TW202138610A - Multi-channel gas ejector with serially-connected cooling chambers capable of effectively removing dust and deposits on the edge of the wafer and improving the product manufacturing yield - Google Patents

Abstract

The present invention relates to a multi-channel gas ejector with serially-connected cooling chambers, which includes a jet housing internally provided with plural layers of cooling chambers. At least one overflow opening is provided on a top portion of a side wall of each cooling chamber to communicate with adjacent cooling chambers. Each cooling chamber is internally provided with a plurality of exhaust pipes, and the openings of the exhaust pipes are exposed outside the jet housing. The present invention can immerse each exhaust pipe in the cooling liquid to achieve the effect of overall exhaust pipe temperature control. The exhaust pipes protrude from the bottom of the multi-channel gas ejector with the serially-connected cooling chambers to be matched with recessed structures of a susceptor, so as to effectively remove dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Description

Multi-channel gas ejector with series cooling chamber

The present invention relates to a wafer plating technology, in particular to a multi-channel gas injector with a series cooling chamber.

With the development of semiconductor technology, semiconductor process technology has become more mature, so that electronic devices composed of more semiconductors can be made more sophisticated and more functional.

The process of semiconductor technology will go through yellow light, etching, diffusion and then enter the formation of thin films. In the thin film deposition process of semiconductor wafers, the wafers are placed in a vacuum reaction chamber to inject the reacted gas onto the wafers horizontally by a gas injector, so as to utilize the physical or chemical reaction caused by heating, so that the wafer Deposit a thin film on it.

During the deposition process, in order to prevent the gas injector from being affected by high temperatures when heating the wafer, in the past, a water-cooling device was installed on the outer edge of the gas injection tube of the gas injector to reduce the temperature of the gas injector. However, the water-cooling equipment in this way can only cover the outermost jet tube, and cannot effectively cool the jet tube in the inner layer of the gas ejector, resulting in poor overall temperature control effect.

In addition, the current ejector design makes the gas source gas to be sprayed around 360 degrees in a horizontal manner, so it is easy to have a dead angle when depositing a thin film. For example, the upper edge of the side edge of the wafer is the front end that contacts the gas. It is especially easy to accumulate reactants, and dust is easy to accumulate over time. And this area is the gas upstream section of the film formation area. Once dust is generated, the dust is easily blown to the surface of the entire wafer along with the airflow, causing the wafer to form dust particle defects, which affects the process yield.

In view of this, the present invention addresses the shortcomings of the above-mentioned conventional technology and proposes a multi-channel gas ejector with a series-type cooling chamber to effectively overcome the above-mentioned problems.

The main purpose of the present invention is to provide a multi-channel gas injector with a series cooling chamber, which can make each exhaust pipe immerse in the cooling liquid to achieve the effect of controlling the temperature of the entire exhaust pipe.

Another object of the present invention is to provide a multi-channel gas injector with a series cooling chamber, which has a common air flow channel that can be used as a purge channel or a clean etching channel, and the air flow channel protrudes from the series cooling chamber The bottom of the multi-channel gas injector, with the concave structure of the susceptor, can effectively sweep dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Another object of the present invention is to provide a multi-channel gas ejector with a series cooling chamber, which can make cooling water flow only in a single direction through the arrangement of partitions, which can avoid the reflux of cooling water, and can greatly improve the cooling performance. effect.

In order to achieve the above-mentioned object, the present invention provides a multi-channel gas ejector with series cooling chambers, which includes a spray shell with a plurality of cooling chambers around the inner ring, and at least one overflow is provided on the top of the side wall of each cooling chamber An opening is used to communicate with adjacent cooling chambers, and a plurality of exhaust pipes are respectively arranged in each cooling chamber, and the opening of each exhaust pipe is exposed outside the spray casing.

In this embodiment, the spray casing can be a stepped spray casing, so that the length of the side wall of each cooling chamber gradually increases from the inside to the outside.

