 of this embodiment, as shown in Figs. 1 and 2, has a simple configuration in which the flow control plate 40 is mounted between the rubber pad 30 and the housing bracket 50, and the flow control plate 40 The orifice 43 provided with fine holes can suppress the pressure change of the negative pressure chamber P and stabilize the flow rate. That is, in the substrate adsorption device 10 of this embodiment, as described above, the flow control plate 40 is installed between the pressure reduction paths 63, 73, and 83 of the three types of adsorption pads 60, 70, and 80 and the negative pressure chamber P And the flow control plate 40 is formed with a plurality of orifices 43 corresponding to the respective decompression paths 63, 73, and 83 respectively.

Thereby, according to the substrate suction device 10 of the present embodiment, as shown in the suction state image in FIG. 4, even at any one of the suction pads 60, 70 on the position facing the through hole H of the printed circuit board K ,80 produces vacuum failure, and it also has the effect of confining the vacuum failure to the individual opposing orifices 43, thereby reducing the impact of vacuum failure on the negative pressure chamber P, and can reduce the impact on other adsorption pads 60, 70 ,80's influence is suppressed to a negligible degree. Therefore, even if air leakage occurs in some of the adsorption pads 60, 70, and 80, the vacuum degree of the negative pressure chamber P can be sufficiently maintained. In addition, in the same figure, dot patterns are used to represent the image of the space that maintains the required sufficient decompression state, and white space is used to represent the image of the space that is vacuum broken due to the through hole H.

In this way, according to the substrate suction device 10 of the present embodiment, even for the printed circuit board K with many through holes H, the pressure applied to the plurality of suction pads 60, 70, 80 can be made independent and stable, and free-standing printing can be reduced. The air flow rate from the adsorption pads 60, 70, 80 on the through holes H of the substrate K. Therefore, according to the substrate suction device 10 of the present embodiment, the suction force of the other suction pads 60, 70, 80 that are not located on the through hole H is not reduced, and the printed substrate K can be suctioned and picked up. In addition, there is also an effect that the suction pressure and the suction flow rate of the pressure reducing means 24 are not excessively increased.

In addition, the substrate adsorption device 10 of this embodiment, as shown in FIG. 1, has an integrated rubber pad 30 formed by integrally forming a plurality of adsorption pads 60, 70, and 80, and a flow control plate installed in the rubber pad 30 40. The extremely simple mechanical structure constituted by the housing bracket 50 connected to the pressure reducing means 24 is used as its basic structure, so it is easy to manufacture. In addition, compared with the prior art exemplified as the aforementioned prior art document, the substrate suction device 10 of this embodiment has a simple structure without movable parts in the integrated rubber pad 30 and the flow control plate 40, so it is less likely to be generated from the printed circuit board. Debris generated by K and dust from other spaces are blocked inside the substrate adsorbing device 10 and the operation is not smooth.

Moreover, even if the movement is not smooth due to dust clogging in the orifice of the flow control plate 40, maintenance can be easily performed by simply attaching and removing the rubber pad 30 by hand and exchanging the flow control plate 40 installed inside. Therefore, it is easy to respond if the operation is not smooth, and maintenance can be carried out inexpensively and quickly.

In particular, the substrate adsorption device 10 of this embodiment, as shown in FIG. 2, corresponds to the respective decompression paths 63, 73, and 83 of the plurality of adsorption pads 60, 70, and 80 in a one-to-one manner. The orifices 43 are individually provided in the positions of the respective pressure reduction paths 63, 73, 83, so it is an excellent structure in terms of preventing the possibility of vacuum breakage from affecting other adsorption pads 60, 70, 80 as much as possible . In addition, in the substrate suction device 10 of the present embodiment, as shown in FIG. 2, the rubber pad 30 has a plurality of pressure-reduction paths 63, 73, and 83 of the pressure-reduction path located at the periphery of the rubber pad 30 itself. When viewed from the side, the axis of φ is inclined from the inner side in the thickness direction of the suction side main surface 31 to the outer side.

In other words, according to the substrate suction device 10 of this embodiment, the air passage in the decompression path located at the peripheral edge of the rubber pad 30 is not vertical, but the air passage is arranged obliquely, whereby the suction pads 60, 70 can be , 80 is arranged as close as possible to the vicinity of the end surface of the main surface 31 on the suction side. Therefore, according to the substrate suction device 10 of the present embodiment, with this mechanism, when there is an obstacle like a screen, for example, the suction pads 60, 70, and 80 arranged on the end portion of the main surface 31 on the suction side can be sucked to It is as close as possible to the position near the end surface of the main surface 31 on the suction side to exert an excellent effect.

Furthermore, according to the substrate suction device 10 of the present embodiment, as shown in FIG. 3, a plurality of suction pads 60, 70 are composed of 3 types of suction pads having different sizes of the suction cup surface diameters of the suction cup parts 61, 71, and 81. 80, and these suction pads 60, 70, 80 are arranged flush on the main surface 31 of the suction side, so it can flexibly correspond to the printed circuit board K with a large size range from the small printed circuit board K to the large printed circuit board K. . In addition, the substrate suction device 10 of this embodiment, as shown in FIG. 3, arranges the suction pads 61, 71, 81 of a plurality of (68) suction pads 60, 70, and 80 with 3 types of suction cup surface sizes on each other. The different positions are arranged in a grid shape, so for a limited surface of the main surface 31 on the suction side, the suction pads 60, 70, 80 are arranged in a way that the number of clusters is as large as possible, and it can correspond to the small size substrate to the large size. Various printed substrates K of the substrate.

As described above, according to the substrate adsorption device 10 of the present embodiment, one flow control plate 40 is installed between the respective decompression paths 63, 73, 83 of the plurality of adsorption pads 60, 70, 80 and the negative pressure chamber P. The flow control plate 40 is formed with orifices 43 that are individually opposed to the respective decompression paths 63, 73, and 83, whereby the pressure applied to the plurality of adsorption pads 60, 70, and 80 can be made independent and stable, and can reduce the pressure The air flow rate from the suction pads 60, 70, and 80 on the through holes H of the printed circuit board K. Therefore, the attraction force of the other suction pads 60, 70, 80 that are not located on the through hole H is not reduced, and the printed circuit board K can be reliably sucked and picked up. In addition, the substrate suction device of the present invention is not limited to the above-mentioned embodiment, and of course various changes can be made as long as it does not deviate from the gist of the present invention.

10: Substrate adsorption device 20: Support shaft 21: Connection port 22: fixed nut 23: Air pipe 24: Decompression means (air suction source) 25: One-touch connector 30: Rubber pad 31: The main surface of the suction side (one surface) 32: The longitudinal wall of the pad 33: Transverse wall of the pad 34: second longitudinal wall 35: The first longitudinal wall 36: spring-loaded engagement convex part 40: flow control board 41: Abutment surface of elastic ring part 42: Negative pressure chamber dividing surface 43: Orifice 50: Shell bracket 51: First longitudinal wall 52: The first transverse wall 53: second longitudinal wall 54: second transverse wall 55: connecting sleeve part 56: connection port 60: (large) adsorption pad 70: (medium) adsorption pad 80: (small) adsorption pad 61, 71, 81: Suction cup part 62, 72, 82: Serpentine tube 63, 73, 83: Decompression path 64, 74, 84: elastic ring part H: Through hole K: printed circuit board M: The suction cup surface of the suction cup part of each suction pad P: negative pressure chamber Z-Z: Section line

Fig. 1 is a schematic perspective view illustrating an embodiment of a substrate adsorption device related to an aspect of the present invention. Fig. 2 is an enlarged cross-sectional view of a substrate suction part of the substrate suction device shown in Fig. 1. FIG. 3 is a plan view of the suction pad surface of the multi-port suction pad of the substrate suction part of the substrate suction device shown in FIG. 1. FIG. Fig. 4 is a diagram illustrating a state where the printed circuit board is sucked in the enlarged cross-sectional view shown in Fig. 2.

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21: Connection port

22: fixed nut

24: Decompression means (air suction source)

30: Rubber pad

31: The main surface of the suction side

32: The longitudinal wall of the pad

33: Transverse wall of the pad

34: second longitudinal wall

35: The first longitudinal wall

40: flow control board

41: Abutment surface of elastic ring part

42: Negative pressure chamber dividing surface

43: Orifice

50: Shell bracket

51: First longitudinal wall

52: The first transverse wall

53: second longitudinal wall

54: second transverse wall

55: connecting sleeve part

56: connection port

60, 70, 80: Adsorption pad

61, 71, 81: Suction cup part

62, 72, 82: serpentine tube

63, 73, 83: Decompression path

64, 74, 84: elastic ring part

P: negative pressure chamber

M: The suction cup surface of the suction cup part of each suction pad

Z-Z: Section line

Claims (6)

A substrate adsorption device, characterized by comprising: A rubber pad, which is provided with a plurality of suction cup parts in a manner protruding from one surface thereof, and a plurality of decompression paths penetrate to the aforementioned surface, and the plurality of decompression paths are individually connected to each suction cup part; The flow control plate is installed on the opposite side of the suction cup part with respect to the surface of the rubber pad, and has a plurality of orifices, and the plurality of orifices are arranged oppositely to communicate with the plurality of decompression Path; and, The housing bracket is mounted on the rubber pad on the back side of the flow control plate so as to divide the negative pressure chamber, and is connected from the side opposite to the flow control plate to reduce the negative pressure chamber. Means of pressure reduction. The substrate adsorption device according to claim 1, wherein, among the plurality of pressure reduction paths of the rubber pad, the axis of the pressure reduction path located at the periphery of the rubber pad itself, when viewed from the side, follows the self-formed The thickness direction inner side of the part which is the said surface faces the outer side, and it is inclined and installed so that it may become close to an outer peripheral surface. The substrate suction device according to claim 1 or 2, wherein each suction cup portion of the rubber pad is arranged at the intersection of the hexagonal lattice when the surface is viewed from above. The substrate suction device according to claim 3, wherein the plurality of suction cup parts of the rubber pad are configured to have three types of the suction cup parts with different suction cup surface diameters; Among the three types of the suction cup parts, the suction cup parts having the largest diameter of the suction cup surface are arranged so as not to be arranged at the adjacent intersection points of the hexagonal lattices. The substrate suction device according to claim 3 or 4, wherein the suction cup parts with the smallest diameter of the suction cup surface among the three types of the suction cup parts are arranged so as not to be arranged at the adjacent intersections of the hexagonal lattices. The substrate suction device according to any one of claims 1 to 5, wherein the plurality of suction cup parts are integrally formed on the surface.

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