In this embodiment, the bottom of each cooling chamber is further provided with a gas drainage plate, perpendicular to the openings of the plurality of exhaust pipes to guide the gas discharged from the exhaust pipes, and there is an overflow space in the gas drainage plate, and the overflow space is connected Cooling room.

In this embodiment, each of the cooling chambers is further provided with at least one partition to separate the cooling chambers.

In this embodiment, the plurality of exhaust pipes includes a common exhaust pipe arranged in the center of the injection housing, and the common exhaust pipe passes through the injection housing.

In this embodiment, the gas injector with a series cooling chamber further includes an adapter. The adapter includes an input connector and a branch connector. The input connector is provided with a plurality of gas pipes, at least one first liquid pipe, and At least one first drain pipe. The branch joint is provided with a plurality of air flow channels, at least one second liquid infusion pipe and at least one second liquid discharge tube. The plurality of air flow channels are respectively connected with the air pipe and with a plurality of exhaust pipes to input different gases to the plurality of exhaust pipes; The second liquid infusion pipe is respectively connected with the first liquid pipe and the innermost cooling chamber to input the cooling liquid; the second liquid discharge pipe is respectively connected with the first liquid discharge pipe and the outermost cooling chamber to discharge the cooling liquid.

In this embodiment, a filter screen is further provided between each gas drainage plate.

Detailed descriptions are given below by specific embodiments, so that it will be easier to understand the purpose, technical content, features, and effects of the present invention.

The multi-channel gas injector with a series cooling chamber of the present invention can be used to connect a thin film deposition gas output system to be used as a nozzle to spray different gases to deposit thin films on wafers. More importantly, it has a series connection The special structure design of the multi-channel gas injector in the cooling chamber can make each exhaust pipe immerse in the coolant to achieve the effect of overall exhaust pipe temperature control.

Please refer to the first to third figures, the multi-channel gas injector 1 with a series cooling chamber includes an injection housing 10 connected to an adapter 20. In this embodiment, the spray casing 10 is a circular spray casing. Of course, the spray casing can also be a square or triangular spray casing, and the shape is not limited. In this embodiment, a plurality of cooling chambers 12 are ringed in the spray housing 10 in a concentric manner, and at least one overflow opening 120 is provided on the top of the side wall of each cooling chamber 12 to communicate with adjacent cooling chambers 12 , So that the cooling liquid contained in the cooling chamber 12 can overflow into the adjacent cooling chamber 12 to achieve the purpose of connecting the cooling chambers 12 in series. The injection casing 10 is further provided with a plurality of exhaust pipes 14 respectively arranged in each cooling chamber 12, and the opening of the exhaust pipe 14 is exposed outside the injection casing 10; through the arrangement of the above structure, when the cooling chamber 12 is filled When the coolant is full, all the exhaust pipes 14 can be immersed in the coolant to achieve the effect of temperature control. The adapter 20 provides a multi-channel gas injector 1 with a series cooling chamber to connect the film deposition gas output system (not shown in the figure) and the water cooling system (not shown in the figure) to provide a series cooling chamber. The multi-channel gas injector 1 sprays deposited gas and cooling liquid.

Please continue to refer to the first to third figures to describe the structure of the spray housing 10 and the adapter 20 in detail. In this embodiment, the injection housing 10 can be a stepped injection housing, so that the length of the side wall of each cooling chamber 12 gradually increases from the outer ring to the inner ring, and the length of the exhaust pipe 14 in the cooling chamber 12 is also the same. According to the side wall of the cooling chamber 12 gradually grows. Please refer to the third figure, the bottom of each cooling chamber 12 is further provided with a gas drainage plate 122, the gas drainage plate 122 is vertically connected to the cooling chamber 12, the gas drainage plate 122 has an overflow space 124, the overflow space 124 is connected to the cooling chamber 12 , And each gas guide plate 122 is vertically arranged below the opening of the plurality of exhaust pipes 14. Since the jet housing 10 is stepped, the gas guide plate 122 will be located just below the exhaust pipe 14, so that it can be used as a drain The gas exhausted from the air pipe 14 allows the gas ejected from the exhaust pipe 14 to be ejected in a horizontal manner. Please refer to the second figure. At least one partition 16 is provided on the side wall of each cooling chamber 12 to divide each cooling chamber 12 into two areas. The partition 16 can prevent the heat exchange liquid from being in the cooling chamber. 12 flows randomly, and interferes with the flow direction of the cooling liquid.

Continue to refer to the first to third figures to describe the structure of the exhaust pipe 14 of the injection housing 10. In this embodiment, the inner diameter of the exhaust pipe 14 is at least four millimeters (mm), and the exhaust pipe 14 can be It is a metal pipe body with fast heat conduction, such as a copper exhaust pipe, and the thickness of the pipe wall of the exhaust pipe 14 is 2.5 mm to 0.5 mm. Since the material of the exhaust pipe 14 conducts heat quickly and is thin in thickness, the temperature conduction is faster, so that the cooling liquid in the cooling chamber 12 can effectively cool the exhaust pipe 14, so that the temperature control effect is better. Please refer to the third figure. In this embodiment, a filter screen 18 is further provided between each gas drainage plate 122. The filter screen 18 can be a metal filter screen to block the gas discharged from the exhaust pipe 14 from forming a gas pressure resistance. , At the same time, it can prevent the jetted gas from directly rushing out, causing uneven jetting problems. In this embodiment, the plurality of exhaust pipes 14 includes a common exhaust pipe 140 disposed in the center of the injection housing 10, and the common exhaust pipe 14 penetrates the bottom of the injection housing 10 to serve as a sweeping channel and cleaning etching ( Cleaning Etching) The common channel of the runner.

Please continue from the first to third figures, and then describe the structure of the adapter 20 in detail. The adapter 20 includes an input connector 22 and a branch connector 24. The input connector 22 is provided with a plurality of gas transmission pipes 220, at least one first liquid transmission pipe 222, and at least one first discharge pipe 224. The plurality of gas transmission pipes 220 are connected to a thin film deposition gas output system (not shown), and the first liquid transmission pipe 222 And the first drain pipe 224 is connected to a water cooling system (not shown in the figure). The shunt connector 24 is connected to the input connector 22. The shunt connector 24 is provided with a plurality of airflow channels 240. Each airflow channel 240 is respectively connected to the air pipe 220, and the bottom of each exhaust airflow channel 240 is further provided with a plurality of exhaust openings 242. The exhaust openings 242 are respectively connected to the exhaust pipe 14 on the jet housing 10 to input different gases to the plurality of exhaust pipes 14; at least one second infusion pipe 244 is further provided on the branch joint 24 to respectively communicate with the first infusion pipe 222 and The innermost cooling chamber 12a is used to input the cooling liquid, and at least one second drain pipe 246 is respectively connected to the first drain pipe 224 and the outermost cooling chamber 12b to discharge the cooling liquid.

After describing the multi-channel gas ejector 1 with a series cooling chamber, please refer to the fourth and fifth figures together to illustrate the cooling in the cooling chamber 12 of the multi-channel gas ejector 1 of the series cooling chamber. In the overflow state of the liquid, the first infusion tube 222 of the input connector 22 of the water cooling system (not shown) is connected to the first infusion tube 222 of the water cooling system (not shown) through the adapter 20, flows to the second infusion tube 244 of the branch connector 24, and then flows into the innermost layer for cooling In the chamber 12a, since the innermost cooling chamber 12a is blocked by a partition plate 16, the cooling liquid only flows on the half side of the innermost cooling chamber 12a at first, until the cooling liquid enters the gas guide plate 122a connected to the innermost cooling chamber 12a The cooling liquid will overflow to the other half of the innermost cooling chamber 12a through the overflow space 124a. After the other half of the innermost cooling chamber 12a overflows, it will overflow through the overflow opening 120a To another cooling chamber 12c. In the same way, because the partition 16 is also provided in the cooling chamber 12c, the cooling liquid only flows on the half side of the cooling chamber 12c at first, until the cooling liquid enters the overflow space 124c of the gas guide plate 122c connected to the cooling chamber 12c, the cooling liquid It will overflow to the other half of the cooling chamber 12c through the overflow space 124c. After the other half of the cooling chamber 12c overflows, it will overflow through the overflow opening 120c to the next cooling chamber 12d. The flow method of each layer is the same in the following, so the description will not be repeated.

Finally, when the cooling water overflows the outermost cooling chamber 12b, the cooling water flows back to the water cooling system through the second drain pipe 246 of the branch connector 24 and the first drain pipe 224 of the input connector 22 (not shown) In order to achieve the effect of cooling water circulation. Of course, two sets of infusion pipes and drain pipes can also be provided, so that more than two sets of series-type cooling chambers are arranged in the spray housing 10, which is not limited here. Moreover, in this embodiment, the arrangement of the partition plate 16 can make the cooling water flow only in a single direction, which can avoid the reflux of the cooling water, and can greatly improve the cooling effect.

Next, please refer to Figure 6 to illustrate how the gas is discharged. The multiple gas pipes 220 of the input connector 22 of the adapter 20 are connected to the film deposition gas output system (not shown in the figure). In this embodiment, different The gas pipe 220 can be used to connect different gas output devices in the thin film deposition gas output system to output different gases. Then, the gas flows into the air flow channel 240 of the branch joint 24, and then flows out to the exhaust pipe 14 on the jet housing 10 through the plurality of exhaust openings 242 on the air flow channel 240. Since the filter screen 18 is provided between the gas guide plates 122, the gas discharged from the exhaust pipe 14 can be prevented from forming a gas pressure resistance, and the sprayed gas can be prevented from directly rushing out, causing the problem of uneven spraying. In addition, after the gas is discharged from the exhaust pipe 14, it will contact the gas guide plate 122, so that the gas ejected from the exhaust pipe 14 can be ejected in a horizontal manner.

The plurality of exhaust pipes 14 are provided with a common exhaust pipe 140, the common air flow channel 140 can be used as a purge flow channel or a clean etching flow channel, and the common exhaust pipe 140 is connected to the thin film deposition gas output system (not shown in the figure), To introduce etching gas, such as hydrogen chloride or chlorine. Since the common air flow channel 140 protrudes from the bottom of the jet housing 10 and the gas drainage plate 122 of the tandem cooling chamber, when the etching gas is discharged, it is matched with the recessed structure of the wafer recess 32 of the susceptor 30, and the etching gas It will rise along the edge of the wafer recess 32, so that the gas flow of the etching gas can contact the corners of the wafer 34, which can effectively remove the dust and deposits accumulated on the edge of the wafer. In addition, an inner sleeve 142 can be provided in the common exhaust pipe 140, and the gas in the inner sleeve 142 can be separated from the gas outside the inner sleeve 142 to prevent different gases from mixing and causing chemical reactions.

In summary, the present invention can make each exhaust pipe soak in the cooling liquid to achieve the effect of overall exhaust pipe temperature control, and the arrangement of the partition can make the cooling water flow only in a single direction, which can avoid cooling The water returns to greatly enhance the cooling effect. In addition, the exhaust pipe of the present invention has a common air flow channel, which can be used as a purge channel or a clean etching channel. The concave structure can effectively remove dust and deposits on the edge of the wafer and improve the product manufacturing yield.

Only the above are only preferred embodiments of the present invention and are not used to limit the scope of implementation of the present invention. Therefore, all equivalent changes or modifications made in accordance with the characteristics and spirit of the application scope of the present invention should be included in the patent application scope of the present invention.

1: Multi-channel gas ejector with series cooling chamber 10: Jet shell 12: Cooling room 12a: The innermost cooling chamber 12b: Outermost cooling chamber 12c: Cooling room 12d: cooling room 120: Overflow opening 120a: overflow opening 120c: overflow opening 122: gas drainage plate 122a: gas drainage plate 122c: gas drainage plate 124: Overflow Space 124a: overflow space 124c: overflow space 14: Exhaust pipe 140: Shared exhaust pipe 142: inner casing 16: partition 18: Filter 20: Adapter 22: Input connector 220: gas pipe 222: The first infusion tube 224: First drain pipe 24: Shunt connector 240: Airflow channel 242: Exhaust opening 244: second infusion tube 246: second drain pipe 30: Crystal seat 32: Wafer recess 34: Wafer

The first figure is a three-dimensional view of the present invention. The second figure is an exploded view of the components of the present invention. The third figure is a cross-sectional side view of the present invention. The fourth figure is a schematic diagram of the overflow state of the present invention. The fifth figure is a schematic diagram of the top view of the spray housing in the overflow state of the present invention. The sixth figure is a schematic side view of the air flow state of the present invention.

1: Multi-channel gas ejector with series cooling chamber

10: Jet shell

12: Cooling room

12a: The innermost cooling chamber

12b: Outermost cooling chamber

120: Overflow opening

122: gas drainage plate

14: Exhaust pipe

140: Shared exhaust pipe

16: partition

20: Adapter

22: Input connector

220: gas pipe

222: The first infusion tube

224: First drain pipe

24: Shunt connector

240: Airflow channel

242: Exhaust opening

244: second infusion tube

246: second drain pipe

Claims (10)

A multi-channel gas ejector with a series cooling chamber, comprising: A spray shell, the inner ring of which is provided with a plurality of layers of cooling chambers, and the top of the side wall of each of the cooling chambers is provided with at least one overflow opening to communicate with adjacent cooling chambers; and A plurality of exhaust pipes are arranged in each cooling chamber, and the opening of the exhaust pipe is exposed outside the injection casing. The multi-channel gas injector with tandem cooling chambers according to claim 1, wherein the spray shell is a stepped spray shell, so that the length of the side wall of each cooling chamber gradually increases from the outside to the inside. The multi-channel gas ejector with tandem cooling chambers according to claim 1, wherein a gas drainage plate is further provided at the bottom of each cooling chamber, which is perpendicular to the openings of the exhaust pipes to guide the exhaust pipes The discharged gas has an overflow space in the gas guide plate, and the overflow space is connected to the cooling chamber. According to claim 3, the multi-channel gas ejector with serial cooling chambers, wherein each cooling chamber is further provided with at least one partition to separate the cooling chambers. The multi-channel gas injector with a series cooling chamber according to claim 1, wherein the exhaust pipes include a common exhaust pipe arranged in the center of the injection housing, and the common exhaust pipe passes through the Spray the bottom of the housing. The multi-channel gas injector with a series cooling chamber as described in claim 5, wherein an inner sleeve is further provided in the common exhaust pipe. The multi-channel gas ejector with tandem cooling chamber as described in claim 1, further comprising an adapter, which includes: An input connector, on which a plurality of gas transmission pipes, at least one first infusion pipe and at least one first discharge pipe are arranged; and A branch joint, which is provided with a plurality of air flow channels, at least one second liquid infusion tube and at least one second liquid discharge tube. Gas to the exhaust pipes; the second liquid infusion pipe is connected to the first liquid pipe and the innermost cooling chamber to input cooling liquid; the second liquid discharge pipe is connected to the first liquid discharge pipe and the outermost layer, respectively The cooling chamber to discharge the cooling liquid. According to claim 7 of the multi-channel gas injector with a series cooling chamber, wherein the exhaust gas flow passages are further provided with a plurality of exhaust openings, and the exhaust openings are respectively connected to the exhaust pipes. The multi-channel gas injector with tandem cooling chamber according to claim 1, wherein the inner diameter of the exhaust pipe is at least four millimeters (mm), and the pipe wall of the exhaust pipe may be 2.5 millimeters (mm) To 0.5 millimeters (mm). According to claim 3, the multi-channel gas ejector with serial cooling chambers, wherein a filter screen is further provided between each of the gas drainage discs.

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